|| List of recent Solder-related patents
| Board connector|
There is provided a board connector that prevents loads due to thermal changes in a connector housing from being directly imposed on soldered areas of anchor hardware and that enhances anchoring reliability of the anchor hardware. A board connector includes a connector housing to be populated on a circuit board, anchor hardware for soldering the connector housing to the circuit board, holding grooves that are formed on the connector housing and capable of press-fitting and holding upper lugs of the anchor hardware, and tapered portions that are formed in the respective holding grooves and that guide the upper lugs of each of the pieces of press-fitted anchor hardware in a direction away from each side surface of the connector housing, thereby creating clearance s between the anchor hardware and respective opposing side surfaces of the connector housing..
| Receptacle connector|
A receptacle connector adapted for engaging with a plug connector includes an inner insulating housing, a plurality of terminals integrally molded to the inner insulating housing, a shielding shell, a waterproof plate and an outer insulating housing. The shielding shell is looped from a first metal plate with an inserting space being formed therein.
| Surface mount zipcord connector and method of making electrical contact with zipcord conductors|
A surface mount connector includes one or two spaced conductive contacts. Each conductive contact(s) include a substantially flat base portion suitable for soldering to a pad or land on a printed circuit board (pcb), at least one vertical finger extends substantially normally from each flat base portion and each terminates in a point or hook formed with a piercing tip at the free end thereof remote from the that base portion.
| Manufacturing method for micro bump structure|
A manufacturing method for a micro bump structure includes the following steps as follows. A substrate is provided and a under bump metallurgy (ubm) is formed on the substrate for accommodating a solder ball.
| Double solder bumps on substrates for low temperature flip chip bonding|
Multiple injections of molten solder are employed to form double solder bumps having outer layers that melt at lower temperatures than the inner portions thereof. During a flip chip assembly process, the reflow temperature is above the melting temperature of the outer layers and below the melting temperature of the inner portions of the solder bumps.
| Uniformly distributed self-assembled solder dot formation for high efficiency solar cells|
A method for fabricating a photovoltaic device includes performing a gettering process in a processing chamber which restricts formation of a layer of gettering materials on a substrate and forming a solder layer on the substrate. The solder layer is annealed to form uniformly distributed solder dots which grow on the substrate.
| Component mounting structures with breakaway support tabs|
Components may be mounted to printed circuit substrates using solder. A breakaway support tab may be detachably connected to a component and may help prevent the component from shifting or toppling over during reflow operations.
| Electronic component incorporated substrate and method for manufacturing electronic component incorporated substrate|
An electronic component incorporated substrate includes a first substrate and a second substrate electrically connected to each other by a spacer unit. An electronic component is mounted on the first substrate and arranged between the first substrate and the second substrate.
| Electronic component incorporated substrate|
An electronic component incorporated substrate includes a first substrate and a second substrate that are electrically connected to each other by a spacer unit. An electronic component is mounted on the first substrate and arranged between the first substrate and the second substrate.
| Method for producing a circuit board system and a circuit board arrangement|
Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a top side, a bottom side, a top metallization layer arranged at the top side, and a bottom metallization layer arranged at the bottom side, wherein the bottom metallization layer comprises a number of soldering pads; applying a first solder over the soldering pads; and applying a second solder over the top metallization layer.
| Cooling structure for a shunt resistor and inverter apparatus using the same|
A cooling structure for a shunt resistor has a semiconductor switching element mounted on a component side of a circuit board, a shunt resistor surface-mounted a solder side of the circuit board, a radiator for releasing heat generated from the semiconductor switching element and the shunt resistor, and an insulating material interposed between the shunt resistor and the radiator and having a high thermal conductivity.. .
| Electronic component with terminal strips|
An electronic component with terminal strips joined to end faces of external electrodes via a solder is characterized in that two plate-like supports of each terminal strip are formed by bending two plate-like parts projecting outward in a line-symmetrical manner from both side edges of a plate-like leg in the width direction such that at least tips of the thickness surfaces on the electronic component sides of the two plate-like parts are positioned below an external electrode of the electronic component, and the electronic component is supported from below by the tips of the thickness surfaces on the electronic component sides of the four plate-like supports. Slipping of the electronic component from both terminal strips due to melting of the solder can be suppressed in a reliable manner..
| Piezoelectric actuator unit|
A piezoelectric actuator unit includes a plurality of laminated piezoelectric elements, a first external electrode positioned on a first side surface of each piezoelectric element, and a conductive member connected to each first external electrode with a solder including indium, bismuth, or a mixture thereof, and some of the indium and/or bismuth in the solder is diffused into the soldered portions of the conductive member.. .
| Package on package structure and method for manufacturing same|
A method for manufacturing a package on package structure includes the step of: providing a package body comprising a first package device and a connection substrate, the first package device comprising a number of first solder pads, the connection substrate comprising a substrate main body and a number of first electrically conductive posts, the first electrically conductive posts spatially corresponding to and being connected to the first solder pads, and a solder paste printed on each first electrically conductive post; attaching a second device on the second surface of the connection substrate, thereby obtaining a stacked structure, the second package device comprising a number of second solder pads; and solidifying the solder paste on each first electrically conductive post, such that each second solder pad is soldered to the corresponding first electrically conductive post using the solder paste, thereby obtaining a package on package structure.. .
| Interconnection structure for semiconductor package|
An interconnection structure for being formed on bonding pads of a substrate in a semiconductor package is provided. The interconnection structure includes a nickel layer formed on each of the bonding pads, a metal layer formed on the nickel layer, and a solder material formed on the metal layer.
| Semiconductor structure|
A semiconductor structure includes a semiconductor substrate, a metal layer formed on the semiconductor substrate, a conductive pillar, and a solder ball. The conductive pillar is formed on and electrically connected with the metal layer, wherein the conductive pillar has a bearing surface and a horizontal sectional surface under the bearing surface, and the contact surface area of the bearing surface is larger than the area of the horizontal sectional surface.
| Semiconductor package with improved redistribution layer design and fabricating method thereof|
A semiconductor package with improved redistribution layer design and fabricating method thereof are disclosed and may include a semiconductor die comprising bond pads, a first redistribution layer (rdl) formed on the semiconductor die. The first rdl has a first end coupled to a bond pad and a second end coupled to a solder bump via under bump metal layers.
| Bump structures for semiconductor package|
A package structure includes a first substrate bonded to a second substrate by connecting metal pillars on the first substrate to connectors on the second substrate. A first metal pillar is formed overlying and electrically connected to a metal pad on a first region of the first substrate, and a second metal pillar is formed overlying a passivation layer in a second region of the first substrate.
| Hybrid thermal interface material for ic packages with integrated heat spreader|
Flip chip packages are described that include two or more thermal interface materials (tims). A die is mounted to a substrate by solder bumps.
| Interfacial alloy layer for improving electromigration (em) resistance in solder joints|
The present invention provides a unique structure for an interfacial alloy layer which is able to improve the electromigration (em) resistance of a solder joint, and a unique method of forming this structure. More specifically, in this unique structure, a controlled interfacial alloy layer is provided on both sides of a solder joint.
| Electronic system modules and method of fabrication|
A circuit assembly includes a plurality of integrated circuits having stud bumps at each input/output pad, an interconnection circuit having wells filled with solder, said wells corresponding in a one-to-one relationship with said stud bumps of said integrated circuits, and electrical and mechanical bonding at each of said input/output pads, wherein each of said stud bumps connects with solder in each of said wells to form a permanent connection.. .
| Lead-free solder ball|
A lead-free solder ball for electrodes of a bga or csp comprising 0.5-1.1 mass % of ag, 0.7-0.8 mass % of cu, 0.05-0.08 mass % of ni, and a remainder of sn. Even when a printed circuit board to which the solder ball is bonded has cu electrodes or au-plated or au/pd-plated ni electrodes, the solder ball has good resistance to drop impacts.
| Hermetically sealed polymer capacitors with high stability at elevated temperatures|
A process for providing an improved hermetically sealed capacitor which includes the steps of applying a solder and a flux to an interior surface of a case; flowing the solder onto the interior surface; remove flux thereby forming a flux depleted solder; inserting the capacitive element into the casing; reflowing the flux depleted solder thereby forming a solder joint between the case and the solderable layer; and sealing the case.. .
| Soldering iron|
A soldering iron includes a soldering tip which is adapted to be heated by means of a laser beam traveling at least partially along a laser path in the soldering iron. The soldering iron further includes an energy converter provided for absorbing the laser beam and coupled to the soldering tip for heating the same..
| Surface mount connector for electrically isolating two insulated conductors|
A surface mount connector includes a pair of electrical contacts spaced from each other a predetermined distance. Each contact includes a substantially flat base portion having upper and lower surfaces, the lower surface being suitable for soldering to a pad or land on a printed circuit board (pcb).
| Printed wiring board and method for manufacturing printed wiring board|
A printed wiring board has an interlayer insulation layer, a conductive pattern formed on the interlayer insulation layer, a solder-resist layer formed on the interlayer insulation layer and conductive pattern and having opening exposing a portion of the conductive pattern and a portion of the interlayer insulation layer around the portion of the conductive pattern, a metal layer formed in the opening of the solder-resist layer such that the metal layer is covering the portion of the conductive pattern exposed through the opening of the solder-resist layer, and a bump formed in the opening of the solder-resist layer such that the bump is on the metal layer in the opening of the solder-resist layer. The opening of the solder-resist layer has space formed with side surface of the bump, inner wall of the solder-resist layer and the portion of the interlayer insulation layer in the opening of the solder-resist layer..
| Printed wiring board and method for manufacturing printed wiring board|
A printed wiring board has an interlayer insulation layer, a conductive pattern formed on the interlayer insulation layer, a solder-resist layer formed on the interlayer insulation layer and the conductive pattern and having an opening portion exposing a portion of the conductive pattern and a portion of the interlayer insulation layer around the portion of the conductive pattern, a metal layer formed in the opening portion of the solder-resist layer such that the metal layer is covering the portion of the conductive pattern and the portion of the interlayer insulation layer exposed through the opening portion of the solder-resist layer, and a bump structure formed in the opening portion of the solder-resist layer such that the bump structure is formed on the metal layer in the opening portion of the solder-resist layer.. .
| Prepreg, copper clad laminate, and printed circuit board|
Disclosed herein are prepreg, a copper clad laminate (ccl), and a printed circuit board. When a reinforcing member formed of organic fiber including a liquid crystal polymer resin or a super engineering resin and a base resin having the same component as the reinforcing member are used, a coefficient of thermal expansion (cte) and rigidity may be adjusted.
| Uniformly distributed self-assembled solder dot formation for high efficiency solar cells|
A substrate for photovoltaic device includes a textured surface formed from silicon-based material. The textured surface includes a plurality of cones uniformly distributed across the textured surface.
| Method for soldering solar cell contacts on aluminium connection-conductors|
The invention relates to a method for connecting solder-coated connection leads (3) made of aluminium or an aluminium alloy having a 0.2% yield strength of less than 120 n/mm2 to photovoltaic solar cells (7, 7a, 7b, 7c) which have metallizations on the upper side and the lower side, by a soldering method such as ir soldering, inductive soldering, thermal contact soldering, ultrasonic soldering or hot air soldering. The metallizations of the solar cells can be precoated with solder.
|Spherical ultrasonic hifu transducer with modular cavitation sense element|
An ultrasonic hifu transducer (120) has a threaded opening into which a modular cavitation sensor (90) is removably located. The modular cavitation sensor includes a modular housing (92) containing a piezoelectric transducer for sensing acoustic signals indicative of cavitation.
|Threaded structures with solder control features|
Threaded standoff structures may be provided with features that control the flow of solder. A base structure for a standoff may be formed from a solderphobic material such as brass.
|Connection structure for flexible circuit cable|
A connection structure for a flexible circuit cable includes a flexible circuit cable that has a flexible circuit substrate having a first end bonded to a soldering stage of the connector housing with first finger pad conductive contacts of conductive lines of the flexible circuit cable respectively corresponding to cable soldering sections of metal conductive terminals of the connector. A soldering layer is formed between a metal coating layer of the first finger pad conductive contact of each of the conductive lines and the cable soldering section of the corresponding metal conductive terminals to set the conductive lines of the flexible circuit cable in electrical connection with the metal conductive terminals of the connector..
The operability and usage durability of a lock cancellation operating part 12e can be improved with a simple configuration. A latch lock part 12a and a lock cancellation operating part 12e are integrally provided to an elastically-displaceable lock arm member 12g, which is integrally extending like a cantilever from a board connecting part 12c solder-joined with a main wiring board.
|Methods and apparatus of packaging semiconductor devices|
Methods and apparatuses for wafer level packaging (wlp) semiconductor devices are disclosed. A redistribution layer (rdl) is formed on a first passivation layer in contact with a conductive pad over a surface of a die.
|Method for making a double-sided fanout semiconductor package with embedded surface mount devices, and product made|
A manufacturing process includes forming a reconstituted wafer, including embedding semiconductor dice in a molding compound layer and forming through-wafer vias in the layer. A fan-out redistribution layer is formed on a front side of the wafer, with electrical traces interconnecting the dice, through-wafer vias, and contact pads positioned on the redistribution layer.
|Copper post solder bumps on substrates|
A method comprises forming semiconductor flip chip interconnects having electrical connecting pads and electrically conductive posts terminating in distal ends operatively associated with the pads. We solder bump the distal ends by injection molding, mask the posts on the pads with a mask having a plurality of through hole reservoirs and align the reservoirs in the mask to be substantially concentric with the distal ends.
|Suspension for high power micro speaker and high power micro speaker having the same|
The present invention relates to a suspension structure for a high power micro speaker and, more particularly, to a shape of a suspension which ensures a lightweight of the suspension as well as high reliability and a conductive pattern which applies electric signals. The present invention provides a suspension for a high power micro speaker that includes an outer peripheral portion, a central portion and a connection portion, is provided with a conductive pattern, and is formed in a rectangular shape, wherein land portions for use in soldering or welding lead-in wires of a voice coil are formed on long connection portions disposed on long sides..
|Surface mount actuator|
A silicon mems device can have at least one solder contact formed thereupon. The silicon mems device can be configured to be mounted to a circuit board via the solder contact(s).
|Board assemblies with minimized warpage and systems and methods for making the same|
Board assemblies with minimized warpage and systems and methods for making the same are disclosed. A board may be pre-conditioned by designing the board to mount components in selected areas of the board and by selectively copper flooding certain regions of the board.
|Printed circuit boards with recesses|
Printed circuit boards are provided with recess-mounted components. The components may be mounted within recesses in the surface of a printed circuit board substrate that are larger than the component.
|Integrated force localizer and digitizer and/or lcd drive for cholesteric liquid crystal display|
A cholesteric liquid crystal display and a method of making are provided. The cholesteric liquid crystal display may include a first layer of insulating material forming a force backplate and having a conductive trace laminated thereto.
|Chip package structure and method for manufacturing same|
A chip package structure includes a first wiring layer, a first solder mask layer, a chip and a plurality of third contact pads. The third contact pads are formed on the first wiring layer.
|Methods, devices, and materials for metallization|
A method of making an electronic device which in one embodiment comprises providing a substrate, electrolessly depositing a barrier metal at least on portions of the substrate, and using wet chemistry such as electroless deposition to deposit a substantially gold-free wetting layer having solder wettability onto the barrier metal. An electronic device which in one embodiment comprises a metallization stack.
|Lead-free solder bump bonding structure|
According to a lead-free solder bump bonding structure, by causing the interface (imc interface) of the intermetallic compound layer at a lead-free-solder-bump side to have scallop shapes of equal to or less than 0.02 [portions/μm] without forming in advance an ni layer as a barrier layer on the surfaces of respective cu electrodes of first and second electronic components like conventional technologies, a cu diffusion can be inhibited, thereby inhibiting an occurrence of an electromigration. Hence, the burden at the time of manufacturing can be reduced by what corresponds to an omission of the formation process of the ni layer as a barrier layer on the cu electrode surfaces, and thus a lead-free solder bump bonding structure can be provided which reduces a burden at the time of manufacturing in comparison with conventional technologies and which can inhibit an occurrence of an electromigration..
|Semiconductor device, and method of manufacturing semiconductor device|
A semiconductor device includes a semiconductor element, a solder layer which is arranged on at least one surface of the semiconductor element and a lead frame which is arranged on the solder layer so that a porous nickel plating part is sandwiched between the lead frame and the solder layer. Compared with a case that the semiconductor element and the lead frame are jointed by a solder directly, an increased part of a thermal resistance of the solder junction is held down only to a part of the porous nickel plating part and a thermal resistance applied to the solder layer can be reduced..
|Printed circuit baord and method for manufacturing same|
A printed circuit board includes a base, a circuit pattern, a solder mask, an activated metal layer, a plurality of metal seed layers, and a plurality of metal bumps. The conductive circuit pattern is formed on the base, to include a plurality of conductive pads.
|Method for forming solder resist and substrate for package|
The present invention relates to a method for forming solder resist and a substrate for a package. The method for forming solder resist including: forming a first solder resist inner region by primarily coating, exposing, and developing a solder resist on a substrate on which an outer pop pad and an inner chip pad are formed, and removing the solder resist's outer portion on the substrate's outer region and curing the solder resist's inner portion on the substrate's inner region; forming a plugged sr region which does not expose the substrate; changing a surface roughness by performing a desmear process on a surface of the first solder resist inner region in which the plugged sr region is formed; and forming a second solder resist smd region which covers an edge of the pop pad, exposing, and developing the solder resist on the substrate after the desmear process is provided..
|Flux for soldering and solder paste composition|
The present invention is a flux for soldering, containing a base resin and an activating agent, in which the base resin contains a thermoplastic acrylic resin obtained by polymerizing a monomer component containing a long chain alkyl(meth)acrylate, the long chain alkyl moiety of the long chain alkyl(meth)acrylate has a branched structure having 12 to 23 carbon atoms, and the acrylic resin has a weight average molecular weight of 30000 or less. A solder paste composition of the present invention improves wettability, storage stability and crack resistance in residue portions, and printability for fine portions without adhering to a squeegee when printed..
|Increasing the efficiency of solar cells by transfer of solder|
Thickening a contact grid of a solar cell for increased efficiency. A mold containing soldering material is heated.
|Method for fabricating package substrate|
A package substrate includes a core layer, a first dielectric layer, a second circuit pattern, a first solder mask and an insulating layer. A first circuit pattern is disposed on a first surface of the core layer.
|Electronic component mounting line and electronic component mounting method|
Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine; a screen printing machine for applying solder paste to the substrate; a resin dispensing machine arranged downstream of the screen printing machine, for dispensing a thermosetting resin onto at least one reinforcement position on the substrate; a second electronic component placement machine arranged adjacent to and downstream of the resin dispensing machine, for placing a second electronic component on the substrate, such that its peripheral edge portion comes in contact with the resin; a first electronic component placement machine arranged downstream of the second electronic component placement machine, for placing a first electronic component on the substrate; and a reflow machine for bonding the electronic components to the substrate, by heating and cooling the resultant..
|Technique for monitoring structural health of a solder joint in no-leads packages|
A printed circuit board (pcb) and a system utilizing the same is presented for use in monitoring a solder joint between the pcb and a package. The pcb comprises at least one slotted pad and at least one health monitoring circuit (hmc).
|Mounted structure and manufacturing method of mounted structure|
In a case where a first mounted substrate to which a semiconductor element is bounded by solder is mounted on a second substrate, connection strength becomes low, when the first mounted substrate is bonded to the second substrate by using a solder having a low melting point. A mounted structure, in which a first mounted substrate on which a semiconductor element is bonded by using a first solder having a melting point of 217° c.
|Solder on trace technology for interconnect attachment|
A solder on trace device includes a conductive trace on a semiconductor substrate surface. The conductive trace has a sidewall and a bonding surface.
|Bonded structures for package and substrate|
The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures.
|Semiconductor package for high power devices|
A semiconductor device package is formed of dbc in which thinned mosgated and/or diode die are soldered to the bottom of an etched depression in the upper conductive layer. A via in the insulation layer of the dbc is filled with a conductive material to form a resistive shunt.
|Method of manufacturing solar cell electrode and conductive paste|
The present invention relates to a method of manufacturing a solar cell electrode, comprising: preparing a semiconductor substrate having a preformed electrode on a front side, a back side, or both of the front and the back side of the semiconductor substrate; applying a conductive paste onto the preformed electrode, wherein the conductive paste comprises a conductive powder, an amorphous saturated polyester resin with glass transitional temperature (tg) of 50° c. Or lower, and an organic solvent; drying the applied conductive paste; putting a tab electrode on the dried conductive paste; and soldering the tab electrode..
|Innovative multi-purpose dipping plate|
The present disclosure is directed to an apparatus for the application of soldering flux to a semiconductor workpiece. In some embodiments the apparatus comprises a dipping plate having a reservoir which is adapted to containing different depths of flux material.
|Floating switch assemblies and methods for making the same|
Switch assemblies that mitigate stack up variations and methods of making the same are provided. The stack up variations are mitigated by embodiments that use a floating switch design.
|Printed circuit solder connections|
Printed circuits may be electrically and mechanically connected to each other using connections such as solder connections. A first printed circuit such as a rigid printed circuit board may have solder pads and other metal traces.
|Apparatus for patterning ribbon, string tabbing method and solar cell module using the same|
An apparatus for patterning a ribbon includes a holding device, a heating device, and an embossing device. The holding device is utilized for positioning the ribbon on a surface of a solar cell.
|Method of making a semiconductor device having a post-passivation interconnect structure|
A method of making a semiconductor device includes forming a passivation layer overlying a semiconductor substrate, the semiconductor substrate having a first region and a second region, wherein the first region is a conductive pad and the second region is adjacent to the first region. The method further includes forming a first protective layer overlying the passivation layer and forming an interconnect layer overlying the first protective layer.
|Lead-free solder composition for glass|
The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin.
|High-temperature lead-free solder alloy|
A sn—sb—ag—cu based high-temperature lead-free solder alloy which has excellent connection reliability and which does not form a low melting point phase even when solidified by slow cooling is provided. It has an alloy composition consisting essentially of, in mass percent, sb: 35-40%, ag: 13-18%, cu: 6-8%, and a remainder of sn..