|| List of recent Solder-related patents
|Power connector and center terminal|
A power connector suitable for being mounted on a circuit board includes an insulating housing and a center terminal. The insulating housing has a plug hole.
|Fabrication method for circuit substrate having post-fed die side power supply connections|
A circuit substrate uses post-fed top side power supply connections to provide improved routing flexibility and lower power supply voltage drop/power loss. Plated-through holes are used near the outside edges of the substrate to provide power supply connections to the top metal layers of the substrate adjacent to the die, which act as power supply planes.
|Resin composition for flexible printed circuit board|
A resin composition for a flexible printed circuit board that can attain high adhesiveness and solder reflow resistance even if a base film having low dielectric properties is used, and that attains excellent electrical properties. The resin comprises a fluororesin and an isocyanate compound, wherein the fluororesin has a content of 1 to 50% by mass, and a hydroxyl equivalent of 300 to 5500 g/equivalent..
There is herein described a method and apparatus for photoimaging. More particularly, there is described a method and apparatus for photoimaging a substrate (e.g.
|Optical printed circuit board|
An optical pcb includes a substrate, conductive traces, a solder resist layer, and a light waveguide. The substrate includes a surface.
|Ultrasound transducer and method for manufacturing an ultrasound transducer|
An ultrasound transducer includes an array of acoustic elements, an integrated circuit, and an interposer. The interposer includes conductive elements for electrically connecting the acoustic elements to the integrated circuit.
|Direct heat sink technology for leds and driving circuits|
Thermally radiating heat sinks are soldered directly beneath individual leds and other heat generating electronic components on the opposite side of an fr4 circuit board and thermally coupled to the heat source through multiple micro-vias. The micro-vias are filled with solder in order to increase the thermal transmission of heat energy through the circuit board to the heat sinks the circuit board thickness is minimized to further reduce the thermal resistance of the transmission path.
|Lens driving motor and elastic member of the same|
Provided are a lens driving motor and an elastic member of the lens driving motor. The elastic member of a lens driving motor, the elastic member includes a first spring and a second spring.
|Solder bump testing apparatus and methods of use|
A testing apparatus for measuring the material properties of solder balls includes a frame and a chuck base moveable in x, y, z dimensions, relative to the frame. A probe tip is fixed to the frame.
|Semiconductor device and a method of manufacturing same|
In a semiconductor device where a metal circuit layer is disposed over a main planar surface of an insulating substrate, a semiconductor chip is connected by way of a solder over the metal circuit layer, and a metal wiring is connected over the metal circuit layer, in which a solder flow prevention area comprising a linear oxide material is formed between the semiconductor chip and the ultrasonic metal bonding region over the metal circuit layer.. .
|Electrical interconnections of semiconductor devices and methods for fabricating the same|
Provided are electrical interconnections and methods for fabricating the same. The electrical interconnection may include a substrate including a bonding pad, a solder ball electrically connected to the bonding pad, a solder supporter on the bonding pad, a portion of the solder ball filling the solder supporter, and a metal layer between the bonding pad and the solder supporter, the metal layer having an ionization tendency lower than the bonding pad..
|Implementing decoupling devices inside a tsv dram stack|
A method and structures are provided for implementing decoupling capacitors within a dram tsv stack. A dram is formed with a plurality of tsvs extending completely through the substrate and filled with a conducting material.
|Semiconductor device having wafer-level chip size package|
A semiconductor device including a semiconductor substrate with circuit elements and electrode pads formed on one surface. The surface is covered by a dielectric layer with openings above the electrode pads.
|Fan-out high-density packaging methods and structures|
A fan-out high-density packaging method includes providing a packaging substrate, forming a stripping film on the packaging substrate, and forming a first protection layer on the stripping film and pre-designed photolithography pattern openings on the first protection layer. The method also includes forming a metal redistribution layer on the surface of the first protection layer and in the photolithography pattern openings, forming a second protection layer on the first protection layer and partially exposing the metal redistribution layer, and forming at least one package layer on the second protection layer.
A semiconductor package with reduced warpage problem is provided, including: a circuit board, having opposing first and second surfaces; a semiconductor chip, formed over a center portion of the first surface of the circuit board, having a first cross sectional dimension; a spacer, formed over a center portion of the semiconductor chip, having a second cross sectional dimension less than that of the first cross sectional dimension; an encapsulant layer, formed over the circuit board, covering the semiconductor chip and surrounding the spacer; a heat spreading layer, formed over the encapsulant layer and the spacer; and a plurality of solder balls, formed over the second surface of the circuit board.. .
|Semiconductor device and manufacturing method for the same|
A semiconductor device which reduces a source resistance and a manufacturing method for the same are provided. The semiconductor device has a nitride based compound semiconductor layer arranged on a substrate, an active region which has an aluminum gallium nitride layer arranged on the nitride based compound semiconductor layer, and a gate electrode, source electrode and drain electrode arranged on the active region.
|Package-integrated thin film led|
Led epitaxial layers (n-type, p-type, and active layers) are grown on a substrate. For each die, the n and p layers are electrically bonded to a package substrate that extends beyond the boundaries of the led die such that the led layers are between the package substrate and the growth substrate.
|Conductive bonding material, method of manufacturing the same, and method of manufacturing electronic device|
A conductive bonding material includes: a solder component including a metal foamed body of a first metal having at least one pore, the pore absorbs melted first metal when the metal foamed body is heated at a temperature higher than the melting point of the first metal, and a second metal having a melting point lower than the melting point of the first metal.. .
|Casing for network transformers|
The invention provides a casing for network transformers. The casing includes a base, pins and a cover plate.
A package substrate includes a solder resist layer having a level surface, a circuit pattern buried in the solder resist layer, and a bump protruding from the solder resist layer.. .
|Multilayer printed circuit board and method for manufacturing same|
A method for manufacturing a multilayer printed circuit board includes the step as follows: providing a glass wiring substrate, the glass wiring substrate comprising a first electrically conductive pattern, a glass base, and a second electrically conductive pattern, the second electrically conductive pattern comprising a plurality of first solder pads; laminating a first lamination substrate onto the glass wiring substrate, the first lamination substrate comprising a first base layer and a first electrically conductive material layer on the first base layer, such that the first base layer is sandwiched between the first electrically conductive pattern and the first electrically conductive material layer; patterning the first electrically conductive material layer to form a third electrically conductive pattern, and electrically connecting the third electrically conductive pattern to the first electrically conductive pattern, and forming a first solder mask on the glass wiring substrate, thereby obtaining a multilayer printed circuit board.. .
|Medical surgical navigation sensor mounting system|
An engagement system for a surgical sensor assembly, formed of a sensing component in a fixed position and a lead wire in an electrical communication therewith. The engagement system employs a jacket of heat shrink polymeric material to hold the sensing component to the lead wire and eliminates the employment of soldering and welding and crimping which can damage such sensing components.
|Solar battery module and manufacturing method thereof|
In a solar battery module including a plurality of solar battery elements each including electrodes that are electrically connected by an electrically conductive wiring member, the electrode and the wiring member are welded by solder on the electrode, resin is arranged while covering at least a side surface of a solder-bonded portion between the solder and the electrode, and a wetted height of the resin on a side surface of the wiring member is lower than the top of wiring member, so that welding by the solder can be reinforced and the bonding reliability can be improved.. .
|Embedded multimediacard and electronic device using the same, and energining board for embedded multimediacard|
An embedded multimediacard (emmc), an electronic device equipped with an emmc and an emmc engineering board are disclosed. The emmc includes an emmc substrate plate, a plurality of solder balls and an emmc chip.
|Card edge connector assembly and positioning mrthod of the same|
A card edge connector assembly comprising a first card edge connector comprising a first insulative housing, a pair of first latching arms disposed on opposite ends of the first insulative housing and a plurality of first conductive terminals retained in the first insulative housing; a second card edge connector including a second insulative housing, a pair of second latching arms located on the opposite ends of the second insulative housing and a plurality of second conductive terminals retained in the second insulative housing. The first and second terminals define pin-shaped solder portions respectively, wherein the first and second insulative housings define protruding portions and recessed portions mutually engaged with each other when the first and second insulative housings are disposed in a head to head arrangement.
|Electrical connector for use with a circuit board|
An electrical connector for use with a circuit board including an insulating housing used to be fixed to a circuit board, a plurality of signal contacts arranged on the insulating housing along a longitudinal direction of the same, at least one ground contact provided in an arrangement of the signal contacts on the insulating housing, and a conductive shell member provided for covering partially a portion of the insulating housing and to be connected with a grounding portion of the circuit board, wherein the conductive shell member has a ground connecting reed-like portion formed thereon so as to correspond to the ground contact and both of the ground connecting reed-like portion of the conductive shell member and the ground contact are connected by means of soldering with the grounding portion of the circuit board.. .
|Semiconductor device and manufacturing method for same|
A semiconductor device has, at least, a cooling base and a plurality of insulating substrates with conductive patterns fixed onto the cooling base through a solder. A solder pool portion is provided on the cooling base to contact a position of the cooling base directly below an edge of each of the insulating substrates with conductive patterns with a shortest distance from a center point of the cooling base..
|Method for flex circuit bonding without solder mask for high density electrical interconnect|
In some aspects of the present application, a print head and a method of forming the print head are disclosed. The print head can include an array of jets formed in a jet stack; at least one ink reservoir operable to deliver ink to the jet stack; an actuator array arranged on the control circuitry formed into an actuator layer to cause the reservoir to deliver ink in response to signals from the control circuitry; a standoff adhesive layer arranged on the actuator layer, the standoff adhesive layer having an array of holes corresponding to the actuators; and a flex circuit layer having an array of bumped contacts pad corresponding to the array of holes of the standoff adhesive layer..
|Semiconductor device packages with solder joint enhancement element and related methods|
Electronic devices including a semiconductor device package, a substrate, and first and second solder joints. The semiconductor device package includes a die pad, leads and enhancement elements surrounding the die pad, a chip electrically connected to the leads, and a package body encapsulating the chip, portions of the leads, and portions of the enhancement elements, but leaving exposed at least a side surface of each enhancement element.
|Mounting structure of electronic component and method of manufacturing the mounting structure of the electronic component|
A mounting structure of an electronic component includes a plurality of joining portions that join a plurality of first electrode terminals on the electronic component to a plurality of second electrode terminals on a circuit board. The joining portions each include a first projecting electrode formed on the first electrode terminal, a second projecting electrode formed on the second electrode terminal, and a solder portion that joins the first projecting electrode to the second projecting electrode.
|Three-dimensional chip stack and method of forming the same|
A three dimensional (3d) chip stack includes a first chip bonded to a second chip. The first chip includes a first bump structure overlying the first substrate, and the second chip includes a second bump structure overlying the second substrate.
|Selective solder bump formation on wafer|
A method for selective bump formation on a wafer includes performing a wafer test on the wafer. Known good dies (kgds) on the wafer are identified based on the wafer test performed.
A semiconductor device is provided, in which a first lead (11) is joined with the bottom electrode (23) of a mos-fet (21) with first solder (51), the top electrode (22) of the mos-fet is joined with an internal lead (31) with second solder (52), the internal lead is joined with a projection (61) of a second lead with third solder (53), and the first lead, second lead, mos-fet and internal lead are integrally molded using sealing resin (41), wherein the first solder and second solder include support members (54) and (55), respectively, located thereinside and positions of the internal lead and mos-fet are stabilized by self-alignment.. .
|Method of forming a solder joint|
A method of forming a solder joint includes the steps of providing a heat shield member formed as an arcuate preferably metallic shell attached to a spring-clamp by means of an obedient shaft; attaching the spring clamp to a structure adjacent the solder joint; moving the heat shield member by bending the obedient shaft so that the heat shield member is positioned in a location spaced-apart from the solder joint with the concave surface of the heat shield member facing the solder joint; and applying heat from a torch to the solder joint from the side opposite the heat shield so that the heat shield reflects the heat back onto the solder joint.. .
|Soldering nozzle for delivering molten solder to the underside of a pcb, method of reducing the rate of occurence of dewetting of a solder nozzle|
The present invention provides an improved soldering nozzle (61, 81) for delivering molten solder to the underside of a pcb. The nozzle (61, 81) comprises a nozzle outlet, the nozzle having an inner bore through which a flow of molten solder can be pumped to overflow the nozzle outlet, the nozzle (61, 81) having an outer surface configured to collect a return flow of molten solder.
|Solder ball supplying apparatus|
Disclosed herein is a solder ball supplying apparatus including: a cartridge formed in a box shape and having a plurality of solder balls embedded therein; a vibration unit coupled to a lower portion of the cartridge; and a metal mask coupled integrally with a lower portion of the vibration unit and having a plurality of holes formed over the entire surface thereof.. .
|Printed circuit board|
A printed circuit board includes a line intensive distribution area, a line sparse distribution area, a solder mask layer, and a signal layer. A first signal line is laid on the signal layer.
|Semiconductor module radiator plate fabrication method, radiator plate, and semiconductor module using the same|
When insulating substrates of different shapes are soldered to a radiator plate, a third concave curve is previously formed on an insulating substrate side of the radiator plate. The third curve is determined by adding a second concave curve which is expected at the time of actually soldering the insulating substrates to the radiator plate to a first concave curve obtained by moving upside down a convex curve which appears at the time of soldering the insulating substrates to a flat radiator plate.