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Sit patents

      

This page is updated frequently with new Sit-related patent applications.




Date/App# patent app List of recent Sit-related patents
08/18/16
20160242320 
 Heat exchange device based on a pulsating heat pipe patent thumbnailHeat exchange device based on a pulsating heat pipe
A heat exchange device may be based on a pulsating heat pipe and a cooling arrangement. The heat exchange device may include a plurality of pipes to provide fluid paths between a first fluid distribution element and a second fluid distribution element.
Abb Technology Ag


08/18/16
20160242318 
 Flexible coolant manifold - heat sink assembly patent thumbnailFlexible coolant manifold - heat sink assembly
A cooling assembly is provided which includes: one or more coolant-cooled heat sinks configured to couple to one or more electronic components to be cooled; one or more flexible coolant conduits; and one or more pivotable coolant manifolds. The flexible coolant conduit(s) couples in fluid communication the pivotable coolant manifold(s) and the coolant-cooled heat sink(s), and accommodates pivoting of the pivotable coolant manifold(s), while maintaining the coolant-cooled heat sink(s) in fluid communication with the pivotable coolant manifold(s).
International Business Machines Corporation


08/18/16
20160242313 
 Electronic assembly with one or more heat sinks patent thumbnailElectronic assembly with one or more heat sinks
An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads.
Deere & Company


08/18/16
20160242312 
 Electronic assembly with one or more heat sinks patent thumbnailElectronic assembly with one or more heat sinks
An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads.
Deere & Company


08/18/16
20160242296 
 Additive fabrication of single and multi-layer electronic circuits patent thumbnailAdditive fabrication of single and multi-layer electronic circuits
A method and apparatus for the additive fabrication of single and multi-layer electronic circuits by using directed local deposition of conductive, insulating, and/or dielectric materials to build circuit layers incorporating conductive, insulating and/or dielectric features, including inter-layer vias and embedded electronic components. Different conductive, insulating, and/or dielectric materials can be deposited at different points in the circuit such that any section of the circuit may be tailored for specific electrical, thermal, or mechanical properties.
Optomec, Inc.


08/18/16
20160242295 
 Display device patent thumbnailDisplay device
A display device including a flexible circuit board including an insulation film, the insulation film including an input pad part and an output pad part on a first side thereof; a printed circuit board including a first pad part, the first pad part being connected to the input pad part; and a display panel including a second pad part, the second pad part being connected to the output pad part, wherein the input pad part includes a plurality of input pads that are arranged in at least two pad columns, and the flexible circuit board includes a plurality of dummy layers aligned with the plurality of input pads on a second side of the insulation film, the second side being an opposite side to the first side.. .
Samsung Display Co., Ltd.


08/18/16
20160242294 
 Electronic device patent thumbnailElectronic device
The present disclosure provides an electronic device suitable for miniaturization. The present electronic device includes: a substrate (1), having a main surface (111) and a back surface (112) facing opposite sides with each other in a thickness direction, wherein the substrate comprises a semiconductor material; an electronic component (8), which is disposed over the substrate (1); and a conductive layer (3), which is electrically connected with the electronic component (8); wherein a recess for disposing the component (14) and a through recess (17) are formed in the substrate, in which recess for disposing the component (14) is recessed from the main surface (111), and the through recess (17) penetrates from the recess for disposing the component (14) to the back surface (112); the electronic component (8) is disposed over the recess for disposing the component (14); a metal-filled portion (4) is formed in the through recess (17), wherein the metal-filled portion blocks at least the bottom of the through recess (17) and is filled with a metal material; and the conductive layer (3) is formed at least from the through recess (17) to the back surface (112)..
Rohm Co., Ltd.


08/18/16
20160242292 
 Electronic device patent thumbnailElectronic device
An electronic device includes a semiconductor substrate, an electronic element mounted on the substrate, a conductive layer electrically connected to the electronic element, a sealing resin and a columnar conductor. The substrate has a recess formed in its obverse surface.
Rohm Co., Ltd.


08/18/16
20160242285 
 Printed wiring board patent thumbnailPrinted wiring board
A printed wiring board includes a resin insulating layer having recess portions formed on first surface, a first conductor layer formed in the recess portions and including pads positioned to mount an electronic component, conductive pillars formed on the pads, respectively, and formed to mount the electronic component onto the resin insulating layer, a second conductor layer formed on second surface of the resin insulating layer on the opposite side with respect to the first surface, and a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer and connecting the first and second conductor layers. The pillars is formed such that each of the pads has an exposed surface exposed from a respective one of the conductive pillars, and the pads are formed such that the exposed surface is recessed from the first surface of the resin insulating layer..
Ibiden Co., Ltd.


08/18/16
20160242283 
 Wiring board, and mounting structure and laminated sheet using the same patent thumbnailWiring board, and mounting structure and laminated sheet using the same
A wiring board excellent in electrical reliability is provided. A wiring board includes a first resin layer; an inorganic insulating layer disposed on the first resin layer; a second resin layer disposed on the inorganic insulating layer; and a conductive layer disposed on the second resin layer.
Kyocera Corporation


08/18/16
20160242279 

Electronic fabric with incorporated chip and interconnect


A system comprises an article comprising one or more fabric layers, a plurality of electronic devices, each being incorporated into or onto one of the one or more fabric layers, and one or more communication links between two or more of the plurality of electronic devices. Each of the plurality of electronic devices can comprise a flexible substrate coupled to the fabric layer, one or more metallization layers deposited on the flexible substrate, and one or more electronic components electrically coupled to the one or more metallization layers..
Intel Corporation


08/18/16
20160242143 

Mobile communication device monitoring systems and methods


Systems and methods are directed to monitoring the communications to and from a mobile communication device in accordance with one or more embodiments. For example in accordance with an embodiment, data services on a mobile communication device, such as communications, application use, functionality, operability, and/or presence, may be monitored against rules available from a central data center repository.
Eagency, Inc.


08/18/16
20160242128 

Power control and power headroom reporting for dual connectivity


The present disclosure relates to a method for efficiently performing power control in situations where the ue is connected to both a menb and senb. The menb determines a power distribution ratio for the power to be used by the ue for uplink transmission to the menb and senb, determines the parameters pemax,menb and pemax,senb and sends these parameters to the senb/ue for use in power control.
Panasonic Intellectual Property Corporation Of America


08/18/16
20160242110 

Method and system for network node selection based ue agent assisted modification of temporary identity in 3g and 4g networks


The embodiments described herein relate generally to a method and system for using mobility management entity (mme) or serving gprs support node (sgsn) pooling features depending on whether it is a 3g or 4g network and adding an enhancement in the user equipment (ue) whereby it uses location information (e.g., broadcast public land mobile network identity (plmn id), tracking area (ta), cell identification, global positioning system (gps) coordinates or the like) to decide from which mme or sgsn it should obtain services.. .
Connectem Inc.


08/18/16
20160242097 

Packet forwarding in wireless networks


A wireless network site comprises a base station and a cell site gateway. The cell site gateway comprises a first interface connected to the base station, a second interface connected to a packet network gateway, a forwarding layer, and a third interface connected to a control server to exchange control plane information.
Ofinno Technologies, Llc


08/18/16
20160241965 

Mems microphone and forming the same


A micro-electro-mechanical system (mems) microphone and a method for forming the same are provided. The method includes: providing a first substrate including a first surface and a second surface opposite to each other; providing a second substrate including a third surface and a fourth surface opposite to each other; bonding the first surface of the first substrate and the third surface of the second substrate to each other; removing a second base of the second substrate to form a fifth surface opposite to the third surface of the second substrate; forming a cavity between the first substrate and the sensitive region of the second substrate; and forming a first conductive plug from the side of the fifth surface of the second substrate, with the first conductive plug passing through to at least one of the conductive layers..
Memsen Electronics Inc


08/18/16
20160241953 

Surface mountable microphone package, a microphone arrangement, a mobile phone and a recording microphone signals


A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a first opening for the first microphone and a second opening for the second microphone.
Infineon Technologies Ag


08/18/16
20160241939 

Speaker mounting assembly


An assembly for mounting a speaker to a surface includes a bracket having an elongated arcuate section and two end sections angled approximately perpendicular to the arcuate section. The end sections are attached on opposite sides of a speaker.
Bogen Communications, Inc.


08/18/16
20160241929 

Utilizing multiple dimensions of commerce and streaming data to provide advanced user profiling and realtime commerce choices


Multiple dimensions of commerce and streaming data are able to be used to provide advanced user profiling and realtime commerce choices. By performing site and experience analytics, video analytics, commerce analytics and user analytics, better commerce choices are able to be presented to the user..
Sony Corporation


08/18/16
20160241917 

System and delivering video on demand


A system and method of delivering video on demand includes a web site for receiving customer requests for video content, locating the requested content on one of a plurality of distributed video servers, and arranging the located content to be distributed to the customer's set top box via a broadband connection.. .
Evideo Incorporated


08/18/16
20160241864 

Geospatial media recording system


A computer implemented geospatial media recording system which receives a global positioning signal from a global positioning system, a video stream from a video recorder and an audio stream from an audio recorder and encodes the global positioning system signal as global positioning data continuously embedded at intervals in the video stream or the audio stream at a frequency at the upper end or outside of the human audible range as a combined data stream which by operation of a geospatial media program can be concurrently displayed as a video in a first display area with a geospatial representation in second display area on a display surface with a plurality of coordinate location indicators located in the geospatial representation each at the coordinate location associated with the global positioning data embedded in the video.. .
Remote Geosystems, Inc.


08/18/16
20160241846 

Method and device for processing image


An image device generates a plurality of multi-view output images on the basis of an input image, and outputs the plurality of generated output images. The plurality of output images are outputted in a direction opposite to the views of the output images.
Samsung Electronics Co., Ltd.


08/18/16
20160241822 

Illumination device and projector


An illumination device includes: a light-emitting element that emits light in a first wavelength band; a substrate rotatable about a predetermined axis of rotation; a phosphor layer that is provided on the substrate at a first distance from the axis of rotation and excited by the light in the first wavelength band to emit light in a second wavelength band different from the first wavelength band; a scattering layer that is provided on the substrate at a second distance, different from the first distance, from the axis of rotation and on which the light in the first wavelength band emitted from the light-emitting element is incident; a first pickup optical system that is provided on the side of the phosphor layer opposite to the substrate; and a second pickup optical system that is provided on the side of the scattering layer opposite to the substrate.. .
Seiko Epson Corporation


08/18/16
20160241799 

Systems and methods for lensless image acquisition


Image-sensing devices include odd-symmetry gratings that cast interference patterns over a photodetector array. Grating features offer considerable insensitivity to the wavelength of incident light, and also to the manufactured distance between the grating and the photodetector array.
Rambus Inc.


08/18/16
20160241797 

Devices, systems, and methods for single-shot high-resolution multispectral image acquisition


Systems, methods, and devices for generating high-resolution multispectral light-field images are described. The systems and devices a main lens include a microlens array, a multispectral-filter array that comprises spectral filters that filter light in different wavelengths, and a sensor that is configured to detect incident light.
Canon Kabushiki Kaisha


08/18/16
20160241763 

Camera apparatus and electronic device including the same


An electronic device is provided that includes a first cover defining one surface, a second cover defining an opposite surface, and a camera assembly of which at least a portion is arranged in a space between the first cover and the second cover. The camera assembly includes a metal plate arranged substantially parallel to the first cover, a printed circuit board arranged between the first cover and the metal plate, the printed circuit board having an opening arranged substantially at a center, and at least one through-hole arranged outside the opening, an image sensor arranged in the opening and attached to the metal plate, a lens assembly arranged adjacent to the image sensor, and a side surface that surrounds at least a portion of the image sensor and the lens assembly.
Samsung Electronics Co., Ltd.


08/18/16
20160241750 

Camera device and electronic device with the same


An electronic device is provide, and may include a first cover forming a first surface of the electronic device, a second cover forming a second surface of the electronic device, the second surface being positioned opposite the first surface, and a camera assembly at least partially disposed in a space between the first cover and the second cover, wherein the camera assembly may include an image sensor, a board having the image sensor mounted thereon and including at least one cut around the image sensor, a lens assembly disposed adjacent to a light-receiving surface of the image sensor, a side wall surrounding at least a portion of the lens assembly and having a protrusion fitted in the at least one cut, and at least one solid body provided between at least a portion of an inner surface of the at least one cut and the protrusion.. .
Samsung Electronics Co., Ltd.


08/18/16
20160241699 

Device, providing exclusive wireless data transfer service between mobile applications and remote servers through an in-vehicle telematics device


A device, system and method for providing an exclusive wireless data transfer service between one or more authorized mobile applications (apps) and one or more remote servers through an in-vehicle telematics device is shown and described. The invention includes establishing a wireless network connection between the wwan communications electronics of the vehicle telematics device and one or more remote servers and a wireless network connection between the wpan communications electronics of the vehicle telematics device and a mobile device hosting one or more authorized apps.
Blue Dot Solutions, Llc


08/18/16
20160241621 

Internet provider subscriber communications system


A system, method, and computer readable medium for communicating at least one real-time specially-composed bulletin message to at least one subscriber of a provider of internet services, comprising a first device, and a second device communicably coupled to the first device, wherein the first device: accesses only subscriber upstream traffic to a destination web site requested by the subscriber, wherein the first device inter-connects between the at least one subscriber and the destination web site, identifies the at least one subscriber's identification based on the accessed subscriber upstream traffic automatically provided by the subscriber, and provides the unique subscriber identification to the second device located at the provider of internet services providing data services and management control to the first device, wherein the second device determines the subscriber associated with the unique subscriber identification.. .
Perftech, Inc.


08/18/16
20160241592 

Identification of trusted websites


This document describes techniques for identifying trusted websites. In one embodiment, a computer system can receive a request from user to access a website and a private image and a public image wherein the public image and the private image are associated with a user account that enables the user to access the website.
Vmware, Inc.


08/18/16
20160241589 

Method and identifying malicious website


Disclosed are a method and an apparatus for identifying a malicious website, the method including: acquiring uniform resource locators (urls) of websites determined as malicious websites and urls of websites determined as safe websites; performing feature extraction on the urls of the malicious websites to obtain a first feature character set and performing feature extraction on the urls of the safe websites to obtain a second feature character set; and determining whether a frequency of a first feature character obtained by feature extraction in the first feature character set is higher than a frequency in the second feature character set, and if the frequency of the first feature character in the first feature character set is higher than the frequency in the second feature character set, adding the first feature character into a malicious feature library, feature characters in the malicious feature library being used for identifying a malicious website.. .
Tencent Technology (shenzhen) Company Limited


08/18/16
20160241588 

Methods for determining cross-site scripting and related vulnerabilities in applications


The invention provides computer-implemented methods and computer systems for testing applications such as web-based (http) applications for cross-site scripting (xss) and related security vulnerabilities and permits the discovery of previously unknown xss and related vulnerabilities in applications without relying on known or previously generated static xss signatures. The invention may be applied to any type of xss or related vulnerability for any variation of application code..

08/18/16
20160241568 

Validation of a location resource based on recipient access


Aspects of the present disclosure relate to a method, a system, and a computer program product for validating a location resource, e.g., a hyperlink, embedded in a message for one or more recipients. The method includes receiving, by a computing node in a distributed computing environment and from a messaging application on a remote client computer, an identifier of a user profile and a location resource.
International Business Machines Corporation


08/18/16
20160241561 

Identifying a measure of online security


A computer-implemented method includes retrieving, by one or more processing devices and from one or more data repositories, user information; generating, based on the retrieved user information, a digital personal profile that is a composite of a set of pre-defined attributes; determining an aggregate strength of values of the set of pre-defined attributes in the digital personal profile; and generating, based on the determined aggregate strength, a digital security score that measures a level of online security of accessing resources over a computer network.. .
Fmr Llc


08/18/16
20160241560 

Client-site dom api access control


A method of restricting usage of a document object model (dom) application programming interfaces (api) is disclosed. A dom virtualization layer intercepts a usage of a dom api associated with one or more scripts running on a web browser.
Instart Logic, Inc.


08/18/16
20160241549 

Method and the secure authentication of a web site


Methods for the authentication of a web site by a visitor to the web site. The visitor uses a device, such as a portable device like a cell phone to compute a dynamic identification string and a one-time password.
Bouyant Holdings Limited


08/18/16
20160241536 

System and methods for user authentication across multiple domains


A new approach is proposed that contemplates systems and methods to support verification of a user's authentication information across multiple websites/domains owned and/or operated by different entities, which share users during a single session. When the user attempts to login to a first website/domain, he/she is required to provide authentication information in addition to user-id/password.
Wepay, Inc.


08/18/16
20160241515 

Method and system for providing "anywhere access" for fixed broadband subscribers


A method is implemented by a border network gateway for enabling an end user device to access home network resources and receive subscriber services in a visited network. The method includes receiving a connection from the end user device, querying an authentication server to obtain a virtual extended local area network (vxlan) network identifier (vni) of the end user device, and checking for the vni for the end user device in a demultiplexor table of the border network gateway.
Telefonaktiebolaget L M Ericsson (publ)


08/18/16
20160241479 

System and method to eliminate duplicate byte patterns in network streams


A mobile codec system for reducing network traffic and methods for making and using the same. The mobile codec system reduces duplicate byte patterns for mobile devices.
Actmobile Networks, Inc.


08/18/16
20160241454 

Location-based website hosting optimization


A hosting provider may host a website at a first hosting location based on initial business information received from a hosting customer, perhaps while the hosting customer created an account. The initial business information may include, as non-limiting examples, whether the business is a local or non-localized business, business addresses and/or registered domain names.
Go Daddy Operating Company, Llc


08/18/16
20160241450 

Management apparatus and information processing system


A management apparatus includes a processor to collect resource usage quantities of one or more first site processes executed on an information processing apparatus of a first site, and the resource usage quantities of one or more second site processes executed on an information processing apparatus of a second site to which the processes of the first site are migrated, and to define, as resource control information, at least one of stopping any one or more of the second site processes and reducing resources allocated to any one or more of the second site processes corresponding to variations of the resource usage quantities of the first site processes and the second site processes, the resource usage quantities being collected by the processor.. .
Fujitsu Limited


08/18/16
20160241448 

Common run-time design-time environment


The present disclosure is related to methods, systems, and machine-readable media for a common run-time design-time environment. That a user has design credentials associated with a website can be confirmed.
Vmware, Inc.


08/18/16
20160241350 

Method and analog and digital audio blend for hd radio receivers


A method and apparatus are provided for blending analog and digital portions of a composite digital radio broadcast signal by processing compressed audio packets to compute corresponding digital audio quality indicator values, storing the compressed audio packets in an audio blend buffer, processing audio information from each compressed audio packet stored in the audio blend buffer with an audio decoder to generate decompressed digital audio signal samples, and using the digital audio quality indicator values to guide a blending process for combining analog audio signal samples with the digital audio signal samples to produce an audio output by preventing unnecessary blending back and forth between analog and digital if the digital audio quality indicator values indicate that the compressed audio packets are degraded or impaired.. .
Ibiquity Digital Corporation


08/18/16
20160241303 

Upstream power amplifier


A communication device includes a communication interface, a number of variable power amplifiers (vpas), and a processor. Some of the vpas are configured to process analog signals to generate processed analog signals (e.g., each vpa configured to process one of the analog signals to generate one of the processed analog signals based on a respective vpa control signal).
Broadcom Corporation


08/18/16
20160241297 

Multi-band isolator assembly


An isolator assembly is configured to provide isolation in each of multiple non-overlapping frequency bands and includes a selection network to select one of the multiple non-overlapping frequency bands for an isolation operation. During the isolation operation, the isolator assembly prevents signal coupling between antennas that are positioned on opposite sides of the isolator assembly..
Microsoft Technology Licensing, Llc


08/18/16
20160241291 

Electronic apparatus


An electronic apparatus comprises a display unit and a first cover member that is located on a surface of the electronic apparatus and includes a layer made of sapphire. The first cover member has a first surface opposed to a display surface of the display unit and a second surface opposite to the first surface.
Kyocera Corporation


08/18/16
20160241255 

Semiconductor device, electronic component, and electronic device


A semiconductor device with a novel structure. An upper-bit grayscale voltage and a lower-bit grayscale voltage are separately produced, and then the grayscale voltages are converted into currents and the currents are synthesized.
Semiconductor Energy Laboratory Co., Ltd.


08/18/16
20160241232 

Methods of operating a double-base-contact bidirectional bipolar junction transistor


Methods, systems, circuits, and devices for power-packet-switching power converters using bidirectional bipolar transistors (b-trans) for switching. Four-terminal three-layer b-trans provide substantially identical operation in either direction with forward voltages of less than a diode drop.
Ideal Power Inc.


08/18/16
20160241225 

Current-controlled active diode


This application relates to an active diode circuit for letting current pass in one direction and blocking current in the opposite direction. The active diode circuit comprises a transistor, a control voltage generation circuit for generating a control voltage that is supplied to a control terminal of the transistor, and a sensing circuit for detecting a quantity indicative of a current flowing through the transistor.
Dialog Semiconductor (uk) Limited


08/18/16
20160241216 

Multi-bit cell attenuator


Hybrid-coding, multi-cell architecture and operating techniques for step devices provide advantages over binary-coded and thermometer-coded step devices by minimizing or avoiding glitches common in the transient response of binary-coded step devices and by minimizing or avoiding significant increases or degradation in one or more of area, package dimensions, pin counts, power consumption, insertion loss and parasitic capacitance common to thermometer-coded step devices having equivalent range and resolution.. .

08/18/16
20160241160 

Resonant type high frequency power supply device and switching circuit for resonant type high frequency power supply device


Disclosed is a resonant type high frequency power supply device provided with a power element that performs a switching operation, the power supply device including a high frequency pulse drive circuit 1 that transmits a pulse-shaped voltage signal having a high frequency exceeding 2 mhz to the power element to drive the power element, wherein a voltage signal from the high frequency pulse drive circuit 1 is subjected to partial resonance by an impedance of a signal line of the voltage signal and a parasitic capacitance of the power element.. .
Mitsubishi Electric Engineering Company, Limited


08/18/16
20160241146 

Sensor data acquisition system with integrated power management


A microelectromechanical systems (mems) sensor with an integrated power management system that performs analog to digital conversion of weak signals is provided. The mems sensor can include a switching regulator that steps a supply voltage down to a voltage appropriate for an analog to digital converter (a/d converter).
Invensense, Inc.


08/18/16
20160241123 

Magnetic gear device


Cylindrical outer and inner rotors coaxially supported so as to be rotatable, and a cylindrical stator interposed between the rotors are provided, and rotational torque is transmitted between the outer rotor and the inner rotor by interaction between: a plurality of magnets uniformly arranged on the inner circumference of the outer rotor; a plurality of magnets uniformly arranged on the outer circumference of the inner rotor; and a plurality of magnetic bodies juxtaposed at equal intervals in the circumferential direction of the stator. Rod-shaped magnetic bodies extending in the axial direction of the stator are used, and each magnetic body is placed in skew arrangement with a deviation amount in the circumferential direction corresponding to 1/12 to ¼ of the juxtaposition pitch in the circumferential direction between one axial end and the other axial end.
Hitachi Metals, Ltd.


08/18/16
20160241118 

Drive system in the form of a torque motor


A drive system in the form of a torque motor, comprising a stator (1), a rotor (3) and exciter coils (2) on the stator and permanent magnets (4) on the rotor (3), the magnets being located radially opposite one another across an air gap such that electrical excitation of the exciter coils (2) creates magnetic fields extending across the gap and rotating the rotor (3) relative to the stator (1), characterized in that, with the drive system arranged/oriented for normal operation and with the rotor (3) located on the inside, a lower half of the stator (1) has a smaller number of exciter coils than an upper half and, with the stator (1) located on the inside, the upper half of the stator (1) has a smaller number of exciter coils than the upper [lower] half. (fig.

08/18/16
20160241088 

Controlling inductive power transfer system


An inductive power transfer system comprises a primary unit operable to generate an electromagnetic field and at least one secondary device, separable from the primary unit, and adapted to couple with the field when the secondary device is in proximity to the primary unit so that power can be received inductively by the secondary device from the primary unit without direct electrical conductive contacts therebetween. The system detects if there is a substantial difference between, on the one hand, a power drawn from the primary unit and, on the other hand, a power required by the secondary device or, if there is more than one secondary device, a combined power required by the secondary devices.
Access Business Group International Llc


08/18/16
20160240984 

Plug connector assembly with light pipe and plural leds


A plug connector assembly including a cable connected to a plug connector, the plug connector including an insulative cover having a light region, a printed circuit board (pcb) received in the insulative cover and having a first surface and an opposite second surface, a mating member mounted on the pcb and extending through the insulative cover, a pair of light-emitting diode (led) lamps, and a light guide disposed between the two led lamps, wherein the mating member is mounted on the first surface of the pcb and the two led lamps are mounted on the second surface of the pcb and wherein the light guide has a top face exposed to the light region of the insulative cover.. .
Foxconn Interconnect Technology Limited


08/18/16
20160240983 

Electrical connector


An electrical connector includes an insulative housing having a front space and a rear space, a number of electrical contacts each having a spring section projecting into the front space and a soldering section, an internal circuit board disposed in the rear space, and a pair of spring tabs secured to opposite sides of the insulative housing. The internal circuit board has a number of first golden fingers to connect with the soldering sections, a number of second golden fingers.
Alltop Electronics (suzhou) Ltd.


08/18/16
20160240981 

Electrical connector and making the same


An electrical connector (100) includes an insulative housing (1), a number of conductive contacts (5) retained in the insulative housing, a metal shell (4) embedded in the insulative housing and a metal cover (3) assembled to the insulative housing. The insulative housing includes a base (10) and a slot (6) formed above the base, and the conductive contacts embedded into the base and defining contact portions (51) protruding into the slot and soldering portions (52) opposite to the contact portions.
Foxconn Interconnect Technology Limited


08/18/16
20160240978 

Electrical connector


An electrical connector is provided and includes an insulating body, a plurality of signal terminals, and a plurality of ground terminals. The insulating body includes a slot extending therein.
Tyco Electronics (shanghai) Co. Ltd.


08/18/16
20160240953 

Electric connector


The contact includes a contact protrusion that is inserted into the contact insertion hole protrudes from the optical axis direction partition wall into the camera lens module side, and functions as an electric contact for the camera lens module, a fixing part fixed to the housing, and a connection part that elastically connects the contact protrusion with the fixing part. The connection part includes a connection main body extending in the radial direction so as to recede from the fixing part, and a folding part disposed on the opposite side to the fixing part across the connection main body.
Japan Aviation Electronics Industry, Ltd.


08/18/16
20160240939 

Conductive sleeved fastener assembly


A conductive fastener assembly, system, and method, wherein the fastener assembly includes a fastener, a fastener sleeve, a nut, and a lubricant coating. The lubricant coating is deposited on a distal portion of a fastener shank and is omitted from the rest of the fastener.
The Boeing Company


08/18/16
20160240933 

Dipole antenna element with open-end traces


A first-band radiating element configured to operate in a first frequency band may be designed for reducing distortion associated with one or more second-band radiating element configured to operate in a second frequency band. The first-band radiating element may include a first printed circuit board.
Commscope Technologies Llc


08/18/16
20160240932 

Node for high-rise building coverage


An antenna arrangement with two horizontal and two vertical array antennas. A first horizontal antenna port and a second vertical antenna port are connected to a first polarization.
Telefonaktiebolaget Lm Ericsson (publ)


08/18/16
20160240926 

Deformed folded dipole antenna


A deformed folded dipole antenna includes: a feed-side parallel part; a non-feed side parallel part arranged to be parallel to the feed-side parallel part; and a pair of short circuit portions respectively connecting to both ends of the feed-side parallel part and both ends of the non-feed side parallel part. The non-feed side parallel part includes: a pair of opposite sides that are arranged to be opposite from each other; and a connecting side that connects one ends of the pair of opposite sides together.
Denso Corporation


08/18/16
20160240920 

Low loss antenna switch


The present invention relates to a low loss antenna switch. The antenna switch comprises a plurality of switch module and a plurality of transmitting/receiving terminals, wherein one end of each switch module is connected to an antenna unit and the other end of each switch module is connected to each transmitting and receiving end respectively.
Airoha Technology Corp.


08/18/16
20160240913 

Antenna device and electronic timepiece


An antenna device housed in a metallic case body of an electronic timepiece includes: a first substrate which is provided on the side of a back over of the metallic case body and on which a ground pattern and an wireless communication unit as a power feeding circuit are formed; a second substrate which is arranged on the opposite side of the movement and on which a chip antenna is formed; and a conductive electrode which is arranged inside the movement and has one end connected to the wireless communication unit and the other end connected to the chip antenna.. .
Seiko Epson Corporation


08/18/16
20160240910 

Antenna azimuth alignment monitor


Apparatus for monitoring an alignment of a base station antenna at a cell site. The apparatus may include an alignment monitor configured to be attached to an antenna mounting bracket for mounting the base station antenna to a support structure.
Commscope Technologies Llc


08/18/16
20160240908 

Radio frequency connection arrangement


A radio frequency transmission arrangement comprises a ground plate having an aperture comprising a slot with an elongate cross-section and substantially parallel sides, and a first and second transmission line. The thickness of the ground plate is greater than a width of the slot.
Cambium Networks Limited


08/18/16
20160240865 

Corrosion resistant metal bipolar plate for a pemfc including a radical scavenger


The present disclosure includes fuel cell bipolar plates and methods of forming a radical scavenging coating on a bipolar plate. The bipolar plates may include a steel substrate, a middle layer contacting the steel substrate and including a bulk material and a radical scavenging material, and a conductive layer contacting the middle layer.
Ford Global Technologies, Llc


08/18/16
20160240855 

Alkaline battery and manufacturing alkaline battery


A method for manufacturing an alkaline battery includes assembling an alkaline battery with a positive electrode, a negative electrode, a separator, and an electrolyte. The positive electrode includes cobalt and a positive electrode active material particle, which has a main component that is nickel hydroxide.
Primearth Ev Energy Co., Ltd.


08/18/16
20160240850 

Transition metal composite hydroxide and lithium composite metal oxide


Provided are a transition metal mixed hydroxide comprising an alkali metal other than li, so4 and a transition metal element, wherein the molar ratio of the molar content of the alkali metal to the molar content of the so4 is not less than 0.05 and less than 2, and a lithium mixed metal oxide obtained by calcining a mixture of the transition metal mixed hydroxide and a lithium compound by maintaining the mixture at a temperature of 650 to 1000° c.. .
Sumitomo Chemical Company, Limited


08/18/16
20160240849 

Nonaqueous electrolyte battery and battery pack


The nonaqueous electrolyte battery according to one embodiment includes a positive electrode and a negative electrode. The positive electrode contains a positive electrode active material containing manganese-containing composite oxide.
Kabushiki Kaisha Toshiba


08/18/16
20160240847 


A method of manufacturing a negative electrode for a nonaqueous electrolyte secondary battery, the method includes mixing negative electrode active material particles and ferroelectric particles with each other to form first composite particles in which the ferroelectric particles are attached to the negative electrode active material particles; mixing the first composite particles and a binder with each other to form granulated particles; applying pressure to an aggregate of the granulated particles to form a sheet-shaped negative electrode mixture layer; and arranging the negative electrode mixture layer on a main surface of a negative electrode current collector foil.. .
Toyota Jidosha Kabushiki Kaisha


08/18/16
20160240846 

Positive active material for lithium secondary battery, producing the same, electrode for lithium secondary battery, lithium secondary battery and energy storage apparatus


A positive active material for a lithium secondary battery containing a lithium transition metal composite oxide having a hexagonal crystal structure in which the transition metal (me) includes ni, co and mn, wherein in the lithium transition metal composite oxide, a molar ratio of ni to the transition metal (me) (ni/me) is 0.5 or more and 0.9 or less, a molar ratio of co to the transition metal (me) (co/me) is 0.1 or more and 0.3 or less, a molar ratio of mn to the transition metal (me) (mn/me) is 0.03 or more and 0.3 or less, and a value obtained by dividing a half width ratio f(003)/f(104) at a potential of 4.3 v (vs. Li/li+) by a half width ratio f(003)/f(104) at a potential of 2.0 v (vs.
Gs Yuasa International Ltd.


08/18/16
20160240839 

Manufacturing non-aqueous electrolyte secondary battery


A manufacturing method for a non-aqueous electrolyte secondary battery includes: forming a powder; forming a sheet-like green compact; and forming a heat-resistant layer. The powder contains composite particles and a solvent.
Toyota Jidosha Kabushiki Kaisha


08/18/16
20160240832 

Connection arrangement for connecting at least one voltage source and/or voltage sink which is in the form of a cell to an external electrical component and electrical arrangement comprising a connection arrangement


A connection arrangement is disclosed. The connection arrangement comprises a cell contact in contact with a cell in the form of at least one of a voltage source and a voltage sink, a cell connection line connected to the cell contact, and a connection line connected to the cell connection line at an end opposite the cell contact, the connection line connecting the cell connection line to an external electrical component..
Te Connectivity Germany Gmbh


08/18/16
20160240819 

Organic light-emitting display apparatus and manufacturing the same


An organic light-emitting display apparatus includes a substrate, an optical layer formed over the substrate and a light emitting pixel formed over the optical layer. The optical layer includes a first refractive index layer portion having a first refractive index, a second refractive index layer portion having a second refractive index greater than the first refractive index.
Samsung Display Co., Ltd.


08/18/16
20160240818 

Organic light emitting display device


An organic light display device includes a first substrate, light emitting structures, a second substrate and a reflective member. The first substrate includes a plurality of pixel regions, each pixel region including a plurality of sub-pixel regions, and a reflective region which surrounds the sub-pixel regions.
Samsung Display Co., Ltd.


08/18/16
20160240816 


The laminate includes an organic semiconductor film, a protective film on the organic semiconductor film, and a resist film on the protective film, in which the resist film is formed of a photosensitive resin composition that contains a photoacid generator (a) which generates an organic acid of which a pka of the generated acid is −1 or less and a resin (b) which reacts with an acid generated by the photoacid generator so that the rate of dissolution in a developer containing an organic solvent is decreased.. .

08/18/16
20160240786 

Methods and compositions for enhancing processability and charge transport of polymer semiconductors and devices made therefrom


Methods of making solid-state semiconducting films. The methods include forming a mixture by mixing at least two monomers in a pre-determined proportion such that at least one of the at least two monomers contains at least one non-conjugation spacer.
Purdue Research Foundation


08/18/16
20160240736 

Semiconductor chip and separating a composite into semiconductor chips


The invention concerns a semiconductor chip (100) with a semiconductor body (2) having a semiconductor layer sequence, and with a substrate body (4) and at least one upper side contact (8). In projection the semiconductor chip (100) has a shape which deviates from a rectangular shape.
Osram Opto Semiconductors Gmbh


08/18/16
20160240692 

Systems and methods for assembling two-dimensional materials


Heterostructures can include multilevel stacks with an electrical contact on a one-dimensional edge of a two-dimensional active layer. A multilevel stack can be provided having a first two-dimensional layer encapsulated between a second layer and a third layer.
The Trustees Of Columbia University In The City Of New York


08/18/16
20160240689 

Thin film transistor


A thin film transistor is provided, and includes a gate electrode, a first gate dielectric layer, a second gate dielectric layer, a channel layer, a source electrode and a drain electrode. The gate electrode is disposed on a substrate.
Hannstar Display Corporation


08/18/16
20160240684 

Semiconductor device and manufacturing the same


A miniaturized transistor, a transistor with low parasitic capacitance, a transistor with high frequency characteristics, or a semiconductor device including the transistor is provided. The semiconductor device includes a first insulator, an oxide semiconductor over the first insulator, a first conductor and a second conductor that are in contact with the oxide semiconductor, a second insulator that is over the first and second conductors and has an opening reaching the oxide semiconductor, a third insulator over the oxide semiconductor and the second insulator, and a fourth conductor over the third insulator.
Semiconductor Energy Laboratory Co., Ltd.


08/18/16
20160240683 

Semiconductor device and display device including the semiconductor device


To reduce parasitic capacitance in a semiconductor device having a transistor including an oxide semiconductor. The transistor includes a first gate electrode, a first gate insulating film over the first gate electrode, an oxide semiconductor film over the first gate insulating film, and source and drain electrodes electrically connected to the oxide semiconductor film.
Semiconductor Energy Laboratory Co., Ltd.


08/18/16
20160240681 

Stacked gate-all-around finfet and ming the same


A device includes a first semiconductor strip, a first gate dielectric encircling the first semiconductor strip, a second semiconductor strip overlapping the first semiconductor strip, and a second gate dielectric encircling the second semiconductor strip. The first gate dielectric contacts the first gate dielectric.
Taiwan Semiconductor Manufacturing Company, Ltd.


08/18/16
20160240677 

Epitaxial wafer and manufacturing the same


A method of manufacturing an epitaxial wafer, including a silicon substrate having a surface sliced from single-crystalline silicon and a silicon epitaxial layer deposited on the surface of the silicon substrate, includes an oxygen concentration controlling heat treatment process in which a heat treatment of the epitaxial layer is performed under a non-oxidizing atmosphere after the epitaxial growth such that an oxygen concentration of the surface of the silicon epitaxial layer is set to 1.0×1017 to 12×1017 atoms/cm3 (astm f-121, 1979).. .
Sumco Corporation


08/18/16
20160240659 

Laterally diffused metal oxide semiconductor device and manufacturing method therefor


An ldmos device, comprising a substrate (202), a gate electrode (211) on the substrate (202), a buried layer area in the substrate (202), and a diffusion layer on the buried layer area, wherein the buried layer area comprises a first buried layer (201) and a second buried layer (203), wherein the conduction types of impurities doped in the first buried layer (201) and the second buried layer (203) are opposite; the diffusion layer comprises a first diffusion area (205) and a second diffusion area (206), wherein the first diffusion area (205) is located on the first buried layer (201) and abuts against the first buried layer (201), and the second diffusion area (206) is located on the second buried layer (203) and abuts against the second buried layer (203); and the conduction types of impurities doped in the first buried layer (201) and the first diffusion area (205) are the same, and the conduction types of impurities doped in the second buried layer (203) and the second diffusion area (206) are the same. Additionally, also disclosed is a manufacturing method for the ldmos device.
Csmc Technologies Fab1 Co., Ltd.


08/18/16
20160240652 

Finfets with wrap-around silicide and ming the same


A device includes isolation regions extending into a semiconductor substrate, with a substrate strip between opposite portions of the isolation regions having a first width. A source/drain region has a portion overlapping the substrate strip, wherein an upper portion of the source/drain region has a second width greater than the first width.
Taiwan Semiconductor Manufacturing Company, Ltd.


08/18/16
20160240649 

Controlling current or mitigating electromagnetic or radiation interference effects using multiple and different semi-conductive channel regions generating structures


Systems and methods for controlling current or mitigating electromagnetic or radiation interference effects using multiple different semi-conductive channel regions generating structures formed by multiple different semi-conductive electrical current or voltage control structures. One embodiment includes providing a first and second metal oxide semiconductor field effect transistor (mosfet) sections formed on opposite sides of a junction field effect transistor (jfet) such that operation of the jfet modulates or controls current otherwise controlled by an electrical path of the mosfet sections.
The United States Of America As Represented By The Secretary Of The Navy


08/18/16
20160240628 

Electrical device and manufacturing same


A method for manufacturing an electrical device is disclosed. In an embodiment, the method includes providing a first layer of a first conductivity type, providing an intrinsic layer onto the first layer, providing one or more trenches into the intrinsic layer, filling the one or more trenches with a material of a second conductivity type opposite to the first conductivity type, and providing a second layer of a second conductivity type onto the intrinsic layer..
Infineon Technologies Ag


08/18/16
20160240627 

Methods of forming metal silicide layers including dopant segregation


A method of forming a metal silicide layer can include implanting dopants to a first depth below a surface of a semiconductor substrate including an active area. A metal-silicon composite layer can be formed on the semiconductor substrate and the metal-silicon composite layer can be silicided to form the metal silicide layer on the active area..
Samsung Electronics Co., Ltd.


08/18/16
20160240624 

Semiconductor devices and methods for manufacturing the same


Semiconductor devices and methods for manufacturing the same are provided. An example method may include: forming a sacrificial gate stack on a substrate; forming a gate spacer on sidewalls of the sacrificial gate stack; forming an interlayer dielectric layer on the substrate and planarizing it to expose the sacrificial gate stack; partially etching back the sacrificial gate stack to form an opening; expanding the resultant opening so that the opening is in a shape whose size gradually increases from a side adjacent to the substrate towards an opposite side away from the substrate; and removing a remaining portion of the sacrificial gate stack and forming a gate stack in a space defined by the gate spacer..
Institute Of Microelectronics, Chinese Academy Of Sciences


08/18/16
20160240617 

Group iii-n transistors on nanoscale template structures


A iii-n semiconductor channel is formed on a iii-n transition layer formed on a (111) or (110) surface of a silicon template structure, such as a fin sidewall. In embodiments, the silicon fin has a width comparable to the iii-n epitaxial film thicknesses for a more compliant seeding layer, permitting lower defect density and/or reduced epitaxial film thickness.
Intel Corporation


08/18/16
20160240611 

Corner transistor suppression


The threshold voltage of parasitic transistors formed at corners of shallow trench isolation regions is increased and mobility decreased by employing a high-k dielectric material. Embodiments include sti regions comprising a liner of a high-k dielectric material extending proximate trench corners.
Globalfoundries Singapore Pte. Ltd.


08/18/16
20160240597 

Package substrate and package sturcture


The present invention provides a package method of a substrate and a package structure. The method comprises: step 1, providing the substrate (1) and a package plate (3), and the package plate (3) comprises a spreading surface (31); step 2, forming at least one groove (311); step 3, spreading seal glue (50) to form the continuous frame (5), and a recess (51) is formed in the frame (5) corresponding to the groove (311); step 4, positioning underfill (70) inside an area surrounded by the frame (5); step 5, oppositely fitting the substrate (1) and the package plate (3), and an air outlet (20) is formed at a position of the recess (51) of the frame (5) between the substrate (1) and the package plate (3); step 6, extracting air between the substrate (1) and the package plate (3) through the air outlet (20); step 7, laminating the substrate (1) and the package plate (3); step 8, irradiating and solidifying the seal glue (50) and the underfill (70) with uv light..
Shenzhen China Star Optoelectronics Technology Co., Ltd.


08/18/16
20160240584 

High-performance radiation detectors and methods of fabricating thereof


A method of fabricating a solid state radiation detector method includes mechanically lapping and polishing the first and the second surfaces of a semiconductor wafer using a plurality of lapping and polishing steps. The method also includes growing passivation oxide layers by use of oxygen plasma on the top of the polished first and second surfaces in order to passivate the semiconductor wafer.
Redlen Technologies, Inc.


08/18/16
20160240578 

Cmos image sensor structure


A semiconductor device includes a substrate, a logic gate structure, a photosensitive gate structure, a hard mask layer, a first spacer, a first source, a first drain, a second spacer, a second source and a second drain. The logic gate structure and the photosensitive gate structure are disposed on a surface of the substrate.
Taiwan Semiconductor Manufacturing Co., Ltd.


08/18/16
20160240575 

Optical device


The invention provides an optical device. The optical device includes an image capture unit, at least one light emitting device, and a light conductor.
Novatek Microelectronics Corp.


08/18/16
20160240546 

Non-volatile storage element with suspended charge storage region


Suspended charge storage regions are utilized for non-volatile storage to decrease parasitic interferences and increase charge retention in memory devices. Charge storage regions are suspended from an overlying intermediate dielectric material.
Sandisk Technologies Inc.


08/18/16
20160240535 

Cmos nfet and pfet comparable spacer width


Embodiments of the present disclosure provide a structure including: a p-type field effect transistor (pfet device) and an n-type field effect transistor (nfet device) each having sidewall spacers on opposite sidewalls of a gate and source drain region adjacent to the sidewall spacers, a distance between the pfet source drain region and the pfet gate is substantially equal to a distance between the nfet source drain region and the nfet gate.. .
International Business Machines Corporation


08/18/16
20160240534 

Techniques for improving gate control over transistor channel by increasing effective gate length


Techniques are disclosed for improving gate control over the channel of a transistor, by increasing the effective electrical gate length (leff) through deposition of a gate control layer (gcl) at the interfaces of the channel with the source and drain regions. The gcl is a nominally undoped layer (or substantially lower doped layer, relative to the heavily doped s/d fill material) that can be deposited when forming a transistor using replacement s/d deposition.
Intel Corporation


08/18/16
20160240524 

Electrostatic discharge (esd) protection device


An electrostatic discharge (esd) protection device includes a semiconductor layer having a first doped region, a second doped region, and an intrinsic region formed therein, and a plurality of insulating elements respectively formed therein. The plurality of insulating elements is respectively formed in a portion of the semiconductor layer between the first, second and third doped regions.
Mediatek Inc.


08/18/16
20160240521 

Circuit device and the production thereof


A circuit device has a base plate, a first substrate arranged on a first outer side of the base plate, a second substrate arranged on a second outer side opposite the first outer side of the base plate, at least one electrical connection element that electrically connects the first substrate and the second substrate, at least one electronic component arranged on or in the first substrate, at least one electronic component arranged on or in the second substrate, a mold package molded around the two substrates and the electronic components arranged thereon, and at least one contacting element for electrically contacting the first substrate and/or the second substrate. The at least one contacting element is electrically conductively connected to the first substrate and/or the second substrate and is led out from the mold package..
Conti Temic Microelectronic Gmbh


08/18/16
20160240518 

Light emitting device


Each of a plurality of light emitting elements has a polygonal shape with five or more corners. An interior angle at each of the corners is less than 180°.
Nichia Corporation


08/18/16
20160240516 

Method of manufacturing semiconductor device array


Present disclosure provides a method for manufacturing a semiconductor device array, including (1) providing a temporary substrate; (2) forming a plurality of discrete semiconductor structures over the temporary substrate; and (3) removing a surface portion of the temporary substrate to expose a peripheral bottom surface of the discrete semiconductor structure. Present disclosure also provides a method for transferring discrete semiconductor device, including (1) detaching discrete semiconductor structures of a first type from a first temporary substrate supporting the discrete semiconductor structures of the first type by a transfer stamp; (2) carrying the discrete semiconductor structures over a target substrate by the transfer stamp; and (3) dismounting the discrete semiconductor structures of the first type from the transfer stamp to predetermined sites on the target substrate.
Globalwafers Co., Ltd.


08/18/16
20160240508 

Package structures and methods of forming the same


Packages structure and methods of forming them are discussed. A structure includes a first die, a first encapsulant at least laterally encapsulating the first die, and a redistribution structure on the first die and the first encapsulant.
Taiwan Semiconductor Manufacturing Company, Ltd.


08/18/16
20160240477 

Semiconductor arrangement and formation thereof


A semiconductor arrangement and method of formation are provided. The semiconductor arrangement includes an interconnect which includes an interconnect metal plug surrounded by a second metal layer.
Taiwan Semiconductor Manufacturing Company Limited


08/18/16
20160240476 

Self-aligned integrated line and via structure for a three-dimensional semiconductor device


At least one via level dielectric layer and at least one line level dielectric layer are sequentially formed over an array of device structures. Conductive line structures are formed within the at least one line level dielectric layer.
Sandisk Technologies Inc.


08/18/16
20160240468 

Anisotropic conductive film


An anisotropic conductive film that is capable of suppressing the occurrence of short circuit during anisotropic conductive connection of electrical components having decreased pitch, and suppressing a decrease in conduction reliability during storage under a high temperature and high humidity environment has a structure in which a conductive particle-containing layer containing conductive particles that are arranged in a single layer in a layered binder resin composition is layered on at least a first insulating resin composition layer. The lowest melt viscosity of the binder resin composition is equal to or higher than that of a first insulating resin composition.
Dexerials Corporation


08/18/16
20160240466 

Electronic package and fabrication method thereof


A method for fabricating an electronic package is provided, including the steps of: providing at least a packaging structure, wherein the packaging structure has a packaging substrate having opposite first and second sides, an electronic element disposed on the first side of the packaging substrate and a plurality of conductors formed on the first side of the packaging substrate; encapsulating the packaging structure with an insulating layer, wherein the insulating layer covers the packaging substrate; and forming an rdl (redistribution layer) structure on the insulating layer, wherein the rdl structure is electrically connected to the conductors. Therefore, the area of the insulating layer is not required to correspond to the area of the packaging substrate, thus allowing the area of the packaging substrate to be reduced according to the practical need so as to reduce the width of the electronic package..
Siliconware Precision Industries Co., Ltd.


08/18/16
20160240464 

Hybrid circuit board and making the same, and semiconductor package structure


A hybrid circuit board includes an insulate molding layer having a first surface and a second surface which is opposite to the first surface, a solder mask layer on the first surface, a conductive patterned layer on the first surface and embedded in the solder mask layer, and a plurality of conductive pillars embedded in the insulate molding layer. The thickness of the conductive patterned layer is substantially equal to the thickness of the solder mask layer.
Zhen Ding Technology Co., Ltd.


08/18/16
20160240459 

Pad configurations for an electronic package assembly


Embodiments of the present disclosure provide an electronic package assembly comprising a solder mask layer, the solder mask layer having at least one opening, and a plurality of pads coupled to the solder mask layer, wherein at least one pad of the plurality of pads includes (i) a first side, (ii) a second side, the first side being disposed opposite to the second side, (iii) a terminal portion and (iv) an extended portion, wherein the first side at the terminal portion is configured to receive a package interconnect structure through the at least one opening in the solder mask layer, the package interconnect structure to route electrical signals between a die and another electronic device that is external to the electronic package assembly, and wherein the second side at the extended portion is configured to receive one or more electrical connections from the die.. .
Marvell World Trade Ltd.


08/18/16
20160240451 

Interconnect structure for semiconductor package and fabricating the interconnect structure


A semiconductor package includes a carrier, at least and adhesive portion, a plurality of micro pins and a die. The carrier has a first surface and second surface opposite to the first surface.
Taiwan Semiconductor Manufacturing Co., Ltd.


08/18/16
20160240450 

Semiconductor device


A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces.
Rohm Co., Ltd.


08/18/16
20160240434 

Method for via plating with seed layer


Presented herein is a method for plating comprising providing a substrate having a dielectric layer formed over a trace, and forming a via/trench opening extending through the dielectric layer, the via/trench opening exposing a surface of the trace. The method further comprises forming a seed layer in the via/trench opening and contacting the trace and forming a protection layer over the seed layer.
Taiwan Semiconductor Manufacturing Company, Ltd.


08/18/16
20160240429 

Dielectric structures with negative taper and methods of formation thereof


A method for forming a dielectric structure includes forming an auxiliary layer over a substrate, and forming a hole within the auxiliary layer. A fill material is deposited into the hole.
Infineon Technologies Ag


08/18/16
20160240428 

Method of forming an interconnect structure having an air gap and structure thereof


A semiconductor device and method of manufacture are provided which utilize an air gap to help isolate conductive structures within a dielectric layer. A first etch stop layer is deposited over the conductive structures, and the first etch stop layer is patterned to expose corner portions of the conductive structures.
Taiwan Semiconductor Manufacturing Company, Ltd.


08/18/16
20160240398 

Wafer holder


A wafer holder includes a holder main body, a supporting member, and a limiting member. The holder main body has a through hole region.
Hermes-epitek Corporation


08/18/16
20160240397 

Method for moulding and surface processing electronic components and electronic component produced with this method


The invention relates to a method for moulding and surface processing electronic components wherein a grid of electronic components is attached on a carrier; subsequently foil is placed against the side of the electronic components opposite to the carrier and are the electronic components partially encapsulated. After moulding the foil is removed from the electronic components and a free side of the components is surface processed.
Besi Netherlands B.v.


08/18/16
20160240396 

Apparatus for manufacturing semiconductor package and manufacturing semiconductor package using the same


The inventive concepts provide an apparatus for manufacturing a semiconductor package and a method for manufacturing a semiconductor package using the same. The apparatus includes a mold unit with a cavity formed by an inner space of the mold unit.
Samsung Electronics Co., Ltd.


08/18/16
20160240391 

Package structures and forming the same


Package structures and methods of forming package structures are described. A method includes depositing and patterning a first dielectric material.
Taiwan Semiconductor Manufacturing Company, Ltd.


08/18/16
20160240390 

Multilevel leadframe


A method for forming a multilevel leadframe for an integrated circuit is provided. A conductive sheet is etched from one side to form a thinner region within a frame region for leads lines and bond pads.
Texas Instruments Incorporated


08/18/16
20160240380 

Method of manufacturing silicon carbide semiconductor device


A method of manufacturing a silicon carbide semiconductor device includes a step of preparing a silicon carbide substrate having a first main surface and a second main surface located opposite to the first main surface, a step of forming a doped region in the silicon carbide substrate by doping the first main surface with an impurity, a step of forming a first protecting film on the first main surface, and a step of forming a second protecting film on the second main surface, the step of forming a first protecting film being performed after the step of forming a doped region, the method further including a step of activating the impurity included in the doped region by annealing with at least a portion of the first main surface covered with the first protecting film and at least a portion of the second main surface covered with the second protecting film.. .
Sumitomo Electric Industries, Ltd.


08/18/16
20160240375 

Stress mitigating amorphous sio2 interlayer


A method of forming a reo dielectric layer and a layer of a-si between a iii-n layer and a silicon substrate. The method includes depositing single crystal reo on the substrate.
Translucent, Inc.


08/18/16
20160240373 

Method for forming oxide layer by oxidizing semiconductor substrate with hydrogen peroxide


In some embodiments, an oxide layer is grown on a semiconductor substrate by oxidizing the semiconductor substrate by exposure to hydrogen peroxide at a process temperature of about 500° c. Or less.
Asm Ip Holding B.v.


08/18/16
20160240357 

Physical vapor deposition system and physical vapor depositing method using the same


A physical vapor deposition system includes a chamber, a cover plate, a pedestal, and a collimator. The cover plate is disposed on the chamber for holding a target.
Taiwan Semiconductor Manufacturing Co., Ltd.


08/18/16
20160240337 

Filter assembly for a circuit breaker arc chamber


A filter assembly for a circuit breaker arc chamber includes a coarse filter layer defining an outlet layer, having an upstream side and a downstream side opposite the upstream side, and a fine filter layer defining an inlet layer, disposed on the upstream side of the coarse filter layer.. .
General Electric Company


08/18/16
20160240336 

Cutout for use in electrial distribution network


The embodiment of the present disclosure provides a cutout which can comprise a top contact assembly being capable of electrically coupled with a first electric cable; a bottom contact assembly being capable of electrically coupled with a second electric cable; an insulator assembly secured to the top contact assembly in a first end thereof, and secured to the bottom assembly in a second end thereof opposite to the first end; and a tube assembly having a fuselink placed therein for conducting electricity between the top contact assembly and a bottom contact assembly. The bottom contact assembly has a bottom contact member which is capable of electrically coupled with the second electrical cable at one end thereof, and removeably coupled with the tube assembly at the other end thereof, such that a current path is formed from the second electrical cable to the tube assembly via the bottom contact member..
Abb Technology Ltd.


08/18/16
20160240332 

Switch apparatus and manufacturing method thereof


A switch and a method of manufacturing the switch are provided. In one embodiment, the switch comprises a switch assembly adapted to receive a first force in a first direction; and a protective member arranged on a substrate and adapted to receive the switch assembly, the protective member comprising a spring portion applying a second force to the switch assembly in a second direction that is opposite to the first direction, the switch assembly being adapted to be moved relative to the substrate in response to the first force exceeding a predefined threshold value.
Microsoft Technology Licensing, Llc


08/18/16
20160240309 

Method for depositing a composite film on a permanent neodymium-iron-born magnet


A method for depositing a composite film on a permanent nd—fe—b magnet including step of spraying the anti-corrosive film of a composite resin selected from one of epoxy and phenol on the coated permanent nd—fe—b magnet and curing the layered permanent nd—fe—b magnet at a first final temperature of 120° c. For a first time interval of 30 minutes and at a second final temperature of 170° c.
Yantai Shougang Magnetic Materials Inc.


08/18/16
20160240304 

Coil component


A coil component has a pair of flange portions including a bottom surface that may be mounted on a mounting substrate and a top surface opposite to the bottom surface, a winding core portion coupling the pair of the flange portions, a top plate attached to the top surface of the flange portions, a metal terminal attached to each of the flange portions, and a wire wound around the winding core portion and electrically connected to the metal terminal. The metal terminal has a wire connecting portion connected to the wire and a flange connecting portion connected to the flange portion, and the wire connecting portion and the flange connecting portion are each located on the top surface side of a peripheral surface positioned between the bottom surface and the top surface of the flange portion..
Murata Manufacturing Co., Ltd.


08/18/16
20160240300 

Solenoid apparatus


An apparatus may include a ferromagnetic housing defining a housing cavity, an electrically-conductive coil disposed in the housing cavity and defining a coil cavity, a ferromagnetic core piece disposed in the coil cavity, a ferromagnetic pole piece comprising a first face in contact with the core piece and a projection extending from a second face of the pole piece opposite the first face, a flexible element defining an opening, where the projection is disposed within the opening and the flexible element is disposed between a portion of the projection and the first face of the pole piece, and a ferromagnetic armature coupled to the flexible element, where the flexible element is disposed between at least a portion of the armature and the first face of the pole piece.. .
Enfield Technologies, Llc


08/18/16
20160240295 

Solenoid apparatus


An apparatus may include a ferromagnetic housing defining a housing cavity, an electrically-conductive coil disposed in the housing cavity and defining a coil cavity, a ferromagnetic core piece disposed in the coil cavity, a ferromagnetic pole piece comprising a first face in contact with the core piece and a projection extending from a second face of the pole piece opposite the first face, a flexible element defining an opening, where the projection is disposed within the opening and the flexible element is disposed between a portion of the projection and the first face of the pole piece, and a ferromagnetic armature coupled to the flexible element, where the flexible element is disposed between at least a portion of the armature and the first face of the pole piece.. .
Enfield Technologies, Llc


08/18/16
20160240291 

Chip resistor and manufacturing the same


A chip resistor includes: a resistor body having a front surface and a mounting surface which face in opposite directions; a pair of electrodes which are disposed on both sides of the resistor body with the resistor body sandwiched therebetween and are in electrical conduction with the resistor body; and a protective film covering a portion of the resistor body, wherein a plurality of grooves, which does not penetrate through the resistor body, is formed in the front surface of the resistor body.. .
Rohm Co., Ltd.


08/18/16
20160240289 

Overvoltage arrester


An overvoltage arrester includes a column extending between first and second electrical terminals and having resistance elements being stacked on one another and having first and second opposite contact faces. The first and second contact faces of adjacent resistance elements adjoin one another.
Siemens Aktiengesellschaft


08/18/16
20160240288 

Resistive element and manufacturing the same


A resistive element including a main body portion, and first and second terminal portions with different shapes that are provided at opposite ends of the main body portion in the long-side direction. At least one side portion of the main body portion in the short-side direction has a protruding portion..
Koa Corporation


08/18/16
20160240284 

Connection structure of high-temperature superconducting wire piece, high-temperature superconducting wire using connection structure, and high-temperature superconducting coil using connection structure


A connection structure of a multi-layer wire includes at least a substrate, a high-temperature superconducting layer, a tape-type laminated body, a conductor layer, and a passage forming body. The high-temperature superconducting layer is formed on one surface of the substrate.
Kabushiki Kaisha Toshiba


08/18/16
20160240279 

Latex composition, production method therefor, composite material, and conductive formed product


Provided is a latex composition including a latex that includes a polymer having a tetrahydrofuran-insoluble component content of at least 1 mass % and no greater than 75 mass % and carbon nanotubes that have an average diameter (av) and a diameter distribution (3σ) satisfying a relationship 0.60>3σ/av>0.20. A composite material and a conductive formed product obtainable using the latex composition exhibit superior conductivity..
Zeon Corporation


08/18/16
20160240249 

Resistance memory cell


A resistance memory includes a resistance memory cell having a resistance memory element and a two-terminal access device in series. The two-terminal access device affects the current-voltage characteristic of the resistance memory cell.
Rambus Inc.


08/18/16
20160240218 

Partial curing of a microactuator mounting adhesive in a disk drive suspension


Various embodiments concern a method of attaching a microactuator to a flexure, depositing a wet mass of structural adhesive on the flexure, mounting the microactuator on the wet mass of structural adhesive, partially curing the mass of structural adhesive through a first application of curing energy, and depositing a mass of conductive adhesive on the flexure. The mass of conductive adhesive is deposited in contact with the mass of structural adhesive.
Hutchinson Technology Incorporated


08/18/16
20160240157 

Display device


According to one embodiment, an active matrix display device includes a non-rectangular display portion in which a part of an outer edge is curved or bent, display pixels arrayed in a matrix in the display portion, gate lines connected for each row of the display pixels, signal lines connected for each column of the display pixels, a gate line driving circuit, a signal line driving circuit, and bus lines extending along a part of an edge of the display portion outside the display portion. A part of the signal lines extends from an edge opposite to the bus lines of the display portion to the bus lines through the display portion, is connected to the bus lines, and further, extends from the bus lines to the edge opposite to the bus lines through the display portion..
Japan Display Inc.


08/18/16
20160240137 

Display device and electronic apparatus


A display panel including pixels disposed on a substrate, where each of the pixels includes a light emitting element, and a capacitor. The capacitor of a first one of the pixels is partially overlapped, in a vertical direction, by respective pixel areas of two of the pixels.
Sony Corporation


08/18/16
20160240133 

Electro-optical unit, electro-optical device and operating an electro-optical device


An electro-unit (1) is provided comprising a photodiode (2), a light-emitting diode (3) and a programmable resistive memory element (4). The electro-optical unit further has first (12), second (13) and third (14) control terminals, wherein the photodiode (2) and the programmable resistive element (4) are coupled in series between the first (12) and third (14) control terminals and m wherein the light emitting diode (3) and the programmable resistive element (4) are coupled between the second (13) and third (14) control terminals.
Nederlandse Organisatie Voor Toegepast-natuurwetenschappelijk Onderzoek Tno


08/18/16
20160240105 

Tooth anatomy model and demonstration method


The present application provides a tooth anatomy model comprising: a first layer representing tooth dentin, said first layer being made of a first material; and a sensor system associated with a surface of the first layer, which system is adapted to sense at least one of temperature and air pressure. The present application also provides a method of demonstrating tooth hypersensitivity using a tooth anatomy model..
Colgate-palmolive Company


08/18/16
20160240097 

Behavioral intelligence framework, content management system, and tool for constructing same


A computer-implemented tool having a collection of content management subsystems allows the content creator to construct a web-based behavioral modification site without the need for computer programming skills. The content delivery system constructed with this tool employs a lesson manager that delivers lesson content based on a tree structure; a virtual educator manager that presents different graphical images of an educator character, complete with different facial expressions and gestures designed to facilitate learning; a link manager that supplements lesson content with links to supplemental material and automatically suppresses dead links; and an impact manager that automatically administers a stage-of-change questionnaire a predefined time interval after the lesson was completed..
Western Michigan University Research Foundation


08/18/16
20160240053 

Portable security system


A portable alarm system designed for unoccupied unsecured locations, such as construction sites, machinery, campsites and the like. The alarm system defines a continuous monitoring line about the perimeter of the unsecured location using a plurality of wireless sensors attached to a flexible non-stretchable tape suspended between to vertical poles.

08/18/16
20160240045 

Application for baby delivery pool


Improvements in an application for baby delivery pool for the application to be available to any family or friend that has access to a computer, tablet or smart phone. The pool aspects include, but are not limited to, birth date, birth hour, and birth minute and birth weight.

08/18/16
20160240032 

Modular outdoor large item vending system


A modular outdoor large item vending system for large items such as firewood, grill wood, cases of drinking water, or charcoal. The vending system can be placed on a store front, parking lot, campsite, or park, and comprises a master module assembly connected to a plurality of add-on module assemblies with each of the master module assembly and the add-on module assemblies having compartments to hold large items which are dispensed from the compartments when a payment is made through a credit card reader interface located on a master module control compartment door face.
Jalh Enterprises D/b/a Outdoor Vending Solutions


08/18/16
20160240031 

Cash processing apparatus


Provided is a money processing device whereby it is possible to alleviate a deterioration in security when a storage unit is extracted. A money processing device comprises: a deposit/withdrawal part which is disposed upon one end side of a device main body in the longitudinal direction which faces a customer, and whereby money is either deposited or withdrawn; and storage units which are disposed to be removable with respect to the device main body and which store money.
Oki Electric Industry Co., Ltd.


08/18/16
20160240028 

Coin depositing and dispensing machine


In a coin depositing and dispensing machine 10, a plurality of storing and feeding apparatuses 50 disposed below a deposited-coin transport unit 20 are arranged vertically on plural levels. A transport direction in which a coin is transported by the deposited-coin transport unit and a feeding direction in which a coin is fed out from each storing and feeding unit are substantially perpendicular to each other..
Glory Ltd.


08/18/16
20160240027 

Coin depositing and dispensing machine


In a coin depositing and dispensing machine 10, a plurality of storing and feeding apparatuses 50 disposed below a deposited-coin transport unit 20 are arranged vertically on plural levels. A transport direction in which a coin is transported by the deposited-coin transport unit and a feeding direction in which a coin is fed out from each storing and feeding unit are substantially perpendicular to each other..
Glory Ltd.


08/18/16
20160240003 

Method for manufacturing a physical volumetric representation of a virtual three-dimensional object


One variation of a method for manufacturing a physical volumetric representation of a virtual three-dimensional object includes: slicing the virtual three-dimensional object into a set of virtual layers of discrete virtual thickness; for each virtual layer in the set of virtual layers, selecting a set of cross-sections of a portion of the virtual three-dimensional object within the virtual layer, setting an opacity level for each cross-section, combining the set of cross-sections into a composite cross-section based on an opacity level set for each cross-section, and printing the composite cross-section onto a dominant face of a substrate in a set of substrates; and assembling the set of substrates into a stack, each substrate in the set of substrates positioned within the stack according to a position within the virtual three-dimensional object of a cross-section printed on the substrate.. .
Looking Glass Hk Ltd.






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