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Sit patents



      

This page is updated frequently with new Sit-related patent applications.




Date/App# patent app List of recent Sit-related patents
05/19/16
20160143189 
 Composite heat sink structures patent thumbnailComposite heat sink structures
Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer.
International Business Machines Corporation


05/19/16
20160143188 
 Heat dissipating module patent thumbnailHeat dissipating module
A heat dissipating module includes a bottom cover, a top cover, a fan body, and a heat dissipating structure. The top cover is disposed opposite the bottom cover, in which an air outlet is formed by the top cover and the bottom cover.
Quanta Computer Inc.


05/19/16
20160143187 
 Semiconductor device and  manufacturing the same patent thumbnailSemiconductor device and manufacturing the same
A semiconductor device includes a semiconductor module which has an external terminal protruding from one surface thereof; a printed circuit board which is electrically and mechanically connected to the external terminal of the semiconductor module; a heatsink which abuts against the other surface of the semiconductor module opposite to the one surface; and a joint member which serves as an elastic support column having a first head portion and a second head portion. The first head portion is shaped like a truncated cone and disposed at one end of the elastic support column, and the second head portion is disposed at the other end of the elastic support column.
Fuji Electric Co., Ltd.


05/19/16
20160143175 
 Server with dual-side bridge circuit boards and  assembling the same patent thumbnailServer with dual-side bridge circuit boards and assembling the same
A server structure includes a transfer board, a connecting backplane, a first bridge circuit board and a second bridge circuit board. The transfer board has oppositely at least one first connector and at least one second connector.
Inventec Corporation


05/19/16
20160143172 
 Electronic device patent thumbnailElectronic device
An electronic device includes: an enclosure that has an opening formed therein; a switch disposed in the enclosure opposite the opening; a key top member disposed inside the opening; and a water sealing member that has a wall part which extends such that a height direction of the wall part coincides with an opening direction of the opening and which seals an inner surface of the opening, an arm part which extends from the wall part to the inner side of the opening and supports the key top member, and a wall part reinforcer provided in the wall part.. .
Fujitsu Limited


05/19/16
20160143149 
 Semiconductor package structure and semiconductor process patent thumbnailSemiconductor package structure and semiconductor process
Disclosed is a semiconductor package structure and manufacturing method. The semiconductor package structure includes a first dielectric layer, a second dielectric layer, a component, a patterned conductive layer and at least two conductive vias.
Advanced Semiconductor Engineering, Inc.


05/19/16
20160143131 
 Flexible display patent thumbnailFlexible display
A flexible display is disclosed. In one aspect, the flexible display includes a flexible display panel including: a first flat portion, a bending portion connected to the first flat portion, and a second flat portion connected to the bending portion and opposing the first flat portion.
Samsung Display Co., Ltd.


05/19/16
20160143125 
 Printed circuit board clip patent thumbnailPrinted circuit board clip
In one embodiment, a printed circuit board has a hole. The hole has a longest extent on a surface of the printed circuit board.
Cisco Technology, Inc.


05/19/16
20160142999 
 System and  reducing paging in utran/geran/e-utran networks when idle signaling reduction is active patent thumbnailSystem and reducing paging in utran/geran/e-utran networks when idle signaling reduction is active
Systems and methods are provided for avoiding excessive paging through messaging-based solutions on a mobile network that supports multiple radio access technologies (rats), such as both long term evolution (lte) and global system for mobile communications (gsm)/enhanced data rates for gsm evolution (edge)/universal mobile communications system (umts) technology, even in situations where the present location of the ue is not known. Preventing paging in access networks where the ue is not present ensures efficient use of radio resources in the paging channel and reduces signaling load on other interfaces.
Cisco Technology, Inc.


05/19/16
20160142997 
 Apparatus and  providing interaction service for kids, system using the same patent thumbnailApparatus and providing interaction service for kids, system using the same
Disclosed are an apparatus and a method for providing an interaction service for children, which give a real-time alarm related to notification details about a child, who goes to a children's educational institution such as a kindergarten or a child-care center, to a teacher and a parent and thereby enable the teacher and the parent to share information and comprehensively take care of the child, and a system using the same. When the teacher enters and transmits a notification message after the teacher uses a terminal to tag an nfc card which a child carries, an interaction service providing apparatus receives the notification message, attaches a connection address of each social commerce site associated with a particular word of the notification message to a partial area of the notification message, and transmits the notification message to which the connection address is attached, to the parent..
Sk Planet Co., Ltd.


05/19/16
20160142982 

Apparatus and controlling transmit power


Disclosed herein is an apparatus for controlling transmit power, including: a global positioning system (gps) receiving unit receiving gps signals from one or more satellites and measuring signal strengths of the gps signals; a processor calculating transmit power corresponding to a current position depending on the gps signals according to a predefined command; a memory storing the command therein; and a communication interface transmitting a data signal including data depending on the transmit power.. .
Electronics And Telecommunications Research Institute


05/19/16
20160142950 

Hybrid-antenna mode of an apparatus configured for wireless communication


Various aspects of the present disclosure provide for an apparatus configured to receive a transmission from a serving cell utilizing a single antenna while the apparatus is operating in a first mode. While the apparatus is operating in a second mode, the apparatus may be configured to measure a signal quality of a neighbor cell utilizing at least one of two or more antennas and use receive diversity (rxd) to receive the transmission from the serving cell utilizing the two or more antennas.
Qualcomm Incorporated


05/19/16
20160142909 

Dynamic password-less user verification


A method, system, and computer program product for dynamic password-less user verification in a mobile device are provided in the illustrative embodiments. Using a processor and a memory in the mobile device, a first portion of a call log stored in the mobile device is selected.
International Business Machines Corporation


05/19/16
20160142904 

Method and data management of third party services


Aspects of the subject disclosure may include, for example, a method comprising caching, by a server comprising a processor, a subscriber profile in a network repository to create a cached subscriber profile. The cached subscriber profile comprises a replica of stored subscriber data.
At&t Intellectual Property I, Lp


05/19/16
20160142896 

Transfer of emergency services session between disparate subsystems


Methods and nodes for coordinating communication sessions are described herein. A method includes providing, by a control system, a signaling anchor point at a domain transfer function in a visited multimedia subsystem for an access signaling leg and a remote access signaling leg for a communication session between a user element and a public service access point and coordinating call signaling for the communication session via the access signaling leg and the remote signaling leg..
Apple Inc.


05/19/16
20160142880 

Enhanced mobile base station


Systems and methods for an in-vehicle base station are described. In one embodiment, a mobile base station is disclosed comprising a first access radio for providing an access network inside and outside a vehicle; a second backhaul radio for providing a backhaul connection to a macro cell; and a global positioning system (gps) module for determining a location of the mobile base station, and for transmitting the location of the mobile base station to a core network, wherein a transmit power of the first access radio is configured to increase or decrease based on a speed of the vehicle..
Parallel Wireless, Inc.


05/19/16
20160142823 

Membrane and producing diaphragm, and composite diaphragm


A membrane and a method for producing a diaphragm, and a composite diaphragm are provided. The mcpet material is a mcpet baffle with micropores independent from each other; wherein an average size of the micropore is smaller than or equal to 5 μm, a foaming rate of the mcpet baffle is less than 2 times, and a density of the mcpet baffle is less than 300 kg/m3.
Furukawa Electric Hong Kong Limited


05/19/16
20160142801 

Flexible electroacoustic apparatus and wearable electronic product capable of processing audio signals using the same


The present invention provides a flexible electroacoustic apparatus. The flexible electroacoustic apparatus includes one or more flexible electroacoustic units.
Aptos Technology Inc.


05/19/16
20160142714 

Data output apparatus, data output method, and data generation method


A data output apparatus includes: a video decoder that decodes a video stream to generate a first video signal; an external metadata acquisition unit that acquires one or more pieces of metadata corresponding to one or more first conversion modes; an hdr metadata interpreter that interprets one of the one or more pieces of metadata to acquire characteristic data and conversion auxiliary data; a dr converter that supports one or more second conversion modes and performs conversion processing of a luminance range of the first video signal based on the conversion auxiliary data to generate a second video signal; and an hdmi output unit that outputs the second video signal to a display apparatus.. .
Panasonic Intellectual Property Management Co., Ltd.


05/19/16
20160142683 

Visualization a surgical site


D2=distance p′s+distance sb.. .

05/19/16
20160142676 

System and making a teleconference with realistic simulation of a direct conversation


A system teleconferences first and second speakers in first and second connected remote teleconference sites. Each teleconference site includes corresponding transceivers to transmit and receive electronic signals.
Unicredit S.p.a.


05/19/16
20160142667 

Image acquisition device, image acquisition method and recording medium


A cpu sets an exposure value to conform to the entire imaging range acquired by an imaging section, and acquires an entire range image captured with this exposure value, at first acquisition timing for an entire-range-image movie. Also, the cpu sets an exposure value for a frame to conform to a main subject image or a predetermined area in the entire range image acquired by the imaging section, and acquires a cut-out image formed by trimming an image area including the main subject image or the predetermined area from an entire range image captured with this exposure value, at second acquisition timing for a partial-range-image movie..
Casio Computer Co., Ltd.


05/19/16
20160142646 

Monocentric lens-based multi-scale optical systems and methods of use


A monocentric lens-based multi-scale imaging system is disclosed. Embodiments of the present invention comprise a monocentric lens as an objective lens that collects light from a scene.
Duke University


05/19/16
20160142637 

Image acquisition and management


A reference image of one or more objects is displayed on the display of a mobile device in a manner that allows a user of the mobile device to simultaneously view the reference image and a preview image of the one or more objects currently in a field of view of a camera of the mobile device. An indication is provided to the user of the mobile device whether the camera of the mobile device is currently located within a specified amount of a distance at which the reference image was acquired.
Ricoh Company, Ltd.


05/19/16
20160142626 

Location aware photograph recommendation notification


Aspects provide for location and time aware photographic scene matching and recommendations by identifying a location of a target scene displayed within a field of view of an electronic display screen of a camera device. A repository is searched for picture(s) related to the identified location and indicated in a social network as attractive.
International Business Machines Corporation


05/19/16
20160142617 

Image acquisition device and image acquisition device focusing method


In an image acquisition device, an optical path length difference in a second light figure can be formed by arrangement of an optical path difference generating member, without need for splitting light in a second optical path for focus control. Therefore, it reduces the quantity of light into the second optical path necessary for acquisition of information of focal position while ensuring the quantity of light enough for execution of imaging by a first imaging device.
Hamamatsu Photonics K.k.


05/19/16
20160142611 

Image acquisition and management


A reference image of one or more objects is displayed on the display of a mobile device in a manner that allows a user of the mobile device to simultaneously view the reference image and a preview image of the one or more objects currently in a field of view of a camera of the mobile device. An indication is provided to the user of the mobile device whether the camera of the mobile device is currently located within a specified amount of a distance at which the reference image was acquired.
Ricoh Company, Ltd.


05/19/16
20160142580 

Photograph sticker creating apparatus, and a generating photograph sticker


A photograph sticker creating apparatus includes an image pickup device that generates a shot image, a storage device that stores a plurality of composite-use images to be combined with shot images, a compositing processor that combines the shot image and the composite-use image to generate a composite image, a printing device that prints the composite image on a sticker sheet, a display processor that generates and displays a selection screen allowing the user to select a composite-use image from a plurality of composite-use images, and a direction receiving device that receives selection of composite-use image performed by the user on the selection screen. The display processor combines a predetermined portrait image with the selected composite-use image and does not combine the portrait image with a composite-use image other than the selected composite-use image, to generate and display the selection screen..
Furyu Corporation


05/19/16
20160142535 

Special emergency call treatment based on the caller


A blacklist of known harassing or non-legitimate emergency calls is maintained. An incoming emergency call is checked against emergency call records to determine if multiple emergency calls have been made recently, from the same general location, and destined to the same psap.
Telecommunication Systems, Inc.


05/19/16
20160142500 

Content suggestion for posting on communication network


Technologies are presented for providing a suggestion list presenting options for posting information related to viewed content on a communication network. In some examples, a user may desire to contribute to posted content by adding comments and other relevant information.
Empire Technology Development Llc


05/19/16
20160142429 

Preventing access to malicious content


System and techniques for preventing access to malicious websites are described herein. A communication message containing content may be received.

05/19/16
20160142426 

Endpoint traffic profiling for early detection of malware spread


According to one exemplary embodiment, a method for detecting malware in a network stream to at least one host computer is provided. The method may include initializing a browser profile corresponding with a first website having a first website source and a first plurality of content features.
International Business Machines Corporation


05/19/16
20160142425 

Anti-malware detection and removal systems and methods


An anti-malware system including at least one database, remote from a plurality of computers to be protected, which stores identification of computer applications resident on the computers to be protected and an application-specific communications footprint for the computer applications, and at least one server, remote from the plurality of computers to be protected, and being operative to calculate a reference computer-specific communications composite pattern based on multiple application-specific communications footprints for applications installed on the computers to be protected, calculate a current computer-specific communications composite pattern based on actual communications of at least one the plurality of computers to be protected, and provide an alert when the current computer-specific communications composite pattern of the at least one of the plurality of computers to be protected differs from the reference computer-specific communications composite pattern of the at least one of the plurality of computers to be protected.. .
Checkpoint Mobile Security Ltd


05/19/16
20160142423 

Endpoint traffic profiling for early detection of malware spread


According to one exemplary embodiment, a method for detecting malware in a network stream to at least one host computer is provided. The method may include initializing a browser profile corresponding with a first website having a first website source and a first plurality of content features.
International Business Machines Corporation


05/19/16
20160142419 

Protecting documents from cross-site scripting attacks


In various implementations, an embedded document receives untrusted content from a containing document, where the embedded document is in the containing document. In some cases, the untrusted content is received by the containing document from a server and is forwarded to the embedded document without rendering the untrusted content in the containing document.
Adobe Systems Incorporated


05/19/16
20160142398 

Method of network identity authentication by using an identification code of a communication device and a network operating password


A method of network identity authentication uses an identification code of a communication device and a network operating password. The network operating password is generated by a password generator in the website server by capturing a partial portion or all of the identification code of a website, account, transaction or other services.

05/19/16
20160142272 

Non-committal visitor stitching


Techniques are provided for transforming information about unique visits to a website or interactions with a mobile application by a single individual on different devices into unified analytical data representing these visits. One or more visitor stitching models can be used to quantify unique visits as belonging to the same person with a certain level of confidence.
Adobe Systems Incorporated


05/19/16
20160142229 

Processing interference in a wireless network


Interference is processed in a waveform received at a device in a wireless network, the received interference comprising non-linear products of at least a first signal (c1) at a first carrier frequency and a second signal (c2) at a second carrier frequency. A complex composite baseband signal is generated comprising at least the first and second signal at baseband, occupying a respective first and second frequency range within a composite baseband frequency range and not overlapping in frequency.
Aceaxis Limited


05/19/16
20160142126 

Method and beamforming using polarized antenna in a wireless communication system


A method and apparatus for beamforming using a polarized antenna in a wireless communication system are disclosed. The apparatus includes a processor configured to process a signal, and a multi-polarized antenna including a plurality of antenna elements, configured to transmit the signal.
Korea Advanced Institute Of Science And Technology


05/19/16
20160142084 

Receiver with orthogonal beam forming technique


A receiver with orthogonal beam forming technique is achieved that is capable of differentiating different signal components within the received composite signal. An adaptive processor is used to eliminate the signal component whose phase information is known or can be calculated.
Spatial Digital Systems, Inc.


05/19/16
20160142081 

System and controlling learning period for adaptive noise cancellation


A data acquisition system coupled to a mains power source and a method of operating the data acquisition system a disclosed. A test probe is configured to be coupled to a subject, and an analog to digital converter converts a signal from the test probe to samples.
Molecular Devices, Llc


05/19/16
20160142034 

Composite electronic component and board having the same


A composite electronic component includes a composite body including a common mode filter and a resistor that are coupled to each other, the common mode filter including a common mode choke coil; and a plurality of input terminals disposed on a first side surface of the composite body, a plurality of output terminals, and a ground terminal.. .
Samsung Electro-mechanics Co., Ltd.


05/19/16
20160142033 

Composite electronic component and board having the same


A composite electronic component includes a composite body in which a common mode filter and a multilayer ceramic capacitor array are coupled to each other, the common mode filter including a first body having a common mode choke coil, and the multilayer ceramic capacitor array including a second body in which a plurality of dielectric layers are stacked.. .
Samsung Electro-mechanics Co., Ltd.


05/19/16
20160142032 

Composite electronic component and board having the same


A composite electronic component includes a composite body in which a common mode filter and a multilayer ceramic capacitor array are coupled to each other, the common mode filter including a first body in which a common mode choke coil is disposed, and the multilayer ceramic capacitor array including a second body in which a plurality of dielectric layers are stacked.. .
Samsung Electro-mechanics Co., Ltd.


05/19/16
20160141977 

Seven-level inverter apparatus


It is composed of a three-phase three-level inverter 1, three single-phase five-level inverters 2, each of which is connected in series with an output of each phase of the three-phase three-level inverter 1, and pulse width modulation control means 8 provided for each phase which supplies gate pulses to the three-level inverter 1 and the single-phase five-level inverter 2 of the relevant phase. State transition means 84 which determines an output of a switching leg of the three-level inverter 1, and outputs of outside and inside switching legs of the single-phase five-level inverter based on transition of a voltage level created by the pulse width modulation control means 8, makes all of the three outputs of the three-level inverter 1, and the outside and inside switching legs of the single-phase five-level inverter 20 or positive, when the voltage level is positive, makes all of the outputs of these three legs 0 or negative, when the voltage level is negative, and makes all of the outputs of these three legs 0, when the voltage level is 0..
Toshiba Mitsubishi-electric Industrial Systems Cor Poration


05/19/16
20160141924 

Rotor of wound rotor synchronous motor


A rotor of a wound rotor synchronous motor (wrsm) drive motor is arranged with a predetermined air gap to an inside surface of a stator, and the rotor may include a rotor core including steel sheets, where the rotor core may has rotor tees arranged at fixed intervals on an outside circumferential surface of a rotor body in a circumferential direction with a slot interposed between the rotor tees for winding a rotor coil thereon, and a rotor shoe formed at an end of each of the rotor tees opposite to the inside diametral surface of the stator, and the rotor core may have a plurality of core groups respectively having stacks of steel sheets with different shapes from one another, such that the rotor tees have different widths from one another in respective sections of a shaft in a shaft direction.. .
Hyundai Motor Company


05/19/16
20160141921 

Helical heat exchanger for electric motors


An electric motor has a stator, a rotor, and a helical heat exchanger disposed outboard of the stator. The helical heat exchanger includes: an inner sleeve; an outer sleeve coaxially disposed with and outboard of the inner sleeve with a void therebetween; at least one helical wall disposed in the void between the inner and outer sleeves extending from one end to an opposite end of the inner and outer sleeves; the at least one helical wall forming a fluid tight seal along its helical path to define at least one helical fluid flow path in the void between the inner and outer sleeves; and the at least one helical fluid flow path configured to permit at least one heat transfer medium to helically travel within the void between the inner and outer sleeves..
Arnold Magnetic Technologies


05/19/16
20160141887 

Tuning circuit, tuning method and resonance-type contactless power supply


The present disclosure relates to a tuning circuit, a tuning method and a resonance-type contactless power supply. The resonance-type contactless power supply has the characteristic that an inductor current has a maximum value when it operates at a resonance frequency.
Silergy Semiconductor Technology (hangzhou) Ltd.


05/19/16
20160141866 

Fins and foams heat exchangers with phase change for cryogenic thermal energy storage and fault current limiters


This disclosure describes a composite device that is referred to as a cryogenic thermal energy storage module (ctesm), which can be used to substantially increase the thermal storage capacity of a cryogenic device. To maximize the utility of the ctesm, it needs to be constructed in such a way that the thermal gradient through the device is low.
Novum Industria Llc


05/19/16
20160141858 

Method for producing a multiplicity of surge arresters in an assembly, surge arrester and surge arrester assembly


A method is provided for manufacturing a plurality of arresters as a composite structure. A ceramic carrier having a plurality of holes and two electrode bodies are provided.
Epcos Ag


05/19/16
20160141845 

Electrical system, and connection device and powering a switchgear bus in an electrical system


A connection device is for an electrical system. The electrical system has a powering apparatus, an electrical switching apparatus, and a switchgear bus.
Westinghouse Electric Company Llc


05/19/16
20160141842 

Method of manufacturing an ignition plug


A method for producing a spark plug for internal combustion engines, having a metallic shell, a ceramic insulator held in the shell, a center electrode embedded in the insulator, and a ground electrode implemented as a bridge attached to the front end of the shell, wherein an end piece made of a precious metal is attached to the front end of the center electrode and a counterpart is attached to the bridge opposite the end piece, between which is formed a spark gap. A cylindrical body made fully or partially of the precious metal or precious metal alloy intended for the end piece and that is longer than the end piece is welded onto the front end of the center electrode.
Federal-mogul Ignition Gmbh


05/19/16
20160141818 

Cable connector assembly and manufacturing the cable connector assembly


A cable connector assembly includes a cable (6), a contact module connected with the cable, a shell (3) enclosing on the contact module, an inner insulator (7) enclosing on the shell and front end of the cable, an outer insulator (5) enclosing on the inner insulator, and a cover (4) assembled on the outer insulator. The shell has a mating section on a front end thereof, and the mating section is extending forwards beyond the outer insulator.
Foxconn Interconnect Technology Limited


05/19/16
20160141814 

Machine case with improved electrical connector


An electrical connector for use within a machine case includes an insulator and a plurality of contacts. The insulator defines opposite top and bottom surfaces thereon in a vertical direction.
Foxconn Interconnect Technology Limited


05/19/16
20160141808 

High speed data contact set with right angle termination insert


A high speed data contact assembly having a linear data contact set and a right-angle termination insert. The linear data contact set has a housing having a hollow body and a termination subassembly.
Virginia Panel Corporation


05/19/16
20160141807 

Very high speed, high density electrical interconnection system with impedance control in mating region


A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material.
Amphenol Corporation


05/19/16
20160141802 

Shunt for electrical connector


A shunt for an electrical connector that comprises a conductive body which has two resilient leg extensions connecting at a hinge, each of the leg extensions terminating at a tail end opposite the hinge. Each of the leg extensions has at least one contact point on an outer surface thereof for engaging a contact of the electrical connector.
Amphenol Corporation


05/19/16
20160141799 

Lever-type connector


A lever-type connector has a female housing (f) with a tubular fitting (13) that includes a lever accommodating portion (15) for accommodating a lever (30) and an inner regulating wall (16) on a side opposite to the lever accommodating portion (15). A male housing (m) has a receptacle (43) with an outer regulating wall (44) facing the inner regulating wall (16), and has a supporting wall (45) facing the lever accommodating portion (15).
Sumitomo Wiring Systems, Ltd.


05/19/16
20160141789 

Lever-type connector


A lever-type connector has tubular fitting (13) with an outer regulating wall (20) on a side opposite to a lever accommodating portion (16) across a terminal accommodating portion (10). A receptacle (41) includes an inner regulating wall (44) arranged along the outer regulating wall (20) and a facing wall (45) arranged along the lever accommodating portion (16) and facing the inner regulating wall (44).
Sumitomo Wiring Systems, Ltd.


05/19/16
20160141784 

Socket contact, inter-connector and connector device


A socket contact is connectable with a first terminal and a second terminal at opposite ends thereof in an axial direction, respectively. The socket contact comprises a first portion, a second portion and a coupling portion.
Japan Aviation Electronics Industry, Limited


05/19/16
20160141781 

Flexible printed circuit board plug-in jig


The present invention provides a flexible printed circuit board (fpcb) plug-in jig, comprising a fixture part for clamping an fpcb, wherein the fixture part comprises a first clamping element and a second clamping element which are arranged oppositely; the first clamping element and the second clamping element are configured such that an opening is formed at one end of the fixture part and a pressing portion is formed at the other end of the fixture part; a signal matching board is arranged on a surface of the first clamping element facing the second clamping element; the signal matching board is used for electrically connecting to the fpcb at one end close to the opening of the fixture part; and an additional signal port is provided at another end of the signal matching board close to the pressing portion of the fixture part.. .
Hefei Boe Optoelectronics Technology Co., Ltd.


05/19/16
20160141776 

Press fit electrical terminal having a solder tab shorter than pcb thickness and using same


A method of assembling a circuit board may include inserting a first electrical terminal into a first side of a circuit board, and applying a second layer of solder paste to a second side of the circuit board, the second side disposed opposite of the first side. The first electrical terminal may include a solder tab, a maximum length of the solder tab may be shorter than a minimum thickness of the circuit board, and if the first electrical terminal is inserted into the circuit board, the solder tab may extend at least partially into the circuit board without extending entirely through the circuit board.
Lear Corporation


05/19/16
20160141773 

Composite and nanowire conduit


An electrical wiring system comprises a plurality of electrical conduits, each of which comprises a plurality of electrically conductive wires, a carrier encapsulating and electrically insulating the wires from each other, the carrier being composed of a rigid material, and at least connector carried by the carrier in electrical communication with the wires. The electrical wiring system further comprises a junction box comprising a plurality of interconnecting wires and a plurality of connectors electrically coupled together by the interconnecting wires.
The Boeing Company


05/19/16
20160141771 

Machine case with improved terminal module


A machine case includes a sink-like main portion and opposite deck stations by two ends of said main portion, and a terminal module. Said terminal module includes an insulator defining opposite top and bottom surfaces and a set of contacts retained to the insulator via a first insert molding process and arranged along a transverse direction.
Foxconn Interconnect Technology Limited


05/19/16
20160141762 

Antenna


Disclosed is an antenna, the antenna includes a metal trace, an antenna feeder, and a power connector set on a printed circuit board (pcb), wherein the metal trance and the antenna feeder are connected at a feed point, the antenna is configured with a reactive element on one surface of the pcb board which is opposite to or the same with the surface where the feed point is located; and when a radio frequency signal of the antenna is at a low frequency, the reactive element is conducted, and when a radio frequency signal of the antenna is at a high frequency, the reactive element is disconnected, or when a radio frequency signal of the antenna is at a low frequency, the reactive element is disconnected, and when a radio frequency signal of the antenna is at a high frequency, a control switch of the reactive element is conducted.. .
Zte Corporation


05/19/16
20160141758 

Antenna for satellite communication having structure for switching multiple band signals


The present invention discloses an antenna for satellite communication having a structure for switching multiband signals. The antenna for satellite communication according to an embodiment of the present invention includes a main reflecting plate configured to be rotatable in a predetermined direction so as to be oriented in a direction in which a satellite is located, a first feed horn configured to be detachably installed in a region of an edge of the main reflecting plate, a sub-reflecting plate configured to be installed so as to be spaced apart from a reflecting surface of the main reflecting plate by a predetermined distance by at least one support means provided in a region of the main reflecting plate, and a second feed horn configured to be detachably installed on a side opposite to the reflecting surface of the sub-reflecting plate, wherein an installation position of the sub-reflecting plate is changeable..
Intellian Technologies Inc.


05/19/16
20160141757 

Shorted bowtie patch antenna with parasitic shorted patches


Described herein are shorted bowtie patch antennas. The shorted bowtie patch antenna includes parasitic shorted patches.
City University Of Hong Kong


05/19/16
20160141749 

Antenna device using ebg structure, wireless communication device, and radar device


An antenna device comprises a first dielectric substrate; first and second antenna elements arranged on a first surface of the first dielectric substrate; a ground conductor arranged on a second surface of the first dielectric substrate; and an ebg structure arranged between the first and second antenna elements. The ebg structure comprises first patch conductors that are each arranged in contact with the first surface of the first dielectric substrate and are each electromagnetically coupled with the ground conductor; second patch conductors that are each arranged in a prescribed distance from the first surface of the first dielectric substrate in a direction opposite to the second surface, and are each electromagnetically coupled with corresponding one of the first patch conductors; and first connection conductors that electrically connect the first patch conductors with the second patch conductors..
Panasonic Intellectual Property Management Co., Ltd.


05/19/16
20160141718 

Composite separator and electrolyte for solid state batteries


Separator and electrolyte composites are disclosed. The composites include a porous self-supporting separator film between or adjacent one or two electrolyte films.
Medtronic, Inc.


05/19/16
20160141701 

Fuel cell device


A fuel cell device includes a fuel cell body, a case and a pin having one end contacting a part of the fuel cell body. A through hole is formed in the case.
Toyota Jidosha Kabushiki Kaisha


05/19/16
20160141695 

Membrane electrode assembly and fuel cell


An object is to prevent an increase in overall thickness of a membrane electrode assembly. There is provided a membrane electrode assembly.
Toyota Jidosha Kabushiki Kaisha


05/19/16
20160141646 

Fuel cell vehicle coolant having improved storage stability and producing the same


There are provided a stock solution composition for fuel cell vehicle coolant used by dilution with a diluent comprising water and a method for producing the same, and further a fuel cell vehicle coolant composition having improved storage stability and a method for producing the same. The present invention relates to a method for producing a stock solution composition for fuel cell vehicle coolant, wherein the stock solution composition comprises at least one ethylene glycol compound selected from the group consisting of ethylene glycol, diethylene glycol, and triethylene glycol, and is used by dilution with a diluent comprising water, and the method comprises the following steps: (a) a step of selecting as a raw material an ethylene glycol compound having an ethylene glycol monoformate content of 60 ppm or less; or (b) a step of selecting as a raw material an ethylene glycol compound, wherein a 50% by mass aqueous solution of the ethylene glycol compound has a conductivity of 4.5 μs/cm or less after heating..
Toyota Jidosha Kabushiki Kaisha


05/19/16
20160141620 

A long-life, high-rate lithium/sulfur cell utilizing a holistic approach to enhancing cell performance


A long-life, high-rate lithium sulfur (li/s) cell with high specific energy uniquely combines cetyltrimethyl ammonium bromide (ctab)-modified sulfur-graphene oxide (s-go) nanocomposites with an elastomeric styrene butadiene rubber (sbr)/carboxy methyl cellulose (cmc) binder and an ionic liquid-based novel electrolyte with the lino3 additive. A li/s cell employing a ctab-modified s-go nanocomposite cathode can be discharged at rates as high as 6c (1c=1.675 a/g of sulfur) and charged at rates as high as 3c while still maintaining high specific capacity (˜800 mah/g of sulfur at 6c), with a long cycle life exceeding 1500 cycles, the longest cycle life with extremely low decay rate (0.039% per cycle) demonstrated so far for a li/s cell..
The Regents Of The University Of California


05/19/16
20160141609 

Aluminum silicate composite, electroconductive material, electroconductive material for lithium ion secondary battery, composition for forming negative electrode for lithium ion secondary battery, composition for forming positive electrode for lithium ion secondary battery, negative electrode for lithium ion secondary battery, positive electrode for lithium ion secondary battery, and lithium ion secondary battery, composition for forming positive


An aluminum silicate complex that comprises an aluminum silicate and carbon that is disposed on a surface of the aluminum silicate.. .
Hitachi Chemical Company, Ltd.


05/19/16
20160141597 

Method of manufacturing negative electrode for nonaqueous electrolyte secondary battery


A method of manufacturing a negative electrode for a nonaqueous electrolyte secondary battery includes: preparing a copper foil having a first main surface and a second main surface that are opposite sides of the copper foil; obtaining a granulated body by mixing a negative electrode active material, a thickener, a binder, and a solvent with each other to obtain a mixture and by granulating the mixture; obtaining a first negative electrode mixture layer by pressing the granulated body; arranging the first negative electrode mixture layer on the first main surface; and softening the copper foil by bringing the second main surface into contact with a heated roller in a state where the first negative electrode mixture layer is arranged on the first main surface. A temperature of the heated roller is a recrystallization temperature of the copper foil or higher..
Toyota Jidosha Kabushiki Kaisha


05/19/16
20160141594 

Battery protection circuit module package, battery pack and electronic device including same


Provided are a battery protection circuit module package capable of achieving high integration and size reduction, and a battery pack and an electronic device including the same. The battery protection circuit module package includes a lead frame including a plurality of leads space apart from each other, and capable of being coupled and electrically connected to electrode tabs of a battery cell, battery protection circuit devices mounted on the lead frame and including a positive temperature coefficient (ptc) structure, and an encapsulant for encapsulating the battery protection circuit devices to expose a part of the lead frame..
Itm Semiconductor Co., Ltd


05/19/16
20160141584 

High voltage electrical center with connectorized bulkhead


An electrical assembly, such as a high voltage electrical center that controls the flow of electricity between a battery pack and the propulsion system of an electric or hybrid electric vehicle. The assembly includes a plurality of electrical connectors configured to receive and mate with a plurality of corresponding mating connectors and a housing containing a plurality of electrical devices interconnected to the plurality of electrical connectors.
Delphi Technologies, Inc.


05/19/16
20160141582 

Layered-double-hydroxide-containing composite material and producing same


Provided is a layered-double-hydroxide-(ldh) containing composite material including a porous substrate and a high density ldh-containing functional layer on and/or in the porous substrate. The ldh-containing composite material of the present invention includes the porous substrate and the functional layer formed on and/or in the porous substrate.
Ngk Insulators, Ltd.


05/19/16
20160141578 

Composite separator equipped in battery cell and manufacturing the same


The present invention provides a composite separator for a battery cell and a method for manufacturing the same. In particular, the composite separator equipped in a battery cell includes a non-woven separator comprising a high heat resistant polymer fiber that comprises a thermal deformation material on a high heat resistant polymer material.
Hyundai Motor Company


05/19/16
20160141574 

Method of manufacturing separator for electrochemical device and separator for electrochemical device manufactured thereby


A method of manufacturing a separator for an electrochemical device according to an exemplary embodiment of the present disclosure includes extruding a resin composition including polyolefin and a diluent, stretching the extruded resin composition to obtain a polyolefin film, extracting the diluent from the obtained polyolefin film to obtain a porous polyolefin film, coating a slurry for forming a porous coating layer on at least one surface of the porous polyolefin film, and heat setting the porous polyolefin film coated with the slurry to obtain a composite separator with a porous coating layer.. .
Lg Chem, Ltd.


05/19/16
20160141564 

Rechargeable battery


A rechargeable battery includes an electrode assembly having a first electrode and a second electrode of different polarities, a case with an opening that houses the electrode assembly, the case having a pair of opposing first side walls, each first side wall of the pair of first side walls including at least one groove extending from the opening of the case to an opposite side of the case, a cap assembly coupled to the opening of the case to seal the case, a first current collecting member and a second current collecting member inside the case, the first and second current collecting members being connected to the first electrode and the second electrode, respectively, and a first terminal and a second terminal on the cap assembly, the first and second terminals being connected to the first current collecting member and the second current collecting member, respectively.. .
Samsung Sdi Co., Ltd.


05/19/16
20160141563 

Lithium secondary battery


The present application relates to the field of energy storage devices, in particular to a lithium secondary battery. The battery comprises a shell having a bottom, a cap assembly, a positive terminal, a negative terminal, an electrode assembly and electrolyte, wherein a side wall of the shell comprises a pair of main planes and a pair of side faces, and the opening is arranged opposite to the bottom; the electrode assembly is formed by winding a positive plate, a negative plate and a composite separation film comprising a polymer microporous film layer and a ceramic composite material layer; a first extension portion extends from one end of the positive plate facing the cap assembly and is electrically connected with the positive terminal; a second extension portion extends from one end of the positive plate facing the cap assembly and is electrically connected with the negative terminal; and the air permeability of the composite separation film and the thickness of the side faces satisfy the relationship of 0.05 s/(100 ml·μm)≦a/b≦1.0 s/(100 ml·μm).
Ningde Amperex Technology Limited


05/19/16
20160141557 

Method of manufacturing organic light-emitting diode (oled) display


A method of manufacturing an organic light-emitting diode (oled) display is disclosed. In one aspect, the method includes forming an oled over a first substrate and forming a sealing member over the first substrate or a second substrate opposite to the first substrate, to at least partially surround the oled, wherein a plurality of holes are defined in a first region of the sealing member.
Samsung Display Co., Ltd.


05/19/16
20160141552 

Flexible display and fabricating the same


The invention provides a flexible display and method for fabricating the same. The flexible display includes: a first flexible substrate and an oppositely disposed second flexible substrate; a tft layer and an emitting unit, sequentially formed on the first flexible substrate; a color filter layer and an overcoat formed on the second flexible substrate; a fill formed between the first flexible substrate and the second flexible substrate; and a dam formed between the first flexible substrate and the second flexible substrate and surrounding the fill..
Industrial Technology Research Institute


05/19/16
20160141548 

Organic electroluminescent display device


An organic electroluminescent display device includes a display region configured to display pixels; a frame region configured to surround the display region; a substrate; an organic electroluminescent element disposed on the substrate; a sealing member configured to cover the organic electroluminescent element; a lead wire disposed on the substrate and extending from a region covered with the sealing member to an outer side of the sealing member; and one or more organic insulators disposed within the frame region instead of within the display region. The lead wire includes two opposite side portions.
Sharp Kabushiki Kaisha


05/19/16
20160141544 

Organic light-emitting display apparatus and manufacturing the same


An organic light-emitting display apparatus includes a substrate, and a thin-film transistor and a capacitor formed over the substrate. The apparatus further includes an interlayer insulation layer, a first organic insulating layer and a second organic insulation layer sequentially stacked over the substrate and covering the thin-film transistor and a capacitor.
Samsung Display Co., Ltd.


05/19/16
20160141532 

Single electron transistor and fabricating the same


A transistor and a fabrication method thereof. A transistor includes a channel region including linkers, formed on a substrate, and a metallic nanoparticle grown from metal ions bonded to the linkers, a source region disposed at one end of the channel region, a drain region disposed at the other end of the channel region opposite of the source region, and a gate coupled to the channel region and serving to control migration of at least one charges in the channel region..
Sk Innovation Co., Ltd.


05/19/16
20160141529 

Method for producing an organic cmos circuit and organic cmos circuit protected against uv radiation


An organic cmos circuit including a substrate having an n-type organic transistor and a p-type organic transistor formed thereon, the transistors respectively including a layer of n-type semiconductor material and a layer of p-type semiconductor material. A surface of each of the semiconductor material layers, opposite to the substrate, is covered with an anti-ultraviolet layer made of electrically-insulating material absorbing and/or reflecting ultra-violet rays..
Commissariat A L'energie Atomique Et Aux Energies Alternatives


05/19/16
20160141501 

Selective placement of carbon nanotubes via coulombic attraction of oppositely charged carbon nanotubes and self-assembled monolayers


A method of forming a structure having selectively placed carbon nanotubes, a method of making charged carbon nanotubes, a bi-functional precursor, and a structure having a high density carbon nanotube layer with minimal bundling. Carbon nanotubes are selectively placed on a substrate having two regions.
International Business Machines Corporation


05/19/16
20160141498 

High precision, high resolution collimating shadow mask and fabricating a micro-display


The method for producing an oled micro-display on a silicon wafer uses a collimating shadow mask formed on a silicon substrate. The mask is fabricated by depositing a material layer on the front side and on the back side of the substrate and etching a portion of the layer on the back side of the substrate to a reduced thickness of at least 20 microns.
Emagin Corporation


05/19/16
20160141492 

Memristor and methods for making the same


An example of the memristor includes a bottom electrode, a switchable material positioned on the bottom electrode, and a cured negative or positive resist that forms an interlayer dielectric positioned on the switchable material. An open area is formed in the interlayer dielectric.
Hewlett-packard Development Company, L.p.


05/19/16
20160141491 

Storage element and memory


A storage element including a storage layer configured to hold information by use of a magnetization state of a magnetic material, with a pinned magnetization layer being provided on one side of the storage layer, with a tunnel insulation layer, and with the direction of magnetization of the storage layer being changed through injection of spin polarized electrons by passing a current in the lamination direction, so as to record information in the storage layer, wherein a spin barrier layer configured to restrain diffusion of the spin polarized electrons is provided on the side, opposite to the pinned magnetization layer, of the storage layer; and the spin barrier layer includes at least one material selected from the group composing of oxides, nitrides, and fluorides.. .
Sony Corporation


05/19/16
20160141488 

Method for electrically contacting a piezoelectric ceramic


A method for electrically contacting a piezoelectric ceramic includes: providing the piezoelectric ceramic having electrodes for electrically contacting the piezoelectric ceramic and having a flexible, electrically conductive film; producing a composite by applying the flexible, electrically conductive film at least partially to an electrode of the piezoelectric ceramic; forming a durable, electrically conductive connection between the flexible, electrically conductive film and the electrode of the piezoelectric ceramic. Also a sound transducer, as well as a sound transducer array produced using the method for electrically contacting a piezoelectric ceramic..
Robert Bosch Gmbh


05/19/16
20160141486 

Piezoelectric composition and piezoelectric device


Provided is a piezoelectric composition containing a major component that is a perovskite-type oxide which is represented by the general formula abo3, which contains no pb, and which has a-sites containing bi, na, and k and b-sites containing ti. The ti is partly substituted with a transition metal element me that is at least one selected from the group consisting of mn, cr, fe, and co.
Tdk Corporation


05/19/16
20160141483 

Highly conducting material


The present invention concerns electrically conductive nanocomposites. More specifically the electrical conductance of graphitic material can be improved significantly by a molecular coating that has well defined repeating structure.

05/19/16
20160141475 

Composite substrate, light emitting device, and manufacturing the light emitting device


A composite substrate includes a plate-like lead frame having a plurality of supporting leads and a plurality of element containers supported by the supporting leads. The plurality of element containers each has a first electrode lead, a second electrode lead, and a resin molded body integrated with the first electrode lead and the second electrode lead, and within the resin molded body, the first electrode lead, the second electrode lead, and the supporting lead are held spaced apart from one another.
Nichia Corporation


05/19/16
20160141473 

Light emitting diode device


A light emitting diode device is described which includes at least one planar non-periodic high-index-contrast grating. The light emitting diode device includes a cavity formed between a reflective optical element and a transmissive optical element.
Hewlett Packard Enterprise Development Lp


05/19/16
20160141471 

Process for forming ultra-micro leds


A flexible light sheet includes a bottom conductor layer overlying a flexible substrate. An array of vertical light emitting diodes (vleds) is printed as an ink over the bottom conductor layer so that bottom electrodes of the vleds electrically contact the bottom conductor layer.
Nthdegree Technologies Worldwide Inc.


05/19/16
20160141469 

Optoelectronic device with light-emitting diodes


An optoelectronic device including an array of light-emitting diodes and photoluminescent blocks opposite at least part of the light-emitting diodes, each light-emitting diode having a lateral dimension smaller than 30 μm, each photoluminescent block including semiconductor crystals having an average size smaller than 1 μm, dispersed in a binding matrix.. .
Alcatel Lucent


05/19/16
20160141466 

Thin film light emitting diode


Light emitting devices comprise a substrate having a surface and a side surface; a semiconductor structure on the surface of the substrate, the semiconductor structure having a first surface, a second surface and a side surface, wherein the second surface is opposite the first surface, wherein the first surface, relative to the second surface, is proximate to the substrate, and wherein the semiconductor structure comprises a first-type layer, a light emitting layer and a second-type layer; a first and a second electrodes; and a wavelength converting element arranged on the side surface of the semiconductor structure, wherein the wavelength converting element has an open space, and wherein the open space is a portion not covered by the wavelength converting element.. .
Lg Innotek Co., Ltd.


05/19/16
20160141463 

Composite having semiconductor structures embedded in a matrix


Semiconductor structures having a nanocrystalline core and corresponding nanocrystalline shell and insulator coating, wherein the semiconductor structure includes an anisotropic nanocrystalline core composed of a first semiconductor material, and an anisotropic nanocrystalline shell composed of a second, different, semiconductor material surrounding the anisotropic nanocrystalline core. The anisotropic nanocrystalline core and the anisotropic nanocrystalline shell form a quantum dot.

05/19/16
20160141458 

Light-emitting device


A light-emitting device comprises a light-emitting stack comprising a first surface and a second surface opposite to the first surface; a first electrode formed on the second surface of the light-emitting stack; a current blocking layer formed on the first surface of the light-emitting stack and corresponding to a location of the first electrode; and a second electrode covering the current blocking layer and comprising a plurality of first metal layers and a plurality of second metal layers alternating with the plurality of first metal layers, wherein the plurality of first metal layers is discontinuous.. .
Epistar Corporation


05/19/16
20160141444 

Method and ming copper (cu) or antimony (sb) doped zinc telluride and cadmium zinc telluride layers in a photovoltaic device


A method and apparatus for an amount of cu or sb dopant incorporated into a zinc-based layer as the layer is being formed. The layer is formed over a coated substrate using an electrochemical deposition (ecd) process.
First Solar, Inc.


05/19/16
20160141434 

Hybrid vapor phase-solution phase growth techniques for improved czt(s,se) photovoltaic device performance


A hybrid vapor phase-solution phase czt(s,se) growth technique is provided. In one aspect, a method of forming a kesterite absorber material on a substrate includes the steps of: depositing a layer of a first kesterite material on the substrate using a vapor phase deposition process, wherein the first kesterite material includes cu, zn, sn, and at least one of s and se; annealing the first kesterite material to crystallize the first kesterite material; and depositing a layer of a second kesterite material on a side of the first kesterite material opposite the substrate using a solution phase deposition process, wherein the second kesterite material includes cu, zn, sn, and at least one of s and se, wherein the first kesterite material and the second kesterite material form a multi-layer stack of the absorber material on the substrate.
International Business Machines Corporation


05/19/16
20160141419 

Three dimensional nand device having reduced wafer bowing and making thereof


A monolithic three dimensional nand string includes a plurality of control gate electrodes extending substantially parallel to a major surface of a substrate, and at least one trench extending substantially perpendicular to the major surface of the substrate. The trench is filled with at least a first trench material and a second trench material.
Sandisk Technologies, Inc.


05/19/16
20160141418 

Embedded jfets for high voltage applications


A device includes a buried well region and a first hvw region of the first conductivity, and an insulation region over the first hvw region. A drain region of the first conductivity type is disposed on a first side of the insulation region and in a top surface region of the first hvw region.
Taiwan Semiconductor Manufacturing Company, Ltd.


05/19/16
20160141411 

High frequency switching mosfets with low output capacitance using a depletable p-shield


Aspects of the present disclosure describe a high density trench-based power mosfets with self-aligned source contacts and methods for making such devices. The source contacts are self-aligned with spacers.
Alpha And Omega Semiconductor Incorporated


05/19/16
20160141377 

Low temperature spacer for advanced semiconductor devices


Embodiments of the present invention provide semiconductor structures and methods for making the same that include a boron nitride (bn) spacer on a gate stack, such as a gate stack of a planar fet or finfet. The boron nitride spacer is fabricated using atomic layer deposition (ald) and/or plasma enhanced atomic layer deposition (peald) techniques to produce a boron nitride spacer at relatively low temperatures that are conducive to devices made from materials such as silicon (si), silicon germanium (sige), germanium (ge), and/or iii-v compounds.
International Business Machines Corporation


05/19/16
20160141376 

Vertical semiconductor device and manufacturing therefor


A vertical semiconductor device includes a semiconductor body having a front side, a backside arranged opposite to the front side and a lateral edge delimiting the semiconductor body in a horizontal direction perpendicular to the front side, a gate metallization arranged on the front side and extending at least close to the lateral edge; a contact metallization arranged on the front side and between the lateral edge and the gate metallization, and a backside metallization arranged on the backside and in electric contact with the contact metallization. The gate metallization is arranged around at least two sides of the contact metallization when viewed from above..
Infineon Technologies Austria Ag


05/19/16
20160141324 

Semiconductor image sensor module, manufacturing the same as well as camera and manufacturing the same


A semiconductor image sensor module 1 at least includes a semiconductor image sensor chip 2 having a transistor forming region on a first main surface of a semiconductor substrate and having a photoelectric conversion region with a light incident surface formed on a second main surface on the side opposite to the first main surface and an image signal processing chip 3 for processing image signals formed in the semiconductor image sensor chip 2, wherein a plurality of bump electrodes 15a are formed on a first main surface, a plurality of bump electrodes 15b are formed on the image signal processing chip 3, both the chips 2 and 3 are formed to be laminated through heat dissipating means 4 and the plurality of bump electrodes 15a of the semiconductor image sensor chip 2 and the plurality of bump electrodes 15b on the image signal processing chip 3 are electrically connected.. .
Sony Corporation


05/19/16
20160141313 

Method for manufacturing flexible display device


Disclosed is a method for manufacturing a flexible display device. The method includes: providing a substrate, the substrate having a first surface and the second surface opposite to each other; forming a first flexible substrate on the first surface of the substrate and forming the second flexible substrate on the second surface of the substrate in such a way that a force acting from the first flexible substrate to the substrate is equal to, but in opposite direction, a force acting from the second substrate to the substrate; forming a displaying component on a surface of the first flexible substrate that is distant from the substrate; and peeling the first flexible substrate on which the displaying component is formed off the substrate so as to form a flexible display device.
Shenzhen China Star Optoelectronics Technology Co., Ltd.


05/19/16
20160141285 

Electrostatic discharge (esd) protection device


An electrostatic discharge (esd) protection device includes a semiconductor substrate and a pair of first well regions formed in the semiconductor substrate, wherein the pair of first well regions have a first conductivity type and are separated by at least one portion of the semiconductor substrate. In addition, the esd protection device further includes a first doping region formed in a portion of the at least one portion of the semiconductor substrate separating the pair of first well regions, having a second conductivity type opposite to the first conductivity type.
Mediatek Inc.


05/19/16
20160141260 

Pre-package and methods of manufacturing semiconductor package and electronic device using the same


Methods of fabricating semiconductor packages are provided. One of the methods includes forming a protection layer including metal on a first surface of a substrate to cover a semiconductor device disposed on the first surface of the substrate, attaching a support substrate to the protection layer by using an adhesive member, processing a second surface of the substrate opposite to the protection layer to remove a part of the substrate, and detaching the support substrate from the substrate..

05/19/16
20160141256 

Method for manufacturing a semiconductor device, and semiconductor device


According to various embodiments, a method for manufacturing a semiconductor device may include providing a semiconductor workpiece including a device region at a first side of the semiconductor workpiece, wherein a mechanical stability of the semiconductor workpiece is insufficient to resist at least one back end process without damage, and depositing at least one conductive layer over a second side of the semiconductor workpiece opposite the first side of the semiconductor workpiece, wherein the at least one conductive layer increases the mechanical stability of the semiconductor workpiece to be sufficient to resist the at least one back end process without damage.. .
Infineon Technologies Ag


05/19/16
20160141255 

Semiconductor package and fabrication method thereof


A semiconductor package is provided, which includes: a circuit structure having a first bottom surface and a first top surface opposite to the first bottom surface; at least a semiconductor element disposed on the first top surface of the circuit structure and electrically connected to the circuit structure; an encapsulant formed on the first top surface of the circuit structure to encapsulate the semiconductor element, wherein the encapsulant has a second bottom surface facing the first top surface of the circuit structure and a second top surface opposite to the second bottom surface; and a strengthening layer formed on the second top surface of the encapsulant, or formed between the circuit structure and the encapsulant, or formed on the first bottom surface of the circuit structure, thereby effectively preventing the encapsulant from warping and the semiconductor element from cracking.. .
Siliconware Precision Industries Co., Ltd.


05/19/16
20160141248 

Chip card module arrangement, chip card arrangement and producing a chip card arrangement


A chip card module arrangement may include a first surface and a second surface, which are opposite from one another, and a chip receptacle for one or more semiconductor chips on the surfaces. The chip card module arrangement may further include a connecting material receiving area on one of the two surfaces, the connecting material receiving area only taking up a portion of the surface..
Infineon Technologies Ag


05/19/16
20160141238 

Semiconductor device and forming a low profile embedded wafer level ball grid array molded laser package (ewlb-mlp)


A semiconductor device has a semiconductor die with an encapsulant deposited over and around the semiconductor die. An interconnect structure is formed over a first surface of the encapsulant.
Stats Chippac, Ltd.


05/19/16
20160141228 

Device connection through a buried oxide layer in a silicon on insulator wafer


An approach to forming a semiconductor structure for a semiconductor device with connections through a buried oxide layer in a silicon on insulator wafer. A buried oxide layer is formed on a semiconductor substrate and at least one semiconductor device is formed on the buried oxide layer.
International Business Machines Corporation


05/19/16
20160141226 

Device connection through a buried oxide layer in a silicon on insulator wafer


An approach to forming a semiconductor structure for a semiconductor device with connections through a buried oxide layer in a silicon on insulator wafer. A buried oxide layer is formed on a semiconductor substrate and at least one semiconductor device is formed on the buried oxide layer.
International Business Machines Corporation


05/19/16
20160141225 

Latent heat storage devices


An apparatus including a composite structure including an expanded graphite matrix infiltrated with a phase change material having dimensions configured for association with an electronic device, the composite structure including a thermal conductivity greater than 5 watts per meter kelvin (w/mk). An apparatus including an integrated circuit package; a planar pad including an expanded graphite matrix; and a heat sink, wherein the pad is disposed between the integrated circuit package and the heat sink.
Sgl Carbon Se


05/19/16
20160141224 

Power module and fabrication the same


A power module includes: an insulating layer; a leadframe (metal layer) disposed on the insulating layer; a semiconductor chip disposed on the leadframe; and a mold resin formed so as to cover the semiconductor chip, at least a part of the metal layer, and at least a part of the insulating layer, wherein the insulating layer includes a relatively-soft insulating layer disposed at a side of the leadframe and a relatively-hard insulating layer disposed at an opposite side of the leadframes. Accordingly, there can be provided the power module with improved cooling capability and improved reliability, and the fabrication method for such a power module..
Rohm Co., Ltd.


05/19/16
20160141217 

Electronic package and fabrication method thereof


A method for fabricating an electronic package, including the steps of: providing a substrate having a plurality of electronic elements and a plurality of separation portions formed between the electronic elements, wherein each of the electronic elements has an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface; forming at least an opening in each of the separation portions from a side corresponding to the inactive surfaces of the electronic elements, wherein the at least an opening does not penetrate the separation portion; forming an encapsulant in the opening; and singulating the electronic elements along the opening from a side corresponding to the active surfaces of the electronic elements. As such, each of the electronic elements has a side surface adjacent to and connecting the active and inactive surfaces of the electronic element and the side surface is partially covered by the encapsulant for protection..
Siliconware Precision Industries Co., Ltd.


05/19/16
20160141205 

Finfets with different fin height and epi height setting


An integrated circuit structure includes a first semiconductor strip, first isolation regions on opposite sides of the first semiconductor strip, and a first epitaxy strip overlapping the first semiconductor strip. A top portion of the first epitaxy strip is over a first top surface of the first isolation regions.
Taiwan Semiconductor Manufacturing Company, Ltd.


05/19/16
20160141204 

Trench having thick dielectric selectively on bottom portion


A method of fabricating a semiconductor device includes etching a semiconductor substrate having a top surface to form a trench having sidewalls and a bottom surface that extends from the top surface into the semiconductor substrate. A dielectric liner of a first dielectric material is formed on the bottom surface and sidewalls of the trench to line the trench.
Texas Instruments Incorporated


05/19/16
20160141190 

Equipment platform system and wafer transfer method thereof


An equipment platform system and a wafer transfer method used to a wafer processing is provided. The equipment platform system comprises: a working platform, each side of the working platform is used to mount process chamber; a top-loading wafer device fixed on the top surface of working platform, the top-loading wafer device includes: a cassette or foup loading unit, a wafer loading unit installed disposed opposite the cassette or foup loading unit, the wafer loading unit has an inside cavity; a central robot, located between the cassette or foup loading unit and the wafer loading unit; a loading gate used to open or close the inside cavity; a wafer tray, which is in the inside cavity; a shutoff gate, which is at the bottom of the inside cavity, used to open or close the internal of the working platform; there is an opening at the top of the working platform, the opening is located at the lower part of the inside cavity, and disposed opposite the shutoff gate, the shutoff gate can seal the opening.
Shanghai Ic R & D Center Co., Ltd.


05/19/16
20160141178 

High speed electroplating metallic conductors


One embodiment is a method for producing void-free electroplated metallic conductors inside openings by electrochemical deposition (ecd), said method including steps of: forming at least one opening in a substrate, said at least one opening having an aspect ratio in a range from 8:1 to 28:1; forming at least one barrier layer over the sidewalls of the at least one opening; depositing at least one seed layer over the at least one barrier layer; immersing the substrate in an electrolyte contained in an ecd cell, the ecd cell including at least one anode and a cathode, wherein the electrolyte includes plating metallic ions and at least one inhibitor additive; providing agitation of the electrolyte across the surface of the substrate by moving multiple non-contacting wiping blades relative to the substrate, wherein the agitation facilitates a limiting current density larger by at least an order of magnitude than a limiting current density without the agitation; and applying an average electroplating current density on the substrate, wherein the agitation, the concentrations of the metallic ions and the inhibitor additive, and the average electroplating current density are such as to produce void-free, electroplated metallic filling inside the at least one opening.. .

05/19/16
20160141176 

Process for forming silicon-filled openings with a reduced occurrence of voids


In some embodiments, silicon-filled openings are formed having no or a low occurrence of voids in the silicon fill, while maintaining a smooth exposed silicon surface. In some embodiments, an opening in a substrate may be filled with silicon, such as amorphous silicon.
Asm Ip Holding B.v.


05/19/16
20160141162 

Projection-type charged particle optical system and imaging mass spectrometry apparatus


Provided is a projection-type charged particle optical system in which a projection magnification can be changed while a decrease in the accuracy in measuring a mass-to-charge ratio is being suppressed. A projection-type charged particle optical system according to the present invention includes a first electrode disposed so as to face a sample and having an opening formed therein for allowing a charged particle to pass, a second electrode disposed on a side of the first electrode opposite to where the sample is disposed and having an opening formed therein for allowing the charged particle to pass, and a flight-tube electrode disposed such that the charged particle that has been emitted from the sample and has passed through the second electrode enters the flight-tube electrode and being configured to form a substantially equipotential space thereinside.
Canon Kabushiki Kaisha


05/19/16
20160141156 

Production infrared radiation reflecting film


An infrared reflecting film includes an infrared reflecting layer having a metal layer and a metal oxide layer and a transparent protective layer in this order on a transparent film substrate. In the manufacturing method, the metal oxide layer is deposited by a dc sputtering method using a roll-to-roll sputtering apparatus.
Nitto Denko Corporation


05/19/16
20160141142 

Blanking system for multi charged particle beams, and multi charged particle beam writing apparatus


A blanking system for multi charged particle beams includes a blanking aperture array device to include a first substrate where a plurality of openings corresponding to passage positions of multi-beams are formed in a penetrating manner from the upper surface, and a plurality of electrode groups each having a pair of electrodes which are close to a corresponding one of the plurality of openings and are at opposite sides, on a same surface, of the corresponding one of the plurality of openings are arranged on the first substrate, a second substrate whose lower surface is electrically connected through a bump to the upper surface of the first substrate, and a mounting substrate whose upper surface is electrically connected through a bump to the lower surface of the second substrate.. .
Nuflare Technology, Inc.


05/19/16
20160141133 

Capacitive microelectromechanical switches with dynamic soft-landing


A microelectromechanical system (mems)-based electrical switch. The electrical switch includes a moveable electrode, a dielectric layer positioned adjacent the moveable electrode on a first side of the dielectric layer and spaced apart from the moveable electrode when the moveable electrode is in an inactivated position and in contact with the moveable electrode when the moveable electrode is in an activated position, and a substrate attached to the dielectric layer on a second side opposite to the first side, the moveable electrode is configured to brake prior to coming in contact with the dielectric layer when the moveable electrode is switched between the inactivated state and the activated state..
Purdue Research Foundation


05/19/16
20160141114 

Nanocomposite of multilayer fullerenes with transition metal oxide nanoparticles and a process for the preparation thereof


Disclosed herein is a simple, cheaper and green approach for low temperature synthesis of functionalized multilayer fullerene from the pure ghee (clarified butter) to get activated multishell graphitized non-porous fullerene in the form of nano-onions (cnos), for fabricating high performance exohedral type of super capacitors by incorporating suitable transition metal oxide. Further the invention relates to an exohedral type supercapacitor composite, comprising non-porous cnos and transition metal oxide nanoparticles with enhanced specific capacitance in 0.5 m h2so4..
Council Of Scientific & Industrial Research


05/19/16
20160141112 

Solar cell and process for producing the same


The present invention relates to photoanodes, solar cells and methods and processes for producing the same. In some embodiments, the solar cells of the invention can do without a sintered nanoporous scaffold layer, making it possible to produce the solar cells in low-temperature procedures.
Ecole Polytechnique Federale De Lausanne (epfl)


05/19/16
20160141098 

Electronic device and wireless power receiver equipped in the same


A wireless power receiver for receiving power from a wireless power transmitter using resonance according to the embodiment includes a reception resonant coil resonance-coupled with a transmission resonant coil of the wireless power transmitter for receiving the power, a reception induction coil coupled with the reception resonant coil for receiving the power, and a connecting unit, and the reception resonant coil includes at least one conductive line having one end and an opposite end being open with each other, and the connecting unit couples the one end and the opposite end of each conductive line with each other so that the reception resonant coil forms a closed loop.. .
Lg Innotek Co., Ltd.


05/19/16
20160141089 

Multilayer inductor


A multilayer inductor providing improved dc superposition characteristics by a permanent magnet that emits a bias magnetic flux, and having a low-loss material as a magnetic body to improve converter conversion efficiency. The multilayer inductor has a plurality of laminated electrically insulating magnetic layers; and laminated conductive patterns, each of the conductive patterns being connected in sequence in the lamination direction forming a spiral coil inside the magnetic layer.
Fdk Corporation


05/19/16
20160141085 

Magnetically controlled polymer nanocomposite material and methods for applying and curing same, and nanomagnetic composite for rf applications


A method includes applying a filler material to at least one component, the filler material including a heat curable matrix and nanoparticles; and applying an electromagnetic field to at least part of the filler material. The nanoparticles have a core capable of being heated by the electromagnetic field to a temperature sufficient to at least partially cure surrounding matrix.
Nokia Technologies Oy


05/19/16
20160141083 

Rare-earth magnet and manufacturing same


A rare earth magnet comprising a crystal grain having an overall composition of (r2(1-x)r1x)yfe100-y-w-z-vcowbztmv (wherein r2 is at least one of nd, pr, dy and tb, r1 is an alloy of at least one or two or more of ce, la, gd, y and sc, tm is at least one of ga, al, cu, au, ag, zn, in and mn, 0<x<1, y=12 to 20, z=5.6 to 6.5, w=0 to 8, and v=0 to 2), wherein the average grain size of the crystal grain is 1,000 nm or less, the crystal grain consists of a core and an outer shell, the core has a composition of r1 that is richer than r2, and the outer shell has a composition of r2 that is richer than r1.. .

05/19/16
20160141079 

Field makeable cryostat/current connections for an hts tape power cable


A method of connecting prefabricated pieces of an hts cable onsite is disclosed. This quick and reliable procedure of connecting pieces of hts cable adds to the flexibility of designing and installing power transmission and distribution grids.
Novum Industria Llc


05/19/16
20160141076 

Method of manufacturing power cables and related power cable


A method for manufacturing an electrical cable includes providing at least one core including an electrical conductor, and arranging at least one copper sheath around the at least one core. The arranging of the copper sheath includes providing at least one foil of copper having two opposite first edges; bending the foil of copper around the core until the first edges of the foil of copper are contacted with each other; welding the first edges of the foil of copper to each other to form a corresponding solder jointwelded joint; and deposing a copper coating on at least portions of the surface of the foil of copper at the welded joint.
Prysmian S.p.a.


05/19/16
20160141065 

Porous substrate electrode body and producing same


The object of the present invention is to provide an electrode member with the hydrogel substrate, capable of producing a high-voltage pulse. Further, the other object of the present invention is to provide an electrode member which is not broken due to a deformation of the hydrogel.
Tohoku University


05/19/16
20160141061 

System and producing technetium-99m using existing pet cyclotrons


The present invention relates generally to a system and method for producing technetium-99m. More specifically, the present invention relates to a novel method and device for modifying commercially-available, widely-used low energy positron emission tomography (pet) cyclotrons in order to produce technetium-99m in a more efficient, less expensive manner that previously known..

05/19/16
20160141055 

Pit gate, pit equipment, nuclear power facility, and installation pit gate


A pit gate 15 that is accommodated in a slot 14 and that seals service water retained in a first pit and a second pit in a watertight manner includes a gate main body 21; a sealing member 22 that is provided on a surface opposite to the slot 14 in a gate main body 21 and that seals between the gate main body 21 and the slot 14 in a watertight manner; and an upper pressing clamp 23, an intermediate pressing clamp 24, and a lower pressing clamp 25 that are provided in the gate main body 21 and that moves gate main body 21 toward the sealing member 22 side due to the weight of the gate main body 21 itself.. .
Mitsubishi Heavy Industries, Ltd.


05/19/16
20160141049 

Anti-fuse type one-time programmable memory cell array and operating the same


An anti-fuse type one-time programmable (otp) memory cell array includes a plurality of unit cells which are respectively located at cross points of a plurality of rows and a plurality of columns, a well region shared by the plurality of unit cells, a plurality of anti-fuse gates respectively disposed in the plurality of columns to intersect the well region, a plurality of source/drain regions respectively disposed in portions of the well region between the plurality of anti-fuse gates, and a plurality of drain regions respectively disposed in portions of the well region located at one sides of the anti-fuse gates arrayed in a last column, which are opposite to the anti-fuse gates arrayed in a first column. Each of the unit cells includes one anti-fuse transistor having a mos transistor structure without a selection transistor..
Sk Hynix Inc.


05/19/16
20160141030 

Semiconductor memory device


A semiconductor memory device has at least one memory cell using a resistance variable element, and a control circuit which controls writing to and reading from the memory cell. Operations by the control circuit include a first writing operation, a second writing operation, and a rewriting operation.
Renesas Electronics Corporation


05/19/16
20160141015 

Memory device including power-up control circuit, and memory system having the same


A memory device may include a power-up control circuit and a first set of boost voltage generators. The power-up control circuit may be configured to consecutively activate a first set of power-up signals with a first delay time between each power-up signal of the first set of power-up signals in response to a rise of a power supply voltage and a reset signal having a first logic level at an initial stage of power-up.
Samsung Electronics Co., Ltd.






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