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 Electronic component mounting method and electronic component mounting apparatus patent thumbnailElectronic component mounting method and electronic component mounting apparatus
A position and orientation of an electronic component attitude are recognized, a mounting head is moved above the electronic component, a rotator is horizontally rotated so that a lower surface of the electronic component is oriented in a direction opposite to a pusher, the electronic component of the fallen-down attitude is sucked and held by the nozzle by lowering a component holder, a attitude of the electronic component that is held is changed to a stand-up attitude by vertically rotating the component holder, leads of the electronic component of which the attitude is changed to the stand-up attitude and insertion holes of the substrate into which the leads are inserted are positioned, and the leads are inserted into the insertion holes of the substrate by pushing the electronic component toward the substrate by causing the pusher to abut against an upper surface of the electronic component of the stand-up attitude.. .
Panasonic Intellectual Property Management Co., Ltd.


 Composite sheet and portable terminal having same patent thumbnailComposite sheet and portable terminal having same
Provided are a composite sheet and a mobile terminal having the same, in which the composite sheet includes: a first heat insulation member having a plurality of fine pores to form air pockets for thermal insulation; and a second insulation member which is laminated on the first insulation member, and which facilitates a horizontal direction transfer of heat conducted but suppresses a vertical direction transfer thereof.. .
Amogreentech Co., Ltd.


 Screwless heat sink attachment patent thumbnailScrewless heat sink attachment
An optoelectronic system includes an optoelectronic module and a heat sink. The optoelectronic module includes a housing and first and second housing slide locks.
Finisar Corporation


 Package substrate and manufacturing method thereof patent thumbnailPackage substrate and manufacturing method thereof
A packaging substrate includes a first dielectric layer, a first wiring layer, a first conductive pillar layer, a second dielectric layer, a second wiring layer, an electrical pad layer, and a third dielectric layer. The first dielectric layer has a first surface, a second surface opposite to the first surface, plural openings, and a wall surface that faces at least one of the openings.
Phoenix Pioneer Technology Co.,ltd.


 Modular power supply and  manufacturing the same patent thumbnailModular power supply and manufacturing the same
A modular power supply and a method for manufacturing the same are disclosed. The modular power supply comprises a printed circuit board, power components, and a heat sink.
Delta Electronics (shanghai) Co., Ltd.


 Communication apparatus, communication method, and program patent thumbnailCommunication apparatus, communication method, and program
[solution] a communication apparatus includes: a control module configured to control operation of the communication apparatus; and a communication module configured to determine whether or not information obtained by reception from another communication apparatus has been changed and control state transition of the control module in a case where it is determined that the information obtained by the reception has been changed.. .

 Inferring logical user locations patent thumbnailInferring logical user locations
A logical location of a user may be inferred using semantics of the user's computing device(s). The logical locations may correspond to venues visited by the user, such as frequently visited venues, referred to as hubs.
Microsoft Technology Licensing, Llc


 Sound transducer structure and  manufacturing a sound transducer structure patent thumbnailSound transducer structure and manufacturing a sound transducer structure
A sound transducer structure includes a membrane and a counter electrode. The membrane includes a first main surface in a sound transducing region made of a membrane material, and an edge region.
Infineon Technologies Ag


 Microstrip filter and microphone device using same patent thumbnailMicrostrip filter and microphone device using same
A microstrip filter is provided in the present disclosure. The microstrip filter includes a substrate having a first surface and a second surface opposite to each other, a first spiral metal line formed on the first surface of the substrate, and a second spiral metal line formed on the second surface of the substrate.
Aac Technologies Pte. Ltd.


 Speaker patent thumbnailSpeaker
A speaker is provided in the present disclosure. The speaker includes a shell, a magnetic system received in the shell, and a vibrating system.
Aac Technologies Pte. Ltd.


Speaker

A speaker is provided in the present disclosure. The speaker includes a shell, a magnetic system and a vibrating system received in the shell.
Aac Technologies Pte. Ltd.

Speaker

A speaker is provided in the present disclosure. The speaker includes a shell, a magnetic system and a vibrating system received in the shell.
Aac Technologies Pte, Ltd.

Near-ear speaker device

An ear-mounted near-ear speaker apparatus includes: an ear hook that is semi-circular when viewed from the side and is hooked onto a root part of a user's auricle; and a speaker where a speaker body is housed in a casing attached to the ear hook. The ear hook includes: a contacting portion that contacts a side of the user's head when the near-ear speaker apparatus is worn by the user and keeps the speaker separated from the auricle; and a joint that enables the ear hook to deform so that a distance between a first end to which the speaker is attached and a second end at an opposite end to the first end changes..

Integrated internet camera system and method

An internet direct device comprises an imaging system to capture at least one of audio, still images and video images, and a microprocessor. The microprocessor transmits at least one of the captured audio, the captured still images and the captured video images to a web site archive and review center and/or another internet direct device upon image capture over a communications network.
Alex Is The Best, Llc

Stereoscopic imaging apparatus and user terminal

The present invention provides a stereoscopic imaging apparatus (100), including: a display module (130), including a display pixel layer (131) and a first substrate (132), where the display pixel layer (131) includes a pixel array (133), and the first substrate (132) is disposed on the display pixel layer (131); a second substrate (120), disposed opposite to the first substrate (132); and a first lens layer (110), including a lens array (111), where the first lens layer (110) is disposed between the first substrate (132) and the second substrate (120), and the lens array (111) is configured to receive light transmitted by the pixel array (133), and deflect light, which is transmitted by a corresponding pixel in the pixel array (133), to a different projection direction to implement stereoscopic parallax.. .
Cambridge Enterprise Limited

Communication device, communication system, and computer-readable recording medium

A communication device includes: a voice input unit configured to input voice that occurs in a site in which the communication device is installed; an imaging unit configured to capture an image of an inside of the site; a recording unit configured to, when speech is made in the site, record a speech spot indicating a location of a speaker and a time in a storage unit; a range determining unit configured to, when a plurality of the speech spots in the site are recorded within a predetermined time, determine a shooting range including the recorded speech spots; and a transmitting unit configured to transmit video of the determined shooting range to other communication device installed in other site.. .

Electronic apparatus

Embodiments of the present invention disclose an electronic apparatus comprising a display panel having a through hole having a through hole passing therethrough in a thickness direction thereof within a display region, and an image capturing device disposed on a side of the display panel opposite to a light-exiting side and configured to capture an image through the through hole. In the electronic apparatus according to the present invention, eyes of a user can look straight at the camera while viewing the screen when taking a photo of him by himself, thereby obtaining a satisfy or desirable face image..
Boe Technology Group Co., Ltd.

Method and system for providing a self-adaptive image

Implementations disclose a method and system for providing a self-adaptive image. According to one implementation, a first non-white ink layer on is deposited on a substrate.
Hewlett-packard Development Company, L.p

System for group supervision

A system includes one or more computer systems configured to receive a plurality of information streams from a corresponding plurality of client systems that have a defined geographic position, analyze the information feeds, generate messages based on the analysis of the information feeds, generate positional information associated with the messages, and generate a set of informational depictions of the generated messages, with the informational depictions of the messages when rendered on a display device are rendered in juxtaposition with representations of the client systems according to the generated positional information.. .
Fmr Llc

Mobile terminal

A mobile terminal is disclosed. The mobile terminal includes an antenna module including a parasitic coupling piece and a dynamic switch; a housing having an accommodation space, the housing including a metal rear cover serving as a radiator of the antenna module, the radiator including a first metal part, a second metal part and a third metal part isolated from each other; and a main board received in the accommodation space and having a grounding point disposed on a surface thereof.
Aac Technologies Pte. Ltd.

Geography based html5 content redirection

Certain information and data, such as html5 content, may be stored at a cloud server. A client may establish a connection with the server whereupon the server redirects the html5 content to the client.
Dell Products L.p.

Facilitation of efficient web site page loading

Utilizing resource data hints and resource data pushes can generate a more efficient web site page load. Utilizing resource data hints and resource data pushes effectively can reduce web site load times and conserve data resources.
At&t Intellectual Property I, L.p.

Network providing location targeted content to a mobile computing device

A network system for providing content to a mobile computing device of a user based upon the location of the mobile computing device. A wireless internet access point provides access to a single vendor web site such that upon connecting the wire-less internet access points to the user's mobile computing device, a processor determines whether the device is associated with a user and if so, said device is directed to the landing page of the vendor web site when the user mobile computing device's device location is within a predetermined proximity to the wireless internet access point of that vendor..
Kiltr Limited

Monitoring a network session

A session, consisting of multiple page views by a user with a web service, is monitored, analyzed, and diagnosed for a user. The session may include one or more requests or page views experienced by a user during the session.
Appdynamics, Inc.

System and the departmentalization of structured content on a website (url) through a secure content management system

The present invention includes a system and method for departmentalization of structured content on a website (url) through a secure content management system. The invention provides a method for auto-categorization and classification of any content from users' hard drives or from the internet stored in the content management system.

Independent control of interactive streaming media

In one general aspect, a method can include receiving, at a server computing device, a launch request to launch and stream media content pertaining to a game session, the launch request being provided by a mobile device, selecting, using the launch request, a media host configured to stream the media content, verifying a user associated with the mobile device and launching the game session for streaming to the user on a device other than the mobile device. In addition, the method can include during the game session and while streaming the media content, receiving a plurality of real time control requests from the mobile device, and executing the control request by compositing, in real time, the at least one change and the media content and to produce a composite display and transmitting, to the device other than the mobile device, the encoded composite display for streaming in real time..
Google Inc.

Systems and methods for identifying phishing websites

Systems and methods are provided for automatically detecting phishing attacks. Network traffic may be monitored to detected phishing attacks and/or identify phishing websites and/or target websites.
Swisscom Ag

Method and detecting website security

The present invention discloses a method and an apparatus for detecting website security. The method includes: performing bypass interception on a network to snatch a hypertext transfer protocol request packet; acquiring a link corresponding to the hypertext transfer protocol request packet; inserting the link into a to-be-scanned queue as a priority task to be scanned if the link is determined to be new; and/or extracting a domain name corresponding to the link, inserting the domain name into the to-be-scanned queue as a priority task to be scanned if the domain name is determined to be new; and performing vulnerability scanning on the task to be scanned in the to-be-scanned queue..
Beijing Qihoo Technology Company Limited

Redirector for secure web browsing

Methods, systems, and computer-readable media for redirecting a web browser application for secure web browsing are described herein. In various embodiments, a user web browser application executing within a secure network may request the content of a website outside of the secure network.
Citrix Systems, Inc.

Generating a domain name for each member in a group using a social graph or contact information

A domain name customer may connect to a domain name registrar website. The domain name registrar may determine a social media platform that is used by the domain name customer.
Go Daddy Operating Company, Llc

Media resource address resolution and acquisition method, system, server and client terminal

The present invention provides a media resource address resolution and acquisition method, system, a server and a client terminal, and relates to the field of multimedia technologies, wherein the resolution method includes: sending an assist resolution request to a client terminal, the assist resolution request carrying reference address information of a media resource on a target website, used for directing the client terminal to acquire webpage information of the media resource from the target website according to the reference address information and return the webpage information; and receiving the webpage information of the media resource returned by the client terminal, and resolving the webpage information of the media resource to obtain a playback address of the media resource. Thus, the capability of the client terminal is utilized to assist in acquiring webpage information of a media resource required by address resolution, and the success rate of the address resolution is improved..
Guangzhou Ucweb Computer Technology Co., Ltd.

Automatic membership in social networks based on current location information

A social networking website system with automatic registration based on a current location information. Individuals are automatically enrolled into social network services based on a current location determined from their mobile devices.

Generating a user name for each member in a group using a social graph or contact information

A domain name customer may connect to a domain name registrar website. The domain name registrar may determine a social media platform that is used by the domain name customer.
Go Daddy Operating Company, Llc

Handheld electronic device and associated method providing time data in a messaging environment

An improved handheld electronic device and an associated method are provided in which time data regarding certain aspects of a messaging conversation on a handheld electronic device are made available to a user. Such time data is provided, for instance, in situations where an interruption has occurred during a messaging conversation.
Blackberry Limited

Stretched subnet routing

In one embodiment, a method for improving routing for a stretched subnet includes receiving a first communication on a border leaf of the stretched subnet, where the border leaf is a top of rack (tor) switch configured to facilitate connectivity between an internal data center fabric and at least one external site associated with the stretched subnet, based on routing information received with the received communication, identifying a source address for the received communication as either from within the internal data center fabric or from the at least one external site, and if the source address is from the external site, storing an abbreviated route based on the source address in at least one hardware table, where the abbreviated route is a route to the at least one external site, and upon subsequent receipt of a second communication to be forwarded to the source address, forwarding the second communication in accordance with the abbreviated route.. .
Cisco Technology, Inc.

Real time event monitoring and analysis system

A system (1) has propensity models (4), and a controller (5) for automatically supplying key event data for user interactions with a network. The key event data is distributed asynchronously around a network to the model systems (4).
Brite:bill Limited

Forum search with time-dependent activity weighting

A search engine index measures and tracks one or more numeric indicators of activity at different times, including a most current time, in on-line forums and social networking sites. Such indicators may include, for example, a current volume per unit time of messages or data posted to the site, a moving average of such volume, a moving average of current participants over time, a count of current participants, other indication of site activity, or any combination of such indicators.

System and monitoring bittorrent content and the computers that share bittorrent content

In one embodiment, one or more bittorrent management pages, such as an index site or a rich site summary (rss) feed, may be scanned for indicia of a torrent file that is associated with one or more search terms. After the torrent file is located, information associated with the torrent file may be utilized to initiate the downloading of one or more portions of the content indicated by the torrent file over a network from swarm computers utilizing a bittorrent protocol.
Tiversa Ip, Inc.

Policy store

Some embodiments provide a method for managing policies for a set of computing resources. The method imports several sets of resource management policy rules from several heterogeneous sources.
Vmware, Inc.

Method and device for processing communication path

Embodiments of the present invention relate to a method and a device for processing a communication path. The method includes: obtaining a path processing parameter from local configuration information or from a control layer device, obtaining path information and/or a restarting counter parameter from the control layer device; increasing a path with an opposite-end device when the path information is of increasing a path, identifying the state of the path and/or the state of the opposite-end device using the path processing parameter and/or the restarting counter parameter the opposite-end device; reporting the fault state of the path and/or the reset state of the opposite-end device to the control layer device when the path fails and/or the opposite-end device is reset, releasing sessions on the failed path and/or on a path connected with the reset opposite-end device..
Huawei Technologies Co., Ltd.

Photonic vector signal generation without precoding

A novel and simple photonic vector signal generation scheme at radio frequency (rf) bands enabled by a single-drive mach-zehnder modulator (mzm)-based optical carrier suppression (ocs) without precoding techniques and optical filter, which can reduce the complexity of transmitter digital signal processing (dsp), is described. The generation and reception of 16/20/22-gbaud quadrature-phase-shift-keying (qpsk) vector signals at 16/20/22 ghz are experimentally demonstrated, respectively.
Zte Corporation

Method and monitoring optical signal-to-noise ratio

A method and an apparatus for monitoring an optical signal-to-noise ratio (osnr) is provided. The method includes coupling a to-be-tested signal with a particular noise signal, to obtain a composite signal, where the particular noise signal is a noise signal that makes an osnr of a signal of a to-be-tested channel in the composite signal be within a preset osnr range.
Huawei Technologies Co., Ltd.

Digital detection method

A passive detection method implemented by a device comprising one or more sensors comprises a step of sampling signals received by each sensor using various sub-nyquist sampling frequency values, a step of transforming the sampled signals to the frequency domain by discrete fourier transform, the frequency pitch Δf being chosen constant, and, for each time/frequency box, a step of calculating the normalized power in each reception channel, a step of calculating the quadratic sum of the calculated powers while taking into account the power of a possible parasitic signal, and a thresholding step carried out so as to ensure a given probability of false alarm.. .
Thales

Electronic device including input apparatus

An electronic device is provided. The electronic device includes a housing including a window, configured to form a 1st side of the electronic device, and a 2nd side of the electronic device directed in an opposite direction of the 1st side of the electronic device, a circuit board between the 1st side and the 2nd side of the electronic device, and including an input circuit configured to detect an input based on a change in a capacitance, a spacer between the window and the circuit board, and having at least one space formed on one side facing the circuit board, a contact electrically connected to the input circuit by being mounted to one side of the circuit board, and contained in the at least one space, and a conductive plate coupled to the spacer, and electrically connected to the contact through the at least one space..
Samsung Electronics Co., Ltd.

Stealth-dicing compatible devices and methods to prevent acoustic backside reflections on acoustic wave devices

Stealth-dicing-compatible devices and methods to prevent acoustic backside reflections on acoustic wave devices are disclosed. An acoustic wave device comprises a substrate having opposing top and bottom surfaces, where a first portion of the bottom surface has a higher roughness than a second portion of the bottom surface, and an acoustic resonator over the top surface of the substrate.
Rf Micro Devices, Inc.

Unit, oscillator and electronic apparatus

A unit comprising a quartz crystal resonator having an overall length less than 2.1 mm and a base portion including a length less than 0.5 mm and a width less than 0.55 mm, and vibrational arms, mounting arms being connected to the base portion through connecting portions, each vibrational arm having a first vibrational portion including a first width and a first length within a range of 0.32 mm to 0.72 mm and a second vibrational portion including a second width greater than the first width and a second length less than the first length, a groove being formed in at least one of opposite main surfaces of the first vibrational portions of the vibrational arms, a width of the groove being less than 0.07 mm and a distance in the width direction of the groove measured from an outer edge of the groove to an outer edge of the corresponding arm being less than 0.015 mm, a width of the mounting arms being less than 0.45 mm and a width of the connecting portions being less than 0.41 mm, the second width being greater than a spaced-apart distance between the second vibrational portions.. .
Piedek Technical Laboratory

Bonded wafers and surface acoustic wave devices using same

A bonded wafer with low carrier lifetime in silicon comprises a silicon substrate having opposing top and bottom surfaces, the structure of the silicon in a top portion of the silicon substrate having been modified to reduce the carrier lifetime in the top portion relative to the carrier lifetime in portions of the silicon substrate other than the top portion; a piezoelectric layer bonded over the top surface of the silicon substrate and having opposing top and bottom surfaces separated by a distance t; and a pair of electrodes having fingers that are inter-digitally dispersed on the top surface of the piezoelectric layer in a pattern having a center-to-center distance d between adjacent fingers of the same electrode, the electrodes comprising a portion of a surface acoustic wave (saw) device. Modification of the top portion of the silicon substrate prevents the creation of a parasitic conductance within the top portion of the silicon substrate during operation of the saw device..
Rf Micro Devices, Inc.

Methods for fabrication of bonded wafers and surface acoustic wave devices using same

A method of fabricating a bonded wafer with low carrier lifetime in silicon comprises providing a silicon substrate having opposing top and bottom surfaces, modifying a top portion of the silicon substrate to reduce carrier lifetime in the top portion relative to the carrier lifetime in portions of the silicon substrate other than the top portion, bonding a piezoelectric layer having opposing top and bottom surfaces separated by a distance t over the top surface of the silicon substrate, and providing a pair of electrodes having fingers that are inter-digitally dispersed on a top surface of the piezoelectric layer, the electrodes comprising a portion of a surface acoustic wave (saw) device. The modifying and bonding steps may be performed in any order.
Rf Micro Devices, Inc.

Solar photovoltaic module clamping system

A clamping system for securing the corners of four photovoltaic modules to a carport purlin, the clamping system having upper and lower body portions with an adjustable set screw between, the gap dimensioned to receive the purlin therein and the set screw rotatable to secure the purlin to the upper body portion. The system also having a pair of pv module connectors at opposite ends of the clamping assembly, each pv module connector adapted to secure a pair of pv modules to the purlin..
Solarcity Corporation

Machine learning learning operation conditions of cooling device, motor control apparatus and motor control system having the machine learning apparatus, and machine learning method

A machine learning apparatus according to the present invention, which learns the operation conditions of a cooling device for cooling a motor or a motor control apparatus, includes a state observer for observing a state variable including at least one of temperature data of the motor and the motor control apparatus at a specific position during operation of the cooling device; a determination data acquisition unit for acquiring determination data that determines a margin of acceptable value of a loss in each of the motor, the motor control apparatus, and the cooling device and a margin of acceptable value of the temperature of each of the motor and the motor control apparatus at the specific position; and a learner for learning the operation conditions of the cooling device in accordance with a training data set constituted of a combination of the state variable and the determination data.. .
Fanuc Corporation

Driving apparatus

A driving apparatus (101) is provided with: a first base part (110); a second base part (120); an elastic part (210) configured to couple the first base part with the second base part; a coil (300) disposed on the first base part; a first magnet (710) disposed on one side of the coil; a second magnet (720) disposed on an opposite side of the first magnet as viewed from the coil; a first middle yoke (810) provided on a surface of the first magnet opposed to the coil; and a second middle yoke (820) provided on a surface of the second magnet opposed to the coil. In particular, the first magnet is smaller than the second magnet.
Pioneer Corporation

Vibrating motor

A vibrating motor is provided in the present disclosure. The vibrating motor includes a shell providing a receiving cavity, a vibrating unit received in the receiving cavity, a pair of elastic members for elastically suspending two opposite ends of the vibrating unit to the shell, and a linking module.
Aac Technologies Pte. Ltd.

Vibrating motor

A vibrating motor is provided in the present disclosure. The vibrating motor includes a shell, a base covered by the shell for forming an accommodating space, a vibrating system accommodated in the accommodating space, and a pair of elastic connectors connected to two opposite ends of the vibrating system respectively for elastically suspending the vibrating system in the accommodating space.
Aac Technologies Pte. Ltd.

Vibrating motor

A vibrating motor is provided in the present disclosure. The vibrating motor includes a shell providing an accommodating space, a vibrating system accommodated in the accommodating space, and a pair of elastic connectors for elastically connecting two opposite ends of the vibrating system with the shell.
Aac Technologies Pte. Ltd.

Air gap baffle train for turbine generator

A baffle train for turbine generator air baffles independently aligns axial position of the composite air baffle along a stator core bore axial slot. Air baffle sectors that form the composite air baffle are coupled to baffle blocks of the baffle train.
Siemens Energy, Inc.

Hydroelectrical machine coil insulation system and method

An insulation system and method are disclosed for insulating formed coils of hydroelectric machines, such as a hydroelectric generator. The system includes strand/turn insulation that may include one or more layers of different materials, depending upon the dielectric requirements.
Integrated Power Services

Method for roebel transposition of form wound conductors of electrical machines such as generators and motors

A method for roebel transposition of form wound conductors for electrical machines is disclosed which creates less distortion of strand geometry and more efficiently stacks the conductor strands. The transposition involves four stacks of conductors, where two conductor strands from a top position in the first two adjacent stacks of conductors are transposed side-by-side two places to a top position in the other two adjacent stacks of conductors, with a corresponding downward shift in the second two stacks and upward shift in the first two stacks.
Siemens Energy, Inc.

Composite integrated circuit for secondary battery, composite device for secondary battery, and battery pack

A composite integrated circuit includes a protection ic that controls a switching circuit inserted in a power supply line to allow or prevent discharging of the secondary battery, and a monitoring ic that includes a ground terminal connected to the power supply line at a position between the secondary battery and the switching circuit, measures a voltage of the secondary battery, and sends the measured voltage to an external apparatus. The protection ic outputs an activation signal to turn on the switching circuit to allow discharging of the secondary battery, and outputs a deactivation signal to turn off the switching circuit to prevent discharging of the secondary battery.
Mitsumi Electric Co., Ltd.

Thermal sleeve with positioning member, assembly therewith and construction thereof

A thermal sleeve for protecting an electronic member connected to a wiring harness against exposure to heat has a tubular member including an inner layer of insulative material and an outer layer of reflective material. The tubular member extends along a central longitudinal axis between opposite open ends.
Federal-mogul Powertrain, Llc

Spark plug

Disclosed is a spark plug with improved lifetime. The spark plug includes a first electrode and a second electrode having an electrode base and an electrode tip joined to the electrode base with a gap defined between the first electrode and the electrode tip.
Ngk Spark Plug Co., Ltd.

Quantum cascade laser

A quantum cascade laser is configured with a semiconductor substrate, and an active layer provided on a first surface of the substrate and having a cascade structure in the form of a multistage lamination of unit laminate structures each of which includes an emission layer and an injection layer. The active layer is configured to be capable of generating first pump light of a frequency ω1 and second pump light of a frequency ω2 by intersubband emission transitions of electrons, and to generate output light of a difference frequency ω by difference frequency generation from the first pump light and the second pump light.
Hamamatsu Photonics K.k.

Flippable electrical connector

A plug connector includes a connector body defining a rear cable supporting platform with opposite first and second surfaces, a plurality of terminals and a cable. The terminal includes a pair of usb 2.0 signal soldering legs, a grounding and power soldering legs exposed to the first surface of the supporting platform and a detecting soldering leg, an additional power and grounding soldering legs exposed to the second surface.
Foxconn Interconnect Technology Limited

Electrical connector assembly with improved ground terminals

An electrical connector for high-frequency transmission comprises an elongate insulative housing including a top wall and a bottom wall opposite to each other, and a pair of end walls respectively connecting two ends thereof, and a receiving cavity surrounded thereby; a terminal assembly received in the top wall and the bottom wall respectively, and stacked in an up-to-down direction; and a metal case enclosing the insulative housing; wherein the terminal assembly includes a signal terminal group, and a ground terminal group including a first contact portion and a second contact portion, wherein the first contact portion and the second contact portion are arranged in a front-to-back direction perpendicular to both the up-to-down direction and the elongate direction, and respectively protruding into the receiving cavity.. .
Foxconn Interconnect Technology Limited

Electrical connector having good anti-emi perfprmance

An electrical connector includes an insultive housing and a terminal module retained in the insultive housing. The insultive housing defines an upper sidewall, a lower sidewall opposite to the upper sidewall and a pair of end walls connected with the upper and lower sidewalls, which together form a receiving cavity, each end wall defines a recess communicating with the receiving cavity.
Foxconn Interconnect Technology Limited

Terminal metal fitting

A terminal connecting body of a terminal metal fitting includes: a first engaging part and a second engaging part on one end side and another end side, respectively, that engage each other movements of an end of the one end side and an end of the other end side in separating directions; has a first gap formed between the first engaging part and the end of the other end side, that allows the end and the other end in directions opposite to the separating directions; and has a second gap formed therein, between the second engaging part and the end of the one end side, that enables the end and the other end in similar opposite directions. The first gap and the second gap are formed so that the first engaging part can be inserted into a notch provided on the other end side while being bent from its base..
Yazaki Corporation

Terminal pair and connector pair including terminal pair

A terminal pair including a first terminal provided with a first contact portion and a second terminal provided with a second contact portion. The first contact portion includes a composite covering layer having a sn—pd based alloy phase and a sn phase, and has a surface including the sn—pd based alloy phase and the sn phase.
Sumitomo Electric Industries, Ltd.

Connector for needle with piezoelectric polymer sensors

A connector includes an inner conductive body (34) for connecting to a sensor contact on a medical device. An insulator (40) is formed on the inner conductive body.
Koninklijke Philips N.v.

Wideband antenna

First and second hot elements are formed on the front surface of a long and thin substrate. First and second earth elements are formed on the rear surface of the substrate.
Nippon Antenna Co., Ltd.

Transmitarray unit cell for a reconfigurable antenna

Unit cell including a receive antenna, a transmit antenna, and including first and second radiation surfaces separated from each other by a separation area, a phase-shift circuit comprising switches, each having an on, respectively off, state, wherein the corresponding switch allows, respectively blocks, the flowing of a current between the first and second radiation surfaces; a ground plane; a first printed circuit board including a first surface provided with the receive antenna, and a second opposite surface provided with the ground plane; a wafer of a semiconductor material including a first surface provide with first and second radiation surfaces and wherein the switches are formed in the separation area, monolithically with the transmit antenna.. .
Commissariat À L'energie Atomique Et Aux Energies Alternatives

Low-profile antenna with high isolation for bluetooth and wifi coexistence

A low-profile, planar antenna structure includes a planar dielectric substrate, a ground plane disposed on an underside of the planar dielectric substrate; a circular planar radiating element disposed on an upper side of the planar dielectric substrate; and four arc-shaped parasitic elements evenly spaced apart and surrounding the circular planar radiating element, the four-arc shaped parasitic elements and the circular planar radiating element configured to operate together as a first planar antenna, a second planar antenna, and a patch antenna. The planar antenna structure may include four notches formed in the circular planar radiating element and extending, from four respective evenly-spaced points on a circumference of the circular planar radiating element, radially inward toward a center of the circular planar radiating element..
Qualcomm Incorporated

Multi-beam antenna system

An antenna array includes a first antenna disposed on a micro strip and oriented along a first axis in a first direction, a second antenna disposed on the micro strip and oriented along a second axis in the first direction, a third antenna disposed on the micro strip and oriented along the first axis in a second direction opposite the first direction and a fourth antenna disposed on the micro strip and oriented along the second axis in the second direction. The antenna array further includes a phase shifter connected to at least one of the antennas..
Google Inc.

Antenna apparatus

An antenna apparatus includes a first ground plane; a second ground plane having first, second, third and fourth sides, a cutout part, and a slit having an open end; a first radiating element having first and second lines, and a feeding point; a second radiating element having a third line; and a parasitic element having first and second parasitic lines. A length from the feeding point to an end part of the slit is set to one-half wavelength at a first communication frequency, a total length of a length from an end part of the fourth line to the feeding point, and a length from a ground potential point to an end part of the second parasitic line is set to one-half wavelength at a second communication frequency, and a length of the third line and the fourth line is set to one-quarter wavelength at a third communication frequency..
Fujitsu Limited

Multiband vehicular antenna assembly

Exemplary embodiments are disclosed of multiband vehicular antenna assemblies with global navigation satellite system (gnss) capabilities. In exemplary embodiments, a multiband antenna assembly is operable with more than two satellite navigation system frequencies (e.g., global positioning system (gps), beidou navigation satellite system (bds), the russian global navigation satellite system (glonass), etc.).
Laird Technologies Shanghai Co., Ltd.

Electronic device including antenna device

An electronic device is provided. The electronic device includes a housing including a window that forms a first side of the electronic device, and a second side that is disposed opposite to the first side, a touch sensor disposed adjacent to the window and configured to generate a capacitance, an input circuit operably connected to the touch sensor and configured to detect an input based on a variation in the capacitance, an antenna radiator at least one of partially disposed inside the housing and a part of the housing, a ground operably disposed between the first side and the second side, a communication circuit operably connected to the antenna radiator and the ground, and an antenna matching circuit operably connected to the touch sensor and the input circuit..
Samsung Electronics Co., Ltd.

Mobile terminal device

A mobile terminal device is provided in the present disclosure. The mobile terminal device includes a metal back cover with a groove, a printed circuit board with a groove opening corresponding to the groove, and an antenna module.
Aac Technologies Pte. Ltd.

Antenna device and electronic appliance

An antenna device includes a planar conductor on a side of a display device that is opposite to a display surface side of the display device and a power feeding coil including a spiral-shaped coil conductor with a coil aperture at a center thereof. The planar conductor includes a cutout portion.
Murata Manufacturing Co., Ltd.

First and second differential interconnects having interleaved stub traces

This disclosure relates generally to an electronic assembly and method having a first electrical connection point and a second electrical connection point and a differential interconnect coupling the first electrical connection point to the second electrical connection point, the differential interconnect including first and second transmission traces including a interior edges and a exterior edges opposite the interior edges, the second interior edge facing the first interior edge, and stub traces, each stub trace coupled to one of the first and second transmission traces and projecting from one of the first interior edge, the first exterior edge, the second interior edge, and the second exterior edge. A substantially equal number of stub traces project from the first exterior edge and the second exterior edge.
Intel Corporation

Non-aqueous electrolyte secondary battery

A non-aqueous electrolyte secondary battery includes a power generating element having a positive electrode having a positive electrode active material layer containing lithium-nickel-manganese-cobalt composite oxide on a surface of a current collector, an electrolyte layer, and a negative electrode. At least one of the following conditions (1) to (4) is satisfied.
Nissan Motor Co., Ltd.

Resource tower

Invented is a resource tower that uses water electrolysis to separate out its elemental and purified h2 hydrogen gas and o2 oxygen gas. These gases form a pressurized flow for electricity generation for distribution and transport to heights atop the resource tower.

Method for producing fuel cell catalyst

The present invention is to provide a method for producing a fuel cell catalyst that is configured to be able to increase the power generation performance of a membrane-electrode assembly. Disclosed is a method for producing a fuel cell catalyst, wherein the method comprises: a mixing step in which, by mixing a platinum-containing solution, a titanium-containing solution and an electroconductive support in a solvent, a catalyst precursor in which a platinum ion compound and a titanium ion compound are supported on the electroconductive support, is formed; a solvent removing step in which, by removing the solvent from a mixture thus obtained after the mixing step, the catalyst precursor is obtained; a firing step in which, by firing the catalyst precursor at a temperature of 500 to 900° c.
Toyota Jidosha Kabushiki Kaisha

Amorphous carbon coating of carbonaceous particles from dispersions including amphiphilic organic compounds

The present disclosure relates to a process for preparing surface-modified carbonaceous particles, wherein said carbonaceous particles are coated with a surface layer of amorphous carbon by dispersing carbonaceous material with an amphiphilic compound, spray drying of the dispersion and subsequent calcination of the dried material. The disclosure also pertains to surface-modified carbonaceous particles coated with amorphous carbon, which can for example be obtained by the process of the invention.
Imerys Graphite & Carbon Switzerland Ltd.

Negative electrode active material for secondary battery and manufacturig same

Provided is an anode active material for a secondary battery and a method of fabricating the anode active material. A silicon-based active material composite according to an embodiment of the inventive concept includes silicon and silicon oxide obtained by oxidizing at least a part of the silicon, and an amount of oxygen with respect to a total weight of the silicon and the silicon oxide is restricted to 9 wt % to 20 wt %..
Orange Power Ltd.

Negative electrode active material, producing same, and electrical storage device

Provided is a negative electrode active material including complex particles formed of: nano silicon aggregated particles produced by heating a layered polysilane represented by a composition formula of (sih)n and having a structure in which multiple six-membered rings formed from silicon atoms are connected; and a composited carbon layer formed from an amorphous carbon and at least covering one portion of the aggregated particles. A mean particle diameter d50 of the aggregated particles is within a range of 0.2 μm to 30 μm, and a mean particle diameter d50 of the complex particles is within a range of 0.5 μm to 40 μm..
Kabushiki Kaisha Toyota Jidoshokki

Cell module

A battery module has aligned battery cells, two plate members provided on the opposite ends in the aligning direction of the battery cells, fasteners joined to the plate members to integrate the battery cells, at least one connection bus bar, which connects terminals of adjacent battery cells in the aligning direction, and an elastic member, which absorbs expansion of the battery cells in the aligning direction. Each connection bus bar includes two connection portions connected to the terminals and a bend portion located between the two connection portions.
Kabushiki Kaisha Toyota Jidoshokki

Composite film and manufacturing same

The present invention relates to a composite film and a method of fabricating the same. The present invention provides a highly flexible and pliable composite film capable of preventing interlayer deformation or interlayer exfoliation based on a difference between thermal expansion coefficients.
Jenax Inc.

Organic light emitting diode device, manufacturing method thereof and display apparatus

An organic light emitting diode (oled) device includes a cathode, an anode and an organic function layer interposed between the cathode and the anode. A material of the cathode is at least one of a metal and a metal alloy.
Ordos Yuansheng Optoelectronics Co., Ltd.

Metal particle enhanced forster resonance energy transfer for organic optoelectronic device

A photovoltaic device that includes an organic or quantum dot sensitizer layer for absorbing light spectra and providing excitons. The sensitizer layer may include metal particles embedded therein for increased exciton transfer efficiency.
International Business Machines Corporation

High density resistive random access memory (rram)

A memory cell includes a substrate layer, with a plurality of silicided semiconductor fins stacked on the substrate layer and spaced apart from one another. A first metal liner layer is stacked on the plurality of silicided semiconductor fins and on the substrate layer.
Stmicroelectronics, Inc.

Physical cleaning with in-situ dielectric encapsulation layer for spintronic device application

A method for etching a magnetic tunneling junction (mtj) structure is described. A stack of mtj layers is provided on a bottom electrode in a substrate.
Headway Technologies, Inc.

Magnetic element

A magnetic element is provided. The magnetic element includes a free magnetization layer having a surface area that is approximately 1,600 nm2 or less, the free magnetization layer including a magnetization state that is configured to be changed; an insulation layer coupled to the free magnetization layer, the insulation layer including a non-magnetic material; and a magnetization fixing layer coupled to the insulation layer opposite the free magnetization layer, the magnetization fixing layer including a fixed magnetization so as to be capable of serving as a reference of the free magnetization layer..
Sony Corporation

Trilayer josephson junction structure with small air bridge and no interlevel dielectric for superconducting qubits

A technique relates to a trilayer josephson junction structure. A dielectric layer is on a base electrode layer that is on a substrate.
International Business Machines Corporation

Light-emitting device

A light-emitting device includes a substrate including an upper surface; a light-emitting stack including a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, wherein the light-emitting stack includes a first surface and a second surface opposite to the first surface toward to the upper surface; a plurality of depressions formed in the light-emitting stack and penetrating the second semiconductor layer, the active layer and a portion of the first semiconductor layer; an insulative layer covering the second surface of the light-emitting stack; a connector including a first portion and a second portion; and an electrode disposed at a side of the light-emitting stack and electrically connecting the connector, wherein the first portion of the connector is formed in the plurality of depressions, the second portion of the connector is between the insulative layer and the light-emitting stack.. .
Epistar Corporation

Metal oxide tft with improved source/drain contacts and reliability

A method including providing a substrate with a gate, a layer of gate insulator material adjacent the gate, and a layer of metal oxide semiconductor material positioned on the gate insulator opposite the gate, forming a selectively patterned etch stop passivation layer and heating at elevated temperature in an oxygen-containing or nitrogen-containing or inert ambience to selectively increase the carrier concentration in regions of the metal oxide semiconductor not covered by the etch stop layer, on which overlying and spaced apart source/drain metals are formed. Subsequently heating the transistor in an oxygen-containing or nitrogen-containing or inert ambience to further improve the source/drain contacts and adjust the threshold voltage to a desired level.

Air gap contact formation for reducing parasitic capacitance

A functional gate structure is located on a surface of a semiconductor material portion and including a u-shaped gate dielectric portion and a gate conductor portion. A source region is located on one side of the functional gate structure, and a drain region is located on another side of the functional gate structure.
International Business Machines Corporation

Mos transistor structure with hump-free effect

A mos transistor structure is provided. The mos transistor structure includes a semiconductor substrate having an active area including a first edge and a second edge opposite thereto.
Mediatek Inc.

Semiconductor device and transistor cell having a diode region

A transistor cell includes a drift region, a source region, and a body region arranged between the source region and the drift region in a semiconductor body. A drain region is below the drift region.
Infineon Technologies Ag

Facilitation of increased locking range transistors

Transistors can be used for a variety of electronic-based applications. Therefore, transistor efficiency and performance is of importance.
City University Of Hong Kong

Breakdown resistant hemt substrate and device

A compound semiconductor device structure having a main surface and a rear surface includes a silicon substrate including first and second substrate layers. The first substrate layer extends to the rear surface.
Infineon Technologies Austria Ag

Mosfet with ultra low drain leakage

A semiconductor device includes a monocrystalline substrate configured to form a channel region between two recesses in the substrate. A gate conductor is formed on a passivation layer over the channel region.
International Business Machines Corporation

Stable high mobility motft and fabrication at low temperature

A method of fabricating a stable high mobility amorphous motft includes a step of providing a substrate with a gate formed thereon and a gate dielectric layer positioned over the gate. A carrier transport structure is deposited by sputtering on the gate dielectric layer.

Air gap contact formation for reducing parasitic capacitance

A functional gate structure is located on a surface of a semiconductor material portion and including a u-shaped gate dielectric portion and a gate conductor portion. A source region is located on one side of the functional gate structure, and a drain region is located on another side of the functional gate structure.
International Business Machines Corporation

Trench formation for dielectric filled cut region

A method for forming a gate cut region includes forming a tapered profile gate line trench through a hard mask, a dummy layer and a dummy dielectric formed on a substrate, forming a dummy gate dielectric and a dummy gate conductor in the trench and planarizing a top surface to reach the hard mask. The dummy gate conductor is patterned to form a cut trench in a cut region.
Globalfoundries, Inc.

Mosfet with ultra low drain leakage

A semiconductor device includes a monocrystalline substrate configured to form a channel region between two recesses in the substrate. A gate conductor is formed on a passivation layer over the channel region.
International Business Machines Corporation

Leakage-free implantation-free etsoi transistors

A semiconductor device includes an extremely thin semiconductor-on-insulator substrate (etsoi) having a base substrate, a thin semiconductor layer and a buried dielectric therebetween. A device channel is formed in the thin semiconductor layer.
International Business Machines Corporation

Method of simultaneously manufacturing partially shielded pixels

A method of simultaneously manufacturing first and second pixels respectively shielded on a first and on a second side are simultaneously manufactured using a process wherein a first insulator is deposited on an active area. A first metal level is deposited and defined, with a first mask, to form a shield on the first side of the first pixel and on the second side of the second pixel, and a line opposite to the shield.
Stmicroelectronics (grenoble 2) Sas

Compositionally graded photodetectors

An ultraviolet photodetector for a sensor device includes a film deposited on a substrate. The film includes a compositionally graded magnesium-zinc oxide having a ratio of magnesium-to-zinc that decreases between a portion of the film adjacent to the substrate and a portion of the film opposite the substrate for shifting the peak absorption of the film toward the visible wavelengths of the electromagnetic spectrum..
Carrier Corporation

Display substrate and manufacturing method thereof, display device

The invention provides a display substrate and a manufacturing method thereof, and a display device. The display substrate comprises: a base, and gate lines and data lines, the data lines and the gate lines intersect with each other and are insulated from each other, the gate lines are electrically connected to a gate driver, the data lines are electrically connected to a source driver, the gate driver is provided at one side opposite to the source driver; gate signal lead-in lines, which are arranged parallel to the data lines; and an interlayer insulation layer provided between a layer in which the gate signal lead-in lines are arranged and a layer in which the gate lines are arranged, one end of each gate signal lead-in line is electrically connected to the gate driver, the other end thereof is connected to a gate line through a via penetrating the interlayer insulation layer..
Beijing Boe Optoelectronics Technology Co., Ltd.

Recess channel semiconductor non-volatile memory device and fabricating the same

A recess channel semiconductor non-volatile memory (nvm) device is disclosed. The recess channel mosfet devices by etching into the silicon substrate for the device channel have been applied to advanced dram process nodes.
Flashsilicon Incorporation

Semiconductor chip, optoelectronic device with a semiconductor chip, and producing a semiconductor chip

A semiconductor chip, an optoelectronic device including a semiconductor chip, and a method for producing a semiconductor chip are disclosed. In an embodiment the chip includes a semiconductor body with a first main surface and a second main surface arranged opposite to the first main surface, wherein the semiconductor body includes a p-doped sub-region, which forms part of the first main surface, and an n-doped sub-region, which forms part of the second main surface and a metallic contact element that extends from the first main surface to the second main surface and that is electrically isolated from one of the sub-regions..
Osram Opto Semiconductors Gmbh

Package-on-package semiconductor assembly having bottom device confined by dielectric recess

A package-on-package semiconductor assembly is characterized by a semiconductor device positioned in a dielectric recess of a core base and surrounded by an array of metal posts. The recess in the core provides lateral displacement control between the device and the metal posts, and the minimal height of the metal posts needed for the vertical connection between two both opposite sides of the core base can be reduced by the amount equal to the depth of the recess.
Bridge Semiconductor Corporation

Face-to-face semiconductor assembly having semiconductor device in dielectric recess

A face-to-face semiconductor assembly is characterized by a semiconductor device positioned in a dielectric recess of a core base and surrounded by an array of metal posts. The recess in the core provides lateral displacement control between the device and the metal posts, and the minimal height of the metal posts needed for the vertical connection between both opposite sides of the core base can be reduced by the amount equal to the depth of the recess.
Bridge Semiconductor Corporation

Multi-chip packages with multi-fan-out scheme and methods of manufacturing the same.

A package may include a first chip having a first surface and a second surface opposite the first surface; a first redistribution line (rdl) coupled to the first surface of the first chip; a second chip having a first surface and a second surface opposite the first surface, the first surface of the second chip facing the first chip; a second rdl disposed between the first chip and the second chip and coupled to the first surface of the second chip; a conductive via laterally adjacent to the second chip, the conductive via coupled to the second rdl; and a molding compound disposed between the second chip and the conductive via.. .
Taiwan Semiconductor Manufacturing Company, Ltd.

Multi-device package and manufacturing method thereof

A multi-device package includes a substrate, at least two device regions, a first redistribution layer, an external chip, a plurality of first connectors and a conductive contact. The two device regions are formed from the substrate, and the substrate has a first surface and a second surface opposite to the first surface.
Inotera Memories, Inc.

Semiconductor device

Provided is a semiconductor device which can be prevented from increasing in size. The semiconductor device includes a semiconductor chip having a first main surface and a second main surface opposite to the first main surface and a wiring substrate over which the semiconductor chip is mounted such that the second main surface of the semiconductor chip faces a first main surface of the wiring substrate.
Renesas Electronics Corporation

Antenna in embedded wafer-level ball-grid array package

A semiconductor device has a semiconductor die and an encapsulant deposited over the semiconductor die. A first conductive layer is formed with an antenna over a first surface of the encapsulant.
Stats Chippac Pte. Ltd.

Connection patterns for high-density device packaging

Connection patterns for device packaging allow high density circuitry dies to be assembled into packages of manufacturable size. The connection patterns may be patterns for solder ball arrays or other types of connection mechanisms under a semiconductor package.
Broadcom Corporation

Contact structure for high aspect ratio and fabricating the same

A method of fabricating semiconductor device includes forming a plurality of gate structures on a semiconductor substrate. A fist inter layer dielectric layer is deposited on the gate structures.
Taiwan Semiconductor Manufacturing Co., Ltd.

Semiconductor device

Object is to provide a semiconductor device with fewer malfunctions. The semiconductor device has a semiconductor chip having a first-signal-output circuit operating at a first-power-supply voltage, a second-signal-output circuit operating at a second power supply voltage, and a plurality of bump electrodes; and a wiring board including a first main surface facing the main surface of the semiconductor chip, a second main surface opposite to the first main surface with a wiring layer therebetween, first external terminals on the first main surface, and second ones on the second main surface; the former being mounted on the latter to couple the bump electrodes to the first external terminals.
Renesas Electronics Corporation

Semiconductor device and fabricating the same

A semiconductor device is provided. The semiconductor device includes a stack structure comprising insulating patterns and electrode structures alternately stacked on a substrate, and a vertical channel structure vertically penetrating the stack structure.

High speed, high density, low power die interconnect system

A system for interconnecting at least two die each die having a plurality of conducting layers and dielectric layers disposed upon a substrate which may include active and passive elements. In one embodiment there is at least one interconnect coupling at least one conducting layer on a side of one die to at least one conducting layer on a side of the other die.
Gula Consulting Limited Liability Company

Carrier structure, packaging substrate, electronic package and fabrication method thereof

An electronic package is provided, including: a circuit structure having opposite first and second surfaces, wherein first and second circuit layers are formed on the first and second surfaces of the circuit structure, respectively, the first circuit layer having a minimum trace width less than that of the second circuit layer; a separation layer formed on the first surface of the circuit structure; a metal layer formed on the separation layer and electrically connected to the first circuit layer; an electronic element disposed on the first surface of the circuit structure and electrically connected to the metal layer; and an encapsulant formed on the circuit structure to encapsulate the electronic element. By disposing the electronic element having high i/o function on the circuit structure, the invention eliminates the need of a packaging substrate having a core layer and thus reduces the thickness of the electronic package..
Siliconware Precision Industries Co., Ltd.

Semiconductor device and forming small z semiconductor package

A semiconductor device has a plurality of first semiconductor die. A plurality of first bumps is formed over the first semiconductor die.
Semtech Corporation

High mobility transistors

An integrated circuit containing an n-channel finfet and a p-channel finfet is formed by forming a first polarity fin epitaxial layer for a first polarity finfet, and subsequently forming a hard mask which exposes an area for a second, opposite, polarity fin epitaxial layer for a second polarity finfet. The second polarity fin epitaxial layer is formed in the area exposed by the hard mask.
Texas Instruments Incorporated

Manufacturing semiconductor structure

The present invention provides a method for forming a semiconductor structure, comprising: firstly, a substrate is provided, having a first fin structure and a second fin structure disposed thereon, next, a first isolation region is formed between the first fin structure and the second fin structure, a second isolation region is formed opposite the first fin structure from the first isolation region, and at least an epitaxial layer is formed on the side of the first fin structure and the second fin structure, wherein the epitaxial layer has a bottom surface, the bottom surface extending from the first fin structure to the second fin structure, and the bottom surface is lower than a bottom surface of the first isolation region and a top surface of the second isolation region, in addition, the epitaxial layer has a stepped-shaped sidewall profile.. .
United Microelectronics Corp.

Integrated circuit devices and methods of manufacturing the same

An integrated circuit device may include a gate insulation layer covering a top surface and opposite sidewalls of a fin-shaped active region, a gate electrode covering the gate insulation layer and a hydrogen atomic layer disposed along an interface between the fin-shaped active region and the gate insulation layer. A method of manufacturing the integrated circuit device may include forming an insulating layer covering a lower portion of a preliminary fin-shaped active region, forming a fin-shaped active region having an outer surface with an increased smoothness through annealing an upper portion of the preliminary fin-shaped active region in a hydrogen atmosphere and forming a hydrogen atomic layer covering the outer surface of the fin-shaped active region.
Samsung Electronics Co., Ltd.

Method for forming a semiconductor device and a semiconductor device

A method of forming a semiconductor device and a semiconductor device are provided. The method includes providing a wafer stack including a carrier wafer comprising graphite and a device wafer comprising a wide band-gap semiconductor material and having a first side and a second side opposite the first side, the second side being attached to the carrier wafer, defining device regions of the wafer stack, partly removing the carrier wafer so that openings are formed in the carrier wafer arranged within respective device regions and that the device wafer is supported by a residual of the carrier wafer; and further processing the device wafer while the device wafer remains supported by the residual of the carrier wafer..
Infineon Technologies Ag

Method for manufacturing a bonded soi wafer and bonded soi wafer

A bonded soi wafer is manufactured by bonding a bond and a base wafer, each composed of a silicon single crystal, via an insulator film, depositing a polycrystalline silicon layer on the bonding surface side of the base wafer, polishing a surface of the polycrystalline silicon layer, forming the insulator film on the bonding surface of the bond wafer, bonding the polished surface of the polycrystalline silicon layer and the bond wafer via the insulator film, and thinning the bonded bond wafer to form an soi layer; wherein, the base wafer is a silicon single crystal wafer having a resistivity of 100 Ω·cm or more, depositing the polycrystalline silicon layer further includes a stage for previously forming an oxide film on the surface of the base wafer on which the polycrystalline silicon layer is deposited, and the polycrystalline silicon layer is deposited at a temperature of 900° c. Or more..
Shin-etsu Handotai Co., Ltd.

Trench formation for dielectric filled cut region

A method for forming a gate cut region includes forming a tapered profile gate line trench through a hard mask, a dummy layer and a dummy dielectric formed on a substrate, forming a dummy gate dielectric and a dummy gate conductor in the trench and planarizing a top surface to reach the hard mask. The dummy gate conductor is patterned to form a cut trench in a cut region.
Globalfoundries, Inc.





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