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 Fluid-flow-through cooling of circuit boards patent thumbnailnew patent Fluid-flow-through cooling of circuit boards
A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening.
Lockheed Martin Corporation


 Fluid-flow-through cooling of circuit boards patent thumbnailnew patent Fluid-flow-through cooling of circuit boards
A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening.
Lockheed Martin Corporation


 Heat dissipation casing and  making the same patent thumbnailnew patent Heat dissipation casing and making the same
A heat dissipation casing is adapted to be mounted to an electronic device, and includes a casing body, a support member and a plurality of thermally conductive fibers. The casing body has an inner surface facing the electronic device, and an outer surface opposite to the inner surface.
Advanced International Multitech Co., Ltd.


 Integrated power electronics assembly module patent thumbnailnew patent Integrated power electronics assembly module
An integrated power electronics assembly module includes a power unit and a clamping auxiliary circuit board. The power unit includes a power level circuit board and a shielding casing.
Delta Electronics, Inc.


 Stretchable electronic patch having a foldable circuit layer patent thumbnailnew patent Stretchable electronic patch having a foldable circuit layer
An electronic patch includes a foldable circuit layer that includes a foldable network that includes comprising: a plurality of electronic modules comprising a plurality of electronic components, and flexible straps that connect the plurality of electronic modules, wherein the flexible straps comprise conductive circuit that are conductively connected with the plurality of electronic components in the plurality of electronic modules. Neighboring electronic modules can undulate in opposite directions normal to the foldable circuit layer.
Vivalnk, Inc.


 Electronic component module and manufacturing method thereof patent thumbnailnew patent Electronic component module and manufacturing method thereof
An electronic component module includes a substrate; at least one electronic component mounted on an electronic component mounting surface of the substrate; an insulating body covering the electronic component on the electronic component mounting surface of the substrate; and a metal film formed by sputtering, the metal film covering at least one exterior surface of the insulating body and at least one side surface of the substrate. The substrate has a recess portion formed on a periphery of the surface of the substrate that is opposite to the electronic component mounting surface, and the recess portion has a top surface parallel to the electronic component mounting surface and a side surface perpendicular to the top surface, and the metal film is extended to cover the top surface of the recess portion, without covering the side surface thereof.
Sae Magnetics (h.k.) Ltd.


 Display device patent thumbnailnew patent Display device
A display device includes: a display panel including a display area and a pad area; a window disposed opposite to the display panel and covering the display area and the pad area; a printed layer located on a portion of the window overlapping the pad area; an adhesive layer located between the window and the display panel and covering at least a portion of an upper surface of the printed layer; and a reflection layer located between the printed layer and the adhesive layer.. .
Samsung Display Co., Ltd.


 Systems, apparatus, and methods for converting a bi-level lighting system to a dimmable lighting system patent thumbnailnew patent Systems, apparatus, and methods for converting a bi-level lighting system to a dimmable lighting system
A dimmable lighting system may replace a bi-level lighting system without having to modify or supplement the existing wiring between a bi-level control unit and one or more light fixtures. The dimmable lighting system may include a dimming controller that may be configured to replace a bi-level control unit in situ (i.e., e.g., in a wall-mounted dual-gang switch box).
Abl Ip Holding, Llc


 Systems, apparatus, and methods for converting a bi-level lighting system to a dimmable lighting system patent thumbnailnew patent Systems, apparatus, and methods for converting a bi-level lighting system to a dimmable lighting system
A dimmable lighting system may replace a bi-level lighting system without having to modify or supplement the existing wiring between a bi-level control unit and one or more light fixtures. The dimmable lighting system may include a dimming controller that may be configured to replace a bi-level control unit in situ (i.e., e.g., in a wall-mounted dual-gang switch box).
Abl Ip Holding, Llc


 Temperature measurement system employing an electromagnetic transponder and separate impedance-changing parasitic antenna patent thumbnailnew patent Temperature measurement system employing an electromagnetic transponder and separate impedance-changing parasitic antenna
Temperature measurement systems (20) include a temperature sensor (22) and an electronic signal interrogator (24). The temperature sensor (22) has a transponder (26) equipped with an antenna (28), and a separate parasitic antenna (32) with a temperature-sensitive transducer (34, 68-74, 78a-84a), while the interrogator (24) has a transmitter (42) and antenna (40).
Tsi Technologies Llc


new patent

Heating jacket


A jacket heater placed in adjacent to an object to be heated so as to heat and keep warm said object, which comprises: a heating element, an outer covering member that envelops and accommodates the heating element, wherein the outer covering member is configured to comprise a first shaped body that is provided on a side thereof facing the object, and a second shaped body that is provided on a side opposite from said side facing the object, the second shaped body is a resin shaped body that has a porous structure, and the second shaped body has larger thickness than the first shaped body has. Provided is a jacket heater capable of efficiently keeping warm an object heated by this configuration..
Nichias Corporation


new patent

Apparatus, system, and predicting roaming patterns of mobile devices within wireless networks


The disclosed apparatus may include (1) a storage device that maintains information about mobile devices roaming within a wireless network, (2) an ap-prediction unit that (a) determines, based at least in part on the information maintained in the storage device, a number of times that a mobile device has visited a specific ap within the wireless network, (c) generates, based at least in part on the number of times, a score that represents a probability that the specific ap is the next ap visited by the mobile device, and then (d) determines that the score is above a certain threshold, and (3) a profile-distribution unit that provides, in response to the determination that the score is above the certain threshold, the specific ap with a roaming-session profile that facilitates transferring a roaming session of the mobile device to the specific ap. Various other apparatuses, systems, and methods are also disclosed..
Juniper Networks, Inc.


new patent

Information processing apparatus, video recording reservation supporting method, and computer program


An information processing apparatus includes: a video recording reserving section configured to reserve video recording of a program in response to an operation performed by a user; and a comment posting section configured to post a comment on a predetermined website offering a predetermined webpage, the comment being supplemented with a uniform resource locator (url) indicative of the program of which the video recording has been reserved on the information processing apparatus, the url causing a video recording reservation screen for the program to be displayed when selected on a screen of the predetermined webpage displayed on another apparatus.. .
Sony Computer Entertainment Inc.


new patent


Provided is an apparatus for acquiring and projecting a broadband image, the apparatus including: a probe unit provided, on a probe housing of the probe unit, with a white light source unit configured to emit white light for acquiring a visible light image to a subject, a fluorescence excitation light source unit configured to emit fluorescence excitation light for acquiring an invisible light fluorescence image, and an image acquisition unit configured to receive an invisible light fluorescence image signal for the subject, and an image projection unit configured to project an image onto the subject; and an image processing unit configured to process an image received from the image acquisition unit. According to the apparatus for acquiring and projecting a broadband image, the visible light image and the invisible light fluorescence image may be simultaneously acquired and then displayed, and the acquired fluorescence image is projected onto a position where a fluorescence signal may be revealed, thus visually providing a position and shape in which the fluorescence signal is generated..
Korea Photonics Technology Institute


new patent

Method and prioritizing data transmission in a wireless broadcasting system


Systems, methods, and computer program code are disclosed for prioritizing data transmission in wireless broadcasting systems and include capturing, by one or more sensors, data at an event site. Scene description data (sdd) is extracted from the data, and the sdd is transmitted in sdd packets, over a wireless communication network, to a processing system.
Disney Enterprises, Inc.


new patent

Information processing apparatus and information processing system


An information processing apparatus includes an image acquisition unit that acquires an initial image to be output by an image output apparatus; an image determining unit that determines, based on an output condition to be implemented by the image output apparatus upon outputting the initial image and image data of the initial image, whether to change the initial image to a substitute image having a higher image quality than the initial image; an image searching unit that searches for the substitute image in a case where a determination is made by the image determining unit to change the initial image to the substitute image; an output data generating unit that generates output data including image data of the substitute image found by the image searching unit; and a transmitting unit configured to transmit the output data to the image output apparatus.. .
Ricoh Company, Ltd.


new patent

Information processing controlling the same


An information processing apparatus includes an image acquisition unit, a first control unit, a second control unit, and a power control unit. The first control unit performs a process for detecting a moving object using image data acquired by the image acquisition unit.
Canon Kabushiki Kaisha


new patent

Image reading device and non-transitory readable recording medium


An image reading device comprises: a feeder that feeds a document along with a predetermined path; a first reading part that reads a first side of the document at a first position in the path and creates a first image; a second reading part that reads a second side of the document at a second position which is located posterior to the first position in the path and creates a second image; a synthesizing part that lays the first image and the second image on top of one another and creates a composite image; and a detecting part that detects a characteristic pattern of a specific document from the composite image created by the synthesizing part.. .
Konica Minolta, Inc.


new patent

Top up communication system and method thereof


A top up communication system and method thereof are provided, which provides a call between at least two electronic devices, where each of the at least two electronic devices has a unique identification code. The method includes following steps: buying a deposit code on the web-site or obtaining it sent from others; surfing a user interface of an activating data server; inputting the deposit code into the user interface to generate an activate identification data; scanning the activate identification data by a scanner to generate a shortcut icon on a monitor of the scanner; transmitting a dialed command to a connection generation server by triggering the shortcut icon; using the dialed command to establish a communication link between the at least two electronic devices by the connection generation server..

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new patent

Global local number


A system and method provides communication between subscribers of a telephone network and the subscribers of an ott provider website wherein each of the subscribers of the ott provider website is assigned a telephone number in a block which is not assigned to any particular country. The system includes terminating a call (e.g., having voice, video, data, and/or messaging) from the telephone network directed to a number in the block, and passing the terminated call to a nearby entry point to the ott provider website, the ott website being configured to associate the incoming call with the user's account to which the called number has been assigned.
Tyntec Limited


new patent

Assistive hearing device for use with a telephone and a hearing aid


An assistive hearing device having a sound entrance aperture on a first side, the sound entrance aperture placed against a voice emitting speaker (or receiver) of the telephone, a sound egress aperture on a second side opposite the first side, and the sound egress aperture located within closer proximity to a hearing device relative to the sound entrance aperture and the speaker to facilitate transmission of sound from the speaker to the hearing device located nearby is provided. The assistive hearing device includes a hollow interior, which connects the sound entrance and sound egress apertures, and allows sound waves entering the sound entrance aperture to travel through the hollow interior and exit the sound egress aperture.

new patent

Multi-site screen interactions


A technology for interacting with a collaborative videoconferencing environment is disclosed. A display having a substantially “l-shaped” configuration allows for display of collaborative materials and video of remote participants simultaneously, which provides for a more natural interaction for a meeting participant interacting with the collaborative materials.
Cisco Technology, Inc.


new patent

Method and system for using smart images


Embodiments of the invention provide systems and methods for using an anti-phishing image. More specifically, embodiments of the present invention provide for using a non-static, location-based anti-phishing image that can, in some cases, include authentication information.
Oracle International Corporation


new patent

Method and system for tracking fraudulent activity


A method and system for tracking potentially fraudulent activities associated with one or more web sites is disclosed. In an example embodiment, the system includes a server communicatively coupled to a database.
Paypal, Inc.


new patent

Computer dynamic website instantiation


A computer system, a computer-implemented method, and a computer program product for dynamic website instantiation. The system includes an interface component which is configured to receive from a first code reader device a first read notification indicating that a unique code is read for the very first time wherein the unique code includes a reference to a url portion in combination with an identifier number; and to further receive from the first reader device location data indicating a particular physical location which is associated with the first read notification.

new patent

Mapping specific user credentials to temporary user favorite credentials


A system for automatically completing fields in online forms, such as login forms and new user registration forms, which employs a master cookie file containing sets of records associated with the user, his or her accounts or web sites, and registered values associated with form tags (e.g. Username, password, address, email, telephone, etc.).
International Business Machines Corp.


new patent

Validation database resident on a network server and containing specified distinctive identifiers of local/mobile computing devices may be used as a digital hardware key in the process of gaining authorized access to a users online website account such as, but not limited to, e-commerce website accounts, online financial accounts and online email accounts


The present invention consists of methods whereby local/mobile computing devices are registered by collecting a set of hardware and/or software distinctive identifiers to be saved in a validation database residing on a validation database server/web server, such that the local/mobile computing device can be used as a digital hardware key for right of access and authorization of electronic transactions. This is done by comparing a regenerated set of hardware and/or software distinctive identifiers with those previously registered in the validation database in order to validate the identity of the local/mobile computing device.
Invysta Technology Group


new patent

Internet profile service


Systems and methods for creating and using a domain profile include identifying a status of a first page associated with a domain. The first page is retrieved and additional pages from the domain are identified based on hyperlinks from the first page.
Verisign, Inc.


new patent

Traffic quality analysis method and apparatus


The disclosure discloses a traffic quality analysis method and apparatus. The method includes that: traffic data of a target website is acquired; a webpage uniform resource locator (url) is extracted from the traffic data; a weight of the webpage url is determined; and in accordance with pre-set dimension data, the traffic data and the weight, the traffic quality of the target website is determined.
Beijing Gridsum Technology Co., Ltd.


new patent

Communication system, virtual network management apparatus, communication node, communication method, and program


In a communication system, a virtual network management apparatus includes: an endpoint management unit configured to manage virtual network endpoints of control target communication nodes; a policy control unit configured to select, when a communication occurs between two sites in each of which a virtual network is configured, virtual network endpoints for realizing the communication from among the virtual network endpoints managed by the endpoint management unit; and a network configuration unit configured to generate and manage a third virtual network that connects the selected endpoints to each other. A control apparatus configured to notify the virtual network management apparatus of occurrence of a communication between the two sites and control a communication node group including the communication nodes having the virtual network endpoints so as to configure the third virtual network on the basis of an instruction from the virtual network management apparatus..
Nec Corporation


new patent

Network bootstrapping for a distributed storage system


Embodiments are directed towards configuring a distributed storage system over a network. Master computers and subordinate computers may separate components of the distributed storage system.
Igneous Systems, Inc.


new patent

Noise-shaping crest factor reduction with polyphase transforming


Apparatus, system and method relates generally to data communication with noise-shaping crest factor reduction using polyphase transformation. In such a method, a composite signal is received by a delay and a waveform generator.
Xilinx, Inc.


new patent

Diversity filtering


Example diversity systems are described. An example diversity receiver includes a first receiver coupled to a first antenna, the first receiver having a first front end including a filter, a second receiver having a second front end without a filter, the second receiver being coupled to a second antenna without a filter between the second receiver and the second antenna, and a combiner coupled to the first receiver and the second receiver and configured to receive data from the first receiver and the second receiver..
Microsoft Technology Licensing, Llc


new patent

Apparatus and providing diversity service antenna in portable terminal


An apparatus and method configure a diversity antenna in a portable terminal. The apparatus includes a first antenna, a second antenna, a first communication unit for processing a first communication scheme signal communicated through the first antenna, a second communication unit for processing a second communication scheme signal communicated through the second antenna, and a control unit for configuring the first antenna as a diversity antenna for the second communication unit when the first communication unit is not driven..
Samsung Electronics Co., Ltd.


new patent

Semiconductor switch


In an embodiment, semiconductor switch includes first switches switching conduction between input-output nodes and a common node. One of the first switches includes a plurality of first transistors connected in series between an input and output node and the common node.
Kabushiki Kaisha Toshiba


new patent

Resonator element, resonator, resonator device, oscillator, electronic apparatus, and moving object


A resonator element includes: a substrate which includes a first region performing thickness shear vibration, a second region located in a periphery of the first region and having a smaller thickness than the first region, a fixed end, and a free end opposite to the fixed end in the first region in a plan view; and excitation electrodes which are disposed on a front and a rear of the first region and have regions overlapping each other in the plan view. A center of the first region and a center of the regions overlapping each other are located between a center of the substrate and the free end in the plan view.
Seiko Epson Corporation


new patent

Magnetoresistive effect device


A magnetoresistive effect device includes a magnetoresistive effect element including a magnetization fixed layer, a spacer layer, and a magnetization free layer; a first port; a second port; a signal line; an impedance element; and a direct-current input terminal. The first port, the magnetoresistive effect element, and the second port are connected in series in this order via the signal line.
Tdk Corporation


new patent

Power converter and controlling method thereof


The present application discloses a power converter and a controlling method thereof. The power converter at least comprises an inductor, a parasitic capacitor, an energy storage switch and a free-wheeling switch, and the controlling method is used for enabling the energy storage switch to maintain zero-voltage turn-on during the normal operation of the power converter.
Delta Electronics, Inc.


new patent

Electronic card comprising magnetic elements


An electronic board, in particular for a power electronics circuit such as a converter, comprises: a planar substrate having a first side and a second side opposite the first side; at least two magnetic core elements, called the first elements, arranged on the first side of the substrate and each having at least two legs passing through the substrate; and at least two windings, arranged around at least one leg of each first magnetic core; wherein: it also comprises a second magnetic core element in the form of a plate, arranged on the second side of the substrate and in contact with respective ends of the legs of at least two first elements; the first elements, the windings and the second element forming at least two mutually decoupled magnetic circuits.. .
Thales


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new patent

High speed, efficient sic power module


A power converter module includes an active metal braze (amb) substrate, power converter circuitry, and a housing. The amb substrate includes an aluminum nitride base layer, a first conductive layer on a first surface of the aluminum nitride base layer, and a second conductive layer on a second surface of the aluminum nitride base layer opposite the first surface.
Cree, Inc.


new patent

Protection circuit for semiconductor switching element, and power conversion device


Upon turn-off of igbt, by suppressing variations in collector-emitter voltage between igbts connected in series, risk of breaking igbt due to overvoltage breakdown can be reduced. In protection circuit provided for each of the plurality of igbts 50 connected in series, between collector and emitter of igbt 50, avalanche elements d1˜d5, resistance r4 and avalanche element d6 are sequentially connected in series.
Meidensha Corporation


new patent

Brushless motor and wiper apparatus


An object of the present invention is to provide a brushless motor and a wiper apparatus which allow high-precision control of a motor unit, and which can be reduced in size and weight. The first surface (91) of the control board (90) is provided on the same side as the rotating shaft (46) and the output shaft (51) so as to face the sensor magnet (mg1), the first and second hall ics (94a) and (94b) are mounted on the first surface (91).
Mitsuba Corporation


new patent

Direct drive actuator with switched reluctance motor


An actuator having a switched reluctance motor and a plunger assembly. The switched reluctance motor has a stator and a rotor.
American Axle & Manufacturing, Inc.


new patent

Electrical machine and hoisting machine


According to one embodiment, an electrical machine includes a rotor and an armature. The armature includes first to third stator cores, and an armature coil.
Toshiba Industrial Products And Systems Corporation


new patent

Nanoscale magnet composite for high-performance permanent magnets


A nanoparticle is disclosed that has an elongated core extending from a first end to a second end along a longitudinal axis and formed of at least one magnetizable and/or magnetized material. A first cover is formed on a first end of the core, and a second cover is formed on a second end of the core, the first cover and the second cover formed from a magnetocrystalline anisotropic material different than the material of the core.
Siemens Aktiengesellschaft


new patent

Apparatus for transmitting data and energy between two objects moving relative to one another


The invention relates to an apparatus for the transmission of data and energy between two objects moving relative to one another about a common axis of rotation. The objects each comprise coils which are disposed opposite and are spaced apart axially with respect to the axis of rotation such that an energy transmission between the coils is possible by inductive coupling.
Sick Ag


new patent

Enclosure for cable distribution assembly


An enclosure for breaking out a trunk cable includes: a base having a generally flat surface adapted for mounting to a mounting surface; a shell having a front and two side walls extending from opposite sides of the front and two opposed end walls, the side walls of the shell mounted to the base to form a cavity; a plurality of connectors mounted to each of the side walls; and a trunk cable routed into the cavity through one of the end walls, the trunk cable comprising a plurality of power conductors and/or a plurality of optical fibers. The power conductors and the optical fibers are connected with respective ones of the plurality of connectors..
Commscope Technologies Llc


new patent

Retracting mechanism for sensing components in a switchgear cabinet


A switchgear cabinet (100) includes an equipment compartment (102), a bus compartment (104) and a cable compartment (106). The cabinet can employ a sensor(s) (190) to monitor conditions, such as arcing, in the bus or cable compartment.
Schneider Electric Usa, Inc.


new patent

Radially polarized thin disk laser


A radially polarized thin disk laser comprises a pumping source (10), a collimating lens (20), a focusing lens (30), a laser gain medium (50), a heat dissipating medium (55), a brewster biaxial cone (60), and an output lens (70) which are arranged in sequence along the laser light path. The brewster biaxial cone (60) comprises two opposite cones and a cylinder connecting the two cones.
Han's Cnc Technology Co., Ltd.


new patent

Shielding shell and electrical connector thereof


A rear shielding shell comprised of two halves is provided. Each half comprises a base portion, two opposite side portions smoothly extending away from both sides of the base portion, two shoulder portions, a collar portion, a first rear abutment and a second rear abutment.
Yong Tai Electronic (dongguan) Ltd.


new patent

Connector


A connector includes: a casing; a terminal which is connected to a mating terminal; a flexible conductor disposed inside the casing and on a side opposite to the mating terminal with respect to the terminal, and electrically connected to the terminal; a connecting member which is a conductor fixed to the casing, is disposed on a side opposite to the terminal with respect to the flexible conductor, and is electrically connected to the flexible conductor; and an electrical wire which is disposed on a side opposite to the terminal with respect to the connecting member, is electrically connected to the connecting member, and is drawn from the casing in a direction opposite to an insertion direction of the terminal toward the mating terminal.. .
Yazaki Corporation


new patent

Electronic device


A circuit board is held by a holding member. A connector portion is located on an opposite side of the circuit board from the holding member.
Denso Corporation


new patent

Patch antenna


A surface-layer conductive plate having an opening is disposed on a first surface of a dielectric substrate. A radiation electrode is disposed inside the opening on the first surface of the dielectric substrate.
Murata Manufacturing Co., Ltd.


new patent

Antenna structure and manufacturing the same, and electronic device


An antenna structure includes a sheet metal antenna, a housing having an outer surface and an inner surface which face opposite to each other and having a through hole for inserting the sheet metal antenna from the outer surface to the inner surface, and a sealing portion which seals the through hole while relative positional relation between the sheet metal antenna and the rear-surface-side housing is fixed with the sheet metal antenna passing through the through hole.. .
Kyocera Corporation


new patent

Electrochemical cell comprising an electrodeposited fuel


Provided is a rechargeable electrochemical cell system for generating electrical current using a fuel and an oxidant. The system includes a plurality of electrochemical cells.
Fluidic, Inc.


new patent

Battery system with heat exchange device


A battery pack is provided including: a plurality of battery cells arranged in multiple battery cell rows; one or more heat exchange spaces; and a device for providing heat exchange to the battery pack. Further, the device includes a heat conduction medium passage arranged in the heat exchange spaces, such that the heat conduction medium passage surrounds multiple battery cells in each battery cell row.
Thunder Power Hong Kong Ltd.


new patent

Battery system with heat exchange device


A battery pack is provided including: a plurality of battery cells arranged in multiple battery cell rows; one or more heat exchange spaces; and a device for providing heat exchange to the battery pack. Further, the device includes a heat conduction medium passage arranged in the heat exchange spaces, such that the heat conduction medium passage surrounds multiple battery cells in each battery cell row.
Thunder Power Hong Kong Ltd.


new patent

Negative electrode active material and producing the same


It is an object of an exemplary embodiment of the present invention to provide a negative electrode active material having excellent rate characteristics and cycle characteristics. One embodiment according to the present invention is a negative electrode active material comprising a carbon-containing composite, wherein, in the carbon-containing composite, an active material capable of intercalating and deintercalating lithium, conductive nanofibers and conductive carbon particles are coated with a carbon material and are integrated..
Nec Corporation


new patent

Carbon material for negative electrode of non-aqueous secondary battery, negative electrode for non-aqueous secondary battery, and non-aqueous secondary battery


The present invention relates to a carbon material for negative electrodes of non-aqueous secondary batteries, the carbon material comprising: (1) a composite carbon particles (a) containing elemental silicon, and (2) amorphous composite graphite particles (b) in which graphite particles (c) and amorphous carbon are composited.. .

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new patent

Spinel-type lithium metal composite oxide


Provided is a spinel-type lithium metal composite oxide that makes it possible to achieve excellent high-temperature storage characteristics when used as a positive electrode active material of a lithium battery. The spinel-type (fd-3m) lithium metal composite oxide is characterized by the oxygen occupancy (occ) thereof as determined by the rietveld method being 0.965-1.000, the lattice strain thereof as determined by the williamson-hall method being 0.015-0.090, and the ratio (na/mn) of the molar content of na to the molar content of mn satisfying 0.00<na/mn<1.00×10−2..
Mitsui Mining & Smelting Co., Ltd.


new patent

Positive electrode active material for lithium ion secondary batteries, producing same and lithium ion secondary battery


An object of the present invention is to provide lithium ion secondary batteries having cycle characteristics as well as high energy density and rate characteristics during high-potential charging of a layered compound. The following is provided, a positive electrode active material for lithium ion secondary batteries, comprising particles each having: a core part comprising a lithium metal composite oxide; and a surface layer part comprising a lithium metal composite oxide having a composition differing from that in the core part, the surface layer part being formed on the surface of the core part, wherein both the core part and the surface layer part have a layered structure, the surface layer part contains ni, mn, and li, and ni/mn mole ratio in the surface is less than 1..
Hitachi Metals, Ltd.


new patent

Electrode, nonaqueous electrolyte battery, and battery pack


In general, according to one embodiment, there is provided an electrode. The electrode includes a current collector, a first electrode mixture layer formed on the current collector, and a second electrode mixture layer formed on the first electrode mixture layer.
Kabushiki Kaisha Toshiba


new patent

Active material, nonaqueous electrolyte battery, battery pack and battery module


In general, according to one embodiment, there is provided an active material. The active material contains active material primary particles of a monoclinic niobium-titanium composite oxide.
Kabushiki Kaisha Toshiba


new patent

Cathode active material for lithium secondary battery, preparing the same, and lithium secondary battery containing the same


There are provided a cathode active material for a lithium secondary battery, a method of preparing the same, and a lithium secondary battery containing the same. The cathode active material for a lithium secondary battery includes: a compound reversibly intercalating and deintercalating lithium; and a coating layer positioned on at least a portion of a surface of the compound, wherein the coating layer is a composite coating layer containing li3po4 and further containing a lithium metal oxide, a metal oxide, and/or a combination thereof, the lithium metal oxide or the metal oxide containing zr..
L&f Co., Ltd.


new patent

Cathode active material for lithium secondary battery, preparing the same, and lithium secondary battery containing the same


There are provided a cathode active material for a lithium secondary battery, a method of preparing the same, and a lithium secondary battery containing the same. The cathode active material for a lithium secondary battery includes: a core made of a compound reversibly intercalating and deintercalating lithium; and a coating layer positioned on at least a portion of a surface of the compound, wherein the coating layer is a composite coating layer containing li3po4 and lif, and further containing a lithium metal compound, a metal oxide, a metal fluoride compound, and/or a combination thereof, and the core is doped with fluorine..
L&f Co., Ltd.


new patent

Cathode active material for lithium secondary battery, preparing the same, and lithium secondary battery containing the same


There are provided a cathode active material for a lithium secondary battery, a method of preparing the same, and a lithium secondary battery containing the same. The cathode active material for a lithium secondary battery includes: a compound reversibly intercalating and deintercalating lithium; and a coating layer positioned on at least a portion of a surface of the compound, wherein the coating layer is a composite coating layer containing li3po4 and lif, and further containing a lithium metal compound, a metal oxide, a metal fluoride compound, and/or a combination thereof..
L&f Co., Ltd.


new patent

Electrode, nonaqueous electrolyte battery, and battery pack


According to one embodiment, an electrode is provided. The electrode includes a current collector and an electrode layer formed on the current collector.
Kabushiki Kaisha Toshiba


new patent

Method of manufacturing active material


According to an embodiment, a method of manufacturing an active material is provided. The active material includes particles of a composite oxide of the general formula ti1±xnb2±ymzo7−δ and a carbon-including phase.
Kabushiki Kaisha Toshiba


new patent

Battery case and electric skateboard using same


A battery case includes a bottom plate part and two side plate parts extending oppositely from the bottom plate part, wherein each of the side plate parts has at least one opening, in which an elastic element is arranged. An electric skateboard includes a bearing deck, wheels mounted on both ends of the bearing deck, an electric motor mounted under the bearing deck, and said battery case which is mounted under the bearing deck.
Haoxiang Electric Energy (kunshan) Co., Ltd.


new patent

Adjustable battery lock device and method


A battery locking device and method comprising a shaft, a rotatable latch, a deformable biasing member and a stop member. The latch extending between a proximal portion carried on the shaft and a distal portion opposite of the proximal portion at a distance from the shaft.
Honeywell International Inc.


new patent

Display device


A structure including a first resin layer and a second resin layer sandwiching a self-light emitting element layer, a first stopper layer, a first resin sacrificial layer and a first glass substrate which are stacked on the first resin layer on the opposite side of the self-light emitting element layer, and a second glass substrate stacked on the second resin layer is prepared. The first glass substrate is peeled off from the first resin sacrificial layer by irradiating the first glass substrate with a laser beam.
Japan Display Inc.


new patent

Organic el panel, producing same, and color filter substrate


An organic el panel includes: an organic el substrate; a color filter substrate; and a resin layer, wherein the organic el substrate and the color filter substrate are adhered to each other via the resin layer, the color filter substrate further includes a moisture absorbent layer, the moisture absorbent layer being vapor-deposited on the colored layers, facing the resin layer, and containing magnesium oxide, and a temperature of the second substrate during vapor deposition of the moisture absorbent layer is 200 degrees celsius or lower.. .
Joled Inc.


new patent

Hollow white composite quantum dot preparation method, display panel and display device


The embodiments of the invention disclose a hollow white composite quantum dot preparation method, a display panel and a display device. In the preparation method, unicolor quantum dots of different colors are prepared into corresponding unicolor quantum dot emulsions through an emulsion polymerization technique, dissolved silicon dioxide nano particles are used as a seed solution, the individual unicolor quantum dot emulsions are dropped in the seed solution in sequence, such that the surfaces of the silicon dioxide nano particles are coated with the unicolor quantum dots in the individual unicolor quantum dot emulsions in sequence according to the dropping order so as to obtain white composite quantum dots, and finally, the silicon dioxide nano particles in the white composite quantum dots are removed to obtain hollow white composite quantum dots.
Boe Technology Group Co., Ltd.


new patent

Hybrid organic/inorganic eutectic solar cell


A semiconductor assembly including substantially non-crystalline substrate having a predetermined softening point, a textured buffer layer deposited on said substrate, a polymer film deposited on said buffer layer, and an inorganic or silicon inorganic film deposited on said polymer film. The buffer layer, polymer film, and inorganic or silicon inorganic film are each deposited at a respective deposition temperature that is below the softening point of the substrate.
Solar-tectic Llc


new patent

Element for stabilising an optoelectronic device, producing an element and optoelectronic device


An element (1) is provided for stabilising an optoelectronic device (7), wherein the element (1) comprises a main body (1c), wherein the main body (1c) consists of a glass or at least comprises a glass and wherein the main body (1c) comprises a first and a second surface (1a, 1b). The first and second surface (1a, 1b) are opposite to one another and extend in each case in a lateral main direction of extension of the element (1), wherein a protective layer (2a, 2b) is formed at least at one of the surfaces (1a, 1b) and wherein the protective layer (2a, 2b) is configured and arranged in such a way that cracks (3) present in the main body (1c) are filled in by a material of the protective layer (2a, 2b).
Osram Oled Gmbh


new patent

Resistive random access memory (rram) cell with a composite capping layer


A resistive random access memory (rram) cell with a composite capping layer is provided. A tantalum oxide based layer is arranged over a bottom electrode layer.
Taiwan Semiconductor Manufacturing Co., Ltd.


new patent

Method of manufacturing tunnel magnetoresistive effect element and sputtering apparatus


A method includes: a first film formation process forming a film by sputtering a first insulator target when a projection plane of the first insulator target on a plane including a front face of a substrate is in a first state; and a second film formation process forming a film by sputtering a second insulator target when a projection plane of the second insulator target formed on the plane including the front face of the substrate is in a second state different from the first state. The second film formation process provides the insulating film having a second characteristic variation having opposite tendency to a first characteristic variation in the film provided by the first film formation process, the first characteristic variation occurring from a center portion to a peripheral portion of the substrate, the second characteristic variation occurring at least partly from the center portion to the peripheral portion..
Canon Anelva Corporation


new patent

Bottom electrode for magnetic memory to increase tmr and thermal budget


Magnetic tunnel junction (mtj) storage unit of a memory cell and method of forming thereof are disclosed. The method includes forming a composite bottom electrode on a substrate.
Globalfoundries Singapore Pte. Ltd.


new patent

Method of forming an on-pitch self-aligned hard mask for contact to a tunnel junction using ion beam etching


A method of forming a memory device that in one embodiment may include forming a magnetic tunnel junction on a first electrode using an electrically conductive mask and subtractive etch method. Following formation of the magnetic tunnel junction, at least one dielectric layer is deposited to encapsulate the magnetic tunnel junction.
Crocus Technology


new patent

Power generator


A power generator including a converter with an electromechnical transducer and a magnetostrictive layer to convert a variation of a magnetic field into a mechanical deformation exerted on the transducer. There is a magnetic field source including a group of several permanent magnets.
Institut Polytechnique De Grenoble


new patent

Method of manufacturing light emitting device with exposed wire end portions


A light emitting device is constituted with a semiconductor light emitting element on which a support member is disposed on one surface provided with a p-side electrode and an n-side electrode and a fluorescent material layer is disposed on the other surface which is an opposite side of the one surface. The support member includes a resin layer, an electrode for p-side external connection and an electrode for n-side external connection disposed exposed at a surface opposite side of a surface where the resin layer is in touch with a light emitting element, and internal wirings disposed in the resin layer and electrically connecting between a p-side electrode and the electrode for p-side external connection respectively.
Nichia Corporation


new patent

Light emitting component


A light emitting component includes a light emitting unit, a molding compound and a wavelength converting layer. The light emitting unit has a forward light emitting surface.
Genesis Photonics Inc.


new patent

Chip package structure and manufacturing the same


A chip package structure and method of manufacturing the same are provided. The chip package structure includes a substrate with a carrier surface, a chip having a first surface and a second surface positioned oppositely and a side surface connecting the first surface and the second surface, an encapsulation layer and a fluorescent layer.
Genesis Photonics Inc.


new patent

Light emitting diodes with current injection enhancement from the periphery


A light emitting diode (led) assembly with current injection enhancement from the periphery of the led is disclosed. In one embodiment, the led assembly includes an led comprising a light emitting layer disposed between a first layer having a first conductivity type and a second layer having a second conductivity type.
Toshiba Corporation


new patent

Light emitting diodes with current spreading material over perimetric sidewalls


A vertical light emitting diode (led) assembly with current spreading material over one or more sidewalls of the led is disclosed. In one embodiment, the vertical led assembly includes an led comprising a light emitting layer disposed between a first layer having a first conductivity type and a second layer have a second conductivity type.
Toshiba Corporation


new patent

Light-emitting device and production method therefor


An emission efficiency of a light-emitting device is improved by reducing strains applied to a light-emitting layer. On a sapphire substrate, an n-type contact layer, an nesd layer, an n-type cladding layer, a light-emitting layer, a p-type cladding layer, and a p-type contact layer, are sequentially deposited.
Toyoda Gosei Co., Ltd.


new patent

Semiconductor light emitting element, manufacturing same, and light emitting device


According to one embodiment, semiconductor light emitting element includes: a substrate having a first surface and a second surface on an opposite side of the first surface; an insulating layer provided on the second surface of the substrate; a first metal layer provided on the insulating layer; a semiconductor light emitting unit provided on the first metal layer, the semiconductor light emitting unit including a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer, the second semiconductor layer being electrically connected to the first metal layer; and a first electrode layer provided on the first surface of the substrate, the first electrode layer extending in the substrate and in the insulating layer, and the first electrode layer being electrically connected to the first metal layer.. .
Kabushiki Kaisha Toshiba


new patent

Semiconductor light-emitting element and manufacturing method thereof


A semiconductor light-emitting element includes a substrate having a first side and a second side, a first semiconductor layer of a first conductivity type on the first side of the substrate, a second semiconductor layer of a second conductivity type between the substrate and the first semiconductor layer, a third semiconductor layer between the first semiconductor layer and the second semiconductor layer, and a metal layer between the substrate and the second semiconductor layer. The substrate has a first surface on the first side facing the metal layer and a second surface on the second side opposite to the first surface, and the second surface is convex..
Kabushiki Kaisha Toshiba


new patent

Passivation stack on a crystalline silicon solar cell


A method for manufacturing a passivation stack on a crystalline silicon solar cell device. The method includes providing a substrate comprising a crystalline silicone layer such as a crystalline silicon wafer or chip, cleaning a surface of the crystalline silicon layer by removing an oxide layer at least from a portion of one side of the crystalline silicon layer, depositing, on at least a part of the cleaned surface, a layer of silicon oxynitride, and depositing a capping layer comprising a hydrogenated dielectric material on top of the layer of silicon oxynitride, wherein the layer of silicon oxynitride is deposited at a temperature from 100° c.
Institutt For Energiteknikk


new patent

Solar cell


Disclosed is a solar cell including a semiconductor substrate, a first conductive area disposed on one surface of the semiconductor substrate, the first conductive area being of a first conductive type, a second conductive area of a second conductive type opposite to the first conductive type, a first electrode connected to the first conductive area, and a second electrode connected to the second conductive area. At least one of the first conductive area and the second conductive area is formed of a metal compound layer..
Lg Electronics Inc.


new patent

Photovoltaic cell and manufacturing photovoltaic cell


A photovoltaic cell includes a translucent substrate; a photoelectric conversion element disposed on a light emission surface of the substrate; and a light guide member disposed on a light incidence surface of the substrate, at a position opposite the photoelectric conversion element across the substrate. A photovoltaic cell is manufactured by forming a first hydrophilic region on a light incidence surface of a translucent substrate, disposing a light guide member within the first hydrophilic region, forming a second hydrophilic region on a light emission surface of the substrate, and disposing a photoelectric conversion element in the second hydrophilic region..
Panasonic Intellectual Property Management Co., Ltd.


new patent

Method for producing thin film transistor


A method for producing a thin film transistor including an oxide semiconductor layer includes: depositing an oxide semiconductor film above a substrate by a sputtering method; and forming the oxide semiconductor layer into a predetermined shape by processing the oxide semiconductor film, wherein in the depositing of an oxide semiconductor film, a first oxide semiconductor film is deposited by using a first power density, and a second oxide semiconductor film is then deposited on the first oxide semiconductor film by using a second power density different from the first power density.. .
Joled Inc.


new patent

Vertical fin field-effect semiconductor device


A vertical finfet semiconductor device and a method of forming the same are disclosed. In one aspect, the semiconductor device includes a current-blocking structure formed over a semiconductor structure and a semiconductor fin formed on the current-blocking structure.
Globalfoundries Inc.


new patent

Access conductivity enhanced high electron mobility transistor


A high electron mobility transistor (hemt) device with enhanced conductivity in the transistor's non-gated access regions and a method for making the hemt device is disclosed. In one embodiment, the hemt device includes a heterojunction comprising a barrier layer formed on a channel layer.
Toshiba Corporation


new patent

Semiconductor device and manufacturing method thereof


A semiconductor device includes a substrate, a buffer layer and a device layer. The buffer layer is deposited on the substrate and comprises at least one gallium nitride (gan) epitaxy layer and at least one insertion layer deposited on the gan epitaxy layer, wherein the gan epitaxy layer adjacent to an interface between the gan epitaxy layer and the upper insertion layer is doped with a trapping electron element.
Hermes-epitek Corp.


new patent

Forming low parasitic trim gate last mosfet


A method for making a fin mosfet with substantially reduced parasitic capacitance and/or resistance is provided. The fin mosfet includes: a patterned fin structure on a substrate, the substrate including a first semiconductor layer; an epitaxy layer covering the substrate and a first portion of the fin structure, the first portion of the fin structure being doped to be integrated with the epitaxy layer, wherein a source and drain region is formed in the epitaxy layer; a metal gate high-k structure covering a second portion of the fin structure; a nitride structure covering the metal gate high-k structure; an oxide spacer structure enclosing the metal gate high-k structure and the nitride structure; and a metal contact structure for the source and drain region..
International Business Machines Corporation


new patent

Esd protection structure and fabrication thereof


An esd protection structure comprising a first semiconductor region of a first doping type, a second semiconductor region of the first doping type, a semiconductor structure of a second doping type opposite to the first doping type formed to provide lateral isolation between the first and second semiconductor regions of the first doping type, and a first contact region of the second doping type formed within a surface of the second semiconductor region. A thyristor structure is formed within the esd protection structure comprising the first contact region of the second doping type, the second semiconductor region of the first doping type, the semiconductor structure of the second doping type, and the first semiconductor region of the first doping type.
Freescale Semiconductor, Inc.


new patent

Divot-free planarization dielectric layer for replacement gate


After formation of a silicon nitride gate spacer and a silicon nitride liner overlying a disposable gate structure, a dielectric material layer is deposited, which includes a dielectric material that is not prone to material loss during subsequent exposure to wet or dry etch chemicals employed to remove disposable gate materials in the disposable gate structure. The dielectric material can be a spin-on dielectric material or can be a dielectric metal oxide material.
International Business Machines Corporation


new patent

Heterogeneous pocket for tunneling field effect transistors (tfets)


Embodiments of the disclosure described herein comprise a tunneling field effect transistor (tfet) having a drain region, a source region having a conductivity type opposite of the drain region, a channel region disposed between the source region and the drain region, a gate disposed over the channel region, and a heterogeneous pocket disposed near a junction of the source region and the channel region. The heterogeneous pocket comprises a semiconductor material different than the channel region, and comprises a tunneling barrier less than the bandgap in the channel region and forming a quantum well in the channel region to in crease a current through the tfet transistor when a voltage applied to the gate is above a threshold voltage..
Intel Corporation


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new patent

Light-emitting device and electronic apparatus


A light-emitting device includes a drive transistor for controlling the quantity of current supplied to a light-emitting element, a capacitor element electrically connected to a gate electrode of the drive transistor, and an electrical continuity portion for electrically connecting the drive transistor and the light-emitting element, these elements being disposed on a substrate. The electrical continuity portion is disposed on the side opposite to the capacitor element with the drive transistor disposed therebetween..
Seiko Epson Corporation


new patent

High thermal budget magnetic memory


Semiconductor devices and methods for forming a semiconductor device are disclosed. The method includes forming a storage unit of a magnetic memory cell.
Globalfoundries Singapore Pte. Ltd.


new patent

Semiconductor devices comprising magnetic memory cells


Memory cells are disclosed. Magnetic regions within the memory cells include an alternating structure of magnetic sub-regions and coupler sub-regions.
Micron Technology, Inc.


new patent

Formation of buried color filters in a back side illuminated image sensor with an ono-like structure


A semiconductor image sensor includes a substrate having a first side and a second side that is opposite the first side. An interconnect structure is disposed over the first side of the substrate.
Taiwan Semiconductor Manufacturing Company, Ltd.


new patent

Composite grid structure to reduce cross talk in back side illumination image sensors


A semiconductor structure for back side illumination (bsi) pixel sensors is provided. Photodiodes are arranged within a semiconductor substrate.
Taiwan Semiconductor Manufacturing Co., Ltd.


new patent

Composite grid structure to reduce crosstalk in back side illumination image sensors


A semiconductor structure for back side illumination (bsi) pixel sensors is provided. Photodiodes are arranged within a semiconductor substrate.
Taiwan Semiconductor Manufacturing Co., Ltd.


new patent

Semiconductor device and manufacturing the same


A semiconductor device including a semiconductor substrate having oppositely facing first and second surfaces, the first surface being an active surface and provided with an electronic element thereon, a pad electrode to be connected to the electronic element in a peripheral portion of the electronic element on the active surface, a first opening extending from the second surface toward the pad electrode so as not to reach the first surface of the semiconductor substrate, a second opening formed to reach the pad electrode from a bottom surface of the first opening and having a diameter smaller than that of the first opening, an insulating layer formed to cover sidewall surfaces of the first opening and the second opening, and a conductive layer formed, inside of the insulating layer, to cover at least an inner wall surface of the insulating layer and a bottom surface of the second opening.. .
Sony Corporation


new patent

Active matrix substrate, display apparatus and manufacturing active matrix substrate


A gate electrode and a capacitance wiring are formed on the insulating substrate in the active matrix substrate, and an interlayer insulating film is formed to cover the insulating substrate. On the gate electrode and the capacitance wiring, contact holes ca and cb are formed.

new patent

Method for the formation of a finfet device having a partially dielectric isolated fin structure


A semiconductor material is patterned to define elongated fins insulated from an underlying substrate. A polysilicon semiconductor material is deposited over and in between the elongated fins, and is patterned to define elongated gates extending to perpendicularly cross over the elongated fins at a transistor channel.
Stmicroelectronics, Inc.


new patent

Semiconductor device and manufacturing method thereof


A semiconductor device includes a substrate, a first gate, a second gate, and an insulating structure. The substrate includes a first fin and a second fin.
Taiwan Semiconductor Manufacturing Co., Ltd.


new patent

Monolithic microwave integrated circuit (mmic) cascode connected transistor circuit


A cascode transistor circuit having an active region, the active region having a source, a drain, a floating source/drain, a first gate disposed between the source and the floating source/drain and a second gate disposed between the floating source/drain and the drain. A first gate pad is displaced from the active region and is electrically connected to the first gate and a second gate pad is displaced from the active region and is electrically connected to the second gate.
Raytheon Company


new patent

Esd protection structure and fabrication thereof


An esd protection structure formed within an isolation trench and comprising a first peripheral semiconductor region of a first doping type, a second semiconductor region of the first doping type, and a semiconductor structure of a second doping type opposite to the first doping type formed to provide lateral isolation between the semiconductor regions of the first doping type and isolation between the further semiconductor region of the first doping type and the isolation trench. The semiconductor structure of the second doping type is formed such that no semiconductor region of the second doping type is formed between a peripheral side of the first semiconductor region of the first doping type and a wall of the isolation trench, and no semiconductor region of the first doping type is in contact with the isolation trench other than the first semiconductor region of the first doping type..
Freescale Semiconductor, Inc.


new patent

Method of embedding wlcsp components in e-wlb and e-plb


Embodiments of the invention include multi-die package and methods of making such multi-die packages. In an embodiment a mold layer has a first surface and a second surface that is opposite from the first surface.
Intel Corporation


new patent

Light-emitting unit and manufacturing light-emitting unit


A light transmissive first insulating film having light transmissive property to visible light, a second insulating film arranged opposite to the first insulating film, a plurality of conductor patterns formed of, for example, mesh patterns having the light transmissive property to the visible light and formed on a surface of at least one of the first insulating film and the second insulating film, a plurality of first light-emitting devices connected to any two conductor patterns of the plurality of conductor patterns, and a resin layer arranged between the first insulating film and the second insulating film to hold the first light-emitting devices are included.. .
Toshiba Hokuto Electronics Corporation


new patent

Semiconductor device and manufacturing method thereof


A semiconductor device according to the present embodiment includes a semiconductor substrate, an insulating film and a conductive film. The insulating film is disposed on a first surface of the semiconductor substrate.
Kabushiki Kaisha Toshiba


new patent

Integrated circuit package having wirebonded multi-die stack


Embodiments of the present disclosure are directed towards an integrated circuit (ic) package including a first die at least partially embedded in a first encapsulation layer and a second die at least partially embedded in a second encapsulation layer. The first die may have a first plurality of die-level interconnect structures disposed at a first side of the first encapsulation layer.
Intel Corporation


new patent

Semiconductor device and forming pop semiconductor device with rdl over top package


A pop semiconductor device has a top semiconductor package disposed over a bottom semiconductor package. The top semiconductor package has a substrate and a first semiconductor die disposed over the substrate.
Stats Chippac, Ltd.


new patent

Tunable composite interposer


A composite interposer can include a substrate element and a support element. The substrate element can have first and second opposite surfaces defining a thickness of 200 microns or less, and can have a plurality of contacts exposed at the first surface and electrically conductive structure extending through the thickness.
Invensas Corporation


new patent

Packaging devices and methods of manufacture thereof


Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a method of manufacturing a packaging device includes forming an interconnect wiring over a substrate, and forming conductive balls over portions of the interconnect wiring.
Taiwan Semiconductor Manufacturing Company, Ltd.


new patent

Semiconductor structure and fabrication method thereof


The disclosed subject matter provides a semiconductor structure and fabrication method thereof. In a semiconductor structure, a dielectric layer, a plurality of discrete gate structures, and a plurality of sidewall spacers are formed on a semiconductor substrate.
Semiconductor Manufacturing International (shanghai) Corporation


new patent

Semiconductor device


A semiconductor device includes a semiconductor chip, an electrically insulating element separated from the semiconductor chip by a space, and encapsulation material disposed in the space. The semiconductor chip includes a first face having a contact, and the electrically insulating element defines at least one through-hole.
Infineon Technologies Ag


new patent

Integrated magnetically coupled devices and making the same


Devices and methods of forming a device are disclosed. The method includes providing a wafer that includes a center insulator layer sandwiched by a top substrate and a bottom substrate.
Globalfoundries Singapore Pte. Ltd.


new patent

Semiconductor device and forming an embedded sop fan-out package


A semiconductor device includes a bga package including first bumps. A first semiconductor die is mounted to the bga package between the first bumps.
Stats Chippac Pte. Ltd.


new patent

Electronic package and fabrication method thereof and substrate structure


A substrate structure is provided, which includes: a substrate body having opposite first and second surfaces; a plurality of conductive posts formed on the first surface of the substrate body and electrically connected to the substrate body; and a dielectric layer formed on the first surface of the substrate body for encapsulating the conductive posts, wherein one end surfaces of the conductive posts are exposed from the dielectric layer. Therefore, the present invention replaces the conventional silicon substrate with the dielectric layer so as to eliminate the need to fabricate the conventional tsvs (through silicon vias) and thereby greatly reduce the fabrication cost.
Siliconware Precision Industries Co., Ltd.


new patent

Semiconductor device and a manufacturing the same and a mounting structure of a semiconductor device


The semiconductor device includes a tab including a chip supporting surface, and a back surface opposite to the chip supporting surface; a plurality of suspension leads supporting the tab; a plurality of leads arranged between the suspension leads; a semiconductor chip mounted on the chip supporting surface of the tab, the semiconductor chip including a main surface, a plurality of pads formed on the main surface, and a rear surface opposite to the main surface; a seal portion sealing the semiconductor chip such that a part of each of the leads is exposed from the seal portion; and a pb-free solder formed on the part of each of the leads. A part of the rear surface of the semiconductor chip is contacted with the seal portion..
Renesas Semiconductor Package & Test Solutions Co., Ltd.


new patent

Semiconductor device and forming stacked vias within interconnect structure for fo-wlcsp


A semiconductor device has a semiconductor die mounted to a carrier. An encapsulant is deposited over the semiconductor die and carrier.
Stats Chippac Pte. Ltd.


new patent

Semiconductor device and forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package


A semiconductor device includes a semiconductor die. An encapsulant is formed around the semiconductor die.
Stats Chippac Pte. Ltd.


new patent

Semiconductor device and forming build-up interconnect structures over carrier for testing at interim stages


A semiconductor device has a first interconnect structure formed over the carrier. A semiconductor die is disposed over the first interconnect structure after testing the first interconnect structure to be known good.
Stats Chippac Pte. Ltd.


new patent

Non-destructive, wafer scale method to evaluate defect density in heterogeneous epitaxial layers


A semiconductor material stack of, from bottom to top, a first semiconductor material having a first lattice constant and a second semiconductor material having a second lattice constant that may or may not differ from the first lattice constant and is selected from an iii-v compound semiconductor and germanium is provided. The second semiconductor material of the semiconductor material stack is then scanned using an atomic force microscope (afm) operating in a tapping mode to provide an afm image of the second semiconductor material of the semiconductor material stack.
International Business Machines Corporation


new patent

Method of dividing wafer


A wafer having a device area on one side with a plurality of devices partitioned by division lines is divided into dies. An adhesive tape for protecting devices is attached to the one side of the wafer, the adhesive tape adhering to at least some, optionally all, of the devices.
Disco Corporation


new patent

Method for manufacturing semiconductor device


A method for manufacturing a semiconductor device is provided. The method comprises steps as follows.
United Microelectronics Corporation


new patent

Methods for etching via atomic layer deposition (ald) cycles


Methods for etching a substrate are provided herein. In some embodiments, a method for etching a substrate disposed within a processing volume of a process chamber includes: (a) exposing a first layer disposed atop the substrate to a first gas comprising tungsten chloride (wcix) for a first period of time and at a first pressure, wherein x is 5 or 6; (b) purging the processing volume of the first gas using an inert gas for a second period of time; (c) exposing the substrate to a hydrogen-containing gas for a third period of time to etch the first layer after purging the processing volume of the first gas; and (d) purging the processing volume of the hydrogen-containing gas using the inert gas for a fourth period of time..
Applied Materials, Inc.


new patent

Selective formation of metallic films on metallic surfaces


Metallic layers can be selectively deposited on surfaces of a substrate relative to a second surface of the substrate. In preferred embodiments, the metallic layers are selectively deposited on copper instead of insulating or dielectric materials.
Asm International N.v.


new patent

Semiconductor manufacturing method and laminated body


A semiconductor manufacturing method according to a present embodiment includes forming a supporter on a second surface of a semiconductor substrate opposite to a first surface to be ground of the semiconductor substrate. The semiconductor manufacturing method includes thinning the thickness of the semiconductor substrate by grinding the first surface.
Kabushiki Kaisha Toshiba


new patent

Semiconductor manufacturing method and semiconductor manufacturing device


According to one embodiment, a semiconductor manufacturing method for a stacked body that includes a semiconductor substrate, a supporting substrate containing silicon, and a joining layer arranged between the semiconductor substrate and the supporting substrate to joint the semiconductor substrate and the supporting substrate, in which a surface of the semiconductor substrate opposite to the joining layer is to be ground, includes irradiating the stacked body with electromagnetic wave having energy of 0.11 to 0.14 ev from a side of the supporting substrate, and separating the semiconductor substrate from the supporting substrate.. .
Kabushiki Kaisha Toshiba


new patent

Electrostatic chuck


According to an aspect of an embodiment of the invention, there is provided an electrostatic chuck including: a ceramic dielectric substrate including a first major surface for mounting a clamped target, a second major surface on opposite side from the first major surface, and a through hole provided from the second major surface to the first major surface; a metallic base plate supporting the ceramic dielectric substrate and including a gas feed channel communicating with the through hole; and an insulator plug including a ceramic porous body provided in the gas feed channel and a ceramic insulating film provided between the ceramic porous body and the gas feed channel and being denser than the ceramic porous body, the ceramic insulating film biting into the ceramic porous body from a surface of the ceramic porous body.. .
Toto Ltd.


new patent

Gas flow for condensation reduction with a substrate processing chuck


A gas flow is described to reduce condensation with a substrate processing chuck. In one example, a workpiece holder in the chamber having a puck to carry the workpiece for fabrication processes, a top plate thermally coupled to the puck, a cooling plate fastened to and thermally coupled to the top plate, the cooling plate having a cooling channel to carry a heat transfer fluid to transfer heat from the cooling plate, a base plate fastened to the cooling plate opposite the puck, and a dry gas inlet of the base plate to supply a dry gas under pressure to a space between the base plate and the cooling plate to drive ambient air from between the base plate and the cooling plate..

new patent

Method for transfer of semiconductor devices


A method of transferring semiconductor devices to a product substrate includes positioning a surface of the product substrate to face a first surface of a semiconductor wafer having the semiconductor devices thereon, and actuating a transfer mechanism to cause the transfer mechanism to engage a second surface of the semiconductor wafer. The second surface of the semiconductor wafer is opposite the first surface of the semiconductor wafer.
Rohinni, Inc.


new patent

Thermally-enhanced provision of underfill to electronic devices


A method of feeding underfill material to fill a space between a semiconductor die and a substrate onto which the semiconductor die has been bonded, the method comprises positioning a stencil over the semiconductor die. The stencil has an elongated slot extending adjacent to an edge of the semiconductor die.
Asm Technology Singapore Pte Ltd


new patent

Silicide region of gate-all-around transistor


The disclosure relates to a semiconductor device and methods of forming same. A representative structure for a semiconductor device comprises a substrate; a nanowire structure protruding from the substrate having a channel region disposed between a source region and a drain region; a pair of silicide regions extending into opposite sides of the source region, wherein each of the pair of silicide regions comprise a vertical portion adjacent to the source region and a horizontal portion adjacent to the substrate; and a metal gate surrounding a portion the channel region..
Taiwan Semiconductor Manufacturing Company, Ltd.


new patent

Pulsed plasma for film deposition


Methods of processing a substrate are provided herein. In some embodiments, a method of processing a substrate disposed in a processing chamber includes: (a) depositing a layer of material on a substrate by exposing the substrate to a first reactive species generated from a remote plasma source and to a first precursor, wherein the first reactive species reacts with the first precursor; and (b) treating all, or substantially all, of the deposited layer of material by exposing the substrate to a plasma generated within the processing chamber from a second plasma source; wherein at least one of the remote plasma source or the second plasma source is pulsed to control periods of depositing and periods of treating..
Applied Materials, Inc.


new patent

Spin-on layer for directed self assembly with tunable neutrality


Techniques disclosed herein include methods for creating a directed self-assembly tunable neutral layer that works with multiple different block copolymer materials. Techniques herein can include depositing a neutral layer and then post-processing this neutral layer to tune its characteristics so that the neutral layer is compatible with a particular block copolymer scheme or schemes.
Tokyo Electron Limited


new patent

Ultrathin atomic layer deposition film accuracy thickness control


Methods for depositing ultrathin films by atomic layer deposition with reduced wafer-to-wafer variation are provided. Methods involve exposing the substrate to soak gases including one or more gases used during a plasma exposure operation of an atomic layer deposition cycle prior to the first atomic layer deposition cycle to heat the substrate to the deposition temperature..
Lam Research Corporation


new patent

Ground state hydrogen radical sources for chemical vapor deposition of silicon-carbon-containing films


A thin layer of a silicon-carbon-containing film is deposited on a substrate by generating hydrogen radicals from hydrogen gas supplied to a radicals generation chamber, supplying the hydrogen radicals to a substrate processing chamber separate from the substrate processing chamber via a multiport gas distributor, and reacting the hydrogen radicals therein with an organosilicon reactant introduced into the substrate processing chamber concurrently. The hydrogen radicals are allowed to relax into a ground state in a radicals relaxation zone within the substrate processing chamber before reacting with the organosilicon reactant..
Lam Research Corporation


new patent

Phase plate, fabricating same, and electron microscope


A phase plate capable of suppressing electrification and a method of fabricating the plate are provided. The phase plate is for use in an electron microscope and includes a phase control layer provided with a through-hole and at least one conductive layer covering and closing off the through-hole.
Jeol Ltd.


new patent

Systems and methods for quick release electromagnetic relays


An electromagnetic relay is provided. The electromagnetic relay includes a first port and a second port, a first coil and a second coil, a movable armature coupled between the first port and the second port constructed to connect and disconnect the first port and the second port, a switch circuit, and a coil control circuit.
Schneider Electric It Corporation


new patent

Trimmer capacitor


A trimmer capacitor is provided which includes a conductive bushing having a first terminal of the capacitor formed integrally therewith, a rotor that is threadably engageable with the bushing, and a dielectric portion attached at one end to the bushing and having a stator surrounding the dielectric portion near the opposite end thereof. The stator forms the second terminal of the capacitor.
Johanson Manufacturing Corporation


new patent

Decoupling loop for reducing undesired magnetic coupling between inductors, and related methods and devices


Devices and related methods use a decoupling loop near closely spaced inductors that couples to each inductor and adds an additional coupling path between them, canceling the effects of the direct coupling between the inductors. When two inductors are close enough that undesired magnetic coupling between the inductors is possible, a decoupling loop adjacent the inductors is added that is configured to cancel the undesired magnetic coupling between the inductors.
Rf Micro Devices, Inc.


new patent

Power inductor


A power inductor may include: an insulating substrate; first and second coil layers disposed on both surfaces of the insulating substrate; an inductor body having a coil part including the insulating substrate and the first and second coil layers and a cover part including upper and lower cover parts, and having end portions of the first and second coil layers exposed to both end surfaces thereof; and first and second external electrodes electrically connected to the end portions of the first and second coil layers, respectively, wherein each of the upper and lower cover parts includes a metal composite plate. Therefore, the power inductor has excellent dc-bias characteristics..
Samsung Electro-mechanics Co., Ltd.


new patent

Multilayer inductor


A multilayer inductor for reducing a difference in inductance values and suppressing magnetic interference. Plural electrically insulating magnetic layers and conductive patterns are laminated, each of the conductive patterns being connected in sequence in the lamination direction, so that two coils having substantially the same number of turns and substantially the same coil diameter are formed, the two coils are in parallel such that each coil is a mirror image with respect to a virtual surface between the coils, and ends of each coil are located at an outer peripheral part on a side opposite to the virtual surface, an electrically insulating nonmagnetic pattern corresponding in shape to each of the conductive patterns is between the conductive patterns adjacent in the lamination direction, and at least one electrically insulating nonmagnetic layer is disposed only inside the coils in the lamination direction in place of the magnetic layers..
Fdk Corporation


new patent

Coil component and manufacturing the same


A coil component and a method of manufacturing a coil component are disclosed. The coil component includes an insulation layer including a coil conductor, and a magnetic-resin composite layer disposed on the insulation layer.
Samsung Electro-mechanics Co., Ltd.


new patent

Gluing device, gluing method and colloid for packaging devices


The present disclosure provides a gluing device, a gluing method and a colloid for packaging devices. The gluing device includes an instillation head configured to guide a glue added with magnetic material in an instillation direction; and a magnetic field generation mechanism configured to apply a magnetic field within the instillation head, so as to apply a force to the magnetic material through the magnetic field in a direction identical to or opposite to the instillation direction.
Hefei Xinsheng Optoelectronics Technology Co. Ltd.


new patent

Processes of manufacturing power cables and related power cables


A method for manufacturing power cables may include: providing at least one insulated conductor; and/or arranging a water barrier around the at least one insulated conductor. Arranging the water barrier may include: providing foil having opposite edges; wrapping the foil around the at least one insulated conductor until the edges of the foil overlap; fastening the overlapped edges of the foil to each other with bonding agent to form a corresponding foil seam; and/or depositing a metal coating on the foil at the seam by a thermal spray process.
Prysmian S.p.a.


new patent

Shielded electrical cable


A shielded electrical cable (50) includes conductor sets (51a, 51b) spaced apart along a width of the cable and extending along a length of the cable. Each conductor set includes first and second insulated conductors (52a, 52b), one or two drain grounding wires (54) disposed between the first and second insulated conductors, first and second conductive shielding films (56a, 56b) disposed on opposite first and second sides of the conductor set, and an adhesive layer (59) bonding the first shielding film to the second shielding film..
3m Innovative Properties Company


new patent

Composite material having improved electrical conductivity and molded article containing same


Provided is a composite produced by processing a resin composition including a thermoplastic resin, carbon nanotubes, and a carbonaceous conductive additive. The carbon nanotubes have an id/ig of 1.0 or less before the processing.
Lg Chem. Ltd.


new patent

Semiconductor device


The trimming range of a reference current is extended larger than that of the related art. A semiconductor device includes a reference current generating circuit that generates a reference current.
Renesas Electronics Corporation


new patent

Method of writing to a spin torque magnetic random access memory


A spin-torque magnetoresistive memory includes array read circuits and array write circuits coupled to an array of magnetic bits. The array read circuits sample magnetic bits in the array, apply a write current pulse to the magnetic bits to set them to a first logic state, resample the magnetic bits using an additional offset current, and compare the results of sampling and resampling to determine the bit state for each magnetic bit.
Everspin Technologies, Inc.






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