This page is updated frequently with new Semiconductors-related patent applications.
|Cdzno/si tandem cell for photoelectrochemical water dissociation|
Here we present an apparatus comprising a photoelectrochemical cell connected a photovoltaic device, comprised of a layer with a thick n-type absorber and a layer comprising a thin p-type hole emitter. The photoelectrochemical cell has binary, metal-oxide semiconductors with wide bandgaps comprising high electron affinities relative to other semiconductor materials allowing for n-type doping..
|Apparatus and detecting faults in multilayer semiconductors|
An apparatus according to embodiments detects locations of faults in a multilayer semiconductor (mls). The apparatus comprises a laser source that outputs a laser beam, an optical system that directs the laser beam selectively onto a target region in the mls to generate an irradiated zone in the mls, a stage and a scanner that control a relative position between the irradiated zone and the mls so that the irradiated zone moves along the target region, a controller system that measures electrical signals or electrical signal changes induced by a temperature increase in the mls, and identifies a location of the target region and locations of faults in the mls based on the measured electrical signal or the measured electrical signal changes.
Kabushiki Kaisha Toshiba
|Controlled growth of nanoscale wires|
The present invention generally relates to nanoscale wires, and to methods of producing nanoscale wires. In some aspects, the nanoscale wires are nanowires comprising a core which is continuous and a shell which may be continuous or discontinuous, and/or may have regions having different cross-sectional areas.
President And Fellows Of Harvard College
|High efficiency inverter for distributed generation|
Systems, methods, and devices relating to a dc/ac inverter. The inverter has a full bridge converter and an output filter with an integrated magnetic subcircuit.
|Slab laser and amplifier and use|
A slab laser and its method of use for high power applications including the manufacture of semiconductors and deposition of diamond and/or diamond-like-carbon layers, among other materials. A lamp driven slab design with a face-to-face beam propagation scheme and an end reflection that redirects the amplified radiation back out the same input surface is utilized.
|Four-junction solar cell and fabrication method|
A method of fabricating a four-junction solar cell includes: forming a first epitaxial structure comprising first and second subcells and a cover layer over a first substrate through a forward epitaxial growth, and forming a second epitaxial structure comprising third and fourth subcells over the second substrate; forming a groove and a metal bonding layer; forming a groove on the cover layer surface of the first epitaxial structure and the substrate back surface of the second epitaxial structure, and depositing a metal bonding layer in the groove; and bonding the first epitaxial structure and the second epitaxial structure; bonding the cover layer surface of the first epitaxial structure and the substrate back surface of the second epitaxial structure, ensuring that the metal bonding layers are aligned to each other to realize dual bonding between the metal bonding layers and between the semiconductors through high temperature and high pressure treatment.. .
Xiamen Sanan Optoelectronics Technology Co., Ltd.
|Guided-wave photodetector apparatus employing mid-bandgap states of semiconductor materials, and fabrication methods for same|
Guided-wave photodetectors based on absorption of infrared photons by mid-bandgap states in non-crystal semiconductors. In one example, a resonant guided-wave photodetector is fabricated based on a polysilicon layer used for the transistor gate in a soi cmos process without any change to the foundry process flow (‘zero-change’ cmos).
|Method of forming a junction field effect transistor|
The disclosed technology relates to semiconductors, and more particularly to a junction field effect transistor (jfet). In one aspect, a method of fabricating a jfet includes forming a well of a first dopant type in a substrate, wherein the well is isolated from the substrate by an isolation region of a second dopant type.
|Method for mounting semiconductors provided with bumps on substrate locations of a substrate|
The invention relates to a method for mounting semiconductor chips provided with bumps as flip chips on substrate locations of a substrate. The method comprises the placing of a flip chip in a cavity arranged in a stationary manner where the bumps are wetted with a fluxing agent and the position of the flip chip is determined by means of a camera.
Besi Switzerland Ag
|Assembly structure of high-power semiconductors and heat sink|
An assembly structure of high-power semiconductors and heat sink includes a high-power semiconductor module and a heat sink. The high-power semiconductor module includes a printed circuit board, and high-power semiconductor components provided on the surfaces of the printed circuit board.
Method for producing differently doped semiconductors
The present invention relates to a liquid-phase method for doping a semiconductor substrate, characterized in that a first composition containing at least one first dopant is applied to one or more regions of the surface of the semiconductor substrate, in order to create one or more region(s) of the surface of the semiconductor substrate coated with the first composition; a second composition containing at least one second dopant is applied to one or more regions of the surface of the semiconductor substrate, in order to create one or more region(s) of the surface of the semiconductor substrate coated with the second composition, where the one or more region(s) coated with the first composition and the one or more region(s) coated with the second composition are different and do not overlap significantly and where the first dopant is an n-type dopant and the second dopant is a p-type dopant or vice versa; the regions of the surface of the semiconductor substrate coated with the first composition and with the second composition are each fully or partly activated; optionally, the unactivated regions of the surface of the semiconductor substrate coated with the first composition and with the second composition are each oxidized; and the semiconductor substrate is heated to a temperature at which the dopants diffuse out of the coating into the semiconductor substrate. The invention further relates to the semiconductor obtainable by the method and to the use thereof, especially in the production of solar cells..
Evonik Degussa Gmbh
Semiconductor modification process and structures
There is herein described a process for providing improved device performance and fabrication techniques for semiconductors. More particularly, the present invention relates to a process for forming features, such as pixels, on gan semiconductors using a p-gan modification and annealing process.
Epitaxial growth of gallium arsenide on silicon using a graphene buffer layer
Epitaxial growth of gallium arsenide (gaas) on a semiconductor material (e.g., si) using quasi-van der waals epitaxy (qvdwe). Prior to gaas growth a buffer layer (e.g., graphene) is deposited which relieves lattice mismatch/thermal expansion.
King Abdulaziz City For Science And Technology
Semiconductor layered structure and photodiode
A semiconductor layered structure according to the present invention includes a substrate formed of a iii-v compound semiconductor; and semiconductor layers disposed on the substrate and formed of iii-v compound semiconductors. The substrate has a majority-carrier-generating impurity concentration of 1×1017 cm−3 or more and 2×1020 cm−3 or less, and the impurity has an activation ratio of 30% or more..
Sumitomo Electric Industries, Ltd.
Lead selenide capped with a benzoate ligand
Semiconductor materials offer several potential benefits as active elements in the development of harvesting-energy conversion technologies. In particular, lead selenide (pbse) semiconductors have been used and proposed to design solar energy harvesting devices, ir sensors, fet devices, amongst others.
Ana G. Méndez University System
Semiconductor device and semiconductor device package using the same
A semiconductor device includes an active layer, a source electrode, a drain electrode, a gate electrode, an interlayer dielectric, an inter-source layer, an inter-source plug, an inter-drain layer, an inter-drain plug, an inter-gate layer, and an inter-gate plug. The active layer is made of iii-v group semiconductors.
Delta Electronics, Inc.
Tooling for a package enclosing electronics and methods of use thereof
The disclosure relates to a precise cut, reusable tooling assembly used to precisely hold and align a package base during manufacture into an electronic package that protects electronic circuits, microelectronic circuits and semiconductors. The assembly comprises a carrier plate and a template, and an optional interface bloc, all of which secure a lower or intermediate section of the outer periphery of the package base to prevent movement of the package base during manufacturing processes.
Microcircuit Laboratories Llc
Cupric oxide semiconductors
A method of preparing a cupric oxide semiconductor. The method includes providing a substrate having a first surface, forming a cuprous oxide layer on the first surface, converting the cuprous oxide layer into a cupric oxide layer via an oxidation reaction, and depositing additional cupric oxide on the cupric oxide layer, which serves as a seed layer, to yield a cupric oxide film, thereby obtaining a cupric oxide semiconductor.
Two-dimensional heterostructure materials
Methods, articles of manufacture and systems for creating new nanoscale two dimensional materials comprising designed arrays of lateral or vertical heterojunctions may be fabricated by first lithographically masking a 2d material. Exposed, or unmasked, regions of the 2d material may be converted to a different composition of matter to form lateral or vertical heterojunctions according to the patterned mask.
Fabrication of an optoelectronic semiconductor device and integrated circuit structure
There is provided a method for fabricating an optoelectronic semiconductor device (2,27) including a layer stack (1,26) that comprises a metallization structure (7,7′) including a contact region (8,11) for electrically contacting the semiconductor device (2,27). Moreover, a dielectric layer (12) and a semiconductor layer (3) are provided.
X-fab Semiconductor Foundries Ag
Display apparatus and manufacturing method thereof
A display apparatus and a method of manufacturing the same are disclosed. The display apparatus includes: a first substrate including a light emitting diode part including a plurality of light emitting diodes regularly arranged on the first substrate; and a second substrate including a tft panel unit including a plurality of tfts driving the light emitting diodes.
Seoul Semiconductor Co., Ltd.
Insulating busbar and manufacturing method
To realize an insulating busbar that has both low inductance and high withstand voltage, provided is an insulating busbar that connects to a module on which is mounted a semiconductor chip, including a plurality of circuit conductors; a plurality of connection terminals that respectively electrically connect the circuit conductors to the module; and an insulating resin portion that is formed integrally between each of the circuit conductors and at least a portion of a region around each connection terminal and does not have any gaps between the circuit semiconductors.. .
Fuji Electric Co., Ltd.
New cyclazines and their use as semiconductors
Wherein, if present, x3, x4 are o or c(cn)2 and m, r4a, r4b, r5a, r5b, r6a, r6b, r6c, r6d, r7a, r7a, r8a, r8b, r9, r10a, r10b, rm1, rm2, rm3 and rm4 are as defined in the claims and description. The present invention also relates to a method for their preparation and their use as semiconductors, in particular as semiconductors in organic electronics and organic photovoltaics..
Formation of homojunction in kesterite-based semiconductors
Kesterite-based homojunction photovoltaic devices are provided. The photovoltaic devices include a p-type semiconductor layer including a copper-zinc-tin containing chalcogenide compound and an n-type semiconductor layer including a silver-zinc-tin containing chalcogenide compound having a crystalline structure the same as a crystalline structure the copper-zinc-tin containing chalcogenide compound..
International Business Machines Corporation
Grid polarizer and photo-alignment device
A stripe-shaped grid provided on a transparent substrate is made from dielectrics or semiconductors. For each linear segment of the grid, a gap (t) on one side of the linear segment, and an opposite gap (t) on an opposite side of the linear segment materially satisfy the relation t<t in a periodic fashion.
Ushio Denki Kabushiki Kaisha
Sputtering target, manufacturing sputtering target, and forming thin film
There have been cases where transistors formed using oxide semiconductors are inferior in reliability to transistors formed using amorphous silicon. Thus, in the present invention, a semiconductor device including a highly reliable transistor formed using an oxide semiconductor is manufactured.
Semiconductor Energy Laboratory Co., Ltd.
Method for synthesis of two-dimensional dichalcogenide semiconductors
The present disclosure relates to methods of making a transition metal dichalcogenide. The methods can include a step of depositing a transition metal onto a substrate to form an epitaxial transition metal layer.
Array voltage regulating technique to enable data operations on large memory arrays with resistive memory elements
Embodiments of the invention relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to preserve states of memory elements in association with data operations using variable access signal magnitudes for other memory elements, such as implemented in third dimensional memory technology. In some embodiments, a memory device can include a cross-point array with resistive memory elements.
Unity Semiconductor Corporation
Stabilized quantum dot structure and making a stabilized quantum dot structure
A stabilized quantum dot structure for use in a light emitting diode (led) comprises, according to one embodiment, a luminescent particle comprising one or more semiconductors, a buffer layer overlying the luminescent particle, where the buffer layer comprises an amorphous material, and a barrier layer overlying the buffer layer, where the barrier layer comprises oxygen, nitrogen and/or carbon. According to another embodiment, the stabilized quantum dot structure includes a luminescent particle comprising one or more semiconductors, and a treated buffer layer comprising amorphous silica overlying the luminescent particle, where the stabilized quantum dot structure exhibits a quantum yield of at least about 0.7 when exposed to a blue light flux of about 30 w/cm2 at a temperature of 80-85° c.
Reducing autodoping of iii-v semiconductors by atomic layer epitaxy (ale)
In one aspect, a method for forming a doped iii-v semiconductor material on a substrate includes the steps of: (a) forming a first monolayer on the substrate, wherein the first monolayer comprises at least one group iii or at least one group v element; and (b) forming a doped second monolayer on a side of the first monolayer opposite the substrate, wherein the second monolayer comprises either i) at least one group v element if the first monolayer comprises at least one group iii element, or ii) at least one group iii element if the first monolayer comprises at least one group v element, wherein a dopant is selectively introduced only during formation of the second monolayer, and wherein steps (a) and (b) are performed using atomic layer epitaxy. Doped iii-v semiconductor materials are also provided..
International Business Machines Corporation
Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes.
The Board Of Trustees Of The University Of Illinois
Controlling the emission wavelength in group iii-v semiconductor laser diodes
Methods are provided for modifying the emission wavelength of a semiconductor quantum well laser diode, e.g. By blue shifting the emission wavelength.
King Abdullah University Of Science And Technology
Integrated multi-color light emitting device made with hybrid crystal structure
An integrated hybrid crystal light emitting diode (“led”) display device that may emit red, green, and blue colors on a single wafer. The various embodiments may provide double-sided hetero crystal growth with hexagonal wurtzite iii-nitride compound semiconductor on one side of (0001) c-plane sapphire media and cubic zinc-blended iii-v or ii-vi compound semiconductor on the opposite side of c-plane sapphire media.
U.s.a. As Represented By The Administrator Of The National Aeronautics And Space Administration
Write enhancement for one time programmable (otp) semiconductors
A method of programming one-time programmable (otp) memory cells in an array is described. Each memory cell has a mosfet programming element and a mosfet pass transistor, the mosfet pass transistor having a gate electrode over a channel region between two source/drain regions, and the mosfet programming element having a gate electrode over a channel region contiguous to a source/drain region either part of, or connected to, one of the two source/drains associated with the mosfet pass transistor.
Kilopass Technology, Inc.
Circuits and techniques to compensate memory access signals for variations of parameters in multiple layers of memory
Embodiments of the invention relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to implement circuits configured to compensate for parameter variations in layers of memory by adjusting access signals during memory operations. In some embodiments, memory cells are based on third dimensional memory technology.
Unity Semiconductor Corporation
Temperature estimation in power semiconductor device in electric drvie system
Estimating junction temperature in a power semiconductor includes monitoring electrical current direction so as to determine which of a first and a second power semiconductor is in an on-state, and sensing a voltage drop across the one of the power semiconductors. Voltage drop may be correlated with temperature according to a gain dependent upon a level of the electrical current..
Multiple input three-phase inverter with independent mppt and high efficiency
Systems, methods, and devices relating to power converters. A power conditioning system uses multiple dc/dc power converter blocks.
High-purity 1-fluorobutane and plasma etching method
The present invention provides: 1-fluorobutane having a purity of 99.9% by volume or more and a total butene content of 1,000 ppm by volume or less; use of the 1-fluorobutane as a dry etching gas; and a plasma etching method using the 1-fluorobutane as an etching gas. According to the present invention, high-purity 1-fluorobutane which is suitable as a plasma reaction gas for semiconductors, the use of the high-purity 1-fluorobutane as a dry etching gas, and a plasma etching method using the high-purity 1-fluorobutane as an etching gas are provided..
Polyimide and film using same
This invention relates to a polyimide and a film using the same and, more particularly, to a polyimide, which can exhibit a low dielectric constant while retaining the superior properties thereof, and can thus be utilized as electronic materials such as protective materials or insulating materials for liquid crystal displays or semiconductors, and optical communication materials such as optical waveguide materials, and to a polyimide film including the same.. .
Kolon Industries, Inc.
High efficiency dc/dc converter and controller
Systems, methods, and devices for use in a dc/dc converter. A circuit uses a full-bridge power semiconductor subcircuit along with a high power transformer subcircuit, a diode bridge subcircuit, and a parallel capacitor to provide galvanic isolation and boost the voltage from a power source such as a photovoltaic panel.
Preparation of semiconductor films
This invention relates to a precursor material, which can be decomposed to form semiconductors and metal oxides, or more generally, materials for electronic components. The precursors comprise metal complexes of hydroxamato ligands.
Merck Patent Gmbh
Minimizing shorting between finfet epitaxial regions
The present invention relates generally to semiconductors, and more particularly, to a structure and method of minimizing shorting between epitaxial regions in small pitch fin field effect transistors (finfets). In an embodiment, a dielectric region may be formed in a middle portion of a gate structure.
International Business Machines Corporation
Compounds having semiconducting properties and related compositions and devices
Disclosed are new compounds having semiconducting properties. Such compounds can be processed in solution-phase at a temperature of less than about 50° c.
Phenazine-based molecular and polymeric semiconductors
The present invention relates to new semiconducting compounds having at least one optionally substituted phenazine moiety. The compounds disclosed herein can exhibit high carrier mobility and/or efficient light absorption/emission characteristics, and can possess certain processing advantages such as solution-processability and/or good stability at ambient conditions..
Methods and compositions for enhancing processability and charge transport of polymer semiconductors
A method of making a solid state semiconducting film. The method includes blending a non-conjugated semiconducting polymer matrix containing crystalline aggregates with intentionally placed conjugation-break spacers along the polymer backbone, and fully conjugated semiconducting polymer.
Purdue Research Foundation
Semiconductor layered structure, producing semiconductor layered structure, and producing semiconductor device
A semiconductor layered structure includes a substrate formed of a iii-v compound semiconductor, a buffer layer disposed on and in contact with the substrate and formed of a iii-v compound semiconductor, and a quantum well layer disposed on and in contact with the buffer layer and including a plurality of component layers formed of iii-v compound semiconductors. The substrate has a diameter of 55 mm or more.
Sumitomo Electric Industries, Ltd.
Separable electrical connector and making it
A novel, low profile connector element is disclosed for the purpose of electrically and mechanically interconnecting circuit elements in electronic devices, said circuit elements including but not limited to printed circuit boards, flexible printed circuits, rigid flex circuits, semiconductors, semiconductor package substrates, ground shields, and batteries, whereby the connector includes electrical contacts which have a unitary structure consisting of at least a distal end, a proximal end, and a middle section between the distal and proximal ends. The contacts of the present invention exhibit a contact diametric true position with respect to one another in an array of less than 0.2 millimeters.
Methods related to a sputtered titanium tungsten layer formed over a copper interconnect stack structure
Disclosed are devices and methods related to metallization of semiconductors. A metalized structure can include a stack disposed over a compound semiconductor, with the stack including a barrier, a copper (cu) layer disposed over the barrier, and a first titanium (ti) layer disposed over the cu layer.
Skyworks Solutions, Inc.
Interposer and semiconductor module for use in automotive applicatons
An interposer of silicon for use in a semiconductor module, wherein the interposer has a top side serving for arrangement of functional semiconductor and an underside and is subdivided into a connection layer and a thermal layer along a plane running between the top side and the underside. The connection layer forming the surface of the interposer has a network with contact pads arranged on the surface for connection of the functional semiconductors arranged on the surface of the interposer, while the thermal layer has no metallization, and the underside of the interposer formed by the thermal layer serves for dissipating the heat generated by the functional semiconductors..
Methods and systems relating to optical waveguide tapers
Photonic integrated circuits required connection to germanium doped silica cored optical fibers or silica cored and fluorine doped silica cladding optical fibers which have low index contrast and large mode field diameters. However, the optical waveguide within a photonic integrated circuit such as formed using silicon-on-insulator or compound semiconductors tends to be high index contrast and small mode field diameter.
Method for splitting circles
The present invention relates to a method for splitting circles, and the method is mainly applied to a wafer of semiconductors. A plurality of splitting blades are disposed above the wafer, and conditions and steps are set for switching the plurality of splitting blades based on a safe distance value set at an outer edge of a wafer or a safe distance value set at an inner edge of a metal ring.
Youngtek Electronics Corporation