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Semiconductor

Semiconductor-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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NEW Semiconductor device
Longitude Semiconductor S.a.r.l.
May 17, 2018 - N°20180139847

One semiconductor device includes a wiring substrate, a semiconductor chip, and a sealing body. The wiring substrate includes an insulating base material, a first conductive pattern formed on one surface of the insulating base material, and a second conductive pattern formed on one surface of the insulating base material, connected to the first conductive pattern and having an end face ...
NEW Magnetic core inductor integrated with multilevel wiring network
Ferric Inc.
May 17, 2018 - N°20180139846

An inductor is integrated into a multilevel wiring network of a semiconductor integrated circuit. The inductor includes a planar magnetic core and a conductive winding. The conductive winding turns around in generally spiral manner on the outside of the planar magnetic core. The conductive winding is piecewise constructed of wire segments and of vias. The wire segments pertain to at ...
NEW Image processing device and semiconductor device
Renesas Electronics Corporation
May 17, 2018 - N°20180139460

In an image processing device, a motion image decoding processing unit extracts a feature amount of a target image to be decoded from an input stream, and changes a read size of a cache fill from an external memory to a cache memory, based on the feature amount. The feature amount represents an intra macro block ratio in, for example, ...
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NEW Tristate and cross current free output buffer
Tesat-spacecom Gmbh & Co. Kg
May 17, 2018 - N°20180138942

A tristate output buffer includes a first branch with a first buffer, and a second branch with a second buffer. The first buffer includes a supply port, a ground port, an output port, two switchable semiconductor elements of a first type, and two switchable semiconductor elements of a second type. Switching behavior of the switchable semiconductor elements of the first ...
NEW Memory controller
Toshiba Memory Corporation
May 17, 2018 - N°20180138923

According to one embodiment, a memory controller includes an encoder, a randomizing circuit, and an interface. The encoder subjects first data received from an external device to error correction coding. The randomizing circuit randomizes second data output from the encoder. The interface transmits third data output from the randomizing circuit to a nonvolatile semiconductor memory and controls write/read of ...
NEW Data communication system and semiconductor device
Seiko Epson Corporation
May 17, 2018 - N°20180138908

A data communication system has a first data communication circuit for outputting a clock signal to a clock signal line, receiving data input from a data signal line, and outputting data as open drain output to the data signal line, a second data communication circuit for receiving input of a clock signal from the clock signal line, receiving input of ...
NEW Semiconductor Patent Pack
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Semiconductor Patent Applications
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  • 122+ full patent PDF documents of Semiconductor-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
NEW Semiconductor module
Renesas Electronics Corporation
May 17, 2018 - N°20180138828

Reliability of a semiconductor device is improved. A third semiconductor chip on which a control circuit is formed, and a first semiconductor chip of a plurality of igbt chips are electrically connected via a high-side relay board. That is, the first semiconductor chip and the third semiconductor chip are electrically connected via a first wire, a high-side relay board and ...
NEW Electric power conversion device and electric power system
Mitsubishi Electric Corporation
May 17, 2018 - N°20180138826

An electric power conversion device includes a first arm and a second arm each including converter cells. The converter cell of the first arm is a first converter cell having a full-bridge configuration including an energy storing element and semiconductor switching elements. The converter cell of the second arm is a second converter cell having a half-bridge configuration including an ...
NEW Switching device
Rohm Co., Ltd.
May 17, 2018 - N°20180138824

A switching device according to the present invention is a switching device for switching a load by on-off control of voltage, and includes an sic semiconductor layer where a current path is formed by on-control of the voltage, a first electrode arranged to be in contact with the sic semiconductor layer, and a second electrode arranged to be in contact ...
NEW Semiconductor device and system
Samsung Electronics Co., Ltd.
May 17, 2018 - N°20180138806

A semiconductor device includes an inductor selectively connected to a power supply voltage and configured to store and release energy; a first transistor connected between the power supply voltage and the inductor and configured to provide the power supply voltage to the inductor; a second transistor connected to the first transistor in series, connected between the inductor and a ground ...
NEW Semiconductor device and semiconductor device mounting method
Shindengen Electric Manufacturing Co., Ltd.
May 17, 2018 - N°20180138788

A semiconductor device includes a device main body that is semi-annular, the device main body having an inner circumferential surface formed arcuate in plan view and an outer circumferential surface formed arcuate in plan view. Cutout portions are formed on a first end surface, on one end side, in a circumferential direction, of the device main body and a second ...
NEW Arc-free dc circuit breaker
Xi'an Jiaotong University
May 17, 2018 - N°20180138695

The present disclosure provides an arc-free dc circuit breaker that combines magnetic induction transfer and resistive current limiting. The circuit breaker comprises a main current circuit and a transfer current circuit. The transfer current circuit has a bridge structure; with a group of unidirectional components having a breaking function, bidirectional current breaking is implemented, such that compared with the prior ...
NEW Semiconductor device for controlling power source
Mitsumi Electric Co., Ltd.
May 17, 2018 - N°20180138693

A semiconductor device for power supply control includes an over-current detection circuit which detects an over-current state on a secondary side of a transformer by comparing a voltage in proportion to current flowing in a primary-side winding wire with an over-current detection voltage; a control signal generation circuit which generates a control signal to turn off a switching element when ...
NEW Semiconductor Patent Pack
Download 122+ patent application PDFs
Semiconductor Patent Applications
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For professional research & prior art discovery
inventor
  • 122+ full patent PDF documents of Semiconductor-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
NEW Semiconductor laser device
Playnitride Inc.
May 17, 2018 - N°20180138663

A semiconductor laser device includes a semiconductor epitaxial structure, an electrode pad layer, and a transparent conductive layer. The semiconductor epitaxial structure includes a first semiconductor layer, a second semiconductor layer, and a light emitting layer. The light emitting layer is disposed between the first semiconductor layer and the second semiconductor layer, and the first semiconductor layer is disposed between ...
NEW Semiconductor optical device
Sony Corporation
May 17, 2018 - N°20180138662

A semiconductor optical device includes a laminated structure constituted of a first compound semiconductor layer of an n type, an active layer, and a second compound semiconductor layer of a p type, the active layer including at least 3 barrier layers and well layers interposed among the barrier layers, and the semiconductor optical device satisfying egp-br>egn-br>...
NEW Optical amplifier including multi-section gain waveguide
Juniper Networks, Inc.
May 17, 2018 - N°20180138658

Described herein are methods, systems, and apparatuses to utilize a semiconductor optical amplifier (soa) comprising a silicon layer including a silicon waveguide, a non-silicon layer disposed on the silicon layer and including a non-silicon waveguide, first and second mode transition region comprising tapers in the silicon waveguide and/or the non-silicon waveguide for exchanging light between the waveguide, and a ...
NEW Semiconductor laser module
Furukawa Electric Co., Ltd.
May 17, 2018 - N°20180138657

A semiconductor laser module includes a semiconductor laser that outputs laser light; an optical fiber that guides the laser light; a lens that couples the laser light, which is output from the semiconductor laser, with the optical fiber; a base that is substantially tabular in shape and that has the semiconductor laser, the optical fiber, and the lens fixed thereon ...
NEW Wafer scale monolithic integration of lasers, modulators, and other optical components using ald optical coatings
International Business Machines Corporation
May 17, 2018 - N°20180138655

After forming a monolithically integrated device including a laser and a modulator on a semiconductor substrate, an anti-reflection coating layer is formed over the monolithically integrated device and the semiconductor substrate by an atomic layer deposition (ald) process. The anti-reflection coating layer is lithographically patterned so that an anti-reflection coating is only present on exposed surfaces of the modulator. After ...
NEW Light-emitting diode device
Epistar Corporation
May 17, 2018 - N°20180138381

A led device includes a substrate; a plurality of led units on the substrate, wherein each led unit includes: a first semiconductor layer; a second semiconductor layer; a first sidewall; a second sidewall opposite to the first sidewall; and a third sidewall connecting the first and second sidewalls; a first group of conductive connecting structure including n (n is an ...
NEW Light emitting device
Epistar Corporation
May 17, 2018 - N°20180138380

A light-emitting device, comprising: a substrate; a semiconductor stacking layer comprising a first type semiconductor layer on the substrate, an active layer on the first semiconductor layer, and a second semiconductor layer on the active layer; and an electrode structure on the second semiconductor layer, wherein the electrode structure comprises a bonding layer, a conductive layer, and a first barrier ...
NEW Method of producing a connection support, connection support and optoelectronic semiconductor component comprising a connection ...
Heraeus Deutschland Gmbh & Co. Kg
May 17, 2018 - N°20180138379

A method of producing at least one connection carrier includes: a) providing a carrier plate with a planar top face; b) applying at least one electrically insulating insulation strip to the top face and cohesively connecting the carrier plate and the insulation strip; and c) applying at least one electrically conductive conductor strip to an adhesive surface of the insulation ...
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