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Rounding

Rounding-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Electromagnetic interference shields for electronic packages and related methods
Intel Corporation
June 22, 2017 - N°20170181334

Disclosed are emi shielded packages, electronic device packages, and related methods. Emi shielded packages are formed by applying an insulating material to a first side of a substrate strip, separating the substrate strip into segments, adhering the insulating material of the segments to a solid conductor, applying a conductive paste around lateral sides of the segments, curing the conductive paste, ...
Cooling apparatus
Abb Technology Oy
June 22, 2017 - N°20170181319

The invention relates to a cooling apparatus, comprising a first evaporator section with first channels, and a first condenser section with second channels. In order to provide adequate cooling for electric components the cooling apparatus further comprises a second evaporator section with third channels, and a base plate with a first surface for receiving a heat load from electric components. ...
Gradient encapsulant protection of devices in stretchable electronics
Intel Corporation
June 22, 2017 - N°20170181275

In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for gradient encapsulant protection of devices in stretchable electronic. For instance, in accordance with one embodiment, there is an apparatus with an electrical device on a stretchable substrate; one or more stretchable electrical interconnects coupled with the electrical device; one or more electrical components electrically coupled with the ...
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Electronic circuit board shielding with open window heat transfer path
Thomson Licensing
June 22, 2017 - N°20170181266

An improved heat transfer system for components an electronic device is provided. The electronic device includes a printed circuit board, a component shield and a heatsink or heat spreader. An open heat transfer window is positioned in the component shield so as to enable a depression in the heat sink to pass through the window and directly contact a thermal ...
Electronic circuit board shielding with open window heat transfer path
Thomson Licensing
June 22, 2017 - N°20170181265

An improved heat transfer system for components an electronic device is provided. The electronic device includes a printed circuit board, a component shield and a heatsink or heat spreader. An open heat transfer window is positioned in the component shield so as to enable the heat sink to directly contact a thermal pad for a component requiring heat dissipation. Grounding ...
Method and apparatus for establishing group cell on basis of measurement signal variation
Korea Advanced Institute Of Science And Technology
June 22, 2017 - N°20170181051

The present specification suggests a method for establishing a terminal-centric group cell on the basis of measurement signal variation for cooperative transmission and handover in a mobile communication system. Specifically, a base station receives transmissions of parameters from a terminal, configures a terminal surrounding cell information table, and configures a cooperative cell cluster configuration table using the terminal surrounding cell ...
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High speed socket connector
Oupiin Electronic (kunshan) Co., Ltd
June 22, 2017 - N°20170179651

A high speed socket connector is disclosed in this invention, including a case, a terminal mould, an upper shield and a lower shield. The terminal mould includes an insulative body, a row of upper terminals and a row of lower terminals. The insulative body forms multiple first openings and second openings. The upper terminals and the lower terminals both include ...
Connector system
Te Connectivity Nederland Bv
June 22, 2017 - N°20170179648

A connector is disclosed. The connector has a plug and a jack receiving the plug. The plug has a plug housing surrounding a plurality of plug contacts and including a plurality of symmetric male fit sections. The jack has a jack housing supporting a plurality of jack contacts corresponding to the plurality of plug contacts. The jack housing includes a ...
Antenna assembly and electronic device
Xiaomi Inc.
June 22, 2017 - N°20170179591

An antenna assembly and an electronic device are provided. The antenna assembly includes: an antenna body having a feed point, a first grounding point, a second grounding point, and a third grounding point; a feed circuit connected with the antenna body via the feed point; a first grounding circuit configured to provide at least two low frequency states and connected ...
Display screen and portable device
Boe Technology Group Co., Ltd.
June 22, 2017 - N°20170179567

A display screen and a portable device are disclosed. The display screen includes a display region (1) and a non-display region (2) surrounding the display region (1), the display region (1) includes at least one transparent antenna structure (3), the antenna structure (3) includes an antenna (31) and a capacitor (32) which are located in a same layer, and the capacitor (32) is electrically connected to the antenna (31). The ...
Method for making iii-v nanowire quantum well transistor
Zing Semiconductor Corporation
June 22, 2017 - N°20170179269

The present invention provides a field effect transistor and the method for preparing such a filed effect transistor. The filed effect transistor comprises a semiconductor, germanium nanowires, a first iii-v compound layer surrounding the germanium nanowires, a semiconductor barrier layer, a gate dielectric layer and a gate electrode sequentially formed surrounding the first iii-v compound layer, and source/drain electrodes ...
Semiconductor device and method of manufacturing semiconductor device
Fuji Electric Co., Ltd.
June 22, 2017 - N°20170179235

A semiconductor device includes an n+ type silicon carbide substrate, and in the substrate an active region where primary current flows and an edge termination area surrounding the active region. The semiconductor device has a first p-type region and a second p-type region in the edge termination area, and the first p-type region includes therein a plurality of third p-type ...
Protecting transistor elements against degrading species
Flexenable Limited
June 22, 2017 - N°20170179231

A technique comprising: providing a stack of layers defining at least (a) source and drain electrodes, (b) gate electrode, and (c) semiconductor channel of at least one transistor; depositing one or more organic insulating layers over the stack; removing at least part of the stack in one or more selected regions by an ablation technique; depositing conductor material over the ...
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Organic light-emitting display device
Samsung Display Co., Ltd.
June 22, 2017 - N°20170179212

An organic light-emitting display device includes a substrate having a display region and a peripheral region, a plurality of pixels on the substrate in the display region, a first wiring and a second wiring on the substrate in the peripheral region, a compensation layer on the first and second wirings, the compensation layer surrounding a top surface and a sidewall ...
Semiconductor device and manufacturing method thereof
Sk Hynix Inc.
June 22, 2017 - N°20170179144

A semiconductor device includes channel layers arranged in a first direction and a second direction intersecting the first direction; stacked insulating layers surrounding sidewalls of the channel layers; stacked gate electrodes interposed between the insulating layers, the gate electrodes respectively surrounding the channel layers; and stacked gate lines interposed between the insulating layers, the gate lines electrically connecting the gate ...
Methods of processing wafer-level assemblies to reduce warpage, and related assemblies
Micron Technology, Inc.
June 22, 2017 - N°20170179045

Wafer-level methods of processing semiconductor devices may involve forming grooves partially through a molding material, the molding material located in streets and at least surrounding stacks of semiconductor dice located on a wafer. Wafer-level methods of preparing semiconductor devices may involve attaching a wafer to a carrier substrate and forming stacks of laterally spaced semiconductor dice on die locations of ...
Perforated conductive material for emi shielding of semiconductor device and components
Intel Corporation
June 22, 2017 - N°20170179040

An electric device and method of fabrication of that electric device is disclosed. The electric device includes one or more electrical devices attached to a substrate. The electric device further includes one or more grounding pads attached to the substrate. The electric device further includes a perforated conductive material placed on the substrate. The electric device further includes a molding ...
Electronic component package
Samsung Electro-mechanics Co., Ltd.
June 22, 2017 - N°20170178992

An electronic component package includes a wiring part including an insulating layer, a conductive pattern formed on the insulating layer, and a conductive via connected to the conductive pattern through the insulating layer, an electronic component disposed on the wiring part, a frame disposed on the wiring part and having a component disposition region defined by an inner wall of ...
Gas diffuser having grooved hollow cathodes
Applied Materials, Inc.
June 22, 2017 - N°20170178867

In one embodiment, a diffuser for a deposition chamber includes a plate having edge regions and a center region, and plurality of gas passages comprising an upstream bore and an orifice hole fluidly coupled to the upstream bore that are formed between an upstream side and a downstream side of the plate, and a plurality of grooves surrounding the gas ...
Gas insulated circuit breaker
Hyundai Heavy Industries Co., Ltd.
June 22, 2017 - N°20170178845

Disclosed is a gas insulated circuit breaker having enhanced insulation properties. A gas insulated circuit breaker comprises: a fixed cylinder unit of which a movable contact point has an internal space; a movable piston unit which is slidably inserted into the inner space of the fixed cylinder unit; a fixing unit provided in a rear of the fixed cylinder unit ...
Touch-action electric switch with pre-load stroke
C&k Components S.a.s.
June 22, 2017 - N°20170178836

An electric switch includes a base which receives a plurality of fixed electrical contacts and a movable electrical contact. The switch also includes an actuating body made of elastic material. The switch also includes a central, top, pushbutton. The body includes a lateral part, surrounding a top force-receiving portion. The pushbutton includes a lateral actuating surface for acting on this ...
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