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Rounding

Rounding-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Shield cap and method for manufacturing the same
Ibiden Co., Ltd
April 19, 2018 - N°20180110164

A shield cap for protecting an electronic component includes a cap member having a ceiling portion, a side wall portion and a partition wall portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The cap member is formed such that the ceiling portion has an inner region and ...
Electronic device including flexible housing
Samsung Electronics Co., Ltd.
April 19, 2018 - N°20180109871

An electronic device includes a foldable housing including a first surface, a second surface, and a side surface surrounding a portion of a space between the first surface and the second surface, and a speaker disposed inside the housing. The housing further includes a hinge unit, a first speaker hole formed in a partial area of the side surface, which ...
Stator slot configurations for electric machines
Ford Global Technologies, Llc
April 19, 2018 - N°20180109155

An electric machine may include a rotor. The electric machine may include a stator surrounding the rotor having teeth defining slots having at least two cross-sectional areas housing windings having uniform cross-sectional areas that fill each of the cross-sectional areas of the slots to substantially similar proportions relative to other slots such that slots housing windings having different phases have ...
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Apparatus for preventing electric shock in event of flooding and method therefor
April 19, 2018 - N°20180109104

The present technology relates to an apparatus for preventing electric shock in the event of flooding and a method therefor. To this end, the apparatus for preventing electric shock in the event of flooding may comprise: a transformer for supplying a voltage using a neutral grounding method in a single-phase two-wire low-voltage power distribution system; an earth leakage circuit breaker ...
Cable gland and method and apparatus for earthing a cable
Cape Industries, Llc
April 19, 2018 - N°20180109093

A cable gland and method for earthing, bonding, and electromagnetic capability with armored, metal-clad, and metallic-sheathed cable types. The cable gland includes an adjustable earthing coil arranged internally in a gland body of the cable gland that secures around a cable inserted in the cable gland. When fully coiled, the adjustable earthing coil is relaxed and as the adjustable earthing ...
Tandem pumped fiber amplifier
Nlight, Inc.
April 19, 2018 - N°20180109064

In an example, a tandem pumped fiber amplifier may include a seed laser, one or more diode pumps, and a plural core fiber including a first core and a second core, the second core surrounding the first core. The plural core fiber may include a first section to operate as an oscillator and a second different section to operate as ...
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Rounding Patent Applications
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  • 3287+ full patent PDF documents of Rounding-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
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Wafer connector with grounding clamp
Molex, Llc
April 19, 2018 - N°20180109037

A wafer connector is disclosed in which a plurality of twin-axial wires are terminated to the tails of ground and signal terminals of the connector. Each twin-axial wire includes a pair of signal wires enclosed in a conductive sheath. A conductive grounding clamp is provided that contacts the sheaths of the twin-axial wires and holds them together as a unit ...
Ground connection for an aluminium component
Bayerische Motoren Werke Aktiengesellschaft
April 19, 2018 - N°20180109008

A ground connection for an aluminium component, in particular an aluminium vehicle body component, has grounding bolt which is fastened to the component, with the interposition of an adapter that extends over the surface, and which is composed of a material which exhibits greater strength than the aluminium component and differs from the aluminium component in terms of the electrochemical ...
Loop antenna for mobile device
Hctm Co., Ltd.
April 19, 2018 - N°20180108994

A loop antenna for a mobile device is disclosed. The loop antenna includes a permanent magnet structure, for accommodating a permanent magnet inside the mobile device, a housing for accommodating the permanent magnet structure, and an antenna pattern unit mounted in the housing, surrounding an outer periphery of the permanent magnet.
Vertical power component
Stmicroelectronics (tours) Sas
April 19, 2018 - N°20180108766

A vertical power component includes a doped silicon substrate of a first conductivity type. A local well of a second conductivity type extends from an upper surface of the substrate. A passivation structure coats a peripheral region of the upper surface side of the substrate surrounding the well. This passivation structure includes, on top of and in contact with the ...
Notched fin structures and methods of manufacture
Globalfoundries Inc.
April 19, 2018 - N°20180108732

The present disclosure relates to semiconductor structures and, more particularly, to notched fin structures and methods of manufacture. The structure includes: a fin structure composed of a substrate material and a stack of multiple epitaxially grown materials on the substrate material; a notch formed in a first epitaxially grown material of the stack of multiple epitaxially grown materials of the ...
Array substrate and display device
Boe Technology Group Co., Ltd.
April 19, 2018 - N°20180108649

An array substrate and a display device are provided. The array substrate includes a display region and a peripheral region surrounding the display region. Gate lines and data lines crossing the gate lines are arranged at the display region. A static charge shielding unit is arranged at the peripheral region. The array substrate further includes a static charge releasing line ...
Method of manufacturing semiconductor package
Samsung Electronics Co., Ltd.
April 19, 2018 - N°20180108639

A method of manufacturing a semiconductor package includes providing a substrate including a mounting region having a recess space for accommodating a semiconductor chip and a connection region surrounding the mounting region, providing a semiconductor chip in the mounting region, the semiconductor chip including a connection pad provided on a top surface of the semiconductor chip, forming a protective layer ...
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Rounding Patent Applications
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  • 3287+ full patent PDF documents of Rounding-related inventions.
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Package structure and its fabrication method
Phoenix Pioneer Technology Co., Ltd.
April 19, 2018 - N°20180108615

This disclosure provides a package structure and its fabrication method. The package structure includes: a conductive pattern layer having a bump region and a wiring region, the bump region comprising a plurality of conductive bumps and a first dielectric material surrounding the plurality of conductive bumps, the wiring region comprising a plurality of first conductive wires and a second dielectric ...
Structure and formation method of chip package with fan-out structure
Taiwan Semiconductor Manufacturing Co., Ltd.
April 19, 2018 - N°20180108614

Structures and formation methods of a chip package are provided. The chip package includes a semiconductor die having a conductive feature and a protection layer surrounding the semiconductor die. The chip package also includes a dielectric layer arranged over the semiconductor die and the protection layer and partially covering the conductive feature. The conductive feature is arranged accessibly from the ...
Chip packaging structure and packaging method
China Wafer Level Csp Co., Ltd.
April 19, 2018 - N°20180108585

A chip package and packaging method are provided. The package includes: a substrate; a sensing chip coupled with the substrate, where the sensing chip has a first surface and a second surface opposite to the first surface and facing the substrate, where the sensing chip includes a sensing area arranged on the first surface and a peripheral area surrounding the ...
Ic unit and methond of manufacturing the same, and electronic device including the same
Institute Of Microelectronics, Chinese Academy Of Sciences
April 19, 2018 - N°20180108577

There are provided an integrated circuit (ic) unit, a method of manufacturing the same, and an electronic device including the ic unit. According to an embodiment, the ic unit includes a first source/drain layer, a channel layer and a second source/drain layer for a first device and a first source/drain layer, a channel layer and a second ...
Semiconductor device and manufacturing method therefor
Imec International
April 19, 2018 - N°20180108572

The present disclosure relates to the technical field of semiconductor processes, and discloses a semiconductor device and a manufacturing method therefor. The semiconductor device includes a substrate; two fins located on the substrate and extending along a first direction; an isolation material layer surrounding the fins, comprising a first isolation regions located at an end region between the two fins ...
Semiconductor apparatus and manufacturing method
Semiconductor Manufacturing International (shanghai) Corporation
April 19, 2018 - N°20180108569

A semiconductor apparatus and its manufacturing method are presented. The method entails providing a substrate structure comprising a substrate, one or more fins positioned along a first direction on the substrate, and a separation region surrounding the fins. The separation region comprises a first separation region neighboring a first side of the fins and a second separation region neighboring a ...
Method and apparataus for obtaining spectrum coefficients for a replacement frame of an audio signal, ...
Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.
April 19, 2018 - N°20180108361

An approach is described that obtains spectrum coefficients for a replacement frame of an audio signal. A tonal component of a spectrum of an audio signal is detected based on a peak that exists in the spectra of frames preceding a replacement frame. For the tonal component of the spectrum a spectrum coefficients for the peak and its surrounding in ...
Method of warning a driver of blind angles and a device for implementing the method
Conti Temic Microelectronic Gmbh
April 19, 2018 - N°20180108258

A method and a device are disclosed for warning a driver of a first vehicle when the first vehicle is located in a blind spot of a second vehicle. The method includes recording the surrounding area in front of and alongside the first vehicle using a sensor, classifying objects in the recorded surrounding area, determining a relative position of an ...
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