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Resin

Resin-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Printed wiring board
Ibiden Co., Ltd.
February 15, 2018 - N°20180049327

A printed wiring board includes a central resin insulating layer, an electronic component embedded in the central insulating layer, a first resin insulating layer formed on first surface side of the central insulating layer, a second resin insulating layer formed on second surface side of the central insulating layer, via conductors formed in the central insulating layer such that the ...
Resin substrate, component-mounted resin substrate, and method of manufacturing component-mounted resin substrate
Murata Manufacturing Co., Ltd.
February 15, 2018 - N°20180049325

A resin substrate includes a base portion including one first resin sheet made of a thermoplastic resin as a main material or a stack of two or more first resin sheets each made of a thermoplastic resin as a main material, the base portion including a main surface, and first and second connecting conductors provided on the main surface of ...
Light-emitting module
Toshiba Hokuto Electronics Corporation
February 15, 2018 - N°20180049318

A light-emitting module according to an embodiment includes a first insulating film with light transmissive property, a plurality of mesh patterns including a plurality of first line patterns and a plurality of second line patterns, a light-emitting element, and a resin layer. The first line patterns are formed on the first insulating film and are parallel to one another. The ...
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Resin Patent Applications
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  • 337+ full patent PDF documents of Resin-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Apparatus and method for injecting resin into laminated iron core
Mitsui High-tec, Inc.
February 15, 2018 - N°20180048220

An apparatus includes a mold unit and a receive unit which clamp a laminated iron core body from both sides in a lamination direction, the laminated iron core body including a plurality of laminated iron core pieces and a resin hole pierced in the lamination direction, a plunger which extrudes a resin of an inside of a resin pool part ...
Insulation wire, rotary electric machine, and manufacturing method of insulation wire
Hitachi Metals, Ltd.
February 15, 2018 - N°20180048205

An insulation wire 10 according to the invention includes: a conductor 11 of any shape; an insulation film 12 made of a first thermoplastic resin that is formed around the conductor 11; and a self-bonding layer 13 made of a second thermoplastic resin that is formed around the insulation film 12 and has a self-bonding property, wherein the first thermoplastic resin contains at least one of ...
Battery protecting apparatus
Mitsumi Electric Co., Ltd.
February 15, 2018 - N°20180048167

A battery protecting apparatus includes: a charging/discharging control chip including a charging control fet and a discharging control fet connected to a secondary battery; a protecting chip configured to control, based on a voltage between both ends of the secondary battery, the fets to prevent overcharging, over discharging, and an overcurrent; and a lead frame having a connection surface ...
Resin Patent Pack
Download 337+ patent application PDFs
Resin Patent Applications
Download 337+ Resin-related PDFs
For professional research & prior art discovery
inventor
  • 337+ full patent PDF documents of Resin-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Hydrogen storage container
Honda Motor Co., Ltd.
February 15, 2018 - N°20180048001

A hydrogen storage container has an inner side resin layer that comes into contact with hydrogen gas that is introduced into the container, a barrier layer which is disposed on the outside of the inner side resin layer and which prevents permeation of hydrogen gas, and an outer side resin layer comprising a resin. Among these layers, the inner side ...
Fuel cell stack
Taiho Kogyo Co., Ltd.
February 15, 2018 - N°20180047995

A fuel cell stack 100 includes a fuel cell stack 10, and an end plate 30 placed at an end of the fuel cell stack 10. The end plate 30 includes a metallic plate-like body 32, and a resin layer 60 formed on a surface 32b of the plate-like body 32. The plate-like body 32 includes flow holes 39 for a reactant gas and a cooling medium, and a stripe-shaped ...
Separator for a non-aqueous secondary battery, and non-aqueous secondary battery
Teijin Limited
February 15, 2018 - N°20180047962

A separator for a non-aqueous secondary battery, the separator including: a porous substrate; and an adhesive porous layer provided on one or both sides of the porous substrate and including a polyvinylidene fluoride-based resin, the adhesive porous layer would exhibit a ratio of an area intensity of a β-phase-crystal-derived peak of the polyvinylidene fluoride-based resin to a sum ...
Electric storage cell, covering film and electric storage module
Taiyo Yuden Co., Ltd.
February 15, 2018 - N°20180047960

An electric storage cell has an electric storage element and a covering film package. The covering film package houses the electric storage element and includes: a metal layer having a first principle face on the electric storage element side and a second principle face on the opposite side of the first principle face, an internal resin layer made of synthetic ...
Method of fabricating light emitting device package
Samsung Electronics Co., Ltd.
February 15, 2018 - N°20180047880

A method of fabricating a light emitting device package includes forming a plurality of semiconductor light emitting parts, each having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer on a growth substrate, forming a partition structure having a plurality of light emitting windows on the growth substrate, filling each of the plurality of light ...
Method for manufacturing semiconductor device and manufacturing apparatus of semiconductor device
Semiconductor Energy Laboratory Co., Ltd.
February 15, 2018 - N°20180047850

A semiconductor device including an oxide semiconductor and an organic resin film is manufactured in the following manner. Heat treatment is performed on a first substrate provided with an organic resin film over a transistor including an oxide semiconductor in a reduced pressure atmosphere; handling of the first substrate is performed in an atmosphere containing moisture as little as possible ...
Semiconductor device
Rohm Co., Ltd.
February 15, 2018 - N°20180047698

An inventive semiconductor device includes: a semiconductor chip including an integrated circuit; a plurality of electrode pads provided on the semiconductor chip and connected to the integrated circuit; a rewiring to which the electrode pads are electrically connected together, the rewiring being exposed on an outermost surface of the semiconductor chip and having an exposed surface area greater than the ...
Resin Patent Pack
Download 337+ patent application PDFs
Resin Patent Applications
Download 337+ Resin-related PDFs
For professional research & prior art discovery
inventor
  • 337+ full patent PDF documents of Resin-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Method of manufacturing a semiconductor device
Renesas Electronics Corporation
February 15, 2018 - N°20180047677

A non-leaded semiconductor device comprises a sealing body for sealing a semiconductor chip, a tab in the interior of the sealing body, suspension leads for supporting the tab, leads having respective surfaces exposed to outer edge portions of a back surface of the sealing body, and wires connecting pads formed on the semiconductor chip and the leads. End portions of ...
Wiring board
Shinko Electric Industries Co., Ltd.
February 15, 2018 - N°20180047661

A wiring board includes an insulating layer including a first insulating film provided with a first surface and a second surface that is opposite to the first surface, and composed of only resin, and a second insulating film provided with a first surface and a second surface that is opposite to the first surface, including a reinforcing member and resin, ...
Support terminal integral with die pad in semiconductor package (as amended)
Rohm Co., Ltd.
February 15, 2018 - N°20180047659

A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. ...
Manufacturing method of semiconductor device
Semiconductor Energy Laboratory Co., Ltd.
February 15, 2018 - N°20180047609

The yield of a manufacturing process of a display device is increased. The productivity of a display device is increased. A hydrogen-containing layer is formed over a substrate. Then, an oxygen-containing layer is formed over the hydrogen-containing layer. After that, a first layer is formed over the oxygen-containing layer with the use of a material containing a resin or a ...
Electronic device and method of manufacturing electronic device
Sony Semiconductor Solutions Corporation
February 15, 2018 - N°20180047608

A method of manufacturing an electronic device includes: in transferring one or a plurality of element sections onto a first substrate from a second substrate, forming part or all of the one or the plurality of element sections on the second substrate with a resin layer in between; peeling off the one or the plurality of element sections that are ...
Electrostatic chuck heater
Ngk Insulators, Ltd.
February 15, 2018 - N°20180047606

An electrostatic chuck heater is such that a sheet heater formed by embedding a heater wire in a resin sheet is disposed between an electrostatic chuck and a support pedestal. The heater wires are provided one for each of many zones of the resin sheet, and are composed of copper wires routed unicursally from their first ends to their second ...
Reactor
Sumitomo Electric Industries, Ltd.
February 15, 2018 - N°20180047502

Provided is a reactor in which an accessory member that is attached to the reactor is integrated with an assembly. The reactor includes an assembly of a coil having a winding portion and a magnetic core and an accessory member that is attached to the assembly. In this reactor, an outer core portion of the magnetic core is made of ...
Inductance element resin case and inductance element
Ntn Corporation
February 15, 2018 - N°20180047492

The present invention facilitates positioning of contact surfaces of a resin case, core gap management, and assembling processing. A resin case 1 can house at least one magnetic core selected from a u-shaped magnetic core, a uu-shaped magnetic core, a ur-shaped magnetic core, and an i-shaped magnetic core. The resin case 1 is used for an inductance element in which a coil ...
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