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Resin-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Shield cap and method for manufacturing the same
Ibiden Co., Ltd.
April 19, 2018 - N°20180110163

A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The ceiling portion includes a resin material and a reinforcing material, and the cap member is formed such that ...
Method for manufacturing endoscope image pickup module, endoscope image pickup module and endoscope
Olympus Corporation
April 19, 2018 - N°20180109707

A method for manufacturing an endoscope image pickup module includes a process of creating a transparent plate with support plates in which the support plates are disposed on side faces of cover glass, a first resin disposing process of disposing uncured first resin in a light receiving section of an image pickup device, a process of fixing a jig to ...
Vibrator, ultrasonic motor, and optical device
Canon Kabushiki Kaisha
April 19, 2018 - N°20180109204

A vibrator includes a piezoelectric element including a piezoelectric ceramic having an electrode, a vibration plate, and an adhesive layer between the piezoelectric element and the vibration plate, wherein the adhesive layer is obtained by a resin containing 50 parts by mass or more and 80 parts by mass or less of organic particles having a number average particle size of 5 ...
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Resin Patent Applications
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  • 337+ full patent PDF documents of Resin-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Fixing structure of voltage detection terminal
Yazaki Corporation
April 19, 2018 - N°20180108953

A fixing structure of voltage detection terminal includes a voltage detection terminal and a resin case having insulation property. The voltage detection terminal includes a flat plate portion, a busbar connection portion that bends from an upper end of the flat plate portion in an extending direction perpendicular to an up-down direction, and a crimping portion connected to an end ...
Packaging material for power storage device and power storage device using the packaging material
Toppan Printing Co., Ltd.
April 19, 2018 - N°20180108880

The present invention relates to a packaging material for a power storage device including at least a substrate layer, an adhesive layer, a metal foil layer, an anti-corrosion treatment layer, an adhesive resin layer and a thermal bonding resin layer laminated in this order, wherein a thickness of the adhesive layer is in a range of 0. 3 to 3 μm, ...
Organic electroluminescence device and manufacturing method thereof
Pioneer Corporation
April 19, 2018 - N°20180108877

In an organic electroluminescence device (100), a hole transport layer (22) is formed of a cured resin obtained by a ring opening polymerization of a polymerizable compound (a) containing a ring opening polymerizable group in the presence of a polymerization initiator (b). In addition, both of a maximum peak height rp and a maximum valley depth rv in an upper surface of ...
Resin Patent Pack
Download 337+ patent application PDFs
Resin Patent Applications
Download 337+ Resin-related PDFs
For professional research & prior art discovery
inventor
  • 337+ full patent PDF documents of Resin-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Method for producing optical semiconductor device and optical semiconductor device
Rohm Co., Ltd.
April 19, 2018 - N°20180108820

A method is provided for making optical semiconductor devices collectively. Led chips are arranged on a material substrate, and the substrate is sandwiched by a common mold and a first cooperating mold formed with a cavity. A light-transmitting resin is injected into the cavity and solidified to form a light-transmitting resin member including body portions for sealing the led chips ...
Light-emitting module and lighting fixture
Panasonic Intellectual Property Management Co., Ltd.
April 19, 2018 - N°20180108818

A light-emitting module is provided. The light-emitting module includes a substrate, a light-emitting element mounted on the substrate, and a sealant that seals the light-emitting element. The sealant includes a resin material containing a wavelength converter. A cross section of the sealant taken through the light-emitting element satisfies hmax/w≤0. 3, where w is a width of a base of ...
Method for manufacturing light emitting device
Nichia Corporation
April 19, 2018 - N°20180108813

A method for manufacturing a light emitting device includes: integrally molding a package and a lead, the package arranged to form at least part of an inner peripheral face of a recess portion in which the light emitting element is housed, the package including a base material and a plurality of particles, the base material including a resin, a coefficient ...
Module and method for manufacturing same
Murata Manufacturing Co., Ltd
April 19, 2018 - N°20180108618

A module includes a wiring board, a plurality of components mounted on an upper surface of the wiring board, a sealing resin layer which seals the components provided on the upper surface of the wiring board, and a shield layer provided so as to cover a surface of the sealing resin layer. The shield layer includes an adhesion layer which ...
Electronic circuit package using composite magnetic sealing material
April 19, 2018 - N°20180108617

Or more and 39 wt. % or less of a metal material contained mainly of ni, thereby a thermal expansion coefficient of the magnetic mold resin is 15 ppm/° c. Or less.
Semiconductor device and manufacturing method thereof
Shindengen Electric Manufacturing Co., Ltd.
April 19, 2018 - N°20180108600

A semiconductor device of the present invention includes: a plurality of wiring boards disposed separately from one another; a plurality of semiconductor elements disposed on first main surfaces of the wiring boards and electrically connected to the wiring boards; a plurality of terminals electrically connected to the wiring boards; a sealing resin sealing the wiring boards and the semiconductor elements ...
Dual module for dual chip card
Oberthur Technologies
April 19, 2018 - N°20180108595

A dual module for a dual chip card includes a supporting film supporting on an outer surface, a plurality of connecting pads including two series of connecting pads extending in a given direction and, on an inner surface, two inner connection areas for connection to an antenna of the dual card and a chip, the chip including contact terminals connected ...
Resin Patent Pack
Download 337+ patent application PDFs
Resin Patent Applications
Download 337+ Resin-related PDFs
For professional research & prior art discovery
inventor
  • 337+ full patent PDF documents of Resin-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Semiconductor device and method for manufacturing the same
Rohm Co., Ltd.
April 19, 2018 - N°20180108582

A semiconductor device includes a substrate with a recess subsiding from a selected surface of the substrate to accommodate a semiconductor element. Connected to the semiconductor element, an electroconductive portion extends from the recess onto the selected surface. A post, formed at the selected surface, has a first surface in contact with the electroconductive portion, a second surface, and a ...
Method for manufacturing niobate-system ferroelectric thin-film device
Sumitomo Chemical Company, Limited
April 19, 2018 - N°20180108530

This method for manufacturing a niobate-system ferroelectric thin-film device includes: a lower electrode film formation step of forming a lower electrode film on a substrate; a ferroelectric thin film formation step of forming a niobate-system ferroelectric thin film on the lower electrode film; an etch mask pattern formation step of forming an etch mask in a desired pattern on the ...
Method of manufacturing coil component
Murata Manufacturing Co., Ltd.
April 19, 2018 - N°20180108475

A method of manufacturing a coil component includes the steps of disposing a dummy metal layer on a base; laminating a base insulating resin on the dummy metal layer; exposing the dummy metal layer by disposing an opening part in the base insulating resin; disposing a spiral wiring on the base insulating resin and disposing a sacrificial conductor on the ...
Parallel pair cable
Sumitomo Electric Industries, Ltd.
April 19, 2018 - N°20180108455

A parallel pair cable includes a pair of metal wires aligned in parallel at a predetermined interval, an insulating resin configured to integrally cover the pair of metal wires and having a cross-sectional shape of an ellipse, and a shield layer provided on an outer periphery of the insulating resin. The shield layer is a layer formed by plating or ...
Image forming apparatus and developing device
Oki Data Corporation
April 19, 2018 - N°20180107133

An image forming apparatus includes a developer, an image bearing body, a charging member that charges a surface of the image bearing body, an exposure device that emits light to expose the surface of the image bearing body to form a latent image, a developer bearing body that bears the developer and develops the latent image to form a developer ...
Toner and method for producing toner
Canon Kabushiki Kaisha
April 19, 2018 - N°20180107128

A toner comprising a toner particle including a resin component, wherein the resin component includes an olefin resin and an olefin copolymer including a hydroxyl group, the olefin resin has a specific monomer unit y1, the olefin copolymer including a hydroxyl group has a specific monomer unit z1 and z2, a hydroxyl value of the olefin resin is not more ...
Method for producing negatively chargeable toner, and negatively chargeable toner
Zeon Corporation
April 19, 2018 - N°20180107127

To provide an efficient method for producing a negatively chargeable toner in which a carbon black (as a colorant) is well dispersed and which has high chargeability, has excellent transfer efficiency, prevent a white spot and provides an image with sufficient image density. Disclosed is a method for producing a negatively chargeable toner, the method including: a suspension step of ...
Pattern forming method, method for manufacturing electronic device, and actinic ray-sensitive or radiation-sensitive resin composition
Fujifilm Corporation
April 19, 2018 - N°20180107118

A pattern forming method includes at least (i) forming a film on a substrate, using an actinic ray-sensitive or radiation-sensitive resin composition, (ii) irradiating the film with actinic rays or radiation, and (iii) developing the film irradiated with actinic rays or radiation, using a developer containing an organic solvent, in which the actinic ray-sensitive or radiation-sensitive resin composition contains a ...
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