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Resin-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Electronic circuit module and manufacturing method of the same
Tdk Corporation
October 12, 2017 - N°20170295643

Disclosed herein is an electronic circuit module that includes a substrate having a power supply pattern, an electronic component mounted on a front surface of the substrate, a molding resin that covers the front surface of the substrate so as to embed the electronic component therein, a metal shield covering the molding resin, and a through conductor formed so as ...
Substrate unit and method of manufacturing substrate unit
Tdk Corporation
October 12, 2017 - N°20170295641

A substrate unit includes a wiring substrate, electronic components as safety maintaining devices arranged on the wiring substrate, plural metal components arranged on the wiring substrate at distances from the electronic components as the safety maintaining devices so as to satisfy a requirement for an intrinsically safe explosion-proof construction, and a resin film covering at least one of the plural ...
Rotating electrical machine
Hitachi Automotive Systems, Ltd.
October 12, 2017 - N°20170294820

Provided is a rotating electrical machine including a housing in which a flow passage of cooling liquid can be easily formed and airtightness and productivity are high. A rotating electrical machine is configured to include a housing which is provided with a part of a flow passage of cooling liquid, a stator which is disposed on an inner circumferential side ...
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Resin Patent Applications
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  • 337+ full patent PDF documents of Resin-related inventions.
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Battery pack manufacturing method using hot-melt fixing structure and battery pack manufactured using the same
Lg Chem, Ltd.
October 12, 2017 - N°20170294664

Disclosed herein is a method of manufacturing a battery pack including a battery cell having an electrode assembly received in a battery case, made of a laminate sheet including a resin layer and a metal layer, together with an electrolytic solution.
Separator for electrochemical device and electrochemical device including the separator
Mitsubishi Paper Mills Limited
October 12, 2017 - N°20170294637

A separator for an electrochemical device which includes a nonwoven fabric base material and an inorganic particle layer is provided. The nonwoven fabric base material includes a synthetic resin fiber with an average fiber diameter of 1 to 20 μm. The inorganic particle layer includes an inorganic particle layer a that contains magnesium hydroxide with an average particle size of 2. 0 ...
Organic el display panel, organic el display device, and method of manufacturing organic el display ...
Joled Inc.
October 12, 2017 - N°20170294610

In an organic electroluminescence (el) display panel including: a substrate that is flexible and is made of a resin material; a plurality of light-emitting elements that are disposed on the substrate and are spaced away from one another; and a plurality of wire units that are disposed on the substrate and establish electrical connection between the plurality of light-emitting elements, ...
Resin Patent Pack
Download 337+ patent application PDFs
Resin Patent Applications
Download 337+ Resin-related PDFs
For professional research & prior art discovery
inventor
  • 337+ full patent PDF documents of Resin-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Insulation paste, method for manufacturing solar cell element and solar cell element
Kyocera Corporation
October 12, 2017 - N°20170294548

An insulating paste includes a siloxane resin and an organic solvent. The siloxane resin includes a phenyl group and an alkyl group expressed by a general formula cnh2n+1, in which n is a natural number. The number of alkyl groups is greater than the number of phenyl groups in the siloxane resin.
Peeling method and manufacturing method of flexible device
Semiconductor Energy Laboratory Co., Ltd.
October 12, 2017 - N°20170294463

A peeling method at low cost with high mass productivity is provided. An oxide layer is formed over a formation substrate, a first layer is formed over the oxide layer using a photosensitive material, an opening is formed in a portion of the first layer that overlaps with the oxide layer by a photolithography method and the first layer is ...
Peeling method and manufacturing method of flexible device
Semiconductor Energy Laboratory Co., Ltd.
October 12, 2017 - N°20170294462

A peeling method at low cost with high mass productivity is provided. A resin layer having a thickness greater than or equal to 0. 1 μm and less than or equal to 3 μm is formed over a formation substrate using a photosensitive and thermosetting material, a transistor including an oxide semiconductor in a channel formation region is formed ...
Semiconductor device that includes a molecular bonding layer for bonding elements
Kabushiki Kaisha Toshiba
October 12, 2017 - N°20170294408

A semiconductor device includes a semiconductor chip covered with a resin layer, the semiconductor chip including an electrode pad at a surface of the semiconductor chop, a first insulating layer covering the surface of the semiconductor chip and having a via hole at a region corresponding to the electrode pad, a conductive layer extending along a surface of the electrode ...
Sinterable bonding material and semiconductor device using the same
Henkel Ip & Holding Gmbh
October 12, 2017 - N°20170294404

An objective of the present invention is to provide a sinterable bonding material capable of providing a bonded article having a long-term reliability. The present invention relates to a sinterable bonding material comprising a silver filler and resin particles, wherein the silver filler comprises a flake-shaped filler having an arithmetic average roughness (ra) of 10 nm or less; and the resin ...
Semiconductor device that includes a molecular bonding layer for bonding of elements
Kabushiki Kaisha Toshiba
October 12, 2017 - N°20170294398

A semiconductor device includes a semiconductor chip covered with a resin layer, the semiconductor chip including an electrode pad at a surface of the semiconductor chip, a first insulating layer covering the surface of the semiconductor chip and having a via hole at a region corresponding to the electrode pad, a conductive layer extending along a surface of the electrode ...
Semiconductor device that includes a molecular bonding layer for bonding elements
Kabushiki Kaisha Toshiba
October 12, 2017 - N°20170294395

A semiconductor device includes a base, a semiconductor chip on the base, a conductive bonding layer between a surface of the base and a surface of the semiconductor chip, the conductive bonding layer including a resin and a plurality of conductive particles contained in the resin, and a molecular bonding layer between the surface of the semiconductor chip and a ...
Resin Patent Pack
Download 337+ patent application PDFs
Resin Patent Applications
Download 337+ Resin-related PDFs
For professional research & prior art discovery
inventor
  • 337+ full patent PDF documents of Resin-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Power semiconductor device and method for manufacturing the same
Mitsubishi Electric Corporation
October 12, 2017 - N°20170294369

A power semiconductor device includes a power semiconductor element, a controlling element, a first lead frame and a second lead frame, respectively, a first metal wire electrically connecting the power semiconductor element and the first lead frame, and a sealing body covering these components. The first lead frame includes a first inner lead having a connecting surface to which one ...
Semiconductor device
Rohm Co., Ltd.
October 12, 2017 - N°20170294368

A semiconductor part includes a resin package and an exposed portion exposed from a bottom surface of the resin package. The exposed portion has a first diagonal line perpendicular to both first and third sides of the package as viewed from the bottom surface. The exposed portion also has a second diagonal line perpendicular to both the second fourth side ...
Semiconductor device
Sumitomo Electric Industries, Ltd.
October 12, 2017 - N°20170294365

A semiconductor device includes: a semiconductor element disposed on a semiconductor substrate; a first insulating film disposed on the semiconductor substrate, the first insulating film having an upper surface and an edge; a resin layer disposed on the semiconductor substrate, the resin layer covering the semiconductor element; and a second insulating film disposed on the semiconductor substrate, the second insulating ...
Packaged wafer manufacturing method and device chip manufacturing method
Disco Corporation
October 12, 2017 - N°20170294364

Disclosed herein is a packaged wafer manufacturing method including the steps of forming a groove along each division line on the front side of a wafer, each groove having a depth greater than the finished thickness of the wafer, next removing a chamfered portion from the outer circumference of the wafer to thereby form a step portion having a depth ...
Method of manufacturing packaged wafer
Disco Corporation
October 12, 2017 - N°20170294353

Disclosed herein is a method of manufacturing a packaged wafer including a step of forming grooves in a face side of a wafer along projected dicing lines to a depth than a finished thickness of the wafer, a step of forming a ring-shaped groove in and along a boundary between a device area and an outer peripheral excess area of ...
Multilayer ceramic capacitor
Murata Manufacturing Co., Ltd.
October 12, 2017 - N°20170294268

In a multilayer ceramic capacitor, outer electrodes include base electrode layers including a conductive metal and a glass component on a ceramic multilayer body, conductive resin layers including a thermosetting resin and a metal component on the base electrode layers such that exposed portions of the base electrode layers are exposed at least at one corner on one end surface ...
Method of manufacturing amorphous alloy magnetic core
Hitachi Metals, Ltd.
October 12, 2017 - N°20170294267

A method of manufacturing an amorphous alloy magnetic core, which includes preparing a layered body by layering amorphous alloy thin strips one on another, and has one end face and another end face in a width direction of the thin strips and an inner peripheral surface and an outer peripheral surface orthogonal to a layering direction of the thin strips; ...
Electronic device and method of manufacturing the same
Samsung Display Co., Ltd.
October 12, 2017 - N°20170293381

A method of manufacturing an electronic device including forming a first conductive pattern layer on a base layer, forming an organic layer on which a plurality of contact holes exposing a portion of the first conductive pattern layer on the base layer are defined, forming a resin pattern layer covering the contact holes on the organic layer, forming an insulating ...
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