Popular terms

Resin topics
Carbon Dioxide
Homogeneous
Back Sheet
Impregnated
Nanoparticle
Carbonate Ion
Carbonic Anhydrase
Deionization
Bicarbonate
Organosiloxane
Surface Treatment
Fluoropolymer
Encapsulation
Display Panel
Semiconductor Device

Follow us on Twitter
twitter icon@FreshPatents

Web & Computing
Cloud Computing
Ecommerce
Search patents
Smartphone patents
Social Media patents
Video patents
Website patents
Web Server
Android patents
Copyright patents
Database patents
Programming patents
Wearable Computing
Webcam patents

Web Companies
Apple patents
Google patents
Adobe patents
Ebay patents
Oracle patents
Yahoo patents

[SEARCH]

Resin patents



      

This page is updated frequently with new Resin-related patent applications.




Date/App# patent app List of recent Resin-related patents
02/04/16
20160037690 
 Electromagnetic shield body and box patent thumbnailElectromagnetic shield body and box
An electromagnetic shield body includes a metal plate and insulating resin combined with each other by insert molding. The metal plate is provided with a projection portion projecting into the insulating resin from the metal plate.
Toyota Jidosha Kabushiki Kaisha


02/04/16
20160037651 
 Process for producing three-dimensional conductive pattern structure, and material for three-dimensional molding for use therein patent thumbnailProcess for producing three-dimensional conductive pattern structure, and material for three-dimensional molding for use therein
[problem] to provide: a material which is for three-dimensional molding and on which a conductive pattern that exhibits excellent adhesiveness even after the three-dimensional molding can be formed; and a process for producing a three-dimensional conductive pattern structure, said process using this material for three-dimensional molding and necessitating no special apparatus. [solution] this three-dimensional conductive pattern structure is produced by: using a material which is for three-dimensional molding and which has, in at least a part thereof, a surface made of a polyimide resin; conducting, in a surface portion (1) made of a polyimide resin, the formation of a modified pattern and then the adsorption and reduction of metal ions to form a material which is provided with a pattern (2) having a plating-catalyzing activity; and subjecting the material which is provided with the pattern (2) to three-dimensional molding and electroless plating successively..
Seiren Co., Ltd.


02/04/16
20160037632 
 Laminate, conductive pattern, and  producing laminate patent thumbnailLaminate, conductive pattern, and producing laminate
Provided is a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment..
Dic Corporation


02/04/16
20160037622 
 Multilayer resin substrate, and  manufacturing multilayer resin substrate patent thumbnailMultilayer resin substrate, and manufacturing multilayer resin substrate
A multilayer resin substrate includes resin substrates laminated together, an overlapping portion in which a signal line as a conductor pattern and another conductor pattern overlap each other in a laminating direction of the resin substrates, and a non-overlapping portion in which the signal line and the other conductor pattern do no overlap each other in the laminating direction. A thin portion is provided at a position in the non-overlapping portion near the overlapping portion.
Murata Manufacturing Co., Ltd.


02/04/16
20160036947 
 Mobile device patent thumbnailMobile device
A mobile phone includes an antenna housing made of a resin, an insert metal plate made of a metal, which is buried in the antenna housing and has a connecting portion exposed from an outer surface of the antenna housing, and an antenna element provided on the outer surface of the antenna housing and brought into contact with the connecting portion. A boundary between a region where the antenna element is in contact with the connecting portion and a region where the antenna element is in contact with the antenna housing is nonlinear.
Sharp Kabushiki Kaisha


02/04/16
20160036416 
 Elastic wave device with integrated inductor patent thumbnailElastic wave device with integrated inductor
An elastic wave device includes an interdigital transducer (idt) electrode disposed on an upper surface of a piezoelectric substrate, a wiring electrode disposed on the upper surface of the piezoelectric substrate and connected to the idt electrode, and a first insulator layer disposed on the upper surface of the piezoelectric substrate. The first insulator layer seals the idt electrode and the wiring electrode and includes a first resin and a first filler.
Skyworks Panasonic Filter Solutions Japan Co., Ltd.


02/04/16
20160036282 
 Coil, rotating electrical machine equipped with same, and  manufacturing same patent thumbnailCoil, rotating electrical machine equipped with same, and manufacturing same
Provided are a coil having excellent insulation properties, a rotating electrical machine equipped with the same, and a method for manufacturing the same. The coil (60) has a covered portion where a conductive body (602) is covered with an insulating film (612) and a stripped portion where the insulating film is stripped off, and the stripped portion is electrophoretically coated with a resin material (601).
Hitachi Automative Systems, Ltd.


02/04/16
20160036187 
 Manufacturing  bus bar unit patent thumbnailManufacturing bus bar unit
A manufacturing method of a bus bar unit includes: a primary setting step of disposing a part of a plurality of bus bars into a first mold; a primary molding step of performing an insert molding by injecting the insulating resin material into the first mold, so as to form a primary molded member having a step part; a secondary setting step of disposing the primary molded member and a remaining bus bar of the plurality of bus bars into a second mold; and a secondary molding step of performing the insert molding by injecting the insulating resin material into the second mold, so as to form the bus bar unit. In the secondary setting step, the primary molded member and the remaining bus bar of the plurality of bus bars are arranged in the second mold in such a manner that at least one of an outer periphery and an inner periphery of the remaining bus bar abuts against the step part of the primary molded member..
Kayaba Industry Co., Ltd.


02/04/16
20160036158 
 Resin molded product and waterproof shielded connector patent thumbnailResin molded product and waterproof shielded connector
The invention is directed to a resin molded product including: a resin molded product body part; and a seal part, serving as a seal structure portion with a fixation target, which is integrated with the resin molded product body part, wherein a resin material for forming the resin molded product is a polyphenylene sulfide resin, and a waterproof shielded connector including: a connector housing which is the resin molded product; a terminal fitting which is provided in a terminal of an electrically conducting path; and a shield shell which is provided on an outer side of the connector housing and fixed so as to press the connector housing onto a fixation target.. .
Yazaki Corporation


02/04/16
20160036027 
 Separator for nonaqueous secondary battery, and nonaqueous secondary battery patent thumbnailSeparator for nonaqueous secondary battery, and nonaqueous secondary battery
An object of the invention is to provide a separator for a nonaqueous secondary battery, which has good adhesion to electrodes and is also capable of ensuring sufficient ion permeability even after attachment to electrodes. The separator for a nonaqueous secondary battery of the invention includes a porous substrate and an adhesive porous layer that is formed on at least one side of the porous substrate and contains a polyvinylidene-fluoride-based resin.
Teijin Limited


02/04/16
20160036013 

Electricity storage device, electricity storage device container, and electricity storage device packaging material


A an electricity storage device according to the present invention including an electricity storage device packaging material, in the electricity storage device packaging material, from an outer layer thereof, at least an outer layer side resin film layer, an outer layer side adhesive layer, a metal foil layer, an inner layer side adhesive layer, and a heat seal layer being stacked, in which the inner layer side adhesive layer is a layer for bonding the metal foil layer with the heat seal layer, and is a layer obtained by performing a curing process for an adhesive compound including: a polyolefin resin (a) including a carboxyl group or an acid anhydride group; and an epoxy compound (b) including at least two epoxy groups and including at least one of an aromatic amino group and a heterocycle including a nitrogen atom as a heteroatom.. .
Toyo Ink Sc Holdings Co., Ltd.


02/04/16
20160035951 

Optical semiconductor element mounting package, and optical semiconductor device using the same


An optical semiconductor element mounting package that has good adhesion between the resin molding and the lead electrodes and has excellent reliability is provided, as well as an optical semiconductor device using the package is also provided. The optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element mounting region, wherein the package is formed by integrating: a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part; and at least a pair of positive and negative lead electrodes disposed opposite each other so as to form part of the bottom face of the recessed part, and there is no gap at a joint face between the resin molding and the lead electrodes..
Hitachi Chemical Company, Ltd.


02/04/16
20160035948 

Electronic component and electronic unit


According to one embodiment, an electronic component includes a metal portion, a mold resin covering at least a part of the metal portion, and a molecular adhesion layer provided between a surface of the metal portion and the mold resin.. .
Kabushiki Kaisha Toshiba


02/04/16
20160035943 

Fluorescent composite resin substrate white light light emitting diode


A fluorescent composite resin substrate white light led includes a fluorescent composite resin substrate, two conductive brackets, a light emitting unit, two conductive lines and a package material. The fluorescent composite resin substrate is formed from a mixture through a curing reaction.

02/04/16
20160035926 

Solar cell panel


A solar cell panel is discussed, which includes a plurality of solar cells, each solar cell including a substrate having a first surface and a second surface opposite the first surface, and a plurality of first electrodes extending in a first direction; an interconnector that is positioned in a second direction crossing the plurality of first electrodes and electrically connects adjacent ones of the plurality of solar cells to one another; and a conductive adhesive film including a resin and a plurality of conductive particles dispersed in the resin, the conductive adhesive film being positioned between the plurality of first electrodes and the interconnector in the second direction crossing the plurality of first electrodes to electrically connect the plurality of first electrodes to the interconnector.. .
Lg Electronics Inc.


02/04/16
20160035910 

Electrically conductive inks


The present invention relates to compositions that are suitable for use as electrically conductive inks in the fabrication of electronic devices, such as c-si solar modules. The electrically conductive ink comprises a) one or more aromatic resins; b) electrically conductive silver particles having an average particle size of 1 μm to 40 μm, and a tap density of 1.5 g/cm3 to 6.5 g/cm3; and c) one or more organic solvents.
Ablestik (shanghai) Limited


02/04/16
20160035894 

Oxide thin film transistor, array substrate, methods of manufacturing the same and display device


An oxide thin film transistor, an array substrate, methods of manufacturing the same and a display device are disclosed. The oxide thin film transistor includes: a base substrate; and a gate electrode, a gate insulating layer, an oxide active layer, drain/source electrodes sequentially disposed on the base substrate.
Boe Technology Group Co., Ltd.


02/04/16
20160035828 

Compound semiconductor device, producing same, and resin-sealed type semiconductor device


In a semiconductor element having a compound semiconductor layer epitaxially grown on a silicon substrate, an object is to suppress generation of deficiency or problems of reliability deriving from the ends of the element that are generated when dividing into semiconductor devices by dicing. A compound semiconductor layer epitaxially grown on a silicon substrate is formed via a buffer layer made of aluminum nitride.
Panasonic Intellectual Property Management Co., Ltd.


02/04/16
20160035760 

Array substrate and manufacturing the same, and display device


The invention belongs to the field of display technology, and particularly provides an array substrate and a method for manufacturing the same, and a display device. The array substrate includes a base substrate, and a thin film transistor and driving electrodes provided on the base substrate, the thin film transistor includes a gate, a gate insulating layer, an active layer, a source and a drain, the driving electrodes include a slit-shaped electrode and a plate-shaped electrode which are located in different layers and at least partially overlap with each other in the orthographic projection direction, the source, the drain and the active layer are formed so that part of their bottom surfaces are located in the same plane, and a resin layer is further provided between the thin film transistor and the plate-shaped electrode..
Boe Technology Group Co., Ltd.


02/04/16
20160035688 

Semiconductor component, semiconductor-mounted product including the component, and producing the product


A semiconductor component includes a semiconductor package having a mountable face, a bump, and a coating part. The bump is made of first solder and is formed on the mountable face.
Panasonic Corporation


02/04/16
20160035672 

Semiconductor device and manufacturing the same


A coil cl1 is formed on a semiconductor substrate sb via a first insulation film, a second insulation film is formed so as to cover the first insulation film and the coil cl1, and a pad pd1 is formed on the second insulation film. A laminated film lf having an opening op1 from which the pad pd1 is partially exposed is formed on the second insulation film, and a coil cl2 is formed on the laminated insulation film.
Renesas Electronics Corporation


02/04/16
20160035661 

Support member, wiring substrate, manufacturing wiring substrate, and manufacturing semiconductor package


A wiring substrate includes a support member, and a wiring member formed on one side of the support member. The support member includes metal foils and at least one resin layer alternately layered, so that one of the metal foils is provided as a first outermost layer on the one side of the support member and another one of the metal foils is provided as a second outermost layer on another side of the support member.
Shinko Electric Industries Co., Ltd.


02/04/16
20160035640 

Underfill film, sealing sheet, manufacturing semiconductor device, and semiconductor device


The present invention provides an underfill film and a sealing sheet that are excellent in thermal conductive property and are capable of satisfactorily filling the space between the semiconductor element and the substrate. The present invention relates to an underfill film having a resin and a thermally conductive filler, in which a content of the thermally conductive filler is 50% by volume or more, an average particle size of the thermally conductive filler is 30% or less of a thickness of the underfill film, and a maximum particle size of the thermally conductive filler is 80% or less of the thickness of the underfill film..
Nitto Denko Corporation


02/04/16
20160035638 

Support base-attached encapsulant, encapsulated substrate having semiconductor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, semiconductor apparatus, and manufacturing semiconductor apparatus


Support base-attached encapsulant for collectively encapsulating a semiconductor device mounting surface of a substrate or semiconductor device forming surface of a wafer, containing a support base having one fibrous film or a plurality of the fibrous films being laminated, the fibrous film subjected to surface treatment with an organosilicon compound, and a resin layer of thermosetting resin formed on one surface of the support base. The support base-attached encapsulant inhibit the substrate or wafer from warping and semiconductor devices from peeling away from the substrate, and collectively encapsulate the semiconductor device mounting surface of the substrate or the semiconductor device forming surface of the wafer even when a large-diameter wafer or large-area substrate is encapsulated.
Shin-etsu Chemical Co., Ltd.


02/04/16
20160035612 

Temporary bonding laminates for used in manufacture of semiconductor devices and methods for manufacturing semiconductor devices


Provided is temporary bonding laminates for used in a manufacture of semiconductor devices, by which a member to be processed (a semiconductor wafer or the like) can be temporarily supported securely and readily during a mechanical or chemical process of the member to be processed and then the processed member can be readily released from the temporary support without damaging the processed member even after a high temperature process, and processes for manufacturing semiconductor devices. The temporary bonding laminate includes (a) a release layer and (b) an adhesive layer, wherein the release layer (a) comprises (a1) a first release layer having a softening point of 200° c.
Fujifilm Corporation


02/04/16
20160035592 

Adhering device and producing electronic device


The adhering device includes a first mold member having a first cavity in which an adhering preform, which includes an electronic component and a resin sheet disposed to face the electronic component in spaced-apart relation, is accomodated; an elastic member disposed to face the resin sheet so that a first enclosed space can be formed with the first cavity; and a differential pressure generation means connected to the first mold member for allowing the air pressure of the first enclosed space to be lower than the air pressure of a space opposite to the first enclosed space relative to the elastic member. The adhering device is configured such that by operating the differential pressure generation means, the elastic member moves towards the first cavity side, the adhering perform is pressed in the direction facing the electronic component and the resin sheet, thereby adhering the resin sheet to the electronic component..
Nitto Denko Corporation


02/04/16
20160035528 

Fuse unit


Between a first housing 20 made of resin which supports a first terminal fitting 10 coupled to a battery terminal and a second housing 60 which supports a second terminal fitting 40 to which a wire harness 30 is coupled and has a fuse mounting hole 61, a communication-plate portion 13, which is integrally formed in the first terminal fitting 10 and bendable in the thickness direction, is exposed. The direction of the second housing 60 is adjustable by bending the communication-plate portion 13.
Yazaki Corporation


02/04/16
20160035522 

Electric part and secondary battery circuit and circuit board including the same


An electric part 100 comprises a terminal piece 102 having an embedded portion 103 embedded in a resinous package 101 and a projecting portion 104 projecting from the package 101 and having a tip end 102e. The projecting portion 104 is provided with a bent section 110 including a first bent position 111 and a second bent position 112.
Komatsulite Mfg. Co., Ltd.


02/04/16
20160035514 

Button cover for improving uniformity of lighting and manufacturing the same


The present invention provides a button cover that improves uniformity of lighting, and prevents lighting quality from decreasing while reducing manufacturing costs using a minimal number of light source elements and a method to manufacture the button cover. The button cover includes a transparent resin that operates as a base and an outer surface of the button cover and a colorant applied to the transparent resin.
Hyundai Motor Company


02/04/16
20160035495 

Solid electrolyte capacitor and housing for solid electrolyte capacitor


A solid electrolyte capacitor includes a bottomed cylindrical housing having a bottom surface portion, a side surface portion raised from the bottom surface portion and an opening portion formed on an end portion of the side surface portion; a capacitor element housed in the inside of the housing, the capacitor element being formed by winding an anode foil and a cathode foil in an overlapping state with a separator interposed therebetween and by filling a solid electrolyte between the anode foil and the cathode foil; and a sealing member sealing the opening portion of the housing in a state where the capacitor element is housed in the inside of the housing, wherein an oxide film repairing body made of a hydrophilic synthetic resin is disposed at least one of between the bottom surface portion and the capacitor element of the housing and between the capacitor element and the sealing member.. .
Rubycon Corporation


02/04/16
20160035484 

Chip electronic component and manufacturing the same


A chip electronic component includes a magnetic body in which internal coil part is embedded, and the magnetic body contains magnetic metal particles, a thermosetting resin, and a dispersing agent containing one or more selected from the group consisting of an acryl-based resin and a polyvinyl butyral (pvb)-based resin.. .
Samsung Electro-mechanics Co., Ltd.


02/04/16
20160035482 

Coil component and electronic device equipped with the same


A coil component includes: a pillar part; first and second rectangular planar parts, each having long sides l, short sides s, and thickness t; a coil formed around the pillar part; two terminal electrodes electrically connected to both ends of the coil; and an outer sheath containing magnetic grains and resin material and covering the coil at least partially; wherein the thickness pl in the l direction and thickness ps in the s direction, of the outer sheath, in a section cut across the center of the pillar part and in parallel with the ls planes, satisfy the relationship of pl<ps.. .
Taiyo Yuden Co., Ltd.


02/04/16
20160035476 

Coil component, manufacturing the same, and electronic device


A coil component includes an air-core coil embedded in a magnetic body constituted by resin and metal magnetic grains. Both ends of the coil are exposed on the surface of the magnetic body, and the side on which both ends are exposed is polished and etched to form terminal electrodes.
Taiyo Yuden Co., Ltd.


02/04/16
20160034066 

Touch panel


A touch panel according to the embodiment includes: a cover substrate including an active area and an unactive area; an intermediate layer on the cover substrate; and an electrode on the intermediate layer, wherein the intermediate layer includes an acrylic resin composition.. .
Lg Innotek Co., Ltd.


02/04/16
20160033925 

Cleaning blade, image forming apparatus, and process cartridge


A cleaning blade, including: rectangular elastic body blade containing cured first-uv-curable resin at tip ridgeline portion thereof, brought into contact with surface of to-be-cleaned member, the cured first-uv-curable resin being formed by impregnating the tip ridgeline portion with the first-uv-curable resin, followed by curing, and depth of the elastic body blade impregnated with the first-uv-curable resin from edge surface thereof is 50 μm-150 μm, wherein the elastic body blade contains surface layer containing cured second-uv-curable resin at the edge surface, wherein load-displacement curve of martens hardness thereof has inflection points, and is obtained by pressing region of the surface layer thereof via resin particles having average particle diameter of 5 μm-10 μm, and distance of the region from the tip ridgeline portion is 0.5 mm or less, and wherein ratio of displacement at the inflection point, with which load is maximum, to the average particle diameter is 1.5-2.0.. .
Ricoh Company, Ltd.


02/04/16
20160033924 

Image forming apparatus and process cartridge


An image forming apparatus is provided which includes an image bearer, a charger, an irradiator, a developing device to develop an electrostatic latent image on the image bearer with a toner to form a toner image, a transfer device to transfer the toner image onto a transfer medium, and a cleaner to remove toner particles remaining on the image bearer without being transferred. The toner includes a mother particle including a binder resin and a colorant and one or more external additives.

02/04/16
20160033888 

Toner


A toner includes a plurality of toner particles each including a core and a shell layer disposed over a surface of the core. The shell layers include a resin containing a unit derived from a thermoplastic resin and a unit derived from a monomer or prepolymer of a thermosetting resin.
Kyocera Document Solutions Inc.


02/04/16
20160033887 

Suspension polymerization toner of core-shell structure with dense charges and preparation method


Suspension polymerization toner of a core-shell structure with dense charges comprises core-shell composite particles prepared by mixing suspension dispersion liquid of toner core particles with shell monomer emulsion and resin-type cca dispersion liquid, and carrying out a polymerization reaction to form rigid shell layers with dense charges coated on the soft toner core particles. A preparation method thereof comprises: mixing a low-tg monomer oil phase forming toner core particles with aqueous dispersion liquid, carrying out a heating polymerization reaction after suspension granulation to convert monomer oil droplet particles to polymer particles, and obtaining soft toner core particles; adding a high-tg shell monomer forming rigid shell layers into water containing a surfactant to form emulsion, adding the emulsion and cca dispersion liquid into suspension dispersion liquid of the soft toner core particles for second polymerization after mixing, and cleaning, filtering, drying and performing additive treatment..
Shenzhen Leputai Technology Co., Ltd


02/04/16
20160033885 

Electrophotographic photosensitive member


An electrophotographic photosensitive member includes a photosensitive layer containing a charge generating material, a charge transport material, and a binder resin. The photosensitive layer is a multi-layer type photosensitive layer or a single-layer type photosensitive layer.
Kyocera Document Solutions Inc.


02/04/16
20160033870 

Pattern formation method, electronic-device manufacturing method, and electronic device


A pattern formation method which includes a process of forming an actinic ray sensitive or radiation sensitive film by coating a substrate with an actinic ray sensitive or radiation sensitive resin composition which contains a resin where the degree of solubility with respect to a developer which includes one or more types of organic solvents decreases due to an effect of an acid, a compound which generates an acid by irradiation with actinic rays or radiation, and a solvent, a process of exposing the actinic ray sensitive or radiation sensitive film via an immersion liquid, a process of heating the actinic ray sensitive or radiation sensitive film, and a process of developing the actinic ray sensitive or radiation sensitive film using the developer which includes an organic solvent in this order, in which a process of cleaning the actinic ray sensitive or radiation sensitive film is included after the film forming process and before the exposing process and/or after the exposing process and before the heating process.. .
Fujifilm Corporation


02/04/16
20160033868 

Method for producing a planographic printing plate


Provided is a method of producing a planographic printing plate, including: subjecting a planographic printing plate precursor, which has a support and a positive-working image recording layer, to image-wise exposure; and developing it using an alkaline aqueous solution which contains a specific compound and has a ph of from 8.5 to 10.8, in this order. The recording layer has: a lower layer containing a water-insoluble and alkali-soluble resin and an infrared ray absorbing agent; and an upper layer containing a water-insoluble and alkali-soluble polyurethane resin and a polyorganosiloxane.
Fujifilm Corporation


02/04/16
20160033864 

Photoresist and methods of preparing and using the same


Disclosed is a photoresist comprising 1 to 90 parts of hydroxyl-containing or carboxyl-containing film-forming resin, 1 to 99 parts of silicon-containing vinyl ether monomer, and an organic solvent capable of dissolving the aforesaid substances. Disclosed is also methods of preparing and using the photoresist..
Boe Technology Group Co., Ltd.


02/04/16
20160033862 

Active light-sensitive, or radiation-sensitive resin composition, and pattern-forming method using same


(b) at least one type of a resin which includes a repeating unit which is represented by general formula (1) below and of which, due to being decomposed by an action of an acid, the solubility increases with respect to an alkali developer.. .

02/04/16
20160033687 

Optical film, process for producing optical film, polarizer, and image display device


There is provided an optical film which includes a light transmissive support body containing a thermoplastic resin, a layer containing the thermoplastic resin and a resin cured with light and/or heat, and a layer containing a resin same as the resin cured with light and/or heat and a cyclic polyolefin-based resin in this order.. .
Fujifilm Corporation


02/04/16
20160033072 

Short liner for sewer rehabilitation


The invention relates to a multi-layer short liner suitable for sewer rehabilitation, a short liner kit suitable for sewer rehabilitation, comprising at least one individual layer of the short liner not impregnated with resin and at least one individual layer impregnated with a polyester resin, to a rehabilitation kit comprising a short liner or a short liner kit and comprising epoxy resin or silicate resin, to the use of a short liner or a short liner kit for sewer rehabilitation, and to a method for sealing a sewer, wherein a short profiled element is inserted into the sewer.. .
Saertex Multicom Gmbh


02/04/16
20160033060 

Multi-layer hose and hose formulation


Multilayer hose construction and hose formulation provide a surprising combination of physical properties and enhanced performance, more specifically providing improved kink resistance and burst strength. The garden hose comprises an extruded composite tube including core and jacket layers of a polyvinyl chloride (pvc) compound and an intermediate reinforcement layer having interstices through which the core and jacket layers are bonded, the pvc compound comprising: 100 pph (parts in weight per hundred parts of resin) of pvc resin; and 45-75 pph of plasticizer.
Swan Products Llc


02/04/16
20160033057 

Heat releasing pipe


A heat releasing pipe includes a metal pipe and a surface coating layer. The metal pipe has an outer circumferential surface.
Ibiden Co., Ltd.


02/04/16
20160033044 

Seal device


There is provided a seal device having a seal ring structure assemblable without lowering the assembling efficiency of cvt, and free from oil leakage when an oil pump is not operated with an engine stopped, namely when oil pressure is not applied to the seal ring, which comprises a combined seal ring comprising an endless resin ring having an outer peripheral surface in slidable contact with an inner peripheral surface of an outer member, and a coil expander pushing the resin ring toward its outer peripheral surface and side surface, the coil expander being arranged in a corner recess portion of the resin ring between its pressure-receiving side surface and its inner peripheral surface, and an inner peripheral side of the combined seal ring being separate from a bottom of the seal ring groove.. .
Kabushiki Kaisha Riken


02/04/16
20160033040 

Fluid barriers with flexible backing material and methods of repairing and manufacturing the same


A component to be repaired includes a relatively rigid plate. On a surface that may have been subject to fracture, a resin material is first laid down, then a relatively flexible material is positioned outwardly of the resin material to repair the barrier.
United Technologies Corporation


02/04/16
20160032978 

Synthetic resin-made thrust sliding bearing


A synthetic resin-made thrust sliding bearing 1 includes a synthetic resin-made upper casing 100, a synthetic resin-made lower casing 200, and a synthetic resin-made thrust bearing piece 300 interposed between the upper and lower casings 100 and 200. If it is assumed that the radial length of the thrust bearing piece 300 up to its outer peripheral surface 303 is (r), and the thickness of an upper annular plate portion 102 at its inner peripheral surface is (t), the upper casing 100 has on its upper surface 108 an annular flat surface 109 having a circular outer peripheral edge with r in a range of r=r±t..
Oiles Corporation


02/04/16
20160032525 

Process for the isolation of lignin from black liquor and modification of the lignin for plastic applications


A process for the isolation of lignin from black liquor and modification of lignin for use in many plastic applications is disclosed. The isolation of lignin consists of removing all of the non-lignin components from black liquor solution.
Organic Chemical Llc


02/04/16
20160032520 

Fiber treatment agent, carbon fibers treated with fiber treatment agent, and carbon fiber composite material containing said carbon fibers


An object of the present invention is to provide a fiber treatment agent that is capable of forming on fibers a film that has excellent water resistance and excellent adhesion to a matrix resin. The present invention provides a fiber treatment agent comprising an aqueous medium, a water-insoluble polyamide dispersed in the aqueous medium, and a water-soluble polyamide that is present in an amount of 2 to 50 parts by mass per 100 parts by mass of the water-insoluble polyamide..
Sumitomo Seika Chemicals Co., Ltd.


02/04/16
20160032506 

Three dimensional netted structure


A three-dimensional netted structure having an upper surface, a lower surface, two side surfaces a left end surface, and a right end surface, including at least a plurality of filaments helically and randomly entangled and thermally bonded together, wherein the filaments are formed out of a thermoplastic resin by extrusion molding followed by cooling with a liquid; and the netted structure is four-surface molded, the upper surface, the lower surface and the two side surfaces being molded. An apparatus and a method for manufacturing the three-dimensional netted structure..
C-eng Co., Ltd.


02/04/16
20160032504 

Nonwoven fabric and fiber product


Provided is a spunbonded nonwoven fabric comprising a core-sheath composite fiber having a core part composed of a core component containing a propylene-based resin (a) satisfying the following (a) to (e) and a sheath part composed of a sheath component containing an ethylene-based resin. (a) [mmmm]=20 to 60 mol %, (b) [mm]×[rr]/[mr]2≦2.0, (c) weight average molecular weight (mw)=10,000 to 200,000, (d) molecular weight distribution (mw/mn)<4.0, and (e) a melting point (tm-d), as defined as a peak top of a peak observed on the highest temperature side of a melting endothermic curve which is obtained by holding under a nitrogen atmosphere at −10° c.
Idemitsu Kosan Co., Ltd.


02/04/16
20160032458 

Silver-plated structure


A silver-plated structure formed on a surface of a metallic base material includes: a pretreatment layer formed by washing the surface of the base material with a pretreatment agent; a resin paint film layer formed on a surface of the pretreatment layer; and a silver plating layer formed on a surface of the resin paint film layer. The silver plating layer includes: a silver film formed by a silver mirror reaction; an undercoat film that causes the silver film to adhere to the surface of the resin paint film layer; and a topcoat film that protects a surface of the silver film..
Kayaba Industry Co., Ltd.


02/04/16
20160032226 

Maintenance liquid for active energy ray-curable inkjet ink


Provided is a non-aqueous maintenance liquid for an active energy ray-curable inkjet ink which can be used as a cleaning liquid for removing the inkjet ink and as a preserving liquid to fill the head when the printer is not in operation. The non-aqueous maintenance liquid for an active energy ray-curable inkjet ink of the present invention comprises a main liquid component, a pigment dispersant resin, and a surface control agent, wherein the main liquid component is an organic solvent and/or an active energy ray-curable compound, and the amount of the surface control agent is 0.01 to 10% by weight in 100% by weight of the maintenance liquid..
Toyo Ink Co.,ltd.


02/04/16
20160032215 

Elastomer composition for a tire object having a self-sealing property


Elastomer composition having a self-sealing property which can be used in particular as puncture-resistant layer in an inflatable article, based on at least (phr meaning parts by weight per 100 parts of solid elastomer): a blend of at least two solid elastomers, a polybutadiene or butadiene copolymer elastomer, referred to as “elastomer a”, and a natural rubber or synthetic polyisoprene elastomer, referred to as “elastomer b”, the elastomer a: elastomer b ratio by weight being within a range from 10:90 to 90:10; between 30 and 90 phr of a hydrocarbon resin; from 0 to less than 30 phr of filler. Inflatable article, such as a tire, provided with a puncture-resistant layer comprising this elastomer composition; the puncture-resistant layer is advantageously used in combination with an airtight layer, for example based on butyl rubber or tps elastomer, in order to form, in the inflatable article, an airtight and puncture-resistant laminate..
Michelin Recherche Et Technique S.a.


02/04/16
20160032210 

Photosensitive coating resin of auxiliary plates for drilling and application thereof


A photosensitive resin composition and auxiliary plates for drilling are introduced. The auxiliary plates are made by coating the photosensitive resin composition on aluminum foil and photocuring the coated resin to make the resin bonded on the aluminum foil.
Gta Electronics Co., Ltd.


02/04/16
20160032180 

Antimicrobial resin coated proppants


The invention relates to polymeric coatings on proppants. These coatings have antimicrobial materials incorporated within these coatings.
Agienic, Inc.


02/04/16
20160032166 

Hot-melt adhesive composition and preparing the same, hot-melt adhesive thermal conductive sheet and preparing the same


The present invention provides a hot melt adhesive composition and a preparation method therefor, and a hot melt adhesive heat-conducting sheet and a preparation method therefor on a basis of the hot melt adhesive composition. The hot melt adhesive composition at least comprises: 6 to 9 parts of thermoplastic resin, 0.40 to 0.60 parts of tackifier, and 73 to 110 parts of heat-conducting particles by weight, the softening point of the thermoplastic resin ranging from 85 to 120 degrees centigrade.
Zhejiang Saintyear Electronic Technologies Co., Ltd.


02/04/16
20160032159 

Moisture-curable reactive hot-melt adhesive agent composition


The present invention aims to provide a moisture-curable reactive hot-melt adhesive composition which contains no vinyl chloride resin, which is excellent in adhesion to oily steel sheets and electroplated steel sheets, which has high strength immediately after application to effectively improve the production cycle, and which can be suitably used in vehicle applications. This challenge is solved by a moisture-curable reactive hot-melt adhesive that includes an oxyalkylene polymer containing a reactive silyl group, an alkyl (meth)acrylate (co)polymer, a tackifying resin, and a specific inorganic filler in combination..
Kaneka Corporation


02/04/16
20160032158 

Bonding adhesive and adhered roofing systems prepared using the same


A bond adhesive composition comprising a polymer having a silicon-containing hydrolyzable terminal group and a hydrocarbon resin, where the composition is substantially devoid of phenolic resin.. .
Firestone Building Products Co., Llc


02/04/16
20160032157 

Adhesive composition and adhesive sheet using the same


An adhesive composition includes an epoxy-based resin, an acryl-based resin, and a curing agent. The acryl-based resin includes a triblock copolymer of methyl methacrylate-butyl acrylate-methyl methacrylate, or a modified product thereof..
Dai Nippon Printing Co., Ltd.


02/04/16
20160032156 

Products comprising at least one synthetic-rubber pressure-sensitive adhesive comprising bio-based adhesive resins and production process for these


Pressure-sensitive adhesive comprising at least one synthetic rubber based on at least one vinylaromatic (a) and at least one diene (b); the proportion of synthetic rubber being at most 45% by weight; at least one bio-based adhesive resin based to an extent of at least 85% on renewable raw materials and making up a proportion of at least 1% by weight to at most 25% by weight of the entire composition of the pressure-sensitive adhesive.. .
Tesa Se


02/04/16
20160032155 

Sealant composition and preparing the same


Disclosed are a sealant composition and a method of preparing the same wherein the sealant composition comprises: 70-80 wt % of a low-viscosity epoxy acrylate conforming to the structure of formula i, 0.5-1 wt % of a photoinitiator, 5-15 wt % of silica microspheres, 5-15 wt % of resinous elastic microspheres, and 1-2 wt % of silane coupling agent, based on the total weight of the sealant composition wherein r1 and r2 are as defined herein. The sealant has improved coating linearity..
Beijing Boe Optoelectrics Technology Co., Ltd.


02/04/16
20160032148 

A making an optical assembly comprising depositing a solid silicone-containing hot melt composition in powder form and forming an encapsulant thereof


Methods of making optical assemblies and electronic devices comprising, depositing a solid silicone-containing hot melt composition in powder form onto an optical surface of an optical device; and forming, from the silicone-containing hot melt composition, an encapsulant that substantially covers the optical surface of the optical device. In some embodiments, the silicone containing hot melt composition is a reactive or unreactive silicone-containing hot melt.
Dow Corning Toray Co., Ltd.


02/04/16
20160032144 

Carbon nanomaterial-containing resin composition and molded plastic product


Disclosed are a resin composition and a molded product obtained using the same. By using the resin composition according to the present invention, a molded product having excellent tensile strength, tensile modulus, electromagnetic shielding effects, anti-static effects, and the like may be provided..
Lg Chem, Ltd.


02/04/16
20160032135 

Coated film


According to the present invention, there is provide a coated film capable of exhibiting an excellent adhesion property to a prism resin used in optical applications such as a backlight unit for liquid crystal displays, etc., in particular, a prism resin adaptable for high-brightness prisms, i.e., a high-refractive index prism resin. The coating film of the present invention comprises a polyester film and a coating layer formed on at least one surface of the polyester film which is prepared from a coating solution comprising a (meth)acrylate (a) and at least one crosslinking agent (b) selected from the group consisting of an oxazoline compound, an isocyanate-based compound and a melamine compound..
Mitsubishi Plastics, Inc.


02/04/16
20160032131 

Polyvinyl acetal resin, slurry composition prepared therefrom, ceramic green sheet, and multilayer ceramic capacitor


A slurry composition, including: a polyvinyl acetal resin; a ceramic powder; and an organic solvent. The polyvinyl acetal resin has a degree of polymerization of from 200 to 6000, a content percentage of vinylester unit of from 0.01 to 30 mol %, and a degree of acetalization of from 55 to 83 mol %.
Kuraray Co., Ltd.


02/04/16
20160032104 

Modified polyphenol binder compositions and methods for making and using same


Modified polyphenol binder compositions and methods for making and using same are provided. In at least one specific embodiment, the binder composition can include at least one unsaturated monomer and at least one polyphenolic compound.
Georgia-pacific Chemicals Llc


02/04/16
20160032101 

Silicone rubber-based hardening resin composition, molded article, and medical tube


A silicone rubber-based hardening composition includes a linear organopolysiloxane having a vinyl group (a), an organohydrogen polysiloxane (b), and a silica filler (c) of which surface is treated with a silane coupling agent having a trimethylsilyl group. The linear organopolysiloxane having a vinyl group (a) includes a first linear organopolysiloxane having a vinyl group (a1), and a second linear organopolysiloxane having a vinyl group (a2)..
Sumitomo Bakelite Company Limited


02/04/16
20160032100 

Polyphenylene sulfide resin composition, molded product of polyphenylene sulfide resin composition and production polyphenylene sulfide resin composition


There is provided a polyphenylene sulfide resin composition, comprising 5 to 95% by weight of a component (b) which is a polyphenylene sulfide resin having a weight-average molecular weight of not less than 10,000 and a weight loss percentage Δwr of not greater than 0.18% under heating, relative to 95 to 5% by weight of a component (a) which is a polyphenylene sulfide resin having the weight loss percentage Δwr of greater than 0.18%, wherein a total of the component (a) and the component (b) is equal to 100% by weight.. .
Toray Industries, Inc.


02/04/16
20160032099 

Polyamide resin composition and molded article using same


The present invention provides a polyamide resin composition containing a polyamide resin (a) in which a diamine constituent unit thereof includes a constituent unit derived from a xylylenediamine (a-1), and a dicarboxylic acid constituent unit thereof includes a constituent unit derived from an α,ω-linear aliphatic dicarboxylic acid (a-2) having from 4 to 20 carbon atoms; and a polyether polyamide (b) in which a diamine constituent unit thereof includes constituent units derived from a polyether diamine compound (b-1) represented by a specified structural formula and a xylylenediamine (b-2), and a dicarboxylic acid constituent unit thereof includes a constituent unit derived from an α,ω-linear aliphatic dicarboxylic acid (b-3) having from 4 to 20 carbon atoms.. .
Mitsubishi Gas Chemical Company, Inc.


02/04/16
20160032097 

Flame retardant polycarbonate


The present invention provides a thermoplastic molding composition comprising a) 60 to 99 percent by weight (pbw) aromatic poly(ester) carbonate having a weight-average molecular weight of at least 25,000, b) 1 to 20 parts per 100 parts resin (phr) graft (co)polymer having a core-shell morphology, comprising a grafted shell that contains polymerized alkyl(meth)acrylate and a composite rubber core that contains interpenetrated and inseparable polyorganosiloxane and poly(meth)alkyl acrylate where the weight ratio of polyorganosiloxane/poly(meth)alkylacrylate/ grafted shell is 70-90/5-15/5-15, c) 2 to 20 phr phosphorus-containing compound, and d) 0.1 to 15 phr boron compound having average particle diameter of 2 to 10 microns.. .
Covestro Llc


02/04/16
20160032094 

Resin composition and molded product thereof


A resin composition including a resin component and glass fibers, the resin component including 0 to 99 wt % of a hydrogenated crystalline cycloolefin ring-opening polymer that includes a repeating unit derived from a polycyclic norbornene-based monomer that includes 3 or more rings, and does not include a polar group, and 1 to 100 wt % of a hydrogenated modified crystalline cycloolefin ring-opening polymer that includes a repeating unit derived from a polycyclic norbornene-based monomer that includes 3 or more rings, and includes a polar group, the resin composition including the glass fibers in an amount of 5 to 150 parts by weight based on 100 parts by weight of the resin component; and a resin formed article obtained by forming the resin composition.. .
Zeon Corporation


02/04/16
20160032092 

Automobile interior component formed of reinforced polyphenylene ether-based resin composition


This disclosure is to provide an automobile interior component formed of a reinforced polyphenylene ether-based resin composition, which is excellent in both urethane adhesion and in appearance after molding, mechanical properties such as tensile strength, bending strength and the like, and resident molding stability; and further has sufficient molding fluidity. Provided is an automobile interior component formed of a reinforced polyphenylene ether-based resin composition, containing a polyphenylene ether (a) whereof the reduced viscosity (chloroform solvent, measured at 30° c.) in the molded product is 0.30 to 0.45 dl/g, a styrene resin (b) and a glass fiber (c), where the content of the component (a) is 10 to 30 mass %, the content of the component (b) is 40 to 85 mass %, and the content of the component (c) is 5 to 30 mass % with respect to 100 mass % in total of the components (a) to (c)..
Asahi Kasei Chemicals Corporation


02/04/16
20160032091 

Elastomeric compositions and their use in articles


A dynamically vulcanized alloy contains at least one isobutylene-containing elastomer, at least one thermoplastic resin, and an anhydride functionalized oligomer grafted to the thermoplastic resin. In the alloy, the elastomer is present as a dispersed phase of small vulcanized or partially vulcanized particles in a continuous phase of the thermoplastic resin and the alloy is substantially absent of any sulfonamides..
Exxonmobil Chemical Patents Inc.


02/04/16
20160032089 

Thermoplastic elastomer composition and molded article thereof


The thermoplastic elastomer composition includes (a) a polypropylene resin, (b) a non-conjugated diene copolymer having a mooney viscosity (ml1+4, 125° c.) of 40 to 85 and a molecular weight distribution of 1.5 to 3.0 and whose eluted amount at −15° c. Measured by cross-fractionation chromatography is 50% to 99.9% of the overall eluted amount, and (c) an ethylene copolymer having a mooney viscosity (ml1+4, 125° c.) of 20 to 30 and a density of 0.850 g/cm3 to 0.890 g/cm3.
Sumitomo Chemical Company, Limited


02/04/16
20160032085 

Polyarylene sulfide resin composition and use of same


Provided is a polyarylene sulfide resin composition which is good in strength, dimensional stability, and moldability in terms of a molded body thereof and is also capable of reducing wearing of a mold or molding machine at the time of molding of a molded body. The polyarylene sulfide resin composition contains 100 parts by mass of a polyarylene sulfide resin and 150 to 400 parts by mass of a glass bead, a sodium content of the polyarylene sulfide resin being 1,200 ppm or less, and the glass bead being surface-treated with a vinylsilane or an epoxysilane and having an average particle diameter of 30 μm or less and a ratio between a cumulative 10% particle diameter and a cumulative 90% particle diameter {(cumulative 90% particle diameter)/(cumulative 10% particle diameter)} of 2.5 or more..
Lion Idemitsu Composites Co., Ltd.


02/04/16
20160032084 

Carbon material for bearings and sliding member made of carbon material for bearings


A carbon material for bearings includes a porous carbon base material and an impregnation material. The impregnation material is made of resin or metal, and with which the carbon base material is impregnated.
Toyo Tanso Co., Ltd.


02/04/16
20160032083 

Transparent artificial chips and artificial marble comprising the same


The present invention relates to transparent chips for artificial marble and artificial marble including the same. The transparent chips for artificial marble include (a) a halogenated epoxy acrylate resin and (b) metal fibers.
Samsung Sdi Co., Ltd.


02/04/16
20160032082 

Composite fibers, weave fabrics, knitted fabrics and composite materials


Provided is a composite fiber in which a polyamide resin fiber and a continuous reinforcing fiber are dispersed. A composite fiber comprising (a) a polyamide resin fiber made from a polyamide resin composition, (b) a continuous reinforcing fiber, and (a) a treating agent for the polyamide resin fiber (a); wherein an amount of the treating agent (a) is 0.1 to 2.0% by mass of the polyamide resin fiber (a); and the polyamide resin composition comprises a polyamide resin containing a diamine structural unit, 50 mol % or more of which is derived from xylylenediamine, and having a number average molecular weight (mn) of 6,000 to 30,000; and 0.5 to 5% by mass of the polyamide resin has a molecular weight of 1,000 or less..
Mitsubishi Gas Chemical Company, Inc.


02/04/16
20160032077 

Thixotropy-increasing additive and composition containing said additive


The invention relates to a use of at least one condensation product (a) in the form of the free compound or in the form of a salt of at least one acid as a thixotropy- increasing additive, which condensation product can be obtained by reacting at least one polymerized fatty acid or at least one reaction product (u) of at least two polymerized fatty acids and at least one polyamine having at least two primary amino groups as component (a1) with at least one polyalkylene polyamine, which is capable of forming at least one imidazoline and/or tetrahydropyrimidine unit and which has at least two primary amino groups or at least one primary and at least one secondary amino group, a composition containing at least one such condensation product (a) and at least one thixotropic agent (b), and a use of said composition, which additionally comprises at least one binder (c), as an adhesive, sealant, paint, coating agent, adhesive resin, casting resin, artificial marble, floor covering, polymer concrete, or fiber composite material.. .
Byk-chemie Gmbh


02/04/16
20160032070 

Polylactic acid-based resin expanded beads and molded article thereof


Where mt represents a melt tension [mn] at 190° c., η represents a melt viscosity [pa·s] at 190° c. And a shear speed of 20 sec−1, and ct1/2 represents a half crystallization time [sec] at 110° c..

02/04/16
20160032068 

Polyamide resin composition for foam molded body, and foam molded body of polyamide resin comprising same


The present invention relates to a polyamide resin composition for a foam molded body, comprising a crystalline polyamide resin (a), carbon black (b) which does not exhibit crystallization promoting action to said crystalline polyamide resin and an inorganic reinforcing material (c), wherein, when the total amount of (a), (b) and (c) is taken as 100% by mass, the composition comprises (a) and (b) in a rate of 60 to 90% by mass in terms of the sum thereof and comprises (c) in a rate of 10 to 40% by mass, and wherein melting point and crystallization temperature of said polyamide resin composition have a specific relationship. The above-mentioned polyamide resin composition can provide a polyamide foam molded body having light weight, high load bearing property and good molded appearance..
Toyobo Co., Ltd.


02/04/16
20160032066 

Puncture-healing thermoplastic resin carbon-fiber reinforced composites


A composite comprising a combination of a self-healing polymer matrix and a carbon fiber reinforcement is described. In one embodiment, the matrix is a polybutadiene graft copolymer matrix, such as polybutadiene graft copolymer comprising poly(butadiene)-graft-poly(methyl acrylate-co-acrylonitrile).
U.s.a. As Represented By The Administrator Of Nasa


02/04/16
20160032065 

Prepreg, fiber-reinforced composite material, and resin composition containing particles


A prepreg 10 comprises: a reinforcing fiber layer 3 including reinforcing fibers 1 and a resin composition 2 with which the space between fibers thereof is impregnated and which contains (a) a benzoxazine resin, (b) an epoxy resin, and (c) a curing agent having 2 or more phenolic hydroxy groups; and surface layers 6a and 6b provided on the surfaces of the reinforcing fiber layer 3 and containing (a) a benzoxazine resin, (b) an epoxy resin, (c) a curing agent having 2 or more phenolic hydroxy groups, and (d) polyamide resin particles 4 having an average particle size of 5 to 50 wherein the polyamide resin particles 4 include a particle made of a copolymer in which caprolactam and laurolactam are copolymerized at a molar ratio of 9:1 to 7:3 and having a melting point of 180° c. Or more..
Fuji Jukogyo Kabushiki Kaisha


02/04/16
20160032064 

Encapsulant sheet for solar cell


An encapsulant sheet for a solar cell contains not less than 91% but less than 99% by mass of an ethylene-unsaturated ester copolymer (a), more than 1% but not more than 9% by mass of an olefin resins (b), 0.001 parts to 5 parts by mass of silicon dioxide and 0.001 to 0.5 parts by mass of a silane coupling agent, where the sum total of the content of the ethylene-unsaturated ester copolymer (a) and the content of the olefin resin (b) is taken as 100% by mass. The content of the silicon dioxide and the content of the silane coupling agent are relative to the total content of the ethylene-unsaturated ester copolymer (a) and the content of the olefin resin (b) being taken as 100% by mass.
Sumitomo Chemical Company, Limited


02/04/16
20160032059 

Radiation curable polythioethers with alkyne-based linkage


Certain polythioether polymers are presented, as well as compositions which are radiation curable to polythioether polymers and seals and sealants comprising same. The compositions radiation curable to polythioether polymers include those comprising: a) at least one dithiol monomer; b) at least one diene monomer; c) at least one polyyne monomer comprising at least two ethyne groups; and d) at least one photoinitiator.
3m Innovative Properties Company


02/04/16
20160032053 

Inner liner for pneumatic tire


The present invention provides an inner liner for pneumatic tire, the inner liner being prepared by molding a resin composition containing a polyether polyamide (a) in which a diamine constituent unit thereof includes constituent units derived from a polyether diamine compound (a-1) represented by the general formula (1) and a xylylenediamine (a-2), and a dicarboxylic acid constituent unit thereof includes a constituent unit derived from an α,ω-linear aliphatic dicarboxylic acid (a-3) having from 4 to 20 carbon atoms.. .
Mitsubishi Gas Chemical Company, Inc.


02/04/16
20160032051 

Copolymerized polyamide resin, preparing the same and article comprising the same


Wherein, r1 and r2 are the same or different and are each independently a c1 to c5 alkyl group or a c6 to c10 aryl group, x is a c1 to c10 hydrocarbon group, and m and n are the same or different and are each independently an integer from 0 to 4. The copolymerized polyamide resin can exhibit excellent properties, such as crystallinity, heat resistance, processability and discoloration resistance, and an excellent balance therebetween..

02/04/16
20160032048 

Bisphenol-a free polyether resins based on phenol stearic acid and coating compositions formed therefrom


Coating compositions can be prepared from a polyether resin, wherein the smallest difunctional hydroxyl phenyl segment used to form the polyether resin has a molecular weight greater than about 500, and wherein the smallest difunctional hydroxyl phenyl segment used to form the polyether resin does not comprise two or more non-impaired hydroxyl groups attached to two or more different five-membered or six-membered carbon atom rings in a segment having a molecular weight less than about 500. The polyether resin can be prepared by reacting a dihydroxyl compound and/or a diamine compound with a phenol stearic acid compound to produce a diphenol, and reacting the diphenol with a diglycidyl ether compound to form the polyether resin..
Si Group, Inc.


02/04/16
20160032043 

Bisphenol polymer precursor replacements


Use of biologically-derived polyphenols for the preparation of epoxy resins is described. Examples of biologically-derived polyphenols include resveratrol, genistein, daidzein, and polyphenols synthesized from tyrosine.
Case Western Reserve University


02/04/16
20160032040 

Acrylic grafted polyether resins based on phenol steric acid and coating compositions formed therefrom


Coating compositions can be prepared from an acrylic grafted polyether resin, wherein the smallest difunctional hydroxyl phenyl segment used to form the acrylic grafted polyether resin has a molecular weight greater than about 500, and wherein the smallest difunctional hydroxyl phenyl segment used to form the acrylic grafted polyether resin does not comprise two or more non-impaired hydroxyl groups attached to two or more different five-membered or six-membered carbon atom rings in a segment having a molecular weight less than about 500. The acrylic grafted polyether resin can be prepared by reacting a dihydroxyl compound and/or a diamine compound with a phenol stearic acid compound to produce a diphenol, reacting the diphenol with a diglycidyl ether compound to form a polyether resin, and mixing the polyether resin with an ethylenically unsaturated monomer component in the presence of an initiator to form the acrylic grafted polyether resin..
Si Group, Inc.


02/04/16
20160032027 

Novel bimodal resins having good film processability


A bimodal polyethylene copolymer comprising a lower molecular weight (lmw) component and a higher molecular weight (hmw) component, the copolymer having a z-average molecular weight (mz) of from about 1,000 kg/mol to about 2,500 kg/mol, a weight fraction of the lmw component (lmw fr.) of from about 0.60 to 0.85, a ratio of a weight average molecular weight (mw) of the hmw component (hmw mw) to a mw of the lmw component (lmw mw) of from about 14 to about 25, a zero shear viscosity (η0) of from about 5×105 pa-s to about 1×107 pa-s and a hmw mw of from about 800 kg/mol to about 1,500 kg/mol.. .
Chevron Phillips Chemical Company Lp




Resin topics: Carbon Dioxide, Homogeneous, Back Sheet, Impregnated, Nanoparticle, Carbonate Ion, Carbonic Anhydrase, Deionization, Bicarbonate, Organosiloxane, Surface Treatment, Fluoropolymer, Encapsulation, Display Panel, Semiconductor Device

Follow us on Twitter
twitter icon@FreshPatents

###

This listing is a sample listing of patent applications related to Resin for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Resin with additional patents listed. Browse our RSS directory or Search for other possible listings.


1.4974

4641

1 - 1 - 111