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Resin-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Encapsulated circuit module, and production method therefor
December 07, 2017 - N°20170354039

A encapsulated circuit module m has a substrate 100 on which a number of electronic components 200 are mounted. An electronic component 200a is a high frequency oscillator. A metal side wall 320 of a partition member is provided on the substrate 100. One surface of the substrate 100 is entirely covered with a first resin 400 together with the electronic components 200 and the side wall 320. ...
Printed wiring board and method of manufacturing the same
Toppan Printing Co., Ltd.
December 07, 2017 - N°20170354034

A printed wiring board according to an aspect of the present invention includes an insulating resin, a plated copper formed on a front surface side of the insulating resin, and a plated copper formed on a back surface side of the insulating resin. The plated copper and the plated copper are electrically connected via a plated copper that fills a ...
Resin composition, prepreg, metal-clad laminate, and wiring board
Kyocera Corporation
December 07, 2017 - N°20170354033

A resin composition contains a component (a) being a polyphenylene ether in which the hydroxy group at an end of the main chain thereof has been modified with an ethylenically unsaturated compound, a component (b) being at least one of triallyl isocyanurate and triallyl cyanurate, and a component (c) being an organic peroxide containing no benzene ring. The component (c) ...
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Power conversion device
Hitachi Automotive Systems, Ltd.
December 07, 2017 - N°20170353118

An object of the invention is to suppress that resistance against vibrations is reduced, while reducing the number of components. A power conversion device according to the present invention includes: a power semiconductor module that converts a dc current into an ac current; a plate conductor that transfers the dc current or the ac current; a resin sealing material that ...
Stator unit, motor, and blower
Nidec Corporation
December 07, 2017 - N°20170353090

A stator unit includes a base member including a bearing housing extending along a rotation axis, a stator fixed to an outer circumferential surface of the bearing housing, and a molding resin part covering the stator. The stator includes a stator core having teeth protruding radially outward, an insulator for partially covering a surface of the stator core, and coils. ...
Stators for electrical machines
Ge Energy Power Conversion Technology Ltd
December 07, 2017 - N°20170353089

A stator for an electrical machine is described. The stator includes a plurality of axially adjacent generally annular laminations. An axially extending coolant passageway through which a coolant fluid flows in use, extends through the stator. A plurality of axially spaced sealing recesses are provided. Each sealing recess is located between a pair of laminations and is in open communication ...
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Resin Patent Applications
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For professional research & prior art discovery
inventor
  • 337+ full patent PDF documents of Resin-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Manufacturing method for all-solid-state battery, manufacturing apparatus for all-solid-state battery, and all-solid-state battery
Toyota Jidosha Kabushiki Kaisha
December 07, 2017 - N°20170352923

A manufacturing method for an all-solid-state battery includes: producing a laminated battery having both end surfaces in a lamination direction and a side surface by laminating pluralities of collector layers, positive electrode mixture layers, solid electrolyte layers, and negative electrode mixture layers; supplying a liquid resin to only the side surface of the laminated battery; and curing the liquid resin. ...
Detection module
Sumitomo Electric Industries, Ltd.
December 07, 2017 - N°20170352859

In a detection module to be mounted on a unit cell group formed by electrically connecting adjacent electrode terminals of a plurality of unit cells including positive and negative electrode terminals by busbars, a plurality of fuse units each configured such that a busbar connection terminal for detecting a state of the unit cell by being connected to the busbar, ...
Electric storage cell, covering film and electric storage module
Taiyo Yuden Co., Ltd.
December 07, 2017 - N°20170352855

An electric storage cell has an electric storage element and a covering film package. The covering film package houses the electric storage element and includes: a metal layer having a first principle face on the electric storage element side and a second principle face on the opposite side of the first principle face, an internal resin layer made of synthetic ...
Pouch case for secondary battery and pouch-type secondary battery comprising the same
Lg Chem, Ltd.
December 07, 2017 - N°20170352844

The present invention relates to a pouch case for a secondary battery and a pouch-type secondary battery comprising the same. More particularly, it relates to a pouch case for a secondary battery comprising an inner resin layer, a metal layer and an outer resin layer, wherein the inner resin layer comprises a porous non-woven fabric support having a plurality of ...
Composition for organic electronic device encapsulant and encapsulant formed using the same
Momentive Performance Materials Korea Co., Ltd.
December 07, 2017 - N°20170352836

The present application relates to a composition for an encapsulant and an encapsulant formed using the same. The composition for an encapsulant according to one embodiment of the present application includes 1) a silicone resin; 2) one or more types of moisture absorbents; and 3) one or more types of photoinitiators.
Anisotropic conductive film and display device using the same
Samsung Display Co., Ltd
December 07, 2017 - N°20170352716

An anisotropic conductive film includes a conductive layer; a first resin insulating layer over a first surface of the conductive layer; and a second resin insulating layer over a second surface of the conductive layer, wherein the conductive layer comprises a plurality of conductive particles and a nano fiber connecting the plurality of conductive particles to each other, each of ...
Wafer laminate and making method
Shin-etsu Chemical Co., Ltd.
December 07, 2017 - N°20170352637

A wafer laminate has an adhesive layer (2) sandwiched between a support (1) and a wafer (3), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer (2) includes a light-shielding resin layer (2a), an epoxy-containing siloxane skeleton resin layer (2b), and a non-silicone thermoplastic resin layer (2c).
Resin Patent Pack
Download 337+ patent application PDFs
Resin Patent Applications
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For professional research & prior art discovery
inventor
  • 337+ full patent PDF documents of Resin-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Wiring board and semiconductor device
Shinko Electric Industries Co., Ltd.
December 07, 2017 - N°20170352628

A wiring board includes a first insulating layer made of a single layer of non-photosensitive resin including a reinforcing member, a center position of the reinforcing member being positioned on a side toward a first surface with respect to a center of the first insulating layer in a thickness direction; a layered structure of a wiring layer and an insulating ...
Wiring board
Fujitsu Limited
December 07, 2017 - N°20170352614

A wiring board includes a base board and a plurality of wiring layers formed of a resin insulating film on the base board, wherein at least one of the wiring layers includes a fine wiring, a barrier film, which is not in contact with the fine wiring, is formed at a more outer side than the base board than the ...
Semiconductor device and power conversion device using same
Hitachi, Ltd.
December 07, 2017 - N°20170352604

In order to improve productivity of a semiconductor device, while improving stability of the blocking voltage of the semiconductor device, this semiconductor device is characterized by having a semiconductor element, and a laminated structure having three resin layers, said laminated structure being in a peripheral section surrounding a main electrode on one surface of the semiconductor element. The semiconductor device ...
Electronic component package including sealing resin layer, metal member, ceramic substrate, and electronic component and ...
Panasonic Corporation
December 07, 2017 - N°20170352603

An electronic component package includes: a sealing resin layer; a metal member buried therein and including a die bond portion and a terminal electrode portion located outside the die bond portion; a ceramic substrate buried in the sealing resin layer; and an electronic component disposed on the die bond portion. When viewed in plan, the die bond portion and the ...
Substrate processing apparatus
Ebara Corporation
December 07, 2017 - N°20170352573

It is an object of the present invention to provide a high-flatness substrate holding table. According to a first aspect, a substrate processing apparatus is provided, and such a substrate processing apparatus includes a table for holding a substrate, a resin film attached to a top surface of the table and a heater provided inside the table, and the top ...
Method for laminating glass panels and vacuum lamination device using same
Shenzhen China Star Optoelectronics Technology Co. , Ltd.
December 07, 2017 - N°20170352561

A method for laminating glass panels includes (1) providing a tft substrate and a cf substrate to be laminated, in which the cf substrate is coated with a seal resin and the tft substrate carries liquid crystal dropped thereon; (2) aligning and laminating the tft substrate and the cf substrate in a vacuum environment to complete a lamination process; (3) applying uv light ...
Dielectric film, film capacitor and combination type capacitor using same, inverter, and electric vehicle
Kyocera Corporation
December 07, 2017 - N°20170352480

There are provided a dielectric film which is excellent in heat resistance and is capable of improvement in breakdown field, a film capacitor and a combination type capacitor using the dielectric film, an inverter, and an electric vehicle. A film capacitor having excellent heat resistance and high breakdown field is obtained by producing a film capacitor that uses a dielectric ...
Core component, method for manufacturing core component, and reactor
Sumitomo Electric Industries, Ltd.
December 07, 2017 - N°20170352478

Provided is a core component having a powder compact and a resin-molded portion joined to each other. In a core component including a powder compact obtained by compression molding a raw material powder containing a soft magnetic powder and a resin-molded portion formed on the surface of the powder compact, and constituting a part of a magnetic core disposed inside ...
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