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This page is updated frequently with new Resin-related patent applications. Subscribe to the Resin RSS feed to automatically get the update: related Resin RSS feeds. RSS updates for this page: Resin RSS RSS


Method and encapsulant for flip-chip assembly

Chulalongkorn University

Method and encapsulant for flip-chip assembly

Surface-treated aluminum plate, organic-resin-coated surface -treated aluminum plate, can body and can lid formed by…

Toyo Seikan Group Holdings

Surface-treated aluminum plate, organic-resin-coated surface -treated aluminum plate, can body and can lid formed by…

Surface-treated aluminum plate, organic-resin-coated surface -treated aluminum plate, can body and can lid formed by…

Denso

Connector with built-in electronic circuit board and method of manufacturing same

Date/App# patent app List of recent Resin-related patents
02/26/15
20150057416
 Organosiloxane-modified novolak resin and making method patent thumbnailnew patent Organosiloxane-modified novolak resin and making method
An organosiloxane-modified novolak resin comprising structural units having formula (1) wherein r1 is an organosiloxy group having a monovalent c1-c10 hydrocarbon group bonded to silicon, and r2 is h or c1-c4 alkyl or alkoxy. The resin has high heat resistance and high strength inherent to novolak resins and low stress inherent to organosilicon compounds..
Shin-etsu Chemical Co., Ltd.
02/26/15
20150057414
 Thermoplastic elastomer composition patent thumbnailnew patent Thermoplastic elastomer composition
A thermoplastic elastomer composition which comprises (a) a thermoplastic resin, (b) a halogenated isoolefin/para-alkylstyrene copolymer rubber, and (c) a thermoplastic elastomer, wherein the thermoplastic resin (a) forms a continuous phase, the halogenated isoolefin/para-alkylstyrene copolymer rubber (b) and the thermoplastic elastomer (c) have been separately dispersed in the continuous phase, the halogenated isoolefin/para-alkylstyrene copolymer (b) has been crosslinked, the thermoplastic elastomer (c) has not been crosslinked, and the amount of the thermoplastic elastomer (c) is 20-50 mass % with respect to the total amount of the halogenated isoolefin/para-alkylstyrene copolymer rubber (b) and the thermoplastic elastomer (c).. .
The Yokohama Rubber Co., Ltd.
02/26/15
20150057413
 Prepreg comprising polyphenylene ether particles patent thumbnailnew patent Prepreg comprising polyphenylene ether particles
Provided is a prepreg suffering little resin particle fall-off and little resin peeling during prepreg production and during handling in order to have excellent dielectric properties for ppe and favorable adhesiveness. A ppe-containing prepreg constituted of a base material and a curable resin composition including ppe particles, wherein the prepreg is characterized in that (1) ppe extracted from the prepreg using a mixed solvent of toluene and methanol in a mass ratio of 95:5 includes ppe particles (a) insoluble in the mixed solvent, (2) the amount of ppe contained in the ppe particles (a) is 70 mass % or higher, and (3) the number-average molecular weight of the ppe contained in the ppe particles (a) is 8,000-40,000..
Asahi Kasei E-materials Corporation
02/26/15
20150057401
 Die release agent composition patent thumbnailnew patent Die release agent composition
A die release agent composition is provided that is used by being applied to a die used for the squeeze casting, low-pressure casting, or the like of a metal or a die used for die forging. The die release agent composition includes a mineral oil or a synthetic oil, a solid lubricant, a thermosetting resin, and a polymer compound.
Denso Corporation
02/26/15
20150057399
 Chloroprene rubber-based polymer latex composition and use thereof patent thumbnailnew patent Chloroprene rubber-based polymer latex composition and use thereof
It is an object of the invention to provide a chloroprene rubber-based polymer latex that has a good balance between initial adhesion and storage stability and is suitable for one-component aqueous adhesive applications. The invention relates to a chloroprene rubber-based polymer latex composition containing a mixture of a chloroprene rubber-based polymer latex and a latex of an acrylic or styrene-acrylic resin-based polymer obtained by copolymerization of a specific carboxyl group-containing unsaturated monomer, in which the specific carboxyl group is neutralized with an alkali..
Showa Denko K.k.
02/26/15
20150057393
 Insulating resin composition for printed circuit board and products manufactured by using the same patent thumbnailnew patent Insulating resin composition for printed circuit board and products manufactured by using the same
Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including a 4-functional naphthalene-based epoxy resin and having improved coefficient of thermal expansion and glass transition temperature properties, and a prepreg and a printed circuit board as products manufactured by using the same.. .
Samsung Electro-mechanics Co., Ltd.
02/26/15
20150057390
 Polycarbonate resin composition having good chemical resistance patent thumbnailnew patent Polycarbonate resin composition having good chemical resistance
A polycarbonate resin composition includes (a) a polycarbonate resin, (b) syndiotactic polystyrene, and (c) modified polyolefin compound including a polar functional group on a polyolefin backbone. The polycarbonate resin compositions can have excellent chemical resistance, impact resistance, weathering resistance, fatigue resistance, thermal stability, mechanical properties, transparency, and/or molding processability..
Cheil Industries Inc.
02/26/15
20150057387
 In-mold foam molded body comprising polypropylene resin foam particles and  producing same patent thumbnailnew patent In-mold foam molded body comprising polypropylene resin foam particles and producing same
An in-mold foaming molded product having a thin wall part of the present invention contains expanded polypropylene resin particles. The expanded polypropylene resin particles include a polypropylene resin composition that contains an aliphatic diethanolamine fatty acid ester and an aliphatic diethanolamine in a total amount of not less than 0.1 part by weight but not greater than 5 parts by weight with respect to 100 parts by weight of polypropylene resin..
Kaneka Corporation
02/26/15
20150057382
 Resin composition foam and  producing the same patent thumbnailnew patent Resin composition foam and producing the same
The present invention relates to a method for producing a resin composition foam comprising dissolving a supercritical fluid in a resin composition containing polytetrafluoroethylene and another resin other than polytetrafluoroethylene at a temperature equal to or higher than a glass transition point of the other resin, then foaming the resin composition by removing the supercritical fluid at a temperature lower than a temperature obtained by adding 15° c. To a thermal deformation starting temperature of the other resin, and subsequently cooling.
Mitsubishi Rayon Co., Ltd.
02/26/15
20150057201
 Lubricating thermoplastic resin composition and formed article thereof patent thumbnailnew patent Lubricating thermoplastic resin composition and formed article thereof
[solution] the lubricating thermoplastic resin composition includes an acid-modified copolymer (a) of a monomer mixture including an aromatic vinyl and a vinyl cyanide, the copolymer having a carboxyl group in the molecular chain, and a functionalized lubricant (b) having, in the molecule, a functional group (b1) capable of reacting with the carboxyl group and a lubricating segment (b2) having lubricating properties. The composition may further include a graft copolymer (c) and/or an additional thermoplastic resin (d) other than the acid-modified copolymer (a)..
02/26/15
20150057199
new patent

Composition for sliding member


A composition for sliding member includes a binder resin, a solid lubricant, and an epoxy modified silicone oil having an epoxy group at both ends or at one end thereof. A weight ratio of the binder resin and the epoxy modified silicone oil is 97:3 to 75:25..
Nok Klueber Co., Ltd.
02/26/15
20150057103
new patent

Resin composition for golf ball and golf ball


The present invention provides a resin composition for golf balls that is excellent in resilience, flexibility, and fluidity. The present invention also provides a golf ball excellent in resilience, shot feeling, and productivity.
Dunlop Sports Co. Ltd.
02/26/15
20150056880
new patent

Eco-friendly and high-strength resin composite material


Disclosed is an eco-friendly and high-strength resin composite material which has high-strength and light weight properties. The eco-friendly and high-strength resin composite material according to the present invention includes: a first base material; a reinforcing material layer formed on the first base material and having a fibrous reinforcement; and a second base material formed on the reinforcing layer.
Lg Hausys, Ltd.
02/26/15
20150056864
new patent

Connector with built-in electronic circuit board and manufacturing same


A connector with built-in electronic circuit board includes an electronic circuit board for a sensor, the electronic circuit board including a first connection terminal, an inner case housing the electronic circuit board, and an outer case having a chamber housing the inner case. The connector further includes a second connection terminal extending from inside the chamber to outside the outer case, a third connection terminal disposed in the chamber, and a cable connected to the sensor at one end thereof at outside the outer case and connected to the third connection terminal at the other end thereof.
Denso Corporation
02/26/15
20150056649
new patent

Method for quantifying cell of interest in blood, and evaluating system for quantifying said cell


A method for quantifying cells of interest potentially contained in a blood-derived sample in cases of their quantification after separation from the blood-derived sample may enable accurate quantification of the cells without causing underestimation of the cell number. The quantification method is a method for quantifying specific cells of interest, the method may include: (a) separating a blood-derived sample containing a known number (p0) of specific resin particles p into at least two layers including a layer of erythrocytes and a layer of cells other than erythrocytes; (b) extracting the layer of cells other than erythrocytes and counting the number of cells of interest and the number (p1) of the resin particles therein; and (c) correcting the number of cells of interest by multiplying the number of cells of interest by p0/p1..
Konica Minolta, Inc.
02/26/15
20150056557
new patent

Chemically amplified positive-type photosensitive resin composition and producing resist pattern using the same


A chemically amplified positive-type photosensitive resin composition including a compound represented by the following formula (1), having a melting point of 40° c. Or lower at 1 atm, a resin whose solubility in alkali increases under the action of an acid, and a photoacid generator.
Tokyo Ohka Kogyo Co., Ltd.
02/26/15
20150056550
new patent

Simplified process for sustainable toner resin


The disclosure describes a one reaction process for making a bio-based polyester resin. The resultant polyester resin retains thermal properties as compared to a similar resin but made using previous multi-step processes conducted in separate vessels..
Xerox Corporation
02/26/15
20150056549
new patent

Toner


The present invention is a toner including toner particles prepared by forming particles of a polymerizable monomer composition including a polymerizable monomer, a pigment, a pigment dispersant and a crystalline polyester resin in an aqueous medium, and polymerizing the polymerizable monomer, wherein the polymerizable monomer is a polymerizable monomer for preparing a vinyl copolymer, the difference in an sp value between the pigment dispersant and the crystalline polyester resin is −1.5 to +0.8, the difference in an sp value between the pigment dispersant an the vinyl copolymer is −1.1 to +1.2, the pigment dispersant has a polymer component and an adsorbable component adsorbed to the pigment, the polymer component is a vinyl polymer, the polymer component of the pigment dispersant has a number average molecular weight of 3,000 to 20,000, and a rate of adsorption of the pigment dispersant to the pigment is 30% or more.. .
Canon Kabushiki Kaisha
02/26/15
20150056545
new patent

Polymer compound, chemically amplified negative resist composition, photo-curable dry film and production method thereof, layered product, patterning process, and substrate


A polymer compound has a carboxyl group and a siloxane chain and is obtained in the presence of an acid catalyst by condensation of at least; (i) a siloxane compound having phenol groups at both terminals, as shown by formula (1), (ii) phenols shown by formula (2) and/or phenols shown by formula (3), and (iii) one or more kinds of aldehydes and ketones shown by the following general formula (4). A polymer compound can be used suitably as a base resin of a chemically amplified negative resist composition with which the problem of delamination generated on metal wires, an electrode, and a substrate, can be improved, and with which a fine pattern can be formed without generating a scum and a footing profile in the pattern bottom and on the substrate, using a widely used aqueous 2.38% tmah solution as a developer..
Shin-etsu Chemical Co., Ltd.
02/26/15
20150056490
new patent

Multi-layered porous film, electrical cell separator, and electrical cell


A laminated porous membrane includes a polyolefin porous membrane a, and a porous layer b provided on at least one surface of the polyolefin porous membrane a, the porous layer b containing a filler (a) and a binder resin (b) as essential components, the filler (a) having a true specific gravity of less than 2.0 g/cm3.. .
Toray Battery Separator Film Co., Ltd.
02/26/15
20150056454
new patent

Resin composition, prepreg, and metal foil-clad laminate


Provided are a resin composition that can realize a prepreg, a metal foil-clad laminate and the like high in light reflectance in an ultraviolet region and in a visible light region, small in the reduction in light reflectance due to a heating treatment and a light irradiation treatment, good in peel strength of metal foil, also excellent in heat resistance after moisture absorption, also good in outer appearance, and also excellent in preservation stability, and a prepreg, a metal foil-clad laminate and the like using the same. The resin composition of the present invention contains at least an epoxy-modified silicone compound (a), a branched imide resin (b) having an isocyanurate group and a carboxyl group, a phosphorus curing accelerator (c), titanium dioxide (d) and a dispersant (e).
Mitsubishi Gas Chemical Company, Inc.
02/26/15
20150056439
new patent

Shaped and coated metallic material, composite body produced by bonding shaped and coated metallic material to molded article of thermoplastic resin composition, and producing said composite body


The present invention relates to a shaped and coated metallic material which has excellent adhesion to a molded article of a thermoplastic resin composition and can be produced in a simple manner. The shaped and coated metallic material comprises a shaped metallic material and a coating film formed on the surface of the shaped metallic material.
Nisshin Steel Co., Ltd.
02/26/15
20150056438
new patent

Hollow silica particles, manufacturing the same, composition including the same and sheet with inner cavities


Disclosed are hollow silica particles having oil absorption ratio of at most 0.1 ml/g, porosity of hollow particles when mixed with a resin of at least 90%, and melting temperature of 130-200° c., and including a silicon compound having an organic group as a main component, and a composition including the hollow silica particles. A sheet including a base and a coating layer formed on the base and including a resin, and a method of manufacturing the same are provided.
Sukgyung At Co ., Ltd.
02/26/15
20150056434
new patent

Curable resin composition, film, laminated film, prepreg, laminate, cured article, and composite article


A curable resin composition containing an epoxy compound (a), active ester compound (b), filler (c), and alicyclic olefin polymer (d) containing an aromatic ring and/or hetero atom and not having reactivity to an epoxy group, wherein a ratio of content of said alicyclic olefin polymer (d) with respect to 100 parts by weight of said epoxy compound (a) is 1 to 50 parts by weight, is provided.. .
Zeon Corporation
02/26/15
20150056433
new patent

Bonding of composite materials


Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing.
Cytec Industries Inc.
02/26/15
20150056417
new patent

Adhesive sheet for image display device, manufacturing image display device, and image display device


A pressure-sensitive adhesive sheet 1 for an image display device, comprising a film-shaped pressure-sensitive adhesive layer 2 and a pair of base material layers 3 and 4 laminated so as to sandwich the adhesive layer 2, wherein outer edges 3a and 4a of the base material layers 3 and 4 project more outward than an outer edge 2a of the pressure-sensitive adhesive layer 2, and the pressure-sensitive adhesive layer 2 is formed from a pressure-sensitive adhesive resin composition comprising a structural unit derived from an alkyl (meth)acrylate in which the number of carbon atoms of an alkyl group is 4 to 18, and has a shear storage modulus at 25° c. Of 30 to 150 kpa..
Hitachi Chemical Company, Ltd.
02/26/15
20150056413
new patent

Optical sheet


The present invention relates to an optical sheet used in a liquid crystal display device, and relates to an optical sheet which comprises a resin curing layer made of a curable resin composition comprising metal oxide nanoparticles, and thus is easy to handle and not liable to be damaged from external shocks, and can prevent reduction in luminance due to damage and at the same time achieve a high refractive index.. .
Kolon Industries, Inc.
02/26/15
20150056405
new patent

Marble chip flooring material using pla resin


The present invention provides a pla flooring material comprising: a marble chip surface layer comprising a pla (poly lactic acid) resin; an adhesive layer and a plywood layer formed under the marble chip surface layer; and a surface treatment layer formed on the marble chip surface layer. In addition, the present invention provides a method for manufacturing a marble chip flooring material, comprising the steps of: preparing a marble chip surface layer comprising a pla resin; forming an adhesive layer and a plywood layer under the marble chip surface layer; and forming a surface treatment layer on the marble chip surface layer..
Lg Hausys, Ltd.
02/26/15
20150056398
new patent

Tire


A tire includes a circular tire frame formed from a resin material, in which the resin material has a tear strength of 10 n/mm or greater.. .
Bridgestone Corporation
02/26/15
20150056396
new patent

Fibre-reinforced composite moulding and manufacture thereof


The present invention provides a moulding material (100) comprising at least one dry fibrous reinforcement layer (102, 103) having a surface resin material (106) conjoined to a first surface thereo and a structural resin material (101) conjoined to a second surface thereof wherein the structural resin material is provided with a recess (107) which is free from resin and is located at the edge of the structural resin layer (101) and wherein the dry fibrous reinforcement layer (102, 103) provides a venting structure to allow entrapped air to pass out during processing. The material of the present invention can be used to form a composite which can be used as surface coating for large components such as wind turbines..
Gurit (uk) Ltd.
02/26/15
20150056394
new patent

Coating composition and anti-spatter coating formed therefrom


A coating composition for forming an anti-spatter coating on a substrate is disclosed. The coating composition comprises a ceramic precursor, a curing agent, and optionally a cross-linkable resin.
Nd Industries, Inc.
02/26/15
20150056393
new patent

Resin composition for fuel tubes, and fuel tube


A resin composition for fuel tubes includes an aromatic polyamide resin (a), an aliphatic polyamide resin (b), and an aminoethylated acrylic polymer (c), wherein a polyamide resin obtained by an amine-exchange reaction between (a) and (b) is contained, and at least one selected from the group consisting of the polyamide resin, (a), and (b) is bound to (c). The resin composition for fuel tubes can achieve both resistance to calcium chloride and fuel barrier properties at the same time and has excellent molding processability..
Sumitomo Riko Company Limited
02/26/15
20150056390
new patent

Surface-treated aluminum plate, organic-resin-coated surface -treated aluminum plate, can body and can lid formed by using the same


A surface-treated aluminum plate obtained by forming, on at least one surface of an aluminum plate, a conversion-coated layer that contains a polyester resin and a zirconium compound or a titanium compound. The surface-treated aluminum plate excellently adheres to an organic resin coating and can be used as a material for producing cans featuring excellent corrosion resistance and shock resistance..
Toyo Seikan Group Holdings, Ltd.
02/26/15
20150056376
new patent

Aqueous paint composition and manufacturing painted article


The first objective of the present invention is to provide an aqueous paint composition that can form a paint film with excellent smoothness, image clarity, adhesion and water resistance. This aqueous paint is characterized in comprising (a) an aqueous dispersion of an acrylic modified polyester resin, (b) a block polyisocyanate compound having a nonionic hydrophilic group, and (c) an aqueous dispersion of acrylic polymer fine particles..
Kansai Paint Co., Ltd.
02/26/15
20150056316
new patent

Apparatus for manufacturing eva sheet for solar cell sealant


The present invention relates to an apparatus for manufacturing an eva sheet for a solar cell sealant by uniformly arranging and melting heat adhesive resins, comprising: a powder supplying unit provided in the form of a container containing a heat-adhesive resin powder inside same and comprising a discharge outlet in the lower portion thereof; a powder-arranging roll which has a concave recess pattern on the surface thereof so as to contain the heat-adhesive resin powder and which is arranged so as to seal the discharge outlet; a circulation belt which circulates while passing through a lower portion of the powder-arranging roll; a heater unit which heats and melts the heat-adhesive resin powder applied onto the circulation belt; and a peel-off roll disposed at the rear end of the heater unit so as to separate the heat-adhesive resin powder sheet melted into a film from the circulation belt .. .
Lg Hausys, Ltd.
02/26/15
20150056278
new patent

Direct compression polymer tablet core


The present invention provides a tablet core which comprises at least about 95% by weight of an aliphatic amine polymer. The invention also provides a method of producing a tablet core comprising at least about 95% by weight of an aliphatic amine polymer resin the method comprises the step of compressing the aliphatic amine polymer to form the tablet core.
Genzyme Corporation
02/26/15
20150055318
new patent

Strobe light device


While maintaining weathering resistance, occurrence of whitening in the lens of the strobe light device is prevented and a color temperature of the emitted light required by the strobe light device is adjusted to fall into a preferable range. A lens of the strobe light device contains a base material and an ultraviolet absorber, and the base material is methacrylic resin.
Stanley Electric Co., Ltd.
02/26/15
20150055311
new patent

Electronic component with coil, manufacturing the same and power supply module


An electronic component includes a circuit board that includes a ground terminal connected to a ground potential, a coil component that is assembled on the circuit board, the coil component includes a t-shaped core and an air-core coil, a ground connection electrode that is assembled on the circuit board next to the coil component and that is connected to the ground terminal, and a mixture of a metal composite magnetic material and a resin that is formed on the circuit board and that covers the coil component and the ground connection electrode as a package. A part of the ground connection electrode is exposed outside the mixture..
Sumida Corporation
02/26/15
20150055033
new patent

Transparent electroconductive laminate


The purpose of the present invention is to provide a transparent electroconductive laminate having extremely high visibility. A transparent electroconductive laminate in which a hard coat layer, a color difference adjustment layer, and a transparent electroconductive layer are formed in this order, wherein (1) the hard coat layer being obtained by applying and curing a hard coating composition including (a) a phenol novolac-type acrylate having two or more acrylate groups and (b) an aromatic-group-containing mono- or poly(meth)acrylate compound having 1-2 moles of a c2 or c3 alkylene oxide structure in the molecule thereof, (2) and the color difference adjustment layer includes a cured resin component (i), and metal oxide particles (ii) having an average primary particle diameter of 100 nm or less and/or metal fluoride particles (iii); having an average primary particle diameter of 100 nm or less, where the total mass of particles (ii) and (iii) in the color difference adjustment layer is 0-200 parts by mass with respect to 100 parts by mass of the cured resin component (i)..
Teijin Limited,
02/26/15
20150054885
new patent

Ink jet textile printing method


An ink jet textile printing method includes applying a pretreatment liquid that contains a coagulant to a fabric, discharging a first ink composition from a first recording head to apply the first ink composition to the fabric, and discharging a second ink composition from a second recording head to apply the second ink composition to the fabric. The first ink composition contains water, pigment, and a cohesive resin.
Seiko Epson Corporation
02/26/15
20150054884
new patent

Ink composition, a preparing the ink composition and use thereof, a water soluble resin and use thereof in an ink composition


The invention relates to a latex ink composition, the latex ink composition comprising a water soluble resin. The invention further relates to a water soluble resin suitable for a latex ink composition, the water soluble resin comprising a backbone and a stabilizing group, wherein the stabilizing group is capable of forming hydrogen bonds.
Oce-technologies B.v.
02/26/15
20150054498
new patent

Magnetic sensor


The magnetic sensor of the invention comprises a base portion, a sensor chip positioned on the base portion, a wiring portion adapted to electrically connect a terminal of the sensor chip to a connecting lead, a resin having a low elastic modulus for coating at least the sensor chip, and a resin having a high elastic modulus for coating at least the low elastic-modulus resin and the wiring portion, wherein the sensor chip includes a magneto-resistive effect device, and the low elastic-modulus resin has an elastic modulus ranging from 10 kpa to 80 mpa while the high elastic-modulus resin has an elastic modulus of 1 gpa or more, and enables the sensor chip to perform well in a good state although having a structure of sealing up the sensor chip with the resin member.. .
Tdk Corporation
02/26/15
20150054409
new patent

Photo sensor package for lighting


Disclosed is a photo sensor package for lighting, which is configured such that a micro control unit having a lighting control function as well as a timer function is integrated with a remote control element receiving a remote control signal of a lighting fixture. The photo sensor package includes a housing molded using infrared transmissible resin, a remote control element configured to receive an infrared signal, an amplification element configured to amplify a signal that is output from the remote control element, and a micro control unit configured to control a lighting fixture in response to a signal that is output from the amplification element.
Raytron Co., Ltd
02/26/15
20150054365
new patent

Motor-driven compressor


A motor-driven compressor includes a metal housing accommodating a compression unit and an electric motor and a cover coupled to the housing. The cover and the housing define an accommodation chamber that accommodates a motor driving circuit that drives the electric motor.
Kabushiki Kaisha Toyota Jidoshokki
02/26/15
20150054196
new patent

Method for manufacturing laminated rotor core


A method for manufacturing a laminated rotor core comprises a first step of positioning and mounting a laminated core body 14 on a mounting table 17 of a carrying tray 16, a second step of positioning and arranging the laminated core body 14 mounted on a mounting table 17 on a lower die 28, the laminated core body 14 having permanent magnets 15 inserted into respective magnet insertion holes 11 and 12, and clamping the laminated core body 14 mounted on the mounting table 17 by an upper die 29 and a lower die 28, and a third step of pushing resin out of resin reservoir pots 42 provided in the lower die 28 and filling the respective corresponding magnet insertion holes 11 and 12 of the laminated core body 14 with the resin through resin passages 43 formed in the mounting table 17.. .
Mitsui High-tec, Inc.
02/26/15
20150054185
new patent

Method for producing wafer lens


Disclosed is a method for producing a wafer lens wherein a glass substrate is provided with a lens part which is made of a first curable resin. A sub-master molding part having a plurality of negative molding surfaces corresponding to the optical surface shape of the lens part is formed from a master having a plurality of positive molding surfaces corresponding to the optical surface shape of the lens part by using a second curable resin; a sub-master is formed by backing the sub-master molding part with a sub-master substrate; and the lens part is formed by filling the space between the sub-master and the glass substrate with the first curable resin and curing the resin therein.
02/26/15
20150054180
new patent

Resin composition for encapsulation and electronic device using the same


The present invention provides a resin composition for encapsulating electronic components that contains a phenol resin curing agent and an epoxy resin, in which either the phenol resin curing agent or the epoxy resin has a biphenyl structure; a resin composition for encapsulating electronic components that contains a phenol resin curing agent and an epoxy resin, in which a glass transition temperature of a cured material is equal to or higher than 200° c., and a weight reduction rate of the cured material is equal to or lower than 0.3%; and an electronic device that includes an electronic component encapsulated with the resin composition.. .
Sumitomo Bakelite Co., Ltd.
02/26/15
20150054154
new patent

Method and encapsulant for flip-chip assembly


A method of forming an assembly of a substrate and a flip-chip having solder balls thereon, the method having steps of: placing the flip chip with the solder balls in contact with the substrate to form a first interim assembly at a first predetermined temperature; providing an encapsulant to the first interim assembly to form a second interim assembly at a second predetermined temperature that is lower than a melting temperature of the solder balls and higher than the first predetermined temperature; and subjecting the second interim assembly to an environment of a third predetermined temperature that is sufficient to melt the solder balls. An encapsulant for use in forming an assembly of a substrate and a flip-chip having solder balls thereon, the encapsulant consisting essentially of: an epoxy resin; an anhydride curing agent; a fluxing agent having a hydroxyl (—oh) group; and an inorganic filler..
Chulalongkorn University
02/26/15
20150054146
new patent

Semiconductor device


A semiconductor device of the present invention includes a semiconductor element having an electrode pad; a substrate over which the semiconductor element is mounted and which has an electrical bonding part; and a bonding wire electrically connecting the electrode pad to the electrical bonding part, wherein a main metal component of the electrode pad is the same as or different from a main metal component of the bonding wire, and when the main metal component of the electrode pad is different from the main metal component of the bonding wire, a rate of interdiffusion of the main metal component of the bonding wire and the main metal component of the electrode pad at a junction of the bonding wire and the electrode pad under a post-curing temperature of an encapsulating resin is lower than that of interdiffusion of gold (au) and aluminum (al) at a junction of aluminum (al) and gold (au) under the post-curing temperature.. .
Sumitomo Bakelite Co., Ltd.
02/26/15
20150054137
new patent

Semiconductor device and manufacturing the same


A semiconductor device includes a semiconductor substrate having opposed main and back surfaces; first and second electrodes in a device region of the substrate, and spaced apart from each other; a metal film on the main surface and joined to the second electrode; an air gap between part of the main surface and the metal film, enveloping the first electrode, and having an opening; a cured resin closing the opening; a liquid repellent film increasing contact angle of the resin, relative to contact angles on the substrate and the metal film; a first metal film joined to the metal film, covering the metal film and the cured resin, and joined to an outer peripheral region of the substrate, at a periphery of the device region; and a second metal film on the back surface and connected to the first electrode through a via hole penetrating the substrate.. .
Mitsubishi Electric Corporation
02/26/15
20150054022
new patent

Semiconductor light emitting device and multiple lead frame for semiconductor light emitting device


A semiconductor light emitting device that is excellent in radiating heat and that can be molded into a sealing shape having intended optical characteristics by die molding is provided. The semiconductor light emitting device includes: a lead frame including a plate-like semiconductor light emitting element mounting portion having an led chip mounted on a main surface, and a plate-like metal wire connecting portion extending over a same plane as the semiconductor light emitting element mounting portion; a metal wire electrically connecting the led chip and the metal wire connecting portion; a thermosetting resin molded by die molding or dam-sheet molding so as to completely cover the led chip and the metal wire; and a resin portion provided to surround the lead frame and having the thickness not greater than the thickness of the lead frame..
Sharp Kabushiki Kaisha
02/26/15
20150054013
new patent

Light emitting device module


A light emitting device module including a first and second lead frames, a light emitting device electrically connected to the first and second lead frames, the light emitting device includes a light emitting structure having a first conduction type semiconductor layer, an active layer, and a second conduction type semiconductor layer, a resin layer surrounding the light emitting device, a psr (photo solder resist) layer disposed between the first and second lead frames and the second lead frame and a sidewall disposed at the peripheral area of the light emitting device and including an inclined plane formed on at least one side surface thereof.. .
Lg Innotek Co., Ltd.
02/26/15
20150054011
new patent

Light emitting device


According to one embodiment, a light emitting device includes a base, a light emitting element, a resin layer, a fluorescent material layer, and a lens layer. The base has an under surface, a top surface, and a side surface.
Kabushiki Kaisha Toshiba
02/26/15
20150054006
new patent

Method for manufacturing bonded body


A method of manufacturing joined body including: firstly, putting sheet material in intimate contact with first substrate to cover, with resin layer of sheet material, areas of first substrate including first area, boundary area surrounding first area, and second area located across from first area with respect to boundary area, sheet material being laminate including resin layer and separable layer, resin layer containing uncured sealing resin; secondly, curing sealing resin in part of resin layer covering boundary area; thirdly, removing, along with separable layer, part of resin layer covering second area in one direction from one end towards the other of two ends of second area; and fourthly, joining first substrate and second substrate together by arranging second substrate to face first substrate and curing sealing resin with parts of resin layer covering boundary area and first area located between second substrate and first substrate.. .
Panasonic Corporation
02/26/15
20150053993
new patent

Semiconductor light emitting device


A semiconductor light-emitting device includes a substrate, a semiconductor light-emitting element, and a transparent resin. The substrate is configured to have an opening portion.
Kabushiki Kaisha Toshiba
02/26/15
20150053952
new patent

Production joined body, and joined body


A method for manufacturing a joined body composed of a first substrate and a second substrate joined together by sealing resin material attached to a predetermined area of the first substrate includes: attaching a sheet material to the first substrate so as to cover the predetermined area, the sheet material including a sheet base material and the resin material provided on one main surface of the sheet base material; forming, after the attaching, in the sheet material, a slit by reducing a thickness of the resin material along an outline of the predetermined area; and separating, after the forming, part of the resin material inside the slit from the sheet base material to keep the part of the resin material inside the slit on the predetermined area of the first substrate and not to keep the rest of the resin material outside the slit on the first substrate.. .
Panasonic Corporation
02/26/15
20150053901
new patent

Fluorine-containing phosphate ester-amide, and flame retardant resin, flame retardant liquid and flame retardant solvent for organic synthesis containing same


[solution] a fluorine-containing phosphate ester-amide represented by general formula (1). (in the formula, r1 and r2 are the same or different and represent a branched or linear alkyl group having 1 to 20 carbon atoms in which at least one carbon bonded to a nitrogen atom is a secondary or tertiary carbon, wherein r1 and r2 may have a substituent group selected from the group consisting of an alkoxy group, a hydroxy group, an amino group, a methyl amino group, an ethyl amino group, a dimethyl amino group, diethyl amino group and a fluorine atom.
02/26/15
20150053900
new patent

Photosensitive resin composition for color filter, and color filter prepared using the same


Wherein z1 to z16 and m1 are the same as in the detailed description of the invention.. .
02/26/15
20150053664
new patent

Direct writing bus bars for screen printed resin-based conductive inks


A method for providing an electrical connection for conductive ink includes direct writing a bus bar onto areas of a desired electrical connection of the conductive ink. The conductive ink is screen printed onto a dielectric film to create a conductive circuit.
Goodrich Corporation
02/26/15
20150053662
new patent

Heating elements for aircraft heated floor panels


A method of forming a heating element includes depositing a conductive ink of silver particles in an epoxy resin on a dielectric film to create a conductive circuit, and heat curing the conductive circuit to achieve a resistivity of the heating element less than 1.68×10−6 ohm·meter. An aircraft heated floor panel includes at least one floor panel of an aircraft includes a conductive circuit positioned within the floor panel having a conductive ink of silver particles in an epoxy resin on a dielectric film..
Goodrich Corporation
02/26/15
20150053620
new patent

Water treatment


The present invention features compositions and methods for reducing the concentration of an endocrine disrupting agent in an aqueous solution. We describe compositions comprising various polymeric resins.
Temple University Of The Commonwealth System Of Higher Education
02/26/15
20150053601
new patent

Membrane module and process for producing same


The membrane module according to the present invention comprises a tubular case, and a membrane fixed with a resin and accommodated in the state where filtered water is capable of being taken out from at least one end of the tubular case, in the tubular case, wherein the resin has an elution rate of chloride ions per unit surface area and per unit time of less than 10 μg/(m2·hr) in an elution test using hot water.. .
Asahi Kasei Chemicals Corporation
02/26/15
20150053479
new patent

Wiring harness protection member and wiring harness


It is aimed to provide a wiring harness protection member and a wiring harness having good protection performance even when being used under high temperature and high humidity. A wiring harness 3 is formed by covering a wire bundle 4 with wiring harness protection members 2 obtained by molding nonwoven fabrics 1 made of mixed fibers containing 10 to 90 mass % of polypropylene resin fibers and 90 to 10 mass % of polyethylene terephthalate resin fibers into a predetermined shape..
Sumitomo Electric Industries, Ltd.
02/26/15
20150053470
new patent

Printed wiring board


A wiring board includes a first resin insulation layer, a conductive layer formed on the first insulation layer and including first and second conductive circuits formed adjacent to each other, and a second resin insulation layer formed on the first insulation layer and on the conductive layer such that the second insulation layer is filling a space between the first and second conductive circuits. The first and second conductive circuits are formed such that a distance between the first conductive circuit and the second conductive circuit is in a range of 10 μm or less at the first insulation layer, and each of the first and second conductive circuits has a bottom portion in contact with the first insulation layer and an upper portion on the bottom portion such that the upper portion has a roughened sidewall and the bottom portion has a sidewall which is not roughened..
Ibiden Co., Ltd.
02/26/15
20150053323
new patent

Tire


A tire including a circular tire frame formed of a resin material, and a metal reinforcing cord member wound on the outer circumference of the tire frame, wherein at least a portion of the metal reinforcing cord member is covered by a covering mixture including at least an olefin-based thermoplastic resin and a thermoplastic resin other than the olefin-based thermoplastic resin.. .
Bridgestone Corporation
02/26/15
20150053116
new patent

Infrared reflecting blue pigment, infrared reflecting green pigment, paint and resin composition using the infrared reflecting blue pigment, and paint and resin composition using the infrared reflecting green pigment


The present invention relates to an infrared reflecting blue pigment comprising a composite oxide comprising co, al and mg, wherein a content of mg in the blue pigment is 11 to 22% in terms of a molar ratio thereof based on whole metal element present in the blue pigment, and the blue pigment has a bet specific surface area of 10 to 100 m2/g; and an infrared reflecting green pigment comprising a composite oxide comprising co, al, mg and fe, wherein a content of mg in the green pigment is 11 to 22% in terms of a molar ratio thereof based on whole metal element present in the green pigment, a content of fe in the green pigment is 0.5 to 20% in terms of a molar ratio thereof based on whole metal element present in the green pigment, and the green pigment has an average particle diameter of 0.02 to 1.2 μm.. .
Toda Kogyo Corporation
02/26/15
20150053103
new patent

Method of developing a lithographic printing plate including post treatment


A method for producing a lithographic plate from a negative working, radiation imageable plate having an oleophilic resin coating that reacts to radiation by cross linking and is non-ionically adhered to a hydrophilic substrate. The steps include imagewise radiation exposing the coating to produce an imaged plate having partially reacted image areas at an initial double bond conversion rate including unreacted coating material, and completely unreacted nonimage areas; developing the plate by removing only the unreacted, nonimage areas from the substrate while retaining unreacted material in the image areas; and subjecting the upper surface of the plate to blanket post treatment energy, which further reacts the retained unreacted material in the image areas to increase the initial double bond conversion rate, producing a lithographic printing plate with enhanced durability..
Anocoil Corporation


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Resin topics: Carbon Dioxide, Homogeneous, Back Sheet, Impregnated, Nanoparticle, Carbonate Ion, Carbonic Anhydrase, Deionization, Bicarbonate, Organosiloxane, Surface Treatment, Fluoropolymer, Encapsulation, Display Panel, Semiconductor Device

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