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This page is updated frequently with new Resin-related patent applications. Subscribe to the Resin RSS feed to automatically get the update: related Resin RSS feeds. RSS updates for this page: Resin RSS RSS


Pattern-forming composition and pattern-forming method using the same

Electronics And Telecommunications Research Institute

Pattern-forming composition and pattern-forming method using the same

Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminate

Jx Nippon Mining & Metals

Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminate

Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminate

Zeon

Method of production of circuit board


Date/App# patent app List of recent Resin-related patents
08/20/15
20150237770 
 Electromagnetic shielding tube patent thumbnailElectromagnetic shielding tube
An electromagnetic shielding tube has a resin inner layer as the innermost layer, a resin outer layer as the outermost layer, and a metal metal-layer between the inner layer and the outer layer. The bonding strength between the outer layer and the metal layer is made weaker with respect to the bonding strength between the inner layer and the metal layer.
Furukawa Electric Co., Ltd.


08/20/15
20150237739 
 Pattern-forming composition and pattern-forming method using the same patent thumbnailPattern-forming composition and pattern-forming method using the same
The present invention relates to a pattern-forming composition used to form a conductive circuit pattern. The pattern-forming composition comprises cu powders, a solder for electrically coupling the cu powders, a polymer resin, a curing agent and a reductant.
Electronics And Telecommunications Research Institute


08/20/15
20150237737 
 Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminate patent thumbnailSurface treated copper foil and laminate using the same, printed wiring board, and copper clad laminate
A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided. The surface treated copper foil to be laminated on a polyimide having the following Δb (pi) of 50 or more and 65 or less before being laminated to the copper foil so as to form a copper clad laminate comprising a surface having a color difference Δe*ab of 50 or more based on jis z 8730 through the polyimide and a difference between the top average bt and the bottom average bb in a brightness curve extending from an edge of the copper foil to a portion without the copper foil Δb (Δb=bt−bb) of 40 or more, wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper foil through the polyimide laminated from the surface treated surface side with a ccd camera for the respective observation spots along the perpendicular direction of the extending direction of the observed copper foil..
Jx Nippon Mining & Metals Corporation


08/20/15
20150237736 
 Method of production of circuit board patent thumbnailMethod of production of circuit board
A method of production of a circuit board comprising a step of forming resist patterns 20 on a support 10 by a photoresist to obtain a support with resist patterns, a step of forming a curable resin composition layer 30 which is comprised of a curable resin composition on the resist patterns 20 of the support with resist patterns, a step of laying a substrate 40 on the curable resin composition layer 30, a step of making the curable resin composition which forms the curable resin composition layer 30 cure to make the curable resin composition layer 30 a cured resin layer 30a, a step of peeling off the support 10 from the curable resin composition layer 30 or the cured resin layer 30a and the resist patterns 20 before or after making the curable resin composition cure, a step of peeling off or dissolving the resist patterns 20 to remove the resist patterns 20 from the cured resin layer 30a so as to form a cured resin layer which has relief structures, and a step of forming fine wirings 50 by plating recesses of the relief structures which are formed at the cured resin layer 30a.. .
Zeon Corporation


08/20/15
20150237725 
 Anisotropic conductive film, connection method, and assembly patent thumbnailAnisotropic conductive film, connection method, and assembly
An anisotropic conductive film, which contains a crystalline resin, an amorphous resin, and conductive particles, wherein the anisotropic conductive film is an anisotropic conductive film configured to anisotropic conductively connect a terminal of a first electronic part and a terminal of a second electronic part, and wherein the crystalline resin contains a crystalline resin containing a bond characterizing a resin, which is identical to a bond characterizing a resin contained in the amorphous resin.. .
Dexerials Corporation


08/20/15
20150237712 
 Radio frequency module patent thumbnailRadio frequency module
A radio frequency module includes a plurality of insulating base material layers made of a thermoplastic resin defining a multilayer circuit board and including a cavity inside thereof, an ic chip disposed in the cavity and including a noise generation source, and planar ground conductive bodies provided in the multilayer circuit board. The planar ground conductive bodies are disposed on a layer not exposed to the inner surface of the cavity, and include inter-layer connection conductive bodies protruding in the direction of the noise generation source from the planar ground conductive bodies..
Murata Manufacturing Co., Ltd.


08/20/15
20150237245 
 Low profile camera module with image compensation patent thumbnailLow profile camera module with image compensation
A low-cost resin lens is disclosed for use in miniature cameras. The resin lens features a low profile that is particularly well-suited to consumer products such as smart phones.
Stmicroelectronics Pte Ltd.


08/20/15
20150236744 
 Protecting device for tablet computer patent thumbnailProtecting device for tablet computer
A protecting device with keys' functions is provided. The protecting device includes a triggering member, a printed circuit board, and plural curable resinic structures.
Primax Electronics Ltd.


08/20/15
20150236387 
 Electrical storage module patent thumbnailElectrical storage module
An electricity storage module includes a stack, holder members, and heat-transfer plate members. The stack is formed by stacking power storage elements having lead terminals protruding outward from end portions.
Sumitomo Electric Industries, Ltd.


08/20/15
20150236369 
 Prismatic secondary battery patent thumbnailPrismatic secondary battery
A prismatic secondary battery includes: an electrode group including electrodes formed of positive electrodes and negative electrodes each having an active material layer coated on a surface of a metallic foil, the electrodes formed of positive and negative electrodes are flatly wound together with a separator intervening with the positive and negative electrodes, the positive and negative electrodes being each formed with a metallic foil exposed section at one end in a direction of a winding axis l; and connection plates that electrically connect the electrode group and electrode terminals. The metallic foil exposed sections of the electrode group and the connection plates are press-joined.
Hitachi Automotive Systems, Ltd.


08/20/15
20150236323 

Separator for non-aqueous secondary battery, manufacturing the same, and non-aqueous secondary battery


The present invention provides a separator for a non-aqueous secondary battery including a porous substrate and an adhesive layer that is formed on one side or both sides of the porous substrate and is an aggregate layer of particles that include a polyvinylidene fluoride resin, the adhesive layer further including a filler that includes at least one of an organic compound or an inorganic compound, the content of the filler being from 20% by mass to 80% by mass, with respect to the total mass of the mass of the particles and the mass of the filler, and the content of the particles per one adhesive layer being from 0.1 g/m2 to 6.0 g/m2.. .
Teijin Limited


08/20/15
20150236237 

Elastic wave device manufacturing method and elastic wave device


Functional element units and a connection line electrically connecting the functional element units are formed on one principal surface of a piezoelectric motherboard. A resin support layer enclosing the functional element units is formed on the one principal surface of the motherboard.
Murata Manufacturing Co., Ltd.


08/20/15
20150236233 

Electronic component package and manufacturing same


A method for manufacturing an electronic component package comprises: (i) preparing a metal foil having opposed principal surface “a” for placement of an electronic component and principal surface “b”, and a through-hole located in an electronic component-placement region of the principal surface “a”; (ii) placing the electronic component on the metal foil such that the electronic component is positioned in the electronic component-placement region, and an opening of the through-hole is capped with an electrode of the electronic component; (iii) forming a sealing resin layer on the principal surface “a” such that the electronic component is covered with the sealing resin layer; and (iv) forming a metal plating layer on the principal surface “b”. A dry plating process and a subsequent wet plating process are performed to form the metal plating layer in the (iv) such that the through-hole is filled with the metal plating layer, and the metal foil and the metal plating layer are integrated with each other..
Panasonic Intellectual Property Management Co., Ltd.


08/20/15
20150236230 

Light-emitting device and process for manufacturing the same


A light-emitting device includes a support including a substrate, a pair of electrodes and an insulating reflective member, the pair of electrodes being disposed on an upper surface of the substrate, and the reflective member being disposed on the substrate, a light-emitting element flip-chip mounted on the pair of electrodes, and a resin member disposed at least between the light-emitting element and the reflective member, the resin member including a conductive substance which electrically connects the light-emitting element to the pair of electrodes, the reflective member being disposed at least over an entirety of a surface that is located immediately below the resin member.. .
Nichia Corporation


08/20/15
20150236218 

Led module


An led module includes: an led chip; and a resin case having a reflective surface surrounding the led chip. An area contact inhibitor to inhibit area contact with an adjacent led module is formed on an outer surface of the resin case..
Rohm Co., Ltd.


08/20/15
20150236184 

Cooling sheet for photovoltaic modules, manufacturing the same and photovoltaic modules including the same


A cooling sheet for photovoltaic modules, a method of manufacturing the same, a backsheet for photovoltaic modules, a method of manufacturing the same, and a photovoltaic module are provided. The cooling sheet for photovoltaic modules which includes a resin layer can be prepared by coating or impregnating one surface of a porous substrate with a super-absorbent polymer (sap) containing a fluid.
Lg Chem, Ltd.


08/20/15
20150236056 

Array substrate and fabricating the same, and display device


The present invention discloses an array substrate and a manufacturing method for the same, and a display device. By adopting the manufacturing method for the array substrate provided by the embodiments of the present invention, via holes with relatively small hole sizes in a color resin layer are realized, so that the aperture ratio of pixels is improved.
Boe Technology Group Co., Ltd.


08/20/15
20150236003 

Method of manufacturing semiconductor device


A method of manufacturing a semiconductor device obtained by laminating a first semiconductor chip and a second semiconductor chip with different planar sizes when seen in a plan view on a wiring board via an adhesive material, in which the second semiconductor chip with a relatively larger planar size is mounted on the first semiconductor chip with a relatively smaller planar size. Also, after the first and second semiconductor chips are mounted, the first and second semiconductor chips are sealed with resin.
Renesas Electronics Corporation


08/20/15
20150235987 

Method of manufacturing semiconductor device


A non-leaded semiconductor device comprises a sealing body for sealing a semiconductor chip, a tab in the interior of the sealing body, suspension leads for supporting the tab, leads having respective surfaces exposed to outer edge portions of a back surface of the sealing body, and wires connecting pads formed on the semiconductor chip and the leads. End portions of the suspension leads positioned in an outer periphery portion of the sealing body are unexposed to the back surface of the sealing body, but are covered with the sealing body.
Renesas Electronics Corporation


08/20/15
20150235980 

Method for mounting semiconductor sensor device


A sensor apparatus includes a semiconductor sensor device including a first attachment surface, a base part being wire-bonded to the semiconductor sensor device and including a second attachment surface, and a spacer being interposed between the first and second attachment surfaces and having a target attachment surface to which at least one of the first and second attachment surfaces is adhered via a die-bond resin. A total area of the target attachment surface is smaller than a total area of the first attachment surface..
Mitsumi Electric Co., Ltd.


08/20/15
20150235966 

Wiring board and semiconductor device using the same


A wiring board of an embodiment includes an insulating substrate and a wiring layer provided on the insulating substrate. The wiring layer has external connection terminals including a ground terminal.
Kabushiki Kaisha Toshiba


08/20/15
20150235965 

Semiconductor device manufacturing method


A method of manufacturing a semiconductor device, includes the steps of passing a control terminal through an opening of a resin case to partially expose the control terminal and covering a patterned insulating substrate with the resin case; inserting a resin block in the opening of the resin case; fitting a convex step portion formed on a side surface of the resin block into a valley formed between two projections of the control terminal; fitting a projection formed on the side surface of the resin block into a concave portion formed on a sidewall of the opening of the resin case; and fitting a projection formed on a bottom surface of the resin block into a concave portion formed in a beam portion at a bottom portion of the opening of the resin case to position and fix the control terminal.. .
Fuji Electric Co., Ltd.


08/20/15
20150235955 

Line structure and a producing the same


A multi-layer line structure including a substrate, a lower layer cu line located on the substrate, an upper layer cu line located on an insulating layer including an inorganic film located on the lower layer cu line and an organic resin film located on the inorganic film, and a via connection part located in a via connection hole running in an up-down direction through the insulating layer in an area where the lower layer cu line and the upper layer cu line overlap each other is provided. The via connection part includes a barrier conductive layer located on a part of the lower layer cu line exposed to a bottom part of the via connection hole and on an inner wall of the via connection hole..
Dai Nippon Printing Co., Ltd.


08/20/15
20150235937 

Method for manufacturing semiconductor device using mold having resin dam and semiconductor device


The suppression of resin leakage is combined with the suppression of damage to the functional wiring area of a wiring board in forming an encapsulation resin. A method for manufacturing a semiconductor device includes the step of clamping a wiring board with a first mold and a second mold.
Renesas Electronics Corporation


08/20/15
20150235931 

Semiconductor device


A semiconductor device includes a semiconductor chip, a plurality of passive electronic components, a substrate, a main lead, and a sealing resin. The semiconductor chip includes a functional circuit.
Rohm Co., Ltd.


08/20/15
20150235928 

Encapsulated semiconductor device and manufacturing the same


An encapsulated semiconductor device includes: a first conduction path formative plate; a second conduction path formative plate joined to the first conduction path formative plate; a power element bonded to the first conduction path formative plate; a heatsink held by the first conduction path formative plate with an insulation sheet interposed between the heatsink and the first conduction path formative plate; and an encapsulation resin configured to encapsulate the first and second conduction path formative plates. A through hole or a lead gap is formed in a region of the first conduction path formative plate in contact with the insulation sheet.
Panasonic Intellectual Property Management Co., Ltd.


08/20/15
20150235872 

Curable silicone composition, producing semiconductor device, and semiconductor device


The present invention relates to a curable silicone composition comprising: (a) an organopolysiloxane composed of: (a-1) a linear organopolysiloxane having at least two silicon-bonded alkenyl groups in a molecule, and (a-2) a resin-like organopolysiloxane including 1.5 to 5.0% by weight alkenyl groups; (b) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (c) a linear dialkyl polysiloxane having a viscosity at 25° c. Of 2 to 10 mm2/s and having alkenyl groups capping both molecular chain terminals; and (d) a hydrosilylation reaction catalyst.
Dow Corning Toray Co., Ltd.


08/20/15
20150235871 

Vacuum laminating manufacturing semiconductor apparatus


A vacuum laminating apparatus for use in manufacturing a semiconductor apparatus, including a frame mechanism to surround at least a side face of a support-base attached encapsulant including a thermosetting resin layer stacked as an encapsulant on a support base, the frame mechanism including a holding unit to hold a substrate on which semiconductor devices are mounted or a wafer on which semiconductor devices are formed with the substrate or the wafer facing and spaced apart from the thermosetting resin layer of the support-base attached encapsulant, the vacuum laminating apparatus capable of vacuum laminating the support-base attached encapsulant surrounded by the frame mechanism together with the substrate or wafer. The vacuum laminating apparatus inhibit the occurrence of voids in resin layer and warp of a substrate or wafer and manufacture a semiconductor apparatus having a precisely formed resin layer, even when the substrate or wafer used has a large area..
Shin-etsu Chemical Co., Ltd.


08/20/15
20150235845 

Method of manufacturing semiconductor device


According to one embodiment, a method of manufacturing a semiconductor device, includes preparing a semiconductor substrate includes a connection pad to electrically connect to a circuit element formed on a main surface, or a rewiring line connected to the connection pad, forming an insulating photosensitive resin film on the substrate with the exclusion of at least an edge portion of the substrate by inkjet, patterning the photosensitive resin film by photolithography, and forming a rewiring line, ubm or an electrode for external connection on the substrate on which the patterned photosensitive resin film is formed.. .
Tera Probe, Inc.


08/20/15
20150235765 

Inductor manufacturing method


An inductor manufacturing method includes a first step of press bonding a cu foil onto a non-magnetic resin sheet, a second step of forming a conductor pattern by performing etching on the cu foil, a third step of press bonding another non-magnetic resin sheet onto the conductor pattern, and a via conductor formation step of forming a via conductor that penetrates through the other resin sheet and leads to the conductor pattern. The method further includes a step of forming a body in which resin having magnetism is provided outside of a coil, by press bonding magnetic-powder-containing resin sheets onto a multilayer body, obtained by a manufacturing method including the first to third steps and the via conductor formation step, and then thermally curing the magnetic-powder-containing resin sheets..
Murata Manufacturing Co., Ltd.


08/20/15
20150235740 

Noise suppression cable


A noise suppression cable includes an insulated wire, an internal magnetic tape layer including a resin layer and a magnetic material layer formed on one surface of the resin layer, the internal magnetic tape layer being spirally wound on a periphery of the insulated wire in a first direction along a longitudinal direction of the cable so as to allow the magnetic material layer of the internal magnetic tape layer to face outside, and an external magnetic tape layer including a resin layer and a magnetic material layer formed on one surface of the resin layer, the external magnetic tape layer being spirally wound on a periphery of the internal magnetic tape layer in a second direction different from the first direction along the longitudinal direction of the cable so as to allow the magnetic material layer of the external magnetic tape layer to face inside.. .
Hitachi Metals, Ltd.


08/20/15
20150235736 

Insulated wire and electric or electronic equipment


An insulated wire having a conductor, and a multilayer insulating layer composed of two or more layers coating the conductor, wherein the innermost insulating layer of the multilayer insulating layer is an insulating layer formed of a crystalline thermoplastic resin having a storage elastic modulus of 10 mpa or more at 300° c. And outer insulating layer(s) other than the innermost insulating layer include(s) an insulating layer formed of a crystalline thermoplastic resin having a melting point of 260° c.
Furukawa Electric Co., Ltd.


08/20/15
20150235732 

Plastic molded product comprising copper-based compound microparticles and preparation method therefor


Molded plastic products having fine particles of copper-based compound with relatively low price, simple process and good economic feasibility and productivity, and method of manufacturing the products are provided. A chemical structure of the molded plastic products is cuxmy, wherein m is any one selected from groups 15 to 17 of the periodic table, x/y is 0.5-1.5.
Bs Support Co., Ltd.


08/20/15
20150234494 

Non-overlapped integral capacitive touch screen with ito (indium tin oxide) layer and manufacturing method thereof


Disclosed are a non-overlapped integral capacitive touch screen with an ito (indium tin oxide) layer and the manufacturing method thereof. The non-overlapped integral capacitive touch screen with the ito layer comprises a transparent substrate, and a silicon dioxide layer, a niobium pentoxide layer, a black resin layer, ito electrodes and an insulating layer sequentially laminated on the transparent substrate.
Shenzhen Baoming Technology Ltd.


08/20/15
20150234331 

Belt member, fixing device, and image forming apparatus including the same


Provided is a belt member used in a fixing device of an electromagnetic induction heating system. The belt member includes an endless resin base layer, heat layers, and an insulating resin layer.
Kyocera Document Solutions Inc.


08/20/15
20150234306 

Toner for electrostatic charge image development and manufacturing the same


The toner for electrostatic charge image development includes toner particles containing a binder resin, a colorant, and a releasing agent, in which the binder resin contains at least an amorphous resin and an urethane modified crystalline resin including a crystalline polymer segment and an urethane polymer segment bound to each other, the urethane modified crystalline resin being non-compatible with the amorphous resin, and the amount of ionic dissociating group of the urethane modified crystalline resin is 5 to 20 mgkoh/g.. .

08/20/15
20150234305 

Polyester resin for toner, toner for electrostatic charge image development, and toner cartridge


There is provided a polyester resin for a toner, which is a polycondensate of (a) a polycarboxylic acid component and a polyol component including (b) polyol represented by the specific general formula and (c) a chain-like aliphatic polyol, wherein the total amount of (b) the polyol represented by the specific general formula and (c) the chain-like aliphatic polyol is 60 mol % to 100 mol % in the entire alcohol components, and the molar ratio ((b)/(c)) of (b) the polyol represented by the specific general formula to (c) the chain-like aliphatic polyol is 0.1 to 1.0.. .
Fuji Xerox Co., Ltd.


08/20/15
20150234304 

Toner, developer, and image forming apparatus


A toner including a crystalline resin wherein the crystalline resin contains a crystalline resin having a urethane bond, a urea bond or both thereof, and wherein the crystalline resin has an average crystallite diameter of 20 nm to 70 nm.. .
Ricoh Company, Ltd.


08/20/15
20150234303 

Toner and developer


A toner is provided. The toner includes a binder resin and a release agent.

08/20/15
20150234302 

Toner, image forming apparatus, image forming method, process cartridge, and two-component developer


To provide a toner, which contains: a colorant; a resin; and a releasing agent, wherein a spin-spin relaxation time (t2s) originated from a soft component is 0.10 msec to 0.50 msec, where the soft component is obtained with a hard component from an echo signal of the toner by a solid-echo technique of pulsed nmr, and a proportion of a proton intensity of the soft component is 50.0% or lower.. .

08/20/15
20150234274 

Resist top-coat composition and patterning process


There are provided a top coat composition and a patterning process using that composition, which reduce the effect of contaminants in the surrounding atmosphere on the resist film in absorbing oob light and in reducing film loss of the resist pattern and bridging between patterns, and also enhances the sensitivity of the resist film and suppresses the emission of outgas from the resist film. The resist top coat composition of the present invention is formed on a photoresist film formed on a wafer, and is used in a patterning process performed by lithography in which, after exposure, developing is performed.

08/20/15
20150234273 

Negative photosensitive resin composition, cured resin film, partition walls and optical element


A negative photosensitive resin composition comprising an alkali-soluble resin or alkali-soluble monomer (a) having an ethylenic double bond, a photopolymerization initiator (b), a thiol compound (c) having at least 3 mercapto groups in one molecule, and an ink repellent agent (d), a cured resin film and partition walls formed by using the negative photosensitive resin composition, and an optical element having the partition walls located between a plurality of dots and their adjacent dots on a substrate surface.. .

08/20/15
20150234257 

Blade-driving device, optical device, and producing arm


A blade-driving device includes: a board including an opening; a blade opening and closing the opening; an arm driving the blade and made of a synthetic resin; a drive member driving the arm; and a reinforcement member formed with a laser welding mark indicating a mark formed by laser welding the reinforcement member and the arm together, and made of a synthetic resin.. .
Seiko Precision Inc.


08/20/15
20150234256 

Focal-plane shutter and optical device


A focal-plane shutter includes: first, second, and third boards each including an opening and arranged in an optical axis direction passing through the openings; a first blade arranged between the first and second boards and capable of opening and closing the openings; a second blade arranged between the second and third boards and capable of opening and closing the openings; first and second arms arranged between the second and third boards, connected to the second blade, made of synthetic resins, and capable of rotating about respective different fulcrums; and a drive member connected to the first arm and driving the first arm.. .
Seiko Precision Inc.


08/20/15
20150234226 

Display device and television receiver device


A liquid crystal display device includes a backlight device; a liquid crystal panel; a chassis which is made of metal and further includes a chassis plate part, and chassis side-plates; a bezel which is made of metal and further includes a bezel frame-shaped part, and a bezel tube-shaped part; a front-side cabinet which configures an exterior appearance of the liquid crystal display device, is made of a resin, covers the bezel, and further includes an exterior frame shaped part, and an exterior tube-shaped part; positioning sections which are disposed in a form of protruding from the exterior frame-shaped part toward the chassis side, and which position the liquid crystal panel in a display face direction; and contact sections which are positioned in opposition to the positioning sections side with respect to each of the bezel tube-shaped part and the side-plates, and which make contact with both the side-plates and the exterior tube-shaped part.. .
Sharp Kabushiki Kaisha


08/20/15
20150234210 

Colored polarizing films, colored polarizing sheets, and colored polarizing lenses, and methods thereof


A polarizing film is produced by swelling a polyvinyl alcohol film with water, uniaxially stretching it, dyeing it with an organic dichroic dye, and drying it, wherein a dichroic organic dye composition includes a combination of organic dyes having a dichroic ratio of 13 or higher used in an amount to keep the degree of polarization at 90% or more, and wherein the coloration dye composition comprises a combination of dyes having extremely low dichroic ratios of 4 or less or substantially having no dichroic ratio, laminating at least one layer of a transparent plastic sheet onto at least both sides of the polarizing film, curving the polarizing sheet so as to impart spherical or aspherical surfaces thereto to obtain a polarizing and injecting a transparent resin to the concave surface of the curved polarizing sheet to obtain an injection polarizing lens.. .
Mgc Filsheet Co., Ltd.


08/20/15
20150234197 

Wavelength selective polarizer, optical system, and projection-type display apparatus


A wavelength selective polarizer includes a substrate that is transparent to light in a visible wavelength band, and an absorption layer configured of a resin composition in which color materials are dispersed and formed on the substrate. The absorption layer includes a plurality of structures that are structured similarly to one another, the plurality of structures being arranged in a predetermined direction with a period shorter than a shortest wavelength in the visible wavelength band.
Canon Kabushiki Kaisha


08/20/15
20150234140 

Optical fiber ribbon


An optical fiber ribbon according to the present invention includes a collective coating layer containing an ultraviolet curable resin containing amorphous ppg and an amorphous monomer, the collective coating layer formed around coated optical fibers. The collective coating layer has an equilibrium elastic modulus of 12 mpa to 20 mpa, both inclusive, and a yield point elongation of 5% to 9%, both inclusive, and the adhesion between the collective coating layer and the outermost layers of the coated optical fibers is 12 n/cm to 15 n/cm, both inclusive..
Furukawa Electric Co., Ltd.


08/20/15
20150234107 

Method for producing retardation film


A method for producing a retardation film comprising the steps of: co-extruding or simultaneously casting a thermoplastic resin a and a thermoplastic resin b to obtain a laminated film comprising a layer of the thermoplastic resin a and a layer of the thermoplastic resin b; and uniaxially stretching the laminated film at least twice to cross a molecular orientation axis in the layer of the thermoplastic resin a and a molecular orientation axis in the layer of the thermoplastic resin b each other at almost right angles.. .
Zeon Corporation


08/20/15
20150233934 

Color-encoding and in-situ interrogation of matrix-coupled chemical compounds


A method and apparatus for the physico-chemical encoding of a collection of beaded resin (“beads”) to determine the chemical identity of bead-anchored compounds by in-situ interrogation of individual beads. The present invention provides method and apparatus to implement color-coding strategies in applications and including the ultrahigh-throughput screening of bead-based combinatorial compounds libraries as well as multiplexed diagnostic and environmental testing and other biochemical assays..
Rutgers, The State University Of New Jersey


08/20/15
20150233876 

Method for producing a chromatography-enrichment column


The invention concerns a method for producing a chromatography-enrichment column, the method comprising the following steps: (a) depositing at least one layer of desired particles, which may be identical or different, and are intended to constitute the stationary phase, in a compact assembly, on the flat surface of a substrate; (b) crosslinking the layer in at least the regions corresponding to the desired shape of the enrichment column to be obtained; (c) impregnating the layer with a light radiation-sensitive material; (d) insolating the layer obtained in step (c) so as to form insolated regions of which the shape corresponds to the desired internal shape of the enrichment column, if the light radiation-sensitive material behaves like a positive resin or to form non-insolated regions of which the shape corresponds to the desired internal shape of the enrichment column if the light radiation-sensitive material behaves like negative resin; and (e) eliminating the light radiation-sensitive material in the zones corresponding to the internal shape of the enrichment column. The invention is used in particular in the field of chemical analysis..
Commissariat A L'energie Atomique Et Aux Energies Alternatives


08/20/15
20150233865 

Method for manufacturing chip comprising microchannel and chip


A method for manufacturing a chip that includes a microchannel is described, wherein the method includes the steps of: fixing a cationic polymer having a quaternary onium group to at least one surface of each of a pair of resin substrates; and joining the resin substrates together on the surfaces on which the cationic polymer has been fixed.. .
Arkray, Inc.


08/20/15
20150233652 

Heat exchanger


A heat exchanger includes tubes and a header tank. The tubes are arranged in parallel with each other, and fluid flows in the tubes.
Denso Corporation


08/20/15
20150233495 

Vibration-proof clamp


A vibration-proof clamp includes a clamp body made of hard resin having a holding part and a stud engaging part, and a rubber member that covers the holding part. The holding part has a curved wall for holding an elongated element from below and at least one elastic holding member that extends slanting downward towards a holding space.
Newfrey Llc


08/20/15
20150233331 

Sealing device


A sealing device (100) includes a resinous sealing ring (110) and an elastomeric elastic ring (120) in an annular groove 210. The sealing ring (110) has a cylindrical surface portion (112a) making intimate contact with a groove bottom of the annular groove (210) and an inclined surface portion (112b) expanding in diameter toward the atmosphere side (a).
Nok Corporation


08/20/15
20150233158 

Motor vehicle door latch device


A motor vehicle door latch device which comprises a body, a latch and a pawl. The pawl engages with the latch to prevent the latch from turning.
Mitsui Kinzoku Act Corporation


08/20/15
20150233119 

Bent reinforcement rod having improved mechanical strength at the bending point thereof, and producing same


The invention relates to a bent rod having improved mechanical strength at the bending point thereof, characterized in that it is made from a bundle of twisted fibers that are secured together using a binder matrix preferably consisting of a thermosetting resin. The invention also relates to a method and device for producing said rod..
Pultrall Inc.


08/20/15
20150233030 

Meltblown nonwoven fabric and uses thereof


A meltblown nonwoven fabric is provided having thermoplastic resin fibers having an average fiber diameter of 0.1 to 10 μm, a bulk density of not more than 36 kg/m3 and an air permeability, as measured by a frazier type method at basis weight of 200 g/m2, of 3 to 100 cc/cm2/sec. The meltblown nonwoven fabric has a low bulk density and is excellent in sound absorption performance, oil adsorption performance, heat insulation performance, dust collection performance and filtration performance.
Mitsui Chemicals, Inc.


08/20/15
20150233028 

Fabric for carbon fiber reinforced composite material and manufacturing the same


A method of manufacturing a fabric for a carbon fiber reinforced composite material according to the present invention binds a front texture 11 woven with warp threads and weft threads which are carbon fibers and a back texture 12 woven with warp threads and weft threads which are thermoplastic resin fibers at binding points 9 to integrate the front texture 11 and the back texture 12.. .
Ayaha Corporation


08/20/15
20150232778 

Grease composition for electric power steering device, and electric power steering device


Provided are both a grease composition for an electric power steering device and an electric power steering device. The grease composition can keep a sufficiently low coefficient of friction in a sliding area between a steel and a resin over a long period, is less susceptible to being removed from the sliding area, does not cause break down of an oil film, and thus can minimize the occurrence of stick-slips.
Hitachi Automotive Systems Steering, Ltd.


08/20/15
20150232731 

Hybrid-filled epoxy molding compositions


A hybrid-filled, electrically insulating composition includes a resinous matrix comprising 56 to 65 volume percent of the total composition and a particulate dispersed phase comprising essentially the balance of the total composition. The dispersed phase includes a first ceramic component such as aln, bn, or beo and a second ceramic component such as mgo, al2o3, sio2, a polycrystalline alumino-silicate, and/or a metal.
Ut-battelle, Llc


08/20/15
20150232722 

Two-component polyurethane compositions, in particular suitable for use as tough structural adhesives or as potting compounds


The invention concerns two-component polyurethane compositions of a polyol component and a polyisocyanate component, the polyol component including at least one reaction product of castor oil and ketone resins with an oh number of 110 to 200 mg koh/g, and at least one aliphatic triol, and the polyisocyanate component including at least one aromatic polyisocyanate, the ratio in weight percent of being between 4 and 50 and the ratio of all nco groups of the aromatic polyisocyanates to all the oh groups totaling (a1+a2)=1.15:1-85:1, the aliphatic triol being—1,2,3-propane triol and/or—1,1,1-trimethylol propane and/or polyether polyols based on 1,1,1-trimethylol propane with a molecular weight of 170-500 g/mol and an oh-number of 400-1100 mg koh/g, and the total of all the oh groups of (a1+a2) being ≧90% of the total of all the oh groups of the two-component polyurethane composition.. .
Sika Technology Ag


08/20/15
20150232719 

Reaction resin composition and use thereof


A reaction resin composition that can be used for the chemical fastening of anchoring means in boreholes and for construction gluing is described. The composition includes (a) a resin component, which contains at least one radically hardenable compound and at least one epoxy resin, which contains, on average, more than one epoxy group per molecule, and a (b) hardener component, which contains a hardening agent for at least one radical compound and at least one amine.
Hilti Aktiengesellschaft


08/20/15
20150232717 

Uv resistant epoxy structural adhesive


The present disclosure relates to uv resistant multi-component structural adhesive systems that are substantially free of aromatic epoxy resins, also provided are methods of preparing the multi-component structural adhesive systems and methods of bonding substrates together with such adhesive systems.. .
Huntsman Advanced Materials Americas Llc


08/20/15
20150232714 

Gas-generating material and micropump


Provided is a gas-generating material which exhibits a high adhesive property to a member to be adhered and which makes it possible to generate a gas in a large amount per unit time even when the gas-generating material contains a silane coupling agent. The gas-generating material according to the present invention contains: a binder resin; a gas-generating agent which is an azo compound or an azide compound; and a silane coupling agent having an amino group..
Sekisui Chemical Co., Ltd.


08/20/15
20150232713 

Adhesive agent having adhesive blend of acrylate and styrene block copolymer


The present invention relates to a carrier-based bonding adhesive agent, which is equipped for bonding adhesion on one or both sides or a carrier-free bonding adhesive agent, in the form of an adhesive strip or stamped part having a bonding adhesive consisting substantially of a blend of polyacrylate and a synthetic rubber as well as one or more adhesive resins. By comparison with previously known adhesive systems such an adhesive exhibits a significant improvement in adhesion on hard, non-polar surfaces such as for example new paint surfaces in the automobile industry..
Lohmann Gmbh & Co. Kg


08/20/15
20150232710 

Prepolymer impact resistor for crack-resistant adhesives for windmills


A composition is described which includes a) a chain-extended prepolymer, which can be obtained from the reaction of a) a polymer containing at least one amino, thiol or hydroxyl group, b) at least one polyisocyanate and c) at least one alkoxylated bisphenol as chain extender, and optionally d) an epoxide compound containing a primary or secondary hydroxy group, said compound containing a primary or secondary hydroxyl group, or at least one epoxy resin a which contains this epoxide compound, and optionally b) an epoxy resin b. The composition is suitable as a toughener or as an a component of a 2k epoxy resin adhesive which contains this toughener.
Sika Technology Ag


08/20/15
20150232708 

Pressure sensitive adhesive waxed cloth tape manufacture and use


A method of manufacturing a pressure sensitive adhesive waxed cloth tape comprising a fabric substrate having an adhesive layer infused on one surface and a wax layer infused on an opposing second surface, the wax layer including a tackifier resin. The pressure sensitive adhesive waxed cloth tape may be used to prevent buildup of snow and ice on a hockey stick blade during exposure to moisture, cold temperatures, snow, ice, and other harsh conditions.

08/20/15
20150232693 

Process for forming multilayer coating film


An object to be attained by the present invention is to provide a method for forming a multilayer coating film having excellent smoothness, distinctness of image, water resistance, adhesion, and popping resistance; moreover, the multilayer coating film has excellent water resistance and adhesion, even when the coating compositions are applied after being stored for a fixed period of time. The present invention provides a method for forming a multilayer coating film comprising applying an aqueous first colored coating composition and a second colored coating composition to a substrate in this order, and heating to simultaneously cure the aqueous first colored coating film and the second colored coating film, wherein the aqueous first colored coating composition comprises an acrylic modified polyester resin and a blocked polyisocyanate compound having a specific blocked isocyanate group..
Kansai Paint Co., Ltd.


08/20/15
20150232691 

Blocked bio-based carboxylic acids and their use in thermosetting materials


This invention relates to bio-based polyfunctional carboxylic acids reacted with vinyl ether compounds to form liquid vinyl-blocked bio-based polyfunctional carboxylic acids. These liquid vinyl-blocked bio-based polyfunctional carboxylic acids can be mixed with a polyfunctional vegetable oil-based epoxy resin to form a homogeneous curable coating composition.
Ndsu Research Foundation


08/20/15
20150232687 

Uv/eb curable biobased coating for flooring application


A coating composition and a floor product are disclosed. The coating composition has a biobased component that includes urethane acrylate, vinyl ether, or polyester acrylate.
Awl Licensing Company


08/20/15
20150232681 

Hydrophilic surface treatment agent for aluminum-containing metal heat exchangers having excellent drainage


A hydrophilic surface treatment agent for an aluminum-containing metallic heat exchanger, which is obtained by mixing: a water-soluble resin (a) having at least one or more functional groups of an amide group, a hydroxyl group, and a carboxyl group, or a water-soluble resin (a) including, in a skeleton thereof, an amide linkage; colloidal silica (b); organo alkoxy silane and/or a hydrolysate thereof (c); a cross-linking agent (d) capable of forming cross-linkage with the water-soluble resin (a); and water (e), wherein the ratio {(b)+(c)}/{(a)+(b)+(c)+(d)} is 0.1 to 0.5 in terms of solid content ratio (mass ratio), and the ratio (c)/(b) is 0.5 to 4.0 in terms of solid content ratio (mass ratio).. .
Nihon Parkerizing Co., Ltd.


08/20/15
20150232679 

Ink set for inkjet recording and inkjet recording method


An ink set for inkjet recording includes: a first ink containing a black dye and a polyamine; and a second ink containing a black pigment having a coat of an anionic resin. An inkjet recording method includes: ejecting a first ink containing a black dye and a polyamine onto a recording medium through an inkjet recording head; and ejecting a second ink containing a black pigment having a coat of an anionic resin onto the first ink ejected on the recording medium through an inkjet recording head..
Kyocera Document Solutions Inc.


08/20/15
20150232663 

Fiber-based ablative and high temperature pre-preg material


A fabric-matrix composite structure [10] for making parts [13] suitable for use in hostile, high-temperature environments, such as rocket exhaust nozzles. The structure [10] includes a fabric [11] formed of polyacrylonitrile fiber, especially a polyacrylonitrile fiber that has been oxidized, and especially a combination of polyacrylonitrile fibers that have been oxidized to different degrees.

08/20/15
20150232660 

Polyester resin composition and producing same


(wherein r is an alkyl group represented by cnh2n+1 and n is an integer of 1 or more and 15 or less), polybutylene adipate terephthalate (pbat), and hydrophilic silica (a), wherein a weight ratio of the aliphatic polyester (p3ha) to the polybutylene adipate terephthalate (pbat) is 90/10 to 10/90, and an amount of the hydrophilic silica (a) contained is 2 to 30 parts by weight with respect to 100 parts by weight of a total amount of the aliphatic polyester (p3ha) and the polybutylene adipate terephthalate (pbat) contained.. .

08/20/15
20150232659 

Molding material for sliding member, and sliding member


A molding material for a sliding member, the molding material being superior in processability and sliding properties, and a sliding member formed from the molding material for a sliding member are provided. The molding material for a sliding member contains a phenol resin, a boron compound, an elastomer and a filler.
Asahi Organic Chemicals Industry Co., Ltd.


08/20/15
20150232658 

Self-extinguishing epoxy resin for epoxy molding compound, preparing the same, and epoxy resin composition for epoxy molding compound.


A self-extinguishing epoxy resin for an epoxy molding compound (emc) represented by formula 1 is disclosed. The epoxy resin (composition) has excellent flame retardancy without using a halogen flame retardant or a phosphorous flame retardant.
Kukdo Chemical Co., Ltd.


08/20/15
20150232657 

Composite fuel pipes


A fuel pipe for an aircraft having a wall made of a material including a matrix composed of an epoxy copolymer obtained through the reaction of a resin of the bisphenol a diglycidyl ether type with an amine hardener, and from 3 to 5% of an organically modified nanoclay by weight of the epoxy copolymer, the nanoclay including layered magnesium aluminum silicate platelets, and reinforcing fibers embedded in the matrix. In one example, the resin is a bisphenol a epichlorohydrin based resin, a phenol, 4,40-(1-methylethylidene) bis-polymer with (chloromethyl) oxirane; the nanoclay is provided in a 4% weight proportion to the epoxy copolymer, and is a montmorillonite; the amine hardener is an amidoamine..
Bombardier Inc.


08/20/15
20150232646 

Thermoformable microsphere articles


There is provided an article comprising at least a first surface having a first binder layer selected from at least one of linear resins and resins having low cross link densities, where the first binder layer has a first major surface opposite a second major surface; and a plurality of microspheres at least partially embedded in the first major surface of the first binder layer. For at least a portion of the first major surface, the plurality of micro spheres may cover 30% to 50% of that portion, and the microspheres may be substantially uniformly spaced..
3m Innovative Properties Company


08/20/15
20150232639 

Rubber composition with low resin crosslinking


A tire component comprising a rubber composition having a highly unsaturated diene elastomer and a reinforcing filler with a methylene acceptor selected from 3-hydroxydiphenyl- amine, 4-hydroxydipheyl- amine or combinations thereof. Such rubber compositions further include a methylene donor, wherein a ratio of the methylene acceptor to the methylene donor may be greater than 10:1 or in other embodiments greater than 10:1 but no more than 50:1 or between 15:1 and 30:1.
Micehlin Recherche Et Technique S.a.


08/20/15
20150232634 

Surface treatment agent and surface treatment method


A surface treatment agent and a surface treatment method capable of imparting excellent corrosion resistance while enhancing adhesion between a surface of a metal substrate and a resin-containing layer. The surface treatment agent for treating a surface of a metal substrate includes an acrylic resin having a carboxyl group and a hydroxyl group, an oxazoline group-containing compound and metal particles containing at least one of nb, ca and nd.
Chemetall Gmbh


08/20/15
20150232626 

Resin composition for printing film and printing film


(wherein, r represents, for example, a hydrogen atom).. .

08/20/15
20150232621 

Laminate, and element comprising substrate manufactured using same


The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin having a similarity score not greater than 0.5, as calculated by equation 1 defined in the detailed description, between a carrier substrate and a flexible substrate.
Lg Chem, Ltd.


08/20/15
20150232620 

Curable resin composition, and cured product thereof


Wherein x represents a single bond or a linking group (a divalent group comprising one or more atoms).. .

08/20/15
20150232619 

Method of producing polyimide resin, producing polyimide coating, producing polyamic acid solution, polyimide coating, and polyamic acid solution


A method of producing a polyimide resin that produces a polyimide resin having excellent heat resistance and mechanical properties, and having a low dielectric constant even when heat-treated at a lower temperature. The method includes heating at 120° c.
Tokyo Ohka Kogyo Co., Ltd.


08/20/15
20150232617 

Polyamide resin composition and molded product


A polyamide resin composition includes 100 parts by weight of a (a) polyamide resin; and 0.1 to 10 parts by weight of a (b) hydroxyl group- and carboxyl group-containing compound, wherein the (b) hydroxyl group- and carboxyl group-containing compound has a ratio (cooh/oh) of 0.01 to 5.0 of a rate (percentage) of a carboxyl group-derived peak area to a total peak area in a 13c-nmr spectrum to a rate (percentage) of a hydroxyl group-derived peak area to a total peak area in a 1h-nmr spectrum and has a degree of branching of 0.05 to 0.35.. .
Toray Industries, Inc.


08/20/15
20150232614 

Blends containing photoactive additive


Polymeric blends having improved flame retardance properties and good ductility at low temperatures are disclosed. The blend is formed from (a) a photoactive additive containing a photoactive group derived from a monofunctional benzophenone; and (b) a polymer resin which is different from the photoactive additive.
Sabic Global Technologies B.v.


08/20/15
20150232613 

Method for producing branched aromatic polycarbonate resin


The present invention provides a method for producing a branched aromatic polycarbonate resin that is molecular weight-increased, which comprises subjecting an aromatic polycarbonate prepolymer and a linking agent comprising a trifunctional or more of an aliphatic polyol compound to transesterification reaction in the presence of a transesterification catalyst under a reduced pressure condition.. .
Mitsubishi Gas Chemical Company, Inc.


08/20/15
20150232612 

Modifier for cellulose ester resins, cellulose ester optical film, and polarizing-plate protective film


To provide a modifier for cellulose ester resins that allows a decrease in retardation value (rth) in the thickness direction of a film, that can impart resistance to moisture permeation, and that can provide a film whose rth value tends not to vary in response to variation in humidity; a cellulose ester optical film including the modifier; and a polarizing-plate protective film including the modifier. Provided are a modifier that includes a polyester resin (a) having a structure represented by a general formula (1) or a general formula (2) below; a cellulose ester optical film including the modifier and a cellulose ester resin; and a polarizing-plate protective film obtained by casting a resin solution onto a metal support, the resin solution being prepared by dissolving in an organic solvent the modifier and a cellulose ester resin and by subsequently drying the resin solution through evaporation of the organic solvent..
Dic Corporation


08/20/15
20150232610 

Resin mixture based on vinyl ester urethane resin and use thereof


A resin mixture comprises a vinyl ester urethane resin as the base resin, wherein the vinyl ester urethane resin can be obtained by reacting a dianhydrohexitol compound with a diisocyanate to obtain a product and reacting the obtained product with a hydroxy substituted (meth)acrylate. The resin mixture can be used to produce a reactive resin mortar containing that resin mixture and inorganic aggregates, organic aggregates or a mixture thereof.
Hilti Aktiengesellschaft


08/20/15
20150232608 

Polyurethane casting compound for producing wear protection coatings in casting house applications


The present invention relates to multi-component compositions including an isocyanate component and an amine component, wherein the isocyanate component includes a prepolymer, obtainable from toluene isocyanate and a polytetramethylene polyol, and the amine component includes a dialkylthio aryl diamine and possibly a polytetramethylene oxide polyamine. Corresponding compositions can be advantageously used as flowable or spreadable resin systems for producing surface protection coatings in casting house applications and are characterized by a significantly improved resistance to abrasion in comparison with conventional casting resin systems based on hexamethylene diisocyanate and dimethyl thiotoluene diamine..
Sika Technology Ag


08/20/15
20150232607 

Composition of allophanate and hydrophobic resin


The invention relates to a composition for preparing (poly)urethane from an allophanate and from a hydrophobic resin. The invention also relates to the use of this composition as a replacement for poly(methylene diphenyl diisocyanate) (pmdi), in particular for the preparation of a material for encapsulating an electrical device..
Vencorex France


08/20/15
20150232595 

Resin mixture based on vinyl ester resin, reactive resin mortar comprising same and use thereof


Described is a resin mixture comprising a vinyl ester resin and a co-polymerizable compound, which bears at least two methacrylate groups, some of which is replaced by an itaconic acid ester. It is possible to control the properties of the composition, such as the curing, through the selection of the itaconic acid ester.
Hilti Aktiengesellschaft


08/20/15
20150232503 

Method for preparing exenatide


Disclosed in the present invention is a method for preparing exenatide. Serine resin is obtained through a first coupling of serine and resin and successively with amino acids through a second coupling to obtain a peptide resin with a sequence as shown by seq id no.
Hybio Pharmaceutical Co., Ltd.


08/20/15
20150232419 

Ketene imine compound, polyester film, back sheet for solar cell module and solar cell module


By forming a polyester film from a polyester resin composition including ketene imine compound represented by the following formula (1) and polyester, the polyester film having excellent hydrolysis resistance in which volatilization of the ketene imine compound or the ketene compound can be suppressed. In formula (1), r1 and r2 represent an alkyl group, an aryl group, an alkoxy group, an alkoxycarbonyl group, an aminocarbonyl group, an aryloxy group, an acyl group, or an aryloxycarbonyl group, and the r1—c(═c)—r2 substructure has a molecular weight of 320 or greater.
Fujifilm Corporation


08/20/15
20150232386 

Composition of silane-modified polymer, epoxy resin and cure catalyst, and polymer concrete comprising the composition


Polymer concrete compositions comprising a silane-modified polymer (smp) composition which comprises a silylated polymer, an epoxy resin, e.g., an epoxy-terminated prepolymer, and a cure catalyst, e.g., tetraethyltetraamine, exhibit good adhesion to wet concrete.. .
Dow Global Technologies Llc


08/20/15
20150232290 

Method and resin delivery with adjustable air flow limiter


Method and apparatus for air flow limiting comprise a vertically oriented tube, a sail assembly positioned in the tube and moveable therewithin responsively to air flow through the tube to limit rate of air flow through the tube and halt air flow through the tube upon air flow rate through the tube exceeding a preselected value, and a moveable stop for adjustably changing the length of travel of the sail assembly thereby changing the maximum amount of air flow.. .

08/20/15
20150232232 

Coffee storage container


The purpose of the present invention is to provide a revolutionary coffee storage container of exceedingly high commercial value. This coffee storage container is designed for storing coffee (20), and has: a container body (1) in which an inner cylinder (3) made of metal is arranged within an outer cylinder (2) with a space (s) therebetween, the space (s) between the outer cylinder (2) and the inner cylinder (3) functioning as a vacuum insulation space; a closure body (4) for providing closure to an opening (1b) of the container body (1); and a coffee pouring cup body (5) that fits about the closure body (4) once the opening (1b) of the container body (1) has been closed by the closure body (4).
Seven . Seven Co., Ltd.




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Resin topics: Carbon Dioxide, Homogeneous, Back Sheet, Impregnated, Nanoparticle, Carbonate Ion, Carbonic Anhydrase, Deionization, Bicarbonate, Organosiloxane, Surface Treatment, Fluoropolymer, Encapsulation, Display Panel, Semiconductor Device

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