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Resin

Resin-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Shielded cable
Sumitomo Electric Industries, Ltd.
August 10, 2017 - N°20170231124

A shielded cable includes signal wires each having a signal conductor covered by an insulator, and a shield conductor comprising a metal foil resin tape spirally and overlappingly wrapped around the two signal wires, wherein an edge portion of the metal foil resin tape is folded back so that the metal foil therein is oriented outward, thereby bringing metal foils, ...
Laminate for printed wiring board, method of manufacturing printed wiring board, and method of manufacturing ...
Jx Nippon Mining & Metals Corporation
August 10, 2017 - N°20170231101

A laminate for printed wiring board is used in a method of manufacturing printed wiring boards that includes a process of forming a circuit by any one of a semi-additive method, a partly additive method, a modified semi-additive method, and an embedding method. The laminate includes an insulating resin substrate, a metal layer 1 and a metal layer 2 in this order. ...
Method for manufacturing wiring circuit component, mold for manufacturing wiring circuit component, and resinous wiring ...
Koto Engraving Co., Ltd.
August 10, 2017 - N°20170231096

A one-surface groove for wiring is formed in a front surface 2a, opposite-surface grooves for wiring are formed in a back surface 2b by protruding core members, and communication parts for allowing the one-surface groove and the opposite-surface grooves to communicate with each other are formed to shape a board section 2 made of a non-conductive resin. After the core members ...
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Double-sided circuit substrate suitable for high-frequency circuits
Daikin Industries, Ltd.
August 10, 2017 - N°20170231088

Provided is a double-sided circuit substrate being a laminate of: a composite material comprising a fluorine resin and a glass cloth; and a copper foil having a two-dimensional roughness ra in a mat surface (a surface that comes in contact with the resin) of less than 0. 2 μm. Ideally, a surface of the fluorine resin has an o content ...
High-frequency component
Murata Manufacturing Co., Ltd.
August 10, 2017 - N°20170231085

A high-frequency component includes a resin layer and a high-frequency circuit provided in and on the resin layer and includes an inductor and an electronic component. The electronic component is arranged on an upper surface of the resin layer. The inductor includes first and second metal pins provided such that upper end surfaces thereof are exposed from the upper surface ...
Connector
Sumitomo Electric Industries, Ltd.
August 10, 2017 - N°20170229808

A connector c to be mounted on a case of a device includes a coated wire 10 formed such that a core 11 is coated with an insulation coating 12, a terminal fitting 20 to be fit and connected to a mating terminal, a flexible conductor 15 interposed between the terminal fitting 20 and an end of the coated wire 10, and a housing 30 made of synthetic ...
Resin Patent Pack
Download 337+ patent application PDFs
Resin Patent Applications
Download 337+ Resin-related PDFs
For professional research & prior art discovery
inventor
  • 337+ full patent PDF documents of Resin-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Separator for battery
Toray Battery Separator Film Co., Ltd.
August 10, 2017 - N°20170229698

A separator for batteries that achieves both adhesiveness to electrodes and low thermal shrinkage, which have been conventionally difficult to be compatible with each other, and has excellent ion permeability in order to further improve the safety of the separator, on the assumption that lithium ion secondary batteries are widely used for electric automobiles and the like, which require the ...
Method for producing laminated porous film
Sumitomo Chemical Company, Limited
August 10, 2017 - N°20170229696

The present invention provides a method for producing a laminated porous film comprising a porous film substrate and a heat-resistant layer. The method comprises forming a heat-resistant layer mainly comprising a filler on the surface of the porous film substrate by applying a coating slurry comprising a solvent, a binder resin and the filler to the surface of the porous ...
Battery
Toyota Jidosha Kabushiki Kaisha
August 10, 2017 - N°20170229686

A battery includes a battery case, an external metallic member, an external resin member which is present between the battery case and the external metallic member, a heat transfer inhibiting portion configured to restrain heat transfer from the external metallic member to the external resin member, and a current collector member including an extending portion that extends from an inside ...
Packaging material for cell
Dai Nippon Printing Co., Ltd.
August 10, 2017 - N°20170229685

A film-shaped packaging material for a cell in which a coating layer is provided as the outermost layer instead of a substrate layer and an adhesive layer in a conventional film-shaped packaging material for a cell, thereby making it possible to produce a thinner film; wherein the packaging material is provided with exceptional moldability and insulation performance and enables lead ...
Packaging material for batteries
Dai Nippon Printing Co., Ltd.
August 10, 2017 - N°20170229684

Provided is a packaging material for batteries, which has excellent insulating properties. A packaging material for batteries, which is formed of a laminate that is obtained by sequentially laminating at least a base layer, a bonding layer, a metal layer and a sealant layer, and wherein the base layer comprises a resin layer a that is formed of a thermoplastic ...
Lead frame and semiconductor device
Nichia Corporation
August 10, 2017 - N°20170229628

A light emitting device includes a resin package and a light emitting element. The resin package has a cavity. The resin package includes first and second lead portions and a resin member. The first lead portion includes a first lead side surface and a lead recess portion that extends from the first lead side surface in a direction away from ...
Carrier, carrier leadframe, and light emitting device
Everlight Electronics Co., Ltd.
August 10, 2017 - N°20170229625

A light emitting device may comprise a wing portion of an electrode exposed from the resin housing. The wing portion may be made by a single or multiple stamp cutting process. To increase the connecting region between the electrode and solder, the outer side surface of the wing portion is an uneven surface. The device may further comprise a protective ...
Resin Patent Pack
Download 337+ patent application PDFs
Resin Patent Applications
Download 337+ Resin-related PDFs
For professional research & prior art discovery
inventor
  • 337+ full patent PDF documents of Resin-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Method for producing semiconductor light-emitting device
Sumitomo Chemical Company, Limited
August 10, 2017 - N°20170229622

A method for producing a semiconductor light-emitting device involves applying a silicone resin composition to a surface of a semiconductor light-emitting element and forming an encapsulating portion covering the surface of the light-emitting element by heat curing the applied resin composition. The silicone resin composition contains at least 60% by mass of a silicone resin in which the constituent silicon atoms ...
Light emitting device with beam shaping structure and manufacturing method of the same
Maven Optronics Co., Ltd.
August 10, 2017 - N°20170229621

A chip scale packaging (csp) light emitting diode (led) device includes a flip-chip led semiconductor die and a beam shaping structure (bss) to form a monochromatic csp led device. A photoluminescent structure can be disposed on the led semiconductor die to form a phosphor-converted white-light csp led device. The bss is fabricated by dispersing light scattering particles with concentration equal ...
Light-emitting apparatus and manufacturing method thereof
Rohm Co., Ltd.
August 10, 2017 - N°20170229616

A light-emitting apparatus includes a light-emitting, a first lead, a second lead, and a resin molded body configured to support the first lead and the second lead. The main surfaces of the first and second leads includes first and second coverage areas covered by the resin molded body and first and second exposure regions exposed from the resin molded body ...
Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
Rohm Co., Ltd.
August 10, 2017 - N°20170229615

The surface mounted light emitting apparatus comprises the light emitting device 10 based on gan which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains yag fluorescent material and covers ...
Light emitting device and light source module having thereof
Lg Innotek Co., Ltd.
August 10, 2017 - N°20170229614

A light emitting device according to an embodiment includes a body having a recess; a light emitting chip disposed in the recess; and a first dampproof layer sealing the light emitting chip and extended from a surface of the light emitting chip to a bottom of the recess, wherein the light emitting chip includes a wavelength range of 100 nm to 280 ...
Light diffusion member for interconnectors, interconnector for solar cells provided with same, and solar cell ...
Lg Innotek Co., Ltd.
August 10, 2017 - N°20170229594

The light diffusion member for an interconnector 3 is disposed on the surface of an interconnector 1 for connecting adjacent solar cells 6 opposite to the solar cells 6, and the light diffusion member comprises a light diffusion layer 3a containing a resin and inorganic particles.
Semiconductor device
Rohm Co., Ltd.
August 10, 2017 - N°20170229382

A semiconductor device includes two or more semiconductor elements, a lead with island portions on which the semiconductor elements are mounted, a heat dissipation member for dissipating heat from the island portions, a bonding layer bonding the island portions and the heat dissipation member, and a sealing resin covering the semiconductor elements, the island portions and a part of the ...
Method of manufacturing semiconductor device having semiconductor chip mounted on lead frame
Sii Semiconductor Corporation
August 10, 2017 - N°20170229355

A semiconductor device uses a lead frame, in which an outer lead is electrically connected to an inner lead suspension lead via an inner lead. An encapsulating resin covers the inner lead and part of the outer lead, and a plated film is formed on an outer lead cut surface so that a solder layer is easily formed on all ...
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