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Resin

Resin-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Card tray for electronic device and tray carrier assembly using the same
Molex, Llc
June 22, 2017 - N°20170181302

A card tray for use in electronic devices is disclosed that can improve tray durability, eliminate the occurrence of resin flash during insert molding, and simplify the tray mold structure. The card tray for electronic devices according to a preferred embodiment may be a card tray for electronic device use for insertion into and withdrawal from a card socket of ...
Semiconductor module
Fuji Electric Co., Ltd.
June 22, 2017 - N°20170181300

A semiconductor module includes sealing resin from which a main terminal protrudes, which seals an insulating substrate. The module includes a semiconductor element and a wiring substrate. The sealing resin has a nut housing portion in which a nut is disposed. The semiconductor module also has a busbar terminal to which a main terminal that protrudes from the sealing resin ...
Prepreg, laminate, and method of production of prepreg
Zeon Corporation
June 22, 2017 - N°20170181294

A prepreg provided with a first resin layer and a second resin layer which is formed on this first resin layer, wherein the first resin layer is formed by a first resin composition, the second resin layer is a layer which comprises a resin layer which is formed by a second resin composition which is different from the first resin ...
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Resin Patent Applications
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  • 337+ full patent PDF documents of Resin-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Damper having a locally coated material and its fabrication method
Kabushiki Kaisha Audio-technica
June 22, 2017 - N°20170180866

A method of fabricating a damper is described. A printed pattern is formed on a screen, the printed pattern having an outer edge and a non-circular inner edge. A fiber fabric is soaked in a resin bath, and has a damper forming region provided with a predetermined coating region. The fiber fabric is placed below the screen so that the ...
Image reading apparatus and image forming apparatus
Canon Kabushiki Kaisha
June 22, 2017 - N°20170180579

An image reading apparatus includes a guide member whose part in sliding-contact with a light-emitting portion is formed of synthetic resin. A control portion is configured to execute a control of changing a turn position among a plurality of positions including a first position and a second position downstream in an image reading direction of the first position in case ...
Controller-included rotating electrical machine
Denso Corporation
June 22, 2017 - N°20170179794

A controller-included rotating electrical machine is provided which includes a rotating electrical machine and a controller. The controller 11 is equipped with a power supply terminal-included bus bar assembly and bus bar assemblies. The power supply terminal-included bus bar assembly has bus bars which are fixedly retained by resin and electrically wire a power modules and also includes a power supply ...
Resin Patent Pack
Download 337+ patent application PDFs
Resin Patent Applications
Download 337+ Resin-related PDFs
For professional research & prior art discovery
inventor
  • 337+ full patent PDF documents of Resin-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Conductive surfacing material for composite structures
Cytec Industries Inc.
June 22, 2017 - N°20170179706

An electrically conductive surfacing material capable of providing sufficient conductivity for lightning strike protection (lsp) and/or electromagnetic interference (emi) shielding is disclosed. The conductive surfacing material is a multi-layered structure having a very thin conductive layer (e. G. Solid metal foil) and a resin film formed on at least one surface of the conductive layer. The resin film is ...
Method for manufacturing terminal with electric wire
Yazaki Corporation
June 22, 2017 - N°20170179664

A method for manufacturing a terminal with an electric wire includes: forming a conductor exposed portion by removing a resin coating of an electric wire; forming a wire-terminal connection portion by connecting a terminal fitting to a position of the conductor exposed portion; supplying a sealing material made of ultraviolet-curing resin from a nozzle to form a sealing portion covering ...
Method for manufacturing terminal with electric wire
Yazaki Corporation
June 22, 2017 - N°20170179663

A method for manufacturing a terminal with an electric wire includes: forming a conductor exposed portion by removing a resin coating of an electric wire; forming a wire-terminal connection portion by connecting a terminal fitting to a position of the conductor exposed portion; and supplying a sealing material from a nozzle to the wire-terminal connection portion. During supply of the ...
Fuel cell gas diffusion layer, fuel cell, and method for manufacturing fuel cell gas diffusion ...
Panasonic Intellectual Property Management Co., Ltd.
June 22, 2017 - N°20170179498

A fuel cell gas diffusion layer includes: a porous layer containing conductive particles and binder resin as primary components; a groove-shaped fluid flow path provided on one of main surfaces of the porous layer; and a conductive wire portion extending along the one of the main surfaces and a surface of the fluid flow path, the conductive wire portion being ...
Bus bar module and bus bar module manufacturing method
Yazaki Corporation
June 22, 2017 - N°20170179460

A bus bar module includes a plurality of bus bars that connects a plurality of unit cells of a battery assembly constituted by the unit cells, a plurality of electric wires that are welded to surfaces of the bus bars, and an electric wire router that is made of insulating resin and includes bus bar reception portions provided side by ...
Oled package structure and oled packaging method
Shenzhen China Star Optoelectronics Technology Co., Ltd.
June 22, 2017 - N°20170179421

An oled package structure includes a substrate, a package lid arranged opposite to the substrate, an oled device arranged between the substrate and the package lid and mounted to the substrate, and enclosure resin located between the substrate and the package lid and bonding the substrate and the package lid together. The package lid includes a recess formed therein at ...
Method of manufacturing a display device
Japan Display Inc.
June 22, 2017 - N°20170179386

A glass substrate that corresponds to a plurality of product regions and a first grid region that surrounds each of the plurality of product regions and is grid-like is prepared. A protective film that is harder than the glass substrate is formed in the first grid region. A resin layer is formed so as to cover the protective film and ...
Resin Patent Pack
Download 337+ patent application PDFs
Resin Patent Applications
Download 337+ Resin-related PDFs
For professional research & prior art discovery
inventor
  • 337+ full patent PDF documents of Resin-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Light emitting device
Nichia Corporation
June 22, 2017 - N°20170179354

A light emitting device includes: a package forming a recess, having a first lead and a second lead arranged on a bottom surface of the recess and a resin section on a lateral wall of the recess to fix the leads, and being in a substantially rectangular shape surrounded by upper sides of the lateral walls of the recess; a ...
Optical solid state prepolymer and molding composition
Industrial Technology Research Institute
June 22, 2017 - N°20170179349

An optical solid state prepolymer is provided, which includes a product formed by reacting 100 parts by weight of (a) epoxy resin and 0. 1 to 30 parts by weight of (b) oligomeric silsesquioxane. The (a) epoxy resin includes (a1) linear siloxane epoxy resin and (a2) cyclic siloxane epoxy resin with a weight ratio of 1:1 to 5:1.
Light-emitting device
Citizen Watch Co., Ltd.
June 22, 2017 - N°20170179348

A light-emitting device includes a base, a substrate, a plurality of light-emitting elements, a filler, and a sealing resin body. The base includes an upper surface and a mounting area. The substrate is disposed on the upper surface of the base. The substrate includes an opening. The mounting area is exposed from the opening of the substrate. The plurality of ...
Adhesive for solar-cell back sheet, polyol composition for solar-cell back sheet adhesive, solar-cell back sheet, ...
Dic Corporation
June 22, 2017 - N°20170179309

There are provided an adhesive for a solar-cell back sheet having an excellent curing rate and being capable of exhibiting excellent adhesive performance by short-term aging, and also a polyol composition used for the adhesive, a solar-cell back sheet using the adhesive, and a solar-cell module using the sheet. The adhesive for a solar-cell back sheet contains, as essential components, ...
Display device and method for manufacturing the same
Japan Display Inc.
June 22, 2017 - N°20170179207

How a flat panel display is bent by external forces is controlled. A display panel 40 has display elements, formed corresponding to the arrangement of pixels, on a first principal surface of a flexible display panel substrate 46. The display panel substrate 46 has a linear groove 48 on at least part of a second principal surface of the display panel substrate 46. A resin ...
Light emitting diode module
Lumens Co., Ltd.
June 22, 2017 - N°20170179084

A light emitting diode module includes: a substrate; led chips mounted on an upper surface of the substrate; a multi-layer reflector formed on the upper surface of the substrate so as to form a cavity in the vicinity of the led chips and having an annular shape; and an encapsulant formed of a resin filled in the cavity and containing ...
Substrate for stacked module, stacked module, and method for manufacturing stacked module
Murata Manufacturing Co., Ltd.
June 22, 2017 - N°20170179014

A substrate for a stacked module includes a stacked insulator in which a plurality of insulator layers mainly composed of a thermoplastic resin are stacked, a conductor pattern arranged along the plurality of insulator layers in the stacked insulator, an embedded component connected to the conductor pattern, a pad provided on a surface of the stacked insulator and configured to ...
Semiconductor device
Rohm Co., Ltd.
June 22, 2017 - N°20170179006

A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package sealing the semiconductor chip, the island, the ...
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