Commscope Technologies Llc
June 15, 2017 - N°20170170549
Aspects of the present disclosure may be directed to a multi-layer feed-board with all the functional components, including phase shifters, diplexers, and dipole element, employed thereon. Therefore, solder interfaces at cable to functional component interfaces are no longer necessary. Instead, component interfaces are within the confines of the multi-layer feed-board, thereby reducing pim issues attributed to solder joint interfaces.