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Packages patents



      
           
This page is updated frequently with new Packages-related patents. Subscribe to the Packages RSS feed to automatically get the update: related Packages RSS feeds.

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Date/App# patent app List of recent Packages-related patents
04/17/14
20140109082
 Verification of complex multi-application and multi-node deployments patent thumbnailnew patent Verification of complex multi-application and multi-node deployments
Systems and methods are disclosed for identifying software components stored on one or more virtual machines (vm). An installation directory is traversed and an ordered installation index of file paths and content identifiers are created for the files thereof.
04/17/14
20140109077
 Methods and systems for package management patent thumbnailnew patent Methods and systems for package management
A server-implemented method for managing packages on a client device is provided. The method initiates with receiving a content request from a client device, the content request defining a requested content item and current package data identifying one or more currently installed packages on the client device.
04/17/14
20140109076
 Secure, non-disruptive firmware updating patent thumbnailnew patent Secure, non-disruptive firmware updating
Firmware updates for, e.g., thin client devices may be achieved in a seamless, non-disruptive manner using a two-stage firmware loader, including a base loader pre-installed on the device and a caching loader downloaded, by the base loader, from a firmware server and thereafter responsible for downloading and updating other firmware application packages.. .
04/17/14
20140108713
 Storage system having a plurality of flash packages patent thumbnailnew patent Storage system having a plurality of flash packages
A storage system 100, which has a plurality of flash packages 230, has a function for minimizing the imbalance of the number of deletions of each block inside the flash package 230 and a block-unit capacity virtualization function, and efficiently manifests lessening of the imbalance of the number of deletions and reduction in the data storage capacity for the entire storage system 100 by having functions for calculating the number of deletions and the data occupancy of each flash package 230, and for transferring data between the flash packages 230 on the basis of the values of these number of deletions and data occupancy.. .
04/17/14
20140107005
 Fuel oil compositions with improved cold flow properties patent thumbnailnew patent Fuel oil compositions with improved cold flow properties
The use is described of polymers which contain, in copolymerized form, an α-olefin, a vinyl ester and an ester of an α,β-unsaturated carboxylic acid as an additive for fuel oils and lubricants and in particular as a cold flow improver in fuel oils. En addition, the fuel oils and lubricants additized with these polymers; and also additive packages comprising such polymers are described..
04/17/14
20140106507
 System and process for fabricating semiconductor packages patent thumbnailnew patent System and process for fabricating semiconductor packages
A method of processing semiconductor chips includes measuring locations of semiconductor dies placed on a carrier with a scanner to generate die location information. The method includes applying a dielectric layer over the semiconductor dies and communicating the die location information to a laser assembly.
04/17/14
20140104953
 Semiconductor storage device and method for producing the same patent thumbnailnew patent Semiconductor storage device and method for producing the same
A semiconductor storage device 100 includes a controller package 110 having a bga terminal on a bottom surface thereof; and one or a plurality of memory packages 120 each including a plurality of semiconductor storage elements and mounted on the controller package. The controller package includes a bottom substrate having the bga terminal on a bottom surface thereof; a power supply ic, mounted on the bottom substrate, for supplying a plurality of power supplies; and a controller mounted on the bottom substrate and operable by the plurality of power supplies supplied from the power supply ic.
04/17/14
20140104626
 System and method for printing advertisements on parcel packages in an automated parcel distribution system patent thumbnailnew patent System and method for printing advertisements on parcel packages in an automated parcel distribution system
Systems and a method for printing and applying labels on packages. The system includes a conveyor configured to transport a plurality of packages, one or more scanners configured to scan the plurality of packages, and one or more print and apply stations.
04/17/14
20140104252
 Display device patent thumbnailnew patent Display device
Disclosed is a display device. The display device includes a plurality of mcc packages each including one source driver ic and one gate driver ic disposed on a film, a panel including a plurality of data lines connected to the source driver ic, a plurality of gate connection lines that are connected to the gate driver ic and disposed in parallel to the data lines, a plurality of gate lines that are disposed vertically to the gate connection lines and the data lines and connected to the gate connection lines, and a plurality of dummy lines disposed in parallel to the gate connection lines and between the data lines, and a timing controller configured to transfer image data and a plurality of control signals to at least one or more of the mcc packages..
04/17/14
20140104184
 Backplate electrode sensor patent thumbnailnew patent Backplate electrode sensor
This disclosure provides systems, methods and apparatus for electromechanical systems (ems) device packages having integrated sensors. In one aspect, electrodes within a packaged ems device can be used in conjunction with an electrode disposed on another substrate within the ems device package to form one or more capacitive sensors.
04/17/14
20140103518
new patent Structure and method for air cavity packaging
A structure and method for air cavity packaging, the structure comprises a carrier having plural die pads and leads, plural dies, plural wires, plural walls, and a lid. The dies are mounted on the die pads.
04/17/14
20140103516
new patent Semiconductor device and method of manufacturing the same
Disclosed are semiconductor devices and methods of manufacturing the same. The semiconductor device includes an interposer and a first semiconductor package comprising a first substrate, and a first semiconductor chip mounted on the first substrate.
04/17/14
20140103509
new patent Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages
A semiconductor device has a semiconductor die with an encapsulant deposited over and around the semiconductor die. An opening is formed in a first surface of the encapsulant by etching or lda.
04/17/14
20140103507
new patent Optical device package and system
Optical device packages and systems are disclosed. In one embodiment, a system may comprise first and second optical device packages.
04/17/14
20140103505
new patent Die down integrated circuit package with integrated heat spreader and leads
Methods, systems, and apparatuses for integrated circuit packages are provided. An integrated circuit package, such as a quad flat no-lead (qfn) package, includes a plurality of peripherally positioned leads, a heat spreader, an integrated circuit die, and an encapsulating material.
04/17/14
20140103371
new patent Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device package
Lead frames for light emitting device packages, light emitting device packages, and illumination apparatuses employing the light emitting device packages. The lead frame including a plurality of mounting portions on which a plurality of light emitting device chips are mounted; a plurality of connection portions for circuit connecting the plurality of light emitting device chips; a terminal portion extended from the plurality of connection portions.
04/17/14
20140103082
new patent Wearable package for consumable products and methods for using same
Wearable packages for consumable products and methods for using same are provided. In a general embodiment, the wearable packages include a first compartment for housing a product and a second compartment for housing a bi-stable band.
04/17/14
20140103011
new patent Flexible packaging materials and methods of making and using same
Packaging materials are disclosed, along with packages formed therefrom and methods for forming the packages.. .
04/17/14
20140102321
new patent Web insertion device for a flat-bed die-cutting machine, manufacturing system for packages and method for feeding a web of printing material
A device for inserting a web of printing material into a flat-bed die-cutting and/or embossing machine includes a compensator for converting a continuous movement of the web of printing material into an iterative movement of the web of printing material. A clamping unit clamps the web of printing material, a cutting unit carries out a cross cut through the web of printing material, and an inserting unit transports the web of printing material into the flat-bed die-cutting and/or embossing machine.
04/17/14
20140102044
new patent Apparatus and method for manufacture of a secondary package
A method for producing a secondary package, comprising a separate lid and tray, for encasing primary packages, the method comprises folding the lid from a first blank, comprising long side areas along a length of the blank and, at each of opposite short ends of the blank, two cuts are made forming two side flaps and a side cover, separated by the cuts, and folding a tray from a second blank, comprising side areas along a length of the blank. The method comprises folding the side areas of the first blank to form long lid sides; placing the second blank onto a substantially horizontal support rail, between operation flaps; thereby folding the side areas of the second blank to form long tray sides; loading the tray with primary packages; applying the lid to the primary packages, with the long lid sides between the primary packages and the long tray sides..
04/10/14
20140101548
Concurrently presenting interactive invitational content and media items within a media station through the use of bumper content
A media channel can include a mix of media items and invitational content packages. At some point during the playback of the media channel, an invitational content package can be presented.
04/10/14
20140100812
Systems and methods for evaluating environmental aspects of shipping systems
According to various embodiments, package evaluation systems and methods are provided for evaluating the sustainability of packaging used in the shipment of goods. In particular, the package evaluation systems and methods are configured for performing package evaluations and managing and providing access to data resulting from package evaluations.
04/10/14
20140099455
Flexible barrier packaging derived from renewable resources
Disclosed herein are flexible barrier packages composed of materials that are substantially free of virgin, petroleum-based compounds. The flexible barrier packages contain a sealant that has a biobased content of at least about 85%.
04/10/14
20140099410
Multi-item packaged food product
Packages for food products and food products packaged in such packages are described. A multi-item packaged food product may include food items, a bottom portion defining containers, and a top portion releasably sealed to the bottom portion such that food items are received in the containers.
04/10/14
20140099409
Multi-item packaged food product
Packages for food products and food products packaged in such packages are described. A multi-item packaged food product may include food items, a bottom portion defining containers, and a top portion releasably sealed to the bottom portion such that food items are received in the containers.
04/10/14
20140097891
Reconfiguring through silicon vias in stacked multi-die packages
Through silicon vias (tsvs) in a stacked multi-die integrated circuit package are controlled to assume different connection configurations as desired during field operation of the package in its normal mission mode. Tsv connections may be reconfigured to connect an affected die in a manner different from, for example, a factory default connection of that die.
04/10/14
20140097536
Two-sided-access extended wafer-level ball grid array (ewlb) package, assembly and method
A two-sided-access (tsa) ewlb is provided that makes it possible to easily access electrical contact pads disposed on both the front and rear faces of the die(s) of the ewlb package. When fabricating the ic die wafer, metal stamps are formed in the ic die wafer in contact with the rear faces of the ic dies.
04/10/14
20140097533
Pop package structure
A package on package (pop) package structure is disclosed, the structure includes at least two layers of carrier boards that are packaged and stacked in sequence, wherein chips are arranged on the bottom side of the carrier boards, a heat sink is arranged on the bottom side of a carrier board other than a layer-1 carrier board, a pad welded to a system board is arranged on the bottom side of the layer-1 carrier board, and a chip on a carrier board other than a top-layer carrier board is surface-mounted onto the heat sink adjacent to the chip. The heat sink increases the heat dissipation area of the chip, enhances the heat dissipation capabilities of the pop stacked packages massively, breaks the bottleneck of the high-density integration and miniaturization of the pop stacked packages, and enhances the packaging density of the pop stacked packages..
04/10/14
20140097525
Circuit boards, methods of fabricating the same, and semiconductor packages including the circuit boards
Provided is a circuit board, which may include a base layer, an adhesive film, a conductive circuit, and a through via. The adhesive film and the conductive circuit may be provided in plurality to be alternately stacked on the base layer.
04/10/14
20140097333
Monolithic optical packages and methods using aluminum nitride
An apparatus and method are disclosed for providing monolithic optical packages. An embodiment optical package includes a base made of aluminum-nitride (aln) that is configured to support an optical component, a plurality of sidewalls made of aln that are coupled to the base, the sidewalls are configured to surround the optical component, and a feed-through made of aln that is coupled to one of the sidewalls, wherein the feed-through is configured to feed a plurality of leads through the one sidewall to provide an electrical connection to the optical component, wherein the base, the sidewalls, and the feed-through have a same coefficient of thermal expansion (cte) for aln.
04/10/14
20140097287
Bulk wire delivery system
The invention described relates generally to a method and apparatus for improving existing bulk wire transfer methodologies and more particularly, to welding wire packages for use as an endless wire container such that the welding wire of multiple containers can be linked together to produce an uninterrupted flow of welding wire to a welding operation by employing a welding wire transfer guide, the guide having an outwardly-facing curvilinear groove, one end of said groove of said welding wire transfer guide positioned along a tangent line running between an outer diameter of the in-process coil of wire and an opposed end of said groove along a tangent line running between an inner diameter of the staged coil of welding wire. The apparatus further includes a magnetically positionable wire guide arm above at least two, preferably each bulk welding wire container..
04/10/14
20140097195
Automated medication dispensing unit
In certain embodiments, a remote automated dispensing unit (adu) may include an enclosed cabinet, one or more locking mechanisms to keep the cabinet secure, one or more doors on the cabinet to allow access to the internal components, and a computer system that manages the dispensing of inventory. The adu may include a mechanism for the dispensing of medications for individual patients including: one or more canisters for storing medications, one or more canister base stations for securing the one or more canisters to the adu, and a chute and funnel system for the guidance of medications as they fall from the canisters into a packaging station for packaging medications into packages for particular patients.
04/10/14
20140097122
Extendable display package system for toys
An extendable display package shipping system including a display package having a slide wall able to be lowered for shipping and raised for display, a product mounted to the slide wall in the display package and able to move between a collapsed position when the slide wall is lowered and a display position when the slide is raised. Two display packages, with slide walls lowered, are placed in a shipping carton and an insert is placed over the display packages in the carton.
04/10/14
20140097118
Flexible packaging system and method of use to eliminate valved coffee bag vacuumization due to change in atmospheric pressure
A packaging system and method of use for packaging coffee in individual valved packages is disclosed. The individual valved packages are disposed within a secondary package formed of a flexible material and including a one-way pressure relief valve.
04/10/14
20140097012
Leadframe for semiconductor packages
A leadframe for semiconductor packages is provided. The leadframe includes a die pad, a side rail, a tie bar, and a plurality of leads.
04/10/14
20140096900
Method and system to print and apply labels to products
The present application relates to a method and system for labeling one or more products such as packages transported along a conveyer, and more specifically to applying a label on a respective package by way of a vertically adjustable assembly positioned above the conveyor. The adjustable assembly includes at least a label printer and an applicator for printing and applying the label on a surface of the package on the conveyor..
04/03/14
20140091471
Apparatus and method for a component package
A component package and a method of forming are provided. A first component package may include a first semiconductor device having a pair of interposers attached thereto on opposing sides of the first semiconductor device.
04/03/14
20140091461
Die cap for use with flip chip package
A die cap for use with flip chip packages, flip chip packages using a die cap, and a method for manufacturing flip chip packages with a die cap are provided in the invention. A die cap encases the die of flip chip packages about its top and sides for constraining the thermal deformation of the die during temperature change.
04/03/14
20140091457
Controlled solder height packages and assembly processes
An apparatus comprises a substrate including a surface and a plurality of bonding pads positioned on the surface. The apparatus also includes a material comprising a solder positioned on the bonding pads and extending a distance outward therefrom.
04/03/14
20140091448
Semiconductor package with corner pins
There are provided semiconductor packages having corner pins and methods for their fabrication. Such a semiconductor package includes a leadframe and a die paddle, the leadframe having first and second edge sides meeting to form a first corner.
04/03/14
20140091332
Led lighting devices incorporating waveguides
A led lighting device includes at least one waveguide element and multiple light-emitting sources such as leds or led packages, which may be optically coupled though different light entry regions to the at least one waveguide. Multiple light solid state sources may be arranged in strips.
04/03/14
20140091196
Shock sensitive transport stabilizer
A transport device for shock sensitive packages maintains an object in a near zero gravity spatial orientation to reduce or eliminate potentially harmful mechanical shock and or vibration to a body, object or device needing protection. This device has active impact cancellation, and is controlled by a computer via attached sensors that return positional data and reduce or eliminate the deceleration rate of the protected body via programmed algorithms, and rapidly compensating linear actuators..
03/27/14
20140089876
Thermal analysis of integrated circuit packages
A method includes retrieving a first component information of a secured portion of a package, wherein the first component information is encrypted. The step of retrieving includes decrypting the first component information.
03/27/14
20140089390
Decentralized cloud workflows
Technologies related to decentralized cloud workflows are generally described. In some examples, client applications may generate workflow packages.
03/27/14
20140089375
Determining points of interest within a geofence
Embodiments of apparatus, packages, computer-implemented methods, systems, devices, and computer-readable media are described herein for a mobile computing device with a primary processing unit configured to operate in a normal mode and a reduced power mode. The mobile computing device may include a secondary processing unit, coupled with the primary processing unit, configured to provide, to a remote computing server, location data of the mobile computing device.
03/27/14
20140088062
Compositions comprising fusidic acid and packages therefor
Described are solid pharmaceutical compositions of fusidic acid, and pharmaceutically acceptable salts thereof, dosage units of the pharmaceutical compositions, and packages for pharmaceutical compositions of fusidic acid, and pharmaceutically acceptable salts thereof, which increase stability against the degradation of the fusidic acid, and pharmaceutically acceptable salts thereof. Also described are uses of the pharmaceutical compositions and dosage units in treating diseases..
03/27/14
20140087553
Fabricating a wafer level semiconductor package having a pre-formed dielectric layer
There are disclosed herein various implementations of improved wafer level semiconductor packages. One exemplary implementation comprises forming a post-fabrication redistribution layer (post-fab rdl) between first and second dielectric layers affixed over a surface of a wafer, and forming a window for receiving an electrical contact body in the second dielectric layer, the window exposing the post-fab rdl.
03/27/14
20140087177
Waterborne adhesives for reduced basis weight multilayer substrates and use thereof
The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates..
03/27/14
20140084487
Pop structure with electrically insulating material between packages
A pop (package-on-package) package includes a bottom package coupled to a top package. Terminals on the top of the bottom package are coupled to terminals on the bottom of the top package with an electrically insulating material located between the upper surface of the bottom package and the lower surface of the top package.
03/27/14
20140084467
Forming functionalized carrier structures with coreless packages
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a die to a carrier material, wherein the carrier material comprises a top layer and a bottom layer separated by an etch stop layer; forming a dielectric material adjacent the die, forming a coreless substrate by building up layers on the dielectric material, and then removing the top layer carrier material and etch stop layer from the bottom layer carrier material..
03/27/14
20140084462
Wafer level semiconductor package
There are disclosed herein various implementations of improved wafer level semiconductor packages. One exemplary implementation comprises forming a post-fabrication redistribution layer (post-fab rdl) between first and second dielectric layers affixed over a surface of a wafer, and forming a window for receiving an electrical contact body in the second dielectric layer, the window exposing the post-fab rdl.
03/27/14
20140084456
Semiconductor packages, methods of manufacturing semiconductor packages, and systems including semiconductor packages
A semiconductor package comprises a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a third semiconductor chip on the second semiconductor chip and a fourth semiconductor chip on the third semiconductor chip. A first underfill layer is positioned between the second semiconductor chip and the first semiconductor chip; a second underfill layer is positioned between the third semiconductor chip and the second semiconductor chip, and a third underfill layer is positioned between the fourth semiconductor chip and the third semiconductor chip.
03/27/14
20140084442
Semiconductor packages having a guide wall and related systems and methods
A semiconductor package includes a first package board, a first semiconductor chip arranged on the first package board, a heat transfer layer arranged on the first semiconductor chip, a heat spreader arranged on the heat transfer layer, and a housing having a molding part arranged on the first package board and directly surrounding side surfaces of the first semiconductor chip and a guide wall arranged on the molding part, with the guide wall spaced apart from the heat spreader and surrounding side surfaces of the heat spreader.. .
03/27/14
20140084056
System for product packaging level serialization
A tracking system for food products includes labeled food product packages and labeled containers for transporting the labeled packages to harvest sites. A data-clearing center receives mobile phone communications from the harvest sites for uploading the container codes.
03/27/14
20140083062
Boxing apparatus
A boxing apparatus erects packages that can be erected along a limited section of a conveyor, without having to erect them all at once, even with individual packages that are long in the feed direction. The boxing apparatus has a fourth conveyor belt that blocks the front of a line of incoming packages and exerts an upward force on the front package.
03/27/14
20140083057
Methods of transporting decarbonated beer base liquid
A method of transporting a decarbonated beer base liquid may comprise packaging said decarbonated beer in package having a non-rigid wall defining an internal orifice wherein said decarbonated beer base liquid is hermetically sealed in said internal orifice. The method may further comprise stacking said packages in a geometrically efficient manner based on a flat-sided geometry of said package, and transporting said stacked packages.
03/20/14
20140082094
Providing notifications of messages for consumption
Embodiments of apparatus, packages, computer-implemented methods, systems, devices, and computer-readable media (transitory and non-transitory) are described herein for providing a notification of a message to a recipient for consumption using a computing device. In various embodiments, provision of the notification may be in a timing or manner that is based on a characteristic of the message, an operational context of the system, and/or empirical data about preferred timing or manner of notification of at least another message to the same or different recipient.
03/20/14
20140081473
Distributed fault-tolerant control and protection system
The present invention relates to a distributed fault-tolerant control system for a modularized wind turbine or wind power plant system comprising sub-assemblies, the control system comprising 1) fault-tolerant control means adapted to generate control set-points and/or data values, said fault-tolerant control means being distributed in sub-assemblies in accordance with the modularization of the wind turbine or wind power plant system, and 2) fault-tolerant communication network for transmitting control set-points and/or data values at essentially the same time to a plurality of nodes in the distributed control system, said plurality of distributed nodes being capable of selecting a valid transmission package out of two or more transmission packages provided on the fault-tolerant communication network.. .
03/20/14
20140081175
Acoustic patient sensor coupler
According to certain described aspects, multiple acoustic sensing elements are employed in a variety of beneficial ways to provide improved physiological monitoring, among other advantages. In various embodiments, sensing elements can be advantageously employed in a single sensor package, in multiple sensor packages, and at a variety of other strategic locations in the monitoring environment.
03/20/14
20140080259
Manufacturing method for layered chip packages
In a manufacturing method for layered chip packages, a layered substructure with at least one additional package joined thereto is used to produce a plurality of layered chip packages. The layered substructure includes a plurality of main bodies to be separated from each other later.
03/20/14
20140079229
Device testing using acoustic port obstruction
Methods and systems are taught for testing microphone packages—including measuring non-acoustic noise for the package. A package positioner holds a microphone package such that an acoustic input port of the microphone package is aligned with a plug.
03/20/14
20140077387
Semiconductor package and fabrication method thereof
A fabrication method of a semiconductor package is provided, which includes the steps of: cutting a substrate into a plurality of interposers; disposing the interposers on a carrier, wherein the interposers are spaced from one another by a distance; disposing at least a semiconductor element on each of the interposers; forming an encapsulant to encapsulate the interposers and the semiconductor elements; and removing the carrier. Therefore, by cutting the substrate first, good interposers can be selected and rearranged such that finished packages can be prevented from being wasted due to inferior interposers..
03/20/14
20140077382
Semiconductor packages having warpage compensation
A semiconductor package can include a substrate body having a first surface and a second surface. A semiconductor chip can be mounted on the first surface and a plurality of electrode pads can be on the second surface and selectively formed to have progressively smaller or larger sizes extending from a central region of the substrate body toward an outer edge of the substrate body based on a reflow soldering process warpage profile for the semiconductor package..
03/20/14
20140077351
Microelectronic packages with nanoparticle joining
A method of making an assembly includes the steps of applying metallic nanoparticles to exposed surfaces of conductive elements of either of or both of a first component and a second component, juxtaposing the conductive elements of the first component with the conductive elements of the second component with the metallic nanoparticles disposed therebetween, and elevating a temperature at least at interfaces of the juxtaposed conductive elements to a joining temperature at which the metallic nanoparticles cause metallurgical joints to form between the juxtaposed conductive elements. The conductive elements of either of or both of the first component and the second component can include substantially rigid posts having top surfaces projecting a height above the surface of the respective component and edge surfaces extending at substantial angles away from the top surfaces thereof..
03/20/14
20140077251
Luminous devices, packages and systems containing the same, and fabricating methods thereof
The present invention is directed to a vertical-type luminous device and high through-put methods of manufacturing the luminous device. These luminous devices can be utilized in a variety of luminous packages, which can be placed in luminous systems.
03/20/14
20140076918
Methods of providing packages of wet wipes with improved wetness gradients and associated product
A method for improving the wetness gradient of a plurality of packages containing stacks of wet wipes, and the associated container, are disclosed. The method may include the steps of providing a plurality of packages of wet wipes, disposing the primary packages in the interior space of a container bearing an indicium that is easily legible when the container is upside-down, inverting the container and thereby the packages to the upside-down orientation, and shipping the container in the upside-down position.
03/20/14
20140076301
Defrosting device
A defrosting device for use in a household or commercial environment to effectively defrost frozen food packages is described. The device consists of three major parts; a top shell, a bottom shell and a hinge mechanism connecting the top shell and the bottom shell to allow the top shell to rotate around the hinge to open and close relative to the bottom shell.
03/20/14
20140075884
Induction sealing device for heat sealing packaging material for producing sealed packages of pourable food products
There is described a heating induction sealing device for forming a seal in a packaging material comprising an electrically conductive element and advancing along a direction; sealing device comprises one first inductive element and one second inductive element; first inductive element comprises a first portion facing second inductive element and defining with second inductive element a passage for packaging material; and a second portion; sealing device is selectively arrangeable in a first configuration, in which alternate currents flow within first and second inductive element; first portion and second inductive element are configured to generate a first magnetic flux transversally to direction, when sealing device is arranged in first configuration; second portion is configured to generate, in use, a second magnetic flux with a main component parallel to direction, when sealing device is arranged in first configuration.. .
03/13/14
20140075431
System and method for service definition packages for use with a cloud computing environment
A system and method for providing service definition packages for use with a cloud computing environment. In accordance with an embodiment, a cloud platform enables provisioning of enterprise software applications (e.g., fusion middleware applications) within a cloud environment.
03/13/14
20140075426
System and method for dynamic modification of service definition packages with a cloud computing environment
A system and method for dynamic modification of service definition packages for use with a cloud computing environment. In accordance with an embodiment, a cloud platform enables provisioning of enterprise software applications (e.g., fusion middleware applications) within a cloud environment.
03/13/14
20140075412
System and method for elasticity management of services with a cloud computing environment
A system and method for elasticity management of services for use with a cloud computing environment. In accordance with an embodiment, a cloud platform enables provisioning of enterprise software applications within a cloud environment, including packaging enterprise applications as service definition packages (sdp), and instantiating the services using service management engines (sme).


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