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Metallic

Metallic-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Solderable two piece board level shields
Laird Technologies, Inc.
June 22, 2017 - N°20170181336

According to various aspects, exemplary embodiments are disclosed of a two-piece metallic board level shield (bls). In an exemplary embodiment, the bls is solderable to a printed circuit board (pcb). The bls includes a lid or cover and a fence or frame. The lid and fence are complementary in shape. The lid may be mounted onto the fence via a ...
Card tray for electronic device and tray carrier assembly using the same
Molex, Llc
June 22, 2017 - N°20170181302

A card tray for use in electronic devices is disclosed that can improve tray durability, eliminate the occurrence of resin flash during insert molding, and simplify the tray mold structure. The card tray for electronic devices according to a preferred embodiment may be a card tray for electronic device use for insertion into and withdrawal from a card socket of ...
Sliding thermal shield
Continental Automotive Systems, Inc.
June 22, 2017 - N°20170181264

An assembly for providing electromagnetic interference (emi) shielding and for dissipating heat from electronic components. The assembly including: a metallic frame including a wall extending upwardly from a circuit board; an emi shield having a top with holes and having sidewalls that surround the top, extend downwardly, and are attachable to the wall of the frame in a first latched ...
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Foreign object detector, power transmitting device and power receiving device for wireless power transmission, and ...
Panasonic Intellectual Property Management Co. Ltd.
June 22, 2017 - N°20170179772

A foreign object detector detects a metallic foreign object between a first resonator and a second resonator which is composed of a parallel resonant circuit including a coil and a capacitor. The foreign object detector includes the first resonator; an oscillator circuit capable of oscillating at a first frequency (f1) which is lower than a resonant frequency (fr) of the ...
Connector with waterproof structure
Foxconn Interconnect Technology Limited
June 22, 2017 - N°20170179634

An electrical connector includes an insulative housing and a plurality of contacts retained in the housing to commonly form a terminal module, a metallic shield enclosing the terminal module and forming a mating cavity, and a glue groove formed in a base of the housing and located behind the mating cavity, in which a glue part is received. The shield ...
Cable end termination including cable dielectric layer hermetic seal and related methods
Sri Hermetics Llc
June 22, 2017 - N°20170179633

A cable end termination is for a coaxial cable that includes inner and outer conductors and a dielectric layer therebetween that is subject to outgassing in a vacuum environment. The cable end termination may include a tubular bi-metallic body that includes a first longitudinal portion including a first metal and a second longitudinal portion joined with the first longitudinal portion ...
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Metallic Patent Applications
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Multi loop antenna module and portable device having the same
Amotech Co., Ltd.
June 22, 2017 - N°20170179574

The present invention provides a multi loop antenna module that maximizes antenna performance even in a portable terminal equipped with a metallic rear cover, using an antenna pattern formed in a multi loop shape, and a portable terminal having the multi loop antenna module. The multi loop antenna module may include: an antenna sheet having a radiation pattern with two ...
Sodium molten salt battery
Sumitomo Electric Industries, Ltd.
June 22, 2017 - N°20170179537

A sodium molten salt battery includes a positive electrode containing a positive electrode active material, a negative electrode containing a negative electrode active material, a separator provided between the positive electrode and the negative electrode, and a molten salt electrolyte having sodium ion conductivity, in which the negative electrode active material contains hard carbon and is pre-doped with sodium ions, ...
Battery cell having a metallic housing, and method for producing it, and battery
Robert Bosch Gmbh
June 22, 2017 - N°20170179450

A battery cell, in particular lithium-ion battery cell, having a metallic housing (2), an electrode assembly (3) being received in the metallic housing (2), and the metallic housing (2) having a first housing element (4) which is connected electrically to a positive pole (8) of the electrode assembly (3) and a second housing element (5) which is connected electrically to a negative pole (9) of the electrode assembly (3), the ...
Organometallic complex, light-emitting element, light-emitting device, electronic device, and lighting device
Robert Bosch Gmbh
June 22, 2017 - N°20170179409

In the formula, each of a1 to a4 independently represents a substituted or unsubstituted alkyl group having 1 to 6 carbon atoms. Each of r1 to r6 independently represents any of hydrogen, a substituted or unsubstituted alkyl group having 1 to 6 carbon atoms, a substituted or unsubstituted aryl group having 6 to 13 carbon atoms, and a substituted or unsubstituted heteroaryl group having 3 to 12 carbon ...
Tandem organic photovoltaic devices that include a metallic nanostructure recombination layer
Champ Great Int'l Corporation
June 22, 2017 - N°20170179198

An intermediate layer (110) useful for coupling two individual organic photovoltaic devices (600) to provide a tandem organic photovoltaic device includes a first hole transport layer (114), a first electron transport layer (112), and a metallic nanostructure layer (116) interposed between the first hole transport layer (114) and the first electron transport layer (112). The metallic nanostructure layer (116) provides an efficient recombination point for electrons and holes. ...
Structures and methods to enable a full intermetallic interconnect
International Business Machines Corporation
June 22, 2017 - N°20170179071

A method forming an interconnect structure includes depositing a first solder bump on a chip; depositing a second solder bump on a laminate, the second solder bump including a nickel copper colloid surrounded by a nickel or copper shell and suspended in a tin-based solder; aligning the chip with the laminate; performing a first reflow process to join the chip ...
Structures to enable a full intermetallic interconnect
International Business Machines Corporation
June 22, 2017 - N°20170179068

A method forming an interconnect structure includes depositing a first solder bump on a chip; depositing a second solder bump on a laminate, the second solder bump including a nickel copper colloid surrounded by a nickel or copper shell and suspended in a tin-based solder; aligning the chip with the laminate; performing a first reflow process to join the chip ...
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Metallic Patent Applications
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  • 2036+ full patent PDF documents of Metallic-related inventions.
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Method of forming metal pads with openings in integrated circuits including forming a polymer extending ...
Taiwan Semiconductor Manufacturing Company, Ltd.
June 22, 2017 - N°20170179052

A device includes a metal pad, and a passivation layer comprising portions overlapping edge portions of the metal pad. The metal pad and the passivation layer are in a chip. A solder region is over the passivation layer. A metallic feature electrically inter-couples the metal pad and the solder region, and the metallic feature includes a continuous metal region. A ...
Increased contact alignment tolerance for direct bonding
Ziptronix, Inc.
June 22, 2017 - N°20170179029

A bonded device structure including a first substrate having a first set of conductive contact structures, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the contact structures on the first substrate, a second substrate having a second set of conductive contact structures, preferably connected to a device or circuit, and having a second ...
Semiconductor package having a leadframe with multi-level assembly pads
Texas Instruments Incorporated
June 22, 2017 - N°20170179007

A leadframe (100) comprises a frame (101) of sheet metal in a first planar level, where the frame has metallic leads (110) and a first metallic pad (120) extending inward from the frame, and the first pad is tied to the frame by first metallic straps (120a). The leadframe further has a second metallic pad (130) in a second planar level parallel to and spaced ...
Distribution and stabilization of fluid flow for interlayer chip cooling
International Business Machines Corporation
June 22, 2017 - N°20170179002

A method of forming metallic pillars between a fluid inlet and outlet for two-phase fluid cooling. The method may include; forming an arrangement of metallic pillars between two structures, the metallic pillars are electrically connected to metallic connecting lines that run through each of the two structures, the arrangement of metallic pillars located between a fluid inlet and a fluid ...
Electrostatic chuck
Toto Ltd.
June 22, 2017 - N°20170178944

An electrostatic chuck includes: a ceramic dielectric substrate having a first major surface, a second major surface, and a through-hole; a metallic base plate which has a gas introduction path that communicates with the through-hole; and a bonding layer which is provided between the ceramic dielectric substrate and the base plate and includes a resin material. The bonding layer has ...
Surface machining method for single crystal sic substrate, manufacturing method thereof, and grinding plate for ...
Showa Denko K.k.
June 22, 2017 - N°20170178919

A surface machining method for a single crystal sic substrate, including: a step of mounting a grinding plate which includes a soft pad and a hard pad sequentially attached onto a base metal having a flat surface, a step of generating an oxidation product by using the grinding plate, and a step of grinding the surface while removing the oxidation ...
Metal mesh sensing module of touch panel and manufacturing method thereof
Jtouch Corporation
June 22, 2017 - N°20170177126

A metal mesh sensing module of a touch panel and a manufacturing method thereof are disclosed. The metal mesh sensing module includes a transparent substrate and a metal mesh sensing circuit. The transparent substrate has at least a surface and plural referring nodes disposed on the surface and arranged in regular order. The metal mesh sensing circuit is disposed on ...
Mask blank, phase-shift mask, method of manufacturing mask blank, method of manufacturing phase-shift mask and ...
Jtouch Corporation
June 22, 2017 - N°20170176848

A mask blank is provided in which a phase-shift film is provided on a transparent substrate, the phase-shift film having a function to transmit arf exposure light therethrough at a predetermined transmittance and generate a predetermined amount of phase shift in the arf exposure light that is transmitted therethrough, wherein the phase-shift film comprises a structure in which a low ...
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