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This page is updated frequently with new Mems-related patent applications.




 Pico-speaker acoustic modulator patent thumbnailnew patent Pico-speaker acoustic modulator
A mems speaker that may include a membrane positioned in a first plane, wherein the membrane may be configured to oscillate at a first frequency thereby generating an ultrasonic acoustic signal; and an acoustic modulator that may include a blind and a shutter; wherein the blind may be positioned in a second plane; wherein the shutter may be positioned in a third plane; wherein the first plane, the second plane and the third plane may be substantially separated from each other; and wherein the acoustic modulator may be configured to (a) receive or generate a shutter control signal and a blind control signal, and (b) modulate, in response to the shutter control signal and the blind control signal, the ultrasonic acoustic signal such that an audio signal may be generated.. .
Dsp Group Ltd.


 Gas sensor patent thumbnailnew patent Gas sensor
Shown is a gas sensor including a sensor element, a measurement chamber and an emitter element. The sensor element has a mems membrane which is arranged in a first substrate region.
Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.


 Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips patent thumbnailnew patent Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips
Integration of sensor chips with integrated circuit (ic) chips. At least a first sensor chip including a first sensor is affixed to a first side of an interposer to hermetically seal the first sensor within a first cavity.
Intel Corporation


 Capacitive mems-sensor element having bond pads for the electrical contacting of the measuring capacitor electrodes patent thumbnailnew patent Capacitive mems-sensor element having bond pads for the electrical contacting of the measuring capacitor electrodes
Measures for reducing parasitic capacitances in the layer structure of capacitive mems sensor elements, in which parasitic capacitances between bond pads for electrically contacting measuring capacitor electrodes and an electrically conductive layer lying underneath are reduced by these measures. The sensor structure having the measuring capacitor electrodes and bond pads of such mems components are in a layer structure on a semiconductor substrate.
Robert Bosch Gmbh


 Mems chip and  manufacturing a mems chip patent thumbnailnew patent Mems chip and manufacturing a mems chip
A mems chip having at least two chip components bonded together by means of an adhesive layer that is applied to at least one of two mating bonding surfaces of the two components, wherein a pattern of finely distributed micro-cavities is formed in at least one of the two mating bonding surfaces, said micro-cavities being arranged to accommodate a major part of the adhesive.. .
Oce-technologies B.v.


 Mems and/or nems dynamic pressure sensor with improved performances and microphone comprising such a sensor patent thumbnailMems and/or nems dynamic pressure sensor with improved performances and microphone comprising such a sensor
Dynamic pressure sensor of mems and/or nems type comprising a support and a rigid sensitive element anchored to the support by at least one anchoring zone, said sensitive element comprising a parallel first and a second face intended to be subjected to different pressures, said sensitive element being capable of having an out-of-plane displacement with respect to the support in a detection direction under the effect of a pressure difference, the pressure sensor also comprising a detector of a force applied to the sensitive element by the pressure difference.. .
Commissariat A L'energie Atomique Et Aux Energies Alternatives


 Acoustic device with one or more trim capacitors patent thumbnailAcoustic device with one or more trim capacitors
An acoustic device includes a substrate that has a port. The acoustic device further includes a microelectromechanical system (mems) that converts sound energy into electrical energy.
Knowles Electronics, Llc


 Mems-based speaker implementation patent thumbnailMems-based speaker implementation
A micro-electromechanical system (mems) device that comprises a substrate, support structures, functional elements and conductive paths that comprise conductive elements; wherein the functional elements are included in a plurality of functional layers, the plurality of functional layers are spaced apart from each other; wherein the support structures are configured to provide structural support to the plurality of functional layers; wherein each functional layer is coupled to a conducting interface via a conductive path that is associated with the functional layer; and wherein the support structures comprise lateral etch stop elements.. .
Dsp Group Ltd.


 Multi-layered mems speaker patent thumbnailMulti-layered mems speaker
A micro-electromechanical system (mems) device that may include a substrate, support structures and functional elements; wherein the functional elements are included in a plurality of functional layers, the plurality of functional layers are spaced apart from each other; wherein the support structures are conductive and are configured to provide structural support to the plurality of functional layers; wherein each functional element is electrically coupled to at least one of the support structures; and wherein the support structures are spaced apart from each other.. .
Dsp Group Ltd.


 Energy efficient charge reuse in driving capacitive loads patent thumbnailEnergy efficient charge reuse in driving capacitive loads
A method of charge reuse, the method may include repeating the steps of: electrically coupling a first group of capacitive loads to a second group of capacitive loads; wherein the capacitive loads of the first group and of the second group are microelectromechanical systems (mems) capacitive loads or nanoelectromechanical systems (nems) capacitive loads; charging the second group with a first charge provided from the first group; electrically disconnecting the first group from the second group; operating the second group while using the first charge; electrically coupling the first group to the second group; charging the first group with a second charge provided from the second group; electrically disconnecting the first group from the second group; and operating the first group while using the second charge.. .
Dsp Group Ltd.


Acoustic apparatus with side port


An apparatus includes a microphone and a gasket. The microphone includes a base having an inner surface and an outer surface.
Knowles Electronics, Llc


Mems fast focus camera module


An auto focus camera module includes a camera module housing defining an aperture and an internal cavity to accommodate camera module components, an image sensor coupled to or within the housing, a lens barrel within the housing that contains an optical train including at least one movable lens disposed relative to the aperture and image sensor to focus images of scenes onto the image sensor along an optical path, and a fast focus mems actuator coupled to one or more lenses of the optical train including the at least one movable lens and configured to rapidly move said at least one movable lens relative to the image sensor to provide autofocus for the camera module in each frame of a preview or video sequence or both.. .
Digitaloptics Corporation Mems


Ferroelectric mechanical memory based on remanent displacement and method


A ferroelectric mechanical memory structure comprising a substrate, a mems switch element movable between a first position and at least one second position, the mems switch element comprising first and second electrodes, a layer of ferroelectric material positioned between the first and second electrodes so that upon application of voltage between the first and second electrodes the mems switch element moves between the first position and the second position, and a switch contact which contacts the first electrode only when the mems switch element is in the first position, wherein the ferroelectric material is selected so that the remanent strain within the layer of ferroelectric material is controlled by the history of the voltage potential applied to the ferroelectric material by the first and second electrodes, and wherein the remanent strain is sufficient to retain the mems switch element in the first or second position upon removal of the voltage.. .
U.s. Army Research Laboratory Attn: Rdrl-loc-i


Display device


In order to achieve a display device that can display a plurality of images and also prevents a lowering of resolution of the images displayed by emitting light in a plurality of different direction from one pixel, a display device 1000, which is a display device that can display at least two images by emitting light in at least two directions from each pixel, includes: a backlight unit 11, a first group of apertures provided on a backlight side substrate 12, a second group of apertures provided on a display side substrate 15, a mems shutter 14, and a display control unit 2. The display device 1000 can display an image for a first viewpoint p1 and an image for a second viewpoint p2 by the display control unit 2 controlling the mems shutter 14 for each pixel..
Sharp Kabushiki Kaisha


Direct-view mems display devices and methods for generating images thereon


A direct-view display includes an array of mems light modulators and a control matrix formed on a transparent substrate, where each light modulator can be driven into at least two states, and a controller for controlling the states of each light modulator in the array. The control matrix transmits data and actuation voltages to the array.
Pixtronix, Inc.


Micro-electro-mechanical acceleration sensor device


A mems acceleration device for measurement of the acceleration along three axes. The device includes capacitors, which capacitance changes under the influence of an acceleration acting upon the device.
Freescale Semiconductor, Inc.


Through electrode and producing multilayer substrate using through electrode


The present invention relates to a through electrode to be mounted on a substrate having a through hole. The through electrode includes: a penetrating part that passes through the through hole; a convex bump part that is formed on at least one end of the penetrating part and is wider than the through electrode; and a metal film that has at least one layer and is formed on a surface of the convex bump part that comes in contact with the substrate.
Tanaka Kikinzoku Kogyo K.k.


Dual cavity pressure structures


Provided herein is a method including forming a trench in a handle substrate, and a trench lining is formed in the trench. A first cavity and a second cavity are formed in the handle substrate, wherein the first cavity is connected to the trench.
Invensense, Inc.


Mems isolation structures


A device may comprise a substrate formed of a first semiconductor material and a trench formed in the substrate. A second semiconductor material may be formed in the trench.
Digitaloptics Corporation Mems


Electronic device and manufacturing the same


According to one embodiment, an electronic device includes a mems element provided on an underlying region, and a protection film including a first layer, a second layer provided on the first layer, and a third layer provided on the second layer, the protection film covering the mems element and forming a cavity in an inside thereof. An outer periphery of the second layer is located inside an outer periphery of the cavity, as viewed in a direction perpendicular to a surface of the underlying region..
Kabushiki Kaisha Toshiba


Fabrication suspended mems device


A microelectromechanical systems (mems) die includes a substrate having a first substrate layer, a second substrate layer, and an insulator layer interposed between the first and second substrate layers. A structure is formed in the first substrate layer and includes a platform upon which a mems device resides.
Freescale Semiconductor, Inc.


Mems device


According to one embodiment, a mems device is disclosed. The device includes a substrate, a first electrode fixed on the substrate.
Kabushiki Kaisha Toshiba


Dual substrate electrostatic mems switch with multiple hinges and manufacture


Systems and methods for forming an electrostatic mems switch include forming a movable cantilevered beam on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. Electrical access to the electrostatic mems switch may be made by forming vias through the thickness of the second substrate.
Innovative Micro Technology


Variable capacitance bank device


According to one embodiment, a variable capacitance bank device, including a plurality of capacitor banks for generation of a variable capacitance, the plurality of capacitor banks being connected parallel with each other. Each of the capacitor banks being constituted by serially connecting a fixed capacitor for generation of a fixed capacitance and a mems capacitor for generation of the variable capacitance.
Kabushiki Kaisha Toshiba


Cement integrity sensors and methods of manufacture and use thereof


The invention encompasses systems and methods for detecting and/or monitoring the integrity and/or condition of cement, structures incorporating cement including, for example, highways, bridges, buildings, and wellbores using nano-electro-mechanical system (nems)-based and/or micro-electro-mechanical system (mems)-based data sensors. The disclosure further encompasses systems and methods of monitoring the integrity and performance of a structure and the surrounding formation of structure through the life of the structure using nems/mems-based data sensors..
Micromem Applied Sensor Technologies Inc.


Monolithic mems platform for integrated pressure, temperature, and gas sensor


The present disclosure is directed to a monolithic mems (micro-electromechanical system) platform having a temperature sensor, a pressure sensor and a gas sensor, and an associated method of formation. In some embodiments, the mems platform includes a semiconductor substrate having one or more transistor devices and a temperature sensor.
Taiwan Semiconductor Manufacturing Co., Ltd.


Sensor and sensor system


According to one embodiment, a sensor includes a substrate, a first memo element provided on the substrate, a cap layer providing a cavity for accommodating the first mems element, and a second mems element for monitoring a pressure in the cavity, the second mems element being provided on the substrate in the cavity.. .
Kabushiki Kaisha Toshiba


Mems sensor for measuring z-axis angular rate


A micromechanical sensor for measuring z-axis angular rate includes a substrate defining a substrate plane and a z-axis perpendicular to the substrate plane. A first vibratory structure has a first shuttle-mass and a first proof-mass coupled to the first shuttle-mass by a first sense-mode spring.
Tronics Microsystems S.a.


Micro-electro-mechanical system (mems) structures and design structures


Micro-electro-mechanical system (mems) structures, methods of manufacture and design structures are disclosed. The method includes forming a micro-electro-mechanical system (mems) beam structure by venting both tungsten material and silicon material above and below the mems beam to form an upper cavity above the mems beam and a lower cavity structure below the mems beam..
International Business Machines Corporation


Mems device and fabrication method


mems devices and methods for forming the same are provided. A first metal interconnect structure is formed on a first semiconductor substrate to connect to a cmos control circuit in the first semiconductor substrate.
Semiconductor Manufacturing International (shangha) Corporation


Micro-electro-mechanical system (mems) structures and design structures


Micro-electro-mechanical system (mems) structures, methods of manufacture and design structures are disclosed. The method includes forming a micro-electro-mechanical system (mems) beam structure by venting both tungsten material and silicon material above and below the mems beam to form an upper cavity above the mems beam and a lower cavity structure below the mems beam..
International Business Machines Corporation


Micro-electro-mechanical system (mems) structures and design structures


Micro-electro-mechanical system (mems) structures, methods of manufacture and design structures are disclosed. The method includes forming a micro-electro-mechanical system (mems) beam structure by venting both tungsten material and silicon material above and below the mems beam to form an upper cavity above the mems beam and a lower cavity structure below the mems beam..
International Business Machines Corporation


Microelectromechanical structure and device


A mems structure that provides an improved way to selectively control electromechanical properties of a mems device with an applied voltage. The mems structure includes a capacitor element that comprises at least one stator element, and at least one rotor element suspended for motion parallel to a first direction in relation to the stator element.
Murata Manufacturing Co., Ltd.


Mems transducer and manufacturing the same


A mems transducer includes a first substrate and a second substrate facing the first substrate. The first substrate includes a piezoelectric diaphragm and a conductive contact structure.
Taiwan Semiconductor Manufacturing Co., Ltd.


Mems acoustic sensor comprising a non-perimeter flexible member


A micro electro-mechanical system (mems) acoustic sensor is disclosed. The acoustic sensor comprises a backplate and a diaphragm.
Invensense, Inc.


Mems device, liquid ejecting head, and liquid ejecting apparatus


A mems device includes a protective substrate on which is mounted a driving circuit that drives a piezoelectric actuator and on which is formed an interconnect pattern electrically connected to the driving circuit, and a sealing substrate that includes a first opening and that is bonded to the protective substrate using an adhesive so that part of the interconnect pattern is located between the protective substrate and the sealing substrate. The interconnect pattern includes a connection portion that extends from a bonding region where the protective substrate and the sealing substrate are bonded by the adhesive to the first opening, and that has a connection region electrically connected to the driving circuit.
Seiko Epson Corporation


Particle manipulation system with out-of-plane channel and focusing element


A particle manipulation system uses a mems-based, microfabricated particle manipulation device which has an inlet channel, output channels, and a movable member formed on a substrate. The movable member moves parallel to the fabrication plane, as does fluid flowing in the inlet channel.
Owl Biomedical, Inc.


Portable recorder


The portable sound recorder (1) according to the invention comprises a) a plurality of microphones (1a-f) arranged for picking up voices or sounds from an external environment; b) a protective outer shell (10) that encloses: b.1) a logic unit (2) programmed or in any case arranged for processing the electrical or opto-electronic signals emitted by the plurality of microphones improving the quality of the sounds recorded; b.2) a mass memory (4) arranged for memorising and store/conserve the sounds picked up by the plurality of microphones; b.3) an electric power supply (6) that supplies the logic unit and the mass memory; and where the plurality of microphones comprises at least three microphones of the micro-electromechanical system (mems) type. The recorder is suitable for semi-professional use, is very small in size, can very faithfully reproduce atmosphere and directionality effects, is suitable for example for making cinematographic recordings or recordings of natural phenomena, live concerts or other music or sports events and press conferences..

Semiconductor integrated device for acoustic applications with contamination protection element, and manufacturing method thereof


A semiconductor integrated device, comprising: a package defining an internal space and having an acoustic-access opening in acoustic communication with an environment external to the package; a mems acoustic transducer, housed in the internal space and provided with an acoustic chamber facing the acoustic-access opening; and a filtering module, which is designed to inhibit passage of contaminating particles having dimensions larger than a filtering dimension and is set between the mems acoustic transducer and the acoustic-access opening. The filtering module defines at least one direct acoustic path between the acoustic-access opening and the acoustic chamber..
Stmicroelectronics (malta) Ltd


Single and multi-modulator projector systems with global dimming


Projector display systems comprising a light dimmer and first modulator are disclosed. The light dimmer may comprise an adjustable iris, adjustable light sources and/or lcd stack that is capable of lowering the luminance of the light source illuminated the first modulator.
Dolby Laboratories Licensing Corporation


Touch panel and electronic device


To provide a touch panel with reduced disturbance of display and with improved mechanical strength by suppressing variation in the space between a pair of substrates which form the touch panel even when in contact with an object to be detected. A pixel portion including a plurality of pixels is provided between a pair of substrates.
Semiconductor Energy Laboratory Co., Ltd.


Methods and multi-touch tactile touch panel actuator mechanisms


A method and apparatus of actuator mechanisms for a multi-touch tactile touch panel are disclosed. The tactile touch panel includes an electrical insulated layer and a tactile layer.
Immersion Corporation


Distributed mems devices synchronization methods and apparatus


A method is provided for time synchronization in a mems (microelectromecahnical system) based system having a mems processor and a plurality of mems devices. In a specific embodiment, the method includes, in the mems processor, transmitting a synchronization signal to the plurality of mems devices and saving a local time upon transmitting the synchronization signal.
Mcube Inc.


High density multi-fiber bundle and alignment for fiber optic interconnection applications


For device application such as fiber optics splitters, mems, and optical switches, a single bundle is aligned and attached to the chip.. .

3d-mems optical switch


A 3d-mems optical switch is disclosed. In an embodiment, the 3d-mems optical switch includes a collimator array, a pd array, a wedge prism, a light-splitting triangular prism, a micro-electro-mechanical system mems micro-mirror, and a core optical switch controller that is connected to the pd array and the mems micro-mirror.
Huawei Technologies Co., Ltd.


Material property measurements using multiple frequency atomic force microscopy


Apparatus and techniques for extracting information carried in higher eigenmodes or harmonics of an oscillating cantilever or other oscillating sensors in atomic force microscopy and related mems work are described. Similar apparatus and techniques for extracting information using contact resonance with multiple excitation signals are also described..
Oxford Instruments Afm Inc.


Mems sensor offset compensation with strain gauge


An example system comprises a microelectromechanical system (mems) sensor, a strain gauge, and a strain compensation circuit. The mems sensor is operable to generate a sensor output signal that corresponds to a sensed condition (e.g., acceleration, orientation, and/or pressure).
Invensense, Inc.


Mems device


According to one embodiment, a mems device includes a mems element including a movable portion and provided on a substrate, a first protective film provided above the substrate and the mems element while shaping a cavity to accommodate the mems element, a sealing layer configured to cover the first protective film and a second protective film provided on the sealing layer. An outer end of the protective film is located on an outer side of an end of the cavity on the substrate, and the ratio between distance a defined from the outer end of the sealing layer to the end of the cavity and thickness b of the first protective film, b/a, is set in a range of 0.25 to 0.52..
Kabushiki Kaisha Toshiba


Method of fabricating mems devices using plasma etching and device therefor


A method for fabricating a mems sensor device. The method can include providing a substrate, forming an ic layer overlying the substrate, forming an oxide layer overlying the ic layer, forming a metal layer coupled to the ic layer through the oxide layer, forming a mems layer having a pair of designated sense electrode portions and a designated proof mass portion overlying the oxide layer, forming a via structure within each of the designated sense electrode portions, and etching the mems layer to form a pair of sense electrodes and a proof mass from the designated sense electrode portions and proof mass portions, respectively.
Mcube Inc.


Electromechanical system substrate attachment for reduced thermal deformation


A mems switch includes a substrate and a switch structure formed on the substrate, with the switch structure further including a conductive contact formed on the substrate, a self-compensating anchor structure coupled to the substrate, and a beam comprising a first end and a second end, the beam integrated with the self-compensating anchor structure at the first end and extending out orthogonally from the self-compensating anchor structure and suspended over the substrate such that the second end comprises a cantilevered portion positioned above the conductive contact. The cantilevered portion of the beam undergoes deformation during periods of strain mismatch between the substrate and the switch structure so as to have a takeoff angle relative to the substrate, and the self-compensating anchor structure directs a portion of the strain mismatch orthogonally to the cantilevered portion so as to warp the anchor and compensate for the takeoff angle of the cantilevered portion..
General Electric Company


Micro-electro-mechanical system (mems) and related actuator bumps, methods of manufacture and design structures


Micro-electro-mechanical system (mems) structures, methods of manufacture and design structures are provided. The method of forming a mems structure includes forming fixed actuator electrodes and a contact point on a substrate.
International Business Machines Corporation


Micro-electro-mechanical system (mems) and related actuator bumps, methods of manufacture and design structures


Micro-electro-mechanical system (mems) structures, methods of manufacture and design structures are provided. The method of forming a mems structure includes forming fixed actuator electrodes and a contact point on a substrate.
International Business Machines Corporation


Surgical instruments including mems devices


Surgical instruments are disclosed that are couplable to or have an end effector or a disposable loading unit with an end effector, and at least one micro-electromechanical system (mems) device operatively connected to the surgical instrument for at least one of sensing a condition, measuring a parameter and controlling the condition and/or parameter.. .
Covidien Lp


Smart electronic vaporizer


The design and structure as well as the control scheme of a smart electronic vaporizer device having a micro-machined (a.k.a. mems, micro electro mechanical systems) mass flow sensor and control electronics that provide the vaporizing process in proportional to the user inhalation flowrate or strength for the best simulation of the experience for traditional cigarette.
Wisenstech Inc.


Mems process and device


A method of fabricating a micro-electrical-mechanical system (mems) transducer comprises the steps of forming a membrane on a substrate, and forming a back-volume in the substrate. The step of forming a back-volume in the substrate comprises the steps of forming a first back-volume portion and a second back-volume portion, the first back-volume portion being separated from the second back-volume portion by a step in a sidewall of the back-volume.
Cirrus Logic International Semiconductor Ltd.


Methods and devices for detecting open and/or shorts circuits in mems micro-mirror devices


According to the present invention there is provided methods and devices for detecting open and/or short circuits in mems micro-mirror devices, which use relative comparisons of voltage levels within the mems micro-mirror devices for detecting the occurrence of open and/or short circuits.. .
Intel Corporation


Micro-electromechanical system (mems) carrier


A micro-electromechanical system (mems) carrier formed by a typical surface micro-machining and bulk micro-machining process on a silicon substrate, having a frame, a movable carrier element, a conductive coil, two return springs and a pair of permanent magnets. The movable carrier element is formed within the frame and movable along a path, the conductive coil is formed on or embedded in the movable carrier element.
Globalmems Taiwan Corporation Limited


Apparatus and forming a mems device with etch channels


A method of fabricating a mems device provides a device substrate, forms a plurality of trenches in/on the substrate, and forms a sacrificial material on the substrate (e.g., growing or depositing the sacrificial material) to form a plurality of etch channels. Each trench defines one etch channel, and each etch channel forms an interior configured to channel etchant.
Analog Devices, Inc.


Mems affinity sensor for continuous monitoring of analytes


Techniques for monitoring a target analyte in a sample using a polymer capable of binding to the target analyte are disclosed. An implantable monitor useful for the disclosed techniques includes a microdevice coupled with a wireless interface.
The Trustees Of Columbia University In The City Of New York


Mems thermal flow sensor with compensation for fluid composition


The present invention provides a mems thermal flow sensor or meter for measuring the flow rate of a fluid without need for calibration of the flow sensor for that particular fluid. A response curve is determined by plotting the sensor output voltage against the volume flow rate divided by fluid thermal diffusivity for a calibration fluid of known thermal diffusivity, and storing response curve data in memory.
Memsic, Inc.


Multi-pressure mems package


The present disclosure relates to a microelectromechanical systems (mems) package having two mems devices with different pressures, and an associated method of formation. In some embodiments, the (mems) package includes a device substrate and a cap substrate bonded together.
Taiwan Semiconductor Manufacturing Co., Ltd.


Mems cavity substrate


In accordance with an example embodiment of this disclosure, a micro-electro-mechanical system (mems) device comprises a substrate, a cmos die, and a mems die, each of which comprises a top side and a bottom side. The bottom side of the cmos die is coupled to the top side of the substrate, and the mems die is coupled to the top side of the cmos die, and there is a cavity positioned between the cmos die and the substrate.
Invensense, Inc.


Integrated mems device


An integrated mems device is provided. The integrated mems device comprises a circuit chip and a device chip.
Asia Pacific Microsystems, Inc.


Planar cavity mems and related structures, methods of manufacture and design structures


A method of forming a micro-electro-mechanical system (mems) includes forming a lower electrode on a first insulator layer within a cavity of the mems. The method further includes forming an upper electrode over another insulator material on top of the lower electrode which is at least partially in contact with the lower electrode.
International Business Machines Corporation


Monolithic complementary metal-oxide semiconductor (cmos) - integrated silicon microphone


Some embodiments relate to a manufacturing process that combines a mems capacitor of a microelectromechanical systems (mems) microphone and an integrated circuit (ic) onto a single substrate. A dielectric is formed over a device substrate.
Taiwan Semiconductor Manufacturing Co., Ltd.


Mems microphone and forming the same


A micro-electro-mechanical system (mems) microphone and a method for forming the same are provided. The method includes: providing a first substrate including a first surface and a second surface opposite to each other; providing a second substrate including a third surface and a fourth surface opposite to each other; bonding the first surface of the first substrate and the third surface of the second substrate to each other; removing a second base of the second substrate to form a fifth surface opposite to the third surface of the second substrate; forming a cavity between the first substrate and the sensitive region of the second substrate; and forming a first conductive plug from the side of the fifth surface of the second substrate, with the first conductive plug passing through to at least one of the conductive layers..
Memsen Electronics Inc


Top port multi-part surface mount silicon condenser microphone


A surface mount package for a micro-electro-mechanical system (mems) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board.
Knowles Electronics, Llc


Single insertion trimming of highly accurate reference oscillators


A highly integrated monolithic self-compensated oscillator (sco) with high frequency stability versus temperature variations is described, together with a cost effective single insertion point trimming (spt) algorithm. The spt is utilized to adjust the phase and frequency of the sco to meet frequency stability versus temperature and frequency accuracy requirements for a reference clock.
Si-ware Systems


Sensor data acquisition system with integrated power management


A microelectromechanical systems (mems) sensor with an integrated power management system that performs analog to digital conversion of weak signals is provided. The mems sensor can include a switching regulator that steps a supply voltage down to a voltage appropriate for an analog to digital converter (a/d converter).
Invensense, Inc.


Apparatus and high voltage i/o electro-static discharge protection


An electronics chip includes a charge pump and at least one high voltage (hv) electro-static discharge (esd) module. The charge pump is configured to provide a predetermined voltage across a microphone.
Knowles Electronics, Llc


Curved rf electrode for improved cmax


The present invention generally relates to a mems device and a method of manufacture thereof. The rf electrode, and hence, the dielectric layer thereover, has a curved upper surface that substantially matches the contact area of the bottom surface as of the movable plate.
Cavendish Kinetics, Inc.


Hybrid mems scanning module


A scanning device includes a base containing one or more rotational bearings disposed along a gimbal axis. A gimbal includes a shaft that fits into the rotational bearings so that the gimbal rotates about the gimbal axis relative to the base.
Apple Inc.


Mems tilt sensor


An acoustic sensor includes a back plate; at least one back plate electrode coupled to the back plate; a proof of mass with the proof of mass elastically coupled to the back plate; and a proof of mass electrode coupled to the proof of mass. Movement of the sensor causes a capacitance between the proof of mass electrode and the at least one back plate electrode to vary and the capacitance represents a magnitude of the movement of the sensor..
Knowles Electronics, Llc


Mems anti-phase vibratory gyroscope


A mems anti-phase vibratory gyroscope includes two measurement masses with a top cap and a bottom cap each coupled with a respective measurement mass. The measurement masses are oppositely coupled with each other in the vertical direction.
Chinese Academy Of Sciences Institute Of Geology And Geophysics


Smart device for gas range


The design and assembly of a smart device constituent of a micro-machined (a.k.a. mems, micro electro mechanical systems) mass flow sensor and an electrically controllable valve for applications in safety enhancement and intermit connectivity for residential or commercial gas range is disclosed in the present invention.
Wisenstech Inc.


Mems pressure sensor and forming the same


Provided are a mems pressure sensor and a method for forming the mems pressure sensor. The method includes: preparing a first substrate, where the first substrate includes a first surface and a second surface opposite to the first surface; preparing a second substrate, where the second substrate includes a third surface and a fourth surface opposite to the third surface, the second substrate includes a pressure sensing region; bonding the first surface of the first substrate and the third surface of the second substrate with each other; forming a cavity between the first substrate and the pressure sensing region of the second substrate; removing the second base to form a fifth surface opposite to the third surface of the second substrate; and forming a first conductive plug passing through the second substrate from the side of the fifth surface of the second substrate to the at least one conductive layer..
Memsen Electronics Inc


Mems pressure sensor and forming the same


Provided are a mems pressure sensor and a method for forming the same. The method includes: preparing a first substrate, where the first substrate includes a first surface and a second surface opposite to the first surface; preparing a second substrate, where the second substrate includes a third surface and a fourth surface opposite to the third surface; bonding the first surface of the first substrate and the third surface of the second substrate with each other and forming a cavity between the first substrate and the pressure sensing region of the second substrate; removing the second base to form a fifth surface opposite to the third surface of the second substrate; and forming a first conductive plug passing through the second substrate from the side of the fifth surface of the second substrate to the at least one conductive layer..
Memsen Electronics Inc


Molded interconnect mircoelectromechanical system (mems) device package


A microelectromechanical system (mems) device package for encapsulating a mems device a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms either side walls or a divider of the mems device package and is adapted to route electrical connections from the mems device to either the substrate or a second mems device package via the substrate..
Robert Bosch Gmbh


Microelectromechanical (mems) manipulators for control of nanoparticle coupling interactions


A nanopositioning system for producing a coupling interaction between a first nanoparticle and a second nanoparticle. A first mems positioning assembly includes an electrostatic comb drive actuator configured to selectively displace a first nanoparticle in a first dimension and an electrode configured to selectively displace the first nanoparticle in a second dimensions.
Uchicago Argonne, Llc


Creep resistant reflective structure in mems display


This disclosure provides devices, systems, and methods for improving creep resistance and mechanical strength of a mems display device. The mems display device can include a movable reflective structure connected and supported by a support structure.
Qualcomm Mems Technologies, Inc.


A controlling the position of a mems mirror


According to the present invention there is provided a method of controlling the position of a mems mirror in a mems device, wherein the mems device comprises, a mems mirror, a magnet which provides a magnetic field (b), an actuating means which operatively cooperates with the mems mirror so that it can apply a force to the mems mirror which can tilt the mems mirror about at least one rotational axis when the actuating means is provided with a drive signal, wherein the magnitude force applied by the actuating means to the mems mirror is dependent on the amplitude of the drive signal, and a detection coil which is mounted on the mems mirror, the method comprising the steps of, detecting a change in the resistance (r) of the detection coil so as to detect a change in temperature of the mems mirror; determining the drive signal amplitude required to maintain the mems mirror at a predefined angular position (Θ); providing the actuating means with a drive signal which has an amplitude which is equal to the determined drive signal amplitude. .
Intel Corporation


Mems device positioning apparatus, test system, and test method


A positioning apparatus includes a support structure, a positioning structure, and a fixture for retaining mems devices. A shaft spans between the support structure and the positioning structure, and is configured to rotate about a first axis relative to the support structure in order to rotate the positioning structure and the fixture about the first axis.
Freescale Semiconductor, Inc.


Mems chip, measuring element and pressure sensor for measuring a pressure


A micro-electro-mechanical system (mems) chip for measuring a pressure in a pressure space includes a mems substrate having a measuring region, a contact-making region connected to the measuring region via lines and having contacts, and a bushing region disposed between the measuring region and the contact-making region. The mems substrate defines a cavity formed as a blind hole that defines an opening through one side of the mems substrate, the bottom of the blind hole forming a membrane.
Kistler Holding Ag


Self calibration for mirror positioning in optical mems interferometers


A micro-electro-mechanical system (mems) apparatus provides for self-calibration of mirror positioning of a moveable mirror of an interferometer. At least one mirror in the mems apparatus includes a non-planar surface.
Si-ware Systems


High-q mems gyroscope


A system and/or method for efficiently operating a mems gyroscope without drive circuitry and/or with drive circuitry and a non-constant oscillating amplitude. In a non-limiting example, drive circuitry may be utilized to drive the mems gyroscope proof mass to a desired oscillating amplitude, and then the drive circuitry may be powered off.
Invensense, Inc.


Semiconductor structure and manufacturing the same


A semiconductor structure and a method for manufacturing the same are provided. The semiconductor structure comprises a base substrate and a mems structure.
United Microelectronics Corp.


Stress relief mems structure and package


Stress relief structures and methods that can be applied to mems sensors requiring a hermetic seal and that can be simply manufactured are disclosed. The system includes a sensor having a first surface and a second surface, the second surface being disposed away from the first surface, the second surface also being disposed away from a package surface and located between the first surface and the package surface, a number of support members, each support member extending from the second surface to the package surface, the support members being disposed on and operatively connected to only a portion of the second surface.
Mks Instruments, Inc.


Gyro mems sensor package


An integrated circuit packaging structure comprises at least one micro electrical mechanical systems (mems) gyroscope die mounted directly on a multi-layer flexible substrate having at least one metal layer and wire-bonded to the flexible substrate and a lid or die coating protecting the mems die and wire bonds.. .
Compass Technology Company Limited


Mems components and wafer-level manufacturing thereof


A mems and a method of manufacturing mems components are provided. The method includes providing a mems wafer stack including a top cap wafer, a mems wafer and optionally a bottom cap wafer.
Motion Engine Inc.


Mems device including support structure and manufacturing


A micro-electro-mechanical system (mems) device and a manufacturing method are provided. The device includes top and bottom cap wafers and a mems wafer disposed between the top cap wafer and the bottom cap wafer.
Motion Engine Inc.


Vehicle suspension and controlling same


A vehicle suspension system having a twist beam axle including a crossbeam and two trailing arms connected thereto. The rear ends of each trailing arm, in the motor vehicle longitudinal direction, having with a wheel mount for fastening a motor vehicle wheel.
Ford Global Technologies, Llc




Mems topics:
  • Camera Module
  • Acceleration Sensor
  • Microelectromechanical Systems
  • Control Unit
  • Semiconductor Substrate
  • Semiconductor
  • Demodulation
  • Accelerometer
  • Calibration
  • Modulation
  • Mems Devices


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