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This page is updated frequently with new Mems-related patent applications. Subscribe to the Mems RSS feed to automatically get the update: related Mems RSS feeds. RSS updates for this page: Mems RSS RSS


Date/App# patent app List of recent Mems-related patents
04/30/15
20150118780
 Microelectromechanical system (mems) microphone with protection film and mems microphonechips at wafer level patent thumbnailnew patent Microelectromechanical system (mems) microphone with protection film and mems microphonechips at wafer level
A method to protect an acoustic port of a microelectromechanical system (mems) microphone is provided. The method includes: providing the mems microphone; and forming a protection film, on the acoustic port of the mems microphone.
Solid State System Co., Ltd.
04/30/15
20150117681
 Acoustic assembly and  manufacturing the same patent thumbnailnew patent Acoustic assembly and manufacturing the same
A microelectromechanical system (mems) microphone includes a base having a port extending there through. A mems die is coupled to the base, and the mems die includes a diaphragm and a back plate.
Knowles Electronics, Llc
04/30/15
20150117673
 Digital signal processing with acoustic arrays patent thumbnailnew patent Digital signal processing with acoustic arrays
Methods, systems, and techniques of digital signal processing using acoustic arrays are provided. Example embodiments described herein provide enhanced acoustic arrays that utilize mems digital microphones to offer greater control and measurement capabilities to users and systems that desire to measure sound typically to derive other data.
04/30/15
20150116297
 Circuits and methods for switching of mems systems patent thumbnailnew patent Circuits and methods for switching of mems systems
This disclosure provides systems, methods and apparatus for addressing an array of pixels in a display. In one aspect, an electromechanical device includes a movable element coupled between a first and second actuator, and a charge distribution circuit arranged to electronically couple the first actuator to the second actuator and capable of equalizing a potential between the first actuator and the second actuator.
Pixtronix, Inc.
04/30/15
20150116285
 Method and  electronic capture of  handwriting and drawing patent thumbnailnew patent Method and electronic capture of handwriting and drawing
With electronic documents increasingly replacing paper based ones there is a need to convert handwriting and drawing into electronic formats. Current solutions have significant drawbacks due to their bulkiness, cost and limited performance.
04/30/15
20150115377
 Mems device with integrated temperature stabilization patent thumbnailnew patent Mems device with integrated temperature stabilization
An apparatus for providing localized heating as well as protection for a vibrating mems device. A cap over a mems gyroscope includes an embedded temperature sensor and a heater.
Teledyne Scientific & Imaging, Llc
04/30/15
20150115376
 Mems device with outgassing shield patent thumbnailnew patent Mems device with outgassing shield
A capped micromachined device has a movable micromachined structure in a first hermetic chamber and one or more interconnections in a second hermetic chamber that is hermetically isolated from the first hermetic chamber, and a barrier layer on its cap where the cap faces the first hermetic chamber, such that the first hermetic chamber is isolated from outgassing from the cap.. .
Analog Devices, Inc.
04/30/15
20150115160
 Thermally shorted bolometer patent thumbnailnew patent Thermally shorted bolometer
In one embodiment, a mems sensor assembly includes a substrate, a first sensor supported by the substrate and including a first absorber spaced apart from the substrate, and a second sensor supported by the substrate and including (i) a second absorber spaced apart from the substrate, and (ii) at least one thermal shorting portion integrally formed with the second absorber and extending downwardly from the second absorber to the substrate thereby thermally shorting the second absorber to the substrate.. .
Robert Bosch Gmbh
04/30/15
20150114111
 Mems sensor and device having the same patent thumbnailnew patent Mems sensor and device having the same
Disclosed herein is an mems sensor, including: a sensor unit; and a substrate connected to the sensor unit, in which the substrate may be provided with a flexible printed circuit board (fpcb) to correspond to an outer peripheral portion of the sensor unit.. .
Samsung Electro-mechanics Co., Ltd.
04/23/15
20150111332
 Method and device of mems process control monitoring and packaged mems with different cavity pressures patent thumbnailMethod and device of mems process control monitoring and packaged mems with different cavity pressures
A method for fabricating an integrated mems device and the resulting structure therefore. A control process monitor comprising a mems membrane cover can be provided within an integrated cmos-mems package to monitor package leaking or outgassing.
Mcube Inc.
04/23/15
20150110672

Method for inducing apoptosis of disease cells and disease-causing microorganisms using plasma for bio-medical use


The present invention relates to a method for inducing apoptosis of disease cells and disease-causing micro-organisms using plasma for bio-medical use, the method comprising the steps of: generating plasma by means of a high-pressure plasma jet produced using a micro-electro-mechanical system (mems) technique; plasma-processing by applying a solution with the plasma; exposing cells to the plasma-processed solution; and inactivating disease cells and disease-causing micro-organisms from among the exposed cells. According to the present invention, after applying plasma to a solution such as a buffer solution or water, targets to be processed such as micro-organisms or animal or plant cells are exposed thereto, and thus the present invention can be used in both bio and medical fields, and has the benefit of effectively inducing apoptosis of disease cells and disease-causing micro-organisms with low power due to indirect processing..
Ajou University Industry-academic Cooperation Foundation
04/23/15
20150109588

Micro projector device and control method thereof


The present invention provides a micro projector device including a mems mirror, a laser source module, a detection module, and a control unit. The mems mirror has a first portion and a second portion, the first portion pivots to the second portion, and the first portion oscillates in relation to the second portion.
Lite-on It Corporation
04/23/15
20150108479

Thin-film transistors incorporated into three dimensional mems structures


This disclosure provides systems, methods and apparatus for forming electromechanical systems (ems) displays where the area of a substrate occupied by a pixel circuit can be reduced if portions of the pixel circuit can be built in three dimensions. In some aspects, certain ems displays can incorporate structures that are substantially normal to the surface of a substrate.
Pixtronix, Inc.
04/23/15
20150107367

Dual range high precision pressure sensor


A high-precision pressure sensor with two or more pressure ranges is formed from multiple micro-electromechanical system (mems) pressure transducers mounted inside a housing and coupled to sense a pressurized fluid. The non-linear outputs of the mems pressure transducers are linearized by a corresponding number of processors, preferably dsps, each processor being coupled to a corresponding mems pressure transducer and receiving the mems pressure transducer output signal there from.
Continental Automotive Systems, Inc.
04/23/15
20150107359

Piezoresistance sensor module and mems sensor having the same


Disclosed herein is a piezoresistance sensor module including: a piezoresistor, a depletion layer formed in a region of a portion of the piezoresistor, an insulator formed to cover the depletion layer and one surface of the piezoresistor, and a piezoelectric capacitor formed on the insulator so as to be opposite to the depletion layer.. .
Samsung Electro-mechanics Co., Ltd.
04/16/15
20150106768

Three dimensional user interface effects on a display by using properties of motion


The techniques disclosed herein use a compass, mems accelerometer, gps module, and mems gyrometer to infer a frame of reference for a hand-held device. This can provide a true frenet frame, i.e., x- and y-vectors for the display, and also a z-vector that points perpendicularly to the display.
Apple Inc.
04/16/15
20150104895

Method of fabricating mems devices having a plurality of cavities


A method for forming an integrated circuit having micro-electromechanical systems (mems) includes forming at least two recesses into a first layer, forming at least two recesses into a second layer, the at least two recesses of the second layer being complementary to the recesses of the first layer. An intermediate layer is bonded onto the second layer, the intermediate layer includes through-holes corresponding to the recesses of the second layer.
Taiwan Semiconductor Manufacturing Company, Ltd.
04/16/15
20150103391

Mems device with improved via support planarization


A microelectromechanical (mems) device has a movable member supported above a substrate on a via support. The member and via support are fabricated integrally from first and second member forming layers.
Texas Instruments Incorporated
04/16/15
20150103387

Shutter-based light modulators incorporating integrated sidewall reflectors


This disclosure provides systems, methods, and apparatus for a mems display incorporating integrated sidewall reflectors. The display can include a light blocking component suspended over a substrate.
Pixtronix, Inc.
04/16/15
20150103190

Image acquisition method and apparatus with mems optical image stabilization (ois)


An image acquisition sensor of a digital image acquisition apparatus is coupled to imaging optics for acquiring a sequence of images. Images acquired by the sensor are stored.
Digitaloptics Corporation Europe Limited
04/16/15
20150102866

Vibrator, oscillator, electronic device, and moving object


A mems vibrator includes: a substrate; a base portion which is disposed on the substrate; and a plurality of vibration portions which extend in directions different from each other from the base portion. The mems vibrator has a curved surface between the adjacent vibration portions..
Seiko Epson Corporation
04/16/15
20150102865

Vibrator, oscillator, electronic device, and moving object


A mems vibrator includes: a substrate; a base portion which is disposed on the substrate; and a plurality of vibration portions which extends in a direction that intersects with a normal line of the substrate from the base portion. In a planar view, when a length of the vibration portion in a direction in which the vibration portion extends from the base portion is l, and a length of the vibration portion in a direction that intersects with a direction in which the vibration portion extends from the base portion is w, a dimension ratio (l/w) of the vibration portion satisfies a relationship in which 0.2≦(l/w)≦7.0..
Seiko Epson Corporation
04/16/15
20150102835

Substrate plate for mems devices


A substrate plate is provided for at least one mems device to be mounted thereon. The mems device has a certain footprint on the substrate plate, and the substrate plate has a pattern of electrically conductive leads to be connected to electric components of the mems device.
Oce-technologies B.v.
04/16/15
20150102703

Vibrator, oscillator, electronic device, and moving object


A mems vibrator includes: a substrate; a supporting portion which is connected to the substrate; a base portion which is connected to the supporting portion; and a plurality of vibration portions which is separated from the substrate and extends in different directions from each other from the base portion, and in which the adjacent vibration portions vibrate in a phase of a reverse direction to each other. In the vibration portion, the base portion has a vibration node, and at least a part of the supporting portion is overlapped with the vibration node in a planar view..
Seiko Epson Corporation
04/16/15
20150102701

Micro-electro-mechanical system device with enhanced structural strength


The invention provides a mems device with enhanced structural strength. The mems device includes a plurality of metal layers, including a top metal layer with a plurality of metal segments.
Pixart Imaging Incorporation
04/16/15
20150102437

Mems sensor device with multi-stimulus sensing and fabrication


A device (20) includes sensors (30, 32, 34) that sense different physical stimuli. Fabrication (90) entails forming (92) a device structure (22) to include the sensors and coupling (150) a cap structure (24) with the device structure so that the sensors are interposed between the cap structure and a substrate layer (28) of the device structure.
Freescale Semiconductor, Inc.
04/16/15
20150102436

Pre-molded mems device package with conductive shell


A mems lead frame package body encloses a mems device enclosed in an internal cavity formed by the mold body and cover. A conductive internal shell with a connection window sits in the cavity.
Invensense, Inc.
04/16/15
20150102435

Mems microphone with membrane antennas


A mems microphone. The microphone includes a backplate, a membrane, and a plurality of antennas.
Robert Bosch Gmbh
04/16/15
20150102433

Package structure having mems element


A package structure having at least an mems element is provided, including a chip having electrical connecting pads and the mems element; a lid disposed on the chip to cover the mems element and having a metal layer provided thereon; first sub-bonding wires electrically connecting to the electrical connecting pads; second sub-bonding wires electrically connecting to the metal layer; an encapsulant disposed on the chip, wherein the top ends of the first and second sub-bonding wires are exposed from the encapsulant; and metallic traces disposed on the encapsulant and electrically connecting to the first sub-bonding wires. The package structure advantageously features reduced size, relatively low costs, diverse bump locations, and an enhanced emi shielding effect..
Siliconware Precision Industries Co., Ltd.
04/16/15
20150102390

Integrated cmos back cavity acoustic transducer and the producing the same


A mems device includes a mems substrate with a movable element. Further included is a cmos substrate with a cavity, the mems substrate disposed on top of the cmos substrate.
Invensense, Inc.
04/09/15
20150098167

Capacitor with electrodes made of an interconnected corrugated carbon-based network


Capacitors having electrodes made of interconnected corrugated carbon-based networks (iccns) are disclosed. The iccn electrodes have properties that include high surface area and high electrical conductivity.
The Regents Of The University Of California
04/09/15
20150097635

Piezoelectric multiplexer


A piezoelectric multiplexer includes an actuator and multiple piezo-morph beams. The actuator includes an actuator conducting head and an actuator stem, and each piezo-morph beam includes a conducting beam contact head and a beam stem manufactured out of piezo-morph material.
19th Space Electronics
04/09/15
20150097632

Vibrator, oscillator, electronic device, and moving object


A mems vibrator includes: a base portion; a plurality of vibration reeds which extends from the base portion; a supporting portion which extends from a vibration node portion of the base portion; a fixing portion which is connected with the supporting portion; and a substrate in which the fixing portion is disposed on a main surface. The plurality of vibration reeds is separated from the substrate..
Seiko Epson Corporation
04/09/15
20150097586

Micro-electro-mechanical system device and micro-electro- mechanical system compensation structure


This invention provides a mems device, including: a mass structure having at least one anchor; at least one flexible structure connected with the mass structure at the at least one anchor; a plurality of top electrodes located above the mass structure and forming a top capacitor circuit with the mass structure; and a plurality of bottom electrodes located under the mass structure and forming a bottom capacitor circuit with the mass structure. The projections of the plural top electrodes on the mass structure along a normal direction of the mass structure are located at opposite sides of the anchor, and the projections of the plural bottom electrodes on the mass structure along a normal direction of the mass structure are located at opposite sides of the anchor.
Pixart Imaging Incorporation
04/09/15
20150097468

Piezoelectric ultrasonic transducer array with switched operational modes


Switchable micromachined transducer arrays are described where one or more switches, or relays, are monolithically integrated with transducer elements in a piezoelectric micromachined transducer array (pmut). In embodiments, a mems switch is implemented on the same substrate as the transducer array for switching operational modes of the transducer array.
04/09/15
20150097253

Sealed mems devices with multiple chamber pressures


A mems apparatus has a substrate, a cap forming first and second chambers with the base, and movable microstructure within the first and second chambers. To control pressures, the mems apparatus also has a first outgas structure within the first chamber.
Analog Devices, Inc.
04/09/15
20150097215

Mechanisms for forming micro-electro mechanical system device


Embodiments of mechanisms for forming a micro-electro mechanical system (mems) device are provided. The mems device includes a cmos substrate and a mems substrate bonded with the cmos substrate.
Taiwan Semiconductor Manufacturing Co., Ltd.
04/09/15
20150096377

Systems and methods to determine stiction failures in mems devices


Various embodiments of the invention provide for stiction testing in mems devices, such as accelerometers. In certain embodiments, testing is accomplished by a high voltage smart circuit that enables an analog front-end circuit to accurately read the position of a movable proof-mass relative to a biased electrode in order to allow the detection of both contact and release conditions.
Maxim Integrated Products, Inc.
04/02/15
20150093817

Particle manipulation system with out-of plane channel


A particle manipulation system uses a mems-based, microfabricated particle manipulation device which has an inlet channel, output channels, and a movable member formed on a substrate. The movable member moves parallel to the fabrication plane, as does fluid flowing in the inlet channel.
Owl Biomedical, Inc.
04/02/15
20150093810

Particle manipulation system with out-of-plane channel and focusing element


A particle manipulation system uses a mems-based, microfabricated particle manipulation device, which has an inlet channel, output channels, and a movable member formed on a substrate. The movable member moves parallel to the fabrication plane, as does fluid flowing in the inlet channel.
Owl Biomedical, Inc.
04/02/15
20150092315

Tunable mems capacitor


A capacitive mems structure comprising first and second opposing capacitor electrode arrangements, wherein at least one of the electrode arrangements is movable, and a dielectric material located adjacent to the second electrode arrangement, wherein the second electrode arrangement is patterned such that it includes electrode areas and spaces adjacent to the electrode areas, and wherein the dielectric material extends at least partially in or over the spaces.. .
Nxp B.v.
04/02/15
20150092274

Optical filter device, optical module, electronic device, and mems device


An optical filter device includes a wavelength variable interference filter, a housing that stores the wavelength variable interference filter, and a bonding member that fixes a movable substrate to the housing. The housing includes a fixing portion that comes into contact with the bonding member, the fixing portion includes a pedestal fixing surface (first surface) facing a portion of a surface of the movable substrate, a sidewall fixing surface (second surface), continuous with a portion of a periphery of the pedestal fixing surface, which faces a lateral side of the movable substrate, and an intersection surface (third surface) continuous from a remaining portion in a periphery of the pedestal fixing surface in a direction away from the movable substrate, and the bonding member is provided between the substrate surface and the pedestal fixing surface, and between the lateral side and the sidewall fixing surface..
Seiko Epson Corporation
04/02/15
20150092261

Micromechanical flexure design using sidewall beam fabrication technology


This disclosure provides systems, methods and apparatus utilizing flexures in a display. In some implementations, an electromechanical systems (ems) device can include flexures that have low stiffness along the axis of motion of a light modulator, and high stiffness in other directions.
Pixtronix, Inc.
04/02/15
20150092118

Display device for vehicle


Provided is a display device for a vehicle that can, in a configuration in which the cost of parts is curbed, quickly raise the temperature of a laser light source (ld) in a low temperature environment, and quickly perform stable image output. The lds (11, 12, 13) emit laser light (rgb) and an mems mirror (30) scans the laser light (rgb) and generates a display image (m).
Nippon Seiki Co., Ltd.
04/02/15
20150091911

Movable mems element with stiction mitigating spring


Systems, methods and methods of manufacture for, among other things, a mems device may be provided with a pair of electrodes that are separated by a gap. At least one of the electrodes is movable toward the other electrode.
Pixtronix, Inc.
04/02/15
20150091411

Method of manufacturing a device with a cavity


A micro-device includes a substrate with a cavity. The cavity is covered with a porous layer that is permeable to vapor hydrofluoric acid (hf) etchant.
Taiwan Semiconductor Manufacturing Company, Ltd.
04/02/15
20150091167

Stress buffer layer for integrated microelectromechanical systems (mems)


Stress buffer layers for integrated microelectromechanical systems (mems) are described. For example, a semiconductor package includes a substrate having first and second surfaces, the second surface having an array of external conductive contacts.
04/02/15
20150091153

Wafer level sealing methods with different vacuum levels for mems sensors


The present disclosure relates to a method of forming a plurality of mems device having a plurality of cavities with different pressures on a wafer package system, and an associated apparatus. In some embodiments, the method is performed by providing a work-piece having a plurality of microelectromechanical system (mems) devices.
Taiwan Semiconductor Manufacturing Co., Ltd.
04/02/15
20150091140

Multiple silicon trenches forming mems sealing cap wafer and etching mask structure thereof


A multiple silicon trenches forming method and an etching mask structure, the method comprises: step s11, providing a mems sealing cap silicon substrate (100); step s12, forming n stacked mask layers (101, 102, 103) on the mems sealing cap silicon substrate (100), after forming each mask layer, photolithographing and etching the mask layer and all other mask layers beneath the same to form a plurality of etching windows (d1, d2, d3); step s13, etching the mems sealing cap silicon substrate by using the current uppermost mask layer and a layer of mask material beneath the same as a mask; step s14, removing the current uppermost mask layer; step s15, repeating the step s13 and the step s14 until all the n mask layers are removed. The present invention can form a plurality of deep trenches with high aspect ratio on the mems sealing cap silicon substrate using conventional semiconductor processes, avoiding the problem that the conventional spin coating cannot be conducted on a sealing cap wafer with deep trenches using photoresist..
Hangzhou Silan Integrated Circuit Co., Ltd
04/02/15
20150091107

Die bond design for medium pressure sensor


A micro-electromechanical pressure transducer formed from a silicon die centers itself on a pedestal, formed from either a metal or a dielectric, by applying a predetermined amount of liquid epoxy adhesive to the square, top surface of the pedestal and allowing the liquid adhesive to distribute itself over the top surface. A mems die placed atop the liquid adhesive is centered on the top surface by surface tension between sides of the die and the top surface..
Continental Automotive Systems, Inc.
04/02/15
20150090043

Mems


Embodiments provide a mems including a mems device and an detector circuit. The mems device includes a membrane, wherein a material of the membrane comprises a band gap and a crystal structure with structural elements (unit cells) connected by covalent bonds in two dimensions only.
Infineon Technologies Ag
03/26/15
20150086043

System and adjusting microphone functionality


An adjustable microphone. The microphone includes a mems microphone, a charge pump, a preamplifier, a first analog-to-digital converter, a root mean square (rms) power detector, and a logic circuit.
Robert Bosch Gmbh
03/26/15
20150085363

Mems-based optical image stabilization


In one example, a camera is provided that includes: a plurality of mems electrostatic comb actuators, each actuator operable to exert a force on at least one lens; and an optical image stabilization (ois) algorithm module operable to command the plurality of actuators to actuate the at least one lens responsive to motion of the camera.. .
Digitaloptics Corporation Mems
03/26/15
20150084139

Device, providing mems structures of a semiconductor package


Techniques and mechanisms for providing precisely fabricated structures of a semiconductor package. In an embodiment, a build-up carrier of the semiconductor package includes a layer of porous dielectric material.
03/26/15
20150082884

Piezoelectric actuator module, manufacturing the same, and mems sensor having the same


An actuator includes a multi-layer part having a multilayered piezoelectric part comprising a plurality of piezoelectric bodies and an electrode part connected to the multilayered piezoelectric part, and a support part displaceably supporting the multi-layer part. The multilayered piezoelectric part is polled in the same direction.
Samsung Electro-mechanics Co., Ltd.
03/19/15
20150078707

Mems-based levers and their use for alignment of optical elements


A mems based alignment technology based on mounting an optical component on a released micromechanical lever configuration that uses multiple flexures rather than a single spring. The optical component may be a lens.
Kaiam Corp.
03/19/15
20150078587

Adjustable ventilation openings in mems structures


A mems structure and a method for operation a mems structure are disclosed. In accordance with an embodiment of the present invention, a mems structure comprises a substrate, a backplate, and a membrane comprising a first region and a second region, wherein the first region is configured to sense a signal and the second region is configured to adjust a threshold frequency from a first value to a second value, and wherein the backplate and the membrane are mechanically connected to the substrate..
Infineon Technologies Ag
03/19/15
20150076923

Systems and methods for mems-based cross-point electrical switching


A microelectromechanical systems (mems)-based n×m cross-point switch, a mems-based system, and a method provide mems-based cross-point electrical switching for a layer 0 flow-based switch. The n×m cross-point switch includes n inputs each at least 10 gbps, m output each at least 10 gbps, a plurality of radio frequency (rf) mems switches selectively interconnecting the n inputs to the m outputs; and control and addressing circuitry to selectively control the plurality of rf mems switches to switch each of the n inputs to a corresponding output of the m outputs.
Ciena Corporation
03/19/15
20150076631

Reduction of chipping damage to mems structure


A mems (microelectromechanical systems) structure comprises a mems wafer. A mems wafer includes a cap with cavities bonded to a structural layer through a dielectric layer disposed between the cap and the structural layer.
Invensense, Inc.
03/19/15
20150076627

Mems-microphone with reduced parasitic capacitance


A mems microphone with reduced parasitic capacitance is provided. A microphone includes a protection film covering a rim-sided area of the backplate..
Epcos Ag


Popular terms: [SEARCH]

Mems topics: Camera Module, Acceleration Sensor, Microelectromechanical Systems, Control Unit, Semiconductor Substrate, Semiconductor, Demodulation, Accelerometer, Calibration, Modulation, Mems Devices

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