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Mems patents



      
           
This page is updated frequently with new Mems-related patent applications. Subscribe to the Mems RSS feed to automatically get the update: related Mems RSS feeds. RSS updates for this page: Mems RSS RSS


Integrated circuit package and method

Texas Instruments

Integrated circuit package and method

Mechanisms for forming micro-electro mechanical system device

Taiwan Semiconductor Manufacturing

Mechanisms for forming micro-electro mechanical system device

Mechanisms for forming micro-electro mechanical system device

Infineon Technologies Ag

Mems device

Date/App# patent app List of recent Mems-related patents
01/22/15
20150024536
 Mems device and  manufacturing a mems device patent thumbnailnew patent Mems device and manufacturing a mems device
Mems devices with a rigid backplate and a method of making a mems device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate and a backplate supported by the substrate.
Infineon Technologies Ag
01/22/15
20150024534
 Two degree of freedom dithering platform for mems sensor calibration patent thumbnailnew patent Two degree of freedom dithering platform for mems sensor calibration
Systems and methods for two degree of freedom dithering for micro-electromechanical system (mems) sensor calibration are provided. In one embodiment, a method for a device comprises forming a mems sensor layer, the mems sensor layer comprising a mems sensor and an in-plane rotator to rotate the mems sensor in the plane of the mems sensor layer.
Honeywell International Inc.
01/22/15
20150023529
 Mems devices, interface circuits, and methods of making thereof patent thumbnailnew patent Mems devices, interface circuits, and methods of making thereof
In accordance with an embodiment of the present invention, a micro-electro-mechanical system (mems) device includes a first plate, a second plate disposed over the first plate, and a first moveable plate disposed between the first plate and the second plate. The mems device further includes a second moveable plate disposed between the first moveable plate and the second plate..
Infineon Technologies Ag
01/22/15
20150022872
 Method of manufacturing a mems micro-mirror assembly patent thumbnailnew patent Method of manufacturing a mems micro-mirror assembly
According to the present invention there is provided a method of manufacturing a mems micro mirror assembly (250), comprising the step of mounting a pcb board (205) on a metallic plate (206), mounting a mems device (240) on the pcb board (205), wherein the mems device (240) comprises a mems die (241) and a magnet (230).. .
Lemoptix Sa
01/22/15
20150022568
 Image display device patent thumbnailnew patent Image display device
The white balance for a high brightness region and a low brightness region is improved in an image display device using mems and a laser light source. An image processing unit of the device superposes a signal based on a first measured value of a light quantity at a first temperature on a picture signal, during its blanking period, which is supplied to the laser light source, and superposes a high frequency signal on the picture signal during its effective scanning period.
Hitachi Media Electronics Co., Ltd.
01/22/15
20150022431
 Stress tolerant mems accelerometer patent thumbnailnew patent Stress tolerant mems accelerometer
A micro-electro-mechanical system (mems) accelerometer employing a rotor and stator that are both released from a substrate. In embodiments, the rotor and stator are each of continuous a metal thin film.
01/22/15
20150021723
 Mechanisms for forming micro-electro mechanical system device patent thumbnailnew patent Mechanisms for forming micro-electro mechanical system device
Embodiments of mechanisms for forming a micro-electro mechanical system (mems) device are provided. The mems device includes a substrate and a mems structure over the substrate, and the mems structure has a movable element.
Taiwan Semiconductor Manufacturing Co., Ltd.
01/22/15
20150021722
 Mems device patent thumbnailnew patent Mems device
A mems device includes a membrane comprising a first plurality of fingers. A counter electrode arrangement includes a second plurality of fingers disposed in a interdigitated relationship with the first plurality of fingers of the membrane.
Infineon Technologies Ag
01/22/15
20150021721
 Integrated circuit package and method patent thumbnailnew patent Integrated circuit package and method
A method of forming a packaged electronic device includes fabricating a mems structure, such as a baw structure, on a first semiconductor wafer substrate; forming a cavity in a second semiconductor wafer substrate; and mounting the second substrate on the first substrate such that the mems structure is positioned inside the cavity in the second substrate. A wafer level assembly and an integrated circuit package are also described..
Texas Instruments Incorporated
01/22/15
20150021718
 Apparatus and  reduced strain on mems devices patent thumbnailnew patent Apparatus and reduced strain on mems devices
A method and apparatus for coupling a mems device to a substrate is disclosed. The method includes providing a substrate with a conductor disposed over the substrate, adhering the mems device to the substrate, wherein a first elastomer adheres the mems device to the substrate.
Invensense, Inc.
01/22/15
20150021717
new patent

Reducing microelectromechanical systems stiction by formation of a silicon carbide layer


A mechanism is provided for reducing stiction in a mems device by forming a near-uniform silicon carbide layer on silicon surfaces using carbon from teos-based silicon oxide sacrificial films used during fabrication. By using the teos as a source of carbon to form an antistiction coating, all silicon surfaces can be coated, including those that are difficult to coat using standard self-assembled monolayer (sam) processes (e.g., locations beneath the proof mass).
01/15/15
20150019129

Portable device for determining azimuth


A device is described herein for determining azimuth comprising a mems inertial measurement unit (imu), a gps system comprising a gps antenna and receiver, and a processor configured to receive data from said imu and from said gps system, said processor being configured to process said imu data and said gps data to derive a true north reference based on said imu data and said gps data. A method for determining azimuth is also described herein..
Atlantic Inertial Systems Limited
01/15/15
20150015489

System and digital recording of handpainted, handdrawn and handwritten information


A system and method of digital recording of painted, drawn and written information and navigating a cursor on the display defined by free moving at least one part of a painter body has steps of providing a computing device with a display serving as a digital electronic canvas; providing an input device comprising: an interchangeable end-point; a single mems sensor of mechanical parameters integrated on a semiconductor substrate chip, which is included in the interchangeable end-point; providing any working surface suitable for moving the input device relative to the working surface in a process of painting, drawing, writing or cursor navigating; moving the input device with at least one part of a painter body such that the interchangeable end-point is interacting with the working surface while recording the change of a vectors of mechanical parameters applied to the sensor; digitizing this information and processing the data related to the change of the vectors of mechanical parameters; and providing a description in digital format of how the input device has been moved over and how it has been pressed to the working surface based on the change of the corresponding vectors of mechanical parameters.. .
01/15/15
20150014798

Assembly for a mems environmental sensor device having improved resistance, and corresponding manufacturing process


Described herein is an assembly for a mems sensor device, which envisages: a first body made of semiconductor material, integrating a micromechanical detection structure at a first main face thereof; a cap element, set stacked on the first main face of the first body, above the micromechanical detection structure; and an adhesion structure set between the first body and the cap element, defining a gap in a position corresponding to the micromechanical detection structure. At least one first opening is defined through the adhesion structure in fluidic communication with the gap..
Stmicroelectronics International N.v.
01/15/15
20150014797

Mems device having a microphone structure, and the production thereof


A microphone structure of an mems device has a layer construction including: a base substrate; a deflectable microphone diaphragm at least partly spanning a through-opening in the substrate; a deflectable electrode of a microphone condenser system; a stationary counter-element having ventilation openings situated in the layer construction over the microphone diaphragm and acting as a bearer for a stationary electrode of the microphone condenser system. The diaphragm is bonded into the layer construction on the substrate via a flexible beam.
Robert Bosch Gmbh
01/15/15
20150014796

Device with mems structure and ventilation path in support structure


A device includes a support structure, a sound port disposed in the support structure, and a mems structure including a membrane acoustically coupled to the sound port. The membrane separates a first space contacting a first side of the membrane from a second space contacting an opposite second side of the membrane.
Infineon Technologies Ag
01/15/15
20150014755

Janus complementary mems transistors and circuits


A method of fabricating an electromechanical device includes the following steps. A first and a second back gate are formed over a substrate.
International Business Machines Corporation
01/08/15
20150013037

Thermal measurements using multiple frequency atomic force microscopy


Apparatus and techniques for extracting information carried in higher eigenmodes or harmonics of an oscillating cantilever or other oscillating sensors in atomic force microscopy and related mems work are described. Similar apparatus and techniques for extracting information from piezoelectric, polymer and other materials using contact resonance with multiple excitation signals are also described..
Asylum Research Corporation
01/08/15
20150010191

Gradient micro-electro-mechanical systems (mems) microphone


In at least one embodiment, a micro-electro-mechanical systems (mems) microphone assembly is provided. The assembly includes an enclosure, a mems transducer, and a plurality of substrate layers.
Harman International Industries, Inc.
01/08/15
20150010031

Wavelength-tunable vertical cavity surface emitting laser for swept source optical coherence tomography system


A wavelength-tunable vertical-cavity surface-emitting laser (vcsel) with the use of micro-electromechanical system (mems) technology is provided as a swept source for optical coherence tomography (oct). The wavelength-tunable vcsel comprises a bottom mirror of the vcsel, an active region, and a mems tunable upper mirror movable by electrostatic deflections.
Inphenix, Inc.
01/08/15
20150010026

Mems based swept laser source


A mems-based swept laser source is formed from two coupled cavities. The first cavity includes a first mirror and a fully reflective moveable minor and operates to tune the output wavelength of the laser.
Si-ware Systems
01/08/15
20150009549

Mems micro-mirror assembly


A mems micro-mirror assembly (250, 300, 270, 400) comprising, a mems device (240) which comprises a mems die (241) and a magnet (231); a flexible pcb board (205) to which the mems device (240) is mechanically, and electrically, connected; wherein the flexible pcb board (205) further comprises a first extension portion (205b) which comprises a least one electrical contact (259a,b) which is useable to electrically connect the mems micro-mirro rassembly (250, 300, 270, 400) to another electrical component). There is further provided a projection system comprising such a mems micro-mirror assembly (250, 300, 270, 400)..
Lemoptix Sa
01/08/15
20150008932

Charged particle detector


A system and method comprising a charger for ionizing aerosols; a spectrometer coupled to the charger and operable to select for a predetermined particle size; a porous charge collector coupled to the spectrometer, and a mems electrometer. In some embodiments the charge collector may be a metal frit electrically coupled to the electrometer.
Brechtel Manufacturing, Inc.
01/08/15
20150008788

Low temperature ceramic microelectromechanical structures


A method of providing microelectromechanical structures (mems) that are compatible with silicon cmos electronics is provided. The method providing for processes and manufacturing sequences limiting the maximum exposure of an integrated circuit upon which the mems is manufactured to below 350° c., and potentially to below 250° c., thereby allowing direct manufacturing of the mems devices onto electronics, such as si cmos circuits.
The Royal Institution For The Advancement Of Learning / Mcgill University
01/08/15
20150008545

Technique for forming a mems device


An apparatus is formed on a substrate including at least one semiconductor device. The apparatus includes a microelectromechanical system (mems) device comprising at least one of a portion of a first structural layer and a portion of a second structural layer formed above the first structural layer.
Silicon Laboratories Inc.
01/08/15
20150008543

Mems capacitive pressure sensors and fabrication method thereof


A mems capacitive pressure sensor is provided. The mems capacitive pressure sensor includes a substrate having a first region and a second region, and a first dielectric layer formed on the substrate.
Semiconductor Manufacturing International (shanghai) Corporation
01/08/15
20150008541

Mems pressure sensors and fabrication method thereof


A mems capacitive pressure sensor is provided. The pressure sensor includes a substrate having a first region and a second region, and a first dielectric layer formed on the substrate.
Semiconductor Manufacturing International (shanghai) Corporation
01/08/15
20150008540

Mems-cmos integrated devices, and methods of integration at wafer level


A method for forming an integrated semiconductor device includes providing a first wafer, providing a second wafer, and bonding the first wafer over the second wafer. The first wafer includes a first substrate having a microelectromechanical system (mems) device layer.
Taiwan Semiconductor Manufacturing Co., Ltd.
01/08/15
20150007656

Reducing the effect of glass charging in mems devices


A method of controlling exposed glass charging in a micro-electro-mechanical systems (mems) device is disclosed. The method includes providing a mems device comprising a proof mass positioned apart from at least one sense plate and at least one outboard metallization layer, wherein at least one conductive glass layer is coupled to the sense plate and the outboard metallization layer, the conductive glass layer including at least one exposed glass portion near the proof mass; and applying a first voltage to the sense plate and a second voltage to the outboard metallization layer.
Honeywell International Inc.
01/01/15
20150006778

Integrated data concentrator for multi-sensor mems systems


An integrated data concentrator, so-called “sensor hub”, for a multi-sensor mems system, implements: a first interface module, for interfacing, in a normal operating mode, with a microprocessor through a first communication bus; and a second interface module, for interfacing, in the normal operating mode, with a plurality of sensors through a second communication bus; the sensor hub further implements a pass-through operating mode, distinct from the normal operating mode, in which it sets the microprocessor in direct communication with the sensors, through the first communication bus and the second communication bus. In particular, the sensor hub implements the direct pass-through operating mode in a totally digital manner..
Stmicroelectronics S.r.l
01/01/15
20150006181

Digital voice processing headset computer


The invention is a multi-microphone voice processing soc primarily for head worn applications. It bypasses the use of conventional pre-amp voice codec (adc/dac) chips all together by replacing their functionality with digital mems microphone(s) and digital speaker driver (dsd).
Kopin Corporation
01/01/15
20150004936

Unlocking mobile terminal and unlocking method


A mobile terminal includes a touchpad, a background system, and a mems gyroscope. The background system includes a control module, an indicating needle displaying module, and a divided circle displaying module.
Hon Hai Precision Industry Co., Ltd.
01/01/15
20150004739

Method for embedding controlled-cavity mems package in integration board


A method for fabricating a micro-electro-mechanical system (mems) provides a semiconductor chip having a cavity with a radiation sensor mems. The opening of the cavity at the chip surface is covered by a plate transmissive to the radiation sensed by the mems.
Texas Instruments Incorporated
01/01/15
20150004732

Method of fabricating integrated structure for mems device and semiconductor device


A method of fabricating an integrated structure for mems device and semiconductor device comprises steps of: providing a substrate having a transistor thereon in a semiconductor device region and a first mems component thereon in a mems region; performing a interconnect process on the substrate in the semiconductor device region to form a plurality of first dielectric layers, at least a conductive plug and at least a conductive layer in the first dielectric layers; forming a plurality of second dielectric layers and an etch stopping device in the second dielectric layers on the substrate in a etch stopping device region; forming a plurality of third dielectric layers and at least a second mems component in the third dielectric layers on the substrate in the mems region; and performing an etching process to remove the third dielectric layers in the mems region.. .
United Microelectronics Corp.
01/01/15
20150004272

Collection of process data using in-situ sensors


A system is provided for collecting data during vacuum molding of a composite part using a mold including an air tight, flexible membrane sealed to a tool. The system comprises a plurality of mems sensors coupled with the interior of the mold at different locations over the part.
The Boeing Company
01/01/15
20150002984

Method of forming a magnetic mems tunable capacitor


An apparatus including a die; a carrier coupled to the die; and at least one capacitor positioned in or on the carrier, the at least one capacitor including a first electrode, a second electrode and a dielectric material; and a magnet positioned such that a magnetic field at least partially actuates the second electrode toward the first electrode. A method including disposing a die, a first electrode of a capacitor and a magnet on a sacrificial substrate; forming a dielectric layer on the first electrode; patterning a conductive material coupled to the first electrode; patterning a second electrode on the dielectric layer; and removing the sacrificial substrate.
01/01/15
20150002982

Recovery mems devices


Various embodiments of the invention reduce stiction in a wide range of mems devices and increase device reliability without negatively impacting performance. In certain embodiments, stiction recover is accomplished by applying electrostatic forces to electrodes via optimized voltage signals that generate a restoring force that aids in overcoming stiction forces between electrodes.
Maxim Integrated Products, Inc.
01/01/15
20150002916

Mems manufacturing and using same


A micro electro mechanical systems (mems) device includes a rotor having first rotor teeth and second rotor teeth formed in at least two layers of silicon-on-insulator (soi) substrate. Each rotor tooth belonging to the first rotor teeth is formed in a first layer and each rotor tooth belonging of the second rotor teeth is formed in a second layer.
Stmicroelectronics International N.v.
01/01/15
20150002832

Lithographic apparatus comprising a support for holding an object, and a support for use therein


A lithographic apparatus has a support that is provided with burls for holding an object. The support has been fabricated with a lithographic manufacturing method, e.g., a mems-technology, so as to create burls whose orientations or positions are individually electrically controllable..
Asml Netherlands B.v.
01/01/15
20150002726

Integrated lens barrel, actuator, and mems snubber systems and methods


Techniques are disclosed for systems and methods to provide concomitant mechanical motion inhibition and electrical distribution for actuator modules, such as microelectromechanical systems (mems) based optical actuators adapted to move and/or orient one or more lenses and/or optical devices of a camera module. A mechanical motion inhibition and electrical distribution system may include one or more flexible snubber structures disposed substantially adjacent a mems structure and between the mems structure and another component of a camera module.
Digitaloptics Corporation
01/01/15
20150002423

Unlocking device and mobile terminal


An unlocking device includes a touchpad, a background system, and an mems gyroscope. The background system includes a control module, a roll ball displaying module, and a moving area displaying module.
Hon Hai Precision Industry Co., Ltd.
01/01/15
20150001653

Mems structural component including a deflectable diaphragm and a fixed counter-element as well as a manufacturing it


For simplifying the manufacture of a mems structural component including a deflectable diaphragm which spans an opening in the rear side of the structural component, and including a fixed counter-element, which is provided with passage openings, the counter-element from the base substrate of the mems structural component is patterned and the deflectable diaphragm is implemented in a layered structure on the base substrate. These measures are intended to improve the diaphragm properties and reduce the overall height of the mems structural component..
Robert Bosch Gmbh
01/01/15
20150001651

Mems device having a suspended diaphragm and manufacturing process thereof


A mems device wherein a die of semiconductor material has a first face and a second face. A diaphragm is formed in or on the die and faces the first surface.
Stmicroelectronics S.r.i.
01/01/15
20150001649

Mems apparatus on a lid with flexible substrate


A micro electro mechanical system (mems) assembly includes a flexible substrate and a lid having an underside. The lid has a port extending there through, and the lid is coupled to the port.
01/01/15
20150001648

Mems microphone


A micro-electro mechanical system (mems) microphone includes: a printed circuit substrate; a mems chip that is combined with the printed circuit substrate and has a mems inner space; and a case that is combined with the printed circuit substrate, accommodates the mems chip, and forms an inner space that is separated from an external space, wherein the case is a double-type case including an inner case and an outer case, a medium acoustic path space is formed between the inner case and the outer case, and the printed circuit substrate includes a substrate acoustic path that connects the medium acoustic path space to the mems inner space of the mems chip so that external sound passing through the sound hole enters the mems inner space of the mems chip after passing through the medium acoustic path space.. .
Bse Co., Ltd.
01/01/15
20150001647

Mems microphone with low pressure region between diaphragm and counter electrode


A mems microphone includes a first diaphragm element, a counter electrode element, and a low pressure region between the first diaphragm element and the counter electrode element. The low pressure region has a pressure less than an ambient pressure..
Infineon Technologies Ag
01/01/15
20150001645

Mems device incorporating a fluidic path, and manufacturing process thereof


A mems device wherein a die of semiconductor material has a first face and a second face. A membrane is formed in or on the die and faces the first surface.
Stmicroelectronics International N.v.
01/01/15
20150001632

Mems device and fabrication method


Mems devices and methods for forming the same are provided. A first metal interconnect structure is formed on a first semiconductor substrate to connect to a cmos control circuit in the first semiconductor substrate.
Semiconductor Manufacturing International (shanghai) Corporation
01/01/15
20150000402

Oscillation frequency measuring a mems sensor


A mems sensor has at least a movable element designed to oscillate at an oscillation frequency, and an integrated measuring system coupled to the movable element to provide a measure of the oscillation frequency. The measuring system has a light source to emit a light beam towards the movable element and a light detector to receive the light beam reflected back from the movable element, including a semiconductor photodiode array.
Stmicroelectronics S.r.l.
01/01/15
20150000400

Integrated microelectromechanical gyroscope with improved driving structure


An integrated mems gyroscope, is provided with: at least a first driving mass driven with a first driving movement along a first axis upon biasing of an assembly of driving electrodes, the first driving movement generating at least one sensing movement, in the presence of rotations of the integrated mems gyroscope; and at least a second driving mass driven with a second driving movement along a second axis, transverse to the first axis, the second driving movement generating at least a respective sensing movement, in the presence of rotations of the integrated mems gyroscope. The integrated mems gyroscope is moreover provided with a first elastic coupling element, which elastically couples the first driving mass and the second driving mass in such a way as to couple the first driving movement to the second driving movement with a given ratio of movement..
Stmicroelectronics S.r.l.
12/25/14
20140376749

Double backplate mems microphone with a single-ended amplifier input port


A double backplate microphone having a good signal-to-noise ratio and being produceable at reduced manufacturing costs is provided. A microphone comprises a first backplate bp1, a second backplate bp2 and a membrane m.
Epcos Ag
12/25/14
20140375969

Mems-based rapidscan device and projector having same


A device projecting images by micro electro-mechanical system (mems) technology mirrors includes a base, a first substrate, a first reflective mirror, a second substrate, and a second reflective mirror. The first substrate and the second substrate are adjacently positioned on the base.
Hon Hai Precision Industry Co., Ltd.
12/25/14
20140374856

Apparatus and preventing stiction of mems devices encapsulated by active circuitry


One or more stopper features (e.g., bump structures) are formed in a standard asic wafer top passivation layer for preventing mems device stiction vertically in integrated devices having a mems device capped directly by an asic wafer. A tin coating may be used on the stopper feature(s) for anti-stiction.
Analog Devices, Inc.
12/25/14
20140374854

Vertical mount package and wafer level packaging therefor


Vertical mount packages and methods for making the same are disclosed. A method for manufacturing a vertical mount package includes providing a device substrate with a plurality of device regions on a front surface, and a plurality of through-wafer vias.
Analog Devices, Inc.
12/25/14
20140374852

Electrical shielding in a mems leadframe package


A lead frame packaged electronic chip. The packaged electronic chip includes a mems device, an integrated circuit and a wire bond electrically coupling the mems device and the integrated circuit.
Analog Devices, Inc.
12/25/14
20140374851

Mems device and fabricating mems devices


A method (60) entails providing a substrate (34) with a structural layer (30) having a thickness (40). A partial etch process is performed at locations (82) on the structural layer (30) so that a portion (92) of the structural layer (30) remains at the locations (82).
Freescale Semiconductor, Inc.
12/25/14
20140374850

Apparatus and shielding and biasing in mems devices encapsulated by active circuitry


One or more conductive shielding plates are formed in a standard asic wafer top metal layer, e.g., for blocking cross-talk from mems device structure(s) on the mems wafer to circuitry on the asic wafer when the mems device is capped directly by the asic wafer in a wafer-level chip scale package. Generally speaking, a shielding plate should be at least slightly larger than the mems device structure it is shielding (e.g., a movable mems structure such as an accelerometer proof mass or a gyroscope resonator), and the shielding plate cannot be in contact with the mems device structure during or after wafer bonding.
Analog Devices, Inc.
12/25/14
20140374847

Packaging mems devices


In a method of packaging micro-electro-mechanical systems (mems) devices, an interposer board is provided having a first surface and an opposing second surface, with the interposer board including a plurality of electrical contacts on the second surface. A plurality of shim layers are bonded to the first surface of the interposer board, and a plurality of mems dies are each separately bonded to a respective one of the shim layers.
Honeywell International Inc.


Popular terms: [SEARCH]

Mems topics: Camera Module, Acceleration Sensor, Microelectromechanical Systems, Control Unit, Semiconductor Substrate, Semiconductor, Demodulation, Accelerometer, Calibration, Modulation, Mems Devices

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