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Mems patents



      
           
This page is updated frequently with new Mems-related patent applications.



Date/App# patent app List of recent Mems-related patents
01/28/16
20160029129 
 Biasing circuit for a mems acoustic transducer with reduced start-up time patent thumbnailBiasing circuit for a mems acoustic transducer with reduced start-up time
A mems acoustic transducer device has a capacitive microelectromechanical sensing structure and a biasing circuit. The biasing circuit includes a voltage-boosting circuit that supplies a boosted voltage on an output terminal, and a high-impedance insulating circuit element set between the output terminal and a terminal of the sensing structure, which defines a first high-impedance node associated with the insulating circuit element.
Stmicroelectronics S.r.l.


01/28/16
20160029126 
 Mems membrane overtravel stop patent thumbnailMems membrane overtravel stop
A micro electrical mechanical system (mems) device in one embodiment includes a substrate defining a back cavity, a membrane above the back cavity, a back plate above the membrane, and a first overtravel stop (ots) positioned at least partially directly beneath the membrane and supported by the back plate.. .
Robert Bosch Gmbh


01/28/16
20160027601 
 Encapsulated micro-electromechanical system switch and  manufacturing the same patent thumbnailEncapsulated micro-electromechanical system switch and manufacturing the same
Encapsulated mems switches are disclosed along with methods of manufacturing the same. A first sacrificial layer is used to form the actuation member of the mems switch.
Rf Micro Devices, Inc.


01/28/16
20160025492 
 Mems gyroscope for determining rotational movements about an x, y, and/or z axis patent thumbnailMems gyroscope for determining rotational movements about an x, y, and/or z axis
The invention relates to a mems gyroscope for detecting rotational motions about an x-, y-, and/or z-axis, in particular a 3-d sensor, containing a substrate, several, at least two, preferably four, drive masses (2) that are movable radially with respect to a center and drive elements (7) for the oscillating vibration of the drive masses (2) in order to generate coriolis forces on the drive masses (2) in the event of rotation of the substrate about the x-, y-, and/or z-axis. The oscillating drive masses (2) are connected to at least one further non-oscillating sensor mass (3) that however can be rotated about the x-, y-, and/or z-axis together with the oscillating drive masses (2) on the substrate.
Maxim Integrated Products, Inc.


01/28/16
20160023892 
 Radio frequency (rf) microelectromechanical systems (mems) devices with gold-doped silicon patent thumbnailRadio frequency (rf) microelectromechanical systems (mems) devices with gold-doped silicon
The present disclosure relates to radio frequency (rf) microelectromechanical system (mems) device packaging, and specifically to reducing harmonic distortion caused by such packaging. In one embodiment, a die is provided that employs a gold-doped silicon substrate, wherein at least one rf mems device is disposed on the gold-doped silicon substrate.
Rf Micro Devices, Inc.


01/28/16
20160023891 
 Component including a mems element and a cap structure including a media connection port patent thumbnailComponent including a mems element and a cap structure including a media connection port
A structural concept for components includes a mems element, the micromechanical function of which requires a media connection to the surroundings, and including a cap structure for this micromechanical component, which may be implemented in a simple and cost-effective manner and which may be used to protect the micromechanical structure of mems elements very effectively against particles and interfering environmental influences despite media access. The cap structure closes at least one first cavity section above the micromechanical component and at least one second cavity section on the side of this micromechanical component, so that the two cavity sections are connected to one another, the connection area between the two cavity sections being configured as particle filters.
Robert Bosch Gmbh


01/28/16
20160023890 
 Microelectromechanical component and manufacturing  microelectromechanical components patent thumbnailMicroelectromechanical component and manufacturing microelectromechanical components
An mems component includes: a substrate into which a cavity is structured from a functional top side; a buried polysilicon layer in which a polysilicon diaphragm which at least partially spans the cavity is exposed as the first electrode; an epi-polysilicon layer in which a conductive structure, which is situated at a distance above the polysilicon diaphragm by a clearance, is exposed as the second electrode; and an access opening which fluidically connects the external surroundings of the mems component to the cavity. At least one access channel is formed in at least one of the buried polysilicon layer, the epi-polysilicon layer, and an inner wall of the cavity of the substrate which connects the access opening to the cavity, and whose channel width is not greater than 5 μm..
Robert Bosch Gmbh


01/28/16
20160023889 
 Membrane transducer structures and methods of manufacturing same using thin-film encapsulation patent thumbnailMembrane transducer structures and methods of manufacturing same using thin-film encapsulation
Membrane transducer structures and thin-film encapsulation methods for manufacturing the same are provided. In one example, the thin film encapsulation methods may be implemented to co-integrate processes for thin-film encapsulation and formation of microelectronic devices and microelectromechanical systems (mems) that include the membrane transducers..
Silicon Laboratories Inc.


01/28/16
20160023888 
 Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (mems) patent thumbnailMethods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (mems)
Methods and structures that may be implemented in one example to co-integrate processes for thin-film encapsulation and formation of microelectronic devices and microelectromechanical systems (mems) such as sensors and actuators. For example, structures having varying characteristics may be fabricated using the same basic process flow by selecting among different process options or modules for use with the basic process flow in order to create the desired structure/s.
Silicon Laboratories Inc.


01/21/16
20160020051 
 Package mems switch and method patent thumbnailPackage mems switch and method
An electronic device and methods including a switch formed in a chip package are shown. An electronic device and methods including a switch formed in a polymer based dielectric are shown.
Intel Corporation


01/21/16
20160018436 

Symmetrical mems accelerometer and its fabrication process


A symmetrical mems accelerometer. The accelerometer includes a top half and a bottom half bonded together to form the frame and the mass located within the frame.
Chinese Academy Of Sciences Institute Of Geology And Geophysics


01/21/16
20160018435 

Mems accelerometer


A mems acceleration sensor comprising: a frame, a plurality of proofmasses; a plurality of flexures; a plurality of hinges and a plurality of gauges. The frame, proofmasses, flexures, hinges and gauges designed to measure acceleration in a direction perpendicular to the device plane while being generally resistant to motions parallel to the device plane.
Meggitt (orange County), Inc.


01/21/16
20160018209 

Vehicle wheel alignment method and system based on gyroscopic sensors or angular rate sensors or mems angular rate sensors


The invention relates to a method and system for determining vehicle wheel alignment, and namely camber angles, total and individual toe and front wheel steering axis caster and steering wheel axle tilt angle, by measuring changes in wheel sensor angles from a predetermined (i.e. Control) position.

01/21/16
20160016792 

Microstructure and electronic device


A method of manufacturing microstructures, such as mems or nems devices, including forming a protective layer on a surface of a moveable component of the microstructure. For example, a silicide layer may be formed on a portion of at least four different surfaces of a poly-silicon mass that is moveable with respect to a substrate of the microstructure.
Stmicroelectronics, Inc.


01/21/16
20160016791 

Optical electronic device and fabrication


An optical electronic device and method that forms cavities through an interposer wafer after bonding the interposer wafer to a window wafer. The cavities are etched into the bonded interposer/window wafer pair using the anti-reflective coating of the window wafer as an etch stop.
Texas Instruments Incorporated


01/21/16
20160016789 

Thin film structure for hermetic sealing


The present disclosure relates to a mems device with a hermetic sealing structure, and an associated method. In some embodiments, a first die and a second die are bonded at a bond interface region to form a chamber.
Taiwan Semiconductor Manufacturing Co., Ltd.


01/21/16
20160015412 

Dynamic orthoscopic sensing


A dynamic sensing method and apparatus employs microelectromechanical systems (mems) and nanoelectromechanical (nems) surgical sensors for gathering and reporting surgical parameters pertaining to a drive mechanism of a surgical device, such as speed, rotation, torque and other characteristics of the surgical device. The surgical device employs or affixes the surgical sensor on or about a surgical device for detecting electromechanical characteristics during the surgical procedure.
Smith & Nephew, Inc.


01/14/16
20160014530 

Packaging concept to improve performance of a micro-electro mechanical (mems) microphone


A size of a port hole in a package for a micro-electro-mechanical (mems) microphone can be modified to improve performance of the mems microphone while protecting the mems microphone from environmental interference. As an example, the port hole diameter is increased along a thickness of a substrate coupled to the mems microphone to reduce air mass loading and air flow resistance and thus, increase the resonant frequency, resonant peak, signal-to-noise ratio (snr) and/or a range for flat frequency response of the mems microphone.
Invensense, Inc.


01/14/16
20160011660 

Handheld and wearable remote-controllers


An apparatus and method for the remote control and/or interaction-with one or more electronic-devices. A remote-controller that contains motion sensors (e.g., accelerometers; inertial sensors; mems sensors) may be held-by or worn-by a user.

01/14/16
20160010994 

Mems gyro motor loop filter


A motor drive loop circuit for a micro-electro-mechanical system (mems) gyroscope is provided. The motor drive loop circuit includes a motor configured to drive a proof mass in the mems gyroscope and a minus-90-degree phase-shift twin-tee notch filter.
Honeywell International Inc.


01/14/16
20160009551 

Mems device structure and methods of forming same


A microelectromechanical system (mems) device may include a mems structure above a first substrate. The mems structure comprising a central static element, a movable element, and an outer static element.
Taiwan Semiconductor Manufacturing Company, Ltd.


01/14/16
20160009550 

Methods of fabricating micro electro mechanical system structures


A method of fabricating a micro electro mechanical system (mems) structure includes providing a first substrate structure including a bonding pad structure. The bonding pad structure has at least one recess therein.
Taiwan Semiconductor Manufacturing Company, Ltd.


01/14/16
20160009548 

Microelectromechanical systems having contaminant control features


Microelectromechanical systems (mems) having contaminant control features. In some embodiments, a mems die can include a substrate and an electromechanical assembly implemented on the substrate.
Skyworks Solutions, Inc.


01/14/16
20160009547 

Mems devices having discharge circuits


mems devices having discharge circuits. In some embodiments, a mems device can include a substrate and an electromechanical assembly implemented on the substrate.
Skyworks Solutions, Inc.


01/14/16
20160009546 

Mems pressure sensor with thermal compensation


A semiconductor device having a capacitive pressure sensor structure includes a substrate, an interlayer dielectric layer on the substrate, a bottom electrode of a pressure sensor within the interlayer dielectric layer, a pressure sensing cavity above the bottom electrode, a sensing film above the pressure sensing cavity and covering a portion of the interlayer dielectric layer, a cover layer on the interlayer dielectric layer and on the sensing film, the cover layer having an opening exposing a portion of the sensing film, and a high thermal expansion coefficient material layer disposed on cover layer and sidewalls of the opening. Through the use of the high thermal expansion coefficient material layer, the capacitive pressure sensor structure is not susceptible to changes in ambient temperature to enhance the sensitivity of the capacitive pressure sensor structure..
Semiconductor Manufacturing International (shanghai) Corporation


01/14/16
20160009089 

Mems devices and methods of fabrication thereof


mems devices and methods of fabrication thereof are described. In one embodiment, the mems device includes a bottom alloy layer disposed over a substrate.
Taiwan Semiconductor Manufacturing Company, Ltd.


01/14/16
20160007653 

Mems vaporizer


A mems vaporizer is described which can be used for electronic cigarettes. The vaporizer mainly composes: a silicon substrate, a micro-channel array, a membrane suspending over the micro-channel array and supported by the silicon substrate, a resistance heater and a resistance temperature sensor are disposed on the membrane.

01/07/16
20160007125 

Open top back plate optical microphone


A micro-electro-mechanical system (mems) optical sensor and method of manufacturing a mems optical sensor. The mems optical sensor may be a mems optical microphone including a compliant membrane configured to vibrate in response to an acoustic wave, the compliant membrane having a grating suspended therein.
Apple Inc.


01/07/16
20160007119 

Diaphragm stiffener


A diaphragm for deployment in a micro electro mechanical system (mems) microphone includes a base portion. The base portion is generally planar and has a first side and a second side.
Knowles Electronics, Llc


01/07/16
20160007108 

Grating only optical microphone


A micro-electro-mechanical system (mems) optical sensor including an enclosure having a top wall, a bottom wall and a sidewall connecting the top wall and the bottom wall. The sensor further including a compliant membrane positioned within the enclosure, which is configured to vibrate in response to an acoustic wave and having a grating formed therein.
Apple Inc.


01/07/16
20160007107 

Gradient micro-electro-mechanical systems (mems) microphone with varying height assemblies


In at least one embodiment, a micro-electro-mechanical systems (mems) microphone assembly is provided. The assembly comprises an enclosure, a single micro-electro-mechanical systems (mems) transducer, a substrate layer, and an application housing.
Harman International Industries, Inc.


01/07/16
20160006414 

Methods and devices for microelectromechanical resonators


mems based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit mems processes that allow for manufacturability and integration of resonator elements into cavities within the mems sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented.
The Royal Institution For The Advancement Of Learning / Mcgill University


01/07/16
20160006241 

Method of and protecting a switch, such as a mems switch, and to a mems switch including such a protection apparatus


A method of and apparatus for protecting a mems switch is provided. The method and apparatus improve the integrity of mems switches by reducing their vulnerability to current flow through them during switching of the mems switch between on and off or vice versa.
Analog Devices Global


01/07/16
20160003945 

Laser rangefinder and measuring distance and direction


A laser rangefinder includes: a mems mirror that changes a traveling direction of laser light; a first photodetector that reflects a portion of the laser light directed in a predetermined direction by the mems mirror and receives another portion of the laser light; a second photodetector that receives first reflected light that is reflection of the laser light from a target object outside an enclosure and second reflected light that is reflection of the portion of the laser light from the first photodetector; and a signal processor that calculates a distance from the laser rangefinder to the target object by subtracting, from a first distance from the laser diode to the target object calculated using the first reflected light, a second distance from the laser diode to the first photodetector calculated using the second reflected light, and calculates a direction of the target object with respect to the laser rangefinder.. .
Kyoto University


01/07/16
20160003863 

Mechanical shock resistant mems accelerometer arrangement, associated method, apparatus and system


An accelerometer arrangement and method are described for determining accelerations of an inground tool. First and second triaxial accelerometers are supported such that a normal sensing axis of the first triaxial accelerometer is at least generally orthogonal to the normal sensing axis of the second triaxial accelerometer for determining the accelerations along the three orthogonal axes based on a combination of sensing axis outputs from one or both of the triaxial accelerometers.
Merlin Technology, Inc.


01/07/16
20160003617 

Method for detecting accelerations and rotation rates, and mems sensor


The invention concerns a mems sensor and a method for detecting accelerations along, and rotation rates about, at least one, preferably two of three mutually perpendicular spatial axes x, y and z by means of a mems sensor (1), wherein at least one driving mass (6; 6.1, 6.2) and at least one sensor mass (5) are moveably arranged on a substrate (2) and the at least one driving mass (6; 6.1, 6.2) is moved relative to the at least one sensor mass (5) in oscillation at a driving frequency and when an external acceleration of the sensor occurs, driving mass/es (6; 6.1, 6.2) and sensor mass/es (5) are deflected at an acceleration frequency and, when an external rotation rate of the sensor (1) occurs, are deflected at a rotation rate frequency, and the acceleration frequency and rotation rate frequency are different. At the mems-sensor the driving mass/es (6; 6.1, 6.2) and sensor mass/es (5) are arranged on the substrate (2), and are balanced in the resting state by means of at least one of the anchors (3).
Maxim Integrated Products, Inc.


01/07/16
20160002028 

Integrated cmos and mems sensor fabrication method and structure


A method of providing a cmos-mems structure is disclosed. The method comprises patterning a first top metal on a mems actuator substrate and a second top metal on a cmos substrate.
Invensense, Inc.


01/07/16
20160002026 

Methods and devices for microelectromechanical pressure sensors


mems based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit mems processes that allow for manufacturability and integration of resonator elements into cavities within the mems sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented.
The Royal Institution For The Advancement Of Learning / Mcgill University


01/07/16
20160000602 

Mems device and delivery of therapeutic agents


Embodiments of an implantable device for delivering a therapeutic agent to a patient include a reservoir configured to contain a liquid comprising the therapeutic agent, and a cannula in fluid communication with the reservoir. When a predetermined cracking pressure is reached, a valve opens and allows the liquid to flow through the cannula..

12/31/15
20150381176 

Trim high voltage drivers


Methods and circuits are provided to create small, power minimizing, multi-channel high voltage drivers for micro-electromechanical systems (mems). A resistor calibration circuit is introduced to allow on chip resistor dividers to be calibrated against a single precision high voltage resistor divider, eliminating the cost and printed circuit board real estate associated with multiple resistor dividers connected to each channel.

12/31/15
20150381078 

Mems device and manufacturing the mems device


A mems device and a method for manufacturing a mems device are disclosed. In an embodiment the mems device comprises a support having a cavity therethrough and a membrane extended over the cavity of the support, wherein the membrane is at least partially reinforced by graphene..
Infineon Technologies Ag


12/31/15
20150380635 

Methods to improve the crystallinity of pbzrtio3 and pt films for mems applications


A microelectronic device containing a piezoelectric component is formed sputtering an adhesion layer of titanium on a substrate by an ionized metal plasma (imp) process. The adhesion layer is oxidized so that at least a portion of the titanium is converted to a layer of substantially stoichiometric titanium dioxide (tio2) at a top surface of the adhesion layer.
Texas Instruments Incorporated


12/31/15
20150379190 

Mems modeling system and method


A system and method for modeling microelectromechanical devices is disclosed. An embodiment includes separating the microelectromechanical design into separate regions and modeling the separate regions separately.
Taiwan Semiconductor Manufacturing Company, Ltd.


12/31/15
20150378618 

Memory allocation buffer for reduction of heap fragmentation


Systems and methods of a memory allocation buffer to reduce heap fragmentation. In one embodiment, the memory allocation buffer structures a memory arena dedicated to a target region that is one of a plurality of regions in a server in a database cluster such as an hbase cluster.
Cloudera, Inc.


12/31/15
20150378164 

Systems, devices, and methods for wearable heads-up displays


Systems, devices, and methods for transparent displays that are well-suited for use in wearable heads-up displays are described. Such transparent displays include a register of light-emitting diodes that sequentially generates pixels or other discrete portions of an image.
Thalmic Labs Inc.


12/31/15
20150378161 

Systems, devices, and methods for wearable heads-up displays


Systems, devices, and methods for transparent displays that are well-suited for use in wearable heads-up displays are described. Such transparent displays include a light source that sequentially generates pixels or other discrete portions of an image.
Thalmic Labs Inc.


12/31/15
20150378127 

Stress compensation for piezoelectric optical mems devices


An apparatus includes a lens material forming a lens. The apparatus also includes a piezoelectric capacitor over the lens material, where the piezoelectric capacitor is configured to change a shape of the lens material in response to a voltage across the piezoelectric capacitor to thereby change a focus of the lens.
Texas Instruments Incorporated


12/31/15
20150378064 

Piezoelectric optical mems device with embedded moisture layers


A piezoelectric optical micro-electro-mechanical systems (pomems) device includes a glass layer having a bottom surface and a top surface. The device may also include an upper moisture barrier layer having a top surface and a bottom surface in which the bottom surface of the top moisture barrier layer is substantially coextensive with and interfaces with the top surface of the glass layer.
Texas Instruments Incorporated


12/31/15
20150377662 

Mems-based conformal air speed sensor


Systems and methods for measuring air speed which solve the problem of icing or blockage by creating an exterior surface on an aircraft that channels air and measures the pressure difference of the pressure through the airflow and the static pressure. This exterior surface cannot be blocked easily because air is always flowing when the aircraft is in motion, any external matter that could be on the exterior surface is readily visible, and the exterior surface can be heated to prevent icing.
The Boeing Company


12/31/15
20150377624 

Micro-electro-mechanical device with compensation of errors due to disturbance forces, such as quadrature components


mems device having a support region elastically carrying a suspended mass through first elastic elements. A tuned dynamic absorber is elastically coupled to the suspended mass and configured to dampen quadrature forces acting on the suspended mass at the natural oscillation frequency of the dynamic absorber.
Stmicroelectronics, S.r.l.


12/31/15
20150377621 

Mems angular inertial sensor operating in tuning fork mode


A vibrating inertial sensor is provided, micro machined in a plane thin wafer, allowing the measurement of an angular position or of an angular speed. The sensor comprises two vibrating masses suspended by springs with identical stiffness in x and y and coupled together by identical stiffness springs in x and y, and at least excitation transducers and detection transducers disposed on at least one of the masses.
Thales


12/31/15
20150376000 

Method for reducing discharge defects and electrode delamination in piezoelectric optical mems devices


A method includes forming a piezoelectric optical micro-electromechanical system (mems) device having a piezoelectric capacitor over a lens material. The lens material forms a lens, and the piezoelectric capacitor is configured to change a shape of the lens material in order to change a focus of the lens.
Texas Instruments Incorporated


12/31/15
20150375995 

Mems fabrication process with two cavities operating at different pressures


A method and apparatus are described for fabricating a high aspect ratio mems sensor device having multiple vertically-stacked inertial transducer elements (101b, 110d) formed in different layers of a multi-layer semiconductor structure (100) and one or more cap devices (200, 300) bonded to the multi-layer semiconductor structure (100) to protect any exposed inertial transducer element from ambient environmental conditions.. .
Freescale Semiconductor, Inc.


12/31/15
20150375994 

Pressure sensor and manufacture method thereof


A pressure sensor using the mems device comprises an airtight ring surrounding a chamber defined by the first substrate and the second substrate. The airtight ring extends from the upper surface of the second substrate to the surface between the first substrate and the second substrate and further breaks out the surface.
Miramems Sensing Technology Co., Ltd.


12/31/15
20150375993 

Mems package structure and fabricating the same


A mems package structure is disclosed. The mems package structure includes a first glass substrate on a micro-electromechanical systems (mems) structure, a sealant adhered between the first glass substrate and the mems structure; and a first moisture barrier on the sidewalls of the first glass substrate, the sealant, and the mems structure..
Himax Display, Inc.


12/31/15
20150375992 

Semiconductor arrangement and formation thereof


A semiconductor arrangement and methods of formation are provided. The semiconductor arrangement includes a micro-electro mechanical system (mems).
Taiwan Semiconductor Manufacturing Company Limited


12/31/15
20150375990 

Micromechanical sensor device


A micromechanical sensor device includes: a mems element; an asic element; a bonding structure provided between the mems element and the asic element; a layer assemblage having insulating layers and functional layers disposed alternatingly on one another; a sensing element movable in a sensing direction provided in at least one of the functional layers; a spacing element for providing a defined spacing between the mems element and the asic element being provided by way of a further functional layer; an abutment element having the spacing element and a first bonding layer being disposed on the sensing element; and an insulating layer being disposed on the asic element in an abutment region of the abutment element.. .
Robert Bosch Gmbh


12/31/15
20150375989 

Microelectromechanical systems devices with improved lateral sensitivity


Microelectromechanical system (mems) devices and methods for forming mems devices are provided. The mems devices include a substrate, an anchored structure fixedly coupled to the substrate, and a movable structure resiliently coupled to the substrate.
Freescale Semiconductor, Inc.


12/31/15
20150375988 

Pressure sensor and manufacture method thereof


A pressure sensor using the mems element and the manufacture method thereof utilize the semiconductor processes to form the micro channel connecting to the chamber, open the micro channel, coat the anti-sticking layer on the inner surface of the chamber, and then seal the micro channel to keep the chamber airtight. Therefore, the manufacture method may essentially simplify the process to coat the anti-sticking layer on the inner surface of the airtight chamber to prevent the sticking and failing of the movable mems element..
Miramems Sensing Technology Co., Ltd.


12/31/15
20150375672 

Illuminating apparatus, vehicle headlamp and control system of vehicle headlamp


An illuminating apparatus includes a first light source that emits blue laser light, a light emitting section that emits light by being irradiated with the blue laser light, a second light source that emits green laser light, a biaxial mems scanner that irradiates a part of the light emitting section with the green laser light, and a convex lens that projects the light emitted from the light emitting section to the outside.. .
Sharp Kabushiki Kaisha


12/24/15
20150373446 

Multi-floor type mems microphone


A multi-floor type mems microphone includes a housing formed by a stack of circuit boards and provided with a first cavity, a second cavity in vertical communication with the first cavity, and a sound hole in communication with the second cavity. The second cavity has a vertical cross-sectional area smaller than that of the first cavity.
Merry Electronics (shenzhen) Co., Ltd.


12/24/15
20150372660 

Switchable filters and design structures


Switchable and/or tunable filters, methods of manufacture and design structures are disclosed herein. The method of forming the filters includes forming at least one piezoelectric filter structure comprising a plurality of electrodes formed to be in contact with at least one piezoelectric substrate.
International Business Machines Corporation


12/24/15
20150372617 

Miniature mems actuator assemblies


In one embodiment, an electrostatic actuator includes a generally planar fixed frame, a generally planar moving frame coupled to the fixed frame by a flexure for substantially coplanar, perpendicular movement relative to the fixed frame, a plurality of interdigitated teeth, a fixed portion of which is attached to the fixed frame and a moving portion of which is attached to the moving frame, and an elongated output shaft having opposite input and output ends, the input end being coupled to the moving frame.. .
Digitaloptics Corporation Mems


12/24/15
20150371890 

Method for fabricating and manufacturing micro- and nano-fabricated devices and systems securely


A method is disclosed for manufacturing integrated circuits, microelectronics, micro-electro-mechanical systems (mems), nano-electro-mechanical systems (nems), photonic, and any micro- and nano-fabricated devices and systems designs that allow these designs to be kept secure. The manufacturing of the devices in the substrates is performed in a traditional manner at a foundry that can be located anywhere in the world., the manufacturing at this foundry is stopped just before the fabrication of the first layer of electrical interconnects.
Corporation For National Research Initiatives


12/24/15
20150370326 

Systems, articles, and methods for wearable human-electronics interface devices


Systems, articles, and methods for wearable human-electronics interfaces are described. A wearable human-electronics interface device includes a band that in use is worn on an appendage (e.g., a wrist, arm, finger, or thumb) of a user.
Thalmic Labs Inc.


12/24/15
20150370085 

Optical mems scanning micro-mirror with anti-speckle cover


Optical mems scanning micro-mirror comprising: —a movable scanning micro-mirror (101), being pivotally connected to a mems body (102) substantially surrounding the lateral sides of the micro-mirror, —a transparent window (202) substantially covering the reflection side of the micro-mirror; —wherein a piezo-actuator assembly (500) and a layer of deformable transparent material (501) are provided on the outer portion of said window (202); —the piezo-actuator assembly (500) being arranged at the periphery of the layer of transparent material (501); —said piezo-actuator assembly (500) and transparent material (501) cooperating so that when actuated, the piezo-actuator assembly (500) causes micro-deformation of the transparent material (501), thereby providing an anti-speckle effect. The invention also provides the corresponding micro-projection system and method for reducing speckle..

12/24/15
20150369839 

Design and interface of a microfabricated scanning force sensor for combined force and position sensing


A micro fabricated sensor for micro-mechanical and nano-mechanical testing and nano-indentation. The sensor includes a force sensing capacitive comb drive for the sensing of a force applied to a sample, a position sensing capacitive comb drive for the sensing of the position of a sample and a micro fabricated actuator to apply a load to the sample.
Femtotools Ag


12/24/15
20150369781 

Mems flow control chip for gas chromatography


A micro-electro-mechanical system (mems) flow control chip that can control the flow of gas and be configured to operate in a gas chromatography system are disclosed. The mems flow control chip can include at least one inlet port in the chip, at least one outlet port in the chip, at least one flow channel between the inlet and outlet ports, and at least one pneumatic valve in the chip for controlling a flow of gas through the flow channel and between the inlet port and outlet ports.
The Penn State Research Foundation


12/24/15
20150368100 

Design of a mold for forming complex 3d mems components


A mold structure having high-precision multi-dimensional components which includes a first oxide layer superimposed on a top of a first semiconductor substrate; a second oxide layer superimposed on a top of a second semiconductor substrate; integrated designs patterned in at least one of the oxide layers; and the first and second semiconductor substrates bonded to one another into a three dimensional (3d) mold such that the first oxide layer only makes partial contact with the second oxide layer such that a portion of the first oxide layer avoids contact with the second oxide layer, the portion of the first oxide layer directly opposite a surface portion of the second semiconductor substrate that is free of the second oxide, the 3d mold selectively filled with a filling material to form a molded high-precision multi-dimensional component.. .
Yale University


12/24/15
20150368099 

Etch release residue removal using anhydrous solution


A method of making a microelectromechanical systems (mems) device includes etching away a sacrificial material layer to release a mechanical element of the mems device. The mems device is formed at least partially on the sacrificial material layer, and the etching leaves a residue in proximity to the mechanical element.
Freescale Semiconductor, Inc.


12/24/15
20150368097 

Methods for producing a cavity within a semiconductor substrate


A method for producing at least one cavity within a semiconductor substrate includes dry etching the semiconductor substrate from a surface of the semiconductor substrate at at least one intended cavity location in order to obtain at least one provisional cavity. The method includes depositing a protective material with regard to a subsequent wet-etching process at the surface of the semiconductor substrate and at cavity surfaces of the at least one provisional cavity.
Infineon Technologies Ag


12/24/15
20150368096 

Mems pressure sensor and manufacturing the same


A method of manufacturing a pressure sensor is provided. The method includes: providing a substrate, wherein a bottom electrode and a pressure sensing film are disposed on the substrate; forming an etch stop assembly on the pressure sensing film at a location corresponding to a pressure trench; forming a cover layer on the substrate covering the etch stop assembly and the pressure sensing film; forming a mask layer on the cover layer, wherein an opening of the mask layer is formed above the etch stop assembly and exposes a portion of the cover layer at the location corresponding to the pressure trench; etching the cover layer using the mask layer so as to form the pressure trench in the cover layer; removing the etch stop assembly at a bottom of the pressure trench; and removing the mask layer..
Semiconductor Manufacturing International (shanghai) Corporation


12/24/15
20150368094 

Robust mems structure with via cap and related method


Self-supported mems structure and method for its formation are disclosed. An exemplary method includes forming a polymer layer over a mems plate over a substrate, forming a via collar along sidewalls of a first portion of a trench over the polymer layer, and forming a second portion of the trench within the polymer layer.
Newport Fab, Llc Dba Jazz Semiconductor


12/24/15
20150368093 

Method for manufacturing slanted copper nanorods


The present invention provides a method for fabricating slanted copper nanorods. The method includes manufacturing a workpiece configured to include an etch stop layer on a wafer, placing the workpiece in a slanted position, and etching the slanted workpiece, forming a copper (cu) layer on the slanted workpiece by plating, removing an over-plated portion from the copper layer, and removing a polysilicon (poly si) excluding copper from the surface of the workpiece.
Ajou University And Industry-academic Cooperation Foundation


12/24/15
20150368092 

Scalable self-supported mems structure and related method


Self-supported mems structure and method for its formation are disclosed. An exemplary method includes forming a polymer layer over a mems plate over a substrate, forming a trench over the mems plate, forming an oxide liner in the trench on sidewalls of the trench, forming a metal liner over the oxide liner in the trench, and depositing a metallic filler in the trench to form a via.
Newport Fab, Llc Dba Jazz Semiconductor


12/24/15
20150368091 

Mems devices utilizing a thick metal layer of an interconnect metal film stack


A mems device, such as an accelerometer or gyroscope, fabricated in interconnect metallization compatible with a cmos microelectronic device. In embodiments, a proof mass has a first body region utilizing a thick metal layer that is separated from a thin metal layer.
Intel Corporation


12/24/15
20150368090 

Micro-electro-mechanical system (mems) structures and design structures


Micro-electro-mechanical system (mems) structures, methods of manufacture and design structures are disclosed. The method includes forming a micro-electro-mechanical system (mems) beam structure by venting both tungsten material and silicon material above and below the mems beam to form an upper cavity above the mems beam and a lower cavity structure below the mems beam..
International Business Machines Corporation


12/24/15
20150368089 

Mems device


A mems device includes a movable section, a frame, a beam, and an electrode substrate. The frame surrounds a surrounding of the movable section.
Panasonic Intellectual Property Management Co., Ltd.


12/24/15
20150367346 

Cell sorting system using microfabricated components


A mems-based cell sorter is disclosed, which uses a novel combination of features to accomplish the cell sorting using a microfabricated cell sorting valve housed in a disposable cartridge. The features include an interposer that provides fluid communication between the microfluidic passages in the silicon substrate and a plurality of fluid reservoirs in the cartridge, including a sample, sort and waste reservoir the disposable cartridge may include other features that assist in the handling of small volumes of fluids, such as a siphon region in the sort reservoir and funnel-shaped regions in the sample and waste reservoirs.
Owl Biomedical, Inc.


12/17/15
20150365770 

Mems device with optical component


A micro electro mechanical system (mems) microphone includes a lid, at least one wall coupled to the lid, a substrate, and a mems die. The substrate is coupled to the at least one wall and a port extending through the substrate.
Knowles Electronics, Llc


12/17/15
20150364363 

Vhf etch barrier for semiconductor integrated microsystem


The present disclosure relates to an integrated microsystem with a protection barrier structure, and an associated method. In some embodiments, the integrated microsystem comprises a first die having a plurality of cmos devices disposed thereon, a second die having a plurality of mems devices disposed thereon and a vapor hydrofluoric acid (vhf) etch barrier structure disposed between the first die and the second die.
Taiwan Semiconductor Manufacturing Co., Ltd.


12/17/15
20150362722 

Membrane structures for microelectromechanical pixel and display devices and systems, and methods for forming membrane structures and related devices


Embodiments relate to microelectromechanical systems (mems) and more particularly to membrane structures comprising pixels for use in, e.g., display devices. In embodiments, a membrane structure comprises a monocrystalline silicon membrane above a cavity formed over a silicon substrate.
Infineon Technologies Ag


12/17/15
20150362522 

Mems resonant accelerometer having improved electrical characteristics


A mems resonant accelerometer is disclosed, having: a proof mass coupled to a first anchoring region via a first elastic element so as to be free to move along a sensing axis in response to an external acceleration; and a first resonant element mechanically coupled to the proof mass through the first elastic element so as to be subject to a first axial stress when the proof mass moves along the sensing axis and thus to a first variation of a resonant frequency. The mems resonant accelerometer is further provided with a second resonant element mechanically coupled to the proof mass through a second elastic element so as to be subject to a second axial stress when the proof mass moves along the sensing axis, substantially opposite to the first axial stress, and thus to a second variation of a resonant frequency, opposite to the first variation..
Stmicroelectronics S.r.l.


12/17/15
20150362395 

Mems device calibration


One example discloses a mems device, including: a cavity having an internal environment; a seal isolating the internal environment from an external environment outside the mems device; wherein the seal is susceptible to damage in response to a calibration unsealing energy; wherein upon damage to the seal, a pathway forms which couples the internal environment to the external environment; and a calibration circuit capable of measuring the internal environment before and after damage to the seal.. .
Ams International Ag


12/17/15
20150362362 

Microelectromechanical systems sensor control interface


Microelectromechanical (mems) sensors and control interfaces, control, interface components, protocols, systems, and methods are described. An exemplary control interface can comprise one or more predefined symbols that facilitate control of a mems sensor over an existing pin of a package comprising one or more mems sensors.
Invensense, Inc.


12/17/15
20150360939 

Method of increasing mems enclosure pressure using outgassing material


Semiconductor manufacturing processes include providing a first substrate having a first passivation layer disposed above a patterned top-level metal layer, and further having a second passivation layer disposed over the first passivation layer; the second passivation layer has a top surface. The processes further include forming an opening in a first portion of the second passivation layer, and the opening exposes a portion of a surface of the first passivation layer.
Invensense, Inc.


12/17/15
20150360938 

Mems structure, cap substrate and fabricating the same


A micro electro mechanical system (mems) structure is provided, which includes a first substrate, a second substrate, a mems device and a hydrophobic semiconductor layer. The first substrate has a first portion.
Taiwan Semiconductor Manufacturing Co., Ltd.


12/17/15
20150360936 

Wafer scale monolithic cmos-integration of free- and non-free-standing metal- and metal alloy-based mems structures in a sealed cavity


An assembly of metallic mems structures directly fabricated on planarized cmos substrates, containing the application-specific integrated circuit (asic), by direct deposition and subsequent microfabrication steps on the asic interconnect layers, with integrated capping for packaging, is provided. The mems structures comprise at least one mems device element, with or without moveable parts anchored on the cmos asic wafer with electrical contact provided via the metallic interconnects of the asic.

12/17/15
20150360935 

Vertically hybridly integrated assembly having an interposer for stress-decoupling of a mems structure, and its manufacture


A structural concept for a vertically hybridly integrated assembly having at least one mems component is provided, whose mems structure is developed at least partially in the front side of the component and which is electrically contactable via at least one connection pad on the front side of the component. This structural concept is able to be realized in an uncomplicated and cost-effective manner and allows the largely stress-free mounting of the mems structure within the chip stack and also ensures a reliable electrical linkage of the mems component to further component parts of the assembly.
Robert Bosch Gmbh


12/17/15
20150360933 

Capacitive mems sensor and method


A system and method for forming a sensor device includes defining an in-plane electrode in a device layer of a silicon on insulator (soi) wafer, forming an out-of-plane electrode in a silicon cap layer located above an upper surface of the device layer, depositing a silicide-forming metal on a top surface of the silicon cap layer, and annealing the deposited silicide-forming metal to form a silicide portion in the silicon cap layer.. .
Robert Bosch Gmbh




Mems topics: Camera Module, Acceleration Sensor, Microelectromechanical Systems, Control Unit, Semiconductor Substrate, Semiconductor, Demodulation, Accelerometer, Calibration, Modulation, Mems Devices

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