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This page is updated frequently with new Mems-related patent applications. Subscribe to the Mems RSS feed to automatically get the update: related Mems RSS feeds. RSS updates for this page: Mems RSS RSS


Manufacturing method of mirco-electro-mechanical system device and mirco-electro-mechanical system device made thereby

Richtek Technology

Manufacturing method of mirco-electro-mechanical system device and mirco-electro-mechanical system device made thereby

Method for manufacturing a mems device and mems device

Infineon Technologies Ag

Method for manufacturing a mems device and mems device

Method for manufacturing a mems device and mems device

International Business Machines

Micro-electro-mechanical system (mems) and related actuator bumps, methods of manufacture and design structures

Date/App# patent app List of recent Mems-related patents
02/26/15
20150057592
 Mems check valve chip and methods patent thumbnailnew patent Mems check valve chip and methods
A mems check valve chip is described. The chip comprises a first side and an opposing second side, an outlet port extending from the first side to the second side, and a flexible outlet membrane anchored to the first side to overlie the outlet port.
Alcon Research, Ltd.
02/26/15
20150056800
 Self-aligned interconnects formed using substractive techniques patent thumbnailnew patent Self-aligned interconnects formed using substractive techniques
A method of forming an interconnect structure for semiconductor or mems structures at a 10 nm node (16 nm hpcd) down to 5 nm node (7 nm hpcd), or lower, where the conductive contacts of the interconnect structure are fabricated using solely subtractive techniques applied to conformal layers of conductive materials.. .
02/26/15
20150056733
 Manufacturing  mirco-electro-mechanical system device and mirco-electro-mechanical system device made thereby patent thumbnailnew patent Manufacturing mirco-electro-mechanical system device and mirco-electro-mechanical system device made thereby
The invention provides a manufacturing method of a mems device, which includes: providing an integrated circuit device including a substrate and an electrical structure on the substrate, the electrical structure includes at least one sensing region and at least one first connection section; providing a structure layer, and forming at least one second connection section on the structure layer; bonding the at least one first connection section and the at least one second connection section; etching the structure layer for forming at least one movable structure, the movable structure being located at a position corresponding to a position of the sensing region, and the movable structure being connected to the at least one first connection section via the at least one second connection section; and thereafter, providing a cap to cover the movable structure and the sensing region, wherein the movable structure is not directly connected to the cap.. .
Richtek Technology Corporation
02/26/15
20150056099
 Diagnostic radio frequency identification sensors and applications thereof patent thumbnailnew patent Diagnostic radio frequency identification sensors and applications thereof
An integrated passive wireless chip diagnostic sensor system is described that can be interrogated remotely with a wireless device such as a modified cell phone incorporating multi-protocol rfid reader capabilities (such as the emerging gen-2 standard) or bluetooth, providing universal easy to use, low cost and immediate quantitative analyses, geolocation and sensor networking capabilities to users of the technology. The present invention can be integrated into various diagnostic platforms and is applicable for use with low power sensors such as thin films, mems, electrochemical, thermal, resistive, nano or microfluidic sensor technologies.
Altivera, Llc
02/26/15
20150055205
 Mems display incorporating extended height actuators patent thumbnailnew patent Mems display incorporating extended height actuators
This disclosure provides systems, methods, and apparatus for a mems display incorporating extended height actuators. A light modulating component can be positioned between a substrate and an opposing surface coupled to the substrate.
Pixtronix, Inc.
02/26/15
20150054100
 Micro-electro-mechanical system (mems) and related actuator bumps, methods of manufacture and design structures patent thumbnailnew patent Micro-electro-mechanical system (mems) and related actuator bumps, methods of manufacture and design structures
Micro-electro-mechanical system (mems) structures, methods of manufacture and design structures are provided. The method of forming a mems structure includes forming a wiring layer on a substrate comprising actuator electrodes and a contact electrode.
International Business Machines Corporation
02/26/15
20150054098
 Mems microphone assembly and  manufacturing the mems microphone assembly patent thumbnailnew patent Mems microphone assembly and manufacturing the mems microphone assembly
The present invention concerns a mems microphone assembly (1) comprising a mems transducer element (2) comprising a mems die (3), a back plate (4) and a diaphragm (5) displaceable in relation to the back plate (4), and a sound inlet (16) for acoustically coupling the mems transducer element (2) to the exterior of the mems microphone assembly (1), wherein the mems die (3) comprises an indentation (17) that forms at least a part of the sound inlet (16). Further, the present invention concerns a method of manufacturing said mems microphone assembly (1)..
Epcos Ag
02/26/15
20150054097
 Method for manufacturing a mems device and mems device patent thumbnailnew patent Method for manufacturing a mems device and mems device
A method for manufacturing a mems device includes providing a cavity within a layer adjacent to a sacrificial layer. The cavity extends to the sacrificial layer and includes a capillary slot protruding into the layer.
Infineon Technologies Ag
02/26/15
20150054096
 Reducing mems stiction by introduction of a carbon barrier patent thumbnailnew patent Reducing mems stiction by introduction of a carbon barrier
A mechanism for reducing stiction in a mems device by decreasing an amount of carbon from teos-based silicon oxide films that can accumulate on polysilicon surfaces during fabrication is provided. A carbon barrier material film is deposited between one or more polysilicon layer in a mems device and the teos-based silicon oxide layer.
Freescale Semiconductor, Inc.
02/19/15
20150049878
 Directional mems microphone patent thumbnailDirectional mems microphone
The present invention relates to a directional mems microphone which comprises a cover, a printed circuit board, a sound inlet structure, an integrated circuit chip which is attached to the printed circuit board, and a mems die which is attached to the printed circuit board. The cover provides an open side where the printed circuit board and the cover are coupled.
Shandong Gettop Acoustic Co., Ltd.
02/19/15
20150048936

Vehicle level indicator device


A level indicator device is disclosed for use in conjunction with a road vehicle such as a caravan, trailer, motor home or mobile crane and which comprises an electrically energised level sensor that is arranged to provide an output signal that is representative of a prevailing level of the sensor, a signal generator associated with the sensor and arranged in use to generate a signal that is representative of a substantially horizontal level when that level is sensed to prevail by the sensor. A radiofrequency signal transmitter is located in circuit with the signal generator and is arranged to transmit a radiofrequency signal that is modulated by the signal generated by the signal generator, and a remote receiver is provide and is arranged to receive and demodulate the radiofrequency signal.
Level Systems Pty Ltd
02/19/15
20150048903

Microelectromechanical system with a micro-scale spring suspension making the same


Integrated microelectromechanical system (“mems”) devices and methods for making the same. The mems devices comprise a substrate (200) and a mems filter device (100) mechanically suspended above a major surface of the substrate.
Harris Corporation
02/19/15
20150048902

Integrated microelectromechanical system devices and methods for making the same


Integrated microelectromechanical system (“mems”) devices and methods for making the same. The integrated mems device comprises a substrate (200) with first electronic circuitry (206) formed thereon, as well as a mems filter device (100).
Harris Corporation
02/19/15
20150048901

Microelectromechanical systems comprising differential inductors and methods for making the same


An integrated microelectromechanical systems (“mems”) device (100). The mems device comprises a substrate (200, 300), a transition portion (118), and a differential inductor (1000, 1100, 1300).
Harris Corporation
02/19/15
20150048895

Accurate frequency control using a mems-based oscillator


A micro electro mechanical system (mems) oscillator supplies an oscillator output signal having a first frequency that differs from a predetermined frequency of the output signal. An error determination circuit determines frequency error from the predetermined frequency based on initial frequency offset and/or temperature and provides the error information indicating a difference between the first frequency and the predetermined frequency.
Silicon Laboratories Inc.
02/19/15
20150048463

Package device for microelectromechanical inertial sensor


A package device for a microelectromechanical inertial sensor comprises a ceramic substrate having an upper accommodation space and a lower accommodation and having a plurality of interconnect metal lines thereinside; a microelectromechanical system (mems) chip mounted inside the upper accommodation of the ceramic substrate and electrically connected with the interconnect metal lines; a top cover arranged on the ceramic substrate and sealing the upper accommodation space; and an integrated circuit (ic) chip mounted inside the lower accommodation space and electrically connected with the interconnect metal lines. The present invention can improve the reliability of components, increase the yield and decrease the fabrication cost..
Txc Corporation
02/12/15
20150044808

Method of fabricating integrated semiconductor device and structure thereof


A method of fabricating an integrated semiconductor device, comprising: providing a substrate having a first region and a second region; and forming a semiconductor unit on the first region and forming a micro electro mechanical system (mems) unit on the second region in one process.. .
Macronix International Co., Ltd.
02/12/15
20150043755

Vad detection microphone and operating the same


A microphone includes a microelectromechanical system (mems) circuit and an integrated circuit. The mems circuit is configured to convert a voice signal into an electrical signal, and the integrated circuit is coupled to the mems circuit and is configured to receive the electrical signal.
Knowles Electronics, Llc
02/12/15
20150043002

Dielectric-enhanced metal coatings for mems tunable filters


The present invention concerns the use of hybrid metal-dielectric optical coatings as the end reflectors of laser cavities and/or in the mirror structures used in other optical resonators, such as fabry-perot tunable filters, along with the use of such fabry-perot tunable filters in wavelength swept sources such as lasers. Hybrid metal-dielectric optical coatings have reflectivity spectra that can be broader than pure dielectric coatings, offer optical reflectivities higher than metal, as high as pure dielectric coatings, eliminate mirror transmission that can cause parasitic light reflections, and use fewer layers and thus have lower mass and higher mechanical resonant frequency for movable mirror applications an important characteristic of these coatings concerns the non-reflected light.
Axsun Technologies, Inc.
02/12/15
20150042418

Switchable filters and design structures


Switchable and/or tunable filters, methods of manufacture and design structures are disclosed herein. The method of forming the filters includes forming at least one piezoelectric filter structure comprising a plurality of electrodes formed on a piezoelectric substrate.
International Business Machines Corporation
02/12/15
20150041932

Planar cavity mems and related structures, methods of manufacture and design structures


A method of forming at least one micro-electro-mechanical system (mems) cavity includes forming a first sacrificial cavity layer over a wiring layer and substrate. The method further includes forming an insulator layer over the first sacrificial cavity layer.
International Business Machines Corporation
02/12/15
20150041931

Embedded micro valve in microphone


A microelectromechanical system (mems) apparatus includes a base. A mems device is disposed on the base.
Knowles Electronics, Llc
02/12/15
20150041929

Packaged microphone with multiple mounting orientations


A packaged microphone has a base and a lid that at least in part form a package having a plurality of exterior sides and an interior chamber. The packaged microphone also has a flexible substrate having a first portion within the interior chamber, and a second portion, extending from the interior chamber, having at least two sets of pads.
Invensense, Inc.
02/12/15
20150041927

Mems device with differential vertical sense electrodes


A mems device includes a first sense electrode and a first portion of a sense mass formed in a first structural layer, where the first sense electrode is fixedly coupled with the substrate and the first portion of the sense mass is suspended over the substrate. The mems device further includes a second sense electrode and a second portion of the sense mass formed in a second structural layer.
Freescale Semiconductor, Inc.
02/12/15
20150041629

Device and micro-electro-mechanical-system photonic switch


In one embodiment, a micro-electro-mechanical-system (mems) photonic switch includes a first plurality of collimators and a first mirror array optically coupled to the first plurality of collimators. The first mirror array includes a first plurality of first mems mirrors integrated on a first substrate and a first plurality of first photodiodes integrated on the first substrate, where the photodiodes are disposed in interstitial spaces between the mems mirrors..
Futurewei Technologies, Inc.
02/05/15
20150037024

Mems iris diaphragm-based for an optical adjusting a size of an aperture thereof


A mems iris diaphragm (400) for an optical system is disclosed. The mems iris diaphragm (400) comprises at least two layers of diaphragm structures with each layer having suspended blade members (404a, 404b, 404c, 404d, 406a, 406b, 406c, 406d) angularly spaced from each other, the at least two layers of blade members (404a, 404b, 404c, 404d, 406a, 406b, 406c, 406d) arranged to overlap and cooperate with each other to define an aperture (408) to allow light to pass through, and a rotary actuating device (401) arranged to rotate at least some of the blade members (404a, 404b, 404c, 404d, 406a, 406b, 406c, 406d) of the at least two layers about their respective axis in a non-contact manner to vary the aperture's size.
National University Of Singapore
02/05/15
20150036057

Multiple stage modulation projector display systems having efficient light utilization


Dual or multi-modulation display systems comprising a first modulator and a second modulator are disclosed. The first modulator may comprise a plurality of analog mirrors (e.g.
Dolby Laboratories Licensing Corporation
02/05/15
20150035387

Mems switch device and fabrication


A mems switch device including: a substrate layer; an insulating layer formed over the substrate layer; and a mems switch module having a plurality of contacts formed on the surface of the insulating layer, wherein the insulating layer includes a number of conductive pathways formed within the insulating layer, the conductive pathways being configured to interconnect selected contacts of the mems switch module.. .
Analog Devices Technology
02/05/15
20150035122

Micro-electro-mechanical system (mems) structures and design structures


Micro-electro-mechanical system (mems) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one fixed electrode on a substrate.
International Business Machines Corporation
02/05/15
20150035110

Pyroelectric aluminum nitride mems infrared sensor with selective wavelength infrared absorber


A mems sensor for detecting electromagnetic waves in a particular frequency range is provided. In a preferred embodiment, the mems sensor comprises a bottom substrate layer; a first electrode layer over the substrate layer; a pyroelectric layer over the first electrode layer; and a second electrode layer over the pyroelectric layer; wherein a top electrode layer is patterned with a periodic structure that has a periodicity less than or equal to target infrared wavelength..
The Regents Of The University Of California
02/05/15
20150035094

Microphone assembly having at least two mems microphone components


A microphone assembly includes two mems components each having a micromechanical microphone structure, each microphone structure having: a diaphragm configured to be deflected by sound pressure and provided with at least one diaphragm electrode of a capacitor system; and a stationary acoustically permeable counter-element that acts as bearer for at least one counter-electrode of the capacitor system. The microphone assembly is configured such that under the action of sound the spacing between the diaphragm and the counter-element of the two microphone structures changes in opposite directions..
Robert Bosch Gmbh
02/05/15
20150035091

Process for manufacturing a packaged device, in particular a packaged micro-electro-mechanical sensor, having an accessible structure, such as a mems microphone and packaged device obtained thereby


In order to manufacture a packaged device, a die having a sensitive region is bonded to a support, and a packaging mass of moldable material is molded on the support so as to surround the die. During molding of the packaging mass, a chamber is formed, which faces the sensitive region and is connected to the outside environment.
Stmicroelectronics S.r.i.
02/05/15
20150035090

Stacked die package for mems resonator system


In a packaging structure for a microelectromechanical-system (mems) resonator system, a resonator-control chip is mounted on a lead frame having a plurality of electrical leads, including electrically coupling a first contact on a first surface of the resonator-control chip to a mounting surface of a first electrical lead of the plurality of electrical leads through a first electrically conductive bump. A mems resonator chip is mounted to the first surface of the resonator-control chip, including electrically coupling a contact on a first surface of the mems resonator chip to a second contact on the first surface of the resonator-control chip through a second electrically conductive bump.
Sitime Corporation
02/05/15
20150035089

Mems device and forming the same


A method for forming a mems device is provided. The method includes the following steps of providing a substrate having a first portion and a second portion; fabricating a membrane type sensor on the first portion of the substrate; and fabricating a bulk silicon sensor on the second portion of the substrate..
Taiwan Semiconductor Manufacturing Company Limited
02/05/15
20150034620

Wafer bonding use in making a mems gyroscope


A method of making a mems gyroscope is disclosed herein, wherein the mems gyroscope comprised a magnetic sensing mechanism on a magnetic sensor wafer and a magnetic source on a mems wafer that further comprises a proof-mass.. .
Insightech, Llc
02/05/15
20150034592

Method for etching deep, high-aspect ratio features into glass, fused silica, and quartz materials


A method or process is disclosed for etching deep, high-aspect ratio features into silicon dioxide material layers and substrates, including glass, fused silica, quartz, or similar materials, using a plasma etch technology. The method has application in the fabrication and manufacturing of mems, microelectronic, micro-mechanical, photonic and nanotechnology devices in which silicon dioxide material layers or substrates are used and must be patterned and etched.
Corporation For National Research Initiatives
02/05/15
20150033856

Mems gyroscope


A mems gyroscope is disclosed herein, wherein the mems gyroscope comprised a driving mechanism, a magnetic sensing mechanism and a magnetic source that is formed at the proof-mass. The mems gyroscope is enclosed in a package that further comprises a magnet for providing bias magnetic field..
Insightech, Llc
02/05/15
20150033855

Mems device


A mems gyroscope is disclosed herein, wherein the mems gyroscope comprised a magnetic sensing mechanism and a magnetic source that is associated with the proof-mass. The magnetic sensing mechanism comprises multiple magnetic field sensors that are designated for sensing the magnetic field from a magnetic source so as to mitigate the problems caused by fabrication..
Insightech, Llc
02/05/15
20150033854

Mems gyroscope


A mems gyroscope is disclosed herein, wherein the mems gyroscope comprised plurality of movable portions that are capable of moving in response to angular velocity and a plurality of magnetic sensing mechanisms for measuring movements of the movable portions.. .
Iinsightech, Llc
02/05/15
20150033853

Mems gyroscope


A mems gyroscope is disclosed herein, wherein the mems gyroscope comprised plurality of movable portions that are capable of moving in response to angular velocity and a plurality of magnetic sensing mechanisms for measuring movements of the movable portions.. .
Insightech, Llc
02/05/15
20150033849

Mems device mechanism enhancement for robust operation through severe shock and acceleration


A micro-electro-mechanical systems (mems) device comprises at least one proof mass configured to have a first voltage and a motor motion in a first horizontal direction. At least one sense plate is separated from the proof mass by a sense gap, with the sense plate having an inner surface facing the proof mass and a second voltage different than the first voltage.
Honeywell International Inc.
01/29/15
20150032034

Apparatus and quantifying stability of the knee


A wireless motion sensor platform comprising mems inertial sensors and accompanying software for classification of diverse motion characteristics and kinematics of patient anatomy at high resolution. The sensor platform comprises a low-cost, compact, and low-weight device that can be applied to a patient's upper and/or lower leg during a knee examination to measure acceleration along three axes as well as rotations about these axes..
The Regents Of The University Of California
01/29/15
20150031160

Cmos compatible mems microphone and manufacturing the same


The present invention relates to a cmos compatible mems microphone, comprising: an soi substrate, wherein a cmos circuitry is accommodated on its silicon device layer; a microphone diaphragm formed with a part of the silicon device layer, wherein the microphone diaphragm is doped to become conductive; a microphone backplate including cmos passivation layers with a metal layer sandwiched and a plurality of through holes, provided above the silicon device layer, wherein the plurality of through holes are formed in the portions thereof opposite to the microphone diaphragm, and the metal layer forms an electrode plate of the backplate; a plurality of dimples protruding from the lower surface of the microphone backplate opposite to the diaphragm; and an air gap, provided between the diaphragm and the microphone backplate, wherein a spacer forming a boundary of the air gap is provided outside of the diaphragm or on the edge of the diaphragm; wherein a back hole is formed to be open in substrate underneath the diaphragm so as to allow sound pass through, and the microphone diaphragm is used as an electrode plate to form a variable capacitive sensing element with the electrode plate of the microphone backplate.. .
01/29/15
20150031159

Mems devices and methods of forming the same


A device includes a substrate, a routing conductive line over the substrate, a dielectric layer over the routing conductive line, and an etch stop layer over the dielectric layer. A micro-electro-mechanical system (mems) device has a portion over the etch stop layer.
Taiwan Semiconductor Manufacturing Company, Ltd.
01/29/15
20150031120

Mems particle sorting actuator and manufacture


A mems-based system and a method are described for separating a target particle from the remainder of a fluid stream. The system makes use of a unique, microfabricated movable structure formed on a substrate, which moves in a rotary fashion about one or more fixed points, which are all located on one side of the axis of motion.
Innovative Micro Technology
01/29/15
20150029700

Backlight module and display device


A backlight module and a display device having the backlight module are disclosed. The backlight module includes tricolor light sources, a light combining unit, a linear reflection unit, and a two-dimension reflection unit.
Hon Hai Precision Industry Co., Ltd.
01/29/15
20150029606

Micro-electromechanical system (mems) carrier


A micro-electromechanical system (mems) carrier formed by a typical surface micro-machining and bulk micro-machining process on a silicon substrate, having a frame, a movable carrier element, a conductive coil, two return springs and a pair of permanent magnets. The movable carrier element is formed within the frame and movable along a path, the conductive coil is formed on or embedded in the movable carrier element.
Globalmems Taiwan Corporation Limited
01/29/15
20150029591

Interference filter, optical filter device, optical module, electronic apparatus, manufacturing interference filter, and mems element


A wavelength variable interference filter includes a fixed substrate, a movable substrate that faces the fixed substrate, a pair of reflective films, a fixed extraction electrode provided on the fixed substrate, and a movable connection electrode that is provided on the movable substrate and is in contact with the fixed extraction electrode at a connection position, in which the movable substrate includes a first groove that is provided at the connection position in a plan view in which the fixed substrate and the movable substrate are viewed from a substrate thickness direction, and a second groove that has a larger area than an area of the first groove in the plan view and is connected to the first groove.. .
Seiko Epson Corporation
01/29/15
20150029590

Optical filter device, optical module, electronic apparatus, and mems device


An optical filter device includes a wavelength variable interference filter that has a fixed substrate provided with a fixed reflective film and a movable substrate provided with a movable reflective film, a casing that has an inner space for storing the wavelength variable interference filter therein, and a fixation portion that fixes the wavelength variable interference filter to the casing. In addition, the fixation portion is provided between a side surface of the fixed substrate and an inner surface of the casing..
Seiko Epson Corporation
01/29/15
20150028455

Method for varied topographic mems cap process


A device includes sidewalls formed in a wafer surface, where the sidewalls descend to a recessed surface. The recessed surface generally promotes resist coverage on the wafer surface, including corners (e.g., junctions between the wafer surface and various surface topographies, such as cavities, the recessed surface, and so forth) on the wafer.
Maxim Integrated Products, Inc.
01/29/15
20150028438

Mems device and process for producing same


There are provided a process for fabricating mems device that includes a plurality of through-holes capable being arranged at a high density, the through-holes having a tapered end portion. Through-holes having vertical side surfaces and tapered bottoms are provided by a processing method including the steps of: disposing quadrilateral patterning having desired dimensions on a silicon substrate having a flat surface of a crystal plane, etching the substrate to a desired depth by dry etching that can realize a high aspect ratio etching, and anisotropic wet etching the dry etched substrate with a koh aqueous solution containing isopropyl alcohol mixed thereinto..
Hitachi, Ltd.
01/29/15
20150028436

Apparatus comprising and a manufacturing an embedded mems device


A system and a method for forming a packaged mems device are disclosed. In one embodiment a packaged mems device includes a mems device having a first main surface with a first area along a first direction and a second direction, a membrane disposed on the first main surface of the mems device and a backplate adjacent to the membrane.
Infineon Technologies Ag
01/29/15
20150028432

Assembly and packaging of mems device


A micro electro mechanical systems (mems) device includes a solder bump on a substrate, a cmos-mems die comprising a cmos die and a mems die, and stud bumps on the cmos die. The mems die is disposed between the cmos die and the substrate.
Invensense, Inc.
01/29/15
20150027523

Nanostructures and methods for manufacturing the same


A resonant tunneling diode, and other one dimensional electronic, photonic structures, and electromechanical mems devices, are formed as a heterostructure in a nanowhisker by forming length segments of the whisker with different materials having different band gaps.. .
Qunano Ab
01/29/15
20150027198

Mems parameter identification using modulated waveforms


A sensor system includes a microelectromechanical systems (mems) sensor, control circuit, signal evaluation circuitry, a digital to analog converter, signal filters, an amplifier, demodulation circuitry and memory. The system is configured to generate high and low-frequency signals, combine them, and provide the combined input signal to a mems sensor.
Freescale Semiconductor, Inc.
01/22/15
20150024536

Mems device and manufacturing a mems device


mems devices with a rigid backplate and a method of making a mems device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate and a backplate supported by the substrate.
Infineon Technologies Ag
01/22/15
20150024534

Two degree of freedom dithering platform for mems sensor calibration


Systems and methods for two degree of freedom dithering for micro-electromechanical system (mems) sensor calibration are provided. In one embodiment, a method for a device comprises forming a mems sensor layer, the mems sensor layer comprising a mems sensor and an in-plane rotator to rotate the mems sensor in the plane of the mems sensor layer.
Honeywell International Inc.
01/22/15
20150023529

Mems devices, interface circuits, and methods of making thereof


In accordance with an embodiment of the present invention, a micro-electro-mechanical system (mems) device includes a first plate, a second plate disposed over the first plate, and a first moveable plate disposed between the first plate and the second plate. The mems device further includes a second moveable plate disposed between the first moveable plate and the second plate..
Infineon Technologies Ag
01/22/15
20150022872

Method of manufacturing a mems micro-mirror assembly


According to the present invention there is provided a method of manufacturing a mems micro mirror assembly (250), comprising the step of mounting a pcb board (205) on a metallic plate (206), mounting a mems device (240) on the pcb board (205), wherein the mems device (240) comprises a mems die (241) and a magnet (230).. .
Lemoptix Sa
01/22/15
20150022568

Image display device


The white balance for a high brightness region and a low brightness region is improved in an image display device using mems and a laser light source. An image processing unit of the device superposes a signal based on a first measured value of a light quantity at a first temperature on a picture signal, during its blanking period, which is supplied to the laser light source, and superposes a high frequency signal on the picture signal during its effective scanning period.
Hitachi Media Electronics Co., Ltd.
01/22/15
20150022431

Stress tolerant mems accelerometer


A micro-electro-mechanical system (mems) accelerometer employing a rotor and stator that are both released from a substrate. In embodiments, the rotor and stator are each of continuous a metal thin film.


Popular terms: [SEARCH]

Mems topics: Camera Module, Acceleration Sensor, Microelectromechanical Systems, Control Unit, Semiconductor Substrate, Semiconductor, Demodulation, Accelerometer, Calibration, Modulation, Mems Devices

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