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This page is updated frequently with new Mems-related patent applications.




Date/App# patent app List of recent Mems-related patents
05/19/16
20160142829 
 Integrated package forming wide sense gap micro electro-mechanical system microphone and methodologies for fabricating the same patent thumbnailIntegrated package forming wide sense gap micro electro-mechanical system microphone and methodologies for fabricating the same
A micro electro-mechanical system (mems) microphone is provided. The microphone includes: a package substrate having a port disposed through the package substrate, wherein the port is configured to receive acoustic waves; and a lid coupled to the substrate and forming a package.
Invensense, Inc.


05/19/16
20160142687 
 Mems oscillator patent thumbnailMems oscillator
A device comprising, a mirror which is configured to oscillate in response to an oscillation signal, wherein the device is configured such that oscillation of the mirror will induce a signal; and a circuit in operable cooperation with the mirror such that an induced signal can be measured by the circuit and wherein the circuit is configured to provide an oscillation signal proportional to the measured induced signal; wherein the device is configured such that the mirror can receive the oscillation signal so that the oscillation signal is filtered due to oscillation limitations of mirror, to provide a filtered signal.. .
Intel Corporation


05/19/16
20160141133 
 Capacitive microelectromechanical switches with dynamic soft-landing patent thumbnailCapacitive microelectromechanical switches with dynamic soft-landing
A microelectromechanical system (mems)-based electrical switch. The electrical switch includes a moveable electrode, a dielectric layer positioned adjacent the moveable electrode on a first side of the dielectric layer and spaced apart from the moveable electrode when the moveable electrode is in an inactivated position and in contact with the moveable electrode when the moveable electrode is in an activated position, and a substrate attached to the dielectric layer on a second side opposite to the first side, the moveable electrode is configured to brake prior to coming in contact with the dielectric layer when the moveable electrode is switched between the inactivated state and the activated state..
Purdue Research Foundation


05/19/16
20160140685 
 Display including sensors patent thumbnailDisplay including sensors
This disclosure provides devices, systems and methods for providing mems display elements in a display region and mems sensors in a shelf region. In one aspect, a display device includes a first substrate with a display region and a shelf region extending from the display region, and a second substrate over the display region and a portion of the shelf region.
Pixtronix, Inc.


05/19/16
20160139340 
 Mems fiber optical switch patent thumbnailMems fiber optical switch
Methods, systems, and apparatus, including computer programs encoded on computer storage media, for optical switching. One of the optical switches includes a plurality of optical fibers positioned in an array, the plurality of fibers including one or more input fibers and a plurality of output fibers; a microelectromechanical (mems) mirror configured to controllably reflect light from an input fiber to a particular target output fiber of the plurality of output fibers, wherein a position of the mems mirror is controllable to switch from a first target output fiber to a second target output fiber of the plurality of output fibers, and wherein the position of the mems mirror is controlled using a vertically staggered comb drive..
Oplink Communications, Inc.


05/19/16
20160139278 
 Device for reading radiological images patent thumbnailDevice for reading radiological images
A radiological image reading device includes a mems mirror that scan a recording medium on which a radiological image is recorded with excitation light; a light detecting element that includes a plurality of channels, each channel including a photodiode array, and detects light emitted from an irradiation position of the excitation light on the recording medium; a mems mirror driving circuit that determines as a light detection channel to detect the light, a channel corresponding to the irradiation position of the excitation light, out of the plurality of channels; and a reading circuit that reads the detection result of the light from the channel determined by the mems mirror driving circuit.. .
Hamamatsu Photonics K.k.


05/19/16
20160139173 
 Combined magnetometer accelerometer mems devices and methods patent thumbnailCombined magnetometer accelerometer mems devices and methods
Considerations for selecting capacitive sensors include accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, integration options with other sensors and/or electronics, and cost effectiveness. It is beneficial if such sensors are amenable to above-ic integration with associated control/readout circuitry for reduced parasitics and reduced footprint through area sharing.

05/19/16
20160138580 
 Mems-based active cooling system patent thumbnailMems-based active cooling system
In various embodiments, a cooling device for dissipating heat generated in an electronic or electrochemical device includes a substrate, multiple benders arranged on the substrate, and supply circuitry for supplying an electric field to actuate the benders for causing movement thereof, thereby producing an air flow.. .

05/19/16
20160137493 
 Mems device having a getter patent thumbnailMems device having a getter
A microelectromechanical system (mems) device includes a high density getter. The high density getter includes a silicon surface area formed by porosification or by the formation of trenches within a sealed cavity of the device.
Robert Bosch Gmbh


05/19/16
20160137492 
 Mems and cmos integration with low-temperature bonding patent thumbnailMems and cmos integration with low-temperature bonding
The present disclosure relates to method of forming a mems device that mitigates the above mentioned difficulties. In some embodiments, the present disclosure relates to a method of forming a mems device, which forms one or more cavities within a first side of a carrier substrate.
Taiwan Semiconductor Manufacturing Co., Ltd.


05/19/16
20160137490 

Cavity package design


A semiconductor device. The device including a substrate having electrical traces, at least one of a mems die and a semiconductor chip mounted on the substrate, and a spacer.
Robert Bosch Gmbh


05/19/16
20160137489 

Microelectromechanical systems device


A microelectromechanical systems (mems) device includes: a circuit board; a lower cap disposed on the circuit board; a case disposed on the lower cap and having an internal space; a rotating part rotatably mounted in the case; an upper cap disposed on the case and including a reinforcing part disposed above a axis of the rotating part; and a molding layer encasing the lower cap, the case, and the upper cap.. .
Samsung Electro-mechanics Co., Ltd.


05/19/16
20160137488 

Method and apparatus of making mems packages


mems packages and modules are described. In an embodiment, a module includes a package mounted within an opening in a module board.
Apple Inc.


05/19/16
20160137486 

Mems microphone with tensioned membrane


A micro electro-mechanical system (mems) microphone is provided. The mems microphone is configured to operate at a predetermined range of frequencies.
Invensense, Inc.


05/12/16
20160134975 

Microphone with trimming


A microphone includes a microelectromechanical system (mems) device, an amplifier, and an attenuation apparatus. The mems device converts acoustic energy into electrical signals.
Knowles Electronics, Llc


05/12/16
20160134974 

Lead frame-based chip carrier used in the fabrication of mems transducer packages


Systems and methods for lead frame-based chip carriers for use with mems transducers. One embodiment provides a method for manufacturing a mems microphone package.
Robert Bosch Gmbh


05/12/16
20160134973 

Secure audio sensor


Providing security features in an audio sensor is presented herein. A micro-electro-mechanical system (mems) microphone can include an acoustic membrane that converts an acoustic signal into an electrical signal; an electronic amplifier that increases an amplitude of the electrical signal to generate an amplified signal; and switch(es) configured to prevent propagation of a direct current (dc) voltage source to the mems microphone; prevent propagation of the dc voltage source to the electronic amplifier; prevent propagation of the electrical signal to the electronic amplifier; and/or prevent propagation of the amplified signal to an external device..
Invensense, Inc.


05/12/16
20160134237 

Low power oscillator system


In a first aspect, an oscillator is disclosed. The oscillator comprises a digital circuit; and at least one microelectromechanical system (mems) resonator.
Invensense, Inc.


05/12/16
20160134016 

Antenna efficiency enhancement by active detuning of diversity antenna


The present invention generally relates to cellular phones having multiple antennas. The invention relates to how two antennas in a diversity or mimo antenna system interact through mutual coupling.
Cavendish Kinetics, Inc.


05/12/16
20160133271 

Microphone with electronic noise filter


An acoustic apparatus includes a microelectromechanical system (mems) device, a controlled filter coupled to the mems device, and an amplifier. The controllable filter and the amplifier are coupled together at a node.
Knowles Electronic, Llc


05/12/16
20160131893 

Mems scanner


The present invention relates to a micro electro mechanical systems (mems) scanner, and more particularly, to an mems scanner for implementing stable driving while increasing a driving angle between a fixed electrode and a driving electrode using an mems process. The mems scanner comprises a lower frame, a pair of upper frames, a pair of levers, a pair of fixed electrode portions, and a driving electrode portion..
Korea Optron Corp.


05/12/16
20160131679 

Mirco-electro-mechanical system (mems) device


The invention provides a mems device. The mems device includes: a substrate; a proof mass, including at least two slots, each of the slots including an inner space and an opening, the inner space being relatively closer to a center area of the proof mass than the opening; at least two anchors located in the corresponding slots and connected to the substrate; at least two linkages located in the corresponding slots and connected to the corresponding anchors; and a multi-dimensional spring structure for assisting a multi-dimensional movement of the proof mass, the multi-dimensional spring structure surrounding a periphery of the proof mass, and connected to the substrate through the linkages and the anchors.
Richtek Technology Corporation


05/12/16
20160131484 

System and device position classification


A system and method for classifying a position of a device may include processing one or more respective signal characteristics of one or more signals indicative of device orientation to determine a position of a device relative to a user. In a non-limiting example, various aspects of this disclosure include analyzing, over time, one or more characteristics of a first signal indicative of the alignment of a first device axis with a reference direction and one or more characteristics of a second signal indicative of the alignment of a second device axis with the known direction, and determining the position of the device based at least in part on such analysis.
Invensense, Inc.


05/12/16
20160131481 

Mems inertial sensing using acoustic waves


A mems structure includes a generating diaphragm, one or more wave channels, and one or more sensing diaphragm. A method for inertial sensing comprises driving the generating diaphragm to generate an acoustic wave, passing the acoustic wave through a channel in the mems structure to the sensing diaphragm, and measuring a relative phase of the wave at the sensing diaphragm to determine acceleration or rotation of the mems structure..

05/12/16
20160131480 

Time multiplexed electrodes in mems inertial sensors


In certain exemplary embodiments of the present invention, rather than having two or more electrodes connected to separate bond pads for making electrical connections to separate electrical circuits to perform various electrode functions (e.g., a drive electrode for performing a drive function and a sense electrode for performing a sense function as in fig. 1), a common electrode that can perform multiple electrode functions is electrically connected to a single bond pad, with the two electrical circuits connected to the single bond pad.
Analog Devices, Inc.


05/12/16
20160130139 

Mems sensor cap with multiple isolated electrodes


The cap wafer for a mems device includes multiple electrically isolated electrodes that can be bonded and electrically connected to separate electrical contacts on a mems device wafer. The electrically isolated electrodes can be used for any of a variety of functions, such as for apply a force to a movable mems structure on the mems device wafer (e.g., for driving resonance of the movable mems structure or for adjusting a resonance or sense mode of the movable mems structure) or for sensing motion of a movable mems structure on the mems device wafer.
Analog Devices, Inc.


05/12/16
20160130138 

Method and applications of thin-film membrane transfer


The disclosure relates to method and apparatus for micro-contact printing of micro-electromechanical systems (“mems”) in a solvent-free environment. The disclosed embodiments enable forming a composite membrane over a parylene layer and transferring the composite structure to a receiving structure to form one or more microcavities covered by the composite membrane.
Massachusetts Institute Of Technology


05/12/16
20160130137 

Microelectromechanical systems (mems) devices at different pressures


Some embodiments relate to multiple mems devices that are integrated together on a single substrate. A device substrate comprising first and second micro-electro mechanical system (mems) devices is bonded to a capping structure.
Taiwan Semiconductor Manufacturing Co., Ltd.


05/12/16
20160130134 

Pre-molded mems device package having conductive column coupled to leadframe and cover


A mems lead frame package body encloses a mems device enclosed in an internal cavity formed by the mold body and cover. To accommodate a mems microphone, an acoustic aperture extends through the mold body.
Invensense, Inc.


05/12/16
20160130133 

Mems-sensor


A sensor for measuring physical parameters such as acceleration, rotation, magnetic field, comprises a substrate (13) defining a substrate plane and at least one sensing plate (11, 12) suspended above the substrate (13) for performing a movement having at least a first component in a sensing direction. The sensing direction is orthogonal to the substrate plane.
Tronics Microsystems S.a.


05/12/16
20160129183 

Wireless strain gauge/flow sensor


A flow rate sensor is provided in a wireless, leadless package. The flow rate sensor includes a mems sensor coupled to an asic and an antenna.
Stmicroelectronics, Inc.


05/12/16
20160128389 

Mems-based sensor for an aerosol delivery device


An aerosol delivery device is provided that includes a housing, microelectromechanical systems-based (mems-based) sensor and microprocessor. The mems-based sensor is within the housing and configured to detect a pressure on the mems-based sensor caused by airflow through at least a portion of the housing.
R.j. Reynolds Tobacco Company


05/05/16
20160127845 

Blockage detection for a microelectromechanical systems sensor


Systems and techniques for detecting blockage associated with a microelectromechanical systems (mems) microphone of a device are presented. The device includes a mems acoustic sensor and a processor.
Invensense, Inc.


05/05/16
20160127838 

Microphone package with molded spacer


A microelectromechanical system (mems) microphone package including a mems microphone die configured to sense acoustic pressure and to generate a signal based on the acoustic pressure. An application specific integrated circuit (asic) electrically connects to the mems microphone die.
Robert Bosch Gmbh


05/05/16
20160127837 

Multi-layer composite backplate for micromechanicala microphone


A mems device. The device includes a membrane, and a reinforced backplate having a plurality of openings.
Robert Bosch Gmbh


05/05/16
20160126926 

Microelectromechanical resonators


Embodiments relate to mems resonator structures and methods that enable application of a maximum available on-chip voltage. In an embodiment, a mems resonator comprises a connection between a ground potential and the gap electrode of the resonator.
Infineon Technologies Dresden Gmbh


05/05/16
20160126045 

Mems switch and manufacturing the same


A microelectromechanical systems (mems) switch includes: a signal line disposed on a substrate; a dielectric member attached to the substrate; support fixtures disposed on the substrate at opposing sides of the signal line; and a membrane having ends fixed to the support fixtures, and a protrusion-recess pattern having a corrugated structure, the membrane being configured to change a capacitance provided by the membrane and the dielectric member by being positioned adjacent to the dielectric member through a downward movement.. .
Samsung Electro-mechanics Co., Ltd.


05/05/16
20160126017 

Stress control during processing of a mems digital variable capacitor (dvc)


The present invention generally relates to a mems digital variable capacitor (dvc) (900) and a method for manufacture thereof. The movable plate (938) within a mems dvc should have the same stress level to ensure proper operation of the mems dvc.
Cavendish Kinetics, Inc.


05/05/16
20160124311 

Sloped electrode element for a torsional spatial light modulator


A method of forming a micro-electromechanical systems (mems) pixel, such as a dmd-type pixel, by depositing a photoresist spacer layer upon a substrate. The photoresist spacer layer is exposed to a grey-scale lithographic mask to shape an upper surface of the photoresist spacer layer.
Texas Instruments Incorporated


05/05/16
20160124302 

Operation/margin enhancement feature for surface-mems structure; sculpting raised address electrode


A method of forming a micro-electromechanical systems (mems) pixel, such as a dmd type pixel, by forming a substrate having a non-planar upper surface, and depositing a photoresist spacer layer upon the substrate. The spacer layer is exposed to a grey-scale lithographic mask to shape an upper surface of the spacer layer.
Texas Instruments Incorporated


05/05/16
20160124215 

Electromagnetic mems device


Embodiments of the present disclosure are directed toward an apparatus comprising a frameless mems device with a two-dimensional (2d) mirror, in accordance with some embodiments. The apparatus may include a base and a mems device disposed on the base.
Intel Corporation


05/05/16
20160124214 

Electromagnetic mems device


Embodiments of the present disclosure are directed toward techniques and configurations for a magnetic mems apparatus that in some instances may comprise a magnetic circuit and a mems device. The magnetic circuit may include two magnets that may be disposed on the substantially flat base and magnetized vertically to the base and in opposite directions to each other to produce a substantially horizontal magnetic field between the magnets.
Intel Corporation


05/05/16
20160124157 

3d-mems optical switch


A 3d-mems optical switch, comprising: a collimator array, a pd array, a window glass which covers the pd array and is coated with a partial reflection film, a micro-electro mechanical system (mems) micro-mirror, and a core optical switch controller connected to the pd array and the mems micro-mirror. The pd array is integrated inside the core optical switch, so that the architecture and the volume of the optical switch are simplified.
Huawei Technologies Co., Ltd.


05/05/16
20160122182 

Mems device with a capping substrate


A method for forming an integrated circuit device includes forming a dielectric layer onto a first substrate, forming a sacrificial material into a sacrificial cavity formed into the dielectric layer, forming a membrane layer over the dielectric layer and sacrificial material, releasing the sacrificial material through at least one via formed through the membrane layer, and bonding a capping substrate to the membrane layer such that a second cavity is formed, the second cavity being connected to the sacrificial cavity though a via formed into the membrane layer.. .
Taiwan Semiconductor Manufacturing Company, Ltd.


05/05/16
20160122181 

Microintegrated encapsulated mems sensor with mechanical decoupling and manufacturing process thereof


The microintegrated sensor comprises a stack formed by a sensor layer, of semiconductor material, by a cap layer, of semiconductor material, and by an insulating layer. The sensor layer and the cap layer have a respective peripheral portion surrounding a central portion, and the insulating layer extends between the peripheral portions of the sensor layer and of the cap layer.
Stmicroelectronics S.r.l.


05/05/16
20160122177 

Trapped membrane


A mems trapped membrane. The mems trapped membrane includes a first layer and a second structure.
Robert Bosch Gmbh


04/28/16
20160119722 

Method for the integration of a microelectromechanical systems (mems) microphone device with a complementary metal-oxide-semiconductor (cmos) device


A microelectromechanical systems (mems) package includes a mems device and an integrated circuit (ic) device connected by a through silicon via (tsv). A conductive mems structure is arranged in a dielectric layer and includes a membrane region extending across a first volume arranged in the dielectric layer.
Taiwan Semiconductor Manufacturing Co., Ltd.


04/28/16
20160118993 

Micro-electro-mechanical systems (mems), apparatus, and operating methods thereof


A method that comprises converting a first electrical signal to a second electrical signal using a converter coupled between a micro-mechanical structure and an analog-to-digital converter (adc). The method also comprises actuating a switch to selectively interpolate at least one datum between two neighboring converted second electrical signals based on a selected clock signal, wherein the selected clock signal is one of a plurality of clock signals, each clock signals of the plurality of clock signals has a corresponding frequency, and the selected clock signal corresponds to an operating mode of the micro-mechanical structure..
Taiwan Semiconductor Manufacturing Company, Ltd.


04/28/16
20160118955 

Multiple coil spring mems resonator


A multiple coil spring mems resonator includes a center anchor and a resonator body including two or more coil springs extending in a spiral pattern from the center anchor to an outer closed ring. Each pair of coil springs originates from opposing points on the center anchor and extends in the spiral pattern to opposing points on the outer ring.
Micrel, Inc.


04/28/16
20160118954 

Compound spring mems resonators for frequency and timing generation


A compound spring mems resonator includes a resonator body constructed using one or more spring unit cells forming a compound spring block and one or more compound spring blocks forming the resonator body. Each compound spring block is anchored at nodal points to ensure a high quality factor.
Micrel, Inc.


04/28/16
20160117541 

Mut fingerprint id system


mems ultrasound fingerprint id systems are provided. Aspects of the systems include the capability of detecting both epidermis and dermis fingerprint patterns in three dimensions.
The Regents Of The University Of California


04/28/16
20160117045 

Oscillator circuit, phase locked loop, and electronic device


An oscillator circuit includes a mems switch, a transistor, a buffer circuit, and an analog memory. The mems switch includes a fixed electrode and a movable electrode.
Semiconductor Energy Laboratory Co., Ltd.


04/28/16
20160116361 

System for wafer-level testing of mems pressure sensors


A system for testing pressure sensors on a device wafer includes a tray for holding the device wafer. The tray includes a base having a surface, a spacer extending from the surface, and a tacky material disposed on the surface.
Freescale Semiconductor, Inc.


04/28/16
20160115016 

Film induced interface roughening and producing the same


Various embodiments provide for a method for roughening a surface of a mems device or the surface of a cmos surface. A first material can be deposited in a thin layer over a surface made of a second material.
Invensense, Inc.


04/28/16
20160115015 

Semiconductor device, display module, and electronic device


A semiconductor device includes a mems device, a first transistor that supplies a first voltage to a first electrode of the mems device, a second transistor that supplies a second voltage to the first electrode of the mems device, a third transistor that supplies a first video signal to a gate of the first transistor, a fourth transistor that supplies the first voltage to a second electrode of the mems device, a fifth transistor that supplies the second voltage to the second electrode of the mems device, and a sixth transistor that supplies a second video signal to a gate of the fourth transistor. A gate of the second transistor is connected to the gate of the fourth transistor.
Semiconductor Energy Laboratory Co., Ltd.


04/28/16
20160115014 

Non-symmetric arrays of mems digital variable capacitor with uniform operating characteristics


The present invention generally relates to a mems dvc. The mems dvc has an rf electrode and is formed above a cmos substrate.
Cavendish Kinetics, Inc.


04/28/16
20160114883 

Actively-controlled superhydrophobic surfaces


Active superhydrophobic surface structures are actively-controlled surface structures exhibiting a superhydrophobic state and an ordinary state. Active superhydrophobic surface structures comprise an outer elastomeric covering defining an exposed surface, a controlled group of mems (micro-electro-mechanical system) actuators at least covered by the elastomeric covering, and, a controlled region of the exposed surface corresponding to the controlled group.
The Boeing Company


04/21/16
20160113108 

Package-level electromagnetic interference shielding structures for a substrate


A electromagnetic interference shielding device is disclosed having a first substrate one or more surfaces. One or more laminates are operatively attached to the one or more surfaces of the first substrate.

04/21/16
20160112809 

Mesh in mesh backplate for micromechanical microphone


A mems backplate. The mems backplate includes a first mesh pattern having a first height and a first arrangement of openings, and a second mesh pattern having a second height and a second arrangement of vent hole apertures.

04/21/16
20160112808 

Mems microphone modules and wafer-level techniques for fabricating the same


A method of fabricating a plurality of mems microphone modules by providing a first substrate wafer 62 on which are mounted a plurality of sets comprising an led 102, an ic chip 22 and a mem microphone device 24, where the led 102 and ic chip 22 are surrounded and separated by first spacers 104, 64a, 64, the spacer 104 being much taller, attaching a second substrate on top of the first spacer elements above the ic chip 22, mounting a mems microphone device 24 to the second substrate 60, the second substrate not extending over the led 102, surrounding the mems microphone device by second spacers 32a, 32, attaching a cover wafer 28 across the whole first substrate wafer 62 covering all the plurality of sets, forming openings 30 to the mems cavities, dividing the substrate wafer 62 into individual mems microphone modules through the width of the separating spacers 104, 32, 64. Conductive traces may extend through the spacers.

04/21/16
20160112807 

Mems microphone structure and manufacturing the same


A mems microphone structure, comprising a semiconductor substrate having a cavity, a first dielectric layer having a through-hole communicating with the cavity, a lower diaphragm electrode formed above the through-hole and at least partially attached to the upper surface of the first dielectric layer, and an upper electrode structure with an insulating layer. The upper electrode structure comprises an annular supporter, a back plate having multiple holes, and an upper electrode connection.

04/21/16
20160112803 

Mems microphone element


A concept is provided which permits the implementation of mems microphone elements having a very good snr, high microphone sensitivity and a large frequency bandwidth. The microphone structure of the mems element is implemented in a layer structure and includes at least one sound pressure-sensitive diaphragm (210), an acoustically permeable counter element (220) and a capacitor system for detecting the diaphragm deflections, the diaphragm (210) and the counter element (220) being situated on top of each other and a distance apart from one another in the layer structure and each bring equipped with at least one electrode of the capacitor system.

04/21/16
20160111625 

Method of fabricating piezoelectric mems devices


A single photo mask can be used to define the three critical layers for the piezoelectric mems device, specifically the top electrode layer, the piezoelectric material layer, and the bottom electrode layer. Using a single photo mask removes the misalignment source caused by using multiple photo masks.

04/21/16
20160109348 

System for measuring shear stress of a fluid with enhanced sensitivity


A measurement system of a tangential force applied by a fluid is provided. The system includes a pipe in which the fluid flows, the pipe includes an inner surface contacting the fluid, and a cavity arranged in the inner surface of the pipe: and a mems and/or nems device measuring the tangential force including a support, a moving plate suspended from the support by a pivot link, the moving plate including a first face on which the fluid applies a tangential force.

04/21/16
20160109315 

Compensated pressure sensors


Compensated pressure sensor includes a mems pressure sensor die having resistors ra and rd connected in series in a first leg of a wheatstone bridge and resistors rb and rc connected in series in a second leg of the wheatstone bridge; a first and second fuse; and a first, second third, fourth, fifth and sixth resistor; wherein: a first end of the first resistor is connected in series with the first leg of the bridge and a first end of the second resistor is connected in series with the second leg of the bridge; the first fuse is connected, at a first end, to a first output of the bridge, and at a second end, to a second end of the third resistor and to a first end of the second fuse; the second fuse is connected, at a second end, to a second output of the bridge; a first end of the third resistor is connected to an input to the bridge and to a first end of the fourth resistor; a second end of the fourth resistor is connected to a second end of the first resistor, a second end of the second resistor and a first end of the sixth resistor; and the fifth resistor is connected, at a first end, to the input to the bridge.. .



Mems topics: Camera Module, Acceleration Sensor, Microelectromechanical Systems, Control Unit, Semiconductor Substrate, Semiconductor, Demodulation, Accelerometer, Calibration, Modulation, Mems Devices

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