|| List of recent Mems-related patents
|Oriented wireless structural health and seismic monitoring|
A sensor for structural health monitoring includes a tri-axis microelectromechanical systems (mems) accelerometer and a tri-axis mems gyrometer. Sampled 3d accelerometer data and 3d gyrometer data are processed using integration and sensor fusion to produce an estimate of 3d rotation of the sensor device and an estimate of 3d displacement of the sensor device expressed in a global reference frame.
|Micromechanical detection structure for a mems acoustic transducer and corresponding manufacturing process|
A micromechanical structure for a mems capacitive acoustic transducer, has: a substrate made of semiconductor material, having a front surface lying in a horizontal plane; a membrane, coupled to the substrate and designed to undergo deformation in the presence of incident acoustic-pressure waves; a fixed electrode, which is rigid with respect to the acoustic-pressure waves and is coupled to the substrate by means of an anchorage structure, in a suspended position facing the membrane to form a detection capacitor. The anchorage structure has at least one pillar element, which is at least in part distinct from the fixed electrode and supports the fixed electrode in a position parallel to the horizontal plane..
|Mems device with asymmetric flexures|
A microelectromechanical systems (mems) device includes a scanning platform suspended from a fixed platform by two flexures that form a pivot axis. The two flexures may be symmetric or asymmetric about a centerline of the scanning platform.
|Mems device with multi-segment flexures|
A microelectromechanical systems (mems) device includes a scanning platform suspended from a fixed platform by two flexures that form a pivot axis. The two flexures may be symmetric or asymmetric about a centerline of the scanning platform.
|Micro electro mechanical systems device and apparatus for compensating tremble|
Disclosed are a micro electro mechanical systems (mems) device and an apparatus for compensating for a tremble. The mems device includes a substrate; a driven member moving relative to the substrate; an elastic member connected to the driven member and the substrate; a driving member fixed to the substrate for driving the driven member; and a dynamic stopper fixed to the substrate and latched to the driven member..
|Satellite reception assembly installation and maintenance|
A direct broadcast satellite (dbs) reception assembly may receive a desired satellite signal and process the desired satellite signal for output to a gateway. The dbs assembly may also receive one or more undesired satellite signals and determine a performance metric of the one or more undesired satellite signals.
|Vibrator, oscillator, electronic device, moving object, and method of manufacturing vibrator|
A mems vibrator includes a substrate, a lower electrode provided on a main surface of the substrate, a fixed portion provided on the main surface, and an upper electrode which is separated from the substrate and is supported by the fixed portion. The upper electrode is a vibrating body having a region overlapping the lower electrode when the substrate is seen in plan view, and includes a weight portion in a region provided with an antinode portion of vibration of the upper electrode as the vibrating body..
|Mems vibrator, electronic apparatus, and moving object|
A mems vibrator includes: a vibrating portion; an electrode portion provided to face the vibrating portion with a gap therebetween; and a support portion extended in a first direction from the vibrating portion. The vibrating portion includes a functional portion having a different thickness viewed from the first direction..
|Method of fabricating mems device having release etch stop layer|
A method of fabricating a microelectromechanical (mems) device includes bonding a transducer wafer to a substrate wafer along a bond interface. An unpatterned transducer layer included within the transducer wafer is patterned.
|Mems device with stress isolation and method of fabrication|
A mems device (20) includes a proof mass structure (26) and beams (28, 30) residing in a central opening (32) of the proof mass structure (26), where the structure and the beams are suspended over a substrate (22). The beams (28, 30) are oriented such that lengthwise edges (34, 36) of the beams are beside one another.
|Multi-axis mems rate sensor device|
A mems rate sensor device. In an embodiment, the sensor device includes a mems rate sensor configured overlying a cmos substrate.
|Multi-axis integrated mems inertial sensing device on single packaged chip|
A multi-axis integrated mems inertial sensor device. The device can include an integrated 3-axis gyroscope and 3-axis accelerometer on a single chip, creating a 6-axis inertial sensor device.
|Mems pressure sensor, electronic device, altimeter, electronic apparatus, and moving object|
A mems pressure sensor includes a diaphragm portion that becomes displaced according to a pressure, and a resonator arranged on a main surface of the diaphragm portion. The resonator includes: a first fixed electrode provided on the main surface; and a drive electrode having a second fixed electrode provided on the main surface, a movable electrode spaced apart from the first fixed electrode, overlapping with the first fixed electrode, as viewed in a plan view seen from a normal direction to the main surface, and driven in a direction that intersects the main surface, and a supporting electrode supporting the movable electrode and connected to the second fixed electrode..
|Method and system for determining vehicle wheel alignment based on the application of systems using gyroscopic sensors and/or mems angular rate sensors (mems gyroscopes)|
The invention relates to a method and system for determining vehicle wheel alignment, and namely, camber angles, total and individual toe and front wheel steering axis caster and tilt angles (caster and kingpin inclination), by measuring changes in wheel sensor angles from a predetermined position. Changes are measured using gyroscopic sensors or mems angular rate sensors (mems gyroscopes)..
|Mems hinges with enhanced rotatability|
A mechanical device includes a long, narrow element made of a rigid, elastic material. A rigid frame is configured to anchor at least one end of the element, which is attached to the frame, and to define a gap running longitudinally along the element between the beam and the frame, so that the element is free to move within the gap.
|Smart shunt devices and methods|
Devices and methods for the measurement and control of fluid using one or two capacitors are described. The devices use micro-electro-mechanical-systems (mems) and radio-frequency inductive coupling to sense the properties of a fluid in a tube.
|Deposition technique for depositing a coating on a device|
The present invention describes a deposition method suitable for depositing a coating on a device. The method is particularly suited for depositing a self assembled monolayer (sam) coating on a micro electro-mechanical structures (mems).
|Micro-electro-mechanical system (mems) structures and design structures|
Micro-electro-mechanical system (mems) structures, methods of manufacture and design structures are disclosed. The method includes forming a micro-electro-mechanical system (mems) beam structure by venting both tungsten material and silicon material above and below the mems beam to form an upper cavity above the mems beam and a lower cavity structure below the mems beam..
|Mems device and a method of making the same|
A mems gyro is provided, having a movable portion, a non-movable portion, and a magnetic sensing structure that comprises a magnetic source disposed at the movable portion, a magnetic sensing element positioned at the non-movable portion. The movable portion is capable of moving in response to external angular velocity or an external accelerator such that the magnetic field sensed by the magnetic sensing element is in relation to the movement of the movable portion, therefore, the angular velocity or the accelerator.
|Differential outputs in multiple motor mems devices|
An the acoustic apparatus comprising a first mems motor that includes a first diaphragm and a first back plate, and a second mems motor that includes a second diaphragm and a second back plate. The first motor is biased with a first electrical polarity and a second motor is biased with a second electrical polarity such that the first electrical polarity and the second electrical polarity are opposite.
|Membrane mems actuator including fluidic impedance structure|
A liquid dispenser includes a first liquid chamber including a nozzle and a second liquid chamber. A flexible membrane is positioned to separate and fluidically seal the first liquid chamber and the second liquid chamber.
|Integrated mems design for manufacturing|
A method of operating a system including a mems device of an integrated circuit die includes generating an indicator of a device parameter of the mems device in a first mode of operating the system using a monitor structure formed using a mems structural layer of the integrated circuit die. The method includes generating, using a cmos device of the integrated circuit die, a signal indicative of the device parameter and based on the indicator.
|Mems sensor packaging and method thereof|
A micro electro mechanical systems (mems sensor packaging includes a first wafer having a readout integrated circuit (roic) formed thereon., a second wafer disposed corresponding to the first wafer and having a concave portion on one side thereof and a mems sensor prepared on the concave portion, joint solders formed along a surrounding of the mems sensor and sealing the mems sensor jointing the first and second wafers, and pad solders formed to electrically connect the roic circuit of the first wafer and the mems sensor of the second wafer. According to the present disclosure, in joining and packaging a wafer having the roic formed thereon and a wafer having the mems sensor formed thereon, the size of a package can be reduced and an electric signal can be stably provided by forming internally pad solders for electrically connecting the roic and the mems sensor..
|Silicon substrate mems device|
A mems device includes a silicon substrate. The silicon substrate includes a plurality of dielectric material grooves spaced apart from each other.
|Mems inertial sensor and method of inertial sensing|
The invention comprises an inertial sensor comprising a frame, a proof mass, a first resonant element, the first resonant element being fixed to the frame and electrostatically coupled to the proof mass, and a second resonant element, the second resonant element being fixed to the frame, adjacent to the first resonant element such that there is substantially no electrostatic coupling between the second resonant element and the proof mass. A coupling is provided between the first resonant element and the second resonant element.
|Electronic drive circuit for a mems type resonator device and method for actuating the same|
The electronic circuit (1) is for driving a resonator (2) of a mems resonator device. The resonator includes a mass (m) connected to a spring (k) and a damping element (d), an actuation element (cact) for actuating the mass via an actuation signal (drive), and a detection element (cdet) for detecting motion of the mass.
|Mems modeling system and method|
A system and method for modeling microelectromechanical devices is disclosed. An embodiment includes separating the microelectromechanical design into separate regions and modeling the separate regions separately.
|Energy harvesting cochlear implant|
The invention is related to a totally implantable cochlear implant having a transducer which is a piezoelectric vibration energy harvester to be mounted on the ossicular chain or the tympanic membrane to detect the frequency of oscillations and generate the required voltage to stimulate the relevant auditory nerves. The invention enables patients' continuous access to sound, since it eliminates the outside components of conventional cochlear implants.
|Mems scanning micromirror|
A mems micromirror (30) is presented including a frame (60) with a mirror body (50) arranged therein. The mirror body (50) is rotatable around a rotation axis (58) extending in a plane (x-y) defined by the frame (60).
|Flow through mems package|
A flow through micro-electromechanical systems (mems) package and methods of operating a mems packaged using the same are provided. Generally, the package includes a cavity in which the mems is enclosed, an inlet through which a fluid is introduced to the cavity during operation of the mems and an outlet through which the fluid is removed during operation of the mems, wherein the package includes features that promote laminar flow of the fluid across the mems.
|Apparatus and method for removing mechanical resonance with internal control loop|
The present invention related to an apparatus and method to removing mechanical resonance of a system using internal control loop, and in more particularly, the internal control loop reduces the resonance factor of the system. The approach in the present invention is not sensitive to the system mechanical parameters changes within time and within temperature changes.
|Rf mems isolation, series and shunt dvc, and small mems|
The present invention generally relates to an architecture for isolating an rf mems device from a substrate and driving circuit, series and shunt dvc die architectures, and smaller mems arrays for high frequency communications. The semiconductor device has one or more cells with a plurality of mems devices therein.
|Mems device anchoring|
Embodiments of the present invention generally relate to a mems device that is anchored using the layer that is deposited to form the cavity sealing layer and/or with the layer that is deposited to form the pull-off electrode. The switching element of the mems device will have a flexible or movable portion and will also have a fixed or anchor portion that is electrically coupled to ground.
|Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof|
A microelectromechanical-acoustic-transducer assembly has: a first die integrating a mems sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the mems sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers..
|Silicon based mems microphone, a system and a package with the same|
The present invention relates to a silicon based mems microphone, comprising a silicon substrate and an acoustic sensing part supported on the silicon substrate, wherein a mesh-structured back hole is formed in the substrate and aligned with the acoustic sensing part, the mesh-structured back hole includes a plurality of mesh beams which are interconnected with each other and supported on the side wall of the mesh-structure back hole, the plurality of mesh beams and the side wall define a plurality of mesh holes which all have a tapered profile and merge into one hole in the vicinity of the acoustic sensing part at the top side of the silicon substrate. The mesh-structured back hole can help to streamline the air pressure pulse caused, for example, in a drop test and thus reduce the impact on the acoustic sensing part of the microphone, and also serve as a protection filter to prevent alien substances such as particles entering the microphone..
|Inertial angular sensor of balanced mems type and method for balancing such a sensor|
An inertial angular sensor of mems type has a support of at least two masses which are mounted movably with respect to the support, at least one electrostatic actuator and at least one electrostatic detector. The masses are suspended in a frame itself connected by suspension means to the support.
|Micro synthetic jet ejector|
A semiconductor device is provided which functions as a synthetic jet ejector. The semiconductor device (201) includes a first layer (203), a third layer (207), and a second layer (205) disposed between the first layer and the third layer, wherein the second layer includes a mems comb drive (221).
|Arrangement and method to sense flow using mechanical stress microsensors|
An arrangement for controlling flow includes a flow control element, an actuator, a linkage assembly, and a sensor module. The linkage assembly is coupled between the flow control element and the actuator, and includes a rotatable linkage element coupled to impart force to the flow control element.
|Isolation and enrichment of nucleic acids on microchip|
Techniques for isolating, enriching, and/or amplifying target dna molecules using mems-based microdevices are disclosed. The techniques can be used for detecting single nucleotide polymorphism, and for isolating and enriching desired dna molecules, such as aptamers..
|Mems infrared sensor including a plasmonic lens|
A portable thermal imaging system includes a portable housing configured to be carried by a user, a bolometer sensor assembly supported by the housing and including an array of thermal sensor elements and at least one plasmonic lens, a memory including program instructions, and a processor operably connected to the memory and to the sensor, and configured to execute the program instructions to obtain signals from each of a selected set of thermal sensor elements of the array of thermal sensor elements, assign each of the obtained signals with a respective color data associated with a temperature of a sensed object, and render the color data.. .
A projector includes laser light sources which emit light, a mems mirror which operates at specified angles of deflection so as to scan light emitted from the laser light sources over a projection area at a sine-function angular velocity in which a scanning speed in a vicinity of a central portion of the projection area in a horizontal direction is faster than a scanning speed in a vicinity of end portions, and a first lens which is disposed at a position between the mems mirror and the projection area and which refracts light scanned by the scanner such that the scanning speed of the light scanned by the mems mirror in the vicinity of the central portion of the projection area in the horizontal direction is equal or substantially equal to the scanning speed in the vicinity of the end portions in the horizontal direction.. .
|Two axes mems resonant magnetometer|
A two-axes mems magnetometer includes, in one plane, a freestanding rectangular frame having inner walls and four torsion springs, wherein opposing inner walls of the frame are contacted by one end of only two torsion springs, each torsion spring being anchored by its other end, towards the centre of the frame, to a substrate. In operation, the magnetometer measures the magnetic field in two orthogonal sensing modes using differential capacitance measurements..
|Temperature drift compensation of mems resonators|
A resonator device comprising a piezoelectric material and at least one electrode, the device also provided with a material with a positive coefficient of stiffness, wherein the material is disposed in the device as an electrode or as a separate layer adjacent the piezoelectric material formed as one or more layers in the device. The material that performs the temperature compensating function is selected from the group consisting of ferromagnetic metal alloys, shape-memory metal alloys, and polymers, wherein the selected material has a temperature coefficient that varies with the relative amounts of the individual constituents of the compositions and wherein the composition is selected to provide the material with the positive coefficient of stiffness..
|Structure of mems electroacoustic transducer|
A structure of micro-electro-mechanical systems (mems) electroacoustic transducer is disclosed. The mems electroacoustic transducer includes a substrate having a mems device region, a diaphragm having openings and disposed in the mems device region, a silicon material layer disposed on the diaphragm and sealing the diaphragm, and a conductive pattern disposed beneath the diaphragm in the mems device region.
|Mems apparatus with increased back volume|
A microelectromechanical system (mems) microphone assembly includes a base and a cover. The cover is coupled to the base and together with the base defines a cavity.
|Cover for a mems microphone|
A microphone assembly includes a base, a cover, and a microelectromechanical system (mems) die. The cover extends at least partially over and is coupled to the base.
|Method of packaging a mems transducer device and packaged mems transducer device|
A packaged mems transducer device comprising: a die, including: a semiconductor body having a front side and a back side, opposite to one another in a first direction, at least one cavity extending through the semiconductor body between the front side and the back side, and at least one membrane extending on the front side at least partially suspended over the cavity; and a package designed to house the die on an inner surface thereof. The transducer device moreover includes a sealing layer extending on the back side of the semiconductor body for sealing the cavity, and includes a paste layer extending between the sealing layer and the inner surface of the package for firmly coupling the die to the package..
|Mems device and method of manufacturing the same|
According to one embodiment, a mems device including a first electrode provided on a support substrate, a second electrode opposed to the first electrode, having at least one end part overlapping the first electrode, and able to move in a direction it is opposed to the first electrode, and beam parts provided on the support substrate and supporting the second electrode. The surface of that part of the first electrode, which opposes the end part of the second electrode, is set at a lower level than the surface of that part of the second electrode, which opposes a center part of the second electrode..
|Mems device and manufacturing method thereof|
According to one embodiment, a mems device includes a first electrode formed on a support substrate, a second electrode arranged to face the first electrode and formed to be movable in a facing direction with respect to the first electrode, a beam portion formed on the support substrate and formed to support the second electrode, a cap layer formed to cover the second electrode and beam portion, a plurality of through-holes formed in the cap layer, the through-holes being formed in a portion other than a proximity portion in which a facing distance between the cap layer and a member in the cap layer is not longer than a preset distance, and a sealing layer formed to cover the cap layer and fill the through-holes.. .
|Low-g mems acceleration switch|
A motion-sensitive low-g mems acceleration switch, which is a mems switch that closes at low-g acceleration (e.g., sensitive to no more than 10 gs), is proposed. Specifically, the low-g mems acceleration switch has a base, a sensor wafer with one or more proofmasses, an open circuit that includes two fixed electrodes, and a contact plate.
A mems gyro is provided, having a movable portion, a non-movable portion, and a magnetic sensing structure that comprises a magnetic source disposed at the movable portion, a magnetic sensing element positioned at the non-movable portion. The movable portion is capable of moving in response to external angular velocity or an external accelerator such that the magnetic field sensed by the magnetic sensing element is in relation to the movement of the movable portion, therefore, the angular velocity or the accelerator..
|Wafer level centrifuge for mems stiction detection and screening system and method|
A wafer level centrifuge (wlc) system and method of testing mems devices using the system. The wafer level centrifuge (wlc) system can include a base centrifuge system and a cassette mounting hub coupled to the base centrifuge system.
|Mems device with release aperture|
The present disclosure provides a method of fabricating a micro-electro-mechanical systems (mems) device. In an embodiment, a method includes providing a substrate including a first sacrificial layer, forming a micro-electro-mechanical systems (mems) structure above the first sacrificial layer, and forming a release aperture at substantially a same level above the first sacrificial layer as the mems structure.
|Inhibiting propagation of surface cracks in a mems device|
A microelectromechanical systems (mems) device (58) includes a structural layer (78) having a top surface (86). The top surface (86) includes surface regions (92, 94) that are generally parallel to one another but are offset relative to one another such that a stress concentration location (90) is formed between them.
|Miniaturized optical zoom lens system|
The present application provides a micromechanical (mems) based zoom lens system, for use in miniature device applications, such as miniature electronic imaging devices. The mems-based zoom lens system comprises at least four optical elements, or two alvarez or lohmann lenses, that are configured for passage of optical signals therethrough along an optical signal path.
|Hidden hinge mems with temporary gimbal anchor|
Micro-electro-mechanical system (mems) mirror devices and manufacturing methods thereof. The device comprising a hinge layer having orthogonal tilt and roll hinges connecting inner and outer platforms such that the inner platform has bi-directional rotation.
|Image display device|
A change in the white balance caused due to the temperature is reduced in an image display device using mems and a laser light source. An image processing unit of the device superposes a signal based on a first measured value of a light quantity at a first temperature on a image signal to be supplied to the laser light source.
|Display apparatus having a micro-electro-mechanical system|
The present invention relates to a display apparatus with pixels, wherein each pixel includes a switching device, a micro-electro-mechanical system (mems), and a gray scale control device. The switching device can be connected to a gate line and a data line to output a corresponding data signal in response to a gate signal.
|Electrical component and method of manufacturing the same|
According to one embodiment, there is disclosed an electrical component. The electrical component includes a substrate, a mems device on the substrate.