FreshPatents.com Logo
Enter keywords:  

Track companies' patents here: Public Companies RSS Feeds | RSS Feed Home Page
Popular terms

[SEARCH]

Mems topics
Camera Module
Acceleration Sensor
Microelectromechanical Systems
Control Unit
Semiconductor Substrate
Semiconductor
Demodulation
Accelerometer
Calibration
Modulation
Mems Devices

Follow us on Twitter
twitter icon@FreshPatents

Web & Computing
Cloud Computing
Ecommerce
Search patents
Smartphone patents
Social Media patents
Video patents
Website patents
Web Server
Android patents
Copyright patents
Database patents
Programming patents
Wearable Computing
Webcam patents

Web Companies
Apple patents
Google patents
Adobe patents
Ebay patents
Oracle patents
Yahoo patents

[SEARCH]

Mems patents



      
           
This page is updated frequently with new Mems-related patent applications. Subscribe to the Mems RSS feed to automatically get the update: related Mems RSS feeds. RSS updates for this page: Mems RSS RSS


Capacitive mems sensor devices

Mems jetting structure for dense packing

Method for mems structure with dual-level structural layer and acoustic port

Date/App# patent app List of recent Mems-related patents
08/28/14
20140241548
 Acoustic sensor apparatus and acoustic camera for using mems microphone array patent thumbnailnew patent Acoustic sensor apparatus and acoustic camera for using mems microphone array
An acoustic camera for using a mems microphone array comprises: an acoustic sensor apparatus (30) comprising a print circuit board (20) on which the plural of mems microphone (10) are mounted, to send signals for the detected sound to a data collection unit (40); a data collection unit (40) connected to the acoustic sensor apparatus (30), which samples analog signals related to sound transmitted from the acoustic sensor apparatus (30) to transform into digital signals and transmit them to the central processing unit (40); a central processing unit (50) connected to the data collection unit (40), which calculates noise level based on digital signals related to sound transmitted from the data collection unit (40); and a display unit (60) which is connected to the central processing unit (50), which displays in color the noise level calculated at the central processing unit.. .
08/28/14
20140240894
 Fractal structures for mems variable capacitors patent thumbnailnew patent Fractal structures for mems variable capacitors
In accordance with the present disclosure, one embodiment of a fractal variable capacitor comprises a capacitor body in a microelectromechanical system (mems) structure, wherein the capacitor body has an upper first metal plate with a fractal shape separated by a vertical distance from a lower first metal plate with a complementary fractal shape; and a substrate above which the capacitor body is suspended.. .
08/28/14
20140240810
 Mems drive and beam-steering apparatus patent thumbnailnew patent Mems drive and beam-steering apparatus
A drive apparatus and a beam-steering apparatus fabricated from a mems process. The apparatus has a first layer, a second layer and a plurality of fluid-filled volumes defined there between.
08/28/14
20140239979
 Capacitive mems sensor devices patent thumbnailnew patent Capacitive mems sensor devices
A packaged capacitive mems sensor device includes at least one capacitive mems sensor element with at least one capacitive mems sensor cell including a first substrate having a thick and a thin dielectric region. A second substrate with a membrane layer is bonded to the thick dielectric region and over the thin dielectric region to provide a mems cavity.
08/28/14
20140239769
 Capacitive micromachined ultrasonic transducer (cmut) device with through-substrate via (tsv) patent thumbnailnew patent Capacitive micromachined ultrasonic transducer (cmut) device with through-substrate via (tsv)
A capacitive micromachined ultrasonic transducer (cmut) device includes at least one cmut cell including a first substrate having a top side including a patterned dielectric layer thereon including a thick and a thin dielectric region. A membrane layer is bonded on the thick dielectric region and over the thin dielectric region to provide a movable membrane over a micro-electro-mechanical system (mems) cavity.
08/28/14
20140239768
 Capacitive micromachined ultrasonic transducer (cmut) with through-substrate via (tsv) substrate plug patent thumbnailnew patent Capacitive micromachined ultrasonic transducer (cmut) with through-substrate via (tsv) substrate plug
A capacitive micromachined ultrasonic transducer (cmut) device includes at least one cmut cell including a first substrate of a single crystal material having a top side including a patterned dielectric layer thereon including a thick and a thin dielectric region, and a through-substrate via (tsv) extending a full thickness of the first substrate. The tsv is formed of the single crystal material, is electrically isolated by isolation regions in the single crystal material, and is positioned under a top side contact area of the first substrate.
08/28/14
20140239446
 Fractal structures for fixed mems capacitors patent thumbnailnew patent Fractal structures for fixed mems capacitors
An embodiment of a fractal fixed capacitor comprises a capacitor body in a microelectromechanical system (mems) structure. The capacitor body has a first plate with a fractal shape separated by a horizontal distance from a second plate with a fractal shape.
08/28/14
20140239423
 Microelectromechanical system devices having through substrate vias and methods for the fabrication thereof patent thumbnailnew patent Microelectromechanical system devices having through substrate vias and methods for the fabrication thereof
Methods for the fabrication of a microelectromechanical systems (“mems”) devices are provided. In one embodiment, the mems device fabrication method forming a via opening extending through a sacrificial layer and into a substrate over which the sacrificial layer has been formed.
08/28/14
20140239421
 Surface charge mitigation layer for mems sensors patent thumbnailnew patent Surface charge mitigation layer for mems sensors
A semiconductor device includes a substrate. At least one transducer is provided on the substrate.
08/28/14
20140239353
 Method for mems structure with dual-level structural layer and acoustic port patent thumbnailnew patent Method for mems structure with dual-level structural layer and acoustic port
A method for fabricating a mems device includes depositing and patterning a first sacrificial layer onto a silicon substrate, the first sacrificial layer being partially removed leaving a first remaining oxide. Further, the method includes depositing a conductive structure layer onto the silicon substrate, the conductive structure layer making physical contact with at least a portion of the silicon substrate.
08/28/14
20140239089
new patent Mems jetting structure for dense packing
A fluid ejector includes a fluid ejection module having a substrate and a layer separate from the substrate. The substrate includes a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle.
08/28/14
20140238828
new patent Merged legs and semi-flexible anchoring for mems device
The present invention generally relates to a mems device having a plurality of cantilevers that are coupled together in an anchor region and/or by legs that are coupled in a center area of the cantilever. The legs ensure that each cantilever can move/release from above the rf electrode at the same voltage.
08/28/14
20140238574
new patent Design of a mold for forming complex 3d mems components
A mold structure having high-precision multi-dimensional components includes: depositing an oxide layer on a top surface of a plurality of semiconductor substrates, patterning a design integrated in one or more of the oxide layers; repositioning the substrates to enable the oxide layers make contact with one another; bonding in sequential order the repositioned substrates using a dielectric bonding, forming a three dimension (3d) mold; filling the 3d mold with filling material and removing the overburden filling material present on a top surface of the component.. .
08/28/14
20140238132
new patent Mems resonant accelerometer
Provided is a micro electro mechanical system (mems) resonating accelerometer. The mems resonating accelerometer according to the present invention comprises: a first inertial mass; a second inertial mass which is spaced at a predetermined distance from the first inertial mass on a first axis; an elastic body which is provided between the first and second inertial masses so as to apply elasticity; and a tuning fork which is connected to the elastic body and measures the change of frequency according to acceleration, wherein the longitudinal direction of the tuning fork is parallel to a second axis which is perpendicular to the first axis, the elastic body has an opening portion being in a circular shape with a portion thereof removed, and one end of the tuning fork penetrates the opening portion and is connected to the inner surface of the elastic body..
08/21/14
20140236479
Attitude estimation for pedestrian navigation using low cost mems accelerometer in mobile applications, and processing methods, apparatus and systems
A user-heading determining system (10) for pedestrian use includes a multiple-axis accelerometer (110) having acceleration sensors; a device-heading sensor circuit (115) physically situated in a fixed relationship to the accelerometer (110); an electronic circuit (100) operable to generate signals representing components of acceleration sensed by the accelerometer (110) sensors, and to electronically process at least some part of the signals to produce an estimation of attitude of a user motion with respect to the accelerometer, and further to combine the attitude estimation (750, α) with a device heading estimation (770, ψ) responsive to the device-heading sensor circuit, to produce a user heading estimation (780); and an electronic display (190) responsive to the electronic circuit (100) to display information at least in part based on the user heading estimation. Other systems, circuits and processes are also disclosed..
08/21/14
20140232475
Single insertion trimming of highly accurate reference oscillators
A highly integrated monolithic self-compensated oscillator (sco) with high frequency stability versus temperature variations is described, together with a cost effective single insertion point trimming (spt) algorithm. The spt is utilized to adjust the phase and frequency of the sco to meet frequency stability versus temperature and frequency accuracy requirements for a reference clock.
08/21/14
20140232241
Piezoelectric array employing integrated mems switches
Switchable micromachined transducer arrays are described where a microelectromechanical systems (mems) switch, or relay, is monolithically integrated with a transducer element. In embodiments, the mems switch is implemented in the same substrate as the transducer array to implement one or more logic, addressing, or transducer control function.
08/21/14
20140231979
Stacked assembly of a mems integrated device having a reduced thickness
An assembly of a mems integrated device envisages: a package having a base substrate with a main surface in a horizontal plane, and a coating set on the base substrate; a first body including semiconductor material and integrating a micromechanical structure, housed within the package on the base substrate; at least one second body including semiconductor material and integrating at least one electronic component, designed to be functionally coupled to the micromechanical structure, the first body and the second body being arranged within the package stacked in a vertical direction transverse to the horizontal plane. In particular, at least one between the first body and the base substrate defines a first recess, in which the second body is housed, at least in part..
08/21/14
20140231939
Capacitive pressure sensor and method
In one embodiment, a method of forming a mems device includes providing a silicon wafer with a base layer and an intermediate layer above an upper surface of the base layer. A first electrode is defined in the intermediate layer and an oxide portion is provided above an upper surface of the intermediate layer.
08/21/14
20140231938
Micro-electro-mechanical device with buried conductive regions, and manufacturing process thereof
A mems device formed by a body; a cavity, extending above the body; mobile and fixed structures extending above the cavity and physically connected to the body via anchoring regions; and electrical-connection regions, extending between the body and the anchoring regions and electrically connected to the mobile and fixed structures. The electrical-connection regions are formed by a conductive multilayer including a first semiconductor material layer, a composite layer of a binary compound of the semiconductor material and of a transition metal, and a second semiconductor material layer..
08/21/14
20140231936
Micro-electro-mechanical system (mems) and related actuator bumps, methods of manufacture and design structures
Micro-electro-mechanical system (mems) structures, methods of manufacture and design structures are provided. The method of forming a mems structure includes forming fixed actuator electrodes and a contact point on a substrate.
08/21/14
20140231254
Method of fabricating a nanochannel system for dna sequencing and nanoparticle characterization
A process for fabricating a nanochannel system using a combination of microelectromechanical system (mems) microfabrication techniques, atomic force microscopy (afm) nanolithography, and focused ion beam (fib). The nanochannel system, fabricated on either a glass or silicon substrate, has channel heights and widths on the order of single to tens of nanometers.
08/21/14
20140231236
Micro-electro-mechanical system (mems) capacitive ohmic switch and design structures
A micro-electro-mechanical system (mems), methods of forming the mems and design structures are provided. The method includes forming a coplanar waveguide (cpw) comprising a signal electrode and a pair of electrodes on a substrate.
08/21/14
20140230576
Sub-millinewton capacitive mems force sensor for mechanical testing on a microscope
Most mechanical tests (compression testing, tensile testing, flexure testing, shear testing) of samples in the sub-mm size scale are performed under the observation with an optical microscope or a scanning electron microscope. However, the following problems exist with prior art force sensors as e.g they cannot be used for in-plane mechanical testing (a- and b-direction) of a sample; they cannot be used for vertical testing (c-direction) of a sample.
08/21/14
20140230560
Three dimensional piezoelectric mems
Method and apparatus for a piezoelectric apparatus are provided. In some embodiments, a method for fabricating a piezoelectric device may include etching a series of vertical trenches in a top substrate portion, depositing a first continuous conductive layer over the trenches and substrate, depositing a continuous piezoelectric layer over the first continuous conductive layer such that the piezoelectric material has trenches and sidewalls, depositing a second continuous conductive layer over the continuous piezoelectric layer, etching through the vertical trenches of the first continuous conductive layer, continuous piezoelectric layer, second continuous conductive layer, and top substrate portion into a bottom substrate portion, etching a series of horizontal trenches in the bottom substrate portion such that the horizontal trenches and vertical trenches occupy a continuous free space and allow movement of a piezoelectric mems device created by the above method in three dimensions..
08/21/14
20140230550
Accelerometer with low sensitivity to thermo-mechanical stress
The invention relates to a microelectro-mechanical structure (mems), and more particularly, to systems, devices and methods of compensating effect of thermo-mechanical stress on a micro-machined accelerometer by incorporating and adjusting elastic elements to couple corresponding sensing electrodes. The sensing electrodes comprise moveable electrodes and stationary electrodes that are respectively coupled on a proof mass and a substrate.
08/21/14
20140230549
Spring system for mems device
A spring system (74) links a pair of drive masses (30, 32) of a mems device (72). The spring system (74) includes stiff beams (76, 78, 80, 82) oriented to form a parallelogram arrangement (84).
08/21/14
20140230547
Microelectromechanical bulk acoustic wave devices and methods
Micromachined gyroscopes, such as those based upon microelectromechanical systems (mems) have the potential to dominate the rate-sensor market mainly due to their small size, low power and low cost. As mems gyroscopes are resonant devices requiring active excitation it would be beneficial to improve the resonator q-factor reducing the electrical drive power requirements for the excitation circuitry.
08/14/14
20140227817
Manufacturing process of mems device
A manufacturing process of a m ems device divides a substrate for fabricating u mems component into two electrically isolated regions, so that the mems component and the circuit disposed on its surface could connect electrically with another substrate below respectively through the corresponding conducing regions, whereby the configuration of the electrical conducting paths and the manufacturing process are simplified. A mems device manufactured by using the aforementioned process is also disclosed herein..
08/14/14
20140227816
Method to package multiple mems sensors and actuators at different gases and cavity pressures
A method for fabricating a multiple mems device. A semiconductor substrate having a first and second mems device, and an encapsulation wafer with a first cavity and a second cavity, which includes at least one channel, can be provided.
08/14/14
20140226838
Signal source separation
In one aspect, a microphone with closely spaced elements is used to acquire multiple signals from which a signal from a desired source is separated. The signal separation approach uses a combination of direction-of-arrival information or other information determined from variation such as phase, delay, and amplitude among the acquired signals, as well as structural information for the signal from the source of interest and/or for the interfering signals.
08/14/14
20140225759
Micro-electro-mechanical systems (mems), systems, and operating methods thereof
A micro-electro-mechanical system (mems) includes a micro-mechanical structure that generates a first electrical signal. An analog-to-digital converter (adc) is coupled with the micro-mechanical structure.
08/14/14
20140225677
Mems oscillator
A device comprising, a mirror which is configured to oscillate in response to an oscillation signal, wherein the device is configured such that oscillation of the mirror will induce a signal; and a circuit in operable cooperation with the mirror such that an induced signal can be measured by the circuit and wherein the circuit is configured to provide an oscillation signal proportional to the measured induced signal; wherein the device is configured such that the mirror can receive the oscillation signal so that the oscillation signal is filtered due to oscillation limitations of mirror, to provide a filtered signal.. .
08/14/14
20140225250
Methods and systems for fabrication of low-profile mems cmos devices
A mems integrated circuit including a plurality of layers where a portion includes one or more electronic elements on a semiconductor material substrate. The circuit includes a structure of interconnection layers having a bottom layer of conductor material and a top layer of conductor material where the layers are separated by at least one layer of dielectric material.
08/14/14
20140225205
Mems component
An mems component includes at least one metal-ceramic multilayer stack as a mechanical functional layer in the layered structure of the mems component. The metal-ceramic multilayer stack functions as a mechanical functional layer in which at least one component of the micromechanical structure of the mems component is configured..
08/14/14
20140225203
Packages and methods for packaging mems microphone devices
Microelectromechanical systems (mems) microphone devices and methods for packaging the same include a package housing, an interior lid, and an integrated mems microphone die. The package housing includes a sound port therethrough for communicating sound from outside the package housing to an interior of the package housing.
08/14/14
20140224018
Mems force sensors fabricated using paper substrates
Also provided are methods of modifying paper for use as a substrate material in mems devices.. .
08/14/14
20140224016
Micro-electromechanical gyro device
A resonator micro-electronic gyro, preferably a micro-electromechanical system (mems) gym comprises a first and a second resonator mass (1, 2) suspended for rotational vibration. The two masses (1, 2) are flexibly connected by four mechanical coupling elements (4, 5, 6, 7) for anti-phase vibration.
08/07/14
20140220723
Methods and structures for using diamond in the production of mems
A mems device with movable mems structure and electrodes is produced by fabricating electrodes and shielding the electrodes with diamond buttons during subsequent fabrication steps, such as the etching of sacrificial oxide using vapor hf. In some embodiments, the diamond buttons are removed after the movable mems structure is released..
08/07/14
20140218839
Routing of mems variable capacitors for rf applications
The present invention generally relates to a variable capacitor for rf and microwave applications. The variable capacitor includes a bond pad that has a plurality of cells electrically coupled thereto.
08/07/14
20140218698
Projection apparatus
A projection apparatus including a light source module and a micro-electro-mechanical-system (mems) mirror is provided. The light source module outputs a plurality of illumination beams having different transmission paths.
08/07/14
20140218237
Electronically steerable antenna using reconfigurable power divider based on cylindrical electromagnetic band gap (cebg) structure
A low complexity/cost beamsteering antenna includes a central line feed affixed to a radial waveguide structure, radiating elements positioned along the circumference of the radial waveguide structure, and a plurality of active elements interspersed along the surface of the radial waveguide structure between the central line feed and the radiating elements. The active elements may comprise pin diodes or microelectromechanical system (mems) components, and may be selectively activated/deactivated by dc switches in order to direct the propagation of an rf signal over the radial waveguide structure in a manner similar to a power divider.
08/07/14
20140217929
Stiction resistant mems device and method of operation
A mems device (20) includes a movable element (20) suspended above a substrate (22) by a spring member (34) having a spring constant (104). A spring softening voltage (58) is applied to electrodes (24, 26) facing the movable element (20) during a powered mode (100) to decrease the stiffness of the spring member (34) and thereby increase the sensitivity of the movable element (32) to an input stimulus (46).
08/07/14
20140217521
Mems device with stress relief structures
An encapsulated mems device includes stress-relief trenches in a region of its substrate that surrounds the movable micromachined structures and that is covered by a cap, such that the trenches are fluidly exposed to a cavity between the substrate and the cap. A method of fabricating a mems device includes fabricating stress-relief trenches through a substrate and fabricating movable micromachined structures, and capping the device prior art encapsulating the device..
07/31/14
20140213916
Wireless mems left atrial pressure sensor
Systems for monitoring left atrial pressure using implantable cardiac monitoring devices and, more specifically, to a left atrial pressure sensor implanted through a septal wall are presented herein.. .
07/31/14
20140213915
Wireless mems left atrial pressure sensor
Systems for monitoring left atrial pressure using implantable cardiac monitoring devices and, more specifically, to a left atrial pressure sensor implanted through a septal wall are presented herein.. .
07/31/14
20140213007
Internal electrical contact for enclosed mems devices
A method of fabricating electrical connections in an integrated mems device is disclosed. The method comprises forming a mems wafer.
07/31/14
20140211366
Micro-electro-mechanical system (mems) variable capacitor apparatuses and related methods
Systems, devices, and methods for micro-electro-mechanical system (mems) tunable capacitors can include a fixed actuation electrode attached to a substrate, a fixed capacitive electrode attached to the substrate, and a movable component positioned above the substrate and movable with respect to the fixed actuation electrode and the fixed capacitive electrode. The movable component can include a movable actuation electrode positioned above the fixed actuation electrode and a movable capacitive electrode positioned above the fixed capacitive electrode.
07/31/14
20140211295
Wavelength converting lighting device and associated methods
A lighting device according to another embodiment of the invention for directing source light within a source wavelength range in a blue wavelength range in a desired output direction may comprise a mems device that may include a dmd that includes an array of mems cells, each mems cell including an operative surface to receive and redirect the source light towards the desired output direction. The array of mems cells may include first and second pluralities of mems cells including first and second conversion coatings applied to the operative surfaces thereof configured to convert source light into first and second wavelength ranges.
07/31/14
20140211193
Structured light and time of flight depth capture with a mems ribbon linear array spatial light modulator
A fast spatial light modulator based on a linear mems ribbon array enables a depth capture system to operate in structured light and time-of-flight modes. Time-of-flight depth information may be used to phase unwrap structured light depth information.
07/31/14
20140210864
Low-voltage mems shutter assemblies
This disclosure provides systems, methods and apparatus for providing relatively thinner and less stiff compliant beams for a shutter assembly. A protective coating is deposited and patterned over the shutter assembly before it is released from a sacrificial mold over which the shutter assembly is formed.
07/31/14
20140210836
Layer for reduced charge migration between mems layers
This disclosure provides systems, methods and apparatus for reducing image artifacts that arise when a display is exposed to sunlight over time. Various implementations disclosed herein can be implemented to prevent charge injection from inducing a negative offset voltage shift for display elements in the display.
07/31/14
20140210315
Mems vibrating structure using an orientation dependent single-crystal piezoelectric thin film layer
A micro-electrical-mechanical system (mems) vibrating structure includes a carrier substrate, a first anchor, a second anchor, a single crystal piezoelectric body, a first conducting layer, and a second conducting layer. The first anchor and the second anchor are provided on the surface of the carrier substrate.
07/31/14
20140210314
Mems vibrating structure using an orientation dependent single-crystal piezoelectric thin film layer
A micro-electrical-mechanical system (mems) vibrating structure includes a carrier substrate, a first anchor, a second anchor, a single crystal piezoelectric body, and a conducting layer. The first anchor and the second anchor are provided on the surface of the carrier substrate.
07/31/14
20140210020
Mems device and method of manufacturing a mems device
Mems devices with a rigid backplate and a method of making a mems device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate and a backplate supported by the substrate.
07/31/14
20140210019
Low-cost package for integrated mems sensors
An integrated mems sensor package is disclosed. The package comprises a sensor chip with a top surface and a bottom surface.
07/31/14
20140210018
Microelectromechanical system devices having crack resistant membrane structures and methods for the fabrication thereof
Methods for fabricating crack resistant microelectromechanical (mems) devices are provided, as are mems devices produced pursuant to such methods. In one embodiment, the method includes forming a sacrificial body over a substrate, producing a multi-layer membrane structure on the substrate, and removing at least a portion of the sacrificial body to form an inner cavity within the multi-layer membrane structure.
07/31/14
20140209442
Mems switches and fabrication methods
Mems switches and methods of fabricating mems switches. The switch has a vertically oriented deflection electrode having a conductive layer supported by a supporting layer, at least one drive electrode, and a stationary electrode.
07/31/14
20140208857
Mems resonator pressure sensor
A resonant mems pressure sensor in which the resonator mass of the mems resonator is anchored both to the fixed base beneath the resonator cavity as well as to the top membrane over the resonator cavity. This provides a more robust fixing of the resonator mass and offers a dependence of resonant frequency on the pressure outside the cavity..
07/31/14
20140208838
Micro electro mechanical system catalytic combustible gas sensor using porous membrane embedded micro-heater
Provided is a catalytic combustible gas sensor using a porous membrane embedded micro-heater and a micro electro mechanical system (mems) technology. The present disclosure provides a gas sensor that is structurally, mechanically, and electrically stable, and has a simple device fabrication process in a mems catalytic combustible gas sensor that is miniaturized and also consumes a significantly small amount of power by puncturing a plurality of holes in membranes, a heating resistor, and a sensing electrode, by etching and thereby thermally isolating a substrate by a predetermined thickness through the plurality of holes, and by including a sensing structure formed using a sensing material and a compensation structure formed using a compensation material..
07/31/14
20140208823
Multi-axis chip-scale mems inertial measurement unit (imu) based on frequency modulation
A multi-axis microelectromechanical-systems (mems) inertial measurement unit (imu) is fabricated in a vacuum sealed single packaged device. An fm vibratory gyroscope and an fm resonant accelerometer both for generating fm output signals is fabricated in the silicon chip using mems.
07/24/14
20140207140
Dynamic orthoscopic sensing
A dynamic sensing method and apparatus employs microelectromechanical systems (mems) and nanoelectromechanical (nems) surgical sensors for gathering and reporting surgical parameters pertaining to a drive mechanism of a surgical device, such as speed, rotation, torque and other characteristics of the surgical device. The surgical device employs or affixes the surgical sensor on or about a surgical device for detecting electromechanical characteristics during the surgical procedure.
07/24/14
20140206123
Dual layer microelectromechanical systems device and method of manufacturing same
Exemplary microelectromechanical system (mems) devices, and methods for fabricating such are disclosed. An exemplary method includes providing a silicon-on-insulator (soi) substrate, wherein the soi substrate includes a first silicon layer separated from a second silicon layer by an insulator layer; processing the first silicon layer to form a first structure layer of a mems device; bonding the first structure layer to a substrate; and processing the second silicon layer to form a second structure layer of the mems device..


Popular terms: [SEARCH]

Mems topics: Camera Module, Acceleration Sensor, Microelectromechanical Systems, Control Unit, Semiconductor Substrate, Semiconductor, Demodulation, Accelerometer, Calibration, Modulation, Mems Devices

Follow us on Twitter
twitter icon@FreshPatents

###

This listing is a sample listing of patent applications related to Mems for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Mems with additional patents listed. Browse our RSS directory or Search for other possible listings.
     SHARE
  
         


FreshNews promo



0.4496

2909

70 - 0 - 71