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This page is updated frequently with new Mems-related patent applications.




Date/App# patent app List of recent Mems-related patents
06/16/16
20160173992 
 Differential-type mems acoustic transducer patent thumbnailDifferential-type mems acoustic transducer
A mems acoustic transducer has: a detection structure, which generates an electrical detection quantity as a function of a detected acoustic signal; and an electronic interface circuit, which is operatively coupled to the detection structure and generates an electrical output quantity as a function of the electrical detection quantity. The detection structure has a first micromechanical structure of a capacitive type and a second micromechanical structure of a capacitive type, each including a membrane that faces and is capacitively coupled to a rigid electrode and defines a respective first detection capacitor and second detection capacitor; the electronic interface circuit defines an electrical connection in series of the first detection capacitor and second detection capacitor between a biasing line and a reference line, and further has a first single-output amplifier and a second single-output amplifier, which are coupled to a respective one of the first detection capacitor and the second detection capacitor and have a respective first output terminal and second output terminal, between which the electrical output quantity is present..
Stmicroelectronics S.r.l.


06/16/16
20160173002 
 Micro-electro-mechanical system device with enhanced structural strength patent thumbnailMicro-electro-mechanical system device with enhanced structural strength
The invention provides a mems device with enhanced structural strength. The mems device includes a plurality of metal layers, including a top metal layer with a plurality of metal segments.
Pixart Imaging Incorporation


06/16/16
20160172112 
 Dvc utilizing mems resistive switches and mim capacitors patent thumbnailDvc utilizing mems resistive switches and mim capacitors
The present invention generally relates to a mems dvc utilizing one or more mim capacitors. The mim capacitor may be disposed between the mems device and the rf pad or the mim capacitor may be integrated into the mems device itself.
Cavendish Kinetics, Inc.


06/16/16
20160169935 
 Multi-axis chip-scale mems inertial measurement unit (imu) based on frequency modulation patent thumbnailMulti-axis chip-scale mems inertial measurement unit (imu) based on frequency modulation
A multi-axis microelectromechanical-systems (mems) inertial measurement unit (imu) is fabricated in a vacuum sealed single packaged device. An fm vibratory gyroscope and an fm resonant accelerometer both for generating fm output signals is fabricated in the silicon chip using mems.
The Regents Of The University Of California


06/16/16
20160169927 
 Mirco-electro-mechanical system device patent thumbnailMirco-electro-mechanical system device
The invention provides an mems device. The mems device includes: a substrate, a proof mass, a spring, a spring anchor, a first electrode anchor, and a second electrode anchor, a first fixed electrode and a second fixed electrode.
Richtek Technology Corporation


06/16/16
20160169760 
 Pressure sensor with differential capacitive output patent thumbnailPressure sensor with differential capacitive output
A mems pressure sensor device is provided that can provide both a linear output with regard to external pressure, and a differential capacitance output so as to improve the signal amplitude level. These benefits are provided through use of a rotating proof mass that generates capacitive output from electrodes configured at both ends of the rotating proof mass.
Freescale Semiconductor, Inc.


06/16/16
20160169758 
 Stress isolated differential pressure sensor patent thumbnailStress isolated differential pressure sensor
A package includes a mems die and a cap element coupled to and stacked with the mems die. The mems die includes at least two physically isolated pressure sensors, each of which resides on its individual cantilevered platform structure.
Freescale Semiconductor, Inc.


06/16/16
20160168983 
 Scalable borehole acquisition system patent thumbnailScalable borehole acquisition system
A method that is usable with a well includes deploying microelectromechanical system (mems)-based seismic receivers in the well and using the mems-based receivers to acquire data indicative of seismic energy.. .
Schlumberger Technology Corporation


06/16/16
20160167961 
 Compensation and calibration for mems devices patent thumbnailCompensation and calibration for mems devices
A sensor system includes a microelectromechanical systems (mems) sensor, processing circuitry, measurement circuitry, stimulus circuitry and memory. The system is configured to provide an output responsive to physical displacement within the mems sensor to the measurement circuitry.
Freescale Semiconductor, Inc.


06/16/16
20160167958 
 Through-wafer interconnects for mems double-sided fabrication process (twids) patent thumbnailThrough-wafer interconnects for mems double-sided fabrication process (twids)
A high-aspect ratio low resistance through-wafer interconnect for double-sided (twids) fabrication of microelectromechanical systems (mems) serves as an interconnection method and structure for co-integration of mems and integrated circuits or other microcomponent utilizing both sides of the wafer. Twids applied to a three dimensional folded timu (timing inertial measurement unit) provides a path for electrical signals from sensors on the front side of the soi wafer to electronic components on the back side of the wafer, while enabling folding of an array of sensors in a three dimensional shape..
The Regents Of The University Of California


06/16/16
20160167956 

Integrated cmos back cavity acoustic transducer and the producing the same


A mems device includes a mems substrate with a movable element. Further included is a cmos substrate with a cavity, the mems substrate disposed on top of the cmos substrate.
Invensense, Inc.


06/16/16
20160167954 

Monolithically integrated multi-sensor device on a semiconductor substrate and method therefor


A monolithically integrated multi-sensor (mims) is disclosed. A mims integrated circuit comprises a plurality of sensors.
Versana Micro Inc.


06/16/16
20160167953 

Monolithically integrated multi-sensor device on a semiconductor substrate and method therefor


A monolithically integrated multi-sensor (mims) is disclosed. A mims integrated circuit comprises a plurality of sensors.
Versana Micro Inc.


06/16/16
20160167952 

Microelectronic packages having hermetic cavities and methods for the production thereof


Microelectronic packages having hermetic cavities are provided, as are methods for producing such packages. In one embodiment, the microelectronic package includes a sensor die having first and second microelectromechanical systems (mems) transducer structures formed thereon.

06/16/16
20160167950 

Encapsulated microelectromechanical structure


A semiconductor layer having an opening and a mems resonator formed in the opening is disposed between first and second substrates to encapsulate the mems resonator. An electrical contact that extends from the opening to an exterior of the mems device is formed at least in part within the semiconductor layer and at least in part within the first substrate..
Sitime Corporation


06/16/16
20160167949 

Method of lower profile mems package with stress isolations


mems packages, modules, and methods of fabrication are described. In an embodiment, a mems package includes a mems die and an ic die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the ic die and the mems die on the front side of the surface mount substrate.
Apple Inc.


06/16/16
20160167948 

Vent attachment system for micro-electromechanical systems


A method of installing a vent to protect an open port of a micro-electrical mechanical system (mems) device, the vent being of the type comprising an environmental barrier membrane attached to a carrier and the vent further being attached to a liner, the method comprising the steps of: (a) feeding the vent to a die attach machine with die ejectors and at least one of a vacuum head and a gripper head; (b) detaching the vent from said liner using the die ejectors; (c) picking up the vent with at least one of the vacuum head and the gripper head of the die attach machine; (d) disposing the vent over the open port of the mems device; and (e) securing the vent over the open port of the mems device.. .
W. L. Gore & Associates, Inc.


06/16/16
20160167946 

Mems device and process


The application describes improvements to (mems) transducers (100) having a flexible membrane (301) with a membrane electrode (302), especially where the membrane is crystalline or polycrystalline and the membrane electrode is metal or a metal alloy. Such transducers may typically include a back-plate having at least one back-plate layer (304) coupled to a back-plate electrode (303), with a plurality of holes (314) in the back-plate electrode corresponding to a plurality back-plate holes (312) through the back-plate.
Cirrus Logic International Semiconductor Ltd.


06/16/16
20160167945 

Microelectromechanical systems (mems) stopper structure for stiction improvement


A microelectromechanical systems (mems) structure having a stopper integrated with a mems substrate is provided. A first substrate has a dielectric layer arranged over the first substrate.
Taiwan Semiconductor Manufacturing Co., Ltd.


06/16/16
20160167944 

Reducing mems stiction by deposition of nanoclusters


A mechanism for reducing stiction in a mems device by decreasing surface area between two surfaces that can come into close contact is provided. Reduction in contact surface area is achieved by increasing surface roughness of one or both of the surfaces.
Freescale Semiconductor, Inc.


06/09/16
20160165358 

Mems microphone package


An mems microphone package includes a substrate, an mems microphone, an ic chip and an electrically conductive cover. The substrate includes a first hole, an upper surface, a bottom surface, a side surface, a first electrically conductive layer and a second electrically conductive layer.
Industrial Technology Research Institute


06/09/16
20160165357 

Dual-element mems microphone for mechanical vibration noise cancellation


Disclosed are systems, devices, and methods for minimizing mechanical-vibration-induced noise in audio signals. In one aspect, a microphone is disclosed that includes a first backplate, a first diaphragm, a second backplate, and a second diaphragm.
Google Inc.


06/09/16
20160165355 

Microelectromechanical systems electret microphone


Microelectromechanical systems (mems) electret acoustic sensors or microphones, devices, systems, and methods are described. Exemplary embodiments employ electret comprising an inorganic dielectric material such as silicon nitride in mems electret acoustic sensors or microphones.
Invensense, Inc.


06/09/16
20160165331 

Systems and apparatus having top port integrated back cavity micro electro-mechanical system microphones and methods of fabrication of the same


A micro electro-mechanical system (mems) device is provided. The mems device includes: a first substrate having a first surface and a second surface, and a port disposed through the first substrate, wherein the port is configured to receive acoustic waves and wherein the first surface is exposed to an environment outside the mems device; and a diaphragm coupled to and facing the second surface and configured to deflect in response to pressure differential at the diaphragm in response to the received acoustic waves.
Invensense, Inc.


06/09/16
20160164161 

Multichannel relay assembly with in line mems switches


An ohmic rf mems relay includes a substrate with a capacitive coupling, csub; two actuating elements electrically coupled in series, so as to define a channel, wherein the actuating elements are configured to be independently actuated or simultaneously operated. The actuating elements have their own capacitive coupling, cgap; a midpoint on the channel is in electrical communication with the actuating elements; and an anchor mechanically coupled to the substrate and supporting at least one of the actuating elements.
General Electric Company


06/09/16
20160163942 

Mems-based wafer level packaging for thermo-electric ir detectors


A device and techniques for fabricating the device are described for forming a wafer-level thermal sensor package using microelectromechanical system (mems) processes. In one or more implementations, a wafer level thermal sensor package includes a thermopile stack, which includes a substrate, a dielectric membrane, a first thermoelectric layer, a first interlayer dielectric, a second thermoelectric layer, a second interlayer dielectric, a metal connection assembly, a passivation layer, where the passivation layer includes at least one of a trench or a hole, and where the substrate includes a cavity adjacent to the at least one trench or hole, and a bond pad disposed on the passivation layer and electrically coupled to the metal connection assembly; and a cap wafer assembly coupled to the thermopile stack, the cap wafer assembly including a wafer having a cavity formed on a side of the wafer configured to be adjacent to the thermopile stack..
Maxim Integrated Products, Inc.


06/09/16
20160161572 

Mems magnetic field sensor


The disclosure provides a magnetic field sensor for sensing the magnetic field caused by a current to be measured, which includes: substrate; a first drive electrode with a path for flowing a reference current supplied from the substrate arranged so as to be moveable by the magnetic field of the current to be measured; and a second drive electrode with a path for flowing a reference current supplied from the substrate arranged so as to be moveable by the magnetic field of the current to be measured, thus measuring the variation of a capacitance caused by the movement of the first drive electrode and the second drive electrode. Hence, the sensing is achieved by the two drive electrodes with no reference electrode, thus maximizing the mechanical displacement to improve the sensing capability..
Lg Innotek Co., Ltd.


06/09/16
20160159644 

Mems integrated pressure sensor devices and methods of forming same


A method embodiment includes providing a micro-electromechanical (mems) wafer including a polysilicon layer having a first and a second portion. A carrier wafer is bonded to a first surface of the mems wafer.
Taiwan Semiconductor Manufacturing Company, Ltd.


06/09/16
20160159643 

Mems integrated pressure sensor devices having isotropic cavitites and methods of forming same


A method embodiment includes providing a mems wafer comprising an oxide layer, a mems substrate, a polysilicon layer. A carrier wafer comprising a first cavity formed using isotropic etching is bonded to the mems, wherein the first cavity is aligned with an exposed first portion of the polysilicon layer.
Taiwan Semiconductor Manufacturing Company, Ltd.


06/09/16
20160159642 

Stress isolated mems device with asic as cap


A package includes a mems die and an integrated circuit (ic) die coupled to and stacked with the mems die. The mems die includes a substrate having a recess formed therein.
Freescale Semiconductor, Inc.


06/09/16
20160159641 

Environment-resistant module, micropackage and methods of manufacturing same


An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or mems device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation.
The Regents Of The University Of Michigan


06/09/16
20160159640 

Mems cavity substrate


In accordance with an example embodiment of this disclosure, a micro-electromechanical system (mems) device comprises a substrate, a cmos die, and a mems die, each of which comprises a top side and a bottom side. The bottom side of the cmos die is coupled to the top side of the substrate, and the mems die is coupled to the top side of the cmos die, and there is a cavity positioned between the cmos die and the substrate.
Invensense, Inc.


06/09/16
20160159638 

Microelectromechanical systems devices with improved reliability


An electronic device may include components that are formed using microelectromechanical systems (mems) technology. A mems device may include a mems structure bonded to a semiconductor substrate.
Apple Inc.


06/09/16
20160158059 

Mems device and delivery of therapeutic agents


Embodiments of an implantable device for delivering a therapeutic agent to a patient include a reservoir configured to contain a liquid comprising the therapeutic agent, and a cannula in fluid communication with the reservoir. The cannula is shaped to facilitate insertion thereof into a patient's eyeball..

06/02/16
20160157025 

Hinged mems diaphragm and manufacture thereof


A micromechanical structure, comprising a substrate having a through hole; a residual portion of a sacrificial oxide layer peripheral to the hole; and a polysilicon layer overlying the hole, patterned to have a planar portion; a supporting portion connecting the planar portion to polysilicon on the residual portion; polysilicon stiffeners formed extending beneath the planar portion overlying the hole; and polysilicon ribs surrounding the supporting portion, attached near a periphery of the planar portion. The polysilicon ribs extend to a depth beyond the stiffeners, and extend laterally beyond an edge of the planar portion.
The Research Foundation For The State University Of New York


06/02/16
20160157024 

Flip-chip mems microphone


A flip-chip mems microphone includes a substrate having a conduction line, a metal shell capped on the substrate to define therein a first cavity and having a sound receiving hole aimed at a sensor chip that is accommodated in the metal shell and electrically connected to a processor chip in the metal shell, and a plastic part mounted at one lateral side inside the metal shell and having built therein exposed ports that are electrically connected with the conduction line and the processor chip. Thus, the flip-chip mems microphone provides a flip-chip package structure to increase the cavity volume, improving the signal-to-noise ratio (snr)..
Lingsen Precision Industries, Ltd.


06/02/16
20160157017 

Signal processing for mems capacitive transducers


This application relates to circuitry for processing sense signals generated by mems capacitive transducers for compensating for distortion in such sense signals. The circuitry has a signal path between an input (204) for receiving the sense signal and an output (205) for outputting an output signal based on said sense signal.
Cirrus Logic International Semiconductor Limited


06/02/16
20160157011 

Microphone device and control method thereof


A microphone device includes a case having a sound hole and a phase delay membrane. A plurality of non-directional microphones disposed in the case.
Hyundai Motor Company


06/02/16
20160155722 

Vertical system integration


The vertical system integration (vsi) invention herein is a method for integration of disparate electronic, optical and mems technologies into a single integrated circuit die or component and wherein the individual device layers used in the vsi fabrication processes are preferably previously fabricated components intended for generic multiple application use and not necessarily limited in its use to a specific application. The vsi method of integration lowers the cost difference between lower volume custom electronic products and high volume generic use electronic products by eliminating or reducing circuit design, layout, tooling and fabrication costs..

06/02/16
20160155595 

Micromechanical resonant switches and charge pumps


A circuit of n micromechanical resonant switches (resoswitches) is presented, which mimics a dickson charge pump to amplify an input voltage to an output voltage of n plus 1 times the input voltage, while avoiding the diode voltage drop and breakdown voltage limitations of cmos-based conventional charge pumps. Important aspects of successful charge pumping are: 1) the long cycle lifetime of resonant micromechanical switches, which has been shown to operate 173.9×1012 cycles, is orders of magnitude higher than non-resonant switches; 2) the use of gated-sinusoid drive excitation to allow a charging period independent of resoswitch resonance frequency; and 3) the use of resonance operation to lower required drive and dc-bias voltages to below the supply voltage.
The Regents Of The University Of California


06/02/16
20160154234 

Enhanced closed loop, optical feedback synchronization system for imaging applications


A closed loop, optical feedback synchronization system provides real time feedback and control of a light emitting fiber when scanning or displaying an image. The light emitting fiber is driven by a mems-based actuator in an angular pattern to scan the image.

06/02/16
20160154183 

Mems optical switch


Methods, systems, and apparatus, including computer programs encoded on computer storage media, for optical switching. One of the optical switches includes a plurality of optical fibers positioned in an array, the plurality of fibers including one or more input fibers and a plurality of output fibers; a microelectromechanical (mems) mirror configured to controllably reflect light from an input fiber to a particular target output fiber of the plurality of output fibers, wherein a position of the mems mirror is controllable to switch from a first target output fiber to a second target output fiber of the plurality of output fibers according to a switch trajectory that does not traverse over any other fiber of the plurality of fibers..
Oplink Communications, Inc.


06/02/16
20160154070 

Wafer bonding use in making a mems gyroscope


A mems gyroscope is disclosed herein, wherein the mems gyroscope comprised a magnetic sensing mechanism on a magnetic sensor wafer and a magnetic source on a mems wafer that further comprises a proof-mass. The magnetic sensor wafer and mems wafer are bonded through a bonding mechanism that comprises a hearting mechanism..
Insightech, Llc


06/02/16
20160154020 

Mems gyroscope


A mems gyroscope is disclosed herein, wherein the mems gyroscope comprised a magnetic sensing mechanism and a magnetic source that is formed at the proof-mass, wherein the magnetic sensing mechanism comprises an integrated pickup coil of a fluxgate. A magnetic shield is provided in the vicinity of the magnetic source..
Insightech, Llc


06/02/16
20160154019 

Mems gyroscope


A mems gyroscope is disclosed herein, wherein the mems gyroscope comprises a movable portion capable of moving in response to angular velocity, a conducting wire attached to the movable portion for generating magnetic field, and a spintronic device for measuring the magnetic field. The conducting wire is disposed such that the current it carries is substantially perpendicular to the sensing direction of the sensing mode of the proof-mass..
Insightech, Llc


06/02/16
20160153858 

Case isolated oil filled mems pressure sensor


An oil filled pressure sensor is provided. The sensor includes a drift-stabilized pressure sensing element mounted to and electrically isolated from a header body, the pressure sensing element immersed in an oil filled cavity and temperature stabilized for sensing pressure in the cavity without substantial signal drift.

06/02/16
20160153780 

Mems gyroscope


A mems gyroscope is disclosed herein, wherein the mems gyroscope comprises a movable portion capable of moving in response to angular velocity, a conducting wire attached to the movable portion for generating magnetic field, and a spintronic device for measuring the magnetic field. The easy axis of the spintronic device is aligned to the sensing mode of the movable portion and to the direction of the current flowing through the conducting wire..
Insightech, Llc


06/02/16
20160153779 

Dual use of a ring structure as gyroscope and accelerometer


Methods and apparatus for sensing linear acceleration with a mems resonator mass, alone, or concurrently with sensing rate of rotation. A resonator mass, which may be a disk or a ring structure, is driven at a resonance frequency of one of the vibration modes of the resonator mass.
Analog Devices, Inc.


06/02/16
20160153444 

Mems fluid pump with integrated pressure sensor for dysfunction detection


The invention concerns a pumping device that includes a pump having a pumping chamber with a variable volume, an inlet that communicates with the pumping chamber and a valve, an outlet that communicates with the pumping chamber and a valve, and an actuator adapted to change the volume of the pumping chamber. A fluidic pathway in the pumping device includes the inlet, the pumping chamber, the outlet, and a downstream line situated downstream of the outlet valve.
Debiotech S.a.


06/02/16
20160152467 

Mems capping method


A method for fabricating a mems device includes providing a substrate having a front surface and a back surface, and forming a protruding engagement member on the front surface of the substrate. The protruding engagement member has an inner periphery defining a groove and an outer periphery.
Semiconductor Manufacturing International (shanghai) Corporation


06/02/16
20160152466 

Micromechanical sensor device and corresponding manufacturing method


A micromechanical sensor device includes: an asic substrate having a first front side and a first rear side; a rewiring element formed on the first front side and including multiple stacked conductor levels and insulating layers; a mems substrate having a second front side and a second rear side; a first micromechanical functional layer formed on top of the second front side; and a second micromechanical functional layer formed on top of the first micromechanical functional layer and connected to the rewiring element. In the second micromechanical functional layer, a movable sensor structure is anchored on one side via a first anchoring area, and an electrical connecting element formed in a second anchoring area is anchored on one side on the asic, and the first and second anchoring areas are elastically connected to one another via a spring element..
Robert Bosch Gmbh


06/02/16
20160152465 

Mems capacitive pressure sensors


A mems capacitive pressure sensor is provided. The mems capacitive pressure sensor includes a substrate having a first region and a second region, and a first dielectric layer formed on the substrate.
Semiconductor Manufacturing International (shanghai) Corporation


06/02/16
20160152464 

Mems parameter identification using modulated waveforms


A sensor system includes a microelectromechanical systems (mems) sensor, control circuit, signal evaluation circuitry, a digital to analog converter, signal filters, an amplifier, demodulation circuitry and memory. The system is configured to generate high and low-frequency signals, combine them, and provide the combined input signal to a mems sensor.
Freescale Semiconductor, Inc.


06/02/16
20160152202 

Mems sensor and a semiconductor package


The mems sensor of the invention has movable and fixed components for measuring acceleration in a rotational mode in a direction in-plane perpendicular to spring axis. The components include an element frame, a substrate, a proof-mass a spring connected to the proof-mass and to the substrate, and comb electrodes.
Murata Manufacturing Co., Ltd.


05/26/16
20160150327 

Photosensitive microphone


A microphone includes a base; a micro electro mechanical system (mems) device disposed on the base, the mems device configured to convert sound into a first electrical signal; an integrated circuit disposed on the base and coupled to the mems device; a photo diode disposed on the base, the photo diode configured to convert light into a second electrical signal. At least one of the first electrical signal and the second electrical signal is processed by the integrated circuit..
Knowles Electronics, Llc


05/26/16
20160150325 

Microelectromechanical systems (mems) microphone array with dedicated amplifiers


Microelectromechanical systems (mems) acoustic sensors with dedicated preamplifiers are described. Provided implementations can comprise an array of mems acoustic sensor elements each having a dedicated preamplifier.
Invensense, Inc.


05/26/16
20160150203 

A for projecting an image with improved safety


A method of projecting an image with improved safety, using a projection device which comprises a mems mirror which oscillates about one or more oscillation axes to scan light from one or more lasers, across a display screen, to project pixels which define an image onto a display screen, the method comprising the steps of, (a) selecting a laser class for the projection device; (b) calculating relationship between maximum accessible emission limit and distance, for the selected laser class, for a predetermined number of black pixels in an image; (c) repeating step (b) a plurality of times, each for a different predetermined number of black pixels in the image, so as to provide a plurality of relationships between maximum accessible emission limit and distance, for the selected laser class, wherein each relationship is for different predetermined number of black pixels in the image; (d) determining the distance between a display screen and the projection device; (e) selecting a desired maximum accessible emission limit for an image which is to be projected by the projection device onto said display screen; (f) selecting a relationship, from the plurality of relationships between maximum accessible emission limit and distance, which contains a maximum accessible emission limit which is equal to the desired maximum accessible emission limit selected in step (e), at the distance determined in step (d) and; (g) identifying the predetermined number of black pixels in the image for that selected relationship; (h) modifying a pixel stream which defines said image which is to be projected by the projection device, so that the pixel stream is provided with said predetermined number of black pixels identified in step (g). There is further provided a corresponding projection device..
Intel Corporation


05/26/16
20160146850 

Micromechanical sensor device and corresponding manufacturing method


A micromechanical sensor device, and a corresponding method, including an asic substrate having first front and rear sides, a first rewiring element on the first front side; a mems substrate having a second front side, and a second rear side having a base substrate and a second rewiring element formed thereon; a micromechanical functional layer having at least one movable sensor structure, and which is on the second front side of the second rewiring element; a capping element having third front and rear sides, the third rear side being applied to the second front side for capping the sensor structure; and a recess formed in the base substrate on the second rear side, or in the capping element on the third front side, and within which the asic substrate is suspended on a flexible layered first suspension element via the first rewiring element, forming a cavity surrounding the asic chip.. .
Robert Bosch Gmbh


05/26/16
20160146692 

Package for semiconductor devices sensitive to mechanical and thermo-mechanical stresses, such as mems pressure sensors


A surface mounting device has one body of semiconductor material such as an asic, and a package surrounding the body. The package has a base region carrying the body, a cap and contact terminals.
Stmicroelectronics, Inc.


05/26/16
20160146685 

Piezoresistive pressure sensor device


The voltages output from a low-pressure mems sensor are increased by increasing the sensitivity of the sensor. Sensitivity is increased by thinning the diaphragm of the low pressure sensor device.
Continental Automotive Systems, Inc.


05/26/16
20160146607 

Dynamically monitoring the instantaneous zero rotation rate voltage of interferometric fiber optic gyroscope (ifog)


The drift (°/h) for an interferometric fiber optic gyroscope (ifog) means the variations on the voltage generated versus the zero angular (rotation) rate, whilst ifog is not under influence of any angular rate effect. If the drift of an ifog is predefined, the compensation of the drift can trivially be carried out by a subtraction process.
Tubitak (turkiye Bilimsel Ve Teknolojik Arastirma Kurumu)


05/26/16
20160146606 

Mems balanced inertial angular sensor and balancing such a sensor


The invention relates to a vibrating mems inertial angular sensor including a substrate for supporting at least two mass bodies mounted to bear mobile relative to the substrate and associated with at least one electrostatic actuator and at least one electrostatic detector. The sensor includes first means for suspending the mass bodies relative to the substrate and means for coupling the mass bodies together.
Sagem Defense Securite


05/26/16
20160145097 

Mems switches with reduced switching voltage and methods of manufacture


mems switches and methods of manufacturing mems switches is provided. The mems switch having at least two cantilevered electrodes having ends which overlap and which are structured and operable to contact one another upon an application of a voltage by at least one fixed electrode..
International Business Machines Corporation


05/26/16
20160145095 

Isolation structure for mems 3d ic integration


A three-dimensional (3d) integrated circuit (ic) includes a first ic and a second ic. The first ic includes a mems device and a first bonding structure.
Taiwan Semiconductor Manufacturing Co., Ltd.


05/26/16
20160145094 

Micro-elelctro-mechanical system device and fabricating the same


A method for fabricating a micro-electro-mechanical system (mems) device includes following steps. A cap layer is formed on an mems structure.
Upi Semiconductor Corp.


05/26/16
20160143577 

System and sensorized user interface


A system and method for is provided for operation of an orthopedic system. The system includes a load sensor for converting an applied pressure associated with a force load on an anatomical joint, and an inertial sensing device configured to measure alignment.
Orthosensor Inc


05/19/16
20160142829 

Integrated package forming wide sense gap micro electro-mechanical system microphone and methodologies for fabricating the same


A micro electro-mechanical system (mems) microphone is provided. The microphone includes: a package substrate having a port disposed through the package substrate, wherein the port is configured to receive acoustic waves; and a lid coupled to the substrate and forming a package.
Invensense, Inc.


05/19/16
20160142687 

Mems oscillator


A device comprising, a mirror which is configured to oscillate in response to an oscillation signal, wherein the device is configured such that oscillation of the mirror will induce a signal; and a circuit in operable cooperation with the mirror such that an induced signal can be measured by the circuit and wherein the circuit is configured to provide an oscillation signal proportional to the measured induced signal; wherein the device is configured such that the mirror can receive the oscillation signal so that the oscillation signal is filtered due to oscillation limitations of mirror, to provide a filtered signal.. .
Intel Corporation


05/19/16
20160141133 

Capacitive microelectromechanical switches with dynamic soft-landing


A microelectromechanical system (mems)-based electrical switch. The electrical switch includes a moveable electrode, a dielectric layer positioned adjacent the moveable electrode on a first side of the dielectric layer and spaced apart from the moveable electrode when the moveable electrode is in an inactivated position and in contact with the moveable electrode when the moveable electrode is in an activated position, and a substrate attached to the dielectric layer on a second side opposite to the first side, the moveable electrode is configured to brake prior to coming in contact with the dielectric layer when the moveable electrode is switched between the inactivated state and the activated state..
Purdue Research Foundation


05/19/16
20160140685 

Display including sensors


This disclosure provides devices, systems and methods for providing mems display elements in a display region and mems sensors in a shelf region. In one aspect, a display device includes a first substrate with a display region and a shelf region extending from the display region, and a second substrate over the display region and a portion of the shelf region.
Pixtronix, Inc.


05/19/16
20160139340 

Mems fiber optical switch


Methods, systems, and apparatus, including computer programs encoded on computer storage media, for optical switching. One of the optical switches includes a plurality of optical fibers positioned in an array, the plurality of fibers including one or more input fibers and a plurality of output fibers; a microelectromechanical (mems) mirror configured to controllably reflect light from an input fiber to a particular target output fiber of the plurality of output fibers, wherein a position of the mems mirror is controllable to switch from a first target output fiber to a second target output fiber of the plurality of output fibers, and wherein the position of the mems mirror is controlled using a vertically staggered comb drive..
Oplink Communications, Inc.


05/19/16
20160139278 

Device for reading radiological images


A radiological image reading device includes a mems mirror that scan a recording medium on which a radiological image is recorded with excitation light; a light detecting element that includes a plurality of channels, each channel including a photodiode array, and detects light emitted from an irradiation position of the excitation light on the recording medium; a mems mirror driving circuit that determines as a light detection channel to detect the light, a channel corresponding to the irradiation position of the excitation light, out of the plurality of channels; and a reading circuit that reads the detection result of the light from the channel determined by the mems mirror driving circuit.. .
Hamamatsu Photonics K.k.


05/19/16
20160139173 

Combined magnetometer accelerometer mems devices and methods


Considerations for selecting capacitive sensors include accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, integration options with other sensors and/or electronics, and cost effectiveness. It is beneficial if such sensors are amenable to above-ic integration with associated control/readout circuitry for reduced parasitics and reduced footprint through area sharing.

05/19/16
20160138580 

Mems-based active cooling system


In various embodiments, a cooling device for dissipating heat generated in an electronic or electrochemical device includes a substrate, multiple benders arranged on the substrate, and supply circuitry for supplying an electric field to actuate the benders for causing movement thereof, thereby producing an air flow.. .

05/19/16
20160137493 

Mems device having a getter


A microelectromechanical system (mems) device includes a high density getter. The high density getter includes a silicon surface area formed by porosification or by the formation of trenches within a sealed cavity of the device.
Robert Bosch Gmbh


05/19/16
20160137492 

Mems and cmos integration with low-temperature bonding


The present disclosure relates to method of forming a mems device that mitigates the above mentioned difficulties. In some embodiments, the present disclosure relates to a method of forming a mems device, which forms one or more cavities within a first side of a carrier substrate.
Taiwan Semiconductor Manufacturing Co., Ltd.


05/19/16
20160137490 

Cavity package design


A semiconductor device. The device including a substrate having electrical traces, at least one of a mems die and a semiconductor chip mounted on the substrate, and a spacer.
Robert Bosch Gmbh


05/19/16
20160137489 

Microelectromechanical systems device


A microelectromechanical systems (mems) device includes: a circuit board; a lower cap disposed on the circuit board; a case disposed on the lower cap and having an internal space; a rotating part rotatably mounted in the case; an upper cap disposed on the case and including a reinforcing part disposed above a axis of the rotating part; and a molding layer encasing the lower cap, the case, and the upper cap.. .
Samsung Electro-mechanics Co., Ltd.


05/19/16
20160137488 

Method and apparatus of making mems packages


mems packages and modules are described. In an embodiment, a module includes a package mounted within an opening in a module board.
Apple Inc.


05/19/16
20160137486 

Mems microphone with tensioned membrane


A micro electro-mechanical system (mems) microphone is provided. The mems microphone is configured to operate at a predetermined range of frequencies.
Invensense, Inc.


05/12/16
20160134975 

Microphone with trimming


A microphone includes a microelectromechanical system (mems) device, an amplifier, and an attenuation apparatus. The mems device converts acoustic energy into electrical signals.
Knowles Electronics, Llc


05/12/16
20160134974 

Lead frame-based chip carrier used in the fabrication of mems transducer packages


Systems and methods for lead frame-based chip carriers for use with mems transducers. One embodiment provides a method for manufacturing a mems microphone package.
Robert Bosch Gmbh


05/12/16
20160134973 

Secure audio sensor


Providing security features in an audio sensor is presented herein. A micro-electro-mechanical system (mems) microphone can include an acoustic membrane that converts an acoustic signal into an electrical signal; an electronic amplifier that increases an amplitude of the electrical signal to generate an amplified signal; and switch(es) configured to prevent propagation of a direct current (dc) voltage source to the mems microphone; prevent propagation of the dc voltage source to the electronic amplifier; prevent propagation of the electrical signal to the electronic amplifier; and/or prevent propagation of the amplified signal to an external device..
Invensense, Inc.


05/12/16
20160134237 

Low power oscillator system


In a first aspect, an oscillator is disclosed. The oscillator comprises a digital circuit; and at least one microelectromechanical system (mems) resonator.
Invensense, Inc.


05/12/16
20160134016 

Antenna efficiency enhancement by active detuning of diversity antenna


The present invention generally relates to cellular phones having multiple antennas. The invention relates to how two antennas in a diversity or mimo antenna system interact through mutual coupling.
Cavendish Kinetics, Inc.




Mems topics: Camera Module, Acceleration Sensor, Microelectromechanical Systems, Control Unit, Semiconductor Substrate, Semiconductor, Demodulation, Accelerometer, Calibration, Modulation, Mems Devices

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