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This page is updated frequently with new Mems-related patent applications.




Date/App# patent app List of recent Mems-related patents
07/21/16
20160212834 
 Cyclic accelerator for accelerating charge carriers and  manufacturing a cyclic accelerator patent thumbnailCyclic accelerator for accelerating charge carriers and manufacturing a cyclic accelerator
What is shown is a cyclic accelerator for accelerating charge carriers. The cyclic accelerator includes a charge carrier source configured to generate free charge carriers, a vacuum chamber configured to receive the free charge carriers, wherein the vacuum chamber is produced by means of mems technology, and wherein at least a main surface region of the vacuum chamber has a semiconductor material.
Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.


07/21/16
20160212549 
 Mems microphone device patent thumbnailMems microphone device
A micro-electro-mechanical system (mems) microphone device is provided in the present disclosure. The mems microphone device includes a first electromagnetic shielding cover defining a first accommodating space; a second electromagnetic shielding cover received in the first accommodating space and defining a second accommodating space; a mems chip and an application specific integrated circuit (asic) chip received in the second accommodating space.
Aac Acoustic Technologies (shenzhen) Co.,ltd.


07/21/16
20160212548 
 Metalized microphone lid with integratd wire bonding shelf patent thumbnailMetalized microphone lid with integratd wire bonding shelf
A mems microphone package and a method of manufacturing a mems microphone package having a lid and a substrate cap. The lid includes a wire bonding shelf that provides a surface internal to the mems microphone for connection points for internal wire bonds.
Robert Bosch Gmbh


07/21/16
20160212542 
 Anti-impact silicon based mems microphone, a system and a package with the same patent thumbnailAnti-impact silicon based mems microphone, a system and a package with the same
The present invention relates to an anti-impact silicon based mems microphone, a system and a package with the same, the microphone comprises: a silicon substrate provided with a back hole therein; a compliant diaphragm supported on the silicon substrate and disposed above the back hole thereof; a perforated backplate disposed above the diaphragm with an air gap sandwiched in between, and further provided with one or more first thorough holes therein; and a stopper mechanism, including one or more t-shaped stoppers corresponding to the one or more first thorough holes, each of which has a lower part passing through its corresponding first thorough hole and connecting to the diaphragm and an upper part being apart from the perforated backplate and free to vertically move, wherein the diaphragm and the perforated backplate are used to form electrode plates of a variable condenser.. .
Goertek Inc.


07/21/16
20160212517 
 Mems microphone device patent thumbnailMems microphone device
A micro-electro-mechanical system (mems) microphone device is provided in the present disclosure. The mems microphone device includes a circuit board, an electromagnetic shielding cover mounted on the circuit board to define an accommodating space, electronic components received in the accommodating space and electrically connected to the circuit board, and a metal shielding member disposed between the electronic components and the electromagnetic shielding cover.
Aac Acoustic Technologies (shenzhen) Co. Ltd.


07/21/16
20160212394 
 Image projection apparatus patent thumbnailImage projection apparatus
An image projection apparatus (1) joins a plurality of display images displayed by scanning a plurality of light beams, as if there is no seam between them, thereby displaying a large-sized high-quality image. The image projection apparatus (1) includes a mems mirror device (11), a mems mirror control unit (13), and a laser beam detector (19).
Mitsubishi Electric Corporation


07/21/16
20160211826 
 Passive wireless sensor including piezoelectric mems resonator patent thumbnailPassive wireless sensor including piezoelectric mems resonator
A passive wireless sensor includes a substrate having at least one microelectromechanical system (mems) piezoelectric resonator thereon. The mems piezoelectric resonator includes a piezoelectric layer between a top metal or semiconductor layer (top electrode layer) and a bottom metal or semiconductor layer (bottom electrode layer).
University Of Central Florida Research Foundation, Inc.


07/21/16
20160211803 
 Mems amplitude modulator and mems magnetic field sensor including same patent thumbnailMems amplitude modulator and mems magnetic field sensor including same
The present invention provides an amplitude modulator, which is disposed in an area through which a magnetic field flows so as to modulate amplitudes, comprising: a substrate; a first driving electrode which receives a first frequency signal and a second frequency signal supplied from the substrate and carries out resonant motion by the magnetic field; and a second driving electrode for receiving the second frequency signal and carries out resonant motion by the first driving electrode and the magnetic field, wherein a modulated signal is generated by modulating the amplitudes of the first and second frequency signals through the resonant motions of the first and second driving electrodes. Therefore, since the signal generated by modulating a carrier signal through mechanical resonance according to the magnetic field is outputted, amplitude modulation can be carried out without a complicated circuit configuration.
Lg Innotek Co., Ltd.


07/21/16
20160211779 
 Three dimensional (3d) robotic micro electro mechanical systems (mems) arm and system patent thumbnailThree dimensional (3d) robotic micro electro mechanical systems (mems) arm and system
A micro assembly having a substrate and an operating plane coupled to the substrate. The operating plane is movable from an in-plane position to an out-of-plane position.

07/21/16
20160211475 
 Micro electro mechanical system (mems) based wide-band polymer photo-detector patent thumbnailMicro electro mechanical system (mems) based wide-band polymer photo-detector
A polymer based photo-detector has photoresponsivity in ultraviolet, visible, near and mid infrared regions. The photo-detector comprises a single layer of polyvinyl alcohol (pva) as a photoactive layer; with no additional buffer layer for accepting ultraviolet, visible and infrared radiation as well as no buffer layer to block charge carrier injection.
Indian Institute Of Technology Bombay


07/21/16
20160207763 

Method of forming planar sacrificial material in a mems device


The present invention generally relates to a method of fabricating a mems device. In the mems device, a movable plate is disposed within a cavity such that the movable plate is movable within the cavity.
Cavendish Kinetics, Inc.


07/21/16
20160207758 

Thin capping for mems devices


A device includes a base substrate (700) with a micro component (702) attached thereto. Suitably it is provided with routing elements (704) for conducting signals to and from the component (702).
Silex Microsystems Ab


07/21/16
20160207757 

Mems device and corresponding micromechanical structure with integrated compensation of thermo-mechanical stress


A micromechanical structure of a mems device, integrated in a die of semiconductor material provided with a substrate and having at least a first axis of symmetry lying in a horizontal plane, has a stator structure, which is fixed with respect to the substrate, and a rotor structure, having a suspended mass, mobile with respect to the substrate and to the stator structure as a result of an external action, the stator structure having fixed sensing electrodes capacitively coupled to the rotor structure; a compensation structure is integrated in the die for compensation of thermo-mechanical strains. The compensation structure has stator compensation electrodes, which are fixed with respect to the substrate, are capacitively coupled to the rotor structure, and are arranged symmetrically to the fixed sensing electrodes with respect to the first axis of symmetry..
Stmicroelectronics S.r.l.


07/21/16
20160207756 

Substrate structure, semiconductor structure and fabricating the same


A substrate structure for a micro electro mechanical system (mems) device, a semiconductor structure and a method for fabricating the same are provided. In various embodiments, the substrate structure for the mems device includes a substrate, the mems device, and an anti-stiction layer.
Taiwan Semiconductor Manufacturing Co., Ltd.


07/14/16
20160205463 

Top port microphone apparatus


A microphone includes a microphone base that has a first surface and a second surface. The microphone also includes a microelectromechanical system (mems) device coupled to the first surface of the microphone base.
Knowles Electronics, Llc


07/14/16
20160203775 

Method and system for writing data to mems display elements


Charge balanced display data writing methods use write and hold cycles of opposite polarity during selected frame update periods. The transitions between voltages of opposite polarity are sufficiently brief that the display elements do not change state.
Qualcomm Mems Technologies, Inc.


07/14/16
20160202478 

An image projector and optical assembly


An image projector is disclosed that can include a light source and a mems mirror to receive a light beam emitted by the light source and oscillate to scan the light beam across multiple-beam-generators that each include a planar beam splitter arranged to receive the light beam and generate multiple beams to project an image.. .
Intel Corporation


07/14/16
20160202470 

Systems and methods for mems light modulator arrays with reduced acoustic emission


Systems and methods for a display having an array of pixels, a substrate, and a control matrix formed on the substrate are described. The array of pixels includes mechanical light modulators that can be referred to as micro-electro-mechanical or mems light modulators.
Pixtronix, Inc.


07/14/16
20160202469 

Shutter-based light modulators incorporating light spreading structures


This disclosure provides systems, methods and apparatus for a mems display apparatus incorporating light spreading elements. The display apparatus can include display elements formed over, and in electrical communication with a backplane.
Pixtronix, Inc.


07/14/16
20160202449 

Mems auto focus miniature camera module with fixed and movable lens groups


A mems auto focus miniature camera module includes an image sensor and an optical train including at least one movable lens and one or more fixed lenses or fixed lens groups on either side of the movable lens. The movable lens provides an auto focus feature of the camera module.
Digitaloptics Corporation


07/14/16
20160202366 

Force feedback electrodes in mems accelerometer


A microelectromechanical system (mems) accelerometer having separate sense and force-feedback electrodes is disclosed. The use of separate electrodes may in some embodiments increase the dynamic range of such devices.
Agency For Science Technology And Research (a*star)


07/14/16
20160202224 

Air sensor with air flow control


A system and method for providing and/or controlling air flow to an air sensor. As a non-limiting example, an air sensor system may include mechanical and/or electromechanical features (e.g., mems features) to control air flow to an air sensor.
Invensense, Inc.


07/14/16
20160200566 

Microelectromechanical system (mems) on application specific integrated circuit (asic)


In embodiments, a package assembly may include an application-specific integrated circuit (asic) and a microelectromechanical system (mems) having an active side and an inactive side. In embodiments, the mems may be coupled directly to the asic by way of one or more interconnects.
Intel Ip Corporation


07/14/16
20160200565 

Rf mems electrodes with limited grain growth


The present invention generally relates to an rf mems dvc and a method for manufacture thereof. To ensure that undesired grain growth does not occur and contribute to an uneven rf electrode, a multilayer stack comprising an alcu layer and a layer containing titanium may be used.
Cavendish Kinetics, Inc


07/07/16
20160198276 

Low-cost testing the signal-to-noise ratio of mems microphones


A method is provided for testing a mems microphone. The mems microphone includes a pressure sensor positioned within a housing and a pressure input port to direct acoustic pressure from outside the housing towards the pressure sensor.
Robert Bosch Gmbh


07/07/16
20160196940 

Mems-based switching system


A switching element that is at least partially implemented in one or more printed wiring boards (pwbs). A plurality of inputs and a plurality of outputs may be integrated into the pwb(s).
National Instruments Corporation


07/07/16
20160196923 

Electrostatic damping of mems devices


The present invention generally relates to a method and apparatus for damping a plate electrode or switching element in a mems dvc device. A resistor disposed between a waveform controller and the electrodes of the mems dvc causes the voltage to increase while capacitance decreases during the time that the plate electrode is moving.
Cavendish Kinetics, Inc


07/07/16
20160195713 

Mems micro-mirror device


A mems micro-mirror device includes, a single package; a first mirror and second mirror, wherein at least one of the mirrors is configured to oscillate along an oscillation axis; wherein both mirrors are located within the single package and are arranged such that as the at least one mirror oscillates, the light incident on the first micro-mirror can be deflected to the second mirror.. .
Intel Corporation


07/07/16
20160195712 

Light modulator for mems display


Electromechanical light modulators and backlight providing efficient, low cost and high performance displays.. .

07/07/16
20160195711 

Mems light modulator for display


Electromechanical light modulators and backlight providing efficient, low cost and high performance displays.. .

07/07/16
20160195710 

Mems display


Electromechanical light modulators and backlight providing efficient, low cost and high performance displays.. .

07/07/16
20160195670 

Mems display


Electromechanical light modulators and backlight providing efficient, low cost and high performance displays.. .

07/07/16
20160195509 

Mems implementation for detection of wear metals


This invention relates to analyzing elements, including metals in mechanical systems. The invention therefore allows for detecting wear elements, such as metals, for example, in lubricants to determine whether the mechanical system is deteriorating, or even approaching failure.
Mastinc.


07/07/16
20160195397 

Opto-mechanical inertial sensor


Embodiments of the present disclosure are directed towards a micro-electromechanical system (mems) sensing apparatus, including a laser arrangement configured to generate a light beam, a first waveguide configured to receive and output the light beam, and a second waveguide aligned endface to endface with the first waveguide. The second waveguide may be configured to receive at least a portion of the light beam from the first waveguide via optical coupling through the aligned endfaces.
Intel Corporation


07/07/16
20160194198 

Semiconductor structures and fabrication method thereof


A method for forming, a mems device is provided, the method includes providing a first wafer and a second wafer. The first wafer has a trench on a top surface of the first wafer and a fixed electrode on the bottom of the trench, and the second wafer has a polishing stop layer, a sacrificial layer, and a movable electrode.
Semiconductor Manufacturing International (shanghai) Corporation


07/07/16
20160194197 

Mems display manufacturing method


Electromechanical light modulators and backlight providing efficient, low cost and high performance displays.. .

06/30/16
20160192085 

Mems microphone package using lead frame


The present disclosure discloses an mems microphone package. The mems microphone package in accordance with the present disclosure comprises a lead frame; an integrated mems chip mounted on the lead frame, having a vibration unit comprising a diaphragm and a backplate spaced each other with an air gap between them and a signal processing unit for amplifying electric signals generated in the vibration unit formed on a single silicon substrate; and an electric connection means for connecting the lead frame to the integrated mems chip..

06/30/16
20160190958 

Mems driver


Systems and methods provide actuator control. Actuator control is provided via charge control as opposed to voltage control.

06/30/16
20160187643 

Micro-electromechanical system (mems) devices and methods for packaging the same


An assembly for a micro-electromechanical system (mems) device includes a sealed enclosure, a mems component disposed within the sealed enclosure, and a transformer arrangement. The transformer arrangement includes a first wire coil disposed outside the sealed enclosure, and a second wire coil disposed within the sealed enclosure and coupled to the mems component, the first and second wire coils being mutually inductively coupled to each other.

06/30/16
20160187372 

Accelerometer with little cross effect


A microelectromechanical system (mems) acceleration sensor includes a mass bar, a first spring disposed on a first set of opposite sides of the mass bar and configured to secure the mass bar in a first direction, an interdigital structure disposed along a second set of opposite sides of the mass bar in a second direction perpendicular to the first direction, a detection electrode corresponding to the interdigital structure, and a second spring disposed on the second set of opposite sides and configured to secure the mass bar in the second direction. The first spring has a frame shape, and the second spring has an s-shape.

06/30/16
20160187369 

Monolithic z-axis torsional cmos mems accelerometer


The present invention discloses a monolithic z-axis torsional cmos mems accelerometer, it includes a curl matching frame, two anchors, a first comb structure, a second comb structure and a proof mass. With the implementation of the present invention, the capacitance sensitivity of z+ direction and z− direction sensing signals by the accelerometer can be improved.

06/30/16
20160186358 

High-throughput batch porous silicon manufacturing equipment design and processing methods


This disclosure enables high-productivity fabrication of porous semiconductor layers (made of single layer or multi-layer porous semiconductors such as porous silicon, comprising single porosity or multi-porosity layers). Some applications include fabrication of mems separation and sacrificial layers for die detachment and mems device fabrication, membrane formation and shallow trench isolation (sti) porous silicon (using porous silicon formation with an optimal porosity and its subsequent oxidation).

06/30/16
20160185593 

Wafer level package for a mems sensor device and corresponding manufacturing process


A mems device having a wafer-level package, is provided with: a stack of a first die and a second die, defining at least a first internal surface internal to the package and carrying at least an electrical contact pad, and at least a first external surface external to the package and defining a first outer face of the package; and a mold compound, at least in part coating the stack of the first and second dies and having a front surface defining at least part of a second outer face of the package, opposite to the first outer face. The mems device is further provided with: at least a vertical connection structure extending from the contact pad at the first internal surface towards the front surface of the mold compound; and at least an external connection element, electrically coupled to the vertical connection structure and exposed to the outside of the package, at the second outer face thereof..

06/30/16
20160185592 

Method of selectively removing an anti-stiction layer on a eutectic bonding area


A microelectromechanical systems (mems) package includes a eutectic bonding structure free of a native oxide layer and an anti-stiction layer, while also including a mems device having a top surface and sidewalls lined with the anti-stiction layer. The mems device is arranged within a mems substrate having a first eutectic bonding substructure arranged thereon.

06/30/16
20160185114 

Mems jetting structure for dense packing


A fluid ejector includes a fluid ejection module having a substrate and a layer separate from the substrate. The substrate includes a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle.

06/23/16
20160183021 

Method for testing signal-to-noise ratio using a film frame


A system and a method are provided for testing a mems microphone during manufacture by using a film to obstruct the acoustic ports of the microphone. The microphone testing is performed while the microphones are still in an array and mounted on a film frame.

06/23/16
20160182988 

Microphone with soft clipping circuit


An apparatus includes a microelectromechanical system (mems) device having a diaphragm and a back plate; a clipping circuit coupled to the mems device, wherein the clipping circuit is configured to clip an output signal of the mems device so that the maximum signal drawn by a buffer is substantially constant over a temperature range; and an integrated circuit coupled to the clipping circuit, the integrated circuit including the buffer.. .

06/23/16
20160182013 

Tunable evanescent-mode cavity filter with closed loop control


An evanescent-mode cavity filter with an improved mems tuner design is disclosed. The mems tuner design allows for the independent control of individual poles in a multi-pole filter, which increases the adaptability of the filter in a crowded rf environment.

06/23/16
20160182009 

Plate wave devices with wave confinement structures and fabrication methods


A micro-electrical-mechanical system (mems) guided wave device includes a single crystal piezoelectric layer and at least one guided wave confinement structure configured to confine a laterally excited wave in the single crystal piezoelectric layer. A bonded interface is provided between the single crystal piezoelectric layer and at least one underlying layer.

06/23/16
20160182008 

Multi-frequency guided wave devices and fabrication methods


A micro-electrical-mechanical system (mems) guided wave device includes a piezoelectric layer including multiple thinned regions of different thicknesses each bounding in part a different recess, different groups of electrodes on or adjacent to different thinned regions and arranged for transduction of lateral acoustic waves of different wavelengths in the different thinned regions, and at least one bonded interface between the piezoelectric layer and a substrate. Optionally, a buffer layer may be intermediately bonded between the piezoelectric layer and the substrate.

06/23/16
20160182007 

Plate wave devices with wave confinement structures and fabrication methods


A micro-electrical-mechanical system (mems) guided wave device includes a single crystal piezoelectric layer and at least one guided wave confinement structure configured to confine a laterally excited wave in the single crystal piezoelectric layer. A bonded interface is provided between the single crystal piezoelectric layer and at least one underlying layer.

06/23/16
20160181041 

Mems structure with thick movable membrane


The present invention relates to a method of manufacturing an mems device that comprises the steps of forming a first membrane layer over a sacrificial base layer, forming a second membrane layer over the first membrane layer, wherein the second membrane layer comprises lateral recesses exposing lateral portions of the first membrane layer and forming stoppers to restrict movement of the first membrane layer. Moreover, it is provided mems device comprising a movable membrane comprising a first membrane layer and a second membrane layer formed over the first membrane layer, wherein the second membrane layer comprises lateral recesses exposing lateral portions of the first membrane layer..

06/23/16
20160181040 

Mems structure with multilayer membrane


Systems and methods for a mems device, in particular, a mems switch, and the manufacture thereof are provided. In one example, said mems device comprises posts and a conduction (transmission) line formed over a substrate and a membrane over the posts and the conduction line.

06/23/16
20160179007 

Method of forming a desired pattern on a substrate


The present invention relates to a method of forming a desired pattern on a substrate comprising the steps of a) generating an atomic or molecular beam, in particular a beam of he atoms; b) providing a mask having a desired pattern such as a fourier transform of the desired pattern on the substrate; c) directing the atomic or molecular beam through the patterned mask onto a substrate, whereby a pattern is formed on the substrate by interaction with the proportion of the atomic or molecular beam which penetrates through the mask, which pattern is based on the pattern of the mask, wherein the patterned mask is prepared by a method comprising d) providing a porous starting mask material having openings of a size which allow the atomic or molecular beam to penetrate through; e) creating the desired pattern on the mask by filling a proportion of the openings of the mask which thereby become non-transparent for the atomic or molecular beam. The method of the present invention is useful for preparing conducting circuit structures (micro-chips) or microelectromechanical systems (mems) or structures for micro/nano fluidics or nanostructured surfaces in general, ie.

06/23/16
20160178876 

Mems-based zoom lens system


The present application provides a micromechanical (mems) based zoom lens system, for use in miniature device applications, such as miniature electronic imaging devices. The mems-based zoom lens system comprises at least four optical elements, or two alvarez or lohmann lenses, that are configured for passage of optical signals therethrough along an optical signal path.

06/23/16
20160178656 

Silicon-based mems devices including wells embedded with high density metal


In one aspect, the disclosure is directed to a mems device. The mems device includes a silicon-based movable mems sensor element.

06/23/16
20160178415 

Device and sensor calibration


A device and method for a mems device with at least one sensor is disclosed. A thermal element is disposed adjacent the mems device to selectively adjust a temperature of the mems device.

06/23/16
20160178393 

Mode-tuning sense interface


A mems capacitive sensing interface includes a sense capacitor having a first terminal and a second terminal, and having associated therewith a first electrostatic force. Further included in the mems capacitive sensing interface is a feedback capacitor having a third terminal and a fourth terminal, the feedback capacitor having associated therewith a second electrostatic force.

06/23/16
20160178372 

Gyro mems sensor package


An integrated circuit packaging structure comprises at least one micro electrical mechanical systems (mems) gyroscope die mounted directly on a multi-layer flexible substrate having at least one metal layer and wire-bonded to the flexible substrate and a lid or die coating protecting the mems die and wire bonds.. .

06/23/16
20160176708 

Methods and structures of integrated mems-cmos devices


A method for fabricating an integrated mems-cmos device uses a micro-fabrication process that realizes moving mechanical structures (mems) on top of a conventional cmos structure by bonding a mechanical structural wafer on top of the cmos and etching the mechanical layer using plasma etching processes, such as deep reactive ion etching (drie). During etching of the mechanical layer, cmos devices that are directly connected to the mechanical layer are exposed to plasma.

06/23/16
20160176707 

Reducing mems stiction by increasing surface roughness


A mechanism for reducing stiction in a mems device by decreasing surface area between two surfaces, such as a travel stop and travel stop region, that can come into close contact is provided. Reduction in contact surface area is achieved by increasing surface roughness of the travel stop region.

06/23/16
20160176706 

Systems and methods for forming mems assemblies incorporating getters


Systems and methods for forming mems assemblies incorporating getters are described. One such method for forming and bonding to a microelectromechanical systems (mems) assembly includes providing a first mems wafer including a metal layer on an inner surface and one or more cavities for forming a mems component, attaching a mems capping wafer, having at least one through hole via, to the inner surface of the first mems wafer thereby forming at least one encapsulated mems component within the first mems wafer, and bonding a wire to the metal layer through an open end of the at least one through hole via..

06/23/16
20160176705 

Systems and methods for forming mems assemblies incorporating getters


Systems and methods for forming mems assemblies incorporating getters are described. One such method for forming and bonding to a microelectromechanical systems (mems) assembly includes providing a first mems wafer including a metal layer on an inner surface and one or more cavities for forming a mems component, attaching a mems capping wafer, having at least one through hole via, to the inner surface of the first mems wafer thereby forming at least one encapsulated mems component within the first mems wafer, and bonding a wire to the metal layer through an open end of the at least one through hole via..

06/23/16
20160176704 

Mems devices and processes


This application relates to mems transducer having a membrane layer (101) and at least one variable vent structure (301). The variable vent structure has a vent hole for venting fluid so as to reduce a pressure differential across the membrane layer and a moveable vent cover (302a, 302b) which, at an equilibrium position, at least partly blocks the vent hole.

06/23/16
20160176701 

Mems electrostatic actuator device for rf varactor applications


A mems actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate.

06/16/16
20160173992 

Differential-type mems acoustic transducer


A mems acoustic transducer has: a detection structure, which generates an electrical detection quantity as a function of a detected acoustic signal; and an electronic interface circuit, which is operatively coupled to the detection structure and generates an electrical output quantity as a function of the electrical detection quantity. The detection structure has a first micromechanical structure of a capacitive type and a second micromechanical structure of a capacitive type, each including a membrane that faces and is capacitively coupled to a rigid electrode and defines a respective first detection capacitor and second detection capacitor; the electronic interface circuit defines an electrical connection in series of the first detection capacitor and second detection capacitor between a biasing line and a reference line, and further has a first single-output amplifier and a second single-output amplifier, which are coupled to a respective one of the first detection capacitor and the second detection capacitor and have a respective first output terminal and second output terminal, between which the electrical output quantity is present..
Stmicroelectronics S.r.l.


06/16/16
20160173002 

Micro-electro-mechanical system device with enhanced structural strength


The invention provides a mems device with enhanced structural strength. The mems device includes a plurality of metal layers, including a top metal layer with a plurality of metal segments.
Pixart Imaging Incorporation


06/16/16
20160172112 

Dvc utilizing mems resistive switches and mim capacitors


The present invention generally relates to a mems dvc utilizing one or more mim capacitors. The mim capacitor may be disposed between the mems device and the rf pad or the mim capacitor may be integrated into the mems device itself.
Cavendish Kinetics, Inc.


06/16/16
20160169935 

Multi-axis chip-scale mems inertial measurement unit (imu) based on frequency modulation


A multi-axis microelectromechanical-systems (mems) inertial measurement unit (imu) is fabricated in a vacuum sealed single packaged device. An fm vibratory gyroscope and an fm resonant accelerometer both for generating fm output signals is fabricated in the silicon chip using mems.
The Regents Of The University Of California


06/16/16
20160169927 

Mirco-electro-mechanical system device


The invention provides an mems device. The mems device includes: a substrate, a proof mass, a spring, a spring anchor, a first electrode anchor, and a second electrode anchor, a first fixed electrode and a second fixed electrode.
Richtek Technology Corporation


06/16/16
20160169760 

Pressure sensor with differential capacitive output


A mems pressure sensor device is provided that can provide both a linear output with regard to external pressure, and a differential capacitance output so as to improve the signal amplitude level. These benefits are provided through use of a rotating proof mass that generates capacitive output from electrodes configured at both ends of the rotating proof mass.
Freescale Semiconductor, Inc.


06/16/16
20160169758 

Stress isolated differential pressure sensor


A package includes a mems die and a cap element coupled to and stacked with the mems die. The mems die includes at least two physically isolated pressure sensors, each of which resides on its individual cantilevered platform structure.
Freescale Semiconductor, Inc.


06/16/16
20160168983 

Scalable borehole acquisition system


A method that is usable with a well includes deploying microelectromechanical system (mems)-based seismic receivers in the well and using the mems-based receivers to acquire data indicative of seismic energy.. .
Schlumberger Technology Corporation


06/16/16
20160167961 

Compensation and calibration for mems devices


A sensor system includes a microelectromechanical systems (mems) sensor, processing circuitry, measurement circuitry, stimulus circuitry and memory. The system is configured to provide an output responsive to physical displacement within the mems sensor to the measurement circuitry.
Freescale Semiconductor, Inc.


06/16/16
20160167958 

Through-wafer interconnects for mems double-sided fabrication process (twids)


A high-aspect ratio low resistance through-wafer interconnect for double-sided (twids) fabrication of microelectromechanical systems (mems) serves as an interconnection method and structure for co-integration of mems and integrated circuits or other microcomponent utilizing both sides of the wafer. Twids applied to a three dimensional folded timu (timing inertial measurement unit) provides a path for electrical signals from sensors on the front side of the soi wafer to electronic components on the back side of the wafer, while enabling folding of an array of sensors in a three dimensional shape..
The Regents Of The University Of California


06/16/16
20160167956 

Integrated cmos back cavity acoustic transducer and the producing the same


A mems device includes a mems substrate with a movable element. Further included is a cmos substrate with a cavity, the mems substrate disposed on top of the cmos substrate.
Invensense, Inc.


06/16/16
20160167954 

Monolithically integrated multi-sensor device on a semiconductor substrate and method therefor


A monolithically integrated multi-sensor (mims) is disclosed. A mims integrated circuit comprises a plurality of sensors.
Versana Micro Inc.


06/16/16
20160167953 

Monolithically integrated multi-sensor device on a semiconductor substrate and method therefor


A monolithically integrated multi-sensor (mims) is disclosed. A mims integrated circuit comprises a plurality of sensors.
Versana Micro Inc.


06/16/16
20160167952 

Microelectronic packages having hermetic cavities and methods for the production thereof


Microelectronic packages having hermetic cavities are provided, as are methods for producing such packages. In one embodiment, the microelectronic package includes a sensor die having first and second microelectromechanical systems (mems) transducer structures formed thereon.

06/16/16
20160167950 

Encapsulated microelectromechanical structure


A semiconductor layer having an opening and a mems resonator formed in the opening is disposed between first and second substrates to encapsulate the mems resonator. An electrical contact that extends from the opening to an exterior of the mems device is formed at least in part within the semiconductor layer and at least in part within the first substrate..
Sitime Corporation


06/16/16
20160167949 

Method of lower profile mems package with stress isolations


mems packages, modules, and methods of fabrication are described. In an embodiment, a mems package includes a mems die and an ic die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the ic die and the mems die on the front side of the surface mount substrate.
Apple Inc.


06/16/16
20160167948 

Vent attachment system for micro-electromechanical systems


A method of installing a vent to protect an open port of a micro-electrical mechanical system (mems) device, the vent being of the type comprising an environmental barrier membrane attached to a carrier and the vent further being attached to a liner, the method comprising the steps of: (a) feeding the vent to a die attach machine with die ejectors and at least one of a vacuum head and a gripper head; (b) detaching the vent from said liner using the die ejectors; (c) picking up the vent with at least one of the vacuum head and the gripper head of the die attach machine; (d) disposing the vent over the open port of the mems device; and (e) securing the vent over the open port of the mems device.. .
W. L. Gore & Associates, Inc.


06/16/16
20160167946 

Mems device and process


The application describes improvements to (mems) transducers (100) having a flexible membrane (301) with a membrane electrode (302), especially where the membrane is crystalline or polycrystalline and the membrane electrode is metal or a metal alloy. Such transducers may typically include a back-plate having at least one back-plate layer (304) coupled to a back-plate electrode (303), with a plurality of holes (314) in the back-plate electrode corresponding to a plurality back-plate holes (312) through the back-plate.
Cirrus Logic International Semiconductor Ltd.


06/16/16
20160167945 

Microelectromechanical systems (mems) stopper structure for stiction improvement


A microelectromechanical systems (mems) structure having a stopper integrated with a mems substrate is provided. A first substrate has a dielectric layer arranged over the first substrate.
Taiwan Semiconductor Manufacturing Co., Ltd.


06/16/16
20160167944 

Reducing mems stiction by deposition of nanoclusters


A mechanism for reducing stiction in a mems device by decreasing surface area between two surfaces that can come into close contact is provided. Reduction in contact surface area is achieved by increasing surface roughness of one or both of the surfaces.
Freescale Semiconductor, Inc.


06/09/16
20160165358 

Mems microphone package


An mems microphone package includes a substrate, an mems microphone, an ic chip and an electrically conductive cover. The substrate includes a first hole, an upper surface, a bottom surface, a side surface, a first electrically conductive layer and a second electrically conductive layer.
Industrial Technology Research Institute


06/09/16
20160165357 

Dual-element mems microphone for mechanical vibration noise cancellation


Disclosed are systems, devices, and methods for minimizing mechanical-vibration-induced noise in audio signals. In one aspect, a microphone is disclosed that includes a first backplate, a first diaphragm, a second backplate, and a second diaphragm.
Google Inc.


06/09/16
20160165355 

Microelectromechanical systems electret microphone


Microelectromechanical systems (mems) electret acoustic sensors or microphones, devices, systems, and methods are described. Exemplary embodiments employ electret comprising an inorganic dielectric material such as silicon nitride in mems electret acoustic sensors or microphones.
Invensense, Inc.


06/09/16
20160165331 

Systems and apparatus having top port integrated back cavity micro electro-mechanical system microphones and methods of fabrication of the same


A micro electro-mechanical system (mems) device is provided. The mems device includes: a first substrate having a first surface and a second surface, and a port disposed through the first substrate, wherein the port is configured to receive acoustic waves and wherein the first surface is exposed to an environment outside the mems device; and a diaphragm coupled to and facing the second surface and configured to deflect in response to pressure differential at the diaphragm in response to the received acoustic waves.
Invensense, Inc.




Mems topics: Camera Module, Acceleration Sensor, Microelectromechanical Systems, Control Unit, Semiconductor Substrate, Semiconductor, Demodulation, Accelerometer, Calibration, Modulation, Mems Devices

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