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Mems patents

      

This page is updated frequently with new Mems-related patent applications.




 Physical object drop and impact alarm device patent thumbnailnew patent Physical object drop and impact alarm device
The present invention comprises a device which emits an audible sound when it is dropped and impacts upon the ground or other surface. The device is small enough to be easily placed in a user's wallet, on a keychain, or other valuable and will alert the user when these valuables are dropped.

 Contact mems architecture for improved cycle count and hot-switching and esd patent thumbnailnew patent Contact mems architecture for improved cycle count and hot-switching and esd
The disclosure is directed to optimized switching circuitry utilizing mems (microelectromechanical systems) circuitry in series with solid state circuitry. Specifically, the mems circuitry includes a first mems circuit in parallel with (and separate from) a second mems circuit.
Qorvo Us, Inc.


 Mirror based micromechanical systems and methods patent thumbnailnew patent Mirror based micromechanical systems and methods
Unlike most mems device configurations which simply switch between two positions in many optical devices the state of a mems mirror is important in all transition positions. It may determine the characteristics of an optical delay line system and by that an optical coherence tomography system in one application and in another the number of wavelength channels and the dynamic wavelength switching capabilities in the other.
Gestion ValeÓ SociÉtÉ En Commandite (valeo Management L.p.)


 Methods and system for wavelength tunable optical components and sub-systems patent thumbnailnew patent Methods and system for wavelength tunable optical components and sub-systems
Wavelength division multiplexing (wdm) has enabled telecommunication service providers to fully exploit the transmission capacity of optical fibers. State of the art systems in long-haul networks now have aggregated capacities of terabits per second.
Aeponyx Inc.


 Duty-cycled gyroscope patent thumbnailnew patent Duty-cycled gyroscope
A gyroscope system comprises a mems gyroscope coupled to a drive system and a sense system. The drive system maintains the mems gyroscope in a state of oscillation and the sense system for receiving, amplifying, and demodulating an output signal of the mems gyroscope that is indicative of the rate of rotation.
Invensense, Inc.


 Release chemical protection for integrated complementary metal-oxide-semiconductor (cmos) and micro-electro-mechanical (mems) devices patent thumbnailnew patent Release chemical protection for integrated complementary metal-oxide-semiconductor (cmos) and micro-electro-mechanical (mems) devices
Systems and methods that protect cmos layers from exposure to a release chemical are provided. The release chemical is utilized to release a micro-electro-mechanical (mems) device integrated with the cmos wafer.
Invensense, Inc.


 Mems micro debrider devices and methods of tissue removal patent thumbnailnew patent Mems micro debrider devices and methods of tissue removal
Medical devices for shearing tissue into small pieces are provided. One exemplary device includes oppositely rotating first and second rotatable members, each located at least partially within a distal housing.

 Unreleased coupled mems resonators and transmission filters patent thumbnailUnreleased coupled mems resonators and transmission filters
Examples of the present invention include unreleased coupled multi-cavity resonators and transmission filters. In some examples, the resonators include resonant cavities coupled by acoustic couplers (abgcs) and acoustic reflectors (abrs).

 Pressure sensing device patent thumbnailPressure sensing device
A pressure sensing device is disclosed in the present disclosure. The pressure sensing device includes a bottom plate, a flexible shell and a mems pressure sensor.
Aac Technologies Pte. Ltd.


 Accelerometer and its fabrication technique patent thumbnailAccelerometer and its fabrication technique
An accelerometer includes a measurement mass, a top cap silicon wafer and a bottom cap silicon wafer, both of which are coupled with the measurement mass. The measurement mass includes a support frame, a mass, and a plurality of resilient beams.
Chinese Academy Of Sciences Institute Of Geology And Geophysics


Mems-cmos-mems platform

A package combining a mems substrate, a cmos substrate and another mems substrate in one package that is vertically stacked is disclosed. The package comprises a sensor chip further comprising a first mems substrate and a cmos substrate with a first surface and a second surface and where the first mems substrate is attached to the first surface of the cmos substrate.
Invensense, Inc.

Mems devices and fabrication methods thereof

A device includes a carrier having a plurality of cavities, a micro-electro-mechanical system (mems) substrate bonded on the carrier, wherein the mems substrate comprises a first side bonded on the carrier, a moving element over a bottom electrode, wherein the bottom electrode is formed of polysilicon and a second side having a plurality of bonding pads and a semiconductor substrate bonded on the mems substrate, wherein the semiconductor substrate comprises a top electrode and the first moving element is between the top electrode and the bottom electrode.. .
Taiwan Semiconductor Manufacturing Company, Ltd.

Cmos-mems device structure, bonding mesa structure and associated method

The present disclosure provides a cmos-mems device structure. The cmos-mems device structure includes a sensing substrate and a cmos substrate.
Taiwan Semiconductor Manufacturing Company Ltd.

Mems dual comb drive

Techniques described herein generally include methods and systems related to a speaker device comprises a planar oscillation element configured to generate an ultrasonic acoustic signal, a shutter element, a first comb drive, and a second comb drive. The shutter element is configured to cover an opening that is positioned to receive the ultrasonic acoustic signal to modulate the ultrasonic acoustic signal such that an audio signal is generated.
Empire Technology Development Llc

Micro-electromechanical sound transducer with sound energy-reflecting interlayer

A mems sound transducer for at least one of generating and detecting sound waves in air in an audible wavelength spectrum includes a carrier substrate, a cavity defined in the carrier substrate, the cavity defining at least one opening, and a multilayered piezoelectric membrane structure spanning over the opening of the cavity and having an edge area connected with the carrier substrate so that with respect to the carrier substrate the membrane structure is capable of vibrating to at least one of generate and/or and detect sound energy, wherein the membrane structure has in cross-section at least in some areas a first piezo layer spaced from a second piezo layer. An interlayer is arranged in an area between the first and second piezo layers, the interlayer being made of at least one of silicon oxide, silicon nitride and polysilicon, the interlayer being configured so that sound energy can be reflected in the direction of at least one interface of the membrane structure adjacent to the air..
Usound Gmbh

Tunable power amplifier with wide frequency range

A circuit includes an amplifier configured to amplify an input signal and generate an output signal. The circuit also includes a tuning network configured to tune frequency response of the amplifier.
Texas Instruments Incorporated

Anti-theft system, anti-theft device and anti-theft method

An anti-theft system includes at least one mems module, a master controlling module and an alerting module. The mems module is used for detecting a velocity, an acceleration and/or a spatial location of the mems module, and transferring the detected velocity, the acceleration or the spatial location of the mems module to the master controlling module.
Quasion Inc.

Silane modified fluid for mems stiction reduction

This disclosure provides devices and methods of reducing stiction during a fluid-filling process. A device can include two substrates with movable mems components on at least one of the substrates.
Pixtronix, Inc.

Mems sensor devices having a self-test mode

A micro-electro-mechanical system (mems) device comprises a micro-electro-mechanical system (mems) sensor; a detector circuit; a controller circuit coupled with the mems sensor; a first connection arranged between a first output of the mems sensor and a first input of the detector circuit; a second connection arranged between a second output of the mems sensor and a second input of the detector circuit; and a first switch arranged in the first connection. The controller circuit is configured to open the first switch during a first test mode so as to connect only a single input of the detector circuit with an output of the mems sensor.
Freescale Semiconductor, Inc.

Method of increasing mems enclosure pressure using outgassing material

Semiconductor manufacturing processes include providing a first substrate having a first passivation layer disposed above a patterned top-level metal layer, and further having a second passivation layer disposed over the first passivation layer; the second passivation layer has a top surface. The processes further include forming an opening in a first portion of the second passivation layer, and the opening exposes a portion of a surface of the first passivation layer.
Invensense, Inc.

Mems devices and fabrication methods thereof

A device includes a carrier having a plurality of cavities, a micro-electro-mechanical system (mems) substrate bonded on the carrier, wherein the mems substrate comprises a shielding layer on the carrier and coupled to ground, a plurality of vias coupled between the shielding layer and a bottom electrode of the mems substrate and a moving element over the bottom electrode and a semiconductor substrate bonded on the mems substrate, wherein the semiconductor substrate comprises a top electrode, and wherein the moving element is between the top electrode and the bottom electrode.. .
Taiwan Semiconductor Manufacturing Company, Ltd.

Mems pressure sensor and microphone devices having through-vias and methods of forming same

A method embodiment includes providing a mems wafer. A portion of the mems wafer is patterned to provide a first membrane for a microphone device and a second membrane for a pressure sensor device.
Taiwan Semiconductor Manufacturing Company, Ltd.

Electronic systems with through-substrate interconnects and mems device

Disclosed are systems, methods, and computer program products for electronic systems with through-substrate interconnects and mems device. An interconnect formed in a substrate having a first surface and a second surface, the interconnect includes: a bulk region; a via extending from the first surface to the second surface; an insulating structure extending through the first surface into the substrate and defining a closed loop around the via, wherein the insulating structure comprises a seam portion separated by at least one solid portion; and an insulating region extending from the insulating structure toward the second surface, the insulating region separating the via from the bulk region, wherein the insulating structure and insulating region collectively provide electrical isolation between the via and the bulk region..
Kionix, Inc.

Mems microphone

A mems microphone is disclosed in the present disclosure. The mems microphone includes a first circuit board; a second circuit board keeping a distance from the first circuit board; a frame located between the first circuit board and the second circuit board for forming a cavity cooperatively with the first circuit board and the second circuit board, the frame including a plated-through-hole; an asic chip located in the cavity; and an mems chip having a back cavity.
Aac Technologies Pte. Ltd.

Method and applications of thin-film membrane transfer

The disclosure relates to method and apparatus for micro-contact printing of micro-electromechanical systems (“mems”) in a solvent-free environment. The disclosed embodiments enable forming a composite membrane over a parylene layer and transferring the composite structure to a receiving structure to form one or more microcavities covered by the composite membrane.
Massachusetts Institute Of Technology

Spatial light modulator for actuating microelectromechanical systems (mems) structures

A spatial light modulator is provided by positioning and repositioning micromirrors of a microelectromechanical system. The micromirrors are positioned by an actuator linked to the micromirrors by a frame.

Mems based photonic devices and methods for forming

Various particular embodiments include a primary waveguide including an end section; cantilevered waveguides, each cantilevered waveguide including an end section disposed adjacent the end section of the primary waveguide; and control pins for applying an electrical bias to the cantilevered waveguides to selectively displace the end sections of the cantilevered waveguides away from the end section of the primary waveguide.. .
International Business Machines Corporation

Mems sensor

The present invention relates to a mems sensor with movable and fixed components for measuring linear acceleration. The mems sensor includes at least two mutually independent differential sensor elements disposed inside a common frame structure providing walls for hermetic sealing of the mems sensor.
Murata Manufacturing Co., Ltd.

System and a mems transducer

According to an embodiment, a microelectromechanical systems (mems) transducer includes a substrate with a first cavity that passes through the substrate from a backside of the substrate. The mems transducer also includes a perforated first electrode plate overlying the first cavity on a topside of the substrate, a second electrode plate overlying the first cavity on the topside of the substrate and spaced apart from the perforated first electrode plate by a spacing region, and a gas sensitive material in the spacing region between the perforated first electrode plate and the second electrode plate.
Infineon Technologies Ag

Particle manipulation system with out-of-plane channel and recovery algorithm

A particle manipulation system uses a mems-based, microfabricated particle manipulation device which has an inlet channel, output channels, and a movable member formed on a substrate. The movable member moves parallel to the fabrication plane, as does fluid flowing in the inlet channel.
Owl Biomedical, Inc.

Particle manipulation system with camera confirmation

A mems-based particle manipulation system which uses a particle manipulation stage and optical confirmation of the manipulation. The optical confirmation may be camera-based, and may be used to assess the effectiveness or accuracy of the particle manipulation stage.
Owl Biomedical, Inc.

Pressure sensor device with a mems piezoresistive element attached to an in-circuit ceramic board

A pressure sensor device with a mems piezoresistive pressure sensing element attached to an in-circuit ceramic board comprises a monolithic ceramic circuit board formed by firing multiple layers of ceramic together. The bottom side of the circuit board has a cavity, which extends through layers of material from the ceramic circuit board is formed.
Continental Automotive Systems, Inc.

Systems and methods for a time-based optical pickoff for mems sensors

Systems and methods for a time-based optical pickoff for mems sensors are provided. In one embodiment, a method for an integrated waveguide time-based optical-pickoff sensor comprises: launching a light beam generated by a light source into an integrated waveguide optical-pickoff monolithically fabricated within a first substrate, the integrated waveguide optical-pickoff including an optical input port, a coupling port, and an optical output port; and detecting changes in an area of overlap between the coupling port and a moving sensor component separated from the coupling port by a gap by measuring an attenuation of the light beam at the optical output port, wherein the moving sensor component is moving in-plane with respect a surface of the first substrate comprising the coupling port and the coupling port is positioned to detect movement of an edge of the moving sensor component..
Honeywell International Inc.

Wafer level mems package including dual seal ring

A microelectromechanical systems (mems) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one mems device and a second boundary point adjacent at least one of the outer edges.
Raytheon Company

Mems device with electrodes permeable to outgassing species

A mems device and method for providing a mems device are disclosed. In a first aspect, the mems device comprises a first substrate and a second substrate coupled to the first substrate forming a sealed enclosure.
Invensense, Inc.

Diagnostic radio frequency identification sensors and applications thereof

An integrated passive wireless chip diagnostic sensor system is described that can be interrogated remotely with a wireless device such as a modified cell phone incorporating multi-protocol rfid reader capabilities (such as the emerging gen-2 standard) or bluetooth, providing universal easy to use, low cost and immediate quantitative analyses, geolocation and sensor networking capabilities to users of the technology. The present invention can be integrated into various diagnostic platforms and is applicable for use with low power sensors such as thin films, mems, electrochemical, thermal, resistive, nano or microfluidic sensor technologies.
Altivera, Llc

In-plane overtravel stops for mems microphone

A mems microphone including a plurality of overtravel stops (ots) connected to a perimeter of a membrane of the mems microphone. The ots are released from a backplate layer during manufacturing and are configured to contact the backplate to restrict movement of the ots and thus restrict movement of the membrane of the mems microphone.
Robert Bosch Gmbh

Mems device

According to the present invention there is provided a mems device comprising, a mirror which is connected to a fixed portion by means of a first and second torsional arm, each of the first and second torsional arms are configured such that they can twist about torsional axes so as to oscillate the mirror about a first oscillation axes, and wherein the first and second torsional arms are each configured to have two or more meanders and wherein the first and second torsional arms are arranged symmetrically relative to the first oscillation axis.. .
Intel Corporation

Capacitive accelerometer devices and wafer level vacuum encapsulation methods

Silicon-based capacitive accelerometers are relatively simple to fabricate and offer low cost, small size, low power, low noise and provide high sensitivity, good dc response, low drift, and low temperature sensitivity. However, tri-axial accelerometers, as opposed to using multiple discrete accelerometers, require very low cross-axis sensitivity and close sensitivities across the three directions.

Micro-electro-mechanical system (mems) device

The present invention discloses a mems device. The mems device includes a substrate, a proof mass, a frame spring and an anchor.
Richtek Technology Corporation

Integrated electronic device including a full scale adjustment stage for signals supplied by a mems sensor

A mems sensor generates an output multiscale reading signal supplied to a full scale adjustment stage. The full scale adjustment stage includes a signal input configured to receive the reading signal, a saturation assessment block, and a full scale change block.
Stmicroelectronics S.r.l.

Mems device with common mode rejection structure

A mems device includes a drive spring system coupling a pair of drive masses and a sense spring system coupling a pair of sense masses. The drive spring system includes a constrained stiff beam and flexures interconnecting the pair of drive masses.
Freescale Semiconductor, Inc.

Inertial sensor with couple spring for common mode rejection

A mems device includes a two spring systems coupling a pair of movable masses. Each of the spring systems includes a constrained stiff beam and a pair of flexures, where one flexure is directly coupled to one end of the stiff beam and to one of the movable masses and the other flexure is directly coupled to the opposing end of the stiff beam and to the other movable mass.
Freescale Semiconductor, Inc.

Use of metal native oxide to control stress gradient and bending moment of a released mems structure

In described examples, a mems device is formed by forming a sacrificial layer over a substrate and forming a first metal layer over the sacrificial layer. Subsequently, the first metal layer is exposed to an oxidizing ambient which oxidizes a surface layer of the first metal layer where exposed to the oxidizing ambient, to form a native oxide layer of the first metal layer.
Texas Instruments Incorporated

Integration of active devices with passive components and mems devices

Integration of active devices with passive components and mems devices is disclosed. An integrated semiconductor structure includes an active device having a device top electrode connected to a conductive jumper by a device-side via/interconnect metal stack.
Newport Fab, Llc Dba Jazz Semiconductor

Method for producing a micromechanical component

A method for manufacturing a micromechanical component including forming an access opening in an mems element or in a cap element of the component; connecting the mems element to the cap element, at least one cavity being formed between the mems element and the cap element; and closing off the access opening with respect to the at least one cavity under a defined atmosphere, using a laser.. .
Robert Bosch Gmbh

Mems devices and methods for forming same

An embodiment is mems device including a first mems die having a first cavity at a first pressure, a second mems die having a second cavity at a second pressure, the second pressure being different from the first pressure, and a molding material surrounding the first mems die and the second mems die, the molding material having a first surface over the first and the second mems dies. The device further includes a first set of electrical connectors in the molding material, each of the first set of electrical connectors coupling at least one of the first and the second mems dies to the first surface of the molding material, and a second set of electrical connectors over the first surface of the molding material, each of the second set of electrical connectors being coupled to at least one of the first set of electrical connectors..
Taiwan Semiconductor Manufacturing Company, Ltd.

Mems chip package

A micro-electro-mechanical system (mems) chip package including a circuit substrate, a driving chip and a mems sensor is provided. The circuit substrate has a first surface and a second surface opposite thereto.
Merry Electronics(shenzhen) Co., Ltd.



Mems topics:
  • Camera Module
  • Acceleration Sensor
  • Microelectromechanical Systems
  • Control Unit
  • Semiconductor Substrate
  • Semiconductor
  • Demodulation
  • Accelerometer
  • Calibration
  • Modulation
  • Mems Devices


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    This listing is a sample listing of patent applications related to Mems for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Mems with additional patents listed. Browse our RSS directory or Search for other possible listings.


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