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This page is updated frequently with new Mems-related patent applications.




Date/App# patent app List of recent Mems-related patents
04/07/16
20160100257 
 Signal processing platform in an acoustic capture device patent thumbnailSignal processing platform in an acoustic capture device
A microphone includes a base, a micro electro mechanical system (mems) device disposed on the base, and a front end processing apparatus disposed on the base and coupled to the mems device, the front end processing apparatus being configured to convert analog signals received from the mems device into digital signals. The microphone also includes a dsp apparatus, the dsp apparatus being a digital programmed device with a computer memory, the dsp apparatus configured to process the digital signals received from the front end processing apparatus.
Knowles Electronics, Llc


04/07/16
20160100256 
 Acoustic assembly and  manufacturing the same patent thumbnailAcoustic assembly and manufacturing the same
A microelectromechanical system (mems) microphone includes a base; a cover having a port extending therethrough; a mems die coupled to the cover, the mems die including a diaphragm and a back plate; an application specific integrated circuit (asic) coupled to the cover and the mems die; and an electrical interconnection from the asic to the base, the electrical interconnection being disposed on an inside surface of the cover. The base includes customer pads, the customer pads on the base being connected electrically to the asic via the electrical interconnection.
Knowles Electronics, Llc


04/07/16
20160099700 
 Cmos tuner and related tuning algorithm for a passive adaptive antenna matching network suitable for use with agile rf transceivers patent thumbnailCmos tuner and related tuning algorithm for a passive adaptive antenna matching network suitable for use with agile rf transceivers
A novel and useful adaptive antenna tuner and associated calibration mechanism for passive adaptive antenna matching networks. The tuner is suitable for use with cellular antennas and in one embodiment uses mems based tunable devices.

04/07/16
20160099393 
 Using mems fabrication incorporating into led device mounting and assembly patent thumbnailUsing mems fabrication incorporating into led device mounting and assembly
Led chip packaging assembly that facilitates an integrated method for mounting led chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. Led chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the led chips, respectively.
Imec Taiwan Co.


04/07/16
20160099124 
 Planar cavity mems and related structures, methods of manufacture and design structures patent thumbnailPlanar cavity mems and related structures, methods of manufacture and design structures
A method of forming a micro-electro-mechanical system (mems) includes forming a lower electrode on a first insulator layer within a cavity of the mems. The method further includes forming an upper electrode over another insulator material on top of the lower electrode which is at least partially in contact with the lower electrode.
International Business Machines Corporation


04/07/16
20160099112 
 Systems, devices, and methods to reduce dielectric charging in micro-electro-mechanical systems devices patent thumbnailSystems, devices, and methods to reduce dielectric charging in micro-electro-mechanical systems devices
The present subject matter relates to devices, systems, and methods for isolation of electrostatic actuators in mems devices to reduce or minimize dielectric charging. A tunable component can include a fixed actuator electrode positioned on a substrate, a movable actuator electrode carried on a movable component that is suspended over the substrate, one or more isolation bumps positioned between the fixed actuator electrode and the movable actuator electrode, and a fixed isolation landing that is isolated within a portion of the fixed actuator electrode that is at, near, and/or substantially aligned with each of the one or more isolation bumps.
Wispry, Inc. .


04/07/16
20160097927 
 Device and  micro-electro-mechanical-system photonic switch patent thumbnailDevice and micro-electro-mechanical-system photonic switch
In one embodiment, a method of controlling a micro-electro-mechanical-system (mems) photonic switch includes applying a voltage to an electrode of an initial mirror of a first mirror array of the mems photonic switch and illuminating a control beam. The method also includes reflecting the control beam off the initial mirror to form a control beam spot on a second mirror array of the mems photonic switch and detecting an initial location of the control beam spot to produce an initial optical response.
Huawei Technologies Co., Ltd.


04/07/16
20160097856 
 Acoustic apparatus with dual mems devices patent thumbnailAcoustic apparatus with dual mems devices
In accordance with one aspect of the disclosure, an acoustic apparatus is provided including a first transducer, a second transducer, a signal generator coupled to the first transducer, and a proximity detection module coupled to the second transducer. A buffering module is coupled to the first and second transducers and is configured to process analog signals received from the second transducer..
Knowles Electronics, Llc


04/07/16
20160097838 
 Portable sound source searching sensor and  manufacturing the same patent thumbnailPortable sound source searching sensor and manufacturing the same
A portable sound source searching sensor comprising: a front body (10) in which acoustic sensors of mems microphones (20) are arranged to face forward; mems microphones (20) of which acoustic sensors are exposed to the front body (10) in a fixed state to the substrate (30); a substrate (30) on which the microphones (20) are mounted; an image photographing unit (40) of which a photographing lens (41) is exposed through a lens hole of the front body (10); and a rear body (50) for surrounding a rear side of the substrate (30) and a rear side of the image photographing unit in a state that the substrate (30) is positioned at a rear side of the front body (10).. .
Sm Instrument Co., Ltd.


04/07/16
20160097792 
 Three-axis microelectromechanical systems device with single proof mass patent thumbnailThree-axis microelectromechanical systems device with single proof mass
A microelectromechanical systems (mems) device, such as a three-axis mems device can sense acceleration in three orthogonal axes. The mems device includes a single proof mass and suspension spring systems that movably couple the proof mass to a substrate.
Freescale Semiconductor, Inc.


04/07/16
20160097791 

Mems accelerometer with z axis anchor tracking


In some exemplary embodiments, a mems accelerometer includes a device wafer having a proof mass and a plurality of tracking anchor points attached to a substrate. Each tracking anchor is configured to deflect in response to asymmetrical deformation in the substrate, and transfer mechanical forces generated in response to the deflection to tilt the proof mass in a direction of the deformation..
Analog Devices, Inc.


04/07/16
20160097789 

Performance improvement of mems devices


A microelectromechanical-systems (mems) device includes a driven mass and has a natural stiffness or damping. An actuator applies force to the mass, movement of which is measured by a sensing capacitor.
Purdue Research Foundation


04/07/16
20160097642 

Mems sensor module, vibration driving module, and mems sensor


A mems sensor module of the present invention, in particular, a vibration driving module includes: a movable electrode supported such that the movable electrode is able to be vibrated, the movable electrode extending in a vibration direction; a fixed electrode provided substantially in parallel with the movable electrode and extending in the vibration direction; a plurality of projection portions provided side by side on a facing wall surface of the movable electrode in the vibration direction, the facing wall surface of the movable electrode facing the fixed electrode; and a plurality of projection portions provided on a facing wall surface of the fixed electrode, the facing wall surface of the fixed electrode facing the movable electrode, the plurality of projection portions of the fixed electrode facing the projection portions of the movable electrode.. .
Murata Manufacturing Co., Ltd.


04/07/16
20160096728 

Mems chip and manufacturing method thereof


A mems chip includes a cap layer and a composite device layer. The cap layer includes a substrate.
Richtek Technology Corporation


04/07/16
20160096727 

Integrated circuit package method


A method of forming a packaged electronic device includes fabricating a mems structure, such as a baw structure, on a first semiconductor wafer substrate; forming a cavity in a second semiconductor wafer substrate; and mounting the second substrate on the first substrate such that the mems structure is positioned inside the cavity in the second substrate using epoxy die attachment film. A wafer level assembly and an integrated circuit package are also described..
Texas Instruments Incorporated


04/07/16
20160096726 

Mems device and making a mems device


A mems device and a method of making a mems device are disclosed. In one embodiment a semiconductor device comprises a substrate, a moveable electrode and a counter electrode, wherein the moveable electrode and the counter electrode are mechanically connected to the substrate.
Infineon Technologies Ag


04/07/16
20160096725 

Semiconductor device, display module, and electronic device


To reduce the amplitude voltage of control signals of a mems device. A semiconductor device includes a mems device, a first transistor, a second transistor whose source or drain is electrically connected to a source or a drain of the first transistor, a third transistor which sets the potential of a gate of the first transistor to a value at which the first transistor is turned on, a fourth transistor which sets the potential of the gate of the first transistor to a value at which the first transistor is turned off, and a fifth transistor which supplies a signal to a gate of the second transistor and a gate of the fourth transistor..
Semiconductor Energy Laboratory Co., Ltd.


04/07/16
20160096724 

Stress isolation for mems device


A microelectromechanical systems (mems) die includes a substrate having a recess formed therein and a cantilevered platform structure. The cantilevered platform structure has a platform and an arm extending from the platform, wherein the platform and arm are suspended over the recess.
Freescale Semiconductor, Inc.


04/07/16
20160096723 

Mems die and methods with multiple-pressure sealing


The present subject matter relates to systems and methods for sealing one or more mems devices within an encapsulated cavity. A first material layer can be positioned on a substrate, the first material layer comprising a first cavity and a second cavity that each have one or more openings out of the first material layer.
Wispry


04/07/16
20160096721 

Planar cavity mems and related structures, methods of manufacture and design structures


A method of forming a micro-electro-mechanical system (mems) includes forming a lower electrode on a first insulator layer within a cavity of the mems. The method further includes forming an upper electrode over another insulator material on top of the lower electrode which is at least partially in contact with the lower electrode.
International Business Machines Corporation


03/31/16
20160094156 

Mems sensor including an over-travel stop and manufacture


A mems sensor is disclosed. The mems sensor includes a mems structure and a substrate coupled to the mems structure.
Invensense, Inc.


03/31/16
20160093791 

Apparatus and sealing a mems device


A method and apparatus for sealing a device with a mems device with an active region is disclosed. A substrate with an opening is disposed relative to the mems device so as to align the active region of the mems device with the opening.
Invensense, Inc.


03/31/16
20160093591 

Microelectromechanical system (mems) bond release structure and wafer transfer for three-dimensional integrated circuit (3d ic) integration


A microelectromechanical system (mems) bond release structure is provided for manufacturing of three-dimensional integrated circuit (3d ic) devices with two or more tiers. The mems bond release structure includes a mems sacrificial release layer which may have a pillar or post structure, or alternatively, a continuous sacrificial layer for bonding and release..
Qualcomm Incorporated


03/31/16
20160091525 

Acceleration sensor


An acceleration sensor that achieves a simultaneous operation method of a signal detection and a servo control is provided as an alternative to a time-division processing method. The acceleration sensor is a mems capacitive acceleration sensor.
Hitachi, Ltd.


03/31/16
20160091524 

Inertial sensor


On the assumption that a movable portion vu1 and a movable portion vu2 are formed in the same soi layer, the movable portion vu1 and the movable portion vu2 are mechanically connected to each other by a mechanical coupling portion mcu even while these movable portions are electrically isolated from each other. Thereby, according to a sensor element se in the invention, it is possible to further suppress a shift between the capacitance of a mems capacitor 1 and the capacitance of a mems capacitor 2..

03/31/16
20160091378 

Microelectromechanical systems (mems) pressure sensor having a leakage path to a cavity


Microelectromechanical systems (mems) pressure sensors having a leakage path are described. Provided implementations can comprise a mems pressure sensor system associated with a back cavity and a membrane that separates the back cavity and an ambient atmosphere.
Invensense, Inc.


03/31/16
20160091308 

Microelectromechanical systems (mems) acoustic sensor-based gesture recognition


Microelectromechanical systems (mems) acoustic sensor-based gesture recognition associated with detecting gestures is described. Provided implementations can comprise mems acoustic sensor elements that receive signals reflected off an object.
Invensense, Inc.


03/31/16
20160090303 

Monolithic cmos-mems microphones and manufacturing


Systems and methods are disclosed for manufacturing a cmos-mems device (100). A partial protective layer (401) is deposited on a top surface of a layered structure to cover a circuit region.
Robert Bosch Gmbh


03/31/16
20160090301 

Packages for semiconductor devices and methods for assembling same


One or more embodiments of the present disclosure are directed to packages that include a stacked microelectromechanical sensor mems die and an application-specific integrated circuit (asic) die. The smaller of the mems die and the asic die is stacked on the larger of the mems die and the asic die.
Stmicroelectronics (malta) Ltd


03/31/16
20160090300 

Piezoelectric microphone with integrated cmos


A piezoelectric microphone and/or a piezoelectric microphone system is presented herein. In an implementation, a piezoelectric microphone includes a microelectromechanical systems (mems) layer and a complementary metal-oxide-semiconductor (cmos) layer.
Invensense, Inc.


03/31/16
20160090297 

Stress isolation platform for mems devices


A mems product includes a stress-isolated mems platform surrounded by a stress-relief gap and suspended from a substrate. The stress-relief gap provides a barrier against the transmission of mechanical stress from the substrate to the platform..
Analog Devices, Inc.


03/31/16
20160090295 

Micro-electro-mechanical system device with low substrate capacitive coupling effect


The present invention discloses a mems device with low substrate capacitive coupling effect, which is manufactured by a cmos manufacturing process. The mems device includes: a substrate; at least one anchor, including an oxide layer connected with the substrate and a connecting structure on the oxide layer; and at least one micro-electro-mechanical structure, connected with the connecting structure.
Pixart Imaging Incorporation


03/31/16
20160090293 

Microelectromechanical systems (mems) audio sensor-based proximity sensor


Microelectromechanical systems (mems) acoustic sensors associated with proximity detection are described. Provided implementations can comprise a mems acoustic sensor element associated with a transmitter and a receiver.
Invensense, Inc.


03/31/16
20160090291 

Semiconductor device, display module, and electronic device


An object is to continuously apply voltage to a mems device using first to fifth or sixth transistors. One of a source and a drain of the first transistor is electrically connected to one of a source and a drain of the second transistor.
Semiconductor Energy Laboratory Co., Ltd.


03/31/16
20160089751 

Armband based controlling welding equipment using gestures and like motions


Portable, wearable or integrate-able devices may be used in detecting gestures or motions by operators of welding systems, and performing actions based thereon. The detection may be performed using sensors (e.g., mems or muscle sensors), which generate sensory data.
Illinois Tool Works


03/24/16
20160088414 

Method of manufacturing a mems microphone


A method of fabricating a micro electrical-mechanical system (mems) microphone on a substrate includes forming a sacrificial layer on a front surface of the substrate, forming a membrane within the sacrificial layer, forming a fixed plate on the sacrificial layer at a location corresponding to a location of the membrane, performing a laser cutting on the back surface of the substrate at a location corresponding to an edge region of the fixed plate until a surface of the sacrificial layer is expose to form an opening, forming a patterned photoresist layer on the back surface exposing a region within the boundary of the opening, removing a portion of the back surface using the patterned photoresist layer as a mask to form a cavity, and removing a portion of the sacrificial layer above and below the membrane to form an air gap between the membrane and the fixed plate.. .
Semiconductor Manufacturing International (shanghai) Corporation


03/24/16
20160088402 

Capacitive micro-electro-mechanical system microphone and manufacturing the same


The invention relates to a capacitive mems microphone and a method for manufacturing the same. The microphone includes: a substrate; a first dielectric supporting layer on the substrate; a movable sensitive layer formed on the first dielectric supporting layer and having a movable diaphragm extending within the air; a backplate disposed over the movable sensitive layer and spaced from the movable diaphragm; a chamber recessed from and extending through the substrate and the first dielectric supporting layer; and an impact resisting device connecting to the movable diaphragm.
Memsensing Microsystems (suzhou, China) Co., Ltd.


03/24/16
20160087628 

Device and micro-electro-mechanical-system photonic switch


In one embodiment, a method includes reflecting, by a first mirror of a first mirror array of a micro-electro-mechanical system (mems) photonic switch, an optical control beam to produce an optical control beam spot on a second mirror array of the mems photonic switch and cyclic dithering of the first mirror to effective enlargement of a size of the optical control beam spot. The method also includes detecting, by a first photodiode having a first location on the second mirror array, a first intensity of the optical control beam spot..
Huawei Technologies Co., Ltd.


03/24/16
20160087606 

Packaged mems device and calibrating a packaged mems device


A packaged mems device and a method of calibrating a packaged mems device are disclosed. In one embodiment a packaged mems device comprises a carrier, a mems device disposed on the substrate, a signal processing device disposed on the carrier, a validation circuit disposed on the carrier; and an encapsulation disposed on the carrier, wherein the encapsulation encapsulates the mems device, the signal processing device and the memory element..
Infineon Technologies Ag


03/24/16
20160087550 

Vibrator, electronic apparatus, and moving object


To reduce concentration of stress near a connection of a connection portion between a support portion and a fixed base portion of a vibration section of a mems vibrator and to achieve a reduction in vibration leakage, a structure of the vibrator includes a portion which extends from a fixed base portion and supports a vibration section and of which a width decreases in a direction directed from the fixed base portion to the vibration section.. .
Seiko Epson Corporation


03/24/16
20160085084 

Projection device


According to the present invention there is provided a projection device (30,50,100) comprising, a light source (31,61) which can provide light beams (32a,b,c 62a,b,c), wherein the light beams (32a,b,c 62a,b,c) can be used to define one or more pixels of a virtual image (48); a mems micro mirror (34) which is arranged to receive the light beams (32a,b,c 62a,b,c) provided by the light source (31,61), and wherein the mems micro mirror (34) can oscillate about at least one oscillation axis (7,17) to scan the light beams (32a,b,c 62a,b,c); a reflective element (38), which comprises a plurality of convex reflective projections (39), and wherein the reflective element (38) is arranged so that light beams (32a,b,c 62a,b,c) reflected by the mems micro mirror (34) are incident on said convex reflective projections (39), so that the light beams (32a,b,c 62a,b,c) are reflected by the convex reflective projections (39); a beam combiner (45,81), wherein the beam combiner is arranged to receive the light beams (32a,b,c 62a,b,c) which are reflected by the convex reflective projections (39) wherein the beam combiner (45,81) is configured to at least partially reflect the light beams (32a,b,c 62a,b,c) which it receives so that the light beams (32a,b,c 62a,b,c) can form a virtual image (48) which is visible when viewed from within an eyebox (47). There is further provided a corresponding method of projecting a virtual image..
Intel Corporation


03/24/16
20160085067 

High power handling optical spatial light modulator


Laser-based material processing systems including a micro-electromechanical system devices (mems) based reflective, optical modulator with dielectric mirrors for high power handling and methods of manufacturing and using the same are described. Generally, the system includes a workpiece support, a laser, a workpiece support, a laser, a mems based reflective, optical modulator to modulate a beam generated by the laser; and imaging optics to direct modulated light from the optical modulator onto a workpiece on the workpiece support.
Silicon Light Machines Corporation


03/24/16
20160085066 

Device and micro-electro-mechanical-system photonic switch


In one embodiment, a method of aligning mirrors of a micro-electro-mechanical system (mems) photonic switch includes illuminating a first group of photodiodes associated with a first mirror of a first mirror array of the mems photonic switch by a first control beam during a first period of time and illuminating a second group of photodiodes associated with a second mirror of the first mirror array by a second control beam during a second period of time, where the second control beam is off during the first period of time, where the first control beam is off during the second period of time, and where the second period of time is after the first period of time. The method also includes illuminating the first group of photodiodes by the first control beam during a third period of time, where the second control beam is off during the third period of time, and where the third period of time is after the second period of time..
Huawei Technologies Co., Ltd.


03/24/16
20160084872 

Three-axis microelectromechanical systems devices


The embodiments described herein provide microelectromechanical systems (mems) devices, such as three-axis mems devices that can sense acceleration in three orthogonal axes (e.g., x-axis, y-axis, and z-axis). In general, the embodiments described can provide decoupling between the sense motions of all three axes from each other.
Freescale Semiconductor, Inc.


03/24/16
20160084729 

Directional ultrasonic gas leak detector


An embodiment of a directional ultrasonic gas leak detector includes an array of spaced mems microphones, each responsive to incident airborne ultrasonic energy from gas leak sources to generate a microphone signal. A beamforming processor is responsive to the microphone signals from the array to generate processor output signals indicative of estimated angles of arrival of ultrasonic energy incident on the array.
General Monitors, Inc.


03/24/16
20160083249 

Mems device with differential vertical sense electrodes


A mems device includes a first sense electrode and a first portion of a sense mass formed in a first structural layer, where the first sense electrode is fixedly coupled with the substrate and the first portion of the sense mass is suspended over the substrate. The mems device further includes a second sense electrode and a second portion of the sense mass formed in a second structural layer.
Freescale Semiconductor, Inc.


03/24/16
20160083248 

Mems device and fabrication method thereof


The present disclosure provides a method for forming micro-electro-mechanical-system (mems) devices. The method includes providing a plurality of wafers; bonding a front surface of at least a first wafer onto a front surface of a second wafer; trimming an edge of and thinning the at least first wafer after the at least first wafer is bonded onto the second wafer; and bonding a first supporting plate onto a front surface of a third wafer.
Semiconductor Manufacturing International (shanghai) Corporation


03/24/16
20160083247 

Method for mems structure with dual-level structural layer and acoustic port


A method for fabricating a mems device includes depositing and patterning a first sacrificial layer onto a silicon substrate, the first sacrificial layer being partially removed leaving a first remaining oxide. Further, the method includes depositing a conductive structure layer onto the silicon substrate, the conductive structure layer making physical contact with at least a portion of the silicon substrate.
Invensense, Inc.


03/24/16
20160083246 

Mems device and process


A mems capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes.
Cirrus Logic International Semiconductor Ltd.


03/24/16
20160083245 

Planar cavity mems and related structures, methods of manufacture and design structures


A method of forming a micro-electro-mechanical system (mems) includes forming a lower electrode on a first insulator layer within a cavity of the mems. The method further includes forming an upper electrode over another insulator material on top of the lower electrode which is at least partially in contact with the lower electrode.
International Business Machines Corporation


03/24/16
20160082480 

Particle manipulation system with cytometric capability


A mems-based particle manipulation system which uses a particle manipulation stage and a plurality of laser interrogation regions. The laser interrogation regions may be used to assess the effectiveness or accuracy of the particle manipulation stage.
Owl Biomedical, Inc.


03/24/16
20160082042 

Use of mesenchymal stem cell-educated macrophages to treat and prevent graft versus host disease and radiation-induced injury


The present invention relates to methods for treating and preventing graft-versus-host disease (gvhd) and radiation-induced tissue damage or organ failure. More particularly, methods of the present invention comprise administering a therapeutically effective amount of mesenchymal stem cell-educated macrophages (mems) to a subject to treat or prevent gvhd, bone marrow failure, radiation-induced tissue damage or organ failure, or a condition associated with aberrant inflammation..
Wisconsin Alumni Research Foundation


03/17/16
20160080871 

Mems device with acoustic leak control features


A microelectromechanical system (mems) microphone in one embodiment includes a backplate, a back cavity aligned with the backplate, at least one post extending from the backplate toward the back cavity, a membrane positioned between the backplate and the back cavity and including an inner portion and an outer portion, a gap defined by a planar portion of the inner portion and the backplate, a spring arm defined in the outer portion and supported by the at least one post, a first leak path between the back cavity and the gap defined between the inner portion and the spring arm, a second leak path between the back cavity and the gap defined between the spring arm and the back cavity, and a first leak path constriction configured to restrict leakage through at least one of the first leak path and the second leak path.. .
Akustica, Inc.


03/17/16
20160079953 

Integrated mems and ic systems and related methods


An integrated mems and ic system (memsic), as well as related methods, are described herein. According to some embodiments, a mechanical resonating structure is coupled to an electrical circuit (e.g., field-effect transistor).
Trustees Of Boston University


03/17/16
20160079003 

Method of controlling mems variable capacitor and integrated circuit device


According to one embodiment, a method of controlling a mems variable capacitor includes first and second electrodes, and having a capacitance varying according to a voltage applied between the first and second electrodes, the method includes applying a voltage between the first and second electrodes, evaluating whether the capacitance of the mems variable capacitor satisfies a predetermined condition while the voltage is being applied between the first and second electrodes, and determining that the voltage applied between the first and second electrodes is a voltage which should be applied therebetween, on a condition that the capacitance of the mems variable capacitor is evaluated as satisfying the predetermined condition.. .
Kabushiki Kaisha Toshiba


03/17/16
20160077126 

Apparatus and calibration of capacitance mismatch and temperature variations in a mems device


A system and calibration method utilizes time averaging to suppress inherent capacitance mismatches or temperature variations in mems devices, such as a tri-axial accelerometer. An calibration interface circuit, operatively coupled the mems sensor, effectively cancels a range of non-ideal capacitive mismatches by employing pockets of calibration charges that are controlled by the duty-cycle of a clock..

03/17/16
20160077078 

Reducing background fluorescence in mems materials by low energy ion beam treatment


Methods for fabricating materials useful for optical detection in microfluidic and nanofluidic devices, such as those used in nanopore-based nucleic acid sequencing are described herein. In certain variations, a method of reducing background fluorescence in a mems material may include the step of treating a surface of the mems material with a low energy ion beam..
Quantapore, Inc.


03/17/16
20160076953 

Flexible sensors and related systems for determining forces applied to an object, such as a surgical instrument, and methods for manufacturing same


Methods of manufacturing a flexible force sensor include forming a first sensor part providing a plurality of spaced first electrode plates in an electrically non-conductive material. A second sensor part is also formed and includes a plurality of second electrode plates in an electrically non-conductive material.
Regents Of The University Of Minnesota


03/17/16
20160075554 

Internal barrier for enclosed mems devices


A mems device having a channel configured to avoid particle contamination is disclosed. The mems device includes a mems substrate and a base substrate.
Invensense, Inc.


03/17/16
20160075553 

Sensor protective coating


A microelectromechanical system (mems) sensor device includes a substrate, a support structure supported by the substrate, a membrane supported by the support structure and spaced from the substrate, and a polymer layer covering the membrane.. .
Freescale Semiconductor, Inc.


03/17/16
20160075551 

Backside bulk silicon mems


An integrated circuit device that comprises a single semiconductor substrate, a device layer formed on a frontside of the single semiconductor substrate, a redistribution layer formed on a backside of the single semiconductor substrate, a through silicon via (tsv) formed within the single semiconductor substrate that is electrically coupled to the device layer and to the redistribution layer, a logic-memory interface (lmi) formed on a backside of the single semiconductor substrate that is electrically coupled to the redistribution layer, and a mems device formed on the backside of the single semiconductor substrate that is electrically coupled to the redistribution layer.. .
Intel Corporation


03/17/16
20160075550 

Mems element and manufacturing the same


According to one embodiment, a mems element is disclosed. The element includes a substrate, a first electrode provided on the substrate, a second electrode disposed above the first electrode, a film including a connection hole defined by an inner wall communicating with the second electrode, the film and the substrate constituting a cavity in which the first electrode and the second electrode are contained.
Kabushiki Kaisha Toshiba


03/17/16
20160075548 

Multi-phased mems plate lowering and lifting system and method


A mems device includes a bottom plate structure supporting a conductive electrode. A flexible conductive top plate movably supported by a flexure is affixed to a small peripheral portion of the top plate that is aligned with the electrode.
Texas Instruments Incorporated


03/17/16
20160074587 

System and capturing dose information


A system for capture of dose delivery information is provided. The system includes a medication delivery device, a dose information capture device adapted to be attached to the medication delivery device, and a target element adapted to be attached to the medication delivery device.
Becton, Dickinson And Company


03/17/16
20160073920 

Hybrid metal and carbon or glassy carbon mems u-ecog electrode and microelectrode structures


Microelectromechanical system are disclosed that include at least one electrode, microelectrode or combination thereof, wherein the at least one electrode comprises a carbon material, a glassy carbon material or a combination thereof. Contemplated systems are suitable for μ-ecog arrays.
San Diego State University Research Foundation (sdsurf)


03/10/16
20160073212 

High-voltage reset mems microphone network and detecting defects thereof


A method of detecting defects in a high impedance network of a mems microphone sensor interface circuit. The method includes adding a high-voltage reset switch to a high-voltage high impedance network, closing the high-voltage reset switch during a start-up phase of the mems microphone sensor interface circuit, simultaneously closing a low-voltage reset switch of a low-voltage high impedance network during the start-up phase, simultaneously opening the high-voltage reset switch and the low-voltage reset switch at the end of the start-up phase, and detecting a defect in the high-voltage high impedance network or the low-voltage high impedance network immediately after opening the high-voltage reset switch and the low-voltage reset switch..
Robert Bosch Gmbh


03/10/16
20160072469 

Switchable filters and design structures


Switchable and/or tunable filters, methods of manufacture and design structures are disclosed herein. The method of forming the filters includes forming at least one piezoelectric filter structure comprising a plurality of electrodes formed on a piezoelectric substrate.
International Business Machines Corporation


03/10/16
20160072412 

Energy harvesting with a micro-electro-mechanical system (mems)


Apparatuses and method are described to create an energy harvesting microstructure, referred to herein as a transduction micro-electro mechanical system (t-mems). A t-mems includes a substrate, a first buckled membrane, the first buckled membrane has a buckling axis and is connected to the substrate.
Duality Reality Energy, Llc


03/10/16
20160072408 

Method and technique to control mems dvc control waveform for lifetime enhancement


The present invention generally relates to a method of operating a mems dvc while minimizing impact of the mems device on contact surfaces. By reducing the drive voltage upon the pull-in movement of the mems device, the acceleration of the mems device towards the contact surface is reduced and thus, the impact velocity is reduced and less damage of the mems dvc device occurs..
Cavendish Kinetics, Inc


03/10/16
20160071416 

System and detecting obstacles


The present invention provides an obstacle detecting system and method. The obstacle detecting system includes: a transmitting unit which emits a laser signal; a mems scanning mirror which scans detecting regions set at an angle of view at which obstacles in front of a vehicle are detected and a cut-in situation when a vehicle in a next lane suddenly cuts in is detected, and divides the detecting regions into a plurality of regions to scan the plurality of regions at different point intervals; a receiving unit which receives the laser signal transmitted from the mems scanning mirror to detect information on an object detected in the detecting regions; and a processing unit which detects the obstacles and the cut-in situation through the information detected in the receiving unit to issue an alarm or transmit a braking command..
Hyundai Mobis Co., Ltd.


03/10/16
20160068388 

Release chemical protection for integrated complementary metal-oxide-semiconductor (cmos) and micro-electro-mechanical (mems) devices


Systems and methods that protect cmos layers from exposure to a release chemical are provided. The release chemical is utilized to release a micro-electro-mechanical (mems) device integrated with the cmos wafer.
Invensense, Inc.


03/10/16
20160068387 

Semiconductor cavity package using photosensitive resin


A packaged device (100) with a semiconductor chip (101) with a mems device (102) in the central chip area, wherein the package includes a light-sensitive first (150) and an opaque second (160) polymerized compound. The second compound (160) encapsulates the chip peripheral areas with the terminals (103) and wire bonds (130), and forms a sidewall (160a, diameter 112) around the un-encapsulated central area.
Texas Instruments Incorporated


03/10/16
20160068386 

Capacitive sensing structure with embedded acoustic channels


A mems device includes a dual membrane, an electrode, and an interconnecting structure. The dual membrane has a top membrane and a bottom membrane.
Invensense, Inc.


03/03/16
20160066099 

Mems microphone with low pressure region between diaphragm and counter electrode


A mems microphone includes a first diaphragm element, a counter electrode element, and a low pressure region between the first diaphragm element and the counter electrode element. The low pressure region has a pressure less than an ambient pressure..
Infineon Technologies Ag


03/03/16
20160065058 

Two-state charge-pump control-loop for mems dvc control


The present invention generally relates to a dvc having a charge-pump coupled to a mems device. The charge-pump is designed to control the output voltage delivered to the electrodes, such as the pull-in electrode or the pull-off electrode, that move the switching element within the mems device between locations spaced far from and disposed closely to the rf electrode..
Cavendish Kinetics, Inc


03/03/16
20160062463 

Nanowire enabled paper based haptic interfaces


Paper, as a ubiquitous material in everyday life, has recently emerged as flexible substrates for electronics. It offers a basis for functional electronic modules with advantages of low cost, ease of fabrication, good printability, high flexibility, and light weight.
The Royal Institution For The Advancement Of Learning / Mcgill University


03/03/16
20160062076 

Mems device


The disclosure provides a mems device including: a fixed substrate having a cavity; a driving unit disposed in the cavity and floating above the fixed substrate; and an elastic unit for physically connecting the fixed substrate with the driving unit and varying the height of the driving unit according to a control current, wherein the elastic unit includes a bimorph driving unit connected to the fixed substrate and bent according to the control current, a spring connected to the driving unit, and a frame connecting the bimorph driving unit to the spring. Therefore, in order to overcome the limitations according to the power consumption and the size-reduction due to a coil and a magnet, the mems device drives one lens and thus can reduce the power consumption and the size thereof.
Lg Innotek Co. Ltd.


03/03/16
20160060108 

Coatings for relatively movable surfaces


A device has a microelectromechanical system (mems) component with at least one surface and a coating disposed on at least a portion of the surface. The coating has a compound of the formula m(cnf2n+1or), wherein m is a polar head group and wherein n≧2r.
Texas Instruments Incorporated


03/03/16
20160060107 

Planar cavity mems and related structures, methods of manufacture and design structures


A method of forming at least one micro-electro-mechanical system (mems) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode.
International Business Machines Corporation


03/03/16
20160060105 

Mems device and manufacturing a mems device


A method for producing a mems device comprises forming a semiconductor layer stack, the semiconductor layer stack comprising at least a first monocrystalline semiconductor layer, a second monocrystalline semiconductor layer and a third monocrystalline semiconductor layer, the second monocrystalline semiconductor layer formed between the first and third monocrystalline semiconductor layers. A semiconductor material of the second monocrystalline semiconductor layer is different from semiconductor materials of the first and third monocrystalline semiconductor layers.
Infineon Technologies Ag


03/03/16
20160060104 

Mems integrated pressure sensor and microphone devices and methods of forming same


A method embodiment for forming a micro-electromechanical (mems) device includes providing a mems wafer, wherein a portion of the mems wafer is patterned to provide a first membrane for a microphone device and a second membrane for a pressure sensor device. A carrier wafer is bonded to the mems wafer, and the carrier wafer is etched to expose the first membrane for the microphone device to an ambient environment.
Taiwan Semiconductor Manufacturing Company, Ltd.


03/03/16
20160060103 

High vacuum sealing for sensor platform process


A method for manufacturing a microelectromechanical systems (mems) device is provided. According to the method, a semiconductor structure is provided.
Taiwan Semiconductor Manufacturing Co., Ltd.


03/03/16
20160060102 

Integrated cmos and mems devices with air dieletrics


A monolithically integrated cmos and mems device. The device includes a first semiconductor substrate having a first surface region and one or more cmos ic devices on a cmos ic device region overlying the first surface region.
Mcube, Inc.


03/03/16
20160060101 

Integrated cmos/mems microphone die components


The claim invention is directed at a mems microphone die fabricated using cmos-based technologies. In particular, the claims are directed at various aspects of a diaphragm for a mems microphone die which is fabricated as stacked metallic layers separated by vias using cmos fabrication technologies..
Knowles Electronics, Llc


03/03/16
20160060100 

Mems sensor integrated with a flip chip


A method and system for providing a mems sensor integrated with a flip chip are disclosed. In a first aspect, the system comprises a mems sensor, at least one flip chip coupled to the mems sensor, and at least one through-silicon via (tsv) that electrically connects the at least one flip chip to the mems sensor.
Invensense, Inc.


03/03/16
20160060099 

Planar cavity mems and related structures, methods of manufacture and design structures


A method of forming at least one micro-electro-mechanical system (mems) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode.
International Business Machines Corporation


03/03/16
20160060098 

Micro electro mechanical system


According to an embodiment, a mems includes a substrate; a substrate; a membrane arranged above the substrate; a first conductor with a first plane, the first conductor being connected to the membrane; and a second conductor with a second plane facing the first plane, the second conductor being arranged with a gap between the first conductor and the second conductor, wherein relative positions of the first conductor and the second conductor change in a direction in which an area of the first plane facing the second plane changes.. .
Kabushiki Kaisha Toshiba




Mems topics: Camera Module, Acceleration Sensor, Microelectromechanical Systems, Control Unit, Semiconductor Substrate, Semiconductor, Demodulation, Accelerometer, Calibration, Modulation, Mems Devices

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