|| List of recent Mems-related patents
|Dynamic orthoscopic sensing|
A dynamic sensing method and apparatus employs microelectromechanical systems (mems) and nanoelectromechanical (nems) surgical sensors for gathering and reporting surgical parameters pertaining to a drive mechanism of a surgical device, such as speed, rotation, torque and other characteristics of the surgical device. The surgical device employs or affixes the surgical sensor on or about a surgical device for detecting electromechanical characteristics during the surgical procedure.
|Dual layer microelectromechanical systems device and method of manufacturing same|
Exemplary microelectromechanical system (mems) devices, and methods for fabricating such are disclosed. An exemplary method includes providing a silicon-on-insulator (soi) substrate, wherein the soi substrate includes a first silicon layer separated from a second silicon layer by an insulator layer; processing the first silicon layer to form a first structure layer of a mems device; bonding the first structure layer to a substrate; and processing the second silicon layer to form a second structure layer of the mems device..
|Mems microdisplay optical imaging and sensor systems for underwater and other scattering environments|
A sensing system is provided that includes a transmitter assembly with a light source and a microdisplay device, wherein the transmitter assembly defines an optical beam transmission path to provide illumination of a substantially one-dimensional (1d) region of a target area, the microdisplay device comprising a plurality of controllable elements for causing the illumination to be a substantially 1d pattern of light along the 1d region. The system further includes a receiver assembly for defining a return optical signal transmission path from the 1d region and collecting return optical signals from the 1d region.
|Asymmetric travel for mems light modulator|
Systems, apparatuses and methods are provided for increasing the aperture ratio of a display by increasing the total travel distance of respective light modulating bodies in a display while maintaining fast switching speeds. Increasing the total travel distance allows for a larger aperture ratio in a display, which provides greater power savings and increased display brightness.
|Tunable cavity resonator including a plurality of mems beams|
A tunable cavity resonator includes a substrate, a cap structure, and a tuning assembly. The cap structure extends from the substrate, and at least one of the substrate and the cap structure defines a resonator cavity.
|Electron emission device|
Provided herein are electron emission devices and device components for optical, electronic and optoelectronic devices, including cantilever-based mems and nems instrumentation. Devices of certain aspects of the invention integrate a dielectric, pyroelectric, piezoelectric or ferroelectric film on the receiving surface of a substrate having an integrated actuator, such as a temperature controller or mechanical actuator, optionally in the form of a cantilever device having an integrated heater-thermometer.
|Micro-electro mechanical system (mems) structures and methods of forming the same|
A device includes a first substrate bonded with a second substrate structure. The second substrate structure includes an outgasing prevention structure.
|Method of modifying surfaces|
The invention provides a method for chemically modifying a surface of a substrate, preferably a silicon substrate, including the steps of providing a substrate having at least a portion of a surface thereof coated with an organic coating composition including unsaturated moieties forming a surface coating, and introducing a vapour phase reactive intermediate species based on a group 14 or group 15 element from the periodic table of elements to the substrate whereupon the reactive intermediate species is able to react with a number of the unsaturated moieties in the coating composition thereby chemically modifying the surface coating. Also disclosed is a surface-modified substrate obtained or obtainable by the method, and uses thereof in the fabrication of mems and ic devices..
|Integration of laminate mems in bbul coreless package|
An apparatus including a die including a first side and an opposite second side including a device side with contact points and lateral sidewalls defining a thickness of the die; a build-up carrier coupled to the second side of the die, the build-up carrier including a plurality of alternating layers of conductive material and insulating material, wherein at least one of the layers of conductive material is coupled to one of the contact points of the die; and at least one device within the build-up carrier disposed in an area void of a layer of patterned conductive material. A method and an apparatus including a computing device including a package including a microprocessor are also disclosed..
|Low-cost process-independent rf mems switch|
A mems switch includes a semiconductor substrate, a movable cantilever and a cantilever anchor. The semiconductor substrate includes a device layer and a handle.
|Process for manufacturing an integrated membrane of nozzles in mems technology for a spray device and spray device using such membrane|
A process for manufacturing a membrane of nozzles of a spray device, comprising the steps of laying a substrate, forming a membrane layer on the substrate, forming a plurality of nozzles in the membrane layer, forming a plurality of supply channels in the substrate, each supply channel being substantially aligned in a vertical direction to a respective nozzle of the plurality of nozzles and in direct communication with the respective nozzle.. .
|Pressure sensor using mems resonator|
A pressure sensor including: a mems resonator; a sweeping unit which sweeps a frequency of an excitation signal in a predetermined direction of sweeping, over a predetermined frequency range including a resonance frequency f0 of a vibrator in the mems resonator, while outputting the excitation signal to the mems resonator; an integrating unit which inputs a vibrating-state information signal as a characteristic amount indicative of a vibrating state of the vibrator from the mems resonator while the sweeping unit sweeps the frequency, integrates a plurality of the vibrating-state information signals at different frequencies of the excitation signal, and outputs the integrated value; and a conversion unit adapted to determine a pressure acting on the mems resonator, based on the integrated value.. .
|Systems and method for gyroscope calibration|
A mechanism by which a mems gyroscope sensor can be calibrated using data gathered from other sensors in a system incorporating the mems gyroscope sensor is provided. Data gathered from an accelerometer and a magnetometer in fixed orientation relative to the gyroscope is used to calculate changes in orientation of a system.
|Method and structure for adding mass with stress isolation to mems structures|
A method and structure for adding mass with stress isolation to mems. The structure has a thickness of silicon material coupled to at least one flexible element.
|Method for accurate and low-consumption mems micropump actuation and device for carrying out said method|
The present invention describes the improvements due to alternated actuation cycles to reduce the delivery errors related to the pumping chamber elasticity, the actuator relaxation or hysteresis. The method actuates a pumping device with an optimal driving voltage profile, wherein the pumping device comprises a pumping chamber including a pumping membrane and a voltage controlled actuator connected to said membrane; the movement of said membrane being defined by three positions, namely a rest, a bottom and a top position.
|Comb mems device and method of making a comb mems device|
A mems device and a method to manufacture a mems device are disclosed. An embodiment includes forming trenches in a first main surface of a substrate, forming conductive fingers by forming a conductive material in the trenches and forming an opening from a second main surface of the substrate thereby exposing the conductive fingers, the second main surface opposite the first main surface..
|Mems device with polymer layer, system of a mems device with a polymer layer, method of making a mems device with a polymer layer|
A mems device, a method of making a mems device and a system of a mems device are shown. In one embodiment, a mems device includes a first polymer layer, a mems substrate disposed on the first polymer layer and a mems structure supported by the mems substrate.
|Safe and arm explosive train|
A safe-and-arm system for the prevention of unintentional operation of an explosive device by interrupting a detonation train, the system employing an interruptive transfer assembly made of silicon and suitable for implementing in a mems device, the assembly including a silicon based transfer charge carrier on a porous explosive passageway made by etching, the passageway extending between at least two ports on the circumference of the transfer assembly, and a drive means that can mechanically bring about at least one armed state of a detonation train.. .
|Bidirectional mems driving arrangement|
A micro-electromechanical system (mems) driving arrangement comprising a driven wheel comprising (n) teeth about an outer periphery thereof, an actuator ring around the driven wheel, itself comprising (n)+(x) teeth about an inner periphery thereof, wherein the (n)+(x) teeth of the actuator ring progressively engage and disengage subsets of the (n) teeth of the driven wheel; a driving actuation assembly, coupled to the actuator ring, for driving the actuator ring in a hysteresis-type motion so as to cause rotation of the driven wheel, wherein after one full cycle of engagements and disengagements between selective subsets of the (n) teeth of the driven wheel with selective subsets of the (n)+(x) teeth of the actuator ring, the driven wheel rotates by (x) teeth corresponding to [(360)(x)/(n)]°.. .
|Socket type mems bonding|
A method for fabricating an integrated circuit device is disclosed. The method includes providing a first substrate; bonding a second substrate to the first substrate, the second substrate including a microeelectromechanical system (mems) device; and bonding a third substrate to the first substrate..
|Rapid auto-focus using classifier chains, mems and multiple object focusing|
A smart-focusing technique includes identifying an object of interest, such as a face, in a digital image. A focus-generic classifier chain is applied that is trained to match both focused and unfocused faces and/or data from a face tracking module is accepted.
|Mems device with sloped support|
A microelectromechanical (mems) device has a movable member supported in elevated position spaced by a sloped support structure above a substrate. The movable member may be a polished metallic plate such as a mirror of a digital micromirror device (dmd) supported by a flexible hinge above an integrated circuit wafer die region.
|Spatial splitting-based optical mems interferometers|
A spatial splitting-based optical micro electro-mechanical systems (mems) interferometer includes a spatial splitter for spatially splitting an input beam into two interferometer beams and a spatial combiner for spatially combining the two interferometer beams. A mems moveable mirror is provided to produce an optical path difference between the first interferometer beam and the second interferometer beam..
|Touchscreen displays incorporating dynamic transmitters|
Systems and methods for implementing touchscreen displays that utilize a transmitter system to dynamically scan at least one light beam across a surface of interest such that substantially every point in a region above the surface of interest is dynamically scanned by a light beam from two directions, a receiver system to receive and detect the at least one dynamically scanned light beams, and a processor configured to determine locations of contact are provided. The systems and methods may utilize a transmitter system that includes dynamic transmitters, which may be in the form mems micromirrors used in conjunction with infrared semiconductor lasers..
A mems switch has fixed support, a plate-shaped flexible beam having at least one end immovably supported by the fixed support and having an extending movable surface, a movable electric contact disposed on the movable surface of the flexible beam, a fixed electric contact facing the movable electric contact and disposed at a fixed position relative to the fixed support, first piezoelectric driver disposed above the movable surface of the flexible beam, extending from a portion above the fixed support towards the movable electric contact, and capable of displacing the movable electric contact towards the fixed electric contact by voltage driving, and second piezoelectric driver disposed at least on the movable surface of the flexible beam and capable of so driving a movable part of the flexible beam by voltage driving that the movable electric contact is separated from the fixed electric contact.. .
|Mems process and device|
A method of fabricating a micro-electrical-mechanical system (mems) transducer comprises the steps of forming a membrane on a substrate, and forming a back-volume in the substrate. The step of forming a back-volume in the substrate comprises the steps of forming a first back-volume portion and a second back-volume portion, the first back-volume portion being separated from the second back-volume portion by a step in a sidewall of the back-volume.
There is provided a mems sensor including a signal processing lsi equipped with a temperature sensor for measuring temperature of a sensor, and a mems sensor chip overlaid on the signal processing lsi, the mems sensor chip being mounted on a heat generating part of the signal processing lsi. This mems sensor decreases the effects caused by thermally triggered changes in temperature characteristics..
|Method and apparatus for a semiconductor structure|
A semiconductor structure may include a first device having first surface with a first bonding layer formed thereon and a second device having a first surface with a second bonding layer formed thereon. The first bonding layer may provide an electrically conductive path to at least one electrical device in the first device.
A 2-chip mems microphone component includes: at least one first mems microphone structural component having at least one first microphone structure formed in the front side of the structural component; an asic structural component having evaluation electronics for the microphone signal of the mems microphone structural component; and a housing having a sound opening. The mems microphone structural component is mounted within the housing and above the sound opening in such a way that the rear side of the microphone structure is acted on by the sound pressure.
Disclosed herein is a mems apparatus comprising a substrate with an etched area, a proof mass disposed at the center of the etched area, and beams supporting the proof mass. The beams are disposed between peripheries of the substrate and the proof mass.
|Mems tunneling micro seismic sensor|
A tunneling accelerometer that can be implemented as a mems micro sensor provides differential sensing that minimizes large forces resulting from undesired environmental effects. Used as a seismic sensor, for example, the accelerometer exhibits maximum sensitivity for small seismic waves and suppresses very large seismic activities occurring at shallower depths.
|Mems device and a method of using the same|
A method of using a mems gyroscope is disclosed herein, wherein the mems gyroscope comprised a magnetic sensing mechanism. A magnetic field is generated by a magnetic source, and is detected by a magnetic sensor.
|Mems mass flow sensor assembly and method of making the same|
A silicon mass flow sensor manufacture process that enables the backside contacts and eliminates the conventional front side wire binding process, and the assembly of such a mass flow sensor is disclosed in the present invention. The achieved assembly enhances the reliability by eliminating the binding wire exposure to the flow medium that may lead to detrimental failure due to the wire shortage or breakage while the miniature footprint could be maintained.
|Micromachined flow sensor integrated with flow inception detection and make of the same|
This invention is related to a microfabricated microelectromechanical systems (a.k.a. Mems) silicon thermal mass flow sensor integrated with a micromachined thermopile temperature sensor as a flow inception detection sensor.
|Method and system of mask data preparation for curvilinear mask patterns for a device|
A method comprises: (a) transforming a layout of a layer of an integrated circuit (ic) or micro electro-mechanical system (mems) to a curvilinear mask layout; (b) replacing at least one pattern of the curvilinear mask layout with a previously stored fracturing template having approximately the same shape as the pattern, to form a fractured ic or mems layout; and (c) storing, in a non-transitory storage medium, an e-beam generation file including a representation of the fractured ic or mems layout, to be used for fabricating a photomask.. .
|Manufacturing methods for micro-electromechanical system device having electrical insulating structure|
The disclosure relates to a micro-electromechanical system (mems) device having an electrical insulating structure. The mems device includes at least one moving part, at least one anchor, at least one spring and an insulating layer.
|Hybrid mems bump design to prevent in-process and in-use stiction|
A micro-electro-mechanical systems (mems) device and method for forming a mems device is provided. A proof mass is suspended a distance above a surface of a substrate by a fulcrum.
|Multi directional multiplexer|
Described herein is an optical transmission cross-connect for routing wavelength signals to a bank of directionless transceivers. One embodiment (1) includes an array of four common-port fibers (3) for transmitting and receiving a multiplexed optical signal and an array of sixteen add/drop fibers (5) for receiving and transmitting demultiplexed signals including individual wavelength channels.
|Auto-focus camera module with mems distance measurement|
A mems actuator for an auto-focus camera module is coupled with a capacitance measurement component configured to determine mems actuator capacitance values to be used to determine motion and displacement of the camera module, the optical module and/or one or more movable lenses thereof, and to adapt a position and alignment of the one or more movable lenses to account for a specific focus distance.. .
|Auto-focus camera module with mems capacitance estimator|
A mems actuator for a compact auto-focus camera module is configured to measure physical values and to estimated values each indicative of position or motion or both of a mems component. A smart logic component determines a set of mems driver control values based on analyzing the measured physical values and substituting estimated values to more accurately position the mems component.
|Auto-focus camera module with mems closed loop compensator|
A mems actuator for a compact camera couples with an alignment compensation component for generating alignment compensation signals to position and align one or more movable lenses to account for a specific focus distance and for a camera module orientation and nonlinear displacement property of the one or more movable lenses.. .
|Microelectronic machine-based variable resonator|
A tunable resonator is provided that has a high q for each resonate frequency. The tunable resonator is a mems tunable resonator wherein the tuner is affected by moving a moveable mass, associated with the resonating portion of the resonator, form a first position to a second position such that the moveable mass is held in the first position or second position by a detent rather than a constant electromagnet magnetic or electrostatic force applied thereon..
|Microelectromechanical system-based resonator device|
The disclosure provides a structure for a microelectromechanical system (mems)-based resonator device. The structure for the mems-based resonator device includes at least one resonator unit.
|Hybrid radio frequency component|
Methods and systems may provide for a hybrid rf mems component design including an electrostatic actuation and a piezoelectric actuation. In one example, the method may include applying a first voltage to generate a first piezoelectric force to reduce a first gap between a cantilever and an actuation electrode, and applying a second voltage to generate an electrostatic force to create contact between the cantilever and a transmission electrode..
|Vibrator, oscillator, electronic apparatus, moving object, and method of manufacturing vibrator|
An mems vibrator includes a substrate, a fixation section disposed above a principal surface of the substrate, a support section extending from the fixation section, and a vibrating body (an upper electrode) separated from the substrate and supported by the support section in a node part of a vibration, and the vibrating body is a 2n-fold rotationally symmetric body having 2n beams radially extending from a node part of a vibration, wherein n is a natural number.. .
|Fabricating polysilicon mos devices and passive esd devices|
A semiconductor fabrication is described, wherein a mos device and a mems device is fabricated simultaneously in the beol process. A silicon layer is deposited and etched to form a silicon film for a mos device and a lower silicon sacrificial film for a mems device.
|Optically controlled mems switch and method of using the same|
The present embodiments are directed towards the optical control of switching an electrical assembly. For example, in an embodiment, an electrical package is provided.
|Method of obtaining patters in an antireflective layer|
The invention relates to the field of production in thin coatings of electronic devices and/or mems and relates to an improved method for forming a pattern in a thin siarc anti-reflective coating, comprising the doping by deposition of such siarc coating covered with a resist pattern through a protective coating of the resist pattern, then etching the doped zones of the siarc coating (fig. 3c)..
|Mems based membrane sensor system and method of use|
A mems sensor system for monitoring membrane elements in a membrane based water filtration plant having a remote telemetry unit (rtu), a scada, and a plurality of mems sensors for measuring pressure, flow rate. And conductivity.
|Digital microphone with frequency booster|
A digital microphone, the microphone includes a microelectromechanical (mems) component and a frequency boost component. The mems component is configured to convert.
|Apparatus and method for high voltage i/o electro-static discharge protection|
An electronics chip includes a charge pump and at least one high voltage (hv) electro-static discharge (esd) module. The charge pump is configured to provide a predetermined voltage across a microphone.
|Oct system with bonded mems tunable mirror vcsel swept source|
A microelectromechanical systems (mems)-tunable vertical-cavity surface-emitting laser (vcsel) in which the mems mirror is a bonded to the active region. This allows for a separate electrostatic cavity, that is outside the laser's optical resonant cavity.
|Filter that is variable by means of a capacitor that is switched using mems components|
A tunable filter comprises at least two resonator circuits placed between two matching networks characterized in that: one resonator is connected at a first of its ends to the ground plane m of the filter by metallized holes and at a second end to a mems network; the distance between the two resonators forms an inter-resonator inductive coupling circuit; an inter-resonator coupling capacitor is formed by two etched lines connected to the first and second resonators; the mems networks are distributed around the ends of the resonators; the mems networks are connected between the first and second resonator and the ground plane m by means of metallized holes; and the filter comprises a number of independent electrical control voltages designed to actuate the mems.. .
|Mems mass bias to track changes in bias conditions and reduce effects of flicker noise|
A technique for tracking changes in bias conditions of a microelectromechanical system (mems) device includes applying an electrode bias signal to an electrode of the mems device. The technique includes applying a mass bias signal to a mass of the mems device suspended from a substrate of the mems device.
|Use of electronic attenuator for mems oscillator overdrive protection|
An apparatus includes a microelectromechanical system (mems) device configured as part of an oscillator. The mems device includes a mass suspended from a substrate of the mems, a first electrode configured to provide a first signal based on a displacement of the mass, and a second electrode configured to receive a second signal based on the first signal.
|Circuit and method for dynamic offset compensation in a mems sensor device|
An offset-compensation circuit in a mems sensor device, provided with a micromechanical detection structure that transduces a quantity to be detected into an electrical detection quantity, and with an electronic reading circuit, coupled to the micromechanical detection structure for processing the electrical detection quantity and supplying an output signal, which is a function of the quantity to be detected. A compensation structure is electrically coupled to the input of the electronic reading circuit and can be controlled for generating an electrical compensation quantity, of a trimmable value, for compensating an offset on the output signal; the compensation circuit has a control unit, which reads the output signal during operation of the mems sensor device; obtains information on the offset present on the output signal itself; and controls the compensation structure as a function of the offset information..
|Soi wafer, manufacturing method therefor, and mems device|
In order to obtain a soi wafer having an excellent ability of gettering metal impurities, an efficient method of manufacturing a soi wafer, and a highly reliable mems device using such a soi wafer, provided is a soi wafer including: a support wafer (1) and an active layer wafer (6) which are bonded together with an oxide film (3) therebetween, each of the support wafer (1) and the active layer wafer (6) being a silicon wafer; a cavity (1b) formed in a bonding surface of at least one of the silicon wafers; and a gettering material (2) formed on a surface on a side opposite to the bonding surface.. .
|Mems device with multiple electrodes and fabricating method thereof|
A mems device with a first electrode, a second electrode and a third electrode is disclosed. These electrodes are disposed on a substrate in such a manner that (1) a pointing direction of the first electrode is in parallel with a normal direction of the substrate, (2) a pointing direction of the third electrode is perpendicular to the pointing direction of the first electrode, (3) the second electrode includes a sensing portion and a stationary portion, (4) the first electrode and the sensing portion are configured to define a sensing capacitor, and (5) the third electrode and the stationary portion are configured to define a reference capacitor.
|Micro electro mechanical system|
In order to provide a technology capable of suppressing degradation of measurement accuracy due to fluctuation of detection sensitivity of an mems by suppressing fluctuation in natural frequency of the mems caused by a stress, first, fixed portions 3a to 3d are displaced outward in a y-direction of a semiconductor substrate 2 by deformation of the semiconductor substrate 2. Since a movable body 5 is disposed in a state of floating above the semiconductor substrate 2, it is not affected and displaced by the deformation of the semiconductor substrate 2.
|Mems component for generating pressure pulses|
A mems component for generating pressure pulses is provided, its micromechanical structure including at least three function levels: a first function level in which at least one stationary trench structure is implemented, a second function level, which is implemented above the first function level and includes at least one triggerable displacement element as well as through-openings as pressure outlet openings, the displacement element protruding into the trench structure and being movable in parallel with the function levels, whereby positive and negative pressure pulses are generated, and a third function level, which is implemented above the second function level and includes at least one triggerable cover element for at least one part of the pressure outlet openings in the second function level.. .
|Sensor with an embedded thermistor for precise local temperature measurement|
A resistive temperature sensor (thermistor) for a microelectromechanical system (mems) device provides local temperatures of mems sensors and other mems devices for temperature compensation. Local accurate temperatures of the sensors and other devices provide for temperature compensation of such sensors or devices.
|Digital drive signals for analog mems ribbon arrays|
On/off digital drive signals are used to create arbitrary spatial and temporal ribbon movement patterns in mems ribbon arrays.. .
|Projection controlling method and mems projection apparatus|
A projection controlling method for controlling a mems scanning mirror to repeatedly scan an image light on a surface and form a projection image is provided. A resonance frequency of the mems scanning minor which swings around a first swing axis is detected and provided to a filter unit as a parameter of a filtering process.
|Resistive mems humidity sensor|
A semiconductor device includes a substrate, an insulating film provided on a surface of the substrate, and a sensing film formed of a conductive material deposited on top of the insulating film. The sensing film defines at least one conductive path between a first position and a second position on the insulating film.
|Mode-tuning sense interface|
A mems capacitive sensing interface includes a sense capacitor having a first terminal and a second terminal, and having associated therewith a first electrostatic force. Further included in the mems capacitive sensing interface is a feedback capacitor having a third terminal and a fourth terminal, the feedback capacitor having associated therewith a second electrostatic force.
|Coatings for relatively movable surfaces|
A device comprises a mems component comprising at least one surface and a coating disposed on at least a portion of the surface. The coating comprises a compound of the formula m(cnf2n+1or), wherein m comprises a polar head group, and wherein n≧2r.
|Monolithic package for housing microelectromechanical systems|
A sensor package for a microelectromechanical system (mems) is provided. The sensor package comprises a slot for receiving a mems, a bonding area in, or adjacent to, the slot for bonding the mems to the package and at least one package electrode to engage an electrode pad on the mems.
|Reducing mems stiction by deposition of nanoclusters|
A mechanism for reducing stiction in a mems device by decreasing surface area between two surfaces that can come into close contact is provided. Reduction in contact surface area is achieved by increasing surface roughness of one or both of the surfaces.
|Reducing mems stiction by introduction of a carbon barrier|
A mechanism for reducing stiction in a mems device by decreasing an amount of carbon from teos-based silicon oxide films that can accumulate on polysilicon surfaces during fabrication is provided. A carbon barrier material film is deposited between one or more polysilicon layer in a mems device and the teos-based silicon oxide layer.
|Ultrananocrystalline diamond films with optimized dielectric properties for advanced rf mems capacitive switches|
An efficient deposition process is provided for fabricating reliable rf mems capacitive switches with multilayer ultrananocrystalline (uncd) films for more rapid recovery, charging and discharging that is effective for more than a billion cycles of operation. Significantly, the deposition process is compatible for integration with cmos electronics and thereby can provide monolithically integrated rf mems capacitive switches for use with cmos electronic devices, such as for insertion into phase array antennas for radars and other rf communication systems..