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This page is updated frequently with new Mems-related patent applications.




Date/App# patent app List of recent Mems-related patents
08/18/16
20160241979 
 Monolithic complementary metal-oxide semiconductor (cmos) - integrated silicon microphone patent thumbnailnew patent Monolithic complementary metal-oxide semiconductor (cmos) - integrated silicon microphone
Some embodiments relate to a manufacturing process that combines a mems capacitor of a microelectromechanical systems (mems) microphone and an integrated circuit (ic) onto a single substrate. A dielectric is formed over a device substrate.
Taiwan Semiconductor Manufacturing Co., Ltd.


08/18/16
20160241965 
 Mems microphone and  forming the same patent thumbnailnew patent Mems microphone and forming the same
A micro-electro-mechanical system (mems) microphone and a method for forming the same are provided. The method includes: providing a first substrate including a first surface and a second surface opposite to each other; providing a second substrate including a third surface and a fourth surface opposite to each other; bonding the first surface of the first substrate and the third surface of the second substrate to each other; removing a second base of the second substrate to form a fifth surface opposite to the third surface of the second substrate; forming a cavity between the first substrate and the sensitive region of the second substrate; and forming a first conductive plug from the side of the fifth surface of the second substrate, with the first conductive plug passing through to at least one of the conductive layers..
Memsen Electronics Inc


08/18/16
20160241951 
 Top port multi-part surface mount silicon condenser microphone patent thumbnailnew patent Top port multi-part surface mount silicon condenser microphone
A surface mount package for a micro-electro-mechanical system (mems) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board.
Knowles Electronics, Llc


08/18/16
20160241248 
 Single insertion trimming of highly accurate reference oscillators patent thumbnailnew patent Single insertion trimming of highly accurate reference oscillators
A highly integrated monolithic self-compensated oscillator (sco) with high frequency stability versus temperature variations is described, together with a cost effective single insertion point trimming (spt) algorithm. The spt is utilized to adjust the phase and frequency of the sco to meet frequency stability versus temperature and frequency accuracy requirements for a reference clock.
Si-ware Systems


08/18/16
20160241146 
 Sensor data acquisition system with integrated power management patent thumbnailnew patent Sensor data acquisition system with integrated power management
A microelectromechanical systems (mems) sensor with an integrated power management system that performs analog to digital conversion of weak signals is provided. The mems sensor can include a switching regulator that steps a supply voltage down to a voltage appropriate for an analog to digital converter (a/d converter).
Invensense, Inc.


08/18/16
20160241022 
 Apparatus and  high voltage i/o electro-static discharge protection patent thumbnailnew patent Apparatus and high voltage i/o electro-static discharge protection
An electronics chip includes a charge pump and at least one high voltage (hv) electro-static discharge (esd) module. The charge pump is configured to provide a predetermined voltage across a microphone.
Knowles Electronics, Llc


08/18/16
20160240320 
 Curved rf electrode for improved cmax patent thumbnailnew patent Curved rf electrode for improved cmax
The present invention generally relates to a mems device and a method of manufacture thereof. The rf electrode, and hence, the dielectric layer thereover, has a curved upper surface that substantially matches the contact area of the bottom surface as of the movable plate.
Cavendish Kinetics, Inc.


08/18/16
20160238834 
 Hybrid mems scanning module patent thumbnailnew patent Hybrid mems scanning module
A scanning device includes a base containing one or more rotational bearings disposed along a gimbal axis. A gimbal includes a shaft that fits into the rotational bearings so that the gimbal rotates about the gimbal axis relative to the base.
Apple Inc.


08/18/16
20160238630 
 Mems tilt sensor patent thumbnailnew patent Mems tilt sensor
An acoustic sensor includes a back plate; at least one back plate electrode coupled to the back plate; a proof of mass with the proof of mass elastically coupled to the back plate; and a proof of mass electrode coupled to the proof of mass. Movement of the sensor causes a capacitance between the proof of mass electrode and the at least one back plate electrode to vary and the capacitance represents a magnitude of the movement of the sensor..
Knowles Electronics, Llc


08/18/16
20160238390 
 Mems anti-phase vibratory gyroscope patent thumbnailnew patent Mems anti-phase vibratory gyroscope
A mems anti-phase vibratory gyroscope includes two measurement masses with a top cap and a bottom cap each coupled with a respective measurement mass. The measurement masses are oppositely coupled with each other in the vertical direction.
Chinese Academy Of Sciences Institute Of Geology And Geophysics


08/18/16
20160238257 
new patent

Smart device for gas range


The design and assembly of a smart device constituent of a micro-machined (a.k.a. mems, micro electro mechanical systems) mass flow sensor and an electrically controllable valve for applications in safety enhancement and intermit connectivity for residential or commercial gas range is disclosed in the present invention.
Wisenstech Inc.


08/18/16
20160236932 
new patent

Mems pressure sensor and forming the same


Provided are a mems pressure sensor and a method for forming the mems pressure sensor. The method includes: preparing a first substrate, where the first substrate includes a first surface and a second surface opposite to the first surface; preparing a second substrate, where the second substrate includes a third surface and a fourth surface opposite to the third surface, the second substrate includes a pressure sensing region; bonding the first surface of the first substrate and the third surface of the second substrate with each other; forming a cavity between the first substrate and the pressure sensing region of the second substrate; removing the second base to form a fifth surface opposite to the third surface of the second substrate; and forming a first conductive plug passing through the second substrate from the side of the fifth surface of the second substrate to the at least one conductive layer..
Memsen Electronics Inc


08/18/16
20160236931 
new patent

Mems pressure sensor and forming the same


Provided are a mems pressure sensor and a method for forming the same. The method includes: preparing a first substrate, where the first substrate includes a first surface and a second surface opposite to the first surface; preparing a second substrate, where the second substrate includes a third surface and a fourth surface opposite to the third surface; bonding the first surface of the first substrate and the third surface of the second substrate with each other and forming a cavity between the first substrate and the pressure sensing region of the second substrate; removing the second base to form a fifth surface opposite to the third surface of the second substrate; and forming a first conductive plug passing through the second substrate from the side of the fifth surface of the second substrate to the at least one conductive layer..
Memsen Electronics Inc


08/11/16
20160234604 

Molded interconnect mircoelectromechanical system (mems) device package


A microelectromechanical system (mems) device package for encapsulating a mems device a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms either side walls or a divider of the mems device package and is adapted to route electrical connections from the mems device to either the substrate or a second mems device package via the substrate..
Robert Bosch Gmbh


08/11/16
20160233791 

Microelectromechanical (mems) manipulators for control of nanoparticle coupling interactions


A nanopositioning system for producing a coupling interaction between a first nanoparticle and a second nanoparticle. A first mems positioning assembly includes an electrostatic comb drive actuator configured to selectively displace a first nanoparticle in a first dimension and an electrode configured to selectively displace the first nanoparticle in a second dimensions.
Uchicago Argonne, Llc


08/11/16
20160232858 

Creep resistant reflective structure in mems display


This disclosure provides devices, systems, and methods for improving creep resistance and mechanical strength of a mems display device. The mems display device can include a movable reflective structure connected and supported by a support structure.
Qualcomm Mems Technologies, Inc.


08/11/16
20160231557 

A controlling the position of a mems mirror


According to the present invention there is provided a method of controlling the position of a mems mirror in a mems device, wherein the mems device comprises, a mems mirror, a magnet which provides a magnetic field (b), an actuating means which operatively cooperates with the mems mirror so that it can apply a force to the mems mirror which can tilt the mems mirror about at least one rotational axis when the actuating means is provided with a drive signal, wherein the magnitude force applied by the actuating means to the mems mirror is dependent on the amplitude of the drive signal, and a detection coil which is mounted on the mems mirror, the method comprising the steps of, detecting a change in the resistance (r) of the detection coil so as to detect a change in temperature of the mems mirror; determining the drive signal amplitude required to maintain the mems mirror at a predefined angular position (Θ); providing the actuating means with a drive signal which has an amplitude which is equal to the determined drive signal amplitude. .
Intel Corporation


08/11/16
20160231369 

Mems device positioning apparatus, test system, and test method


A positioning apparatus includes a support structure, a positioning structure, and a fixture for retaining mems devices. A shaft spans between the support structure and the positioning structure, and is configured to rotate about a first axis relative to the support structure in order to rotate the positioning structure and the fixture about the first axis.
Freescale Semiconductor, Inc.


08/11/16
20160231189 

Mems chip, measuring element and pressure sensor for measuring a pressure


A micro-electro-mechanical system (mems) chip for measuring a pressure in a pressure space includes a mems substrate having a measuring region, a contact-making region connected to the measuring region via lines and having contacts, and a bushing region disposed between the measuring region and the contact-making region. The mems substrate defines a cavity formed as a blind hole that defines an opening through one side of the mems substrate, the bottom of the blind hole forming a membrane.
Kistler Holding Ag


08/11/16
20160231172 

Self calibration for mirror positioning in optical mems interferometers


A micro-electro-mechanical system (mems) apparatus provides for self-calibration of mirror positioning of a moveable mirror of an interferometer. At least one mirror in the mems apparatus includes a non-planar surface.
Si-ware Systems


08/11/16
20160231117 

High-q mems gyroscope


A system and/or method for efficiently operating a mems gyroscope without drive circuitry and/or with drive circuitry and a non-constant oscillating amplitude. In a non-limiting example, drive circuitry may be utilized to drive the mems gyroscope proof mass to a desired oscillating amplitude, and then the drive circuitry may be powered off.
Invensense, Inc.


08/11/16
20160229692 

Semiconductor structure and manufacturing the same


A semiconductor structure and a method for manufacturing the same are provided. The semiconductor structure comprises a base substrate and a mems structure.
United Microelectronics Corp.


08/11/16
20160229688 

Stress relief mems structure and package


Stress relief structures and methods that can be applied to mems sensors requiring a hermetic seal and that can be simply manufactured are disclosed. The system includes a sensor having a first surface and a second surface, the second surface being disposed away from the first surface, the second surface also being disposed away from a package surface and located between the first surface and the package surface, a number of support members, each support member extending from the second surface to the package surface, the support members being disposed on and operatively connected to only a portion of the second surface.
Mks Instruments, Inc.


08/11/16
20160229686 

Gyro mems sensor package


An integrated circuit packaging structure comprises at least one micro electrical mechanical systems (mems) gyroscope die mounted directly on a multi-layer flexible substrate having at least one metal layer and wire-bonded to the flexible substrate and a lid or die coating protecting the mems die and wire bonds.. .
Compass Technology Company Limited


08/11/16
20160229685 

Mems components and wafer-level manufacturing thereof


A mems and a method of manufacturing mems components are provided. The method includes providing a mems wafer stack including a top cap wafer, a mems wafer and optionally a bottom cap wafer.
Motion Engine Inc.


08/11/16
20160229684 

Mems device including support structure and manufacturing


A micro-electro-mechanical system (mems) device and a manufacturing method are provided. The device includes top and bottom cap wafers and a mems wafer disposed between the top cap wafer and the bottom cap wafer.
Motion Engine Inc.


08/11/16
20160229248 

Vehicle suspension and controlling same


A vehicle suspension system having a twist beam axle including a crossbeam and two trailing arms connected thereto. The rear ends of each trailing arm, in the motor vehicle longitudinal direction, having with a wheel mount for fastening a motor vehicle wheel.
Ford Global Technologies, Llc


08/04/16
20160225793 

Direct bandgap substrates and methods of making and using


An indirect bandgap thin film semiconductor circuit can be combined with a compound semiconductor led such as to provide an active matrix led array that can have high luminous capabilities such as for a light projector application. In another example, a highly efficient optical detector is achievable through the combination of indirect and direct bandgap semiconductors.
The Trustees Of Columbia University In The City Of New York


08/04/16
20160225643 

Method and nozzle for hermetically sealed packaged devices


Microelectromechanical systems (mems) such as digital micromirror devices (dmd) are manufactured in arrays. Covers, packages, and lids are placed around each device and a liquid such as epoxy resin is dispensed around the packaged device.
Texas Instruments Incorporated


08/04/16
20160225569 

Normally closed microelectromechanical switches (mems), methods of manufacture and design structures


Normally closed (shut) micro-electro-mechanical switches (mems), methods of manufacture and design structures are provided. A structure includes a beam structure that includes a first end hinged on a first electrode and in electrical contact with a second electrode, in its natural state when not actuated..
International Business Machines Corporation


08/04/16
20160223456 

Miniaturized integrated micro electo-mechanical systems (mems) optical sensor array for viscosity and mass detection


The present invention relates generally to the field of chemical and biological sensors and in particular to micro electro-mechanical systems (mems) sensors for measuring fluid viscosity and detection of minute amounts of chemicals and biological agents in fluids. It is an object of the present invention to provide a sensor that will work in disposable cartridges with remote sensing that can measure dynamic changes of the functionalized cantilevers in liquid and gas environment..
Koc Universitesi


08/04/16
20160223404 

Titanium nitride for mems bolometers


A method for fabricating a semiconductor device includes patterning a sacrificial layer on a substrate to define a bolometer, with trenches being formed in the sacrificial layer to define anchors for the bolometer, the trenches extending through the sacrificial layer and exposing conductive elements at the bottom of the trenches. A thin titanium nitride layer is then deposited on the sacrificial layer and within the trenches.
Robert Bosch Gmbh


08/04/16
20160221824 

Method of wafer-level hermetic packaging with vertical feedthroughs


A wafer-level packaging method for mems structures that are desired to be encapsulated in a hermetic cavity and that need the transfer of at least a single or multiple electrical leads to the outside of the cavity without destroying the hermeticity of the cavity. Lead transfer is achieved using vertical feedthroughs that are patterned on the capping substrate within the same fabrication step to produce the encapsulating cavity.

08/04/16
20160221823 

Method for achieving good adhesion between dielectric and organic material


The present invention generally relates to a method for forming a mems device and a mems device formed by the method. When forming the mems device, sacrificial material is deposited around the switching element within the cavity body.
Cavendish Kinetics, Inc


08/04/16
20160221821 

Method for improving manufacturability of cavity packages for direct top port mems microphone


A mems device for use in some embodiments in a microphone or pressure sensor and method of making the same wherein a portion of the package surrounding the acoustic port is deformed either away from, towards, or both away from and towards the interior of the package. By providing this raised area proximate the acoustic port, external debris is less likely to enter the acoustic port and damage the fragile mems die.
Unisem (m) Berhad


08/04/16
20160221820 

Semiconductor package using a polymer substrate


A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (mems) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the mems device and the semiconductor die.
Amkor Technology, Inc.


08/04/16
20160221819 

Mems-cmos device that minimizes outgassing and methods of manufacture


A mems device is disclosed. The mems device includes a first substrate.
Invensense, Inc.


08/04/16
20160221038 

Capacitive micromachined ultrasonic transducer (cmut) forming


A capacitive micromachined ultrasonic transducer (cmut) device including at least one cmut element with at least one cmut cell is formed. A patterned dielectric layer thereon including a thick and a thin dielectric region is formed on a top side of a single crystal material substrate.
Texas Instruments Incorporated


07/28/16
20160219377 

Mems microphone


The present disclosure discloses a mems microphone including a mems chip, an asic chip and an injection molding package. The mems chip is stacked on and connected to the asic chip by a tsv connector.
Aac Technologies Pte. Ltd.


07/28/16
20160219376 

Mems microphone package


A micro-electro-mechanical system (mems) microphone package is provided in the present disclosure. The mems microphone package includes a circuit board, an electromagnetic shielding cover mounted on the circuit board to define an accommodating space, electronic components received in the accommodating space and electrically connected to the circuit board, and a shielding ring covering a joint between the electromagnetic shielding cover and the circuit board.
Aac Acoustic Technologies (shenzhen) Co., Ltd.


07/28/16
20160218688 

Preamplifier circuit for a microelectromechanical capacitive acoustic transducer


Described herein is a preamplifier circuit for a capacitive acoustic transducer provided with a mems detection structure that generates a capacitive variation as a function of an acoustic signal to be detected, starting from a capacitance at rest; the preamplifier circuit is provided with an amplification stage that generates a differential output signal correlated to the capacitive variation. In particular, the amplification stage is an input stage of the preamplifier circuit and has a fully differential amplifier having a first differential input (inp) directly connected to the mems detection structure and a second differential input (inn) connected to a reference capacitive element, which has a value of capacitance equal to the capacitance at rest of the mems detection structure and fixed with respect to the acoustic signal to be detected; the fully differential amplifier amplifies the capacitive variation and generates the differential output signal..
Stmicroelectronics S.r.l.


07/28/16
20160218431 

Techniques of tuning an antenna by weak coupling of a variable impedance component


The present invention generally relates to small antennas suitable for mobile devices operating in the high frequency and radio frequency bands in the range 100 mhz to 5 ghz. The antennas may be coupled to a dvc such as a mems dvc.
Cavendish Kinetics, Inc.


07/28/16
20160218258 

Light-emitting element unit and display device


A light-emitting element unit which can improve color purity of light emitted from a color filter is provided. A display device with high color purity and high color reproducibility is provided.
Semiconductor Energy Laboratory Co., Ltd.


07/28/16
20160217780 

Time-division-multiplexing based noise cancelation earphone


A time-division-multiplexing (tdm) based noise cancelation headphone is presented herein. A headphone can include an earbud including a speaker, and a tdm based bus that electrically couples the earbud to a portable electronic device.
Invensense, Inc.


07/28/16
20160216290 

Mems device with over-travel stop structure and fabrication


A mems device comprises a substrate, a proof mass spaced apart from a surface of the substrate, and an over-travel stop structure. The over-travel stop structure includes a lateral stop structure and a cap coupled to the lateral stop structure.
Freescale Semiconductor, Inc.


07/28/16
20160216165 

Mems piton-tube capacitive force sensor


12. .

07/28/16
20160216163 

Mems-based calorimeter, fabrication, and use thereof


mems-based calorimeter including two microchambers supported in a thin film substrate formed on a polymeric layer is provided. The thin film substrate includes a thermoelectric sensor configured to measure temperature differential between the two microchambers, and also includes a thermally stable and high strength polymeric diaphragm.
The Trustees Of Columbia University In The City Of New York


07/28/16
20160214857 

Semiconductor device and forming mems package


A microelectromechanical system (mems) semiconductor device has a first and second semiconductor die. A first semiconductor die is embedded within an encapsulant together with a modular interconnect unit.
Stats Chippac, Ltd.


07/28/16
20160214854 

Mems sensor


A microelectromechanical systems (mems) sensor includes a first layer on which a first displacement limiting part and a second displacement limiting part are formed; a third layer on which a mass body part and a support part are formed; and a second layer connecting the first layer and the third layer to each other, wherein at least a portion of the first displacement limiting part is directly opposed to the mass body part, and at least a portion of the second displacement limiting part is directly opposed to the support part.. .
Samsung Electro-mechanics Co., Ltd.


07/28/16
20160214853 

Translating z axis accelerometer


A system and method for providing a mems sensor are disclosed. In a first aspect, the system is a mems sensor that comprises a substrate, an anchor region coupled to the substrate, at least one support arm coupled to the anchor region, at least two guiding arms coupled to and moving relative to the at least one support arm, a plurality of sensing elements disposed on the at least two guiding arms to measure motion of the at least two guiding arms relative to the substrate, and a proof mass system comprising at least one mass coupled to each of the at least two guiding arms by a set of springs.
Invensense, Inc.


07/28/16
20160214077 

Getter, mems device and forming the same


A getter is provided. The getter consists essentially of from about 0% to 50% of titanium, from about 0% to 50% zirconium, and from about 5% to 50% of tantalum.
Taiwan Semiconductor Manufacturing Company Limited


07/28/16
20160213934 

Accelerometer integrity alert


A medical device and associated method determine a signal amplitude of a sensor signal produced by a mems sensor, compare the signal amplitude to a stiction detection condition, detect stiction of the mems sensor in response to the signal amplitude meeting the stiction detection condition, and automatically provide a corrective action in response to detecting the stiction.. .
Medtronic, Inc.


07/21/16
20160212834 

Cyclic accelerator for accelerating charge carriers and manufacturing a cyclic accelerator


What is shown is a cyclic accelerator for accelerating charge carriers. The cyclic accelerator includes a charge carrier source configured to generate free charge carriers, a vacuum chamber configured to receive the free charge carriers, wherein the vacuum chamber is produced by means of mems technology, and wherein at least a main surface region of the vacuum chamber has a semiconductor material.
Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.


07/21/16
20160212549 

Mems microphone device


A micro-electro-mechanical system (mems) microphone device is provided in the present disclosure. The mems microphone device includes a first electromagnetic shielding cover defining a first accommodating space; a second electromagnetic shielding cover received in the first accommodating space and defining a second accommodating space; a mems chip and an application specific integrated circuit (asic) chip received in the second accommodating space.
Aac Acoustic Technologies (shenzhen) Co.,ltd.


07/21/16
20160212548 

Metalized microphone lid with integratd wire bonding shelf


A mems microphone package and a method of manufacturing a mems microphone package having a lid and a substrate cap. The lid includes a wire bonding shelf that provides a surface internal to the mems microphone for connection points for internal wire bonds.
Robert Bosch Gmbh


07/21/16
20160212542 

Anti-impact silicon based mems microphone, a system and a package with the same


The present invention relates to an anti-impact silicon based mems microphone, a system and a package with the same, the microphone comprises: a silicon substrate provided with a back hole therein; a compliant diaphragm supported on the silicon substrate and disposed above the back hole thereof; a perforated backplate disposed above the diaphragm with an air gap sandwiched in between, and further provided with one or more first thorough holes therein; and a stopper mechanism, including one or more t-shaped stoppers corresponding to the one or more first thorough holes, each of which has a lower part passing through its corresponding first thorough hole and connecting to the diaphragm and an upper part being apart from the perforated backplate and free to vertically move, wherein the diaphragm and the perforated backplate are used to form electrode plates of a variable condenser.. .
Goertek Inc.


07/21/16
20160212517 

Mems microphone device


A micro-electro-mechanical system (mems) microphone device is provided in the present disclosure. The mems microphone device includes a circuit board, an electromagnetic shielding cover mounted on the circuit board to define an accommodating space, electronic components received in the accommodating space and electrically connected to the circuit board, and a metal shielding member disposed between the electronic components and the electromagnetic shielding cover.
Aac Acoustic Technologies (shenzhen) Co. Ltd.


07/21/16
20160212394 

Image projection apparatus


An image projection apparatus (1) joins a plurality of display images displayed by scanning a plurality of light beams, as if there is no seam between them, thereby displaying a large-sized high-quality image. The image projection apparatus (1) includes a mems mirror device (11), a mems mirror control unit (13), and a laser beam detector (19).
Mitsubishi Electric Corporation


07/21/16
20160211826 

Passive wireless sensor including piezoelectric mems resonator


A passive wireless sensor includes a substrate having at least one microelectromechanical system (mems) piezoelectric resonator thereon. The mems piezoelectric resonator includes a piezoelectric layer between a top metal or semiconductor layer (top electrode layer) and a bottom metal or semiconductor layer (bottom electrode layer).
University Of Central Florida Research Foundation, Inc.


07/21/16
20160211803 

Mems amplitude modulator and mems magnetic field sensor including same


The present invention provides an amplitude modulator, which is disposed in an area through which a magnetic field flows so as to modulate amplitudes, comprising: a substrate; a first driving electrode which receives a first frequency signal and a second frequency signal supplied from the substrate and carries out resonant motion by the magnetic field; and a second driving electrode for receiving the second frequency signal and carries out resonant motion by the first driving electrode and the magnetic field, wherein a modulated signal is generated by modulating the amplitudes of the first and second frequency signals through the resonant motions of the first and second driving electrodes. Therefore, since the signal generated by modulating a carrier signal through mechanical resonance according to the magnetic field is outputted, amplitude modulation can be carried out without a complicated circuit configuration.
Lg Innotek Co., Ltd.


07/21/16
20160211779 

Three dimensional (3d) robotic micro electro mechanical systems (mems) arm and system


A micro assembly having a substrate and an operating plane coupled to the substrate. The operating plane is movable from an in-plane position to an out-of-plane position.

07/21/16
20160211475 

Micro electro mechanical system (mems) based wide-band polymer photo-detector


A polymer based photo-detector has photoresponsivity in ultraviolet, visible, near and mid infrared regions. The photo-detector comprises a single layer of polyvinyl alcohol (pva) as a photoactive layer; with no additional buffer layer for accepting ultraviolet, visible and infrared radiation as well as no buffer layer to block charge carrier injection.
Indian Institute Of Technology Bombay


07/21/16
20160207763 

Method of forming planar sacrificial material in a mems device


The present invention generally relates to a method of fabricating a mems device. In the mems device, a movable plate is disposed within a cavity such that the movable plate is movable within the cavity.
Cavendish Kinetics, Inc.


07/21/16
20160207758 

Thin capping for mems devices


A device includes a base substrate (700) with a micro component (702) attached thereto. Suitably it is provided with routing elements (704) for conducting signals to and from the component (702).
Silex Microsystems Ab


07/21/16
20160207757 

Mems device and corresponding micromechanical structure with integrated compensation of thermo-mechanical stress


A micromechanical structure of a mems device, integrated in a die of semiconductor material provided with a substrate and having at least a first axis of symmetry lying in a horizontal plane, has a stator structure, which is fixed with respect to the substrate, and a rotor structure, having a suspended mass, mobile with respect to the substrate and to the stator structure as a result of an external action, the stator structure having fixed sensing electrodes capacitively coupled to the rotor structure; a compensation structure is integrated in the die for compensation of thermo-mechanical strains. The compensation structure has stator compensation electrodes, which are fixed with respect to the substrate, are capacitively coupled to the rotor structure, and are arranged symmetrically to the fixed sensing electrodes with respect to the first axis of symmetry..
Stmicroelectronics S.r.l.


07/21/16
20160207756 

Substrate structure, semiconductor structure and fabricating the same


A substrate structure for a micro electro mechanical system (mems) device, a semiconductor structure and a method for fabricating the same are provided. In various embodiments, the substrate structure for the mems device includes a substrate, the mems device, and an anti-stiction layer.
Taiwan Semiconductor Manufacturing Co., Ltd.


07/14/16
20160205463 

Top port microphone apparatus


A microphone includes a microphone base that has a first surface and a second surface. The microphone also includes a microelectromechanical system (mems) device coupled to the first surface of the microphone base.
Knowles Electronics, Llc


07/14/16
20160203775 

Method and system for writing data to mems display elements


Charge balanced display data writing methods use write and hold cycles of opposite polarity during selected frame update periods. The transitions between voltages of opposite polarity are sufficiently brief that the display elements do not change state.
Qualcomm Mems Technologies, Inc.


07/14/16
20160202478 

An image projector and optical assembly


An image projector is disclosed that can include a light source and a mems mirror to receive a light beam emitted by the light source and oscillate to scan the light beam across multiple-beam-generators that each include a planar beam splitter arranged to receive the light beam and generate multiple beams to project an image.. .
Intel Corporation


07/14/16
20160202470 

Systems and methods for mems light modulator arrays with reduced acoustic emission


Systems and methods for a display having an array of pixels, a substrate, and a control matrix formed on the substrate are described. The array of pixels includes mechanical light modulators that can be referred to as micro-electro-mechanical or mems light modulators.
Pixtronix, Inc.


07/14/16
20160202469 

Shutter-based light modulators incorporating light spreading structures


This disclosure provides systems, methods and apparatus for a mems display apparatus incorporating light spreading elements. The display apparatus can include display elements formed over, and in electrical communication with a backplane.
Pixtronix, Inc.


07/14/16
20160202449 

Mems auto focus miniature camera module with fixed and movable lens groups


A mems auto focus miniature camera module includes an image sensor and an optical train including at least one movable lens and one or more fixed lenses or fixed lens groups on either side of the movable lens. The movable lens provides an auto focus feature of the camera module.
Digitaloptics Corporation


07/14/16
20160202366 

Force feedback electrodes in mems accelerometer


A microelectromechanical system (mems) accelerometer having separate sense and force-feedback electrodes is disclosed. The use of separate electrodes may in some embodiments increase the dynamic range of such devices.
Agency For Science Technology And Research (a*star)


07/14/16
20160202224 

Air sensor with air flow control


A system and method for providing and/or controlling air flow to an air sensor. As a non-limiting example, an air sensor system may include mechanical and/or electromechanical features (e.g., mems features) to control air flow to an air sensor.
Invensense, Inc.


07/14/16
20160200566 

Microelectromechanical system (mems) on application specific integrated circuit (asic)


In embodiments, a package assembly may include an application-specific integrated circuit (asic) and a microelectromechanical system (mems) having an active side and an inactive side. In embodiments, the mems may be coupled directly to the asic by way of one or more interconnects.
Intel Ip Corporation


07/14/16
20160200565 

Rf mems electrodes with limited grain growth


The present invention generally relates to an rf mems dvc and a method for manufacture thereof. To ensure that undesired grain growth does not occur and contribute to an uneven rf electrode, a multilayer stack comprising an alcu layer and a layer containing titanium may be used.
Cavendish Kinetics, Inc


07/07/16
20160198276 

Low-cost testing the signal-to-noise ratio of mems microphones


A method is provided for testing a mems microphone. The mems microphone includes a pressure sensor positioned within a housing and a pressure input port to direct acoustic pressure from outside the housing towards the pressure sensor.
Robert Bosch Gmbh


07/07/16
20160196940 

Mems-based switching system


A switching element that is at least partially implemented in one or more printed wiring boards (pwbs). A plurality of inputs and a plurality of outputs may be integrated into the pwb(s).
National Instruments Corporation


07/07/16
20160196923 

Electrostatic damping of mems devices


The present invention generally relates to a method and apparatus for damping a plate electrode or switching element in a mems dvc device. A resistor disposed between a waveform controller and the electrodes of the mems dvc causes the voltage to increase while capacitance decreases during the time that the plate electrode is moving.
Cavendish Kinetics, Inc


07/07/16
20160195713 

Mems micro-mirror device


A mems micro-mirror device includes, a single package; a first mirror and second mirror, wherein at least one of the mirrors is configured to oscillate along an oscillation axis; wherein both mirrors are located within the single package and are arranged such that as the at least one mirror oscillates, the light incident on the first micro-mirror can be deflected to the second mirror.. .
Intel Corporation


07/07/16
20160195712 

Light modulator for mems display


Electromechanical light modulators and backlight providing efficient, low cost and high performance displays.. .

07/07/16
20160195711 

Mems light modulator for display


Electromechanical light modulators and backlight providing efficient, low cost and high performance displays.. .

07/07/16
20160195710 

Mems display


Electromechanical light modulators and backlight providing efficient, low cost and high performance displays.. .

07/07/16
20160195670 

Mems display


Electromechanical light modulators and backlight providing efficient, low cost and high performance displays.. .

07/07/16
20160195509 

Mems implementation for detection of wear metals


This invention relates to analyzing elements, including metals in mechanical systems. The invention therefore allows for detecting wear elements, such as metals, for example, in lubricants to determine whether the mechanical system is deteriorating, or even approaching failure.
Mastinc.


07/07/16
20160195397 

Opto-mechanical inertial sensor


Embodiments of the present disclosure are directed towards a micro-electromechanical system (mems) sensing apparatus, including a laser arrangement configured to generate a light beam, a first waveguide configured to receive and output the light beam, and a second waveguide aligned endface to endface with the first waveguide. The second waveguide may be configured to receive at least a portion of the light beam from the first waveguide via optical coupling through the aligned endfaces.
Intel Corporation




Mems topics: Camera Module, Acceleration Sensor, Microelectromechanical Systems, Control Unit, Semiconductor Substrate, Semiconductor, Demodulation, Accelerometer, Calibration, Modulation, Mems Devices

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