|| List of recent Mems-related patents
|Mems modeling system and method|
A system and method for modeling microelectromechanical devices is disclosed. An embodiment includes separating the microelectromechanical design into separate regions and modeling the separate regions separately.
|Energy harvesting cochlear implant|
The invention is related to a totally implantable cochlear implant having a transducer which is a piezoelectric vibration energy harvester to be mounted on the ossicular chain or the tympanic membrane to detect the frequency of oscillations and generate the required voltage to stimulate the relevant auditory nerves. The invention enables patients' continuous access to sound, since it eliminates the outside components of conventional cochlear implants.
|Mems scanning micromirror|
A mems micromirror (30) is presented including a frame (60) with a mirror body (50) arranged therein. The mirror body (50) is rotatable around a rotation axis (58) extending in a plane (x-y) defined by the frame (60).
|Flow through mems package|
A flow through micro-electromechanical systems (mems) package and methods of operating a mems packaged using the same are provided. Generally, the package includes a cavity in which the mems is enclosed, an inlet through which a fluid is introduced to the cavity during operation of the mems and an outlet through which the fluid is removed during operation of the mems, wherein the package includes features that promote laminar flow of the fluid across the mems.
|Apparatus and method for removing mechanical resonance with internal control loop|
The present invention related to an apparatus and method to removing mechanical resonance of a system using internal control loop, and in more particularly, the internal control loop reduces the resonance factor of the system. The approach in the present invention is not sensitive to the system mechanical parameters changes within time and within temperature changes.
|Rf mems isolation, series and shunt dvc, and small mems|
The present invention generally relates to an architecture for isolating an rf mems device from a substrate and driving circuit, series and shunt dvc die architectures, and smaller mems arrays for high frequency communications. The semiconductor device has one or more cells with a plurality of mems devices therein.
|Mems device anchoring|
Embodiments of the present invention generally relate to a mems device that is anchored using the layer that is deposited to form the cavity sealing layer and/or with the layer that is deposited to form the pull-off electrode. The switching element of the mems device will have a flexible or movable portion and will also have a fixed or anchor portion that is electrically coupled to ground.
|Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof|
A microelectromechanical-acoustic-transducer assembly has: a first die integrating a mems sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the mems sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers..
|Silicon based mems microphone, a system and a package with the same|
The present invention relates to a silicon based mems microphone, comprising a silicon substrate and an acoustic sensing part supported on the silicon substrate, wherein a mesh-structured back hole is formed in the substrate and aligned with the acoustic sensing part, the mesh-structured back hole includes a plurality of mesh beams which are interconnected with each other and supported on the side wall of the mesh-structure back hole, the plurality of mesh beams and the side wall define a plurality of mesh holes which all have a tapered profile and merge into one hole in the vicinity of the acoustic sensing part at the top side of the silicon substrate. The mesh-structured back hole can help to streamline the air pressure pulse caused, for example, in a drop test and thus reduce the impact on the acoustic sensing part of the microphone, and also serve as a protection filter to prevent alien substances such as particles entering the microphone..
|Inertial angular sensor of balanced mems type and method for balancing such a sensor|
An inertial angular sensor of mems type has a support of at least two masses which are mounted movably with respect to the support, at least one electrostatic actuator and at least one electrostatic detector. The masses are suspended in a frame itself connected by suspension means to the support.
|Micro synthetic jet ejector|
A semiconductor device is provided which functions as a synthetic jet ejector. The semiconductor device (201) includes a first layer (203), a third layer (207), and a second layer (205) disposed between the first layer and the third layer, wherein the second layer includes a mems comb drive (221).
|Arrangement and method to sense flow using mechanical stress microsensors|
An arrangement for controlling flow includes a flow control element, an actuator, a linkage assembly, and a sensor module. The linkage assembly is coupled between the flow control element and the actuator, and includes a rotatable linkage element coupled to impart force to the flow control element.
|Isolation and enrichment of nucleic acids on microchip|
Techniques for isolating, enriching, and/or amplifying target dna molecules using mems-based microdevices are disclosed. The techniques can be used for detecting single nucleotide polymorphism, and for isolating and enriching desired dna molecules, such as aptamers..
|Mems infrared sensor including a plasmonic lens|
A portable thermal imaging system includes a portable housing configured to be carried by a user, a bolometer sensor assembly supported by the housing and including an array of thermal sensor elements and at least one plasmonic lens, a memory including program instructions, and a processor operably connected to the memory and to the sensor, and configured to execute the program instructions to obtain signals from each of a selected set of thermal sensor elements of the array of thermal sensor elements, assign each of the obtained signals with a respective color data associated with a temperature of a sensed object, and render the color data.. .
A projector includes laser light sources which emit light, a mems mirror which operates at specified angles of deflection so as to scan light emitted from the laser light sources over a projection area at a sine-function angular velocity in which a scanning speed in a vicinity of a central portion of the projection area in a horizontal direction is faster than a scanning speed in a vicinity of end portions, and a first lens which is disposed at a position between the mems mirror and the projection area and which refracts light scanned by the scanner such that the scanning speed of the light scanned by the mems mirror in the vicinity of the central portion of the projection area in the horizontal direction is equal or substantially equal to the scanning speed in the vicinity of the end portions in the horizontal direction.. .
|Two axes mems resonant magnetometer|
A two-axes mems magnetometer includes, in one plane, a freestanding rectangular frame having inner walls and four torsion springs, wherein opposing inner walls of the frame are contacted by one end of only two torsion springs, each torsion spring being anchored by its other end, towards the centre of the frame, to a substrate. In operation, the magnetometer measures the magnetic field in two orthogonal sensing modes using differential capacitance measurements..
|Temperature drift compensation of mems resonators|
A resonator device comprising a piezoelectric material and at least one electrode, the device also provided with a material with a positive coefficient of stiffness, wherein the material is disposed in the device as an electrode or as a separate layer adjacent the piezoelectric material formed as one or more layers in the device. The material that performs the temperature compensating function is selected from the group consisting of ferromagnetic metal alloys, shape-memory metal alloys, and polymers, wherein the selected material has a temperature coefficient that varies with the relative amounts of the individual constituents of the compositions and wherein the composition is selected to provide the material with the positive coefficient of stiffness..
|Structure of mems electroacoustic transducer|
A structure of micro-electro-mechanical systems (mems) electroacoustic transducer is disclosed. The mems electroacoustic transducer includes a substrate having a mems device region, a diaphragm having openings and disposed in the mems device region, a silicon material layer disposed on the diaphragm and sealing the diaphragm, and a conductive pattern disposed beneath the diaphragm in the mems device region.
|Mems apparatus with increased back volume|
A microelectromechanical system (mems) microphone assembly includes a base and a cover. The cover is coupled to the base and together with the base defines a cavity.
|Cover for a mems microphone|
A microphone assembly includes a base, a cover, and a microelectromechanical system (mems) die. The cover extends at least partially over and is coupled to the base.
|Method of packaging a mems transducer device and packaged mems transducer device|
A packaged mems transducer device comprising: a die, including: a semiconductor body having a front side and a back side, opposite to one another in a first direction, at least one cavity extending through the semiconductor body between the front side and the back side, and at least one membrane extending on the front side at least partially suspended over the cavity; and a package designed to house the die on an inner surface thereof. The transducer device moreover includes a sealing layer extending on the back side of the semiconductor body for sealing the cavity, and includes a paste layer extending between the sealing layer and the inner surface of the package for firmly coupling the die to the package..
|Mems device and method of manufacturing the same|
According to one embodiment, a mems device including a first electrode provided on a support substrate, a second electrode opposed to the first electrode, having at least one end part overlapping the first electrode, and able to move in a direction it is opposed to the first electrode, and beam parts provided on the support substrate and supporting the second electrode. The surface of that part of the first electrode, which opposes the end part of the second electrode, is set at a lower level than the surface of that part of the second electrode, which opposes a center part of the second electrode..
|Mems device and manufacturing method thereof|
According to one embodiment, a mems device includes a first electrode formed on a support substrate, a second electrode arranged to face the first electrode and formed to be movable in a facing direction with respect to the first electrode, a beam portion formed on the support substrate and formed to support the second electrode, a cap layer formed to cover the second electrode and beam portion, a plurality of through-holes formed in the cap layer, the through-holes being formed in a portion other than a proximity portion in which a facing distance between the cap layer and a member in the cap layer is not longer than a preset distance, and a sealing layer formed to cover the cap layer and fill the through-holes.. .
|Low-g mems acceleration switch|
A motion-sensitive low-g mems acceleration switch, which is a mems switch that closes at low-g acceleration (e.g., sensitive to no more than 10 gs), is proposed. Specifically, the low-g mems acceleration switch has a base, a sensor wafer with one or more proofmasses, an open circuit that includes two fixed electrodes, and a contact plate.
A mems gyro is provided, having a movable portion, a non-movable portion, and a magnetic sensing structure that comprises a magnetic source disposed at the movable portion, a magnetic sensing element positioned at the non-movable portion. The movable portion is capable of moving in response to external angular velocity or an external accelerator such that the magnetic field sensed by the magnetic sensing element is in relation to the movement of the movable portion, therefore, the angular velocity or the accelerator..
|Wafer level centrifuge for mems stiction detection and screening system and method|
A wafer level centrifuge (wlc) system and method of testing mems devices using the system. The wafer level centrifuge (wlc) system can include a base centrifuge system and a cassette mounting hub coupled to the base centrifuge system.
|Mems device with release aperture|
The present disclosure provides a method of fabricating a micro-electro-mechanical systems (mems) device. In an embodiment, a method includes providing a substrate including a first sacrificial layer, forming a micro-electro-mechanical systems (mems) structure above the first sacrificial layer, and forming a release aperture at substantially a same level above the first sacrificial layer as the mems structure.
|Inhibiting propagation of surface cracks in a mems device|
A microelectromechanical systems (mems) device (58) includes a structural layer (78) having a top surface (86). The top surface (86) includes surface regions (92, 94) that are generally parallel to one another but are offset relative to one another such that a stress concentration location (90) is formed between them.
|Miniaturized optical zoom lens system|
The present application provides a micromechanical (mems) based zoom lens system, for use in miniature device applications, such as miniature electronic imaging devices. The mems-based zoom lens system comprises at least four optical elements, or two alvarez or lohmann lenses, that are configured for passage of optical signals therethrough along an optical signal path.
|Hidden hinge mems with temporary gimbal anchor|
Micro-electro-mechanical system (mems) mirror devices and manufacturing methods thereof. The device comprising a hinge layer having orthogonal tilt and roll hinges connecting inner and outer platforms such that the inner platform has bi-directional rotation.
|Image display device|
A change in the white balance caused due to the temperature is reduced in an image display device using mems and a laser light source. An image processing unit of the device superposes a signal based on a first measured value of a light quantity at a first temperature on a image signal to be supplied to the laser light source.
|Display apparatus having a micro-electro-mechanical system|
The present invention relates to a display apparatus with pixels, wherein each pixel includes a switching device, a micro-electro-mechanical system (mems), and a gray scale control device. The switching device can be connected to a gate line and a data line to output a corresponding data signal in response to a gate signal.
|Electrical component and method of manufacturing the same|
According to one embodiment, there is disclosed an electrical component. The electrical component includes a substrate, a mems device on the substrate.
According to one embodiment, there is disclosed a mems element. The mems element includes a lower electrode having a surface on which a plurality of minute convex portions are formed.
|Mems device and method of manufacturing the same|
According to one embodiment, a mems device comprises a first electrode provided on a support substrate, a burying insulating film formed at the sides of the first electrode, and a second electrode opposed to the first electrode, having ends extending outside the ends of the first electrode and able to move in the direction it is opposed to the first electrode.. .
|Display device having mems transmissive light valve and method for forming the same|
A display device having a mems transmissive light valve and a method for forming the same are provided. The method includes: providing a multilayer semiconductor substrate comprising a bottom semiconductor layer, a middle buried layer and a top semiconductor layer; forming a light guide opening in the top semiconductor layer; forming at least one mos device in a remaining part of the top semiconductor layer; forming an interconnection layer and an interlayer dielectric layer on the at least one mos; forming a mems transmissive light valve, which is electrically connected to the interconnection layer, on the light guide opening, where the mems transmissive light valve is surrounded by the interlayer dielectric layer; forming a transparent backplane on a top surface of the interlayer dielectric layer; and removing the bottom semiconductor layer..
|Composite micro-electro-mechanical-system apparatus and manufacturing method thereof|
A mems apparatus comprising composite vibrating unit and the manufacturing method thereof are disclosed. The vibrating unit includes a stiffness element on which a first material is disposed.
|Mems device and method of manufacturing the same|
According to one embodiment, a mems device comprises a first electrode provided on a support substrate, a second electrode opposed to the first electrode and movable in the direction it is opposed to the first electrode, and beam parts, each connected to those sides of the second electrode, which oppose to each other, and each supporting the second electrode. The second electrode has a slit extending parallel to the sides to which the beam parts are connected and opening at both the front and the back.
|High-sensitivity, z-axis micro-electro-mechanical detection structure, in particular for an mems accelerometer|
A z-axis micro-electro-mechanical detection structure, having a substrate defining a plane and a suspended mass carried by two anchorage elements. The suspended mass includes a translating mass, suspended over the substrate, mobile in a transverse direction to the plane and arranged between the anchorage elements and two tilting masses, each of which is supported by the anchorage elements through respective elastic anchorage elements so as to be able to rotate with respect to respective oscillation axes.
|Three-dimensional microelectromechanical systems structure|
A three-dimensional microelectromechanical systems (mems) structure includes a substrate and having a height extending outwardly from the substrate and a largest lateral dimension orthogonal to the height. The largest lateral dimension is smaller than the height.
|Micromachined mass flow sensor with condensation prevention and method of making the same|
The design and manufacture method of a silicon mass flow sensor made with silicon micromachining mems, micro electro mechanical systems) process for applications of gas flow measurement with highly humidified or liquid vapors is disclosed in the present invention. The said silicon mass flow sensor operates with an embedded heater and an adjacent control temperature sensor beneath the integrated calorimetric and thermal dissipative sensing thermistors.
|Embedded processor on an integrated mems sensor chip autonomously managing external sensor|
A device and method for managing external sensors are disclosed. The device comprises at least one embedded processor and a memory device and at least one bus controller that can be used by the embedded processors to communicate with external sensors.
|Anti-stick surface coatings|
The present invention describes anti-stick coatings composed of carboxylic acid, carboxylate salt or thiol functionalized siloxanes. The compounds of this invention can be used as coatings on the surface of wind turbine blades, aircraft wings and fuselage, or on the surface of oil and gas platforms, ships, and other vehicles exposed to harsh weather conditions.
|Digital acoustic low frequency response control for mems microphones|
A system and method for controlling and adjusting a low-frequency response of a mems microphone. The system comprising the mems microphone, a controller, and a memory.
|Mems acoustic transducer, mems microphone, mems microspeaker, array of speakers and method for manufacturing an acoustic transducer|
A mems acoustic transducer includes a substrate having a cavity therethrough, and a conductive back plate unit including a plurality of conductive perforated back plate portions which extend over the substrate cavity. A dielectric spacer arranged on the back plate unit between adjacent conductive perforated back plate portions, and one or more graphene membranes are supported by the dielectric spacer and extend over the conductive perforated back plate portions..
|Adjustable biasing circuits for mems capacitive microphones|
An adjustable charge pump system. The system includes a voltage regulator, a clock circuit, a voltage adjustment circuit, and a charge pump.
|Speech detection using low power microelectrical mechanical systems sensor|
Devices and techniques for speech detection using low power microelectrical mechanical systems (mems) sensor are described, including monitoring acoustic energy using a microelectrical mechanical system sensor, detecting a presence of speech using a voice activity detection device comprising a voice activity detection logic and the microelectrical mechanical system sensor formed on die, switching a host system from a first power mode to a second power mode, using a power manager, upon receiving a signal from the voice activity detection device indicating a presence of speech, the host system comprising one or more sensors and a speech recognition module configured to recognize a speech command, and taking an action in response to the speech command.. .
|Speech detection using low power microelectrical mechanical systems sensor|
Devices and techniques for speech detection using low power microelectrical mechanical systems (mems) sensor are described, including a power source, a voice activity detection device connected to the power source and having a microelectrical mechanical system sensor formed on die with a digital signal processor and a voice activity detection logic, and a host system connected to the power source and the voice activity detection device, the host system having sensors, a power manager configured to control power being consumed by the host system according to various power modes, and a speech recognition module, where the voice activity detection device is configured to provide a signal to the host system indicating the presence of speech.. .
|Reset circuit for mems capacitive microphones|
A method of initiating a reset sequence for a mems capacitive microphone. The method includes monitoring an output of a microphone and detecting a mute condition in the output of the microphone indicative of a fault condition.