|| List of recent Mems-related patents
| Quick calibration method for inertial measurement unit|
The invention relates to a quick calibration method for an inertial measurement unit (imu). According to the method, a user holds and rotates the imu to move in all directions without any external equipment, so that twelve error coefficients including gyro biases, gyro scale factors, accelerometer biases and accelerometer scale factors can be accurately calibrated in a short time.
| Method of forming fine patterns of a semiconductor device|
A method of forming fine patterns in a semiconductor device includes forming narrow-width patterns in a first region and wide-width patterns in a second region, where the widths of the narrow-width patterns are smaller than the resolution limitations in a photolithography process used to make the semiconductor device. The first and second regions may comprise cell array regions, with memory cells in the first region and peripheral circuits for operating the memory cells in the second region.
| Micro electro mechanical system, semiconductor device, and manufacturing method thereof|
The present invention provides a mems and a sensor having the mems which can be formed without a process of etching a sacrifice layer. The mems and the sensor having the mems are formed by forming an interspace using a spacer layer.
| Mems structure with improved shielding and method|
A method for fabricating an integrated mems-cmos device. The method can include providing a substrate member having a surface region and forming a cmos ic layer having at least one cmos device overlying the surface region.
| Mems-based rapidscan device and projector having same|
A device projecting images by micro electro-mechanical system (mems) technology mirrors includes a base, a rotating seat, a substrate, a reflective mirror, a driver, and a controller. The rotating seat is rotably positioned on the base.
| Optical cantilever based analysis|
An optical sensor including a mems structure, and a grating coupled resonating structure positioned adjacent to the mems structure, the grating coupled resonating structure comprising an interrogating grating coupler configured to direct light towards the mems structure. The interrogating grating coupler is two dimensional, and the interrogating grating coupler and the mems structure form an optical resonant cavity..
| Touch panel and electronic device|
To provide a touch panel with reduced disturbance of display and with improved mechanical strength by suppressing variation in the space between a pair of substrates which form the touch panel even when in contact with an object to be detected. A pixel portion including a plurality of pixels is provided between a pair of substrates.
| Micro-electro-mechanical system (mems) structure and design structures|
Micro-electro-mechanical system (mems) structures, methods of manufacture and usage, and design structures are disclosed herein. The method includes applying a first voltage polarity to an actuator of a micro-electro-mechanical system (mems) structure to place the mems structure in a predetermined state for a first operating condition.
| Open cavity substrate in a mems microphone assembly and method of manufacturing the same|
An acoustic apparatus includes a substrate. A microelectromechanical system (mems) device is disposed on the substrate.
| Viristor in base for mems microphones|
A micro electro mechanical system (mems) apparatus includes a substrate. The substrate includes a first surface and a second surface.
| Mems structure and method of forming the same|
A method of forming a mems structure, in which an etch stop layer is formed to be buried within the inter-dielectric layer and, during an etch of the substrate and the inter-dielectric layer from backside to form a chamber, the etch stop layer protect the remaining inter-dielectric layer. The chamber thus formed has an opening at a backside of the substrate, a ceiling opposite to the opening, and a sidewall joining the ceiling.
|Optical die test interface|
An integrated circuit optical die test interface and associated testing method are described for using scribe area optical mirror structures (106) to perform wafer die tests on mems optical beam waveguide (112) and optical circuit elements (113) by perpendicularly deflecting optical test signals (122) from the scribe area optical mirror structures (106) into and out of the plane of the integrated circuit die under test (104) and/or production test die (157).. .
A high density, low power, high performance information system, method and apparatus are described in which an integrated circuit apparatus includes a first integrated circuit link element (657) and a redundant integrated circuit link element (660) connected in parallel between first and second deflectable mems switches (652-655, 662-665) which are connected in a signal path and controlled to deselect the first integrated circuit link element (657) and connect the redundant integrated circuit link element (660) in the signal path in response to a two-state control signal provided to the first and second deflectable mems switches which identifies the first integrated circuit link element as being defective.. .
|Integration of a mems beam with optical waveguide and deflection in two dimensions|
A high density, low power, high performance information system, method and apparatus are described in which an integrated circuit apparatus includes a plurality of deflectable mems optical beam waveguides (e.g., 190) at each die edge which are each formed with an optical beam structure (193) which is encapsulated by a waveguide beam structure (194) to extend into a deflection cavity (198) and which is surrounded by a plurality of deflection electrodes (195-197) that are positioned on walls of the deflection cavity (198) to provide two-dimensional deflection control of each deflectable mems optical beam waveguide in response to application of one or more deflection voltages to provide optical communications (e.g., 184) between different die.. .
|Communication system die stack|
A high density, low power, high performance information system, method and apparatus are described in which perpendicularly oriented processor and memory die stacks (130, 140, 150, 160, 170) include integrated deflectable mems optical beam waveguides (e.g., 190) at each die edge to provide optical communications (182-185) in and between die stacks by supplying deflection voltages to a plurality of deflection electrodes (195-197) positioned on and around each mems optical beam waveguide (193-194) to provide two-dimensional alignment and controlled feedback to adjust beam alignment and establish optical communication links between die stacks.. .
|Suspended passive element for mems devices|
A technique decouples a mems device from sources of strain by forming a mems structure with suspended electrodes that are mechanically anchored in a manner that reduces or eliminates transfer of strain from the substrate into the structure, or transfers strain to electrodes and body so that a transducer is strain-tolerant. The technique includes using an electrically insulating material embedded in a conductive structural material for mechanical coupling and electrical isolation.
|Monolithic body mems devices|
A technique decouples a mems device from sources of strain by forming a mems structure with suspended electrodes that are mechanically anchored in a manner that reduces or eliminates transfer of strain from the substrate into the structure, or transfers strain to electrodes and body so that a transducer is strain-tolerant. The technique includes using an electrically insulating material embedded in a conductive structural material for mechanical coupling and electrical isolation..
|Temperature compensation for mems devices|
A microelectromechanical system (mems) device includes a temperature compensating structure including a first beam suspended from a substrate and a second beam suspended from the substrate. The first beam is formed from a first material having a first young's modulus temperature coefficient.
|Capacitive sensing structure with embedded acoustic channels|
A mems device includes a dual membrane, an electrode, and an interconnecting structure. The dual membrane has a top membrane and a bottom membrane.
|Method and structure of an integrated mems inertial sensor device using electrostatic quadrature-cancellation|
An integrated mems inertial sensor device. The device includes a mems inertial sensor overlying a cmos substrate.
|Micro-electro-mechanical-system resonant sensor and method of controlling the same|
A micro-electro-mechanical-system (mems) resonant sensor includes: a mems unit that generates an output signal corresponding to a vibration component of a mass body vibratable between a first driving electrode and a second driving electrode; an automatic gain control (agc) unit that automatically generates a comparative voltage by controlling a gain of the output signal; and a bias unit that receives a reference voltage and generates a bias voltage using the comparative voltage and the reference voltage, wherein a sinusoidal driving voltage is applied to the first driving electrode and the second driving electrode, and the bias voltage is applied to the mass body. It can maintain the amplitude of the mass body stably in the mems resonant sensor, and prevent malfunction of an electronic circuit by reducing a response error of the mems resonant sensor..
|Method of forming a bond ring for a first and second substrate|
One method includes providing a first substrate; the first substrate may include a first mems device and a second mems device. A second substrate is also provided.
|Method of manufacturing mems devices with reliable hermetic seal|
Manufactured capped mems device wafers are tested for hermeticity on a vacuum prober at differing pressures or on a wafer prober at differing temperatures. Resonant frequency testing is conducted.
|Multi-purpose optical cap and apparatus and methods useful in conjunction therewith|
A method for protecting an optical mems device, including providing an optical mems device defining a field of view and including layers which define a main plane; and forming a protective element, constructed and operative for at least partly covering the optical mems device, from an optical structural material and wherein the protective element includes a planar portion tilted with respect to said main plane via which a majority of light energy directed toward said main plane must pass.. .
|Mems device and electronic device having projector function|
In a mems device (1), a first drive portion (40) is divided into a first drive section (41) and a second drive section (42). A second drive portion (50) is divided into a third drive section (51) and a fourth drive section (52).
|Mems-based zoom lens system|
The present application provides a micromechanical (mems) based zoom lens system, for use in miniature device applications, such as miniature electronic imaging devices. The mems-based zoom lens system comprises at least four optical elements, or two alvarez or lohmann lenses, that are configured for passage of optical signals therethrough along an optical signal path.
|Detection structure for a mems acoustic transducer with improved robustness to deformation|
A micromechanical structure for a mems capacitive acoustic transducer, has: a substrate of semiconductor material; a rigid electrode, at least in part of conductive material, coupled to the substrate; a membrane, at least in part of conductive material, facing the rigid electrode and coupled to the substrate, which undergoes deformation in the presence of incident acoustic pressure waves and is arranged between the substrate and the rigid electrode and has a first surface and a second surface, in fluid communication, respectively, with a first chamber and a second chamber, the first chamber being delimited at least in part by a first wall portion and by a second wall portion formed by the substrate, and the second chamber being delimited at least in part by the rigid electrode; and a stopper element, connected between the first and second wall portions for limiting the deformations of the membrane. At least one electrode-anchorage element couples the rigid electrode to the stopper element..
|Mems microphone and electronic equipment having the mems microphone|
The present invention provides a mems microphone and an electronic equipment having the mems microphone. The electronic equipment of the present invention at least comprises: a mems microphone and a printed circuit board, wherein, the microphone comprises: a microphone chip containing acoustic and electric sensor, a package shell packaging the microphone chip, wherein, it is provided a sound hole on the package shell, the sound hole is positioned on the side of the microphone chip, it is also provided pins derived from the microphone chip on the side face of the package shell adjacent to the sound hole; the printed circuit board electrically connect with the pins of the mems microphone, which is used to output the electric signal generated by the microphone.
|Mems structure with adaptable inter-substrate bond|
A mems structure incorporating multiple joined substrates and a method for forming the mems structure are disclosed. An exemplary mems structure includes a first substrate having a bottom surface and a second substrate having a top surface substantially parallel to the bottom surface of the first substrate.
|Wafer-level packaging of integrated devices, and manufacturing method thereof|
A wafer-level packaging, comprising: a first semiconductor body integrating a mems structure; a second semiconductor body, including a surface electrical-contact region and an asic coupled to the mems structure and to said electrical-contact region; a first coating layer, made of resin, which englobes and protects the first body, the second body, and the electrical-contact region; at least one first conductive through via, which extends through the first coating layer in an area corresponding, and electrically coupled, to the first electrical-contact region; an electrical-contact pad, which extends over the first coating layer, electrically coupled to the first conductive through via; a third semiconductor body, integrating an electronic circuit, glued on the first coating layer; a second coating layer, made of resin, which englobes and protects the third body; at least one second conductive through via, which extends completely through the second coating layer in an area corresponding, and electrically coupled, to the electrical-contact pad; and a further electrical-contact pad electrically coupled to the second conductive through via.. .
|Methods for stiction reduction in mems sensors|
A method of the invention includes reducing stiction of a mems device by providing a conductive path for electric charge collected on a bump stop formed on a substrate. The bump stop is formed by depositing and patterning a dielectric material on the substrate, and the conductive path is provided by a conductive layer deposited on the bump stop.
|Extended-range closed-loop accelerometer|
A microelectromechanical systems (mems) accelerometer with extended operational capabilities beyond a closed-loop saturation. The present invention combines the closed-loop feedback signal and the measured proof-mass position into a hybrid acceleration measurement, which effectively provides an operating range equal to the traditional closed-loop operating range plus the sensor's mechanical open-loop range..
|Multiaxial micro-electronic inertial sensor|
A resonator micro-electronic inertial sensor, preferably a micro-electromechanical system (mems) sensor (e.g. A gyro), for detecting linear accelerations and rotation rates in more than one axis comprises: a proof-mass system (21.1, 21.4) flexibly suspended above a substrate for performing a rotational in-plane vibration about a central axis (24,) a drive electrode system (d1, .
|Centrifuge mems stiction test system and method|
A system for testing a device under a high gravitational force including a centrifuge with a rotating member and method of operation thereof. An operating power can be applied to a device, which can be coupled to the rotating member.
|Internal electrical contact for enclosed mems devices|
A method of fabricating electrical connections in an integrated mems device is disclosed. The method comprises forming a mems wafer.
|Aerogel-based mold for mems fabrication and formation thereof|
The invention is directed to a patterned aerogel-based layer that serves as a mold for at least part of a microelectromechanical feature. The density of an aerogel is less than that of typical materials used in mems fabrication, such as poly-silicon, silicon oxide, single-crystal silicon, metals, metal alloys, and the like.
|Vad detection microphone and method of operating the same|
A microphone includes a microelectromechanical system (mems) circuit and an integrated circuit. The mems circuit is configured to convert a voice signal into an electrical signal, and the integrated circuit is coupled to the mems circuit and is configured to receive the electrical signal.
|Capacitor, mems device, and method of manufacturing the mems device|
Disclosed is a capacitor. The capacitor includes a plurality of capacitor units connected to each other in parallel.
|Thin film capping|
A method for sealing cavities in micro-electronic/-mechanical system (mems) devices to provide a controlled atmosphere within the sealed cavity includes providing a semiconductor substrate on which a template is provided on a localized area of the substrate. The template defines the interior shape of the cavity.
|Forming semiconductor structure with device layers and trl|
A semiconductor wafer is formed with a first device layer having active devices. A handle wafer having a trap rich layer is bonded to a top surface of the semiconductor wafer.
|Mems backplate, mems microphone comprising a mems backplate and method for manufacturing a mems microphone|
A mems backplate enables mems microphones with reduced parasitic capacitance. A mems backplate includes a central area and a perforation in the central area.
|Mems microphone with reduced parasitic capacitance|
A mems microphone has reduced parasitic capacitance. The microphone includes a trench electrically separating an acoustically active section of the backplate from an acoustically inactive section of the backplate..
|Active lateral force stiction self-recovery for microelectromechanical systems devices|
A mechanism for recovering from stiction-related events in a mems device through application of a force orthogonal to the stiction force is provided. A small force applied orthogonal to the vector of a stiction force can release the stuck proof mass easier than a force parallel to the vector of the stiction force.
|Optical cross-connect switch with configurable optical input/output ports|
An optical cross-connect switch having a fiber collimator array (fca), a mems mirror array, and a folded 4f relay system. Each optical fiber in the fca can work as an input fiber or an output fiber.
|Mems process and device|
A method of fabricating a micro-electrical-mechanical system (mems) transducer comprises the steps of forming a membrane on a substrate, and forming a back-volume in the substrate. The step of forming a back-volume in the substrate comprises the steps of forming a first back-volume portion and a second back-volume portion, the first back-volume portion being separated from the second back-volume portion by a step in a sidewall of the back-volume.
|Mems variable capacitor with enhanced rf performance|
In a mems device, the manner in which the membrane lands over the rf electrode can affect device performance. Bumps or stoppers placed over the rf electrode can be used to control the landing of the membrane and thus, the capacitance of the mems device.
|Liquid ion detector|
A system and method comprising a liquid interface with an electrode. The electrode may be coupled to a mems-based electrometer for sensing small amounts of charge imposed on the electrode.
|Mems resonator active temperature compensation method and thermally-actuated mems resonator|
A mems resonator active temperature compensation method is provided. The mems resonator active temperature compensation method includes: a mems resonator is provided, wherein a structural resistance of the mems resonator is varied with an environmental temperature; a structural resistance shift value is formed by a variation of the environmental temperature; an electrical circuit is provided, wherein the electrical circuit is electrically connected with the mems resonator for providing an adjustment mechanism to the mems resonator; and a compensation value is provided from the adjustment mechanism for controlling the structural resistance shift value..
|Techniques for the cancellation of chip scale packaging parasitic losses|
The present invention generally relates to techniques and structures that cancel or mitigate rf coupling from the rf circuit to the silicon die. To cancel or mitigate the rf coupling, a conductive coating may be formed over the rf-mems device.
|Method of manufacturing a semiconductor integrated circuit device having a mems element|
In a method of manufacturing a semiconductor integrated circuit device having an mems element over a single semiconductor chip, the movable part of the mems element is fixed before the formation of a rewiring. After formation of the rewiring, the wafer is diced.
|Device comprising a spring and an element suspended thereon, and method for manufacturing same|
The invention relates to an mems structure with a stack made of different layers and a spring-and-mass system varying in its thickness which is formed of the stack, and wherein, starting from a back side of the stack and the substrate, at laterally different positions, the substrate while leaving the first semiconductor layer, or the substrate, the first etch-stop layer and the first semiconductor layer are removed, and to a method for manufacturing such a structure.. .
|Piezoelectric mems microphone|
A piezoelectric mems microphone comprising a multi-layer sensor that includes at least one piezoelectric layer between two electrode layers, with the sensor being dimensioned such that it provides a near maximized ratio of output energy to sensor area, as determined by an optimization parameter that accounts for input pressure, bandwidth, and characteristics of the piezoelectric and electrode materials. The sensor can be formed from single or stacked cantilevered beams separated from each other by a small gap, or can be a stress-relieved diaphragm that is formed by deposition onto a silicon substrate, with the diaphragm then being stress relieved by substantial detachment of the diaphragm from the substrate, and then followed by reattachment of the now stress relieved diaphragm..
|Mems pressure transducer assembly|
An assembly (20) includes a mems die (22) having a pressure transducer device (40) formed on a substrate (44) and a cap layer (38). A packaging process (74) entails forming the device (40) on the substrate, creating an aperture (70) through a back side (58) of the substrate underlying a diaphragm (46) of the device (40), and coupling a cap layer (38) to the front side of the substrate overlying the device.
|Mems package structure|
A mems package structure, including a substrate, an interconnecting structure, an upper metallic layer, a deposition element and a packaging element is provided. The interconnecting structure is disposed on the substrate.
|Fabricating polysilicon mos devices and passive esd devices|
A semiconductor fabrication is described, wherein a mos device and a mems device is fabricated simultaneously in the beol process. A silicon layer is deposited and etched to form a silicon film for a mos device and a lower silicon sacrificial film for a mems device.
A system and method comprising an ion production chamber having a plasma source disposed in said chamber, a harvest gas disposed to flow through the chamber from an inlet to an outlet, and a jet, said jet operable to introduce a sample into the harvest gas flow. In some embodiments the system includes using helium as the harvest gas.
|Tri-axial mems accelerometer|
A tri-axial mems accelerometer includes a top cap silicon wafer and a bottom cap silicon wafer coupled with a measurement mass. The measurement mass has a two level structure, each level having an inner frame coupled to an outer frame by a plurality of first elastic beams, a mass coupled to the inner frame by a plurality of second elastic beams, and a comb coupling structure between the mass and the inner frame.
|Vertical embedded sensor and process of manufacturing thereof|
A scanning probe assembly having a nanometer sensor element defined at a tip apex and its method of fabrication using micro-electromechanical systems (mems) processing techniques. The assembly comprises a probe body, a cantilever extending outward, and a hollow tip at the end of the cantilever.
|Surgical instruments including mems devices|
Surgical instruments are disclosed that are couplable to or have an end effector or a disposable loading unit with an end effector, and at least one micro-electromechanical system (mems) device operatively connected to the surgical instrument for at least one of sensing a condition, measuring a parameter and controlling the condition and/or parameter.. .