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Mems patents

      

This page is updated frequently with new Mems-related patent applications.




new patent Mems-based structure for pico speaker
Techniques described herein generally include methods and systems related to a mems-based audio speaker system that includes a first movable element, formed from a first layer of a semiconductor substrate, and a second movable element, formed from a second layer of the semiconductor substrate that is a different layer than the first layer of the semiconductor substrate. The first movable element may be configured to oscillate along a first directional path substantially orthogonal to the first plane..
Empire Technology Development Llc


new patent Mems-based audio speaker system with modulation element
Techniques described herein generally include methods and systems related to a mems-based audio speaker system configured for generating an audio signal. The speaker system includes one or more apertures in the speaker system positioned to receive the ultrasonic carrier signal and one or more movable and over-sized obstruction elements that are configured to modulate the ultrasonic carrier signal and thereby generate an audio signal.
Empire Technology Development Llc


new patent Method and means for regulating the electrical bias voltage at the measuring capacitor of a mems sensor element
Measures for regulating the electrical bias voltage at the measuring capacitor of a mems sensor element are described. A base voltage is applied to the measuring capacitor and regulated in such a way that the potential difference between the two electrode sides of the measuring capacitor corresponds to the setpoint voltage.
Robert Bosch Gmbh


new patent System and cryptographic key identification
A system includes a mems device and a key generating device formed over the substrate. The key generating device is configured to generate a cryptographic key based on a property of the mems device and the mems device is configured to output a signal indicative of a sensed parameter.
Robert Bosch Gmbh


new patent Charge drain coating for electron-optical mems
A system and method associated with a charge drain coating are disclosed. The charge drain coating may be applied to surfaces of an electron-optical device to drain electrons that come into contact with the charge drain coating so that the performance of the electron-optical device will not be hindered by electron charge build-up.

new patent A pixel structure and a preparation method thereof, a pixel display method and an array substrate
The present disclosure discloses a pixel structure and a preparation method thereof, a pixel display method and an array substrate. The pixel structure comprises: a thin film transistor tft for controlling a micro-electro-mechanical system mems switch; the micro-electro-mechanical system mems switch being used for controlling transmission amount of outgoing light of a quantum dot light emitting diode qled device; the quantum dot light emitting diode qled device being a top emission type for emitting light constantly based on a constant light emitting driving signal..
Boe Technology Group Co., Ltd.


new patent Consensus-based multi-piezoelectric microcantilever sensor
Systems and methods are disclosed that describe a mems device and a method of sensing based on a consensus algorithm. The mems device is a sensor comprising multiple piezoelectric layers attached to a microcantilever.
The Board Of Trustees Of The University Of Alabama


new patent Sampling delay indications in mems sensors
Systems, devices, methods, and computer-program products for reducing sensor reading time error and estimating the time of an event sensed by a sensor are presented. According to implementations, a sensor indicates to a system with which it interacts, the time when an event occurred.
Qualcomm Incorporated


new patent Semiconductor device and manufacturing the same
Provided herein is a semiconductor device is provided. The semiconductor device includes a substrate including a mems region and a connection region thereon; a dielectric layer disposed on the substrate in the connection region; a poly-silicon layer disposed on the dielectric layer, wherein the poly-silicon layer serves as an etch-stop layer; a connection pad disposed on the poly-silicon layer; and a passivation layer covering the dielectric layer, wherein the passivation layer includes an opening that exposes the connection pad and a transition region between the connection pad and the passivation layer..
United Microelectronics Corporation


new patent Reversible top/bottom mems package
A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate.
Amkor Technology, Inc.


new patent

Wafer level hermetic seal process for microelectromechanical systems (mems) devices

A microelectromechanical systems (mems) structure with a cavity hermetically sealed using a mask layer is provided. A capping substrate is arranged over a mems substrate, which includes a movable element.
Taiwan Semiconductor Manufacturing Co., Ltd.

new patent

Planar cavity mems and related structures, methods of manufacture and design structures

A method of forming at least one micro-electro-mechanical system (mems) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material.
International Business Machines Corporation

Raised shoulder micro electro mechanical system (mems) microphone

Microphone devices are disclosed. The microphone device includes a base, a lid, a side wall between the base and the lid, and a mems die.
Knowles Electronics, Llc

Mems resonator with high quality factor

A symmetrical mems resonator is disclosed with a high quality factor. The mems resonator includes a silicon layer with a top surface and bottom surface opposite the top surface.
Murata Manufacturing Co., Ltd.

Lighting system of a microlithographic projection exposure operating such a lighting system

An illumination system of a microlithographic projection exposure apparatus includes a light source operated in a pulsed fashion and an array of optical elements which are digitally switchable between two switching positions. The array may be produced using mems technology..
Carl Zeiss Smt Gmbh

Security integrated devices

A method is provided for implementing a security mechanism in an integrated mems (micro-electro-mechanical-system) device having a mems sensor with an output register associated with a sensing operation, the integrated mems device being electrically coupled to a computing system programmed to perform the method. The method includes, in normal operation, reading from the output register an output of the sensing operation, and in a test mode, determining, by a processor disposed within the computing system, a random value.
Mcube Inc.

Apparatus and methods for photonic integrated resonant accelerometer

The accelerometers disclosed herein provide excellent sensitivity, long-term stability, and low swap-c through a combination of photonic integrated circuit technology with standard micro-electromechanical systems (mems) technology. Examples of these accelerometers use optical transduction to improve the scale factor of traditional mems resonant accelerometers by accurately measuring the resonant frequencies of very small (e.g., about 1 μm) tethers attached to a large (e.g., about 1 mm) proof mass.

Method and system for controlling antenna of mobile communication application system based on double quaternions in mems inertial navigation

A method for controlling an antenna of a mobile communication application system based on double quaternions in mems inertial navigation. The method comprises: introducing an antenna control quaternion based on a navigation attitude quaternion; in each interrupt cycle of a navigation computer, updating the two quaternions respectively using a carrier system measured by a gyroscope relative to a rotation vector of an ideal platform coordinate system; in each filter cycle, correcting the error of the navigation attitude quaternion respectively using a kalman filter; according to the relationship between the attitudes determined by the two attitude quaternions, determining the angular speed in an antenna control instruction; and finally, driving a servo system to rotate at an antenna servo control angle converted by an antenna control quaternion attitude.
Beijing Aerospace Wanda Hi-tech Ltd.

Mems device mechanical amplitude control

A system and/or method for utilizing mechanical motion limiters to control proof mass amplitude in mems devices (e.g., mems devices having resonant mems structures, for example various implementations of gyroscopes, magnetometers, accelerometers, etc.). As a non-limiting example, amplitude control for a mems gyroscope proof mass may be accomplished during normal (e.g., steady state) gyroscope operation utilizing impact stops (e.g., bump stops) of various designs.
Invensense, Inc.

Method and electrostatic mode-alignment on planar mems gyroscopes

A mems baw vibratory planar gyroscope having an in-plane electrode configuration for mode-alignment by utilizing alignment electrodes that have a height less than a full height of the gyroscope resonant body. Such alignment electrodes apply a force component that affects modes with both in-plane and out-of-plane movements.
Qualtre, Inc.

Micromachined resonating beam gyroscopes

A single-axis resonating beam gyroscope uses a special arrangement of support tethers that maximizes the q (quality factor) and minimizes stress sensitivity. The tethers are located at the nodal points of the beam with respect to a predetermined drive mode and are approximately one-fourth the length of the beam.
Analog Devices, Inc.

Mems packages and methods of manufacture thereof

Microelectromechanical systems (mems) packages and methods of manufacture thereof are described. In an embodiment, a method of manufacturing a mems package may include attaching a mems structure having a capping structure thereon to a device wafer comprising a plurality of first devices formed therein to form a wafer level mems package; and singulating the device wafer having the mems structure attached thereto to form a plurality of chip scale mems packages..
Taiwan Semiconductor Manufacturing Company, Ltd.

Mems sensor with high voltage switch

A system and/or method for utilizing mems switching technology to operate mems sensors. As a non-limiting example, a mems switch may be utilized to control dc and/or ac bias applied to mems sensor structures.
Invensense, Inc.

Multi-mems module

A multi-mems module is specified which can be produced expediently and enables a smaller design. The module comprises a housing having an interior and a first and a second opening, a first mems chip and a second mems chip.
Epcos Ag

Mems-based audio speaker system using single sideband modulation

Techniques described herein generally include methods and systems related to a mems-based audio speaker system configured with multiple speaker devices to generate an audio signal that is substantially without a high-band ultrasonic signal. Energy may be transferred to a low frequency sideband of the audio signal output and substantially eliminated from the high frequency sideband of the audio signal by passing an acoustic carrier signal through two different modulators.
Empire Technology Development Llc

Micro-hemispherical resonators and methods of making the same

Aspects of the present disclosure relate to microelectromechanical systems (mems) and methods for fabricating mems. In some embodiments, the system includes a resonator and a support stem.
Georgia Tech Research Corporation

Method and improving performance of digital microelectromechanical systems microphones

A microphone device comprising a microelectromechanical systems (mems) acoustic sensors, an automatic gain compensation (agc) component, and a direct current (dc) offset cancellation component is described. An microphone device can be configured for agc of an analog gain stage or a digital gain stage associated with the mems acoustic sensor.
Invensense, Inc.

Method for forming polysilicon

A method for forming polysilicon on a semiconductor substrate that include providing amorphous silicon on a semiconductor substrate, exposing at least an area of the amorphous silicon to a first laser beam and a second laser beam, characterized in that during exposing the area to the second laser beam no displacement of the laser beam relative to the area occurs. In addition, the use of such method for producing large grain polysilicon.
Laser Systems & Solutions Of Europe

Apparatus and decoupling an mri receive coil

An apparatus for decoupling a receive coil from a transmit coil includes a tuning circuit connected electrically with the receive coil and a mems switch connected electrically in parallel with the tuning circuit, and operable to line up or to bypass the tuning circuit by opening or closing the mems switch. The apparatus further includes a control circuit operatively connected with the mems switch and operable to open or to close the mems within a window of time responsive to energization of the transmit coil to transmit a signal..
General Electric Company

Whole angle mems gyroscope on hexagonal crystal substrate

According to one aspect, embodiments herein provide a gyroscope comprising an axially symmetric structure, and a plurality of transducers, each configured to perform at least one of driving and sensing motion of the axially symmetric structure, wherein the plurality of transducers is configured to drive the axially symmetric structure in at least a first vibratory mode and a second vibratory mode, and wherein the gyroscope is implemented on a hexagonal crystal-based substrate.. .
The Government Of The United States, As Represented By The Secretary Of The Navy

Whole angle mems gyroscope

According to one aspect, embodiments herein provide a gyroscope comprising a central anchor, a plurality of internal flexures, a plurality of masses, each mass coupled to the central anchor via at least one of the plurality of internal flexures and configured to translate in a plane of the gyroscope, and a plurality of mass-to-mass couplers, each mass-to-mass coupler coupled between two adjacent masses of the plurality of masses, and a plurality of transducers, each configured to perform at least one of driving and sensing motion of a corresponding one of the plurality of masses, wherein the plurality of transducers is configured to drive the plurality of masses in at least a first vibratory mode and a second vibratory mode.. .
The Charles Stark Draper Laboratory, Inc.

Pressure sensor package with stress isolation features

A sensor package includes a manifold and a mems die. The manifold includes a cylindrical body, a flange, and a mounting surface.
Rosemount Aerospace Inc.

Method of lower profile mems package with stress isolations

mems packages, modules, and methods of fabrication are described. In an embodiment, a mems package includes a mems die and an ic die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the ic die and the mems die on the front side of the surface mount substrate.
Apple Inc.

Monolithic fabrication of thermally isolated microelectromechanical system (mems) devices

A method for fabricating a thermally isolated microelectromechanical system (mems) structure is provided. The method includes processing a first wafer of a first material with a glass wafer to form a composite substrate including at least one sacrificial structure of the first material and glass; forming a mems device in a second material; forming at least one temperature sensing element on at least one of: the composite substrate; and the mems device; and etching away the at least one sacrificial structure of the first material in the composite substrate to form at least one thermally isolating glass flexure.
Honeywell International Inc.

System and a mems transducer

According to an embodiment, a microelectromechanical systems (mems) transducer includes a first electrode, a second electrode fixed to an anchor at a perimeter of the second electrode, and a mechanical support separate from the anchor at the perimeter of the second electrode and mechanically connected to the first electrode and the second electrode. The mechanical support is fixed to a portion of the second electrode such that, during operation, a maximum deflection of the second electrode occurs between the mechanical structure and the perimeter of the second electrode..
Infineon Technologies Ag

Identification tag for tracking objects

An apparatus for location of objects is provided. The apparatus includes an integrated circuit including a processor, a memory, a transceiver for sending and receiving data over a cellular network, and gps receiver components for receiving gps signals.

Tilted mems

A micro-electro-mechanical system (mems) optical sensor, method of detecting sound using the mems optical sensor and method of manufacturing. The mems optical sensor including a substrate having a base portion and a vertically extending support portion.
Apple Inc.

Microphone with coined area

A microphone includes a base and a microelectromechanical system (mems) die mounted to the base. The microphone also includes an integrated circuit fixed to the base.
Knowles Electronics, Llc

Nonuniform corrugated diaphragm for mems tuners and actuators

A cavity resonator tuning diaphragm comprising a plurality of inner corrugations, the plurality of inner corrugations having a first depth. An outer corrugation located between the plurality of inner corrugations and a perimeter of the diaphragm is also included, the outer corrugation having a second depth greater than the first depth.
Purdue Research Foundation

Systems and methods for laser splitting and device layer transfer

Methods and systems are provided for the split and separation of a layer of desired thickness of crystalline semiconductor material containing optical, photovoltaic, electronic, micro-electro-mechanical system (mems), or optoelectronic devices, from a thicker donor wafer using laser irradiation.. .
Solexel, Inc.

In-situ bias correction for mems accelerometers

In some examples, an accelerometer may self-calibrate while in use by setting a scale factor of the accelerometer to a first value; while the scale factor of the accelerometer is set to the first value, obtaining a first acceleration value; setting the scale factor of the accelerometer to a second value; while the scale factor of the accelerometer is set to the second value, obtaining a second acceleration value; based on the first acceleration value and the second acceleration value, determining a bias correction value; obtaining a third acceleration value; and correcting the third acceleration value based on the bias correction value.. .
Honeywell International Inc.

Active, in-situ, calibration of mems accelerometers using optical forces

An accelerometer device configured for in-situ calibration applies a laser-induced pushing force at a first magnitude to a proof mass of an accelerometer, and while applying the laser-induced pushing force at the first magnitude to the proof mass, the device obtains a first output from the accelerometer. The device is further configured to apply a laser-induced pushing force at a second magnitude to the proof mass, and while applying the laser-induced pushing force at the second magnitude to the proof mass, the device obtains a second output from the accelerometer.
Honeywell International Inc.

Offset rejection electrodes

A system and method for reducing offset in a mems sensor are disclosed. In a first aspect, the system is a mems sensor that comprises a sensing reference plane, at least one anchor coupled to the sensing reference plane, at least one proof mass coupled to the at least one anchor, wherein one of the at least one proof mass moves under an external excitation, a pattern of sensing elements coupled between the sensing reference plane and the at least one proof mass to detect motion normal to the sensing reference plane, wherein the pattern of sensing elements shares at least three axes of polarity anti-symmetry, and a signal processing circuit to combine the pattern of sensing elements thereby providing an output proportional to the external excitation.
Invensense, Inc.

Package formation method and mems package

This invention includes a sacrificial thin film formation step for chemical-mechanical polishing a temporary substrate made of a readily polishable material and sputtering a metal thin film along the smoothly polished surface, and a first bonding step for forming a sealing frame obtained by bringing at least a noble metal on the metal thin film and bonding a substrate on the sealing frame. This invention also includes a temporary substrate removal step for then removing the metal thin film along with the temporary substrate and exposing a new surface at the tip of the sealing frame; and a second bonding step for sputtering a noble metal thin film around a precision machine element on the machine substrate, bringing the new surface of the sealing frame into contact onto the noble metal thin film and bonding the new surface of the sealing frame onto the noble metal thin film at room temperature..
National Institute Of Advanced Industrial Science And Technology

Recess with tapered sidewalls for hermetic seal in mems devices

An integrated circuit (ic) device is provided. The ic device includes a first substrate having a frontside and a backside.
Taiwan Semiconductor Manufacturing Co., Ltd.

Miniaturized and ruggedized wafer level mems force sensors

Described herein is a miniaturized and ruggedized wafer level mems force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges..
Nextinput, Inc.

Movement microelectromechanical systems (mems) package

The present disclosure relates to a microelectromechanical systems (mems) package with an anti-stiction layer, and an associated method of formation. In some embodiments, the mems package comprises a device substrate and a cmos substrate.
Taiwan Semiconductor Manufacturing Co., Ltd.



Mems topics:
  • Camera Module
  • Acceleration Sensor
  • Microelectromechanical Systems
  • Control Unit
  • Semiconductor Substrate
  • Semiconductor
  • Demodulation
  • Accelerometer
  • Calibration
  • Modulation
  • Mems Devices


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    This listing is a sample listing of patent applications related to Mems for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Mems with additional patents listed. Browse our RSS directory or Search for other possible listings.


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