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This page is updated frequently with new Mems-related patent applications. Subscribe to the Mems RSS feed to automatically get the update: related Mems RSS feeds. RSS updates for this page: Mems RSS RSS


Samsung Electro-mechanics

Piezoelectric actuator module, method of manufacturing the same, and mems sensor having the same

Date/App# patent app List of recent Mems-related patents
03/26/15
20150086043
 System and  adjusting microphone functionality patent thumbnailnew patent System and adjusting microphone functionality
An adjustable microphone. The microphone includes a mems microphone, a charge pump, a preamplifier, a first analog-to-digital converter, a root mean square (rms) power detector, and a logic circuit.
Robert Bosch Gmbh
03/26/15
20150085363
 Mems-based optical image stabilization patent thumbnailnew patent Mems-based optical image stabilization
In one example, a camera is provided that includes: a plurality of mems electrostatic comb actuators, each actuator operable to exert a force on at least one lens; and an optical image stabilization (ois) algorithm module operable to command the plurality of actuators to actuate the at least one lens responsive to motion of the camera.. .
Digitaloptics Corporation Mems
03/26/15
20150084139
 Device,  providing mems structures of a semiconductor package patent thumbnailnew patent Device, providing mems structures of a semiconductor package
Techniques and mechanisms for providing precisely fabricated structures of a semiconductor package. In an embodiment, a build-up carrier of the semiconductor package includes a layer of porous dielectric material.
03/26/15
20150082884
 Piezoelectric actuator module,  manufacturing the same, and mems sensor having the same patent thumbnailnew patent Piezoelectric actuator module, manufacturing the same, and mems sensor having the same
An actuator includes a multi-layer part having a multilayered piezoelectric part comprising a plurality of piezoelectric bodies and an electrode part connected to the multilayered piezoelectric part, and a support part displaceably supporting the multi-layer part. The multilayered piezoelectric part is polled in the same direction.
Samsung Electro-mechanics Co., Ltd.
03/19/15
20150078707
 Mems-based levers and their use for alignment of optical elements patent thumbnailMems-based levers and their use for alignment of optical elements
A mems based alignment technology based on mounting an optical component on a released micromechanical lever configuration that uses multiple flexures rather than a single spring. The optical component may be a lens.
Kaiam Corp.
03/19/15
20150078587
 Adjustable ventilation openings in mems structures patent thumbnailAdjustable ventilation openings in mems structures
A mems structure and a method for operation a mems structure are disclosed. In accordance with an embodiment of the present invention, a mems structure comprises a substrate, a backplate, and a membrane comprising a first region and a second region, wherein the first region is configured to sense a signal and the second region is configured to adjust a threshold frequency from a first value to a second value, and wherein the backplate and the membrane are mechanically connected to the substrate..
Infineon Technologies Ag
03/19/15
20150076923
 Systems and methods for mems-based cross-point electrical switching patent thumbnailSystems and methods for mems-based cross-point electrical switching
A microelectromechanical systems (mems)-based n×m cross-point switch, a mems-based system, and a method provide mems-based cross-point electrical switching for a layer 0 flow-based switch. The n×m cross-point switch includes n inputs each at least 10 gbps, m output each at least 10 gbps, a plurality of radio frequency (rf) mems switches selectively interconnecting the n inputs to the m outputs; and control and addressing circuitry to selectively control the plurality of rf mems switches to switch each of the n inputs to a corresponding output of the m outputs.
Ciena Corporation
03/19/15
20150076631
 Reduction of chipping damage to mems structure patent thumbnailReduction of chipping damage to mems structure
A mems (microelectromechanical systems) structure comprises a mems wafer. A mems wafer includes a cap with cavities bonded to a structural layer through a dielectric layer disposed between the cap and the structural layer.
Invensense, Inc.
03/19/15
20150076627
 Mems-microphone with reduced parasitic capacitance patent thumbnailMems-microphone with reduced parasitic capacitance
A mems microphone with reduced parasitic capacitance is provided. A microphone includes a protection film covering a rim-sided area of the backplate..
Epcos Ag
03/19/15
20150075957
 High voltage control with digital mems logic patent thumbnailHigh voltage control with digital mems logic
A complex logic gate comprising digital mem switches, coupled to a high voltage mems buffer, to provide a high voltage depending upon gate and body voltages of the digital mem switches.. .
Ciena Corporation
03/12/15
20150071466

Read-out for mems capacitive transducers


Amplifier arrangements for read-out of mems capacitive transducers, such as low-noise amplifiers. An amplifier circuit has first and second mos transistors, with the gate of the first transistor driven by the input signal, and the gate of the second transistor driven by a reference.
Wolfson Microelectronics Plc
03/12/15
20150070793

Miniature mems actuator assemblies


In one embodiment, an electrostatic actuator includes a generally planar fixed frame, a generally planar moving frame coupled to the fixed frame by a flexure for substantially coplanar, perpendicular movement relative to the fixed frame, a plurality of interdigitated teeth, a fixed portion of which is attached to the fixed frame and a moving portion of which is attached to the moving frame, and an elongated output shaft having opposite input and output ends, the input end being coupled to the moving frame.. .
Digitaloptics Corporation Mems
03/12/15
20150070628

Electro-optical switching element and electro-optical display


The present invention relates to electro-optical switching elements and displays comprising them. In particular, it relates to electro-optical switching elements comprising at least a light reflecting layer, a light switching layer, and a light conversion layer, which comprises one or more light emitting substances, in particular, a light reflecting layer, which selectively reflects visible light, a light controlling element that controls the amount of transmitted and/or reflected light, and a light converting layer that shifts the wavelength of the transmitted light to longer values.
Merck Patent Gmbh
03/12/15
20150068314

Mems device


According to one embodiment, a mems device is disclosed. The device includes a substrate, a first and second mems elements on the substrate.
Kabushiki Kaisha Toshiba
03/05/15
20150063608

Capacitive mems element including a pressure-sensitive diaphragm


An implementation for an electret in a capacitive mems element including a pressure-sensitive diaphragm, which is produce-able using standard methods of semiconductor technology for easy integration into the manufacturing process of mems semiconductor elements. Such mems elements include at least one pressure-sensitive diaphragm including at least one deflectable diaphragm electrode of a capacitor system for signal detection and one fixed non-pressure-sensitive counter-element including at least one counter-electrode of this capacitor system, at least one electrode of the capacitor system being provided with an electrically charged electret, so that there is a potential difference between the two electrodes of the capacitor system.
Robert Bosch Gmbh
03/05/15
20150061048

Packaged mems device


A packaged mems device may include an embedding arrangement, a mems device disposed in the embedding arrangement, a sound port disposed in the embedding arrangement and acoustically coupled to the mems device, and a grille within the sound port. Some embodiments relate to a sound transducer component including an embedding material and a substrate-stripped mems die embedded into the embedding material.
Infineon Technologies Ag
03/05/15
20150061046

Wafer level sealing different pressure levels for mems sensors


The present disclosure relates to a method of forming a plurality of mems device having a plurality of chambers with different pressures on a substrate, and an associated apparatus. In some embodiments, the method is performed by providing a device wafer having a plurality of microelectromechanical system (mems) devices.
Taiwan Semiconductor Manufacturing Co., Ltd.
03/05/15
20150061045

Mems device


A mems device includes a first chip and a mems chip. The first chip has a mounting surface and includes at least an integrated circuit.
Infineon Technologies Ag
03/05/15
20150060956

Integrated mems pressure sensor with mechanical electrical isolation


An integrated mems pressure sensor is provided, including, a cmos substrate layer, an n+ implant doped silicon layer, a field oxide (fox) layer, a plurality of implant doped silicon areas forming cmos wells, a two-tier polysilicon layer with selective ion implantation forming a membrane, including an implant doped polysilicon layer and a non-doped polysilicon layer, a second non-doped polysilicon layer, a plurality of implant doped silicon areas forming cmos source/drain, a gate poly layer made of polysilicon forming cmos transistor gates, said cmos wells, cmos transistor sources/drains and cmos gates forming cmos transistors, an oxide layer embedded with an interconnect contact layer, a plurality of metal layers interleaved with a plurality of via hole layers, a nitride deposition layer, an under bump metal (ubm) layer and a plurality of solder spheres. N+ implant doped silicon layer and implant doped/un-doped composition polysilicon layer forming a sealed vacuum chamber..
Windtop Technology Corp.
03/05/15
20150060955

Integrated mems microphone with mechanical electrical isolation


An integrated mems microphone is provided, including, a bonding wafer layer, a bonding layer, an aluminum layer, cmos substrate layer, an n+ implant doped silicon layer, a field oxide (fox) layer, a plurality of implant doped silicon areas forming cmos wells, a two-tier polysilicon layer with selective ion implantation forming a diaphragm, a plurality of implant doped silicon areas forming cmos source/drain, a gate poly layer forming cmos transistor gates, said cmos wells, said cmos transistor sources/drains and said cmos gates forming cmos transistors, an oxide layer embedded with an interconnect contact layer, a plurality of metal layers interleaved with a plurality of via hole layers, a nitride deposition layer, an under bump metal (ubm) layer and a plurality of solder spheres. Diaphragm is sandwiched between a small top chamber and a small back chamber, and substrate layer includes a large back chamber..
Windtop Technology Corp.
03/05/15
20150060954

Cmos-mems integrated flow for making a pressure sensitive transducer


A sensor is made up of two substrates which are adhered together. A first substrate includes a pressure-sensitive micro-electrical-mechanical (mems) structure and a conductive contact structure that protrudes outwardly beyond a first face of the first substrate.
Taiwan Semiconductor Manufacturing Co., Ltd.
03/05/15
20150060688

Mems 2d air amplifier ion focusing device and manufacturing method thereof


The present invention relates to the field of micro electro mechanical system (mems), and particularly relates to a mems device of a two-dimensional (2d) air amplifier for electro spray ion focusing. It mainly includes original gas inlets, a gap structure, a wall structure and a center focusing groove in the axis of air amplifier.
Dalian University Of Technology
03/05/15
20150059484

Microelectromechanical system devices having crack resistant membrane structures and methods for the fabrication thereof


Methods for fabricating crack resistant microelectromechanical (mems) devices are provided, as are mems devices produced pursuant to such methods. In one embodiment, the method includes forming a sacrificial body over a substrate, producing a multi-layer membrane structure on the substrate, and removing at least a portion of the sacrificial body to form an inner cavity within the multi-layer membrane structure.
03/05/15
20150059482

Mems component


A new signal acquisition concept is provided for mems components having a pressure-sensitive diaphragm element, which at least partially spans a pressure connection opening. This signal acquisition concept is distinguished by an especially high sensitivity.
Robert Bosch Gmbh
03/05/15
20150059473

Multiple sense axis mems gyroscope having a single drive mode


A gyroscope includes a first drive mass driven in a first drive motion along a first axis, the first drive motion generating a first sense motion of a first sense mass in response to rotation of the gyroscope. The gyroscope further includes a second drive mass driven in a second drive motion along a second axis that is transverse to the first axis.
Freescale Semiconductor, Inc.
02/26/15
20150057592

Mems check valve chip and methods


A mems check valve chip is described. The chip comprises a first side and an opposing second side, an outlet port extending from the first side to the second side, and a flexible outlet membrane anchored to the first side to overlie the outlet port.
Alcon Research, Ltd.
02/26/15
20150056800

Self-aligned interconnects formed using substractive techniques


A method of forming an interconnect structure for semiconductor or mems structures at a 10 nm node (16 nm hpcd) down to 5 nm node (7 nm hpcd), or lower, where the conductive contacts of the interconnect structure are fabricated using solely subtractive techniques applied to conformal layers of conductive materials.. .
02/26/15
20150056733

Manufacturing mirco-electro-mechanical system device and mirco-electro-mechanical system device made thereby


The invention provides a manufacturing method of a mems device, which includes: providing an integrated circuit device including a substrate and an electrical structure on the substrate, the electrical structure includes at least one sensing region and at least one first connection section; providing a structure layer, and forming at least one second connection section on the structure layer; bonding the at least one first connection section and the at least one second connection section; etching the structure layer for forming at least one movable structure, the movable structure being located at a position corresponding to a position of the sensing region, and the movable structure being connected to the at least one first connection section via the at least one second connection section; and thereafter, providing a cap to cover the movable structure and the sensing region, wherein the movable structure is not directly connected to the cap.. .
Richtek Technology Corporation
02/26/15
20150056099

Diagnostic radio frequency identification sensors and applications thereof


An integrated passive wireless chip diagnostic sensor system is described that can be interrogated remotely with a wireless device such as a modified cell phone incorporating multi-protocol rfid reader capabilities (such as the emerging gen-2 standard) or bluetooth, providing universal easy to use, low cost and immediate quantitative analyses, geolocation and sensor networking capabilities to users of the technology. The present invention can be integrated into various diagnostic platforms and is applicable for use with low power sensors such as thin films, mems, electrochemical, thermal, resistive, nano or microfluidic sensor technologies.
Altivera, Llc
02/26/15
20150055205

Mems display incorporating extended height actuators


This disclosure provides systems, methods, and apparatus for a mems display incorporating extended height actuators. A light modulating component can be positioned between a substrate and an opposing surface coupled to the substrate.
Pixtronix, Inc.
02/26/15
20150054100

Micro-electro-mechanical system (mems) and related actuator bumps, methods of manufacture and design structures


Micro-electro-mechanical system (mems) structures, methods of manufacture and design structures are provided. The method of forming a mems structure includes forming a wiring layer on a substrate comprising actuator electrodes and a contact electrode.
International Business Machines Corporation
02/26/15
20150054098

Mems microphone assembly and manufacturing the mems microphone assembly


The present invention concerns a mems microphone assembly (1) comprising a mems transducer element (2) comprising a mems die (3), a back plate (4) and a diaphragm (5) displaceable in relation to the back plate (4), and a sound inlet (16) for acoustically coupling the mems transducer element (2) to the exterior of the mems microphone assembly (1), wherein the mems die (3) comprises an indentation (17) that forms at least a part of the sound inlet (16). Further, the present invention concerns a method of manufacturing said mems microphone assembly (1)..
Epcos Ag
02/26/15
20150054097

Method for manufacturing a mems device and mems device


A method for manufacturing a mems device includes providing a cavity within a layer adjacent to a sacrificial layer. The cavity extends to the sacrificial layer and includes a capillary slot protruding into the layer.
Infineon Technologies Ag
02/26/15
20150054096

Reducing mems stiction by introduction of a carbon barrier


A mechanism for reducing stiction in a mems device by decreasing an amount of carbon from teos-based silicon oxide films that can accumulate on polysilicon surfaces during fabrication is provided. A carbon barrier material film is deposited between one or more polysilicon layer in a mems device and the teos-based silicon oxide layer.
Freescale Semiconductor, Inc.
02/19/15
20150049878

Directional mems microphone


The present invention relates to a directional mems microphone which comprises a cover, a printed circuit board, a sound inlet structure, an integrated circuit chip which is attached to the printed circuit board, and a mems die which is attached to the printed circuit board. The cover provides an open side where the printed circuit board and the cover are coupled.
Shandong Gettop Acoustic Co., Ltd.
02/19/15
20150048936

Vehicle level indicator device


A level indicator device is disclosed for use in conjunction with a road vehicle such as a caravan, trailer, motor home or mobile crane and which comprises an electrically energised level sensor that is arranged to provide an output signal that is representative of a prevailing level of the sensor, a signal generator associated with the sensor and arranged in use to generate a signal that is representative of a substantially horizontal level when that level is sensed to prevail by the sensor. A radiofrequency signal transmitter is located in circuit with the signal generator and is arranged to transmit a radiofrequency signal that is modulated by the signal generated by the signal generator, and a remote receiver is provide and is arranged to receive and demodulate the radiofrequency signal.
Level Systems Pty Ltd
02/19/15
20150048903

Microelectromechanical system with a micro-scale spring suspension making the same


Integrated microelectromechanical system (“mems”) devices and methods for making the same. The mems devices comprise a substrate (200) and a mems filter device (100) mechanically suspended above a major surface of the substrate.
Harris Corporation
02/19/15
20150048902

Integrated microelectromechanical system devices and methods for making the same


Integrated microelectromechanical system (“mems”) devices and methods for making the same. The integrated mems device comprises a substrate (200) with first electronic circuitry (206) formed thereon, as well as a mems filter device (100).
Harris Corporation
02/19/15
20150048901

Microelectromechanical systems comprising differential inductors and methods for making the same


An integrated microelectromechanical systems (“mems”) device (100). The mems device comprises a substrate (200, 300), a transition portion (118), and a differential inductor (1000, 1100, 1300).
Harris Corporation
02/19/15
20150048895

Accurate frequency control using a mems-based oscillator


A micro electro mechanical system (mems) oscillator supplies an oscillator output signal having a first frequency that differs from a predetermined frequency of the output signal. An error determination circuit determines frequency error from the predetermined frequency based on initial frequency offset and/or temperature and provides the error information indicating a difference between the first frequency and the predetermined frequency.
Silicon Laboratories Inc.
02/19/15
20150048463

Package device for microelectromechanical inertial sensor


A package device for a microelectromechanical inertial sensor comprises a ceramic substrate having an upper accommodation space and a lower accommodation and having a plurality of interconnect metal lines thereinside; a microelectromechanical system (mems) chip mounted inside the upper accommodation of the ceramic substrate and electrically connected with the interconnect metal lines; a top cover arranged on the ceramic substrate and sealing the upper accommodation space; and an integrated circuit (ic) chip mounted inside the lower accommodation space and electrically connected with the interconnect metal lines. The present invention can improve the reliability of components, increase the yield and decrease the fabrication cost..
Txc Corporation
02/12/15
20150044808

Method of fabricating integrated semiconductor device and structure thereof


A method of fabricating an integrated semiconductor device, comprising: providing a substrate having a first region and a second region; and forming a semiconductor unit on the first region and forming a micro electro mechanical system (mems) unit on the second region in one process.. .
Macronix International Co., Ltd.
02/12/15
20150043755

Vad detection microphone and operating the same


A microphone includes a microelectromechanical system (mems) circuit and an integrated circuit. The mems circuit is configured to convert a voice signal into an electrical signal, and the integrated circuit is coupled to the mems circuit and is configured to receive the electrical signal.
Knowles Electronics, Llc
02/12/15
20150043002

Dielectric-enhanced metal coatings for mems tunable filters


The present invention concerns the use of hybrid metal-dielectric optical coatings as the end reflectors of laser cavities and/or in the mirror structures used in other optical resonators, such as fabry-perot tunable filters, along with the use of such fabry-perot tunable filters in wavelength swept sources such as lasers. Hybrid metal-dielectric optical coatings have reflectivity spectra that can be broader than pure dielectric coatings, offer optical reflectivities higher than metal, as high as pure dielectric coatings, eliminate mirror transmission that can cause parasitic light reflections, and use fewer layers and thus have lower mass and higher mechanical resonant frequency for movable mirror applications an important characteristic of these coatings concerns the non-reflected light.
Axsun Technologies, Inc.
02/12/15
20150042418

Switchable filters and design structures


Switchable and/or tunable filters, methods of manufacture and design structures are disclosed herein. The method of forming the filters includes forming at least one piezoelectric filter structure comprising a plurality of electrodes formed on a piezoelectric substrate.
International Business Machines Corporation
02/12/15
20150041932

Planar cavity mems and related structures, methods of manufacture and design structures


A method of forming at least one micro-electro-mechanical system (mems) cavity includes forming a first sacrificial cavity layer over a wiring layer and substrate. The method further includes forming an insulator layer over the first sacrificial cavity layer.
International Business Machines Corporation
02/12/15
20150041931

Embedded micro valve in microphone


A microelectromechanical system (mems) apparatus includes a base. A mems device is disposed on the base.
Knowles Electronics, Llc
02/12/15
20150041929

Packaged microphone with multiple mounting orientations


A packaged microphone has a base and a lid that at least in part form a package having a plurality of exterior sides and an interior chamber. The packaged microphone also has a flexible substrate having a first portion within the interior chamber, and a second portion, extending from the interior chamber, having at least two sets of pads.
Invensense, Inc.
02/12/15
20150041927

Mems device with differential vertical sense electrodes


A mems device includes a first sense electrode and a first portion of a sense mass formed in a first structural layer, where the first sense electrode is fixedly coupled with the substrate and the first portion of the sense mass is suspended over the substrate. The mems device further includes a second sense electrode and a second portion of the sense mass formed in a second structural layer.
Freescale Semiconductor, Inc.
02/12/15
20150041629

Device and micro-electro-mechanical-system photonic switch


In one embodiment, a micro-electro-mechanical-system (mems) photonic switch includes a first plurality of collimators and a first mirror array optically coupled to the first plurality of collimators. The first mirror array includes a first plurality of first mems mirrors integrated on a first substrate and a first plurality of first photodiodes integrated on the first substrate, where the photodiodes are disposed in interstitial spaces between the mems mirrors..
Futurewei Technologies, Inc.
02/05/15
20150037024

Mems iris diaphragm-based for an optical adjusting a size of an aperture thereof


A mems iris diaphragm (400) for an optical system is disclosed. The mems iris diaphragm (400) comprises at least two layers of diaphragm structures with each layer having suspended blade members (404a, 404b, 404c, 404d, 406a, 406b, 406c, 406d) angularly spaced from each other, the at least two layers of blade members (404a, 404b, 404c, 404d, 406a, 406b, 406c, 406d) arranged to overlap and cooperate with each other to define an aperture (408) to allow light to pass through, and a rotary actuating device (401) arranged to rotate at least some of the blade members (404a, 404b, 404c, 404d, 406a, 406b, 406c, 406d) of the at least two layers about their respective axis in a non-contact manner to vary the aperture's size.
National University Of Singapore


Popular terms: [SEARCH]

Mems topics: Camera Module, Acceleration Sensor, Microelectromechanical Systems, Control Unit, Semiconductor Substrate, Semiconductor, Demodulation, Accelerometer, Calibration, Modulation, Mems Devices

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This listing is a sample listing of patent applications related to Mems for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Mems with additional patents listed. Browse our RSS directory or Search for other possible listings.
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