FreshPatents.com Logo
Enter keywords:  

Track companies' patents here: Public Companies RSS Feeds | RSS Feed Home Page
Popular terms

[SEARCH]

Mems topics
Camera Module
Acceleration Sensor
Microelectromechanical Systems
Control Unit
Semiconductor Substrate
Semiconductor
Demodulation
Accelerometer
Calibration
Modulation
Mems Devices

Follow us on Twitter
twitter icon@FreshPatents

Web & Computing
Cloud Computing
Ecommerce
Search patents
Smartphone patents
Social Media patents
Video patents
Website patents
Web Server
Android patents
Copyright patents
Database patents
Programming patents
Wearable Computing
Webcam patents

Web Companies
Apple patents
Google patents
Adobe patents
Ebay patents
Oracle patents
Yahoo patents

[SEARCH]

Mems patents



      
           
This page is updated frequently with new Mems-related patent applications. Subscribe to the Mems RSS feed to automatically get the update: related Mems RSS feeds. RSS updates for this page: Mems RSS RSS


Multicast optical switch

Mems microphone packaging structure

Packaged microphone system with a permanent magnet

Date/App# patent app List of recent Mems-related patents
09/11/14
20140255730
 Scalable micro power cells with no-gap arrangement between electron and proton transfer elements patent thumbnailScalable micro power cells with no-gap arrangement between electron and proton transfer elements
Energy is probably one of the most important issues of the current century. New sources, approaches and systems have been studied in order to find suitable and more reliable power sources and energy harvesting devices.
09/11/14
20140254982
 Multicast optical switch patent thumbnailMulticast optical switch
Described herein is an optical switch (1), including 4 common port optical fibers (e.g. 3), disposed in a vertical y dimension, a wavelength independent beam splitter (5), a switching unit (7) and 16 add/drop optical fibers (e.g.
09/11/14
20140254851
 Mems microphone packaging structure patent thumbnailMems microphone packaging structure
The invention provides a mems microphone packaging structure for reducing the packaging structure volume, lowering manufacturing cost and improving impact resistance. The packaging structure has a large back cavity formed by a recess of a controlling chip and a deep hole of a mems microphone chip.
09/11/14
20140254835
 Packaged microphone system with a permanent magnet patent thumbnailPackaged microphone system with a permanent magnet
A microphone structure has a lid forming an interior chamber. The lid includes a permanent magnet for forming a permanent magnetic field.
09/11/14
20140253993
 Light field display with mems scanners patent thumbnailLight field display with mems scanners
A light field display device comprising an array of light field display elements, each display element comprising: a beam generator for generating an output beam of light; a radiance modulator for modulating the radiance of the beam over time; a focus modulator for modulating the focus of the beam over time; and a scanner for scanning the beam across a two-dimensional angular field, the scanner comprising a biaxial electromechanical scanning mirror comprising: a mirror, a platform, an inner frame, and an outer frame; the mirror attached to the platform via a post, the platform attached to the inner frame via a first pair of hinges, and the inner frame attached to the outer frame via a second pair of hinges; the first pair of hinges arranged substantially orthogonally to the second pair of hinges, thereby to allow biaxial movement of the mirror; the extent of the mirror larger than the extent of the inner frame.. .
09/11/14
20140253992
 Mems scanning mirror field of view provision methods and apparatus patent thumbnailMems scanning mirror field of view provision methods and apparatus
Embodiments of the present disclosure provide techniques and configurations for an optoelectronic assembly including a mems scanning mirror. In one embodiment, the mems scanning mirror may include a micro-scale mirror configured to be rotatable about a chord axis of the mirror to deflect an incident light beam into an exit window of the optoelectronic assembly, and a support structure configured to host the mirror to provide a light delivery field between a mirror surface and the exit window such that a path of the deflected light beam via the provided light delivery field to the exit window is un-obstructed.
09/11/14
20140253219
 Compensation of changes in mems capacitive transduction patent thumbnailCompensation of changes in mems capacitive transduction
A method for compensating for strain on a mems device includes generating a signal indicative of a strain on the mems device in a first mode of operating a system including the mems device. The method includes compensating for the strain in a second mode of operating the system based on the signal.
09/11/14
20140252512
 Methods and apparatus for mems structure release patent thumbnailMethods and apparatus for mems structure release
Methods and apparatus for mems release are disclosed. A method is described including providing a substrate including at least one mems device supported by a sacrificial layer; performing an etch in solution to remove the sacrificial layer from at least one mems device; immersing the substrate including the at least one mems device in an organic solvent; and while the substrate is immersed in the organic solvent, removing water from the organic solvent until the water remaining in the organic solvent is less than a predetermined threshold.
09/11/14
20140252511
 Mems apparatus patent thumbnailMems apparatus
A mems apparatus includes a pillar, a supporter, and a solder. The pillar has a first side and a second side opposite to the first side.
09/11/14
20140252510
 Signal boosting apparatus and method of boosting signals patent thumbnailSignal boosting apparatus and method of boosting signals
A signal boosting apparatus and a method of boosting signals applied in the mems are disclosed. The signal boosting apparatus includes a substrate, an oxide layer, and a signal transmission layer.
09/11/14
20140252509
Mems device and corresponding micromechanical structure with integrated compensation of thermo-mechanical stress
A micromechanical structure of a mems device, integrated in a die of semiconductor material provided with a substrate and having at least a first axis of symmetry lying in a horizontal plane, has a stator structure, which is fixed with respect to the substrate, and a rotor structure, having a suspended mass, mobile with respect to the substrate and to the stator structure as a result of an external action, the stator structure having fixed sensing electrodes capacitively coupled to the rotor structure; a compensation structure is integrated in the die for compensation of thermo-mechanical strains. The compensation structure has stator compensation electrodes, which are fixed with respect to the substrate, are capacitively coupled to the rotor structure, and are arranged symmetrically to the fixed sensing electrodes with respect to the first axis of symmetry..
09/11/14
20140252508
Mems device with a capping substrate
An integrated circuit device includes a dielectric layer disposed onto a first substrate, the dielectric layer having a sacrificial cavity formed therein. The circuit also includes a membrane layer formed onto the dielectric layer and suspended over the sacrificial cavity, and a capping substrate bonded to the membrane layer such that a second cavity is formed, the second cavity being connected to the sacrificial cavity though a via formed into the membrane layer..
09/11/14
20140252507
Self-sealing membrane for mems devices
Embodiments of the present disclosure are related to mems devices having a suspended membrane that are secured to and spaced apart from a substrate with a sealed cavity therebetween. The membrane includes openings with sidewalls that are closed by a dielectric material.
09/11/14
20140252506
Semi-conductor sensor fabrication
Methods of fabricating semiconductor sensor devices include steps of fabricating a hermetically sealed mems cavity enclosing a mems sensor, while forming conductive vias through the device. The devices include a first semi-conductor layer defining at least one conductive via lined with an insulator and having a lower insulating surface; a central dielectric layer above the first semiconductor layer; a second semiconductor layer in contact with the at least one conductive via, and which defines a mems cavity; a third semiconductor layer disposed above the second semiconductor layer, and which includes a sensor element aligned with the mems cavity; a cap bonded to the third semiconductor to enclose and hermetically seal the mems cavity; wherein the third semiconductor layer separates the cap and the second semiconductor layer..
09/11/14
20140252422
Cavity structures for mems devices
Embodiments relate to mems devices, particularly mems devices integrated with related electrical devices on a single wafer. Embodiments utilize a modular process flow concept as part of a mems-first approach, enabling use of a novel cavity sealing process.
09/11/14
20140252419
Mems device and method of manufacture
A mems logic device comprising agate which pivots on a torsion hinge, two conductive channels on the gate, one on each side of the torsion hinge, source and drain landing pads under the channels, and two body bias elements under the gate, one on each side of the torsion hinge, so that applying a threshold bias between one body bias element and the gate will pivot the gate so that one channel connects the respective source and drain landing pad, and vice versa. An integrated circuit with mems logic devices on the dielectric layer, with the source and drain landing pads connected to metal interconnects of the integrated circuit.
09/11/14
20140252358
Methods and apparatus for mems devices with increased sensitivity
Methods and apparatus for forming mems devices. An apparatus includes at least a portion of a semiconductor substrate having a first thickness and patterned to form a moveable mass; a moving sense electrode forming the first plate of a first capacitance; at least one anchor patterned from the semiconductor substrate and having a portion that forms the second plate of the first capacitance and spaced by a first gap from the first plate; a layer of semiconductor material of a second thickness patterned to form a first electrode forming a first plate of a second capacitance and further patterned to form a second electrode overlying the at least one anchor and forming a second plate spaced by a second gap that is less than the first gap; wherein a total capacitance is formed that is the sum of the first capacitance and the second capacitance.
09/11/14
20140251770
Switching device
An acceleration responsive switching device formed as a micro-electromechanical systems (mems) device in which components are deposited and etched on and or above a substrate. The device has a proof mass module.
09/11/14
20140251009
System and method for reducing offset variation in multifunction sensor devices
Systems and methods are provided for improved multifunction sensing. In these embodiments a multifunction sensing device (100) includes a microelectromechanical (mems) gyroscope (110) and at least a second sensor (112).
09/11/14
20140250971
System and method for monitoring an accelerometer
Systems and methods are provided for monitoring operation of mems accelerometers (100). In these embodiments a control loop (112) having a forward path (114) is coupled a mems transducer (110), and a test signal generator (124) and test signal detector (126) is provided.
09/11/14
20140250970
System and method for monitoring a gyroscope
Systems and methods are provided for monitoring operation of mems gyroscopes (110). A test signal generator (124) is configured to generate and apply a test signal to the rate feedback loop (112) of a mems gyroscope (110).
09/11/14
20140250969
Spread-spectrum mems self-test system and method
A mems sensor includes a micro-electromechanical structure, a detection circuit, and a self-test circuit to test the health of the mems sensor during runtime operations. The self-test circuit is configured to inject into the micro-electromechanical structure a plurality of injected test signals that are broad-band frequency-varying frequency signals, which are based on spread spectrum based modulation.
09/04/14
20140248730
Mems device and method of formation thereof
The present disclosure provides a method including providing a first substrate; and forming a microelectromechanical system (mems) device on a first surface of the first substrate. A bond pad is formed on at least one bonding site on the first surface of the first substrate.
09/04/14
20140247430
Image display system
In an image display system, a light distribution forming lens is placed between a laser light source and a spatial light modulator or a mems mirror device for adjusting a distribution of light intensity of the laser light so that light intensity at an exit pupil of a projection lens is greater in a radially intermediate part thereof than in a central part thereof. The light distribution lens is provided with a conical incident surface and a convex exit surface so as to function also as a collimator lens.
09/04/14
20140246949
Mems device, electronic device, electronic apparatus, and moving object
A mems device includes a substrate and a vibrator. The vibrator includes a first conductive layer and a second conductive layer.
09/04/14
20140246740
Implantation of gaseous chemicals into cavities formed in intermediate dielectrics layers for subsequent thermal diffusion release
The present invention generally relates to methods for increasing the lifetime of mems devices by reducing the landing velocity on switching by introducing gas into the cavity surrounding the switching element of the mems device. The gas is introduced using ion implantation into a cavity close to the cavity housing the switching element and connected to that cavity by a channel through which the gas can flow from one cavity to the other.
09/04/14
20140246739
Top port mems cavity package and method of manufacture thereof
A method for the manufacture of a package encasing a micro-electro-mechanical systems (mems) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity.
09/04/14
20140246738
Top port mems cavity package and method of manufacture thereof
A method for the manufacture of a package encasing a micro-electro-mechanical systems (mems) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity.
09/04/14
20140246737
Mems vibrator, method of manufacturing mems vibrator, electronic device, and moving object
A mems vibrator includes an insulating portion, a first electrode provided on one surface of the insulating portion, a fixed portion, and a function portion, a second electrode provided so that at least a portion thereof overlaps the first electrode at a distance therefrom. The second electrode comes into contact with the function portion and extends from the fixed portion..
09/04/14
20140246708
Mems structures and methods of forming the same
An integrated circuit device includes a first layer comprising at least two partial cavities, an intermediate layer bonded to the first layer, the intermediate layer formed to support at least two micro-electromechanical system (mems) devices, and a second layer bonded to the intermediate layer, the second layer comprising at least two partial cavities to complete the at least two partial cavities of the first layer through the intermediate layer to form at least two sealed full cavities. The at least two full cavities have different pressures within..
09/04/14
20140245810
Single motor dynamic calibration unit
A calibration unit, system, and method for calibrating a device under test are provided. The calibration unit, system, and method use a single axis rotational unit to calibrate devices under test on a test head.
08/28/14
20140241548
Acoustic sensor apparatus and acoustic camera for using mems microphone array
An acoustic camera for using a mems microphone array comprises: an acoustic sensor apparatus (30) comprising a print circuit board (20) on which the plural of mems microphone (10) are mounted, to send signals for the detected sound to a data collection unit (40); a data collection unit (40) connected to the acoustic sensor apparatus (30), which samples analog signals related to sound transmitted from the acoustic sensor apparatus (30) to transform into digital signals and transmit them to the central processing unit (40); a central processing unit (50) connected to the data collection unit (40), which calculates noise level based on digital signals related to sound transmitted from the data collection unit (40); and a display unit (60) which is connected to the central processing unit (50), which displays in color the noise level calculated at the central processing unit.. .
08/28/14
20140240894
Fractal structures for mems variable capacitors
In accordance with the present disclosure, one embodiment of a fractal variable capacitor comprises a capacitor body in a microelectromechanical system (mems) structure, wherein the capacitor body has an upper first metal plate with a fractal shape separated by a vertical distance from a lower first metal plate with a complementary fractal shape; and a substrate above which the capacitor body is suspended.. .
08/28/14
20140240810
Mems drive and beam-steering apparatus
A drive apparatus and a beam-steering apparatus fabricated from a mems process. The apparatus has a first layer, a second layer and a plurality of fluid-filled volumes defined there between.
08/28/14
20140239979
Capacitive mems sensor devices
A packaged capacitive mems sensor device includes at least one capacitive mems sensor element with at least one capacitive mems sensor cell including a first substrate having a thick and a thin dielectric region. A second substrate with a membrane layer is bonded to the thick dielectric region and over the thin dielectric region to provide a mems cavity.
08/28/14
20140239769
Capacitive micromachined ultrasonic transducer (cmut) device with through-substrate via (tsv)
A capacitive micromachined ultrasonic transducer (cmut) device includes at least one cmut cell including a first substrate having a top side including a patterned dielectric layer thereon including a thick and a thin dielectric region. A membrane layer is bonded on the thick dielectric region and over the thin dielectric region to provide a movable membrane over a micro-electro-mechanical system (mems) cavity.
08/28/14
20140239768
Capacitive micromachined ultrasonic transducer (cmut) with through-substrate via (tsv) substrate plug
A capacitive micromachined ultrasonic transducer (cmut) device includes at least one cmut cell including a first substrate of a single crystal material having a top side including a patterned dielectric layer thereon including a thick and a thin dielectric region, and a through-substrate via (tsv) extending a full thickness of the first substrate. The tsv is formed of the single crystal material, is electrically isolated by isolation regions in the single crystal material, and is positioned under a top side contact area of the first substrate.
08/28/14
20140239446
Fractal structures for fixed mems capacitors
An embodiment of a fractal fixed capacitor comprises a capacitor body in a microelectromechanical system (mems) structure. The capacitor body has a first plate with a fractal shape separated by a horizontal distance from a second plate with a fractal shape.
08/28/14
20140239423
Microelectromechanical system devices having through substrate vias and methods for the fabrication thereof
Methods for the fabrication of a microelectromechanical systems (“mems”) devices are provided. In one embodiment, the mems device fabrication method forming a via opening extending through a sacrificial layer and into a substrate over which the sacrificial layer has been formed.
08/28/14
20140239421
Surface charge mitigation layer for mems sensors
A semiconductor device includes a substrate. At least one transducer is provided on the substrate.
08/28/14
20140239353
Method for mems structure with dual-level structural layer and acoustic port
A method for fabricating a mems device includes depositing and patterning a first sacrificial layer onto a silicon substrate, the first sacrificial layer being partially removed leaving a first remaining oxide. Further, the method includes depositing a conductive structure layer onto the silicon substrate, the conductive structure layer making physical contact with at least a portion of the silicon substrate.
08/28/14
20140239089
Mems jetting structure for dense packing
A fluid ejector includes a fluid ejection module having a substrate and a layer separate from the substrate. The substrate includes a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle.
08/28/14
20140238828
Merged legs and semi-flexible anchoring for mems device
The present invention generally relates to a mems device having a plurality of cantilevers that are coupled together in an anchor region and/or by legs that are coupled in a center area of the cantilever. The legs ensure that each cantilever can move/release from above the rf electrode at the same voltage.
08/28/14
20140238574
Design of a mold for forming complex 3d mems components
A mold structure having high-precision multi-dimensional components includes: depositing an oxide layer on a top surface of a plurality of semiconductor substrates, patterning a design integrated in one or more of the oxide layers; repositioning the substrates to enable the oxide layers make contact with one another; bonding in sequential order the repositioned substrates using a dielectric bonding, forming a three dimension (3d) mold; filling the 3d mold with filling material and removing the overburden filling material present on a top surface of the component.. .
08/28/14
20140238132
Mems resonant accelerometer
Provided is a micro electro mechanical system (mems) resonating accelerometer. The mems resonating accelerometer according to the present invention comprises: a first inertial mass; a second inertial mass which is spaced at a predetermined distance from the first inertial mass on a first axis; an elastic body which is provided between the first and second inertial masses so as to apply elasticity; and a tuning fork which is connected to the elastic body and measures the change of frequency according to acceleration, wherein the longitudinal direction of the tuning fork is parallel to a second axis which is perpendicular to the first axis, the elastic body has an opening portion being in a circular shape with a portion thereof removed, and one end of the tuning fork penetrates the opening portion and is connected to the inner surface of the elastic body..
08/21/14
20140236479
Attitude estimation for pedestrian navigation using low cost mems accelerometer in mobile applications, and processing methods, apparatus and systems
A user-heading determining system (10) for pedestrian use includes a multiple-axis accelerometer (110) having acceleration sensors; a device-heading sensor circuit (115) physically situated in a fixed relationship to the accelerometer (110); an electronic circuit (100) operable to generate signals representing components of acceleration sensed by the accelerometer (110) sensors, and to electronically process at least some part of the signals to produce an estimation of attitude of a user motion with respect to the accelerometer, and further to combine the attitude estimation (750, α) with a device heading estimation (770, ψ) responsive to the device-heading sensor circuit, to produce a user heading estimation (780); and an electronic display (190) responsive to the electronic circuit (100) to display information at least in part based on the user heading estimation. Other systems, circuits and processes are also disclosed..
08/21/14
20140232475
Single insertion trimming of highly accurate reference oscillators
A highly integrated monolithic self-compensated oscillator (sco) with high frequency stability versus temperature variations is described, together with a cost effective single insertion point trimming (spt) algorithm. The spt is utilized to adjust the phase and frequency of the sco to meet frequency stability versus temperature and frequency accuracy requirements for a reference clock.
08/21/14
20140232241
Piezoelectric array employing integrated mems switches
Switchable micromachined transducer arrays are described where a microelectromechanical systems (mems) switch, or relay, is monolithically integrated with a transducer element. In embodiments, the mems switch is implemented in the same substrate as the transducer array to implement one or more logic, addressing, or transducer control function.
08/21/14
20140231979
Stacked assembly of a mems integrated device having a reduced thickness
An assembly of a mems integrated device envisages: a package having a base substrate with a main surface in a horizontal plane, and a coating set on the base substrate; a first body including semiconductor material and integrating a micromechanical structure, housed within the package on the base substrate; at least one second body including semiconductor material and integrating at least one electronic component, designed to be functionally coupled to the micromechanical structure, the first body and the second body being arranged within the package stacked in a vertical direction transverse to the horizontal plane. In particular, at least one between the first body and the base substrate defines a first recess, in which the second body is housed, at least in part..
08/21/14
20140231939
Capacitive pressure sensor and method
In one embodiment, a method of forming a mems device includes providing a silicon wafer with a base layer and an intermediate layer above an upper surface of the base layer. A first electrode is defined in the intermediate layer and an oxide portion is provided above an upper surface of the intermediate layer.
08/21/14
20140231938
Micro-electro-mechanical device with buried conductive regions, and manufacturing process thereof
A mems device formed by a body; a cavity, extending above the body; mobile and fixed structures extending above the cavity and physically connected to the body via anchoring regions; and electrical-connection regions, extending between the body and the anchoring regions and electrically connected to the mobile and fixed structures. The electrical-connection regions are formed by a conductive multilayer including a first semiconductor material layer, a composite layer of a binary compound of the semiconductor material and of a transition metal, and a second semiconductor material layer..
08/21/14
20140231936
Micro-electro-mechanical system (mems) and related actuator bumps, methods of manufacture and design structures
Micro-electro-mechanical system (mems) structures, methods of manufacture and design structures are provided. The method of forming a mems structure includes forming fixed actuator electrodes and a contact point on a substrate.
08/21/14
20140231254
Method of fabricating a nanochannel system for dna sequencing and nanoparticle characterization
A process for fabricating a nanochannel system using a combination of microelectromechanical system (mems) microfabrication techniques, atomic force microscopy (afm) nanolithography, and focused ion beam (fib). The nanochannel system, fabricated on either a glass or silicon substrate, has channel heights and widths on the order of single to tens of nanometers.
08/21/14
20140231236
Micro-electro-mechanical system (mems) capacitive ohmic switch and design structures
A micro-electro-mechanical system (mems), methods of forming the mems and design structures are provided. The method includes forming a coplanar waveguide (cpw) comprising a signal electrode and a pair of electrodes on a substrate.
08/21/14
20140230576
Sub-millinewton capacitive mems force sensor for mechanical testing on a microscope
Most mechanical tests (compression testing, tensile testing, flexure testing, shear testing) of samples in the sub-mm size scale are performed under the observation with an optical microscope or a scanning electron microscope. However, the following problems exist with prior art force sensors as e.g they cannot be used for in-plane mechanical testing (a- and b-direction) of a sample; they cannot be used for vertical testing (c-direction) of a sample.
08/21/14
20140230560
Three dimensional piezoelectric mems
Method and apparatus for a piezoelectric apparatus are provided. In some embodiments, a method for fabricating a piezoelectric device may include etching a series of vertical trenches in a top substrate portion, depositing a first continuous conductive layer over the trenches and substrate, depositing a continuous piezoelectric layer over the first continuous conductive layer such that the piezoelectric material has trenches and sidewalls, depositing a second continuous conductive layer over the continuous piezoelectric layer, etching through the vertical trenches of the first continuous conductive layer, continuous piezoelectric layer, second continuous conductive layer, and top substrate portion into a bottom substrate portion, etching a series of horizontal trenches in the bottom substrate portion such that the horizontal trenches and vertical trenches occupy a continuous free space and allow movement of a piezoelectric mems device created by the above method in three dimensions..
08/21/14
20140230550
Accelerometer with low sensitivity to thermo-mechanical stress
The invention relates to a microelectro-mechanical structure (mems), and more particularly, to systems, devices and methods of compensating effect of thermo-mechanical stress on a micro-machined accelerometer by incorporating and adjusting elastic elements to couple corresponding sensing electrodes. The sensing electrodes comprise moveable electrodes and stationary electrodes that are respectively coupled on a proof mass and a substrate.
08/21/14
20140230549
Spring system for mems device
A spring system (74) links a pair of drive masses (30, 32) of a mems device (72). The spring system (74) includes stiff beams (76, 78, 80, 82) oriented to form a parallelogram arrangement (84).
08/21/14
20140230547
Microelectromechanical bulk acoustic wave devices and methods
Micromachined gyroscopes, such as those based upon microelectromechanical systems (mems) have the potential to dominate the rate-sensor market mainly due to their small size, low power and low cost. As mems gyroscopes are resonant devices requiring active excitation it would be beneficial to improve the resonator q-factor reducing the electrical drive power requirements for the excitation circuitry.
08/14/14
20140227817
Manufacturing process of mems device
A manufacturing process of a m ems device divides a substrate for fabricating u mems component into two electrically isolated regions, so that the mems component and the circuit disposed on its surface could connect electrically with another substrate below respectively through the corresponding conducing regions, whereby the configuration of the electrical conducting paths and the manufacturing process are simplified. A mems device manufactured by using the aforementioned process is also disclosed herein..
08/14/14
20140227816
Method to package multiple mems sensors and actuators at different gases and cavity pressures
A method for fabricating a multiple mems device. A semiconductor substrate having a first and second mems device, and an encapsulation wafer with a first cavity and a second cavity, which includes at least one channel, can be provided.
08/14/14
20140226838
Signal source separation
In one aspect, a microphone with closely spaced elements is used to acquire multiple signals from which a signal from a desired source is separated. The signal separation approach uses a combination of direction-of-arrival information or other information determined from variation such as phase, delay, and amplitude among the acquired signals, as well as structural information for the signal from the source of interest and/or for the interfering signals.


Popular terms: [SEARCH]

Mems topics: Camera Module, Acceleration Sensor, Microelectromechanical Systems, Control Unit, Semiconductor Substrate, Semiconductor, Demodulation, Accelerometer, Calibration, Modulation, Mems Devices

Follow us on Twitter
twitter icon@FreshPatents

###

This listing is a sample listing of patent applications related to Mems for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Mems with additional patents listed. Browse our RSS directory or Search for other possible listings.
     SHARE
  
         


FreshNews promo



0.5825

0

0 - 0 - 71