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This page is updated frequently with new Mems-related patent applications. Subscribe to the Mems RSS feed to automatically get the update: related Mems RSS feeds. RSS updates for this page: Mems RSS RSS


Mems process and device

Mems process and device

Mems variable capacitor with enhanced rf performance

Mems variable capacitor with enhanced rf performance

Mems variable capacitor with enhanced rf performance

Liquid ion detector

Date/App# patent app List of recent Mems-related patents
11/20/14
20140341504
 Optical cross-connect switch with configurable optical input/output ports patent thumbnailOptical cross-connect switch with configurable optical input/output ports
An optical cross-connect switch having a fiber collimator array (fca), a mems mirror array, and a folded 4f relay system. Each optical fiber in the fca can work as an input fiber or an output fiber.
11/20/14
20140341402
 Mems process and device patent thumbnailMems process and device
A method of fabricating a micro-electrical-mechanical system (mems) transducer comprises the steps of forming a membrane on a substrate, and forming a back-volume in the substrate. The step of forming a back-volume in the substrate comprises the steps of forming a first back-volume portion and a second back-volume portion, the first back-volume portion being separated from the second back-volume portion by a step in a sidewall of the back-volume.
11/20/14
20140340814
 Mems variable capacitor with enhanced rf performance patent thumbnailMems variable capacitor with enhanced rf performance
In a mems device, the manner in which the membrane lands over the rf electrode can affect device performance. Bumps or stoppers placed over the rf electrode can be used to control the landing of the membrane and thus, the capacitance of the mems device.
11/20/14
20140340093
 Liquid ion detector patent thumbnailLiquid ion detector
A system and method comprising a liquid interface with an electrode. The electrode may be coupled to a mems-based electrometer for sensing small amounts of charge imposed on the electrode.
11/20/14
20140339953
 Mems resonator active temperature compensation method and thermally-actuated mems resonator patent thumbnailMems resonator active temperature compensation method and thermally-actuated mems resonator
A mems resonator active temperature compensation method is provided. The mems resonator active temperature compensation method includes: a mems resonator is provided, wherein a structural resistance of the mems resonator is varied with an environmental temperature; a structural resistance shift value is formed by a variation of the environmental temperature; an electrical circuit is provided, wherein the electrical circuit is electrically connected with the mems resonator for providing an adjustment mechanism to the mems resonator; and a compensation value is provided from the adjustment mechanism for controlling the structural resistance shift value..
11/20/14
20140339688
 Techniques for the cancellation of chip scale packaging parasitic losses patent thumbnailTechniques for the cancellation of chip scale packaging parasitic losses
The present invention generally relates to techniques and structures that cancel or mitigate rf coupling from the rf circuit to the silicon die. To cancel or mitigate the rf coupling, a conductive coating may be formed over the rf-mems device.
11/20/14
20140339659
 Method of manufacturing a semiconductor integrated circuit device having a mems element patent thumbnailMethod of manufacturing a semiconductor integrated circuit device having a mems element
In a method of manufacturing a semiconductor integrated circuit device having an mems element over a single semiconductor chip, the movable part of the mems element is fixed before the formation of a rewiring. After formation of the rewiring, the wafer is diced.
11/20/14
20140339658
 Device comprising a spring and an element suspended thereon, and method for manufacturing same patent thumbnailDevice comprising a spring and an element suspended thereon, and method for manufacturing same
The invention relates to an mems structure with a stack made of different layers and a spring-and-mass system varying in its thickness which is formed of the stack, and wherein, starting from a back side of the stack and the substrate, at laterally different positions, the substrate while leaving the first semiconductor layer, or the substrate, the first etch-stop layer and the first semiconductor layer are removed, and to a method for manufacturing such a structure.. .
11/20/14
20140339657
 Piezoelectric mems microphone patent thumbnailPiezoelectric mems microphone
A piezoelectric mems microphone comprising a multi-layer sensor that includes at least one piezoelectric layer between two electrode layers, with the sensor being dimensioned such that it provides a near maximized ratio of output energy to sensor area, as determined by an optimization parameter that accounts for input pressure, bandwidth, and characteristics of the piezoelectric and electrode materials. The sensor can be formed from single or stacked cantilevered beams separated from each other by a small gap, or can be a stress-relieved diaphragm that is formed by deposition onto a silicon substrate, with the diaphragm then being stress relieved by substantial detachment of the diaphragm from the substrate, and then followed by reattachment of the now stress relieved diaphragm..
11/20/14
20140339656
 Mems pressure transducer assembly patent thumbnailMems pressure transducer assembly
An assembly (20) includes a mems die (22) having a pressure transducer device (40) formed on a substrate (44) and a cap layer (38). A packaging process (74) entails forming the device (40) on the substrate, creating an aperture (70) through a back side (58) of the substrate underlying a diaphragm (46) of the device (40), and coupling a cap layer (38) to the front side of the substrate overlying the device.
11/20/14
20140339655
Mems package structure
A mems package structure, including a substrate, an interconnecting structure, an upper metallic layer, a deposition element and a packaging element is provided. The interconnecting structure is disposed on the substrate.
11/20/14
20140339607
Fabricating polysilicon mos devices and passive esd devices
A semiconductor fabrication is described, wherein a mos device and a mems device is fabricated simultaneously in the beol process. A silicon layer is deposited and etched to form a silicon film for a mos device and a lower silicon sacrificial film for a mems device.
11/20/14
20140339441
Aerosol ionizer
A system and method comprising an ion production chamber having a plasma source disposed in said chamber, a harvest gas disposed to flow through the chamber from an inlet to an outlet, and a jet, said jet operable to introduce a sample into the harvest gas flow. In some embodiments the system includes using helium as the harvest gas.
11/20/14
20140338452
Tri-axial mems accelerometer
A tri-axial mems accelerometer includes a top cap silicon wafer and a bottom cap silicon wafer coupled with a measurement mass. The measurement mass has a two level structure, each level having an inner frame coupled to an outer frame by a plurality of first elastic beams, a mass coupled to the inner frame by a plurality of second elastic beams, and a comb coupling structure between the mass and the inner frame.
11/13/14
20140338075
Vertical embedded sensor and process of manufacturing thereof
A scanning probe assembly having a nanometer sensor element defined at a tip apex and its method of fabrication using micro-electromechanical systems (mems) processing techniques. The assembly comprises a probe body, a cantilever extending outward, and a hollow tip at the end of the cantilever.
11/13/14
20140336641
Surgical instruments including mems devices
Surgical instruments are disclosed that are couplable to or have an end effector or a disposable loading unit with an end effector, and at least one micro-electromechanical system (mems) device operatively connected to the surgical instrument for at least one of sensing a condition, measuring a parameter and controlling the condition and/or parameter.. .
11/13/14
20140335640
Biomems and planar light circuit with integrated package
A biomems microelectromechanical apparatus and for fabricating the same is disclosed. A substrate is provided with at least one signal conduit formed on the substrate.
11/13/14
20140334991
Thermally or photochemically activated small molecule delivery platform
Thermally or photochemically activated small molecule delivery polymers and platforms enable ‘on-demand’ delivery of a vapor-phase lubricant, such as pentanol or other alcohols, that enable scheduled or as-needed lubrication of mems devices, thereby greatly improving the reliability and lifespan of the devices.. .
11/13/14
20140334607
Diffraction leveraged modulation of x-ray pulses using mems-based x-ray optics
A method and apparatus are provided for implementing bragg-diffraction leveraged modulation of x-ray pulses using microelectromechanical systems (mems) based diffractive optics. An oscillating crystalline mems device generates a controllable time-window for diffraction of the incident x-ray radiation.
11/13/14
20140332947
Packages and methods for packaging
Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (mems) device.
11/13/14
20140332913
Micro-electro-mechanical system (mems) structures and design structures
Dummy micro-electro-mechanical system (mems) structures, methods of manufacture and design structures are disclosed. The method includes forming a bumper extending from a micro-electro-mechanical system (mems) beam structure provided within a cavity structure.
11/13/14
20140332910
Microelectromechanical device and a method of manufacturing
A microelectromechanical device that comprises a wafer plate, a group of one or more wafer connector elements, and an electrical distribution layer between them. For reduced device thickness, the wafer plate comprises at least two dies and bonding material that bonds the at least two dies alongside each other to the longitudinal extent of the wafer plate, wherein at least one of the dies is a microelectromechanical die.
11/13/14
20140332909
Integrated chip with micro-electro-mechanical system and integrated circuit mounted therein and method for manufacturing the same
The invention relates to an integrated chip with an mems and an integrated circuit mounted therein and a method for manufacturing the same. The method includes the steps of: s1: providing a first chip, wherein the first chip comprises a first substrate, an mems component layer formed on the first substrate and comprising a first electrical bonding point disposed on mems the component layer; s2: providing a second chip with an ic integrated circuit, wherein the second chip comprises a second lead layer and a second electrical bonding point; s3: bonding the first electrical bonding point and the second electrical bonding point; s4: processing a thinning operation for the bottom surface of the first substrate; and s5: forming an electrical connection layer electrically connected to an external circuit on the bottom surface of the first substrate..
11/13/14
20140331770
Mechanical connection forming a pivot for mems and nems mechanical structures
A mechanical connection between two parts of a microelectromechanical and/or nanoelectromechanical structure forming a pivot with an axis of rotation pivot includes two first beams with an axis parallel to the pivot axis, the first beams configured to work in torsion, and two second beams with an axis orthogonal to the axis of the first beams, the second beams configured to work in bending, each one of the first and second beams being connected at their ends to the two parts of the structure.. .
11/13/14
20140331769
Mems sensors
A mems sensor comprises a vibrating sensing structure formed from a semiconductor substrate layer (50). The semiconductor substrate layer (50) is mounted on a pedestal comprising an electrically insulating substrate layer (52) bonded to the semiconductor substrate (50) to form a rectangular sensor chip.
11/13/14
20140331484
Mems switch with reduced dielectric charging effect
The present disclosure provides methods of fabricating a micro-electro-mechanical systems (mems) switch. The methods include providing a substrate, forming a first dielectric layer disposed above the substrate, forming a bump above the first dielectric layer, providing a movable member including a top actuation electrode, and forming at least one support member that includes the first dielectric layer and is directly below the top actuation electrode.
11/06/14
20140331367
Motion sensor integrated nano-probe n/mems apparatus, method, and applications
A multi-tip nano-probe apparatus and a method for probing a sample while using the multi-tip nano-probe apparatus each employ located over a substrate: (1) an immovable probe tip with respect to the substrate; (2) a movable probe tip with respect to the substrate; and (3) a motion sensor that is coupled with the movable probe tip. The multi-tip nano-probe apparatus and related method provide for improved sample probing due to close coupling of the motion sensor with the movable probe tip, and also retractability of the movable probe tip with respect to the immovable probe tip..
11/06/14
20140329392
Coatings for relatively movable surfaces
A device has a microelectromechanical system (mems) component with at least one surface and a coating disposed on at least a portion of the surface. The coating has a compound of the formula m(cnf2n+1or), wherein m is a polar head group and wherein n≧2r.
11/06/14
20140328597
Trackable wireless optical communication
Embodiments provide a first communications device configured to communicate with one or more other communications devices over a wireless optical link. The first communications device may include a first communications structure configured to communicate with a second communications structure via the wireless optical link.
11/06/14
20140327946
Mems scanning micromirror
A mems-micro-mirror (30) is provided comprising a mirror body (50) that is rotatably arranged in a mirror frame (60) around a rotation axis (58) extending in a plane defined by the mirror body. The rotation axis extends through a first and a second mutually opposite end-portion (51, 53) of the mirror body.
10/30/14
20140322854
Method for manufacturing a mems sensor
A capacitance type gyro sensor includes a semiconductor substrate, a first electrode integrally including a first base portion and first comb tooth portions and a second electrode integrally including a second base portion and second comb tooth portions, formed by processing the surface portion of the semiconductor substrate. The first electrode has first drive portions that extend from opposed portions opposed to the respective second comb tooth portions on the first base portion toward the respective second comb tooth portions.
10/30/14
20140321687
Mems microphone with out-gassing openings and method of manufacturing the same
An acoustic apparatus includes a substrate, micro electro mechanical system (mems) die, and an integrated circuit. The substrate includes a permanent opening that extends there through.
10/30/14
20140321159
Light guide plate and backlight module having same
A backlight module includes a light guide plate and a light source module. The light guide plate includes a light incident surface.
10/30/14
20140320944
Gimbaled scanning micro-mirror apparatus
A micro-electro-mechanical systems (mems) device for actuating a gimbaled element, the device comprising a symmetric electromagnetic actuator for actuating one degree of freedom (dof) and a symmetric electrostatic actuator for actuating the second degree of freedom.. .
10/30/14
20140320847
Temporary optical wave diffusion-promoting film adhered to lidded mems wafer for testing using interferometer
A temporary optical wave diffusion-promoting film is adhered to a lidded microelectromechanical systems (mems) wafer. Testing is performed on the lidded mems wafer using an interferometer directed towards the temporary optical wave diffusion-promoting film applied to the lidded mems wafer.
10/30/14
20140319631
Mems integrated pressure sensor devices having isotropic cavities and methods of forming same
A method embodiment includes providing a mems wafer comprising an oxide layer, a mems substrate, a polysilicon layer. A carrier wafer comprising a first cavity formed using isotropic etching is bonded to the mems, wherein the first cavity is aligned with an exposed first portion of the polysilicon layer.
10/30/14
20140319630
Wafer level assembly of a mems sensor device and related mems sensor device
An assembly of a mems sensor device envisages: a first die, integrating a micromechanical detection structure and having an external main face; a second die, integrating an electronic circuit operatively coupled to the micromechanical detection structure, electrically and mechanically coupled to the first die and having a respective external main face. Both of the external main faces of the first die and of the second die are set in direct contact with an environment external to the assembly, without interposition of a package..
10/30/14
20140318960
Micromachined oxygen sensor and method of making the same
The design and manufacture method of an oxygen concentration sensor made with silicon micromachining (a.k.a. Mems, micro electro mechanical systems) process for applications of oxygen measurement with fast response time and low power consumption is disclosed in the present invention.
10/30/14
20140318656
Mems pressure sensors with integrated baffles
A pressure sensor system may sense the pressure of a gas or liquid. The system may include a housing that has an entry port for the gas or liquid; a pressure sensor within the housing; and a baffle positioned between the entry port and the pressure sensor.
10/23/14
20140316708
Oriented wireless structural health and seismic monitoring
A sensor for structural health monitoring includes a tri-axis microelectromechanical systems (mems) accelerometer and a tri-axis mems gyrometer. Sampled 3d accelerometer data and 3d gyrometer data are processed using integration and sensor fusion to produce an estimate of 3d rotation of the sensor device and an estimate of 3d displacement of the sensor device expressed in a global reference frame.
10/23/14
20140314254
Micromechanical detection structure for a mems acoustic transducer and corresponding manufacturing process
A micromechanical structure for a mems capacitive acoustic transducer, has: a substrate made of semiconductor material, having a front surface lying in a horizontal plane; a membrane, coupled to the substrate and designed to undergo deformation in the presence of incident acoustic-pressure waves; a fixed electrode, which is rigid with respect to the acoustic-pressure waves and is coupled to the substrate by means of an anchorage structure, in a suspended position facing the membrane to form a detection capacitor. The anchorage structure has at least one pillar element, which is at least in part distinct from the fixed electrode and supports the fixed electrode in a position parallel to the horizontal plane..
10/23/14
20140313558
Mems device with asymmetric flexures
A microelectromechanical systems (mems) device includes a scanning platform suspended from a fixed platform by two flexures that form a pivot axis. The two flexures may be symmetric or asymmetric about a centerline of the scanning platform.
10/23/14
20140313557
Mems device with multi-segment flexures
A microelectromechanical systems (mems) device includes a scanning platform suspended from a fixed platform by two flexures that form a pivot axis. The two flexures may be symmetric or asymmetric about a centerline of the scanning platform.
10/23/14
20140313355
Micro electro mechanical systems device and apparatus for compensating tremble
Disclosed are a micro electro mechanical systems (mems) device and an apparatus for compensating for a tremble. The mems device includes a substrate; a driven member moving relative to the substrate; an elastic member connected to the driven member and the substrate; a driving member fixed to the substrate for driving the driven member; and a dynamic stopper fixed to the substrate and latched to the driven member..
10/23/14
20140313074
Satellite reception assembly installation and maintenance
A direct broadcast satellite (dbs) reception assembly may receive a desired satellite signal and process the desired satellite signal for output to a gateway. The dbs assembly may also receive one or more undesired satellite signals and determine a performance metric of the one or more undesired satellite signals.
10/23/14
20140312734
Vibrator, oscillator, electronic device, moving object, and method of manufacturing vibrator
A mems vibrator includes a substrate, a lower electrode provided on a main surface of the substrate, a fixed portion provided on the main surface, and an upper electrode which is separated from the substrate and is supported by the fixed portion. The upper electrode is a vibrating body having a region overlapping the lower electrode when the substrate is seen in plan view, and includes a weight portion in a region provided with an antinode portion of vibration of the upper electrode as the vibrating body..
10/23/14
20140312733
Mems vibrator, electronic apparatus, and moving object
A mems vibrator includes: a vibrating portion; an electrode portion provided to face the vibrating portion with a gap therebetween; and a support portion extended in a first direction from the vibrating portion. The vibrating portion includes a functional portion having a different thickness viewed from the first direction..
10/23/14
20140312436
Method of fabricating mems device having release etch stop layer
A method of fabricating a microelectromechanical (mems) device includes bonding a transducer wafer to a substrate wafer along a bond interface. An unpatterned transducer layer included within the transducer wafer is patterned.
10/23/14
20140312435
Mems device with stress isolation and method of fabrication
A mems device (20) includes a proof mass structure (26) and beams (28, 30) residing in a central opening (32) of the proof mass structure (26), where the structure and the beams are suspended over a substrate (22). The beams (28, 30) are oriented such that lengthwise edges (34, 36) of the beams are beside one another.
10/23/14
20140311247
Multi-axis mems rate sensor device
A mems rate sensor device. In an embodiment, the sensor device includes a mems rate sensor configured overlying a cmos substrate.
10/23/14
20140311242
Multi-axis integrated mems inertial sensing device on single packaged chip
A multi-axis integrated mems inertial sensor device. The device can include an integrated 3-axis gyroscope and 3-axis accelerometer on a single chip, creating a 6-axis inertial sensor device.
10/23/14
20140311241
Mems pressure sensor, electronic device, altimeter, electronic apparatus, and moving object
A mems pressure sensor includes a diaphragm portion that becomes displaced according to a pressure, and a resonator arranged on a main surface of the diaphragm portion. The resonator includes: a first fixed electrode provided on the main surface; and a drive electrode having a second fixed electrode provided on the main surface, a movable electrode spaced apart from the first fixed electrode, overlapping with the first fixed electrode, as viewed in a plan view seen from a normal direction to the main surface, and driven in a direction that intersects the main surface, and a supporting electrode supporting the movable electrode and connected to the second fixed electrode..
10/23/14
20140310967
Method and system for determining vehicle wheel alignment based on the application of systems using gyroscopic sensors and/or mems angular rate sensors (mems gyroscopes)
The invention relates to a method and system for determining vehicle wheel alignment, and namely, camber angles, total and individual toe and front wheel steering axis caster and tilt angles (caster and kingpin inclination), by measuring changes in wheel sensor angles from a predetermined position. Changes are measured using gyroscopic sensors or mems angular rate sensors (mems gyroscopes)..
10/23/14
20140310914
Mems hinges with enhanced rotatability
A mechanical device includes a long, narrow element made of a rigid, elastic material. A rigid frame is configured to anchor at least one end of the element, which is attached to the frame, and to define a gap running longitudinally along the element between the beam and the frame, so that the element is free to move within the gap.
10/16/14
20140309577
Smart shunt devices and methods
Devices and methods for the measurement and control of fluid using one or two capacitors are described. The devices use micro-electro-mechanical-systems (mems) and radio-frequency inductive coupling to sense the properties of a fluid in a tube.
10/16/14
20140308822
Deposition technique for depositing a coating on a device
The present invention describes a deposition method suitable for depositing a coating on a device. The method is particularly suited for depositing a self assembled monolayer (sam) coating on a micro electro-mechanical structures (mems).
10/16/14
20140308771
Micro-electro-mechanical system (mems) structures and design structures
Micro-electro-mechanical system (mems) structures, methods of manufacture and design structures are disclosed. The method includes forming a micro-electro-mechanical system (mems) beam structure by venting both tungsten material and silicon material above and below the mems beam to form an upper cavity above the mems beam and a lower cavity structure below the mems beam..
10/16/14
20140308757
Mems device and a method of making the same
A mems gyro is provided, having a movable portion, a non-movable portion, and a magnetic sensing structure that comprises a magnetic source disposed at the movable portion, a magnetic sensing element positioned at the non-movable portion. The movable portion is capable of moving in response to external angular velocity or an external accelerator such that the magnetic field sensed by the magnetic sensing element is in relation to the movement of the movable portion, therefore, the angular velocity or the accelerator.
10/16/14
20140307885
Differential outputs in multiple motor mems devices
An the acoustic apparatus comprising a first mems motor that includes a first diaphragm and a first back plate, and a second mems motor that includes a second diaphragm and a second back plate. The first motor is biased with a first electrical polarity and a second motor is biased with a second electrical polarity such that the first electrical polarity and the second electrical polarity are opposite.
10/16/14
20140307032
Membrane mems actuator including fluidic impedance structure
A liquid dispenser includes a first liquid chamber including a nozzle and a second liquid chamber. A flexible membrane is positioned to separate and fluidically seal the first liquid chamber and the second liquid chamber.
10/16/14
20140306623
Integrated mems design for manufacturing
A method of operating a system including a mems device of an integrated circuit die includes generating an indicator of a device parameter of the mems device in a first mode of operating the system using a monitor structure formed using a mems structural layer of the integrated circuit die. The method includes generating, using a cmos device of the integrated circuit die, a signal indicative of the device parameter and based on the indicator.
10/16/14
20140306312
Mems sensor packaging and method thereof
A micro electro mechanical systems (mems sensor packaging includes a first wafer having a readout integrated circuit (roic) formed thereon., a second wafer disposed corresponding to the first wafer and having a concave portion on one side thereof and a mems sensor prepared on the concave portion, joint solders formed along a surrounding of the mems sensor and sealing the mems sensor jointing the first and second wafers, and pad solders formed to electrically connect the roic circuit of the first wafer and the mems sensor of the second wafer. According to the present disclosure, in joining and packaging a wafer having the roic formed thereon and a wafer having the mems sensor formed thereon, the size of a package can be reduced and an electric signal can be stably provided by forming internally pad solders for electrically connecting the roic and the mems sensor..
10/16/14
20140306301
Silicon substrate mems device
A mems device includes a silicon substrate. The silicon substrate includes a plurality of dielectric material grooves spaced apart from each other.
10/16/14
20140305208
Mems inertial sensor and method of inertial sensing
The invention comprises an inertial sensor comprising a frame, a proof mass, a first resonant element, the first resonant element being fixed to the frame and electrostatically coupled to the proof mass, and a second resonant element, the second resonant element being fixed to the frame, adjacent to the first resonant element such that there is substantially no electrostatic coupling between the second resonant element and the proof mass. A coupling is provided between the first resonant element and the second resonant element.
10/16/14
20140305207
Electronic drive circuit for a mems type resonator device and method for actuating the same
The electronic circuit (1) is for driving a resonator (2) of a mems resonator device. The resonator includes a mass (m) connected to a spring (k) and a damping element (d), an actuation element (cact) for actuating the mass via an actuation signal (drive), and a detection element (cdet) for detecting motion of the mass.


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Mems topics: Camera Module, Acceleration Sensor, Microelectromechanical Systems, Control Unit, Semiconductor Substrate, Semiconductor, Demodulation, Accelerometer, Calibration, Modulation, Mems Devices

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