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Mems patents

      

This page is updated frequently with new Mems-related patent applications.




 Low-cost  testing the signal-to-noise ratio of mems microphones patent thumbnailLow-cost testing the signal-to-noise ratio of mems microphones
A method is provided for testing a mems microphone. The mems microphone includes a pressure sensor positioned within a housing and a pressure input port to direct acoustic pressure from outside the housing towards the pressure sensor.
Robert Bosch Gmbh


 System and  all electrical noise testing of mems microphones in production patent thumbnailSystem and all electrical noise testing of mems microphones in production
Systems and methods for electrical testing of noise in a multi-membrane micro-electro-mechanical systems (mems) microphone are disclosed. The mems system has a test mode that includes placing the microphones' mems biasing networks into a reset mode, adjusting the first bias voltage for the first mems sensor such that a polarity matches the polarity of the bias voltage of the second mems sensor.
Robert Bosch Gmbh


 Mems microphone package patent thumbnailMems microphone package
In one embodiment a micro-electro-mechanical system (mems) microphone package includes a multiple layer substrate, an upper acoustic port formed through a plurality of upper layers of the multiple layer substrate and exposing an upper surface of a membrane portion, a lower acoustic port formed through a plurality of lower layers of the multiple layer substrate and exposing a lower surface of the membrane portion, a ring trench formed through at least one of the plurality of upper layers and exposing a metal ring, a mems die located above the ring trench, a copper pillar ring extending between the metal ring and the mems die, and a solder pillar ring positioned on a first surface of the copper pillar ring, the copper pillar ring and solder pillar ring attaching the mems die to the metal ring.. .
Robert Bosch Gmbh


 Loud speaker arrangement with circuit-board-integrated asic patent thumbnailLoud speaker arrangement with circuit-board-integrated asic
The present invention relates to a loudspeaker array (1) comprising a printed circuit board (2); a mems loudspeaker (3), which is intended for generating sound waves in the audible wavelength range and which has a diaphragm (9) deflectable along a z axis; a sound-conducting channel (21), which is adjacent to the mems loudspeaker (3) and which has an acoustic outlet opening (22); and an asic (4), which is electrically connected to the mems loudspeaker (3). Furthermore, the printed circuit board (2) comprises a first circuit board cavity (11), in which the asic (4) is disposed so as to be fully integrated into the printed circuit board (2).
Usound Gmbh


 Dual band mems acoustic device patent thumbnailDual band mems acoustic device
A device includes a first microelectromechanical systems (mems) transducer, a second mems transducer and a summing device. A first dimension of the first mems transducer is predefined to configure the first mems transducer to have a first resonance frequency.
Knowles Electronics, Llc


 Micromechanical frequency divider patent thumbnailMicromechanical frequency divider
A micro-electromechanical system (mems) frequency divider apparatus having one or more mems resonators on a substrate is presented. A first oscillator frequency, as an approximate multiple of the parametric oscillation frequency, is capacitively coupled from a very closely-spaced electrode (e.g., 40 nm) to a resonant structure of the first oscillator, thus inducing mechanical oscillation.
The Regents Of The University Of California


 Detecting moisture proximate to insulation patent thumbnailDetecting moisture proximate to insulation
Systems and a method for detecting potential areas of corrosion under insulation are provided. An exemplary system includes an enclosure, insulation disposed upon an outer surface of the enclosure, and a number of microelectromechanical system (mems) sensors.

 Optical electronic device and  fabrication patent thumbnailOptical electronic device and fabrication
For an optical electronic device and method that forms cavities through an interposer wafer after bonding the interposer wafer to a window wafer, the cavities are etched into the bonded interposer/window wafer pair using the anti-reflective coating of the window wafer as an etch stop. After formation of the cavities, the bonded interposer/window wafer pair is bonded peripherally of die areas to the mems device wafer, with die area micromechanical elements sealed within respectively corresponding ones of the cavities..
Texas Instruments Incorporated


 Monolithic cmos-mems microphones and  manufacturing patent thumbnailMonolithic cmos-mems microphones and manufacturing
Systems and methods are disclosed for manufacturing a cmos-mems device. A partial protective layer is deposited on a top surface of a layered to cover a logic region.
Robert Bosch Gmbh


 Assembly and packaging of mems device patent thumbnailAssembly and packaging of mems device
A micro electro mechanical systems (mems) device includes a solder bump on a substrate, a cmos-mems die comprising a cmos die and a mems die, and stud bumps on the cmos die. The mems die is disposed between the cmos die and the substrate.
Invensense, Inc.


Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof

Microelectronic packages and methods for producing microelectronic packages are provided. In one embodiment, the method includes bonding a first microelectromechanical systems (mems) die having a first mems transducer structure thereon to a cap piece.
Freescale Semiconductor, Inc.

Micro-electro-mechanical system and manufacturing method thereof

Some embodiments of the present disclosure provide a microelectromechanical systems (mems). The mems includes a semiconductive block.
Taiwan Semiconductor Manufacturing Company Ltd.

Piezoelectric printhead assembly

A piezoelectric printhead assembly can include a micro-electro mechanical system (mems) die including a plurality of nozzles and a first application-specific integrated circuit (asic) die coupled to the mems die by a first plurality of wire bonds.. .
Hewlett-packard Development Company, L.p.

High voltage mems, and a portable ultrasound device comprising such a mems

An improved high voltage mems, and a portable ultrasound device comprising such a mems, and use of such a portable device for detecting a liquid volume. Microelectromechanical systems (mems) relate to a technology of very small devices.
Novioscan B.v.

Method for manufacturing thermal bimorph diaphragm and mems speaker with thermal bimorphs

The present invention provides a method for manufacturing a thermal bimorph diaphragm and a mems speaker with thermal bimorphs, wherein the method comprises the steps of: thermally oxidizing a substrate to obtain an insulating layer thereon and providing a metal layer on the insulating layer; providing a sacrificial layer on the metal layer; providing a first thermal bimorph layer on the sacrificial layer; providing a second thermal bimorph layer on the first thermal bimorph layer; providing a metal connecting layer at the positions on the metal layer where the sacrificial layer is not provided; forming corresponding back holes on the substrate and the insulating layer and releasing the sacrificial layer; forming the thermal bimorph diaphragm which is warped with the first thermal bimorph layer and the second thermal bimorph layer after the sacrificial layer is released.. .
Goertek Inc.

Silicon speaker

The present invention provides a silicon speaker comprising an mems acoustoelectric chip and a pcb substrate, wherein the mems acoustoelectric chip comprises a corrugated diaphragm on a silicon substrate; and one side surface of the mems acoustoelectric chip is metalized, and the metalized side surface of the mems acoustoelectric chip is connected with the pcb substrate. The corrugated diaphragm is electrically conductive and interconnected with metal paths on mems acoustoelectric chip, which is led out to a first pcb metal path as one electrode.
Goertek Inc.

System and a multi-electrode mems device

According to an embodiment, a mems transducer includes a stator, a rotor spaced apart from the stator, and a multi-electrode structure including electrodes with different polarities. The multi-electrode structure is formed on one of the rotor and the stator and is configured to generate a repulsive electrostatic force between the stator and the rotor.
Infineon Technologies Ag

Ingress protection for reducing particle infiltration into acoustic chamber of a mems microphone package

A surface-mountable mems microphone comprising a mems microphone die and an application-specific integrated circuit (asic) mounted inside a surface-mountable package housing, and fully enclosed therein. The surface-mountable package is a single, self-contained housing that provides an electrical interface to external circuitry for the enclosed mems microphone die and the asic, and provides electrical, physical, and environmental protection for the mems microphone die and the asic.
Knowles Electronics, Llc

Systems and methods for facilitating repair of inoperable mems display elements

This disclosure provides systems, methods, and apparatus for facilitating repair of inoperable mems display elements. A display apparatus can include a plurality of display elements over a substrate.
Pixtronix, Inc

Systems and methods for using multiple mems projectors to determine a position of a photosensor of an hmd or another controller

A method for determining an orientation of a photosensor of a controller with respect to a projector is described. The method includes generating, by a beam generator of the projector, a beam.
Sony Interactive Entertainment Inc.

Auto-focus camera module with mems capacitance estimator

A mems actuator for a compact auto-focus camera module is configured to measure physical values and to estimated values each indicative of position or motion or both of a mems component. A smart logic component determines a set of mems driver control values based on analyzing the measured physical values and substituting estimated values to more accurately position the mems component.
Digitaloptics Corporation

Device and micro-electro-mechanical-system photonic switch

In one embodiment, a micro-electro-mechanical-system (mems) photonic switch includes a first plurality of collimators including a first collimator configured to receive a first traffic optical beam having a traffic wavelength and a first control optical beam having a control wavelength, where a first focal length of the first collimators at the traffic wavelength is different than a second focal length of the first collimators at the control wavelength. The mems photonic switch also includes a first mirror array optically coupled to the first plurality of collimators, where the first mirror array including a first plurality of first mems mirrors integrated on a first substrate and a first plurality of first photodiodes integrated on the first substrate, where the photodiodes are disposed in interstitial spaces between the mems mirrors..
Huawei Technologies Co., Ltd.

Universal hermetically sealed button pressure sensor

A hermetically-sealed universal pressure sensor comprises a mems disk, a compensate disk, and an optional interconnect ring. The mems disk has one or more mems dies that can convert ambient pressures to electrical signals, which is processed and compensated at an integrated circuit on the compensate disk.
Memssensors, Inc.

Systems and methods for using a mems projector to determine an orientation of a photosensor of an hmd or another controller

A method for determining an orientation of a photosensor of a controller with respect to a projector is described. The method includes generating, by a beam generator of the projector, a beam.
Sony Interactive Entertainment Inc.

Mems flow sensor

A mems flow sensor is provided having a micro flow channel etched in a silicon structure composed of two silicon substrates bonded or fused together. A heater and one or more temperature sensors are, in one embodiment, disposed around the perimeter of the flow channel and outside of the channel.
Memsic, Inc.

Micro electro mechanical system

In order to provide a technology capable of suppressing degradation of measurement accuracy ale to fluctuation of detection sensitivity of an mems by suppressing fluctuation in natural frequency of the mems caused by a stress, first, fixed portions 3a to 3d are displaced outward in a y-direction of a semiconductor substrate 2 by deformation of the semiconductor substrate 2. Since a movable body 5 is disposed in a state of floating above the semiconductor substrate 2, it is not affected and displaced by the deformation of the semiconductor substrate 2.
Hitachi, Ltd.

Microelectronic packages having split gyroscope structures and methods for the fabrication thereof

Methods for fabricating microelectronic packages and microelectronic packages having split gyroscope structures are provided. In one embodiment, the microelectronic package includes a first microelectromechanical systems (mems) die having a first mems gyroscope structure thereon.

Mechanisms for forming micro-electro mechanical system device

A method for forming a micro-electro mechanical system (mems) device is provided. The method includes bonding a semiconductor substrate with a carrier substrate through a dielectric layer and patterning the semiconductor substrate into multiple elements.
Taiwan Semiconductor Manufacturing Co., Ltd.

Mems device

The present disclosure provides a method for forming micro-electro-mechanical-system (mems) devices. The method includes providing a plurality of wafers; bonding a front surface of at least a first wafer onto a front surface of a second wafer; trimming an edge of and thinning the at least first wafer after the at least first wafer is bonded onto the second wafer; and bonding a first supporting plate onto a front surface of a third wafer.
Semiconductor Manufacturing International (shanghai) Corporation

Stress relief mems structure and package

Stress relief structures and methods that can be applied to mems sensors requiring a hermetic seal and that can be simply manufactured are disclosed. The system includes a sensor having a first surface and a second surface, the second surface being disposed away from the first surface, the second surface also being disposed away from a package surface and located between the first surface and the package surface, a number of support members, each support member extending from the second surface to the package surface, the support members being disposed on and operatively connected to only a portion of the second surface.
Mks Instruments, Inc.

Mems structure with an etch stop layer buried within inter-dielectric layer

A mems structure includes a substrate, an inter-dielectric layer on a front side of the substrate, a mems component on the inter-dielectric layer, and a chamber disposed within the inter-dielectric layer and through the substrate. The chamber has an opening at a backside of the substrate.
United Microelectronics Corp.

Injection molded microoptics

A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem.
International Business Machines Corporation

Pixel for realizing a full-color display, micro- electro-mechanical system (mems) including the same and fabrication methods thereof, and method to realize full-color display with single pixel

The present invention provides a pixel for realizing a full-color display, including an elastomer; and a plurality of microstructures disposed on the elastomer, wherein the pixel is composed of a single sub-pixel and the plurality of microstructures have the same primary morphology; wherein when applying a force to the elastomer, the plurality of microstructures have a second morphology which is different from the primary morphology. The present invention also provides a micro-electro-mechanical system (mems) for realizing a full-color display, fabrication methods thereof, and a method to realize a full-color display with a single pixel..
National Tsing Hua University

Optical scanner

An optical scanner comprises a light source and an mems mirror. The light source emits a light beam.
Toshiba Tec Kabushiki Kaisha

Optical scanner, optical scanning method and non-transient recording medium

An optical scanner comprises a light source, an mems mirror and a position detector. The light source emits a light beam.
Toshiba Tec Kabushiki Kaisha

Mems micro-mirror assembly

A mems micro-mirror assembly (250, 300, 270, 400) comprising, a mems device (240) which comprises a mems die (241) and a magnet (231); a flexible pcb board (205) to which the mems device (240) is mechanically, and electrically, connected; wherein the flexible pcb board (205) further comprises a first extension portion (205b) which comprises a least one electrical contact (259a,b) which is useable to electrically connect the mems micro-mirror assembly (250, 300, 270, 400) to another electrical component). There is further provided a projection system comprising such a mems micro-mirror assembly (250, 300, 270, 400)..
Intel Corporation

Mems pressure sensor

The present invention provides a mems pressure sensor and a manufacturing method. The pressure is formed by a top cap wafer, a mems wafer and a bottom cap wafer.
Motion Engine Inc.

Micro-electro-mechanical system device with electrical compensation and readout circuit thereof

A mems device includes: a fixed structure, a movable structure, and a compensation circuit. The fixed structure includes a fixed electrode and a fixed compensation electrode.
Richtek Technology Corporation

Reducing resonance peaks and drive tones from a micro-electro-mechanical system gyroscope response

Reducing noise from drive tone and sense resonance peaks of a micro-electro-mechanical system (mems) gyroscope output using a notch filter is presented herein. The mems gyroscope can include a drive oscillation component configured to vibrate a sensor mass at a drive resonance frequency; a sense circuit configured to detect a deflection of the sensor mass, and generate, based on the deflection and the drive resonance frequency, a demodulated output; and a signal processing component configured to receive a set of frequencies comprising a first value representing the drive resonance frequency and a second value corresponding to a sense resonance frequency associated with the sense circuit, and apply, based on the first value and the second value, a notch filter to the demodulated output to obtain a filtered output..
Invensense, Inc.

Gas detector with a thermally uniform mems die

A microelectromechanical systems die including a thermally conductive substrate, at least one insulator film disposed on the thermally conductive substrate, a sensor material disposed on the at least one insulator film, and a heater circumferentially disposed around the sensor material.. .
Carrier Corporation

Stacked-die mems resonator system

A low-profile packaging structure for a microelectromechanical-system (mems) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.
Sitime Corporation

Mems device and process

A mems capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes.
Cirrus Logic International Semiconductor Ltd.

Deep brain stimulation lead

The present disclosure discusses a system and methods for a deep brain stimulation lead. More particularly, the disclosure discusses a stimulation lead that includes one or more silicon based barrier layers within a mems film.
Aleva Neurotherapeutics

Mems film for semiconductor device test socket including mems bump

A microelectromechanical system (mems) film for a test socket is arranged between a semiconductor device and a test apparatus for performing an electrical test of the semiconductor device and includes a flexible bare film and a plurality of round-type mems bumps on the bare film, each of the mems bumps being formed on the bare film by using a mems processing technique, having an electrical contact with an electrode pad of the test apparatus or a conductive ball of the semiconductor device, and having a contact surface rounded from an edge side toward a center side in a convex manner in a direction toward the electrode pad or the conductive ball.. .
Okins Electronics Co., Ltd.

Microphone with humidity sensor

Various embodiments relating to microphone with integrated sensor are disclosed herein. In one implementation, a sensor is disposed in, on, integrated with, and/or at the lid of a micro electro mechanical system (mems) microphone.
Knowles Electronics, Llc

Microphone with wind noise resistance

A microphone device is comprises a first micro electro mechanical system (mems) device and a second mems device with difference size of pierce holes in the diaphragms. Signal outputs from the first and second mems devices are selectively used to provide wind noise resistance..
Knowles Electronics, Llc

Mems component including a sound-pressure-sensitive diaphragm element and piezosensitive signal detection

For a mems component, in the layer structure of which at least one sound-pressure-sensitive diaphragm element is formed, which spans an opening or cavity in the layer structure and the deflections of which are detected with the aid of at least one piezosensitive circuit element in the attachment area of the diaphragm element, design measures are provided, by which the stress distribution over the diaphragm surface may be influenced intentionally in the event of deflection of the diaphragm element. In particular, measures are provided, by which the mechanical stresses are intentionally introduced into predefined areas of the diaphragm element, to thus amplify the measuring signal.
Robert Bosch Gmbh

Microphone with temperature sensor

A microphone includes a base, a mems device, and an integrated circuit. The mems device includes a diaphragm and a back plate.
Knowles Electronics, Llc

Microphone with pressure sensor

A microphone includes a base, a mems device, and an integrated circuit. The mems device includes a diaphragm and a back plate.
Knowles Electronics, Llc



Mems topics:
  • Camera Module
  • Acceleration Sensor
  • Microelectromechanical Systems
  • Control Unit
  • Semiconductor Substrate
  • Semiconductor
  • Demodulation
  • Accelerometer
  • Calibration
  • Modulation
  • Mems Devices


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    This listing is a sample listing of patent applications related to Mems for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Mems with additional patents listed. Browse our RSS directory or Search for other possible listings.


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