|| List of recent Mems-related patents
| Mems microphone|
Mechanical resonating structures, as well as related devices and methods of manufacture. The mechanical resonating structures can be microphones, each including a diaphragm and a piezoelectric stack.
Sand 9, Inc.
| Method and ultra-low power switching microphone|
A scheme is described to switch the power supply to the mems microphone on and off in a cyclic manner that is synchronized with the associated adc sampling rate. In this way the mems microphone amplifier, whether it is a j-fet transistor or an operational amplifier, is off most of the cycle time, and is turned on only for a few micro-seconds prior to the sample-and-hold timing of the adc device.
Dsp Group Ltd.
| Temperature compensated oscillator and control method thereof|
A temperature compensated oscillator and a control method are provided. The oscillator includes a micro electro mechanical systems (mems) resonator group, a heating device, and a controller.
Harmony Electronics Corp.
| Temperature compensated mems oscillator|
A temperature compensated micro electro mechanical (mems) oscillator is provided. The oscillator includes a mems resonator group, a heating device, a connection body, and a controller.
Harmony Electronics Corp.
| Acoustic sensor resonant peak reduction|
A mems acoustic sensor includes a transducer with a frequency response with a gain peak, and a peak reduction circuit with a frequency response and coupled to the transducer. The frequency response of the peak reduction circuit causes attenuation of the gain peak..
| Absorptive electromagnetic slow wave structures|
Electromagnetic slow wave structures (sws) comprised of arrays of conductive obstacles are formed inside conductive parallel-plate waveguides these sws may be formed using, for example, mems manufacturing processes at the wafer level on substrates including ceramic and silicon. An effective relative permittivity in the range of 15 to 40 may be obtained at millimeterwave frequencies.
| Mems sensor|
Embodiments of the invention provide a mems sensor, including a flexible substrate having a vibrator and a sensor, a mass body coupled with the flexible substrate, and a support part supporting the flexible substrate. The vibrator includes a multilayer piezoelectric part and an electrode part connected to the multilayer piezoelectric part, and the sensor includes a piezoelectric material and an electrode part.
Samsung Electro-mechanics Co., Ltd.
| Mems sensor with decoupled drive system|
In a first aspect, the angular rate sensor comprises a substrate and a rotating structure anchored to the substrate. The angular rate sensor also includes a drive mass anchored to the substrate and an element coupling the drive mass and the rotating structure.
| Particle manipulation system with stay-wet algorithm|
A mems-based particle manipulation system which uses a particle manipulation stage and a sensor to detect when the sample volume is exhausted or nearly exhausted. The sensor sends a signal to a fluid control means that reverses the pressure between one of the output channels and the input channels, to keep the surfaces wet with a volume of the sample fluid.
Owl Biomedical, Inc.
| Mems device with polymer layer, system of a mems device with a polymer layer, making a mems device with a polymer layer|
A mems device, a method of making a mems device and a system of a mems device are shown. In one embodiment, a mems device includes a first polymer layer, a mems substrate disposed on the first polymer layer and a mems structure supported by the mems substrate.
Infineon Technologies Ag
Mems chip and manufacturing method thereof
A mems chip includes a cap layer and a composite device layer. The cap layer includes a substrate.
Richtek Technology Corporation
Methods of forming semiconductor structures including mems devices and integrated circuits on common sides of substrates, and related structures and devices
Methods are used to form semiconductor devices that include an integrated circuit and a microelectromechanical system (mems) device operatively coupled with the integrated circuit. At least a portion of an integrated circuit may be fabricated on a surface of a substrate, and a mems device may be formed over the at least a portion of the integrated circuit.
Mems package structure
A mems package structure including a chip, a mems device, a lid, a sealant and a first moisture barrier is provided. The chip comprises an active surface.
Himax Display, Inc.
Semiconductor device and forming the same
The substrate structure includes a substrate and a second bonding layer formed on the substrate. The substrate includes a micro-electro-mechanical system (mems) substrate or a semiconductor substrate.
Mems pressure sensors and fabrication method thereof
A mems capacitive pressure sensor is provided. The pressure sensor includes a substrate having a first region and a second region, and a first dielectric layer formed on the substrate.
Semiconductor Manufacturing International (shanghai) Corporation
Mems gas sensing device
A microelectromechanical system (mems) gas sensing device includes a substrate, an oxide layer, a heating unit, a thermal-conductive metal layer, a passivation layer, and a sensor layer. The substrate includes a first cavity.
Sensor Tek Co., Ltd.
Controlled fluid delivery in a microelectronic package
A microelectronic package includes a die which may include mems and cmos circuitry for analyzing a fluid. A defined path is provided for channeling fluid to the die.
Mems component and the production thereof
The invention proposes a mems component having a crystalline base body (gk), a recess (an) and a structured assembly (a) which closes said recess, in which an opening (og) is structured in a first functional layer (mn), the effective opening cross section thereof varying as a function of the pressure difference on the two sides of the first functional layer (mn).. .
Systems, articles, and methods for wearable heads-up displays
Systems, articles, and methods for transparent displays that are particularly well-suited for use in wearable heads-up display devices are described. Such transparent displays include a register of light sources that sequentially generates light signals representative of portions (e.g., pixels, and sometimes rows or columns of pixels) of an image.
Thalmic Labs Inc.
System for the combined, probe-based mechanical and electrical testing of mems
A system for testing mems-structures includes a microforce sensor, two or more multi-axis micropositioning units, at least one electrical probe and a sample holder on which a mems-structure is mounted. At least one of the multi-axis micropositioning units is motorized and at least one additional micropositioning unit is equipped with at least one electrical probe to apply electrical signals or to measure electrical signals at one or multiple locations on the mems structure.
Atomic referenced optical accelerometer
In some examples, a micro-electro-mechanical system (mems) optical accelerometer includes a housing comprising an internal chamber that includes a fabry-perot cavity and a proof mass affixed to the housing via one or more elastic elements, a light source configured to emit radiation, a first detector configured to receive radiation transmitted through the fabry-perot cavity and configured to generate one or more signals that indicate a position of the proof mass. The mems optical accelerometer further comprises an atomic wavelength reference and a second detector configured to detect radiation transmitted through the atomic wavelength reference and configured to generate one or more signals that indicate a wavelength of the radiation emitted by the light source, and a servomechanism electrically coupled to the second photo detector and the light source, configured to adjust the light source to maintain the radiation emitted by the light source at approximately a selected wavelength..
Honeywell International Inc.
Semiconductor structure and ming the same
A semiconductor structure having a micro electromechanical system (mems) device is provided. The mems device includes a first and a second type electrical terminal, and a semiconductor interconnector.
Taiwan Semiconductor Manufacturing Company Ltd.
Polymer anchored microelectromechanical system (mems) cantilever and fabricating the same
A microelectromechanical system (mems) cantilever includes a base and a cantilever beam projecting from the base. The cantilever beam includes a piezo layer sandwiched between an inorganic material structural layer and an inorganic material encapsulating and immobilising layer.
Indian Institute Of Technology, Bombay
System and cryptographic key identification
A method for determining a cyrptographic key for a mems device includes identifying physical properties for the device. A feature vector having a plurality of values is determined.
Robert Bosch Gmbh
Mems switches with reduced switching voltage and methods of manufacture
mems switches and methods of manufacturing mems switches is provided. The mems switch having at least two cantilevered electrodes having ends which overlap and which are structured and operable to contact one another upon an application of a voltage by at least one fixed electrode..
International Business Machines Corporation
Mems scanning mirror light pattern generation
Embodiments of the present disclosure provide techniques and configurations for an apparatus for projecting a light pattern on an object. In one embodiment, the apparatus may include a laser arrangement configured to generate a laser line, a tiltable micro-electromechanical system (mems) mirror configured to tiltably reflect the laser line, and a controller configured to control tilting of the mems mirror to enable the reflected laser line to project a light pattern on the object.
Packaging mems in fluidic environments
A method and apparatus for packaging a mems device is disclosed that includes a mems die mounting surface, a mems device disposed on the mounting surface, and a fluid contained within the package and surrounding at least a portion of the mems device. The fluid may be selected to provide certain advantageous features.
Micromechanical pressure sensor device and corresponding manufacturing method
A micromechanical pressure sensor device includes: an mems wafer having a front side and a rear side; a first micromechanical functional layer formed above the front side of the mems wafer; and a second micromechanical functional layer formed above the first micromechanical functional layer. A deflectable first pressure detection electrode is formed in one of the first and second micromechanical functional layers.
Robert Bosch Gmbh
Micro-electro-mechanical-system device with guard ring and making same
The present invention discloses a mems device with guard ring, and a method for making the mems device. The mems device comprises a bond pad and a sidewall surrounding and connecting with the bond pad, characterized in that the sidewall forms a guard ring by an etch-resistive material..
Pixart Imaging Incorporation
Mems devices and methods for forming same
An embodiment is mems device including a first mems die having a first cavity at a first pressure, a second mems die having a second cavity at a second pressure, the second pressure being different from the first pressure, and a molding material surrounding the first mems die and the second mems die, the molding material having a first surface over the first and the second mems dies. The device further includes a first set of electrical connectors in the molding material, each of the first set of electrical connectors coupling at least one of the first and the second mems dies to the first surface of the molding material, and a second set of electrical connectors over the first surface of the molding material, each of the second set of electrical connectors being coupled to at least one of the first set of electrical connectors..
Taiwan Semiconductor Manufacturing Company, Ltd.
Interposer for mems-on-lid micirophone
A microphone includes an interposer, a lid, and a base. The interposer includes at least one wall portion that forms a cavity.
Knowles Electronics, Llc
Mems microphone with spring suspended backplate
A mems microphone has a base, a backplate, and a backplate spring suspending the backplate from the base. The microphone also has a diaphragm forming a variable capacitor with the backplate..
Integrated rf mems on ate loadboards for smart self rf matching
In a testing device, a method for implementing automatic rf port testing. The method includes attaching a device under test having a plurality of rf pins to a load board, dynamically tuning a plurality of rf ports of the load board to the plurality of rf pins, and automatically matching the plurality of rf ports to the plurality of rf pins with respect to impedance.
Display aperture pixel circuit architecture including planarization layer
This disclosure provides systems, methods, and apparatus for providing pixel circuits for controlling the state of operation of light modulators in a display. A pixel circuit used to control one or more display elements of a mems display apparatus can include a first output node coupled to a first actuator of a display element and a second output node coupled to a second actuator of the display element.
Wireless, motion and position-sensing, integrating radiation sensor for occupational and environmental dosimetry
Described is a radiation dosimeter including multiple sensor devices (including one or more passive integrating electronic radiation sensor, a mems accelerometers, a wireless transmitters and, optionally, a gps, a thermistor, or other chemical, biological or emf sensors) and a computer program for the simultaneous detection and wireless transmission of ionizing radiation, motion and global position for use in occupational and environmental dosimetry. The described dosimeter utilizes new processes and algorithms to create a self-contained, passive, integrating dosimeter.
Mems accelerometer with proof masses moving in an anti-phase direction
A sensor is disclosed. The sensor includes a substrate and a mechanical structure.
Integrated motion processing unit (mpu) with mems inertial sensing and embedded digital electronics
A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis.
Method for the prevention of suspended silicon structure etching during reactive ion etching
The present disclosure is directed to a device and its method of manufacture in which a protective region is formed below a suspended body. The protective region allows deep reactive ion etching of a bulk silicon body to form a mems device without encountering the various problems presented by damage to the silicon caused by backscattering of oxide during over etching periods of drie processes..
Taiwan Semiconductor Manufacturing Co., Ltd.
Method of forming mems device
A method of forming a micro-electro-mechanical systems device includes: providing a substrate; sequentially forming a tantalum nitride (tan) layer and a hard mask layer on the substrate, the hard mask layer having a thickness larger than a thickness of the tan layer; coating photoresist on the hard mask layer, patterning the photoresist and performing a first etching process on the hard mask layer with the photoresist serving as a mask to form an opening in the hard mask layer, wherein a portion of the thickness of the hard mask layer is remained under the opening; removing the photoresist; and performing a second etching process to remove the portion of the thickness of the hard mask layer under the opening as well as a portion of the tan layer under the opening to form a trench.. .
Shanghai Huahong Grace Semiconductor Manufacturing Corporation
Reversible top/bottom mems package
Methods and systems for a reversible top/bottom mems package may comprise a base substrate comprising metal traces, an opening through the base substrate, a die coupled to a first surface of the substrate and positioned over the opening, a frame member coupled to the first surface of the substrate wherein the die is positioned interior of the frame member, a cover substrate coupled to the frame member, and conductive plating on the frame member that electrically couples the base substrate to the cover substrate, wherein the conductive plating is exposed. The conductive plating may couple a ground plane in the base substrate to a ground plane in the cover substrate.
Amkor Technology, Inc.
Mems device and manufacturing
A mems device is provided. The device includes a mems wafer, a top cap wafer and a bottom cap wafer.
Motion Engine Inc.
Methods of forming semiconductor structures including mems devices and integrated circuits on opposing sides of substrates, and related structures and devices
Methods of forming semiconductor devices comprising integrated circuits and microelectromechanical system (mems) devices operatively coupled with the integrated circuits involve the formation of an electrically conductive via extending at least partially through a substrate from a first major surface of the substrate toward an opposing second major surface of the substrate, and the fabrication of at least a portion of an integrated circuit on the first major surface of the substrate. A mems device is provided on the second major surface of the substrate, and the mems device is operatively coupled with the integrated circuit using the at least one electrically conductive via.
Magnetic field shielding for packaging build-up architectures
Magnetic field shielding material with high relative permeability incorporated into a build-up package, for example to restrict a field of a magnet integrated with the build-up to a target device configured to operate in the field. In embodiments, a first device is physically coupled to the build-up.
Disclosed is mems microphone. The mems microphone includes a substrate and a capacitor system disposed on the substrate.
Aac Acoustic Technologies (shenzhen) Co., Ltd.
Noise reduction in mems oscillators and related apparatus and methods
Mechanical resonating structures are used to generate signals having a target frequency with low noise. The mechanical resonating structures may generate output signals containing multiple frequencies which may be suitably combined with one or more additional signals to generate the target frequency with low noise.
Sand 9, Inc.
Piezoelectric actuator module, manufacturing the same, and mems sensor having the same
Embodiments of the invention provide a method of manufacturing a piezoelectric actuator module. The method includes the steps of depositing a second piezoelectric material on one surface of a support layer in a second temperature section, and depositing a first piezoelectric material in a first temperature section to be stacked on the second piezoelectric material.
Samsung Electro-mechanics Co., Ltd.
Driving calibration apparatus of electrostatic mems scanning mirror and driving calibration method therefof
The invention provides a driving calibration apparatus of an electrostatic mems scanning mirror and a driving calibration method thereof the driving calibration method includes the following steps. Different reference voltages are sequentially set to drive a plane mirror of the electrostatic mems scanning mirror to swing.
Lite-on It Corporation
Shutter-based light modulators incorporating tiered backplane slot structures
This disclosure provides systems, methods and apparatus for a mems display apparatus incorporating a tiered backplane slot structure. The backplane can include two or more light-blocking layers defining optical windows and positioned at different heights.
Angle detection circuit of electrostatic mems scanning mirror
An angle detection circuit of an electrostatic mems scanning mirror is provided. The angle detection circuit includes a capacitance sensing unit, a low-pass filter amplifier unit and an angle determination unit.
Lite-on It Corporation
Mems proof mass with split z-axis portions
This document discusses among other things apparatus and methods for a proof mass including split z-axis portions. An example proof mass can include a center portion configured to anchor the proof-mass to an adjacent layer, a first z-axis portion configure to rotate about a first axis using a first hinge, the first axis parallel to an x-y plane orthogonal to a z-axis, a second z-axis portion configure to rotate about a second axis using a second hinge, the second axis parallel to the x-y plane, wherein the first z-axis portion is configured to rotate independent of the second z-axis portion..
Fairchild Semiconductor Corporation
Micro-electro-mechanical system drive-mode oscillator module and method therefor
A drive-mode oscillator module for use within a micro-electro-mechanical system (mems) device is described. The drive-mode oscillator module is arranged to receive a proof-mass measurement signal from a proof-mass of the mems device and to output a proof-mass actuation signal to the proof-mass of the mems device.
Freescale Semiconductor, Inc.
Compact electronic package with mems ic and related methods
An electronic device may include first and second laterally spaced apart interconnect substrates defining a slotted opening, and a first ic in the slotted opening and electrically coupled to one or more of the first and second interconnect substrates. The electronic device may include a first other ic over the first ic and electrically coupled to one or more of the first and second interconnect substrates, and encapsulation material over the first and second interconnect substrates, the first ic, and the first other ic..
Stmicroelectronics (shenzhen) R&d Co., Ltd.