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This page is updated frequently with new Mems-related patent applications. Subscribe to the Mems RSS feed to automatically get the update: related Mems RSS feeds. RSS updates for this page: Mems RSS RSS


Device and method for micro-electro-mechanical-system photonic switch

Futurewei Technologies

Device and method for micro-electro-mechanical-system photonic switch

Mems rotation sensor with integrated electronics

Invensense

Mems rotation sensor with integrated electronics

Mems rotation sensor with integrated electronics

Samsung Electro-mechanics

Acoustic device and microphone package including the same

Date/App# patent app List of recent Mems-related patents
05/21/15
20150141772
 Physiological monitoring methods patent thumbnailnew patent Physiological monitoring methods
A method of monitoring a subject includes detecting subject head motion via a microelectromechanical systems (mems) sensor associated with a device worn by the subject, such as a device worn on a region of the head or a headset attached to an ear. The head motion information from the mems sensor is processed to determine subject head displacement relative to an origin and/or to identify footstep information, and the processed head motion information is transmitted to a remote device.
Valencell, Inc.
05/21/15
20150139585
 Device and  micro-electro-mechanical-system photonic switch patent thumbnailnew patent Device and micro-electro-mechanical-system photonic switch
In one embodiment, a micro-electro-mechanical-system (mems) photonic switch includes a first plurality of collimators and a first minor array optically coupled to the first plurality of collimators, where the first minor array includes a first plurality of minors, and where a first minor of the first plurality of minors includes a first plurality of photodiodes integrated on the first mirror.. .
Futurewei Technologies, Inc.
05/21/15
20150139467
 Acoustic device and microphone package including the same patent thumbnailnew patent Acoustic device and microphone package including the same
There are provided an acoustic device manufactured using a micro electro mechanical system (mems) technology, and a microphone package including the acoustic device. The acoustic device includes a device substrate including a cavity formed therein, a diaphragm formed to cover the cavity on the device substrate, a back plate formed to be spaced apart from the diaphragm, and a shielding plate disposed to be spaced apart from the diaphragm and the back plate, including a plurality of through holes, and shielding noise introduced from outside..
Samsung Electro-mechanics Co., Ltd.
05/21/15
20150139432
 Device for measuring sound level patent thumbnailnew patent Device for measuring sound level
A device for measuring sound level, comprising: an inlet opening; a mems microphone for measuring sound level; and an external acoustic attenuator with a pressure divider comprising: a first branch between the inlet opening and the membrane of the mems microphone via an inlet channel and a resonant cavity; and a second branch between the resonant cavity and a vent chamber via a vent channel.. .
Svantek Sp. Z O.o
05/21/15
20150138623
 Device and  micro-electro-mechanical-system photonic switch patent thumbnailnew patent Device and micro-electro-mechanical-system photonic switch
In one embodiment, a micro-electro-mechanical-system (mems) photonic switch includes a first plurality of collimators including a first collimator configured to receive a first traffic optical beam having a traffic wavelength and a first control optical beam having a control wavelength, where a first focal length of the first collimators at the traffic wavelength is different than a second focal length of the first collimators at the control wavelength. The mems photonic switch also includes a first minor array optically coupled to the first plurality of collimators, where the first mirror array including a first plurality of first mems minors integrated on a first substrate and a first plurality of first photodiodes integrated on the first substrate, where the photodiodes are disposed in interstitial spaces between the mems mirrors..
Futurewei Technologies, Inc.
05/21/15
20150138556
 Monitoring devices with energy-harvesting power sources patent thumbnailnew patent Monitoring devices with energy-harvesting power sources
An apparatus worn by a subject includes an energy-harvesting power source, at least one physiological sensor and/or at least one environmental sensor coupled to the energy-harvesting power source. The at least one physiological sensor senses physiological information from the subject and the at least one environmental sensor senses environmental information in a vicinity of the subject.
Valencell, Inc.
05/21/15
20150137304
 Structure and fabrication  a high performance mems thermopile ir detector patent thumbnailnew patent Structure and fabrication a high performance mems thermopile ir detector
The invention involves structure and fabrication method of a high performance ir detector. The structure comprises a substrate; a releasing barrier band on the substrate; a thermal isolation chamber constructed by the releasing barrier band; a black silicon-based ir absorber located right above the thermal isolation chamber and the black silicon-based ir absorber is set on the releasing barrier band; a number of thermocouples are set around the lateral sides of the black silicon-based ir absorber.
Jiangsu R&d Center For Internet Of Things
05/21/15
20150137303
 Mechanisms for forming micro-electro mechanical device patent thumbnailnew patent Mechanisms for forming micro-electro mechanical device
Embodiments of mechanisms for forming a micro-electro mechanical system (mems) device are provided. The mems device includes a substrate and a mems sensor over the substrate.
Taiwan Semiconductor Manufacturing Co., Ltd
05/21/15
20150137283
 Mems devices, packaged mems devices, and methods of manufacture thereof patent thumbnailnew patent Mems devices, packaged mems devices, and methods of manufacture thereof
mems devices, packaged mems devices, and methods of manufacture thereof are disclosed. In one embodiment, a microelectromechanical system (mems) device includes a first mems functional structure and a second mems functional structure.
Taiwan Semiconductor Manufacturing Company, Ltd.
05/21/15
20150137280
 Structures and formation methods of micro-electro mechanical system device patent thumbnailnew patent Structures and formation methods of micro-electro mechanical system device
A structure and a formation method of a micro-electro mechanical system (mems) device are provided. The mems device includes a cap substrate and a mems substrate bonded with the cap substrate.
Taiwan Semiconductor Manufacturing Co., Ltd.
05/21/15
20150137276
new patent

Mechanisms for forming micro-electro mechanical system device


Embodiments of mechanisms for forming a micro-electro mechanical system (mems) device are provided. The mems device includes a cmos substrate, a cap substrate, and a mems substrate bonded between the cmos substrate and the cap substrate.
Taiwan Semiconductor Manufacturing Co., Ltd.
05/21/15
20150135860
new patent

Capacitive micro-electro-mechanical force sensor and corresponding force sensing method


A mems force sensor has: a substrate; a fixed electrode coupled to the substrate; and a mobile electrode suspended above the substrate at the fixed electrode to define a sensing capacitor, the mobile electrode being designed to undergo deformation due to application of a force to be detected. A dielectric material region is set on the fixed electrode and spaced apart by an air gap from the mobile electrode, in resting conditions.
Stmicroelectronics S.r.l.
05/21/15
20150135854
new patent

Mems pressure sensor field shield layout for surface charge immunity in oil filled packaging


A pressure sensing element includes a sensing sub-element disposed on a diaphragm, the element including a shield disposed over the sub-element and configured to substantially eliminate influence of external charge on the sub-element during operation. A method of fabrication and a pressure sensor making use of the pressure sensing element are disclosed..
Sensata Technologies, Inc.
05/21/15
20150135853
new patent

Mems pressure sensor field shield layout for surface charge immunity in oil filled packaging


A pressure sensing element includes a sensing sub-element disposed on a diaphragm, the element including a shield disposed over the sub-element and configured to substantially eliminate influence of external charge on the sub-element during operation. A method of fabrication and a pressure sensor making use of the pressure sensing element are disclosed..
05/21/15
20150135834
new patent

Micro electro mechanical systems sensor


There is provided a mems sensor including: a mass body; a support part floatably supporting the mass body; and a flexible beam having one end connected to the mass body and the other end connected to the support part. At least one end of the flexible beam connected to the mass body or the support part includes a curved portion to maximize an effective length supporting a load..
Samsung Electro-mechanics Co., Ltd.
05/21/15
20150135831
new patent

Mems rotation sensor with integrated electronics


A rotational sensor for measuring rotational acceleration is disclosed. The rotational sensor comprises a sense substrate; at least two proof masses, and a set of two transducers.
Invensense, Inc.
05/14/15
20150132880

Microelectromechanical system (mems) device and fabrication method thereof


A method for fabricating mems device includes providing a silicon substrate. A structural dielectric layer is formed over a first side of the silicon substrate.
05/14/15
20150131820

Micro-electro-mechanical acoustic transducer device with improved detection features and corresponding electronic apparatus


Described herein is a mems acoustic transducer device provided with a micromechanical detection structure that detects acoustic-pressure waves and supplies a transduced electrical quantity, and with an integrated circuit operatively coupled to the micromechanical detection structure and having a reading module that generates at output an audio signal as a function of the transduced electrical quantity. The integrated circuit is further provided with a recognition module, which recognizes a of sound activity event associated to the transduced electrical quantity.
05/14/15
20150131812

Mems microphone assembly and operating the mems microphone assembly


A mems microphone assembly includes a mems transducer element having a back plate and a diaphragm displaceable relative to the back plate. A bias voltage generator is adapted to provide a dc bias voltage applicable between the diaphragm and the back plate.
05/14/15
20150131156

Display device with light diffusive glass panel


A display device having a display element, such as a light-emitting device or a light-reflecting device, such as a mems device, and a glass touch panel covering the display element, the outer surface of the panel being textured. The panel is thin, having a thickness of 1.1 mm or less between the inner and outer surfaces.
05/14/15
20150131100

Mems optical sensor


The present invention relates to an all-optical sensor utilizing effective index modulation of a waveguide and detection of a wavelength shift of reflected light and a force sensing system accommodating said optical sensor. One embodiment of the invention relates to a sensor system comprising at least one multimode light source, one or more optical sensors comprising a multimode sensor optical waveguide accommodating a distributed bragg reflector, at least one transmitting optical waveguide for guiding light from said at least one light source to said one or more multimode sensor optical waveguides, a detector for measuring light reflected from said bragg reflector in said one or more multimode sensor optical waveguides, and a data processor adapted for analyzing variations in the bragg wavelength of at least one higher order mode of the reflected light..
05/14/15
20150131000

Camera module having mems actuator, connecting shutter coil of camera module and camera module manufactured by the same method


Disclosed is a camera module including a substrate which is provided with an electrode pad and an image sensor; a housing which is stacked on the substrate and of which an upper portion is opened so that light is incident to the image sensor; a mems actuator which is installed at the housing and has an electrode terminal at one side thereof, and a conductive pattern which is formed at the housing, wherein a lower end of the conductive pattern is connected with the electrode pad of the substrate, and an upper end thereof is connected with the electrode terminal of the mems actuator, whereby it is possible to improve electrical reliability between the electrode terminal of the mems actuator and the electrode pad of the substrate and facilely form the electrical connection therebetween, thereby reducing the number of processes.. .
05/14/15
20150130876

Mems actuator pressure compensation structure for decreasing humidity


A printhead including a venting system and an actuator array, wherein each actuator may include an actuator air chamber. The venting system includes an air path that vents each actuator air chamber to the atmosphere.
05/14/15
20150130044

Novel mechanism for mems bump side wall angle improvement


The present disclosure relates to a bump processing method and/or resulting mems-cmos structure, in which one or more anti-stiction bumps are formed within a substrate prior to the formation of a cavity in which the one or more anti-stiction bumps reside. By forming the one or more anti-stiction bumps prior to a cavity, the sidewall angle and the top critical dimension (i.e., surface area) of the one or more anti-stiction bumps are reduced.
05/14/15
20150130039

Layer arrangement and a wafer level package comprising the layer arrangement


The invention relates to a layer arrangement and a wafer level package comprising the layer arrangement, and in particular, the layer arrangement comprises a getter layer and further comprises a sacrificial layer. The wafer level package may be used in microelectromechanical systems (mems) packaging at a vacuum level of about 10 mtorr or less such as close to 1 mtorr (i.e.
05/14/15
20150129992

Mems microphone having dual back plate and manufacturing same


Disclosed herein are a microelectromechanical systems (mems) microphone with a dual-back plate, and a method of manufacturing the same. The mems microphone according to an exemplary embodiment of the present invention includes: a substrate having a first back plate formed at a central portion thereof; a membrane plate disposed on first support parts formed at both sides on the substrate and vibrated depending on external sound pressure; and a second back plate disposed on second support parts formed at both sides of the membrane plate..
05/14/15
20150129991

Cmos-mems integrated device including multiple cavities at different controlled pressures and methods of manufacture


An integrated mems device comprises two substrates where the first and second substrates are coupled together and have two enclosures there between. One of the first and second substrates includes an outgassing source layer and an outgassing barrier layer to adjust pressure within the two enclosures.
05/14/15
20150128707

Intermodulation sensor platform based on mechanical resonator


The present invention related to a new passive wireless sensor platform which is based on the intermodulation communication principle. The platform may utilize a quartz crystal or other mechanical resonator.
05/14/15
20150128703

Micromechanical sensor device


A micromechanical sensor device includes an evaluation circuit formed in a first substrate, and an mems structure which is situated in a cavity delimited by a second substrate and a third substrate, the mems structure and the second substrate being situated on top of each other, the mems structure being functionally connected to the evaluation circuit via a contact area, the contact area between the mems structure and the first substrate being situated essentially centrally on the second substrate and essentially centrally on the first substrate and has an essentially punctiform configuration, proceeding radially from the contact area, a clearance being formed between the first substrate and the second substrate.. .
05/14/15
20150128697

Mems device package


Disclosed herein is a mems device package including a hollow tubular part, a top cap formed to cover a top opening of the tubular part, a bottom cap formed to cover a bottom opening of the tubular part, and a sensor device equipped in a cavity of the tubular part. The mems device can use tubular parts having a variety of cross sections and also enhance an impact resistance by inserting a damper into the tubular part..
05/07/15
20150126145

Signal receiver with a duty-cycle controller


The signal receiver has means to suppress at least one higher harmonic component from a mems or crystal oscillator having a reference resonator in filtered intermediate signals of a signal receiver. The signal receiver comprises an antenna for receiving electromagnetic signals, a low noise amplifier for amplifying signals received by the antenna, one mems or crystal oscillator comprising a reference resonator to generate an oscillating signal with a predefined duty-cycle, a mixer for mixing the amplified and received signals with the oscillating signal to generate intermediate signals, a band-pass filter to filter the intermediate signals, and a duty-cycle controller coupled to the mems or crystal oscillator and coupled to the output of the band-pass filter to analyze the spectrum of the filtered intermediate signals and to modify the duty-cycle of the oscillating signal in response to the spectrum analysis of the filtered intermediate signals..
The Swatch Group Research And Development Ltd
05/07/15
20150125004

Multi-function pins for a programmable acoustic sensor


A programmable acoustic sensor is disclosed. The programmable acoustic sensor includes a mems transducer and a programmable circuitry coupled to the mems transducer.
Invensense, Inc.
05/07/15
20150125003

System and a mems transducer


An embodiment as described herein includes a microelectromechanical system (mems) with a first mems transducer element, a second mems transducer element, and a semiconductor substrate. The first and second mems transducer elements are disposed at a top surface of the semiconductor substrate and the semiconductor substrate includes a shared cavity acoustically coupled to the first and second mems transducer elements..
Infineon Technologies Ag
05/07/15
20150124176

Enhanced global dimming for projector display systems


Projector display systems comprising a light dimmer and first modulator are disclosed. The light dimmer may comprise an adjustable iris, adjustable light sources and/or lcd stack that is capable of lowering the luminance of the light source illuminated the first modulator.
Dolby Laboratories Licensing Corporation
05/07/15
20150123745

Mems/nems device comprising a network of electrostatically actuated resonators and having an adjustable frequency response, notably for a band-pass filter


A mems/nems device having an adjustable frequency response comprises an array of electrostatically actuated resonators, an electrostatic actuation circuit, electrical detection means, and means adjusting the frequency response of the resonators. The device comprises resonators having a movable portion, electrically connected in series between a first biasing potential vb and a second biasing potential vb2, each resonator biased to a potential vi between vb and vb2, depending on position in the series.
Commissariat A L'energie Atomique Et Aux Energies Alternatives
05/07/15
20150123221

Micromechanical sensor device and corresponding manufacturing method


A micromechanical sensor device and a corresponding manufacturing method are described. The micromechanical sensor device includes a cmos wafer having a front side and a rear side, a rewiring device formed on the front side of the cmos wafer including a plurality of stacked printed conductor levels and insulation layers, an mems wafer having a front side and a rear side, a micromechanical sensor device formed across the front side of the mems wafer, a bond connection between the mems wafer and the cmos wafer, a cavern between the mems wafer and the cmos wafer, in which the sensor device is hermetically enclosed, and an exposed getter layer area applied to at least one of the plurality of stacked printed conductor levels and insulation layers..
Robert Bosch Gmbh
05/07/15
20150123220

Low-profile stacked-die mems resonator system


A low-profile packaging structure for a microelectromechanical-system (mems) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.
Sitime Corporation
05/07/15
20150123129

Wafer level packaging techniques


In a wafer level chip scale packaging technique for mems devices, a deep trench is etched on a scribe line area between two cmos devices of a cmos substrate at first. After bonding of the cmos substrate with a mems substrate, the deep trench is opened by thin-down process so that cmos substrate is singulated while mems substrate is not (partial singulation).
Taiwan Semiconductor Manufacturing Co., Ltd.
04/30/15
20150118780

Microelectromechanical system (mems) microphone with protection film and mems microphonechips at wafer level


A method to protect an acoustic port of a microelectromechanical system (mems) microphone is provided. The method includes: providing the mems microphone; and forming a protection film, on the acoustic port of the mems microphone.
Solid State System Co., Ltd.
04/30/15
20150117681

Acoustic assembly and manufacturing the same


A microelectromechanical system (mems) microphone includes a base having a port extending there through. A mems die is coupled to the base, and the mems die includes a diaphragm and a back plate.
Knowles Electronics, Llc
04/30/15
20150117673

Digital signal processing with acoustic arrays


Methods, systems, and techniques of digital signal processing using acoustic arrays are provided. Example embodiments described herein provide enhanced acoustic arrays that utilize mems digital microphones to offer greater control and measurement capabilities to users and systems that desire to measure sound typically to derive other data.
04/30/15
20150116297

Circuits and methods for switching of mems systems


This disclosure provides systems, methods and apparatus for addressing an array of pixels in a display. In one aspect, an electromechanical device includes a movable element coupled between a first and second actuator, and a charge distribution circuit arranged to electronically couple the first actuator to the second actuator and capable of equalizing a potential between the first actuator and the second actuator.
Pixtronix, Inc.
04/30/15
20150116285

Method and electronic capture of handwriting and drawing


With electronic documents increasingly replacing paper based ones there is a need to convert handwriting and drawing into electronic formats. Current solutions have significant drawbacks due to their bulkiness, cost and limited performance.
04/30/15
20150115377

Mems device with integrated temperature stabilization


An apparatus for providing localized heating as well as protection for a vibrating mems device. A cap over a mems gyroscope includes an embedded temperature sensor and a heater.
Teledyne Scientific & Imaging, Llc
04/30/15
20150115376

Mems device with outgassing shield


A capped micromachined device has a movable micromachined structure in a first hermetic chamber and one or more interconnections in a second hermetic chamber that is hermetically isolated from the first hermetic chamber, and a barrier layer on its cap where the cap faces the first hermetic chamber, such that the first hermetic chamber is isolated from outgassing from the cap.. .
Analog Devices, Inc.
04/30/15
20150115160

Thermally shorted bolometer


In one embodiment, a mems sensor assembly includes a substrate, a first sensor supported by the substrate and including a first absorber spaced apart from the substrate, and a second sensor supported by the substrate and including (i) a second absorber spaced apart from the substrate, and (ii) at least one thermal shorting portion integrally formed with the second absorber and extending downwardly from the second absorber to the substrate thereby thermally shorting the second absorber to the substrate.. .
Robert Bosch Gmbh
04/30/15
20150114111

Mems sensor and device having the same


Disclosed herein is an mems sensor, including: a sensor unit; and a substrate connected to the sensor unit, in which the substrate may be provided with a flexible printed circuit board (fpcb) to correspond to an outer peripheral portion of the sensor unit.. .
Samsung Electro-mechanics Co., Ltd.
04/23/15
20150111332

Method and device of mems process control monitoring and packaged mems with different cavity pressures


A method for fabricating an integrated mems device and the resulting structure therefore. A control process monitor comprising a mems membrane cover can be provided within an integrated cmos-mems package to monitor package leaking or outgassing.
Mcube Inc.
04/23/15
20150110672

Method for inducing apoptosis of disease cells and disease-causing microorganisms using plasma for bio-medical use


The present invention relates to a method for inducing apoptosis of disease cells and disease-causing micro-organisms using plasma for bio-medical use, the method comprising the steps of: generating plasma by means of a high-pressure plasma jet produced using a micro-electro-mechanical system (mems) technique; plasma-processing by applying a solution with the plasma; exposing cells to the plasma-processed solution; and inactivating disease cells and disease-causing micro-organisms from among the exposed cells. According to the present invention, after applying plasma to a solution such as a buffer solution or water, targets to be processed such as micro-organisms or animal or plant cells are exposed thereto, and thus the present invention can be used in both bio and medical fields, and has the benefit of effectively inducing apoptosis of disease cells and disease-causing micro-organisms with low power due to indirect processing..
Ajou University Industry-academic Cooperation Foundation
04/23/15
20150109588

Micro projector device and control method thereof


The present invention provides a micro projector device including a mems mirror, a laser source module, a detection module, and a control unit. The mems mirror has a first portion and a second portion, the first portion pivots to the second portion, and the first portion oscillates in relation to the second portion.
Lite-on It Corporation
04/23/15
20150108479

Thin-film transistors incorporated into three dimensional mems structures


This disclosure provides systems, methods and apparatus for forming electromechanical systems (ems) displays where the area of a substrate occupied by a pixel circuit can be reduced if portions of the pixel circuit can be built in three dimensions. In some aspects, certain ems displays can incorporate structures that are substantially normal to the surface of a substrate.
Pixtronix, Inc.
04/23/15
20150107367

Dual range high precision pressure sensor


A high-precision pressure sensor with two or more pressure ranges is formed from multiple micro-electromechanical system (mems) pressure transducers mounted inside a housing and coupled to sense a pressurized fluid. The non-linear outputs of the mems pressure transducers are linearized by a corresponding number of processors, preferably dsps, each processor being coupled to a corresponding mems pressure transducer and receiving the mems pressure transducer output signal there from.
Continental Automotive Systems, Inc.
04/23/15
20150107359

Piezoresistance sensor module and mems sensor having the same


Disclosed herein is a piezoresistance sensor module including: a piezoresistor, a depletion layer formed in a region of a portion of the piezoresistor, an insulator formed to cover the depletion layer and one surface of the piezoresistor, and a piezoelectric capacitor formed on the insulator so as to be opposite to the depletion layer.. .
Samsung Electro-mechanics Co., Ltd.
04/16/15
20150106768

Three dimensional user interface effects on a display by using properties of motion


The techniques disclosed herein use a compass, mems accelerometer, gps module, and mems gyrometer to infer a frame of reference for a hand-held device. This can provide a true frenet frame, i.e., x- and y-vectors for the display, and also a z-vector that points perpendicularly to the display.
Apple Inc.
04/16/15
20150104895

Method of fabricating mems devices having a plurality of cavities


A method for forming an integrated circuit having micro-electromechanical systems (mems) includes forming at least two recesses into a first layer, forming at least two recesses into a second layer, the at least two recesses of the second layer being complementary to the recesses of the first layer. An intermediate layer is bonded onto the second layer, the intermediate layer includes through-holes corresponding to the recesses of the second layer.
Taiwan Semiconductor Manufacturing Company, Ltd.
04/16/15
20150103391

Mems device with improved via support planarization


A microelectromechanical (mems) device has a movable member supported above a substrate on a via support. The member and via support are fabricated integrally from first and second member forming layers.
Texas Instruments Incorporated
04/16/15
20150103387

Shutter-based light modulators incorporating integrated sidewall reflectors


This disclosure provides systems, methods, and apparatus for a mems display incorporating integrated sidewall reflectors. The display can include a light blocking component suspended over a substrate.
Pixtronix, Inc.
04/16/15
20150103190

Image acquisition method and apparatus with mems optical image stabilization (ois)


An image acquisition sensor of a digital image acquisition apparatus is coupled to imaging optics for acquiring a sequence of images. Images acquired by the sensor are stored.
Digitaloptics Corporation Europe Limited
04/16/15
20150102866

Vibrator, oscillator, electronic device, and moving object


A mems vibrator includes: a substrate; a base portion which is disposed on the substrate; and a plurality of vibration portions which extend in directions different from each other from the base portion. The mems vibrator has a curved surface between the adjacent vibration portions..
Seiko Epson Corporation
04/16/15
20150102865

Vibrator, oscillator, electronic device, and moving object


A mems vibrator includes: a substrate; a base portion which is disposed on the substrate; and a plurality of vibration portions which extends in a direction that intersects with a normal line of the substrate from the base portion. In a planar view, when a length of the vibration portion in a direction in which the vibration portion extends from the base portion is l, and a length of the vibration portion in a direction that intersects with a direction in which the vibration portion extends from the base portion is w, a dimension ratio (l/w) of the vibration portion satisfies a relationship in which 0.2≦(l/w)≦7.0..
Seiko Epson Corporation
04/16/15
20150102835

Substrate plate for mems devices


A substrate plate is provided for at least one mems device to be mounted thereon. The mems device has a certain footprint on the substrate plate, and the substrate plate has a pattern of electrically conductive leads to be connected to electric components of the mems device.
Oce-technologies B.v.
04/16/15
20150102703

Vibrator, oscillator, electronic device, and moving object


A mems vibrator includes: a substrate; a supporting portion which is connected to the substrate; a base portion which is connected to the supporting portion; and a plurality of vibration portions which is separated from the substrate and extends in different directions from each other from the base portion, and in which the adjacent vibration portions vibrate in a phase of a reverse direction to each other. In the vibration portion, the base portion has a vibration node, and at least a part of the supporting portion is overlapped with the vibration node in a planar view..
Seiko Epson Corporation
04/16/15
20150102701

Micro-electro-mechanical system device with enhanced structural strength


The invention provides a mems device with enhanced structural strength. The mems device includes a plurality of metal layers, including a top metal layer with a plurality of metal segments.
Pixart Imaging Incorporation
04/16/15
20150102437

Mems sensor device with multi-stimulus sensing and fabrication


A device (20) includes sensors (30, 32, 34) that sense different physical stimuli. Fabrication (90) entails forming (92) a device structure (22) to include the sensors and coupling (150) a cap structure (24) with the device structure so that the sensors are interposed between the cap structure and a substrate layer (28) of the device structure.
Freescale Semiconductor, Inc.
04/16/15
20150102436

Pre-molded mems device package with conductive shell


A mems lead frame package body encloses a mems device enclosed in an internal cavity formed by the mold body and cover. A conductive internal shell with a connection window sits in the cavity.
Invensense, Inc.
04/16/15
20150102435

Mems microphone with membrane antennas


A mems microphone. The microphone includes a backplate, a membrane, and a plurality of antennas.
Robert Bosch Gmbh
04/16/15
20150102433

Package structure having mems element


A package structure having at least an mems element is provided, including a chip having electrical connecting pads and the mems element; a lid disposed on the chip to cover the mems element and having a metal layer provided thereon; first sub-bonding wires electrically connecting to the electrical connecting pads; second sub-bonding wires electrically connecting to the metal layer; an encapsulant disposed on the chip, wherein the top ends of the first and second sub-bonding wires are exposed from the encapsulant; and metallic traces disposed on the encapsulant and electrically connecting to the first sub-bonding wires. The package structure advantageously features reduced size, relatively low costs, diverse bump locations, and an enhanced emi shielding effect..
Siliconware Precision Industries Co., Ltd.
04/16/15
20150102390

Integrated cmos back cavity acoustic transducer and the producing the same


A mems device includes a mems substrate with a movable element. Further included is a cmos substrate with a cavity, the mems substrate disposed on top of the cmos substrate.
Invensense, Inc.


Popular terms: [SEARCH]

Mems topics: Camera Module, Acceleration Sensor, Microelectromechanical Systems, Control Unit, Semiconductor Substrate, Semiconductor, Demodulation, Accelerometer, Calibration, Modulation, Mems Devices

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This listing is a sample listing of patent applications related to Mems for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Mems with additional patents listed. Browse our RSS directory or Search for other possible listings.
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