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Mems patents

      

This page is updated frequently with new Mems-related patent applications.




 Condenser microphone with non-circular membrane patent thumbnailCondenser microphone with non-circular membrane
A non-uniform stress distribution of a mems microphone having a non-circular shape is compensated by a structured back plate that has a compensating structure to provide a stress distribution opposite to that of the membrane.. .
Epcos Ag


 Multiple stage modulation projector display systems having efficient light utilization patent thumbnailMultiple stage modulation projector display systems having efficient light utilization
Dual or multi-modulation display systems comprising a first modulator and a second modulator are disclosed. The first modulator may comprise a plurality of analog mirrors (e.g.
Dolby Laboratories Licensing Corporation


 Mems-based  manufacturing sensor patent thumbnailMems-based manufacturing sensor
An mems-based method for manufacturing a sensor comprises the steps of: forming a shallow channel (120) and a support beam (140) on a front surface of a substrate (100); forming a first epitaxial layer (200) on the front surface of the substrate (100) to seal the shallow channel (120); forming a suspended mesh structure (160) below the first epitaxial layer (200); and forming a deep channel (180) at a position on a back surface of the substrate (100) corresponding to the shallow channel (120), so that the shallow channel (120) is in communication with the deep channel (180). In the method of manufacturing a mems-based sensor, when a shallow channel is formed on a front surface, a support beam of a mass block is formed, so the etching of a channel is easier to control, the process is snore precise.
Csmc Technologies Fab1 Co., Ltd.


 Microelectromechanical sensor device with reduced stress-sensitivity and corresponding manufacturing process patent thumbnailMicroelectromechanical sensor device with reduced stress-sensitivity and corresponding manufacturing process
A mems device is provided with: a supporting base, having a bottom surface in contact with an external environment; a sensor die, which is of semiconductor material and integrates a micromechanical detection structure; a sensor frame, which is arranged around the sensor die and is mechanically coupled to a top surface of the supporting base; and a cap, which is arranged above the sensor die and is mechanically coupled to a top surface of the sensor frame, a top surface of the cap being in contact with an external environment. The sensor die is mechanically decoupled from the sensor frame..
Stmicroelectronics S.r.l.


 Mechanically isolated mems device patent thumbnailMechanically isolated mems device
A mems device has a substrate with a structure surface and an opposing exterior surface, microstructure formed on the structure surface of the substrate, and a cap coupled with the substrate to form a hermetically sealed interior chamber containing the microstructure. The substrate forms a trench extending from, and being open to, the opposing exterior surface to produce a sensor region and a second region.
Analog Devices. Inc.


 Mems-cmos device that minimizes outgassing and methods of manufacture patent thumbnailMems-cmos device that minimizes outgassing and methods of manufacture
A mems device is disclosed. The mems device includes a first substrate.
Invensense, Inc.


 Mems structure patent thumbnailMems structure
A mems structure includes a planar substrate, a support body coupled to the planar substrate, a fixed electrode coupled to the planar substrate and a moveable portion. The movable portion is spaced from and faces the fixed electrode.
Murata Manufacturing Co., Ltd.


 Mems devices on flexible substrate patent thumbnailMems devices on flexible substrate
A flexible film including one or more mems elements and articles including the flexible film are described. The flexible film includes a polymer layer between two metal layers with one of the metal layers containing a perforation.
3m Innovative Properties Company


 Mems device patent thumbnailMems device
A mems device including a fixed member and a movable member supported via a resilient body. The mems device includes an impact alleviation mechanism provided at a position where the movable member and the fixed member collide during operation.
Murata Manufacturing Co., Ltd.


 Comb mems device and  making a comb mems device patent thumbnailComb mems device and making a comb mems device
A mems device and a method to manufacture a mems device are disclosed. An embodiment includes forming trenches in a first main surface of a substrate, forming conductive fingers by forming a conductive material in the trenches and forming an opening from a second main surface of the substrate thereby exposing the conductive fingers, the second main surface opposite the first main surface..
Infineon Technologies Ag


Mems microphone

A mems microphone includes a substrate (100), a supporting part (200), an upper polar plate (300) and a lower polar plate (400). The substrate (100) is provided with an opening (120) penetrating the middle thereof; the lower polar plate (400) straddles the opening (120); the supporting part (200) is fixed on the lower polar plate (400); the upper polar plate (300) is affixed to the supporting part (200); an accommodating cavity (500) is formed among the supporting part (200), the upper polar plate (300) and the lower polar plate (400); a recess (600) opposite to the accommodating cavity (500) is arranged in an intermediate region of at least one of the upper polar plate (300) and the lower polar plate (400), and insulation is achieved between the upper polar plate (300) and a lower polar plate (400)..
Csmc Technologies Fab Co., Ltd.

Elimination of 3d parasitic effects on microphone power supply rejection

Systems and methods are presented for power supply noise cancellation in a microphone package. A first node on a mems microphone package is coupled to an inverted voltage signal of a power supply output.
Robert Bosch Gmbh

Dynamic constancy of brightness or size of projected content in a scanning display system

A scanning projector includes a mems device with a scanning mirror that sweeps a beam in two dimensions. Actuating circuits receive scan angle information and provide signal stimulus to the mems device to control the amount of mirror deflection on two axes.
Microvision, Inc.

Mixed-mode depth detection

Briefly, in accordance with one or more embodiments, a mems laser beam display to implement mixed-mode depth detection comprises an imaging engine to project an image in a field of view of the mems laser beam display, a time of flight (tof) depth detector to determine a distance to a target within the field of view in a first mode of depth detection, wherein the tof depth detector determines coarse depth data of the target, and a structured light depth detector to determine a distance to the target in a second mode of depth detection, wherein the structured light depth detector determines fine depth data of the target. Depth processing circuitry may generate a composite three-dimensional (3d) image of the target, or may identify a gesture region of the target for gesture recognition..
Microvision, Inc.

Compensation and calibration of multiple mass mems sensor

A system includes a mems sensor having dual proof masses capable of moving independently from one another in response to forces imposed upon the proof masses. Each proof mass includes an independent set of sense contacts configured to provide output signals corresponding to the physical displacement of the corresponding sense mass.
Freescale Semiconductor, Inc.

Cmos-mems integrated device with selective bond pad protection

A method and system for preparing a semiconductor wafer are disclosed. In a first aspect, the method comprises providing a passivation layer over a patterned top metal on the semiconductor wafer, etching the passivation layer to open a bond pad in the semiconductor wafer using a first mask, depositing a protection layer on the semiconductor wafer, patterning the protective layer using a second mask, and etching the passivation layer to open other electrodes in the semiconductor wafer using a third mask.
Invensense, Inc.

Mems devices and methods of forming same

A microelectromechanical system (mems) device may include a mems structure over a first substrate. The mems structure comprises a movable element.
Taiwan Semiconductor Manufacturing Company, Ltd.

Refractory seed metal for electroplated mems structures

A system and method for a micro-electrical-mechanical system (mems) device including a substrate and a free-standing and suspended electroplated metal mems structure formed on the substrate. The free-standing and suspended electroplated metal mems structure includes a metal mechanical element mechanically coupled to the substrate and a seed layer mechanically coupled to and in electrical communication with the mechanical element, the seed layer comprising at least one of a refractory metal and a refractory metal alloy, wherein a thickness of the mechanical element is substantially greater than a thickness of the seed layer such that the mechanical and electrical properties of the free-standing and suspended electroplated metal mems structure are defined by the material properties of the mechanical element..
General Electric Company

Mems device, liquid ejecting head, liquid ejecting apparatus, manufacturing mems device, and manufacturing liquid ejecting head

A mems device includes a first substrate and a second substrate that is disposed laminated on the first substrate and has a piezoelectric element on the first substrate side, in which the first substrate and the second substrate are substantially the same size, and in planar view, an end of the first substrate and an end of the second substrate are disposed at substantially the same position.. .
Seiko Epson Corporation

Mems device, liquid ejecting head, liquid ejecting apparatus, manufacturing mems device, and manufacturing liquid ejecting head

A mems device includes a first substrate; a second substrate that is disposed laminated on the first substrate; and a functional element that is disposed between the first substrate and the second substrate, in which the second substrate is smaller than the first substrate, and in planar view, an end portion of the second substrate is disposed inside an end portion of the first substrate.. .
Seiko Epson Corporation

Mems device, liquid ejecting head, liquid ejecting apparatus, and manufacturing mems device

A mems device includes a first substrate which has a first electrode and a protective layer that covers the first electrode; a second substrate that is disposed laminated on the first substrate and that has a second electrode that is electrically connected to the first electrode; and a photosensitive adhesive which joins the protective layer and the second substrate, in which a joining surface of the protective layer which is joined by the photosensitive adhesive is flat.. .
Seiko Epson Corporation

Piezoelectric printhead assembly with multiplier to scale multiple nozzles

In an example, a piezoelectric printhead assembly includes a micro-electro mechanical system (mems) die including a plurality of nozzles. An application-specific integrated circuit (asic) die is coupled to the mems die by a plurality of wire bonds, wherein each of the wire bonds corresponds to a respective nozzle of the plurality of nozzles.
Hewlett-packard Development Company, L.p.

Release hole plus contact via for fine pitch ultrasound transducer integration

Methods, systems, computer-readable media, and apparatuses for high density micro-electro-mechanical systems (mems) are presented. In some embodiments, a method for manufacturing a micro-electro-mechanical device on a substrate can comprise etching a release via through a layer of the device.
Qualcomm Incorporated

Mems loudspeaker with position sensor

A mems loudspeaker for generating sound waves within an audible wavelength spectrum includes a circuit board, a membrane spaced from the circuit board and being deflectable along a z-axis, at least one piezoelectric actuator for deflecting the membrane, an electronic control unit embedded in the circuit board for controlling the at least one piezoelectric actuator, and at least one position sensor for providing to the control unit a sensor signal dependent on the deflection of the membrane, the control unit controlling the piezoelectric actuator based on the sensor signal.. .
Usound Gmbh

Mems microphone package structure having a non-planar substrate

A mems microphone package structure having a non-planar substrate is provided. It includes a non-planar substrate, a lid and a transducer.

Generation of audio and ultrasonic signals and measuring ultrasonic response in dual-mode mems speaker

A mems speaker that includes a control unit and multiple mems elements that include a membrane positioned in a first plane, a blind that is positioned in a second plane and a shutter that is positioned in a third plane. The control unit is configured to control the multiple mems elements to operate in an audio output mode or an ultrasonic output mode.
Dsp Group Ltd.

Digital mems loudspeaker

Devices related to digital mems loudspeakers are discussed. Such devices may include an air pressure source, mems valves coupled to the air pressure source, and an audio modulator coupled to the mems valve to receive an audio signal and to control the mems valves via a modulation signal to provide an acoustic output..
Intel Corporation

Radio frequency micro-electromechanical systems having inverted microstrip transmission lines and making the same

A rf mems package includes a mems die assembly having a signal line formed on a top surface of a first mounting substrate, the signal line comprising a mems device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and two pairs of ground pads formed on the top surface of the first mounting substrate adjacent respective portions of the signal line. The pairs of ground pads are positioned adjacent respective sides of the mems device.
General Electric Company

Radio frequency micro-electromechanical systems having inverted microstrip transmission lines and making the same

A radio frequency (rf) microelectromechanical system (mems) package includes a first mounting substrate, a signal line formed on a top surface of the first mounting substrate, the signal line comprising a mems device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and a ground assembly coupled to the first mounting substrate. The ground assembly includes a second mounting substrate, a ground plane formed on a bottom surface of the second mounting substrate, and at least one electrical interconnect extending through a thickness of the second mounting substrate to contact the ground plane, wherein the ground plane is spaced apart from the signal line..
General Electric Company

Hybrid mems oled display

A hybrid display includes a blue led backlight layer, at least one shutter element, a frontplane having multiple sub-pixels, and a backplane operatively connected to the frontplane and the at least one shutter element. The backplane and the at least one shutter element are positioned between the backlight layer and the frontplane..
Universal Display Corporation

Mems frame heating platform for electron imagable fluid reservoirs or larger conductive samples

A heating device having a heating element patterned into a robust mems substrate, wherein the heating element is electrically isolated from a fluid reservoir or bulk conductive sample, but close enough in proximity to an imagable window/area having the fluid or sample thereon, such that the sample is heated through conduction. The heating device can be used in a microscope sample holder, e.g., for sem, tem, stem, x-ray synchrotron, scanning probe microscopy, and optical microscopy..
Protochips, Inc.

Device with separation limiting standoff

An mems device, having two substantially parallel surfaces are separated by an initial distance. At least one of the surfaces includes a raised feature that limits the gap between the surfaces to less than the initial distance when an actuating voltage is applied.
Innovative Micro Technology

Mems reed switch device

A mems device, having two flexible, permeable members which are manufactured to have sub-millimeter dimensions using mems fabrication procedures. The flexible, permeable members may form a reed switch, which closes an electrical connection in the presence of a magnetic field, and opens the connection otherwise.
Innovative Micro Technology

Object recognition device

An object recognition device having a vcsel doppler sensor and an mems scanner; the mems scanner having at least one deflectable mems mirror for scanning an angular region using a laser beam from the vcsel doppler sensor; the vcsel doppler sensor being connected to a doppler control and evaluation element that is adapted for determining the velocity and/or the distance of an object.. .
Robert Bosch Gmbh

Miniature hermetic acceleration detection device

A mems acceleration detection device including a housing having a cavity and a spring mass system assembled into the cavity of the housing. A lid enclosing the spring mass system in the cavity and contacting a top surface of the housing..
Circor Aerospace, Inc.

Supersensitive linear pressure transducer

Apparatus and methods for a mems-fabricated variable capacitor. In one embodiment the capacitor is a comb drive comprising a plurality of plates interdigitated with a corresponding blades.
Purdue Research Foundation

Microelectromechanical structure with enhanced rejection of acceleration noise

An integrated mems structure includes a driving assembly anchored to a substrate and actuated with a driving movement. A pair of sensing masses suspended above the substrate and coupled to the driving assembly via elastic elements is fixed in the driving movement and performs a movement along a first direction of detection, in response to an external stress.
Stmicroelectronics S.r.l.

Method for manufacturing a mems element

A method for manufacturing a mems element, including the following: forming a least one stationary weight element and at least one moving weight element in the mems element, and positioning at least one fixing element at the stationary weight element and at the moving weight element, the fixing element being formed so as to be able to be severed.. .
Robert Bosch Gmbh

Cell stimulating system

Provided is a cell stimulating system including an oscillator, in an ultrasound probe array type, including a plurality of ultrasound devices disposed in a matrix structure, the oscillator being produced using a micro electro mechanical system (mems), a plurality of cell containers configured to each contain a cell that is selectively stimulated by the ultrasound devices, the cell containers being disposed on a top of the oscillator to correspond to each of the ultrasound devices, and a device operator configured to operate an ultrasound device selected from among the ultrasound devices. According to an embodiment of the present invention, it is possible to selectively and simultaneously stimulate the cell of each of the cell containers based on a plurality of parameters, by selective operation of the ultrasound devices of the oscillator by the device operator, such that various experiments are simultaneously performed while reducing cost and an amount of time used for the experiments..
Daegu Gyeongbuk Institute Of Science And Technolog

Mems device and fabrication method thereof

A method for fabricating an mems device includes providing a first substrate with a central region and a peripheral region, and forming a plurality of first openings in the peripheral region and a plurality of third openings in the central region by etching the first substrate from a front side. The depth of the first openings is larger than the depth of the third openings.
Semiconductor Manufacturing International (shanghai) Corporation

Mems and cmos integration with low-temperature bonding

The present disclosure relates an integrated chip having one or more mems devices. In some embodiments, the integrated chip has a carrier substrate with one or more cavities disposed within a first side of the carrier substrate.
Taiwan Semiconductor Manufacturing Co., Ltd.

Cmos-mems integration using metal silicide formation

A method and system for forming a mems device are disclosed. In a first aspect, the method comprises providing a conductive material over at least a portion of a top metal layer of a base substrate, patterning the conductive material and the at least a portion of the top metal layer, and bonding the conductive material with a device layer of a mems substrate via metal silicide formation.
Invensense, Inc.

Mems chip package and manufacturing the same

Provided is a micro-electro-mechanical system (mems) chip package, including a circuit substrate, a mems chip, a driving chip, a cover, an insulator, and at least one first pad. The circuit substrate has a first surface and a second surface opposite to each other.
Merry Electronics(shenzhen) Co., Ltd.

Multiple digital data sequences from an arbitrary data generator of a printhead assembly

In an example, a piezoelectric printhead assembly includes a micro-electro mechanical system (mems) die including a plurality of nozzles. An application-specific integrated circuit (asic) die is coupled to the mems die by a plurality of wire bonds, wherein each of the wire bonds corresponds to a respective nozzle of the plurality of nozzles.
Hewlett-packard Development Company, L.p.



Mems topics:
  • Camera Module
  • Acceleration Sensor
  • Microelectromechanical Systems
  • Control Unit
  • Semiconductor Substrate
  • Semiconductor
  • Demodulation
  • Accelerometer
  • Calibration
  • Modulation
  • Mems Devices


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    This listing is a sample listing of patent applications related to Mems for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Mems with additional patents listed. Browse our RSS directory or Search for other possible listings.


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