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Mems Devices

Mems Devices-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Protection schemes for mems switch devices
Analog Devices Global
March 22, 2018 - N°20180083439

Micro-electromechanical switch (mems) devices can be fabricated using integrated circuit fabrication techniques and materials. Such switch devices can provide cycle life and insertion loss performance suiting for use in a broad range of applications including, for example, automated test equipment (ate), switching for measurement instrumentation (such as a spectrum analyzer, network analyzer, or communication test system), and uses in communication ...
Internal tire windmill energy harvester
Bridgestone Americas Tire Operations, Llc
March 22, 2018 - N°20180079265

Electrical system may be configured to operate inside a tire mounted to a wheel. Electrical system may include a plurality of microelectromechanical system (mems) devices including a gas flow energy receiver mechanically coupled to at least one base. Each gas flow energy receiver may be operatively coupled to at least one generator. Generator may be configured to convert gas flow ...
Mems device and process
Cirrus Logic International Semiconductor Ltd.
February 01, 2018 - N°20180035190

This application relates to mems devices, especially mems capacitive transducers and to processes for forming such mems transducer that provide increased robustness and resilience to acoustic shock. The application describes a mems transducer (400) having at least one membrane layer (101) supported so as to define a flexible membrane. A strengthening layer (401; 701) is mechanically coupled to the membrane layer and is disposed ...
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Mems devices having tethering structures
Taiwan Semiconductor Manufacturing Co., Ltd.
January 25, 2018 - N°20180022603

The present disclosure relates to a method for fabricating a micro-electromechanical system (mems) device. In the method, a carrier wafer is received. A mems wafer, which includes a plurality of die, is bonded to the carrier wafer. A cavity is formed to separate an upper surface of the carrier wafer from a lower surface of a die of the mems ...
Use of a reactive, or reducing gas as a method to increase contact lifetime in ...
International Business Machines Corporation
January 11, 2018 - N°20180009657

A mems device comprises an electro mechanical element in a sealed chamber containing a gas comprising a reactive gas selected to react with any contaminants that may be present or formed on the operating surfaces of the device in a manner to maximize the electrical conductivity of the surfaces during operation of the device. The mems device may comprise a ...
Mems devices and processes
Cirrus Logic International Semiconductor Ltd.
January 04, 2018 - N°20180007474

A mems transducer structure comprises a substrate comprising a cavity. A membrane layer is supported relative to the substrate to provide a flexible membrane. A peripheral edge of the cavity defines at least one perimeter region that is convex with reference to the center of the cavity. The peripheral edge of the cavity may further define at least one perimeter ...
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Mems devices and processes
Cirrus Logic International Semiconductor Ltd.
January 04, 2018 - N°20180002159

The application describes mems transducer having a flexible membrane and which seeks to alleviate and/or redistribute stresses within the membrane layer. A membrane having a first/active region and a second/inactive region is described.
Mems device for harvesting sound energy and methods for fabricating same
Globalfoundries Singapore Pte. Ltd.
December 21, 2017 - N°20170366107

Micro-electro-mechanical system (mems) devices for harvesting sound energy and methods for fabricating mems devices for harvesting sound energy are provided. In an embodiment, a method for fabricating a mems device for harvesting sound energy includes forming a pressure sensitive mems structure disposed over a semiconductor substrate and including a suspended structure in a cavity. Further, the method includes etching the ...
Resistive switching for mems devices
Robert Bosch Gmbh
December 21, 2017 - N°20170363478

A mems device includes a bolometer attached to a silicon wafer by a base portion of at least one anchor structure. The base portion comprises a layer stack having a metal-insulator-metal (mim) configuration such that the base portion acts as a resistive switch such that, when the first dc voltage is applied to the patterned conductive layer, the base portion ...
Anti-getter: expandable polymer microspheres for mems devices
Robert Bosch Gmbh
December 21, 2017 - N°20170362078

A method of fabricating a mems device includes depositing an expandable material into a first recess of a cap wafer. The cap wafer includes a plurality of walls that surround and define the first recess and a second recess. The cap wafer is bonded to a mems wafer including a first mems device and a second mems device. The first ...
Method and system for mems devices with dual damascene formed electrodes
Invensense, Inc.
December 14, 2017 - N°20170355593

Methods and systems for mems devices with dual damascene formed electrodes is disclosed and may include forming first and second dielectric layers on a semiconductor substrate that includes a conductive layer at least partially covered by the first dielectric layer; removing a portion of the second dielectric layer; forming vias through the second dielectric layer and at least a portion ...
Mems electrical contact systems and methods
Digitaloptics Corporation
November 16, 2017 - N°20170329098

A microelectromechanical systems (mems) device may be provided with one or more sintered electrical contacts. The mems device may be a mems actuator or a mems sensor. The sintered electrical contacts may be silver-paste metalized electrical contacts. The sintered electrical contacts may be formed by depositing a sintering material such as a metal paste, a metal preform, a metal ink, ...
Subterranean formation characterization using microelectromechanical system (mems) devices
Halliburton Energy Services, Inc.
November 09, 2017 - N°20170322341

Systems and methods for formation characterization in a subterranean formation are disclosed. A set of microelectromechanical system (mems) devices may be disposed in a circulating fluid. Each mems device in the set may have a machine-scannable designator. A mems scanner may be configured to scan the designator of a mems device in response to circulation of the circulating fluid in ...
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Subterranean formation characterization using microelectromechanical system (mems) devices
November 02, 2017 - N°20170314391

Systems and methods for formation characterization in a subterranean formation are disclosed. A set of microelectromechanical system (mems) devices may be disposed in a circulating fluid. Each mems device in the set may have a machine-scannable designator. A mems scanner may be configured to scan the designator of a mems device in response to circulation of the circulating fluid in ...
Integrated circuits having shielded mems devices and methods for fabricating shielded mems devices
November 02, 2017 - N°20170313577

Integrated circuits having shielded micro-electromechanical system (mems) devices and method for fabricating shielded mems devices are provided. In an example, an integrated circuit having a shielded mems device includes a substrate, a ground plane including conductive material over the substrate, and a dielectric layer over the ground plane. The integrated circuit further includes a mems device over the ground plane. ...
Flexure shear and strain actuator
October 19, 2017 - N°20170302197

Systems and apparatuses are provided for increasing the possible force and/or travel generated in mems devices. For example, comb fingers may be utilized to form a strain actuator to generate larger forces. As another example, the force advantage of a parallel plate actuator is leveraged while also leveraging the travel advantage of comb drives to increase force and/or ...
Magnetic circuits for mems devices
Intel Corporation
October 05, 2017 - N°20170288479

An example apparatus for produce magnetic fields includes a base plate comprising a plurality of grooves. The apparatus includes an mems device disposed on the base plate. The apparatus further includes a number of magnets to produce one or more magnetic fields disposed on the plurality of grooves and adjacent to the mems device.
Apparatus and methods for integrated mems devices
Mcube, Inc.
October 05, 2017 - N°20170283256

A method for a mems device includes receiving a diced wafer having a plurality devices disposed upon an adhesive substrate and having an associated known good device data, removing a first set of devices from the plurality of devices from the adhesive substrate in response to the known good device data, picking and placing a first set of the devices ...
Stabilized transient liquid phase metal bonding material for hermetic wafer level packaging of mems devices
Texas Instruments Incorporated
October 05, 2017 - N°20170283255

In described examples, a transient liquid phase (tlp) metal bonding material includes a first substrate and a base metal layer. The base metal layer is disposed over at least a portion of the first substrate. The base metal has a surface roughness (ra) of between about 0. 001 to 500 nm. Also, the tlp metal bonding material includes a first terminal metal layer ...
Multi-pressure mems package
Taiwan Semiconductor Manufacturing Co., Ltd.
October 05, 2017 - N°20170283250

The present disclosure relates to a microelectromechanical systems (mems) package having two mems devices with different pressures, and an associated method of formation. In some embodiments, the (mems) package includes a device substrate and a cap substrate bonded together. The device substrate includes a first trench and a second trench. A first mems device is disposed over the first trench ...
In-plane overtravel stops for mems microphone
Robert Bosch Gmbh
September 28, 2017 - N°20170280263

Mems microphones and mems devices. In one embodiment, the mems microphone includes a membrane and a layer. The membrane is coupled to a support. The layer includes a backplate and an overtravel stop. The backplate is coupled to the support. The overtravel stop is coupled to the membrane and is physically separated from the backplate by a gap in a ...
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