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Mems Devices

Mems Devices-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Subterranean formation characterization using microelectromechanical system (mems) devices
Halliburton Energy Services, Inc.
November 09, 2017 - N°20170322341

Systems and methods for formation characterization in a subterranean formation are disclosed. A set of microelectromechanical system (mems) devices may be disposed in a circulating fluid. Each mems device in the set may have a machine-scannable designator. A mems scanner may be configured to scan the designator of a mems device in response to circulation of the circulating fluid in ...
Mems grid for manipulating structural parameters of mems devices
Mems Drive, Inc.
November 09, 2017 - N°20170320724

A system and method for manipulating the structural characteristics of a mems device include etching a plurality of holes into the surface of a mems device, wherein the plurality of holes comprise one or more geometric shapes determined to provide specific structural characteristics desired in the mems device.
Subterranean formation characterization using microelectromechanical system (mems) devices
Mems Drive, Inc.
November 02, 2017 - N°20170314391

Systems and methods for formation characterization in a subterranean formation are disclosed. A set of microelectromechanical system (mems) devices may be disposed in a circulating fluid. Each mems device in the set may have a machine-scannable designator. A mems scanner may be configured to scan the designator of a mems device in response to circulation of the circulating fluid in ...
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Flexure shear and strain actuator
Mems Drive, Inc.
October 19, 2017 - N°20170302197

Systems and apparatuses are provided for increasing the possible force and/or travel generated in mems devices. For example, comb fingers may be utilized to form a strain actuator to generate larger forces. As another example, the force advantage of a parallel plate actuator is leveraged while also leveraging the travel advantage of comb drives to increase force and/or ...
Magnetic circuits for mems devices
Intel Corporation
October 05, 2017 - N°20170288479

An example apparatus for produce magnetic fields includes a base plate comprising a plurality of grooves. The apparatus includes an mems device disposed on the base plate. The apparatus further includes a number of magnets to produce one or more magnetic fields disposed on the plurality of grooves and adjacent to the mems device.
Apparatus and methods for integrated mems devices
Mcube, Inc.
October 05, 2017 - N°20170283256

A method for a mems device includes receiving a diced wafer having a plurality devices disposed upon an adhesive substrate and having an associated known good device data, removing a first set of devices from the plurality of devices from the adhesive substrate in response to the known good device data, picking and placing a first set of the devices ...
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Multi-pressure mems package
Taiwan Semiconductor Manufacturing Co., Ltd.
October 05, 2017 - N°20170283250

The present disclosure relates to a microelectromechanical systems (mems) package having two mems devices with different pressures, and an associated method of formation. In some embodiments, the (mems) package includes a device substrate and a cap substrate bonded together. The device substrate includes a first trench and a second trench. A first mems device is disposed over the first trench ...
In-plane overtravel stops for mems microphone
Robert Bosch Gmbh
September 28, 2017 - N°20170280263

Mems microphones and mems devices. In one embodiment, the mems microphone includes a membrane and a layer. The membrane is coupled to a support. The layer includes a backplate and an overtravel stop. The backplate is coupled to the support. The overtravel stop is coupled to the membrane and is physically separated from the backplate by a gap in a ...
Piezoelectric alloy films
Teledyne Dalsa Semiconductor, Inc.
September 14, 2017 - N°20170263847

A thin film xyal(1-y)n alloy preferably deposited with an intrinsic tensile stress significantly enhances the piezoelectric properties of aln. The alloy contains y percent of the compound xn, where x is selected from the group consisting of yb, ho, dy, lu, tm, tb, and gd. The percentage of xn preferably lies in the range 10-60%, and the stress ...
Mems devices and processes
Cirrus Logic International Semiconductor Ltd.
September 14, 2017 - N°20170260044

This application relates to mems transducer having a membrane layer (101) and at least one variable vent structure (301). The variable vent structure has a vent hole for venting fluid so as to reduce a pressure differential across the membrane layer and a moveable vent cover (302a, 302b) which, at an equilibrium position, at least partly blocks the vent hole. The vent ...
Method and structure for cmos-mems thin film encapsulation
Taiwan Semiconductor Manufacturing Company, Ltd.
September 14, 2017 - N°20170260042

Representative methods for sealing mems devices include depositing insulating material over a substrate, forming conductive vias in a first set of layers of the insulating material, and forming metal structures in a second set of layers of the insulating material. The first and second sets of layers are interleaved in alternation. A dummy insulating layer is provided as an upper-most ...
Multi-layer composite backplate for micromechanical microphone
Robert Bosch Gmbh
August 24, 2017 - N°20170245060

Backplates for mems devices. In one embodiment, the backplate includes an interconnect layer, a first layer, a second layer and a plurality of openings. The interconnect layer includes a first side and a second side that is opposite from the first side. The first layer is coupled to the first side of the interconnect layer. The second layer is coupled ...
Low cost wafer level process for packaging mems three dimensional devices
The Regents Of The University Of California
August 17, 2017 - N°20170233247

An apparatus and method for wafer-level hermetic packaging of microelectromechanical systems (mems) devices of different shapes and form factors is presented in this disclosure. The method is based on bonding a glass cap wafer with fabricated micro-glassblown “bubble-shaped” structures to the substrate glass/si wafer. Metal traces fabricated on the substrate wafer serve to transfer signals ...
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Use of a reactive, or reducing gas as a method to increase contact lifetime in ...
International Business Machines Corporation
July 27, 2017 - N°20170210620

A mems device comprises an electro mechanical element in a sealed chamber containing a gas comprising a reactive gas selected to react with any contaminants that may be present or formed on the operating surfaces of the device in a manner to maximize the electrical conductivity of the surfaces during operation of the device. The mems device may comprise a ...
Mems devices and methods of forming the same
Taiwan Semiconductor Manufacturing Company, Ltd.
July 27, 2017 - N°20170210618

A mems device and methods of forming are provided. A dielectric layer of a first substrate is patterned to expose conductive features and a bottom layer through the dielectric layer. A first surface of a second substrate is bonded to the dielectric layer and the second substrate is patterned to form a membrane and a movable element. A cap wafer ...
Simplified mems device fabrication process
Mems Drive, Inc.
July 13, 2017 - N°20170197825

A simplified mems fabrication process and mems device is provided that allows for cheaper and lighter-weight mems devices to be fabricated. The process comprises etching a plurality of holes or other feature patterns into a mems device, and then etching away the underlying wafer such that, after the etching process, the mems device is the required thickness and the individual ...
Microfluidic die on a support with at least one other die
Stmicroelectronics, Inc.
July 06, 2017 - N°20170190175

The present disclosure provides supports for a microfluidic die and one or more additional die including, but not limited to, microfluidic die, asics, mems devices, and sensors. This includes semi-flexible supports that allow a microfluidic die to be at a 90 degree angle with respect to another die and rigid supports that allow a microfluidic and another die to be in ...
Mems grid for manipulating structural parameters of mems devices
Mems Drive, Inc.
June 15, 2017 - N°20170170059

A system and method for manipulating the structural characteristics of a mems device include etching a plurality of holes into the surface of a mems device, wherein the plurality of holes comprise one or more geometric shapes determined to provide specific structural characteristics desired in the mems device.
Identification of a seal failure in mems devices
Invensense International, Inc.
June 15, 2017 - N°20170167945

A microelectromechanical sensor (mems) package includes a gyroscope and an accelerometer. The gyroscope is located within a low-pressure cavity that is sealed from an external pressure. The accelerometer is located within a cavity, and the seal for the accelerometer cavity is entirely within the gyroscope cavity. Under normal operating conditions, the accelerometer seal holds the accelerometer cavity at a higher ...
Metallizing mems devices
Analog Devices, Inc.
June 15, 2017 - N°20170166439

Various embodiments produce a semiconductor device, such a mems device, having metallized structures formed by replacing a semiconductor structure with a metal structure. Some embodiments expose a semiconductor structure to one or more a reacting gasses, such as gasses including tungsten or molybdenum.
Surgical instruments including mems devices
Covidien Lp
May 11, 2017 - N°20170128149

Surgical instruments are disclosed that are couplable to or have an end effector or a disposable loading unit with an end effector, and at least one micro-electromechanical system (mems) device operatively connected to the surgical instrument for at least one of sensing a condition, measuring a parameter and controlling the condition and/or parameter.
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