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Mems Devices patents



      
           
This page is updated frequently with new Mems Devices-related patent applications. Subscribe to the Mems Devices RSS feed to automatically get the update: related Mems RSS feeds. RSS updates for this page: Mems Devices RSS RSS


Date/App# patent app List of recent Mems Devices-related patents
06/19/14
20140169405
 Sensor with an embedded thermistor for precise local temperature measurement patent thumbnailSensor with an embedded thermistor for precise local temperature measurement
A resistive temperature sensor (thermistor) for a microelectromechanical system (mems) device provides local temperatures of mems sensors and other mems devices for temperature compensation. Local accurate temperatures of the sensors and other devices provide for temperature compensation of such sensors or devices.
06/12/14
20140162462
 High frequency filter for improved rf bias signal stability patent thumbnailHigh frequency filter for improved rf bias signal stability
A plasma-assisted etch process for the manufacture of semiconductor or mems devices employs an rf source to generate a plasma that is terminated through an electrode. The termination is designed as a “short” at the frequency of the rf source to minimize voltage fluctuations on the electrode due to the rf source energy.
06/12/14
20140162393
 Multi-axis integrated mems devices with cmos circuits and method therefor patent thumbnailMulti-axis integrated mems devices with cmos circuits and method therefor
An integrated multi-axis mechanical device and integrated circuit system. The integrated system can include a silicon substrate layer, a cmos device region, four or more mechanical devices, and a wafer level packaging (wlp) layer.
06/12/14
20140159779
 Stiction reduction for mems devices patent thumbnailStiction reduction for mems devices
A capacitive micro-electromechanical switch (mems) integrated circuit (ic) comprises a plurality of capacitors, each having a voltage terminal for applying an actuation voltage to the individual capacitor, wherein each capacitor is capable of being individually cycled. The mems ic further includes: a high voltage driver having a voltage distribution mechanism that couples to the voltage terminal of each of the plurality of capacitors to enable the high voltage driver to selectively provide a pre-determined voltage input required to actuate and charge a selected one or more of the plurality of capacitors; and control logic communicatively coupled to the high voltage driver and which deterministically applies power cycle times (less than a stiction limit) for an actuation and de-actuation of at least a first capacitor of the plurality of capacitors to substantially reduce an occurrence of stiction within at least the first capacitor during operation of the mems device..
06/05/14
20140152143
 Control circuitry routing configuration for mems devices patent thumbnailControl circuitry routing configuration for mems devices
A method for constructing a mems system includes first depositing on a surface of a substrate a first plurality of thin film layers formed of dielectric material. The first plurality of thin-film layers includes at least one conductive trace extending a distance on the substrate, parallel to the surface.
06/05/14
20140151823
 Mems devices and methods of forming same patent thumbnailMems devices and methods of forming same
The present invention provides a mems structure comprising confined sacrificial oxide layer and a bonded si layer. Polysilicon stack is used to fill aligned oxide openings and mems vias on the sacrificial layer and the bonded si layer respectively.
05/08/14
20140126167
Using millisecond pulsed laser welding in mems packaging
A new packaging method for a wide range of mems for application on both the wafer and device scale. Titanium is used as the packaging material and both silicon and titanium mems devices are integrated on to a titanium substrate.
05/08/14
20140125431
Tunable and switchable resonator and filter structures in single crystal piezoelectric mems devices using bimorphs
A mems device includes a substrate, one or more anchors formed on a first surface of the substrate, and a piezoelectric layer suspended over the first surface of the substrate by the one or more anchors. Notably, the piezoelectric layer is a bimorph including a first bimorph layer and a second bimorph layer.
05/08/14
20140125201
Variable capacitor and switch structures in single crystal piezoelectric mems devices using bimorphs
A micro-electrical-mechanical systems (mems) device includes a substrate, one or more anchors formed on a first surface of the substrate, and a piezoelectric layer suspended over the first surface of the substrate by the one or more anchors. A first electrode may be provided on a first surface of the piezoelectric layer facing the first surface of the substrate, such that the first electrode is in contact with a first bimorph layer of the piezoelectric layer.
04/17/14
20140105242
 Device and methods for temperature and humidity measurements using a nanocomposite film sensor patent thumbnailDevice and methods for temperature and humidity measurements using a nanocomposite film sensor
Devices and methods are provided for a nanocomposite having a phase change polymer matrix and conductive nanoparticles to provide greatly enhanced responsivity to temperature and/or humidity. A sensing film includes carbon nanotubes (cnts) and the polymer.
04/17/14
20140103462
Mems devices and methods for forming the same
A method includes forming a micro-electro-mechanical system (mems) device on a front surface of a substrate. After the step of forming the mems device, a through-opening is formed in the substrate, wherein the through-opening is formed from a backside of the substrate.
04/17/14
20140103461
Mems devices and fabrication methods thereof
A method for fabricating a mems device includes providing a micro-electro-mechanical system (mems) substrate having a sacrificial layer on a first side, providing a carrier including a plurality of cavities, bonding the first side of the mems substrate on the carrier, forming a first bonding material layer on a second side of the mems substrate, applying a sacrificial layer removal process to the mems substrate, providing a semiconductor substrate including a second bonding material layer and bonding the semiconductor substrate on the second side of the mems substrate.. .
04/17/14
20140103460
Mems device and method of manufacturing a mems device
A method for manufacturing a mems device is disclosed. Moreover a mems device and a module including a mems device are disclosed.
03/20/14
20140078154
Display apparatus with multi-height spacers
A device includes an array of devices formed on a first substrate. A second substrate is spaced away from the first substrate such that the array of devices are positioned between the first and second substrates.
02/13/14
20140042562
Mems devices and methods for forming the same
A device includes a micro-electro-mechanical system (mems) wafer having a mems device therein. The mems device includes a movable element, and first openings in the mems wafer.
01/30/14
20140031750
Systems, methods, and devices for in vivo delivery using remote actuation of implantable hydrogel mems devices
Microelectromechanical system (mems) devices can be fabricated completely of hydrogel materials. Such hydrogels can include polyethylene glycol with diacrylate functional groups (e.g., pegda), which are photopolymerizable in the presence of crosslinkers and photoinitiators.
01/16/14
20140018703
Microphone for remote health sensing
A health sensing device is described for placement on a user. The device may include a sensor, a filter, and a transmitter.
01/16/14
20140015069
Mems devices, packaged mems devices, and methods of manufacture thereof
Mems devices, packaged mems devices, and methods of manufacture thereof are disclosed. In one embodiment, a microelectromechanical system (mems) device includes a first mems functional structure and a second mems functional structure.
01/09/14
20140008738
Mems die and methods with multiple-pressure sealing
The present subject matter relates to systems and methods for sealing one or more mems devices within an encapsulated cavity. A first material layer can be positioned on a substrate, the first material layer comprising a first cavity and a second cavity that each have one or more openings out of the first material layer.
01/02/14
20140000367
Mems gyros with quadrature reducing springs
Spring set configurations that include an advantageous combination of spring geometries are disclosed. Spring elements having curved and straight sections, orientation of spring element anchor points with respect to the common radius, orientation of spring element segments with respect to a specific axis, balance of the length of spring elements about the common radius, and mass balance about the common radius can be used to mitigate unwanted out of plane motion.
12/26/13
20130341736
Packaging compatible wafer level capping of mems devices
This invention discloses and claims a cost-effective, wafer-level package process for microelectromechanical devices (mems). Specifically, the movable part of mems device is encapsulated and protected while in wafer form so that commodity, lead-frame packaging can be used.
12/19/13
20130335878
Mems lifetime enhancement
The present invention generally relates to methods for increasing the lifetime of mems devices by reducing the number of movements of a switching element in the mems device. Rather than returning to a ground state between cycles, the switching element can remain in the same state if both cycles necessitate the same capacitance.
12/19/13
20130334620
Mems devices and fabrication methods thereof
A method for fabricating a mems device includes providing a micro-electro-mechanical system (mems) substrate having a sacrificial layer on a first side, providing a carrier including a plurality of cavities, bonding the first side of the mems substrate on the carrier, forming a first bonding material layer on a second side of the mems substrate, applying a sacrificial layer removal process to the mems substrate, providing a semiconductor substrate including a second bonding material layer and bonding the semiconductor substrate on the second side of the mems substrate.. .
10/31/13
20130283913
Microelectromechanical systems devices and methods for the fabrication thereof
Embodiments of compact micro-electro-mechanical systems (mems) devices are provided, as are embodiments of methods for fabricating mems devices. In one embodiment, the mems device includes a substrate, a movable structure resiliently coupled to the substrate, and an anchored structure fixedly coupled to the substrate.
10/24/13
20130282020
Method for using microelectromechanical systems to generate movement in a phacoemulsification handpiece
The present invention relates to a phacoemulsification handpiece, comprising a needle and a microelectromechanical system (mems) device, wherein the needle is coupled with the mems device. The phacoemulsification handpiece may further comprise a horn, wherein the horn is coupled with the needle and the mems device.
10/24/13
20130277836
Method and structure of sensors and mems devices using vertical mounting with interconnections
A method and structure for fabricating sensor(s) or electronic device(s) using vertical mounting with interconnections. The method includes providing a resulting device including at least one sensor or electronic device, formed on a die member, having contact region(s) with one or more conductive materials formed thereon.
10/24/13
20130277770
Mems devices and methods of forming the same
A device includes a substrate, a routing conductive line over the substrate, a dielectric layer over the routing conductive line, and an etch stop layer over the dielectric layer. A micro-electro-mechanical system (mems) device has a portion over the etch stop layer.
10/10/13
20130264662
Electronic device, system, and method comprising differential sensor mems devices and drilled substrates
Electronic device including a substrate provided with at least one passing opening, a mems device with a differential sensor provided with a first and a second surface having at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof. The first surface of the mems device leaves the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the mems device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the mems device and the substrate..
10/03/13
20130260503
Methods and apparatuses for integrated packaging of microelectromechanical devices
Microelectromechanical systems (mems) packages, packaged mems devices, and methods for making the same are disclosed. The method may include forming a chamber sacrificial layer above an insulating layer that is coupled to a wafer.
10/03/13
20130256896
Vertical mount package and wafer level packaging therefor
Vertical mount packages and methods for making the same are disclosed. A method for manufacturing a vertical mount package includes providing a device substrate with a plurality of device regions on a front surface, and a plurality of through-wafer vias.
09/19/13
20130241999
Highly integrated wafer bonded mems devices with release-free membrane manufacture for high density print heads
A method of fabricating a mems inkjet type print head and the resulting device is disclosed. The method includes providing a driver component and separately providing an actuatable membrane component, the actuatable membrane component being formed in the absence of an acid etch removing a sacrificial layer.
09/19/13
20130239996
Integrated processing and critical point drying systems for semiconductor and mems devices
Processing and drying of a sample, such as a semiconductor or mems device, is achieved using a single pressure chamber. The pressure chamber holds the sample in a sealed interior volume throughout various process steps, such as, but not limited to, photoresist removal, sacrificial layer etching, flushing or rinsing, dehydration, and critical point drying.
09/05/13
20130230939
High aspect ratio mems devices and methods for forming the same
An hf vapor etch etches high aspect ratio openings to form mems devices and other tightly-packed semiconductor devices with 0.2 μm air gaps between structures. The hf vapor etch etches oxide plugs and gaps with void portions and oxide liner portions and further etches oxide layers that are buried beneath silicon and other structures and is ideally suited to release cantilevers and other mems devices.
09/05/13
20130228881
High aspect ratio capacitively coupled mems devices
A method that includes forming an opening between at least one first electrode and a second electrode by forming a recess in a first electrode layer, the recess having sidewalls that correspond to a surface of the at least one first electrode, forming a first sacrificial layer on the sidewalls of the recess, the first sacrificial layer having a first width that corresponds to a second width of the opening, forming a second electrode layer in the recess that corresponds to the second electrode, and removing the first sacrificial layer to form the opening between the second electrode and the at least one first electrode.. .
08/29/13
20130222073
Design and control of multi-temperature micro-oven for mems devices
Disclosed are microelectromechanical system (mems) devices and methods of using the same. In some embodiments, a mems device comprises a micro-oven comprising a mems oscillator configured to generate a reference signal.
08/22/13
20130219207
Distributed mems devices synchronization methods and apparatus
A method is provided for time synchronization in a mems (microelectromechanical system) based system having a mems processor and a plurality of mems devices. In a specific embodiment, the method includes, in the mems processor, transmitting a synchronization signal to the plurality of mems devices and saving a local time upon transmitting the synchronization signal.
08/22/13
20130213139
Mems vacuum level monitor in sealed package
A vacuum sensor for sensing vacuum in a sealed enclosure is provided. The sealed enclosure includes active mems devices desired to be maintained in vacuum conditions.
08/08/13
20130203199
Methods of bonding caps for mems devices
A method includes bonding a first bond layer to a second bond layer through eutectic bonding. The step of bonding includes heating the first bond layer and the second bond layer to a temperature higher than a eutectic temperature of the first bond layer and the second bond layer, and performing a pumping cycle.
07/04/13
20130170166
Semiconductor package substrate and method, in particular for mems devices
A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.. .
07/04/13
20130168852
Mems devices and methods of forming same
A microelectromechanical system (mems) device may include a mems structure over a first substrate. The mems structure comprises a movable element.
07/04/13
20130168675
Detection and mitigation of particle contaminants in mems devices
Detecting and/or mitigating the presence of particle contaminants in a mems device involves including mems structures that in normal operation are robust against the presence of particles but which can be made sensitive to that presence during a test mode prior to use, e.g., by switching the impedance of sensitive structures between an exceptionally sensitive condition during test and a normal sensitivity during operation; surrounding sensitive nodes with guard elements that are at the same potential as those nodes during operation, thereby offering protection against bridging particles, but are at a very different potential during test and reveal the particles by their resulting leakage currents; extending the sensitive nodes to interdigitate with or otherwise extend adjacent to the guard structures, which neither contribute to nor detract from the device operation but cover otherwise open areas with detection means during test; and/or converting benign areas in which particles might become trapped undetectably by electric fields during test to field-free regions by extending otherwise non-functional conductive layers so that the particles can then be moved into detection locations by providing some mechanical disturbance.. .
06/13/13
20130146835
Nanostructures and methods for manufacturing the same
A resonant tunneling diode, and other one dimensional electronic, photonic structures, and electromechanical mems devices, are formed as a heterostructure in a nanowhisker by forming length segments of the whisker with different materials having different band gaps.. .
06/06/13
20130140678
Insulator layer based mems devices
The present invention relates to using an insulator layer between two metal layers of a semiconductor die to provide a micro-electromechanical systems (mems) device, such as an ohmic mems switch or a capacitive mems switch. In an ohmic mems switch, the insulator layer may be used to reduce metal undercutting during fabrication, to prevent electrical shorting of a mems actuator to a mems cantilever, or both.
06/06/13
20130140650
Mems devices and methods for forming the same
A method includes forming a micro-electro-mechanical system (mems) device on a front surface of a substrate. After the step of forming the mems device, a through-opening is formed in the substrate, wherein the through-opening is formed from a backside of the substrate.
05/30/13
20130135317
Thin back glass interconnect
This disclosure provides systems, methods and apparatus for providing packaged microelectromechanical systems (mems) devices. In one aspect, package can include a cover glass joined to a device substrate, the cover glass including integrated electrical connectivity and configured to encapsulate one or more mems devices on the device substrate.
05/16/13
20130119489
Method and apparatus for wafer-level solder hermetic seal encapsulation of mems devices
A plurality of mems devices are formed on a substrate, a sacrificial layer is formed to cover each of the mems devices and a protective cap layer is formed on the sacrificial layer. A release hole is formed through the protective cap layer to the underlying sacrificial layer, and a releasing agent is introduced through the release hole to remove the sacrificial layer under the protective cap layer and expose a mems device.
05/09/13
20130115730
Low-temperature wafer level processing for mems devices
It would be beneficial to integrate mems devices with silicon cmos electronics, package them in controlled environments, e.g. Vacuum for mems resonators, and provide industry standard electrical interconnections such as solder bumps.
05/02/13
20130104980
Low-melting lead-free bismuth sealing glasses
Glasses comprising bi203, zno b203 and optionally a colorant including an oxide of a metal such as iron, cobalt, manganese, nickel, copper and chromium are suitable to form hermetic seals in solar cell modules, architectural glass windows and mems devices. Glass frit and paste compositions suitable for flow and bonding to various substrates—glass, metal, silicon, in the temperature range of 400-500 degrees centigrade.
04/04/13
20130082258
Method for strip testing of mems devices, testing strip of mems devices and mems device thereof
A method for testing a strip of mems devices, the mems devices including at least a respective die of semiconductor material coupled to an internal surface of a common substrate and covered by a protection material; the method envisages: detecting electrical values generated by the mems devices in response to at least a testing stimulus; and, before the step of detecting, at least partially separating contiguous mems devices in the strip. The step of separating includes defining a separation trench between the contiguous mems devices, the separation trench extending through the whole thickness of the protection material and through a surface portion of the substrate, starting from the internal surface of the substrate..
03/28/13
20130076919
Optical image stabilization using tangentially actuated mems devices
In one example, an actuator device useful in, e.g., a camera for, e.g., optical image stabilization (ois), includes a stage resiliently supported for movement within a plane, three or more actuators, each coupled to an outer periphery of the stage and operable to apply a force acting in the plane and tangentially to the stage when actuated, and an outer frame surrounding and supporting the stage and the actuators.. .
03/28/13
20130076144
System and method for limiting photovoltaic string voltage
A system and method are provided for enabling a pv inverter to be connected to a string of series connected pv modules without exposing the inverter to elevated voltage stresses. The input voltage to the inverter is gradually built up by sequentially switching in more series pv modules.
03/21/13
20130070436
Systems and methods for high aspect ratio flip-chip interconnects
Interconnect and/or reflow methods of the present disclosure achieve high aspect ratio interconnects, for example interconnects having an aspect ratio as high as 4, in addition to wider interconnect height tolerances among interconnects (for example, interconnects having a height variability of up to about 30%) while still achieving reliable electrical connections. Moreover, flip-chip interconnects configured in accordance with principles of the present disclosure can provide improved z-axis spacing between die-to-die and/or die-to-substrate flip chip stacks, for example z-axis spacing as large as 600 μm.
03/21/13
20130069178
Method of manufacturing a device with a cavity
The invention relates to a micro-device with a cavity, the micro-device comprising a substrate, the method comprising steps of: a) providing the substrate, having a surface and comprising a sacrificial oxide region at the surface; b) covering the sacrificial oxide region with a porous layer being permeable to a vapor hf etchant, and c) selectively etching the sacrificial oxide region through the porous layer using the vapor hf etchant to obtain the cavity. This method may be used in the manufacture of various micro-devices with a cavity, i.e.
03/07/13
20130056036
Integrated processing and critical point drying systems for semiconductor and mems devices
Processing and drying of a sample, such as a semiconductor or mems device, is achieved using a single pressure chamber. The pressure chamber holds the sample in a sealed interior volume throughout various process steps, such as, but not limited to, photoresist removal, sacrificial layer etching, flushing or rinsing, dehydration, and critical point drying.
02/21/13
20130044898
Sensitivity adjustment apparatus and method for mems devices
A microelectromechanical (mems) microphone includes a mems motor and a gain adjustment apparatus. The mems motor includes at least a diaphragm and a charge plate and is configured to receive sound energy and transform the sound energy into an electrical signal.
01/31/13
20130030354
Systems, methods, and devices for in vivo delivery using remote actuation of implantable hydrogel mems devices
Microelectromechanical system (mems) devices can be fabricated completely of hydrogel materials. Such hydrogels can include polyethylene glycol with diacrylate functional groups (e.g., pegda), which are photopolymerizable in the presence of crosslinkers and photoinitiators.
01/24/13
20130023082
Apparatus and method of wafer bonding using compatible alloy
A method of forming a mems device provides first and second wafers, where at least one of the first and second wafers has a two-dimensional array of mems devices. The method deposits a layer of first germanium onto the first wafer, and a layer of aluminum-germanium alloy onto the second wafer.
01/24/13
20130020718
Mems devices and methods of forming same
The present invention provides a mems structure comprising confined sacrificial oxide layer and a bonded si layer. Polysilicon stack is used to fill aligned oxide openings and mems vias on the sacrificial layer and the bonded si layer respectively.


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Mems Devices topics: Mems Devices, Microelectromechanical Systems, Electronic Device, Semiconductor, Semiconductor Device, Aspect Ratio, Phacoemulsification, Vitrectomy, Led Substrate, Conductive Elements, Integrated Circuit, Copper Alloy, Critical Point, Dehydration, Actuatable

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This listing is a sample listing of patent applications related to Mems Devices for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Mems Devices with additional patents listed. Browse our RSS directory or Search for other possible listings.
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