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Mems Devices patents



      

This page is updated frequently with new Mems Devices-related patent applications.




Date/App# patent app List of recent Mems Devices-related patents
06/16/16
20160167961 
 Compensation and calibration for mems devices patent thumbnailCompensation and calibration for mems devices
A sensor system includes a microelectromechanical systems (mems) sensor, processing circuitry, measurement circuitry, stimulus circuitry and memory. The system is configured to provide an output responsive to physical displacement within the mems sensor to the measurement circuitry.
Freescale Semiconductor, Inc.


05/19/16
20160139173 
 Combined magnetometer accelerometer mems devices and methods patent thumbnailCombined magnetometer accelerometer mems devices and methods
Considerations for selecting capacitive sensors include accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, integration options with other sensors and/or electronics, and cost effectiveness. It is beneficial if such sensors are amenable to above-ic integration with associated control/readout circuitry for reduced parasitics and reduced footprint through area sharing.

05/12/16
20160130137 
 Microelectromechanical systems (mems) devices at different pressures patent thumbnailMicroelectromechanical systems (mems) devices at different pressures
Some embodiments relate to multiple mems devices that are integrated together on a single substrate. A device substrate comprising first and second micro-electro mechanical system (mems) devices is bonded to a capping structure.
Taiwan Semiconductor Manufacturing Co., Ltd.


04/21/16
20160111625 
 Method of fabricating piezoelectric mems devices patent thumbnailMethod of fabricating piezoelectric mems devices
A single photo mask can be used to define the three critical layers for the piezoelectric mems device, specifically the top electrode layer, the piezoelectric material layer, and the bottom electrode layer. Using a single photo mask removes the misalignment source caused by using multiple photo masks.

04/21/16
20160107881 
 Internal electrical contact for enclosed mems devices patent thumbnailInternal electrical contact for enclosed mems devices
A method of fabricating electrical connections in an integrated mems device is disclosed. The method comprises providing a mems substrate which includes forming one or more cavities in a first semiconductor layer; forming a second semiconductor layer; and providing a dielectric layer between the first semiconductor layer and the second semiconductor layer the mems substrate providing step further includes bonding the first semiconductor layer to a second semiconductor layer; etching at least one via through the second semiconductor layer and the dielectric layer; and depositing a first conductive material onto the second semiconductor layer surface and filling the at least one via.

04/21/16
20160107880 
 Substrate for diaphragm-type resonant mems devices, diaphragm-type resonant mems device and  manufacturing same patent thumbnailSubstrate for diaphragm-type resonant mems devices, diaphragm-type resonant mems device and manufacturing same
R2≧0.70.. .

04/07/16
20160099112 
 Systems, devices, and methods to reduce dielectric charging in micro-electro-mechanical systems devices patent thumbnailSystems, devices, and methods to reduce dielectric charging in micro-electro-mechanical systems devices
The present subject matter relates to devices, systems, and methods for isolation of electrostatic actuators in mems devices to reduce or minimize dielectric charging. A tunable component can include a fixed actuator electrode positioned on a substrate, a movable actuator electrode carried on a movable component that is suspended over the substrate, one or more isolation bumps positioned between the fixed actuator electrode and the movable actuator electrode, and a fixed isolation landing that is isolated within a portion of the fixed actuator electrode that is at, near, and/or substantially aligned with each of the one or more isolation bumps.
Wispry, Inc. .


04/07/16
20160097856 
 Acoustic apparatus with dual mems devices patent thumbnailAcoustic apparatus with dual mems devices
In accordance with one aspect of the disclosure, an acoustic apparatus is provided including a first transducer, a second transducer, a signal generator coupled to the first transducer, and a proximity detection module coupled to the second transducer. A buffering module is coupled to the first and second transducers and is configured to process analog signals received from the second transducer..
Knowles Electronics, Llc


04/07/16
20160097789 
 Performance improvement of mems devices patent thumbnailPerformance improvement of mems devices
A microelectromechanical-systems (mems) device includes a driven mass and has a natural stiffness or damping. An actuator applies force to the mass, movement of which is measured by a sensing capacitor.
Purdue Research Foundation


04/07/16
20160096723 
 Mems die and methods with multiple-pressure sealing patent thumbnailMems die and methods with multiple-pressure sealing
The present subject matter relates to systems and methods for sealing one or more mems devices within an encapsulated cavity. A first material layer can be positioned on a substrate, the first material layer comprising a first cavity and a second cavity that each have one or more openings out of the first material layer.
Wispry


03/31/16
20160090297 

Stress isolation platform for mems devices


A mems product includes a stress-isolated mems platform surrounded by a stress-relief gap and suspended from a substrate. The stress-relief gap provides a barrier against the transmission of mechanical stress from the substrate to the platform..
Analog Devices, Inc.


03/24/16
20160084872 

Three-axis microelectromechanical systems devices


The embodiments described herein provide microelectromechanical systems (mems) devices, such as three-axis mems devices that can sense acceleration in three orthogonal axes (e.g., x-axis, y-axis, and z-axis). In general, the embodiments described can provide decoupling between the sense motions of all three axes from each other.
Freescale Semiconductor, Inc.


03/17/16
20160077126 

Apparatus and calibration of capacitance mismatch and temperature variations in a mems device


A system and calibration method utilizes time averaging to suppress inherent capacitance mismatches or temperature variations in mems devices, such as a tri-axial accelerometer. An calibration interface circuit, operatively coupled the mems sensor, effectively cancels a range of non-ideal capacitive mismatches by employing pockets of calibration charges that are controlled by the duty-cycle of a clock..

03/17/16
20160075554 

Internal barrier for enclosed mems devices


A mems device having a channel configured to avoid particle contamination is disclosed. The mems device includes a mems substrate and a base substrate.
Invensense, Inc.


03/03/16
20160060102 

Integrated cmos and mems devices with air dieletrics


A monolithically integrated cmos and mems device. The device includes a first semiconductor substrate having a first surface region and one or more cmos ic devices on a cmos ic device region overlying the first surface region.
Mcube, Inc.


02/25/16
20160052784 

Mems devices and manufacturing


A mems sensor includes a sensor die configured to generate a sensor signal and a pedestal layer disposed on the sensor die. The pedestal layer includes a channel defined therein about a pedestal of the pedestal layer.
Rosemount Aerospace Inc.


02/25/16
20160052781 

Wafer level packaging of mems


A mems device is formed by applying a lower polymer film to top surfaces of a common substrate containing a plurality of mems devices, and patterning the lower polymer film to form a headspace wall surrounding components of each mems device. Subsequently an upper polymer dry film is applied to top surfaces of the headspace walls and patterned to form headspace caps which isolate the components of each mems device.
Texas Instruments Incorporated


02/18/16
20160046482 

Mems devices and methods of forming the same


A device includes a substrate, a routing conductive line over the substrate, a dielectric layer over the routing conductive line, and an etch stop layer over the dielectric layer. A micro-electro-mechanical system (mems) device has a portion over the etch stop layer.
Taiwan Semiconductor Manufacturing Company, Ltd.


02/04/16
20160030042 

Surgical instruments including mems devices


Surgical instruments are disclosed that are couplable to or have an end effector or a disposable loading unit with an end effector, and at least one micro-electromechanical system (mems) device operatively connected to the surgical instrument for at least one of sensing a condition, measuring a parameter and controlling the condition and/or parameter.. .
Covidien Lp


01/28/16
20160023892 

Radio frequency (rf) microelectromechanical systems (mems) devices with gold-doped silicon


The present disclosure relates to radio frequency (rf) microelectromechanical system (mems) device packaging, and specifically to reducing harmonic distortion caused by such packaging. In one embodiment, a die is provided that employs a gold-doped silicon substrate, wherein at least one rf mems device is disposed on the gold-doped silicon substrate.
Rf Micro Devices, Inc.


01/14/16
20160009547 

Mems devices having discharge circuits


mems devices having discharge circuits. In some embodiments, a mems device can include a substrate and an electromechanical assembly implemented on the substrate.
Skyworks Solutions, Inc.


01/14/16
20160009089 

Mems devices and methods of fabrication thereof


mems devices and methods of fabrication thereof are described. In one embodiment, the mems device includes a bottom alloy layer disposed over a substrate.
Taiwan Semiconductor Manufacturing Company, Ltd.


12/31/15
20150378127 

Stress compensation for piezoelectric optical mems devices


An apparatus includes a lens material forming a lens. The apparatus also includes a piezoelectric capacitor over the lens material, where the piezoelectric capacitor is configured to change a shape of the lens material in response to a voltage across the piezoelectric capacitor to thereby change a focus of the lens.
Texas Instruments Incorporated


12/31/15
20150376000 

Method for reducing discharge defects and electrode delamination in piezoelectric optical mems devices


A method includes forming a piezoelectric optical micro-electromechanical system (mems) device having a piezoelectric capacitor over a lens material. The lens material forms a lens, and the piezoelectric capacitor is configured to change a shape of the lens material in order to change a focus of the lens.
Texas Instruments Incorporated


12/31/15
20150375989 

Microelectromechanical systems devices with improved lateral sensitivity


Microelectromechanical system (mems) devices and methods for forming mems devices are provided. The mems devices include a substrate, an anchored structure fixedly coupled to the substrate, and a movable structure resiliently coupled to the substrate.
Freescale Semiconductor, Inc.


12/24/15
20150368091 

Mems devices utilizing a thick metal layer of an interconnect metal film stack


A mems device, such as an accelerometer or gyroscope, fabricated in interconnect metallization compatible with a cmos microelectronic device. In embodiments, a proof mass has a first body region utilizing a thick metal layer that is separated from a thin metal layer.
Intel Corporation


12/17/15
20150364363 

Vhf etch barrier for semiconductor integrated microsystem


The present disclosure relates to an integrated microsystem with a protection barrier structure, and an associated method. In some embodiments, the integrated microsystem comprises a first die having a plurality of cmos devices disposed thereon, a second die having a plurality of mems devices disposed thereon and a vapor hydrofluoric acid (vhf) etch barrier structure disposed between the first die and the second die.
Taiwan Semiconductor Manufacturing Co., Ltd.


12/10/15
20150355523 

Signal processing multiple mirco-electro-mechanical system (mems) devices and combo mems device applying the method


This invention provides a signal processing method of multiple micro-electro-mechanical system devices. The signal processing method includes: providing at least two mems devices; applying driving or modulating signals of different frequencies to the mems devices such that the mems devices generate respective mems signals with respective frequencies; and combining the mems signals with respective frequencies into one or more multi-frequency signals and outputting the multi-frequency signals, wherein a number of the multi-frequency signals is less than a number of the mems signals with respective frequencies.
Richtek Technology Corporation


12/10/15
20150353344 

Cavity structures for mems devices


Embodiments relate to mems devices and methods for manufacturing mems devices. In one embodiment, the manufacturing includes forming a monocrystalline sacrificial layer on a non-silicon-on-insulator (non-soi) substrate, patterning the monocrystalline sacrificial layer such that the monocrystalline sacrificial layer remains in a first portion and is removed in a second portion lateral to the first portion; depositing a first silicon layer, the first silicon layer deposited on the remaining monocrystalline sacrificial layer and further lateral to the first portion; removing at least a portion of the monocrystalline sacrificial layer via at least one release aperture in the first silicon layer to form a cavity and sealing the cavity..
Infineon Technologies Ag


11/26/15
20150338435 

Methods and mems devices with increased sensitivity


Methods and apparatus for forming mems devices. An apparatus includes at least a portion of a semiconductor substrate having a first thickness and patterned to form a moveable mass; a moving sense electrode forming the first plate of a first capacitance; at least one anchor patterned from the semiconductor substrate and having a portion that forms the second plate of the first capacitance and spaced by a first gap from the first plate; a layer of semiconductor material of a second thickness patterned to form a first electrode forming a first plate of a second capacitance and further patterned to form a second electrode overlying the at least one anchor and forming a second plate spaced by a second gap that is less than the first gap; wherein a total capacitance is formed that is the sum of the first capacitance and the second capacitance.
Taiwan Semiconductor Manufacturing Company, Ltd.


11/26/15
20150336792 

Internal electrical contact for enclosed mems devices


A method of fabricating electrical connections in an integrated mems device is disclosed. The method comprises forming a mems wafer.
Invensense, Inc.


10/29/15
20150307347 

System on a chip using integrated mems and cmos devices


An integrated mems system in which cmos and mems devices are provided to form an integrated cmos-mems system. The system can include a silicon substrate layer, a cmos layer, mems and cmos devices, and a wafer level packaging (wlp) layer.
Mcube Inc.


10/29/15
20150307346 

Mems devices and methods for forming same


Embodiments of the present disclosure include mems devices and methods for forming mems devices. An embodiment is a method for forming a microelectromechanical system (mems) device, the method including forming a mems wafer having a first cavity, the first cavity having a first pressure, and bonding a carrier wafer to a first side of the mems wafer, the bonding forming a second cavity, the second cavity having a second pressure, the second pressure being greater than the first pressure.
Taiwan Semiconductor Manufacturing Company, Ltd.


10/22/15
20150304783 

Radio frequency mems devices for improved wireless performance for hearing assistance devices


Disclosed herein, among other things, are methods and apparatus for wireless electronics using a mems switch for a hearing assistance device. The present application relates to a hearing assistance device configured to be worn by a wearer.
Starkey Laboratories, Inc.


10/15/15
20150292973 

Humidity resistant sensors and methods of making same


A pressure sensor device which uses appropriate passivation materials/patterns to make the device more robust and resistant to a hot and humid environment. The pressure sensor device uses moisture resistant passivation material(s) covering exposed glass areas, including sidewalls, and bonding interfaces to avoid the glass and bonding interfaces absorbing and reacting with moisture, thus maintaining the integrity of the device output after exposure in a humid/hot environment.

10/15/15
20150291415 

Hermetic encapsulation for microelectromechanical systems (mems) devices


Embodiments of the invention describe hermetic encapsulation for mems devices, and processes to create the hermetic encapsulation structure. Embodiments comprise a mems substrate stack that further includes a magnet, a first laminate organic dielectric film, a first hermetic coating disposed over the magnet, a second laminate organic dielectric film disposed on the hermetic coating, a mems device layer disposed over the magnet, and a plurality of metal interconnects surrounding the mems device layer.

10/08/15
20150284245 

Centrifuge mems stiction detection and screening system and method


A centrifuge screening system and method of testing mems devices using the system. The wafer level centrifuge screening system can include a base centrifuge system and a cassette mounting hub coupled to the base centrifuge system.

10/01/15
20150279282 

Distributed electrostatic actuator for mems devices


This disclosure provides systems, methods and apparatus for shutter-based ems light modulators controlled by electrode actuators that include a compliant inner beam electrode positioned between a movable beam electrode and a fixed beam electrode. A first voltage is applied to the movable beam electrode, and a sufficiently different voltage is applied to one of the compliant beam electrode and the fixed outer beam electrode.
Pixtronix, Inc.


10/01/15
20150274512 

Mems device and formation method thereof


The present disclosure provides mems devices and their fabrication methods. A first dielectric layer is formed on a first substrate including integrated circuits therein.
Semiconductor Manufacturing International (shanghai) Corporation


10/01/15
20150274507 

Mems device and formation method thereof


The present disclosure provides mems devices and their fabrication methods. A first dielectric layer is formed on a substrate including integrated circuits therein.
Semiconductor Manufacturing International (shanghai) Corporation


09/10/15
20150256924 

Mems device and process


This application relates to mems devices, especially mems capacitive transducers and to processes for forming such mems transducer that provide increased robustness and resilience to acoustic shock. The application describes a mems transducer having a flexible membrane (101) supported relative to a first surface of a substrate (105) which has one or more cavities therein, e.g.
Cirrus Logic International (uk) Ltd.


09/10/15
20150256915 

Mems device and process


This application relates to mems devices, especially mems capacitive transducers and to processes for forming such mems transducer that provide increased robustness and resilience to acoustic shock. The application describes a mems transducer (400) having at least one membrane layer (101) supported so as to define a flexible membrane.
Cirrus Logic International (u.k.) Ltd


09/10/15
20150251902 

Mems device chip manufacturing method


A mems device chip manufacturing method including a grinding step of grinding a device forming area of a wafer to thereby form a recess and an annular reinforcing portion surrounding the recess, a mems device forming step of performing any processing including etching to the wafer after performing the grinding step to thereby form a plurality of mems devices partitioned by a plurality of crossing division lines in the device forming area, and a dividing step of dividing the wafer along the division lines after performing the mems device forming step to thereby manufacture a plurality of mems device chips.. .
Disco Corporation


08/27/15
20150241479 

Transducer structure and mems devices


An improved mems transducer apparatus and method is provided. The apparatus has a movable base structure including an outer surface region and at least one portion removed to form at least one inner surface region.
Mcube Inc.


08/20/15
20150235771 

Variable capacitor compromising mems devices for radio frequency applications


A variable capacitor (300) comprises cells (200, 400) that have an rf electrode (202, 402) coupled to a bond pad (30). Each cell comprises a plurality of mems devices (100) the capacitance of which can be changed by means of a movable electrode.
Cavendish Kinetics, Inc.


08/20/15
20150234251 

Display apparatus including mems devices


Embodiments of the present disclosure provide techniques and configurations for a display apparatus. In one embodiment, the apparatus may include one or more micro-electro-mechanical system (mems) devices.
Intel Corporation


08/20/15
20150232326 

Method of sealing and shielding for dual pressure mems devices


The present disclosure relates to a mems substrate. In some embodiments, the mems substrate has a device substrate having a micro-electromechanical system (mems) device, and a layer of bonding material positioned over the device substrate at positions adjacent to the mems device.
Taiwan Semiconductor Manufacturing Co., Ltd.


08/13/15
20150225229 

Microelectromechanical system devices having through substrate vias and methods for the fabrication thereof


Methods for the fabrication of a microelectromechanical systems (“mems”) devices are provided, as are mems devices. In one embodiment, the mems device fabrication method includes forming at least one via opening extending into a substrate wafer, depositing a body of electrically-conductive material over the substrate wafer and into the via opening to produce a via, bonding the substrate wafer to a transducer wafer having an electrically-conductive transducer layer, and forming an electrical connection between the via and the electrically-conductive transducer layer.

07/30/15
20150210540 

Methods of forming semiconductor structures including mems devices and integrated circuits on common sides of substrates, and related structures and devices


Methods are used to form semiconductor devices that include an integrated circuit and a microelectromechanical system (mems) device operatively coupled with the integrated circuit. At least a portion of an integrated circuit may be fabricated on a surface of a substrate, and a mems device may be formed over the at least a portion of the integrated circuit.
Soitec


07/16/15
20150197419 

Mems devices and methods for forming same


An embodiment is mems device including a first mems die having a first cavity at a first pressure, a second mems die having a second cavity at a second pressure, the second pressure being different from the first pressure, and a molding material surrounding the first mems die and the second mems die, the molding material having a first surface over the first and the second mems dies. The device further includes a first set of electrical connectors in the molding material, each of the first set of electrical connectors coupling at least one of the first and the second mems dies to the first surface of the molding material, and a second set of electrical connectors over the first surface of the molding material, each of the second set of electrical connectors being coupled to at least one of the first set of electrical connectors..
Taiwan Semiconductor Manufacturing Company, Ltd.


07/09/15
20150191344 

Methods of forming semiconductor structures including mems devices and integrated circuits on opposing sides of substrates, and related structures and devices


Methods of forming semiconductor devices comprising integrated circuits and microelectromechanical system (mems) devices operatively coupled with the integrated circuits involve the formation of an electrically conductive via extending at least partially through a substrate from a first major surface of the substrate toward an opposing second major surface of the substrate, and the fabrication of at least a portion of an integrated circuit on the first major surface of the substrate. A mems device is provided on the second major surface of the substrate, and the mems device is operatively coupled with the integrated circuit using the at least one electrically conductive via.
Soitec


06/18/15
20150164380 

System and measuring respiration with accelerometers


The respiration rate of a patient may be measured by sensing respiration motion using two mems devices, and by processing a respiration signal produced by processing the outputs of the two mems devices. Some embodiments dispose two accelerometers around a patient's abdomen and determine respiratory motion from the difference between the outputs of the two accelerometers.
Analog Devices Global


06/11/15
20150158723 

Mems devices and methods of forming same


A microelectromechanical system (mems) device may include a mems structure over a first substrate. The mems structure comprises a movable element.
Taiwan Semiconductor Manufacturing Company, Ltd.


05/28/15
20150146312 

Mems electrical contact systems and methods


A microelectromechanical systems (mems) device may be provided with one or more sintered electrical contacts. The mems device may be a mems actuator or a mems sensor.
Digitaloptics Corporation


05/28/15
20150145543 

Mems device positioning apparatus, test system, and test method


A positioning apparatus includes a support structure, a positioning structure, and a fixture for retaining mems devices. A shaft spans between the support structure and the positioning structure, and is configured to rotate about a first axis relative to the support structure in order to rotate the positioning structure and the fixture about the first axis.
Freescale Semiconductor, Inc.


05/28/15
20150145075 

Mems devices utilizing a thick metal layer of an interconnect metal film stack


A mems device, such as an accelerometer or gyroscope, fabricated in interconnect metallization compatible with a cmos microelectronic device. In embodiments, a proof mass has a first body region utilizing a thick metal layer that is separated from a thin metal layer.

05/21/15
20150137283 

Mems devices, packaged mems devices, and methods of manufacture thereof


mems devices, packaged mems devices, and methods of manufacture thereof are disclosed. In one embodiment, a microelectromechanical system (mems) device includes a first mems functional structure and a second mems functional structure.
Taiwan Semiconductor Manufacturing Company, Ltd.


05/07/15
20150123129 

Wafer level packaging techniques


In a wafer level chip scale packaging technique for mems devices, a deep trench is etched on a scribe line area between two cmos devices of a cmos substrate at first. After bonding of the cmos substrate with a mems substrate, the deep trench is opened by thin-down process so that cmos substrate is singulated while mems substrate is not (partial singulation).
Taiwan Semiconductor Manufacturing Co., Ltd.


04/16/15
20150104895 

Method of fabricating mems devices having a plurality of cavities


A method for forming an integrated circuit having micro-electromechanical systems (mems) includes forming at least two recesses into a first layer, forming at least two recesses into a second layer, the at least two recesses of the second layer being complementary to the recesses of the first layer. An intermediate layer is bonded onto the second layer, the intermediate layer includes through-holes corresponding to the recesses of the second layer.
Taiwan Semiconductor Manufacturing Company, Ltd.


04/16/15
20150102835 

Substrate plate for mems devices


A substrate plate is provided for at least one mems device to be mounted thereon. The mems device has a certain footprint on the substrate plate, and the substrate plate has a pattern of electrically conductive leads to be connected to electric components of the mems device.
Oce-technologies B.v.


04/09/15
20150097253 

Sealed mems devices with multiple chamber pressures


A mems apparatus has a substrate, a cap forming first and second chambers with the base, and movable microstructure within the first and second chambers. To control pressures, the mems apparatus also has a first outgas structure within the first chamber.
Analog Devices, Inc.


04/09/15
20150096377 

Systems and methods to determine stiction failures in mems devices


Various embodiments of the invention provide for stiction testing in mems devices, such as accelerometers. In certain embodiments, testing is accomplished by a high voltage smart circuit that enables an analog front-end circuit to accurately read the position of a movable proof-mass relative to a biased electrode in order to allow the detection of both contact and release conditions.
Maxim Integrated Products, Inc.


04/02/15
20150091153 

Wafer level sealing methods with different vacuum levels for mems sensors


The present disclosure relates to a method of forming a plurality of mems device having a plurality of cavities with different pressures on a wafer package system, and an associated apparatus. In some embodiments, the method is performed by providing a work-piece having a plurality of microelectromechanical system (mems) devices.
Taiwan Semiconductor Manufacturing Co., Ltd.


03/19/15
20150076631 

Reduction of chipping damage to mems structure


A mems (microelectromechanical systems) structure comprises a mems wafer. A mems wafer includes a cap with cavities bonded to a structural layer through a dielectric layer disposed between the cap and the structural layer.
Invensense, Inc.


03/05/15
20150061046 

Wafer level sealing different pressure levels for mems sensors


The present disclosure relates to a method of forming a plurality of mems device having a plurality of chambers with different pressures on a substrate, and an associated apparatus. In some embodiments, the method is performed by providing a device wafer having a plurality of microelectromechanical system (mems) devices.
Taiwan Semiconductor Manufacturing Co., Ltd.


03/05/15
20150059484 

Microelectromechanical system devices having crack resistant membrane structures and methods for the fabrication thereof


Methods for fabricating crack resistant microelectromechanical (mems) devices are provided, as are mems devices produced pursuant to such methods. In one embodiment, the method includes forming a sacrificial body over a substrate, producing a multi-layer membrane structure on the substrate, and removing at least a portion of the sacrificial body to form an inner cavity within the multi-layer membrane structure.

02/19/15
20150048903 

Microelectromechanical system with a micro-scale spring suspension making the same


Integrated microelectromechanical system (“mems”) devices and methods for making the same. The mems devices comprise a substrate (200) and a mems filter device (100) mechanically suspended above a major surface of the substrate.
Harris Corporation


01/29/15
20150031159 

Mems devices and methods of forming the same


A device includes a substrate, a routing conductive line over the substrate, a dielectric layer over the routing conductive line, and an etch stop layer over the dielectric layer. A micro-electro-mechanical system (mems) device has a portion over the etch stop layer.
Taiwan Semiconductor Manufacturing Company, Ltd.


01/29/15
20150027523 

Nanostructures and methods for manufacturing the same


A resonant tunneling diode, and other one dimensional electronic, photonic structures, and electromechanical mems devices, are formed as a heterostructure in a nanowhisker by forming length segments of the whisker with different materials having different band gaps.. .
Qunano Ab


01/22/15
20150024536 

Mems device and manufacturing a mems device


mems devices with a rigid backplate and a method of making a mems device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate and a backplate supported by the substrate.
Infineon Technologies Ag


01/22/15
20150023529 

Mems devices, interface circuits, and methods of making thereof


In accordance with an embodiment of the present invention, a micro-electro-mechanical system (mems) device includes a first plate, a second plate disposed over the first plate, and a first moveable plate disposed between the first plate and the second plate. The mems device further includes a second moveable plate disposed between the first moveable plate and the second plate..
Infineon Technologies Ag


01/22/15
20150021718 

Apparatus and reduced strain on mems devices


A method and apparatus for coupling a mems device to a substrate is disclosed. The method includes providing a substrate with a conductor disposed over the substrate, adhering the mems device to the substrate, wherein a first elastomer adheres the mems device to the substrate.
Invensense, Inc.


01/08/15
20150008788 

Low temperature ceramic microelectromechanical structures


A method of providing microelectromechanical structures (mems) that are compatible with silicon cmos electronics is provided. The method providing for processes and manufacturing sequences limiting the maximum exposure of an integrated circuit upon which the mems is manufactured to below 350° c., and potentially to below 250° c., thereby allowing direct manufacturing of the mems devices onto electronics, such as si cmos circuits.
The Royal Institution For The Advancement Of Learning / Mcgill University


01/08/15
20150007656 

Reducing the effect of glass charging in mems devices


A method of controlling exposed glass charging in a micro-electro-mechanical systems (mems) device is disclosed. The method includes providing a mems device comprising a proof mass positioned apart from at least one sense plate and at least one outboard metallization layer, wherein at least one conductive glass layer is coupled to the sense plate and the outboard metallization layer, the conductive glass layer including at least one exposed glass portion near the proof mass; and applying a first voltage to the sense plate and a second voltage to the outboard metallization layer.
Honeywell International Inc.


01/01/15
20150002982 

Recovery mems devices


Various embodiments of the invention reduce stiction in a wide range of mems devices and increase device reliability without negatively impacting performance. In certain embodiments, stiction recover is accomplished by applying electrostatic forces to electrodes via optimized voltage signals that generate a restoring force that aids in overcoming stiction forces between electrodes.
Maxim Integrated Products, Inc.


01/01/15
20150001632 

Mems device and fabrication method


mems devices and methods for forming the same are provided. A first metal interconnect structure is formed on a first semiconductor substrate to connect to a cmos control circuit in the first semiconductor substrate.
Semiconductor Manufacturing International (shanghai) Corporation


12/25/14
20140374856 

Apparatus and preventing stiction of mems devices encapsulated by active circuitry


One or more stopper features (e.g., bump structures) are formed in a standard asic wafer top passivation layer for preventing mems device stiction vertically in integrated devices having a mems device capped directly by an asic wafer. A tin coating may be used on the stopper feature(s) for anti-stiction.
Analog Devices, Inc.


12/25/14
20140374854 

Vertical mount package and wafer level packaging therefor


Vertical mount packages and methods for making the same are disclosed. A method for manufacturing a vertical mount package includes providing a device substrate with a plurality of device regions on a front surface, and a plurality of through-wafer vias.
Analog Devices, Inc.


12/25/14
20140374851 

Mems device and fabricating mems devices


A method (60) entails providing a substrate (34) with a structural layer (30) having a thickness (40). A partial etch process is performed at locations (82) on the structural layer (30) so that a portion (92) of the structural layer (30) remains at the locations (82).
Freescale Semiconductor, Inc.


12/25/14
20140374850 

Apparatus and shielding and biasing in mems devices encapsulated by active circuitry


One or more conductive shielding plates are formed in a standard asic wafer top metal layer, e.g., for blocking cross-talk from mems device structure(s) on the mems wafer to circuitry on the asic wafer when the mems device is capped directly by the asic wafer in a wafer-level chip scale package. Generally speaking, a shielding plate should be at least slightly larger than the mems device structure it is shielding (e.g., a movable mems structure such as an accelerometer proof mass or a gyroscope resonator), and the shielding plate cannot be in contact with the mems device structure during or after wafer bonding.
Analog Devices, Inc.


12/25/14
20140374847 

Packaging mems devices


In a method of packaging micro-electro-mechanical systems (mems) devices, an interposer board is provided having a first surface and an opposing second surface, with the interposer board including a plurality of electrical contacts on the second surface. A plurality of shim layers are bonded to the first surface of the interposer board, and a plurality of mems dies are each separately bonded to a respective one of the shim layers.
Honeywell International Inc.


12/11/14
20140361844 

Suspended passive element for mems devices


A technique decouples a mems device from sources of strain by forming a mems structure with suspended electrodes that are mechanically anchored in a manner that reduces or eliminates transfer of strain from the substrate into the structure, or transfers strain to electrodes and body so that a transducer is strain-tolerant. The technique includes using an electrically insulating material embedded in a conductive structural material for mechanical coupling and electrical isolation.

12/11/14
20140361843 

Monolithic body mems devices


A technique decouples a mems device from sources of strain by forming a mems structure with suspended electrodes that are mechanically anchored in a manner that reduces or eliminates transfer of strain from the substrate into the structure, or transfers strain to electrodes and body so that a transducer is strain-tolerant. The technique includes using an electrically insulating material embedded in a conductive structural material for mechanical coupling and electrical isolation..

12/11/14
20140361661 

Temperature compensation for mems devices


A microelectromechanical system (mems) device includes a temperature compensating structure including a first beam suspended from a substrate and a second beam suspended from the substrate. The first beam is formed from a first material having a first young's modulus temperature coefficient.

12/04/14
20140356989 

Method of manufacturing mems devices with reliable hermetic seal


Manufactured capped mems device wafers are tested for hermeticity on a vacuum prober at differing pressures or on a wafer prober at differing temperatures. Resonant frequency testing is conducted.

11/27/14
20140349434 

Internal electrical contact for enclosed mems devices


A method of fabricating electrical connections in an integrated mems device is disclosed. The method comprises forming a mems wafer.

11/13/14
20140336641 

Surgical instruments including mems devices


Surgical instruments are disclosed that are couplable to or have an end effector or a disposable loading unit with an end effector, and at least one micro-electromechanical system (mems) device operatively connected to the surgical instrument for at least one of sensing a condition, measuring a parameter and controlling the condition and/or parameter.. .

11/13/14
20140334991 

Thermally or photochemically activated small molecule delivery platform


Thermally or photochemically activated small molecule delivery polymers and platforms enable ‘on-demand’ delivery of a vapor-phase lubricant, such as pentanol or other alcohols, that enable scheduled or as-needed lubrication of mems devices, thereby greatly improving the reliability and lifespan of the devices.. .

10/16/14
20140307885 

Differential outputs in multiple motor mems devices


An the acoustic apparatus comprising a first mems motor that includes a first diaphragm and a first back plate, and a second mems motor that includes a second diaphragm and a second back plate. The first motor is biased with a first electrical polarity and a second motor is biased with a second electrical polarity such that the first electrical polarity and the second electrical polarity are opposite.

10/09/14
20140300411 

Apparatus and removing mechanical resonance with internal control loop


The present invention related to an apparatus and method to removing mechanical resonance of a system using internal control loop, and in more particularly, the internal control loop reduces the resonance factor of the system. The approach in the present invention is not sensitive to the system mechanical parameters changes within time and within temperature changes.

10/09/14
20140300404 

Rf mems isolation, series and shunt dvc, and small mems


The present invention generally relates to an architecture for isolating an rf mems device from a substrate and driving circuit, series and shunt dvc die architectures, and smaller mems arrays for high frequency communications. The semiconductor device has one or more cells with a plurality of mems devices therein.

10/02/14
20140290331 

Wafer level centrifuge for mems stiction detection and screening system and method


A wafer level centrifuge (wlc) system and method of testing mems devices using the system. The wafer level centrifuge (wlc) system can include a base centrifuge system and a cassette mounting hub coupled to the base centrifuge system.

09/18/14
20140272435 

Anti-stick surface coatings


The present invention describes anti-stick coatings composed of carboxylic acid, carboxylate salt or thiol functionalized siloxanes. The compounds of this invention can be used as coatings on the surface of wind turbine blades, aircraft wings and fuselage, or on the surface of oil and gas platforms, ships, and other vehicles exposed to harsh weather conditions.

09/18/14
20140266246 

Mcu-based compensation and calibration for mems devices


A sensor system includes a microelectromechanical systems (mems) sensor, a processor, measurement circuitry, stimulus circuitry and memory. The mems sensor is configured to provide an output responsive to physical displacement within the mems sensor to the measurement circuitry.

09/18/14
20140264909 

Microelectromechanical system devices having through substrate vias and methods for the fabrication thereof


Methods for the fabrication of a microelectromechanical systems (“mems”) devices are provided, as are mems devices. In one embodiment, the mems device fabrication method includes forming at least one via opening extending into a substrate wafer, depositing a body of electrically-conductive material over the substrate wafer and into the via opening to produce a via, bonding the substrate wafer to a transducer wafer having an electrically-conductive transducer layer, and forming an electrical connection between the via and the electrically-conductive transducer layer.

09/18/14
20140264661 

Mems devices and methods for forming same


Embodiments of the present disclosure include mems devices and methods for forming mems devices. An embodiment is a method for forming a microelectromechanical system (mems) device, the method including forming a mems wafer having a first cavity, the first cavity having a first pressure, and bonding a carrier wafer to a first side of the mems wafer, the bonding forming a second cavity, the second cavity having a second pressure, the second pressure being greater than the first pressure.

09/18/14
20140260613 

Elastic bump stops for mems devices


A mems device includes at least one proof mass, the at least one proof mass is capable of moving to contact at least one target structure. The mems device further includes at least one elastic bump stop coupled to the proof mass and situated at a first distance from the target structure.

09/18/14
20140260508 

Compensation and calibration for mems devices


A sensor system includes a microelectromechanical systems (mems) sensor, processing circuitry, measurement circuitry, stimulus circuitry and memory. The system is configured to provide an output responsive to physical displacement within the mems sensor to the measurement circuitry.

09/11/14
20140252507 

Self-sealing membrane for mems devices


Embodiments of the present disclosure are related to mems devices having a suspended membrane that are secured to and spaced apart from a substrate with a sealed cavity therebetween. The membrane includes openings with sidewalls that are closed by a dielectric material.

09/11/14
20140252422 

Cavity structures for mems devices


Embodiments relate to mems devices, particularly mems devices integrated with related electrical devices on a single wafer. Embodiments utilize a modular process flow concept as part of a mems-first approach, enabling use of a novel cavity sealing process.

09/11/14
20140252358 

Methods and mems devices with increased sensitivity


Methods and apparatus for forming mems devices. An apparatus includes at least a portion of a semiconductor substrate having a first thickness and patterned to form a moveable mass; a moving sense electrode forming the first plate of a first capacitance; at least one anchor patterned from the semiconductor substrate and having a portion that forms the second plate of the first capacitance and spaced by a first gap from the first plate; a layer of semiconductor material of a second thickness patterned to form a first electrode forming a first plate of a second capacitance and further patterned to form a second electrode overlying the at least one anchor and forming a second plate spaced by a second gap that is less than the first gap; wherein a total capacitance is formed that is the sum of the first capacitance and the second capacitance.



Mems Devices topics: Mems Devices, Microelectromechanical Systems, Electronic Device, Semiconductor, Semiconductor Device, Aspect Ratio, Phacoemulsification, Vitrectomy, Led Substrate, Conductive Elements, Integrated Circuit, Copper Alloy, Critical Point, Dehydration, Actuatable

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