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Mems Devices

Mems Devices-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Wafer level packaging of mems
Texas Instruments Incorporated
August 03, 2017 - N°20170217759

A mems device is formed by applying a lower polymer film to top surfaces of a common substrate containing a plurality of mems devices, and patterning the lower polymer film to form a headspace wall surrounding components of each mems device. Subsequently an upper polymer dry film is applied to top surfaces of the headspace walls and patterned to form ...
Use of a reactive, or reducing gas as a method to increase contact lifetime in ...
International Business Machines Corporation
July 27, 2017 - N°20170210620

A mems device comprises an electro mechanical element in a sealed chamber containing a gas comprising a reactive gas selected to react with any contaminants that may be present or formed on the operating surfaces of the device in a manner to maximize the electrical conductivity of the surfaces during operation of the device. The mems device may comprise a ...
Mems devices and methods of forming the same
Taiwan Semiconductor Manufacturing Company, Ltd.
July 27, 2017 - N°20170210618

A mems device and methods of forming are provided. A dielectric layer of a first substrate is patterned to expose conductive features and a bottom layer through the dielectric layer. A first surface of a second substrate is bonded to the dielectric layer and the second substrate is patterned to form a membrane and a movable element. A cap wafer ...
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Microfluidic die on a support with at least one other die
Stmicroelectronics, Inc.
July 06, 2017 - N°20170190175

The present disclosure provides supports for a microfluidic die and one or more additional die including, but not limited to, microfluidic die, asics, mems devices, and sensors. This includes semi-flexible supports that allow a microfluidic die to be at a 90 degree angle with respect to another die and rigid supports that allow a microfluidic and another die to be in ...
Mems grid for manipulating structural parameters of mems devices
Mems Drive, Inc.
June 15, 2017 - N°20170170059

A system and method for manipulating the structural characteristics of a mems device include etching a plurality of holes into the surface of a mems device, wherein the plurality of holes comprise one or more geometric shapes determined to provide specific structural characteristics desired in the mems device.
Identification of a seal failure in mems devices
Invensense International, Inc.
June 15, 2017 - N°20170167945

A microelectromechanical sensor (mems) package includes a gyroscope and an accelerometer. The gyroscope is located within a low-pressure cavity that is sealed from an external pressure. The accelerometer is located within a cavity, and the seal for the accelerometer cavity is entirely within the gyroscope cavity. Under normal operating conditions, the accelerometer seal holds the accelerometer cavity at a higher ...
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Surgical instruments including mems devices
Covidien Lp
May 11, 2017 - N°20170128149

Surgical instruments are disclosed that are couplable to or have an end effector or a disposable loading unit with an end effector, and at least one micro-electromechanical system (mems) device operatively connected to the surgical instrument for at least one of sensing a condition, measuring a parameter and controlling the condition and/or parameter.
Integrated mems-cmos devices and integrated circuits with mems devices and cmos devices
Globalfoundries Singapore Pte. Ltd.
May 04, 2017 - N°20170121172

Integrated mems-cmos devices and integrated circuits with mems devices and cmos devices are provided. An exemplary integrated mems-cmos device is vertically integrated and includes a substrate having a first side and a second side opposite the first side. Further, the exemplary vertically integrated mems-cmos device includes a cmos device located in and/or over the first side of the substrate. ...
Mems device and process
Cirrus Logic International Semiconductor Ltd.
April 27, 2017 - N°20170118561

This application relates to mems devices, especially mems capacitive transducers and to processes for forming such mems transducer that provide increased robustness and resilience to acoustic shock. The application describes a mems transducer having a flexible membrane (101) supported relative to a first surface of a substrate (105) which has one or more cavities therein, e. G. To provide an acoustic volume. ...
Humidity resistant sensors and methods of making same
Continental Automotive Systems, Inc.
April 27, 2017 - N°20170115177

A pressure sensor device which uses appropriate passivation materials/patterns to make the device more robust and resistant to a hot and humid environment. The pressure sensor device uses moisture resistant passivation material(s) covering exposed glass areas, including sidewalls, and bonding interfaces to avoid the glass and bonding interfaces absorbing and reacting with moisture, thus maintaining the integrity of ...
Method and apparatus for reducing in-process and in-use stiction for mems devices
Taiwan Semiconductor Manufacturing Company, Ltd.
April 06, 2017 - N°20170096328

The present disclosure involves forming a method of fabricating a micro-electro-mechanical system (mems) device. A plurality of openings is formed in a first side of a first substrate. A dielectric layer is formed over the first side of the substrate. A plurality of segments of the dielectric layer fills the openings. The first side of the first substrate is bonded ...
Simplified mems device fabrication process
Mems Drive, Inc.
March 30, 2017 - N°20170088418

A simplified mems fabrication process and mems device is provided that allows for cheaper and lighter-weight mems devices to be fabricated. The process comprises etching a plurality of holes or other feature patterns into a mems device, and then etching away the underlying wafer such that, after the etching process, the mems device is the required thickness and the individual ...
Mems grid for manipulating structural parameters of mems devices
Mems Drive, Inc.
March 30, 2017 - N°20170088415

A system and method for manipulating the structural characteristics of a mems device include etching a plurality of holes into the surface of a mems device, wherein the plurality of holes comprise one or more geometric shapes determined to provide specific structural characteristics desired in the mems device.
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Mems Devices Patent Applications
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Mems devices on flexible substrate
3m Innovative Properties Company
March 16, 2017 - N°20170073215

A flexible film including one or more mems elements and articles including the flexible film are described. The flexible film includes a polymer layer between two metal layers with one of the metal layers containing a perforation. The polymer layer includes voided regions that allow for relative movement of the two metal layers.
Mems devices and methods of forming same
Taiwan Semiconductor Manufacturing Company, Ltd.
March 09, 2017 - N°20170066647

A microelectromechanical system (mems) device may include a mems structure over a first substrate. The mems structure comprises a movable element. Depositing a first conductive material over the first substrate and etching trenches in a second substrate. Filling the trenches with a second conductive material and depositing a third conductive material over the second conductive material and the second substrate. ...
Mems and cmos integration with low-temperature bonding
Taiwan Semiconductor Manufacturing Co., Ltd.
March 02, 2017 - N°20170057814

The present disclosure relates an integrated chip having one or more mems devices. In some embodiments, the integrated chip has a carrier substrate with one or more cavities disposed within a first side of the carrier substrate. A dielectric layer is disposed between the first side of the carrier substrate and a first side of a micro-electromechanical system (mems) substrate. ...
Microphone with wind noise resistance
Knowles Electronics, Llc
January 26, 2017 - N°20170026759

A microphone device is comprises a first micro electro mechanical system (mems) device and a second mems device with difference size of pierce holes in the diaphragms. Signal outputs from the first and second mems devices are selectively used to provide wind noise resistance.
Hermetic encapsulation for microelectromechanical systems (mems) devices
Knowles Electronics, Llc
January 26, 2017 - N°20170022050

Embodiments of the invention describe hermetic encapsulation for mems devices, and processes to create the hermetic encapsulation structure. Embodiments comprise a mems substrate stack that further includes a magnet, a first laminate organic dielectric film, a first hermetic coating disposed over the magnet, a second laminate organic dielectric film disposed on the hermetic coating, a mems device layer disposed over ...
Mems devices and fabrication methods thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
January 12, 2017 - N°20170008758

A device includes a carrier having a plurality of cavities, a micro-electro-mechanical system (mems) substrate bonded on the carrier, wherein the mems substrate comprises a first side bonded on the carrier, a moving element over a bottom electrode, wherein the bottom electrode is formed of polysilicon and a second side having a plurality of bonding pads and a semiconductor substrate ...
Mems devices and fabrication methods thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
January 05, 2017 - N°20170001860

A device includes a carrier having a plurality of cavities, a micro-electro-mechanical system (mems) substrate bonded on the carrier, wherein the mems substrate comprises a shielding layer on the carrier and coupled to ground, a plurality of vias coupled between the shielding layer and a bottom electrode of the mems substrate and a moving element over the bottom electrode and ...
Integration of active devices with passive components and mems devices
Newport Fab, Llc Dba Jazz Semiconductor
December 22, 2016 - N°20160368764

Integration of active devices with passive components and mems devices is disclosed. An integrated semiconductor structure includes an active device having a device top electrode connected to a conductive jumper by a device-side via/interconnect metal stack. The integrated semiconductor structure also includes a passive component having a component bottom plate connected to the conductive jumper by a component side ...
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