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This page is updated frequently with new Mems Devices-related patent applications. Subscribe to the Mems Devices RSS feed to automatically get the update: related Mems RSS feeds. RSS updates for this page: Mems Devices RSS RSS


Display apparatus including mems devices

Intel

Display apparatus including mems devices

Method of sealing and shielding for dual pressure mems devices

Taiwan Semiconductor Manufacturing

Method of sealing and shielding for dual pressure mems devices

Method of sealing and shielding for dual pressure mems devices

Microelectromechanical system devices having through substrate vias and methods for the fabrication thereof


Date/App# patent app List of recent Mems Devices-related patents
08/20/15
20150235771 
 Variable capacitor compromising mems devices for radio frequency applications patent thumbnailVariable capacitor compromising mems devices for radio frequency applications
A variable capacitor (300) comprises cells (200, 400) that have an rf electrode (202, 402) coupled to a bond pad (30). Each cell comprises a plurality of mems devices (100) the capacitance of which can be changed by means of a movable electrode.
Cavendish Kinetics, Inc.


08/20/15
20150234251 
 Display apparatus including mems devices patent thumbnailDisplay apparatus including mems devices
Embodiments of the present disclosure provide techniques and configurations for a display apparatus. In one embodiment, the apparatus may include one or more micro-electro-mechanical system (mems) devices.
Intel Corporation


08/20/15
20150232326 
 Method of sealing and shielding for dual pressure mems devices patent thumbnailMethod of sealing and shielding for dual pressure mems devices
The present disclosure relates to a mems substrate. In some embodiments, the mems substrate has a device substrate having a micro-electromechanical system (mems) device, and a layer of bonding material positioned over the device substrate at positions adjacent to the mems device.
Taiwan Semiconductor Manufacturing Co., Ltd.


08/13/15
20150225229 
 Microelectromechanical system devices having through substrate vias and methods for the fabrication thereof patent thumbnailMicroelectromechanical system devices having through substrate vias and methods for the fabrication thereof
Methods for the fabrication of a microelectromechanical systems (“mems”) devices are provided, as are mems devices. In one embodiment, the mems device fabrication method includes forming at least one via opening extending into a substrate wafer, depositing a body of electrically-conductive material over the substrate wafer and into the via opening to produce a via, bonding the substrate wafer to a transducer wafer having an electrically-conductive transducer layer, and forming an electrical connection between the via and the electrically-conductive transducer layer.

07/30/15
20150210540 
 Methods of forming semiconductor structures including mems devices and integrated circuits on common sides of substrates, and related structures and devices patent thumbnailMethods of forming semiconductor structures including mems devices and integrated circuits on common sides of substrates, and related structures and devices
Methods are used to form semiconductor devices that include an integrated circuit and a microelectromechanical system (mems) device operatively coupled with the integrated circuit. At least a portion of an integrated circuit may be fabricated on a surface of a substrate, and a mems device may be formed over the at least a portion of the integrated circuit.
Soitec


07/16/15
20150197419 
 Mems devices and methods for forming same patent thumbnailMems devices and methods for forming same
An embodiment is mems device including a first mems die having a first cavity at a first pressure, a second mems die having a second cavity at a second pressure, the second pressure being different from the first pressure, and a molding material surrounding the first mems die and the second mems die, the molding material having a first surface over the first and the second mems dies. The device further includes a first set of electrical connectors in the molding material, each of the first set of electrical connectors coupling at least one of the first and the second mems dies to the first surface of the molding material, and a second set of electrical connectors over the first surface of the molding material, each of the second set of electrical connectors being coupled to at least one of the first set of electrical connectors..
Taiwan Semiconductor Manufacturing Company, Ltd.


07/09/15
20150191344 
 Methods of forming semiconductor structures including mems devices and integrated circuits on opposing sides of substrates, and related structures and devices patent thumbnailMethods of forming semiconductor structures including mems devices and integrated circuits on opposing sides of substrates, and related structures and devices
Methods of forming semiconductor devices comprising integrated circuits and microelectromechanical system (mems) devices operatively coupled with the integrated circuits involve the formation of an electrically conductive via extending at least partially through a substrate from a first major surface of the substrate toward an opposing second major surface of the substrate, and the fabrication of at least a portion of an integrated circuit on the first major surface of the substrate. A mems device is provided on the second major surface of the substrate, and the mems device is operatively coupled with the integrated circuit using the at least one electrically conductive via.
Soitec


06/18/15
20150164380 
 System and  measuring respiration with accelerometers patent thumbnailSystem and measuring respiration with accelerometers
The respiration rate of a patient may be measured by sensing respiration motion using two mems devices, and by processing a respiration signal produced by processing the outputs of the two mems devices. Some embodiments dispose two accelerometers around a patient's abdomen and determine respiratory motion from the difference between the outputs of the two accelerometers.
Analog Devices Global


06/11/15
20150158723 
 Mems devices and methods of forming same patent thumbnailMems devices and methods of forming same
A microelectromechanical system (mems) device may include a mems structure over a first substrate. The mems structure comprises a movable element.
Taiwan Semiconductor Manufacturing Company, Ltd.


05/28/15
20150146312 
 Mems electrical contact systems and methods patent thumbnailMems electrical contact systems and methods
A microelectromechanical systems (mems) device may be provided with one or more sintered electrical contacts. The mems device may be a mems actuator or a mems sensor.
Digitaloptics Corporation


05/28/15
20150145543 

Mems device positioning apparatus, test system, and test method


A positioning apparatus includes a support structure, a positioning structure, and a fixture for retaining mems devices. A shaft spans between the support structure and the positioning structure, and is configured to rotate about a first axis relative to the support structure in order to rotate the positioning structure and the fixture about the first axis.
Freescale Semiconductor, Inc.


05/28/15
20150145075 

Mems devices utilizing a thick metal layer of an interconnect metal film stack


A mems device, such as an accelerometer or gyroscope, fabricated in interconnect metallization compatible with a cmos microelectronic device. In embodiments, a proof mass has a first body region utilizing a thick metal layer that is separated from a thin metal layer.

05/21/15
20150137283 

Mems devices, packaged mems devices, and methods of manufacture thereof


mems devices, packaged mems devices, and methods of manufacture thereof are disclosed. In one embodiment, a microelectromechanical system (mems) device includes a first mems functional structure and a second mems functional structure.
Taiwan Semiconductor Manufacturing Company, Ltd.


05/07/15
20150123129 

Wafer level packaging techniques


In a wafer level chip scale packaging technique for mems devices, a deep trench is etched on a scribe line area between two cmos devices of a cmos substrate at first. After bonding of the cmos substrate with a mems substrate, the deep trench is opened by thin-down process so that cmos substrate is singulated while mems substrate is not (partial singulation).
Taiwan Semiconductor Manufacturing Co., Ltd.


04/16/15
20150104895 

Method of fabricating mems devices having a plurality of cavities


A method for forming an integrated circuit having micro-electromechanical systems (mems) includes forming at least two recesses into a first layer, forming at least two recesses into a second layer, the at least two recesses of the second layer being complementary to the recesses of the first layer. An intermediate layer is bonded onto the second layer, the intermediate layer includes through-holes corresponding to the recesses of the second layer.
Taiwan Semiconductor Manufacturing Company, Ltd.


04/16/15
20150102835 

Substrate plate for mems devices


A substrate plate is provided for at least one mems device to be mounted thereon. The mems device has a certain footprint on the substrate plate, and the substrate plate has a pattern of electrically conductive leads to be connected to electric components of the mems device.
Oce-technologies B.v.


04/09/15
20150097253 

Sealed mems devices with multiple chamber pressures


A mems apparatus has a substrate, a cap forming first and second chambers with the base, and movable microstructure within the first and second chambers. To control pressures, the mems apparatus also has a first outgas structure within the first chamber.
Analog Devices, Inc.


04/09/15
20150096377 

Systems and methods to determine stiction failures in mems devices


Various embodiments of the invention provide for stiction testing in mems devices, such as accelerometers. In certain embodiments, testing is accomplished by a high voltage smart circuit that enables an analog front-end circuit to accurately read the position of a movable proof-mass relative to a biased electrode in order to allow the detection of both contact and release conditions.
Maxim Integrated Products, Inc.


04/02/15
20150091153 

Wafer level sealing methods with different vacuum levels for mems sensors


The present disclosure relates to a method of forming a plurality of mems device having a plurality of cavities with different pressures on a wafer package system, and an associated apparatus. In some embodiments, the method is performed by providing a work-piece having a plurality of microelectromechanical system (mems) devices.
Taiwan Semiconductor Manufacturing Co., Ltd.


03/19/15
20150076631 

Reduction of chipping damage to mems structure


A mems (microelectromechanical systems) structure comprises a mems wafer. A mems wafer includes a cap with cavities bonded to a structural layer through a dielectric layer disposed between the cap and the structural layer.
Invensense, Inc.


03/05/15
20150061046 

Wafer level sealing different pressure levels for mems sensors


The present disclosure relates to a method of forming a plurality of mems device having a plurality of chambers with different pressures on a substrate, and an associated apparatus. In some embodiments, the method is performed by providing a device wafer having a plurality of microelectromechanical system (mems) devices.
Taiwan Semiconductor Manufacturing Co., Ltd.


03/05/15
20150059484 

Microelectromechanical system devices having crack resistant membrane structures and methods for the fabrication thereof


Methods for fabricating crack resistant microelectromechanical (mems) devices are provided, as are mems devices produced pursuant to such methods. In one embodiment, the method includes forming a sacrificial body over a substrate, producing a multi-layer membrane structure on the substrate, and removing at least a portion of the sacrificial body to form an inner cavity within the multi-layer membrane structure.

02/19/15
20150048903 

Microelectromechanical system with a micro-scale spring suspension making the same


Integrated microelectromechanical system (“mems”) devices and methods for making the same. The mems devices comprise a substrate (200) and a mems filter device (100) mechanically suspended above a major surface of the substrate.
Harris Corporation


01/29/15
20150031159 

Mems devices and methods of forming the same


A device includes a substrate, a routing conductive line over the substrate, a dielectric layer over the routing conductive line, and an etch stop layer over the dielectric layer. A micro-electro-mechanical system (mems) device has a portion over the etch stop layer.
Taiwan Semiconductor Manufacturing Company, Ltd.


01/29/15
20150027523 

Nanostructures and methods for manufacturing the same


A resonant tunneling diode, and other one dimensional electronic, photonic structures, and electromechanical mems devices, are formed as a heterostructure in a nanowhisker by forming length segments of the whisker with different materials having different band gaps.. .
Qunano Ab


01/22/15
20150024536 

Mems device and manufacturing a mems device


mems devices with a rigid backplate and a method of making a mems device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate and a backplate supported by the substrate.
Infineon Technologies Ag


01/22/15
20150023529 

Mems devices, interface circuits, and methods of making thereof


In accordance with an embodiment of the present invention, a micro-electro-mechanical system (mems) device includes a first plate, a second plate disposed over the first plate, and a first moveable plate disposed between the first plate and the second plate. The mems device further includes a second moveable plate disposed between the first moveable plate and the second plate..
Infineon Technologies Ag


01/22/15
20150021718 

Apparatus and reduced strain on mems devices


A method and apparatus for coupling a mems device to a substrate is disclosed. The method includes providing a substrate with a conductor disposed over the substrate, adhering the mems device to the substrate, wherein a first elastomer adheres the mems device to the substrate.
Invensense, Inc.


01/08/15
20150008788 

Low temperature ceramic microelectromechanical structures


A method of providing microelectromechanical structures (mems) that are compatible with silicon cmos electronics is provided. The method providing for processes and manufacturing sequences limiting the maximum exposure of an integrated circuit upon which the mems is manufactured to below 350° c., and potentially to below 250° c., thereby allowing direct manufacturing of the mems devices onto electronics, such as si cmos circuits.
The Royal Institution For The Advancement Of Learning / Mcgill University


01/08/15
20150007656 

Reducing the effect of glass charging in mems devices


A method of controlling exposed glass charging in a micro-electro-mechanical systems (mems) device is disclosed. The method includes providing a mems device comprising a proof mass positioned apart from at least one sense plate and at least one outboard metallization layer, wherein at least one conductive glass layer is coupled to the sense plate and the outboard metallization layer, the conductive glass layer including at least one exposed glass portion near the proof mass; and applying a first voltage to the sense plate and a second voltage to the outboard metallization layer.
Honeywell International Inc.


01/01/15
20150002982 

Recovery mems devices


Various embodiments of the invention reduce stiction in a wide range of mems devices and increase device reliability without negatively impacting performance. In certain embodiments, stiction recover is accomplished by applying electrostatic forces to electrodes via optimized voltage signals that generate a restoring force that aids in overcoming stiction forces between electrodes.
Maxim Integrated Products, Inc.


01/01/15
20150001632 

Mems device and fabrication method


mems devices and methods for forming the same are provided. A first metal interconnect structure is formed on a first semiconductor substrate to connect to a cmos control circuit in the first semiconductor substrate.
Semiconductor Manufacturing International (shanghai) Corporation


12/25/14
20140374856 

Apparatus and preventing stiction of mems devices encapsulated by active circuitry


One or more stopper features (e.g., bump structures) are formed in a standard asic wafer top passivation layer for preventing mems device stiction vertically in integrated devices having a mems device capped directly by an asic wafer. A tin coating may be used on the stopper feature(s) for anti-stiction.
Analog Devices, Inc.


12/25/14
20140374854 

Vertical mount package and wafer level packaging therefor


Vertical mount packages and methods for making the same are disclosed. A method for manufacturing a vertical mount package includes providing a device substrate with a plurality of device regions on a front surface, and a plurality of through-wafer vias.
Analog Devices, Inc.


12/25/14
20140374851 

Mems device and fabricating mems devices


A method (60) entails providing a substrate (34) with a structural layer (30) having a thickness (40). A partial etch process is performed at locations (82) on the structural layer (30) so that a portion (92) of the structural layer (30) remains at the locations (82).
Freescale Semiconductor, Inc.


12/25/14
20140374850 

Apparatus and shielding and biasing in mems devices encapsulated by active circuitry


One or more conductive shielding plates are formed in a standard asic wafer top metal layer, e.g., for blocking cross-talk from mems device structure(s) on the mems wafer to circuitry on the asic wafer when the mems device is capped directly by the asic wafer in a wafer-level chip scale package. Generally speaking, a shielding plate should be at least slightly larger than the mems device structure it is shielding (e.g., a movable mems structure such as an accelerometer proof mass or a gyroscope resonator), and the shielding plate cannot be in contact with the mems device structure during or after wafer bonding.
Analog Devices, Inc.


12/25/14
20140374847 

Packaging mems devices


In a method of packaging micro-electro-mechanical systems (mems) devices, an interposer board is provided having a first surface and an opposing second surface, with the interposer board including a plurality of electrical contacts on the second surface. A plurality of shim layers are bonded to the first surface of the interposer board, and a plurality of mems dies are each separately bonded to a respective one of the shim layers.
Honeywell International Inc.


12/11/14
20140361844 

Suspended passive element for mems devices


A technique decouples a mems device from sources of strain by forming a mems structure with suspended electrodes that are mechanically anchored in a manner that reduces or eliminates transfer of strain from the substrate into the structure, or transfers strain to electrodes and body so that a transducer is strain-tolerant. The technique includes using an electrically insulating material embedded in a conductive structural material for mechanical coupling and electrical isolation.

12/11/14
20140361843 

Monolithic body mems devices


A technique decouples a mems device from sources of strain by forming a mems structure with suspended electrodes that are mechanically anchored in a manner that reduces or eliminates transfer of strain from the substrate into the structure, or transfers strain to electrodes and body so that a transducer is strain-tolerant. The technique includes using an electrically insulating material embedded in a conductive structural material for mechanical coupling and electrical isolation..

12/11/14
20140361661 

Temperature compensation for mems devices


A microelectromechanical system (mems) device includes a temperature compensating structure including a first beam suspended from a substrate and a second beam suspended from the substrate. The first beam is formed from a first material having a first young's modulus temperature coefficient.

12/04/14
20140356989 

Method of manufacturing mems devices with reliable hermetic seal


Manufactured capped mems device wafers are tested for hermeticity on a vacuum prober at differing pressures or on a wafer prober at differing temperatures. Resonant frequency testing is conducted.

11/27/14
20140349434 

Internal electrical contact for enclosed mems devices


A method of fabricating electrical connections in an integrated mems device is disclosed. The method comprises forming a mems wafer.

11/13/14
20140336641 

Surgical instruments including mems devices


Surgical instruments are disclosed that are couplable to or have an end effector or a disposable loading unit with an end effector, and at least one micro-electromechanical system (mems) device operatively connected to the surgical instrument for at least one of sensing a condition, measuring a parameter and controlling the condition and/or parameter.. .

11/13/14
20140334991 

Thermally or photochemically activated small molecule delivery platform


Thermally or photochemically activated small molecule delivery polymers and platforms enable ‘on-demand’ delivery of a vapor-phase lubricant, such as pentanol or other alcohols, that enable scheduled or as-needed lubrication of mems devices, thereby greatly improving the reliability and lifespan of the devices.. .

10/16/14
20140307885 

Differential outputs in multiple motor mems devices


An the acoustic apparatus comprising a first mems motor that includes a first diaphragm and a first back plate, and a second mems motor that includes a second diaphragm and a second back plate. The first motor is biased with a first electrical polarity and a second motor is biased with a second electrical polarity such that the first electrical polarity and the second electrical polarity are opposite.

10/09/14
20140300411 

Apparatus and removing mechanical resonance with internal control loop


The present invention related to an apparatus and method to removing mechanical resonance of a system using internal control loop, and in more particularly, the internal control loop reduces the resonance factor of the system. The approach in the present invention is not sensitive to the system mechanical parameters changes within time and within temperature changes.

10/09/14
20140300404 

Rf mems isolation, series and shunt dvc, and small mems


The present invention generally relates to an architecture for isolating an rf mems device from a substrate and driving circuit, series and shunt dvc die architectures, and smaller mems arrays for high frequency communications. The semiconductor device has one or more cells with a plurality of mems devices therein.

10/02/14
20140290331 

Wafer level centrifuge for mems stiction detection and screening system and method


A wafer level centrifuge (wlc) system and method of testing mems devices using the system. The wafer level centrifuge (wlc) system can include a base centrifuge system and a cassette mounting hub coupled to the base centrifuge system.

09/18/14
20140272435 

Anti-stick surface coatings


The present invention describes anti-stick coatings composed of carboxylic acid, carboxylate salt or thiol functionalized siloxanes. The compounds of this invention can be used as coatings on the surface of wind turbine blades, aircraft wings and fuselage, or on the surface of oil and gas platforms, ships, and other vehicles exposed to harsh weather conditions.

09/18/14
20140266246 

Mcu-based compensation and calibration for mems devices


A sensor system includes a microelectromechanical systems (mems) sensor, a processor, measurement circuitry, stimulus circuitry and memory. The mems sensor is configured to provide an output responsive to physical displacement within the mems sensor to the measurement circuitry.

09/18/14
20140264909 

Microelectromechanical system devices having through substrate vias and methods for the fabrication thereof


Methods for the fabrication of a microelectromechanical systems (“mems”) devices are provided, as are mems devices. In one embodiment, the mems device fabrication method includes forming at least one via opening extending into a substrate wafer, depositing a body of electrically-conductive material over the substrate wafer and into the via opening to produce a via, bonding the substrate wafer to a transducer wafer having an electrically-conductive transducer layer, and forming an electrical connection between the via and the electrically-conductive transducer layer.

09/18/14
20140264661 

Mems devices and methods for forming same


Embodiments of the present disclosure include mems devices and methods for forming mems devices. An embodiment is a method for forming a microelectromechanical system (mems) device, the method including forming a mems wafer having a first cavity, the first cavity having a first pressure, and bonding a carrier wafer to a first side of the mems wafer, the bonding forming a second cavity, the second cavity having a second pressure, the second pressure being greater than the first pressure.

09/18/14
20140260613 

Elastic bump stops for mems devices


A mems device includes at least one proof mass, the at least one proof mass is capable of moving to contact at least one target structure. The mems device further includes at least one elastic bump stop coupled to the proof mass and situated at a first distance from the target structure.

09/18/14
20140260508 

Compensation and calibration for mems devices


A sensor system includes a microelectromechanical systems (mems) sensor, processing circuitry, measurement circuitry, stimulus circuitry and memory. The system is configured to provide an output responsive to physical displacement within the mems sensor to the measurement circuitry.

09/11/14
20140252507 

Self-sealing membrane for mems devices


Embodiments of the present disclosure are related to mems devices having a suspended membrane that are secured to and spaced apart from a substrate with a sealed cavity therebetween. The membrane includes openings with sidewalls that are closed by a dielectric material.

09/11/14
20140252422 

Cavity structures for mems devices


Embodiments relate to mems devices, particularly mems devices integrated with related electrical devices on a single wafer. Embodiments utilize a modular process flow concept as part of a mems-first approach, enabling use of a novel cavity sealing process.

09/11/14
20140252358 

Methods and mems devices with increased sensitivity


Methods and apparatus for forming mems devices. An apparatus includes at least a portion of a semiconductor substrate having a first thickness and patterned to form a moveable mass; a moving sense electrode forming the first plate of a first capacitance; at least one anchor patterned from the semiconductor substrate and having a portion that forms the second plate of the first capacitance and spaced by a first gap from the first plate; a layer of semiconductor material of a second thickness patterned to form a first electrode forming a first plate of a second capacitance and further patterned to form a second electrode overlying the at least one anchor and forming a second plate spaced by a second gap that is less than the first gap; wherein a total capacitance is formed that is the sum of the first capacitance and the second capacitance.

09/04/14
20140246740 

Implantation of gaseous chemicals into cavities formed in intermediate dielectrics layers for subsequent thermal diffusion release


The present invention generally relates to methods for increasing the lifetime of mems devices by reducing the landing velocity on switching by introducing gas into the cavity surrounding the switching element of the mems device. The gas is introduced using ion implantation into a cavity close to the cavity housing the switching element and connected to that cavity by a channel through which the gas can flow from one cavity to the other.

09/04/14
20140245810 

Single motor dynamic calibration unit


A calibration unit, system, and method for calibrating a device under test are provided. The calibration unit, system, and method use a single axis rotational unit to calibrate devices under test on a test head.

08/14/14
20140224018 

Mems force sensors fabricated using paper substrates


Also provided are methods of modifying paper for use as a substrate material in mems devices.. .

08/07/14
20140218839 

Routing of mems variable capacitors for rf applications


The present invention generally relates to a variable capacitor for rf and microwave applications. The variable capacitor includes a bond pad that has a plurality of cells electrically coupled thereto.

07/31/14
20140213007 

Internal electrical contact for enclosed mems devices


A method of fabricating electrical connections in an integrated mems device is disclosed. The method comprises forming a mems wafer.

07/31/14
20140210020 

Mems device and manufacturing a mems device


mems devices with a rigid backplate and a method of making a mems device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate and a backplate supported by the substrate.

07/31/14
20140210018 

Microelectromechanical system devices having crack resistant membrane structures and methods for the fabrication thereof


Methods for fabricating crack resistant microelectromechanical (mems) devices are provided, as are mems devices produced pursuant to such methods. In one embodiment, the method includes forming a sacrificial body over a substrate, producing a multi-layer membrane structure on the substrate, and removing at least a portion of the sacrificial body to form an inner cavity within the multi-layer membrane structure.

06/19/14
20140169405 

Sensor with an embedded thermistor for precise local temperature measurement


A resistive temperature sensor (thermistor) for a microelectromechanical system (mems) device provides local temperatures of mems sensors and other mems devices for temperature compensation. Local accurate temperatures of the sensors and other devices provide for temperature compensation of such sensors or devices.

06/12/14
20140162462 

High frequency filter for improved rf bias signal stability


A plasma-assisted etch process for the manufacture of semiconductor or mems devices employs an rf source to generate a plasma that is terminated through an electrode. The termination is designed as a “short” at the frequency of the rf source to minimize voltage fluctuations on the electrode due to the rf source energy.

06/12/14
20140162393 

Multi-axis integrated mems devices with cmos circuits and method therefor


An integrated multi-axis mechanical device and integrated circuit system. The integrated system can include a silicon substrate layer, a cmos device region, four or more mechanical devices, and a wafer level packaging (wlp) layer.

06/12/14
20140159779 

Stiction reduction for mems devices


A capacitive micro-electromechanical switch (mems) integrated circuit (ic) comprises a plurality of capacitors, each having a voltage terminal for applying an actuation voltage to the individual capacitor, wherein each capacitor is capable of being individually cycled. The mems ic further includes: a high voltage driver having a voltage distribution mechanism that couples to the voltage terminal of each of the plurality of capacitors to enable the high voltage driver to selectively provide a pre-determined voltage input required to actuate and charge a selected one or more of the plurality of capacitors; and control logic communicatively coupled to the high voltage driver and which deterministically applies power cycle times (less than a stiction limit) for an actuation and de-actuation of at least a first capacitor of the plurality of capacitors to substantially reduce an occurrence of stiction within at least the first capacitor during operation of the mems device..

06/05/14
20140152143 

Control circuitry routing configuration for mems devices


A method for constructing a mems system includes first depositing on a surface of a substrate a first plurality of thin film layers formed of dielectric material. The first plurality of thin-film layers includes at least one conductive trace extending a distance on the substrate, parallel to the surface.

06/05/14
20140151823 

Mems devices and methods of forming same


The present invention provides a mems structure comprising confined sacrificial oxide layer and a bonded si layer. Polysilicon stack is used to fill aligned oxide openings and mems vias on the sacrificial layer and the bonded si layer respectively.

05/08/14
20140126167 

Using millisecond pulsed laser welding in mems packaging


A new packaging method for a wide range of mems for application on both the wafer and device scale. Titanium is used as the packaging material and both silicon and titanium mems devices are integrated on to a titanium substrate.

05/08/14
20140125431 

Tunable and switchable resonator and filter structures in single crystal piezoelectric mems devices using bimorphs


A mems device includes a substrate, one or more anchors formed on a first surface of the substrate, and a piezoelectric layer suspended over the first surface of the substrate by the one or more anchors. Notably, the piezoelectric layer is a bimorph including a first bimorph layer and a second bimorph layer.

05/08/14
20140125201 

Variable capacitor and switch structures in single crystal piezoelectric mems devices using bimorphs


A micro-electrical-mechanical systems (mems) device includes a substrate, one or more anchors formed on a first surface of the substrate, and a piezoelectric layer suspended over the first surface of the substrate by the one or more anchors. A first electrode may be provided on a first surface of the piezoelectric layer facing the first surface of the substrate, such that the first electrode is in contact with a first bimorph layer of the piezoelectric layer.

04/17/14
20140105242 

Device and methods for temperature and humidity measurements using a nanocomposite film sensor


Devices and methods are provided for a nanocomposite having a phase change polymer matrix and conductive nanoparticles to provide greatly enhanced responsivity to temperature and/or humidity. A sensing film includes carbon nanotubes (cnts) and the polymer.

04/17/14
20140103462 

Mems devices and methods for forming the same


A method includes forming a micro-electro-mechanical system (mems) device on a front surface of a substrate. After the step of forming the mems device, a through-opening is formed in the substrate, wherein the through-opening is formed from a backside of the substrate.

04/17/14
20140103461 

Mems devices and fabrication methods thereof


A method for fabricating a mems device includes providing a micro-electro-mechanical system (mems) substrate having a sacrificial layer on a first side, providing a carrier including a plurality of cavities, bonding the first side of the mems substrate on the carrier, forming a first bonding material layer on a second side of the mems substrate, applying a sacrificial layer removal process to the mems substrate, providing a semiconductor substrate including a second bonding material layer and bonding the semiconductor substrate on the second side of the mems substrate.. .

04/17/14
20140103460 

Mems device and manufacturing a mems device


A method for manufacturing a mems device is disclosed. Moreover a mems device and a module including a mems device are disclosed.

03/20/14
20140078154 

Display apparatus with multi-height spacers


A device includes an array of devices formed on a first substrate. A second substrate is spaced away from the first substrate such that the array of devices are positioned between the first and second substrates.

02/13/14
20140042562 

Mems devices and methods for forming the same


A device includes a micro-electro-mechanical system (mems) wafer having a mems device therein. The mems device includes a movable element, and first openings in the mems wafer.

01/30/14
20140031750 

Systems, methods, and devices for in vivo delivery using remote actuation of implantable hydrogel mems devices


Microelectromechanical system (mems) devices can be fabricated completely of hydrogel materials. Such hydrogels can include polyethylene glycol with diacrylate functional groups (e.g., pegda), which are photopolymerizable in the presence of crosslinkers and photoinitiators.

01/16/14
20140018703 

Microphone for remote health sensing


A health sensing device is described for placement on a user. The device may include a sensor, a filter, and a transmitter.

01/16/14
20140015069 

Mems devices, packaged mems devices, and methods of manufacture thereof


mems devices, packaged mems devices, and methods of manufacture thereof are disclosed. In one embodiment, a microelectromechanical system (mems) device includes a first mems functional structure and a second mems functional structure.

01/09/14
20140008738 

Mems die and methods with multiple-pressure sealing


The present subject matter relates to systems and methods for sealing one or more mems devices within an encapsulated cavity. A first material layer can be positioned on a substrate, the first material layer comprising a first cavity and a second cavity that each have one or more openings out of the first material layer.

01/02/14
20140000367 

Mems gyros with quadrature reducing springs


Spring set configurations that include an advantageous combination of spring geometries are disclosed. Spring elements having curved and straight sections, orientation of spring element anchor points with respect to the common radius, orientation of spring element segments with respect to a specific axis, balance of the length of spring elements about the common radius, and mass balance about the common radius can be used to mitigate unwanted out of plane motion.

12/26/13
20130341736 

Packaging compatible wafer level capping of mems devices


This invention discloses and claims a cost-effective, wafer-level package process for microelectromechanical devices (mems). Specifically, the movable part of mems device is encapsulated and protected while in wafer form so that commodity, lead-frame packaging can be used.

12/19/13
20130335878 

Mems lifetime enhancement


The present invention generally relates to methods for increasing the lifetime of mems devices by reducing the number of movements of a switching element in the mems device. Rather than returning to a ground state between cycles, the switching element can remain in the same state if both cycles necessitate the same capacitance.

12/19/13
20130334620 

Mems devices and fabrication methods thereof


A method for fabricating a mems device includes providing a micro-electro-mechanical system (mems) substrate having a sacrificial layer on a first side, providing a carrier including a plurality of cavities, bonding the first side of the mems substrate on the carrier, forming a first bonding material layer on a second side of the mems substrate, applying a sacrificial layer removal process to the mems substrate, providing a semiconductor substrate including a second bonding material layer and bonding the semiconductor substrate on the second side of the mems substrate.. .

10/31/13
20130283913 

Microelectromechanical systems devices and methods for the fabrication thereof


Embodiments of compact micro-electro-mechanical systems (mems) devices are provided, as are embodiments of methods for fabricating mems devices. In one embodiment, the mems device includes a substrate, a movable structure resiliently coupled to the substrate, and an anchored structure fixedly coupled to the substrate.

10/24/13
20130282020 

Method for using microelectromechanical systems to generate movement in a phacoemulsification handpiece


The present invention relates to a phacoemulsification handpiece, comprising a needle and a microelectromechanical system (mems) device, wherein the needle is coupled with the mems device. The phacoemulsification handpiece may further comprise a horn, wherein the horn is coupled with the needle and the mems device.

10/24/13
20130277836 

Method and structure of sensors and mems devices using vertical mounting with interconnections


A method and structure for fabricating sensor(s) or electronic device(s) using vertical mounting with interconnections. The method includes providing a resulting device including at least one sensor or electronic device, formed on a die member, having contact region(s) with one or more conductive materials formed thereon.

10/24/13
20130277770 

Mems devices and methods of forming the same


A device includes a substrate, a routing conductive line over the substrate, a dielectric layer over the routing conductive line, and an etch stop layer over the dielectric layer. A micro-electro-mechanical system (mems) device has a portion over the etch stop layer.

10/10/13
20130264662 

Electronic device, system, and method comprising differential sensor mems devices and drilled substrates


Electronic device including a substrate provided with at least one passing opening, a mems device with a differential sensor provided with a first and a second surface having at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof. The first surface of the mems device leaves the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the mems device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the mems device and the substrate..

10/03/13
20130260503 

Methods and apparatuses for integrated packaging of microelectromechanical devices


Microelectromechanical systems (mems) packages, packaged mems devices, and methods for making the same are disclosed. The method may include forming a chamber sacrificial layer above an insulating layer that is coupled to a wafer.

10/03/13
20130256896 

Vertical mount package and wafer level packaging therefor


Vertical mount packages and methods for making the same are disclosed. A method for manufacturing a vertical mount package includes providing a device substrate with a plurality of device regions on a front surface, and a plurality of through-wafer vias.

09/19/13
20130241999 

Highly integrated wafer bonded mems devices with release-free membrane manufacture for high density print heads


A method of fabricating a mems inkjet type print head and the resulting device is disclosed. The method includes providing a driver component and separately providing an actuatable membrane component, the actuatable membrane component being formed in the absence of an acid etch removing a sacrificial layer.

09/19/13
20130239996 

Integrated processing and critical point drying systems for semiconductor and mems devices


Processing and drying of a sample, such as a semiconductor or mems device, is achieved using a single pressure chamber. The pressure chamber holds the sample in a sealed interior volume throughout various process steps, such as, but not limited to, photoresist removal, sacrificial layer etching, flushing or rinsing, dehydration, and critical point drying.

09/05/13
20130230939 

High aspect ratio mems devices and methods for forming the same


An hf vapor etch etches high aspect ratio openings to form mems devices and other tightly-packed semiconductor devices with 0.2 μm air gaps between structures. The hf vapor etch etches oxide plugs and gaps with void portions and oxide liner portions and further etches oxide layers that are buried beneath silicon and other structures and is ideally suited to release cantilevers and other mems devices.

09/05/13
20130228881 

High aspect ratio capacitively coupled mems devices


A method that includes forming an opening between at least one first electrode and a second electrode by forming a recess in a first electrode layer, the recess having sidewalls that correspond to a surface of the at least one first electrode, forming a first sacrificial layer on the sidewalls of the recess, the first sacrificial layer having a first width that corresponds to a second width of the opening, forming a second electrode layer in the recess that corresponds to the second electrode, and removing the first sacrificial layer to form the opening between the second electrode and the at least one first electrode.. .

08/29/13
20130222073 

Design and control of multi-temperature micro-oven for mems devices


Disclosed are microelectromechanical system (mems) devices and methods of using the same. In some embodiments, a mems device comprises a micro-oven comprising a mems oscillator configured to generate a reference signal.

08/22/13
20130219207 

Distributed mems devices synchronization methods and apparatus


A method is provided for time synchronization in a mems (microelectromechanical system) based system having a mems processor and a plurality of mems devices. In a specific embodiment, the method includes, in the mems processor, transmitting a synchronization signal to the plurality of mems devices and saving a local time upon transmitting the synchronization signal.



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Mems Devices topics: Mems Devices, Microelectromechanical Systems, Electronic Device, Semiconductor, Semiconductor Device, Aspect Ratio, Phacoemulsification, Vitrectomy, Led Substrate, Conductive Elements, Integrated Circuit, Copper Alloy, Critical Point, Dehydration, Actuatable

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