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Mems Devices patents

      

This page is updated frequently with new Mems Devices-related patent applications.




 Mems device mechanical amplitude control patent thumbnailnew patent Mems device mechanical amplitude control
A system and/or method for utilizing mechanical motion limiters to control proof mass amplitude in mems devices (e.g., mems devices having resonant mems structures, for example various implementations of gyroscopes, magnetometers, accelerometers, etc.). As a non-limiting example, amplitude control for a mems gyroscope proof mass may be accomplished during normal (e.g., steady state) gyroscope operation utilizing impact stops (e.g., bump stops) of various designs.
Invensense, Inc.


 Recess with tapered sidewalls for hermetic seal in mems devices patent thumbnailRecess with tapered sidewalls for hermetic seal in mems devices
An integrated circuit (ic) device is provided. The ic device includes a first substrate having a frontside and a backside.
Taiwan Semiconductor Manufacturing Co., Ltd.


 Integrated mems system patent thumbnailIntegrated mems system
The present invention provides a 3d system (“3ds”) mems architecture that enables the integration of mems devices with ic chips to form a system on chip (soc) or system in package (sip). The integrated mems system comprises at least one mems chip, including mems transducers, and at least one ic chip, including not only mems processing circuitry, but also additional/auxiliary circuitry to process auxiliary signals.
Motion Engine, Inc.


 Mems device and  manufacturing a mems device patent thumbnailMems device and manufacturing a mems device
A method for manufacturing a mems device is disclosed. Moreover a mems device and a module including a mems device are disclosed.
Infineon Technologies Ag


 Wafer level chip scale packaged micro-electro-mechanical-system (mems) device and methods of producing thereof patent thumbnailWafer level chip scale packaged micro-electro-mechanical-system (mems) device and methods of producing thereof
Packaged mems devices are described. One such device includes a substrate having an active surface with an integrated circuit.
Memsic, Inc.


 Integration of active devices with passive components and mems devices patent thumbnailIntegration of active devices with passive components and mems devices
Integration of active devices with passive components and mems devices is disclosed. An integrated semiconductor structure includes an active device having a device top electrode connected to a conductive jumper by a device-side via/interconnect metal stack.
Newport Fab, Llc Dba Jazz Semiconductor


 Thin film encapsulation of electrodes patent thumbnailThin film encapsulation of electrodes
A method of fabricating encapsulated microelectromechanical system (mems) devices, comprising: providing a substrate having one or more mems devices formed thereon; depositing a sacrificial layer over the substrate and the one or more mems devices; patterning the sacrificial layer to define one or more cavities in the sacrificial layer and around the one or more mems devices; forming a cap layer over the sacrificial layer and the one or more cavities, the cap layer having one or more etch holes defined therein; removing the sacrificial layer by etching the sacrificial layer at least through the one or more etch holes; and depositing a sealing layer over the cap layer and the one or more etch holes to encapsulate the one or more mems devices, the substrate, and the cap layer.. .
Agency For Science, Technology And Research


 Mems device and fabrication method patent thumbnailMems device and fabrication method
mems devices and methods for forming the same are provided. A first metal interconnect structure is formed on a first semiconductor substrate to connect to a cmos control circuit in the first semiconductor substrate.
Semiconductor Manufacturing International (shangha) Corporation


 Distributed mems devices synchronization methods and apparatus patent thumbnailDistributed mems devices synchronization methods and apparatus
A method is provided for time synchronization in a mems (microelectromecahnical system) based system having a mems processor and a plurality of mems devices. In a specific embodiment, the method includes, in the mems processor, transmitting a synchronization signal to the plurality of mems devices and saving a local time upon transmitting the synchronization signal.
Mcube Inc.


 Method of fabricating mems devices using plasma etching and device therefor patent thumbnailMethod of fabricating mems devices using plasma etching and device therefor
A method for fabricating a mems sensor device. The method can include providing a substrate, forming an ic layer overlying the substrate, forming an oxide layer overlying the ic layer, forming a metal layer coupled to the ic layer through the oxide layer, forming a mems layer having a pair of designated sense electrode portions and a designated proof mass portion overlying the oxide layer, forming a via structure within each of the designated sense electrode portions, and etching the mems layer to form a pair of sense electrodes and a proof mass from the designated sense electrode portions and proof mass portions, respectively.
Mcube Inc.


Surgical instruments including mems devices

Surgical instruments are disclosed that are couplable to or have an end effector or a disposable loading unit with an end effector, and at least one micro-electromechanical system (mems) device operatively connected to the surgical instrument for at least one of sensing a condition, measuring a parameter and controlling the condition and/or parameter.. .
Covidien Lp

Multi-pressure mems package

The present disclosure relates to a microelectromechanical systems (mems) package having two mems devices with different pressures, and an associated method of formation. In some embodiments, the (mems) package includes a device substrate and a cap substrate bonded together.
Taiwan Semiconductor Manufacturing Co., Ltd.

Mems device positioning apparatus, test system, and test method

A positioning apparatus includes a support structure, a positioning structure, and a fixture for retaining mems devices. A shaft spans between the support structure and the positioning structure, and is configured to rotate about a first axis relative to the support structure in order to rotate the positioning structure and the fixture about the first axis.
Freescale Semiconductor, Inc.

Thin capping for mems devices

A device includes a base substrate (700) with a micro component (702) attached thereto. Suitably it is provided with routing elements (704) for conducting signals to and from the component (702).
Silex Microsystems Ab

Electrostatic damping of mems devices

The present invention generally relates to a method and apparatus for damping a plate electrode or switching element in a mems dvc device. A resistor disposed between a waveform controller and the electrodes of the mems dvc causes the voltage to increase while capacitance decreases during the time that the plate electrode is moving.
Cavendish Kinetics, Inc

Silicon-based mems devices including wells embedded with high density metal

In one aspect, the disclosure is directed to a mems device. The mems device includes a silicon-based movable mems sensor element.

Mems devices and processes

This application relates to mems transducer having a membrane layer (101) and at least one variable vent structure (301). The variable vent structure has a vent hole for venting fluid so as to reduce a pressure differential across the membrane layer and a moveable vent cover (302a, 302b) which, at an equilibrium position, at least partly blocks the vent hole.

Compensation and calibration for mems devices

A sensor system includes a microelectromechanical systems (mems) sensor, processing circuitry, measurement circuitry, stimulus circuitry and memory. The system is configured to provide an output responsive to physical displacement within the mems sensor to the measurement circuitry.
Freescale Semiconductor, Inc.

Combined magnetometer accelerometer mems devices and methods

Considerations for selecting capacitive sensors include accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, integration options with other sensors and/or electronics, and cost effectiveness. It is beneficial if such sensors are amenable to above-ic integration with associated control/readout circuitry for reduced parasitics and reduced footprint through area sharing.

Microelectromechanical systems (mems) devices at different pressures

Some embodiments relate to multiple mems devices that are integrated together on a single substrate. A device substrate comprising first and second micro-electro mechanical system (mems) devices is bonded to a capping structure.
Taiwan Semiconductor Manufacturing Co., Ltd.

Method of fabricating piezoelectric mems devices

A single photo mask can be used to define the three critical layers for the piezoelectric mems device, specifically the top electrode layer, the piezoelectric material layer, and the bottom electrode layer. Using a single photo mask removes the misalignment source caused by using multiple photo masks.

Internal electrical contact for enclosed mems devices

A method of fabricating electrical connections in an integrated mems device is disclosed. The method comprises providing a mems substrate which includes forming one or more cavities in a first semiconductor layer; forming a second semiconductor layer; and providing a dielectric layer between the first semiconductor layer and the second semiconductor layer the mems substrate providing step further includes bonding the first semiconductor layer to a second semiconductor layer; etching at least one via through the second semiconductor layer and the dielectric layer; and depositing a first conductive material onto the second semiconductor layer surface and filling the at least one via.

Substrate for diaphragm-type resonant mems devices, diaphragm-type resonant mems device and manufacturing same

R2≧0.70.. .

Systems, devices, and methods to reduce dielectric charging in micro-electro-mechanical systems devices

The present subject matter relates to devices, systems, and methods for isolation of electrostatic actuators in mems devices to reduce or minimize dielectric charging. A tunable component can include a fixed actuator electrode positioned on a substrate, a movable actuator electrode carried on a movable component that is suspended over the substrate, one or more isolation bumps positioned between the fixed actuator electrode and the movable actuator electrode, and a fixed isolation landing that is isolated within a portion of the fixed actuator electrode that is at, near, and/or substantially aligned with each of the one or more isolation bumps.
Wispry, Inc. .

Acoustic apparatus with dual mems devices

In accordance with one aspect of the disclosure, an acoustic apparatus is provided including a first transducer, a second transducer, a signal generator coupled to the first transducer, and a proximity detection module coupled to the second transducer. A buffering module is coupled to the first and second transducers and is configured to process analog signals received from the second transducer..
Knowles Electronics, Llc

Performance improvement of mems devices

A microelectromechanical-systems (mems) device includes a driven mass and has a natural stiffness or damping. An actuator applies force to the mass, movement of which is measured by a sensing capacitor.
Purdue Research Foundation

Mems die and methods with multiple-pressure sealing

The present subject matter relates to systems and methods for sealing one or more mems devices within an encapsulated cavity. A first material layer can be positioned on a substrate, the first material layer comprising a first cavity and a second cavity that each have one or more openings out of the first material layer.
Wispry

Stress isolation platform for mems devices

A mems product includes a stress-isolated mems platform surrounded by a stress-relief gap and suspended from a substrate. The stress-relief gap provides a barrier against the transmission of mechanical stress from the substrate to the platform..
Analog Devices, Inc.

Three-axis microelectromechanical systems devices

The embodiments described herein provide microelectromechanical systems (mems) devices, such as three-axis mems devices that can sense acceleration in three orthogonal axes (e.g., x-axis, y-axis, and z-axis). In general, the embodiments described can provide decoupling between the sense motions of all three axes from each other.
Freescale Semiconductor, Inc.

Apparatus and calibration of capacitance mismatch and temperature variations in a mems device

A system and calibration method utilizes time averaging to suppress inherent capacitance mismatches or temperature variations in mems devices, such as a tri-axial accelerometer. An calibration interface circuit, operatively coupled the mems sensor, effectively cancels a range of non-ideal capacitive mismatches by employing pockets of calibration charges that are controlled by the duty-cycle of a clock..

Internal barrier for enclosed mems devices

A mems device having a channel configured to avoid particle contamination is disclosed. The mems device includes a mems substrate and a base substrate.
Invensense, Inc.

Integrated cmos and mems devices with air dieletrics

A monolithically integrated cmos and mems device. The device includes a first semiconductor substrate having a first surface region and one or more cmos ic devices on a cmos ic device region overlying the first surface region.
Mcube, Inc.

Mems devices and manufacturing

A mems sensor includes a sensor die configured to generate a sensor signal and a pedestal layer disposed on the sensor die. The pedestal layer includes a channel defined therein about a pedestal of the pedestal layer.
Rosemount Aerospace Inc.

Wafer level packaging of mems

A mems device is formed by applying a lower polymer film to top surfaces of a common substrate containing a plurality of mems devices, and patterning the lower polymer film to form a headspace wall surrounding components of each mems device. Subsequently an upper polymer dry film is applied to top surfaces of the headspace walls and patterned to form headspace caps which isolate the components of each mems device.
Texas Instruments Incorporated

Mems devices and methods of forming the same

A device includes a substrate, a routing conductive line over the substrate, a dielectric layer over the routing conductive line, and an etch stop layer over the dielectric layer. A micro-electro-mechanical system (mems) device has a portion over the etch stop layer.
Taiwan Semiconductor Manufacturing Company, Ltd.

Surgical instruments including mems devices

Surgical instruments are disclosed that are couplable to or have an end effector or a disposable loading unit with an end effector, and at least one micro-electromechanical system (mems) device operatively connected to the surgical instrument for at least one of sensing a condition, measuring a parameter and controlling the condition and/or parameter.. .
Covidien Lp

Radio frequency (rf) microelectromechanical systems (mems) devices with gold-doped silicon

The present disclosure relates to radio frequency (rf) microelectromechanical system (mems) device packaging, and specifically to reducing harmonic distortion caused by such packaging. In one embodiment, a die is provided that employs a gold-doped silicon substrate, wherein at least one rf mems device is disposed on the gold-doped silicon substrate.
Rf Micro Devices, Inc.

Mems devices having discharge circuits

mems devices having discharge circuits. In some embodiments, a mems device can include a substrate and an electromechanical assembly implemented on the substrate.
Skyworks Solutions, Inc.

Mems devices and methods of fabrication thereof

mems devices and methods of fabrication thereof are described. In one embodiment, the mems device includes a bottom alloy layer disposed over a substrate.
Taiwan Semiconductor Manufacturing Company, Ltd.

Stress compensation for piezoelectric optical mems devices

An apparatus includes a lens material forming a lens. The apparatus also includes a piezoelectric capacitor over the lens material, where the piezoelectric capacitor is configured to change a shape of the lens material in response to a voltage across the piezoelectric capacitor to thereby change a focus of the lens.
Texas Instruments Incorporated

Method for reducing discharge defects and electrode delamination in piezoelectric optical mems devices

A method includes forming a piezoelectric optical micro-electromechanical system (mems) device having a piezoelectric capacitor over a lens material. The lens material forms a lens, and the piezoelectric capacitor is configured to change a shape of the lens material in order to change a focus of the lens.
Texas Instruments Incorporated

Microelectromechanical systems devices with improved lateral sensitivity

Microelectromechanical system (mems) devices and methods for forming mems devices are provided. The mems devices include a substrate, an anchored structure fixedly coupled to the substrate, and a movable structure resiliently coupled to the substrate.
Freescale Semiconductor, Inc.

Mems devices utilizing a thick metal layer of an interconnect metal film stack

A mems device, such as an accelerometer or gyroscope, fabricated in interconnect metallization compatible with a cmos microelectronic device. In embodiments, a proof mass has a first body region utilizing a thick metal layer that is separated from a thin metal layer.
Intel Corporation

Vhf etch barrier for semiconductor integrated microsystem

The present disclosure relates to an integrated microsystem with a protection barrier structure, and an associated method. In some embodiments, the integrated microsystem comprises a first die having a plurality of cmos devices disposed thereon, a second die having a plurality of mems devices disposed thereon and a vapor hydrofluoric acid (vhf) etch barrier structure disposed between the first die and the second die.
Taiwan Semiconductor Manufacturing Co., Ltd.

Signal processing multiple mirco-electro-mechanical system (mems) devices and combo mems device applying the method

This invention provides a signal processing method of multiple micro-electro-mechanical system devices. The signal processing method includes: providing at least two mems devices; applying driving or modulating signals of different frequencies to the mems devices such that the mems devices generate respective mems signals with respective frequencies; and combining the mems signals with respective frequencies into one or more multi-frequency signals and outputting the multi-frequency signals, wherein a number of the multi-frequency signals is less than a number of the mems signals with respective frequencies.
Richtek Technology Corporation

Cavity structures for mems devices

Embodiments relate to mems devices and methods for manufacturing mems devices. In one embodiment, the manufacturing includes forming a monocrystalline sacrificial layer on a non-silicon-on-insulator (non-soi) substrate, patterning the monocrystalline sacrificial layer such that the monocrystalline sacrificial layer remains in a first portion and is removed in a second portion lateral to the first portion; depositing a first silicon layer, the first silicon layer deposited on the remaining monocrystalline sacrificial layer and further lateral to the first portion; removing at least a portion of the monocrystalline sacrificial layer via at least one release aperture in the first silicon layer to form a cavity and sealing the cavity..
Infineon Technologies Ag

Methods and mems devices with increased sensitivity

Methods and apparatus for forming mems devices. An apparatus includes at least a portion of a semiconductor substrate having a first thickness and patterned to form a moveable mass; a moving sense electrode forming the first plate of a first capacitance; at least one anchor patterned from the semiconductor substrate and having a portion that forms the second plate of the first capacitance and spaced by a first gap from the first plate; a layer of semiconductor material of a second thickness patterned to form a first electrode forming a first plate of a second capacitance and further patterned to form a second electrode overlying the at least one anchor and forming a second plate spaced by a second gap that is less than the first gap; wherein a total capacitance is formed that is the sum of the first capacitance and the second capacitance.
Taiwan Semiconductor Manufacturing Company, Ltd.

Internal electrical contact for enclosed mems devices

A method of fabricating electrical connections in an integrated mems device is disclosed. The method comprises forming a mems wafer.
Invensense, Inc.

System on a chip using integrated mems and cmos devices

An integrated mems system in which cmos and mems devices are provided to form an integrated cmos-mems system. The system can include a silicon substrate layer, a cmos layer, mems and cmos devices, and a wafer level packaging (wlp) layer.
Mcube Inc.

Mems devices and methods for forming same

Embodiments of the present disclosure include mems devices and methods for forming mems devices. An embodiment is a method for forming a microelectromechanical system (mems) device, the method including forming a mems wafer having a first cavity, the first cavity having a first pressure, and bonding a carrier wafer to a first side of the mems wafer, the bonding forming a second cavity, the second cavity having a second pressure, the second pressure being greater than the first pressure.
Taiwan Semiconductor Manufacturing Company, Ltd.



Mems Devices topics:
  • Mems Devices
  • Microelectromechanical Systems
  • Electronic Device
  • Semiconductor
  • Semiconductor Device
  • Aspect Ratio
  • Phacoemulsification
  • Vitrectomy
  • Led Substrate
  • Conductive Elements
  • Integrated Circuit
  • Copper Alloy
  • Critical Point
  • Dehydration
  • Actuatable


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    This listing is a sample listing of patent applications related to Mems Devices for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Mems Devices with additional patents listed. Browse our RSS directory or Search for other possible listings.


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