Mems Devices

Mems Devices-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).

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Surgical instruments including mems devices
Covidien Lp
May 11, 2017 - N°20170128149

Surgical instruments are disclosed that are couplable to or have an end effector or a disposable loading unit with an end effector, and at least one micro-electromechanical system (mems) device operatively connected to the surgical instrument for at least one of sensing a condition, measuring a parameter and controlling the condition and/or parameter.
Integrated mems-cmos devices and integrated circuits with mems devices and cmos devices
Globalfoundries Singapore Pte. Ltd.
May 04, 2017 - N°20170121172

Integrated mems-cmos devices and integrated circuits with mems devices and cmos devices are provided. An exemplary integrated mems-cmos device is vertically integrated and includes a substrate having a first side and a second side opposite the first side. Further, the exemplary vertically integrated mems-cmos device includes a cmos device located in and/or over the first side of the substrate. ...
Mems device and process
Cirrus Logic International Semiconductor Ltd.
April 27, 2017 - N°20170118561

This application relates to mems devices, especially mems capacitive transducers and to processes for forming such mems transducer that provide increased robustness and resilience to acoustic shock. The application describes a mems transducer having a flexible membrane (101) supported relative to a first surface of a substrate (105) which has one or more cavities therein, e. G. To provide an acoustic volume. ...
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Method and apparatus for reducing in-process and in-use stiction for mems devices
Taiwan Semiconductor Manufacturing Company, Ltd.
April 06, 2017 - N°20170096328

The present disclosure involves forming a method of fabricating a micro-electro-mechanical system (mems) device. A plurality of openings is formed in a first side of a first substrate. A dielectric layer is formed over the first side of the substrate. A plurality of segments of the dielectric layer fills the openings. The first side of the first substrate is bonded ...
Simplified mems device fabrication process
Mems Drive, Inc.
March 30, 2017 - N°20170088418

A simplified mems fabrication process and mems device is provided that allows for cheaper and lighter-weight mems devices to be fabricated. The process comprises etching a plurality of holes or other feature patterns into a mems device, and then etching away the underlying wafer such that, after the etching process, the mems device is the required thickness and the individual ...
Mems grid for manipulating structural parameters of mems devices
Mems Drive, Inc.
March 30, 2017 - N°20170088415

A system and method for manipulating the structural characteristics of a mems device include etching a plurality of holes into the surface of a mems device, wherein the plurality of holes comprise one or more geometric shapes determined to provide specific structural characteristics desired in the mems device.
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Mems devices on flexible substrate
3m Innovative Properties Company
March 16, 2017 - N°20170073215

A flexible film including one or more mems elements and articles including the flexible film are described. The flexible film includes a polymer layer between two metal layers with one of the metal layers containing a perforation. The polymer layer includes voided regions that allow for relative movement of the two metal layers.
Mems devices and methods of forming same
Taiwan Semiconductor Manufacturing Company, Ltd.
March 09, 2017 - N°20170066647

A microelectromechanical system (mems) device may include a mems structure over a first substrate. The mems structure comprises a movable element. Depositing a first conductive material over the first substrate and etching trenches in a second substrate. Filling the trenches with a second conductive material and depositing a third conductive material over the second conductive material and the second substrate. ...
Mems and cmos integration with low-temperature bonding
Taiwan Semiconductor Manufacturing Co., Ltd.
March 02, 2017 - N°20170057814

The present disclosure relates an integrated chip having one or more mems devices. In some embodiments, the integrated chip has a carrier substrate with one or more cavities disposed within a first side of the carrier substrate. A dielectric layer is disposed between the first side of the carrier substrate and a first side of a micro-electromechanical system (mems) substrate. ...
Microphone with wind noise resistance
Knowles Electronics, Llc
January 26, 2017 - N°20170026759

A microphone device is comprises a first micro electro mechanical system (mems) device and a second mems device with difference size of pierce holes in the diaphragms. Signal outputs from the first and second mems devices are selectively used to provide wind noise resistance.
Hermetic encapsulation for microelectromechanical systems (mems) devices
Knowles Electronics, Llc
January 26, 2017 - N°20170022050

Embodiments of the invention describe hermetic encapsulation for mems devices, and processes to create the hermetic encapsulation structure. Embodiments comprise a mems substrate stack that further includes a magnet, a first laminate organic dielectric film, a first hermetic coating disposed over the magnet, a second laminate organic dielectric film disposed on the hermetic coating, a mems device layer disposed over ...
Mems devices and fabrication methods thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
January 12, 2017 - N°20170008758

A device includes a carrier having a plurality of cavities, a micro-electro-mechanical system (mems) substrate bonded on the carrier, wherein the mems substrate comprises a first side bonded on the carrier, a moving element over a bottom electrode, wherein the bottom electrode is formed of polysilicon and a second side having a plurality of bonding pads and a semiconductor substrate ...
Mems devices and fabrication methods thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
January 05, 2017 - N°20170001860

A device includes a carrier having a plurality of cavities, a micro-electro-mechanical system (mems) substrate bonded on the carrier, wherein the mems substrate comprises a shielding layer on the carrier and coupled to ground, a plurality of vias coupled between the shielding layer and a bottom electrode of the mems substrate and a moving element over the bottom electrode and ...
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Mems devices and methods for forming same
Taiwan Semiconductor Manufacturing Company, Ltd.
December 22, 2016 - N°20160368762

An embodiment is mems device including a first mems die having a first cavity at a first pressure, a second mems die having a second cavity at a second pressure, the second pressure being different from the first pressure, and a molding material surrounding the first mems die and the second mems die, the molding material having a first surface ...
Methods and devices for extraction of mems structures from a mems layout
Cadence Design Systems, Inc.
December 15, 2016 - N°20160364515

Electronic design automation systems and methods for extracting microelectromechanical systems (mems) objects from a manufacturing mems layout are described for mems layouts directed to mems devices including mass and spring objects. Pattern recognition is used on a mems layer of the mems layout to identify beams and supports. The identified beams and supports are then used to derive a set ...
Mems device mechanical amplitude control
Invensense, Inc.
December 01, 2016 - N°20160349056

A system and/or method for utilizing mechanical motion limiters to control proof mass amplitude in mems devices (e. G., mems devices having resonant mems structures, for example various implementations of gyroscopes, magnetometers, accelerometers, etc.). As a non-limiting example, amplitude control for a mems gyroscope proof mass may be accomplished during normal (e. G., steady state) gyroscope operation utilizing impact ...
Recess with tapered sidewalls for hermetic seal in mems devices
Taiwan Semiconductor Manufacturing Co., Ltd.
November 17, 2016 - N°20160332867

An integrated circuit (ic) device is provided. The ic device includes a first substrate having a frontside and a backside. The backside includes a first cavity extending into the first substrate. A dielectric layer is disposed on the backside of the first substrate, and includes an opening corresponding to the first cavity and a trench extending laterally away from the ...
Integrated mems system
Motion Engine, Inc.
November 03, 2016 - N°20160320426

The present invention provides a 3d system (“3ds”) mems architecture that enables the integration of mems devices with ic chips to form a system on chip (soc) or system in package (sip). The integrated mems system comprises at least one mems chip, including mems transducers, and at least one ic chip, including not only mems processing ...
Mems device and method of manufacturing a mems device
Infineon Technologies Ag
November 03, 2016 - N°20160318759

A method for manufacturing a mems device is disclosed. Moreover a mems device and a module including a mems device are disclosed. An embodiment includes a method for manufacturing mems devices includes forming a mems stack on a first main surface of a substrate, forming a polymer layer on a second main surface of the substrate and forming a first ...
Wafer level chip scale packaged micro-electro-mechanical-system (mems) device and methods of producing thereof
Memsic, Inc.
October 13, 2016 - N°20160297674

Packaged mems devices are described. One such device includes a substrate having an active surface with an integrated circuit. Two substrate pads are formed on the substrate; one pad is a closed ring pad. The device also includes a cap wafer with two wafer pads. One of these wafer pads is also a closed ring pad. A hermetic seal ring ...
Integration of active devices with passive components and mems devices
Newport Fab, Llc Dba Jazz Semiconductor
October 06, 2016 - N°20160289065

Integration of active devices with passive components and mems devices is disclosed. An integrated semiconductor structure includes an active device having a device top electrode connected to a conductive jumper by a device-side via/interconnect metal stack. The integrated semiconductor structure also includes a passive component having a component bottom plate connected to the conductive jumper by a component-side via/...