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Memory Chip

Memory Chip-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Optical module
July 13, 2017 - N°20170200710

[solving means] the present optical module includes a sensor configured to pick up an image of an image pickup object, and a memory chip configured to store pixel data read out from the sensor and having the sensor joined thereto. The memory chip is connected to a substrate by a connection portion by flip-chip connection. The sensor can be connected ...
Method and apparatus for calibrating write timing in a memory system
Rambus Inc.
July 13, 2017 - N°20170200489

A system that calibrates timing relationships between signals involved in performing write operations is described. This system includes a memory controller which is coupled to a set of memory chips, wherein each memory chip includes a phase detector configured to calibrate a phase relationship between a data-strobe signal and a clock signal received at the memory chip from the memory ...
Semiconductor memory device
Renesas Electronics Corporation
July 06, 2017 - N°20170194039

A stack memory includes a base chip, a memory chip stacked over the base chip, and a via 42 provided between the base chip and the memory chip. The base chip has an external interface circuit and a late write control circuit. The external interface circuit externally receives/transmits write data and read data. The late write control circuit has at ...
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Memory systems and electronic devices including nonvolatile memory modules
Samsung Electronics Co .. Ltd.
July 06, 2017 - N°20170192704

A memory system includes a nonvolatile memory module and a memory controller. The nonvolatile memory module includes a plurality of memory chips and a module controller disposed on a printed circuit board. The module controller controls operations of the plurality of memory chips. Each of the plurality of memory chips includes a plurality of nonvolatile memory cells and operates in ...
Memory module and memory system including the memory module
Sk Hynix Inc.
June 29, 2017 - N°20170185349

A memory system may include a controller and a plurality of memory modules. Each of the plurality of memory modules may include a buffer chip and a plurality of memory chips coupled to the buffer chip through independent input and output (i/o) lines. The buffer chips in the plurality of memory modules may be coupled to the controller through ...
Apparatus and method to support a storage mode over a cache-line memory interface to a ...
Intel Corporation
June 22, 2017 - N°20170177496

Provided are an apparatus and method for using block windows configured in a memory module to provide block level access to memory chips in the memory module. A plurality of block windows are configured that map to addresses corresponding to the addressable locations in the memory chips. A read/write request is received indicating a requested read or write operation ...
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Semiconductor package
Samsung Electronics Co., Ltd.
June 15, 2017 - N°20170170156

A semiconductor package is provided. The semiconductor package may include a plurality of memory chips, which are mounted on a top surface of a package substrate, and a plurality of controller chips, which are vertically stacked on at least one of top and bottom surfaces of the package substrate.
Apparatus to inhibit misuse of an electrically powered device
The Trustees Of Columbia University In The City Of New York
June 08, 2017 - N°20170164267

A system includes an electrical device comprising a power supply and circuitry and a supplemental device integrated into the electrical device. The supplemental device includes a tracker chip to receive current location data of the electrical device. The supplemental device also includes a switch with one side connected to the power supply and another side connected to the circuitry of ...
Apparatus having dice to perorm refresh operations
Micron Technology, Inc.
June 01, 2017 - N°20170154663

Some embodiments include an apparatus that comprise an interface chip having an oscillator to produce an original clock signal, a first memory chip having first memory cells, and a second memory chip having second memory cells. The first memory cells may be refreshed in response to a first clock signal based on the original clock signal. The second memory cells ...
Nonvolatile memory modules and electronic devices having the same
Micron Technology, Inc.
May 25, 2017 - N°20170148514

A nonvolatile memory module including a plurality of memory chips and a module controller on a printed circuit board (pcb) may be provided. Each of the plurality of memory chips may include a plurality of nonvolatile memory cell array layers stacked on a substrate in a three dimensional structure. The module controller may control operations of the plurality of memory ...
Nonvolatile memory modules and electronic devices having the same
Micron Technology, Inc.
May 25, 2017 - N°20170147262

A nonvolatile memory module including a plurality of memory chips, a spare chip, and a module controller may be provided. The plurality of memory chips may he disposed on a printed circuit board (pcb), and each of the plurality of memory chips may include a plurality of nonvolatile memory cells. The spare chip may be disposed on the pcb and ...
Memory system controlling interleaving write to memory chips
Micron Technology, Inc.
May 25, 2017 - N°20170147235

According to one embodiment, a controller executes a first process such that writing is performed in an order of page numbers in the memory chip. The first process includes a second process to be executed in an order of group units. The second process includes a process of writing data to the lower pages of the memory chips belonging to ...
Semiconductor package
Samsung Electronics Co., Ltd.
May 18, 2017 - N°20170141092

A semiconductor package includes a logic chip mounted on a substrate, a first memory chip disposed on the logic chip, which includes a first active surface, and a second memory chip disposed on the first memory chip. The second memory chip is disposed on the first memory chip in such a way that the first memory chip and second memory ...
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Length-adjustable storage device
Kabushiki Kaisha Toshiba
May 11, 2017 - N°20170131748

A storage device includes a base board and a memory chip package. The base board includes, on a first edge, a connector that is connectable to a host device and through which the storage device communicates with the host device, on a second edge that is opposite to the first edge, a first engaging portion by which the base board ...
Semiconductor device having chip id generation circuit
Samsung Electronics Co., Ltd.
May 04, 2017 - N°20170125119

Provided is a semiconductor device including chip identification (id) generation circuits. The semiconductor device may be a multi-chip package including a plurality of memory chips, and each of the memory chips includes a chip id generation circuit configured to selectively modify a chip id of a corresponding memory chip. The chip id generation circuit determines the chip id of the ...
Memory error recovery
International Business Machines Corporation
May 04, 2017 - N°20170123936

An aspect includes memory error recovery in a memory system includes detecting an error condition within a memory chip of the memory system. A chip mark is applied to the memory chip to flag the error condition. An address range of the memory chip associated with the error condition is determined. Data are written from the address range of the ...
Multistage boot image loading by configuration of a bus interface
Xilinx, Inc.
May 04, 2017 - N°20170123815

An integrated circuit (ic) that includes a processor circuit can be booted by receiving, using a storage interface circuit of the ic, a first boot image from a nonvolatile memory chip. The first boot image is executed on a processor circuit of the ic to configure a bus interface module that is designed to communicate with a host device over ...
Semiconductor device and method for driving the same
Sk Hynix Inc.
May 04, 2017 - N°20170123695

A semiconductor device includes: a first memory chip including a plurality of first memory regions; a temporary memory chip including a plurality of temporary memory regions; and a control chip suitable for accessing a first access target memory region among the plurality of first memory regions or a first temporary memory region among the plurality of temporary memory regions based ...
Printed circuit board with edge soldering for high-density packages and assemblies
International Business Machines Corporation
April 27, 2017 - N°20170118839

The present invention is notably directed to a printed circuit board, or pcb. This pcb has two main surfaces, each delimited by lateral edges, as well as lateral surfaces, each meeting each of the two main surfaces at one lateral edge. The present pcb further comprises a row of solder pads, which extends along a lateral edge of the pcb. ...
Memory chip, memory device, and reading method
Kabushiki Kaisha Toshiba
April 27, 2017 - N°20170117050

A memory chip includes a memory cell array having a plurality of memory cells connected to word lines and bit lines, and a sense amplifier configured to detect data stored in a memory cell that is connected to a selected one of the word lines and a selected one of the bit lines, and a control circuit configured to read ...
Semiconductor memory device that varies voltage levels depending on which of different memory regions thereof ...
Kabushiki Kaisha Toshiba
April 27, 2017 - N°20170117032

A semiconductor memory device includes a semiconductor memory chip including a plurality of regions of memory cells, including a first memory region and a second memory region, and a memory controller configured to carry out a read of a memory cell in the first memory region by applying a first read voltage, and a read of a memory cell in ...
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