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Led Structure patents



      
           
This page is updated frequently with new Led Structure-related patent applications. Subscribe to the Led Structure RSS feed to automatically get the update: related Led RSS feeds. RSS updates for this page: Led Structure RSS RSS


Methods of patterning block copolymer layers and patterned structures

Aln cap grown on gan/reo/silicon substrate structure

Non-blocked phosphorescent oleds

Date/App# patent app List of recent Led Structure-related patents
08/28/14
20140240930
 Thermal transfer and coolant-cooled structures facilitating cooling of electronics card(s) patent thumbnailnew patent Thermal transfer and coolant-cooled structures facilitating cooling of electronics card(s)
Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader coupled to the one side of the electronics card, and the apparatus further includes a coolant-cooled structure disposed adjacent to the socket of the electronic system.
08/21/14
20140234589
 Methods of patterning block copolymer layers and patterned structures patent thumbnailMethods of patterning block copolymer layers and patterned structures
Heat-treating the block copolymer layer to form a self-assembled structure of the block copolymer directed by the topographic pattern.. .
08/21/14
20140231818
 Aln cap grown on gan/reo/silicon substrate structure patent thumbnailAln cap grown on gan/reo/silicon substrate structure
Iii-n material grown on a silicon substrate includes a single crystal rare earth oxide layer positioned on a silicon substrate. The rare earth oxide is substantially crystal lattice matched to the surface of the silicon substrate.
08/21/14
20140231768
 Non-blocked phosphorescent oleds patent thumbnailNon-blocked phosphorescent oleds
An organic light emitting diode (oled) architecture in which efficient operation is achieved without requiring a blocking layer by locating the recombination zone close to the hole transport side of the emissive layer. Aryl-based hosts and ir-based dopants with suitable concentrations result in an efficient phosphorescent oled structure.
08/14/14
20140227517
 Entangled filament molded product patent thumbnailEntangled filament molded product
A polymer filament molded product and a method of making a filament network that includes coating filaments with a latex polymer and shaping the filaments into a molded product; one in which a polymer is shaped and molded into a larger filament network. The molded products can be objects for apparel, home and garden, furnishings, health care, engineering, industrial and consumer goods.
08/14/14
20140225123
 Reo/alo/aln template for iii-n material growth on silicon patent thumbnailReo/alo/aln template for iii-n material growth on silicon
A iii-n template formed on a silicon substrate includes a distributed bragg reflector positioned on the silicon substrate. The distributed bragg reflector is substantially crystal lattice matched to the surface of the silicon substrate.
08/14/14
20140223745
 Bolted structural connection systems patent thumbnailBolted structural connection systems
Systems and methods directed to the art of connectors and assembling structures, such as securing rail members together to form an assembled structure. A connector system capable of inducing a clamping stress in a connector and thereby securing at least one rail within the connector.
08/07/14
20140217451
 Mixed light led structure patent thumbnailMixed light led structure
Disclosed is a mixed light led structure which is a solid-state phosphor plate manufactured by mixing phosphor and resin, and the solid-state phosphor plate is installed in a carrier and covered onto the top of a light emitting chip, and a specific ratio relation between the area of the solid-state phosphor plate and the area of the light emitting chip area or a specific ratio relation between the area of the solid-state phosphor plate and the area of a light emitting hole are used, and also the relation of limiting the distance between the solid-state phosphor plate and the light emitting chip is satisfied, so as to achieve a better mixed light effect and a longer service life of the mixed light led structure.. .
08/07/14
20140216645
 Method for forming glass layer and method for manufacturing sealed structure patent thumbnailMethod for forming glass layer and method for manufacturing sealed structure
To form a glass layer with high productivity over a substrate provided with a material whose upper temperature limit is low. A method for forming the glass layer includes a first step of providing a frit paste including a glass frit and a binder over a substrate, and a second step of relatively moving a laser light irradiation portion over the frit paste not to overlap with a laser light irradiation start portion.
07/31/14
20140210991
 Sealing method for flat panel display device patent thumbnailSealing method for flat panel display device
A method of sealing a flat panel display device by using laser and a charge-coupled device (ccd) camera. The sealing method includes applying a sealant around a light-emitting unit on a substrate and covering above the light-emitting unit with the encapsulating substrate; irradiating light onto a sealant area to harden the sealant for the first time (first hardening); monitoring a hardening state of the sealant; and further irradiating light onto a region of the sealant in a bad hardening state based on the monitoring result to harden the region of the sealant in the bad hardening state (second hardening).
07/31/14
20140209822
Autonomous valve with temperature responsive device
A self-adjustable valve or flow control device for controlling the flow of a fluid from one space or area to another by exploiting the bernoulli principle, to control the flow of fluid, such as oil and/or gas including any water, from an oil or gas reservoir and into a production pipe of a well in the oil and/or gas reservoir, from an inlet port on an inlet side to an outlet port on an outlet side of the device. The valve includes a movable valve body arranged to be acted on by a temperature responsive device.
07/24/14
20140203312
Mixed light led structure
Disclosed is a mixed light led structure which is a solid-state phosphor plate manufactured by mixing phosphor and resin, and the solid-state phosphor plate is installed in a carrier and covered onto the top of a light emitting chip, and a specific ratio relation between the area of the solid-state phosphor plate and the area of the light emitting chip area or a specific ratio relation between the area of the solid-state phosphor plate and the area a light emitting hole are used. And also the relation of limiting the distance between the solid-state phosphor plate and the light emitting chip is satisfied, so as to achieve a better mixed light effect and a longer service life of the mixed light led structure..
07/17/14
20140197441
Semiconductor light emitting element and illumination device comprising the same
A semiconductor light emitting element includes a transparent substrate and a plurality of light emitting diode (led) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other.
07/17/14
20140197440
Illumination device
A semiconductor light emitting element includes a transparent substrate and a plurality of light emitting diode (led) structures. The transparent substrate has a support surface and a second main surface disposed opposite to each other.
07/17/14
20140196848
Finned shutter disk for a substrate process chamber
Shutter disks for use in process chambers are provided herein. In some embodiments, a shutter disk for use in a process chamber may include a body having an outer perimeter, a top surface of the body, wherein the top surface includes a central portion having a substantially horizontal planar surface, and at least one angled structure disposed radially outward of the central portion, each of the at least one angled structure having a top portion and an angled surface disposed at a downward angle in a radially outward direction from the top portion toward the outer perimeter, and a bottom surface of the body..
07/10/14
20140190211
System and method for forming fused quartz glass
A method of forming fused quartz glass is provided. The method includes the steps of: (a) providing a starting body made of fused quartz glass; (b) positioning the fused quartz glass starting body on a base plate; (c) inserting a first insert device into an interior cavity of the starting body to form an assembled structure; (d) heating the assembled structure to a predetermined temperature at which the fused quartz glass has a viscosity in a range of 105 to 1013 poise; and (e) deforming the fused quartz glass of the starting body at the predetermined temperature or in the viscosity range of 105 to 1013 poise around the first insert device to change a shape of the starting body.
07/03/14
20140183444
High-voltage flip-chip led structure and manufacturing method thereof
A high-voltage flip-chip led structure and a manufacturing method thereof are disclosed. The manufacturing method includes: providing a die substrate, depositing a first passivation layer, forming a co-electrical-connecting layer, depositing a second passivation layer, depositing a mirror layer, forming two conductive tunnels by etching, and providing two connecting metal layers.
06/26/14
20140176383
Coil antenna device and antenna module
In a coil antenna device, a multilayer structure includes non-magnetic sheets and magnetic sheets stacked on each other. A coil conductor is provided in the multilayer structure such that a portion of the magnetic material defines a magnetic core and such that a coil axis extends along a principle surface of the multilayer structure.
06/19/14
20140172107
Biomedical implant inserters and related apparatus, systems, and methods
Embodiments of apparatus, systems, and methods relating to spinal implants. In some embodiments, the spinal implant may comprise a first sidewall, a second sidewall opposite from the first sidewall, a pair of opposed frictional surfaces each comprising a plurality of raised structures, a first end wall joining the pair of opposed sidewall surfaces, and a second end wall joining the first sidewall and the second sidewall.
06/19/14
20140170792
Forming thin film vertical light emitting diodes
A thin film vertical light emitting diode (vled) structure and process are described. Features of the design include the following: bonding multiple smaller diameter led wafers to a larger diameter carrier wafer, which reduces the per led fabrication cost; using thin film techniques to metalize the anode and cathode and using respective annealing steps prior to photolithography patterning of led structures; enabling the thin film process by semi-permanent bonding techniques which provide thermal and chemical stability, while allowing bond release at an opportune time by thermal, optical, or chemical means; using epitaxial substrate removal techniques to separate the entire led film from its growth substrate; and patterning various vertical led devices which can emit light from the n-type side (cathode), p-type side (anode), side wall, or a combination of the surfaces by using mirror layers and electrically conductive and optically transmissive layers..
06/19/14
20140170204
Multilayer thin film drug delivery device and methods of making and using the same
Multilayer thin film devices that include a bioactive agent for elution to the surrounding tissue upon administration to a subject are provided. The multilayer thin film devices are useful as medical devices, such as ocular devices.
06/19/14
20140167065
Led structure with enhanced mirror reflectivity
Embodiments of the present invention are generally related to led chips having improved overall emission by reducing the light-absorbing effects of barrier layers adjacent mirror contacts. In one embodiment, a led chip comprises one or more leds, with each led having an active region, a first contact under the active region having a highly reflective mirror, and a barrier layer adjacent the mirror.
06/19/14
20140167012
Organic light-emitting diode device, method for packaging the same and display device
The present invention provided an oled device, a method for packaging the same, and a display device. With the solution of the present invention, it is not necessary to dispose a recess in the package substrate and the cost of production and thickness of the package substrate are decreased.
06/19/14
20140166979
Light-emitting diode with textured substrate
A light-emitting diode (led) device is provided. The led device has raised semiconductor regions formed on a substrate.
06/05/14
20140151078
Method and system for controlling the movement of a mast of a drilling machine, in particular for obtaining piles
The method comprises the following operations: delivering a moving power to at least one linear actuator (1, 7) arranged to move a mast (5) mounted so as to swing with respect to a self-propelled structure (3) among a plurality of moving operating configurations; delivering an actuating power to a winch (8) which is supported by said self-propelled structure (3) and adapted to allow the winding or unwinding of a respective traction element which is constrained to a drilling assembly, in particular a bank of telescopic or kelly bars (12) to which a drilling tool can be associated; at least temporarily preventing a relative axial movement between said drilling assembly (12) and said mast (5) during the passage between at least two consecutive operating configurations; and automatically controlling the delivery of said moving power in a coordinated manner with the delivery of said actuating power when said axial movement is hindered.. .
05/29/14
20140146565
Backlight led structure, backlight and display device
The present invention discloses a backlight led structure, a backlight and a display device. In the backlight led structure, a flange structure is arranged at the upper side of an led bracket which is defined when the led bracket is mounted close to a light guide plate such that the flange structure covers the upper side of the light guide plate when the led structure and the light guide plate are assembled.
05/22/14
20140142252
Self-assembled structures, method of manufacture thereof and articles comprising the same
Disclosed herein is a copolymer comprising a backbone polymer; and a first graft polymer that comprises a surface energy reducing moiety; the first graft polymer being grafted onto the backbone polymer; where the surface energy reducing moiety comprises a fluorine atom, a silicon atom, or a combination of a fluorine atom and a silicon atom.. .
05/22/14
20140142249
Self-assembled structures, method of manufacture thereof and articles comprising the same
Disclosed herein is a graft block copolymer comprising a first block polymer; the first block polymer comprising a backbone polymer and a first graft polymer; where the first graft polymer comprises a surface energy reducing moiety; and a second block polymer; the second block polymer being covalently bonded to the first block; wherein the second block comprises the backbone polymer and a second graft polymer; where the second graft polymer comprises a functional group that is operative to crosslink the graft block copolymer.. .
05/22/14
20140141555
Nanowire led structure and method for manufacturing the same
A light emitting diode (led) structure includes a plurality of devices arranged side by side on a support layer. Each device includes a first conductivity type semiconductor nanowire core and an enclosing second conductivity type semiconductor shell for forming a pn or pin junction that in operation provides an active region for light generation.
05/22/14
20140141538
Methods of characterizing semiconductor light-emitting devices based on product wafer characteristics
Methods of characterizing semiconductor light-emitting devices (leds) based on product wafer characteristics are disclosed. The methods include measuring at least one product wafer characteristic, such curvature or device layer stress.
05/22/14
20140141376
Self-assembled structures, method of manufacture thereof and articles comprising the same
Disclosed herein is a composition comprising a graft block copolymer comprising a first block polymer; the first block polymer comprising a backbone polymer and a first graft polymer; where the first graft polymer comprises a surface energy reducing moiety; and a second block polymer; the second block polymer being covalently bonded to the first block; wherein the second block comprises the backbone polymer and a second graft polymer; where the second graft polymer comprises a functional group that is operative to crosslink the graft block copolymer; a photoacid generator; and a crosslinking agent.. .
05/22/14
20140141375
Self-assembled structures, method of manufacture thereof and articles comprising the same
Disclosed herein is a composition comprising a graft block copolymer comprising a copolymer comprising a backbone polymer; and a first graft polymer that comprises a surface energy reducing moiety; the first graft polymer being grafted onto the backbone polymer; where the surface energy reducing moiety comprises a fluorine atom, a silicon atom, or a combination of a fluorine atom and a silicon atom; a photoacid generator; and a crosslinking agent.. .
05/22/14
20140138620
Nanowire sized opto-electronic structure and method for modifying selected portions of same
A led structure includes a support and a plurality of nanowires located on the support, where each nanowire includes a tip and a sidewall. A method of making the led structure includes reducing or eliminating the conductivity of the tips of the nanowires compared to the conductivity of the sidewalls during or after creation of the nanowires..
05/15/14
20140131723
Laser annealing of gan leds with reduced pattern effects
The disclosure is directed to laser annealing of gan light-emitting diodes (leds) with reduced pattern effects. A method includes forming elongate conductive structures atop either an n-gan layer or a p-gan layer of a gan led structure, the elongate conductive structures having long and short dimensions, and being spaced apart and substantially aligned in the long dimensions.
05/08/14
20140123461
Three dimensional assembly of diamagnetic materials using magnetic levitation
The ability to assemble three-dimensional structures using diamagnetic particles suspended in solutions containing paramagnetic cations is described. The major advantages of this separation device are that: (i) it is a simple apparatus that does not require electric power (a set of permanent magnets and gravity are sufficient for the diamagnetic separation and collection system to work); ii) the assembled structures can be removed from the paramagnetic solution for further processing after fixing the structure; iii) the assembly is fast; and iv) it is small, portable..
05/01/14
20140117401
Nanowire led structure and method for manufacturing the same
A method for ablating a first area of a light emitting diode (led) device which includes an array of nanowires on a support with a laser is provided. The laser ablation exposes a conductive layer of the support that is electrically connected to a first conductivity type semiconductor nanowire core in the nanowires, to form a first electrode for the led device.
05/01/14
20140117307
Nanowire sized opto-electronic structure and method for modifying selected portions of same
A method for treating a led structure with a substance, the led structure includes an array of nanowires on a planar support. The method includes producing the substance at a source and causing it to move to the array along a line.
05/01/14
20140117038
Drug dispensing box and cartridge having mutually coupled structure
Provided is a drug dispensing box and cartridge having a mutually coupled structure. The cartridge disposed on each of floors of a drug dispensing apparatus and connected to each of a plurality of drug dispensing boxes includes a cartridge housing comprising a lower housing supporting the drug dispensing box and a rear housing restricting entry of the drug dispensing box by a predetermined distance, a rail disposed along an entry path of the drug dispensing box on the lower housing; and a first data transmitting/receiving terminal connected to the drug dispensing box to transmit/receive data.
04/17/14
20140105246
Temperature controlled structured asic manufactured on a 28 nm cmos process lithographic node
A temperature control for a structured asic chip, manufactured using a cmos process is shown. A circuit employing temperature feedback using a microprocessor and active heating elements, that in a preferred embodiment uses decoupling cell capacitors, is employed to actively heat a die when the temperature of the die drops below a predetermined minimum temperature, in order to achieve timing closure in the chip..
04/17/14
20140103369
Illumination device
A semiconductor light emitting element includes a transparent substrate and a plurality of light emitting diode (led) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other.
04/17/14
20140103291
Inverted light-emitting diode having plasmonically enhanced emission
An led device having plasmonically enhanced emission is provided. The device includes an inverted led structure with a coating of metal nanoparticles on the surface chosen to match the plasmonic response to the peak emission from the active quantum well (qw) emission region of the led.
04/10/14
20140097532
Thermally enhanced package-on-package (pop)
A method and structure for providing improved thermal management in multichip and package on package (pop) applications. A first substrate attached to a second smaller substrate wherein the second substrate is encircled by a heat ring attached to the first substrate, the heat ring comprising heat conducting materials and efficient heat dissipating geometries.
04/03/14
20140094878
Method for producing a micro-led matrix, micro-led matrix and use of a micro-led matrix
A method for producing a micro-led matrix by (a) depositing an led layer structure onto a working substrate; (b) singulating a plurality of led structures from the led layer structure on the working substrate; (c) applying a first contact-making structure to a carrier substrate; and (d) transferring the plurality of led structures from the working substrate to the carrier substrate by bonding and laser lift-off. An at least two-layered carrier substrate is used, including a carrier layer and a first flexible polymer layer, in step c the first contact-making structure is applied indirectly or directly to a side of the first polymer layer which faces away from the carrier layer, and in an additional method step d-0 between method steps c and d, a second flexible polymer layer is formed at least between the singulated led structures.
04/03/14
20140091476
Directed self assembly of block copolymers to form vias aligned with interconnects
A method of an aspect includes forming an interconnect line etch opening in a hardmask layer. The hardmask layer is over a dielectric layer that has an interconnect line disposed therein.
03/27/14
20140087505
Light-emitting diodes on concave texture substrate
A semiconductor device having light-emitting diodes (leds) formed on a concave textured substrate is provided. A substrate is patterned and etched to form recesses.
03/27/14
20140085710
Wavelength conversion element and manufacturing method thereof
A wavelength conversion element includes a core formed of a ferroelectric crystal having a periodically poled structure in which first and second domains having mutually inverted directions of spontaneous polarization are alternately aligned side by side, and a cladding covering all side surfaces of the core along a light propagation direction and having a uniform refractive index. Boundary surfaces of the first and second domains are arranged in a non-parallel manner with respect to the light propagation direction..
03/13/14
20140073075
Method for separating light-emitting diode from a substrate
A method for separating a light-emitting diode (led) from a substrate comprises the following steps. First, a substrate is provided which includes a junction surface and a bottom surface far away from the junction surface.
03/13/14
20140072922
Opening and closing device of autoclave, and autoclave
The present invention relates to an opening and closing device of an autoclave and the autoclave, wherein: supplying and discharging of a product to a chamber having a sealed structure can be performed automatically, and the occurrence of accidents caused by back pressure is structurally prevented; and a product bonded by pre-load is heated and transferred whereby energy loss is minimized and the product is cooled off uniformly, thereby improving the quality of the product. According to the present invention, an opening and closing device of an autoclave comprises: a front opening and closing unit (20) which is mounted on an outer side of a front part of a square container-shaped chamber (10) having a chamber inlet port (14) through which a product is inserted; a rear opening and closing unit (40) which is mounted on an outer side of a chamber outlet port (15) formed on the rear side part of said chamber (10) such that said product is discharged; and an opening and closing means which respectively opens and closes, by internal pressure of said chamber (10), a product inlet port (22) and a product outlet port (42) that are respectively formed in said front opening and closing unit (20) and said rear opening and closing unit (40)..
03/13/14
20140069111
Thermoelectric-enhanced air and liquid cooling of an electronic system
Thermoelectric-enhanced air and liquid cooling of an electronic system is provided by a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array.
03/13/14
20140068943
Thermoelectric-enhanced air and liquid cooling of an electronic system
Thermoelectric-enhanced air and liquid cooling of an electronic system is facilitated by providing a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array.
03/06/14
20140065743
Method of manufacturing light emitting diode die
An exemplary method of manufacturing a light emitting diode (led) die includes steps: providing a preformed led structure, the led structure including a first substrate, and a nucleation layer, a buffer layer, an n-type layer, a muti-quantum well layer and an p-type layer formed successively on the first substrate; forming at least one insulation block on the p-type layer; forming a mirror layer on the on the p-type layer and covering the insulation block; forming a conductive second substrate on the mirror layer; removing the first substrate, the nucleation layer and the buffer layer and exposing a bottom surface of the n-type layer; and disposing one n-electrode on the exposed surface of the n-type layer. The n-electrode is located corresponding to the insulation block..
03/06/14
20140062255
Piezoelectric apparatuses, systems and methods therefor
Various aspects as described herein are directed to piezoelectric materials. As consistent with one or more embodiments, an apparatus includes a nanomaterial and structures coupled to the nanomaterial.
03/06/14
20140061694
Method for producing a thin-film semiconductor body and thin-film semiconductor body
A method for producing a thin-film semiconductor body is provided. A growth substrate is provided.
03/06/14
20140061688
Led structure
A light emitting diode (led) structure comprises a first dopant region, a dielectric layer on top of the first dopant region, a bond pad layer on top of a first portion the dielectric layer, and an led layer having a first led region and a second led region. The bond pad layer is electrically connected to the first dopant region.
03/06/14
20140059789
Apparatus for cleaning a semiconductor substrate
An apparatus for processing a substrate is provided. The apparatus includes a solid material having a support side and a contact side.
02/20/14
20140051925
Filter switching device for fluorescence endoscopic television camera system
The present invention provides a filter switching device for a fluorescence endoscopic television camera system, which is configured to conveniently switch filters according to the rotational movement of the camera head, by inducing a change of magnetic forces according to the rotation of the camera head by magnetic substances disposed therein while maintaining a sealed structure inside the camera head connecting between a fluorescence endoscope and a television camera and thus allowing the frame of the camera head mounted with two types of filter to move upward and downward.. .
02/20/14
20140051038
Method of creating an accurate bone and soft-tissue digital dental model
A method of creating a 3-d anatomic digital model for determining a desired location for placing at least one dental implant in a patient's mouth. The method comprises the act of obtaining a first dataset associated with hard tissue of the patient's mouth.
02/20/14
20140047758
Fishing pole mount apparatus
An adjustable fishing pole holder system which is adaptable to temporarily but securely mount on a variety of receiving structures is described. The adjustable fishing pole holder system of the invention may be mounted on horizontal structures of various cross-sections such as the hand rails of bridges, catwalks, jetties or similar structures.
02/13/14
20140045143
Method of creating an accurate bone and soft-tissue digital dental model
A method of creating a 3-d anatomic digital model for determining a desired location for placing at least one dental implant in a patient's mouth. The method comprises the act of obtaining a first dataset associated with hard tissue of the patient's mouth.
02/13/14
20140041894
Extension wire socket assembled structure having safety see-saw switch disposed from inside out
The invention relates to an extension wire socket assembled structure, and more particularly to a safety see-saw switch with an embedded electrical connection device for the extension wire socket having safety see-saw switch disposed from inside out. The present invention is a two-in-one molded structure.
02/06/14
20140038816
Methods for preparing and using metal and/or metal oxide porous materials
Disclosed are methods for producing carbon, metal and/or metal oxide porous materials that have precisely controlled structures on the nanometer and micrometer scales. The methods involve the single or repeated infiltration of porous templates with metal salts at controlled temperatures, the controlled drying and decomposition of the metal salts under reducing conditions, and optionally the removal of the template.
02/06/14
20140034976
Light-emitting diode structure and method for manufacturing the same
A light-emitting diode (led) structure and a method for manufacturing the same. The led structure includes an insulation substrate, a plurality of led chips and a plurality of interconnection layers.
02/06/14
20140034246
Methods and system for producing on-demand reduction in coupling strength of pressure-sensitive adhesives
The systems and methods of the present disclosure relate to safely coupling and decoupling various solid objects with the use of pressure-sensitive adhesive. In particular, the disclosure relates to methods and systems for delivering vibrational energy to a pressure-sensitive coupled structure, sufficient to decrease coupling strength of the pressure-sensitive adhesive as well as to de couple or reposition the coupled objects..
01/09/14
20140011027
Graphene conjugate fiber and method for manufacturing same
The present invention relates to a graphene conjugate fiber and a method for manufacturing same, and more particularly, to a conjugate fiber including graphene and a polymer, wherein a wrinkled structure of the graphene is maintained in a fiber state. The graphene conjugate fiber manufactured thereby has superior mechanical properties, is flexible, and has high utility by being manufactured as a fiber..
01/02/14
20140004344
Graphene fiber and method for manufacturing same
The present invention relates to a method for manufacturing a graphene fiber and a graphene fiber manufactured thereby, comprising the following steps: a) preparing a dispersion liquid by dispersing graphene with a surfactant in a solvent; b) preparing a composite fiber by mixing the dispersion liquid with a polymer solution, wet spinning and drying same; and c) removing polymers by heat-treating or treating the composite fiber with strong acid. The graphene fiber manufactured by the method has superior electric and mechanical properties, is flexible, and can be utilized as a storage medium for energy, hydrogen, etc.


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Led Structure topics: Led Structure, Semiconductor, Oled Structure, Conductive Elements, Transverse, Epitaxial Growth, Defect Density, Engageable, Fluorescence, Pathologic, Transport Layer, Organosiloxane, Block Copolymer, Mobile Computing Device, Software As A Service

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