|| List of recent Led Chip-related patents
| Light emitting apparatus, and light irradiation apparatus provided with light emitting apparatus|
A light emitting device (1) includes (i) a surface-mounted light emitting section (10a), (ii) a lens section (30) which is provided on a light exit side of the surface-mount light emitting section (10a), and (iii) a frame section (40) which fixes a periphery of the lens section (30). In the surface-mounted light emitting section (10a), a resin layer (17) that contains a red fluorescent material (17b) covers at least one (1) blue led chip (14a).
| Light emitting device, light emitting element mounting method, and light emitting element mounter|
Disclosed is a light emitting device including: a light emitting element including an led chip and a phosphor layer provided at the light emitting side of the led chip; and a substrate on which the light emitting element is bonded by an adhesive material. The adhesive material is an anisotropic conductive material..
| Light emitting diode backlight module|
A light emitting diode (led) backlight module includes a transparent conductive substrate that has an electrode-bearing surface and a plurality of transparent conductive electrodes disposed on the electrode-bearing surface, an led chip that is welded on the transparent conductive electrodes by flip-chip packaging techniques, and a reflecting member that is spaced apart from and that corresponds in position to the led chip so as to reflect light generated from the led chip to the transparent conductive substrate.. .
| Light emitter components and methods having improved performance|
Light emitter components and methods having improved performance and related methods are disclosed. In one embodiment, a light emitter component can include a submount and at least one light emitting diode (led) chip disposed over the submount.
| Lighting device, backlight module and illumination module|
Various examples of a lighting device, backlight module and illumination module are described. A lighting device includes a carrier component, an led chip, a thermistor, and a plurality of metal wires.
A semiconductor device has a first controlled chip, including a first replica output circuit having the same configuration as a first output circuit, a first zq terminal connected to the first replica output circuit, a first through electrode connected to the first zq terminal, and a first control circuit which sets the impedance of the first replica output circuit. A control chip includes a second zq terminal connected to the first through electrode, a comparator circuit which compares a voltage of the second zq terminal with a reference voltage, and a second control circuit 123 which performs a process based on a comparison by the comparator circuit.
|Led chip resistant to electrostatic discharge and led package including the same|
A light emitting diode chip and a light emitting diode package including the same. The light emitting diode chip includes a substrate, a light emitting diode section disposed on the substrate, an inverse parallel diode section disposed on the substrate and connected inversely parallel to the light emitting diode section.
An led module has an electrically insulating main body, a base surface and a mounting surface located opposite the base surface. A number of electrical connection contacts are arranged at the mounting surface.
|Led chip and method for manufacturing the same|
The invention provides a substrate structure used for manufacturing a light-emitting diode and a method for manufacturing the light-emitting diode. The substrate structure includes a substrate having a first surface and a second surface opposite to the first surface and a plurality of grooving structure formed on the first surface of the substrate.
A light-emitting device includes a plurality of led chips arranged in series and each including a chip substrate and a crystal layer including a light-emitting layer. One of the plurality of led chips is configured such that the chip substrate thereof includes a side surface facing another adjacent led chip of the plurality of led chips.
An led device is disclosed in which an led chip is encapsulated in a encapsulant. The led device includes an led chip mounted on a support and electrically connected and an encapsulant encapsulating the led chip, wherein the encapsulant is a transparent amorphous solid made of a metal oxide, and the solid contains as a major component at least one metal oxide selected from the group consisting of al2o3, mgo, zro, la2o3, ceo, y2o3, eu2o3, and sco..
|Application-specific led module and associated led point source luminaires|
Led downlight and other point source luminaires contain one or more application-specific led modules with integrated optical, mechanical, and heat dissipation systems; a fluted extruded metal housing acts as a heat sink as well as the luminaire housing containing the as-led module(s) or receiving a rotatable spherical housing that contains the as-led module, printed circuit board units, and wires; mounting brackets; and a remote led driver. The extruded aluminum housing (and heat sink) may be comprised of a single cylinder or multiple concentric cylinders.
|Light emitting device and display device|
There are provided a light-emitting device for use in a backlight unit of a display apparatus equipped with a display panel, which can be made lower in profile and is capable of applying light to the display panel with uniformity in the brightness of the display panel in the planar direction of the display panel, as well as a display apparatus equipped with the light-emitting device. A backlight unit includes a printed substrate, a plurality of light-emitting sections each having a base support, an led chip and a lens, and a reflective member surrounding the light-emitting section.
|Light-emitting apparatus and method for manufacturing same|
A light-emitting apparatus including: a substrate; an led chip mounted on a first surface of the substrate; a fluorescent material-containing layer containing a first fluorescent material, which fluorescent material-containing layer is provided above the first surface of the substrate so as to cover the led chip; and a color-adjusting fluorescent layer that contains a second fluorescent material, which color-adjusting fluorescent material layer is formed in a layer provided on an outer side of the fluorescent material-containing layer in an emission direction, the color-adjusting fluorescent layer being formed in dots. Thus, the present invention provides a light-emitting apparatus and a method for manufacturing the same, each making it possible to carry out fine color adjustment so as to prevent a subtle color shift that occurs due to a factor such as a difference in concentration of a fluorescent material or the like..
|Method for manufacturing light emitting diode package having a voltage stabilizing module consisting of two doping layers|
A method for manufacturing an led (light emitting diode) package comprises following steps: providing an electrically insulated base, the base having a first surface and a second surface opposite thereto; an annular voltage stabilizing module is formed on the first surface; a first electrode is formed on the first surface, wherein the first electrode is attached to and encircled by the voltage stabilizing module; a second electrode is formed on the first surface, wherein the second electrode is attached to and encircles the voltage stabilizing module; an led chip is mounted on the first electrode, wherein the led chip is electrically connected to the first and second electrodes, and the led chip and the voltage stabilizing module are connected in reverse parallel. Finally, an encapsulative layer is brought to encapsulate the led chip..
|Heat sink module and omnidirectional led lamp holder assembly using same|
An omnidirectional led lamp holder assembly includes a heat sink module including a heat sink base and radiation fins around the heat sink base, a lampshade and an electrical connector respectively mounted at opposing top and bottom sides of the heat sink module. The heat sink base is a one-piece extruded member defining a tubular heat-transfer base portion, a broad platform and a hollow protruding mount for holding led chips at different angles.
|Wafer leveled chip packaging structure and method thereof|
A wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias.. .
|Led package and metallic frame thereof|
A light emitting diode package includes a metallic frame, and an led chip disposed on the metallic frame. The metallic frame includes first and second metal plates arranged side by side with a space therebetween, and two support arms extending integrally and respectively from two opposite ends of the second metal plate to a level higher than the second top surface and that further extend toward the first metal plate at a level higher than the first top surface crossing the space.
|Submount-free light emitting diode (led) components and methods of fabricating same|
Light emitting devices include a light emitting diode (led) chip having an anode contact and a cathode contact on a face thereof. A solder mask extends from the gap between the contacts onto one or both of the contacts.
|Light emitting devices and methods|
Light emitting devices and methods such as light emitting diodes (leds) are disclosed for use in higher voltage applications. Variable arrangements of leds are disclosed herein.
|Light emitter devices and methods for light emitting diode (led) chips|
Light emitter devices for light emitting diodes (led chips) and related methods are disclosed. In one embodiment a light emitter device includes a substrate and a chip on board (cob) array of led chips disposed over the substrate.
|Gan type light emitting diode device and method of manufacturing the same|
The present invention relates to a gan type led device and a method of manufacturing the same. More particularly, there are provided a gan type led device including an led chip; and a submount eutectic-bonded with the led chip through an adhesive layer, wherein the adhesive layer is configured by soldering a plurality of metallic layers in which a first metallic layer and a second metallic layer are sequentially stacked, and the second metallic layer is formed in a paste form.
|Resin application apparatus, optical property correction apparatus and method, and method for manufacturing led package|
A resin application apparatus includes: an optical property measurement unit measuring an optical property of light emitted from a light emitting diode (led) chip which is mounted on a package body and to which transparent resin is not applied; and a resin application unit applying light conversion material-containing transparent resin to the led chip in accordance with a resin application amount which is decided depending on the optical property measured by the optical measurement unit.. .
|Light-emitting device and method for compensating chromaticity of light-emitting device|
An object of the present invention is to provide a light-emitting device having a temperature compensation function implemented with simple circuitry, and a method of temperature compensation in such a light-emitting device. More specifically, the invention provides a light-emitting device and a method of temperature compensation using a light-emitting device, wherein the light-emitting device includes a substrate, a first led chip which is arranged on the substrate, and which has a characteristic such that Δx and Δy, each representing an amount of displacement on an xy chromaticity diagram, both are negative as temperature rises, and a second led chip which is arranged on the substrate, and which has a characteristic such that Δx and Δy, each representing an amount of displacement on an xy chromaticity diagram, both are positive as temperature rises..
|Led illuminator apparatus, using multiple luminescent materials dispensed onto an array of leds, for improved color rendering, color mixing, and color temperature control|
An led array includes three or more strings of bare leds mounted in close proximity to each other on a substrate. The strings of leds emit light of one or more wavelengths of blue, indigo and/or violet light, with peak wavelengths that are less than 490 nm.
|Phosphor-containing sheet, led light emitting device using the same, and method for manufacturing led|
A phosphor-containing sheet having a storage modulus of 0.1 mpa or more at 25° c. And a storage modulus of less than 0.1 mpa at 100° c., wherein a resin main component of the phosphor-containing sheet is a crosslinked product formed by subjecting a crosslinkable silicone composition containing a specific composition to a hydrosilylation reaction.
|Led lighting assembly and an led retrofit lamp having the led lighting assembly|
An led lighting assembly may include a printed circuit board with an led chip, and a heat sink thermally conducted with the printed circuit board, wherein the led lighting assembly further comprises a light guide body configured as a bulb, the light guide body having an end surface as a light incidence surface of light from the led chip, an outer surface as a light emergent surface and an inner surface, wherein the inner surface is structured so as to form a reflecting surface, reflecting at least part of light from the end surface to the outer surface.. .
A led module includes a substrate, a led chip supported on the substrate, a metal wiring installed on the substrate, the metal wiring including a mounting portion on which the led chip is mounted, an encapsulating resin configured to cover the led chip and the metal wiring, and a clad member configured to cover the metal wiring to expose the mounting portion, the encapsulating resin arranged to cover the clad member.. .
|Light emitting diode package and method for manufacturing the same|
An led package includes a lens, an led chip securely received and engaged in the lens, and a base with an electrode assembly thereon. A bottom surface of the led chip is bare.
|White led apparatus|
Provided is a white led device. The white led device includes a blue led chip configured to emit blue light of a wavelength range of about 440 nm to 490 nm, a yellow phosphor formed on the blue led chip and excited by the blue light to emit yellow light of a wavelength range of about 560 nm to 615 nm, a green led chip configured to emit green light of a wavelength range of about 500 nm to 560 nm, and a red phosphor formed on the green led chip and excited by the green light to emit red light of a wavelength range of about 615 nm to about 670 nm..
|Package-free and circuit board-free led device and method for fabricating the same|
The present invention discloses a package-free and circuit board-free led device and a method for fabricating the same. The led device is exempted from the semiconductor package substrate and the printed circuit board and comprises at least one led chip having two electrodes able to directly connect with external wires and at least one chip unit.
|White light emitting diodes package containing plural blue light-emitting diodes|
A white light-emitting diode (led) package containing plural blue led chips is disclosed. The white led package includes a transparent plate, plural blue led chips bonded on a front surface of the transparent plate, a front fluorescent glue layer covering the plural blue led chips, and a rear transparent glue layer covering a rear surface of the transparent plate and located at a position aligned with the front fluorescent glue layer.
|Composite high reflectivity layer|
A high efficiency light emitting diode with a composite high reflectivity layer integral to said led to improve emission efficiency. One embodiment of a light emitting diode (led) chip comprises an led and a composite high reflectivity layer integral to the led to reflect light emitted from the active region.
|Wavelength conversion chip for a light emitting diode, and method for manufacturing same|
There is provided a method of manufacturing a wavelength converted led chip, including attaching a plurality of led chips to a chip alignment region of an upper surface of a temporary support plate, forming a conductive bump on the electrode of the respective led chips, forming a phosphor-containing resin encapsulation part in the chip alignment region to cover the conductive bump, polishing the phosphor containing resin encapsulation part, forming the wavelength converted led chips by cutting the provided phosphor containing resin encapsulation part between the led chips, the wavelength converted led chip including a wavelength conversion layer obtained from the phosphor containing resin encapsulation part and formed on lateral surfaces and an upper surface of the wavelength converted led chip, and removing the temporary support plate from the wavelength converted led chip.. .
|Light emitting device|
The light emitting device (10a) includes an led chip (12) and a ceramic support body (14) where the led chip (12) is placed. The ceramic support body (14) includes a placement surface (14d) where the led chip (12) is placed, internal terminals (22a, 22b) disposed on the placement surface (14d), a back surface (14c) that face the placement surface (14d), a mounting surface (14b) between the placement surface (14d) and the back surface (14c), and external terminals (28a, 28b) disposed on the mounting surface (14b).
|Led device having improved luminous efficacy|
There are provided a light emitting diode (led) device including an led chip emitting light within a specific wavelength region, a transparent resin layer covering a light emission surface of the led chip, and a color conversion layer formed to be spaced apart from the led chip by the transparent resin layer to cover the transparent resin layer and including at least one type of phosphor converting light emitted from the led chip into light within a different wavelength region, wherein a mean free path of phosphor particles included in the color conversion layer is 0.8 mm or more at a temperature of 5500 k.. .
|Light emitting diode device and method for manufacturing heat dissipation substrate|
The light emitting diode (led) device includes a substrate formed with at least one electrode; an led chip disposed on the substrate, and formed with at least one solder pad; at least one wire electrically connected between the solder pad and the electrode; and a fluorescent material layer covering the led chip. Thermal conductivity of the substrate is 80˜120 w/mk and a color rendering index of the led device under correlated color temperatures 2600k˜3700k is greater than 90..
|Light emitting device|
A light emitting device includes: a ceramic substrate; a plurality of led chips; a printed resistor(s) connected in parallel with the plurality of led chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of leds, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency..
|Light-emitting device and luminaire|
A light-emitting device and a luminaire that can reduce glare are provided. A light-emitting device according to an embodiment includes a substrate, an led chip mounted on the lower surface of the substrate, a light reflecting member arranged downward and on one side when viewed from the led chip and opened on the other side, a surface of the light reflecting member opposed to the led chip being a light reflecting surface, and an optical member configured to guide light emitted from the led chip and reflected by the light reflecting member downward..
|Light emitting module|
In a light emitting module, a red phosphor is contained in a second phosphor layer so that the wavelength of a second phosphor layer after the wavelength conversion is longer than that of a first phosphor layer. And a blue phosphor and a yellow-green phosphor are contained in the first phosphor layer.
|Light emitting semiconductor structure|
The invention provides a light emitting semiconductor structure, which includes a substrate; a first led chip formed on the substrate; an adhesion layer formed on the first led chip; and a second light emitting diode chip formed on the adhesion layer, wherein the second led chip has a first conductive wire which is electrically connected to the substrate.. .
|Method of manufacturing light emitting device and spray coating machine|
A method of manufacturing a light emitting device, using a spray coating method, a fluorescent material can be easily adhered on corner portions and side surfaces of an led chip, a lens-shaped light transmissive resin member surface, an optical lens surface, etc., and a spray coating machine used in the method. The method includes mounting an led chip on a substrate member, applying a spray coating to a coating object including the led chip by spraying a powder-containing solution.
|Outdoor led lamp with heated cover|
An outdoor led lamp assembly includes a light transmissive cover disposed over at least one led chip of the lamp assembly. A heating element is provided for providing heat to the cover.
|Systems and methods for a light emitting diode chip|
Provided is a light emitting diode (led) chip. The led chip includes a substrate and a mesa structure formed from a heterostructure grown on the substrate.
|Light emitting diode package|
An led package includes a substrate, an led chip arranged on the substrate, and a light transmission layer arranged on a light output path of the led chip. The substrate includes a first electrode and a second electrode separated and electrically insulated from the first electrode.
The present invention provides an illumination apparatus. The illumination apparatus comprises a body having a lower portion coupled to a standard metallic lamp adaptor and an upper portion; a light source module comprising an led array of led chips connected in series, a phosphor powder layer encapsulating the led chips, and a pair of conductive wires electrically connected to the led chips for transmitting electric power to the led chips; and a transparent housing coupled to the upper portion of the body, so that the led chips are enveloped within the transparent housing..
|Led chip unit and manufacturing method thereof, and led module|
An led chip unit and manufacturing method thereof, a led module, an illuminating device and a display device. The led chip unit includes a plurality of led cores which are electrically isolated from each other.
|Light-emitting module board and manufacturing method of the light-emitting module board|
A light-emitting module board includes a metal board provided with an insulating layer, a light-emitting part and a white insulating film. The light-emitting part includes plural led chips mounted on the metal board, and a white reflecting film of a ceramic coating formed in a light-emitting area on the metal board on which the plural led chips are mounted.
|High-voltage flip-chip led structure and manufacturing method thereof|
A high-voltage flip-chip led structure and a manufacturing method thereof are disclosed. The manufacturing method includes: providing a die substrate, depositing a first passivation layer, forming a co-electrical-connecting layer, depositing a second passivation layer, depositing a mirror layer, forming two conductive tunnels by etching, and providing two connecting metal layers.
|Light-emitting diode manufacturing method|
A light-emitting diode manufacturing method comprises steps of: providing a flexible material layer having a flexible reflective layer and phosphor glue in the flexible reflective layer; providing a hard material layer having a substrate and an led chip on the substrate; combining the flexible material layer and the hard material layer together wherein the led chip inserts into the phosphor glue and is surrounded by the flexible reflective layer; and solidifying the flexible reflective layer and the phosphor glue to form a reflective cup and a phosphor layer, respectively.. .
|Method for manufcturing light emitting diode package|
A method for manufacturing an led package comprising following steps: providing a substrate and an led chip mounted on the substrate; providing glue and arranging the glue on a periphery of the substrate and drying the glue to form a blocking loop to enclose the led chip therein; and injecting the glue in the blocking loop, and drying the glue to form a packaging layer to encapsulate the led chip therein. Light emitted from the led chip travels through a top surface of the packaging layer, a periphery of the packaging layer, and the blocking loop to illuminate..
|Method for dispensing glue on led chip|
A method for dispensing glue on an led chip includes following steps: providing a glue dispensing device which includes a syringe, a needle head communicating with the syringe, and a valve mounted on the needle head for controlling flowing of content in the syringe out of the syringe, wherein the valve has an aperture, and a diameter of the aperture is adjustable; providing glue and injecting the glue into the syringe; providing an led chip which is mounted a circuit board and orientating the needle head of the glue dispensing device towards the led chip, wherein the needle head is spaced from the led chip, and the diameter of the aperture of the valve is adjusted to a predetermined size; squeezing the glue out of the syringe under a predetermined pressure and a predetermined time, wherein the glue dispensed on the led chip forms an encapsulation structure.. .
|Led module and method for manufacturing the same|
An led module includes an led unit having an led chip, a lens covering the led chip, and a diffusing film. The lens includes a light-incident face facing the led chip, a light-emitting face opposite to the light-incident face, and a connecting face connecting the light-incident face to the light-emitting face.
|Light emitting module and light source device|
A light emitting module is a light emitting module including a substrate, a first area in which led chips are mainly arranged and mounted in a longitudinal direction of the substrate in an area on one side of the longitudinal direction, a second area in which non-light emitting components are mainly mounted in an area on another side of the longitudinal direction of the substrate and a notch portion which is between the first area and the second area and formed on the substrate. The non-light emitting components are mountable across the notch portion between the first area and the second area.
|Light emitting diode light bar for use in a backlight module|
An led (light emitting diode) light bar is for use as a light source of a backlight module of an lcd (liquid crystal display). The led light bar includes a printed circuit board having a circuit therein, a plurality of led chips located on the printed circuit board and an encapsulation layer sealing the plurality of led chips.
|Aligning module and method for assembling light-emitting diode with lens using the same|
An exemplary aligning module for aligning a lens with a light-emitting diode (led) chip includes a controlling module, a first image sensing module and a second image sensing module controlled by the controlling module, and a gripping module controlled also by the controlling module. The controlling module controls the first image sensing module and the second image sensing module to sense the light center of the led chip and the geometric center of the lens, respectively.
|Led device and liquid crystal display device|
An led device includes an led chip, a fluorescent layer and a lens. The fluorescent layer has phosphor powder diffused therein.
|Backlight unit and liquid crystal display device including the same|
A backlight unit according to an embodiment includes: a light guide plate; a light emitting diode (led) assembly supplying a light to the light guide plate; and a reflecting plate under the light guide plate, wherein the led assembly includes: an led printed circuit board (pcb) disposed at a side of the light guide plate; a plurality of led chips over the led pcb, the plurality of led chips spaced apart from each other; a plurality of first lead frames electrically connecting the led pcb and the plurality of led chips; and an led housing surrounding the plurality of led chips and the plurality of first lead frames.. .
|Led light assembly and system|
An led based light assembly and lighting system is disclosed. The lighting system includes at least one light assembly comprising a plurality of led chips, a controller and a power supply module.
|Automotive headlamp apparatus|
An automotive headlamp apparatus includes a light source, in which a plurality of led chips are arranged at intervals from each other, and a projection lens for projecting the light, emitted from the light source, toward a front area of a vehicle as a light source image. The semiconductor light-emitting elements may be located within than a focal point of the projection lens.
|Led package structure, dam structure thereof, and method of manufacturing led package thereof|
An led package structure includes a carrier mounted with a plurality of led chips, a first glue-layer, a second glue-layer and an encapsulation resin filled within the first and the second glue-layers. The first glue-layer is formed on a top surface of the carrier and has a thin-film structure which is substantially flat on a top surface thereof.
|Light emitting diode|
An led includes an led chip, a substrate, a first electrode and a second electrode formed on the led chip, and a first solder layer and a second solder layer formed on a top face of the substrate. The first solder layer is soldered on the first electrode and sandwiched between the led chip and the substrate.
|Led chip unit with current baffle|
An led chip unit includes a base and a chip mounted on the base. The chip includes a substrate, a first semiconductor layer, a light emitting layer, a second semiconductor layer and an electrode.
|Led chip with groove and method for manufacturing the same|
An led chip includes a substrate and an epitaxy structure formed on the substrate. The epitaxy structure includes a first semiconductor layer, a light emitting layer and a second semiconductor layer.
|Light emitting diode package|
An led package includes a first electrode, a second electrode, a reflecting cup connecting the first electrode and the second electrode, and an led chip. The first electrode includes a first main portion and a first connecting portion extending outwardly from the first main portion.
|Light emitting diode package|
An led package includes a first electrode, a second electrode electrically insulated from the first electrode, a reflecting cup connecting the first electrode and the second electrode, and an led chip. The first electrode includes an elongated first main portion and a first connecting portion bending downwardly from an end of the first main portion.
|Light emitting diode package with light reflecting cup internally slanted|
An exemplary led package includes a base, electrodes formed on the base, an led chip electrically connecting the electrodes, and a reflecting cup mounted on the base and surrounding the led chip therein. The reflecting cup includes a bottom surface and an inner surface recessed up from the bottom surface and slantwise oriented towards a top end of the reflecting cup.
|Method for manufacturing light emitting diode package|
A method for manufacturing an led package includes following steps: providing a eutectic bonding apparatus comprising a heating device, a supporting platform located in the heating device, and a nozzle; providing a resistance measuring device comprising a probe, an electrical power, and a controlling unit; providing an led chip; providing a substrate and positioning the substrate on the supporting platform of the eutectic bonding apparatus; moving the nozzle to catch the led chip onto the substrate; and heating the substrate and the led chip to form a eutectic bonding process. The probe of the resistance measuring device is electrically connected to the led chip, a total resistance of the led chip and the substrate is measured by the resistance measuring device in real-time, when the total resistance is equal to a predetermined value, the heating device is ordered to stop heating by the controlling unit..
|Lens and led lamp having the same|
A light emitting diode (led) lamp includes a base, led chips mounted on base, and a lens covering the led chips and engaging with the base. The lens includes an arc-shaped engaging portion, and an extending portion extending from a radial outer side of a top surface of the engaging portion with a radial inner side of the top surface of the engaging portion exposed.
|Light emitting diode module with heat-conducting poles|
An exemplary light-emitting diode (led) module includes a base, a substrate arranged on the base, and led chips mounted on the substrate. Through holes are defined in the substrate.
|Light emitting diode having a plurality of heat conductive columns|
An led (light emitting diode) includes a substrate, a first electrode and a second electrode located on the substrate, and an led chip electrically connected to the first electrode and the second electrode. The substrate includes a ceramic plate and a plurality of metallic heat conductive columns inserted in an interior of the plate.
|Light emitting device and manufacturing method for the same|
The present invention provides a light emitting device, which includes a light emitting diode (led) chip, a wavelength conversion plate including a fluorescent substance and disposed on a light output surface side of the led chip, and a sub heat radiation path formed to radiate heat of the wavelength conversion plate. The sub heat radiation path includes a transparent heat-conductive film provided on a surface of the wavelength conversion plate, a heat radiator provided in the vicinity of the led chip, and a thermal connection member that thermally connects the transparent heat-conductive film to the heat radiator..
|Light source module|
A light source module includes a substrate, at least two light emitting diode (led) chips and at least one dummy chip. The led chips are disposed on the substrate.
|Led module with separate heat-dissipation and electrical conduction paths, and related heat dissipation board|
A led module with separate heat-dissipation and electrical conduction paths is disclosed, having a metal substrate; a plastic layer, comprising one or more hollow regions, and attached to the metal substrate; one or more conducting elements attached to the plastic layer; one or more led chips positioned in the one or more hollow regions of the plastic layer and directly attached to the metal substrate; and a plurality of conducting wires for electrically connecting the one or more conducting elements and the one or more led chips; wherein inner sides of the one or more hollow regions comprise one or more inclined surfaces each having an included angle with an upper surface of the metal substrate, and the included angle is between 90-180 degrees.. .
|Led structure with enhanced mirror reflectivity|
Embodiments of the present invention are generally related to led chips having improved overall emission by reducing the light-absorbing effects of barrier layers adjacent mirror contacts. In one embodiment, a led chip comprises one or more leds, with each led having an active region, a first contact under the active region having a highly reflective mirror, and a barrier layer adjacent the mirror.
|Led chip packaging structure, its manufacturing method, and display device|
A led chip packaging structure, its manufacturing method, and a display device are disclosed. A conductive unit is formed at two opposite sides of a led chip unit, and comprises a first conductive layer formed at a side of, and electrically connected to, a first electrode, a second conductive layer formed at a side of, and electrically connected to, a second electrode, and an intermediate isolation layer formed at a side of a gan layer.