|| List of recent Led Chip-related patents
| Light emitting element and illumination device thereof|
A light emitting element includes a transparent substrate and a plurality of light emitting diode (led) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other.
| Led lighting device|
An led lighting device at least comprises a base made of metal materials; a substrate which is disposed on a surface of the base and has one electrode and at least one led chip; and an insulation sheet which is disposed between the base and the substrate. The insulation sheet and the substrate satisfy the correlations l2+2×t≧l1+2×cr, w2+2×t≧w1+2×cr and cr≧1.6 mm.
| Light emitting apparatus|
The present invention relates to a light emitting apparatus comprising at least one light emitting device and a support mechanism. The light emitting device includes a transparent substrate which light can pass through; at least one led chip emitting light omni-directionally is disposed on one surface of the substrate, and the light emitted by the led chip will penetrate into the substrate and at least partially emerge from another surface of the substrate.
| Light source module|
A light source module includes a substrate, a first illumination element, a second illumination element and a third illumination element. The first illumination element includes a blue led chip disposed on the substrate and a first wavelength converting layer that covers the blue led chip, in which blue light emitted from the blue led chip can be converted to light in the range of a first wavelength.
| Light-emitting device|
A light-emitting device includes a face-up type led chip formed rectangular in a top view, and a rectangular parallelepiped-shaped sealing portion to seal the led chip. An angle formed between a side surface of the led chip and a side surface of the sealing portion in the top view is 45±17°, and a portion of light emitted from the led chip is emitted from the side surface of the sealing portion..
| Light emitting device|
The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one led chip emitting light omni-directionally. Wherein the led chip is disposed on one surface of the substrate and the light emitting angle of the led chip is wider than 180°, and the light emitted by the led chip will penetrate into the substrate and at least partially emerge from another surface of the substrate.
| Sapphire substrate configured to form light emitting diode chip providing light in multi-directions, light emitting diode chip, and illumination device|
A sapphire substrate configured to form a light emitting diode (led) chip providing light in multi-directions, a led chip and an illumination device are provided in the present invention. The sapphire substrate includes a growth surface and a second main surface opposite to each other.
| High voltage light emitting diode package and method for manufacuting the same|
A high voltage led package includes a substrate and led chips formed on a top surface of the substrate. A periphery of each led chip is roughened.
A vehicular lamp has a light source unit having an led and an optical element that performs light distribution control for directing light from the led in a predetermined direction, a heat sink to which the light source unit is attached, and a lamp chamber in which the light source unit is disposed. The led is an led module formed by installing an led chip on a power supply circuit board.
|Led illumination device having a first led chip and a second led chip, and a method for the production thereof|
An led illumination device (10) having a first led chip (1) and a second led chip (2) is described, wherein the first led chip (1) is suitable to emit radiation having a first emission characteristic (a1) and the second led chip (2) is suitable to emit radiation having a second emission characteristic (a2). The first emission characteristic (a1) and the second emission characteristic (a2) have temperature-dependent changes (Δa1t, Δa1t), wherein the temperature-dependent change (Δa1t) in the first emission characteristic (a1) and the temperature-dependent change (Δa2t) in the second emission characteristic (a2) are, in operation, at least partially compensated for or are synchronised with respect to each other such that the chromaticity co-ordinate remains stable.
|White nanoled without requiring color conversion|
A nano-led containing an array of nano-pillars of different diameters that are distributed over an emission area of an led chip is capable of emitting broadband and white or nearly white light. Since each pillar emits light at a different wavelength according to its diameter and strain state, the overall emission spectral characteristics of the device is a combination of individual spectrum, giving rise to broadband emission.
|Method for manufacturing led chip with inclined side surface|
A method for manufacturing an led chip is disclosed wherein a substrate is provided. A first semi-conductor layer is formed on the substrate.
|Led lighting module and method of making the same|
An led lighting module includes a substrate and an led chip mounted on the substrate. The substrate includes a base made of metal and an insulating layer.
|Light emitting diode with two alternative mounting sides for mounting on circuit board|
An exemplary light-emitting diode (led) includes a substrate, a first electrode and a second electrode sandwiching the substrate therebetween, an led chip electrically connected to the first electrode and the second electrode, a reflector located on the first electrode and the second electrode and surrounding the led chip, and a first retaining wall mounted on an edge of the first electrode and a second retaining wall mounted on an edge of the second electrode. The first retaining wall and the second retaining wall are made of conductive material.
|Semiconductor light-emitting device|
A semiconductor light-emitting device includes a substrate, an led chip mounted on the substrate, and a resin package covering the led chip. The substrate includes a base and a wiring pattern formed on the base.
|Color temperature tunable led-based lamp module|
A light mixing and folding lamp includes an led assembly with two or more led chips that direct light into the ingress end of a light mixing rod. The light mixing rod is positioned to pass through an aperture in a concave second reflecting element, and mixed light emerges from the egress end of the light mixing rod, where it is directed toward a first reflecting element positioned near a focal point of the second reflecting element.
|Lighting device with led chip and protective cast|
The lighting device has at least one led chip that is potted by means of a potting compound, which potting compound has a light-transmissive, castable and curable matrix material comprising scattering volumes as filler material, wherein the scattering volumes are distributed inhomogeneously over a thickness of the potting compound and these scattering volumes have a lower density than the matrix material in its castable state. A method is used for producing a lighting device, which comprises at least one led chip, by means of at least the following steps: potting the at least one led chip by means of a potting compound containing scattering volumes, wherein the scattering volumes have a lower density than a matrix material of the potting compound in this state; curing the potting compound so that an inhomogeneous distribution of the scattering volumes is obtained owing to floating of the scattering volumes in the matrix material..
|Light-emitting diode structure and method for manufacturing the same|
A light-emitting diode (led) structure includes an insulation substrate; led chips each includes an epitaxial layer having a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer stacked on the insulation substrate, and comprises a mesa structure and an exposed portion of the first conductivity type semiconductor layer adjacent to each other, and a first isolation trench within the mesa structure; interconnection layers connect the led chips; electrode pads respectively connected to exposed portions of the semiconductor layers; a reflective insulating layer covering the interconnection layers, the mesa structures and the electrode pads, and having penetration holes respectively exposing a portion of the electrode pads; and bonding pads located on a portion of the reflective insulating layer and connected to the electrode pads through the penetrating holes. A method of manufacturing the led structure..
|Light-emitting diode structure and method for manufacturing the same|
A light-emitting diode (led) structure and a method for manufacturing the same. The led structure comprises an insulating substrate, a plurality of led chips and a plurality of interconnection layers.
|Method for manufacturing light emitting diode|
An exemplary method for manufacturing an led includes steps: providing a substrate with a first electrode and a second electrode; providing an isosceles trapezoidal led chip and making the led chip electrically connecting the first electrode and the second electrode; providing a mold with a cavity and setting the mold on the substrate to make the led chip received in the cavity, an outer periphery of the led chip spaced from confronting edges of the mold defining the cavity to define a channel therebetween, and a width of the channel being uniform; providing phosphor glue and filling the phosphor glue in the channel to make the phosphor glue enclose the led chip therein; solidifying the phosphor glue to form a phosphor layer covering the led chip and removing the mold.. .
|Method for manufacturing led|
A method for manufacturing an led includes steps: providing a base and an led chip disposed on the base; providing an optical element and disposing the optical element on the base to cover the led chip; providing a phosphor film and disposing the phosphor film on the optical element; providing a holding plate with capillary holes and disposing the base on the holding plate; providing a mold, wherein the mold and the holding plate cooperatively form a receiving room which receives the base, the led chip, the optical element and the phosphor film therein; extracting air from the receiving room through the capillary holes of the holding plate, and/or, blowing air toward the phosphor film, whereby the phosphor film is conformably attached onto the optical element; and solidifying the phosphor film on the optical element.. .
|Method for manufacturing led package|
A method for manufacturing an led package includes providing a substrate including an insulating layer inlayed with first and second electrodes. The first and second electrodes define a chip fastening area.
|Led lamp and an x-ray device and a collimator comprising the led lamp|
An embodiment of the present invention discloses a led lamp as well as a x-ray device and a collimator comprising the led lamp. The led lamp comprises a single led chip serving as the light-emitting member of the led lamp for emitting light beams; and a convex lens mounted in front of the led chip for converging the light beams emitted from the led chip.
|Led light bar with balanced resistance for light emtitting diodes thereof|
An led light bar includes led chips and a printed circuit board. A number of welding pads are disposed on the printed circuit board, and correspondingly connected to anodes and cathodes of the led chips respectively.
A method of operating a color-temperature-tunable device is described. The method drives a first light emitting diode (led) chip with a first driving current from a first power source.
|Thermal management for light-emitting diodes|
Embodiments of the invention provide lighting systems that employ light-emitting diode (led) chips as active lighting elements. Heat management components for the led chips employed in the lighting sources are provided.
|Easily assembled chip assembly and chip assembling method|
A chip assembly includes a pcb, a connecting pad fixed on the pcb, and a chip. The connecting pad defines a through hole.
|Light-emitting diode (led) module with light sensor configurations for optical feedback|
An embodiment of the disclosure includes a led module. A substrate is provided.
|Light emitting diode package structure having a substrate including ceramic fibers|
An led package structure includes a substrate and an led chip formed on the substrate. The substrate has a first electrode and a second electrode formed on an upper surface thereof.
|Light emitting module|
A light emitting module including a substrate, a plurality of first light emitting diode (led) chips and a plurality of second led chips is provided. The substrate has a cross-shaped central region and a peripheral region surrounding the cross-shaped central region.
|Method for manufacturing led|
A method for manufacturing an led package includes following steps: providing a base with an led chip mounted on the base; providing a porous carrier with a plurality of holes, and disposing the base on the porous carrier; providing a film with a phosphor layer attached on the film; providing a mold, and putting the porous carrier, the base, the led chip, and the film into the mold; extracting air from the mold to an external environment through the holes of the porous carrier, and/or, blowing air toward the film to urge the film to move toward the led chip, resulting in that the film is conformably attached onto the led chip and the base; and solidifying the phosphor layer on the led chip by means of heating whereby the phosphor is conformably and securely attached on the led chip.. .
|Led lamp for producing biologically-corrected light|
A light-emitting diode (led) lamp for producing a biologically-corrected light. In one embodiment, the led lamp includes a color filter, which modifies the light produced by the lamp's led chips, to increase spectral opponency and minimize melatonin suppression.
|Semiconductor light-emitting device, exhibit-irradiating illumination device, meat-irradiating illumination device, vegetable-irradiating illumination device, fresh fish-irradiating illumination device, general-purpose illumination device, and semiconductor light-emitting system|
The present invention provides a semiconductor light-emitting device which emits light with high chroma, and an exhibit-irradiating illumination device, a meat-irradiating illumination device, a vegetable-irradiating illumination device, a fresh fish-irradiating illumination device, a general-purpose illumination device, and a semiconductor light-emitting system which include the semiconductor light-emitting device. A semiconductor light-emitting device 1 comprises an led chip 10 as a semiconductor light-emitting element and a phosphor 20 which uses the led chip 10 as an excitation source to emit light.
|Light emitting diode (led) component with high signal-to-noise ratio|
The invention relates to a light emitting diode (led) component that is assembled with a plurality of led chips, incorporating luminescence conversion element and is characterized by a wide color spectrum ranging from 400 nm to 680 nm and has a high signal-to-noise ratio for each of the peak wavelength in the spectrum.. .
|Light-emitting diode package|
A light-emitting diode (led) package comprising a carrier, an led chip and a phosphor glue is provided. The carrier has a recess, an upper surface, and a ring-shape rough surface connected to a top edge of the recess.
|Light emitting diode package and method of manufacturing the same|
A light emitting diode package including a package body with a cavity, a plurality of light emitting diode (led) chips in the cavity, a plurality of wires connected to the plurality of led chips, and a plurality of lead frames in the package body, wherein the lead frames comprise a first lead frame electrically connected to a first electrode of a first led chip, a second lead frame electrically connected to a second electrode of the first led chip and a second electrode of a second led chip, a third lead frame electrically connected to a first electrode of the second led chip, and fourth lead frame electrically connected to a second electrode of a third led chip. Further, ends of the lead frames are exposed outside of the package body and penetrate the package body, and the first electrodes are p electrodes and the second electrodes are n electrodes..
A cooling unit main body having vapor diffusion flow paths which extend to the peripheral portion and capillary flow paths formed between the vapor diffusion flow paths and in a concave portion opposite region is provided with a thin concave portion in which an led chip is mounted. Accordingly, heat from the led chip can be easily transferred by what corresponds to the thinning of the concave portion, and successive circulating phenomenon caused by a refrigerant is repeated by the heat, and the heat is surely drawn from the led chip by latent heat at a time when the refrigerant vaporizes, so that a heat pipe can maintain the light emitting state of the led chip stably..
|Led lamp and lens unit therefor|
An led lamp includes: a plurality of light source units, each of which includes one or more led chips and an emission surface through which light from the led chips is emitted; and a lens unit having a plurality of lenses, each of which is located in front of the emission surface of each of the plurality of light source units.. .
|Light emitting device, led light source for plant cultivation, and plant factory|
A substrate-type led light source (10) includes: at least one blue led chip (2) which has an emission peak in a range from 400 nm to 480 nm so as to correspond to a blue light region absorption peak of chlorophyll; a red phosphor (7b) which emit, upon receiving excitation light from the at least one blue led chip (2), light having a peak wavelength in a range from 620 nm to 700 nm so as to correspond to a red light region absorption peak of chlorophyll; and a resin layer (7) in which the red phosphor 7b is dispersed and which covers the at least one blue led chip (2).. .
|Surface-mounting led chip|
An led (light emitting diode) chip includes a semiconductor. The semiconductor includes a main emitting surface on a top surface and a mounting surface on a bottom surface thereof.
|Backlight module, lcd device and light source of backlight module|
The invention provides a backlight module, an lcd device and a light source of the backlight module. The backlight module includes an led chip, and a heat sink; the led chip and a circuit thereof are directly arranged on the heat sink.
|Led spotlight having a reflector|
The invention relates to a led spotlight, preferably for white light, comprising—an led module (5) having several led chips (7, 7′) on a carrier (6),—a cooling body (3) that is in thermal contact with the led module (5),—a reflector (2) that laterally surrounds the led chips (7, 7′), and—a light mixing chamber (40) arranged within the reflector (3) and laterally surrounding the led chips (7, 7′), the light mixing chamber base surface (50) and the reflector bottom (60) being located on the same plane.. .
|Led light module and led chip|
An led light module and an led chip are provided. Led wafers (1) are provided on one side of a heat spreading plate (3) made of copper, aluminum or copper-aluminum composite material with a thickness of more than 0.4 mm and with an area of 5 times of the sum area of the led wafers larger to reduce the heat-flux density.
|Ceramic-based light emitting diode (led) devices, components and methods|
Devices, components and methods containing one or more light emitter devices, such as light emitting diodes (leds) or led chips, are disclosed. In one aspect, a light emitter device component can include a ceramic body having a top surface, one or more light emitter devices mounted directly or indirectly on the top surface, and one or more electrical components mounted on the top surface and electrically coupled to the one or more light emitter devices, wherein the one or more electrical components can be spaced from the ceramic body by one or more non-metallic layers.