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This page is updated frequently with new Led Chip-related patent applications. Subscribe to the Led Chip RSS feed to automatically get the update: related Led RSS feeds. RSS updates for this page: Led Chip RSS RSS


Led device having improved luminous efficacy

Light emitting device

Date/App# patent app List of recent Led Chip-related patents
07/17/14
20140198528
 Wavelength conversion chip for a light emitting diode, and method for manufacturing same patent thumbnailnew patent Wavelength conversion chip for a light emitting diode, and method for manufacturing same
There is provided a method of manufacturing a wavelength converted led chip, including attaching a plurality of led chips to a chip alignment region of an upper surface of a temporary support plate, forming a conductive bump on the electrode of the respective led chips, forming a phosphor-containing resin encapsulation part in the chip alignment region to cover the conductive bump, polishing the phosphor containing resin encapsulation part, forming the wavelength converted led chips by cutting the provided phosphor containing resin encapsulation part between the led chips, the wavelength converted led chip including a wavelength conversion layer obtained from the phosphor containing resin encapsulation part and formed on lateral surfaces and an upper surface of the wavelength converted led chip, and removing the temporary support plate from the wavelength converted led chip.. .
07/17/14
20140197447
 Light emitting device patent thumbnailnew patent Light emitting device
The light emitting device (10a) includes an led chip (12) and a ceramic support body (14) where the led chip (12) is placed. The ceramic support body (14) includes a placement surface (14d) where the led chip (12) is placed, internal terminals (22a, 22b) disposed on the placement surface (14d), a back surface (14c) that face the placement surface (14d), a mounting surface (14b) between the placement surface (14d) and the back surface (14c), and external terminals (28a, 28b) disposed on the mounting surface (14b).
07/17/14
20140197443
 Led device having improved luminous efficacy patent thumbnailnew patent Led device having improved luminous efficacy
There are provided a light emitting diode (led) device including an led chip emitting light within a specific wavelength region, a transparent resin layer covering a light emission surface of the led chip, and a color conversion layer formed to be spaced apart from the led chip by the transparent resin layer to cover the transparent resin layer and including at least one type of phosphor converting light emitted from the led chip into light within a different wavelength region, wherein a mean free path of phosphor particles included in the color conversion layer is 0.8 mm or more at a temperature of 5500 k.. .
07/17/14
20140197434
 Light emitting diode device and method for manufacturing heat dissipation substrate patent thumbnailnew patent Light emitting diode device and method for manufacturing heat dissipation substrate
The light emitting diode (led) device includes a substrate formed with at least one electrode; an led chip disposed on the substrate, and formed with at least one solder pad; at least one wire electrically connected between the solder pad and the electrode; and a fluorescent material layer covering the led chip. Thermal conductivity of the substrate is 80˜120 w/mk and a color rendering index of the led device under correlated color temperatures 2600k˜3700k is greater than 90..
07/17/14
20140197433
 Light emitting device patent thumbnailnew patent Light emitting device
A light emitting device includes: a ceramic substrate; a plurality of led chips; a printed resistor(s) connected in parallel with the plurality of led chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of leds, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency..
07/10/14
20140192528
 Light-emitting device and luminaire patent thumbnailLight-emitting device and luminaire
A light-emitting device and a luminaire that can reduce glare are provided. A light-emitting device according to an embodiment includes a substrate, an led chip mounted on the lower surface of the substrate, a light reflecting member arranged downward and on one side when viewed from the led chip and opened on the other side, a surface of the light reflecting member opposed to the led chip being a light reflecting surface, and an optical member configured to guide light emitted from the led chip and reflected by the light reflecting member downward..
07/10/14
20140191271
 Light emitting module patent thumbnailLight emitting module
In a light emitting module, a red phosphor is contained in a second phosphor layer so that the wavelength of a second phosphor layer after the wavelength conversion is longer than that of a first phosphor layer. And a blue phosphor and a yellow-green phosphor are contained in the first phosphor layer.
07/10/14
20140191260
 Light emitting semiconductor structure patent thumbnailLight emitting semiconductor structure
The invention provides a light emitting semiconductor structure, which includes a substrate; a first led chip formed on the substrate; an adhesion layer formed on the first led chip; and a second light emitting diode chip formed on the adhesion layer, wherein the second led chip has a first conductive wire which is electrically connected to the substrate.. .
07/03/14
20140186980
 Method of manufacturing light emitting device and spray coating machine patent thumbnailMethod of manufacturing light emitting device and spray coating machine
A method of manufacturing a light emitting device, using a spray coating method, a fluorescent material can be easily adhered on corner portions and side surfaces of an led chip, a lens-shaped light transmissive resin member surface, an optical lens surface, etc., and a spray coating machine used in the method. The method includes mounting an led chip on a substrate member, applying a spray coating to a coating object including the led chip by spraying a powder-containing solution.
07/03/14
20140184075
 Outdoor led lamp with heated cover patent thumbnailOutdoor led lamp with heated cover
An outdoor led lamp assembly includes a light transmissive cover disposed over at least one led chip of the lamp assembly. A heating element is provided for providing heat to the cover.
07/03/14
20140184062
Systems and methods for a light emitting diode chip
Provided is a light emitting diode (led) chip. The led chip includes a substrate and a mesa structure formed from a heterostructure grown on the substrate.
07/03/14
20140183587
Light emitting diode package
An led package includes a substrate, an led chip arranged on the substrate, and a light transmission layer arranged on a light output path of the led chip. The substrate includes a first electrode and a second electrode separated and electrically insulated from the first electrode.
07/03/14
20140183570
Illumination apparatuses
The present invention provides an illumination apparatus. The illumination apparatus comprises a body having a lower portion coupled to a standard metallic lamp adaptor and an upper portion; a light source module comprising an led array of led chips connected in series, a phosphor powder layer encapsulating the led chips, and a pair of conductive wires electrically connected to the led chips for transmitting electric power to the led chips; and a transparent housing coupled to the upper portion of the body, so that the led chips are enveloped within the transparent housing..
07/03/14
20140183569
Led chip unit and manufacturing method thereof, and led module
An led chip unit and manufacturing method thereof, a led module, an illuminating device and a display device. The led chip unit includes a plurality of led cores which are electrically isolated from each other.
07/03/14
20140183565
Light-emitting module board and manufacturing method of the light-emitting module board
A light-emitting module board includes a metal board provided with an insulating layer, a light-emitting part and a white insulating film. The light-emitting part includes plural led chips mounted on the metal board, and a white reflecting film of a ceramic coating formed in a light-emitting area on the metal board on which the plural led chips are mounted.
07/03/14
20140183444
High-voltage flip-chip led structure and manufacturing method thereof
A high-voltage flip-chip led structure and a manufacturing method thereof are disclosed. The manufacturing method includes: providing a die substrate, depositing a first passivation layer, forming a co-electrical-connecting layer, depositing a second passivation layer, depositing a mirror layer, forming two conductive tunnels by etching, and providing two connecting metal layers.
06/26/14
20140179042
Light-emitting diode manufacturing method
A light-emitting diode manufacturing method comprises steps of: providing a flexible material layer having a flexible reflective layer and phosphor glue in the flexible reflective layer; providing a hard material layer having a substrate and an led chip on the substrate; combining the flexible material layer and the hard material layer together wherein the led chip inserts into the phosphor glue and is surrounded by the flexible reflective layer; and solidifying the flexible reflective layer and the phosphor glue to form a reflective cup and a phosphor layer, respectively.. .
06/26/14
20140179038
Method for manufcturing light emitting diode package
A method for manufacturing an led package comprising following steps: providing a substrate and an led chip mounted on the substrate; providing glue and arranging the glue on a periphery of the substrate and drying the glue to form a blocking loop to enclose the led chip therein; and injecting the glue in the blocking loop, and drying the glue to form a packaging layer to encapsulate the led chip therein. Light emitted from the led chip travels through a top surface of the packaging layer, a periphery of the packaging layer, and the blocking loop to illuminate..
06/26/14
20140179035
Method for dispensing glue on led chip
A method for dispensing glue on an led chip includes following steps: providing a glue dispensing device which includes a syringe, a needle head communicating with the syringe, and a valve mounted on the needle head for controlling flowing of content in the syringe out of the syringe, wherein the valve has an aperture, and a diameter of the aperture is adjustable; providing glue and injecting the glue into the syringe; providing an led chip which is mounted a circuit board and orientating the needle head of the glue dispensing device towards the led chip, wherein the needle head is spaced from the led chip, and the diameter of the aperture of the valve is adjusted to a predetermined size; squeezing the glue out of the syringe under a predetermined pressure and a predetermined time, wherein the glue dispensed on the led chip forms an encapsulation structure.. .
06/26/14
20140177232
Led module and method for manufacturing the same
An led module includes an led unit having an led chip, a lens covering the led chip, and a diffusing film. The lens includes a light-incident face facing the led chip, a light-emitting face opposite to the light-incident face, and a connecting face connecting the light-incident face to the light-emitting face.
06/26/14
20140177223
Light emitting module and light source device
A light emitting module is a light emitting module including a substrate, a first area in which led chips are mainly arranged and mounted in a longitudinal direction of the substrate in an area on one side of the longitudinal direction, a second area in which non-light emitting components are mainly mounted in an area on another side of the longitudinal direction of the substrate and a notch portion which is between the first area and the second area and formed on the substrate. The non-light emitting components are mountable across the notch portion between the first area and the second area.
06/26/14
20140177206
Light emitting diode light bar for use in a backlight module
An led (light emitting diode) light bar is for use as a light source of a backlight module of an lcd (liquid crystal display). The led light bar includes a printed circuit board having a circuit therein, a plurality of led chips located on the printed circuit board and an encapsulation layer sealing the plurality of led chips.
06/26/14
20140176945
Aligning module and method for assembling light-emitting diode with lens using the same
An exemplary aligning module for aligning a lens with a light-emitting diode (led) chip includes a controlling module, a first image sensing module and a second image sensing module controlled by the controlling module, and a gripping module controlled also by the controlling module. The controlling module controls the first image sensing module and the second image sensing module to sense the light center of the led chip and the geometric center of the lens, respectively.
06/26/14
20140176866
Led device and liquid crystal display device
An led device includes an led chip, a fluorescent layer and a lens. The fluorescent layer has phosphor powder diffused therein.
06/26/14
20140176861
Backlight unit and liquid crystal display device including the same
A backlight unit according to an embodiment includes: a light guide plate; a light emitting diode (led) assembly supplying a light to the light guide plate; and a reflecting plate under the light guide plate, wherein the led assembly includes: an led printed circuit board (pcb) disposed at a side of the light guide plate; a plurality of led chips over the led pcb, the plurality of led chips spaced apart from each other; a plurality of first lead frames electrically connecting the led pcb and the plurality of led chips; and an led housing surrounding the plurality of led chips and the plurality of first lead frames.. .
06/26/14
20140175988
Led light assembly and system
An led based light assembly and lighting system is disclosed. The lighting system includes at least one light assembly comprising a plurality of led chips, a controller and a power supply module.
06/26/14
20140175978
Automotive headlamp apparatus
An automotive headlamp apparatus includes a light source, in which a plurality of led chips are arranged at intervals from each other, and a projection lens for projecting the light, emitted from the light source, toward a front area of a vehicle as a light source image. The semiconductor light-emitting elements may be located within than a focal point of the projection lens.
06/26/14
20140175502
Led package structure, dam structure thereof, and method of manufacturing led package thereof
An led package structure includes a carrier mounted with a plurality of led chips, a first glue-layer, a second glue-layer and an encapsulation resin filled within the first and the second glue-layers. The first glue-layer is formed on a top surface of the carrier and has a thin-film structure which is substantially flat on a top surface thereof.
06/26/14
20140175499
Light emitting diode
An led includes an led chip, a substrate, a first electrode and a second electrode formed on the led chip, and a first solder layer and a second solder layer formed on a top face of the substrate. The first solder layer is soldered on the first electrode and sandwiched between the led chip and the substrate.
06/26/14
20140175498
Led chip unit with current baffle
An led chip unit includes a base and a chip mounted on the base. The chip includes a substrate, a first semiconductor layer, a light emitting layer, a second semiconductor layer and an electrode.
06/26/14
20140175497
Led chip with groove and method for manufacturing the same
An led chip includes a substrate and an epitaxy structure formed on the substrate. The epitaxy structure includes a first semiconductor layer, a light emitting layer and a second semiconductor layer.
06/26/14
20140175484
Light emitting diode package
An led package includes a first electrode, a second electrode, a reflecting cup connecting the first electrode and the second electrode, and an led chip. The first electrode includes a first main portion and a first connecting portion extending outwardly from the first main portion.
06/26/14
20140175483
Light emitting diode package
An led package includes a first electrode, a second electrode electrically insulated from the first electrode, a reflecting cup connecting the first electrode and the second electrode, and an led chip. The first electrode includes an elongated first main portion and a first connecting portion bending downwardly from an end of the first main portion.
06/26/14
20140175482
Light emitting diode package with light reflecting cup internally slanted
An exemplary led package includes a base, electrodes formed on the base, an led chip electrically connecting the electrodes, and a reflecting cup mounted on the base and surrounding the led chip therein. The reflecting cup includes a bottom surface and an inner surface recessed up from the bottom surface and slantwise oriented towards a top end of the reflecting cup.
06/26/14
20140175158
Method for manufacturing light emitting diode package
A method for manufacturing an led package includes following steps: providing a eutectic bonding apparatus comprising a heating device, a supporting platform located in the heating device, and a nozzle; providing a resistance measuring device comprising a probe, an electrical power, and a controlling unit; providing an led chip; providing a substrate and positioning the substrate on the supporting platform of the eutectic bonding apparatus; moving the nozzle to catch the led chip onto the substrate; and heating the substrate and the led chip to form a eutectic bonding process. The probe of the resistance measuring device is electrically connected to the led chip, a total resistance of the led chip and the substrate is measured by the resistance measuring device in real-time, when the total resistance is equal to a predetermined value, the heating device is ordered to stop heating by the controlling unit..
06/19/14
20140168995
Lens and led lamp having the same
A light emitting diode (led) lamp includes a base, led chips mounted on base, and a lens covering the led chips and engaging with the base. The lens includes an arc-shaped engaging portion, and an extending portion extending from a radial outer side of a top surface of the engaging portion with a radial inner side of the top surface of the engaging portion exposed.
06/19/14
20140168979
Light emitting diode module with heat-conducting poles
An exemplary light-emitting diode (led) module includes a base, a substrate arranged on the base, and led chips mounted on the substrate. Through holes are defined in the substrate.
06/19/14
20140167093
Light emitting diode having a plurality of heat conductive columns
An led (light emitting diode) includes a substrate, a first electrode and a second electrode located on the substrate, and an led chip electrically connected to the first electrode and the second electrode. The substrate includes a ceramic plate and a plurality of metallic heat conductive columns inserted in an interior of the plate.
06/19/14
20140167087
Light emitting device and manufacturing method for the same
The present invention provides a light emitting device, which includes a light emitting diode (led) chip, a wavelength conversion plate including a fluorescent substance and disposed on a light output surface side of the led chip, and a sub heat radiation path formed to radiate heat of the wavelength conversion plate. The sub heat radiation path includes a transparent heat-conductive film provided on a surface of the wavelength conversion plate, a heat radiator provided in the vicinity of the led chip, and a thermal connection member that thermally connects the transparent heat-conductive film to the heat radiator..
06/19/14
20140167077
Light source module
A light source module includes a substrate, at least two light emitting diode (led) chips and at least one dummy chip. The led chips are disposed on the substrate.
06/19/14
20140167076
Led module with separate heat-dissipation and electrical conduction paths, and related heat dissipation board
A led module with separate heat-dissipation and electrical conduction paths is disclosed, having a metal substrate; a plastic layer, comprising one or more hollow regions, and attached to the metal substrate; one or more conducting elements attached to the plastic layer; one or more led chips positioned in the one or more hollow regions of the plastic layer and directly attached to the metal substrate; and a plurality of conducting wires for electrically connecting the one or more conducting elements and the one or more led chips; wherein inner sides of the one or more hollow regions comprise one or more inclined surfaces each having an included angle with an upper surface of the metal substrate, and the included angle is between 90-180 degrees.. .
06/19/14
20140167065
Led structure with enhanced mirror reflectivity
Embodiments of the present invention are generally related to led chips having improved overall emission by reducing the light-absorbing effects of barrier layers adjacent mirror contacts. In one embodiment, a led chip comprises one or more leds, with each led having an active region, a first contact under the active region having a highly reflective mirror, and a barrier layer adjacent the mirror.
06/19/14
20140167063
Led chip packaging structure, its manufacturing method, and display device
A led chip packaging structure, its manufacturing method, and a display device are disclosed. A conductive unit is formed at two opposite sides of a led chip unit, and comprises a first conductive layer formed at a side of, and electrically connected to, a first electrode, a second conductive layer formed at a side of, and electrically connected to, a second electrode, and an intermediate isolation layer formed at a side of a gan layer.
06/12/14
20140160733
Light emitting device, illuminating apparatus, and display apparatus
There are provided a light-emitting device, an illuminating apparatus, and a display apparatus in which, in order to apply light to an object to be illuminated with uniformity in light intensity, the quantity of light which is applied to a part of an edge of a to-be-illuminated region of the to-be-illuminated object located near a light-emitting section can be lessened. A backlight unit includes a printed substrate, a plurality of light-emitting sections each of which has a base support, an led chip and a lens, and reflective members each of which is placed around the light-emitting section and has a first wall portion and a second wall portion..
06/12/14
20140159094
Wavelength-converting light emitting diode (led) chip and led device equipped with chip
A wavelength-converted light emitting diode (led) chip is provided. The wavelength-converted led chip includes an led chip and a wavelength-converted layer.
05/29/14
20140146539
Led lamp
An led lamp includes housing, an led chip, and a lens. The housing includes an opening shell and a cover, the opening shell has an opening, and the cover is joined with the opening shell and covers the opening.
05/29/14
20140146536
Led component, led module and method for manufacturing the led component
A light emitting diode (led) component includes a base having a main body and a wiring pattern. The main body defines an axis and includes two connecting surfaces respectively located at two opposite sides thereof, and a plurality of interconnected mounting surfaces surrounding the axis and connected between the connecting surfaces.
05/29/14
20140145225
White light emitting diode module
Disclosed is a white light emitting diode module including a conducting wire frame, a first primary color chip, a second primary color chip and a phosphor layer. The conducting wire frame has an accommodating groove.
05/22/14
20140140046
Light-emitting device and display apparatus
There are provided a light-emitting device for use in a backlight unit of a display apparatus equipped with a display panel, which can be made lower in profile and is capable of applying light to the display panel with uniformity in the brightness of the display panel in a planar direction of the display panel, as well as a display apparatus equipped with the light-emitting device. A backlight unit includes a plurality of light-emitting devices each having a printed substrate, a base support, an led chip and a lens, and a reflective member surrounding the light-emitting device.
05/22/14
20140138721
Light emitting diode heat-dissipation carrier structure
An led heat-dissipation carrier structure includes a circuit board having at least one led chip mounted thereon; at least one electrical terminal pin having at an end connected to the led chip on the circuit board and another end extended in a direction away from a rear side of the led chip; a bowl-shaped metal-made heat-dissipation carrier for receiving the circuit board and the led chip therein, and through a bottom of which the electrical terminal pin is extended away from the led chip; and a light-pervious epoxy filled in the heat-dissipation carrier to completely cover the circuit board and the led chip. With these arrangements, a watertight and dustproof led with good heat dissipation ability is formed and suitable for mounting on outdoor signboards, signs or exterior walls of high-rise buildings..
05/15/14
20140134767
Led light source, its manufacturing method, and led-based photolithography apparatus and method
Structurally-simple led light source preventing temperature variations among multiple led elements arranged densely on led-mounting substrate is described. Led light source includes a plurality of led elements each of which is formed by connecting an led chip to electrodes formed on a ceramic substrate; led-mounting substrate on which to mount the plurality of led elements, the led-mounting substrate having through holes therein; and heat sink plate for releasing heat from the led-mounting substrate, wherein a thermally conductive resin is present between the led-mounting substrate and the heat sink plate and wherein part of the thermally conductive resin protrudes from the through holes of the led-mounting substrate and covers the top surface of the led-mounting substrate on which the plurality of led elements are mounted, so thermally conductive resin is in contact with the plurality of led elements..
05/15/14
20140134764
White light emitting diode (led) lighting device driven by pulse current
A white led lighting device driven by a pulse current is provided, which consists of blue, violet or ultraviolet led chips, blue afterglow luminescence materials a and yellow luminescence materials b. Wherein the weight ratio of the blue afterglow luminescence materials a to the yellow luminescence materials b is 10-70 wt %:30-90 wt %.
05/15/14
20140132888
Backlight unit and liquid crystal display apparatus
In order to prevent unevenness in planar light and reduce power consumption, a backlight unit a that emits planar light towards a front side thereof has a light-shielding part 500 provided on a package 50 at least on a front side of the backlight unit. The package 50 has an led module 5 that surrounds an led chip 51 that is a light source, and the light-shielding part 500 protrudes towards a light receiving face 22 of a light guide plate 2..
05/15/14
20140132177
White light emitting diode (led) lighting device driven by pulse current
A white led lighting device driven by a pulse current is provided, which consists of blue, violet or ultraviolet led chips, blue afterglow luminescence materials a and yellow luminescence materials b. Wherein the weight ratio of the blue afterglow luminescence materials a to the yellow luminescence materials b is 10-70 wt %:30-90 wt %.
05/15/14
20140132163
High-voltage led multichip module and method for adjusting an led multichip module
An led multichip module may include a plurality of led chips, which have electrical terminals and are connected in series via electrical connections, and have a designated operating voltage, wherein at least one short-circuiting connection is provided, which connects two of the terminals or connections electrically conductively to one another, and the short-circuiting connection bypasses at least one of the led chips or a resistor, with the result that the operating voltage is in the range of between 150 v and 350 v.. .
05/15/14
20140131762
Slim led package
Disclosed herein is a slim led package. The slim led package includes first and second lead frames separated from each other, a chip mounting recess formed on one upper surface region of the first lead frame by reducing a thickness of the one upper surface region below other upper surface regions of the first lead frame, an led chip mounted on a bottom surface of the chip mounting recess and connected with the second lead frame via a bonding wire, and a transparent encapsulation material protecting the led chip while supporting the first and second lead frames..
05/15/14
20140131756
Light-emitting device
The present invention provides a light emitting device, which includes a light emitting diode (led) chip, a case formed of polycyclohexylene dimethylene terephthalate, and a sealant that is charged into the case to seal the led chip. In the light emitting device, a stabilizer having a melting point that is higher than a junction temperature of the led chip by 80° c.
05/15/14
20140131746
White light emitting diode (led) lighting device driven by pulse current
A white led lighting device driven by a pulse current is provided, which consists of blue, violet or ultraviolet led chips, blue afterglow luminescence materials a and yellow luminescence materials b. Wherein the weight ratio of the blue afterglow luminescence materials a to the yellow luminescence materials b is 10-70 wt %: 30-90 wt %.
05/15/14
20140131727
Light emitting diode chip and method for manufacturing the same
A method for manufacturing a light emitting diode chip includes following steps: providing a sapphire substrate, the sapphire substrate having a plurality of protrusions on an upper surface thereof; forming an un-doped gan layer on the upper surface of the sapphire substrate, the un-doped gan layer having an upper part covering top ends of the protrusions; forming a distributed bragg reflective layer on the un-doped gan layer until the distributed bragg reflective layer totally covering the protrusions and the un-doped gan layer; etching the distributed bragg reflective layer and the upper part of the un-doped gan layer to expose the top ends of the protrusions; and forming an n-type gan layer, an active layer, and a p-type gan layer sequentially on the top ends of the protrusions and the distributed bragg reflective layer. An led chip formed by the method described above is also provided..
05/08/14
20140126209
Led lamp strip and manufacturing process thereof
A process of manufacturing an led lamp strip includes the steps of forming a plurality of through holes on an adhesive tape, mounting the adhesive tape to a top side of a scrollable lead frame, bonding a plurality of led chips to the top side of the scrollable lead frame according to the positions of the through holes, packaging the led chips respectively, and finally cutting the scrollable lead frame. In light of this, the led lamp strip can be produced under the circumstances of low production cost and less production time..
05/08/14
20140126185
Backlight module
A backlight module is provided, including a first light-emitting device and a second light-emitting device. The first light-emitting device includes a first blue light led chip and a first phosphor layer having a first color spectrum, wherein the first color spectrum has a first color spectrum area with at least 70% thereof distributed within the range from 500 nm to 580 nm.
05/08/14
20140125253
Led ballast controller device
A device and method to interface with a magnetic or electronic fluorescent ballast; evaluate, process, and regulate the incoming power from the ballast device and output a steady ac power that can be used by led drivers, led chips, or set of multiple led chips in a tube or bulb application. This device and method will allow for a non-fluorescent replacement lighting device such as a led lighting tube or bulb to be used in a fluorescent light luminaire (fixture) without any electrical wiring modification or removal of the electronic or magnetic ballast..
05/08/14
20140125213
Methods of integrating led chips with heat sinks, and led-based lighting assemblies made thereby
An led-based lighting assembly includes a heat sink having at least one pedestal with an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly facing, lower planar surface of the heat sink. A pcb forms an aperture corresponding to the pedestal, includes electrical conductors on an upper surface thereof, and is attached to the lower planar surface.
05/08/14
20140124815
Light emitting device assembly and headlamp including the same
An led assembly according to an embodiment of the present invention may improve dark regions generated between led chips by employing a first reflective layer between the led chips. By employing a transparent optical layer or an optical layer including a scattering particle between an led chip and a phosphor layer, direct contact between the led chip and the phosphor layer may be avoided, thereby preventing a low light extraction efficiency.
05/01/14
20140119000
Led light bar and backlight module using the led light bar
The present invention provides an led light bar and a backlight module using the led light bar. The led light bar includes a heat dissipation strip, a pcb mounted on the heat dissipation strip, led chips mounted on the heat dissipation strip and electrically connected to the pcb, and a thermal interface material layer arranged between the led chips and the heat dissipation strip.
05/01/14
20140117390
Light emitting diode package
An led package includes a first electrode and a second electrode electrically insulating from the first electrode, an led chip, two electrically insulating connecting layers, and a reflector. Top surfaces of the first electrode and the second electrode are recessed to define a first receiving space and a second receiving space therein.
05/01/14
20140117386
Tilted emission led array
The present disclosure is directed to led components, and systems using such components, having a light emission profile that may be controlled independently of the lens shape by varying the position and/or orientation of led chips with respect to one or both of an overlying lens and the surface of the component. For example, the optical centers of the led emitting surface and the lens, which are normally aligned, may be offset from each other to generate a controlled and predictable emission profile.
04/24/14
20140112000
Led lamp
An led lamp includes a heat dissipator, a module substrate fixed to one end of the dissipator and mounted with an led chip, a cap mounted via an insulator on the other end of the dissipator, a lighting circuit disposed in the dissipator and/or the cap, a glove having an open end attached to the one end of the dissipator so as to cover the module substrate, an intermediate ring including an engaging portion formed on its one end, and an engaged portion formed on the one end of the dissipator so as to be detachably engageable with the engaging portion. The other end of the ring is bonded with the open end of the glove to be fixed to the open end of the glove.
04/24/14
20140110745
Light emitting diode package
An led package includes a lead frame, a housing part, and a lead heat dissipating part. The lead frame includes a first lead mounting an led chip and a second lead spaced apart from the first lead.
04/24/14
20140110739
Led package and method for fabricating the same
A light emitting diode (led) package according to an exemplary embodiment of the present invention includes a base including a first lead terminal and a second lead terminal, an led chip disposed on the base, a housing disposed on the base, the housing having a cavity in which the led chip is disposed, and an encapsulation member having a side surface contacting the housing. The first lead terminal and the second lead terminal each have a first surface and a second surface opposite the first surface, and have an unbent form, respectively.
04/24/14
20140110724
Process of making a structure for encapsulating led chips and the led chips encapsulation structure
A process of making a structure for encapsulating led chips is provided with punching a reflective substrate into a reflective layer including through holes as reflective cups; punching an insulating substrate into an insulating layer including through holes, a flexible member having top and bottom formed with top and bottom layers of thermoset respectively, and top and bottom coatings formed on the top and bottom layers of thermoset respectively; punching a conductive substrate to form conductive members each having a solder pad and a lead leg; roughening bottom of the reflective layer; roughening top of the conductive substrate; filling an insulating material around the solder pads and the lead legs to form a lead frame; stacking and fastening the reflective layer, the insulating layer, and the lead frame fastened together; and electroplating the stack to form an airtight radiation emitting coating, thereby forming an led chips encapsulation structure.. .


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Led Chip topics: Semiconductor, Led Structure, Distributed, Scattering, Homogeneous, Led Assembly, Led Module, Circuit Board, Buffer Layer, Trapezoidal, Ion Source, Refrigerant

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