Lamina

Lamina-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).

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NEW Three-dimensional display
May 25, 2017 - N°20170150133

In a light ray controller, a light transmission diffusion layer and a light reflection layer are laminated on each other. The light ray controller is arranged such that the light transmission diffusion layer is located between a rotation center axis and the light reflection layer. A light ray generator emits a light ray group including a plurality of light rays ...
NEW Impedance matching transformer for high-frequency transmission line
May 25, 2017 - N°20170149407

An impedance matching transformer for high-frequency transmission line includes a carrier plate, a plurality of conductive posts, a magnetic core and a microstrip inductor. During high frequency transmission, the impedance matching transformer is used as a balanced-to-unbalanced transformation between high-frequency transmission lines. The microstrip inductor includes a plurality of laminated non-conductive substrates, a plurality of conductive tracks laid on the ...
NEW Method for fabricating flexible solar panel module
May 25, 2017 - N°20170149376

A flexible solar panel module is provided having a plurality of non-flexible solar panels, a plurality of non-flexible covers and a flexible back sheet. Each of the non-flexible solar panels has a photoreactive device layer, a positive ribbon and a negative ribbon. The non-flexible covers correspond to the non-flexible solar panels respectively and are disposed on front surfaces of the ...
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NEW Composite transmission line and electronic device
May 25, 2017 - N°20170149111

A composite transmission line includes a laminated insulator including insulator layers, signal transmission lines including first and second signal transmission lines and a power transmission line. The power transmission line includes a power transmission conductor pattern along the insulator layers, and an interlayer connection conductor that interlayer-connects power transmission conductor patterns. The first signal conductor pattern of the first signal ...
NEW Configurations of solid state thin film batteries
May 25, 2017 - N°20170149093

A solid state thin film battery may comprise: an adhesion promotion and intermixing barrier layer on a substrate, the layer comprising an electrically insulating material having a thickness in the range of 50 nm to 5,000 nm; a metal adhesion layer on the adhesion promotion and intermixing barrier layer; a current collector layer on the metal adhesion layer; a cathode layer on ...
NEW Layered porous film, and non-aqueous electrolyte secondary battery
May 25, 2017 - N°20170149040

A laminated porous film includes: a porous base material layer containing polyolefin as a main component; a filler layer containing inorganic particles as a main component; and a resin layer containing, as a main component, resin particles having a median diameter (d50) of greater than 1 μm.
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NEW Piezoelectric element, piezoelectric actuator device, liquid ejecting head, liquid ejecting apparatus, and ultrasonic wave measurement ...
May 25, 2017 - N°20170148974

A piezoelectric element in which a first electrode, a piezoelectric body layer comprised of a composite oxide having a perovskite structure that includes at least pb, nb and ti, and a second electrode are sequentially laminated on a substrate, in which a crystal that configures the piezoelectric body layer has a tetragonal structure, and the crystal is {100} oriented to the ...
NEW Layered body and electronic element
May 25, 2017 - N°20170148880

A laminated body includes: a substrate portion composed of silicon carbide; and a graphene film disposed on a first main surface of the substrate portion, the graphene film having an atomic arrangement oriented with respect to an atomic arrangement of the silicon carbide of the substrate portion. A region in which a value of g′/g in raman spectrometry ...
NEW Circuit card attachment for enhanced robustness of thermal performance
May 25, 2017 - N°20170148758

Exemplary embodiments of the invention include a method and apparatus for assembling a semiconductor device. The method may include heating the semiconductor device, which comprises a printed circuit card and a packaging laminate, according to a device heating profile to melt solder material located between an array of contact points on the printed circuit card and an array of corresponding ...
NEW Reduced-warpage laminate structure
May 25, 2017 - N°20170148749

A laminate structure includes a conductive layer and a dielectric layer in contact with the conductive layer, the dielectric layer comprises a selectively patterned high-modulus dielectric material that balances a differential stress between the conductive layer and the dielectric layer to mechanically stiffen the laminate structure and reduce warpage.
NEW Materials, structures and methods for microelectronic packaging
May 25, 2017 - N°20170148723

Highly reliable interconnections for microelectronic packaging. In one embodiment, dielectric layers in a build-up interconnect have a gradation in glass transition temperature; and the later applied dielectric layers are laminated at temperatures lower than the glass transition temperatures of the earlier applied dielectric layers. In one embodiment, the glass transition temperatures of earlier applied dielectric films in a build-up interconnect ...
NEW Semiconductor package, semiconductor substrate, semiconductor structure and fabrication method thereof
May 25, 2017 - N°20170148679

A semiconductor package is disclosed, which includes: a packaging substrate; a semiconductor element disposed on the packaging substrate in a flip-chip manner; a stopping portion formed at edges of the semiconductor element; an insulating layer formed on an active surface of the semiconductor element and the stopping portion; and an encapsulant formed between the packaging substrate and the insulating layer. ...
NEW Adhesive composition, laminate, and stripping method
May 25, 2017 - N°20170148659

An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, including a thermoplastic resin and a release agent.
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NEW Fingerprint recognition chip packaging structure and packaging method
May 25, 2017 - N°20170147851

A fingerprint recognition chip packaging structure and a packaging method. The packaging structure includes: a substrate, which is provided with a substrate surface; a sensor chip coupled on the surface of the substrate, where the sensor chip is provided with a first surface and a second surface opposite the first surface, the first surface of the sensor chip is provided ...
NEW Interlayer filling material for touch panel, and laminated body
May 25, 2017 - N°20170147098

The present invention aims to provide an interlayer filling material for a touch panel which is used for filling an interlayer space between a touch panel and another member in production of a personal digital assistant and the like, which is excellent in followability to a difference in level due to a decorative printing portion or wiring upon filling of ...
NEW Methods for fabricating display structures
May 25, 2017 - N°20170147036

An electronic device display may have a color filter layer and a thin film transistor layer. A layer of liquid crystal material may be interposed between the color filter layer and the thin film transistor layer. A layer of polarizer may be laminated onto the surface of the color filter layer. Laser trimming may ensure that the edges of the ...
NEW Optical interface device having a curved waveguide using laser writing and methods of forming
May 25, 2017 - N°20170146751

An optical interface device for optically connecting photonic devices to optical device along with methods of making. The method includes providing a glass support member that is either monolithic or laminated. A laser beam is used to write cores in the body of the support member. The support member includes a bend section and the cores generally follow the bend ...
NEW Method for manufacturing long laminated polarizing plate and long laminated polarizing plate
May 25, 2017 - N°20170146713

It is an object of the invention to provide a method for manufacturing a long laminated polarizing plate having a long polarizing coating formed by coating directly on a long retardation film and to provide such a long laminated polarizing plate. The present invention relates to a method for manufacturing a long laminated polarizing plate comprising a long retardation film ...
NEW Increased accuracy corner cube arrays for high resolution retro-reflective imaging applications
May 25, 2017 - N°20170146703

Tooling and optic elements for a retro-imaging system may be formed on order near atomic level of accuracy by making use of either etching or growth techniques of a cubic crystal lattice, such as silicon. The elements may be formed directly using selective etching or epitaxial growth by coating and clear resin lamination, or replicated to avoid shrinkage and curvature ...
NEW Surface mountable piezoelectric sensor array fabric
May 25, 2017 - N°20170146493

A fabric with an integrated piezoelectric sensor array and optionally with an integrated display; the fabric may be mounted to the surface of an object to be measured or monitored. The fabric may comprise multiple laminar layers, such as sensor layers, processing layers, display layers, and cladding layers for protection and sealing. The array of piezoelectric sensors may be produced ...