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This page is updated frequently with new Lamina-related patent applications. Subscribe to the Lamina RSS feed to automatically get the update: related Lamina RSS feeds. RSS updates for this page: Lamina RSS RSS


Printed wiring board and method for manufacturing printed wiring board

Ibiden

Printed wiring board and method for manufacturing printed wiring board

Circuit board and vehicle brake hydraulic pressure control unit

Nissin Kogyo

Circuit board and vehicle brake hydraulic pressure control unit

Circuit board and vehicle brake hydraulic pressure control unit

Surface treated copper foil and laminate using the same


Date/App# patent app List of recent Lamina-related patents
08/27/15
20150245496 
 Transfer  manufacturing conductor structures by means of nano-inks patent thumbnailTransfer manufacturing conductor structures by means of nano-inks
A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material.
Giesecke & Devrient Gmbh


08/27/15
20150245485 
 Printed wiring board and  manufacturing printed wiring board patent thumbnailPrinted wiring board and manufacturing printed wiring board
A printed wiring board includes a first insulating layer, a first conductor layer formed on a surface of the first insulating layer and including first pads, and a wiring structure including a second conductor layer formed on the first insulating layer, a second insulating layer laminated on the second conductor layer, a third conductor layer formed on the second insulating layer, and formed through the second insulating layer. The second conductor layer includes second pads formed on the first insulating layer, the third conductor layer includes third pads formed on the second insulating layer, the via conductors are positioned such that the via conductors are connecting the second pads and the third conductor layer, and the wiring structure is formed such that the second conductor layer and third conductor layer are not electrically connected to the first conductor layer..
Ibiden Co., Ltd.


08/27/15
20150245483 
 Circuit board and vehicle brake hydraulic pressure control unit patent thumbnailCircuit board and vehicle brake hydraulic pressure control unit
One embodiment provides a circuit board having a substrate and an electrode portion which is provided on the substrate. The electrode portion includes: a quadrangular land which is provided on a front surface of the substrate; a solder layer which is laminated on the whole of a front surface of the land; and a pad which is joined to a front surface of the solder layer.
Nissin Kogyo Co., Ltd.


08/27/15
20150245477 
 Surface treated copper foil and laminate using the same patent thumbnailSurface treated copper foil and laminate using the same
Wherein t1 represents a value pointing the position of the intersection closest to the linear mark among the intersections of the brightness curve and bt in the observation spot versus brightness graph, and t2 represents a value pointing the position of the intersection closest to the linear mark among the intersections of the brightness curve and 0.1Δb in the range from the intersections of the brightness curve and bt to a depth of 0.1Δb with bt as reference.. .

08/27/15
20150245475 
 Component-embedded substrate and manufacturing method thereof patent thumbnailComponent-embedded substrate and manufacturing method thereof
The present invention provides a component-embedded substrate (1) formed by dividing a laminate which is formed by bonding a component (12) onto a conductive material (10) placed on a support (8); sequentially laminating an insulation material (18, 28) and a core substrate (20) each having a component avoiding hole (32) which avoids the component; and hot-pressing the laminate to allow the melted insulation material to flow into the component avoiding hole to thereby form an integrated laminate (2, 36), wherein the component-embedded substrate includes regulation means (16, 34, 32, 38) which limits the displacement of the core substrate slipping on the insulation material melted during the hot pressing.. .
Meiko Electronics Co., Ltd.


08/27/15
20150245467 
 Apparatus and  miniaturizing the size of a printed circuit board patent thumbnailApparatus and miniaturizing the size of a printed circuit board
A printed circuit board includes at least one plated-through hole via drilled into at least one of a first layer on a first side of the printed circuit board and a second layer on a second side of the printed circuit board. The printed circuit board also includes a core section laminated between the first layer and the second layer, wherein a length of the core section is shorter than a length of the first layer and a length of the second layer.
Motorola Solutions, Inc


08/27/15
20150244958 
 Solid-state imaging device patent thumbnailSolid-state imaging device
According to one embodiment, there is provided a solid-state imaging device including a plurality of pixels. Each of the plurality of pixels includes a first photoelectric conversion unit, a second photoelectric conversion unit, a multilayer interference filter, and a reflective unit.
Kabushiki Kaisha Toshiba


08/27/15
20150244214 
 Component, electric machine and associated method patent thumbnailComponent, electric machine and associated method
According to an embodiment of the present invention, a component for an electric machine, for example, an interlocking stator, rotor, armature or exciter, for use in an electric machine prepared by a process is provided. The process by which the component is prepared includes the steps of applying a first material to a first portion of a first surface to form a first stator lamination and applying the first material to a second portion of a first surface, spaced from the first portion, to form a first rotor lamination.
Regal Beloit America, Inc.


08/27/15
20150244110 
 Electrical connector patent thumbnailElectrical connector
An electrical connector for mating with a mating connector includes an insulating body having a base and a tongue extending forward from the base. An upper row of terminals and a lower row of terminals are disposed in the insulating body.
Lotes Co., Ltd


08/27/15
20150243877 
 Piezoelectric element unit and driving device patent thumbnailPiezoelectric element unit and driving device
A piezoelectric element unit comprises an element body having internal electrodes laminated with piezoelectric layers therebetween and a pair of external electrodes electrically connected to the internal electrodes and an electric connection part for connecting a wiring part to the external electrodes. The electric connection part is composed of a conductive resin adhesive part and the conductive resin adhesive part is covered by a resin part..
Tdk Corporation


08/27/15
20150243876 

Piezoelectric element unit and driving device


A piezoelectric element unit comprises an element body having an active part and an inactive part; and a first resin part bonding one end surface in the laminating direction of the element body to a mounting surface of a joint member placed to face the one end surface. The first resin part covers the mounting surface up to an outer side surface of the element body corresponding to an interface between the active part and the inactive part, a second resin part covers an outer surface of the first resin part covering the outer side surface of the element body at a position corresponding to the interface between the active part and the inactive part, and the second resin part also integrally covers the outer side surface of the element body corresponding to the active part..
Tdk Corporation


08/27/15
20150243832 

Two-part screen printing for solar collection grid


Methods and apparatus relating to providing a collection grid suitable for use in pv modules. The disclosed collection grid may be at least partially applied to a protective laminate sheet in a manner that removes the high temperature requirements of conventional screen printed collection grids, to avoid unwanted heat-related deformation of the laminate sheet..
Hanergy Hi-tech Power (hk) Limited


08/27/15
20150243703 

Methods of fabricating camera module and spacer of a lens structure in the camera module


A camera module and a fabrication method thereof are provided. The camera module includes a lens structure and an image sensor device chip disposed under the lens structure.
Omnivision Technologies, Inc


08/27/15
20150243581 

Semiconductor cooling device


A semiconductor cooling device includes: a cooling medium flow channel, through which a cooling medium for cooling a semiconductor chip flows; a laminar flow section which is provided in a region upstream of the cooling medium flow channel and allows the cooling medium to flow in the form of laminar flow; and a turbulent flow section which is provided in a region downstream of the laminar flow section in the cooling medium flow channel and allows the cooling medium, which flows in the form of laminar flow from the laminar flow section, to flow in the form of turbulent flow.. .
Mitsubishi Electric Corporation


08/27/15
20150243575 

Semiconductor device and forming encapsulated wafer level chip scale package (ewlcsp)


A semiconductor device has a semiconductor die and an encapsulant around the semiconductor die. A fan-in interconnect structure is formed over the semiconductor die while leaving the encapsulant devoid of the interconnect structure.
Stats Chippac, Ltd.


08/27/15
20150243550 

Method for manufacturing soi wafer


A method for manufacturing soi wafer of forming an oxide film on a bond wafer of a semiconductor single crystal substrate, forming an ion implanted layer into the bond wafer by implanting ions of at least one kind of gas in hydrogen and rare gases through the oxide film, bonding together an ion implanted front surface of the bond wafer and base wafer front surface via the oxide film, thereafter delaminating the bond wafer along the ion implanted layer, and thereby fabricating an soi wafer. The oxide film is formed on the bond wafer such that on a back surface it is made thicker than the oxide film on a bonded face.
Shin-etsu Handotai Co., Ltd.


08/27/15
20150243521 

Plasma processing method and plasma processing apparatus


A main etching process of forming a recess portion in a multilayer film having a laminated film where a first film and a second film having different relative permitivities are alternately formed on a base silicon film to a preset depth and an over etching process of forming the recess portion until the base silicon film is exposed are performed by introducing a processing gas including a cf-based gas and an oxygen gas and by performing a plasma etching process. In the over etching process, a first over etching process where a flow rate ratio of the oxygen gas to the cf-based gas is increased as compared to the main etching process and a second over etching process where the flow rate ratio of the oxygen gas to the cf-based gas is reduced as compared to the first over etching process are repeatedly performed two or more times..
Tokyo Electron Limited


08/27/15
20150243405 

Transparent conductive laminate


Provided is a transparent conductive laminate whose surface resistance change after molding (r) is reduced.. .

08/27/15
20150243399 

Conductive film, producing the same and array substrate comprising the same


A conductive film, a method for producing the same and an array substrate comprising the same are provided, so that copper atoms can be efficiently prevented from diffusing into an adjacent semiconductor layer or interlaminated insulation film. The conductive film comprises a base film made of copper or copper alloy, in which hydrogen and/or carbon atoms are distributed..
Boe Technology Group Co., Ltd.


08/27/15
20150243231 

Display device and electronic apparatus


Disclosed is a display device including a display element and a transistor configured to drive the display element. The transistor has a channel layer, a gate electrode laminated under the channel layer, and wiring connecting the gate electrode and a capacitance electrode together.
Sony Corporation


08/27/15
20150242726 

Image processing apparatus, computer-readable recording medium, and image processing method


An image processing apparatus that outputs print data to a recording apparatus including a recording unit that causes each of a plurality of nozzles to eject droplets to record dots on a recording medium, the image processing apparatus comprises: an acquiring module that acquires image data for an image to be formed by the recording unit; a determining module that determines whether or not the image data is laminated image data formed of a plurality of layers; and a generating module that generates, when the image data is the laminated image data, the print data that assigns nozzles for recording dots corresponding to respective pixels of the laminated image data such that a specific nozzle for recording dots that correspond to pixels at an identical pixel position in the laminated image data varies from one layer to another.. .
Ricoh Company, Ltd.


08/27/15
20150241809 

Conductive roll and manufacturing the same


A phenol resin adhesive is applied to the outer peripheral surface of an axis body 2 and heated for baking to thereby form a undercoating layer 31. A phenol resin adhesive is further applied to the outer peripheral surface of the undercoating layer 31 to thereby form an upper coating layer 32.
Sumitomo Riko Company Limited


08/27/15
20150241770 

Photosensitive resin laminate for flexographic plate with infrared ablation layer


A photosensitive resin laminate comprising infrared ablation layer which could be removed by infrared laser, wherein the photosensitive resin laminate has excellent properties such as membrane strength, scratch resistance, adhesion with photosensitive resin layer, handling easiness when making the plates, plotting property with infrared laser, solubility to flexographic developing solvent and sensitivity improvement to infrared laser. A photosensitive resin laminate for flexographic plate consisting of; support layer, photosensitive resin layer placed on said support layer comprising thermoplastic elastomer, polymerizable unsaturated monomer and photopolymerization initiator, infrared ablation layer placed on said photosensitive resin layer which is removable by infrared laser and masks non-infrared radiation, and cover film placed on said infrared ablation layer, wherein said infrared ablation layer comprises modified polyolefin and infrared absorbing material, and wherein said modified polyolefin comprises at least more than one polymer selected from the group consisting of polyolefin modified by chlorine and/or maleic acid..
The Osaka Printing Ink Mfg. Co., Ltd.


08/27/15
20150241158 

Projectile launching device


A projectile launching device includes a primary tube having a primary passage for launching a projectile. In some embodiments, the projectile launching device further includes a secondary tube disposed about the primary tube and defining a secondary passage, and a flow apparatus in fluid communication with the secondary passage configured to move gas through the secondary passage.

08/27/15
20150241045 

Dual polarity led lighting device


A lighting device is described that includes a voltage source, a substrate, a wiring, a first light emitting diode (led) and a second led, a first electrical conductive element (ece) and a second ece, and a transparent, conductive sheet material. The wiring is formed on the substrate, and is connected to the voltage source.
Grote Industries, Llc


08/27/15
20150240777 

Turbine structure and owc device comprising such turbine structure


A turbine structure, includes a rotor having a hub rotatable about a central axis of rotation and adapted to be operatively coupled to an external system generating electric power, a plurality of laminar elements firmly associated with the hub and arranged peripherally of the central axis of rotation to intercept a fluid stream, wherein each laminar element includes a flexible seal having upper and lower opposite faces adapted to alternatively engage the fluid stream to deform and transmit a driving torque to the rotor. The seals radially extend outwardly from the outer peripheral wall of the hub with respective opposite faces extending, in a non-deformed condition, mainly in planes substantially coplanar with each other and to the plane of the hub, perpendicular to the axis of rotation, to define as a whole respective mutually opposite surfaces adapted to be alternately invested by the fluid stream on their entire extension..

08/27/15
20150240757 

Canister


A canister includes: a casing provided with a cylindrical case member having one end closed as a bottom portion and another end opened as an opened portion, and a cylindrical bottom case member closing the opened portion of the cylindrical case member, the casing being formed with a fuel vapor introducing port, a purge port and an air communication port; an adsorbent material disposed within the cylindrical case member; a pad member disposed between the adsorbent material and the cylindrical bottom case member; a grid member disposed between the adsorbent material and the cylindrical bottom case member, the pad member and the grid member being laminated as a lamination layer; and an air ventilation path formed to the grid member so as to extend in axial and radial directions of the casing in a meandering manner.. .
Roki Co., Ltd.


08/27/15
20150240496 

Laminated hip and ridge shingle


Hip and ridge shingles may be single layer or laminated. One hip and ridge shingle has a base layer and a dimensional layer affixed to the base layer by an adhesive line that extends in the machine direction and along the width of the base and the dimensional layers.
Owens Corning Intellectual Capital, Llc


08/27/15
20150240487 

Flexible furniture system


An article of flexible furniture having a core formed from a plurality of laminar panels of a flaccid material and each panel having a pair of oppositely directed major faces, adjacent faces of said panels being inter-connected to provide a cellular structure upon movement of abutting faces away from each other, a pair of supports at opposite ends of said core and connected to respective ones of said faces, said supports being self-supporting to provide rigidity to said core whereby said supports may be moved apart to expand said cellular and extend the length of said partition.. .
Molo Design, Ltd.


08/27/15
20150240135 

Reactive polyolefin hot melt adhesive with low adhesion to uncoated aluminum tools and use thereof as a laminating hot melt


A hot melt adhesive composition is provided which contains at least one silane group-containing thermoplastic poly-α-olefin which is solid at 25° c. And at least one paraffin wax.
Sika Technology Ag


08/27/15
20150240071 

Curable resin composition, composition for forming solder resist, dry film and printed wiring board, and laminate and process for preparing the same


The present invention provides a curable resin composition that can provide a cured material excellent in insulation reliability while maintaining adhesiveness and provide a composition for forming a solder resist, a dry film and a printed wiring board, a laminate having a resin insulating layer excellent in insulation reliability while maintaining adhesiveness, a dry film for forming this and a process for preparing a laminate using the dry film. The curable resin composition contains (a) an imidazole-isocyanate adduct, (b) a carboxyl group-containing resin and (c) a thermosetting resin.
Taiyo Ink Mfg. Co., Ltd.


08/27/15
20150240055 

Epoxy resin compound and prepreg and copper-clad laminate manufactured using the compound


The present invention relates to an epoxy resin composition and a prepreg and a copper-clad laminate made by using same. The epoxy resin composition comprises components as follows: an epoxy resin containing 3 or more epoxy groups and containing nitrogen in the molecular chain, a phosphate salt compound and an active ester hardener; the amount of the epoxy resin containing 3 or more epoxy groups and containing nitrogen in the molecular chain is 100 parts by weight, the amount of the phosphate salt compound is 5˜50 parts by weight.
Shengyi Technology Co., Ltd.


08/27/15
20150240023 

Catalyst compositions and methods for making foam


A composition and process to make polyisocyanurate or polyurethane foam using a catalyst composition comprising at least one bismuth carboxylate catalyst and one or more co-catalysts selected from the group of alkali metal carboxylates and quaternary ammonium carboxylate salts, such that the resultant foam has improved insulation properties. The polyisocyanurate or polyurethane foams produced by this catalyst composition and method are useful for laminated boardstock, construction panels, appliance insulation, and spray-applied insulation..
Air Products And Chemicals, Inc.


08/27/15
20150240014 

Acrylic film, producing same, laminate film, laminated injection molded article, and producing rubber-containing polymer


An acrylic film having few fish eyes and a method for producing latex of an acrylic rubber-containing polymer having low amounts of coarse particles, excellent filtering properties, and low filter clogging frequency during a filtration step for removing foreign substances. An acrylic film containing an acrylic rubber-containing polymer and a thickness of 30 to 300 μm, wherein the number of fish eyes that are 0.001 mm2 or greater in size is 130/m2 or fewer when a section having a light transmission rate of 75% or less for light having a wavelength of 400 to 1100 nm was detected as a fish eye a laminate film formed by laminating the acrylic film and a layer of at least one resin selected from thermoplastic resin, thermosetting resin, and photo curable resin.
Mitsubishi Rayon Co., Ltd.


08/27/15
20150239619 

Resealable laminate for heat sealed packaging


A resealable package assembly is described. The package assembly includes a selectively positionable flap that covers an aperture or enables access through the aperture into the package.
Avery Dennison Corporation


08/27/15
20150239605 

Fastener for dismountably assembling laminar elements


Fastener (4) for dismountably assembling laminar elements such as the bottom (2) and lateral (3) walls of containers, boxes (1) and the like comprising, at least, a tongue (6) having a widened head (6a) defining a neck (6b), which is located in one of the elements to be assembled and, at least, a groove (5) intended for receiving said neck (6b), located in the other element to be assembled, and whose width is comprised between the width of the neck (6b) and the width of the widened (6a) head; the groove (5) having, at least, an open side (7) where a resiliently displaceable retainer (8) is provided.. .

08/27/15
20150239602 

Packaging convertible to a cone-shaped container with removable lamina


Packaging which has at least one lamina removable from the packaging and wherein said lamina is also convertible to a cone having retention means that ensure the maintenance of the adopted shape. The lamina is a deformable lamina, which may be of any material, but preferably plastics and the like, and furthermore, has a means of retention for ensuring the maintenance of the adopted shape as a cone.
Iberic Premium, S.l.


08/27/15
20150239513 

Aerodynamic semi-trailer fairing


A fairing includes a prow portion having a pointed leading end adjacent an undercarriage and an aft trailing end. The trailing end extends across the undercarriage and vertically spans the space from the height of the undercarriage to the ride height of a vehicle.

08/27/15
20150239508 

Hybrid laminated wood floor with wood strips arranged in a pattern for vehicular trailers


A hybrid laminated wood floor for cargo-carrying truck trailers, truck bodies and containers is provided. The hybrid laminated wood floor is formed from two or more different types of hardwood strips that are mixed in a controlled manner and arranged in a pattern.
Havco Woods Products, Llc


08/27/15
20150239300 

Heavy duty pneumatic tire


A heavy duty pneumatic tire includes a pair of beads, a carcass and a pair of bead fillers laminated outward with respect to the beads in the axial direction, respectively. Each bead includes a core and an apex, the carcass includes a carcass ply folded back around the core and having a main portion and a folding-back portion, each bead filler has an outer edge, an inner edge and a fitting portion to fit to a rim, the fitting portion includes a bottom surface to make contact with a seat surface of the rim and an outer-side contact surface to make contact with a flange of the rim, and the outer-side contact surface has inner-side, outer-side and middle portions such that when not mounted to the rim, the middle portion is recessed inward with respect to imaginary straight line l1 passing through outer edges of the inner-side and outer-side portions..
Sumitomo Rubber Industries Ltd.


08/27/15
20150239227 

Delamination method, delamination device, and delamination system


A delamination method for delaminating a laminated substrate which includes a first and a second substrates bonded to each other, includes: adjusting a position of the laminated substrate at a holding unit by a position adjusting unit and disposing the holding unit at a predetermined height position; disposing a sharp member of a delamination inducing unit at a predetermined height position; detecting a contact of the sharp member by bringing the sharp member into contact with a side surface of one end portion of the laminated substrate; inserting the sharp member into the side surface of the one end portion of the laminated substrate; and delaminating the second substrate from the first substrate by a plurality of suction movement units which sucks the second substrate of the laminated substrate to move the second substrate away from the first substrate.. .
Tokyo Electron Limited


08/27/15
20150239224 

Method for providing a lamination film with adhesive, applying hot melt, application, lamination plant and upgrading such a plant


A method for providing a laminate film with adhesive as a step in the preparatory process for manufacturing a laminate mold part using a support part, a method for applying a hot melt to a laminate film, a method for manufacturing a laminate mold part, using a method, a system for laminating a support part as well as a method for such a system produces especially high quality lamination and even if the support part, where the laminate film should be laminated, is not porous by applying the adhesive to the support part for bonding the macroscopically structured laminate film, so that there is a duct system. The air can flow through the duct system between the laminate film and the support part during the lamination process..
Kiefel Gmbh


08/27/15
20150239222 

Use of aqueous polyurethane dispersions for laminating molded articles


The use of aqueous polyurethane dispersions is described for the lamination of moldings, where the polyurethane comprises units derived from at least one amorphous polyester polyol and comprises units derived from at least one polycarbonate.. .
Basf Se


08/27/15
20150239221 

Method for splicing stress skins used for manufacturing structural insulated panels


A method for manufacturing substantially longer structural insulated panels through lamination without sacrificing thermal efficiency and structural integrity. The method includes laminating an insulating structure in between a lower sheet of serial panels and an upper sheet of serial panels.

08/27/15
20150239220 

Adhesive film


The adhesive film includes a film-like adhesive layer, a light release separator and a heavy release separator that are laminated on either side of the adhesive layer, and a carrier film further laminated on the heavy release separator. The outer edges of the light release separator and the carrier film forming the outer layer extend outward beyond the outer edge of the adhesive layer and the heavy release separator forming the inner layer.
Hitachi Chemical Company, Ltd.


08/27/15
20150239218 

Multilayer plastic film with separable layers for covering of inflated greenhouse


The present invention provides a multilayered polymeric film with a luminous transmittance greater than 30% when measured using astm-d 1003-92, for covering an agricultural structure or greenhouse, wherein the film contains adjacent layers that have an average delamination strength of less than 250 g/15 mm when measured using astm d-1876. More particularly, the film is thus separated into two or more film layers which are inflated with gas to provide thermal insulation..
Plastika Kritis S.a.


08/27/15
20150239216 

Glass laminate using textured adhesive


A method for laminating glass, a laminate assembly, and an adhesive-coated plastic material used in a laminate assembly. Specifically an adhesive, once applied to a plastic layer is grooved or textured to allow formerly trapped air to escape from between layers of a laminate assembly during a laminate process.
Southwall Technologies, Inc.


08/27/15
20150239215 

Transparent laminated glass and use thereof


A transparent laminated glass is described. The transparent laminated glass can comprise a transparent outer pane, at least one polymer layer, and a transparent inner pane.
Saint-gobain Glass France


08/27/15
20150239211 

Laminate comprising adhesive layer and manufacturing same


Provided is a laminate comprising a composite first adhesive layer in which a printed portion is embedded within an adhesive portion. The laminate can solve the bending phenomenon caused by raised parts, have a reduced thickness, allow manufacturing thereof due to a simplified process, and remedy problems arising from faulty lamination..
Lg Hausys, Ltd.


08/27/15
20150239210 

Laminite, and element comprising substrate manufactured using same


The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin between a carrier substrate and a flexible substrate.
Lg Chem, Ltd.


08/27/15
20150239197 

Article and laminate


According to the present invention, there is provided an article including: a main body portion (10) that is formed of a material composition containing a fiber filler and a resin and obtained using a paper-making method; and a functional layer (20) that covers the main body portion (10).. .
Sumitomo Bakelite Co., Ltd.


08/27/15
20150239185 

Appliance for repairs of local damage of laminated glasses, particularly glasses of cars and other transportation means


The invention relates to an appliance for repairs of local damage of laminated glasses consisting of a body with a base fitted with circumferential elastomer gasket for underpressure suction to the glass. The substance of the invention is that a closing member of an overflow valve for underpressure supply to a repair compartment is arranged so that when closing, it moves in the underpressure suction direction and pushed to a seat by generated pressure.

08/27/15
20150239090 

Abrasive product with a concave-convex structure and preparation method thereof


An abrasive product with a concave-convex structure includes laminated three planar layers and an abrasive layer with a concave-convex structures located on an upper surface of the three planar layers. The abrasive layer with a concave-convex structure is an array of abrasive blocks, and a groove serving as chips discharging groove is formed between each two adjacent abrasive blocks.
Beijing Grish Hitech Co., Ltd.


08/27/15
20150239070 

Joining material


A joining material includes a composite material including a first metal material having a thermal expansion coefficient of not more than 5, and a second metal material formed on the first metal material, the second metal material having a thermal expansion coefficient higher than the first metal material, and a solder material formed on the composite material. The solder material includes a lead-free solder having a melting point of not less than 260 degrees c., and a laminated structure configured such that a zn based metal material including zn as a main component, a first al based metal material including al as a main component, and a first x based metal material including cu, au, ag or sn as a main component are laminated in the order starting from the composite material..
Hitachi Metals, Ltd.


08/27/15
20150239065 

Laser processing apparatus and laser processing method


A laser processing apparatus for radiating a laser beam to a member to be treated provided in an air environment to perform surface treatment. The member to be treated forms a structure extending in a vertical direction.
Kabushiki Kaisha Toshiba


08/27/15
20150239047 

Transfer manufacturing conductor structures by means of nano-inks


A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material.
Giesecke & Devrient Gmbh


08/27/15
20150239044 

Transfer manufacturing conductor structures by means of nano-inks


A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material.
Giesecke & Devrient Gmbh


08/27/15
20150238782 

Combination of an envelope for a laminar structure providing adaptive thermal insulation and a heat protection shield


The present invention relates to a combination of at least one envelope (20) for a laminar structure (100) providing adaptive thermal insulation, and a heat pro-tection shield (50) for the envelope (20), the envelope (20) enclosing at least one cavity (16) having included therein a gas generating agent (18) having an unactivated configuration and an activated configuration, the gas generating agent (18) being adapted to change from the unactivated configuration to the activated configuration, such as to increase a gas pressure inside the cavity (16), in response to an increase in temperature in the cavity (16), the envelope (20) being configured such that a volume of the envelope (20) increases in re-sponse to the increase in gas pressure inside the cavity (16), the heat protection shield (50) being assigned to the at least one envelope (20) such as to cover at least a heat exposed side of the envelope (20) with respect to a source of heat (700).. .

08/27/15
20150238743 

Molding compact, and manufacturing transdermal absorption sheet


A molding compact for forming a transdermal absorption sheet on which a needle-shaped protruding part is arranged is a molding compact that is a laminate of: a first member having a needle-shaped recessed part formed on a front surface thereof, the needle-shaped recessed part being an inverse of the needle-shaped protruding part; a second member provided on a back surface of the first member, the second member being composed of a waterproof and moisture-permeable material; and a third member provided on a back surface of the second member, the third member being composed of a rigid body. Provided are a molding compact that makes it possible to prevent leakage of a drug-containing solution filled into the needle-shaped recessed part, and a manufacturing method for a transdermal absorption sheet using the molding compact..
Fujifilm Corporation


08/27/15
20150238436 

Support body for transdermal patch or transdermal preparation, and transdermal patch and transdermal preparation using same


The present invention provides a patch or patch preparation in which the anchoring property of a pressure-sensitive adhesive layer to a support is improved with no adverse effects on its pressure-sensitive adhesive properties such as adhesion, pressure-sensitive adhesiveness, and a cohesive strength. A support of the present invention is for a patch or patches preparation, and comprises a base material containing a plastic film and an undercoat agent layer laminated on the base material.
Nitto Denko Corporation


08/27/15
20150238434 

Transdermal absorption sheet, and manufacturing the same


A transdermal absorption sheet and a manufacturing method for the transdermal absorption sheet includes a laminating step of forming a multilayer film with a viscosity difference by forming, on a support, a lower layer containing a first transdermal absorption material and an upper layer containing a drug and a second transdermal absorption material and having a lower viscosity than the lower layer, a filling step of filling needle-like recessed portions corresponding to inverted needle-like protruding portions with a solution of the transdermal absorption material by pressing a mold in which the needle-like recessed portions are arranged in a two-dimensional array, against a surface of the multilayer film supported by the support to allow the multilayer film to flow, a solidifying step of solidifying the multilayer film with the mold pressed against the surface of the multilayer film, and a peeling-off step of peeling the solidified multilayer film from the mold.. .
Fujifilm Corporation


08/27/15
20150238220 

Ultrasonic surgical instruments


An ultrasonic surgical instrument is provided. The ultrasonic surgical instrument includes a housing having an elongated shaft extending therefrom.
Covidien Lp


08/20/15
20150237738 

Method for producing a circuit board element, and circuit board element


A method for producing a circuit board element, and a corresponding circuit board element, with which it is possible to suppress the risk of delamination in the region of a component (e.g. A wire or a plate-like shaped part) that is embedded in the circuit board element.
Jumatech Gmbh


08/20/15
20150237737 

Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminate


A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided. The surface treated copper foil to be laminated on a polyimide having the following Δb (pi) of 50 or more and 65 or less before being laminated to the copper foil so as to form a copper clad laminate comprising a surface having a color difference Δe*ab of 50 or more based on jis z 8730 through the polyimide and a difference between the top average bt and the bottom average bb in a brightness curve extending from an edge of the copper foil to a portion without the copper foil Δb (Δb=bt−bb) of 40 or more, wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper foil through the polyimide laminated from the surface treated surface side with a ccd camera for the respective observation spots along the perpendicular direction of the extending direction of the observed copper foil..
Jx Nippon Mining & Metals Corporation


08/20/15
20150236638 

Solar photovoltaic module power control and status monitoring system utilizing laminateembedded remote access module switch


A solar photovoltaic module laminate for electric power generation is provided. The module comprises a plurality of solar cells embedded within the module laminate and electrically interconnected to form at least one string of electrically interconnected solar cells within said module laminate.
Solexel, Inc.


08/20/15
20150236607 

Power converter


A power converter, including: at least two inverting modules, where direct current sides of the at least two inverting modules are connected in parallel using a laminated busbar or a circuit board, and the at least two inverting modules run in an interleaved and parallel manner. In the present invention, the power converter is formed by connecting at least two inverting modules in parallel, and the direct current sides of the at least two inverting modules are connected in parallel using the laminated busbar or the circuit board, so that parasitic inductance between inverting modules is small, forming a low parasitic inductance loop.
Huawei Technologies Co., Ltd.


08/20/15
20150236491 

Laminated glazing unit


A laminated glazing unit including a first and a second glass sheet, the first glass sheet being equipped with a first through-hole, a spacer film of thermoplastic polymer disposed between the first and second glass sheets, at least one conducting wire buried within the spacer film or disposed between the spacer film and the first glass sheet or disposed between the spacer film and the second glass sheet, one end of each conducting wire exiting from the laminated glazing unit via the first through-hole in the first glass sheet. The conducting wires are fed through a laminated glazing unit, with a guaranteed quality of positioning of the conducting wires, an improved field of view and with no induced noise..
Saint-gobain Glass France


08/20/15
20150236403 

Planar antenna microwave module


The present invention discloses a planar antenna microwave module, including an oscillation circuit board and a planar antenna board. The oscillation circuit board is a double-sided printed circuit board.
Hytronik Electronics Co., Ltd


08/20/15
20150236322 

Electrode protection using electrolyte-inhibiting ion conductor


The use of ion-conducting materials to protect electrodes is generally described. The ion-conducting material may be in the form of a layer that is adjacent to a polymeric layer, such as a porous separator, to form a composite.
Sion Power Corporation


08/20/15
20150236321 

Electrode assembly, battery cell, manufacturing electrode assembly, and manufacturing battery cell


The present invention relates to a method of manufacturing an electrode assembly, the method including: preparing an electrode laminate including at least one negative electrode, at least one positive electrode, and at least one separation film; generating a separation film assembly by bonding remaining portions of the separation film positioned in regions not corresponding to shapes of the negative electrode and the positive electrode; and cutting the separation film assembly so as to correspond to the shapes of the negative electrode and the positive electrode, and an electrode assembly manufactured by the method.. .
Lg Chem, Ltd.


08/20/15
20150236267 

Organic electroluminescence device


An organic electroluminescence (el) device including an anode; an emission layer for obtaining luminescence via a singlet excited state; and a laminated structure between the anode and the emission layer, the laminated structure including at least three layers having different components.. .
Samsung Display Co., Ltd.


08/20/15
20150236242 

Single-crystal piezoelectric fiber composite and magnetoelectric laminate composite including the same


A piezoelectric fiber composite and a magnetoelectric laminate composite including the same are disclosed. The piezoelectric fiber composite includes a first protective layer having a first electrode, a second protective layer having a second electrode, and a piezoelectric fiber layer formed between the first and the second electrode and having piezoelectric fibers arranged in the longitudinal direction of the composite, wherein the piezoelectric fibers include a single-crystal piezoelectric material and are configured such that a <011> direction of the single crystal is identical to a thickness direction of the composite and a <001> direction of the single crystal is identical to a longitudinal direction of the composite, thus exhibiting superior piezoelectric strain properties and sensing properties.
Korea Institute Of Machinery And Minerals


08/20/15
20150236207 

Semiconductor light emitting element


The present disclosure relates to a semiconductor light emitting element. The semiconductor light emitting element has a first conductivity type layer, a light emitting layer, and a second conductivity type layer that are laminated; a first pad electrode provided to the first conductivity type layer; and second pad electrodes provided to the second conductivity type layer.
Nichia Corporation


08/20/15
20150236194 

Method of manufacturing microarray type nitride light emitting device


A method of manufacturing a microarray type nitride light emitting device includes forming a light emitting semiconductor layer by sequentially laminating a buffer layer, an n-type nitride contact layer, an active layer, and a p-type nitride contact layer on a substrate, forming a first transparent contact layer on the formed light emitting semiconductor layer, dividing a microarray type light emitting region through heat treatment of the first transparent contact layer through formation of a pattern, and connecting the divided light emitting regions by a second transparent contact layer.. .
Electronics And Telecommunications Research Institute


08/20/15
20150236182 

Smart photovoltaic cells and modules


A solar photovoltaic module laminate for electric power generation is provided. A plurality of solar cells are embedded within module laminate and arranged to form at least one string of electrically interconnected solar cells within said module laminate.
Solexel, Inc.


08/20/15
20150236170 

Semiconductor device


The performances of a semiconductor device are improved. Between a memory gate electrode and a p type well, and between a control gate electrode and the memory gate electrode of a split gate type nonvolatile memory, an insulation film having a charge accumulation layer therein is formed.
Renesas Electronics Corporation


08/20/15
20150236152 

Semiconductor device


A semiconductor device includes a pillar-shaped silicon layer. A sidewall having a laminated structure including an insulating film and silicon resides on an upper sidewall of the pillar-shaped silicon layer.
Unisantis Electronics Singapore Pte. Ltd.


08/20/15
20150236121 

Semiconductor device and forming the same


A semiconductor device comprising a substrate, a channel layer over the substrate, an active layer over the channel layer and a laminate layer in contact with the active layer. The active layer has a band gap discontinuity with the channel layer..
Taiwan Semiconductor Manufacturing Company, Ltd.


08/20/15
20150236003 

Method of manufacturing semiconductor device


A method of manufacturing a semiconductor device obtained by laminating a first semiconductor chip and a second semiconductor chip with different planar sizes when seen in a plan view on a wiring board via an adhesive material, in which the second semiconductor chip with a relatively larger planar size is mounted on the first semiconductor chip with a relatively smaller planar size. Also, after the first and second semiconductor chips are mounted, the first and second semiconductor chips are sealed with resin.
Renesas Electronics Corporation


08/20/15
20150235994 

Semiconductor device and manufacturing a semiconductor device


A semiconductor device comprises the following: a wiring substrate having on one side a recessed section and a plurality of connection pads; a first semiconductor chip mounted in the recessed section; a second semiconductor chip that has a plurality of electrode pads on the surface of at least one end section (in this case, both ends) and that is laminated onto the first semiconductor chip so that at least one end section (in this case, both ends) protrudes from the first semiconductor chip; a plurality of wires that mutually and electrically connect the plurality of connection pads of the wiring substrate and the plurality of electrode pads of the second semiconductor chip. One end section of the second semiconductor chip extends beyond the inner surface of the recessed section and is supported by one side of the wiring substrate..
Ps5 Luxco S.a.r.l.


08/20/15
20150235986 

Selective area heating for 3d chip stack


A method of forming a 3d package. The method may include joining an interposer to a laminate chip carrier with the solid state diffusion of a first plurality of solder bumps by applying a first selective non-uniform heat and first uniform pressure; joining a top chip to the interposer with the solid state diffusion of a second plurality of solder bumps by applying a second selective non-uniform heat and second uniform pressure; heating the 3d package, the first and second pluralities of solder bumps to a temperature greater than the reflow temperature of the first and second pluralities of solder bumps, where the second plurality of solder bumps achieves the reflow temperature before the first plurality of solder bumps, where the first and second selective non-uniform heats being less that the reflow temperature of the first and second pluralities of solder bumps, respectively..
International Business Machines Corporation


08/20/15
20150235934 

Methods and thinner package on package structures


Methods and apparatus for thinner package on package (“pop”) structures. A structure includes a first integrated circuit package including at least one integrated circuit device mounted on a first substrate and a plurality of package on package connectors extending from a bottom surface; and a second integrated circuit package including at least another integrated circuit device mounted on a second substrate and a plurality of lands on an upper surface coupled to the plurality of package on package connectors, and a plurality of external connectors extending from a bottom surface; wherein at least the second substrate is formed of a plurality of layers of laminated dielectric and conductors.
Taiwan Semiconductor Manufacturing Company, Ltd.


08/20/15
20150235879 

Device and wafer taping


In accordance with some embodiments, a wafer taping device is provided. The wafer taping device includes a tape delivering along a first direction.
Taiwan Semiconductor Manufacturing Co., Ltd.


08/20/15
20150235871 

Vacuum laminating manufacturing semiconductor apparatus


A vacuum laminating apparatus for use in manufacturing a semiconductor apparatus, including a frame mechanism to surround at least a side face of a support-base attached encapsulant including a thermosetting resin layer stacked as an encapsulant on a support base, the frame mechanism including a holding unit to hold a substrate on which semiconductor devices are mounted or a wafer on which semiconductor devices are formed with the substrate or the wafer facing and spaced apart from the thermosetting resin layer of the support-base attached encapsulant, the vacuum laminating apparatus capable of vacuum laminating the support-base attached encapsulant surrounded by the frame mechanism together with the substrate or wafer. The vacuum laminating apparatus inhibit the occurrence of voids in resin layer and warp of a substrate or wafer and manufacture a semiconductor apparatus having a precisely formed resin layer, even when the substrate or wafer used has a large area..
Shin-etsu Chemical Co., Ltd.


08/20/15
20150235753 

Sheet-shaped inductor, inductor within laminated substrate, and manufacturing said inductors


A sheet-shaped inductor includes a magnetic core and a coil. First and second via holes respectively pass through, in a lamination direction, two surfaces facing each other of the magnetic core.
Nec Tokin Corporation


08/20/15
20150235752 

Compact triangular core transformer


A three-phase stacked triangular transformer core is provided. The transformer has three legs and six yoke parts therebetween, wherein the legs include stacked laminations.
Abb Technology Ltd


08/20/15
20150235749 

Magnetic core


A magnetic core utilized in a reactor includes an upper yoke, a bottom yoke, and at least two core columns. The closed magnetic loop is formed by the upper yoke, the bottom yoke, and the core columns.
Delta Electronics (shanghai) Co., Ltd.


08/20/15
20150235734 

Protective material for wiring harness and protective member for wiring harness


It is aimed to provide a protective material for wiring harness which is good in adhesiveness, makes tensile strength of a protective member for wiring harness difficult to decrease at a high temperature and is excellent in heat resistance, a protective member for wiring harness and a wiring harness. A protective material for wiring harness 1 is composed of a nonwoven fabric laminate formed by laminating at least two nonwoven fabrics, and the nonwoven fabric laminate includes a base nonwoven fabric 2 mainly containing main fibers and configured to impart strength and a heat adhesive nonwoven fabric 3 mainly containing binder fibers having a heat adhesive property and configured to impart thermoformability..
Sumitomo Electric Industries, Ltd.


08/20/15
20150235688 

Memory element and memory apparatus


According to some aspects, a layered structure includes a memory layer, a magnetization-fixed layer, and a tunnel insulating layer. The memory layer has magnetization perpendicular to a film face in which a direction of the magnetization is configured to be changed according to information by applying a current in a lamination direction of the layered structure.
Sony Corporation


08/20/15
20150234494 

Non-overlapped integral capacitive touch screen with ito (indium tin oxide) layer and manufacturing method thereof


Disclosed are a non-overlapped integral capacitive touch screen with an ito (indium tin oxide) layer and the manufacturing method thereof. The non-overlapped integral capacitive touch screen with the ito layer comprises a transparent substrate, and a silicon dioxide layer, a niobium pentoxide layer, a black resin layer, ito electrodes and an insulating layer sequentially laminated on the transparent substrate.
Shenzhen Baoming Technology Ltd.


08/20/15
20150234486 

Touch panel and manufacturing method thereof


A manufacturing method of a touch panel is provided. The method comprises the following procedures: forming a sensing electrode layer on a cover plate, wherein the sensing electrode layer comprises a plurality of first axis electrodes, a plurality of second axis electrodes, a plurality of bonding pads and a plurality of first periphery traces; forming a insulating layer on the sensing electrode layer, wherein a plurality of first via holes and a plurality of second via holes are formed on the insulating layer; forming a jumper layer on the insulating layer, wherein the jumper layer comprises a plurality of jumper traces and a plurality of second periphery traces.
Tpk Touch Solutions Inc.


08/20/15
20150234430 

Electronic device display stack


This disclosure describes electronic devices that include displays for rendering content, touch sensors disposed beneath the displays for detecting touch inputs, and antiglare components for reducing glare caused by ambient light. In some embodiments, the displays include a single transparent substrate, a thin film transistor array connected to a bottom surface of the transparent substrate, a conductive substrate, and a front plane laminate connected to the conductive substrate.
Amazon Technologies, Inc.


08/20/15
20150234210 

Colored polarizing films, colored polarizing sheets, and colored polarizing lenses, and methods thereof


A polarizing film is produced by swelling a polyvinyl alcohol film with water, uniaxially stretching it, dyeing it with an organic dichroic dye, and drying it, wherein a dichroic organic dye composition includes a combination of organic dyes having a dichroic ratio of 13 or higher used in an amount to keep the degree of polarization at 90% or more, and wherein the coloration dye composition comprises a combination of dyes having extremely low dichroic ratios of 4 or less or substantially having no dichroic ratio, laminating at least one layer of a transparent plastic sheet onto at least both sides of the polarizing film, curving the polarizing sheet so as to impart spherical or aspherical surfaces thereto to obtain a polarizing and injecting a transparent resin to the concave surface of the curved polarizing sheet to obtain an injection polarizing lens.. .
Mgc Filsheet Co., Ltd.


08/20/15
20150234107 

Method for producing retardation film


A method for producing a retardation film comprising the steps of: co-extruding or simultaneously casting a thermoplastic resin a and a thermoplastic resin b to obtain a laminated film comprising a layer of the thermoplastic resin a and a layer of the thermoplastic resin b; and uniaxially stretching the laminated film at least twice to cross a molecular orientation axis in the layer of the thermoplastic resin a and a molecular orientation axis in the layer of the thermoplastic resin b each other at almost right angles.. .
Zeon Corporation


08/20/15
20150234099 

Method for producing light control panel


A method for producing a light control panel includes a first step of forming a block 19 in which transparent sheets 16 of glass, ceramic or transparent plastic and mirror sheets 17 each having a metallic reflective surface on one side or both sides are alternately stacked and laminated, and a second step of forming a first light control panel 13 and a second light control panel 14 to be stacked with planar light-reflective portions 11, 12 of each of the first and the second light control panels 13, 14 in a crossed state, the first and the second light control panels 13, 14 being arranged opposed to each other, by cutting out from the block 19 on a surface crossing the transparent sheets 16 and the mirror sheets 17 in a manner that makes the thickness of a cutout constant.. .
Asukanet Company, Ltd.


08/20/15
20150234096 

Method and manufacturing optical display device


A method for manufacturing an optical display device comprising: after completing lamination of a preceding optical film sheet to one of opposite surfaces of a preceding panel component at the predetermined laminating position, unwinding the carrier film in a state where another surface thereof folded to inside at a tip-end configuring a head portion of a peeling member and the carrier film is passed around the peeling member, and backwardly feeding a leading end of the optical film sheet supported on the carrier film to a predetermined feeding position provided at upstream of the tip-end of the peeling member.. .
Nitto Denko Corporation




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Lamina topics: Inflatable Bladder, Transverse, Surfactant, Electric Conversion, Semiconductor Material, Semiconductor, Electronic Device, Liquid Crystal, Liquid Crystal Display, Scattering, Planarization, Phosphorus, Epoxy Resin, Copper Clad Laminate, Benzoxazine

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