Integrated Circuit

Integrated Circuit-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).

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NEW Adapter cooling apparatus and method for modular computing devices
May 25, 2017 - N°20170150643

Disclosed herein are apparatuses and methods for the cooling of electronic components of a com-express module using an adapter module to become vita-59 compliant module. The adapter module operatively and thermally couple to a modular computing device, e. G., the com-express compliant module, configured with a conduction-cooled plate to provide an additional path for conducting thermal energy generated from integrated ...
NEW Interconnect structure for e/o engines having impedance compensation at the integrated circuits' front end
May 25, 2017 - N°20170150593

Disclosed embodiments relate to an interconnect structure for coupling at least one electronic unit for outputting and/or receiving electric signals, and at least one optical unit for converting said electric signals into optical signals and/or vice versa, to a further electronic component. The interconnect structure comprises an electrically insulating substrate and a plurality of signal lead pairs to ...
NEW Secure electronic subscriber identity module (esim) restoration
May 25, 2017 - N°20170150356

A secure element uses a backup context to restore a deleted electronic subscriber identity module (esim) without compromising a trust relationship with a mobile network operator (mno). A backup copy of a data binary large object (data blob) originally used to instantiate the esim is retrieved. The secure element determines if the esim within the data blob is uniquely associated ...
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NEW Method, system, and computer-readable recording medium for processing network traffic
May 25, 2017 - N°20170149936

There are provided a method, a system, and a computer-readable recording medium for processing network traffic. A method for processing network traffic using a switching application specific integrated circuit (asic) includes generating, by a software forwarder operated in a software-based network operating system, a message including network processing information, transmitting the message to a switch manager operated in a hardware-based ...
NEW Devices and methods related to packaging of radio-frequency devices on ceramic substrates
May 25, 2017 - N°20170149466

Devices and methods related to packaging of radio-frequency (rf) devices on ceramic substrates. In some embodiments, a packaged electronic device can include a ceramic substrate configured to receive one or more components. The ceramic substrate can include a conductive layer in electrical contact with a ground plane. The packaged electronic device can further include a die having an integrated circuit ...
NEW High resolution capture
May 25, 2017 - N°20170149418

A high resolution capture circuit and integrated circuit chip are disclosed and include first and second capture delay lines and an oscillator delay line. The oscillator delay line includes n timing delay elements sequentially coupled in a ring to generate a first clock signal. The first and second capture delay lines each include m capture delay elements sequentially coupled to ...
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NEW Motor component and integrated circuit for driving motor
May 25, 2017 - N°20170149312

A motor component and an integrated circuit for driving a motor are provided. The integrated circuit includes a housing, pins extended out from the housing, and a switch control circuit disposed on a semiconductor substrate. The semiconductor substrate and the switch control circuit are packaged in the housing. The switch control circuit is configured to generate a control signal for ...
NEW Application apparatus, motor assembly and integrated circuit for driving motor
May 25, 2017 - N°20170149311

A motor assembly and an integrated circuit for motor drive. The motor assembly includes a single-phase permanent-magnet synchronous motor capable of being powered by an ac power source and an integrated circuit, wherein the single-phase permanent-magnet synchronous motor comprises a stator and a permanent-magnet rotor capable of rotating relative to the stator, the stator comprises a stator iron core and ...
NEW Digital ground-fault circuit interrupter
May 25, 2017 - N°20170149235

A gfci circuit that includes an electronically controllable main switch that can turn on, and turn off, the delivery of electrical power from the gfci circuit. The main switch is controlled and monitored by a microcontroller unit using at least digital input and digital output signals, and which includes analog to digital converter. The microcontroller unit may also use the ...
NEW Solar cells and modules with fired multilayer stacks
May 25, 2017 - N°20170148937

Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer ...
NEW Fired multilayer stacks for use in integrated circuits and solar cells
May 25, 2017 - N°20170148933

Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer ...
NEW Integrated circuit structure and method with solid phase diffusion
May 25, 2017 - N°20170148879

A method includes forming fin semiconductor features on a substrate. A dopant-containing dielectric material layer is formed on sidewalls of the fin semiconductor features and the substrate. A precise material modification (pmm) process is performed to the dopant-containing dielectric material layer. The pmm process includes forming a first dielectric material layer over the dopant-containing dielectric material layer; performing a tilted ...
NEW Integrated circuit comprising a metal-insulator-metal capacitor and fabrication method thereof
May 25, 2017 - N°20170148869

The disclosed technology relates to a metal-insulator-metal capacitor (mimcap) integrated as part of a back-end-of-line of an integrated circuit (ic). In one aspect, a mimcap comprises a first planar electrode having perforations formed therethrough, and a metal-insulator-metal (mim) stack lining inner surfaces of cavities formed in the perforations and extending into the substrate. The mimcap additionally comprises a second electrode ...
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NEW Etchstop layers and capacitors
May 25, 2017 - N°20170148867

Capacitor structures for integrated circuit devices are provided. Capacitors include proximate dense or highly dense etchstop layers. The dense or highly dense etchstop layer is, for example, a high-k material. Capacitors are, for example, metal-insulator-metal (mim) capacitors and are useful in dram (dynamic random access memory) and edram (embedded dynamic random access memory) structures.
NEW Semiconductor device and manufacturing method thereof
May 25, 2017 - N°20170148827

It is an object of the present invention to provide a method for preventing a breaking and poor contact, without increasing the number of steps, thereby forming an integrated circuit with high driving performance and reliability. The present invention applies a photo mask or a reticle each of which is provided with a diffraction grating pattern or with an auxiliary ...
NEW Three-dimensionally integrated circuit devices including oxidation suppression layers
May 25, 2017 - N°20170148804

A vertically integrated circuit device can include a substrate having a first region reserved for first functional circuits of the vertically integrated circuit device, where the first functional circuits has a substantially constant top surface level across the first region and having a second region reserved for second functional circuits of the vertically integrated circuit device and spaced apart from ...
NEW Two-transistor sram semiconductor structure and methods of fabrication
May 25, 2017 - N°20170148795

A two-transistor memory cell based upon a thyristor for an sram integrated circuit is described together with a process for fabricating it. The memory cell can be implemented in different combinations of mos and bipolar select transistors, or without select transistors, with thyristors in a semiconductor substrate with shallow trench isolation. Standard cmos process technology can be used to manufacture ...
NEW P-channel multi-time programmable (mtp) memory cells
May 25, 2017 - N°20170148794

Multi-time programmable (mtp) memory cells, integrated circuits including mtp memory cells, and methods for fabricating mtp memory cells are provided. In an embodiment, an mtp memory cell includes a semiconductor substrate, a p-well formed in the semiconductor substrate, and an n-well formed in the semiconductor substrate and isolated from the p-well. The mtp memory cell further includes a p-channel transistor ...
NEW Stop layer through ion implantation for etch stop
May 25, 2017 - N°20170148790

A process for etching a bulk integrated circuit substrate to form features on the substrate, such as fins, having substantially vertical walls comprises forming an etch stop layer beneath the surface of the substrate by ion implantation, e. G., carbon, oxygen, or boron ions or combinations thereof, masking the surface with a patterned etching mask that defines the features by ...
NEW Six-transistor sram semiconductor structures and methods of fabrication
May 25, 2017 - N°20170148782

A two-transistor memory cell based upon a thyristor for an sram integrated circuit is described together with a process for fabricating it. The memory cell can be implemented in different combinations of mos and bipolar select transistors, or without select transistors, with thyristors in a semiconductor substrate with shallow trench isolation. Standard cmos process technology can be used to manufacture ...
NEW Integrated circuit packages and methods of forming same
May 25, 2017 - N°20170148768

Packages and methods of manufacture thereof are described. A package may include a first package and a die structure disposed over the first package. The first package may include: a first encapsulant; a first via structure within the first encapsulant; a first die within the first encapsulant, at least a portion of the first encapsulant being interposed between a sidewall ...