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Integrated Circuit

Integrated Circuit-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Light brightness and color temperature control unit
Afx Inc.
November 09, 2017 - N°20170325298

A light control unit that includes a housing sized and shaped as a standard electrical dimmer switch that can reside in an a standard electrical handy box and at least one integrated circuit that comprises a brightness dimming control adapted to reduce and increase brightness of one or more light sources, for example a series of light sources, electronically connected ...
Multi-mode power-efficient light and gesture sensing in image sensors
Invisage Technologies, Inc.
November 09, 2017 - N°20170324901

Various embodiments comprise apparatuses and methods including an image sensor. In one example, the image sensor includes a read-out integrated circuit, a plurality of pixel electrodes, an optically sensitive layer, and a top electrical contact. In a first low-power mode, electrical current passing through the top electrical contact is configured to be sensed, and independent currents passing through the plurality ...
Uicc sms routing to device application
Cellco Partnership D/b/a Verizon Wireless
November 09, 2017 - N°20170324804

Information regarding the status of an update to a universal integrated circuit card (uicc) being performed across a mobile wireless communication network is provided to a server involved in the update process and/or to a user of the mobile communication device having the uicc. The uicc update server sends an update trigger to the mobile communication device, and the ...
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System for wireless charging of a plurality of devices
Golba Llc
November 09, 2017 - N°20170324448

A master unit for wirelessly charging a slave device includes a plurality of radio frequency integrated circuit (rfic) modules, each of the plurality of rfic modules having an antenna array. The master unit is configured to select one of a single beam mode by using all or substantially all antenna arrays in the plurality of rfic modules, a multi-beam mode ...
Multiple band multiple mode transceiver front end flip-chip architecture and circuitry with integrated power amplifiers
Skyworks Solutions, Inc.
November 09, 2017 - N°20170324432

An integrated circuit architecture and circuitry is defined by a die structure with a plurality of exposed conductive pads arranged in a grid of rows and columns. The die structure has a first operating frequency region with a first transmit and receive chain, and a second operating frequency region with a second transmit chain and a second receive chain. There ...
Voltage converter integrated circuit with an integrated bootstrap capacitor
Chengdu Monolithic Power Systems, Co., Ltd.
November 09, 2017 - N°20170324411

A bootstrap circuit integrated to a voltage converter integrated circuit (ic) and a voltage converter ic for a switch mode voltage regulator. The bootstrap circuit is used to provide a bootstrap voltage signal for driving a high side switch of the voltage converter ic. The bootstrap circuit has a pre-charger and a bootstrap capacitor. The pre-charger provides a first bootstrap ...
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Integrated Circuit Patent Applications
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inventor
  • 3515+ full patent PDF documents of Integrated Circuit-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Semiconductor integrated circuit
Renesas Electronics Corporation
November 09, 2017 - N°20170324399

An object of the present invention is to reduce burden on a program for changing an operation mode of an internal circuit in accordance with an internal clock frequency without mounting a large-scale circuit in an lsi in which setting of the frequency of an internal clock can be dynamically changed. In an lsi including an internal clock generation circuit ...
Calibration of push-pull amplifier to a low second order distortion
Telefonaktiebolaget Lm Ericsson (publ)
November 09, 2017 - N°20170324383

An integrated circuit comprises a first amplifier circuit with a push-pull amplifier configured to be calibrated to a low second order distortion. The integrated circuit further comprises a second amplifier circuit with at least one push-pull amplifier, wherein a size ratio between sizes of the transistors is adjustable by adjusting the size of at least one transistor device. The size ...
Apparatus and method for receiving wireless power
Samsung Electronics Co., Ltd.
November 09, 2017 - N°20170324253

An apparatus for controlling wireless power transmission includes a near-field wireless communication antenna for receiving wireless power transmission control signals from a power transmitting device at a communication frequency, a near-field wireless communication integrated circuit (ic) for delivering wireless power transmission control messages based on the wireless power transmission control signals received through the near-field wireless communication antenna to a ...
Trigate transistor structure with unrecessed field insulator and thinner electrodes over the field insulator
Intel Corporation
November 09, 2017 - N°20170323965

Techniques related to integrated circuits having mosfets with an unrecessed field insulator and thinner electrodes over the field insulator of ics, systems incorporating such integrated circuits, and methods for forming them are discussed.
Integrated circuit structure and method with solid phase diffusion
Taiwan Semiconductor Manufacturing Company, Ltd.
November 09, 2017 - N°20170323943

The present disclosure provides a semiconductor structure. The semiconductor structure includes a fin active region formed on a semiconductor substrate and spanning between a first sidewall of a first shallow trench isolation (sti) feature and a second sidewall of a second sti feature; an anti-punch through (apt) feature of a first type conductivity; and a channel material layer of the ...
Semiconductor integrated circuits having contacts spaced apart from active regions
Samsung Electronics Co .. Ltd.
November 09, 2017 - N°20170323889

First and second active regions are doped with different types of impurities, and extend in a first direction and spaced apart from each other in a second direction. First and third gate structures, which are on the first active region and a first portion of the isolation layer between the first and second active regions, extend in the second direction ...
Semiconductor integrated circuit and logic circuit
Socionext Inc.
November 09, 2017 - N°20170323887

Disclosed herein is a driver circuit including first and second n-channel transistors connected together in series between first and second nodes. The first n-channel transistor is comprised of n fin transistor(s) having an identical gate length and an identical gate width where n is equal to or greater than one, and has its gate connected to a first input ...
Integrated Circuit Patent Pack
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Integrated Circuit Patent Applications
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For professional research & prior art discovery
inventor
  • 3515+ full patent PDF documents of Integrated Circuit-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Integrated circuit and method of fabricating the same
Taiwan Semiconductor Manufacturing Co., Ltd.
November 09, 2017 - N°20170323877

A layout includes a plurality of cells and at least one dummy gate electrode continuously extends across the cells. Since the dummy gate electrode is electrically conductive, the dummy gate electrode can be utilized for interconnecting the cells. That is, some signals may travel through the dummy gate electrode rather than through a metal one line or a metal two ...
Integrated circuit assembly that includes stacked dice
Intel Corporation
November 09, 2017 - N°20170323874

An integrated circuit assembly that includes a substrate; a member formed on the substrate; a first die mounted to the substrate within an opening in the member such that there is space between the first die and the member and the member surrounds the first die, and wherein the first die does not extend above an upper surface of the ...
Backside fib probing detector in a forward and reverse body biasing architecture
Stmicroelectronics (rousset) Sas
November 09, 2017 - N°20170323859

An integrated circuit including a plurality of first semiconductor strips of a first conductivity type and of second semiconductor strips of a second conductivity type arranged in alternated and contiguous fashion on a region of the second conductivity type, including for each of the first strips: a plurality of bias contacts; for each bias contact, a switch capable of applying ...
Feeding overlay data of one layer to next layer for manufacturing integrated circuit
United Microelectronics Corp.
November 09, 2017 - N°20170323854

A method of manufacturing an integrated circuit includes the following steps. A substrate including a plurality of exposure fields is provided, and each of the exposure fields includes a target portion and a set of overlay marks. The substrate is exposed to form a first layer lithography pattern on the target portion for the respective exposure field by an exposure ...
Integrated fan-out package and method of fabricating the same
Taiwan Semiconductor Manufacturing Co., Ltd.
November 09, 2017 - N°20170323853

An integrated fan-out package including an integrated circuit, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated circuit includes an active surface, a plurality of sidewalls connected to the active surface, and a plurality of pads distributed on the active surface. The insulating encapsulation encapsulates the active surface and the sidewalls of the integrated circuit. The insulating ...
Gas-cooled 3d ic with wireless interconnects
Rochester Institute Of Technology
November 09, 2017 - N°20170323843

A three-dimensional integrated circuit includes two or more stacks of one or more active layers; a gas-cooling layer separating the two or more stacks and a wireless interconnect between the two or more stacks enabling communication between the two or more stacks and system including a gas-cooled three-dimensional integrated circuit having wireless data interconnects is disclosed.
Electronic device provided with an integral conductive wire and method of manufacture
Stmicroelectronics (grenoble 2) Sas
November 09, 2017 - N°20170323841

An electronic device includes a supporting substrate having a front mounting face and an electrical connection network. An integrated circuit chip is mounted to the mounting face and is electrically connected to the electrical connection network. A primary encapsulation block embeds the integrated circuit chip and extends above and around the integrated circuit chip on the mounting face of the ...
Integrated circuit package having pin up interconnect
Twisden Ltd.
November 09, 2017 - N°20170323830

An integrated circuit package and manufacturing method thereof are described. The integrated circuit package includes pin up conductive plating to form an interconnect, where an opening on a patterned fifth layer photo-resist material located at bottom portion of a base developed for etching selectively the base to form at least an internal opening and at least a positioning opening, wherein ...
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