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Integrated Circuit

Integrated Circuit-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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NEW Terminal device, integrated circuit, and communication method
Sharp Kabushiki Kaisha
January 18, 2018 - N°20180020484

In a first case, in which a condition is satisfied that includes at least conditions that at least one scheduling request is pending in a certain tti, there is no ul-sch resource available for transmission in the certain tti, and a terminal device has a valid resource for a physical uplink control channel for the scheduling request configured for the ...
NEW Terminal device, integrated circuit, and communication method
Sharp Kabushiki Kaisha
January 18, 2018 - N°20180020473

A terminal device is configured to instruct an rrc to release a pucch for all serving cells, in a case, in which a condition is satisfied that includes at least a condition that the terminal device has a valid pucch resource for an sr configured, in the primary cell, for the certain tti, when a value of the counter is ...
NEW Terminal device, base station device, communication method, and integrated circuit
Sharp Kabushiki Kaisha
January 18, 2018 - N°20180020430

A terminal device configured to efficiently transmit uplink control information includes a transmission unit configured to perform an aperiodic csi report on the basis of first information and a value of a 2-bit csi request field and perform the aperiodic csi report on the basis of second information and a value of a 3-bit csi request field. In a case ...
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NEW Terminal device, base station device, radio communication method, and integrated circuit
Sharp Kabushiki Kaisha
January 18, 2018 - N°20180020378

A terminal device derives the number of repetitive transmissions and/or repetitive receptions required on the basis of the downlink reference signal received power, compares that number with the number of repetitive transmissions and/or repetitive receptions configured in the terminal device, performs a random access procedure upon the numbers being different from each other, and determines a configuration for ...
NEW Method and apparatus for selecting profile of terminal in mobile network
Samsung Electronics Co., Ltd.
January 18, 2018 - N°20180020342

A method and apparatus of selecting profiles is provided that provides communication services of a terminal equipped with embedded universal integrated circuit card (euicc) (or embedded subscriber identity module (esim)) and universal integrated circuit card (uicc). The method of selecting a profile in a terminal including a plurality of subscriber identity module (sims) that differ from each other in type, ...
NEW Stacked chip microphone
Knowles Electronics, Llc
January 18, 2018 - N°20180020275

A microphone device comprises a base, a port formed in the base, a cover attached to the base that forms a housing interior with the base, an mems element disposed in the housing interior and on top of the port, and an integrated circuit stacked on top of the mems element. The mems element includes a diaphragm and a backplate ...
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  • 3515+ full patent PDF documents of Integrated Circuit-related inventions.
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NEW Method and apparatus for re-establishing a ring topology following a loss of power
Cooper Technologies Company
January 18, 2018 - N°20180019896

A gateway for a computer network includes a programmable integrated circuit device, and a first port and a second port coupled to the programmable integrated circuit device. The programmable integrated circuit device is structured and configured to, responsive to a restoration of power to the gateway following a loss of power at the gateway, read configuration information stored by the ...
NEW Baseband integrated circuit for performing digital communication with radio frequency integrated circuit and device including ...
Samsung Electronics Co., Ltd.
January 18, 2018 - N°20180019865

A baseband ic for performing digital communication with an rfic and a device including the same. The baseband ic for performing digital communication with an rfic includes a digital interface circuit configured to receive a frame signal including at least one sampled signal from the rfic according to a digital interface protocol, reconstruct the at least one sampled signal from ...
NEW Terminal device, base station device, communication method, and integrated circuit
Sharp Kabushiki Kaisha
January 18, 2018 - N°20180019853

A terminal device configured to efficiently transmit uplink control information uses, if harq-ack corresponds to transmission on a physical downlink shared channel (pdsch) only in a first serving cell, a first pucch format and a first pucch resource for transmission of the harq-ack and channel state information, and, if the harq-ack corresponds to the transmission on a pdsch in a ...
NEW Integrated circuit
Sun Patent Trust
January 18, 2018 - N°20180019846

A wireless communication base station apparatus prevents degradation of throughput of lte terminals, even when lte terminals and lte+ terminals are present together. A setting section sets in each subframe a resource block in which is arranged a reference signal that is employed solely by lte+ terminals, based on the pattern of arrangement of reference signals employed solely by lte+ ...
NEW Systems and methods for non-volatile flip flops
Freescale Semiconductor, Inc.
January 18, 2018 - N°20180019735

A non-volatile flip flop integrated circuit includes a master latch circuit, a slave latch circuit coupled to the master latch circuit, and a non-volatile memory array coupled to the slave latch circuit. The non-volatile memory array includes a first pair of memory cells coupled to the slave latch circuit, and a second pair of memory cells coupled to the slave ...
NEW Methods and apparatus for efficient linear combiner
Texas Instruments Incorporated
January 18, 2018 - N°20180019732

In accordance with an example, an integrated circuit includes a linear combiner having an input for receiving a signal. The linear combiner also has a plurality of operator circuits for applying weighting factors to the signal, in which a first operator circuit in the plurality of operator circuits performs a first operation on the signal using a first sub-weight of ...
NEW Input/output cell
Nxp B.v.
January 18, 2018 - N°20180019709

An integrated circuit and method are provided. The integrated circuit comprises: a digital core configured to output a first voltage signal: and a first input/output cell: wherein the first input/output cell is configured to convert the first voltage signal to a first current signal and provide the first current signal to circuitry external to the integrated circuit.
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NEW Top electrode for device structures in interconnect
Taiwan Semiconductor Manufacturing Co., Ltd.
January 18, 2018 - N°20180019390

Some embodiments relate to an integrated circuit device, which includes a bottom electrode, a dielectric layer, and top electrode. The dielectric layer is disposed over the bottom electrode. The top electrode is disposed over the dielectric layer, and an upper surface of the top electrode exhibits a recess. A via is disposed over the top electrode. The via makes electrical ...
NEW Magnetoresistance effect element, magnetic memory device, manufacturing method, operation method, and integrated circuit
Tohoku University
January 18, 2018 - N°20180019388

A magnetoresistance effect element includes a bias layer comprised of an antiferromagnetic material and having a shape in which a first length in a first direction greater than a second length in a second direction perpendicular to the first direction, a recording layer comprised of a ferromagnetic material and being disposed on the bias layer, a direction of magnetization of ...
NEW Three-dimensional semiconductor integrated circuit device and method of manufacturing the same
Sk Hynix Inc.
January 18, 2018 - N°20180019336

A semiconductor integrated circuit device may include an isolating layer, a buried gate, source and drain regions, a dielectric layer having a high dielectric constant and an insulating interlayer. The isolating layer may be formed on a semiconductor substrate to define an active region. The buried gate may be formed in the active region of the semiconductor substrate. The source ...
NEW Method and structure for dual sheet resistance trimmable thin film resistors at same level
Texas Instruments Deutschland Gmbh
January 18, 2018 - N°20180019297

An integrated circuit includes a higher sheet resistance resistor and a lower sheet resistance resistor, disposed in a same level of dielectric layers of the integrated circuit. The higher sheet resistor has a body region and head regions in a higher sheet resistance layer. The lower sheet resistor has a body region and head regions in a lower sheet resistance ...
NEW Integrated circuits with programmable memory and methods for producing the same
Globalfoundries Singapore Pte. Ltd.
January 18, 2018 - N°20180019249

Methods of producing integrated circuits and integrated circuits produced by those methods are provided. In an exemplary embodiment, a method of producing an integrated circuit includes forming first and second shallow trench isolations within a substrate, where the first and second shallow trench isolations have an initial shallow trench height. A base well is formed in the substrate, where the ...
NEW Integrated circuit package assembly
Taiwan Semiconductor Manufacturing Co., Ltd.
January 18, 2018 - N°20180019229

An integrated circuit package assembly includes a first integrated circuit package and a second integrated circuit package. The first integrated circuit package includes a first integrated circuit die mounted on a first substrate. The second integrated circuit package includes a second integrated circuit die mounted on a second substrate. The second integrated circuit package is disposed under the first integrated ...
NEW Through silicon via sharing in a 3d integrated circuit
Globalfoundries Inc.
January 18, 2018 - N°20180019227

The present disclosure generally relates to semiconductor structures and, more particularly, to intelligent through silicon via sharing in 3d-ic integrated structures and methods of manufacture. The structure includes: a plurality of stacked dies each containing at least one macro device; and a layer structure positioned between the plurality of stacked dies which comprises a control structured to route signals between ...
NEW Flexible circuit leads in packaging for radio frequency devices and methods thereof
Nxp Usa, Inc.
January 18, 2018 - N°20180019222

A packaged rf device is provided that utilizes flexible circuit leads. The rf device includes at least one integrated circuit (ic) die configured to implement the rf device. The ic die is contained inside a package. In accordance with the embodiments described herein, a flexible circuit is implemented as a lead. Specifically, the flexible circuit lead is coupled to the ...
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