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Heat Sink patents



      
           
This page is updated frequently with new Heat Sink-related patent applications. Subscribe to the Heat Sink RSS feed to automatically get the update: related Heat RSS feeds. RSS updates for this page: Heat Sink RSS RSS


Side-edge backlight module

Replaceable single led lamp for runway sign

Led lighting apparatus with flexible light modules

Date/App# patent app List of recent Heat Sink-related patents
07/17/14
20140199881
 Active cooling of electrical connectors patent thumbnailActive cooling of electrical connectors
An electrical connector having an active cooling system is described herein. The electrical connector can include a conductor having an electrically conductive pin, and a conductor receiver slidably coupled to the conductor.
07/17/14
20140198522
 Side-edge backlight module patent thumbnailSide-edge backlight module
The present invention provides a side-edge backlight module, which includes a backplane, a backlight source arranged inside the backplane, and a light guide plate arranged inside the backplane. The backplane and the backlight source receive an aluminum-extruded heat sink arranged therebetween.
07/17/14
20140198500
 Replaceable single led lamp for runway sign patent thumbnailReplaceable single led lamp for runway sign
A replacement lamp for an airport runway sign. Light is produced by a linear array of white-light leds.
07/17/14
20140198499
 Led lighting apparatus with flexible light modules patent thumbnailLed lighting apparatus with flexible light modules
The present disclosure involves a street light. The street light includes a base, a lamp post coupled to the base, and a lamp head coupled to the lamp post.
07/17/14
20140198498
 Runway sign having a replaceable single led lamp patent thumbnailRunway sign having a replaceable single led lamp
A two-sided airfield runway sign with direct illumination by a single led lamp. Light is produced by a linear array of white-light leds.
07/17/14
20140198487
 Led lamp with asymmetric cylindrical lens for poster display case patent thumbnailLed lamp with asymmetric cylindrical lens for poster display case
A replacement lamp for a cinema poster display case. Light is produced by a linear array of white-light leds.
07/17/14
20140198456
 Set top box having snap-in heat sink and smart card reader with a hold down for retaining the heat sink patent thumbnailSet top box having snap-in heat sink and smart card reader with a hold down for retaining the heat sink
A hold down for an electronic device is provided that includes a bottom frame, a circuit board mounted above the bottom frame, a thermal pad mounted on the circuit board, and a heat sink associated with the thermal pad. The hold down includes a frame that defines a perimeter having a plurality of retainers that are configured to engage with a plurality of mating locations defined on at least a bottom frame to provide a biasing force that retains the heat sink against a circuit board that is positioned between the bottom frame and the hold down..
07/17/14
20140198304
 Projector with fan and heat sinks patent thumbnailProjector with fan and heat sinks
A projector includes a case, an optical engine, a heat sink, a circuit board, and a fan. The case includes two sidewalls, and each sidewall defines an air hole.
07/17/14
20140197702
 Electric motor rotor thermal interface with axial heat sinks patent thumbnailElectric motor rotor thermal interface with axial heat sinks
A cooling system of an electric machine first and second heat sinks respectively mounted to axial ends of a rotor core, and a thermal interfacial material interposed between respective complementary surfaces of the heat sinks and the rotor core for substantially eliminating air gaps therebetween. A method of cooling includes placing thermal interfacial material onto a heat transfer interface between the rotor core and the heat sink, whereby the thermal interfacial material reduces contact resistance at the heat transfer interface.
07/17/14
20140197533
 Semiconductor device and method for manufacturing the semiconductor device patent thumbnailSemiconductor device and method for manufacturing the semiconductor device
A method for manufacturing a semiconductor device is provided, the method including: mounting a first element on a wiring substrate, placing a first heat sink on the first element with a metal material interposed between the first heat sink and the first element, attaching the first heat sink to the first element via the metal material by heating and melting the metal material, and mounting a second element on the wiring substrate after the steps of attaching the first heat sink to the first element.. .
07/17/14
20140197445
Semiconductor light-emitting device
A semiconductor light-emitting device including a favorable radiating structure can include a semiconductor light source sealed between a metallic cap having a light-emitting window and a metallic base attached on a heat sink plate. The semiconductor light-emitting device can also include a holder attaching the metallic base along the metallic cap between the holder and the heat sink plate to efficiently radiate heat generated from the light source, and a thermal interface material layer disposed between at least a top surface of the heat sink plate and an outer bottom surface of the holder so as to be able to enlarge each tolerance of parts composing the light-emitting device.
07/17/14
20140197259
Stationary disc, rotating disc and mill assembly for reducing machines
A reducing machine having an air cooled cutting discs is disclosed. The air cooled discs have cutting surfaces on both sides.
07/17/14
20140196879
Heat sink thermal press for phase change heat sink material
Methods of and apparatuses for electronic board assembly are provided. The apparatus can comprises one or more thermal heads controlled by a programmable logic controller.
07/17/14
20140196871
Semiconductor module cooler and semiconductor module
A semiconductor module cooler includes a fin which is a heat sink, which is thermally connected to a semiconductor element, and which has one or more notches in an edge at one or more arbitrary positions in a longitudinal direction and one or more convex ribs which are formed on a bottom of a water jacket having a cooling flow path and which fit into the one or more notches at one or more arbitrary positions. By doing so, the efficiency of transferring heat generated by the semiconductor element by a coolant is improved and cooling performance is improved..
07/17/14
20140196844
Magnetic heat sink device and heat removal method
A magnetic heat sink device and a heat removal method employs a heat sink device comprising a base assembly and a handle which extends in upright fashion from the base assembly. The base assembly has an array of fins.
07/17/14
20140196281
Method of retrofitting a runway sign with a single led lamp
A method of retrofitting an existing airfield runway sign with a single led lamp. Light is produced by a linear array of white-light leds.
07/10/14
20140193160
Optical module
An optical module includes: a first circuit board on which a connector socket is mounted, an optical transceiver module that is electrically connected to the first circuit board via the connector socket; a heat sink; and a heat dissipating sheet. The optical transceiver module includes: a second circuit board on which an e/o converter, a drive circuit for the e/o converter, an o/e converter, and a current-to-voltage conversion circuit for the o/e converter are mounted; and an optical waveguide that guides an optical signal generated by the e/o converter to an output end of the optical transceiver module, and that guides an input optical signal to the o/e converter.
07/10/14
20140192537
Heat sink and lighting apparatus having same
Provided are a heat sink and a lighting apparatus having same, the heat sink including: a heat radiation plate having a mounting region formed on one side surface thereof on which a driving heat radiation element is mounted, and including a heat radiation hole formed in a central portion thereof, and including a heat radiation hole formed in a central portion thereof; and heat radiation fins provided on the other side surface of the heat radiation plate, and including a plurality of first heat radiation fins radially arranged in a circumferential direction and a plurality of second heat radiation fins having a length shorter than that of the first heat radiation fins and radially arranged between the first heat radiation fins.. .
07/10/14
20140192486
Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate
A power module substrate includes an insulating substrate, and a circuit layer that is formed on one surface of the insulating substrate. The circuit layer is formed by bonding a first copper plate onto one surface of the insulating substrate.
07/10/14
20140192480
Mobile computing device dock station with headset jack heat pipe interface
An improved electronic communications system 100 features a holder assembly 104 such as a mobile computing device dock station 106 and dock heat exchanger providing an external heat sink 162 which when coupled with a user-friendly heat transfer device 164 such as a heat pipe can transfer heat from internal electronic components 146, 148 and 154 and an internal heat sink 157 of an electronic communications device 102, such as a cellular phone or mobile computing device, via a special headset jack-heat pipe interface 167 to help cool the electronic communications device 102. The electronic communications device 102 can also include one or more thermal couplings 158-160 for coupling and providing a thermal pathway(s) from at least one of the internal electronic components 146, 148 and 154 to the internal heat sink 157..
07/10/14
20140191386
Semiconductor package and fabrication method thereof
A semiconductor package is provided. The semiconductor package includes a substrate; a semiconductor element having opposite active and inactive surfaces and disposed on the substrate via the active surface thereof, wherein the inactive surface of the semiconductor element is roughened; a thermally conductive layer bonded to the inactive surface of the semiconductor element; and a heat sink disposed on the thermally conductive layer.
07/10/14
20140191322
Silicon-on-insulator heat sink
An approach for sinking heat from a transistor is provided. A method includes forming a substrate contact extending from a first portion of a silicon-on-insulator (soi) island to a substrate.
07/10/14
20140190676
Unitary graphene material-based integrated finned heat sink
A unitary graphene-based integrated heat sink comprising a heat collection member (base) and at least one heat dissipation member (e.g. Fins) integral to the baser, wherein the base is configured to be in thermal contact with a heat source, collects heat therefrom, and dissipates heat through the fins.
07/10/14
20140190185
System and method for preventing overheating or excessive backpressure in thermoelectric systems
A thermoelectric assembly and a method of operating a thermoelectric assembly are provided. The thermoelectric assembly includes at least one thermoelectric subassembly configured to be in thermal communication with a heat source and configured to be in thermal communication with a heat sink.
07/03/14
20140186669
Polymerized lithium ion battery cells and modules with overmolded heat sinks
A lithium ion (li-ion) battery cell includes a prismatic housing that includes four sides formed by side walls coupled to and extending from a bottom portion of the housing. The housing is configured to receive and hold a prismatic li-ion electrochemical cell element.
07/03/14
20140186155
Apparatus for controlling the flow-rate of liquid of an electric pump and the temperature of the control and actuation electronics of a pumping device that carries the electric pump
An apparatus for controlling the flow-rate of liquid of an electric pump and the temperature of the control and actuation electronics of a pumping device that carries the electric pump, the apparatus comprising, on a single monolithic segment of delivery duct, a flow-rate detector and a heat sink for a control and actuation unit, which is provided with temperature detection elements, the heat sink having a wet side that is exposed to the liquid and a dry side that is sealed from the liquid, with which the control and actuation unit is associated.. .
07/03/14
20140185300
Insulated led device
An led device has an led assembly connected to or abutting a heat sink, the heat sink connected to a cooling bridge and optionally enclosed within insulated connector end caps and crossover end caps and within a reflector cover and side cover. The cooling bridge conducts heat to the heat sink away from the reflector cover, and side cover, where the heat may be removed by a circulating coolant.
07/03/14
20140185288
Lighting fixture and light-emitting diode light source assembly
An improved led light source assembly is described, suitable for use as a retrofit for prior lighting fixtures of a kind including a concave reflector, an incandescent lamp positioned with its filament(s) at or near a focal region of the reflector, and a lens assembly for projecting light reflected by the reflector to a distant location, e.g., a theater stage. The improved led light source assembly includes a compact arrangement of three or more led assemblies, which are mounted at the forward end of an elongated heat pipe.
07/03/14
20140185287
Lighting fixture and light-emitting diode light source assembly
An improved led light source assembly is described, suitable for use as a retrofit for prior lighting fixtures of a kind including a concave reflector, an incandescent lamp positioned with its filament(s) at or near a focal region of the reflector, and a lens assembly for projecting light reflected by the reflector to a distant location, e.g., a theater stage. The improved led light source assembly includes a compact arrangement of three or more led assemblies, which are mounted at the forward end of an elongated heat pipe.
07/03/14
20140185243
Heat sink-integrated double-sided cooled power module
A power module for an inverter that is used in an eco-friendly vehicle, such as a hybrid vehicle, an electrical vehicle, or a fuel cell vehicle, i.e., a heat sink-integrated double-sided cooled power module in which cooling efficiency is maximized by adopting a double-sided direct cooling method that uses a heat sink manufactured by an extrusion method. In particular, the heat sink is disposed in upper and lower portions of the power module, and direct bonding materials (dbms) are deposited between the upper and lower heat sinks where a chip is interposed between the dbms.
07/03/14
20140184051
Lighting lamp
A lighting lamp for improving heat dissipation efficiency and preventing life-shorting of an lighting lamp is provided. More specifically, an lighting lamp which comprises a heat sink on peripheral surface of which a first heat transfer flow path is provided, a light emission module provided on the upper plane of the heat sink and provided with at least one light emission element, and a globe connected to the upper part of the heat sink and covering the light emission module, and a second heat transfer flow path provided on outer peripheral surface of the globe and corresponds to the first heat transfer flow path..
07/03/14
20140183870
Power recovery system using a rankine power cycle incorporating a two-phase liquid-vapor expander with electric generator
A power recovery system using the rankine power cycle incorporating a two-phase liquid-vapor expander with an electric generator which further consists of a heat sink, a heat source, a working fluid to transport heat and pressure energy, a feed pump and a two-phase liquid-vapor expander for the working fluid mounted together with an electric generator on one rotating shaft, a first heat exchanger to transport heat from the working fluid to the heat sink, a second heat exchanger to transport heat from the heat source to the working fluid.. .
07/03/14
20140183709
Compartmentalized heat spreader for electromagnetic mitigation
An approach for compartmentalizing heat spreaders within an integrated circuit package is provided. In one aspect, the approach comprises a shielding member that is connected to the integrated circuit package.
07/03/14
20140183699
Phase changing on-chip thermal heat sink
A method of forming an on-chip heat sink includes forming a device on a substrate. The method also includes forming a plurality of insulator layers over the device.
07/03/14
20140183584
Led lamp incorporating remote phosphor and diffuser with heat dissipation features
Led lamps or bulbs are disclosed that comprise a light source, a heat sink structure and a remote phosphor carrier having at least one conversion material. The phosphor carrier can be remote to the light sources and mounted to the heat sink.
07/03/14
20140182823
Substantially aligned boron nitride nano-element arrays
Substantially aligned boron nitride nano-element arrays prepared by contacting a carbon nano-element array with a source of boron and nitrogen; methods for preparing such arrays and methods for their use including use as a heat sink or as a thermally conductivity interface in microelectronic devices.. .
07/03/14
20140182818
Heat sink
A heat sink for dissipating heat generated by an electronic element is provided. The heat sink includes a heat pipe and a conducting member for transferring heat generated by the electronic element to the heat pipe.
07/03/14
20140182684
Refrigerant removal device and method
A refrigerant recovery system includes a recovery apparatus and a refrigerant recovery unit. The recovery apparatus includes a heat sink, a capture tank, and a hose.
07/03/14
20140182523
Coolant circuit for an internal combustion engine and method of operating a coolant circuit
The invention relates to a coolant circuit (1) for an internal combustion engine (2), wherein the coolant can circulate between the internal combustion engine (2) and a heat sink (3) depending upon a switchable valve (4), which is closed in the initial state during a cold start of the internal combustion engine (2), wherein the valve (4) can be switched to an at least partially opened sequential state depending on an exhaust gas mass flow emitted by the internal combustion engine (2), and wherein a control device (6) determines an integral of the exhaust gas mass flow with respect to the time and switches the valve (4) into the sequential state when an integral threshold value is exceeded.. .
07/03/14
20140182291
Power recovery system using a rankine power cycle incorporating a two-phase liquid-vapor expander with electric generator
A power recovery system using the rankine power cycle incorporating a two-phase liquid-vapor expander with an electric generator which further consists of a heat sink, a heat source, a working fluid to transport heat and pressure energy, a feed pump and a two-phase liquid-vapor expander for the working fluid mounted together with an electric generator on one rotating shaft, a first heat exchanger to transport heat from the working fluid to the heat sink, a second heat exchanger to transport heat from the heat source to the working fluid.. .
06/26/14
20140178513
Non ionic/electrolyte, liquid/gaseous, mechanically refined/nanoparticle dispersion building materials/high wear-heat resistant part brushes, windings, battery cells, brake pads, die cast molding, refrigeration, polarized/integrated optical, spectrometric processors, central processor unit processors, electronic storage media, analogous series/parallel circuit generators/transceivers, particulate matter pm carbonaceous-polyamide, crystalline silica, and cellulosic filament extraction/miners suit
The variable hydraulic press and distillation reservoir process scientific formula non ionic or electrolyte mechanically refined and nanoparticle dispersion preform slurry extrusion with or without ionic suspension preform slurry high wear-heat resistant parts electronic composite coils, windings, annealing, drawn, spun, coils, windings, wire, woven textile mesh, shielding, parts brushes, inductors, antinode couplers, electric rheostats, starters, motors, alternators, generators, ionic suspension enhanced composite coils, composite windings, spun wound coils and windings beryllium be4, magnesium mg12, copper cu29 and carbon nanofoam c6, electronic parts capacitors, ionic suspension circuit battery cells, electronic parts rheostats, resistors, transformers, transducers, rectifiers, power supplies, or heat sinks preform slurry high wear-heat resistant parts aerospace, automotive, and transportation brake calipers, rotors, pads, and bushings preform slurry non ionic or electrolyte mechanically refined and nanoparticle high wear-heat resistant parts precision casting molds 2.5 phase die cast molding building materials fine concrete, mortar, brick, and tiles.. .
06/26/14
20140177238
Sealed electrical device with cooling system and associated methods
An electrical device and method are presented, the device having an enclosure defining an interior volume sealed from the environment and an electronic lighting apparatus, which may include a heat generating element such as a light source, a heat sink, and a fluid flow generator. The heat sink may be positioned partially within the sealed interior volume and adjacent the heat generating element and transfer heat therefrom.
06/26/14
20140177226
Led lighting apparatus with facilitated heat transfer and fluid seal
Led lighting apparatus including (a) a circuit board which has a plurality of light sources spaced thereon, (b) a heat sink to which the circuit board is thermally coupled, and (c) a securement structure which includes a rigid peripheral structure applying force along a peripheral area of the circuit board toward the heat sink to increase the thermal coupling therebetween to facilitate heat transfer from the light sources during operation. The lighting apparatus may also include an optical member with a plurality of lens portions over corresponding light sources and a peripheral region, the securement structure engaging the peripheral region which sandwiches a gasket against the heat sink.
06/26/14
20140177214
Elongated led luminaire and associated methods
A fluorescent tube retrofit luminaire includes a lamp, a light guide, and a heat dissipating frame. The lamp may include a bi-pin base, middle structure, and outer structure, which may include a light-emitting diode (led)-based light source in thermal communication with a finned heat sink section of the middle structure.
06/26/14
20140177167
Heat dissipation device
A heat dissipation device includes a heat sink and an air duct mounted to the heat sink. The heat sink includes a board and a number of fins extending up from the board.
06/26/14
20140176294
Power resistor with integrated heat spreader
An integrated assembly includes a resistor and a heat spreader. The resistor includes a resistive element and terminals.
06/26/14
20140176272
Power component device
A power component device includes a heat sink having a recess with a base surface and a first side surface. The first side surface of the recess is at a generally acute angle relative to the base surface.
06/26/14
20140175966
Led lamp
A lamp comprises an led light source for emitting light. A combined heat sink and reflector is thermally coupled to the led light source.
06/26/14
20140175633
Thermally enhanced semiconductor assembly with embedded chip and interposer and method of manufacturing the same
The present invention relates to a method of making a thermally conductive semiconductor assembly. In accordance with a preferred embodiment, the method includes: providing a chip; providing an interposer that includes a through via, a first contact pad on a first surface and a second contact pad on an opposite second surface; electrically coupling the chip to the first contact pad of the interposer by a conductive bump or a wire; providing a heat sink with a cavity; then attaching the chip and the interposer on the heat sink using an adhesive with the chip inserted into the cavity; and then forming a build-up circuitry on the second surface of the interposer.
06/26/14
20140174919
Electrode having heat sinks and coating device
An electrode is made of conductive material, and includes a first surface, a second surface, and two opposite side surfaces. The second surface is opposite to the first surface.
06/26/14
20140174795
Printed wiring board, printed circuit board, and method for manufacturing printed circuit board
A printed wiring board has a heat transfer pattern facing a heat sink of an electronic component, on a first surface layer on which the electronic component having the heat sink is mounted. The printed wiring board has a through hole conductor formed in a through hole penetrating the printed wiring board corresponding to the heat transfer pattern, and thermally connected to the heat transfer pattern.
06/26/14
20140174705
Heat sink assembly
A heat sink assembly includes a heat sink and a grease cover. The heat sink includes a bottom plate.
06/26/14
20140174699
Heat dissipation assembly
A heat sink assembly includes a base, a heat pipe, a first heat sink, and a second heat sink. The second heat sink is installed between the base and the first heat sink.
06/26/14
20140174695
Fixing assembly and heat sink using fixing assembly
A fixing assembly for use on an object which is to be attached to or detachable from another object includes a main body defining a through hole, a fixing member mounted to the through hole, and two limiting members secured to the main body and arranged at opposite sides of the through hole. When the fixing member is mounted to the through hole, the limiting members limit and hold captive the fixing member to prevent from falling off or displacement of the fixing member when not being used for attachment purposes.
06/26/14
20140174383
Vaporizer with integral heat sink
A vaporization device has a vaporizing chamber attached to a stem. A conduit running through the stem places the chamber in fluid communication with a device attached to the abutment of the stem.
06/19/14
20140170898
Receptacle with heat management for electronic and optical systems
An apparatus that is a receptacle adapted for receiving a connector. The apparatus may further include a hinged heat sink included in the receptacle.
06/19/14
20140169005
Heat cooling apparatus assembly of led illuminating device having heat pipe and heat sink
The present invention provides the cooling apparatus assembly of the led lighting device, consisting of a led lighting apparatus mounting plate (300), heat pipes (400) that are secured at the opposite surface to the surface where the lighting apparatus is fixed, and heat radiation pins (500) that are mechanically pressed and fixed to the heat pipes. On the mounting plate (300) of said led lighting apparatus, at least one fixing hole (320) is provided and the heat pipes (400) are fixed rearward by the binding bolt (310), perpendicular to the mounting plate.
06/19/14
20140168982
Layered structure for use with high power light emitting diode systems
A layered structure for use with a high power light emitting diode system comprises an electrically insulating intermediate layer interconnecting a top layer and a bottom layer. The top layer, the intermediate layer, and the bottom layer form an at least semi-flexible elongate member having a longitudinal axis and a plurality of positions spaced along the longitudinal axis.
06/19/14
20140168980
Arrangement of a heat sink and heat-generating electronic components housed thereon
The invention concerns an arrangement of a heat sink and heat-generating electronic components housed thereon, in which the heat sink comprises a main part (1) and a moulding (2) of plastic with first fitting interfaces, in which the electronic components are arranged on the first side (7) of the main part (1) with thermal contact to said main part, and in which sections of a second side (8) of the main part (1) opposite the first side (7) are not insert moulded.. .
06/19/14
20140168976
Lighting apparatus
A lighting apparatus includes a bulb-shaped cover, a heat sink unit disposed in an interior space of the bulb-shaped cover and including an end wall portion having a lateral surface and a tubular portion, and a light-emitting unit including a first circuit board disposed on the end wall portion, a second circuit board disposed around the tubular portion, a third circuit board including at least one extension which covers the lateral surface, and a plurality of light-emitting elements respectively mounted on the first and second circuit boards and the extension of the third circuit board. A tubular seat is coupled to the bulb-shaped cover.
06/19/14
20140167241
Semiconductor device
A semiconductor device includes a resin package, a semiconductor element, a sealing resin, and a metal terminal. The sealing resin is filled into the resin package to seal the semiconductor element and the insulating substrate.
06/19/14
20140166428
Clutch and/or brake module
The brake module further has an actuation system (cylinder with piston movable therein, schematically indicated by an arrow) which can exert an axial pressing force directly on the brake disc. The brake disc is located axially between the heat sink and the actuation system.
06/19/14
20140166234
Laptop computer cooling stand
A laptop computer cooling stand includes a main body, a number of semiconductor chilling plates, a number of first heat sinks, and a number of second heat sinks. The main body includes a base and a cover.
06/19/14
20140165608
Device and method for supporting a person
A device for supporting a person may include a thermoelectric generator configured to receive heat provided from the person. The device may further include a first heat conductor overlapping the first thermoelectric generator and configured to conduct the heat to the thermoelectric generator.
06/19/14
20140165603
Cooling system for ice maker
An ice maker having an ice tray horizontally suspended within a housing and a drive body rotatably coupled to a transverse axis of the ice tray and configured to oscillate the ice tray about the transverse axis. The cold side of a thermoelectric device is thermally coupled with a bottom surface of the ice tray, and a hot side opposes the cold side.
06/12/14
20140163815
System and method for determining an adaptive turnaround threshold
A method includes measuring a brake temperature of an aircraft brake using a sensor; determining a brake heat sink mass of the aircraft brake using a wear measuring device; and calculating a turnaround threshold based upon the measured brake temperature and the determined brake heat sink mass.. .
06/12/14
20140162882
Cable termination for high voltage power cables cooled by a gaseous cryogen
A cable termination utilizing liquid and gaseous cryogen. The liquid cryogen maintains cryogen temperatures of all dielectric surfaces exposed to gaseous cryogen and to high voltage potential.
06/12/14
20140162475
Connector assembly and method
Connectors and methods to couple packages and dies are shown. Selected examples include plugs and receptacles having two or more terraces with contacts provided along the terraces.
06/12/14
20140161408
Optical module
An optical module includes a wiring board on which a first opening and a second opening are provided having, between the first and second openings, a traversing portion on which a signal wire is arranged, an optical component that is mounted on a first plane side of the first opening and the second opening of the wiring board and that generates heat, a heat sink arranged on a second plane side, which is on a reverse of the first plane side, of the first opening and the second opening of the wiring board, and an anisotropic heat dissipation sheet that is provided between the traversing portion and the heat sink, and the optical component, and that has a thermal conductivity higher in second directions, which cross the traversing portion in a plane orthogonal to first directions, than in the first directions, which are thickness directions of the wiring board.. .
06/12/14
20140161399
Heat sink retention in an optical component
An example embodiment includes a retention spring. The retention spring includes a central portion, a coupling feature, and a spring arm.
06/12/14
20140160757
Light engine
An led-based high power uniform light engine including an array of leds having a common anode and a fill factor which exceeds 0.85, the common anode having heat spreading functionality and an active heat sink which is thermally connected to the common anode.. .
06/12/14
20140160740
Light tube with low up-light
An illumination device, system, and method are disclosed. The illumination device includes a heat sink having a depression or channel established therein.
06/12/14
20140160737
Led heat sink apparatus
An led heat sink apparatus (20) comprising a housing (22) that defines a chamber (26). A downward platform (82) is connected with the housing (22) in the chamber (26) to define a bottom cavity (84) and a central cavity (88).
06/12/14
20140160685
Composite heat sink device for cooling of multiple heat sources in close proximity
In one aspect, an apparatus comprises a substrate, a first electrically-driven device disposed on the substrate, a second electrically-driven device disposed on the substrate, and a composite heat sink device. The composite heat sink device comprises a first thermal conduction member, a second thermal conduction member, and a thermal insulation member.
06/12/14
20140160684
Cooling for electronic components
Examples of electronic components and printed circuit board assemblies which may be configured for directional heat transport are described herein. A circuit board assembly according to the examples herein may include a plurality of stacked planar layers, including a signal layer with a plurality of signal traces, a ground layer separated from the signal layer using an insulating layer, and a plurality of heat sink traces extending from the ground layer through at least a portion of the thickness of the insulating layer, each of the plurality of heat sink traces being electrically insulated from the signal traces and coupled to ground.
06/12/14
20140160671
Motherboard cooling system
A motherboard cooling system includes a motherboard, a heat producing element, a fan module, a heat sink, a heat pipe, and a heat conducting plate. The heat conducting plate, the heat pipe, the heat sink, and the fan module cooperatively define an air path for airflow produced by the fan module to cool the heat producing element..


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