|| List of recent Heat Sink-related patents
| Systems, methods and apparatus for bilateral caloric vestibular stimulation|
An in-ear stimulation device for administering caloric stimulation to the ear canal of a subject includes (a) first and second earpieces configured to be insertable into the ear canals of the subject; (b) at least first and second thermoelectric devices thermally coupled to respective ones of the first and second earpieces; (c) a first heat sink thermally coupled to the first thermoelectric device opposite the first earpiece and a second heat sink thermally coupled to the second thermoelectric device opposite the second earpiece; and (d) a controller comprising a waveform generator in communication with the first and second thermoelectric devices, the waveform generator configured to generate a first control signal to control a first caloric output to the first thermoelectric device and a second control signal to control a second caloric output to the second caloric device.. .
| Cryogenic heat sink for gas cooled superconducting power devices|
A heat sink and method for gaseous cooling of superconducting power devices. Heat sink is formed of a solid material of high thermal conductivity and attached to the area needed to be cooled.
| Heat shrink joining of battery cell components|
A cooling system for a battery cell includes at least one plate having at least one key, and a heat sink having at least one slot formed therein. The at least one key of the at least one plate is disposed in the at least one slot.
| Lighting device|
A lighting device includes a heat sink including a first heat radiation part and a second heat radiation part; a light source module including a substrate disposed on the first heat radiation part, and a light emitting device disposed on the substrate; and a power supply unit which is disposed within the second heat radiation part and supplies power to the light source module. The second heat radiation part includes an inner portion receiving the power supply unit therewithin, an outer portion enclosing the inner portion, and a first receiver disposed between the inner portion and the outer portion.
| Led lighting device|
The present invention relates to an led lighting device comprising: a power case main body wherein one side is opened to form a receiving space inside, and a lamp terminal is provided to be electrically connected to a lamp socket on an end of the other side; a main body heat sink which surrounds a part or most of an outer circumference of the power case main body, and is combined to one side of the open power case main body; a plurality of lamp heat sinks which are protruded and combined to contact one side of the main body heat sink to conduct heat with the main body heat sink and forms a radiation structure around a central shaft formed according to a protruded direction; and a main led module which contacts and is combined to an outer side end in a radiation direction of the lamp heat sink to conduct the heat with the lamp heat sink.. .
| Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly|
In an embodiment, a method of making a heat sink assembly (10) can comprise: forming an heat sink assembly (10) comprising a polymer heat sink (14) around a metal insert (12), the polymer heat sink (14) comprising a thermally conductive polymer material, wherein the heat sink assembly (10) has a contact pressure between the polymer heat sink (14) and the metal insert (12); and increasing the contact pressure. In an embodiment, a method of making a heat sink assembly (10), comprises: heating a mold and subsequently introducing a metal insert to the mold, wherein the metal insert has an insert temperature of 30° c.
| Servo amplifier having cooling structure including heat sink|
A servo amplifier includes a housing, a heat source arranged in the housing, and a heat dissipating structure including a heat sink arranged in the housing and thermally connected to the heat source. The heat sink has heat dissipating fins extending from at least a portion of a surface of the heat sink, other than a connecting face thermally connected to the heat source.
| Heat sink with an integrated vapor chamber|
A cooling subsystem is provided for dissipating heat from processor. The cooling subsystem includes a heat sink comprising an upper portion having a plurality of fins formed therein and a base portion fixed to the upper portion to form a vapor chamber in an enclosed volume between the upper portion and the base portion..
| Thermal design for high output led backlights|
The present disclosure includes a led illuminator that improves heat conduction through a lcd module's rear cover. The disclosed led illuminator integrates a heat dissipation device for reducing thermal spikes on the lcd glass and in the led packages by dissipating heat generated within the lcd module.
| Inverter-integrated rotating electrical apparatus|
An inverter-integrated rotating electrical apparatus includes a rotating electrical machine and an inverter case. The rotating electrical machine has a housing.
| Apparatus, systems and methods for reducing noise generated by rotating couplings|
A heat sink element for an adjustable speed magnetic drive unit operable by relative rotation of a conductor rotor assembly and a magnet rotor assembly includes a base portion and a plurality of groupings of fins. The base portion includes a mounting face that is sized and dimensioned to be coupled to the conductor rotor assembly, and an opposing convective heat transfer face.
| Electronic component unit and fixing structure|
An electronic component unit includes a semiconductor package mounted on a front surface of a substrate, a heat sink including a pushing plate installed on the semiconductor package, a reinforcing plate disposed on a back surface of the substrate, and a plurality of fasteners that connect corner portions of the pushing plate and the reinforcing plate to each other, wherein the semiconductor package is pressed and fixed on the substrate by fastening the plurality of fasteners, and the reinforcing plate includes a base plate portion including a connection portion to which each of the plurality of fasteners is connected, and a pressing plate portion which is disposed at a planar central side of the base plate portion, and separably laminated on the base plate portion to press the back surface of the substrate.. .
| Cooling device for semiconductor module, and semiconductor module|
A cooling device for a semiconductor module supplying a coolant from outside into a water jacket and cooling a semiconductor element, includes a heat sink thermally connected to the semiconductor element; a first flow channel extending from a coolant introducing port and including a guide section having an inclined surface for guiding the coolant toward one side surface of the heat sink; a second flow channel disposed parallel to the first flow channel and extending toward a coolant discharge port; a flow velocity adjusting plate disposed in the second flow channel and formed parallel to the other side surface of the heat sink at a distance therefrom; and a third flow channel formed to communicate the first flow channel and the second flow channel. The heat sink is disposed in the third flow channel..
| Semiconductor device and method for fabricating the same|
A semiconductor device includes a first semiconductor chip at least partially overlapping a second semiconductor chip. The first semiconductor chip is coupled to a substrate and has a first width, and the second semiconductor chip has a second width.
| Semiconductor device with integral heat sink|
A packaged semiconductor device has opposing first and second main surfaces and a sidewall connecting the first and second main surfaces. A semiconductor die is embedded in the package and has a first main surface facing the first main surface of the package and an opposing second main surface facing the second main surface of the package.
| Power electronic device|
A device includes a first and second transistors integrated in first and second chips. Each chip has opposed rear and front surfaces, and further has a first conduction terminal and a control terminal on the front surface and a second conduction terminal on the rear surface.
| Led back end assembly and method of manufacturing|
An led device and method of manufacture including separately coupling a thin flexible interposer and an led die to a heat sink structure and then electrically coupling the interposer and the led die together with a wirebond. A specifically shaped perimeter of an aperture within the interposer negates the need for a cavity or alignment markings within the heat sink structure by limiting the orientation in which the die fits within the aperture.
| Electric car|
In an electric car, a power control unit includes: a heat sink that has an electric device fixed thereto and performs a heat exchange with the electric device; and a case that is attached to a surface of the heat sink to which the electric device is fixed and that covers the electric device. A reserve tank that stores a circulation liquid is attached to a front end surface of the heat sink via a bracket, a bulkhead frame that retains a radiator is provided in a vehicle width direction ahead of the reserve tank, the reserve tank is arranged at a position that overlaps the bulkhead frame in a front view, and a front surface of the power control unit has a protruding portion that protrudes forward, at a position that overlaps the reserve tank and the bulkhead frame in a front view..
| Heat sink of porous graphite|
A heat sink using porous graphite having graphite particle-stacked porous graphite is provided. The heat sink may provide good heat conductivity and improve strength of carbon foam..
| Semiconductor device comprising a stacked die configuration including an integrated peltier element|
A method of controlling temperature in a semiconductor device that includes a stacked device configuration is disclosed. The method includes providing a peltier element having a metal-based heat sink formed above a first substrate of the stacked device configuration and a metal-based heat source formed above a second substrate of the stacked device configuration, and establishing a current flow through the peltier element when the semiconductor device is in a specified operating phase..
| Air conditioned headgear and air conditioned clothing|
The present invention provides an air conditioned headgear and clothing. The headgear includes a thermoelectric cooling module and a control chip.
|Vehicle lighting device|
There is provided a lighting device which is to be mounted on a vehicle. The lighting device includes: a housing forming a lamp chamber, the housing including a wall having an opening therethrough; a light source which is disposed in the lamp chamber; a heat sink, wherein the light source is fixed to the heat sink; a fixation portion, wherein the heat sink is fixed to the housing via the fixation portion.
|Pivoting thermal transfer joint|
A recessed luminaire thermal management assembly (20) includes a recessed luminaire can (22) having an open lower end (26) and an upper end (24) with at least one sidewall (28) extending between the open lower end and the closed upper end, an intermediate heat sink (50) connected to the luminaire can, the intermediate sink being rotatable through a horizontal plane, a source heat sink (70) being movable through a vertical plane, the source heat sink transferring heat to the luminaire can through the intermediate sink.. .
|Phase change material as a dynamic heat sink for trancutaneous energy transmission systems|
A method and system for management of thermal energy produced during transcutaneous energy transmission to provide power to energize implanted medical devices. A phase changing material (pcm) acts as a heat sink to absorb thermal energy generated during the energy transfer process.
|Heat sink for processor|
A heat sink for a processor includes: a main heat exchange zone that bears in contact with a processor; at least one peripheral heat exchange zone that bears in contact with a cooling source, and at least one heat pipe connecting the main heat exchange zone with the peripheral heat exchange zone, the heat pipe containing a cooling fluid.. .
An automated microscope apparatus comprises an outer housing having an external wall; optionally but preferably an internal wall in the housing configured to form a first compartment and a separate second compartment in the outer housing; a microscope assembly in the housing (preferably in the first compartment); a microprocessor in the housing (preferably in the second compartment), and (optionally but preferably) a heat sink mounted on the housing external wall, preferably adjacent the second compartment, with the microprocessor thermally coupled to said heat sink and operatively associated with the microscope assembly. Systems and methods employing the same are also described, along with component parts thereof..
|Rf power amplifier and method of assembly for same|
In general, an rf power amplifier comprises a controller, a driver, a splitter, a final stage, and a combiner coupled together to function as the rf power amplifier. One or more of the above components are arranged on one or more motherboards, e.g., a printed circuit board (pcb).
|Liquid-cooled led lamp|
An electrical device, preferably a light bulb having an electrical base, comprises a container having a sealed interior, an electrical component contained within the sealed interior; a liquid filling the sealed interior; and a pressure relief member. The pressure relief member has an interior tubular passage.
|Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation|
A semiconductor device has a semiconductor die with a plurality of bumps formed over a surface of the first semiconductor die. A penetrable adhesive layer is formed over a temporary carrier.
An led module has an electrically insulating main body, a base surface and a mounting surface located opposite the base surface. A number of electrical connection contacts are arranged at the mounting surface.
|Method of manufacturing electronic component unit|
An electronic component unit manufacturing method includes: preparing a circuit board including a heat generating element mounted thereon and a bonding metal foil layer formed thereon, a heat transfer board including an insulative layer formed on one face thereof and a heat transfer metal foil layer formed on the insulative layer, and a heat sink; applying a cream solder to form a solder layer on the board bonding metal foil layer or the heat transfer metal foil layer; superimposing the bonding metal foil layer and the heat transfer metal foil layer with each other via the solder layer; re-melting the solder layer to solder the bonding metal foil layer and the heat transfer metal foil layer; and superimposing the other face of the heat transfer board with the heat sink to thereby assemble the circuit board with the heat sink via the heat transfer board.. .
|Heat exchanger produced from laminar elements|
The present invention provides a heat exchanging device, formable into a three dimensional configuration. The heat exchanger device may be of the heat sink type, a dual fluid type, or virtually any other as may be desired.
|Dustproof device for heat sink|
A dustproof device is disclosed. The first blade set includes a plurality of first blades.
|Electrohydrodynamic airflow across a heat sink using a non-planar ion emitter array|
A method of cooling a heat generating device includes positioning a base of an electronically conductive heat sink in thermal communication with a heat generating device, wherein the heat sink includes a plurality of fins extending in a longitudinal direction from a first end to a second end, and coupling the heat sink to ground. The method further includes emitting ions from a plurality of ion emitter elements disposed in a non-planar pattern along the first ends of the plurality of fins, wherein at least three ion emitter elements are equidistant from the first end of the nearest fin and are positioned in an arc having an axis that extends along the first end of the nearest fin..
|Food holding cabinet and method for holding hot food|
A food holding cabinet for holding and keeping hot food safe and fresh at a desired temperature until ready to be served. Radiant heaters disposed in food compartment walls supply radiant heat to the interior of the food holding compartment.
|Led light fixture with integrated light shielding|
An led light fixture including a housing, a heat sink secured with respect to the housing and an led illuminator secured with respect to the heat sink. The heat sink includes central and peripheral portions.
|Application-specific led module and associated led point source luminaires|
Led downlight and other point source luminaires contain one or more application-specific led modules with integrated optical, mechanical, and heat dissipation systems; a fluted extruded metal housing acts as a heat sink as well as the luminaire housing containing the as-led module(s) or receiving a rotatable spherical housing that contains the as-led module, printed circuit board units, and wires; mounting brackets; and a remote led driver. The extruded aluminum housing (and heat sink) may be comprised of a single cylinder or multiple concentric cylinders.
|Light-fixture support assembly|
An led light fixture including a housing, a heat sink secured with respect to the housing and an led illuminator secured with respect to the heat sink. The heat sink includes central and peripheral portions.
|Mixed light source|
A mixed light source has a first semiconductor component, which is provided for generating a first radiation fraction, and a second semiconductor component, which is provided for generating radiation of a second radiation fraction different from the first radiation fraction. The first semiconductor component is mounted by a first mounting point on a first heat sink with a first thermal resistance r1.
|Barrier with integrated self cooling solid state light sources|
An integrated barrier or partition (e.g. Suspended ceiling, wall, etc.) containing lightweight solid state light sources wherein the light emitting surface of the light sources are the primary heat dissipating surfaces of the light sources.
|Three-dimensional (3-d) integrated circuits (3dics) with graphene shield, and related components and methods|
A three-dimensional (3-d) integrated circuit (3dic) with a graphene shield is disclosed. In certain embodiments, at least a graphene layer is positioned between two adjacent tiers of the 3dic.
|Optical device array substrate having a heat dissipating structure integrated with a substrate, and method for manufacturing same|
The present invention relates to an optical device array substrate having a built-in heat dissipating structure, and to a method for manufacturing same, wherein the optical device array substrate itself is used as a heat sink and a coupling hole is formed at the bottom of the substrate to have a heat dissipating rod coupled thereto. The optical device array substrate having a built-in heat dissipating structure of the present invention consists essentially of: an optical device array substrate having a plurality of optical devices arranged on the top surface thereof and a plurality of coupling holes formed in the bottom surface thereof; and rod-shaped heat dissipating rods that have coupling projections formed on upper ends thereof, and are coupled to each of the coupling holes.
|Heat sink and method for manufacturing heat sink|
This heat sink has bonded on one surface a member to be bonded, and has a cooling member in contact with the other surface. The heat sink is provided with a metal plate having a thermal expansion coefficient larger than that of the member to be bonded, and the metal plate is provided with a center portion where the member to be bonded is bonded, and a plurality of linear peripheral slits formed in a whirl-like radial manner such that the linear peripheral slits surround the center portion..
|Nano graphene platelet-reinforced composite heat sinks and process for producing same|
An integrated heat sink article composed of a heat collection member and at least one heat dissipation member integral to the heat collection member, wherein the heat collection member is configured to be in thermal contact with a heat source, collects heat from the heat source, and dissipates heat through the at least one heat dissipation member, and further wherein the heat sink is formed of a nano graphene platelet-reinforced composite having nano graphene platelets or sheets (ngps) as a first reinforcement phase dispersed in a matrix material and the first reinforcement phase occupies a weight fraction of 1-90% based on the total composite weight. Preferably, these ngps, alone or in combination with a second reinforcement phase, are bonded by an adhesive and constitute a continuous 3-d network of electron- and phonon-conducting paths..
|Coolant circuit manifold for a tractor-trailer truck|
A tractor-trailer truck engine coolant manifold comprises a first supply port for receiving coolant from an engine or radiator, and a first return port for returning coolant to the engine or radiator. The manifold also has a second supply port in fluid communication with the first supply port, and a second return port in fluid communication with the first return port.
|Apparatus for reforming a portion of a plastic container|
A kit and method for converting a refurbishing machine into a reforming apparatus. The apparatus reforms a portion of a plastic container using induction heating.
|Semiconductor device manufacturing method|
A semiconductor device includes: a semiconductor substrate; a heat sink mounted on an upper surface of the semiconductor substrate; wirings formed on a lower surface of the semiconductor substrate; and the like. The heat sink is mounted on the upper surface of the semiconductor substrate, and a planar size thereof is approximately the same as that of the semiconductor substrate.
|Thermal management in laser diode device|
Embodiments are disclosed that relate to reducing inductive losses and controlling driver and laser diode temperatures in an optical assembly comprising a laser diode. For example, one disclosed embodiment provides an optical assembly comprising a printed circuit board, and a laser diode package and laser diode driver mounted to the printed circuit board.
|Illumination device with multi-layered heat sink|
The present invention relates to an illumination device where a number of light sources are arranged on a heat sink and adapted to emit light in substantially the same direction. The heat sink comprises a first cooling plate and a second cooling plate and a first part of the light sources are arrange on the first cooling plate and a second part of the light sources are arranged on the second cooling plate.
|Cooling structure for led lighting device and light emitting module having the same|
Provided are a cooling structure for an led lighting device and a light emitting module having the same. The cooling structure for an led lighting device according to the present invention has a structure in which an led module is disposed in a tray-shaped heat sink coupled with a lower portion of a lighting box having an led module disposed therein to block the lower portion of the lighting box and perforated with a ventilation hole to make external air flow therein, thereby discharging heat generated from the led module through the heat sink.
|Led light fixture|
An led light fixture including a housing and an led assembly secured with respect to the housing. The led assembly includes a heat sink and an led illuminator secured with respect to an led-supporting region of the heat sink with heat-dissipating surfaces extending therefrom.
|Heat sink module and omnidirectional led lamp holder assembly using same|
An omnidirectional led lamp holder assembly includes a heat sink module including a heat sink base and radiation fins around the heat sink base, a lampshade and an electrical connector respectively mounted at opposing top and bottom sides of the heat sink module. The heat sink base is a one-piece extruded member defining a tubular heat-transfer base portion, a broad platform and a hollow protruding mount for holding led chips at different angles.
|Led lamp with omnidirectional light distribution|
An led based lamp has an optically transmissive enclosure connected to a base. The base may include a heat sink.
A display device includes a display device body, a display portion arranged on the front side, a light source, a light source substrate, a light guide plate having a light incident surface, and a heat sink arranged to be opposed to the light incident surface of the light guide plate between the light guide plate and the light source substrate, including a light source arrangement hole configured to arrange the light source and a spacer portion arranged to be opposed to the light incident surface of the light guide plate between the light guide plate and the light source substrate and keeping an interval between the light incident surface of the light guide plate and the light source at a prescribed interval.. .
|Heat sink package|
The heat sink package includes a heat sink having a cavity on an upper surface thereof; a metal layer formed on the bottom surface of the cavity; a solder paste layer formed on the metal layer; a substrate on the solder paste layer; and a lead and a semiconductor chip mounted on the substrate.. .
|Oven cavity temperature lowering by forced air|
A matchbox oven is disclosed. The matchbox oven includes a housing, a slider, a mover, a heat source and a blower.
A heat sink includes a frame having a non-metallic body that includes a window. The non-metallic body includes at least one peripheral wall that defines a boundary of the window.
|Cooling device and a cooling assembly comprising the cooling device|
A cooling device comprises a heat sink having fins and a piezofan having a piezoelectric element attached to a planar body. The planar body is capable of oscillating at a movable end in response to applying alternating electric current to the piezoelectric element, thereby generating an air flow toward an output of the cooling device.
|Vehicular thermal management system and method thereof|
A thermal management system having a first heating device, such as a rechargeable energy storage system (ress), and a second heating device, such as an internal combustion engine (ice), for a vehicle is provided. The system may allow waste heat within an ice to be stored in a ress, and may cool the ress by depositing heat in the ice.
|Vertical thermoelectric structures|
A thermoelectric device is disclosed which includes metal thermal terminals protruding from a top surface of an ic, connected to vertical thermally conductive conduits made of interconnect elements of the ic. Lateral thermoelectric elements are connected to the vertical conduits at one end and heatsinked to the ic substrate at the other end.
|Matchbox oven with heat sink temperature control|
A matchbox oven is disclosed. The matchbox oven includes a housing, a slider, a mover and a heat source.
|Micro channel cooling device, micro channel cooling system, and electronic instrument|
A microchannel cooling device includes a heat sink having a liquid refrigerant flow channel having a microscopic cross section and connected to a heat source thermally, and a thermoelectric element provided on the heat sink and extending parallel to a direction of extension of the liquid refrigerant flow channel.. .
|Heat exchanger for led light fixture|
A heat exchange system for an led light fixture is provided. The heat exchange system includes an enclosure 4, a heat sink 9 positioned inside of and spaced apart from said enclosure 4, and a fan positioned inside of and spaced part from said enclosure 4.
A lighting device including: a light emitting module; a heat sink which is disposed on the light emitting module; a heat sink fan which is disposed over the heat sink; an upper case which covers the heat sink fan and the heat sink; and a lower case which is coupled to the upper case and fixes the light emitting module. A first air inlet is disposed in the lower case.
|Led fixture with interchangeable components|
A light includes a central tube having heat sink fins coupled to the tube, a light emitting diode package thermally coupled within the central tube and located a selected distance from a first end of the tube, an electronics module coupled to a second end of the tube and electrically connected through the tube to the light emitting diode package, an edison connector coupled to the electronics module, and a lens optically coupled to the light emitting diode package, wherein the lens extends through the tube from an end proximate the light emitting diode package to beyond the first end of the tube to disperse light in a selected pattern.. .
|Led lighting fixture|
An led light fixture including a frame defining a forward open region and a rearward region with a rearmost portion adapted for securement to a support member. An led assembly is secured with respect to the frame and positioned within the open forward region with open spaces remaining therebetween.
|Light emitting diode lamp and system of the same|
A light emitting diode lamp system, comprising: multiple lamps, a control module, multiple hubs and a receiver. Each of the multiple lamps includes a main body and a heat sink.
A lighting device may be provided that comprises: a heat sink; a light source which is disposed on the heat sink; a cover which is coupled to the heat sink and includes a dome disposed on the light source and a body supporting the dome; and a reflective plate which is disposed in the body and has an opening through which a part of light from the light source passes.. .
|Led lighting assembly and an led retrofit lamp having the led lighting assembly|
An led lighting assembly may include a printed circuit board with an led chip, and a heat sink thermally conducted with the printed circuit board, wherein the led lighting assembly further comprises a light guide body configured as a bulb, the light guide body having an end surface as a light incidence surface of light from the led chip, an outer surface as a light emergent surface and an inner surface, wherein the inner surface is structured so as to form a reflecting surface, reflecting at least part of light from the end surface to the outer surface.. .
|Heat dissipation apparatus for expansion base|
A heat dissipation apparatus includes an expansion base, an air duct, a fan, a heat sink, and a portable device. A number of air inlet slots is defined in the expansion base.
An illuminating apparatus includes a lamp member, a lighting member, a waterproof member, and cooling liquid. The lamp member has a closed chamber, in which the cooling liquid is filled.
|Explosion-proof led module|
An explosion-proof led module has at least one light-emitting diode, a heat sink connected to this and an led cover that covers the led at least in the emission direction. The led cover extends into an insertion recess of the heat sink.
|Heat sink for cooling of power semiconductor modules|
A heat sink for cooling at least one power semiconductor module, and that includes a basin for containing a cooling liquid. The basin has a contact rim for receiving the base plate and that includes a surface that is sloped inwards to the basin..
|Projector with heat sinks and single fan module|
An image projector in a case, having a light engine, a circuit board, a heat sink assembly, and a fan assembly, has one or more heat sinks and heat pipes shaped to gather heat from all heat-generating components within the projector and a single air passage to receive the heated air combined from all components, allowing the employment of a single fan module in sucking cool air from the exterior and exhausting heated air through the single air passage.. .