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Heat Dissipation patents



      
           
This page is updated frequently with new Heat Dissipation-related patent applications. Subscribe to the Heat Dissipation RSS feed to automatically get the update: related Heat RSS feeds. RSS updates for this page: Heat Dissipation RSS RSS


Date/App# patent app List of recent Heat Dissipation-related patents
05/22/14
20140140008
 Heat dissipation material and method of manufacturing thereof, and electronic device and method of manufacturing thereof patent thumbnailHeat dissipation material and method of manufacturing thereof, and electronic device and method of manufacturing thereof
A heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects.. .
05/01/14
20140118948
Electronic device
An electronic device includes a housing, a heat source located inside a casing, and a heat dissipation device disposed inside a casing. The heat dissipation device is in thermal contact with the heat source.
05/01/14
20140118945
Electronic device
An electronic device includes a housing, a heat source located in a casing, and a heat dissipation device disposed in a casing. The heat dissipation device is kept apart from the heat source.
05/01/14
20140118943
Electronic device
An electronic device includes a housing, a heat source in the housing, and a heat dissipation device in the housing and separated from the heat source by a distance. The heat dissipation device includes a casing.
05/01/14
20140118942
Electronic device
An electronic device includes a housing, a heat source located in the housing, and a heat dissipation device disposed in the housing. The heat dissipation device thermally contacts the heat source.
05/01/14
20140118928
Electronic device
An electronic device comprises a case, a heat source and a radiator. The heat source is disposed inside the case.
10/03/13
20130258641
 Backplane and backlight module comprising backplane patent thumbnailBackplane and backlight module comprising backplane
The invention provides a backplane and a backlight module including the backplane. The backplane is formed by joining a plurality of brackets; the plurality of brackets include light incident side bracket(s) for arranging the light source, and the structure part of the light incident side bracket for arranging the light source is coated with heat dissipation material.


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This listing is a sample listing of patent applications related to Heat Dissipation for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Heat Dissipation with additional patents listed. Browse our RSS directory or Search for other possible listings.
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