This page is updated frequently with new Heat Dissipation-related patent applications.
|| List of recent Heat Dissipation-related patents
|Epoxy resin composition, cured product, heat radiating material, and electronic member|
The present invention provides an epoxy resin composition including 2,2′,7,7′-tetraglycidyloxy-1,1′-binaphthalene as an epoxy resin (a), and a filler (b). Further, the present invention provides an epoxy resin composition in which the filler (b) in the epoxy resin composition is a thermally conductive filler and an epoxy resin composition in which the filler (b) is silica.
|Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and manufacturing the printed wiring board|
A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from cu, co, ni, w, p, zn, cr, fe, sn and mo on one or both surfaces, in which surface roughness sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 μm or more..
Jx Nippon Mining & Metals Corporation
|Heat sink for chip mounting substrate and manufacturing the same|
Provided is a heat sink for a chip mounting substrate in which a heat dissipation material is embedded. The heat sink includes: an accommodation portion configured to accommodate a substrate whereon a chip is mounted or to be mounted, and support or fix the accommodated substrate; and a heat dissipation portion configured to insulate the accommodated substrate, and dissipate heat generated from the substrate or the chip mounted on the substrate to an outside through a heat dissipation material contained in the heat dissipation portion.
Point Engineering Co., Ltd.
|Article of apparel|
The present invention is directed toward an article of apparel effective to regulate the temperature of the wearer. In an embodiment, the article of apparel includes a base textile with a thermal regulation membrane.
Under Armour, Inc.
|Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material|
Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.. .
|Heat dissipation material and manufacturing thereof, and electronic device and manufacturing thereof|
A heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects.. .
An electronic device includes a housing, a heat source located inside a casing, and a heat dissipation device disposed inside a casing. The heat dissipation device is in thermal contact with the heat source.
An electronic device includes a housing, a heat source located in a casing, and a heat dissipation device disposed in a casing. The heat dissipation device is kept apart from the heat source.
An electronic device includes a housing, a heat source in the housing, and a heat dissipation device in the housing and separated from the heat source by a distance. The heat dissipation device includes a casing.
An electronic device includes a housing, a heat source located in the housing, and a heat dissipation device disposed in the housing. The heat dissipation device thermally contacts the heat source.
An electronic device comprises a case, a heat source and a radiator. The heat source is disposed inside the case.
Backplane and backlight module comprising backplane
The invention provides a backplane and a backlight module including the backplane. The backplane is formed by joining a plurality of brackets; the plurality of brackets include light incident side bracket(s) for arranging the light source, and the structure part of the light incident side bracket for arranging the light source is coated with heat dissipation material.
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