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Form Factor

Form Factor-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Ingestible electrical device for stimulating tissues in a gastrointestinal tract of an organism
Carnegie Mellon University
January 11, 2018 - N°20180008825

In one aspect, an ingestible, electrical device, comprises one or more electrodes comprising a biocompatible conducting material and a biocompatible insulating material; a generator connected to the one or more electrodes; and an outer casing enclosing the one or more electrodes and the generator, the outer casing configured to dissolve in an aqueous environment of the organism; wherein the one ...
Interposer device
Hewlett-packard Development Company, L.p.
January 04, 2018 - N°20180006391

An interposer for connecting a module to an m. 2 socket includes a different form factor connector. The interposer includes an m. 2 connector to couple the interposer to the m. 2 socket. The m. 2 connector is formed to mate with the m. 2 socket. The interposer includes a different form factor socket to couple the interposer to the module including the different form ...
Small form factor betavoltaic battery for use in applications requiring a volumetrically-small power source
City Labs, Inc.
January 04, 2018 - N°20180005720

A betavoltaic power source. The power source comprises a source of beta particles and a plurality of regions each for collecting the beta particles and for generating electron hole pairs responsive to the beta particle flux. A first set of the plurality of regions is disposed proximate a first surface of the source and a second set of the plurality ...
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Plug-through power meter with planar profile
The Regents Of The University Of Michigan
January 04, 2018 - N°20180003739

An improved energy meter is presented that achieves a vastly smaller form factor than prior systems. The energy meter occupies an unobtrusive and essentially two-dimensional volume, 1″×1″× 1/16″, and meters loads plugged through it and into an outlet. Despite its small size, the energy meter is a wireless true power meter, capable of metering real, reactive, and ...
Pixel array area optimization using stacking scheme for hybrid image sensor with minimal vertical interconnects
Depuy Synthes Products, Inc.
January 04, 2018 - N°20180000333

Embodiments of a hybrid imaging sensor that optimizes a pixel array area on a substrate using a stacking scheme for placement of related circuitry with minimal vertical interconnects between stacked substrates and associated features are disclosed. Embodiments of maximized pixel array size/die size (area optimization) are disclosed, and an optimized imaging sensor providing improved image quality, improved functionality, and ...
Computer system to continuously maintain a user session when a display device is mechanically connected ...
Hewlett-packard Development Company, L.p.
December 28, 2017 - N°20170372676

A computer system to continuously maintain a user session when a display device is mechanically connected and disconnected with a base processing device is described. The computer system allows the user to run applications during the user session on the base processing device and use the display device as a monitor. The display device can be detached from the base ...
Form Factor Patent Pack
Download 125+ patent application PDFs
Form Factor Patent Applications
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For professional research & prior art discovery
inventor
  • 125+ full patent PDF documents of Form Factor-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Input/output card for use in storage device and storage device
Emc Ip Holding Company Llc
December 21, 2017 - N°20170364467

Implementations of the subject matter described herein provide an input/output (i/o) card for storage device and a storage device. The i/o card and the disk drive for the storage device have the same form factor and comply with the same protocol, to enable the i/o card and the disk drive can be arranged at the same ...
Infrared camera system architectures
Flir Systems, Inc.
December 14, 2017 - N°20170359526

Various techniques are disclosed for providing an infrared imaging module that exhibits a small form factor and may be used with one or more portable devices. Such an infrared imaging module may be implemented with a housing that includes electrical connections that may be used to electrically connect various components of the infrared imaging module. In addition, various techniques are ...
High capacity firearm magazine
Vista Outdoor Operations Llc
December 14, 2017 - N°20170356708

A high capacity magazine for high powered rimfire cartridges comprises a header portion that has a form factor to be received in a rotary magazine receptacle and an arcuate cartridge bank portion that holds a column of cartridges. A pair of clamshell halves define an arcuate cartridge bank and a lower portion of the header potion. A header caps the ...
Illumination assembly including thermal energy management
Innotec, Corp.
December 14, 2017 - N°20170356640

An illumination assembly includes a polymeric substrate, an electrical circuit including two conductors supported by the polymeric substrate, an led electrically coupled to the two conductors, and a heat spreader thermally coupled to the led. The two conductors can be printed on the polymeric substrate, embedded within the polymeric substrate, or lie atop the polymeric substrate. The illumination assembly may ...
Camera with polygonal lens
Netgear, Inc.
December 07, 2017 - N°20170353656

A camera and/or a method of manufacturing said camera configured for receiving a widescreen format image from an led array camera having a reduced form factor. The camera has a generally circular led array located around an image sensor and a generally polygonal lens covering the generally circular led array. The outer edge of the generally polygonal lens has ...
Hybrid embedded surface mount module form factor with same signal source subset mapping
Digi International Inc.
November 16, 2017 - N°20170330827

A surface mount module form factor comprises a substrate having a bottom surface, a top surface, and an outer periphery, with at least one electronic component mounted on the substrate, and a plurality of land grid array pads mounted on the bottom surface of the substrate. At least some of the land grid array pads are coupled to the at ...
Universal dock for context sensitive computing device
Microsoft Technology Licensing, Llc
November 16, 2017 - N°20170329366

A dock for interacting with a computing device. The computing device configures itself for operations based on its context, which may be determined form the dock by reading a value from a tag on the dock. The computing device may use low power transmissions such that receiving a value from the tag provides an indication of proximity to the dock. ...
Form Factor Patent Pack
Download 125+ patent application PDFs
Form Factor Patent Applications
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For professional research & prior art discovery
inventor
  • 125+ full patent PDF documents of Form Factor-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Optical waveguide using fresnel lenses
Bitome, Inc.
November 09, 2017 - N°20170322414

An optical waveguide for a see-through display system using fresnel lenses is disclosed. This invention enables high efficiency of light utilization, wavelength independence, high resolution and very small form factor. This display system is suitable for head-up-display and wearable display.
System and method of conducting particle monitoring using low cost particle sensors
Tsi, Incorporated
November 09, 2017 - N°20170322123

There is disclosed a field calibratable particle sensor solution in a low-cost, very compact form factor. This makes a low-cost sensor more accurate for low-concentration pollution measurements and decreases the cost of pollution measurement systems having a wide geographic coverage. In a related embodiment, the invention illustrates a method and system to remotely and automatically calibrate one or more of ...
Low power and small form factor infrared imaging
Tsi, Incorporated
November 02, 2017 - N°20170318237

Various techniques are provided for implementing an infrared imaging system. In one example, a system includes a focal plane array (fpa). The fpa includes an array of infrared sensors adapted to image a scene. The fpa also includes a bias circuit adapted to provide a bias voltage to the infrared sensors. The bias voltage is selected from a range of ...
Transposable battery pack for uninterruptible power supply
Tsi, Incorporated
November 02, 2017 - N°20170317323

According to an example, a plurality of battery modules may be dimensioned to fit within a form factor.
Small scale reaction wheel assemblies
Tsi, Incorporated
November 02, 2017 - N°20170313445

Reaction wheel assemblies having relatively compact and lightweight form factors (referred to as “small scale” rwas) are disclosed. Such small scale rwas are well-suited for deployment onboard relatively small satellites, but are not restricted to usage within any particular device or platform. In one embodiment, the small scale rwa includes a primary support platform to which ...
Programmable small form-factor pluggable module
Accedian Networks Inc.
October 26, 2017 - N°20170310397

A small form factor pluggable (“sfp”) transceiver for use in a communications network includes a transmitter adapted to be coupled to the network for supplying signals to the network, a receiver adapted to be coupled to the network for receiving signals from the network, and a programmable signal processing module coupled to the transmitter and the ...
Single layer capacitors
Eulex Corp.
October 26, 2017 - N°20170309405

Capacitors having form factors (e. G., dimensions and functionality) comparable with traditional single layer capacitors, but with considerably higher capacitance and methods of their manufacture are provided. Capacitors and methods that implement capacitors where at least one of the dielectric layers is reduced in thickness post firing to produce a device robust enough for automated handling and provide a stable ...
Surface mount device stacking for reduced form factor
Eulex Corp.
October 19, 2017 - N°20170303400

A packaged module for use in a wireless communication device has a substrate supporting an integrated circuit die that includes at least a microprocessor and radio frequency receiver circuitry and a stacked filter assembly configured as a filter circuit that is in communication with the radio frequency receiver circuitry. The stacked filter assembly includes a plurality of passive components, where ...
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