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Footprint

Footprint-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Packaging for mems transducers
Cirrus Logic International Semiconductor Ltd.
October 12, 2017 - N°20170295434

This application describes methods and apparatus relating to packaging of mems transducers and to mems transducer packages. The application describes a mems transducer package (300) having a first integrated circuit die (200) which has an integrated mems transducer (202) and integrated electronic circuitry (203) for operation of the mems transducer. The package is arranged such that the footprint of the mems transducer package is ...
Optical loop enhanced optical modulators
Cirrus Logic International Semiconductor Ltd.
October 12, 2017 - N°20170293083

External modulators, variable optical attenuators, optical gates, etc. Employing mach-zehnder interferometers (mzis) are a common structure within photonic integrated circuits and solutions for addressing the ever increasing demands for larger bandwidth and higher capacity in telecommunication and datacom networks. In most applications, but particularly data centers with potentially tens of thousands of optical links where direct board level applications would ...
Kit for increasing th1 cells
Immunovative Therapies, Ltd.
October 12, 2017 - N°20170290857

The present invention includes vaccine compositions and methods for using these vaccine compositions in active immunotherapy. The vaccine compositions include allogeneic activated th1 memory cells. The compositions can also include one or more disease-related antigens. The methods include administering the vaccine compositions to provide a th1 footprint in normal individuals or patients susceptible to disease or having minimal residual disease.
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Footprint Patent Applications
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Consolidated kitchen workspace
Immunovative Therapies, Ltd.
October 12, 2017 - N°20170290422

A kitchen workspace and a method of organizing a kitchen workspace is set forth. The kitchen workspace is consolidated into a small footprint area with automated vertical storage shelves for storing and housing kitchen items and kitchen appliances. The automated storage shelves may be provided with electrical power for powering kitchen appliances found on the shelves. Kitchen appliances may be ...
System and method for zero-footprint screen capture
Zoom International S.r.o.
October 05, 2017 - N°20170289310

A system for zero-footprint screen capture, comprising a communication server software module, a screen capture server software module, a web server software module, and a media upload server software module, wherein the web server, on receiving a request for a specific web page from a client application whose screen is to be captured, uploads a persistent screen capture software application ...
Multiple-input multiple-output (mimo) antenna swapping circuit
Qorvo Us, Inc.
October 05, 2017 - N°20170288765

Aspects disclosed herein include a multiple-input multiple-output (mimo) antenna swapping circuit. The mimo antenna swapping circuit includes primary switching circuitry configured to be coupled to a first antenna and a third antenna, and secondary switching circuitry configured to be coupled to a second antenna and a fourth antenna. The primary switching circuitry is coupled to the secondary switching circuitry via ...
Footprint Patent Pack
Download 214+ patent application PDFs
Footprint Patent Applications
Download 214+ Footprint-related PDFs
For professional research & prior art discovery
inventor
  • 214+ full patent PDF documents of Footprint-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Wiring board, electric motor, electric apparatus, and air conditioner
Mitsubishi Electric Corporation
October 05, 2017 - N°20170288509

An object of the present invention is to obtain a wiring board that achieves both of high mounting position accuracy and high solder strength in a circumferential direction. On the wiring board, an electronic component including a plurality of pins is mounted. The wiring board includes a base substrate, a plurality of wires provided on the base substrate, a resist ...
Monolithic three-dimensional (3d) ics with local inter-level interconnects
Intel Corporation
October 05, 2017 - N°20170287905

Monolithic 3d ics employing one or more local inter-level interconnect integrated intimately with at least one structure of at least one transistor on at least one transistor level within the 3d ic. In certain embodiments the local inter-level interconnect intersects a gate electrode or a source/drain region of at least one transistor and extends through at least one inter-level ...
Integrated circuit package having integrated emi shield
Intel Corporation
October 05, 2017 - N°20170287847

Apparatus and methods are provided for an integrated circuit package that includes an integrated emi shield. In an example, an integrated circuit package can include an integrated circuit mounted to a substrate via connections on the bottom surface of the integrated circuit, a conductive fence surrounding side surfaces of the integrated circuit, a conductive film coupled to the conductive fence, ...
Three-dimensional model creation and rendering with improved virtual reality experience
Umbra Software Oy
October 05, 2017 - N°20170287199

A cloud network server system, a method, and a software program product for compiling and presenting a three-dimensional (3d) model are provided. An end 3d model is composed from at least two pre-existing 3d models stored in the cloud network server system by combining the pre-existing 3d models. The end 3d model is partitioned into smaller cells. The system and ...
Reduction of bvh-node bandwidth with incremental traversal
Intel Corporation
October 05, 2017 - N°20170287100

Incremental encoding of bounding volume hierarchies (bvh) enables coarse quantization of bounding volumes, significantly reducing their memory footprint. However, reducing the size of the bvh alone does not yield a comparable reduction in memory bandwidth in some embodiments. While the bounding volumes of the bvh nodes can be aggressively quantized, the size of the child node pointers remains a significant ...
Optical fiber connector
Clearfield, Inc.
October 05, 2017 - N°20170285275

An optical fiber connector and method for assembly and use are disclosed. The optical fiber connector is configured to have a small footprint so that the connector may be pushable or pullable through a conduit if use of a conduit may be needed. The connector may include a first number of connector components configured to fit through a conduit, and ...
Simple lamp pcr design for low resource setting and minimal environmental footprint
Nowdiagnostics
October 05, 2017 - N°20170283858

The present invention provides a device and method for testing a material for the presence of dna. The system includes a centrifuge, a microchip performing cell lysis and an enclosure that contains an isothermal ballast material and chromogenic agent that melts at a specific temperature and displays a color change, respectively.
Footprint Patent Pack
Download 214+ patent application PDFs
Footprint Patent Applications
Download 214+ Footprint-related PDFs
For professional research & prior art discovery
inventor
  • 214+ full patent PDF documents of Footprint-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Transformable intravenous pole and boom combination and method thereof
Skytron, Llc
October 05, 2017 - N°20170281856

An intravenous (iv) pole docking system for supporting medical equipment having a mast engaged to a base, the base having legs to support the mast and a lifting mechanism engaged to the base and the mast for moving the base along the mast in combination with an extension arm meant to reduce the iv pole footprint. The boom/iv pole ...
Th1 vaccination priming for active immunotherapy
Immunovative Therapies, Ltd.
October 05, 2017 - N°20170281743

The present invention includes vaccine compositions and methods for using these vaccine compositions in active immunotherapy. The vaccine compositions include allogeneic activated th1 memory cells. The compositions can also include one or more disease-related antigens. The methods include administering the vaccine compositions to provide a th1 footprint in normal individuals or patients susceptible to disease or having minimal residual disease.
Surgical instruments and methods
Stryker European Holdings I, Llc
October 05, 2017 - N°20170281249

Various surgical instruments, implants, and their methods of use are disclosed. The surgical instruments are usable to insert various implants into a patient through an access portal in a minimally-invasive manner. The implants are rotatable between different orientations using the instruments to change the footprint of the implant and allow the implant to be inserted through the minimally-invasive access portal.
Method to fabricate discreet vertical transistors
Hgst Netherlands B.v.
September 28, 2017 - N°20170279043

The present disclosure generally relates to the fabrication of metal-oxide-semiconductor (mos) select transistors in a vertical orientation such that the transistor pair fits within the footprint of a 4f2 memory cell. The present disclosure further relates to the simultaneous fabrication of a vertical stack of transistors in which each transistor is distinct, as opposed to being serially connected in a ...
Semiconductor device and method of forming encapsulated wafer level chip scale package (ewlcsp)
Stats Chippac Pte. Ltd.
September 28, 2017 - N°20170278765

A semiconductor device has a semiconductor die and an encapsulant around the semiconductor die. A fan-in interconnect structure is formed over the semiconductor die while leaving the encapsulant devoid of the interconnect structure. The fan-in interconnect structure includes an insulating layer and a conductive layer formed over the semiconductor die. The conductive layer remains within a footprint of the semiconductor ...
Low pry seismic fitting
Loos & Co., Inc.
September 28, 2017 - N°20170275871

Applicant has disclosed a seismic fitting, and related method, to attach a cable to a structure (e. G., a concrete ceiling, wall or beam of a commercial building). In the preferred “apparatus” embodiment, the seismic fitting, when anchored, comprises: a base with a substantially circular footprint; a substantially circular inner channel, in the base, housing a ...
Stabilizing system for excavators
Mime, Llc
September 28, 2017 - N°20170275850

A support system for an excavator is disclosed as it may include an extended center frame, a trench support, and/or a mat. The extended center frame may be bolted onto a standard excavator to widen the overall footprint of the machine and reduce ground pressure. The trench support relieves any remaining pressure toward the open trench. The extended center ...
Modularized system and method for urea production using stranded natural gas
4a Technologies, Llc
September 28, 2017 - N°20170275245

A modular system and method for producing urea from stranded natural gas includes removal of foreign particulate matter to obtain a substantially homogeneous gas. The gas is processed by controlling the quality of the stranded natural gas to maintain a substantially homogenous mixture the resultant gas stream is further cleaned and compressed to a high pressure of about 3,000 psi. The ...
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