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Encapsulation

Encapsulation-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Device and method of handling data transmissions in a wireless communication system
Htc Corporation
June 14, 2018 - N°20180167859

A first communication device for communicating with a second communication device according to a cellular network/wireless local area network (wlan) radio level integration with internet protocol security (ipsec) tunnel (cwip) comprises a storage device for storing instructions and a processing circuit coupled to the storage device. The processing circuit is configured to execute the instructions stored in the storage ...
Data packet forwarding
New H3c Technologies Co., Ltd.
June 14, 2018 - N°20180167320

A sdn controller obtains and stores a nat mapping relationship between a private network address and a public network of a host computer in each sdn; receives a flow table request for a data packet from a vtep device, searching for a nat mapping relationship corresponding to a target ip address of the data packet when determining that the data ...
System and method for stator slot encapsulation using injected polymer
American Axle & Manufacturing, Inc.
June 14, 2018 - N°20180166951

A method for improving thermal conduction in a stator having electrically conductive windings wound in a plurality of gaps formed between adjacent pairs of a plurality of teeth of the stator. A plurality of interstitial spaces are formed within each of the gaps during winding of the electrically conductive windings around the teeth.
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Electronic device
Lg Display Co., Ltd.
June 14, 2018 - N°20180166507

An electronic device can include: a pixel array layer disposed on a substrate and including a plurality of pixels, each of the plurality of pixels including a thin film transistor and an organic light emitting device; an encapsulation layer covering the pixel array layer; a shielding layer disposed on the encapsulation layer; and a touch sensing layer disposed on the ...
Package structure and method for forming the same
Taiwan Semiconductor Manufacturing Co., Ltd.
June 14, 2018 - N°20180166396

Package structures and methods for forming the same are provided. A fan-out package structure includes a semiconductor substrate.
Semiconductor devices including exposed opposing die pads
Infineon Technologies Austria Ag
June 14, 2018 - N°20180166366

A semiconductor device includes a first lead frame, a second lead frame, a first semiconductor chip, and an encapsulation material. The first lead frame includes a first die pad having a first surface and a second surface opposite to the first surface.
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Encapsulation Patent Applications
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Powder phase-change energy-saving material and preparation method
Pioneer Energy (jiangsu) Co., Ltd
June 14, 2018 - N°20180163108

A powdered phase-change energy-saving material includes a carrier and an inorganic phase-change energy-saving material adsorbed onto the carrier. The powdered phase-change energy-saving material includes 35-50 parts by weight of an energy-saving material, 0.1-1 parts by weight of a nucleating agent, 0-15 parts by weight of a modifier, 35-50 parts by weight of water, and 20-25 parts by weight of a ...
Method of treating proteinuria in pregnancy
Curemark, Llc
June 14, 2018 - N°20180161409

A therapeutic agent for the treatment of toxemia, preeclampsia and eclampsia and a method for preparing the therapeutic agent are disclosed. The therapeutic agent is a stable pharmaceutical preparation containing, but not limited to, digestive/pancreatic enzymes.
Organic light emitting display device
Samsung Display Co., Ltd.
June 07, 2018 - N°20180159083

An organic light emitting display device includes: a substrate; an organic light emitting element on the substrate; and a thin film encapsulation layer on the organic light emitting element. The thin film encapsulation layer includes a first thin film, a second thin film and a third thin film which are sequentially stacked therein, a refractive index of the second thin ...
Display device
Samsung Display Co., Ltd.
June 07, 2018 - N°20180159077

A display device includes a substrate including a display area and a peripheral area, a first insulating layer on the substrate, a first dam in the peripheral area and separated from the first insulating layer, an electrode power supply line on the substrate between the first insulating layer and the first dam, a protection conductive layer on the first insulating ...
Lighting apparatus using organic light-emitting diode and method of fabricating the same
Lg Display Co., Ltd.
June 07, 2018 - N°20180159071

A lighting apparatus using an organic light-emitting diode and a method of fabricating the same are characterized in that an organic emissive material and a conductive film used as a cathode are deposited on the entire surface of a substrate, and then an organic emissive layer in a lighting area and contact areas becomes separated (disconnected or cut) by laser ...
Flexible encapsulation of a flexible thin-film based thermoelectric device with sputter deposited layer of n-type ...
June 07, 2018 - N°20180159015

A method of encapsulating a thin-film based thermoelectric module includes forming the thin-film based thermoelectric module by sputter depositing pairs of n-type thermoelectric legs and p-type thermoelectric legs electrically in contact with one another on a flexible substrate having a dimensional thickness less than or equal to 25 μm, and rendering the formed thin-film based thermoelectric module flexible and ...
Display device
Samsung Display Co, Ltd
June 07, 2018 - N°20180158894

A display device includes a substrate, a display area disposed on the substrate and including a plurality of pixels and data lines, a peripheral area disposed outside the display area of the substrate, a pad portion disposed in the peripheral area, an encapsulation layer disposed in the peripheral area and the display area, and disposed on the plurality of pixels ...
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Encapsulation Patent Applications
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For professional research & prior art discovery
inventor
  • 581+ full patent PDF documents of Encapsulation-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Organic light emitting display
Samsung Sdi Co., Ltd.
June 07, 2018 - N°20180158879

Disclosed is an organic light emitting display device including a substrate, an organic light emitting element formed on the substrate, and an encapsulation layer encapsulating the organic light emitting element, wherein the encapsulation layer has a structure in which at least two inorganic layers and at least one organic layer are alternately stacked one above another, each of the inorganic ...
Fan-out package structure, and manufacturing method thereof
Sj Semiconductor (jiangyin) Corporation
June 07, 2018 - N°20180158798

The method of fabricating a fan-out package structure comprises: s1, providing a substrate (1), forming an adhesive layer (2) on the substrate's upper surface; s2, forming a redistribution layer (3) on the adhesive layer's upper surface; s3, bonding one first chip (4) to the redistribution layer's upper surface, and constructing at least two first bump structures (5), wherein the first chip and the first bump ...
Integrated fan-out package and method of fabricating the same
Taiwan Semiconductor Manufacturing Co., Ltd.
June 07, 2018 - N°20180158787

An integrated fan-out package including an insulating encapsulation, a radio frequency integrated circuit (rf-ic), an antenna, a ground conductor, and a redistribution circuit structure is provided. The integrated circuit includes a plurality of conductive terminals.
Light emitting package, display apparatus having the light emitting package and method of manufacturing the ...
Samsung Display Co., Ltd.
June 07, 2018 - N°20180157118

A light emitting package includes a light source which generates light provided to a display panel which displays an image with the light; a lead frame on which the light source is disposed and to which power for driving the light source is applied; an encapsulation mold which covers an upper portion and a side portion of the light source ...
Encapsulation sleeve gasket assembly with removable inner layer
Total Piping Solutions, Inc.
June 07, 2018 - N°20180156367

A coupling assembly orientated about a longitudinal axis and having a first sleeve and second sleeve configured to be tightened to a fluid conduit, a radial-split gasket configured to be positioned between the sleeves and the fluid conduit and having an outer gasket layer and a separate inner gasket layer that are configured to be selectively disengaged from each other, ...
Thin film encapsulation processing system and process kit
Applied Materials, Inc.
June 07, 2018 - N°20180155835

The present disclosure relates to methods and apparatus for a thin film encapsulation (tfe). In one embodiment a process kit for use in an atomic layer deposition (ald) chamber is disclosed and includes a dielectric window, a sealing frame, and a mask frame connected with the sealing frame, wherein the mask frame has a gas inlet channel and a gas ...
Insertable photoelectric device using absorption of light penetrating skin and electronic apparatus having same photoelectric ...
Gwangju Institute Of Science And Technology
June 07, 2018 - N°20180154158

An implantable photovoltaic device. The implantable photovoltaic device includes: at least two solar microcells configured to absorb sunlight; a thin film wire configured to connecting the at least two solar microcells to each other; a film configured to support the solar microcells; an upper encapsulation layer configured to encapsulate an upper side of the solar microcells and shield the solar ...
Process of preparing mrna-loaded lipid nanoparticles
Translate Bio, Inc.
June 07, 2018 - N°20180153822

The present invention provides an improved process for lipid nanoparticle formulation and mrna encapsulation. In some embodiments, the present invention provides a process of encapsulating messenger rna (mrna) in lipid nanoparticles comprising a step of mixing a solution of pre-formed lipid nanoparticles and mrna..
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