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Encapsulation patents

      

This page is updated frequently with new Encapsulation-related patent applications.




 Overmold proximity sensor and associated methods patent thumbnailnew patent Overmold proximity sensor and associated methods
An electronic device includes a substrate, an optical sensor coupled to the substrate, and an optical emitter coupled to the substrate. A lens is aligned with the optical emitter and includes an upper surface and an encapsulation bleed stop groove around the upper surface.
Stmicroelectronics Pte Ltd


 Display apparatus patent thumbnailnew patent Display apparatus
A display apparatus includes a substrate including at least one hole disposed in a hole area of the substrate, a thin film transistor disposed on the substrate, a light-emitting component disposed on the substrate and electrically connected to the thin film transistor, an insulating layer disposed on the substrate, a thin film encapsulation layer disposed on the substrate, and a laser blocking layer. The substrate includes a display area and a non-display area that is disposed between the display area and the hole area.
Samsung Display Co., Ltd.


 Transparent display apparatus patent thumbnailnew patent Transparent display apparatus
A display apparatus includes a display area and a non-display area around the display area. A substrate includes a plurality of pixels.
Samsung Display Co., Ltd.


 Top-emitting organic electroluminescent display panel, manufacturing method thereof and display device patent thumbnailnew patent Top-emitting organic electroluminescent display panel, manufacturing method thereof and display device
A top-emitting organic electroluminescent display panel, a manufacturing method, and a display device. The top-emitting organic electroluminescent display panel comprises: a substrate, a layer of white organic light emitting diodes and a thin film encapsulation layer arranged on the substrate in sequence.
Boe Technology Group Co., Ltd.


 Lead frame and semiconductor device patent thumbnailnew patent Lead frame and semiconductor device
A semiconductor device includes a lead frame; a semiconductor chip mounted on the lead frame; and an encapsulation resin, wherein a convexo-concave portion including a plurality of concave portions is provided at a covered portion of the lead frame that is covered by the encapsulation resin, wherein the planer shape of each of the concave portions is a circle, the diameter of which is greater than or equal to 0.020 mm and less than or equal to 0.060 mm, or a polygon, the diameter of whose circumcircle is greater than or equal to 0.020 mm and less than or equal to 0.060 mm, and wherein a ratio s/s0 is greater than or equal to 1.7 where “s” is a surface area of the convexo-concave portion that is formed at a flat surface whose surface area is “s0”.. .
Shinko Electric Industries Co., Ltd.


 External gettering patent thumbnailnew patent External gettering
Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed.
Micron Technology, Inc.


 Digital encapsulation of audio signals patent thumbnailnew patent Digital encapsulation of audio signals
Encoding and decoding systems are described for the provision of high quality digital representations of audio signals with particular attention to the correct perceptual rendering of fast transients at modest sample rates. This is achieved by optimising downsampling and upsampling filters to minimise the length of the impulse response while adequately attenuating alias products that have been found perceptually harmful..
Reinet S.a.r.l.


 Encapsulation of light-emitting elements on a display module patent thumbnailnew patent Encapsulation of light-emitting elements on a display module
A video display module comprises a circuit board having a front face, a plurality of light-emitting elements electrically coupled to the front face of the circuit board, and a polymer encapsulating member adhered to the front face of the circuit board, the polymer encapsulating member substantially covering at least a portion of the circuit board and a portion of the plurality of light-emitting elements, the polymer encapsulating member substantially sealing the portion of the circuit board and the portion of the plurality of light-emitting elements.. .
Daktronics, Inc.


 Display device having planarized surface patent thumbnailnew patent Display device having planarized surface
A display device according to an exemplary embodiment includes: a substrate; a thin film transistor disposed on the substrate; an electrode connected with the thin film transistor; a roof layer disposed on the electrode, while interposing a microcavity therebetween; an injection hole disposed along a side surface of the microcavity; a liquid crystal layer disposed in the microcavity; and an encapsulation layer covering the injection hole of the microcavity. The roof layer comprises a first portion disposed adjacent to the injection hole, and a second portion other than the first portion, and a height from the substrate to an upper surface of the first portion is lower than the height from the substrate to an upper surface of the second portion..
Samsung Display Co., Ltd.


 Encapsulated light fixture patent thumbnailnew patent Encapsulated light fixture
An encapsulated light fixture is provided that may be mounted to a ceiling or a wall. Multiple light fixtures may be connected with one another to provide for lighting a greater area.
The Original Cast Lighting, Inc.


new patent

Vine lamp and production method thereof

A vine lamp and a production method thereof, the lamp including plural light strings, each of which includes a plurality of light emitting components and two conducting wires arranged side by side, wherein the insulating layer of each conducting wire is provided with a plurality of openings, on each of which one light emitting component is welded; a transparent encapsulation layer is wrapped outside of each light emitting component to form a lamp bead; the conducting wire between two adjacent light beads is divided into a first conducting wire section, a second conducting wire section and a third conducting wire section in sequence; the first conducting wire section and the third conducting wire section on both sides of each lamp bead intersect and are winded with each other; a plurality of the second conducting wire sections of the plurality of light strings intersect and are winded with each other.. .
Guangzhou Kingyi Metal Product Co., Ltd.

Multi-hop wan macsec over ip

An egress frame processing method, an ethernet frame is received. Information defining an internet protocol (ip) tunnel between the network device and a peer network device over a public wide area network is determined.
Cisco Technology, Inc.

Multi-hop wan macsec over ip

In an egress processing method, an egress frame is received. The egress frame includes an outer ethernet frame, an internet protocol (ip) header, a layer 3 (l3) encapsulation identifying a layer 2 (l2)-over-l3 tunnel protocol, and an inner ethernet frame with a payload.
Cisco Technology, Inc.

Slot liner thermal conductivity for electric motors

An electric machine includes a stator having a stator core, rotor core and/or magnetic core comprising a plurality of slots. Each of the plurality of slots includes a spacer, a conductor, and encapsulated slot insulation.
Uqm Technologies, Inc.

Composite brake disks with an integrated heat sink, methods for manufacturing the same, and methods for producing encapsulated heat sink material

Brake disks with integrated heat sink are provided. Brake disk includes a fiber-reinforced composite material and an encapsulated heat sink material impregnated into the fiber-reinforced composite material.
Goodrich Corporation

Degradation agent encapsulation

Degradation agent encapsulation is provided. In one possible implementation, a capsule includes a degradation agent configured to encourage degradation of the part and a coating at least partially encapsulating the degradation agent.
Schlumberger Technology Corporation

Fixed window assembly for a vehicle and manufacturing same

The subject invention includes a fixed window assembly for a vehicle comprising a fixed glass, a trim portion having a polymeric base and a decorative member bonded to the polymeric base. An encapsulation is coupled to the fixed glass and the polymeric base to mount the trim portion in a spaced and adjacent position relative to the fixed glass.
Henniges Automotive Sealing Systems North America, Inc.

Patterned surfaces

The present disclosure provides patterned materials that may be useful in reducing certain negative effects associated with damaged tissue in vivo. The patterned materials can modify the healing process, and may minimize the formation of scar tissue.
Kimberly-clark Worldwide, Inc.

Patterned surface

The present disclosure provides patterned materials that may be useful in reducing certain negative effects associated with damaged tissue in vivo. The patterned materials can modify the healing process, and may minimize the formation of scar tissue.
Kimberly-clark Worldwide, Inc.

Lineage differentiation of encapsulated embryonic stem cells

This application discloses alginate microencapsulation-mediated differentiation of embryonic stem cells and use of the stem cell differentiation method for the development of effective treatment of various diseases and disorders. The microencapsulation of embryonic stem (es) cells results in decreased cell aggregation and enhanced neural lineage differentiation through incorporating the soluble inducer retinoic acid (ra) into the permeable microcapsule system.
Rutgers, The State University Of New Jersey

Therapeutic encapsulated mesenchymal stromal cells

This application discloses a micro-encapsulation system for immobilizing mesenchymal stromal cells (mscs) while sustaining the molecular communication. Thus, the invention provides the use of encapsulated mesenchymal stromal cells in the cellular transplantation therapies.
Rutgers, The State University Of New Jersey

Pharmaceutical composition with ionically crosslinked polymer encapsulation of active ingredient

Compositions and thin films containing an encapsulated active pharmaceutical ingredient, as well as methods of manufacturing and using the same.. .
Cure Pharmaceutical Corporation

Bit indexed explicit replication packet encapsulation

Methods and network devices are disclosed for multicast forwarding. In one embodiment, a method includes receiving at a node a multicast message comprising a message header, where the message header comprises an incoming message bit array and a set identifier value associated with the incoming message bit array.
Cisco Technology, Inc.

Network traffic pre-classification within vm platforms in virtual processing environments

Methods and systems are disclosed that pre-classify network traffic monitored within virtual machine (vm) platforms. Client packet monitor applications operate within client vm platforms to monitor network packets, generate monitored packets representing traffic of interest, determine packet classifications for the monitored packets based upon packet contents, identify tags associated with the packet classifications, encapsulate monitored packets with encapsulation headers including the tags to form encapsulated packets, and forward the encapsulated packets to tool vm platforms.
Ixia

Direct network traffic monitoring within vm platforms in virtual processing environments

Systems and methods are disclosed that provide direct network traffic monitoring within virtual machine (vm) platforms operating in virtual processing environments. The disclosed embodiments in part provide direct network packet monitoring through client packet monitor applications that run within client vm platforms to obtain packet traffic and to forward this traffic directly to tool packet monitor applications operating within tool vm platforms.
Ixia

Nanoparticulate encapsulation barrier stack

A barrier stack for encapsulating a moisture and/or oxygen sensitive electronic device is provided. The barrier stack comprises a multilayer film having at least one barrier layer having low moisture and/or oxygen permeability, and at least one sealing layer arranged to be in contact with a surface of the barrier layer, wherein the sealing material comprises reactive nanoparticles capable of interacting with moisture and/or oxygen, thereby retarding the permeation of moisture and/or oxygen through defects present in the barrier layer..
Agency For Science, Technology And Research

Organic light emitting display device and manufacturing the same

An organic light emitting display (oled) device includes a substrate, a plurality of first electrodes, a plurality of light emitting layers, a second electrode, a power supply line, a third electrode, and an encapsulation member. The third electrode that is formed on the power supply line and the second electrode that is formed on the light emitting layers extend to a contact region that is in a peripheral region of the substrate.
Samsung Display Co., Ltd.

Light emitting diode

A light emitting diode includes: a substrate; a semiconductor light emitting laminate on the substrate, including from bottom up a first semiconductor layer, an active layer, and a second semiconductor layer electrically dissimilar to the first semiconductor layer; a transparent conductive layer with an opening portion; the first electrode electrically connected with the first semiconductor layer; and the second electrode electrically connected with the second semiconductor layer; the second electrode fills the opening portion, and the position where the second electrode contacts the transparent conductive layer is arranged with a recessed portion, and the second electrode is embedded in the transparent conductive layer. The recessed portion is formed on the second electrode, having the second electrode embedded in the transparent conductive layer, increasing the counter force of the second electrode against the horizontal thrust during encapsulation of the led structure and avoiding detachment during wire bonding for encapsulation..
Xiamen Sanan Optoelectronics Technology Co., Ltd.

Shield wrap for a heterostructure field effect transistor

Devices are disclosed for providing heterojunction field effect transistor (hfets) having improved performance and/or reduced noise generation. A gate electrode is over a portion of the active region and is configured to modulate a conduction channel in the active region of an hfet.
Power Integrations, Inc.

Integrated device comprising embedded package on package (pop) device

An integrated device that includes a printed circuit board (pcb) and a package on package (pop) device coupled to the printed circuit board (pcb). The package on package (pop) device includes a first package that includes a first electronic package component (e.g., first die) and a second package coupled to the first package.
Qualcomm Incorporated

Package-on-package (pop) device comprising a gap controller between integrated circuit (ic) packages

A package on package (pop) device that includes a first package, a second package that is coupled to the first package, and at least one gap controller located between the first package and the second package, where the at least one gap controller is configured to provide a minimum gap between the first package and the second package. The first package includes a first electronic package component (e.g., first die).
Qualcomm Incorporated

Base-attached encapsulant for semiconductor encapsulation, manufacturing base-attached encapsulant for semiconductor encapsulation, and manufacturing semiconductor apparatus

A base-attached encapsulant for semiconductor encapsulation, includes a base and encapsulating resin layer on one surface of the base, the base being composed of a fibrous base layer in which a thermosetting resin composition containing a thermosetting resin is impregnated into a fibrous base and cured, a cured material layer a composed of a cured material of the thermosetting resin composition formed on the fibrous base layer at the opposite side to the encapsulating resin layer, and a cured material layer b composed of a cured material of the thermosetting resin composition formed on the fibrous base layer at the encapsulating resin layer side. The thickness ta of the cured material layer a is 0.5 μm or more.
Shin-etsu Chemical Co., Ltd.

Display device and manufacturing method thereof

The exemplary embodiments relate generally to a display device that may include: a first substrate and a second substrate, each including a transparent encapsulation area; an outer sealant along a side of the transparent encapsulation area; a pattern part disposed on the first substrate and extending in a direction parallel to the outer sealant; and a transparent sealant adjacent to the pattern part and extending in a direction parallel to the pattern part, and a manufacturing method thereof.. .
Samsung Display Co., Ltd.

Polymersome encapsulation of hydrophobic fluorescent polymers

Described herein are aqueous soluble polymersomes that encapsulate one or more hydrophobic fluorescent polymers and methods of their preparation and use.. .
Becton, Dickinson And Company

Multi-layer hydrogel capsules for encapsulation of cells and cell aggregates

Biocompatible hydrogel capsules encapsulating mammalian cells having a diameter of greater than 1 mm, and optionally a cell free core, are disclosed which have reduced fibrotic overgrowth after implantation in a subject. Methods of treating a disease in a subject are also disclosed that involve administering a therapeutically effective amount of the disclosed encapsulated cells to the subject..
The Children's Medical Center Corporation

Encapsulation of isoquinoline alkaloids

Processes of extracting isoquinoline alkaloids from natural sources and encapsulating the alkaloids in an alginate and inulin matrix are provided. The isoquinoline alkaloid encapsulates are useful as animal feed..
Rhizofeed, Llc

Flexible display device and fabrication method thereof

A flexible display device and fabrication method thereof are provided. The flexible display device includes a flexible substrate, a buffer layer disposed on the flexible substrate, a display unit disposed on the buffer layer covering a part of the buffer layer, and a thin film encapsulation layer disposed on the display unit and a rest part of the buffer layer.
Tianma Micro-electronics Co., Ltd.

Bromine containing silicon precursors for encapsulation layers

Methods of depositing silicon nitride encapsulation layers by atomic layer deposition over memory devices including chalcogenide material are provided herein. Methods include using iodine-containing and/or bromine-containing silicon precursors and depositing thermally using ammonia or hydrazine as a second reactant, or iodine-containing and/or bromine-containing silicon precursors and depositing using a nitrogen-based or hydrogen-based plasma..
Lam Research Corporation

Method for encapsulating a chalcogenide material

Methods of depositing silicon nitride encapsulation layers by atomic layer deposition over memory devices including chalcogenide material are provided herein. Methods include using iodine-containing silicon precursors and depositing thermally using ammonia or hydrazine as a second reactant, or iodine-containing silicon precursors and depositing using a nitrogen-based or hydrogen-based plasma..
Lam Research Corporation

Electronic device provided with an integral conductive wire and manufacture

An electronic device includes a supporting substrate having a front mounting face and an electrical connection network. An integrated circuit chip is mounted to the mounting face and is electrically connected to the electrical connection network.
Stmicroelectronics (alps) Sas

Display device including touch screen function

Disclosed is a an in-cell type display device including a touch screen function which is capable of preventing a luminance from being changed in accordance with a viewing angle, and omitting a process of connecting touch electrodes provided in an upper substrate with tx driver and rx driver connected with a lower substrate, wherein the display device includes a lower substrate, a thin film transistor layer including thin film transistors provided on the lower substrate, an encapsulation layer provided on the thin film transistor layer, color filters provided on the encapsulation layer, a black matrix provided between the color filters and provided on the encapsulation layer, and first touch electrodes overlapped with the black matrix.. .
Lg Display Co., Ltd.

Shelf life of polyol blends containing halogenated olefins by encapsulation of active components

The shelf life of polyurethane polyol pre-blends containing halogenated olefins is extended by encapsulation of active components such as catalysts anti/or surfactants. The active component is encapsulated in a crystallizable or thermoplastic polymer.
Arkema Inc.

Nanoparticle compositions and methods of making and using the same

Water soluble graphene oxide nanoparticles (go) are provided having graphene sheets containing carboxylic and hydroxyl groups. The diameter of the go when present in a closed form ranges from about 40 nm to 120 nm.
Cromoz, Inc.

Method for the electrical passivation of electrode arrays and/or conductive paths in general, and a producing stretchable electrode arrays and/or stretchable conductive paths in general

A method produces a conductive paste comprising 15-20% by weight of pdms and 80-85% by weight of metallic micro-nano particles, wherein the conductive paste is obtained by repeated addition of singular doses of pdms to a heptane diluted pdms low viscosity liquid containing the metallic micro-nano particles, wherein the heptane fraction is allowed to evaporate after addition of each of the singular doses of pdms. A method forms a conductive path on a support layer, wherein the conductive path is encapsulated by an encapsulation layer comprising at least one via through which at least one portion of the conductive path is exposed, the method comprising filling the at least one via with the conductive paste..
Ecole Polytechnique Federale De Lausanne (epfl)

Virtual port channel bounce in overlay network

Aspects of the subject disclosure provide methods for avoiding a packet bounce event in a virtual port channel (vpc). A method of the technology can include steps for detecting a link failure event (e.g., between a first network device and a destination node), and receiving a data packet addressed to the destination node.
Cisco Technology, Inc.

Encapsulation layer thickness regulation in light emitting device

An ink jet process is used to deposit a material layer to a desired thickness. Layout data is converted to per-cell grayscale values, each representing ink volume to be locally delivered.
Kateeva, Inc.

Method for cutting display panel

A method for cutting a display panel is provided by the disclosure. The display panel includes a substrate, a cover plate provided opposite to the substrate, multiple display components sandwiched between the substrate and the cover plate, and encapsulation glue sandwiched between the substrate and the cover plate and surrounding the multiple display components.
Everdisplay Optronics (shanghai) Limited

Touch control organic light-emitting display panel

The present disclosure relates to an organic light-emitting display panel. A dielectric layer having a specific bragg reflector layer structure is disposed between a polarizer and an organic light-emitting diode device or between a polarizer and a touch control panel.
Everdisplay Optronics (shanghai) Limited

Encapsulation structure, encapsulating organic light-emitting diode device, and flexible display device

The present disclosure provides an encapsulation structure, a method for encapsulating an oled device, and a flexible display device. The encapsulation structure includes: a flexible substrate; an oled device arranged on the flexible substrate; a thin film encapsulation layer covering the oled device and including a plurality of first inorganic films and a plurality of organic polymer films arranged alternately; and a second inorganic film having a nanowire structure and covering the thin film encapsulation layer..
Boe Technology Group Co., Ltd.

Display device

Discussed herein is an organic light-emitting display (oled) device that may include an organic light-emitting element layer disposed on a substrate; and an encapsulation layer covering the organic light-emitting element layer to block moisture and/or oxygen from permeating, wherein the encapsulation layer includes a barrier film having at least one transmittance adjusting layer that adjusts a ratio at which light emitted from the organic light-emitting element layer exits the oled device, whereby the use of a polarizer is avoided.. .
Lg Display Co., Ltd.

Optoelectronic component and producing an optoelectronic component

An optoelectronic component may include a carrier, above which a first electrode is formed. An optically functional layer structure is formed above the first electrode.
Osram Oled Gmbh

Magnetresistive random-access memory and fabrication method thereof

Provided are exemplary circuits including a magnetoresistive random-access memory (mram) and methods for fabricating the circuits. In an example, a circuit includes an mram.
Qualcomm Incorporated

Microelectronic package debug access ports

A microelectronic package may be fabricated with debug access ports formed either at a side or at a bottom of the microelectronic package. In one embodiment, the debug access ports may be formed within an encapsulation material proximate the microelectronic package side.
Intel Corporation

Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies

Die (110) and/or undiced wafers and/or multichip modules (mcms) are attached on top of an interposer (120) or some other structure (e.g. Another integrated circuit) and are covered by an encapsulant (160).
Invensas Corporation



Encapsulation topics:
  • Encapsulation
  • Integrated Circuit
  • Switched Network
  • Communications
  • Biodegradable
  • Surfactant
  • Enhancement
  • Circuit Pack
  • Epoxy Resin
  • Monovalent
  • Flowability
  • Physical Layer
  • Transmitting And Receiving
  • Photovoltaic Module
  • Organopolysiloxane


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    This listing is a sample listing of patent applications related to Encapsulation for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Encapsulation with additional patents listed. Browse our RSS directory or Search for other possible listings.


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