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Encapsulation patents

      

This page is updated frequently with new Encapsulation-related patent applications.




 Binding registration method, data forwarding method, related device, and network system patent thumbnailBinding registration method, data forwarding method, related device, and network system
A binding registration method, a data forwarding method, a related device, and a network system are disclosed. An sdn controller includes: a first receiving unit, configured to receive a first bearer message that is forwarded by a first mag in multiple mags and that carries a first l2 attach request message; a first sending unit, configured to send, to each of the first mag and an lma, a message for establishing a tunnel between the first mag and the lma; a second sending unit, configured to send, to each of the first mag and the lma, a message for adjusting a flow entry of an mn; a configuration and encapsulation unit, configured to: configure an hnp(s) for the mn, and encapsulate the hnp(s) into an ra message; and a third sending unit, configured to send the ra message to the first mag..
University Of Science And Technology Of China


 Congestion sensitive path-balancing patent thumbnailCongestion sensitive path-balancing
Encapsulated packets may be generated for different packets transmitted between a source instance and destination instance in a computer system. The source instance and destination instance may be implemented by different physical hosts linked by multiple network paths.
Amazon Technologies, Inc.


 Congestion sensitive path-balancing patent thumbnailCongestion sensitive path-balancing
Encapsulated packets may be generated for different packets transmitted between a source instance and destination instance in a computer system. The source instance and destination instance may be implemented by different physical hosts linked by multiple network paths.
Amazon Technologies, Inc.


 Apparatuses and methods for encapsulated devices patent thumbnailApparatuses and methods for encapsulated devices
One embodiment is directed towards an encapsulated device. The encapsulated device includes a device, and a first encapsulation covering the device.
Intersil Americas Llc


 Organic light emitting display apparatus and  manufacturing organic light emitting display apparatus patent thumbnailOrganic light emitting display apparatus and manufacturing organic light emitting display apparatus
An organic :light emitting display apparatus includes a substrate, an organic light emitting portion comprising a plurality of organic light emitting devices formed on the substrate, and an encapsulation portion for encapsulating the organic light emitting portion. The encapsulation portion includes a porous layer formed on the organic light emitting portion, a planarization layer formed on the porous layer, and a barrier layer formed on the planarization layer.
Samsung Display Co., Ltd.


 Encapsulation film patent thumbnailEncapsulation film
Provided are an encapsulation film, an organic electronic device including the same, and a method of manufacturing the organic electronic device using the same. Particularly, the encapsulation film, which effectively blocks moisture or oxygen entering the organic electronic device from the outside, and has excellent mechanical properties such as handleability and processability, and the organic electronic device including the same are provided..
Lg Chem, Ltd.


 Display apparatus patent thumbnailDisplay apparatus
A display apparatus, including a display including a display element; an encapsulation layer on the display, the encapsulation layer including an outmost inorganic film; and a self-assembled monolayer on the encapsulation layer, self-assembled monolayer including a head portion, a chain portion connected to the head portion, and an end portion connected to the chain portion.. .
Samsung Display Co., Ltd.


 Pressure-sensitive adhesive composition patent thumbnailPressure-sensitive adhesive composition
Provided are a pressure-sensitive adhesive composition, an encapsulation film including the same, an organic electronic device including the same, and a method of manufacturing the organic electronic device. Therefore, provided is the pressure-sensitive adhesive composition, which can form a structure capable of effectively blocking moisture or water entering the organic electronic device from the outside, and have excellent processability in a process of manufacturing a panel and excellent heat retention under a high-temperature and high-humidity condition..
Lg Chem, Ltd.


 Wafer-level flipped die stacks with leadframes or metal foil interconnects patent thumbnailWafer-level flipped die stacks with leadframes or metal foil interconnects
An assembly includes a plurality of stacked encapsulated microelectronic packages, each package including a microelectronic element having a front surface with a plurality of chip contacts at the front surface and edge surfaces extending away from the front surface. An encapsulation region of each package contacts at least one edge surface and extends away therefrom to a remote surface of the package.
Invensas Corporation


 Isolation structure and  fabricating the same patent thumbnailIsolation structure and fabricating the same
An isolation structure and a method of fabricating the same are provided. The isolation structure includes a buffer layer and an encapsulation layer.
Macronix International Co., Ltd.


Magneto-impedance sensing device method and manufacturing method thereof

An electromagnetic impedance sensing device includes a substrate, a first patterned conductive layer, a second patterned conductive layer, a magneto-conductive wire and an encapsulation layer. The substrate has a surface and a trench extending into thereof.
Prolific Technology Inc.

Magneto-impedance sensing device and manufacturing method thereof

An electromagnetic impedance sensing device includes a first substrate, a first patterned conductive layer, a second substrate, a second patterned conductive layer, a magneto-conductive wire and an encapsulation layer. The first substrate has a first surface, and the first patterned conductive layer is formed on the first surface.
Prolific Technology Inc.

Microencapsulation of chemical additives

The present disclosure relates to new and optimized processes for the preparation of micro- and nano-scale capsules containing lubricant chemical additives. The present disclosure also relates to micro- and nano-scale capsules prepared by such processes, which are useful in a variety of applications, including automotive lubricants, diesel lubricants, industrial lubricants, metal-working lubricants, coolants, and process fluids.
The George Washington University

Implantable cell encapsulation device

Apparatus is provided for implantation of live cells in a subject. The apparatus includes an implantable immunoisolation device, which includes (a) a chamber, which contains the live cells; (b) an inner membrane layer, which is disposed at an external surface of the chamber, and which comprises a selective membrane that is permeable to nutrients; and (c) an outer hydrogel layer, which comprises a hydrogel, and which is attached to and coats an outer surface of the inner membrane layer.
Glusense Ltd.

Display device

A display device includes a substrate, an encapsulation unit opposite to the substrate, a display unit disposed between the substrate and the encapsulation unit and including a pixel, a camera unit disposed on one side of the substrate and including at least one camera module, and a mirror member disposed on one side of the encapsulation unit.. .
Samsung Display Co., Ltd.

System and restoration in a multimedia ip network

Disclosed herein are systems, methods, and computer readable media for modifying ip backbone link weights such that multicast traffic and unicast traffic will not travel on a same path between nodes. The method comprises assigning link weights to nodes within an ip backbone such that multicast forwarding paths and unicast forwarding paths are failure disjoint, and delivering undelivered multicast packets using ip unicast encapsulation to the loopback address of next hop router on a multicast tree upon link/interface failure..
At&t Intellectual Property I, L.p.

Battery encapsulaton method

A battery encapsulation method includes disposing an active battery layer on each of a plurality of battery substrates, with each battery substrate having a greater area than its corresponding active battery layer. The plurality of battery substrates are attached to an interposer having a greater area than an aggregate area of the plurality of battery substrates.
Stmicroelectronics (tours) Sas

Optoelectronic component and producing an optoelectronic component

An optoelectronic component may include a carrier, a first electrode over the carrier, an organically functional layer structure over the first electrode, a second electrode over the organically functional layer structure, and an encapsulation layer structure over the second electrode, the encapsulation layer structure encapsulating the organically functional layer structure and including a first layer structure facing toward the second electrode and a second layer structure facing away from the second electrode, the first layer structure alternately including first layers having a first expansion coefficient and second layers having a second expansion coefficient, which is not equal to the first expansion coefficient, and the second layer structure alternately including third layers having a third expansion coefficient and fourth layers having a fourth expansion coefficient, which is not equal to the third expansion coefficient.. .
Osram Oled Gmbh

Mirror display apparatus and manufacturing the same

A mirror display apparatus includes a display unit, a thin film encapsulation layer, a plurality of mirror patterns, a protection layer and a refractive index matching layer. The display unit is disposed on a substrate.
Samsung Display Co., Ltd.

Microelectronic assembly with redistribution structure formed on carrier

A microelectronic assembly can be made by forming a redistribution structure supported on a carrier, the structure including two or more layers of deposited dielectric material and two or more electrically conductive layers and including conductive features such as pads and traces electrically interconnected by vias. Electrical connectors may project above a second surface of the structure opposite an interconnection surface of the redistribution structure adjacent to the carrier.
Invensas Corporation

Encapsulated metal nanowires

An optically-transparent conductive structure is disclosed. The optically-transparent conductive structure can be used within a display stack of an electronic device.
Apple Inc.

Integrated circuit (ic) module comprising an integrated circuit (ic) package and an interposer with embedded passive components

An integrated circuit (ic) module that includes an integrated circuit (ic) package, a plurality of first solder interconnects coupled to the ic package, an interposer coupled to the ic package through the plurality of first solder interconnects a plurality of second solder interconnects coupled to the interposer; and a printed circuit board (pcb) coupled to the interposer through the plurality of second solder interconnects. The interposer includes an encapsulation layer, a first passive component at least partially embedded in the encapsulation layer, and a plurality of interconnects coupled to the first passive component.
Qualcomm Incorporated

System and tunnel stitching transport

A first network element (ne) implemented as a network virtualization edge (nve) includes a receiver configured to receive a packet comprising a destination address, a processor coupled to the receiver and configured to obtain a tunnel identifier of an overlay tunnel that communicatively couples a second ne to a third ne on an overlay path toward the destination address, add the tunnel identifier to an encapsulation header of the packet, and add an address of the second ne to an outer header of the packet, and a transmitter coupled to the processor and configured to transmit the packet to the second ne, wherein the packet is forwarded from the second ne to the third ne via the overlay tunnel identified by the tunnel identifier.. .
Futurewei Technologies, Inc.

Method and system for network and intra-portal link (ipl) sharing in distributed relay control protocol (drcp)

A method supporting network and intra-portal link (ipl) sharing in a link aggregation group at a network device is disclosed. The method starts with transmitting frames on the ipl at the network device, where the physical link or aggregation link of the link aggregation group is dedicated to the ipl.
Telefonaktiebolaget Lm Ericsson (publ)

Organic light emitting display apparatus

An organic light emitting display apparatus includes a substrate, a plurality of organic light emitting elements on the substrate, an encapsulation substrate covering the organic light emitting elements, and a scattering layer including a resin, and a plurality of scattering particles distributed in the resin, and including a variety of particle sizes in a first range from about 500 nm to about 800 nm, wherein ones of the scattering particles having a first particle size include a highest concentration of the scattering particles, and wherein a concentration of other ones of the scattering particles is inversely proportional to a magnitude of a difference in particle size between the other ones of the scattering particles and the ones of the scattering particles having the first particle size.. .
Samsung Display Co., Ltd.

Display apparatus, and apparatus and manufacturing the same

A display apparatus includes an emission portion disposed on a substrate and comprising an intermediate layer; and an encapsulation portion sealing the emission portion by overlapping the emission portion, wherein the intermediate layer comprises at least two organic materials, the organic materials having different phase transition temperatures at a first saturated vapor pressure in a range from 5×10−4 torr to 3×10−2 torr, and the difference between the phase transition temperatures being less than or equal to 5° c.. .
Samsung Display Co., Ltd.

Flexible oled display and manufacturing the same

A flexible oled includes: a flexible substrate; a thin film transistor (tft) array, disposed on the flexible substrate; an oled device, disposed on the tft array; a first encapsulation layer, disposed on the oled device; a second encapsulation layer, disposed under the flexible substrate; and a third encapsulation layer, laterally encapsulating a peripheral portion of the first encapsulation layer to the second encapsulation layer and forming an airtight space together with the first encapsulation layer and the second encapsulation layer to seal the flexible substrate, the tft array and the oled device in the airtight space.. .
Everdisplay Optronics (shanghai) Limited

Organic light-emitting display device

Disclosed herein is an organic light-emitting display device having a first flexible substrate; a second flexible substrate; a plurality of organic light-emitting pixels on the first flexible substrate and between the first flexible substrate and the second flexible substrate; an encapsulation unit covering the pixels; and an adhesive layer on the encapsulation unit. The young's modulus of the adhesive layer is equal to or larger than a value so that the first flexible substrate is not deformed by bending stress when it is rolled up..
Lg Display Co., Ltd.

Slim led package

Disclosed herein is a slim led package. The slim led package includes first and second lead frames separated from each other, a chip mounting recess formed on one upper surface region of the first lead frame by reducing a thickness of the one upper surface region below other upper surface regions of the first lead frame, an led chip mounted on a bottom surface of the chip mounting recess and connected with the second lead frame via a bonding wire, and a transparent encapsulation material protecting the led chip while supporting the first and second lead frames..
Seoul Semiconductor Co., Ltd.

Photodetector methods and photodetector structures

Disclosed are a method of forming a photodetector and a photodetector structure. In the method, a polycrystalline or amorphous light-absorbing layer is formed on a dielectric layer such that it is in contact with a monocrystalline semiconductor core of an optical waveguide.
Globalfoundries Inc.

Surface encapsulation for wafer bonding

Techniques are disclosed for wafer bonding with an encapsulation layer. A first semiconductor substrate is provided.
Intel Corporation

Narrow border organic light-emitting diode display

An electronic device may be provided having an organic light-emitting diode display and control circuitry for operating the display. The display may include one or more display layers interposed between the control circuitry and a display layer having thin-film transistors.
Apple Inc.

Flexible organic light emitting diode display panel

A flexible oled display panel includes: a flexible substrate; an oled device disposed on the flexible substrate; a first encapsulation layer disposed on the flexible substrate and covering the oled device; a bank layer disposed on the flexible substrate and surrounding a periphery of the first encapsulation layer, the bank layer including a plurality of noncontinuous bank units that are disposed in a chain form; and a second encapsulation layer disposed on the flexible substrate and covering the first encapsulation layer and the bank layer.. .
Everdisplay Optronics (shanghai) Limited

Semiconductor package embedded with plurality of chips and manufacturing the same

A semiconductor package may include first semiconductor chips disposed in a rotationally symmetrical structure. First bonding pads are arranged over the bottom surfaces of the first semiconductor chips.
Sk Hynix Inc.

Flat no-lead packages with electroplated edges

A lead frame sheet of flat no-lead lead frames having a semiconductor die on a die pad, terminals, and plastic encapsulation except on a back side of the sheet to provide an exposed thermal die pad, exposed side walls, and exposed back sides of the terminals. A solder wetable metal or metal alloy plating layer is on the back side and on the exposed the walls of the terminals.
Texas Instruments Incorporated

Electronic device provided with an integrated conductor element and fabrication method

An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network.
Stmicroelectronics (alps) Sas

Electronic device furnished with a conducting layer and fabrication

An electronic device includes a support board having a mounting face and an integrated circuit chip mounted on the mounting face. An encapsulation block embeds the integrated circuit chip, the encapsulation block extending above the integrated circuit chip and around the integrated circuit chip on the mounting face of the support board.
Stmicroelectronics (alps) Sas

Sensor ring

A sensor ring is provided for a magnetic measuring transducer of an abs system consisting of at least two annularly arranged functional elements. The first functional element is formed as a ferromagnetic annular disc element with a flat upper side and a flat underside with a multiplicity of openings.
Bayerische Motoren Werke Aktiengesellschaft

Card and corresponding manufacture

A card has: a substrate of id-1 format according to the iso 7810 standard; and at least one electronic component arranged on the substrate, all or part of said at least one electronic component being disposed in at least one of the two embossing regions defined in the iso 7811-1 standard as regions in which embossed characters can be formed on the substrate; an encapsulation of the unit comprising the substrate and said at least one electronic component; such that the thickness of the card at the level of said embossing regions does not exceed 1.32 mm.. .
Ingenico Group

Lipoprotein nanoplatelets: fluorescent, zwitterionic probes for molecular and cellular imaging

Compositions are provided comprising water-stable semi-conductor nanoplatelets encapsulated in a hydrophilic coating further comprising lipids and lipoproteins. Uses include biomolecular imaging and sensing, and methods of making comprise: colloidal synthesis of cdse core npls; layer-by-layer growth of a cds shell; and encapsulation of cdse/cdscore/shell npls in lipid and lipoprotein components through an evaporation-encapsulation using zwitterionic phospholipids, detergents, and amphipathic membrane scaffold proteins..
The Board Of Trustees Of The University Of Illinois

Stabilization of metallic nanowire meshes via encapsulation

Techniques for mechanically stabilizing metallic nanowire meshes using encapsulation are provided. In one aspect, a method for forming a mechanically-stabilized metallic nanowire mesh is provided which includes the steps of: forming the metallic nanowire mesh on a substrate; and coating the metallic nanowire mesh with a metal oxide that encapsulates the metallic nanowire mesh to mechanically-stabilize the metallic nanowire mesh which permits the metallic nanowire mesh to remain conductive at temperatures greater than or equal to about 600° c.
International Business Machines Corporation

Menthol cigarette

Cigarettes are provided which contain a filtering system and flavorants encapsulated with polyvinyl acetate, wherein deactivation of a sorbent by the flavorant is reduced through the encapsulation of the flavorant within the polyvinyl acetate. A preferred flavorant is menthol.
Philip Morris Usa Inc.

Method and system for efficient encryption, transmission, and decryption of video data

One embodiment provides a system for efficiently and securely encrypting, transmitting, and decrypting video data, including selective encryption of image frames. During operation, the system obtains by a content-transmitting device, an image frame which is used to form a video stream.
Alibaba Group Holding Limited

Organic light-emitting display devices and methods of manufacturing organic light-emitting display devices

An organic light-emitting display (oled) device is disclosed. In one aspect, the oled device includes a substrate including a display region and a peripheral region and a transistor disposed in the display region and including an active pattern, a gate insulation layer, a gate electrode, a source electrode, and a drain electrode.
Samsung Display Co., Ltd.

Techniques for edge management of printed layers in a flat panel display

An ink jet process is used to deposit a material layer to a desired thickness. Layout data is converted to per-cell grayscale values, each representing ink volume to be locally delivered.
Kateeva, Inc.

Reducing directional stress in an orthotropic encapsulation member of an electronic package

Methods and apparatuses for reducing directional stress in an orthotropic encapsulation member of an electronic package may include attaching a stiffening frame to a carrier, the stiffening frame comprising a central opening to accept a semiconductor chip and a plurality of opposing sidewalls, electronically coupling the semiconductor chip to the carrier concentrically arranged within the central opening, and thermally contacting a directional heat spreader to the semiconductor chip, the directional heat spreader transferring heat from the semiconductor chip, wherein the directional heat spreader is shaped to reduce a directional stress along the opposing bivector direction.. .
International Business Machines Corporation

Pressure-sensitive adhesive composition

Provided are a pressure-sensitive adhesive composition, an encapsulation film including the same, an organic electronic device including the same, and a method of manufacturing the organic electronic device. Therefore, provided is the pressure-sensitive adhesive composition, which can form a structure capable of effectively blocking moisture or water entering the organic electronic device from the outside, and have excellent processability in a process of manufacturing a panel and excellent heat retention under a high-temperature and high-humidity condition..
Lg Chem, Ltd.

Clustoidal multilamellar soy lecithin phospholipid structures for transdermal, transmucosal, or oral delivery, improved intestinal absorption, and improved bioavailability of nutrients

Clustoidal multilamellar soy lecithin phospholipid structures are provided. A process enables comprehensive and uniform encapsulation of nutritional and/or pharmaceutical ingredients in multilamellar clustoidal soy lecithin phospholipid (prodosome) capsules facilitating superior absorption of nutritionally and pharmacologically active therapeutic substances that provide benefits following absorption of the energetically enhanced electrolyte-impregnated phospholipids.

Method and system for vxlan encapsulation offload

A method for virtual extensible local area network (vxlan) encapsulation. The method includes receiving a first augmented mac frame on a first ingress port of a first network device, where the first augmented mac frame includes a first egress port id (epid), a first ingress port id (ipid), and a first mac frame.
Arista Networks, Inc.



Encapsulation topics:
  • Encapsulation
  • Integrated Circuit
  • Switched Network
  • Communications
  • Biodegradable
  • Surfactant
  • Enhancement
  • Circuit Pack
  • Epoxy Resin
  • Monovalent
  • Flowability
  • Physical Layer
  • Transmitting And Receiving
  • Photovoltaic Module
  • Organopolysiloxane


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    This listing is a sample listing of patent applications related to Encapsulation for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Encapsulation with additional patents listed. Browse our RSS directory or Search for other possible listings.


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