Encapsulation

Encapsulation-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).

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NEW Flexible display panel and display apparatus including the same
May 25, 2017 - N°20170150575

A flexible display panel and a display apparatus including the flexible display panel are disclosed. The flexible display panel includes an encapsulated panel, a first protective film on one side of the encapsulated panel, and a second protective film on another side of the encapsulated panel. The encapsulated panel includes a flexible panel and a flexible encapsulation member on the ...
NEW Flexible display panel and display apparatus including the same
May 25, 2017 - N°20170150574

A flexible display panel and a display apparatus including the flexible display panel are disclosed. The flexible display panel includes an encapsulated panel, a first protective film on one side of the encapsulated panel, and a second protective film on another side of the encapsulated panel. The encapsulated panel includes a flexible panel and a flexible encapsulation member on the ...
NEW Organic light emitting display apparatus
May 25, 2017 - N°20170149017

An apparatus includes a plurality of pixels on a substrate; a gate driver disposed outside of the plurality of pixels; a common voltage line disposed outside both of the gate driver and the plurality of pixels, the common voltage line having a first cross-sectional width; a dam structure configured to surround the plurality of pixels and disposed on at least ...
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NEW Encapsulation method of an oled and oled device
May 25, 2017 - N°20170149009

An encapsulation method of an oled and an oled device are provided, and the method includes: providing a substrate for encapsulation (401) and a cover plate (403); forming a conductive frame (402) on the substrate for encapsulation (401); cell assembling the substrate for encapsulation (401) which is provided with the frame (402) and the cover plate (403) to obtain a preforming device; placing the preforming device into ...
NEW Magnetoresistive structure having two dielectric layers, and method of manufacturing same
May 25, 2017 - N°20170148980

A magnetoresistive structure having two dielectric layers, and method of manufacturing same, includes a free magnetic layer positioned between the two dielectric layers. The method of manufacture comprises at least two etch processes and at least one encapsulation process interposed therebetween wherein the encapsulation is formed on sidewalls of the partially formed magnetoresistive stack between etch processes.
NEW Light emitting apparatus
May 25, 2017 - N°20170148958

A light emitting device includes a light emitting device on a substrate; an encapsulation layer covering the light emitting device; and a texture layer on the encapsulation layer. A surface of the texture layer has a ridge structure. A radial cross section of the ridge structure has a triangular shape with a distal vertex relative to the encapsulation layer surface. ...
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NEW Multi-chip microelectronic assembly with built-up fine-patterned circuit structure
May 25, 2017 - N°20170148764

A microelectronic assembly includes a dielectric element having bumps projecting from a first surface thereof, the bumps having end surfaces flush with a planarized encapsulation. A circuit structure having a thickness less than or equal to 10 microns, formed by depositing two or more dielectric layers and conductive layers on the respective dielectric layers, has electrically conductive features thereon which electrically ...
NEW Semiconductor chip package comprising side wall marking
May 25, 2017 - N°20170148743

The semiconductor chip package comprises a semiconductor chip, and an encapsulation body encapsulating the semiconductor chip, wherein the encapsulation body comprises a semiconductor chip; an encapsulation body encapsulating the semiconductor chip, wherein the encapsulation body comprises two opposing main faces and side faces which connect the two main faces with each other, wherein the side face have a smaller surface ...
NEW Fine pitch bva using reconstituted wafer with area array accessible for testing
May 25, 2017 - N°20170148696

A method for simultaneously making a plurality of microelectronic packages by forming an electrically conductive redistribution structure along with a plurality of microelectronic element attachment regions on a carrier. The attachment regions being spaced apart from one another and overlying the carrier. The method also including the formation of conductive connector elements between adjacent attachment regions. Each connector element having ...
NEW Damage preventing identification system for conductors and coupling points in electrical systems with data acquisition
May 25, 2017 - N°20170146586

Damage preventing identification system for electrical conductors and coupling points including at least one identification unit arranged for arrangement to a surface, end cap or cable shoe of an electrical conductor, which identification unit is provided with an encapsulation for arrangement of the identification unit to the electrical conductor, and for housing means for visual and electronic tagging, which identification ...
Fabrication of thin-film encapsulation layer for light emitting device
Kateeva, Inc.
May 18, 2017 - N°20170141357

An ink jet process is used to deposit a material layer to a desired thickness. Layout data is converted to per-cell grayscale values, each representing ink volume to be locally delivered. The grayscale values are used to generate a halftone pattern to deliver variable ink volume (and thickness) to the substrate. The halftoning provides for a relatively continuous layer (e. ...
Encapsulation of an organic optoelectronic component
Microoled
May 18, 2017 - N°20170141354

An encapsulated device comprises: an organic optoelectronic component exhibiting at least one sensitive surface protected from oxygen and/or water vapor; and a multilayer encapsulation structure covering the sensitive surface, comprising at least one layer made of organic material interposed between first and second barrier layers made of nonmetallic inorganic material impermeable to oxygen and water vapor; wherein the barrier ...
Calibration of layer thickness and ink volume in fabrication of encapsulation layer for light emitting ...
Kateeva, Inc.
May 18, 2017 - N°20170141353

An ink jet process is used to deposit a material layer to a desired thickness. Layout data is converted to per-cell grayscale values, each representing ink volume to be locally delivered. The grayscale values are used to generate a halftone pattern to deliver variable ink volume (and thickness) to the substrate. The halftoning provides for a relatively continuous layer (e. ...
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Optical device
Heptagon Micro Optics Pte. Ltd.
May 18, 2017 - N°20170141241

Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include ...
Stiffened wires for offset bva
Invensas Corporation
May 18, 2017 - N°20170141020

A component can include a generally planar element, a reinforcing dielectric layer overlying the generally planar element, an encapsulation overlying the reinforcing dielectric layer, and a plurality of wire bonds. Each wire bond can have a tip at a major surface of the encapsulation. The wire bonds can have first portions extending within the reinforcing dielectric layer. The first portions ...
Semiconductor package with integrated heatsink
Stmicroelectronics, Inc.
May 18, 2017 - N°20170141014

One or more embodiments are directed to semiconductor packages having an integrated heatsink and methods of forming same. In one embodiment, a package includes a plurality of leads that support and enclose periphery portions of the semiconductor die. The leads have first and second, opposing surfaces that form outer surfaces of the package. The first surface of the leads may ...
Fabrication of thin-film encapsulation layer for light emitting device
Kateeva, Inc.
May 18, 2017 - N°20170140999

An ink jet process is used to deposit a material layer to a desired thickness. Layout data is converted to per-cell grayscale values, each representing ink volume to be locally delivered. The grayscale values are used to generate a halftone pattern to deliver variable ink volume (and thickness) to the substrate. The halftoning provides for a relatively continuous layer (e. ...
Underlayment with thermal insulation
Environmentally Safe Products, Inc.
May 18, 2017 - N°20170138040

An underlayment that meets underlayment requirements and provides thermal insulation is disclosed. The underlayment includes a core material and an upper emittance layer having an exterior surface. An upper reinforcement layer is positioned between the upper emittance layer and the core material. A first encapsulation layer is positioned between the upper emittance layer and the upper reinforcement layer. A second ...
Encapsulation assembly and forming method thereof, and vehicle window
Saint-gobain Glass France
May 18, 2017 - N°20170136860

An encapsulation assembly and a forming method thereof, and a vehicle window are provided. The method includes: forming a trim which includes a decoration section and a connection section with a penetration structure formed therein; and forming a gasket which includes a fixing section covering the connection section of the trim, wherein a part of the fixing section is filled ...
Use of vitelline protein b as a microencapsulating additive
The Regents Of The University Of California
May 18, 2017 - N°20170135958

The present invention includes compositions and methods for the use of an encapsulation additive having between about 0. 1 to about 30 percent isolated and purified vitelline protein b to provide for mixed and extended release formulations.
Image data encapsulation with referenced description information
Canon Kabushiki Kaisha
May 11, 2017 - N°20170134756

Methods of encapsulating a bitstream include generating reference information to enable image items identifying image portions of a bit-stream to be referenced to corresponding description information. The resulting encapsulated file may also include information identifying a timed portion of the data stream corresponding to a video sequence. Description information may include spatial parameters, such as position and width and height ...