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Encapsulation

Encapsulation-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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NEW Substrate processing system and substrate processing method
Wonik Ips Co., Ltd.
January 18, 2018 - N°20180019441

A substrate processing system and substrate processing method. The substrate processing system includes: a chamber; a susceptor disposed inside the chamber and allowing a substrate to be seated thereon; a mask member disposed over the substrate; and a controller for controlling an arrangement height of the mask member with respect to the substrate. Here, an encapsulation layer covering a device ...
NEW Organic light-emitting display apparatus
Samsung Display Co., Ltd.
January 18, 2018 - N°20180019439

An organic light-emitting display apparatus includes: a substrate; a pixel electrode above the substrate; an intermediate layer above the pixel electrode and comprising an organic emission layer; an opposite electrode above the intermediate layer; and an encapsulation structure above the opposite electrode and comprising at least one inorganic film and at least one organic film. A difference between a refractive ...
NEW Display apparatus and method of manufacturing the same
Samsung Display Co., Ltd.
January 18, 2018 - N°20180019438

A display apparatus and a method of manufacturing a display apparatus, the apparatus including a substrate; a display on the substrate; and an encapsulation layer that seals the display, wherein the encapsulation layer includes a matrix including an organic material, and an inorganic material bonded to the organic material through functional groups of the organic material of the matrix, wherein ...
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NEW Package-on-package structure
Taiwan Semiconductor Manufacturing Company, Ltd.
January 18, 2018 - N°20180019151

A method comprises forming a plurality of interconnect structures including a dielectric layer, a metal line and a redistribution line over a carrier, attaching a semiconductor die on a first side of the plurality of interconnect structures, forming an underfill layer between the semiconductor die and the plurality of interconnect structures, mounting a top package on the first side the ...
NEW Encrypting system level data structures
Seagate Technology Llc
January 18, 2018 - N°20180018469

Systems and methods for encrypting system level data structures are described. In one embodiment, a storage system may include a storage drive and at least one controller for the storage drive. In some embodiments, the at least one controller may be configured to identify user data assigned to be stored on the storage drive, encrypt the user data, identify a ...
NEW Encapsulated splice chuck
January 18, 2018 - N°20180016789

An encapsulated splice chuck may include a splice chuck body and a body encapsulation positioned about an exterior surface of the splice chuck body. The encapsulated splice chuck may also include a first forcing cone threadedly coupled to the splice chuck body, the first forcing cone including a tapered inner surface. In addition, the encapsulated splice chuck may include a ...
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Encapsulation Patent Applications
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  • 581+ full patent PDF documents of Encapsulation-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
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Systems, methods and devices for direct communication
Intel Ip Corporation
January 11, 2018 - N°20180013737

Device to device (d2d) communication can be performed with packet data convergence protocol (pdcp) based encapsulation without internet protocol (ip) addressing. The non-ip d2d pdcp-encapsulated communication can further include two forms of secure data transfer. A first non-ip d2d pdcp-encapsulated communication can be a negotiated non-ip d2d pdcp-encapsulated communication. A second non-ip d2d pdcp-encapsulated communication ...
Configuration data distribution method and apparatus
Zte Corporation
January 11, 2018 - N°20180013625

The present disclosure provides a configuration data distribution method, including: determining an encapsulation manner of configuration data according to identifiers of optical network units (onus) and a preset corresponding relationship between the identifiers of the onus and the encapsulation manner of the configuration data of the onus; and encapsulating the configuration data according to the determined encapsulation manner, and distributing ...
Organic light-emitting diode display device
Samsung Display Co., Ltd.
January 11, 2018 - N°20180013100

An display device including a substrate, an organic light-emitting diode, and a thin film encapsulation layer. The organic light-emitting diode is disposed on the substrate. The thin film encapsulation layer is disposed on the organic light-emitting diode. The thin film encapsulation layer includes at least one inorganic layer, at least one organic layer, and a first refractive-index control layer. The ...
Fluorine-containing plasma polymerized hmdso for oled thin film encapsulation
Applied Materials, Inc.
January 11, 2018 - N°20180013097

Methods for forming an oled device are described. An encapsulation structure having organic buffer layer sandwiched between barrier layers is deposited over an oled structure. The buffer layer is formed with a fluorine-containing plasma. The second barrier layer is then deposited over the buffer layer. Additionally, to ensure good adhesion, a buffer adhesion layer is formed between the buffer layer ...
Display device
Samsung Display Co., Ltd.
January 11, 2018 - N°20180013094

A display device includes a substrate, an encapsulation portion on the substrate, a seal portion between the substrate and the encapsulation portion, and at least one dummy seal portion around the seal portion. The substrate and the encapsulation portion at least partially overlap each other in a first direction perpendicular to a surface of the substrate. The dummy seal portion ...
Flexible display apparatus
Samsung Display Co., Ltd.
January 11, 2018 - N°20180013092

A flexible display apparatus includes a substrate, a thin film encapsulation layer, a plurality of spacers, and at least one layer of a blocking dam in the non-display region. The substrate includes a display region having a plurality of pixels and a non-display region adjacent to the display region. The thin film encapsulation layer is over the substrate. The spacers ...
Led light system
Cooper Technologies Company
January 11, 2018 - N°20180013041

A light system includes a first substrate and a second substrate having the first substrate thereon. A light emitting diode (led) is connected to the first substrate. An encapsulation layer covers the led and at least a majority of the first substrate.
Encapsulation Patent Pack
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Encapsulation Patent Applications
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For professional research & prior art discovery
inventor
  • 581+ full patent PDF documents of Encapsulation-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Thin film cell encapsulation devices
The Regents Of The University Of California
January 11, 2018 - N°20180010089

Thin film devices, e. G., multilayer thin film devices, that encapsulate cells for transplantation into a subject are provided. Also provided are methods of using and methods of preparing the subject devices. The thin film devices include a first porous polymer layer and a second porous polymer layer that define a lumen therebetween and encapsulate a population of cells within ...
Encapsulation method
Calyxia
January 11, 2018 - N°20180008948

The present invention relates to a method for preparing solid capsules comprising a compound a, dispersed in a composition c4.
Electro-catalytic honeycomb for exhaust emissions control and manufacturing method thereof
Jm International Patent Company
January 11, 2018 - N°20180008931

An electro-catalytic honeycomb for exhaust emissions control and manufacturing method thereof firstly provides a honeycomb structural body comprising a backbone, a solid-oxide layer, a cathode layer and an inner annular layer. The backbone is provided with an anode and gas channels. The anode is provided with an outer surface and an inner surface inside the gas channels. The solid-oxide layer ...
Flexible organic light-emitting display apparatus and method of manufacturing the same
Samsung Display Co., Ltd.
January 04, 2018 - N°20180007747

In one aspect, a flexible organic light-emitting display apparatus including a substrate; a display device formed on a first surface of the substrate; a thin film encapsulation layer covering the display device; and a protection film generally surrounding the substrate, the display device, and the thin film encapsulation layer, and a method of manufacturing the flexible organic light-emitting display apparatus ...
Image data encapsulation
Canon Kabushiki Kaisha
January 04, 2018 - N°20180007407

A method of encapsulating an encoded bitstream representing one or more images, the encapsulated bitstream comprising a data part and a metadata part. The method including providing image item information identifying a portion of the data part representing a sub-image or an image of a single image; providing image description information comprising parameters including display parameters and/or transformation operators ...
Flexible display and method of forming the same
Wuhan China Star Optoelectronics Technology Co., Ltd.
January 04, 2018 - N°20180006271

The present disclosure proposes a flexible display and a method of forming the flexible display. The flexible display includes a flexible base, an oled element disposing on the flexible base, an encapsulation layer disposed on the oled element, with the flexible base and/or the encapsulation layer comprising one or more patterned inorganic layers and two or more organic layers, ...
Organic light emitting display and method of fabricating the same
Lg Display Co., Ltd.
January 04, 2018 - N°20180006265

An organic light emitting display can include a plurality of light emitting elements disposed on a substrate; an encapsulation unit disposed on the plurality of light emitting elements and including a plurality of inorganic encapsulation layers and at least one organic encapsulation layer disposed between the plurality of inorganic encapsulation layers; and a plurality of touch sensing lines and a ...
Proteins, pools, and slawx in processing environments
Oblong Industries, Inc.
January 04, 2018 - N°20180004583

Embodiments described herein include mechanisms for encapsulating data that needs to be shared between or across processes. These mechanisms include slawx (plural of “slaw”), proteins, and pools. Generally, slawx provide the lowest-level of data definition for inter-process exchange, proteins provide mid-level structure and hooks for querying and filtering, and pools provide for high-level organization and access ...
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