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Encapsulation

Encapsulation-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Digital broadcasting system and method of processing data in digital broadcasting system
Lg Electronics Inc.
November 09, 2017 - N°20170325197

A digital broadcasting system and a data processing method are disclosed. A receiver receives a broadcast signal including mobile service data and main service data. A known data detector detects known data from the broadcast signal. An equalizer performs channel equalization on the mobile service data received by means of the detected known data. An rs frame decoder acquires an ...
Network service provider architecture with internet-route-free control plane
At&t Intellectual Property I, L.p.
November 09, 2017 - N°20170324707

In a network service provider environment, the service provider infrastructure is protected by separating internet routing from the default context and placing it within a virtual private network context. Packets received from the public internet are encapsulated for transit through the service provider infrastructure based on the packet source being the public internet. Mpls vpn technology may be used in ...
Organic light-emitting diode, organic light module, and method for producing an organic light-emitting diode
Osram Oled Gmbh
November 09, 2017 - N°20170324065

An organic light-emitting diode provides a substrate having a top side and one or a plurality of substrate side surfaces running transversely to the top side and connected thereto via a substrate edge; and an organic layer sequence applied to the top side with an emitter layer, which generates electromagnetic radiation coupled out from the diode via a luminous surface ...
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Display apparatus
Samsung Display Co., Ltd.
November 09, 2017 - N°20170323936

A display apparatus includes a substrate including a display area displaying an image and a peripheral area outside the display area, a main wiring and an auxiliary wiring disposed in an identical layer in the peripheral area, the main wiring being disposed closer to the display area than the auxiliary wiring, a dam configured to cover at least a part ...
Integrated fan-out package and method of fabricating the same
Taiwan Semiconductor Manufacturing Co., Ltd.
November 09, 2017 - N°20170323853

An integrated fan-out package including an integrated circuit, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated circuit includes an active surface, a plurality of sidewalls connected to the active surface, and a plurality of pads distributed on the active surface. The insulating encapsulation encapsulates the active surface and the sidewalls of the integrated circuit. The insulating ...
Adapter panel and manufacturing method and encapsulation structure thereof and bonding method for the adapter ...
Tsinghua University
November 09, 2017 - N°20170323849

Disclosed is an adapter panel and a method of manufacturing the same comprising a panel body having a first surface and an opposing second surface, wherein a through-hole in a frustrum shape is formed through the panel body and filled by a conical electrical conductor between the first and second surface. The conical electrical conductor has a plane end flush ...
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Encapsulation Patent Applications
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  • 581+ full patent PDF documents of Encapsulation-related inventions.
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Semiconductor package with electrical test pads
Stmicroelectronics S.r.l.
November 09, 2017 - N°20170323834

One or more embodiments are directed to semiconductor packages that include conductive test pads that are electrically coupled to, but distinct from, the leads of the package. In one embodiment the test pads are located on the plastic packaging material, such as encapsulation material, of the package and are electrically coupled to the leads of the package by traces. The ...
Methods of encapsulation
Lam Research Corporation
November 09, 2017 - N°20170323803

Methods and apparatuses suitable for depositing low hydrogen content, hermetic, thin encapsulation layers at temperatures less than about 300° c. Are provided herein. Methods involve pulsing plasma while exposing a substrate to deposition reactants, and post-treating deposited encapsulation films to densify and reduce hydrogen content. Post-treatment methods include periodic exposure to inert plasma without reactants and exposure to ultraviolet radiation ...
Method to deposit conformal and low wet etch rate encapsulation layer using pecvd
Lam Research Corporation
November 09, 2017 - N°20170323785

Methods of depositing conformal, dense silicon-containing films having low hydrogen content are provided herein. Methods involve pulsing a plasma while exposing a substrate to a silicon-containing precursor and reactant to facilitate a primarily radical-based pulsed plasma enhanced chemical vapor deposition process for depositing a conformal silicon-containing film. Methods also involve periodically performing a post-treatment operation whereby, for every about 20 Ȓ...
Bioactive wound dressing and teeth coating based on morphogenetically active amorphous calcium polyphosphate
Nanotecmarin Gmbh
November 09, 2017 - N°20170319740

This invention relates to a method for sealing dentinal tubules exposed at the tooth surface as a consequence of enamel defects, based on amorphous calcium polyphosphate (ca-polyp) nano- or microparticles that strongly bind both to tooth enamel, cementum and dentin surfaces. The inventive method can also be used for the production of morphogenetically active tooth implants. A further aspect of ...
Encapsulation of an oil containing unsaturated fatty acids
Nanotecmarin Gmbh
November 09, 2017 - N°20170319503

The present invention provides microcapsules in which oil comprising unsaturated fatty acids is encapsulated, such as polyunsaturated fatty acids (pufas), the invention further relates to a process for preparing the microcapsules. The process comprises the step of adding a plasticizer to the ingredients forming an emulsion, which emulsion may be spray-dried in a subsequent step to form the microcapsules. The ...
Liquid encapsulated apparatus
Galia Textil
November 09, 2017 - N°20170318935

A method for manufacturing a liquid encapsulation apparatus includes deforming waterproof film to create a plurality of chambers therein, filling each of the plurality of chambers with liquid, sealing the plurality of chambers with a protective layer to create a plurality of capsules, cutting the plurality of capsules into a predetermined grouping, and forming the liquid encapsulation apparatus by placing ...
Systems and methods for secure communications over broadband datalinks
Galia Textil
November 02, 2017 - N°20170317975

Systems and methods for secure communications over broadband datalinks are provided. In certain implementations, a system for providing secure communications through a communication link includes a first communication unit that includes a processing unit that is configured to execute code that causes the first communication unit to verify messages with a firewall as they are received by the first communication ...
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Encapsulation Patent Applications
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inventor
  • 581+ full patent PDF documents of Encapsulation-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Display panel and electronic device
Galia Textil
November 02, 2017 - N°20170317157

A display panel and an electronic device are provided. The display panel comprises a base substrate including a display region and a border region surrounding the display region, wherein the border region includes an encapsulation region; a plurality of display units disposed in the display region; an encapsulation member disposed in the border region; a plurality of wires disposed in ...
Touch sensible organic light emitting device
Galia Textil
November 02, 2017 - N°20170317146

Embodiments of the present invention generally relate to a touch sensible organic light emitting device. The organic light emitting device according to an exemplary embodiment of the present invention comprises: a substrate; a thin film transistor disposed on the substrate; an organic light emitting element connected to the thin film transistor and receiving a data voltage; a plurality of encapsulation ...
Radiation detector core assembly
Galia Textil
November 02, 2017 - N°20170317133

The present invention is directed towards a moisture resistant radiation detector core assembly which was constructed by first assembling the photon-electron conversion layer, integrated circuit and the connection elements between and then encapsulating the whole assembly. This provides improved moisture barrier properties, since the encapsulation also covers the connection elements and does not have to be opened to apply the ...
Stackable semiconductor package and manufacturing method thereof
Galia Textil
November 02, 2017 - N°20170317041

A stackable semiconductor package and manufacturing method thereof are provided. The stackable semiconductor package includes carrier, first rdl, encapsulation layer, vertical interposers, second rdl, and chip. The carrier has first surface in which the first rdl and the encapsulation layer are formed thereon. The first rdl includes first pads and second pads. The encapsulation layer covers the first rdl and ...
Electronic sub-module including a leadframe and a semiconductor chip disposed on the leadframe
Galia Textil
November 02, 2017 - N°20170316999

An electronic sub-module includes a leadframe, a semiconductor chip disposed on the leadframe and an encapsulation material disposed on the leadframe and on the semiconductor chip. The semiconductor chip has a first contact pad on a first main face of the semiconductor chip. The sub-module also includes a first contact element on a first main face of the electronic sub-module. ...
Method for encapsulating large-area semiconductor element-mounted base material
Galia Textil
November 02, 2017 - N°20170316956

Provided is an encapsulation method not causing molding failures such as filling failures and flow marks when collectively encapsulating a large-area silicon wafer or substrate with a resin composition. Specifically, provided is a method for encapsulating a semiconductor element-mounted base material, using a curable epoxy resin composition containing: an epoxy resin (a), a curing agent (b), a pre-gelatinizing agent (c) ...
Flexible display device including touch sensor
Galia Textil
November 02, 2017 - N°20170315590

A flexible display device including a touch sensor is disclosed. In one aspect, the display device includes a flexible substrate, a light emission layer formed over the flexible substrate, and an encapsulation layer formed over the light emission layer and comprising a plurality of encapsulating thin films and a touch detecting layer configured to detect a touch input. The encapsulating ...
Self-assembled nanostructures
Galia Textil
November 02, 2017 - N°20170313747

The present disclosure is directed to the preparation of nanostructures by the encapsulation of a charged compound with individual self-assembled unit nanostructures.
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