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Encapsulation

Encapsulation-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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NEW Method and apparatus for forwarding generic routing encapsulation packets at a network address translation gateway
Cisco Technology, Inc.
July 20, 2017 - N°20170208032

In one embodiment, a method includes receiving on a private network at a network address translation (nat) gateway, a generic routing encapsulation (gre) packet comprising a client address and a gre node private internet protocol (ip) address, mapping the client address to the gre node private ip address at the nat gateway, storing the mapping at the nat gateway, replacing ...
NEW Encapsulation packet with class of service encoding
Hewlett Packard Enterprise Development Lp
July 20, 2017 - N°20170207929

In an example, a technique for integrating fibre channel over ethernet and an overlay network is described herein. A virtual extensible local area network (vxlan) tunnel endpoint (vtep) may encode class of service fields in ethernet frames and encapsulated frames based on class of service fields of inbound and/or outbound messages.
NEW Organic light emitting diode display
Samsung Display Co., Ltd.
July 20, 2017 - N°20170207423

An organic light emitting diode (oled) display includes a substrate where oleds are formed and an encapsulation member fixed onto the substrate while covering the oleds. The encapsulation member includes a photochromic material so that the encapsulation member is colored by external light.
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NEW Display device and method of manufacturing display device
Samsung Display Co., Ltd.
July 20, 2017 - N°20170207418

A display device and a method of manufacturing the display device are disclosed. In one aspect, the display device includes a substrate including a display region and a peripheral region. A first block member is in the peripheral region and surrounding display structures, the first block member having a first height. A second block member is spaced apart from the ...
NEW Encapsulation structure and encapsulation method, and oled apparatus
Hefei Boe Optoelectronics Technology Co., Ltd.
July 20, 2017 - N°20170207413

A package structure, a packaging method and an organic light-emitting diode (oled) device are provided. The package structure includes a first substrate and a second substrate which are arranged opposite to each other, and a sealant portion which is disposed between the first substrate and the second substrate, a first enclosed cavity being encircled by the first substrate, the second ...
NEW Touch sensible organic light emitting device
Samsung Display Co., Ltd.
July 20, 2017 - N°20170207280

Embodiments of the present invention generally relate to a touch sensible organic light emitting device. The organic light emitting device according to an exemplary embodiment of the present invention comprises: a substrate; a thin film transistor disposed on the substrate; an organic light emitting element connected to the thin film transistor and receiving a data voltage; a plurality of encapsulation ...
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NEW Method of manufacturing an electromagnetic radiation detector with micro-encapsulation
Commissariat A L'energie Atomique Et Aux Energies Alternatives
July 20, 2017 - N°20170207265

A method of manufacturing a detector capable of detecting a wavelength range [λ8; λ14] centered on a wavelength λ10, including: forming said device on a substrate by depositing a sacrificial layer totally embedding said device; forming, on the sacrificial layer, a cap including first, second, and third optical structures transparent in said range [Δ8; λ14], the ...
NEW Display device and manufacturing method thereof
Samsung Display Co., Ltd.
July 20, 2017 - N°20170205661

An exemplary embodiment provides a display device and a manufacturing method thereof. A display device according to the exemplary embodiment includes: a substrate; a thin film transistor disposed on the substrate; a first electrode connected to the thin film transistor; a roof layer disposed on the first electrode and spaced apart from the first electrode by interposing a microcavity therebetween; ...
NEW Thermal flow meter
Hitachi Automotive Systems, Ltd.
July 20, 2017 - N°20170205262

A thermal-type flowmeter includes a chip package. The chip package is formed through encapsulation with a resin of a sensor element, a drive circuit, a metal lead frame adapted to have mounted thereon the sensor element and the drive circuit, and a temperature detecting element. The chip package has an exposed structure in which a surface of the sensor element ...
NEW Flavor pouch
Philip Morris Usa Inc.
July 20, 2017 - N°20170203913

A flavor pouch includes a porous covering that encloses a carrier having a flavorant. The carrier may be solid or particulate. Flavorants may be one or more of tea, coffee, rose hips, honey, royal jelly, fruit extracts, mint, sweeteners, ginger, pepper extract, exotic flavors, ethnic flavors and the like. Where the carrier comprises a plurality of beads, the beads may ...
NEW Livestock display tag
Tadbik Advanced Technologies Ltd.
July 20, 2017 - N°20170202179

A livestock pasture display tag of a type used under harsh agricultural conditions, the tag comprising: (i) a thin, substantially, flat planar flexible display having a thickness, a front planar surface and a back planar surface, both surfaces are substantially parallel to a longitudinal axis positioned between surfaces; at least one of said surfaces is having a display section in ...
Flexible display device
Samsung Display Co., Ltd.
July 13, 2017 - N°20170200709

A flexible display device is disclosed. In one aspect, the display device includes a flexible display panel including a display substrate, wherein the display substrate includes an active area for pixel circuits, an inactive area adjacent to the active area and having a pad area including a plurality of pad terminals, and a thin film encapsulation layer covering the active ...
Microelectronic package debug access ports and methods of fabricating the same
Intel Corporation
July 13, 2017 - N°20170200685

A microelectronic package may be fabricated with debug access ports formed either at a side or at a bottom of the microelectronic package. In one embodiment, the debug access ports may be formed within an encapsulation material proximate the microelectronic package side. In another embodiment, the debug access ports may be formed in a microelectronic interposer of the microelectronic package ...
Encapsulation Patent Pack
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Encapsulation Patent Applications
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  • 581+ full patent PDF documents of Encapsulation-related inventions.
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Display device and manufacturing method thereof
Samsung Display Co., Ltd.
July 13, 2017 - N°20170199418

A display device according to an exemplary embodiment includes: a substrate including a display area and a peripheral area; a thin film transistor positioned in the display area of the substrate; a first electrode connected to the thin film transistor; a roof layer positioned on the first electrode and spaced apart from the first electrode by a microcavity that is ...
Encapsulation and cardiac differentiation of hipscs in 3d peg-fibrinogen hydrogels
Auburn University
July 13, 2017 - N°20170198256

The present invention relates to the production of cell cultures and tissues from undifferentiated pluripotent stem cells using three-dimensional biomimetic materials. The resultant cell cultures or tissues can be used in any of a number of protocols including testing chemicals, compounds, and drugs. Further, the methods and compositions of the present invention further provide viable cell sources and novel cell ...
Membrane transducer structures and methods of manufacturing same using thin-film encapsulation
Semiconductor Manufacturing International (shanghai) Corporation
July 13, 2017 - N°20170197822

Membrane transducer structures and thin-film encapsulation methods for manufacturing the same are provided. In one example, the thin film encapsulation methods may be implemented to co-integrate processes for thin-film encapsulation and formation of microelectronic devices and microelectromechanical systems (mems) that include the membrane transducers.
High power solar cell module
Win Win Precision Technology Co., Ltd.
July 06, 2017 - N°20170194525

A high power solar cell module including a cover plate, a back plate, a first encapsulation, a second encapsulation, a plurality of n type hetero-junction solar cells, and a plurality of reflective connection ribbons is provided. The back plate is opposite to the cover plate. The first encapsulation is located between the cover plate and the back plate. The second ...
Encapsulation method, display panel and display device
Boe Technology Group Co., Ltd.
July 06, 2017 - N°20170194380

The embodiments of the present invention provide an encapsulation method, a display panel and a display device. The encapsulation method includes: forming a first room temperature bonding layer on the encapsulation region of the array substrate, an oled device is formed on the display region of the array substrate; forming a second room temperature bonding layer on the encapsulation region ...
Method of making interlocking joint for pile encapsulation jackets
Ats Products, Inc.
July 06, 2017 - N°20170190103

Embodiments provide a method for forming a groove on a pile encapsulation jacket to form an interlocking joint on the pile encapsulation jacket. A spacer may be used to form the groove. First, a pile jacket laminate is formed on a mandrel surface. The pile jacket laminate may be partially cured to have a solid but sticky surface. The spacer ...
Enhanced cell/bead encapsulation methods and apparatuses
The Regents Of The University Of California
July 06, 2017 - N°20170189909

A microfluidic droplet system that employs flow-focusing methods to generate droplets of desired sizes for encapsulating particles, cells or beads. The microfluidic droplet system can comprise an air cavity that can be vibrated to reduce trapping of cells or beads in flow-focusing regions of the microfluidic droplet systems thereby increasing the encapsulation efficiency of the cells/beads.
Stabilizing additives for thermochromic pigments
Chromatic Technologies, Inc.
July 06, 2017 - N°20170189880

A microencapsulation process is improved by adding a stabilizing agent that contains one or more catalytic organo-metal oxide materials, such as metal soaps. This functions as a crosslinker by causing unsaturated bonds in the microcapsule walls to react, thereby stabilizing the microcapsules against the effects of additives to coatings that, otherwise, degrade the functionality of thermochromic or photochromic materials at ...
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