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Ems patents



      

This page is updated frequently with new Ems-related patent applications.




Date/App# patent app List of recent Ems-related patents
06/16/16
20160173992 
 Differential-type mems acoustic transducer patent thumbnailDifferential-type mems acoustic transducer
A mems acoustic transducer has: a detection structure, which generates an electrical detection quantity as a function of a detected acoustic signal; and an electronic interface circuit, which is operatively coupled to the detection structure and generates an electrical output quantity as a function of the electrical detection quantity. The detection structure has a first micromechanical structure of a capacitive type and a second micromechanical structure of a capacitive type, each including a membrane that faces and is capacitively coupled to a rigid electrode and defines a respective first detection capacitor and second detection capacitor; the electronic interface circuit defines an electrical connection in series of the first detection capacitor and second detection capacitor between a biasing line and a reference line, and further has a first single-output amplifier and a second single-output amplifier, which are coupled to a respective one of the first detection capacitor and the second detection capacitor and have a respective first output terminal and second output terminal, between which the electrical output quantity is present..
Stmicroelectronics S.r.l.


06/16/16
20160173743 
 Intrapersonal data communication systems patent thumbnailIntrapersonal data communication systems
Intrapersonal communication systems and methods that provide an optical digital signal link between two or more local devices are disclosed. In some embodiments, the system includes a first signal converter disposed at a first end of the optical digital signal link and configured to convert between electrical digital signals from a first local device and optical digital signals from the optical digital signal link.
N2 Imaging Systems, Llc


06/16/16
20160173533 
 Systems and methods for assessing the compliance of a computer across a network patent thumbnailSystems and methods for assessing the compliance of a computer across a network
The disclosed principles describe systems and methods for assessing the security posture of a target device, wherein the assessment is performed by a scanning computer in communication with the target device via a communication network. By employing a system or method in accordance with the disclosed principles, distinct advantages are achieved.
Qualys, Inc.


06/16/16
20160173525 
 Server drift monitoring patent thumbnailServer drift monitoring
Threat detection is improved by monitoring variations in observable events and correlating these variations to malicious activity. The disclosed techniques can be usefully employed with any attribute or other metric that can be instrumented on an endpoint and tracked over time including observable events such as changes to files, data, software configurations, operating systems, and so forth.
Sophos Limited


06/16/16
20160173510 
 Threat detection using url cache hits patent thumbnailThreat detection using url cache hits
Threat detection is improved by monitoring variations in observable events and correlating these variations to malicious activity. The disclosed techniques can be usefully employed with any attribute or other metric that can be instrumented on an endpoint and tracked over time including observable events such as changes to files, data, software configurations, operating systems, and so forth.
Sophos Limited


06/16/16
20160173509 
 Threat detection using endpoint variance patent thumbnailThreat detection using endpoint variance
Threat detection is improved by monitoring variations in observable events and correlating these variations to malicious activity. The disclosed techniques can be usefully employed with any attribute or other metric that can be instrumented on an endpoint and tracked over time including observable events such as changes to files, data, software configurations, operating systems, and so forth.
Sophos Limited


06/16/16
20160173002 
 Micro-electro-mechanical system device with enhanced structural strength patent thumbnailMicro-electro-mechanical system device with enhanced structural strength
The invention provides a mems device with enhanced structural strength. The mems device includes a plurality of metal layers, including a top metal layer with a plurality of metal segments.
Pixart Imaging Incorporation


06/16/16
20160172112 
 Dvc utilizing mems resistive switches and mim capacitors patent thumbnailDvc utilizing mems resistive switches and mim capacitors
The present invention generally relates to a mems dvc utilizing one or more mim capacitors. The mim capacitor may be disposed between the mems device and the rf pad or the mim capacitor may be integrated into the mems device itself.
Cavendish Kinetics, Inc.


06/16/16
20160171176 
 Medication management  health and health related facilities patent thumbnailMedication management health and health related facilities
A system and method for control of prescription drug packaging and dispensing machines located in an in-patient health care facility including centralized control and enhanced communication between system components. Delay and errors in processing item data in the prescription dispensing system are reduced by using concise id data incorporated into each canister memory chip and storing canister contents data elsewhere.
Cerx Pharmacy Partners, Lp


06/16/16
20160170942 
 Data processing systems, devices, and methods for content analysis patent thumbnailData processing systems, devices, and methods for content analysis
Systems, devices and methods operative for identifying a reference within a figure and an identifier in a text associated with the figure, the reference referring to an element depicted in the figure, the reference corresponding to the identifier, the identifier identifying the element in the text, placing the identifier on the figure at a distance from the reference, the identifier visually associated with the reference upon the placing, the placing of the identifier on the figure is irrespective of the distance between the identifier and the reference.. .

06/16/16
20160170722 

System and managing and using data model


Disclosed is a system and method for defining data structures for client-server system. In one embodiment, the present invention provides a compiler-enforced data model across distributed systems for providing system stability and the ability to identify and fix violations of the data model contract in a more efficient manner..
Jumbo, Inc.


06/16/16
20160169935 

Multi-axis chip-scale mems inertial measurement unit (imu) based on frequency modulation


A multi-axis microelectromechanical-systems (mems) inertial measurement unit (imu) is fabricated in a vacuum sealed single packaged device. An fm vibratory gyroscope and an fm resonant accelerometer both for generating fm output signals is fabricated in the silicon chip using mems.
The Regents Of The University Of California


06/16/16
20160169927 

Mirco-electro-mechanical system device


The invention provides an mems device. The mems device includes: a substrate, a proof mass, a spring, a spring anchor, a first electrode anchor, and a second electrode anchor, a first fixed electrode and a second fixed electrode.
Richtek Technology Corporation


06/16/16
20160169760 

Pressure sensor with differential capacitive output


A mems pressure sensor device is provided that can provide both a linear output with regard to external pressure, and a differential capacitance output so as to improve the signal amplitude level. These benefits are provided through use of a rotating proof mass that generates capacitive output from electrodes configured at both ends of the rotating proof mass.
Freescale Semiconductor, Inc.


06/16/16
20160169758 

Stress isolated differential pressure sensor


A package includes a mems die and a cap element coupled to and stacked with the mems die. The mems die includes at least two physically isolated pressure sensors, each of which resides on its individual cantilevered platform structure.
Freescale Semiconductor, Inc.


06/16/16
20160168983 

Scalable borehole acquisition system


A method that is usable with a well includes deploying microelectromechanical system (mems)-based seismic receivers in the well and using the mems-based receivers to acquire data indicative of seismic energy.. .
Schlumberger Technology Corporation


06/16/16
20160167961 

Compensation and calibration for mems devices


A sensor system includes a microelectromechanical systems (mems) sensor, processing circuitry, measurement circuitry, stimulus circuitry and memory. The system is configured to provide an output responsive to physical displacement within the mems sensor to the measurement circuitry.
Freescale Semiconductor, Inc.


06/16/16
20160167958 

Through-wafer interconnects for mems double-sided fabrication process (twids)


A high-aspect ratio low resistance through-wafer interconnect for double-sided (twids) fabrication of microelectromechanical systems (mems) serves as an interconnection method and structure for co-integration of mems and integrated circuits or other microcomponent utilizing both sides of the wafer. Twids applied to a three dimensional folded timu (timing inertial measurement unit) provides a path for electrical signals from sensors on the front side of the soi wafer to electronic components on the back side of the wafer, while enabling folding of an array of sensors in a three dimensional shape..
The Regents Of The University Of California


06/16/16
20160167956 

Integrated cmos back cavity acoustic transducer and the producing the same


A mems device includes a mems substrate with a movable element. Further included is a cmos substrate with a cavity, the mems substrate disposed on top of the cmos substrate.
Invensense, Inc.


06/16/16
20160167954 

Monolithically integrated multi-sensor device on a semiconductor substrate and method therefor


A monolithically integrated multi-sensor (mims) is disclosed. A mims integrated circuit comprises a plurality of sensors.
Versana Micro Inc.


06/16/16
20160167953 

Monolithically integrated multi-sensor device on a semiconductor substrate and method therefor


A monolithically integrated multi-sensor (mims) is disclosed. A mims integrated circuit comprises a plurality of sensors.
Versana Micro Inc.


06/16/16
20160167952 

Microelectronic packages having hermetic cavities and methods for the production thereof


Microelectronic packages having hermetic cavities are provided, as are methods for producing such packages. In one embodiment, the microelectronic package includes a sensor die having first and second microelectromechanical systems (mems) transducer structures formed thereon.

06/16/16
20160167950 

Encapsulated microelectromechanical structure


A semiconductor layer having an opening and a mems resonator formed in the opening is disposed between first and second substrates to encapsulate the mems resonator. An electrical contact that extends from the opening to an exterior of the mems device is formed at least in part within the semiconductor layer and at least in part within the first substrate..
Sitime Corporation


06/16/16
20160167949 

Method of lower profile mems package with stress isolations


Mems packages, modules, and methods of fabrication are described. In an embodiment, a mems package includes a mems die and an ic die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the ic die and the mems die on the front side of the surface mount substrate.
Apple Inc.


06/16/16
20160167948 

Vent attachment system for micro-electromechanical systems


A method of installing a vent to protect an open port of a micro-electrical mechanical system (mems) device, the vent being of the type comprising an environmental barrier membrane attached to a carrier and the vent further being attached to a liner, the method comprising the steps of: (a) feeding the vent to a die attach machine with die ejectors and at least one of a vacuum head and a gripper head; (b) detaching the vent from said liner using the die ejectors; (c) picking up the vent with at least one of the vacuum head and the gripper head of the die attach machine; (d) disposing the vent over the open port of the mems device; and (e) securing the vent over the open port of the mems device.. .
W. L. Gore & Associates, Inc.


06/16/16
20160167946 

Mems device and process


The application describes improvements to (mems) transducers (100) having a flexible membrane (301) with a membrane electrode (302), especially where the membrane is crystalline or polycrystalline and the membrane electrode is metal or a metal alloy. Such transducers may typically include a back-plate having at least one back-plate layer (304) coupled to a back-plate electrode (303), with a plurality of holes (314) in the back-plate electrode corresponding to a plurality back-plate holes (312) through the back-plate.
Cirrus Logic International Semiconductor Ltd.


06/16/16
20160167945 

Microelectromechanical systems (mems) stopper structure for stiction improvement


A microelectromechanical systems (mems) structure having a stopper integrated with a mems substrate is provided. A first substrate has a dielectric layer arranged over the first substrate.
Taiwan Semiconductor Manufacturing Co., Ltd.


06/16/16
20160167944 

Reducing mems stiction by deposition of nanoclusters


A mechanism for reducing stiction in a mems device by decreasing surface area between two surfaces that can come into close contact is provided. Reduction in contact surface area is achieved by increasing surface roughness of one or both of the surfaces.
Freescale Semiconductor, Inc.


06/16/16
20160166021 

Round cut gemstone exhibiting excellent optical brilliance


A gemstone including a substantially round girdle, a crown extending in a first direction from the girdle, and a pavilion extending in a second direction from the girdle opposite the first direction. The gemstone has 73 uniquely arranged and angled facets, 33 of which are in the crown, and 40 of which are in the pavilion.
Hasenfeld-stein, Inc.


06/16/16
20160165788 

Independent closing system with adjustable down force


A furrow closing system for an agricultural seed planter provides soil closing and soil pressing that are controlled by independent adjustable down force or pressure systems that react to a common frame element or backbone. The adjustable down force systems may be manually controlled, electronically controlled and/or part of a closed loop system.
Cnh Industrial America, Llc.


06/09/16
20160165358 

Mems microphone package


An mems microphone package includes a substrate, an mems microphone, an ic chip and an electrically conductive cover. The substrate includes a first hole, an upper surface, a bottom surface, a side surface, a first electrically conductive layer and a second electrically conductive layer.
Industrial Technology Research Institute


06/09/16
20160165357 

Dual-element mems microphone for mechanical vibration noise cancellation


Disclosed are systems, devices, and methods for minimizing mechanical-vibration-induced noise in audio signals. In one aspect, a microphone is disclosed that includes a first backplate, a first diaphragm, a second backplate, and a second diaphragm.
Google Inc.


06/09/16
20160165355 

Microelectromechanical systems electret microphone


Microelectromechanical systems (mems) electret acoustic sensors or microphones, devices, systems, and methods are described. Exemplary embodiments employ electret comprising an inorganic dielectric material such as silicon nitride in mems electret acoustic sensors or microphones.
Invensense, Inc.


06/09/16
20160165331 

Systems and apparatus having top port integrated back cavity micro electro-mechanical system microphones and methods of fabrication of the same


A micro electro-mechanical system (mems) device is provided. The mems device includes: a first substrate having a first surface and a second surface, and a port disposed through the first substrate, wherein the port is configured to receive acoustic waves and wherein the first surface is exposed to an environment outside the mems device; and a diaphragm coupled to and facing the second surface and configured to deflect in response to pressure differential at the diaphragm in response to the received acoustic waves.
Invensense, Inc.


06/09/16
20160165211 

Automotive imaging system


Various implementations include an automotive imaging system that includes at least three cameras disposed on a vehicle and an electronic control unit (ecu) in electronic communication with the cameras. The three cameras have overlapping fields of view, and a processor of the ecu may be configured for generating at least three stereoscopic images from images captured by each pair of cameras and blending these stereoscopic images into one high quality panoramic image.
Board Of Trustees Of The University Of Alabama


06/09/16
20160165042 

Systems and methods for establishing a diagnostic transmission mode and communicating over the same


Upon detection of a trigger, such as the exceeding of an error threshold or the direction of a user, a diagnostic link system enters a diagnostic information transmission mode. This diagnostic information transmission mode allows for two modems to exchange diagnostic and/or test information that may not otherwise be exchangeable during normal communication.
Tq Delta, Llc


06/09/16
20160164687 

Reverse powering system for telecommunications node


To initiate the transmission of electrical power over a telecommunications connection from a power-collecting telecommunications interface unit o such as a customer premises equipment, connectable to a power supply, to a power-receiving unit such as a curbside electrical/optical interface, when a connection is first established, or the collecting unit is first powered up, or in order to re-establish connection alter a power outage, control signals are transmitted between low-power modems in the interlace units using a low-power communications protocol. This allows the controlled initiation of a larger power output and a higher speed exchange of data once the full telecommunications connection has been established.
British Telecommunications Public Limited Company


06/09/16
20160164520 

Power management system for integrated circuits


A power management circuit for integrated circuits operating systems where the power supply may be marginal includes a supply voltage characterization circuit and a clock synthesis circuit. The supply voltage characterization circuit determines the strength of the supply voltage applied to the ic and provides information to the synthesis circuit that is used to adjust the clock frequency of the ic to insure the ic does not draw too much current and force the ic into reset.

06/09/16
20160164173 

Dual antenna tracking in leo & meo satcom


Control of dual (two) antennas, for satellite communications (satcom) with satellites in one or more constellations in low earth orbit (leo) and medium earth orbit (meo). The dual antennas are typically part of a ground-based antenna system, in particular using the satrack single pedestal with split antenna design, housed efficiently under a compact radome.
Orbit Communication Systems Ltd


06/09/16
20160164161 

Multichannel relay assembly with in line mems switches


An ohmic rf mems relay includes a substrate with a capacitive coupling, csub; two actuating elements electrically coupled in series, so as to define a channel, wherein the actuating elements are configured to be independently actuated or simultaneously operated. The actuating elements have their own capacitive coupling, cgap; a midpoint on the channel is in electrical communication with the actuating elements; and an anchor mechanically coupled to the substrate and supporting at least one of the actuating elements.
General Electric Company


06/09/16
20160163942 

Mems-based wafer level packaging for thermo-electric ir detectors


A device and techniques for fabricating the device are described for forming a wafer-level thermal sensor package using microelectromechanical system (mems) processes. In one or more implementations, a wafer level thermal sensor package includes a thermopile stack, which includes a substrate, a dielectric membrane, a first thermoelectric layer, a first interlayer dielectric, a second thermoelectric layer, a second interlayer dielectric, a metal connection assembly, a passivation layer, where the passivation layer includes at least one of a trench or a hole, and where the substrate includes a cavity adjacent to the at least one trench or hole, and a bond pad disposed on the passivation layer and electrically coupled to the metal connection assembly; and a cap wafer assembly coupled to the thermopile stack, the cap wafer assembly including a wafer having a cavity formed on a side of the wafer configured to be adjacent to the thermopile stack..
Maxim Integrated Products, Inc.


06/09/16
20160162532 

Digital content aggregation from multiple sources


Embodiments are directed to aggregating content from a plurality of sources and to applying exclusive locks to portions of content on distributed systems. In one scenario, a computer system accesses content from at least two different content sources.
Microsoft Technology Licensing, Llc


06/09/16
20160162279 

Capturing updates to applications and operating systems


An enterprise network management system is described for automatically updating program layers. A program is installed on a reference machine designated for the program and the reference machine is subsequently suspended.
Vmware, Inc.


06/09/16
20160161572 

Mems magnetic field sensor


The disclosure provides a magnetic field sensor for sensing the magnetic field caused by a current to be measured, which includes: substrate; a first drive electrode with a path for flowing a reference current supplied from the substrate arranged so as to be moveable by the magnetic field of the current to be measured; and a second drive electrode with a path for flowing a reference current supplied from the substrate arranged so as to be moveable by the magnetic field of the current to be measured, thus measuring the variation of a capacitance caused by the movement of the first drive electrode and the second drive electrode. Hence, the sensing is achieved by the two drive electrodes with no reference electrode, thus maximizing the mechanical displacement to improve the sensing capability..
Lg Innotek Co., Ltd.


06/09/16
20160159644 

Mems integrated pressure sensor devices and methods of forming same


A method embodiment includes providing a micro-electromechanical (mems) wafer including a polysilicon layer having a first and a second portion. A carrier wafer is bonded to a first surface of the mems wafer.
Taiwan Semiconductor Manufacturing Company, Ltd.


06/09/16
20160159643 

Mems integrated pressure sensor devices having isotropic cavitites and methods of forming same


A method embodiment includes providing a mems wafer comprising an oxide layer, a mems substrate, a polysilicon layer. A carrier wafer comprising a first cavity formed using isotropic etching is bonded to the mems, wherein the first cavity is aligned with an exposed first portion of the polysilicon layer.
Taiwan Semiconductor Manufacturing Company, Ltd.


06/09/16
20160159642 

Stress isolated mems device with asic as cap


A package includes a mems die and an integrated circuit (ic) die coupled to and stacked with the mems die. The mems die includes a substrate having a recess formed therein.
Freescale Semiconductor, Inc.


06/09/16
20160159641 

Environment-resistant module, micropackage and methods of manufacturing same


An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or mems device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation.
The Regents Of The University Of Michigan


06/09/16
20160159640 

Mems cavity substrate


In accordance with an example embodiment of this disclosure, a micro-electromechanical system (mems) device comprises a substrate, a cmos die, and a mems die, each of which comprises a top side and a bottom side. The bottom side of the cmos die is coupled to the top side of the substrate, and the mems die is coupled to the top side of the cmos die, and there is a cavity positioned between the cmos die and the substrate.
Invensense, Inc.


06/09/16
20160159638 

Microelectromechanical systems devices with improved reliability


An electronic device may include components that are formed using microelectromechanical systems (mems) technology. A mems device may include a mems structure bonded to a semiconductor substrate.
Apple Inc.


06/09/16
20160158059 

Mems device and delivery of therapeutic agents


Embodiments of an implantable device for delivering a therapeutic agent to a patient include a reservoir configured to contain a liquid comprising the therapeutic agent, and a cannula in fluid communication with the reservoir. The cannula is shaped to facilitate insertion thereof into a patient's eyeball..

06/02/16
20160157025 

Hinged mems diaphragm and manufacture thereof


A micromechanical structure, comprising a substrate having a through hole; a residual portion of a sacrificial oxide layer peripheral to the hole; and a polysilicon layer overlying the hole, patterned to have a planar portion; a supporting portion connecting the planar portion to polysilicon on the residual portion; polysilicon stiffeners formed extending beneath the planar portion overlying the hole; and polysilicon ribs surrounding the supporting portion, attached near a periphery of the planar portion. The polysilicon ribs extend to a depth beyond the stiffeners, and extend laterally beyond an edge of the planar portion.
The Research Foundation For The State University Of New York


06/02/16
20160157024 

Flip-chip mems microphone


A flip-chip mems microphone includes a substrate having a conduction line, a metal shell capped on the substrate to define therein a first cavity and having a sound receiving hole aimed at a sensor chip that is accommodated in the metal shell and electrically connected to a processor chip in the metal shell, and a plastic part mounted at one lateral side inside the metal shell and having built therein exposed ports that are electrically connected with the conduction line and the processor chip. Thus, the flip-chip mems microphone provides a flip-chip package structure to increase the cavity volume, improving the signal-to-noise ratio (snr)..
Lingsen Precision Industries, Ltd.


06/02/16
20160157017 

Signal processing for mems capacitive transducers


This application relates to circuitry for processing sense signals generated by mems capacitive transducers for compensating for distortion in such sense signals. The circuitry has a signal path between an input (204) for receiving the sense signal and an output (205) for outputting an output signal based on said sense signal.
Cirrus Logic International Semiconductor Limited


06/02/16
20160157011 

Microphone device and control method thereof


A microphone device includes a case having a sound hole and a phase delay membrane. A plurality of non-directional microphones disposed in the case.
Hyundai Motor Company


06/02/16
20160155722 

Vertical system integration


The vertical system integration (vsi) invention herein is a method for integration of disparate electronic, optical and mems technologies into a single integrated circuit die or component and wherein the individual device layers used in the vsi fabrication processes are preferably previously fabricated components intended for generic multiple application use and not necessarily limited in its use to a specific application. The vsi method of integration lowers the cost difference between lower volume custom electronic products and high volume generic use electronic products by eliminating or reducing circuit design, layout, tooling and fabrication costs..

06/02/16
20160155595 

Micromechanical resonant switches and charge pumps


A circuit of n micromechanical resonant switches (resoswitches) is presented, which mimics a dickson charge pump to amplify an input voltage to an output voltage of n plus 1 times the input voltage, while avoiding the diode voltage drop and breakdown voltage limitations of cmos-based conventional charge pumps. Important aspects of successful charge pumping are: 1) the long cycle lifetime of resonant micromechanical switches, which has been shown to operate 173.9×1012 cycles, is orders of magnitude higher than non-resonant switches; 2) the use of gated-sinusoid drive excitation to allow a charging period independent of resoswitch resonance frequency; and 3) the use of resonance operation to lower required drive and dc-bias voltages to below the supply voltage.
The Regents Of The University Of California


06/02/16
20160154672 

Sharing resources allocated to an entitled virtual machine


A mechanism is provided for sharing resources allocated to an entitled virtual machine (vm). A blocked domain is created around the entitled vm and one or more processors allocated to the entitled vm.
International Business Machines Corporation


06/02/16
20160154671 

Sharing resources allocated to an entitled virtual machine


A mechanism is provided for sharing resources allocated to an entitled virtual machine (vm). A blocked domain is created around the entitled vm and one or more processors allocated to the entitled vm.
International Business Machines Corporation


06/02/16
20160154234 

Enhanced closed loop, optical feedback synchronization system for imaging applications


A closed loop, optical feedback synchronization system provides real time feedback and control of a light emitting fiber when scanning or displaying an image. The light emitting fiber is driven by a mems-based actuator in an angular pattern to scan the image.

06/02/16
20160154183 

Mems optical switch


Methods, systems, and apparatus, including computer programs encoded on computer storage media, for optical switching. One of the optical switches includes a plurality of optical fibers positioned in an array, the plurality of fibers including one or more input fibers and a plurality of output fibers; a microelectromechanical (mems) mirror configured to controllably reflect light from an input fiber to a particular target output fiber of the plurality of output fibers, wherein a position of the mems mirror is controllable to switch from a first target output fiber to a second target output fiber of the plurality of output fibers according to a switch trajectory that does not traverse over any other fiber of the plurality of fibers..
Oplink Communications, Inc.


06/02/16
20160154070 

Wafer bonding use in making a mems gyroscope


A mems gyroscope is disclosed herein, wherein the mems gyroscope comprised a magnetic sensing mechanism on a magnetic sensor wafer and a magnetic source on a mems wafer that further comprises a proof-mass. The magnetic sensor wafer and mems wafer are bonded through a bonding mechanism that comprises a hearting mechanism..
Insightech, Llc


06/02/16
20160154020 

Mems gyroscope


A mems gyroscope is disclosed herein, wherein the mems gyroscope comprised a magnetic sensing mechanism and a magnetic source that is formed at the proof-mass, wherein the magnetic sensing mechanism comprises an integrated pickup coil of a fluxgate. A magnetic shield is provided in the vicinity of the magnetic source..
Insightech, Llc


06/02/16
20160154019 

Mems gyroscope


A mems gyroscope is disclosed herein, wherein the mems gyroscope comprises a movable portion capable of moving in response to angular velocity, a conducting wire attached to the movable portion for generating magnetic field, and a spintronic device for measuring the magnetic field. The conducting wire is disposed such that the current it carries is substantially perpendicular to the sensing direction of the sensing mode of the proof-mass..
Insightech, Llc


06/02/16
20160153858 

Case isolated oil filled mems pressure sensor


An oil filled pressure sensor is provided. The sensor includes a drift-stabilized pressure sensing element mounted to and electrically isolated from a header body, the pressure sensing element immersed in an oil filled cavity and temperature stabilized for sensing pressure in the cavity without substantial signal drift.

06/02/16
20160153780 

Mems gyroscope


A mems gyroscope is disclosed herein, wherein the mems gyroscope comprises a movable portion capable of moving in response to angular velocity, a conducting wire attached to the movable portion for generating magnetic field, and a spintronic device for measuring the magnetic field. The easy axis of the spintronic device is aligned to the sensing mode of the movable portion and to the direction of the current flowing through the conducting wire..
Insightech, Llc


06/02/16
20160153779 

Dual use of a ring structure as gyroscope and accelerometer


Methods and apparatus for sensing linear acceleration with a mems resonator mass, alone, or concurrently with sensing rate of rotation. A resonator mass, which may be a disk or a ring structure, is driven at a resonance frequency of one of the vibration modes of the resonator mass.
Analog Devices, Inc.


06/02/16
20160153444 

Mems fluid pump with integrated pressure sensor for dysfunction detection


The invention concerns a pumping device that includes a pump having a pumping chamber with a variable volume, an inlet that communicates with the pumping chamber and a valve, an outlet that communicates with the pumping chamber and a valve, and an actuator adapted to change the volume of the pumping chamber. A fluidic pathway in the pumping device includes the inlet, the pumping chamber, the outlet, and a downstream line situated downstream of the outlet valve.
Debiotech S.a.


06/02/16
20160152467 

Mems capping method


A method for fabricating a mems device includes providing a substrate having a front surface and a back surface, and forming a protruding engagement member on the front surface of the substrate. The protruding engagement member has an inner periphery defining a groove and an outer periphery.
Semiconductor Manufacturing International (shanghai) Corporation


06/02/16
20160152466 

Micromechanical sensor device and corresponding manufacturing method


A micromechanical sensor device includes: an asic substrate having a first front side and a first rear side; a rewiring element formed on the first front side and including multiple stacked conductor levels and insulating layers; a mems substrate having a second front side and a second rear side; a first micromechanical functional layer formed on top of the second front side; and a second micromechanical functional layer formed on top of the first micromechanical functional layer and connected to the rewiring element. In the second micromechanical functional layer, a movable sensor structure is anchored on one side via a first anchoring area, and an electrical connecting element formed in a second anchoring area is anchored on one side on the asic, and the first and second anchoring areas are elastically connected to one another via a spring element..
Robert Bosch Gmbh


06/02/16
20160152465 

Mems capacitive pressure sensors


A mems capacitive pressure sensor is provided. The mems capacitive pressure sensor includes a substrate having a first region and a second region, and a first dielectric layer formed on the substrate.
Semiconductor Manufacturing International (shanghai) Corporation


06/02/16
20160152464 

Mems parameter identification using modulated waveforms


A sensor system includes a microelectromechanical systems (mems) sensor, control circuit, signal evaluation circuitry, a digital to analog converter, signal filters, an amplifier, demodulation circuitry and memory. The system is configured to generate high and low-frequency signals, combine them, and provide the combined input signal to a mems sensor.
Freescale Semiconductor, Inc.


06/02/16
20160152202 

Mems sensor and a semiconductor package


The mems sensor of the invention has movable and fixed components for measuring acceleration in a rotational mode in a direction in-plane perpendicular to spring axis. The components include an element frame, a substrate, a proof-mass a spring connected to the proof-mass and to the substrate, and comb electrodes.
Murata Manufacturing Co., Ltd.


05/26/16
20160150327 

Photosensitive microphone


A microphone includes a base; a micro electro mechanical system (mems) device disposed on the base, the mems device configured to convert sound into a first electrical signal; an integrated circuit disposed on the base and coupled to the mems device; a photo diode disposed on the base, the photo diode configured to convert light into a second electrical signal. At least one of the first electrical signal and the second electrical signal is processed by the integrated circuit..
Knowles Electronics, Llc


05/26/16
20160150325 

Microelectromechanical systems (mems) microphone array with dedicated amplifiers


Microelectromechanical systems (mems) acoustic sensors with dedicated preamplifiers are described. Provided implementations can comprise an array of mems acoustic sensor elements each having a dedicated preamplifier.
Invensense, Inc.


05/26/16
20160150203 

A for projecting an image with improved safety


A method of projecting an image with improved safety, using a projection device which comprises a mems mirror which oscillates about one or more oscillation axes to scan light from one or more lasers, across a display screen, to project pixels which define an image onto a display screen, the method comprising the steps of, (a) selecting a laser class for the projection device; (b) calculating relationship between maximum accessible emission limit and distance, for the selected laser class, for a predetermined number of black pixels in an image; (c) repeating step (b) a plurality of times, each for a different predetermined number of black pixels in the image, so as to provide a plurality of relationships between maximum accessible emission limit and distance, for the selected laser class, wherein each relationship is for different predetermined number of black pixels in the image; (d) determining the distance between a display screen and the projection device; (e) selecting a desired maximum accessible emission limit for an image which is to be projected by the projection device onto said display screen; (f) selecting a relationship, from the plurality of relationships between maximum accessible emission limit and distance, which contains a maximum accessible emission limit which is equal to the desired maximum accessible emission limit selected in step (e), at the distance determined in step (d) and; (g) identifying the predetermined number of black pixels in the image for that selected relationship; (h) modifying a pixel stream which defines said image which is to be projected by the projection device, so that the pixel stream is provided with said predetermined number of black pixels identified in step (g). There is further provided a corresponding projection device..
Intel Corporation


05/26/16
20160147972 

Computerized data processing generating graphical user interfaces


A method for processing data to generate a graphical user interface may include receiving a set of referral requirements for a first department of a facility, wherein the set of referral requirements indicates data requested by the department for making a referral to the first department. The method may also include creating a plurality of data entry fields associated with the set of referral requirements into an electronic form, receiving a referral request directed to the first department, and providing the electronic form.
Teletracking Technologies, Inc.


05/26/16
20160147942 

System, method and computer readable medium for executing software in compliance with health data standards, quality control protocols, and device operating systems


A launcher system, method and computer readable medium are used with software and a device having an operating system. They provide an api sub-layer which communicates with the software, and an interfacing sub-layer which communicates with the device.
Fio Corporation


05/26/16
20160147145 

Photoimageable compositions containing oxetane functionality


Embodiments in accordance with the present invention encompass negative-tone, solvent developable, self-imageable polymer compositions useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays.. .
Promerus, Llc


05/26/16
20160146850 

Micromechanical sensor device and corresponding manufacturing method


A micromechanical sensor device, and a corresponding method, including an asic substrate having first front and rear sides, a first rewiring element on the first front side; a mems substrate having a second front side, and a second rear side having a base substrate and a second rewiring element formed thereon; a micromechanical functional layer having at least one movable sensor structure, and which is on the second front side of the second rewiring element; a capping element having third front and rear sides, the third rear side being applied to the second front side for capping the sensor structure; and a recess formed in the base substrate on the second rear side, or in the capping element on the third front side, and within which the asic substrate is suspended on a flexible layered first suspension element via the first rewiring element, forming a cavity surrounding the asic chip.. .
Robert Bosch Gmbh


05/26/16
20160146692 

Package for semiconductor devices sensitive to mechanical and thermo-mechanical stresses, such as mems pressure sensors


A surface mounting device has one body of semiconductor material such as an asic, and a package surrounding the body. The package has a base region carrying the body, a cap and contact terminals.
Stmicroelectronics, Inc.


05/26/16
20160146685 

Piezoresistive pressure sensor device


The voltages output from a low-pressure mems sensor are increased by increasing the sensitivity of the sensor. Sensitivity is increased by thinning the diaphragm of the low pressure sensor device.
Continental Automotive Systems, Inc.


05/26/16
20160146607 

Dynamically monitoring the instantaneous zero rotation rate voltage of interferometric fiber optic gyroscope (ifog)


The drift (°/h) for an interferometric fiber optic gyroscope (ifog) means the variations on the voltage generated versus the zero angular (rotation) rate, whilst ifog is not under influence of any angular rate effect. If the drift of an ifog is predefined, the compensation of the drift can trivially be carried out by a subtraction process.
Tubitak (turkiye Bilimsel Ve Teknolojik Arastirma Kurumu)


05/26/16
20160146606 

Mems balanced inertial angular sensor and balancing such a sensor


The invention relates to a vibrating mems inertial angular sensor including a substrate for supporting at least two mass bodies mounted to bear mobile relative to the substrate and associated with at least one electrostatic actuator and at least one electrostatic detector. The sensor includes first means for suspending the mass bodies relative to the substrate and means for coupling the mass bodies together.
Sagem Defense Securite


05/26/16
20160146522 

Methods and systems for operating hvac systems in low load conditions


A system comprising a compressor, a first valve coupled to the compressor and coupled to a first coil, a first expansion valve coupled to the first coil, a second coil, and a second expansion valve. The second expansion valve coupled to a third coil, a second valve coupled to the compressor and the third coil.
Lennox Industries Inc.


05/26/16
20160146520 

Hvac systems, devices, and methods with improved regulation of refrigerant flow


Systems, devices, and methods are presented that include an expansion valve having a pin operable to regulate a primary flow of refrigerant through a flow orifice. A flange is coupled to the pin and is configured to regulate a bleed flow of refrigerant through a bleed orifice.
Lennox Industries Inc.


05/26/16
20160146477 

Hvac reheat operation


Systems and methods are presented that enable a heating, ventilating, and air conditioning (hvac) system to store refrigerant within a reheat circuit. In one instance, the hvac system includes a valve, having a first position and a second position, configured to selectively control a flow of refrigerant into a reheat coil.
Lennox Industries Inc.


05/26/16
20160145097 

Mems switches with reduced switching voltage and methods of manufacture


Mems switches and methods of manufacturing mems switches is provided. The mems switch having at least two cantilevered electrodes having ends which overlap and which are structured and operable to contact one another upon an application of a voltage by at least one fixed electrode..
International Business Machines Corporation


05/26/16
20160145095 

Isolation structure for mems 3d ic integration


A three-dimensional (3d) integrated circuit (ic) includes a first ic and a second ic. The first ic includes a mems device and a first bonding structure.
Taiwan Semiconductor Manufacturing Co., Ltd.


05/26/16
20160145094 

Micro-elelctro-mechanical system device and fabricating the same


A method for fabricating a micro-electro-mechanical system (mems) device includes following steps. A cap layer is formed on an mems structure.
Upi Semiconductor Corp.






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