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Ems-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).

NEW Charge pump assembly
Tdk Corporation
February 15, 2018 - N°20180048965

A charge pump assembly allowing mems microphones being temperature-compensated in a large temperature range and corresponding microphones are provided. An assembly comprises a charge pump and a bias circuit electrically connected to the charge pump. A bias voltage provided by the bias circuit has a temperature dependence.
NEW Package structure of mems microphone
Goertek. Inc
February 15, 2018 - N°20180048951

The present invention discloses a package structure of a mems microphone. The package structure comprises a closed inner cavity formed by a package shell in a surrounding manner, as well as a mems chip and an asic chip which are located in the closed inner cavity, wherein a sound hole allowing sound to flow into the closed inner cavity is ...
NEW Distributed filesystem atomic flush transactions
February 15, 2018 - N°20180048733

Large scale high performance file proxy caching sites may be configured to coalesce many client write operations into one very large assemblage of modified file data. At some point the caching site will flush all modified file data downstream towards the origin file server. In some instances the amount of modified data being flushed may be more than can be ...
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NEW Acoustic resonator device with controlled placement of functionalization material
Qorvo Us, Inc.
February 15, 2018 - N°20180048280

A micro-electrical-mechanical system (mems) resonator device includes at least one functionalization material arranged over at least a central portion, but less than an entirety, of a top side electrode. For an active region exhibiting greatest sensitivity at a center point and reduced sensitivity along its periphery, omitting functionalization material over at least one peripheral portion of a resonator active region ...
NEW Motor operating systems and methods thereof
Princeton Technology Corporation
February 15, 2018 - N°20180048253

A motor operating system includes a parameter-setting module and a control circuit. The parameter-setting module generates a first parameter-setting corresponding to a first operating stage through a user interface, and determines whether a first operating status conforms to a first threshold setting. The control circuit is coupled to a motor, receives the first parameter-setting corresponding to the first operating status, ...
NEW Distributed resource electrical demand forecasting system and method
Zeco Systems, Inc.
February 15, 2018 - N°20180048150

A method is disclosed to predict demand pricing events and forecast changes in price based on data collected from a distributed network of control systems and sensors. In one embodiment, the method uses a distributed network of systems and sensors to collect and monitor data that may be used to predict and preempt electrical grid demand events including black outs ...
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NEW Sound event detection
Google Llc
February 15, 2018 - N°20180047415

A system and method for the use of sensors and processors of existing, distributed systems, operating individually or in cooperation with other systems, networks or cloud-based services to enhance the detection and classification of sound events in an environment (e. G., a home), while having low computational complexity. The system and method provides functions where the most relevant features that ...
NEW System and method for dynamically managing compute and i/o resources in data processing systems
Samsung Electronics Co., Ltd.
February 15, 2018 - N°20180046512

A method for managing compute and i/o tasks in a data processing system includes: providing a thread pool including a plurality of thread groups, each thread group including one or more threads; providing a cpu pool including a plurality of cpu groups, each cpu group including one or more cpu cores; receiving a plurality of tasks comprising i/o ...
NEW Optical scanner
Toshiba Tec Kabushiki Kaisha
February 15, 2018 - N°20180045951

An optical scanner comprises a light source and an mems mirror. The light source emits a light beam. The mems mirror has a reflecting surface for reflecting the light beam coming from the light source. The light source is configured in such a manner that the optical axis of the light beam vertically irradiates the reflecting surface of the mems ...
NEW Tri-axial mems accelerometer
Chinese Academy Of Sciences Institute Of Geology And Geophysics
February 15, 2018 - N°20180045753

A method for fabricating a tri-axial mems accelerometer that has a top cap silicon wafer and a bottom cap silicon wafer coupled with a measurement mass. The measurement mass has a two level structure, each level having an inner frame coupled to an outer frame by a plurality of first elastic beams, a mass coupled to the inner frame by ...
NEW Hybrid mems microfluidic gyroscope
The University Of Cyprus, Aglantzia, Cyprus
February 15, 2018 - N°20180045514

A hybrid mems microfluidic gyroscope is disclosed. The hybrid mems microfluidic gyroscope may include a micro-machined base enclosure having a top fluid enclosure, a fluid sensing enclosure and a bottom fluid enclosure. The hybrid mems microfluidic gyroscope may include a plurality of cantilevers disposed within the bottom semi-circular portion of the micro-machined base enclosure or a single membrane disposed within ...
NEW Encapsulated microelectromechanical structure
Sitime Corporation
February 15, 2018 - N°20180044176

A semiconductor layer having an opening and a mems resonator formed in the opening is disposed between first and second substrates to encapsulate the mems resonator. An electrical contact that extends from the opening to an exterior of the mems device is formed at least in part within the semiconductor layer and at least in part within the first substrate.
NEW Integrated structure of mems pressure sensor and mems inertia sensor
Goertek. Inc
February 15, 2018 - N°20180044174

The present invention discloses a integrated structure of an mems pressure sensor and an mems inertia sensor, comprising: an insulating layer formed on a substrate, a first lower electrode and a second lower electrode both formed on the insulating layer, further comprising a first upper electrode forming an air pressure-sensitive capacitor together with the first lower electrode, and a second ...
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NEW Wafer level package for a mems sensor device and corresponding manufacturing process
Stmicroelectronics (malta) Ltd
February 15, 2018 - N°20180044170

A mems device having a wafer-level package, is provided with: a stack of a first die and a second die, defining at least a first internal surface internal to the package and carrying at least an electrical contact pad, and at least a first external surface external to the package and defining a first outer face of the package; and ...
NEW Process for manufacturing a semiconductor device including a microelectromechanical structure and an associated integrated electronic ...
Stmicroelectronics S.r.l.
February 15, 2018 - N°20180044168

A process for manufacturing an integrated semiconductor device, envisages: forming a mems structure; forming an asic electronic circuit; and electrically coupling the mems structure to the asic electronic circuit. The mems structure and the asic electronic circuit are integrated starting from a same substrate including semiconductor material; wherein the mems structure is formed at a first surface of the substrate, ...
NEW Mems device and process
Cirrus Logic International Semiconductor Ltd.
February 15, 2018 - N°20180044167

The application describes improvements to (mems) transducers (100) having a flexible membrane (301) with a membrane electrode (302), especially where the membrane is crystalline or polycrystalline and the membrane electrode is metal or a metal alloy. Such transducers may typically include a back-plate having at least one back-plate layer (304) coupled to a back-plate electrode (303), with a plurality of holes (314) in the back-plate electrode ...
NEW Mems sensor, especially pressure sensor
Endress + Hauser Gmbh + Co. Kg
February 15, 2018 - N°20180044166

A mems sensor with improved overload resistance for metrological registering of a measured variable comprises a plurality of layers, especially silicon layers, arranged on one another. The layers include at least one inner layer, which is arranged between a first layer and a second layer, and in the inner layer there is provided extending perpendicularly to the plane of the ...
NEW Gemstone
Idd Limited
February 15, 2018 - N°20180042344

The present invention provides a gemstone comprising a girdle dividing the gemstone into a pavilion and a crown having a table surface; a tier of facets cut into the pavilion at a position immediately below the girdle; and a continuous groove. The groove facilitates mounting to a collet having a mounting rim. The continuous groove is located in the tier ...
Mems microphone assembly
Incus Laboratories Limited
February 08, 2018 - N°20180041843

A mems microphone assembly has an enclosure enclosing a volume of air. A mems microphone chip is provided within the enclosure. First and second acoustic ports are formed in the enclosure, defining first and second fluid paths between the volume of air and air outside the enclosure. The mems microphone responds to a pre-determined linear interpolative value between two independent ...
Mems microphone element and manufacturing method thereof
Goertek. Inc
February 08, 2018 - N°20180041842

The present invention discloses a mems microphone element, comprising a base, the base being provided with a first opening and a second opening which run through from top to bottom; and a first capacitor and a second capacitor disposed on the base in parallel, the first capacitor being disposed on the first opening, and the second capacitor being disposed on ...
Mems microphone with improved sensitivity
Tdk Corporation
February 08, 2018 - N°20180041841

A mems microphone with an improved sensitivity, e. G. A reduced temperature dependence of the sensitivity, is provided. The microphone comprises a mems capacitor, a charging circuit and a bias circuit. The bias circuit comprises a closed loop control circuit and creates a bias voltage with a temperature dependence.