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Duc patents



      
           
This page is updated frequently with new Duc-related patent applications. Subscribe to the Duc RSS feed to automatically get the update: related Duc RSS feeds. RSS updates for this page: Duc RSS RSS


Educational board game

Educational board game

P-type doping layers for use with light emitting devices

Manutius Ip

P-type doping layers for use with light emitting devices

P-type doping layers for use with light emitting devices

Fuji Electric

Semiconductor device manufacturing method and manufacturing device

Date/App# patent app List of recent Duc-related patents
01/22/15
20150026763
 Educating users and enforcing data dissemination policies patent thumbnailnew patent Educating users and enforcing data dissemination policies
An authoring component determines the sensitivity of an authored document and generates a user interface conveying contextual educational information about data dissemination policies that apply to the document. The user interface also provides user input mechanisms that allow the user to provide inputs affect the enforcement of a given data dissemination policy on the document..
Microsoft Corporation
01/22/15
20150026739
 Content transmission apparatus, content transmission method, content reproduction apparatus, content reproduction method, program and content delivery system patent thumbnailnew patent Content transmission apparatus, content transmission method, content reproduction apparatus, content reproduction method, program and content delivery system
Disclosed herein is a content transmission apparatus, including: a retaining section adapted to retain a multi viewpoint video content formed from a plurality of viewpoint videos imaged simultaneously by a plurality of different video cameras; a production section adapted to produce a vrt including acquisition destination information of the viewpoint videos which configure the multi viewpoint video content, vrt standing for view relation table; a supplying section adapted to supply the produced vrt to a content reproduction apparatus; a broadcasting section adapted to broadcast one or plural ones of the viewpoint videos which configure the retained multi viewpoint video content; and a delivery section adapted to deliver one or plural ones of the viewpoint videos which configure the retained multi viewpoint video content through a network.. .
Sony Corporation
01/22/15
20150026603
 Techniques to manage recordings for multimedia conference events patent thumbnailnew patent Techniques to manage recordings for multimedia conference events
Techniques to manage recordings for multimedia conference events are described. An apparatus may comprise a recording management component operative to manage recording and reproduction operations for a multimedia conference event.
Microsoft Corporation
01/22/15
20150026529
 Semiconductor device and  evaluating semiconductor device patent thumbnailnew patent Semiconductor device and evaluating semiconductor device
A semiconductor device includes a plurality of memory cell array units and a test circuit unit. The test circuit unit includes a test data generating unit configured to generate a test data piece per test cycle including a writing period and a retrieving period; an expected value register configured to output the test data piece as an expected value data piece; a memory cell driving unit configured to supply a writing driving signal during the writing period, and a retrieving driving signal during the retrieving period; a data relay switching unit configured to supply the test data piece during the writing period, and to output retrieved data piece during the retrieving period; and a determining unit configured to determine whether the retrieved data piece output from the data relay switching unit matches the expected value data piece, and to generate a test result signal indicating a determination result..
Lapis Semiconductor Co., Ltd.
01/22/15
20150026393
 Semiconductor memory device patent thumbnailnew patent Semiconductor memory device
A semiconductor memory device includes a memory array, a setting unit and a control unit. The memory array consists of non-volatile memory cells.
Winbond Electronics Corp.
01/22/15
20150026364
 Semiconductor device and memory system having the same patent thumbnailnew patent Semiconductor device and memory system having the same
A semiconductor device includes a plurality of bus lines, a plurality of bus bar lines grouped in pairs with the plurality of bus lines, respectively, and a parameter register including a plurality of parameter groups coupled to the plurality of bus lines and a plurality of bus bar lines, wherein the parameter groups store parameters for different operating modes.. .
Sk Hynix Inc.
01/22/15
20150026185
 Content classification method and content reproduction apparatus capable of performing the method patent thumbnailnew patent Content classification method and content reproduction apparatus capable of performing the method
A tag-based content classification method of classifying content based on a custom tag defined using user taste-based category information and a content reproduction apparatus to perform the method. The content classification method includes: analyzing content, and classifying the content based on whether the content comprises a first custom tag, the first custom tag and a second custom tag, the first custom tag, the second custom tag, and a tag, or the first custom tag and the tag..
Samsung Electronics Co., Ltd.
01/22/15
20150025857
 Statistical power estimation patent thumbnailnew patent Statistical power estimation
A method for predicting the power consumption of a semiconductor chip is provided. A plurality of statistical distributions characterizing a plurality of power contributing parameters for a plurality of power consuming units included in the semiconductor chip is received.
International Business Machines Corporation
01/22/15
20150025852
 Signal data processing for radiation detection patent thumbnailnew patent Signal data processing for radiation detection
To make correct determination of electric charge collection among signals from a semiconductor radiation detector, provided in an embodiment of the present invention is a signal data processing method. The method includes a step of calculating timing data sequences unique to channels (timing data calculation step s02), each of channels corresponding to each of plural electrodes of the radiation detector, from detection signal data sequences.
Riken
01/22/15
20150025845
 Surface measurement apparatus and method patent thumbnailnew patent Surface measurement apparatus and method
A stylus is deflected as a tip of the stylus follows surface variations along a measurement path on a surface of a workpiece. A transducer provides measurement data in a measurement coordinate system.
Taylor Hobson Limited
01/22/15
20150025844
new patent

Surface measurement apparatus and method


A metrological apparatus has a workpiece support surface (16) and a mover (9) to carry out a measurement by effecting relative movement in a measurement direction, x, between the workpiece support surface and a stylus (11) such that the stylus is deflected as a stylus tip of the stylus follows surface variations. A transducer (39) provides a measurement data set in a measurement coordinate system representing the deflection, a, of the stylus at measurement points in the measurement direction, x.
Taylor Hobson Limited
01/22/15
20150025772
new patent

Position indicator device


Also a position indicator device (10) comprising at least one pulse-induction affecting target (12), at least one pulse-induction coil (18), and pulse-induction indicator circuitry (22) connected to the said at least one pulse-induction coil (18) to provide a signal dependent upon the output thereof indicative of the position of the said at least one pulse-induction coil (18) relative to the said at least one pulse-induction affecting target (12). Metallic glass or amorphous metal is arranged to shield the said at least one pulse-induction affecting target (12) and/or the said at least one pulse-induction coil (18) from stray signals..
01/22/15
20150025557
new patent

Tool for surgical operation using ultrasonic waves


A tool for surgical operation using ultrasonic waves is provided. The tool includes a transducer generating ultrasonic waves, a cylindrical bar-shaped transmitting rod for transmitting the ultrasonic waves, an end effector for cutting a surgical site using the ultrasonic waves transmitted from the transmitting rod, extended from one end of the transmitting rod, in which a part of the circular cross-sectional area thereof is flatly formed from the point corresponding to a second vibration node so as to allow gain step to start at the second vibration node, a rod cover for encompassing the transmitting rod using, as connection points, a plurality of vibration nodes formed when ultrasonic waves are transmitted through the transmitting rod, and a jaw for holding the surgical site while engaged with the end effector, is combined to one end of the rod cover in a pivotable manner, and is positioned to face the end effector..
E-med Co., Ltd.
01/22/15
20150025517
new patent

Probe and treatment instrument including probe


A probe treating a living tissue in cooperation with a jaw pivoting on a supporting point includes a treatment portion including a proximal end to which ultrasonic vibration generated from an ultrasonic transducer unit is transmitted; a distal end to which the ultrasonic vibration is transmitted from the proximal end; a holding surface holding the living tissue between the holding surface and the jaw; a back surface serving as a rear surface of the holding surface; a side surface extending from the proximal end to the distal end and being different from the holding surface; and a stress release portion provided between the distal end and the proximal end and on the side surface and releasing stress to stop development of a crack when the crack is produced in the holding surface or the back surface by external forces applied during the treatment of the living tissue.. .
Olympus Medical Systems Corp.
01/22/15
20150025515
new patent

Induction coil vapor generator


An induction coil vapor generator is provided that may include any of a number of features. One feature of the vapor generator is that it can inductively generate high quality condensable vapor.
Nxthera, Inc.
01/22/15
20150025514
new patent

Selective delivery of cryogenic energy to intervertebral disc tissue and related methods of intradiscal hypothermia therapy


The present invention relates to devices and methods for altering the tissue in and around an intervertebral disc through localized hypothermia therapy to restore function of the disc and reduce pain. Hypothermia therapy is defined as the reduction of tissue temperature to below that of the equilibrium temperature.
01/22/15
20150025485
new patent

Fluid volume measurement using canister resonance for reduced pressure therapy systems


A wound fluid collection system includes a canister adapted to collect bodily fluids from a tissue site. The canister includes an acoustic transducer adapted and positioned to insonify a cavity within the canister, the cavity being defined by a wall of the canister and the bodily fluids collected within the canister.
Kci Licensing, Inc.
01/22/15
20150025422
new patent

Methods and devices for modulating cellular activity using ultrasound


The present invention comprises methods and devices for modulating the activity or activities of living cells, such as cells found in or derived from humans, animals, plants, insects, microorganisms and other organisms. Methods of the present invention comprise use of the application of ultrasound, such as low intensity, low frequency ultrasound, to living cells to affect the cells and modulate the cells' activities.
Arizona Board Of Regents For And On Behalf Of Arizona State University
01/22/15
20150025411
new patent

Vascular introducer with temperature monitoring probe and systems for endovascular temperature control


An introducer sheath/temperature probe assembly that is insertable into a blood vessel of a human or veterinary patent to measure the temperature of blood flowing through that blood vessel. The introducer sheath/temperature probe assembly may be used in conjunction with an indwelling heat exchange catheter system to warm or cool all or a portion of the patient's body to a desired target temperature and to maintain such target temperature for a desired period of time..
Zoll Circulation, Inc.
01/22/15
20150025390
new patent

Ultrasound transducer connector


A reversible transducer connector allows the connector to be inserted within the receptacle in more than one orientation. The electrical connections between the receptacle and connector are reprogrammed based on the orientation.
Siemens Medical Solutions Usa, Inc.
01/22/15
20150025389
new patent

Ultrasound system and transducer assemblies


An ultrasound system is disclosed. The ultrasound system includes an ultrasound device.
Edan Instuments, Inc.
01/22/15
20150025384
new patent

Ultrasound medical apparatus and ultrasound diagnosis apparatus


In embodiments of an ultrasound medical apparatus, main body part includes ultrasound transducer and is inserted into lumen of subject. First and second blocking parts are inserted into lumen and capable of substantially occluding lumen by changing dimensions.
Toshiba Medical Systems Corporation
01/22/15
20150025378
new patent

Ultrasound signal processing device, ultrasound signal processing method, and non-transitory computer-readable recording medium


Preceding decoders each convolve a corresponding one of a plurality of transducer elements constituting a transducer element array of an ultrasound probe with an impulse response waveform, while varying a filter coefficient corresponding to time side lobes for each transmission event. A succeeding decoder stores, in a memory, a reception beam signal that is output from a reception beam former.
Konica Minolta, Inc.
01/22/15
20150025344
new patent

Method for spectrophotometric blood oxygenation monitoring


An apparatus and method for non-invasively determining a blood oxygen parameter value of a subject's tissue is provided. An embodiment of the method includes the steps of: a) providing a spectrophotometric sensor that includes a processing portion and a transducer, b) detecting at least a portion of transmitted light after passage through the subject's tissue and producing initial signal data from the detected light; and c) using the processing portion to: (i) determine a value representative of an attenuation of at least one wavelength of light detected; (ii) determine whether the representative attenuation value is outside a predefined range of attenuation values; and (iii) determine the blood oxygen parameter value using a first interrogation or an alternate interrogation setting..
Cas Medical Systems, Inc.
01/22/15
20150025325
new patent

Insertable lighting device


The present invention relates to an insertable lighting device that includes an optical fiber assembly 40 that resides slidably within the elongated interior cavity 58 of an introducer sheath 10 that includes an incision blade 12 on the first (or forward) end 49 thereof, which can be inserted through a cavity wall 32 and into an internal cavity 97. The introducer sheath 10 is also slidably positionable over and along the optical fiber assembly 40.
01/22/15
20150025234
new patent

Ganglioside compositions


The invention provides novel gangliosides and mixtures of novel gangliosides, and drug products containing the same. The invention also provides cells induced to over-express one or more gangliosides.
Garnet Biotherapeutics, Inc.
01/22/15
20150025130
new patent

Sterol derivative, preparation method therefor and use thereof


Where r1 is —oh, ═o, h or c1-c3 alkyl; r2 is —oh, h or c1-c3 alkyl; r3 is —oh, ═o, h or c1-c3 alkyl; r4 is —oh, h or c1-c3 alkyl, and at least one of r1, r2, r3 and r4 is —oh. The compound with structural formula (i) can be used for preparing a drug having inhibitory effect on 3-hydroxy-3-methylglutaryl-coenzyme a (hmg-coa) reductase activity and the prepared drug can effectively inhibit the hmg-coa reductase activity or be used for preparing an anti-cancer drug..
01/22/15
20150025083
new patent

Procaspase combination therapy for glioblastoma


The invention provides compositions and methods for the induction of cell death, for example, cancer cell death. Combinations of compounds and related methods of use are disclosed, including the use of compounds in therapy for the treatment of cancer and selective induction of apoptosis in cells.
Vanquish Oncology, Inc.
01/22/15
20150025042
new patent

Compounds for treating proliferative disorders


Disclosed are compounds of formulae (i), (iii), (iv), (vii), (x), (xi), (xii), (xiii) and (xiv), wherein the variables are as defined in the claims, and methods of using compounds of the invention for treating a subject with a proliferative disorder, such as cancer, and methods for treating disorders responsive to hsp70 induction and/or natural killer induction. Also disclosed are pharmaceutical compositions comprising compounds of the invention and a pharmaceutically acceptable carrier..
Synta Pharmaceuticals Corp.
01/22/15
20150024989
new patent

Cleaning composition and process for cleaning semiconductor devices and/or tooling during manufacturing thereof


Cleaning solutions and processes for cleaning semiconductor devices or semiconductor tooling during manufacture thereof generally include contacting the semiconductor devices or semiconductor tooling with an acidic aqueous cleaning solution free of a fluorine containing compound, the acidic aqueous cleaning solution including at least one antioxidant and at least one non-oxidizing acid.. .
International Business Machines Corporation
01/22/15
20150024924
new patent

Zeolite coating preparation assembly and operation method


The present invention relates to a zeolite coating preparation assembly (1) and operation method wherein zeolite adsorbents are coated by crystallization process on various surfaces heated by induction. The objective of the present invention is to provide a zeolite coating preparation assembly (1) and operation method; by which time saving is achieved owing to heating by induction, material saving is achieved since large heating resistances and complicated reactors are not used; and which is thus more economical; and wherein thicker and more stable coatings with high diffusion coefficients are prepared by using a more practical reaction system in a shorter period of time in comparison to the known methods, and wherein mass production is enabled..
Inventram Fikri Mulkiyet Haklari Yonetim Ticaret Ve Yatirim Anonim Sirketi
01/22/15
20150024799
new patent

Microphone array transducer for acoustic musical instrument


A dipole microphone assembly for a nearfield sound source has a first microphone and a second microphone. The second microphone is out of phase with the first microphone so as to provide a dipole microphone assembly.
The Penn State Research Foundation
01/22/15
20150024732
new patent

Electronic device and controlling the same


According to one embodiment, an electronic device including a display configured to display video, a speech reproduction module configured to reproduce speech, a reception module configured to receive a notification of an incoming call to a connected call-capable device, and a controller configured to cause the display to display receipt of the incoming call when the reception module receives the notification of the incoming call to the call-capable device.. .
Kabushiki Kaisha Toshiba
01/22/15
20150024674
new patent

Agricultural frost protection using induction fans


A system for protecting an agricultural field from frost damage, comprising: one or more induced flow apparatuses, each comprising an induced flow fan that has a primary air flow inlet, a primary air flow outlet, a secondary flow inlet and a secondary flow outlet wherein said primary air flow induces a larger volume of secondary air flow; a primary air flow impeller, powered by a motor, and a duct arrayed to conduct the primary flow from the primary flow impeller to the induced flow fan. The induced flow apparatuses are disposed to induce the flow of warmer, upper-level, air into a lower level, displacing lower, cooler, air in an agricultural field..
01/22/15
20150024662
new patent

Flexible diaphragm post-type floating and rigid abrading workholder


Hard-material, flat-surfaced workpieces such as semiconductor wafers or sapphire disks are quickly attached with vacuum to a rotatable floating workpiece carrier. Fluid pressure in a sealed chamber applies uniform abrading pressure over the full abraded surface of the workpieces.
01/22/15
20150024609
new patent

Semiconductor reaction chamber with plasma capabilities


A processing chamber including a reaction chamber having a processing area, a processing gas inlet in communication with the processing area, a first excited species generation zone in communication with the processing gas inlet and a second exited species generation zone in communication with the processing gas inlet. A method of processing a substrate including the steps of loading a substrate within a processing area, activating a first excited species generation zone to provide a first excited species precursor to the processing area during a first pulse and, activating a second excited species generation zone to provide a second excited species precursor different from the first excited species precursor to the processing area during a second pulse..
Asm Ip Holding B.v.
01/22/15
20150024600
new patent

Systems and methods to mitigate nitride precipitates


A method of fabricating a semiconductor device is disclosed. A substrate having an oxide layer is provided.
Taiwan Semiconductor Manufacturing Co., Ltd.
01/22/15
20150024598
new patent

Method for manufacturing semiconductor device


A method for manufacturing a semiconductor device is provided. A substrate having a first area with a first poly layer and a second area with a second poly layer is provided.
United Microelectronics Corp.
01/22/15
20150024594
new patent

Cooled pin lifter paddle for semiconductor substrate processing apparatus


A semiconductor substrate processing apparatus includes a cooled pin lifter paddle for raising and lowering a semiconductor substrate. The semiconductor substrate processing apparatus comprises a processing chamber in which the semiconductor substrate is processed, a heated pedestal for supporting the semiconductor substrate in the processing chamber, and the cooled pin lifter paddle located below the pedestal.
Lam Research Corporation
01/22/15
20150024593
new patent

Semiconductor device comprising capacitive element


A semiconductor device production method includes forming a transition metal film, irradiating a surface of the transition metal film with a mono-silane gas to form a silicon-containing transition metal film, and oxidizing the silicon-containing transition metal film by an oxygen plasma treatment, thereby forming a transition metal silicate film.. .
Renesas Electronics Corporation
01/22/15
20150024587
new patent

Method of fabricating semiconductor device


A method of fabricating a semiconductor device is provided. An etch-target layer is formed on a substrate.
01/22/15
20150024586
new patent

Method for producing a monocrystalline metal/semiconductor compound


In the method for producing a monocrystalline metal-semiconductor compound on the surface of a semiconducting functional layer, initially a supply layer comprising the metal is applied to the functional layer. Thereafter, the reaction between the metal and the functional layer is triggered by way of annealing.
Forschungszentrum Juelich Gmbh
01/22/15
20150024585
new patent

Systems and methods for fabricating gate structures for semiconductor devices


A method includes forming a gate structure by growing an interfacial layer on a substrate, depositing a high k layer on the interfacial layer, depositing a tin cap on the high k layer and forming a thin barrier layer on the tin cap. The gate structure is annealed..
Globalfoundries Inc.
01/22/15
20150024584
new patent

Methods for forming integrated circuits with reduced replacement metal gate height variability


Methods for fabricating integrated circuits with reduced replacement metal gate height variability are provided. In an embodiment, a method includes providing a semiconductor substrate with a fin supported thereon and forming a conformal material layer overlying the fin and the semiconductor substrate.
Global Foundries, Inc.
01/22/15
20150024582
new patent

Method of making a gas distribution member for a plasma processing chamber


A method of making a si containing gas distribution member for a semiconductor plasma processing chamber comprises forming a carbon member into an internal cavity structure of the si containing gas distribution member. The method includes depositing si containing material on the formed carbon member such that the si containing material forms a shell around the formed carbon member.
Lam Research Corporation
01/22/15
20150024581
new patent

Method for manufacturing a semiconductor device


A method for manufacturing a semiconductor device in which an electrode structure is formed on a silicon carbide semiconductor substrate, includes forming a schottky layer including a metal selected from the group titanium, tungsten, molybdenum, and chrome on a front surface of the silicon carbide semiconductor substrate; heating the schottky layer to form a schottky electrode which has a schottky contact with the silicon carbide semiconductor substrate; and forming a surface electrode composed of aluminum or aluminum including silicon on a surface of the schottky electrode, while heating at a temperature range effective for the surface electrode to closely cover any uneven portion of the schottky electrode, and provide a surface electrode having a predetermined reflectance or less that is suitable for use in an automatic wire bonding apparatus for image recognition such as positioning.. .
Fuji Electric Co., Ltd.
01/22/15
20150024578
new patent

Methods for etching dielectric materials in the fabrication of integrated circuits


Methods for etching dielectric materials in the fabrication of integrated circuits are disclosed herein. In one exemplary embodiment, a method for fabricating an integrated circuit includes forming a layer of a first dielectric material over a gate electrode structure formed on a semiconductor substrate.
Globalfoundries, Inc.
01/22/15
20150024577
new patent

Semiconductor device and manufacturing semiconductor device


A manufacturing method of a semiconductor device in which the threshold is corrected is provided. In a semiconductor device including a plurality of transistors each includes a semiconductor, a source or drain electrode electrically connected to the semiconductor, a gate electrode, and a charge trap layer between the gate electrode and the semiconductor, electrons are trapped in the charge trap layer by performing heat treatment and, simultaneously, keeping a potential of the gate electrode higher than that of the source or drain electrode for 1 second or more.
Semiconductor Energy Laboratory Co., Ltd.
01/22/15
20150024574
new patent

Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the same


A temporary bonding adhesive composition includes a first compound including a thermosetting polyorganosiloxane and a second compound including a thermoplastic polyorganosiloxane.. .
Shin-etsu Chemical Co., Ltd.
01/22/15
20150024573
new patent

Methods of forming replacement fins for a finfet semiconductor device by performing a replacement growth process


Various methods are disclosed herein for forming alternative fin materials that are in a stable or metastable condition. In one case, a stable replacement fin is grown to a height that is greater than an unconfined stable critical thickness of the replacement fin material and it has a defect density of 104 defects/cm2 or less throughout its entire height.
Globalfoundries Inc.
01/22/15
20150024572
new patent

Process for faciltiating fin isolation schemes


Semiconductor fabrication methods are provided which include facilitating fabricating semiconductor fin structures by: providing a wafer with at least one fin extending above a substrate, the at least one fin including a first layer disposed above a second layer; mechanically stabilizing the first layer; removing at least a portion of the second layer of the fin(s) to create a void below the first layer; filling the void, at least partially, below the first layer with an isolation material to create an isolation layer within the fin(s); and proceeding with forming a fin device(s) of a first architectural type in a first fin region of the fin(s), and a fin device(s) of a second architectural type in a second fin region of the fin(s), where the first architectural type and the second architectural type are different fin device architectures.. .
Globalfoundries Inc.
01/22/15
20150024568
new patent

Spacer replacement for replacement metal gate semiconductor devices


A method comprising steps of removing a first dielectric material, including a hard mask layer and one or more spacer material layers, from a semiconductor device having a sacrificial gate whose sidewalls being covered by said spacer material layers, and a raised source and a raised drain region with both, together with said sacrificial gate, being covered by said hard mask layer, wherein the removing is selective to the sacrificial gate, raised source region and raised drain region and creates a void between each of the raised source region, raised drain region and sacrificial gate. The method includes depositing a conformal layer of a second dielectric material to the semiconductor device, wherein the second material conforms in a uniform layer to the raised source region, raised drain region and sacrificial gate, and fills the void between each of the raised source region, raised drain region and sacrificial gate..
International Business Machines Corporation
01/22/15
20150024566
new patent

Finlike structures and methods of making same


Semiconductor materials, particularly iii-v materials used to form, e.g., a finlike structure can suffer structural damage during chemical mechanical polishing steps. This damage can be reduced or eliminated by oxidizing the damaged surface of the material and then etching away the oxidized material.
Taiwan Semiconductor Manufacturing Company, Ltd.
01/22/15
20150024565
new patent

Method of forming semiconductor device having embedded strain-inducing pattern


A semiconductor device can include an active region having a fin portion providing a channel region between opposing source and drain regions. A gate electrode can cross over the channel region between the opposing source and drain regions and first and second strain inducing structures can be on opposing sides of the gate electrode and can be configured to induce strain on the channel region, where each of the first and second strain inducing structures including a respective facing side having a pair of {111} crystallographically oriented facets..
01/22/15
20150024564
new patent

Method for manufacturing semiconductor device


A method for manufacturing a semiconductor device, includes forming a first gate oxide film in each of a first region and a second region by thermally oxidizing a silicon substrate, forming a cvd oxide film on the first gate oxide film, implanting fluorine into each of the first region and the second region through the cvd oxide film and the first gate oxide film, removing the cvd oxide film from the first gate oxide film in the second region, removing the first gate oxide film from the second region, and forming a second gate oxide film in the second region by thermally oxidizing the silicon substrate.. .
Asahi Kasei Microdevices Corporation
01/22/15
20150024563
new patent

Semiconductor device, manufacturing the semiconductor device, and electronic device


The upper end of a gate electrode is situated below the surface of a semiconductor substrate. An insulating layer is formed over the gate electrode and over the semiconductor substrate situated at the periphery thereof.
Renesas Electronics Corporation
01/22/15
20150024562
new patent

Method of forming semiconductor structure


A method of forming a semiconductor structure is provided. A substrate having a cell area and a periphery area is provided.
Maxchip Electronics Corp.
01/22/15
20150024559
new patent

System and integrated circuits with cylindrical gate structures


A system and method for integrated circuits with surrounding gate structures are disclosed. The integrated circuits system includes a transistor having a gate all around cylindrical (gaac) nanowire channel with an interposed dielectric layer.
Semiconductor Manufacturing International (beijing) Corporation
01/22/15
20150024558
new patent

Asymmetrical replacement metal gate field effect transistor


An asymmetrical field effect transistor (fet) device includes a semiconductor substrate, a buried oxide layer disposed on the semiconductor substrate, an extended source region disposed on the buried oxide layer and a drain region disposed on the buried oxide layer. The asymmetrical fet device also includes a silicon on insulator region disposed between the extended source region and the drain region and a gate region disposed above the extended source region and the silicon on insulator region..
International Business Machines Corporation
01/22/15
20150024557
new patent

Semiconductor device having local buried oxide


There is set forth herein a semiconductor device fabricated on a bulk wafer having a local buried oxide region underneath a channel region of a mosfet. In one embodiment the local buried oxide region can be self-aligned to a gate, and a source/drain region can be formed in a bulk substrate.
Globalfoundries Inc.
01/22/15
20150024556
new patent

Method for manufacturing semiconductor device


A semiconductor device includes an input electrode provided on a front surface of a semiconductor substrate of a first conductivity type and an output electrode provided on a rear surface of the semiconductor substrate. The device has reduced deterioration of electrical characteristics when manufactured by a method including introducing impurities into the rear surface of the semiconductor substrate; activating the impurities using a first annealing process to form a first semiconductor layer, which is a contact portion in contact with the output electrode, in a surface layer of the rear surface; radiating protons to the rear surface; and activating the protons radiated using a second annealing process to form a second semiconductor layer of the first conductivity type, which has a higher impurity concentration than the semiconductor substrate, in a region that is deeper than the first semiconductor layer from the rear surface of the semiconductor substrate..
Fuji Electric Co., Ltd.
01/22/15
20150024555
new patent

Semiconductor device, electronic device, and semiconductor device manufacturing method


A semiconductor device, includes: a connection member including a first pad formed on a principal surface thereof; a semiconductor chip including a circuit-formed surface on which a second pad is formed, the chip mounted on the connection member so that the circuit-formed surface faces the principal surface; and a solder bump that connects the first and second pads and is made of metal containing bi and sn, wherein the bump includes a first interface-layer formed adjacent to the second pad, a second interface-layer formed adjacent to the first pad, a first intermediate region formed adjacent to either one of the interface-layers, and a second intermediate region formed adjacent to the other one of the interface-layers and formed adjacent to the first intermediate region; bi-concentration in the first intermediate region is higher than a sn-concentration; and a sn-concentration in the second intermediate region is higher than a bi-concentration.. .
Fujitsu Limited
01/22/15
20150024554
new patent

Chip to package interface


In accordance with an embodiment of the present invention, a semiconductor package includes a semiconductor chip disposed within an encapsulant, and a first coil disposed in the semiconductor chip. A dielectric layer is disposed above the encapsulant and the semiconductor chip.
Infineon Technologies Ag
01/22/15
20150024553
new patent

Power module package


An integrated power module includes a substantially planar insulated metal substrate having at least one cut-out region; at least one substantially planar ceramic substrate disposed within the cut-out region, wherein the ceramic substrate is framed on at least two sides by the insulated metal substrate, the ceramic substrate including a first metal layer on a first side and a second metal layer on a second side; at least one power semiconductor device coupled to the first side of the ceramic substrate; at least one control device coupled to a first surface of the insulated metal substrate; a power overlay electrically connecting the at least one semiconductor power device and the at least one control device; and a cooling fluid reservoir operatively connected to the second metal layer of the at least one ceramic substrate, wherein a plurality of cooling fluid passages are provided in the cooling fluid reservoir.. .
General Electric Company
01/22/15
20150024551
new patent

Semiconductor chip bonding apparatus and forming semiconductor device using the same


A method of manufacturing a semiconductor device includes: providing a first substrate that includes internal wiring, the first substrate including an array of chip mounting regions that includes a first chip mounting region; placing the first substrate on a first carrier line; providing a first semiconductor chip; placing the first semiconductor chip on a first moveable tray; vertically aligning the first chip mounting region of the first substrate with the first semiconductor chip, and performing initial bonding of the first semiconductor chip to the first chip mounting region of the first substrate; and performing subsequent bonding on the initially-bonded first semiconductor chip and first mounting region of the first substrate, thereby more strongly bonding the first semiconductor chip to the first substrate at the first mounting region. The initial bonding occurs after performing a subsequent bonding of at least one other semiconductor chip on the first substrate..
Samsung Electronics Co., Ltd.
01/22/15
20150024550
new patent

Methods for producing semiconductor devices


A method for producing a semiconductor device in accordance with various embodiments may include providing a semiconductor workpiece attached to a first carrier; dicing the semiconductor workpiece and the carrier so as to form at least one individual semiconductor chip; mounting the at least one semiconductor chip with a side facing away from the carrier, to an additional carrier.. .
Infineon Technologies Austria Ag
01/22/15
20150024546
new patent

System, structure, and manufacturing a semiconductor substrate stack


A method of manufacturing a semiconductor substrate structure for use in a semiconductor substrate stack system is presented. The method includes a semiconductor substrate which includes a front-face, a backside, a bulk layer, an interconnect layer that includes a plurality of inter-metal dielectric layers sandwiched between conductive layers, a contact layer that is between the bulk layer and the interconnect layer, and a tsv structure commencing between the bulk layer and the contact layer and terminating at the backside of the substrate.
Taiwan Semiconductor Manufacturing Company, Ltd.
01/22/15
20150024545
new patent

Stacked package structure and manufacturing a package-on-package device


A stacked package structure is provided. The stacked package structure includes a stacked package including a lower semiconductor package, an upper semiconductor package disposed on the lower semiconductor package and spaced a predetermined distance apart from the lower semiconductor package, an inter-package connecting portion electrically connecting the lower semiconductor package and the upper semiconductor package while supporting a space therebetween, and an insulation layer disposed at least outside the inter-package connecting portion and filling the space between the lower semiconductor package and the upper semiconductor package, and an electromagnetic shielding layer surrounding lateral and top surfaces of the stacked package..
Samsung Electronics Co., Ltd.
01/22/15
20150024544
new patent

Method for manufacturing semiconductor device


An object is to manufacture a semiconductor device including an oxide semiconductor film, which has stable electric characteristics and high reliability. A crystalline oxide semiconductor film is formed, without performing a plurality of steps, as follows: by utilizing a difference in atomic weight of plural kinds of atoms included in an oxide semiconductor target, zinc with low atomic weight is preferentially deposited on an oxide insulating film to form a seed crystal including zinc; and tin, indium, or the like with high atomic weight is deposited on the seed crystal while causing crystal growth.
Semiconductor Energy Laboratory Co., Ltd.
01/22/15
20150024543
new patent

Preparation of copper selenide nanoparticles


A process for producing copper selenide nanoparticles by effecting conversion of a nanoparticle precursor composition comprising copper and selenide ions to the material of the copper selenide nanoparticles in the presence of a selenol compound. Copper selenide-containing films and cigs semiconductor films produced using copper selenide as a fluxing agent are also disclosed..
Nanoco Technologies Ltd.
01/22/15
20150024542
new patent

Segmented thin film solar cells


Use of chemical mechanical polishing (cmp) and/or pure mechanical polishing to separate sub-cells in a thin film solar cell. In one embodiment the cmp is only used to separate the active, thin film layer into sub-cells, with scribing still being used to achieve sub-cell separation in conductive layers above and below the active, thin film layer.
International Business Machines Corporation
01/22/15
20150024541
new patent

Method for fabricating photovoltaic cells with plated contacts


The disclosed technology relates generally to photovoltaic cells, and more particularly to photovoltaic cells with plated metal contacts. In one aspect, a method of fabricating a photovoltaic cell with a metal contact pattern on a surface of a semiconductor substrate includes locally smoothening portions of the surface of the semiconductor substrate by using a first laser, at predetermined locations.
Katholieke Universiteit Leuven, Ku Leuven R&d
01/22/15
20150024539
new patent

Formulation of colloidal titanium-oxide solutions composition for coating and printing methods, and improvement of the output and lifespan of organic p-i-n/n-i-p photovoltaic cells


The invention also relates to a colloidal titanium-oxide nanoparticle solution containing a dispersion of titanium-oxide nanoparticles in a solvent or system of solvents, the viscosity of which is between 4 and 54 cp, said solution being particularly obtainable according to the method of the invention, as well as to the uses thereof, in particular for preparing photovoltaic cells. The invention also relates to a method for generating power using a semiconductor prepared from said solution..
01/22/15
20150024537
new patent

Ultrasonic transducer, biological sensor, and manufacturing an ultrasonic transducer


A method for manufacturing an ultrasonic transducer includes: forming a piezoelectric element by laminating a lower electrode, a piezoelectric body, and an upper electrode on a first face of a support film; affixing a reinforcing substrate that covers the piezoelectric element to the first face of the support film; forming a photosensitive resin substrate to a second face of the support film that is on an opposite side from the first face; forming an opening in the resin substrate by irradiating the resin substrate with light; and removing the reinforcing substrate.. .
Seiko Epson Corporation
01/22/15
20150024535
new patent

Semiconductor sensor device with footed lid


A semiconductor sensor device is packaged using a footed lid instead of a pre-molded lead frame. A semiconductor sensor die is attached to a first side of a lead frame.
Freescale Semiconductor, Inc.
01/22/15
20150024533
new patent

Method of forming a semiconductor device


A method of forming a semiconductor device includes depositing a light reflecting layer over a substrate. The method also includes forming a protection layer over the light reflecting layer.
Taiwan Semiconductor Manufacturing Company, Ltd.
01/22/15
20150024532
new patent

Electrically conductive polymers


An electrically conductive film suited to use as a transparent anode, a method of forming the film, and an electronic device comprising the film are disclosed. The device includes a conductive polymer electrode defining first and second surfaces and having an electrical conductivity gradient between the first and second surfaces.
01/22/15
20150024531
new patent

P-type doping layers for use with light emitting devices


A light emitting diode (led) comprises an n-type group iii-v semiconductor layer, an active layer adjacent to the n-type group iii-v semiconductor layer, and a p-type group iii-v semiconductor layer adjacent to the active layer. The active layer includes one or more v-pits.
Manutius Ip Inc.
01/22/15
20150024530
new patent

Method of manufacturing an oxide semiconductor device and manufacturing a display device having the same


Disclosed is a method of manufacturing an oxide semiconductor device, including: forming a gate electrode on a substrate; forming a gate insulating layer on the gate electrode; forming an active pattern on the gate insulating layer; forming a first mask pattern on the gate insulating layer and the active pattern; forming an insulating interlayer on the gate insulating layer, the active pattern, and the first mask pattern; forming a second mask pattern on the insulating interlayer, the second mask pattern comprising an opening that exposes a region where the first mask pattern is formed; forming contact holes exposing portions of the active pattern by patterning the insulating interlayer using the first mask pattern and the second mask pattern; and forming a source electrode and a drain electrode on the gate insulating layer by filling the contact holes, the drain electrode spaced apart from the source electrode.. .
Samsung Display Co., Ltd.
01/22/15
20150024529
new patent

Display apparatus and manufacturing the same


A display apparatus includes a base substrate, a data line to transmit a data signal, a gate line disposed on the base substrate and insulated from the data line, and a pixel electrically connected to the gate line and/or the data line via a thin film transistor. At least one of the data line and the gate line includes a lower conductive layer and an upper conductive layer.
Samsung Display Co., Ltd.
01/22/15
20150024527
new patent

Method for producing spot-size convertor


A method for producing a spot-size convertor includes the steps of preparing a substrate; forming a stacked semiconductor layer including first and second core layers on the substrate; forming a mesa structure by etching the stacked semiconductor layer using a first mask, the mesa structure including a side surface and a bottom portion of the first core layer; forming a protective mask covering the side surface; etching the bottom portion using the protective mask to form a top mesa; and forming a bottom mesa by etching the second core layer using a second mask. The top mesa includes the first core layer and a portion having a mesa width gradually reduced in a first direction of a waveguide axis.
Sumitomo Electric Industries, Ltd.
01/22/15
20150024520
new patent

Semiconductor device manufacturing method and manufacturing device


A marker which is a reference of a coordinate position defining a region of a chip that is manufactured in a semiconductor substrate is formed. A crystal defect on the semiconductor substrate is detected.
Fuji Electric Co., Ltd.
01/22/15
20150024518
new patent

Method of forming a selectively adjustable gate structure


The present disclosure relates to a method of forming a gate structure that can be selectively adjusted to reduce critical-dimension (cd) variations. In some embodiments, the method is performed by forming a gate structure having a first length over a semiconductor substrate.
Taiwan Semiconductor Manufacturing Co., Ltd.
01/22/15
20150024517
new patent

Plasma etcher chuck band


A plasma etch tool includes a wafer chuck with a chuck base and at least one functional component layer attached to the chuck base. A perimeter of the functional component layer has a polymer material permanently attached to it that extends to within 2 millimeters of a top surface of the chuck.
Texas Instruments Incorporated
01/22/15
20150024485
new patent

Puro-dhfr quadrifunctional marker and its use in protein production


This invention relates to industrial production of proteins. More specifically, the invention relates to the res-dhfr surrogate marker, which corresponds to a fusion between dhfr and a protein conferring resistance to a toxic compound or conferring a metabolic advantage.
Merck Serono Sa
01/22/15
20150024445
new patent

Method of producing chemical substance


A method of producing a chemical product by continuous fermentation includes filtering a culture liquid of a microorganism(s) through a separation membrane; retaining unfiltered liquid in, or refluxing unfiltered liquid to, the culture liquid; adding a fermentation feedstock to the culture liquid; and recovering a product in the filtrate, wherein the fermentation feedstock contains pentose and hexose, and wherein the microorganism(s) is/are a microorganism(s) having a pathway in which pentose reductase and pentol dehydrogenase are used to metabolize pentose.. .
Toray Industries, Inc.
01/22/15
20150024350
new patent

Educational board game


An educational device comprising a game board demarcated with a plurality of positions, each position having associated with it and actuator, actuation of which causes the communication device to provide instruction to the player as to what the player is supposed to do. A player can activate a random number generator to determine how many positions to move.
01/22/15
20150024304
new patent

Catalyst layer constituting body and preparing catalyst layer constituting body


A catalyst layer constituting body which prevents runoff of a proton conductive polymer from a catalyst layer even when moisture is generated by an operation of a fuel cell. In a catalyst layer constituting body of a fuel cell where catalyst particles are carried on carbon, the catalyst particles are carried by way of a carrying layer constituted of two upper and lower layers, the upper layer of the carrying layer is formed by using a polymer having proton conductivity, the upper layer forming a proton conduction layer which conducts protons generated in the catalyst particles or protons to be supplied to the catalyst particles therethrough, and the lower layer of the carrying layer is formed using a polymer having affinity with both the proton conduction layer and the carbon, the lower layer forming an adhesive layer which bonds the proton conduction layer and the carbon to each other..
Kyushu University, National University Corporation
01/22/15
20150024175
new patent

Fiberglass reinforced plastic products having increased weatherability, system and method


Climbing products containing rails decorated using veil products colored, patterned, painted or in combination with marking methods such as company names and logos and resin formulation designed to withstand exposure to uv radiation with minimal change in appearance which create specific appearances for applications, enhance weathering performance, and facilitate processing efficiency. A combination of a filler free resin or resin with filler and coated veil systems to create a synergistic weather resistance surface with self-contained color, pattern, picture, logo or combination of said same for climbing products.
Werner Co.
01/22/15
20150024065
new patent

Treatment of retroviral reservoirs exploiting oxidative stress


Activation of hiv-1 replication causes oxidative stress, which in turn potentiates hiv-1 replication. The common basis for the compounds of the present invention is: a) the capacity of reactivating hiv-1 from latency, and b) the ability to counteract the cellular machinery which activates in order to limit the effects of oxidative stress.
Istituto Superiore Di Sanita


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