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Duc patents



      
           
This page is updated frequently with new Duc-related patent applications. Subscribe to the Duc RSS feed to automatically get the update: related Duc RSS feeds. RSS updates for this page: Duc RSS RSS


Method for producing semiconductor regions including impurities

Infineon Technologies Austria Ag

Method for producing semiconductor regions including impurities

Method for producing image pickup apparatus, and method for producing semiconductor apparatus

Olympus

Method for producing image pickup apparatus, and method for producing semiconductor apparatus

Method for producing image pickup apparatus, and method for producing semiconductor apparatus

Theraclion Sa

Device for therapeutic treatment and method for controlling a treatment device

Date/App# patent app List of recent Duc-related patents
03/26/15
20150089676
 Semiconductor integrated circuit patent thumbnailnew patent Semiconductor integrated circuit
A method of a semiconductor integrated circuit comprising a logic circuit including n storage elements (n is a positive integer) which can each store 1-bit information and an attack detection circuit, the method including detecting, by an error determination circuit, through a logic operation that k-bit or less errors (k is a positive integer) have occurred in n-bit codes stored in the n storage elements, and detecting, by a light irradiation detection circuit which includes light detection elements, that light has been irradiated to (k+1) or more of the n storage elements. It is determined that the logic circuit has been attacked from outside when the error determination circuit detects an error or the light irradiation detection circuit detects light irradiation..
Renesas Electronics Corporation
03/26/15
20150089521
 Data translation for video-viewing activity patent thumbnailnew patent Data translation for video-viewing activity
A computer-implemented method of using linear, dvr, and vod video viewing activity data as input to a data translation processor which prepares that viewing activity for more efficient downstream processing by translating detailed values to aggregated values according to analyst defined translation rules in preparation for ingestion by a mapreduce framework with the result that the mapreduce framework needs to process less data in order to create analytical studies of second-by-second viewing activity for program, channel, house, device, viewer, demographic, and geographic attributes. The source data may be extracted from a database defined according to the cable television laboratories, inc.
Comcast Cable Communications, Llc
03/26/15
20150089458
 Systems and methods for mitigating print-out defects patent thumbnailnew patent Systems and methods for mitigating print-out defects
The present disclosure provides methods and systems for mitigating print-out defects that result during semiconductor simulation and/or fabrication. One of the methods disclosed herein includes steps of receiving a first desired sub-layout and a second desired sub-layout and of optimizing the first desired sub-layout and the second desired sub-layout to generate a first optimized sub-layout and a second optimized sub-layout.
Taiwan Semiconductor Manufacturing Company, Ltd.
03/26/15
20150089399
 System and methods for real-time formation of groups and decentralized decision making patent thumbnailnew patent System and methods for real-time formation of groups and decentralized decision making
Systems and methods for enabling the formation and analysis of social structures, such as groups, in real-time among a number of participants. Embodiments of the invention are also directed to systems and methods for enabling an understanding of the responses, opinions, or decisions of individual members of a group and how those may change and coalesce into one or more consensus views of a majority of the group.
Polis Technology Inc.
03/26/15
20150089390
 Information processing apparatus, information processing method, and program patent thumbnailnew patent Information processing apparatus, information processing method, and program
There is provided an information processing apparatus including an operation unit acquiring an input operation for a message composed of at least one of text and an image, a recording control unit recording the message in accordance with the acquired input operation, and a reproduction control unit reproducing the recorded message to display the message on a display unit.. .
Sony Corporation
03/26/15
20150089327
 Semiconductor memory devices and memory systems including the same patent thumbnailnew patent Semiconductor memory devices and memory systems including the same
The semiconductor memory device includes a memory cell array and an error correction code (ecc) circuit. The memory cell array is divided into a first memory region and a second memory region.
Samsung Electronics Co., Ltd.
03/26/15
20150089267
 Memory control device that control semiconductor memory, memory control method, information device equipped with memory control device, and storage medium storing memory control program patent thumbnailnew patent Memory control device that control semiconductor memory, memory control method, information device equipped with memory control device, and storage medium storing memory control program
A memory control device that is capable of making a nonvolatile memory of an information device exhibit the performance thereof certainly. A detection unit detects whether a data writable semiconductor memory is a nonvolatile memory or a volatile memory.
Canon Kabushiki Kaisha
03/26/15
20150089265
 Semiconductor integrated circuit and circuit operation method patent thumbnailnew patent Semiconductor integrated circuit and circuit operation method
The power consumption of a data sampling unit that selects a phase of a clock signal appropriate for sampling payload data is reduced at an input interface. A semiconductor integrated circuit includes an input interface and internal core circuits.
Renesas Electronics Corporation
03/26/15
20150089261
 Information processing device and semiconductor device patent thumbnailnew patent Information processing device and semiconductor device
According to an embodiment, an information processing device includes a memory device, one or more peripheral devices, a processor, and a state controller. The processor is able to change between a first state, in which a command is executed, and a second state, in which an interrupt is awaited.
Kabushiki Kaisha Toshiba
03/26/15
20150089087
 Electronic device patent thumbnailnew patent Electronic device
A semiconductor memory may include: a first stacked structure including a first word line disposed over a substrate and extended in a first direction, a first bit line disposed over the first word line and extended in a second direction crossing the first direction, and a first variable resistance layer interposed between the first word line and the first bit line; and a second stacked structure including a second bit line disposed over the first stacked structure and extended in the second direction, a second word line disposed over the second bit line and extended in the first direction, and a second variable resistance layer interposed between the second word line and the second bit line; and a first selecting element layer interposed between the first bit line and the second bit line.. .
Sk Hynix Inc.
03/26/15
20150088994
new patent

Image display apparatus, server, operating the image display apparatus, and operating the server


A method of operating an image display apparatus includes receiving image contents, performing a social network service (sns) according to the image contents, receiving a reference time set according to information corresponding to an image contents reproduction time of a plurality of image display apparatuses interworking with the sns, and displaying the image contents according to the reference time.. .
Samsung Electronics Co., Ltd.
03/26/15
20150088774
new patent

Platform for generating personalized career pathways


The disclosure provides for generating an adaptive career pathway for an individual. An apparatus is provided that includes at least one processing unit to: (a) receive data indicative of two or more of an educational level, a skill level, a personality metric, a residence location, a score in an educational course, a score in a vocational course, a job location, and a skill set selected by the individual; (b) compute an assessment vector associated with the individual based on the received data; (c) perform a gap analysis to compare the assessment vector to a database of job taxonomy vectors, wherein each job taxonomy vector comprises data indicative of deconstruction parameters associated with a specified job; and (d) classify the individual, based on the gap analysis, according to at least one of a coursework recommendation, a career pathway recommendation, and an employability score..
Viridis Learning Inc.
03/26/15
20150088715
new patent

Activity review for a financial and social management system


Embodiments of the invention comprise systems, computer program products, and methods for a financial and social management system that provides improved tracking and management related to how, where, when, and with whom a user enters into activities. The financial and social management system captures activity information and images from various sources of information, including but not limited to social networking accounts, e-receipts, location determination devices, and the like, and associates the activity information and images with the activities.
Bank Of America Corporation
03/26/15
20150088653
new patent

Marketing management system and method


A demographic-based marketing system and related method of providing services, education, and tracking results for client business owners using a web-hosted remote server accessible by client computing devices. The system requests information from the clients and accesses multiple national databases to determine relevant customer demographic information which would direct the clients how to best advertise their products to increase local foot traffic to a physical retail location..
Two West, Inc.
03/26/15
20150088605
new patent

System and identifying a marketplace status


A system for diagnosing an object that includes a preset of an object, a visual representation associated with one or more sub objects of at least part of the object, and a module to analyze the applicable visual representation. The visual representation is captured by a device and provides a specified status of the object.
03/26/15
20150088444
new patent

Monitoring synchronization of a motor using stator current measurements


Monitoring synchronization of an electric motor using current signals from power supplied to the motor is disclosed herein. The current signals may be used to calculate representative current values which may be used to calculate a rotational frequency of the rotor of the motor.
Schweitzer Engineering Laboratories, Inc.
03/26/15
20150088321
new patent

Self-learning closed-loop control valve system


A pressure independent control valve system including a pipe system defining a flow path for a volume of fluid to regulate flow downstream of the pressure independent control valve system, wherein the pipe system has a butterfly valve configured to control a flow rate of the volume of fluid; an ultrasonic sensor configured to transmit and receive a signal across the flow path; and an electronic transducer processor in data communication with the ultrasonic sensor and the butterfly valve.. .
Bray International, Inc.
03/26/15
20150088249
new patent

Heart valve delivery catheter with safety button


Valve delivery catheter assemblies including components that limit trauma to the expanded prosthetic valve and body channels as the distal tip of the catheter is withdrawn through the expanded valve and thereafter from the body. Catheter assemblies according to the present invention can include a handle assembly, an introducer sheath, and a distal tip assembly.
Medtronic, Inc.
03/26/15
20150088178
new patent

Transducer features for ultrasonic surgical instrument


An apparatus for operating on tissue includes a body, a shaft, an ultrasonic blade, and an acoustic assembly. The shaft extends distally from the body.
Ethicon Endo-surgery, Inc.
03/26/15
20150088154
new patent

Ultrasonic generator systems and methods


Embodiments shown and described herein relate, in general, to systems and methods for driving ultrasonic transducers and, more particularly, to systems and methods for controlling the output of high power ultrasonic transducers and improving performance of ultrasonic systems.. .
03/26/15
20150088072
new patent

Introducer sheath and methods of making


An introducer sheath and methods of making the introducer sheath are described. The introducer sheath may include a hub portion and a tubular portion.
Abbott Vascular Inc.
03/26/15
20150088039
new patent

Device for therapeutic treatment and controlling a treatment device


A device (1) and a method for therapeutic treatment comprising an acoustic treatment transducer (2) able to emit high intensity waves (hifu) toward a target (3) in order to treat the target. The high intensity waves have a focal point.
Theraclion Sa
03/26/15
20150087991
new patent

Application specific integrated circuit with column-row-parallel architecture for ultrasonic imaging


An ultrasonic imaging system is described in which a column-row-parallel architecture is provided at the circuit level of an ultrasonic transceiver. The ultrasonic imaging system can include a n×m array of transducer elements and a plurality of transceiver circuits where each transceiver circuit is connected to a corresponding one transducer element of the n×m array of transducer elements.
Massachusetts Institute Of Technology
03/26/15
20150087990
new patent

Semiconductor switch circuit, signal processing apparatus, and ultrasound diagnostic apparatus


A semiconductor switch circuit comprises: a first switch pair including two mosfets having gates connected one another and sources connected to one another, and a zener diode reversely connected between the gates and sources of the mosfets; a second switch pair including two mosfets having gates connected one another and sources connected to one another, and a zener diode reversely connected between the gates and sources of the mosfets; and a third switch pair comprising two mosfets having gates connected to one another and sources connected to one another. The first switch pair and the second switch pair are connected in series between two input/output terminals through a connecting node.
Hitachi Power Semiconductor Device, Ltd.
03/26/15
20150087988
new patent

Ultrasound transducer arrays


An ultrasound transducer array for an ultrasound probe is presented. The ultrasound transducer array includes a support structure.
General Electric Company
03/26/15
20150087986
new patent

Systems and methods for producing intravascular images


The invention generally relates to systems and methods for producing intravascular images. In certain embodiments, systems and methods of the invention involve causing transducers of an intravascular ultrasound device to generate a plurality of different types of data, each type of data being based on a different manner of operation of the transducers.
Volcano Corporation
03/26/15
20150087983
new patent

Echolocation data generation


Methods of probing a material under investigation using an ultrasound beam. Echolocation data is generated using a multi-dimensional transform capable of using phase and magnitude information to distinguish echoes resulting from ultrasound beam components produced using different ultrasound transducers.
Zonare Medical Systems, Inc.
03/26/15
20150087977
new patent

Monolithic ultrasonic imaging devices, systems and methods


To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate.
Butterfly Network, Inc.
03/26/15
20150087888
new patent

Method and system for displaying the electric field generated on the brain by transcranial magnetic stimulation


A visualization surface representative of a portion of the brain at a depth below the head surface of the subject is generated by combining an actual representation of the head surface with an idealized representation of the head surface. The combining is a function of the depth and is performed to minimize in the visualization surface any irregularities existing in the actual head surface of the subject.
Nexstim Oy
03/26/15
20150087874
new patent

Reactor and gasifying and/or cleaning a starting material


The invention relates to a reactor for gasifying and/or cleaning a starting material (12), especially for depolymerizing plastic material (12), wherein the reactor comprises: a reactor vessel (14) for receiving the starting material (12), especially the plastic material (12); a metal bath (26) which is arranged in the reactor vessel (14) and includes a liquid metallic material having a metal bath melting temperature (tschmelz); a plurality of filling elements (25) which are at least partially arranged in the metal bath (26); and a heater, especially an induction heater (18) for heating the starting material in the reactor vessel (14). According to the invention, a metal bath intermediate storage device (52) is provided and is connected to the reactor vessel (14) and is designed to remove at least part of the metal bath (26) from the reactor vessel (14) and to return the metal bath (26) to the reactor vessel (14), and comprises a delivery device (64) for delivering the metal bath (26), the delivery device (64) having a pressure increasing unit (60) by means of which the metal bath (26) can be delivered by applying the gas pressure (p)..
03/26/15
20150087865
new patent

Method for producing synthesis gas for methanol production


Method for producing synthesis gas for methanol production the present invention relates to a method for producing synthesis gas from a hydrocarbon containing feed, which synthesis gas is particularly suitable for subsequent use in methanol production. In this method, a feed (100) is divided into two streams, wherein one stream is subjected to catalytic partial oxidation (cpo) (2) and the other stream is subjected to steam reforming (5) followed by a water gas shift reaction (51).
Stamicarbon B.v. Acting Under The Name Of Mt Innovation Center
03/26/15
20150087861
new patent

Method for producing acrolein and/or acrylic acid from glycerol


The invention relates to the production of acrolein and/or acrylic acid from glycerol, and more particularly to a method for continuous production of a stream comprising acrolein by dehydration of glycerol, comprising cycles of reaction and regeneration of a dehydration catalyst.. .
Arkema France
03/26/15
20150087844
new patent

Ribonucleotide reductase inhibitors and methods of use


Provided herein are novel compounds that inhibit ribonucleotide reductase (rr) by binding to rrm2 and interfering with the activity of the rrm1/rrm2 holoenzyme, as well as methods of synthesizing these novel compounds. The compounds may be used to inhibit rr activity and to treat various conditions associated with rrm2 expression, such as for example certain cancer types, mitochondrial diseases, or degenerative diseases..
City Of Hope
03/26/15
20150087798
new patent

Method for continuous production of polycarbonate


(iii) at least a part of the organic solvent used in at least one of the steps (2) and (3) is purified to obtain an organic solvent having the content of each of carbon tetrachloride and chloroform of not more than 50 ppm by mass, and the organic solvent is reused as the organic solvent of at least one of the steps (2) and (3).. .
03/26/15
20150087590
new patent

Diaspirin crosslinked pegylated hemoglobin


Pegylated diaspirin-crosslinked hemoglobin conjugates having high oxygen affinity are described which have enhanced nitrite reductase activity to deliver oxygen, carbon monoxide, nitric oxide or mixtures thereof to tissues to treat various diseases and conditions.. .
Sangart, Inc.
03/26/15
20150087352
new patent

Method for determining uplink transmission power


There is provided a method for determining uplink transmission power. The method may performed by a user equipment (ue) and comprise: receiving, by the ue, a value of additional maximum power reduction (a-mpr) from a base station (bs), if the ue is configured to use for uplink transmission a frequency range of 1980 mhz through 2010 mhz or 1920 mhz through 2010 mhz and if another ue which is located in an adjacent bs and is to be protected uses for an uplink transmission a frequency range of 2010 mhz through 2025 mhz; and determining an uplink transmission power by applying the value of a-mpr..
Lg Electronics Inc.
03/26/15
20150087285
new patent

Method for reproducing music file of mobile communication terminal and mobile terminal implementing the same


Mobile communication terminals and methods are provided. A mobile communication terminal includes a transceiver, audio processing unit, speaker, connecting unit, display unit, input unit, and control unit.
Samsung Electronics Co., Ltd.
03/26/15
20150087247
new patent

Semiconductor device and wireless communication device


A semiconductor device according to the present invention includes two diodes connected in parallel between power supplies, and a resistor circuit and a capacitance element connected in parallel between one power supply and each of the two diodes, and outputs a comparison result between voltages outputted from the two resistor circuits as a reset signal.. .
03/26/15
20150087208
new patent

Apparatus and manufacturing a semiconductor wafer


In a semiconductor wafer manufacturing apparatus, a rotation module is provided to hold the semiconductor wafer at a plane. The semiconductor wafer is revolved by the rotation module around a first axis.
Taiwan Semiconductor Manufacturing Company, Ltd.
03/26/15
20150087205
new patent

Adaptive uniform polishing system


An adaptive uniform polishing system is equipped with feedback control to apply localized adjustments during a polishing operation. The adaptive uniform polishing system disclosed has particular application to the semiconductor industry.
Stmicroelectronics, Inc.
03/26/15
20150087160
new patent

Substrate processing apparatus, manufacturing semiconductor device, and recording medium


A substrate processing apparatus includes: a processing gas supply pipe configured to supply a processing gas into a processing chamber; a substrate mounting table that is installed in the processing chamber and on which a substrate to be processed is mounted; a driving unit configured to drive the substrate mounting table to move the substrate mounted on the substrate mounting table; a first plasma generating unit configured to generate plasma of the processing gas supplied into the processing chamber with a first density; and a second plasma generating unit that is installed adjacent to the first plasma generating unit in a traveling direction of the substrate and configured to generate plasma of the processing gas supplied into the processing chamber with a second density lower than the first density.. .
Hitachi Kokusai Electric Inc.
03/26/15
20150087159
new patent

Substrate processing apparatus, manufacturing semiconductor device and non-transitory computer readable recording medium


Provided is a technique of efficiently purging source gases remaining on a substrate and improving in-plane uniformity of a substrate. A method of processing a substrate includes forming a thin film on a substrate accommodated in a process chamber by (a) supplying a source gas into the process chamber, and (b) supplying an inert gas into the process chamber while alternately increasing and decreasing a flow rate of the inert gas supplied into the process chamber and exhausting the source gas and the inert gas from the process chamber..
Hitachi Kokusai Electric Inc.
03/26/15
20150087156
new patent

Etching method, and producing semiconductor substrate product and semiconductor device using the same, as well as kit for preparation of etching liquid


A method of etching a semiconductor substrate, having the steps of: preparing an etching liquid by mixing a first liquid with a second liquid to be in the range of ph from 8.5 to 14, the first liquid containing a basic compound, the second liquid containing an oxidizing agent; and then applying the etching liquid to a semiconductor substrate on a timely basis for etching a ti-containing layer in or on the semiconductor substrate.. .
Fujifilm Corporation
03/26/15
20150087150
new patent

Semiconductor structures and fabrication method thereof


A method is provided for fabricating a semiconductor structure. The method includes providing a to-be-etched layer; and forming a hard mask layer on the to-be-etched layer.
Semiconductor Manufacturing International (beijing) Corporation
03/26/15
20150087149
new patent

Methods for fabricating integrated circuits using improved masks


Methods for fabricating integrated circuits are provided. In an embodiment, a method for fabricating an integrated circuit includes forming a mask overlying a material to be etched by forming first hard mask segments overlying the material to be etched, forming sacrificial mandrels overlying the material to be etched and around each hard mask segment, forming second hard mask segments overlying the semiconductor substrate and adjacent each sacrificial mandrel, and removing the sacrificial mandrels to form first gaps surrounding each first hard mask segment, wherein each first gap is bounded by a respective first hard mask segment and an adjacent second hard mask segment.
Globalfoundries, Inc.
03/26/15
20150087147
new patent

Methods of forming through substrate interconnects


A method of forming a through substrate interconnect includes forming a via into a semiconductor substrate. The via extends into semiconductive material of the substrate.
Micron Technology, Inc.
03/26/15
20150087144
new patent

Apparatus and manufacturing metal gate semiconductor device


A method of manufacturing a semiconductor device includes providing a semiconductor substrate and forming a structure over the semiconductor substrate. The structure includes a sacrificial dielectric on the semiconductor substrate and a dummy gate over the sacrificial dielectric.
Taiwan Semiconductor Manufacturing Company Ltd.
03/26/15
20150087143
new patent

Jog design in integrated circuits


A device includes an active region in a semiconductor substrate, a gate strip over and crossing the active region, and a jog over the active region and connected to the gate strip to form a continuous region. The jog is on a side of the gate strip.
Taiwan Semiconductor Manufacturing Company, Ltd.
03/26/15
20150087140
new patent

Film forming method, film forming device, and film forming system


A film forming method according to an embodiment includes: (a) a step of supplying a first precursor gas of a semiconductor material into a processing vessel in which a processing target substrate is disposed, the first precursor gas being adsorbed onto the processing target substrate during the step; (b) a step of supplying a second precursor gas of a dopant material into the processing vessel, the second precursor gas being adsorbed onto the processing target substrate during the step; and (c) a step of generating the plasma of a reaction gas in the processing vessel, a plasma treatment being performed during the step so as to modify a layer adsorbed onto the processing target substrate.. .
Tokyo Electron Limited
03/26/15
20150087135
new patent

Method of forming a trench isolation structure using a sion layer


A moat, which is a region of a semiconductor wafer that is laterally surrounded by a trench isolation structure, is protected from damage due to dishing or low spots that result from chemical-mechanical polishing by forming a patterned hard mask structure with an upper silicon oxynitride layer, and performing the polishing with a slurry that includes ceria.. .
Texas Instruments Incorporated
03/26/15
20150087134
new patent

Semiconductor isolation region uniformity


Methods of facilitating isolation region uniformity include: patterning a semiconductor substrate to form at least one isolation opening within the semiconductor substrate, the patterning comprising leaving, at least in part, a protective hard mask above a portion of the semiconductor substrate; providing an insulating material within and over the at least one isolation opening, and planarizing the insulating material to facilitate fabricating an isolation region within the semiconductor substrate; stopping the planarizing on the protective hard mask and exposing at least a portion of the protective hard mask above the portion of the semiconductor substrate; and non-selectively removing a remaining portion of the insulating material over the at least one isolation opening and the exposed protective hard mask above the portion of the semiconductor substrate while leaving the insulating material within the at least one isolation opening and exposing upper surfaces of the semiconductor substrate, to facilitate isolation region uniformity.. .
Globalfoundries Inc.
03/26/15
20150087132
new patent

Wafer processing


Semiconductor device and method for forming a semiconductor device are presented. A substrate having top and bottom pad stacks is provided.
Globalfoundries Singapore Pte. Ltd.
03/26/15
20150087129
new patent

Method for producing semiconductor regions including impurities


A method for producing semiconductor regions including impurities includes forming a trench in a first surface of a semiconductor body. Impurity atoms are implanted into a bottom of the trench.
Infineon Technologies Austria Ag
03/26/15
20150087128
new patent

Method of manufacturing a semiconductor device that includes a misfet


An insulating film and another insulating film are formed over a semiconductor substrate in that order to cover first, second, and third gate electrodes. The another insulating film is etched back to form sidewall spacers over side surfaces of the insulating film.
Renesas Electronics Corporation
03/26/15
20150087126
new patent

Method of fabrication transistor with non-uniform stress layer with stress concentrated regions


A method of fabrication a transistor device with a non-uniform stress layer including the following processes. First, a semiconductor substrate having a first transistor region is provided.
United Microelectronics Corp.
03/26/15
20150087125
new patent

Method of manufacturing semiconductor device


A method of manufacturing a semiconductor device of an embodiment includes: preparing a substrate; and growing a p-type sic single-crystal layer on the surface of the substrate from a liquid phase that contains si (silicon), c (carbon), a p-type impurity, and an n-type impurity, the p-type impurity being an element a, the n-type impurity being an element d, the element a and the element d forming a first combination that is at least one combination selected from al (aluminum) and n (nitrogen), ga (gallium) and n (nitrogen), and in (indium) and n (nitrogen), and/or a second combination of b (boron) and p (phosphorus), the ratio of the concentration of the element d to the concentration of the element a in the first or second combination being higher than 0.33 but lower than 1.0.. .
Kabushiki Kaisha Toshiba
03/26/15
20150087124
new patent

Semiconductor device and manufacturing the same


According to one embodiment, a semiconductor device includes a first, a second, a third, a fourth semiconductor region, a control electrode, and an insulating film. The first region contains silicon carbide.
Kabushiki Kaisha Toshiba
03/26/15
20150087122
new patent

Manufacturing semiconductor device


Provided is a semiconductor device that can be manufactured at low cost and that can reduce a reverse leak current, and a manufacturing method thereof. A semiconductor device has: a source region and a drain region having a body region therebetween; a source trench that reaches the body region, penetrating the source region; a body contact region formed at the bottom of the source trench; a source electrode embedded in the source trench; and a gate electrode that faces the body region.
Rohm Co., Ltd.
03/26/15
20150087121
new patent

Cmos structures and methods for improving yield


A simple, effective and economical method to improved the yield of cmos devices using contact etching stopper liner, including, single neutral stressed liner, single stressed liner and dual stress liner (dsl), technology is provided. In order to improve the chip yield, the present invention provides a method in which a sputter etching process is employed to smooth/flatten (i.e., thin) the top surface of the contact etch stopper liners.
International Business Machines Corporation
03/26/15
20150087120
new patent

Raised source/drain and gate portion with dielectric spacer or air gap spacer


A semiconductor structure and method of manufacturing the same are provided. The semiconductor device includes epitaxial raised source/drain (rsd) regions formed on the surface of a semiconductor substrate through selective epitaxial growth.
International Business Machines Corporation
03/26/15
20150087119
new patent

Compound semiconductor device, manufacturing the same, power supply device and high-frequency amplifier


A compound semiconductor device includes a substrate having an opening formed from the rear side thereof; a compound semiconductor layer disposed over the surface of the substrate; a local p-type region in the compound semiconductor layer, partially exposed at the end of the substrate opening; and a rear electrode made of a conductive material, disposed in the substrate opening so as to be connected to the local p-type region.. .
Fujitsu Limited
03/26/15
20150087117
new patent

Power semiconductor device and manufacturing the same


Disclosed herein is a power semiconductor device including: a base substrate having one surface and the other surface and formed of a first conductive type drift layer; a first conductive type diffusion layer formed on one surface of the base substrate and having a concentration higher than that of the first conductive type drift layer; and a trench formed so as to penetrate through the second conductive type well layer and the first conductive type diffusion layer from one surface of the base substrate including the second conductive type well layer in a thickness direction.. .
Samsung Electro-mechanics Co., Ltd.
03/26/15
20150087116
new patent

Sawtooth electric field drift region structure for power semiconductor devices


This invention discloses a semiconductor power device formed in a semiconductor substrate includes rows of multiple horizontal columns of thin layers of alternate conductivity types in a drift region of the semiconductor substrate where each of the thin layers having a thickness to enable a punch through the thin layers when the semiconductor power device is turned on. In a specific embodiment the thickness of the thin layers satisfying charge balance equation q*nd*wn=q*na*wp and a punch through condition of wp<2*wd*[nd/(na+nd)] where nd and wn represent the doping concentration and the thickness of the n type layers 160, while na and wp represent the doping concentration and thickness of the p type layers; wd represents the depletion width; and q represents an electron charge, which cancel out.
03/26/15
20150087114
new patent

Method for packaging a power device with bottom source electrode


A power semiconductor package has an ultra thin chip with front side molding to reduce substrate resistance; a lead frame unit with grooves located on both side leads provides precise positioning for connecting numerous bridge-shaped metal clips to the front side of the side leads. The bridge-shaped metal clips are provided with bridge structure and half or fully etched through holes for relieving superfluous solder during manufacturing process..
03/26/15
20150087113
new patent

Electrically isolated power semiconductor package with optimized layout


A packaged power semiconductor device is provided with voltage isolation between a metal backside and terminals of the device. The packaged power semiconductor device is arranged in an encapsulant defining a hole for receiving a structure for physically coupling the device to an object.
Ixys Corporation
03/26/15
20150087112
new patent

Manufacturing the semiconductor device


The semiconductor device is manufactured through the following steps: after first heat treatment is performed on an oxide semiconductor film, the oxide semiconductor film is processed to form an oxide semiconductor layer; immediately after that, side walls of the oxide semiconductor layer are covered with an insulating oxide; and in second heat treatment, the side surfaces of the oxide semiconductor layer are prevented from being exposed to a vacuum and defects (oxygen deficiency) in the oxide semiconductor layer are reduced.. .
Semiconductor Energy Laboratory Co., Ltd.
03/26/15
20150087111
new patent

3 dimensional semiconductor device and manufacturing the same


A 3d semiconductor device and a method of manufacturing the same are provided. The method includes forming a first semiconductor layer including a common source node on a semiconductor substrate, forming a transistor region on the first semiconductor layer, wherein the transistor region includes a horizontal channel region substantially parallel to a surface of the semiconductor substrate, and source and drain regions branched from the horizontal channel region to a direction substantially perpendicular to the surface of the semiconductor substrate, processing the first semiconductor layer to locate the common source node corresponding to the source region, forming a gate in a space between the source region and the drain region, forming heating electrodes on the source region and the drain region, and forming resistance variable material layers on the exposed heating electrodes..
Sk Hynix Inc.
03/26/15
20150087110
new patent

Low-temperature fabrication of spray-coated metal oxide thin film transistors


The present teachings relate to a method of enabling metal oxide film growth via solution processes at low temperatures (≦350° c.) and in a time-efficient manner. The present thin films are useful as thin film semiconductors, thin film dielectrics, or thin film conductors, and can be implemented into semiconductor devices such as thin film transistors and thin film photovoltaic devices..
Polyera Corporation
03/26/15
20150087109
new patent

Dyketopyrrolopyrrole polymers for use in organic semiconductor devices


The present invention relates to polymers comprising one or more (repeating) unit(s) of the formula *a-d* (i), or a polymer of formula *a-dxb-dy* (ii), or *a-drb-dsa-etb-eu (iii), and their use as organic semiconductor in organic devices, especially in organic photovoltaics (solar cells) and photodiodes, or in a device containing a diode and/or an organic field effect transistor. The polymers according to the invention have excellent solubility in organic solvents and excellent film-forming properties.
Basf Se
03/26/15
20150087107
new patent

Method for manufacturing photoelectric conversion device


A method for manufacturing a photoelectric conversion device of an embodiment includes forming, on a first electrode, a photoelectric conversion layer comprising at least one of a chalcopyrite compound, a stannite compound, and a kesterite compound. The forming of the photoelectric conversion layer includes forming a photoelectric conversion layer precursor comprising at least one compound semiconductor of a chalcopyrite compound, a stannite compound, and a kesterite compound on the first electrode.
Kabushiki Kaisha Toshiba
03/26/15
20150087101
new patent

Method for forming semiconductor device


A method for forming a semiconductor device includes providing a wafer having a plurality of chip regions, in which each chip region includes a sensing array on a front side of the wafer. A plurality of through silicon vias is formed in the wafer from a back side of the wafer, in which the plurality of through silicon vias is electrically connected to the plurality of sensing arrays.
Silicon Optronics, Inc.
03/26/15
20150087097
new patent

Method for manufacturing a light-emitting diode


The present disclosure provides a method for manufacturing a light-emitting diode, including: providing a substrate; forming a first semiconductor layer over the substrate; forming an active layer over the first semiconductor layer; forming a second semiconductor layer over the active layer; removing a portion of the second semiconductor layer and a portion of the active layer to expose a portion of the first semiconductor layer; conform to depositing a transparent conductive layer; forming a patterned mask layer over the transparent conductive layer; performing a wet etch process to remove a portion of the transparent conductive layer; performing a dry etch process to completely remove the portion of the transparent conductive layer not covered by the patterned mask layer; removing the patterned mask layer; and forming a first electrode and a second electrode.. .
Lextar Electronics Corporation
03/26/15
20150087096
new patent

Method of manufacturing semiconductor light emitting device


A method of manufacturing a semiconductor light emitting device is performed on a light emitting structure including a sequential stack of a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer. The second conductivity-type semiconductor layer and the active layer are mesa-etched to expose a portion of the first conductivity-type semiconductor layer therethrough.
Samsung Electronics Co., Ltd.
03/26/15
20150087094
new patent

Method of manufacturing a semiconductor laser module


A semiconductor laser module includes a laser diode array, an optical fiber array, a fiber array fitting for fixing the optical fiber array, a casing, and a support fitting for fixing the fiber array fitting and casing. The fiber array fitting and support fitting have a first contact section that is in line-contact or surface-contact with the plane section parallel with the light emission surface of the laser diode array, and are laser-welded and fixed to each other at the first contact section.
Panasonic Intellectual Property Management Co., Ltd.
03/26/15
20150087091
new patent

Manufacturing method and test semiconductor device


Provided is a test method by which a transistor whose reliability is low can be detected with low stress and high accuracy in a shorter period of time than a bt test. Provided is to detect a transistor whose reliability is high in a shorter period of time than a bt test and manufacture an electronic device with high reliability efficiently.
Semiconductor Energy Laboratory Co., Ltd.
03/26/15
20150087090
new patent

Monitor test key of epi profile


A method and apparatus for estimating a height of an epitaxially grown semiconductor material in other semiconductor devices. The method includes epitaxially growing first, second, and third portions of semiconductor material on a first semiconductor device, measuring a height of the third portion of semiconductor material and a height of the first or second portion of semiconductor material, measuring a first saturation current through the first and second portions of semiconductor material, measuring a second saturation current through the first and third portions of semiconductor material, and preparing a model of the first saturation current relative to the height of the first or second portion of semiconductor material and the second saturation current relative to an average of the height of the first and third portions of semiconductor material.
Taiwan Semiconductor Manufacturing Company, Ltd.
03/26/15
20150087088
new patent

Method for producing image pickup producing semiconductor apparatus


A method for producing an image pickup apparatus includes processes of: cutting an image pickup chip substrate to fabricate a plurality of image pickup chips; bonding the image pickup chips to a glass wafer via a transparent adhesive layer as well as bonding dummy chips to an outer peripheral region of the glass wafer where the image pickup chips are not bonded to fabricate a joined wafer; filling a sealing member between the image pickup chips and the dummy chips; machining the joined wafer to thin a thickness; and cutting the joined wafer.. .
Olympus Corporation
03/26/15
20150087086
new patent

Method for producing image pickup apparatus, and producing semiconductor apparatus


A method for producing an image pickup apparatus includes: a process of fabricating a plurality of image pickup chips by cutting an image pickup chip substrate where light receiving sections and electrode pads are formed; a process of fabricating a joined wafer by bonding the image pickup chips to a glass wafer; a process of filling a gap between the plurality of image pickup chips with a sealing member; a process of machining the joined wafer to reduce a thickness; a process of forming through-hole vias; a process of forming an insulating layer that covers the image pickup chips; a process of forming through-hole interconnections; a process of forming external connection electrodes, each of which is connected to each of the through-hole interconnections; and a process of cutting the joined wafer.. .
Olympus Corporation
03/26/15
20150087085
new patent

Device for determining the temperature of a substrate


An apparatus and a method for determining the temperature of a substrate, in particular of a semiconductor substrate during the heating thereof by means of at least one first radiation source are disclosed. A determination of the temperature is based on detecting first and second radiations, each comprising radiation emitted by the substrate due to its own temperature and radiation emitted by the first radiation, which is reflected at the substrate and at least one of a drive power of the first radiation source and the radiation intensity of the first radiation source..
Hq-dielectrics Gmbh
03/26/15
20150087083
new patent

Bonding apparatus and manufacturing semiconductor device


Chips (20) and (30); and a control unit (50) having a relative-position detection program (53) for detecting relative positions of the first-layer of the semiconductor chip (20) and the second-layer of the semiconductor chip (30) that are stacked and bonded based on an image of the first through-silicon vias on a surface of the first-layer of the semiconductor chip (20) taken by the double-view camera (16) before stacked bonding, and an image of the second through-silicon vias on a surface of the second-layer of the semiconductor chip (30) taken by the double-view camera (16) after stacked bonding. This provides accurate connection between through-silicon vias using a simple method..
03/26/15
20150087082
new patent

Selective heating during semiconductor device processing to compensate for substrate uniformity variations


In some embodiments, a system includes (1) a controller configured to receive information regarding substrate uniformity; (2) a processing tool configured to perform a semiconductor device manufacturing process on a substrate; and (3) a laser delivery mechanism coupled to the controller, the laser delivery mechanism configured to selectively deliver laser energy to the substrate during processing within the processing tool so as to selectively heat the substrate during processing. The controller is configured to employ the substrate uniformity information to determine a temperature profile to apply to the substrate during processing within the processing tool and to employ the laser delivery mechanism to selectively heat the substrate during processing within the processing tool based on the temperature profile.
Applied Materials, Inc.
03/26/15
20150087009
new patent

Live cell viability modification system and method


An apparatus, system, and method are provided for selectively altering the viability characteristics of a live cell. In some embodiments, an electrical signal acquisition array, electrically coupled to a high gain amplifier, is used in conjunction with an analog to digital converter and a computer to record natural electrical signals that a cell type may use to communicate with its neighbors, the immune system, and the organism in which it is operating, as well as the signals and waveforms that define its particular natural operational electrical signature.


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