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Die Paddle patents



      
           
This page is updated frequently with new Die Paddle-related patent applications. Subscribe to the Die Paddle RSS feed to automatically get the update: related Die RSS feeds. RSS updates for this page: Die Paddle RSS RSS


Date/App# patent app List of recent Die Paddle-related patents
07/03/14
20140183711
 Semiconductor device and method of making a semiconductor device patent thumbnailSemiconductor device and method of making a semiconductor device
In accordance with an embodiment of the present invention, a semiconductor device has a substrate having a first surface and a second surface opposite the first surface. Also, the substrate has a first hole.
05/29/14
20140145318
 Semiconductor packages and methods of formation thereof patent thumbnailSemiconductor packages and methods of formation thereof
In accordance with an embodiment of the present invention, a semiconductor package includes a die paddle, and an encapsulant disposed around the die paddle. The semiconductor package has a first sidewall and a second sidewall.
04/24/14
20140110828
 Semiconductor packages and methods of formation thereof patent thumbnailSemiconductor packages and methods of formation thereof
In accordance with an embodiment of the present invention, a semiconductor device includes a lead frame having a die paddle and a lead. A chip is disposed over the die paddle of the lead frame.
04/03/14
20140091448
 Semiconductor package with corner pins patent thumbnailSemiconductor package with corner pins
There are provided semiconductor packages having corner pins and methods for their fabrication. Such a semiconductor package includes a leadframe and a die paddle, the leadframe having first and second edge sides meeting to form a first corner.
03/27/14
20140084400
 Methods and apparatus for magnetic sensor having non-conductive die paddle patent thumbnailMethods and apparatus for magnetic sensor having non-conductive die paddle
Methods and apparatus to provide an integrated circuit package having a conductive leadframe, a non-conductive die paddle mechanically coupled to the leadframe, and a die disposed on the die paddle and electrically connected to the leadframe. With this arrangement, eddy currents are reduced near the magnetic field transducer to reduce interference with magnetic fields..
02/13/14
20140042605
 Lead frame package and method for manufacturing the same patent thumbnailLead frame package and method for manufacturing the same
In one embodiment, a lead frame package structure includes a lead frame having sides that surround a die paddle and on which a plurality of leads are formed. An electronic chip is attached to the die paddle and a case is attached to the lead frame to seal the leads and the electronic chip.
01/09/14
20140008702
 Semiconductor packages having multiple lead frames and methods of formation thereof patent thumbnailSemiconductor packages having multiple lead frames and methods of formation thereof
In accordance with an embodiment of the present invention, a semiconductor package includes a first lead frame having a first die paddle, and a second lead frame, which has a second die paddle and a plurality of leads. The second die paddle is disposed over the first die paddle.
01/02/14
20140001617
 Method of using bonding ball array as height keeper and paste holder in semiconductor device package patent thumbnailMethod of using bonding ball array as height keeper and paste holder in semiconductor device package
A die attach method for a semiconductor chip with a back metal layer located at the back surface of the semiconductor chip comprises the steps of forming a bonding ball array including a plurality of bonding balls with a same height on a die attach area at a top surface of a die paddle; depositing a die attach material in the bonding ball array area with a thickness of the die attach material equal or slightly larger than the height of the bonding ball; attaching the semiconductor chip to the die attach area at the top surface of the die paddle by the die attach material, wherein the bonding ball array controls the bond line thickness of the die attach material between the back metal layer and the top surface of the die paddle and prevents the semiconductor chip from rotating on the die attach material when it is melted.. .
01/02/14
20140001615
 Package-in-packages and methods of formation thereof patent thumbnailPackage-in-packages and methods of formation thereof
In accordance with an embodiment of the present invention, a semiconductor device includes a leadframe having a plurality of leads and a die paddle and a semiconductor module attached to the die paddle of the leadframe. The semiconductor module includes a first semiconductor chip disposed in a first encapsulant.
10/03/13
20130256857
 Semiconductor packages and methods of formation thereof patent thumbnailSemiconductor packages and methods of formation thereof
In one embodiment, a method of forming a semiconductor package comprises providing a first die having contact regions on a top surface but not on an opposite bottom surface. A dielectric liner layer is deposited under the bottom surface of the first die.
07/18/13
20130181304
Methods and apparatus for magnetic sensor having non-conductive die paddle
Methods and apparatus to provide an integrated circuit package having a conductive leadframe, a non-conductive die paddle mechanically coupled to the leadframe, and a die disposed on the die paddle and electrically connected to the leadframe. With this arrangement, eddy currents are reduced near the magnetic field transducer to reduce interference with magnetic fields..
06/20/13
20130154118
Integrated circuit packaging system with contacts and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: forming an isolated contact having a contact protrusion; forming a die paddle, adjacent to the isolated contact, having a die paddle contour; depositing a contact pad on the contact protrusion; coupling an integrated circuit die to the contact protrusion; molding an encapsulation on the integrated circuit die; and depositing an organic filler on and between the isolated contact and the die paddle, the contact protrusion extended past the organic filler.. .
06/20/13
20130154067
Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe
A semiconductor device has a vertically offset bot interconnect structure. The vertical offset is achieved with a leadframe having a plurality of lead fingers around a die paddle.
05/02/13
20130105970
Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe
A semiconductor device has a prefabricated multi-die leadframe with a base and integrated raised die paddle and a plurality of bodies extending from the base. A thermal interface layer is formed over a back surface of a semiconductor die or top surface of the raised die paddle.
03/28/13
20130075922
Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: providing a dummy-die paddle having a first inactive side facing up, a second inactive side facing down; forming an insulator in a single continuous structure around and in direct contact with the first inactive side; and mounting an integrated circuit over the dummy-die paddle and the insulator, the integrated circuit and the dummy-die paddle having the same coefficient of thermal expansion as the dummy-die paddle.. .
01/10/13
20130009294
Multi-chip package having leaderframe-type contact fingers
Disclosed is a multi-chip package having leadframe-type contact fingers, primarily comprising a leadframe, a non-conductive tape, a first chip and a second chip disposed on the first chip. The leadframe includes a die paddle on which the first chip is disposed and a plurality of first contact fingers, moreover, at least a second contact finger is integrally extended from the die paddle and is located among the first contact fingers so that the first and second contact fingers are arranged in a row.


Popular terms: [SEARCH]

Die Paddle topics: Die Paddle, Semiconductor, Integrated Circuit, Circuit Pack, Semiconductor Device, Transducer, Magnetic Field, Eddy Currents, Conductive Layer, Encapsulation

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This listing is a sample listing of patent applications related to Die Paddle for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Die Paddle with additional patents listed. Browse our RSS directory or Search for other possible listings.
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