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Date/App# patent app List of recent Copper-related patents
04/17/14
20140107364
 Organic electronic device and dopant for doping an organic semiconducting matrix material patent thumbnailOrganic electronic device and dopant for doping an organic semiconducting matrix material
An organic electronic device includes a substrate, a first electrode arranged on the substrate, at least a first functional organic layer arranged on the first electrode and a second electrode arranged on the first functional organic layer. The first functional organic layer includes a matrix material and a p-dopant with regard to the matrix material, wherein the p-dopant includes a copper complex containing at least one ligand..
04/17/14
20140107348
 Methods for the preparation of aryl amides patent thumbnailMethods for the preparation of aryl amides
Wherein q is optionally substituted aryl or optionally substituted heteroaryl; x is halogen or a sulphonate; p is an organic radical; r is hydrogen or an organic radical; wherein the catalyst comprises copper and a ligand; comprising providing the compound of formula iii in liquid form prior to contacting the compound of formula iii with the catalyst.. .
04/17/14
20140107327
 Methods for preparing deuterated 1,2,3-triazoles patent thumbnailMethods for preparing deuterated 1,2,3-triazoles
This disclosure relates to a method that involves reacting an azide with an alkyne in the presence of deuterated water and a copper-containing catalyst, thereby forming a deuterated 1,2,3-triazole.. .
04/17/14
20140107256
 Thermoset resin composition and its use patent thumbnailThermoset resin composition and its use
The present invention discloses a thermoset resin composition including epoxy resin other than brominated epoxy resin, styrene maleic anhydride copolymer and additive-type flame retardant. The thermoset resin composition also includes an active ester.
04/17/14
20140106562
 Barrier layer for copper interconnect patent thumbnailBarrier layer for copper interconnect
A copper interconnect includes a copper layer formed in a dielectric layer. A glue layer is formed between the copper layer and the dielectric layer.
04/17/14
20140106559
 System and method for forming an aluminum fuse for compatibility with copper beol interconnect scheme patent thumbnailSystem and method for forming an aluminum fuse for compatibility with copper beol interconnect scheme
A semiconductor fuse device and a method of fabricating the fuse device including a last metal interconnect layer including at least two discrete metal conductors, an inter-level dielectric layer deposited over the last metal interconnect layer and the at least two discrete metal conductors, a thin wire aluminum fuse connecting the at least two discrete metal conductors, and a fuse opening above the aluminum fuse.. .
04/17/14
20140106147
 Prepreg, copper clad laminate, and printed circuit board patent thumbnailPrepreg, copper clad laminate, and printed circuit board
Disclosed herein is a prepreg including: a reinforcement substrate; and a polymer resin layer formed by impregnating a polymer resin containing a liquid crystal oligomer and an inorganic filler on the reinforcement substrate, wherein an impregnation ratio of the polymer resin is 60 to 85 wt., whereby a product manufactured by using the prepreg may have excellent coefficient of thermal expansion and thermal properties.. .
04/17/14
20140106145
 Metallized cutlery and tableware and method therefor patent thumbnailMetallized cutlery and tableware and method therefor
A tableware item molded from a plastic material, such as polystyrene has a metallic coating applied to at least one surface by a sputtering deposition process. The sputtered coating is suitable for food contact without an overcoat, and imparts the appearance of a metal tableware item.
04/17/14
20140106063
 Spark plug electrode material and spark plug and method for manufacturing the spark plug electrode material and an electrode for the spark plug patent thumbnailSpark plug electrode material and spark plug and method for manufacturing the spark plug electrode material and an electrode for the spark plug
A spark plug electrode material containing a) 0.7 to 1.3% silicon by weight, b) 0.5 to 1.0% copper by weight, and c) nickel as the balance.. .
04/17/14
20140106028
 Methods and kits for co-administration of nutritional supplements patent thumbnailMethods and kits for co-administration of nutritional supplements
The present invention relates to methods of co-administration of various vitamin and mineral compositions, and in a specific embodiment, said methods comprise co-administering one composition comprising vitamin a, vitamin d, vitamin c, vitamin e, folic acid, vitamin b1, vitamin b2, vitamin b6, vitamin b12, niacin, calcium, iron, magnesium, zinc, and/or copper, and a second composition comprising omega-3 fatty acids such as dha, to supplement the nutritional needs of individuals within physiologically stressful states; and kits provided for co-administration of various vitamin and mineral compositions, and in a specific embodiment, said kits comprise one composition comprising vitamin a, vitamin d, vitamin c, vitamin e, folic acid, vitamin b1, vitamin b2, vitamin b6, vitamin b12, niacin, calcium, iron, magnesium, zinc, and/or copper, and a second composition comprising omega-3 fatty acids such as dha, to supplement the nutritional needs of individuals within physiologically stressful states.. .
04/17/14
20140105965
Modified polynucleotides encoding copper metabolism (murr1) domain containing 1
The invention relates to compositions and methods for the preparation, manufacture and therapeutic use of polynucleotides, primary transcripts and mmrna molecules.. .
04/17/14
20140105953
Antimicrobial glass-ceramics
The application discloses the formation of antimicrobial glass-ceramic articles having an amorphous phase and a crystalline phase and an antimicrobial agent selected from the group consisting of silver, copper and a mixture of silver and copper. The antimicrobial glass-ceramic can have a log reduction of >2..
04/17/14
20140105819
In vivo copper-free click chemistry for delivery of therapeutic and/or diagnostic agents
The present application discloses compositions and methods of synthesis and use involving click chemistry reactions for in vivo or in vitro formation of therapeutic and/or diagnostic complexes. Preferably, the diagnostic complex is of use for 18f imaging, while the therapeutic complex is of use for targeted delivery of chemotherapeutic drugs or toxins.
04/17/14
20140105769
Method for fabricating electric wire for winding of super-high heat-resistant motor pump, electric wire fabricated by the method, and motor pump having the electric wire
Disclosed herein is a method for fabricating an electric wire for a winding of a super-high heat-resistant motor pump, including: coating a bare copper wire with a first heat-resistant resin layer; applying a woven fiber cladding to an outer surface of the first heat-resistant resin layer; coating an outer surface of the woven fiber cladding with a second heat-resistant resin layer; and applying an inorganic sheath to an outer surface of the second heat-resistant resin layer.. .
04/17/14
20140105014
Method and system for extended reach copper transceiver
Aspects of a method and system for an extended range copper transceiver are provided. Reducing the communication rate provided by multi-rate physical (phy) layer operations in an ethernet transceiver may extend the range of the ethernet transceiver over twisted-pair copper cabling from a standard connection length.
04/17/14
20140104912
Water cooling sub-high frequency transformer and cooling device thereof
A sub-high frequency transformer with water-cooled heat dissipation includes a magnetic core (8), primary coils (10), secondary coils (9a1, 9a2, 9b1, 9b2, 9c1, 9c2, 9d1, 9d2), secondary leading terminals of the transformer, and a rectifying tube circuit connected with the secondary leading terminals of the transformer. The rectifying tube circuit includes plane-type rectifying diodes (11, 12), positive leading plates (3, 4, 5, 6) of the diodes, a rectifier positive output plate (2), and a rectifier negative output plate (1) which is also the central tap of the transformer.
04/17/14
20140103770
Permanent magnet rotor and methods thereof
In one embodiment, an electric machine is provided. The electric machine includes a machine housing and a stator disposed at least partially within the housing, the stator comprising a plurality of teeth and an aluminum winding wound around at least one tooth of the plurality of teeth.
04/17/14
20140103526
Self-aligned protection layer for copper post structure
A semiconductor device includes a copper-containing post overlying and electrically connected to a bond pad region. The semiconductor device further includes a protection layer on a surface of the copper-containing post, where the protection layer includes manganese..
04/17/14
20140103477
Solid-state imaging device, method for manufacturing solid-state imaging device, and electronic apparatus
A solid-state imaging device with a pixel region in which a plurality of pixels with photoelectric conversion films are arrayed and pixel isolation portions are interposed between the plurality of pixels. The photoelectric conversion film is a chalcopyrite-structure compound semiconductor composed of a copper-aluminum-gallium-indium-sulfur-selenium based mixed crystal or a copper-aluminum-gallium-indium-zinc-sulfur-selenium based mixed crystal, and is disposed on a silicon substrate in such a way as to lattice-match the silicon substrate concerned.
04/17/14
20140103281
Resistive memory based on taox containing ru doping and method of preparing the same
The present invention pertains to the technical field of semi-conductor memory. More particularly, the invention relates to a resistive memory based on taox containing ru doping.
04/17/14
20140103256
Adsorbents for removing contaminants from gas flows containing water
The invention relates to adsorbents for removing impurities from water-comprising gas streams, in particular for use in fuel cell systems, wherein the adsorbents comprise oxides of elements selected from the group consisting of cu, fe, zn, ni, co, mn, mg, ba, zr, ce, la or combinations of these elements, have a copper oxide content of at least 30% by weight and have pore volumes of less than 0.175 ml·g−1 for pores having a radius of less than 20 nm.. .
04/17/14
20140102910
Method for copper plating
A method for copper plating in a plating bath wherein the substrate is brought into contact with a leveller additive comprising a heterocyclic core having a thiol group and an amino group attached to said heterocyclic core by a spacer is disclosed. Said method is particularly suitable for filling recessed structures in the manufacture of printed circuit boards, ic substrates and semiconducting substrates..
04/17/14
20140102909
Copper electrodeposition in microelectronics
A method and composition for electroplating cu onto a substrate in the manufacture of a microelectronic device involving and electrolytic solution containing a source of cu ions and a quaternized pyridinium salt compound for leveling.. .
04/17/14
20140102891
Manufacturing apparatus and method for large-scale production of thin-film solar cells
A method of manufacturing improved thin-film solar cells entirely by sputtering includes a high efficiency back contact/reflecting multi-layer containing at least one barrier layer consisting of a transition metal nitride. A copper indium gallium diselenide (cu(inxga1-x)se2) absorber layer (x ranging from 1 to approximately 0.7) is co-sputtered from specially prepared electrically conductive targets using dual cylindrical rotary magnetron technology.
04/17/14
20140102887
Plasma electrolytic cell
Electrolytic devices, including electrolytic cells, are described, that can be used in various segments of technology for the production of hydrogen and oxygen by electrolysis of water electrolytes. In one embodiment, a plasma electrolytic cell is provided, comprising an anode and a cathode located in dielectric containers interconnected via a pipe in their bottom portions, wherein the spiral shaped cathode is made from electrically insulated copper wire and the electric insulation has local breaks, wherein the anode is planar, the cathode and anode containers have covers with embedded gas pressure adjustment valves, wherein the top portions of the containers are connected to gas offtake devices, and wherein the cathode and anode containers allow adding more electrolyte..
04/17/14
20140102773
Adhesiveless copper clad laminates and printed circuit board having adhesiveless copper clad laminates as base material
Adhesiveless copper clad laminates obtained by metallizing excellent in wiring microfabrication ability in processing by semi-additive method, and a printed circuit board using the adhesiveless copper clad laminates excellent in wiring microfabrication ability as a base material are provided. The adhesiveless copper clad laminates include a base metal layer made of an alloy containing nickel and formed on at least one surface of an insulating film without using an adhesive in between, a thin copper layer formed on a front surface of the base metal layer by dry plating, and a copper plating film formed on a front surface of the thin copper layer by electroplating.
04/17/14
20140102765
Multilayer electronic structures with improved control of dielectric thickness
A method of fabricating a multilayer electronic support structure comprising electroplating copper substructures, laying a dielectric pre-preg comprising a polymer resin over the copper substructures, and pressing to pressures of 200 to 600 psi against a release film having a higher hardness than the resin of the prepreg but a lower hardness than the cured resin, and heating through a curing cycle whilst maintaining pressure.. .
04/17/14
20140102660
Combined furnace system for fire refining red impure copper
A combined furnace system for fire refining red impure copper, comprising in order: a shaft furnace (2) for smelting red impure copper raw material into red impure copper liquid; a red impure copper liquid groove (4); at least one rotary furnace (5) for refining and producing refined copper liquid by means of oxidation reduction; a refined copper liquid groove (6). The combined furnace system is characterized in that the system comprises a tilting furnace (3) between the shaft furnace (2) and the red impure copper liquid groove (4) for removing slag from red impure copper liquid having slag.
04/17/14
20140102509
Solar cell with reduced absorber thickness and reduced back surface recombination
Manufacture for an improved stacked-layered thin film solar cell. Solar cell has reduced absorber thickness and an improved back contact for copper indium gallium selenide solar cells.
04/17/14
20140102257
Copper anode refining system and method
A method and system for the copper anode refining is provided in which coherent jet technology is employed to heat the molten blister copper and/or melt scrap copper charges using a melting flame, oxidize the sulfur in the molten blister copper, and reduce the oxygen in the molten blister copper using top-blown coherent jet gas streams from one or more multi-functional, coherent jet lance assemblies. The present system and method employs a microprocessor-based controller operatively controlling the flow of an oxygen-containing gas, an inert gas, a reducing agent and a fuel to the coherent jet lance.
04/10/14
20140099587
Burner arrangement and burner assembly
The invention relates to a burner arrangement comprising a fluid cooled copper block. Further, the invention relates to a burner assembly, a duct element, a gas circulating duct, and a metallurgical furnace comprising said burner arrangement.
04/10/14
20140099514
Bi-material strip and a method of bonding strips of different materials together
A continuous hot bonding method for producing a bi-material strip with a strong bond therebetween is provided. The method comprises sanding a first strip formed of steel; and applying a layer of first particles, typically formed of copper, to the sanded first strip.
04/10/14
20140099230
Aluminum alloy that is not sensitive to quenching, as well as method for the production of a semi-finished product
An aluminum alloy that is not sensitive to quenching, for the production of high-strength forged pieces that are low in inherent tension, and high-strength extruded and rolled products, consisting of: 7.0-10.5 wt. % zinc, 1.0-2.5 wt.
04/10/14
20140098454
Multilayered ceramic electronic component and method of manufacturing the same
There is provided a multilayered ceramic electronic component including: a ceramic body having first and second main surfaces opposing each other and first and second end surfaces opposing each other and including dielectric layers; internal electrodes disposed to face each other and having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein the external electrodes include first external electrodes formed of nickel (ni) on portions of the first and second main surfaces while covering the entirety of the first and second end surfaces of the ceramic body; and second external electrodes formed of copper (cu) on outer surfaces of the first external electrodes.. .
04/10/14
20140098444
Stall delay attachment
The stall delay attachment is a copper terminal strip that is designed to increase the life of any battery, voltage regulator or starter by acting as a surge protector or a heat sink that dissipates heat only for electrical current and would be attached and fused into a battery cable that leads to the battery on one end and attached and fused to an electrical wire leading to the voltage regulator or starter on the opposite end of the stall delay unit requiring no direct connection of the stall delay unit to the battery, voltage regulator or starter of any car, boat, motorcycle, riding lawn mower, tractor, truck or rv.. .
04/10/14
20140097720
Production of die cast rotors with copper bars for electric motors
A rotor core for an electric motor includes a stack of laminations having peripherally spaced openings receiving copper bars with opposite end portions projecting from the stack. The core is mounted on an arbor and is inserted into a mold on a vertical die cast press having a shot chamber.
04/10/14
20140097717
Fluid dynamic pressure bearing apparatus and spindle motor
There is provided a fluid dynamic pressure bearing apparatus including a shaft, a bearing sleeve rotatably supporting the shaft, and a lubricating oil filled between the shaft and the bearing sleeve, wherein at least one of the shaft and the bearing sleeve is formed of a copper alloy containing 0.8 wt % to 5 wt % of lead, and a base oil of the lubricating is a member selected from the group consisting of monoester, dibasic acid diester, diol ester and mixtures thereof, and the lubricating oil contains 0.1 wt % to 1 wt % of condensed phosphate ester. The fluid dynamic pressure bearing apparatus is capable of suppressing the hydrolysis of the lubricating oil, and the wear of the shaft and the bearing sleeve..
04/10/14
20140097539
Technique for uniform cmp
Pitch-dependent dishing and erosion following cmp treatment of copper features is quantitatively assessed by atomic force microscopy (afm) and transmission electron microscopy (tem). A new sequence of processing steps presented herein is used to prevent dishing and to reduce significantly the local pitch- and pattern density-induced cmp non-uniformity for copper metal lines having widths and spacing in the range of about 32-128 nm.
04/10/14
20140097538
Semiconductor device having a self-forming barrier layer at via bottom
An approach for forming a semiconductor device is provided. In general, the device is formed by providing a metal layer, a cap layer over the metal layer, and an ultra low k layer over the cap layer.
04/10/14
20140097515
Compound semiconductor integrated circuit with three-dimensionally formed components
A compound semiconductor integrated circuit with three-dimensionally formed components, such as three-dimensionally formed bond pads or inductors, positioned above an electronic device. The dielectric layer inserted between the electronic device and the bond pads or inductors thereon has a thickness between 10 to 30 microns, so that it can effectively mitigate the effect of the structure on the device performance.
04/10/14
20140097452
Luminescence device
A luminescence device used in a backlight unit for lighting or displaying may include: a substrate including at least two electrode patterns and led chips which are provided over the substrate and include a phosphor provided thereon. A dam is provided over the substrate, and an encapsulation layer is provided over the substrate.
04/10/14
20140097231
Surface treating composition for copper and copper alloy and utilization thereof
A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.. .
04/10/14
20140097087
Electrolytic copper plating liquid and the electrolytic copper plating method
Copper electroplating liquid which does not use formaldehyde, which is harmful to the environment, and which exhibits excellent via filling ability is offered. The copper electroplating liquid of this invention includes the compound that has the structure of —x—s—y— where x and y are each an atom selected from the group of hydrogen atoms, carbon atoms, sulfur atoms, nitrogen atoms and oxygen atoms, and x and y can be the same only when they are carbon atoms, and a specific urea derivative.
04/10/14
20140097084
High-purity copper-manganese-alloy sputtering target
Provided is a high-purity copper-manganese-alloy sputtering target comprising 0.05 to 20 wt % of mn and the remainder being cu and inevitable impurities. The high-purity copper-manganese-alloy sputtering target is characterized in that the in-plane variation (cv value) in mn concentration of the target is 3% or less.
04/10/14
20140097006
Etchant composition, metal wiring, and method of manufacturing a display substrate
A wet etching composition usable for etching a copper-based wiring layer includes between about 40% by weight to about 60% by weight of phosphoric acid, between about 1% by weight to about 10% by weight of nitric acid, between about 3% by weight to about 15% by weight of acetic acid, between about 0.01% by weight to about 0.1% by weight of a copper-ion compound, between about 1% by weight to about 10% by weight of a nitric salt, between about 1% by weight to about 10% by weight of an acetic salt, and a remainder of water. .
04/10/14
20140097005
Glass wiring board
A glass wiring board is provided that includes a glass substrate and a primer layer. The prime layer is disposed on the glass substrate and includes an intermediate layer and a copper plating layer disposed on the intermediate layer.
04/10/14
20140096999
Collective conductor and method for producing collective conductor
A collective conductor includes a plurality of conductive wires that is arranged collectively; and a copper foil that is wound around the collectively-arranged conductive wires and fusion-bonded to the conductive wires, and the copper foil has a tin plating on the side in contact with the conductive wires.. .
04/10/14
20140096879
Aluminum alloy composition and heat treatment method of the aluminum alloy composition
Disclosed herein is an aluminum alloy composition and a method of heat treating the aluminum alloy, to improve process control and strength of the aluminum alloy for a rear safety plate mounted on a truck, etc., complying with safety regulations wherein the aluminum alloy composition includes silicon (si) about 0.8 to 1.3% by weight, iron (fe) up to about 0.5% by weight, copper (cu) about 0.15 to 0.4% by weight, manganese (mn) up to about 0.15% by weight, magnesium (mg) about 0.8 to 1.2% by weight, chromium (cr) up to about 0.25% by weight, zinc (zn) up to about 0.2% by weight, titanium (ti) up to about 0.1% by weight and the remaining percent by weight of aluminum (al) of the entire composition.. .
04/10/14
20140096877
Copper alloy for electronic devices, method for producing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices
An aspect of this method for producing a copper alloy includes: heating a copper material having the composition of the copper alloy to a temperature of 300° c. To 900° c.; rapidly cooling the heated copper material to a temperature of 200° c.
04/10/14
20140096859
Muffler insulator for motocycles
An insulator for a motorcycle muffler having an insulating blanket, copper tubes attached to an inner surface of the insulating blanket, an outer decorative cover attached to the insulating blanket, and a means for attaching the insulator to a motorcycle muffler.. .
04/10/14
20140096487
Fixation of mineral oil in paper food packaging with laccase to prevent mineral oil migration into food
A method is provided for preventing, minimizing, and/or eliminating the migration of mineral oils from paper food packaging into packaged food. The method can include adding a copper-containing oxidase enzyme, such as a laccase enzyme, to a paper pulp from which the paper food packaging is to be formed.
04/10/14
20140096420
Fabric material
A method for making a fabric material includes the steps of weaving a plurality of strands of a warp yarn in a warp direction with a plurality of strands of a first filling yarn impregnated with silver ions in a filling direction and a plurality of strands of a second filling yarn impregnated with copper ions in the filling direction. Each of the plurality of stands of the first filling yarn and each of said plurality of strands of the second filling yarn are alternately woven with the plurality of strands of the warp yarn in the filling direction.
04/10/14
20140096383
Rigid-flexible printed circuit board and method of manufacturing the same
A method of manufacturing a rigid-flexible printed circuit board includes providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns and a first window are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the base substrate; forming a via hole in the rigid region, and, simultaneously, forming a via hole to correspond to the first window in a flexible region; forming outer circuit patterns including areas adjacent to the first window; and applying solder resists in the rigid region to expose portions of external circuit patterns. The region adjacent to the via holes in the flexible region includes additional plating portions for covering the coverlays..
04/10/14
20140096382
Manufacturing method of substrate structure
A manufacturing method of substrate structure is provided. The base material having a core layer and a first and second copper foil layers located at a first and second surfaces of the core layer is provided.
04/10/14
20140096381
Manufacturing method of multilayer printed wiring board and multilayer printed wiring board obtained by the manufacturing method
A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a carrier foil/a release layer/a heat-resistant metal layer/a copper foil layer is used; a supporting substrate is manufactured by laminating an insulating layer constituting material on the surface of the copper foil layer constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the carrier foil constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board.. .
04/03/14
20140094040
Plasma processing method
In a plasma torch unit, copper rods forming a coil as a whole are disposed inside copper rod inserting holes formed in a quartz block so that the quartz block is cooled by water flowing inside the copper rod inserting holes and cooling water pipes. A plasma ejection port is formed on the lowermost portion of the torch unit.
04/03/14
20140093743
Liquid crystal polymer copper-clad laminate and copper foil used for said laminate
Provided is a copper-clad laminate obtainable by bonding a copper foil on which roughening treatment including copper-cobalt-nickel alloy plating is performed and a liquid crystal polymer to each other, wherein the copper-clad laminate is free from a roughening particle residue on a surface of the liquid crystal polymer resin after copper foil circuit etching. The copper-clad laminate obtainable by bonding a copper foil and a liquid crystal polymer to each other, wherein the copper foil includes a copper primary particle layer formed on a surface bonded to the liquid crystal polymer and a secondary particle layer formed on the primary particle layer and made from a ternary alloy including copper, cobalt, and nickel; the primary particle layer has an average particle size of 0.25 to 0.45 μm; and the secondary particle layer has an average particle size of 0.05 to 0.25 μm..
04/03/14
20140093674
Systems and methods implementing wear-resistant copper-based materials
Systems and methods in accordance with embodiments of the invention implement copper-based materials in applications where resistance to wear is desired. In one embodiment, a wear-resistant gear includes a gear defined by a rotatable body having teeth disposed on an outer surface of the rotatable body, where the gear body is formed at least in part from a material including copper and x, where x is one of zirconium, titanium, hafnium, rutherfordium, and mixtures thereof and where the atomic ratio of copper to x is approximately between 2:3 and 3:2..
04/03/14
20140093584
Genetic test for liver copper accumulation in dogs and low copper pet diet
The present invention provides a method of testing a dog to determine the likelihood that the dog is protected from liver copper accumulation, comprising detecting in a sample the presence or absence in the genome of the dog of one or more polymorphisms selected from (a) snp atp7a_reg3_f_6 (seq id no:142) and (b) one or more polymorphisms in linkage disequilibrium with (a).. .
04/03/14
20140092931
Laser diode assembly
A laser diode assembly includes a housing having a housing part and a mounting part that is connected to the housing part and that extends away from the housing part along an extension direction. A laser diode chip is disposed on the mounting part.
04/03/14
20140092560
Force and heat spreading pcb for lcd protection and interconnection
The described embodiment relates generally to the manufacture of display assemblies. More particularly the use of alternative back plates for a display assembly is discussed.
04/03/14
20140092182
Phase change inks containing novel synergist
A phase change ink composition including a pigment; a carrier; a dispersant; and a copper phthalocyanine synergist having a carboxylic acid group thereon.. .
04/03/14
20140091821
Composite wire probes for testing integrated circuits
An electrical probe of an aspect includes a high yield strength wire core. The high yield strength wire core includes predominantly one or more materials selected from tungsten, tungsten-copper alloy, tungsten-nickel alloy, beryllium-copper alloy, molybdenum, stainless steel, and combinations thereof.
04/03/14
20140091668
Hybrid rotor bar assemblies, electric motors including hybrid rotor bar assemblies, and methods of assemblying same
Hybrid rotor bar assemblies and electric motors having hybrid rotor bar assemblies are disclosed, as are other aspects. The hybrid rotor tar assemblies have rotor bars lined with shims.
04/03/14
20140091468
Semiconductor device and manufacturing method thereof
The reliability of wirings, each of which includes a main conductive film containing copper as a primary component, is improved. On an insulating film including the upper surface of a wiring serving as a lower layer wiring, an insulating film formed of a silicon carbonitride film having excellent barrier properties to copper is formed; on the insulating film, an insulating film formed of a silicon carbide film having excellent adhesiveness to a low dielectric constant material film is formed; on the insulating film, an insulating film formed of a low dielectric constant material as an interlayer insulating film is formed; and thereafter a wiring as an upper layer wiring is formed..
04/03/14
20140091467
Forming barrier walls, capping, or alloys /compounds within metal lines
Described herein are techniques structures related to forming barrier walls, capping, or alloys/compounds such as treating copper so that an alloy or compound is formed, to reduce electromigration (em) and strengthen metal reliability which degrades as the length of the lines increases in integrated circuits.. .
04/03/14
20140091446
Semiconductor device employing aluminum alloy lead-frame with anodized aluminum
A semiconductor device comprises an aluminum alloy lead-frame with a passivation layer covering an exposed portion of the aluminum alloy lead-frame. Since aluminum alloy is a low-cost material, and its hardness and flexibility are suitable for deformation process, such as punching, bending, molding and the like, aluminum alloy lead frame is suitable for mass production; furthermore, since its weight is much lower than copper or iron-nickel material, aluminum alloy lead frame is very convenient for the production of semiconductor devices..
04/03/14
20140091414
Semiconductor apparatus
A semiconductor apparatus includes a conductive member penetrating through a first semiconductor layer, a first insulator layer, and a third insulator layer, and connecting a first conductor layer with a second conductor layer. The conductive member has a first region containing copper, and a second region containing a material different from the copper is located at least between a first region and the first semiconductor layer, between the first region and the first insulator layer, and between the first region and the third insulator layer.
04/03/14
20140091345
Luminescence device
A luminescence device used in a backlight unit for lighting or displaying may include a substrate having a first electrode and a second electrode, and an led chip disposed on the first electrode. A dam is disposed on the substrate.
04/03/14
20140091307
Laser power and energy sensor utilizing anisotropic thermoelectric material
A laser-radiation sensor includes a copper substrate on which is grown an oriented polycrystalline buffer layer surmounted by an oriented polycrystalline sensor-element of an anisotropic transverse thermoelectric material. An absorber layer, thermally connected to the sensor -element, is heated by laser-radiation to be measured and communicates the heat to the sensor-element, causing a thermal gradient across the sensor-element.
04/03/14
20140091304
Laser power and energy sensor utilizing anisotropic thermoelectric material
A laser-radiation sensor includes a copper substrate on which is grown an oriented polycrystalline buffer layer surmounted by an oriented polycrystalline sensor-element of an anisotropic transverse thermoelectric material. An absorber layer, thermally connected to the sensor-element, is heated by laser-radiation to be measured and communicates the heat to the sensor-element, causing a thermal gradient across the sensor-element.
04/03/14
20140091058
Copper oxide etchant and etching method using the same
In order to provide a copper oxide etchant and an etching method using the same capable of selectively etching exposure/non-exposure portions when laser light exposure is performed by using copper oxide as a thermal-reactive resist material, the copper oxide etchant for selectively etching copper oxides having different oxidation numbers in a copper oxide-containing layer containing the copper oxide as a main component contains at least a chelating agent or salts thereof.. .


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Copper topics: Molybdenum, Nitrous Oxide, Carbon Dioxide, Semiconductor, Conductive Layer, Copper Alloy, Sulfuric Acid, Sodium Hydroxide, Essential Oil, Mineral Oil, Carbon Monoxide, Electronic Device, Epoxy Resin, Copper Clad Laminate, Benzoxazine

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