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|| List of recent Copper-related patents
| Hydrocarbons selective oxidation with heterogeneous catalysts|
A process for the complete or partial oxidation of hydrocarbons comprises contacting a c1-c8 hydrocarbon and hydrogen peroxide in the presence of a heterogeneous catalyst under conditions suitable to convert the c1-c8 hydrocarbon to at least one corresponding c1-c8 oxygenate product, wherein the heterogeneous catalyst provides confinement and contains both brønsted-lowry and lewis acid centers. Examples include zeolites modified with selected metals or metal oxides.
| Process for the preparation of a mono-n-alkypiperazine|
With a primary amine of the formula h2n—r1 (iii) in the presence of hydrogen and a supported, metal-containing catalyst, where the catalytically active mass of the catalyst, prior to its reduction with hydrogen, comprises oxygen-containing compounds of aluminum, copper, nickel and cobalt and, in the range from 0.2 to 5.0% by weight, oxygen-containing compounds of tin, calculated as sno, and the reaction is carried out in the liquid phase at an absolute pressure in the range from 95 to 145 bar.. .
| Novel visible-light-responsive photocatalyst with environmental resistance|
The tungsten oxide visible light-responsive semiconductor unstable under an alkaline condition is improved in environmental resistance without losing photocatalytic function thereof by adding thereto at least one element selected from the group consisting of copper, tantalum, niobium, lanthanum, bismuth, calcium, chromium, manganese and zinc. The obtained environmental resistant visible light-responsive photocatalyst is subjected to an alkaline treatment to thereby be improved in photocatalytic activity..
| Method for the production of an lmo product|
A fused product including lithium-manganese spinel, which is optionally doped, having a spinel structure ab2o4, where the site a is occupied by lithium and the site b is occupied by manganese, it being possible for the site b to be doped with an element b′ and it being possible for the site a to exert a substoichiometry or a superstoichiometry with respect to the site b, so that the product observes the formula li(1+x)mn(2−y)b′yo4, with −0.20≦x≦0.4 and 0≦y≦1, the element b′ being chosen from aluminum, cobalt, nickel, chromium, iron, magnesium, titanium, vanadium, copper, zinc, gallium, calcium, niobium, yttrium, barium, silicon, boron, zirconium and their mixtures.. .
| Processes for the manufacture of conductive particle films for lithium ion batteries|
The invention is directed to a process for forming a particle film on a substrate. Preferably, a series of corona guns, staggered to optimize film thickness uniformity, are oriented on both sides of a slowly translating grounded substrate (copper or aluminum for the anode or cathode, respectively).
| Copper-based material and method for producing the same|
A copper-based material includes a base comprising copper and a surface treatment layer disposed on a surface of the base, the surface treatment layer including an amorphous layer containing a metal element that has a greater affinity for oxygen than for copper, oxygen, and, optionally, copper diffused from the base.. .
| Active solder|
An active solder is revealed. The active solder includes an active material and a metal substrate.
| Sliding bearing composite material|
The invention relates to a sliding bearing composite material with a substrate layer made of steel, an intermediate layer which lies on the substrate layer, and a bearing metal layer which lies on the intermediate layer and which is made of an aluminum alloy that is free of lead apart from impurities. The aluminum alloy contains 10.5-14 wt.
| Nutritional compositions including exogenous vitamin k2|
Nutritional composition and methods of making and using the nutritional compositions are provided. In a general embodiment, the present disclosure provides a nutritional composition including exogenous vitamin k2.
| Antimicrobial substance, method for producing same, and antimicrobial material|
Provided an antimicrobial substance that includes a base material layer, and a copper-tin alloy layer 5-200 nm in thickness disposed on the base material layer, the copper-tin alloy layer containing copper in an amount of more than 60 atomic percent but not more than 90 atomic percent, and containing tin in an amount of not less than 10 atomic percent but less than 40 atomic percent. The copper-tin alloy layer includes a cu41sn11 crystalline phase, and a cu3sn crystalline phase.
| Small pore molecular sieve supported copper catalysts durable against lean/rich aging for the reduction of nitrogen oxides|
A method of using a catalyst comprises exposing a catalyst to at least one reactant in a chemical process. The catalyst comprises copper and a small pore molecular sieve having a maximum ring size of eight tetrahedral atoms.
| High-strength copper alloy forging material|
The high-strength copper alloy forging material contains, in mass %, 3 to 7.2% of ni, 0.7 to 1.8% of si, 0.02 to 0.35% of zr and 0.002 to 0.05% of p, and further contains 1.5% or less of one or two or more of cr, mn and zn in total, as needed, whereby appropriate amounts of zr and p act to cause cracks to be less likely to occur in the material during working or heat treatment. After the working and the heat treatment, the forging material of the invention can have properties of high hardness, high strength and high thermal conductivity, and can be suitably used for resin injection mold materials, aircraft components and the like..
| Circuit board and image forming apparatus|
The circuit board includes a contact for supplying power, in which the contact includes plural copper foil patterns each having a predetermined width, the plural copper foil patterns being formed radially from a center of the contact and connected to each other at the center of the contact. Accordingly, it is possible to enhance contact reliability of the contact while suppressing cost for connecting a high-voltage board to an image forming unit..
| Distributed communications system employing free-space-optical link(s), and related components and methods|
Distributed communications systems employing one or more free-space-optics (fso) links, and related components and methods are disclosed. In one embodiment, a distributed communications system is provided in which one or more links of a communications path located between a central unit and a remote unit include fso provided by one or more fso components.
| Optical printed circuit board and method for manufacturing same|
An optical printed circuit board includes a flexible substrate and a flexible optical wave guide. The flexible substrate includes a flexible sheet and a copper layer set on the flexible sheet.
| Connection wire structure of direct light bar and connection method thereof|
The present invention relates to a connection wire structure of a direct light bar and a connection method thereof. The connection wire structure of the direct light bar includes a plurality of light bars and connection wires, and a circuit board.
| Printed circuit board|
A printed circuit board includes a power supply, a plurality of loads, a copper sheet, and a plurality of metal sheets mounted onto the copper sheet. The copper sheet is electronically connected between the power supply and the loads.
| Coupled dual-band dipole antenna with interference cancellation gap, method of manufacture and kits therefor|
A planar dipole antenna for dual-band wi-fi application is disclosed. The antenna has a ground copper and a radiation copper.
| Sensing device, sensing charger and sensing emergency lamp|
A sensing device includes a sensing transmitting module and a sensing receiving module respectively mounted in a first housing and a second housing. And an output terminal of the sensing transmitting module and an input terminal of the sensing receiving module are provided with a sensing coil and an electromagnetic rod respectively, the first housing and the second housings are cooperated with each other, and the electromagnetic rod is inserted into the sensing coil, so that the sensing coil or the electromagnetic rod is placed in magnetic field generated by the electromagnetic rod or the sensing coil thereby generating sensing voltage.
| Hybrid copper interconnect structure and method of fabricating same|
A hybrid interconnect structure containing copper regions that have different impurities levels within a same opening is provided. In one embodiment, the interconnect structure includes a patterned dielectric material having at least one opening located therein.
| Corrosion/etching protection in integration circuit fabrications|
A method of producing reduced corrosion interconnect structures and structures thereby formed. A method of producing microelectronic interconnects having reduced corrosion begins with a damascene structure having a first dielectric and a first interconnect.
| Semiconductor device contact structures|
Semiconductor contact structures extend through a dielectric material and provide contact to multiple different subjacent materials including a silicide material and a non-silicide material such as doped silicon. The contact structures includes a lower composite layer formed using a multi-step ionized metal plasma (imp) deposition operation.
| Wafer-level package and method of manufacturing the same|
A wafer-level package and a method of manufacturing the same. The wafer-level package includes a first semiconductor chip on an upper side of which an active surface facing downward is disposed, a redistribution formed on the active surface of the first semiconductor chip, a second semiconductor chip disposed on the redistribution using a flip-chip bonding (fcp) technique, a copper (cu) post and a first solder ball sequentially disposed on the redistribution, a molding member formed on the active surface of the first semiconductor chip to expose a bottom surface of the first solder ball and an inactive surface of the second semiconductor chip, and a second solder ball disposed on the first solder ball and electrically connected to an external apparatus..
| System and method for forming aluminum fuse for compatibility with copper beol interconnect scheme|
A semiconductor fuse device and a method of fabricating the fuse device including a last metal interconnect layer including at least two discrete metal conductors, an inter-level dielectric layer deposited over the last metal interconnect layer and the at least two discrete metal conductors, a thin wire aluminum fuse connecting the at least two discrete metal conductors, and a fuse opening above the aluminum fuse.. .
| Transparent conductive laminate body and organic thin film device|
A problem is to provide a transparent conductive laminate body that has a low surface resistivity and an organic thin film device using the laminate body, and the problem is solved by a transparent conductive laminate body having a transparent substrate having laminated directly on at least one surface thereof in this order a conductive metal pattern layer and a conductive organic layer having a conductive organic polymer compound, a material for forming the conductive metal pattern layer being at least one metal selected from gold, silver, copper and platinum, or an alloy having the metal, and an organic thin film device using the same.. .
| Electrolytic copper plating solution and method of electrolytic copper plating|
An electrolytic copper plating solution is provided which has an excellent via filling ability without using formaldehyde, which is harmful to the environment. An electrolytic copper plating solution which contains compounds which have an —x—s—y— structure wherein x and y are individually atoms selected from a group comprising hydrogen, carbon, sulfur, nitrogen, and oxygen atoms and x and y can be the same only when they are carbon atoms and specific nitrogen-containing compounds.
| Method for manufacturing target material for copper lead of tft-lcd array substrate and target material|
The present invention relates to a method for manufacturing target material for copper lead of tft-lcd array substrate and a target material. The method includes (1) providing copper powder and a spark plasma activated sintering device; and (2) placing the copper powder in the spark plasma activated sintering device for sintering to obtain a target material for manufacturing copper lead of tft-lcd array substrate.
| Multi-core wire|
A wire that can be used in a wire bonding step in the assembly of a semiconductor device has a first conductive core, a second conductive core surrounding the first conductive core, and a third conductive core surrounding the first second conductive core. The first and third conductive cores are formed of a material such as palladium and the second conductive core is formed of a material such as copper.
| Composite conductive cable comprising nanotubes and nanofibers, coaxial microstructure including a copper matrix and said nanotubes and nanofibers, and method for manufacturing said microstructure|
A conductive composite wire includes at least one external jacket made of copper, a first tube including a first metallic material (m1) contacting and located inside the copper jacket; a second tube including a second metallic material (m2) contacting and located inside the first tube; and a fiber including a third metallic material (m3) contacting and located inside the second tube. The copper and the first metallic material are immiscible with each other, the first and second metallic materials are immiscible with each other, and the second and third metallic materials are immiscible with each other.
| Cooling ring for welding bellows generating less metal powder|
Since the cooling ring includes the body having the circular arc shape including copper and the plating layer plating the body, it is possible to prevent powder of a metal having high electrical conductivity, such as copper, aluminum, gold, and silver, during a welding process.. .
| Cu-zr-based copper alloy plate and process for manufacturing same|
Provided are a cu—zr-based copper alloy plate which retains satisfactory mechanical strength and, at the same time, has a good balance of bending formability and bending elastic limit at a high level and a process for manufacturing the cu—zr-based copper alloy plate. The copper alloy plate contains 0.05% to 0.2% by mass of zr and a remainder including cu and unavoidable impurities, and the average value of kam values measured by an ebsd method using a scanning electron microscope equipped with a backscattered electron diffraction pattern system is 1.5° to 1.8°, the r/t ratio is 0.1 to 0.6 wherein r represents the minimum bending radius which does not cause a crack and t represents the thickness of the plate in a w bending test, and the bending elastic limit is 420 n/mm2 to 520 n/mm2..
| Pressure resistant and corrosion resistant copper alloy, brazed structure, and method of manufacturing brazed structure|
A pressure resistant and corrosion resistant copper alloy contains 73.0 mass % to 79.5 mass % of cu and 2.5 mass % to 4.0 mass % of si with a remainder composed of zn and inevitable impurities, in which the content of cu [cu] mass % and the content of si [si] mass % have a relationship of 62.0≦[cu]−3.6×[si]≦67.5. In addition, the area fraction of the α phase “α”%, the area fraction of a β phase “β”%, the area fraction of a γ phase “γ”%, the area fraction of the κ phase “κ”%, and the area fraction of a μ phase “μ”% satisfy 30≦“α”≦84, 15≦“κ”≦68, “α”+“κ”≧92, 0.2≦“κ”/“α”≦2, “β”≦3, “μ”≦5, “β”+“μ”≦6, 0≦“γ”≦7, and 0≦“β”+“μ”+“γ”≦8.
| Zinc-free spray powder, copper-containing thermal spray layer, as well as method of manufacturing a copper-containing thermal spray layer|
The invention relates to a zinc-free spray powder for thermally coating a substrate, in particular for thermally coating a bearing part of a bearing apparatus, which spray powder has the following composition except for unavoidable contaminants: tin=5% to 30% weight percent; aluminum=0.1% to 5% weight percent; iron=at most 1% weight percent, and copper=difference to 100% weight percent. The invention furthermore relates to a layer system applied via thermal spraying, a work piece, particularly a connecting rod, as well as a spray method for manufacturing a spray layer..
| Method for manufacturing ic substrate|
A method for manufacturing an ic substrate includes following steps: providing a roll of double-sided flexible copper clad laminate; converting the roll of double sided flexible copper clad laminate into a roll of double sided flexible wiring board in a roll to roll manner; cutting the roll of double-sided flexible wiring board into a plurality of separate sheets of double sided flexible wiring board; forming first and second rigid insulating layers on the first and second wiring layers of each sheet of double sided flexible wiring board; forming third and fourth wiring layers on the first and second rigid insulating layers, and electrically connecting the first and third wiring layers, and electrically connecting the fourth and second wiring layers, thereby obtaining a sheet of substrate having a plurality of ic substrate units; and cutting the sheet of substrate into separate ic substrate units.. .
|Process for generating a synthetic natural gas|
A process is described for reducing the thiophene content in a synthesis gas mixture, comprising comprises the steps of (i) passing a synthesis gas mixture comprising hydrogen and carbon oxides and containing thiophene over a copper-containing sorbent disposed in a sorbent vessel at an inlet temperature in the range 200-280 oc, (ii) withdrawing a thiophene depleted synthesis gas containing methanol from the sorbent vessel, and (iii) adjusting the temperature of the methanol-containing thiophene-depleted synthesis gas mixture. The resulting gas mixture may be used for production of chemicals, e.g.
|Syngas fermentation process and medium|
A process for fermenting syngas and a fermentation medium provides high ethanol productivity while removing medium components that were previously thought to be essential. The process is effective for providing a specific sty of at least about 1 g ethanol/(l·day·gram cells).
|Braze compositions, and related devices|
A braze alloy composition for sealing a ceramic component to a metal component in an electrochemical cell is presented. The braze alloy composition includes copper, nickel, and an active metal element.
|Copper substrate for deposition of graphene|
Technologies are presented for growing graphene by chemical vapor deposition (cvd) on a high purity copper surface. The surface may be prepared by deposition of a high purity copper layer on a lower purity copper substrate using deposition processes such as sputtering, evaporation, electroplating, or cvd.
|Halogen-free resin composition|
A halogen-free resin composition includes 100 parts by weight of epoxy resin; 10 to 100 parts by weight of benzoxazine resin; 10 to 100 parts by weight of styrene-maleic anhydride copolymer; and 10 to 90 parts by weight of dicyclopentadiene phenol novolac resin. The halogen-free resin composition features specific ingredients and proportions thereof to attain low dielectric constant (dk), low dielectric dissipation factor, high heat resistance and high non-flammability and produce prepregs or resin film, and is thus applicable to copper clad laminates and printed circuit boards..
|Antibacterial or anti-acne formulations containing usnic acid or an usnate and a metal salt|
An antibacterial or anti-acne formulation suitable for topical or local application to human skin containing (a) either usnic acid or an usnate and (b) a metal salt selected from copper salts, bismuth salts, and mixtures thereof, wherein if the component (a) is an usnate, the components (a) and (b) are not the same compound.. .
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Copper topics: Molybdenum, Nitrous Oxide, Carbon Dioxide, Semiconductor, Conductive Layer, Copper Alloy, Sulfuric Acid, Sodium Hydroxide, Essential Oil, Mineral Oil, Carbon Monoxide, Electronic Device, Epoxy Resin, Copper Clad Laminate, Benzoxazine
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