 Patent Application Title |
Patent App Num. |
Date |
| Manufacture method of buildup circuit board | 20130056362 | 20130307 |  A manufacturing method of a buildup circuit board includes forming a wiring layer on an organic polymer insulating layer by copper electroplating and building up other organic polymer insulating layer on the wiring layer, wherein in a final step of the copper electroplating, a surface of the wiring layer is roughened by copper electroplating and the organic polymer insulating layer is formed directly on the roughened surface of the wiring layer. According to the invention, a specific etching step that is essential for enhancing adhesion between the organic polymer insulating layer and the wiring layer can be omitted and no expensive etching apparatus is necessary, thus being good in economy. In addition, if various types of copper sulfate plating baths containing different types of additives used... | | Electroplating method | 20120255864 | 20121011 |  An electroplating method is capable of reliably embedding via holes with a plated metal such as copper or the like when a substrate with a seed layer of a metal having a greater ionization tendency than hydrogen is electroplated using an acidic plating solution such as a copper sulfate plating solution. The electroplating method including preparing a substrate having via holes covered with a first metal, which has a greater ionization tendency than hydrogen, in a surface thereof, pretreating the substrate by immersing the substrate in a pretreatment solution in which a second metal that is more noble than the first metal or a salt thereof is dissolved, and then electroplating the surface of the substrate to embed the second metal or a third metal in... | | Methods and compositions for managing water quality in a body of water | 20120149574 | 20120614 |  Described are compositions and methods for application to a body of water to manage water quality therein. The compositions and methods involve the use of a combination of aluminum sulfate and copper sulfate formulated for rapid release in the body of water. Simple compositions and facile methods are made available which balance algae control and phosphorous depletion to improve or maintain water quality while not unduly upsetting other chemistries of the body of water.
... | | Preservatives from chitin derivatives | 20120108540 | 20120503 |  The invention comprises a process for producing a chitosan derivative, and a product prepared thereby, by activating chitosan or a chitosan precursor chitin in alcohol that contains water from 0% to maximum of about 30% and preparing derivatives by reacting with a reagent to get derivatives that have various uses including an antimicrobial, or a microbiostatic, or an antitranspirant, or an antifungal, or a fruit preservative properties or as carrier of active molecules or functional groups etc. or a combination thereof. Illustrated derivatives include acid, succinic, enzymatically deacetylated, enzymatically hydrolysed by chitinolysis, sugar, formaldehyde, phosphoric acid, hydrochloric acid and copper sulfate derivatives that are obtained by reaction individually or in a combination of consecutive reactions. A novel class of thermostable proteo-chitinase is also disclosed prepared from... | | Method of roughening rolled copper or copper alloy foil | 20120012463 | 20120119 |  A rolled copper or copper alloy foil having a roughened surface formed of fine copper particles is obtained by subjecting a rolled foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of temperature of 20 to 50° C. and current density of 10 to 100 A/dm2. The foil has reduced craters, which are defects unique to rolled foils having a roughened surface, has high strength, adhesive strength with the resin layer, acid resistance and anti-tin plating solution properties, high peel strength, favorable etching properties and gloss level, and is suitable... | | | | Swinglea glutinosa leaves derived material, alone or in combination with copper sulfate, for control of sour rot grapes and bunch rot grapes | 20100316751 | 20101216 | | The invention of the present application provides a natural material derived from Swinglea glutinosa leaves that alone or in combination with copper sulfate is as good or better than pesticide combinations for controlling Botrytis cinerea bunch rot of grapes, and sour rot of grapes caused by Alternaria sp., Cladosporium sp., Aspergillus sp., Mucor sp., Rhizopus sp., and Penicilium sp. The material derived from Swinglea glutinosa leaves, by itself, has better results than any of the pesticide combinations for controlling both, sour rot and bunch rot. A preparation of the material derived from Swinglea glutinosa leaves in combination with copper sulfate is better than pesticide combinations for sour rot of grapes, and a very good alternative, instead of pesticide combinations, for Botrytis cinerea bunch rot of grapes.
... | | Process for sealing glass containers, glass containers and coating material | 20100272934 | 20101028 | | The top of an opening of a glass container is hot end coated, and then is coated with a coating agent of an aqueous solution containing casein and polyphenol and one or more members selected from copper sulfates, calcium hydroxides, and ferric chlorides. Thereafter, a sealing material, to which a thermoplastic resin is applied, is adhered to the top of the opening of the glass container, whereby the water resistance of the sealing of the glass container becomes excellent irrespective of weathering of glass.
... | | Circuit board and method for manufacturing the same | 20100270057 | 20101028 | | A pattern of the recesses 31 transferred to the substrate-20 side is determined depending on a pattern comprising the protrusions 11 on the mold 10. Thus, a microfabricated high-density circuit pattern formed with metal wirings 32 having arbitrary aspect ratios can be obtained.
... | | Polymerization inhibition method | 20100130766 | 20100527 | | The objective of the present invention is to provide a method for inhibiting polymerization of (meth)acrylic acid and the like. By the method, the generation of deposit in a pipe, which is exclusively used for providing a solution of a dialkyldithiocarbamic acid copper salt to a distillation column and the like, is prevented, and the problems such as the clogging of the pipe and polymerization in the distillation column are solved. The method according to the present invention for inhibiting polymerization of (meth)acrylic acid and/or an ester thereof is characterized in comprising a step of inhibiting polymerization of (meth)acrylic acid and/or the ester thereof by using a solution of a dialkyldithiocarbamic acid copper salt dissolved in an organic solvent, wherein a content amount of copper sulfate... | | Method for coloring solder | 20090280254 | 20091112 | | A method of coloring solder is provided. The method includes providing an aqueous coloring agent solution essentially containing 31-32% wt of copper sulfate, 64-65% wt of water and 3-4% wt of salt and an anti-caking agent, drying a solder seam with a dry cloth to remove excess flux, applying the aqueous coloring agent solution directly onto the solder seam; and wiping away excess amounts of the aqueous coloring agent solution with a second dry cloth.
... | | Particulate wood preservative and method for producing the same | 20090280185 | 20091112 | | A wood preservative includes injectable particles comprising one or more sparingly soluble copper salts. The copper-based particles are sufficiently insoluble so as to not be easily removed by leaching but are sufficiently soluble to exhibit toxicity to primary organisms primarily responsible for the decay of the wood. Exemplary particles contain for example copper hydroxide, basic copper carbonate, copper carbonate, basic copper sulfates including particularly tribasic copper sulfate, basic copper nitrates, copper oxychlorides, copper borates, basic copper borates, and mixtures thereof. The particles typically have a size distribution in which at least 50% of particles have a diameter smaller than 0.25 μm, 0.2 μm, or 0.15 μm. At least about 20% and even more than 75% of the weight of the particles may be composed of the... | | Method for coloring solder | 20090280254 | 20091112 | | A method of coloring solder is provided. The method includes providing an aqueous coloring agent solution essentially containing 31-32% wt of copper sulfate, 64-65% wt of water and 3-4% wt of salt and an anti-caking agent, drying a solder seam with a dry cloth to remove excess flux, applying the aqueous coloring agent solution directly onto the solder seam; and wiping away excess amounts of the aqueous coloring agent solution with a second dry cloth.
... | | Particulate wood preservative and method for producing the same | 20090280185 | 20091112 | | A wood preservative includes injectable particles comprising one or more sparingly soluble copper salts. The copper-based particles are sufficiently insoluble so as to not be easily removed by leaching but are sufficiently soluble to exhibit toxicity to primary organisms primarily responsible for the decay of the wood. Exemplary particles contain for example copper hydroxide, basic copper carbonate, copper carbonate, basic copper sulfates including particularly tribasic copper sulfate, basic copper nitrates, copper oxychlorides, copper borates, basic copper borates, and mixtures thereof. The particles typically have a size distribution in which at least 50% of particles have a diameter smaller than 0.25 μm, 0.2 μm, or 0.15 μm. At least about 20% and even more than 75% of the weight of the particles may be composed of the... | | | | Compositions for cleaning contained bodies of water with metal hydrates | 20090263503 | 20091022 | | Compositions for cleaning, sanitizing and maintaining contained bodies of water such as swimming pools, wading pools, fountains, ornamental ponds, etc. The compositions include pre-determined percentages of hydrates of copper sulfate, zinc sulfate, and aluminum sulfate by weight. The composition uses hydrates of copper, zinc and aluminum sulfates instead of the anhydrous metal salts. The hydrate forms can be mined, transported, processed, mixed and packaged without climate controlled conditions necessary for anhydrous metal salts. Hydrates in the composition can gain additional water molecules or lose attached water molecules during manufacture, processing, transportation or use of the composition, without negatively affecting the physical format of the composition or reducing its effectiveness. The compositions reduce amounts of chlorine and an amount of labor associated with the cleaning, sanitization and... | | Method of obtaining copper from ore | 20090241732 | 20091001 | | A method of obtaining copper from sulfide ore including copper (hereinafter referred to as feedstock) includes: providing feedstock into acid solution, the acid solution including chloride and bromide of one of alkali metal and alkali earth metal, and one of chloride of copper and iron and bromide of copper and iron; leaching monovalent copper and divalent copper from the feedstock with use of oxidizing power of at least one of iron ion and copper ion in the acid solution, with air being blown into the acid solution under an atmospheric pressure at a temperature less than a boiling point of the acid solution; solid-liquid separating the acid solution after the leaching; blowing air into the solution after the solid-liquid separation; oxidizing copper in the solution; coprecipitating... |
| Electrolytic plating solution, electrolytic plating method, and method for manufacturing semiconductor device | 20090236232 | 20090924 | | An electrolytic plating solution includes a polar solvent, copper sulfate dissolved in the polar solvent, an accelerator including a sulfur compound, and a reducing agent having a smaller molecular weight than the accelerator.
... | | Thrush and white line medicinal delivery system | 20090238894 | 20090924 | | An equine medicinal delivery system includes a dental roll impregnated with a medicinal solution for placement in an equine hoof. Another embodiment of an equine medicinal delivery system includes a pledget impregnated with a medicinal solution for placement in an equine hoof. A method of manufacturing an equine medicinal delivery system includes providing copper sulfate powder, combining water with the copper sulfate power to form a solution, and impregnating an applicator device with the solution. A method of manufacturing an equine medicinal delivery system includes providing an applicator device impregnated with a medicinal solution for placement in an equine hoof.
... | | Continuous copper electroplating method | 20090229986 | 20090917 | | Disclosed is a method for a repeated electroplating of a workpiece to be plated as a cathode by using an insoluble anode in a plating vessel accommodating a copper sulfate plating bath, wherein a copper dissolution vessel different from the plating vessel is provided, the plating bath is transferred to the copper dissolution vessel and is returned from the copper dissolution vessel to the plating vessel for circulating the plating bath between the plating vessel and the copper dissolution vessel, copper ion supplying salt is charged into the copper dissolution vessel and dissolved in the plating bath so that copper ions consumed by the plating can be replenished, and the workpiece to be plated is continuously electroplated, characterized in that the plating bath is permitted to... | | Continuous copper electroplating method | 20090229986 | 20090917 | | Disclosed is a method for a repeated electroplating of a workpiece to be plated as a cathode by using an insoluble anode in a plating vessel accommodating a copper sulfate plating bath, wherein a copper dissolution vessel different from the plating vessel is provided, the plating bath is transferred to the copper dissolution vessel and is returned from the copper dissolution vessel to the plating vessel for circulating the plating bath between the plating vessel and the copper dissolution vessel, copper ion supplying salt is charged into the copper dissolution vessel and dissolved in the plating bath so that copper ions consumed by the plating can be replenished, and the workpiece to be plated is continuously electroplated, characterized in that the plating bath is permitted to... | | Use of sub-micron copper salt particles in wood preservation | 20090223408 | 20090910 | | A method for preserving wood by injecting into the wood a slurry having: particles of a sparingly soluble copper salt, copper hydroxide, or both, wherein the weight average diameter d50 of the particles in the slurry is between 0.1 microns and 0.7 microns and the d98 of the particles in the slurry is less than about 1 micron; a dispersant; and water. The dispersant is anionic or a mix of anionic and non-ionic. Advantageously, less than 20% by weight of the particles have a diameter less than 20 nanometers. Useful copper salts include basic copper carbonate, tri-basic copper sulfate, copper oxychloride, basic copper nitrate, basic copper borate, copper borate, basic copper phosphate, or copper silicate. The slurry most preferably includes copper hydroxide particles. The slurry further... | | Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foil | 20090162685 | 20090625 | | Provided is a rolled copper or copper alloy foil having a roughened surface formed of fine copper particles, obtained by subjecting a rolled copper or copper alloy foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of a temperature of 20 to 50° C. and a current density of 10 to 100 A/dm2. The provided rolled copper or copper alloy foil subject to roughening is reduced in craters which are obvious defects unique to rolled copper or copper alloy foils having a roughened surface, has high strength, adhesive strength with... | | Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foil | 20090162685 | 20090625 | | Provided is a rolled copper or copper alloy foil having a roughened surface formed of fine copper particles, obtained by subjecting a rolled copper or copper alloy foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of a temperature of 20 to 50° C. and a current density of 10 to 100 A/dm2. The provided rolled copper or copper alloy foil subject to roughening is reduced in craters which are obvious defects unique to rolled copper or copper alloy foils having a roughened surface, has high strength, adhesive strength with... | | Method of fabricating superconducting wire and superconducting apparatus | 20090137399 | 20090528 | | An object of the present invention is to provide a method of fabricating a superconducting wire that can reduce the fabrication cost and increase the mechanical strength of the superconducting wire, and a superconducting apparatus including a superconducting wire obtained by the method. The present invention provides a method of fabricating a superconducting wire including the steps of forming a superconducting layer on a substrate or an intermediate layer formed on the substrate, forming a silver stabilization layer on the superconducting layer immersing the substrate in a copper sulfate solution after the superconducting layer and the silver stabilization layer are formed thereon, and forming a copper stabilization layer on the silver stabilization layer by electroplating with the copper sulfate solution as a plating bath. A superconducting... | | Particulate wood preservative and method for producing same | 20090123505 | 20090514 | | A wood preservative includes injectable particles comprising one or more sparingly soluble copper salts. The copper-based particles are sufficiently insoluble so as to not be easily removed by leaching but are sufficiently soluble to exhibit toxicity to primary organisms primarily responsible for the decay of the wood. Exemplary particles contain for example copper hydroxide, basic copper carbonate, copper carbonate, basic copper sulfates including particularly tribasic copper sulfate, basic copper nitrates, copper oxychlorides, copper borates, basic copper borates, and mixtures thereof. The particles typically have a size distribution in which at least 50% of particles have a diameter smaller than 0.25 μm, 0.2 μm, or 0.15 μm. At least about 20% and even more than 75% of the weight of the particles may be composed of the... | | Compositions and methods for treatment of diseases of the foot of an animal | 20090110751 | 20090430 | | The present invention is directed to an activator composition comprising copper sulfate, zinc sulfate, sodium chloride, and ammonium sulfate, for the activation of an anti-microbial composition. The resulting activated anti-microbial composition is used for the treatment of an infectious disease of a foot of an animal, particularly for the use of ungulates. Benefits of using the activator composition, either alone or in conjunction with other anti-microbial compositions, include the reduction of copper deposited into the environment from anti-microbial treatments, extended use of an anti-microbial composition, and maintenance of low levels of infectious diseases of the feet of animals.
... | | Manufacture method of buildup circuit board | 20090092749 | 20090409 | | A manufacturing method of a buildup circuit board includes forming a wiring layer on an organic polymer insulating layer by copper electroplating and building up other organic polymer insulating layer on the wiring layer, wherein in a final step of the copper electroplating, a surface of the wiring layer is roughened by copper electroplating and the organic polymer insulating layer is formed directly on the roughened surface of the wiring layer. According to the invention, a specific etching step that is essential for enhancing adhesion between the organic polymer insulating layer and the wiring layer can be omitted and no expensive etching apparatus is necessary, thus being good in economy. In addition, if various types of copper sulfate plating baths containing different types of additives used... | | Electrolytic copper plating process | 20090038952 | 20090212 | | Disclosed herein is an electrolytic copper plating process for electroplating copper on workpieces in a copper sulfate plating bath filled in a plating tank and containing an organic additive while using a soluble anode or insoluble anode as an anode and the workpieces as cathodes, including the steps of, setting a bath current density at not higher than 5 A/L, immersing metal copper in a region of the copper sulfate plating bath, the region being apart from a region between the anode and the cathode and also from regions adjacent the anode and cathode, respectively, such that a neighborhood of the thus-immersed metal copper can be used as an oxidative decomposition region, setting an immersed area of the metal copper at not smaller than 0.001 dm2/L... | | Continuous copper electroplating method | 20090026083 | 20090129 | | A continuous copper electroplating method wherein copper is continuously plated on a workpiece to be placed in a plating vessel accommodating a copper sulfate plating bath containing organic additives by use of a soluble or insoluble anode and a workpiece as a cathode, the method including overflowing the plating bath from the plating vessel in an lo overflow vessel under which the plating bath in the overflow vessel is returned to the plating vessel, providing an oxidative decomposition vessel, and returning a plating bath from the oxidative decomposition vessel through the overflow vessel to the plating vessel to circulate the plating bath between the plating vessel and oxidative decomposition vessel, and metallic copper is immersed in the plating bath in the oxidative decomposition vessel and exposed... | | Use of nonionic surfactants in extractive metallurgy by electrolysis | 20080264799 | 20081030 | | A process for the electrolytic treatment of metal-containing solutions, wherein at least one nonionic surfactant is used in the electrolyte solution, the surfactant reducing the surface tension of the electrolyte solution at a surfactant concentration of 0.2% by weight and a temperature of 24° C. in an aqueous solution with 190 g/l of sulfuric acid and 157 g/l of copper sulfate, which is diluted with water in a ratio of 1:10, by from 20 to 60%, is useful for working up ores or the purification of metals, like copper, chromium, nickel, zinc, gold and silver.
... | | Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board | 20080230263 | 20080925 | | The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in approximately the same plane at the time of manufacturing a multilayer printed circuit board. The electroplating solution of the present invention is characterized by containing 50 to 300 g/L of copper sulfate, 30 to 200 g/L of sulfuric acid, 25 to 90 mg/L of chlorine ion, and 1 to 1000 mg/L of an additive comprising at least a levelling agent and a brightener.
... | | Method for manufacturing printed circuit board | 20080164236 | 20080710 | | An insulating layer made of an insulator film or the like is prepared. Then, a thin metal film and a thin copper film are formed in sequence on the insulating layer. The thin copper film is subsequently laminated with a dry film or the like, and exposed and developed to form a plating resist thereon that have patterns opposite to conductor patterns which are formed in a subsequent step. This is followed by forming conductor patterns made of copper, by electrolytic plating using an electrolytic copper sulfate plating solution, on the surfaces of the thin copper film where the plating resist is not formed. The plating resist is then removed by, for example, stripping. After this, the thin copper film is held at a temperature of... | | Cyanide-free pre-treating solution for electroplating copper coating layer on zinc alloy surface and a pre-treating method thereof | 20080156652 | 20080703 | | A pre-treating solution for electroplating zinc alloy surface contains copper ions, hydroxyl ions, a complexing agent and an additive, wherein the additive is selected from sodium phosphate, sodium hypophosphite, phosphoric acid and dissolvable salts of phosphoric acid. The zinc alloy is dipped in the pre-treating solution and electroplated with a copper coating layer. Then, the zinc alloy is further dipped in a copper sulfate solution for thickening the copper coating layer and lastly coated with an anti-corrosion metal layer. Thereby, zinc alloy has excellent anti-corrosion and anti-wearing efficiency and varnish appearance. Moreover, the pre-treating solution contains no cyanide and thus is low toxic and safe to operator during electroplating and to environment after discharging.
... | | Cyanide-free pre-treating solution for electroplating copper coating layer on magnesium alloy surface and a pre-treating method thereof | 20080156653 | 20080703 | | A pre-treating solution for electroplating magnesium alloy surface contains copper ions, a complexing agent and an additive, wherein the complexing agent is selected from potassium sodium tartrate, potassium tartrate, sodium tartrate, tartaric acid, and dissolvable salts derivative from tartaric acid and the additive is selected from sodium phosphate, sodium hypophosphite, phosphoric acid and dissolvable salts derivative from phosphoric acid or hypophosphite acid. The magnesium alloy is dipped in the pre-treating solution and electroplated with a copper coating layer. Then, the magnesium alloy is further dipped in a copper sulfate solution for thickening the copper coating layer and lastly coated with an anti-corrosion metal layer. Thereby, magnesium alloy has excellent anti-corrosion and anti-wearing efficiency and varnish appearance. Moreover, the pre-treating solution contains no cyanide and thus is... | | Portable test station | 20080149481 | 20080626 | | A portable test station is disclosed in a unitary package that integrates a typical Copper-copper sulfate reference electrode with test apparatus. The electrode is maintained in a state of equilibrium by way of immersion in a liquid environment which prevents the solution contained within the electrode from leaching out of the electrode's porous end. This feature enables extended periods of reliable service not otherwise possible. The liquid environment also serves as a conductive bridge between the electrode's porous end and the installation site's environment. Continuity is achieved by way of an adjustable porous ceramic plug located in the base of the apparatus, which may be manipulated by the user prior to installation, i.e. water is allowed to leech from the apparatus into the environment through the... | | Method of manufacturing semiconductor device | 20080132062 | 20080605 | | To obtain a copper film having satisfactory electrical characteristics with a simple structure, there is provided a method of manufacturing a semiconductor device including the step of forming on a semiconductor substrate a barrier metal film to be a seed film which functions as a cathode when a copper film is formed by electrolytic plating (S10), the step of immersing the barrier metal film in a plating solution containing copper ion in a plating bath for a predetermined length of time with the barrier metal film and an anode being substantially at the same potential (S20), and the step of, after the barrier metal film is immersed in the copper sulfate plating solution for the predetermined length of time, applying voltage between the barrier metal film... | | Method and means for using microwave energy to oxidize sulfidic copper ore into a prescribed oxide-sulfate product | 20080118421 | 20080522 | | The present invention is directed to the microwave treatment of a class of selected metal ores and concentrates, particularly those known as chalcopyrite, in a fluidized bed reactor. The end product is commonly a mixture of copper oxide and copper sulfate, both of which are liquid soluble and directly recoverable by known techniques. The ratio of the oxide-sulfate mixture end product may be controlled by suitable control of microwave parameters.
... | | Plating method, electrically conductive film and light-transmitting electromagnetic wave shielding film | 20080096044 | 20080424 | | A plating method comprising: continuously electroplating a film having a surface resistance of 1 to 1,000 ohms per square, wherein a plating solution has a copper content of 150 to 300 g/l as expressed by weight of copper sulfate pentahydrate.
... | | Use of menadione | 20080039320 | 20080214 | | The use of menadione or one of its plant-compatible acid addition salts for enhancing the activity of agrochemicals against phytopathogenic fungi, mixtures of menadione and at least one active compound selected from the following groups: A) azoles, such as cyproconazole, difenoconazole, epoxiconazole, fluquinconazole, flusilazole, hexaconazole, imazalil, metconazole, myclobutanil, penconazole, prochloraz, prothioconazole, tebuconazole, triadimefon, triadimenol, triflumizole; B) strobilurins, such as azoxystrobin, dimoxystrobin, fluoxastrobin, kresoxim-methyl, metominostrobin, orysastrobin, picoxystrobin, pyraclostrobin or trifloxystrobin; C) acylalanines, such as benalaxyl, metalaxyl, mefenoxam, ofurace, oxadixyl; D) amine derivatives, such as spiroxamine; E) anilinopyrimidines, such as pyrimethanil, mepanipyrim or cyprodinil; F) dicarboximides, such as iprodione, procymidone, vinclozolin; G) cinnamides and analogs, such as dimethomorph, flumetover or flumorph; H) dithiocarbamates, such as ferbam, nabam, maneb, metam, metiram, propineb, polycarbamate, thiram, ziram, zineb; I) heterocylic compounds,... | | Composition and method for cleaning contained bodies of water | 20080000838 | 20080103 | | A composition and method for cleaning, sanitizing and maintaining contained bodies of water such as swimming pools, wading pools, fountains, ornamental ponds, etc. The composition includes pre-determined percentages of copper sulfate, zinc sulfate, and aluminum sulfate by weight. The composition and method reduce amounts of chlorine and an amount of labor associated with the cleaning, sanitization and maintenance of contained bodies of water.
... | | Thrush and white line medicinal delivery system | 20070295517 | 20071227 | | An equine medicinal delivery system includes a dental roll impregnated with a medicinal solution for placement in an equine hoof. Another embodiment of an equine medicinal delivery system includes a pledget impregnated with a medicinal solution for placement in an equine hoof. A method of manufacturing an equine medicinal delivery system includes providing copper sulfate powder, combining water with the copper sulfate power to form a solution, and impregnating an applicator device with the solution. A method of manufacturing an equine medicinal delivery system includes providing an applicator device impregnated with a medicinal solution for placement in an equine hoof.
... | | Surface treated electrodeposited copper foil, the production method and circuit board | 20070287020 | 20071213 | | To provide a surface treated electrodeposited copper foil having a smooth M surface with less asperity on the surface instead of an S surface affected by stripes transferred from a surface drum; a surface treatment is performed on the M surface being an opposite surface of a surface which contacted with a drum in an electrodeposited copper foil, wherein Rz is 1.0 μm or smaller and Ra is 0.2 μm or smaller on the M surface, electrodeposited copper plating is performed to produce a copper foil under a condition of using a copper sulfate bath, wherein a copper concentration is 50 to 80 g/l, a sulfuric acid concentration is 30 to 70 g/l, a solution temperature is 35 to 45° C., a chloride concentration is 0.01... | | Direct synthesis of copper carbonate | 20070269362 | 20071122 | | A basic copper salt selected from basic copper carbonate, basic copper sulfate, basic copper acetate, basic copper citrate, and basic copper nitrate is manufactured by contacting copper metal with an aqueous solution having ammonia; an acid selected from carbonic acid, sulfuric acid, acetic acid, nitric acid, or citric acid; and oxygen, under conditions where the copper metal is converted to the basic copper salt; and then recovering the basic copper salt. The most economical embodiment is where the ammonia is present in the aqueous solution is in an amount between about 6.7 g/l and about 15 g/l calculated as NH3, and the pH of the composition is between 8 and 10, and the temperature of the composition is between 25° C. and 100° C. The method... | | Method for producing a composite copper wire | 20070193884 | 20070823 | | The present discloses a method for producing a composite copper wire including the steps of passing an aluminum wire through an electroplating device and removing an oxidized film on the surface of the aluminum wire in deoxidized water by a rotary knife; plating a copper coat onto the aluminum wire by sequentially passing through a tank containing a copper phosphate solution and a tank containing a copper sulfate solution to produce a copper plating aluminum wire; preparing a casting furnace comprising a primary furnace and a plurality of secondary furnaces extended from the primary furnace and passing the aluminum wire vertically through the secondary furnaces, such that the copper solutions are attached on the copper plating aluminum wire according to a predetermined thickness to produce a... | | Electro-chemical mechanical planarization pad with uniform polish performance | 20070131564 | 20070614 | | A polishing pad includes at least one conductive polishing element supported by a compressible under layer having conductive patterning therein, the conductive patterning adapted to permit coupling of a potential to the conductive polishing element; a guide plate above the compressible under layer, the guide plate having a hole through which the polishing element passes and further having a cathodic element connected thereto; and a slurry distribution layer adhered to the guide plate opposite the compressible under layer. The polishing pad may further include a proton exchange membrane placed over the cathodic element. A semiconductor wafer having a metal film thereon may be polished using the polishing pad by placing the wafer in contact with the polishing element, applying anodic current to the polishing element and... | | High purity copper sulfate and method for production thereof | 20070053828 | 20070308 | | Provided are high purity copper sulfate wherein the content of Ag impurities is 1 wtppm or less, and having a purity of 99.99 wt % or higher, and a manufacturing method of high purity copper sulfate including the steps of dissolving crude copper sulfate crystals or copper metal, and subjecting this to active carbon treatment or solvent extraction and active carbon treatment in order to realize recrystallization. The present invention aims to provide a manufacturing method of high purity copper sulfate capable of efficiently removing impurities at a low cost by dissolving commercially available copper sulfate crystals in purified water or acid and thereafter subjecting this to the refining process, and high purity copper sulfate obtained thereby.
... | | Method for recycling sludge during waste-water treatment | 20060278583 | 20061214 | | A method for recycling sludge during waste-water treatment firstly utilizes a process of chemical coagulation to produce sludge rich in copper ions. The sludge is then leached in a sulfuric acid storage tank with sulfuric acid of concentration 1-2N, whereby a extractive solution with copper enrichment 18-39 g/L and residues can be obtained. The extractive solution is then processed in a refrigeration crystallization tank to form copper sulfate crystals. Further, the residues produced are added into the coagulation tank as a coagulant in the process of chemical coagulation for wastewater treatment, thereby achieving a goal of zero sludge production.
... | | Multiple chemistry electrochemical plating method | 20060266655 | 20061130 | | Embodiments of the invention generally include a method and intermediate plating solution for plating metal onto a substrate surface. The method generally includes filling the features and/or growing a film layer on the field areas by plating a metal from a first solution on a seed layer under an applied first current, wherein the first solution includes an acid in an amount sufficient to provide a first solution pH of about 6 or less, copper ions, and at least one suppressor. The method may further include substantially filling features by plating metal ions from a second solution onto the substrate under an applied second current to form a metal layer, wherein the second solution includes an acid in an amount sufficient to provide a second solution... | | Low surface roughness electrolytic copper foil and process for producing the same | 20060210823 | 20060921 | | An electrodeposited copper foil with low surface roughness having a surface roughness Rz not higher than 2.5 μm and an elongation percentage not smaller than 6% at 180° C. in which tensile strength at 25° C. measured within 20 min of the point in time of ending electrodeposition is not higher than 500 MPa and the lowering rate of tensile strength at 25° C. measured within 300 min of the point in time of ending electrodeposition is not higher than 10%. The electrodeposited copper foil with low surface roughness is produced by a process employing aqueous solution of sulfuric acid-copper sulfate as electrolyte and conducting a DC current between an insoluble anode of titanium coated with a platinum metal element or its oxide element and a... | | Regeneration of cupric etchants and recovery of copper sulfate | 20060196761 | 20060907 | | Spent, acidic solutions comprising cupric chloride and hyrdrochloric acid from the copper etching process are regenerated by a process in which the acid is subjected to distillation with sulfuric acid. In one embodiment, the process comprises (a) providing a spent etchant comprising at least about 10% by weight chloride and at least about 5% dissolved copper; (b) adding at least about 2 moles of sulfuric acid per mole of dissolved copper to the spent etching solution, thereby converting copper chloride into hydrochloric acid and precipitated copper sulfate; (c) distilling the mixture from step (b) to vaporize at least a portion of the hydrochloric acid; (d) condensing at least a portion of the vaporized hydrochloric acid; (e) separating at least a portion of the precipitated copper sulfate... | | Electrolytic copper foil with low roughness surface and process for producing the same | 20060191798 | 20060831 | | An electrolytic copper foil with low roughness surface whose surface roughness (Rz) is 2.0 μm or less, the surface uniformly provided with low roughness without uneven surge, which electrolytic copper foil exhibits a percent elongation of 10.0% or higher at 180° C. This electrolytic copper foil with low roughness surface can be obtained by a process for producing an electrolytic copper foil, comprising passing a direct current between an insoluble anode consisting of a titanium plate coated with a Platinum Group element or oxide thereof and a titanium drum as a cathode counter to the anode in an electrolyte of an aqueous solution of sulfuric acid/copper sulfate, wherein the electrolyte contains an oxyethylene surfactant a polyethyleneimine or derivative thereof, a sulfonate of active organosulfer compound and... | | Wood preservative | 20060189497 | 20060824 | | A wood preservative composition for treating wood to impart biocide and antimicrobial characteristics to wood contains a mixture of one or more cleaning members containing quaternary salts, an aromatic quaternary salt, a copper sulfate, a glycol ether and a chelator, mixed with water. The preferred active members are tetradecyltrimethylammonium bromide, tetrasodium ethylenediaminetetraacetic acid, benzethonium hydrochloride, copper sulfate pentahydrate and 2-butoxyethanol. The chelator is tetrasodium salt ethylenediamine of tetraacetic acid (EDTA).
... | | Liquid detection end effector sensor and method of using the same | 20060169977 | 20060803 | | Liquid detection sensors are attached to both sides of a robotic arm end effector of a semiconductor wafer process system. The sensor mechanism or probe is situated on the front side and backside of the end effector, designed with electrical lines that are traced onto a polyester base material. The electrical lines are positioned in a serpentine formation. The high conductance of the sulfuric acid in the copper sulfate solution acts as the conductor between the traced lines. When the conductive liquid comes in contact with the traced lines, the lines short and the sensor activates or turns on.
... | | Production of benzyllithium, benzylsodium, and polyphenylene paradimethylene | 20060170118 | 20060803 | | A process for producing benzyllithium, benzylsodium and polyphenylene paradimethylene and analogs comprising dissolving toluene in an aprotic polar solvent in which toluene is more acidic than water, such as DMSO, under an inert atmosphere, such as argon, adding an alkali metal hydroxide, such as lithium or sodium hydroxide, to form the alkali metal anion of the benzyl cation and water then removing the solvent and water to obtain the solid alkali metal alpha-carbon toluene compound, which is best stored under hexane. This process also relating to toluene analogs such as parachloro toluene which thereby yields parachloro alkali metal alpha-carbon toluene which is then polymerized by heating with a suitable high-boiling solvent, such as dibutyl ether or dimethoxy ethane in the presence of a copper catalyst, such... | | Process for preparing copper oxide-coated antibacterial material | 20060172013 | 20060803 | | Disclosed herein is an antibacterial material exhibiting constant, stable, and potent antibacterial, bactericidal and antifungal effects by formation of uniform, hard and thin film-like copper oxide coatings on surfaces of inoxidizable natural materials including mineral materials such as ceramics, glass, stone, tile, pumice and sand, to which a plating method is not easily applicable, or of ceramic products and titanium products, and a process for preparing a copper oxide-coated antibacterial material, comprising dissolving less than or equal to 10% by weight of inorganic copper salt powder or copper sulfate hydrate powder in a polar solvent, in relation to the weight of the polar solvent, so as to prepare a copper ion mixed solution, dipping a target material in the mixed solution, and sintering the target material... | | Fungicidal compositions | 20060159772 | 20060720 | | Fungicidal compositions are described, consisting of mixtures comprising salts of an alkaline or alkaline-earth metal, Mn or Zn of phosphorous acid and at least a second component selected from compounds having an antifungal activity. The component having an antifungal activity can be selected, for example, from IR5885, IR6141, copper (1) or copper (11) salts (such as copper oxychloride, copper hydroxide, tribasic copper sulfate), dithiocarbamates (such as mancozeb, zineb, propineb), folpet.
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