Copper Sulfate patents

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Date/App#	List of recent Copper Sulfate-related patents
02/13/14 20140045061	Electrolysis copper-alloy foil, method of the same, electrolytic-solution using the production, negative electrode aggregation used the same, secondary battery, and electrode of the same The invention relates to an electrolytic copper alloy foil having large mechanical strength in an ordinary state and showing resistant to heat deterioration even when it is heated to 300° c. Or more.
02/13/14 20140041430	Pelletized fertilizer and method for manufacturing the same A method for manufacturing a pelletized fertilizer includes the following steps. A water-soluble manure and a colloidal solution are mixed, to form an aqueous solution of a fertilizer, wherein the water-soluble manure is selected from the group consisting of monopotassium phosphate, epsomite, manganous sulfite, boric acid, borax, copper sulfate pentahydrate, white vitriol, ammonium molybdate, urea, ferric ethylenediaminetetraacetic acid and potassium nitrate, the colloidal solution is selected from the group consisting of agar, xanthan gum, shellac, guar gum, natto gum, pectin, synthetic hydrogel and plga, and the weight percentage of the colloidal solution in the aqueous solution of the fertilizer is between 1.5 and 15%.
10/24/13 20130280383	Electrolyte fortifying composition for recharge, a hydrating supplement, and process for preparing the same Nutrient fortifying composition for food products and electrolyte fortifying composition for recharge comprising calcium chloride, magnesium chloride, potassium bicarbonate, acidity regulator, copper sulphate; and class ii preservative. A hydration supplement and a fortified water beverage to supplement the deficiencies of chromium and boron in humans.
09/05/13 20130230575	Particulate wood preservative and method for producing the same A wood preservative includes injectable particles comprising one or more sparingly soluble copper salts. The copper-based particles are sufficiently insoluble so as to not be easily removed by leaching but are sufficiently soluble to exhibit toxicity to primary organisms primarily responsible for the decay of the wood.
07/25/13 20130189538	Method of manufacturing copper foil for printed wiring board, and copper foil printed wiring board A method of manufacturing a copper foil for a printed wiring board, characterized in that a roughened layer of roughening copper grains is formed on at least one surface of the copper foil by using an electrolytic bath of sulfuric acid and copper sulfate, and the electrolytic bath contains tungsten ions and/or arsenic ions and further contains an alkyl sulfate-based anionic surfactant. The object of the present invention is to provide a method of manufacturing a copper foil for a printed wiring board, wherein in particular a roughened layer on the copper foil can be improved to enhance the adhesive strength between the copper foil and a resin substrate without deteriorating other properties of the copper foil..
07/11/13 20130178474	Water treatment composition containing halogen-releasing compound and fluoropolymer The present invention is directed to a water treatment composition, containing 50-99.9 wt. % of particulate halogen-releasing compound; and 0.1-10 wt.
06/27/13 20130164362	Particulate wood preservative and method for producing same A wood preservative includes injectable particles comprising one or more sparingly soluble copper salts. The copper-based particles are sufficiently insoluble so as to not be easily removed by leaching but are sufficiently soluble to exhibit toxicity to primary organisms primarily responsible for the decay of the wood.
06/20/13 20130156631	Method of removing oxide film on surface of copper or copper-base alloy and copper or copper-base alloy recovered using the method A pickling solution, including: 50 g/l to 400 g/l of sulfuric acid; 1 g/l to 100 g/l of at least one oxidant selected from a group consisting of nitric acid, hydrogen peroxide, peroxodisulfate ions, and iron (iii) ions; 0.01 g/l to 10 g/l of at least one additive selected from a group consisting of aromatic sulfonic acid, aromatic sulfonate, alkylamine, aromatic carboxylic acid, and aromatic carboxylate; 0.005 g/l to 10 g/l of at least one surfactant selected from a group consisting of alkylbenzene sulfonic acid and alkylbenzene sulfonate; and 10 g/l to 300 g/l of copper sulfate, is used to remove oxide film, and then reused by being electrolyzed and adding the oxidant, the additive and the surfactant in amounts equivalent to consumed amounts.. .
05/30/13 20130136821	Deer attractant and nutrient The embodiments of the deer attractant and nutrient is a deer attractant and feed comprising rice hulls; calcium carbonate; manganese; copper sulfate; zinc sulfate; trace amounts of cobalt carbonate; eddi; mono dical; selenium; and power sweet. Because of the balanced nutritional components of the deer attractant and nutrient the product enhances overall deer growth including antler growth in bucks.
04/18/13 20130092548	Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boards The present invention relates to a manufacturing method for a fine grain surface copper foil with the low roughness, high peeling strength, high chemical resistance, high heat resistance, high resistance to moisture absorption and good etching properties, and applicable to all kinds of printed circuit boards. The technical characteristics are that the adhesion surface of copper foil is electroplated in an electroplating bath composed of copper sulfate, sulfuric acid, tungsten compounds to obtain a roughening treatment layer which is then treated with a electroplating copper foil method for anti-rust and thermoresistance known to the art to get a zn alloy thermoresistant layer..
03/07/13 20130056362	Manufacture method of buildup circuit board A manufacturing method of a buildup circuit board includes forming a wiring layer on an organic polymer insulating layer by copper electroplating and building up other organic polymer insulating layer on the wiring layer, wherein in a final step of the copper electroplating, a surface of the wiring layer is roughened by copper electroplating and the organic polymer insulating layer is formed directly on the roughened surface of the wiring layer. According to the invention, a specific etching step that is essential for enhancing adhesion between the organic polymer insulating layer and the wiring layer can be omitted and no expensive etching apparatus is necessary, thus being good in economy.

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