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 Cosmetic formulation and device for the treatment of deep wrinkles of the skin by means of iontophoresisThe formulation can additionally include one or more other ingredients for the treatment of other disorders, including: magnesium ascorbyl phosphate (map), lipoic acid, carnitine, ellagic acid, magnesium ascorbyl phosphate (map), vitamin k oxide, kojic acid dipaimitate, phytic acid, copper sulfate, zinc sulfate, glycolic acid, salicylic acid and potassium azeloyl diglycinate.. . |
 Pipe fitting adhesive compound with vegetation deterring propertiesAn adhesive used in underground applications where vegetation is present wherein the adhesive has been doped with a material or materials that deter the growth properties of adjacent vegetation. The materials can include zinc, copper sulfate, copper oxide, as well as sulfates of zinc, manganese, and nickel, in quantities that will repel or deter the advancement of roots and invasive vegetation into fittings and joints in an underground system. T. Christy Enterprises, Inc. |
 Surface anti-fouling structure, composition, and methodAn article surface anti-fouling structure, composition, and method includes a surface structure for encapsulating an article from an external environment, the structure having anti fouling properties protecting the article from the external environment. Also, a composition for applying to the surface of the article for the anti-fouling surface treatment of the article, the composition including copper sulfate, sulfuric acid, hydrochloric acid, umicore 836 brightener 1, umicore 836 leveler 1, and distilled water. |
 Plating methodA method of plating a substrate, such as a wafer, by applying a voltage between the substrate and an anode is disclosed. The plating method includes: preparing a substrate having a recess formed in a surface thereof, a conductive layer being formed in at least a part of the recess; placing an insoluble anode and the substrate in contact with a copper sulfate plating solution containing an additive; applying a predetermined plating voltage between the substrate and the insoluble anode by a plating power source to plate the substrate; and shutting off a reverse electric current, which flows from the insoluble anode to the substrate via the plating power source, by a diode disposed between the insoluble anode and the substrate when the predetermined plating voltage is not applied.. Ebara Corporation |
 Method of producing hydrogen gas from waterA method for producing hydrogen gas from distilled water or sea water. The method includes providing a housing with a volume of distilled water, adding sulfuric acid or copper sulfate to the distilled water, running a current between a cathode and an anode via an electrical connection disposed within the electrolyte chamber, and collecting the hydrogen gas that rises to the top of the housing. |
 Plastic molded product comprising copper-based compound microparticles and preparation method thereforMolded plastic products having fine particles of copper-based compound with relatively low price, simple process and good economic feasibility and productivity, and method of manufacturing the products are provided. A chemical structure of the molded plastic products is cuxmy, wherein m is any one selected from groups 15 to 17 of the periodic table, x/y is 0.5-1.5. Bs Support Co., Ltd. |
 Thrush treatment pasteA composition for treating hoof thrush and similar ailments in horses is composed of a blend of copper sulfate dispersed in a viscous carrier. The copper sulfate may be anywhere between about 20 percent to 70 about percent by weight of the final product. |
 Particulate wood preservative and producing the sameA wood preservative includes injectable particles comprising one or more sparingly soluble copper salts. The copper-based particles are sufficiently insoluble so as to not be easily removed by leaching but are sufficiently soluble to exhibit toxicity to primary organisms primarily responsible for the decay of the wood. Koppers Performance Chemicals Inc. |
 Particulate wood preservative and producing sameA wood preservative includes injectable particles comprising one or more sparingly soluble copper salts. The copper-based particles are sufficiently insoluble so as to not be easily removed by leaching but are sufficiently soluble to exhibit toxicity to primary organisms primarily responsible for the decay of the wood. Osmose, Inc. |
 Antimicrobial packaging materialA packaging material includes an antimicrobial agent adhered to a substrate. The antimicrobial agent can include copper, and the packaging material can include cellulose. Graphic Packaging International, Inc. |
There is a need to protect the health of hummingbirds by preventing the rapid microbial spoiling of sugar nectar used in hummingbird feeders, without using artificial preservatives. The invention is a method, composition and kit, for naturally preventing spoilage of sugar nectar liquid food by using a transition metal salt, an optional acidifying agent, and an optional functional additive. |
Wine additives for improving the taste, aroma and quality of wine The present invention provides compositions and methods of using these compositions to improve the taste, aroma and quality of wine. The compositions are aqueous solutions containing gelatin having a concentration of about 45 g/l to about 55 g/l, gum arabic having a concentration of about 92 g/l to about 112 g/l and copper sulfate having a concentration of about 0.014 g/l to about 0.018 g/l or ascorbic acid having a concentration of about 223 g/l to about 273 g/l and gum arabic having a concentration of about 46 g/l to about 56 g/l or gelatin having a concentration of 42 g/l to about 52 g/l, gum arabic having a concentration of about 86 g/l to about 106 g/l, ascorbic acid having a concentration of about 9.9 g/l to about 11 g/l and potassium metabisulfite having a concentration of about 12 g/l to about 15 g/l. |
A controlled release copper sulfate algaecide for controlling phytoplankton growth, including blue green algae is described. The controlled release algaecide includes a copper sulfate granule coated with at least one layer including a polyurethane which is a reaction product of a polymeric diisocyanate and a polyol.. |
The present invention provides an electrodeposited copper foil having a tensile strength of at least 300 mpa and elongation rate of at least 3.0% after heat treatment at 350° c. For 1 hour and provides a copper foil which prevents the breakage of a current collector (copper foil) while maintaining adhesiveness between the current collector (copper foil) and the active material in response to substantial expansion and contraction of a si or sn alloy-based active material. |
A composition for treating hoof thrush and similar ailments in horses is composed of a blend of copper sulfate and chlorhexidine dispersed in a viscous carrier. Preferably, the copper sulfate makes up 20 to 45 percent by weight of the final product and the chlorhexidine compound accounts for 1 to 5 percent by weight. |
A cu-amine complex of hydrated copper sulfate and ethylene diamine or an oligomer of ethylene diamine is employed in a direct (one-pot) synthesis of a copper-cation containing silicoaluminophosphate (sapo) zeolite material having the cu/sapo-34 structure. The copper-amine complex is included in an aqueous gel of precursors of the sio2, al2o3, and p2o5 constituents, which are mixed, aged, and thermally treated to form the desired cu/sapo-34 structure. |
The invention relates to an electrolytic copper alloy foil having large mechanical strength in an ordinary state and showing resistant to heat deterioration even when it is heated to 300° c. Or more. |
A method for manufacturing a pelletized fertilizer includes the following steps. A water-soluble manure and a colloidal solution are mixed, to form an aqueous solution of a fertilizer, wherein the water-soluble manure is selected from the group consisting of monopotassium phosphate, epsomite, manganous sulfite, boric acid, borax, copper sulfate pentahydrate, white vitriol, ammonium molybdate, urea, ferric ethylenediaminetetraacetic acid and potassium nitrate, the colloidal solution is selected from the group consisting of agar, xanthan gum, shellac, guar gum, natto gum, pectin, synthetic hydrogel and plga, and the weight percentage of the colloidal solution in the aqueous solution of the fertilizer is between 1.5 and 15%. |
Nutrient fortifying composition for food products and electrolyte fortifying composition for recharge comprising calcium chloride, magnesium chloride, potassium bicarbonate, acidity regulator, copper sulphate; and class ii preservative. A hydration supplement and a fortified water beverage to supplement the deficiencies of chromium and boron in humans. |
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A wood preservative includes injectable particles comprising one or more sparingly soluble copper salts. The copper-based particles are sufficiently insoluble so as to not be easily removed by leaching but are sufficiently soluble to exhibit toxicity to primary organisms primarily responsible for the decay of the wood. |
Method of manufacturing copper foil for printed wiring board, and copper foil printed wiring board A method of manufacturing a copper foil for a printed wiring board, characterized in that a roughened layer of roughening copper grains is formed on at least one surface of the copper foil by using an electrolytic bath of sulfuric acid and copper sulfate, and the electrolytic bath contains tungsten ions and/or arsenic ions and further contains an alkyl sulfate-based anionic surfactant. The object of the present invention is to provide a method of manufacturing a copper foil for a printed wiring board, wherein in particular a roughened layer on the copper foil can be improved to enhance the adhesive strength between the copper foil and a resin substrate without deteriorating other properties of the copper foil.. |
Water treatment composition containing halogen-releasing compound and fluoropolymer The present invention is directed to a water treatment composition, containing 50-99.9 wt. % of particulate halogen-releasing compound; and 0.1-10 wt. |
A wood preservative includes injectable particles comprising one or more sparingly soluble copper salts. The copper-based particles are sufficiently insoluble so as to not be easily removed by leaching but are sufficiently soluble to exhibit toxicity to primary organisms primarily responsible for the decay of the wood. |
A pickling solution, including: 50 g/l to 400 g/l of sulfuric acid; 1 g/l to 100 g/l of at least one oxidant selected from a group consisting of nitric acid, hydrogen peroxide, peroxodisulfate ions, and iron (iii) ions; 0.01 g/l to 10 g/l of at least one additive selected from a group consisting of aromatic sulfonic acid, aromatic sulfonate, alkylamine, aromatic carboxylic acid, and aromatic carboxylate; 0.005 g/l to 10 g/l of at least one surfactant selected from a group consisting of alkylbenzene sulfonic acid and alkylbenzene sulfonate; and 10 g/l to 300 g/l of copper sulfate, is used to remove oxide film, and then reused by being electrolyzed and adding the oxidant, the additive and the surfactant in amounts equivalent to consumed amounts.. . |
The embodiments of the deer attractant and nutrient is a deer attractant and feed comprising rice hulls; calcium carbonate; manganese; copper sulfate; zinc sulfate; trace amounts of cobalt carbonate; eddi; mono dical; selenium; and power sweet. Because of the balanced nutritional components of the deer attractant and nutrient the product enhances overall deer growth including antler growth in bucks. |
The present invention relates to a manufacturing method for a fine grain surface copper foil with the low roughness, high peeling strength, high chemical resistance, high heat resistance, high resistance to moisture absorption and good etching properties, and applicable to all kinds of printed circuit boards. The technical characteristics are that the adhesion surface of copper foil is electroplated in an electroplating bath composed of copper sulfate, sulfuric acid, tungsten compounds to obtain a roughening treatment layer which is then treated with a electroplating copper foil method for anti-rust and thermoresistance known to the art to get a zn alloy thermoresistant layer.. |
A manufacturing method of a buildup circuit board includes forming a wiring layer on an organic polymer insulating layer by copper electroplating and building up other organic polymer insulating layer on the wiring layer, wherein in a final step of the copper electroplating, a surface of the wiring layer is roughened by copper electroplating and the organic polymer insulating layer is formed directly on the roughened surface of the wiring layer. According to the invention, a specific etching step that is essential for enhancing adhesion between the organic polymer insulating layer and the wiring layer can be omitted and no expensive etching apparatus is necessary, thus being good in economy. |
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