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Conductive Layer patents



      
           
This page is updated frequently with new Conductive Layer-related patent applications. Subscribe to the Conductive Layer RSS feed to automatically get the update: related Conductive RSS feeds. RSS updates for this page: Conductive Layer RSS RSS


Methods for fabricating semiconductor devices having through electrodes

Method of semiconductor integrated circuit fabrication

Semiconductor devices and methods of manufacture thereof

Date/App# patent app List of recent Conductive Layer-related patents
08/21/14
20140235183
 Interposer package structure for wireless communication element, thermal enhancement, and emi shielding patent thumbnailInterposer package structure for wireless communication element, thermal enhancement, and emi shielding
Embodiments of provide an integrated circuit (ic) device. The ic device can include a substrate having first and second opposing surfaces, an ic die electrically coupled to the first surface of the substrate, a plurality of contact members coupled to the first surface of the substrate, and an interposer.
08/21/14
20140235052
 Methods for fabricating semiconductor devices having through electrodes patent thumbnailMethods for fabricating semiconductor devices having through electrodes
Methods for fabricating semiconductor devices having through electrodes are provided. The method may comprise forming a via hole which opens towards an upper surface of a substrate and disconnects with a lower surface of the substrate; forming a via isolation layer which extends along an inner surface of the via hole and covers the upper surface of the substrate; forming a seed layer on the via isolation layer which extends along the via isolation layer; annealing the seed layer in-situ after forming the seed layer; forming a conductive layer, filling the via hole, by an electroplating using the seed layer; and planarizing the upper surface of the substrate to form a through electrode surrounded by the via isolation layer in the via hole..
08/21/14
20140235050
 Method of semiconductor integrated circuit fabrication patent thumbnailMethod of semiconductor integrated circuit fabrication
A method of fabricating a semiconductor integrated circuit (ic) is disclosed. The method includes providing a substrate and depositing a conductive layer on the substrate.
08/21/14
20140235049
 Semiconductor devices and methods of manufacture thereof patent thumbnailSemiconductor devices and methods of manufacture thereof
Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes providing a workpiece including a conductive feature formed in a first insulating material and a second insulating material disposed over the first insulating material.
08/21/14
20140234026
 Asphaltene based photovoltaic devices patent thumbnailAsphaltene based photovoltaic devices
Photovoltaic devices and methods of making the same, are disclosed herein. The cell comprises a photovoltaic device that comprises a first electrically conductive layer comprising a photo-sensitized electrode; at least one photoelectrochemical layer comprising metal-oxide particles, an electrolyte solution comprising at least one asphaltene fraction, wherein the metal-oxide particles are optionally dispersed in a surfactant; and a second electrically conductive layer comprising a counter-electrode, wherein the second electrically conductive layer comprises one or more conductive elements comprising carbon, graphite, soot, carbon allotropes or any combinations thereof..
08/21/14
20140233199
 Component built-in board and method of manufacturing the same, and mounting body patent thumbnailComponent built-in board and method of manufacturing the same, and mounting body
A component built-in board of multi-layer structure that has a plurality of unit boards stacked therein and is configured having a plurality of electronic components built in thereto in a stacking direction, wherein the plurality of unit boards include: a double-sided board that includes a first insulating layer, a first wiring layer formed on both surfaces of the first insulating layer, and a first interlayer conductive layer that penetrates the first insulating layer and is connected to the first wiring layer, and that comprises an opening in which the electronic component is housed; and an intermediate board that includes a second insulating layer, a first adhesive layer provided on both surfaces of the second insulating layer, and a second interlayer conductive layer that penetrates the second insulating layer along with the first adhesive layer, and the double-sided board is disposed above and below the intermediate board.. .
08/21/14
20140233165
 Flex circuit patent thumbnailFlex circuit
A flex circuit including a plurality of layers folded on a first fold line and folded on a second fold line is disclosed. The plurality of layers may include a first conductive layer, an insulating layer adjacent the first conductive layer, and a second conductive layer adjacent the insulating layer.
08/21/14
20140232762
 Organic light emitting display device, driving method thereof, and manufacturing method thereof patent thumbnailOrganic light emitting display device, driving method thereof, and manufacturing method thereof
An organic light emitting diode (oled) display with improved long range uniformity, driving method and manufacturing method are disclosed. The oled display manufacturing method includes forming a first active pattern on a substrate, a gate insulating layer, a gate electrode overlapping at least a part of the first active pattern on the gate insulating layer and an interlayer insulating layer.
08/21/14
20140232604
 Mobile wireless communications device with electrically conductive continuous ring and related methods patent thumbnailMobile wireless communications device with electrically conductive continuous ring and related methods
A mobile wireless communications device may include a portable housing that may include an electrically conductive continuous ring defining a perimeter of the portable housing. The electrically conductive continuous ring may be configured to function as an antenna.
08/21/14
20140232276
 Light-emitting panel, display device and electronic equipment patent thumbnailLight-emitting panel, display device and electronic equipment
Disclosed herein is a light-emitting panel including: an organic electroluminescence element adapted to emit electroluminescence light toward a transparent substrate; a pixel circuit formed on the transparent substrate and adapted to drive the organic electroluminescence element; a color filter formed not only between the transparent substrate and organic electroluminescence element but also immediately on or above the pixel circuit; and a conductive layer formed between the pixel circuit and color filter, the conductive layer being more conductive than the color filter.. .
08/21/14
20140232012
Semiconductor device
According to one embodiment, a semiconductor device includes: a semiconductor layer of a first conductivity type, the semiconductor layer having a first surface and a second surface on an opposite side to the first surface; a plurality of conductive layers extending in a direction from the first surface side toward the second surface side of the semiconductor layer; a first semiconductor region of a second conductivity type surrounding part of each of the plurality of conductive layers on the second surface side of the semiconductor layer, a portion other than a front surface of the first semiconductor region being surrounded by the semiconductor layer; and an insulating film provided between each of the plurality of conductive layers and the semiconductor layer and between each of the plurality of conductive layers and the first semiconductor region.. .
08/21/14
20140232009
Memory circuits and routing of conductive layers thereof
A memory circuit memory circuit comprises at least one memory cell for storing a datum. The memory cell is coupled with a word line, a bit line, a bit line bar, a first voltage line, and a second voltage line.
08/21/14
20140231997
Semiconductor device and method for manufacturing the same
A semiconductor device concerning the embodiment includes a semiconductor layer which has a first surface and a second surface which is opposite to the first surface, an interlayer which is provided on the first surface and which consists of only metal whose standard oxidation-reduction potential is not lower than 0 (zero) v in an ionization tendency, and an electrode provided on the interlayer. The semiconductor device further includes an electrical conductive layer which covers an inside of a hole which is formed in the semiconductor layer so as to reach the interlayer the interlayer from the second surface, and which is electrically connected to the electrode via the interlayer which is exposed to a bottom of the hole..
08/21/14
20140231956
Integrated circuit inductor
An inductive device is formed in a circuit structure that includes alternating conductive and insulating layers. The device includes, in a plurality of the conductive layers, traces forming a respective pair of interleaved loops and at least one interconnect segment in each of the plurality of the conductive layers.
08/21/14
20140231942
Semiconductor device and method for fabricating the same
A method for fabricating a semiconductor device includes forming a magnetic tunnel junction (mtj) element on a substrate, forming a first capping layer along the shape of the mtj element, forming an insulating layer on the first capping layer, forming a trench exposing a portion of the first capping layer above the mtj element by selectively etching the insulating layer, forming a second capping layer on sidewalls of the trench, removing the exposed portion of the first capping layer using the second capping layer as an etching mask to expose an upper surface of the mtj element, and forming a conductive layer in the trench, wherein the conductive layer contacts the upper surface of the mtj element.. .
08/21/14
20140231932
Methods and apparatus of metal gate transistors
Methods and devices for forming a contact over a metal gate for a transistor are provided. The device may comprise an active area, an isolation area surrounding the active area, and a metal gate above the isolation area, wherein the metal gate comprises a conductive layer.
08/21/14
20140231858
Led sub-mount and method for manufacturing light emitting device using the sub-mount
A led sub-mount includes a substrate body and a plurality of first electrical-conductive layers. The substrate body has a first surface.
08/21/14
20140231851
Light emitting diode
A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer.
08/21/14
20140231838
Semiconductor light-emission device and manufacturing method
A semiconductor light-emission device includes: a p-type conductive layer that is one or more layers each made of a iii-v compound semiconductor; an active layer made of a iii-v compound semiconductor; and an electron barrier layer inserted between the p-type conductive layer and the active layer, and made of a iii-v compound semiconductor. The electron barrier layer includes first and second regions.
08/21/14
20140231811
Semiconductor device structure, method for manufacturing the same and pixel structure using the same
A semiconductor device structure is provided. The semiconductor device structure may include a substrate, a semiconductor layer, a first conductive layer, a second conductive layer, a first dielectric layer and a second dielectric layer.
08/21/14
20140231802
Semiconductor device and manufacturing method thereof
The semiconductor device includes a driver circuit portion including a driver circuit and a pixel portion including a pixel. The pixel includes a gate electrode layer having a light-transmitting property, a gate insulating layer, a source electrode layer and a drain electrode layer each having a light-transmitting property provided over the gate insulating layer, an oxide semiconductor layer covering top surfaces and side surfaces of the source electrode layer and the drain electrode layer and provided over the gate electrode layer with the gate insulating layer therebetween, a conductive layer provided over part of the oxide semiconductor layer and having a lower resistance than the source electrode layer and the drain electrode layer, and an oxide insulating layer in contact with part of the oxide semiconductor layer..
08/21/14
20140231797
Semiconductor device
According to one embodiment, a semiconductor device includes, an oxide semiconductor layer including a channel region, and a source region and a drain region, a first insulation film covering the channel region and exposing the source region and the drain region, a first conductive layer including a gate electrode, and a first terminal electrode, a second insulation film covering the first conductive layer, the source region and the drain region, a second conductive layer including a source electrode, a drain electrode, and a second terminal electrode which is opposed to the first terminal electrode via the second insulation film, and a third insulation film interposed between the second insulation film, and the source electrode and the drain electrode.. .
08/21/14
20140231788
Digitized oled light source
Embodiments described herein may provide for devices comprising a digitized oled light source (900) and/or methods of manufacturing such devices. In some embodiments, a first method may be provided.
08/21/14
20140231744
Methods for forming resistive switching memory elements
Resistive switching memory elements are provided that may contain electroless metal electrodes and metal oxides formed from electroless metal. The resistive switching memory elements may exhibit bistability and may be used in high-density multi-layer memory integrated circuits.
08/21/14
20140231742
Resistance memory device
Provided is a resistance memory device including a dielectric layer, a conductive layer, a bottom electrode, a top electrode and a variable resistance layer. The dielectric layer is disposed on a substrate and has a first opening constituted by a lower opening and an upper opening.
08/21/14
20140231740
Memory device
According to one embodiment, a memory device includes first and second conductive layers, a variable resistance portion, and a multiple tunnel junction portion. The variable resistance portion is provided between the first and second conductive layers.
08/21/14
20140230967
Non-ablative laser patterning
A method for processing a transparent substrate includes generating at least one laser pulse having laser parameters selected for non-ablatively changing a conductive layer disposed on the transparent substrate into a non-conductive feature, and directing the pulse to said conductive layer. A protective film may be affixed to a surface of the transparent substrate and need not be removed during the processing of the substrate.
08/21/14
20140230891
Solar cell and method of fabricating the same
A solar cell includes a back electrode layer provided on a support substrate and including a first through hole, a light absorbing layer provided on the first through hole and the back electrode layer and including a second through hole, a front electrode layer provided on the second through hole and the light absorbing layer, and a first conductive layer provided on the front electrode layer. Furthermore, the first conductive layer is formed on at least a portion of the front electrode layer which corresponds to the second through hole..
08/21/14
20140230560
Three dimensional piezoelectric mems
Method and apparatus for a piezoelectric apparatus are provided. In some embodiments, a method for fabricating a piezoelectric device may include etching a series of vertical trenches in a top substrate portion, depositing a first continuous conductive layer over the trenches and substrate, depositing a continuous piezoelectric layer over the first continuous conductive layer such that the piezoelectric material has trenches and sidewalls, depositing a second continuous conductive layer over the continuous piezoelectric layer, etching through the vertical trenches of the first continuous conductive layer, continuous piezoelectric layer, second continuous conductive layer, and top substrate portion into a bottom substrate portion, etching a series of horizontal trenches in the bottom substrate portion such that the horizontal trenches and vertical trenches occupy a continuous free space and allow movement of a piezoelectric mems device created by the above method in three dimensions..
08/14/14
20140228659
Remanufactured medical sensor with flexible faraday shield
Present embodiments include a remanufactured bandage-type medical sensor having an optical assembly with an emitter adapted to transmit one or more wavelengths of light and a photodetector adapted to receive the one or more wavelengths of light transmitted by the emitter. The sensor also includes a laminate assembly having an electrically conductive adhesive transfer tape (ecatt) layer disposed over the photodetector, and the ecatt layer is adapted to shield the photodetector from electromagnetic interference (emi).
08/14/14
20140227811
Method for producing an optoelectronic device with wireless contacting
A method for producing an optoelectronic device is provided, in which a luminescent diode chip (10) is mounted on a base surface (8) on the first terminal area (1) of a carrier (3). An electrically insulating layer (4) is applied to side faces (17) of the luminescent diode chip (10).
08/14/14
20140227575
Battery cell assembly and method for manufacturing the battery cell assembly
A battery cell assembly is provided. The battery cell assembly includes a cooling fin having first and second plate portions and a first thermally conductive layer.
08/14/14
20140227560
Conductive layer and preparation method for conductive layer
Provided are a conductive layer and a method of manufacturing the same. The conductive layer is formed without, so called, a high temperature process but has suitable crystallinity, excellent transparency and excellent resistance characteristic, and the method of manufacturing the same is also provided..
08/14/14
20140227436
Method for forming patterned conductive film
According to the present invention, there is provided a method for forming a patterned conductive layer, which can ensure electrical bonding with a substrate and also can be suitably applied to various electronic devices, simply without requiring a massive and heavy apparatus.. .
08/14/14
20140227014
Fuser for preventing excessive increased temperature in paper non-passing region
A fuser includes an endless heat generating part including a conductive layer, an induced current generating part to heat the conductive layer by electromagnetic induction, and a magnetic shunt metal member that is located at a side opposite to the induced current generating part across the heat generating part, forms a first gap between the magnetic shunt metal member and the heat generating part in a first paper passing region of the heat generating part, and forms a second gap, which is different from the first gap in size, between the magnetic shunt metal member and the heat generating part in a second paper passing region different from the first paper passing region.. .
08/14/14
20140226345
Light-emitting device packages
The present application describes a light-emitting device package including a package substrate having first and second conductive layers that are spaced apart from each other. A light-emitting device is mounted on the package substrate to overlap with the first and second conductive layers.
08/14/14
20140226290
Wiring substrate, component embedded substrate, and package structure
A wiring substrate for improving connection reliability with an electronic component, a component embedded substrate that incorporates an embedded component into the wiring substrate, and a package structure including an electronic component mounted on the wiring substrate or the component embedded substrate. The wiring substrate includes a metal plate, and a wiring layer including a plurality of insulating layers and a conductive layer arranged on the plurality of insulating layers arranged on at least one principal surface of the metal plate.
08/14/14
20140226283
Isolation of thermal ground for multiple heat-generating devices on a substrate
Embodiments of a mechanism of thermal isolation for multiple heat-generating devices on a substrate are described. In one aspect, a substrate is configured for a plurality of heat-generating devices to be disposed thereon.
08/14/14
20140226239
Magnetic read sensor using spin hall effect
A magnetic sensor utilizing the spin hall effect to polarize electrons for use in measuring a magnetic field. The sensor eliminates the need for a pinned layer structure or antiferromagnetic layer (afm layer), thereby reducing gap thickness for increased data density.
08/14/14
20140226098
Display device
A display device includes a substrate, a display region, a peripheral region, an insulating layer which is disposed on a gate signal line and a conductor, a conductive layer which is disposed on the insulating layer and crosses a plurality of gate signal lines and the conductor in the peripheral region, a first semiconductor film which is disposed between the insulating layer and the conductive layer, and a second semiconductor film which is disposed between the insulating layer and the conductive layer and which is separated from the first semiconductor film. The conductive layer is connected to the plurality of gate signal lines via a plurality of diodes, and the plurality of gate signal lines are arranged in the display region and the peripheral region.
08/14/14
20140226096
Liquid crystal light variable device
Provided is a liquid crystal light variable device having a liquid crystal cell, comprising a mixture of a liquid crystal material and one or more dichroic dyes interposed between a first and a second substrate, each substrate having a conductive layer disposed thereon. The device further includes a voltage supply or controller coupled with the conductive layers for application of a voltage waveform across the liquid crystal cell.
08/14/14
20140225864
Touch panel and manufacturing method thereof
A touch panel includes a substrate, a plurality of first sensing units arranged on the substrate along a first direction, a plurality of second sensing units arranged on the substrate along a second direction different from the first direction; a plurality of first bridge units for electrically connecting two adjacent first sensing units, a plurality of second bridge units arranged across over the plurality of first bridge units for electrically connecting two adjacent second sensing units, and a plurality of insulation units respectively arranged between the corresponding first bridge units and the second bridge units, wherein the plurality of first sensing units and the plurality of second sensing units are formed by performing same lithography and etching steps on a first conductive layer and a second conductive layer after the second conductive layer forming on the first conductive layer.. .
08/14/14
20140225862
Touch panel
A touch panel includes an operation surface, a plurality of light-transmitting belt-like first conductive layers, belt-like second conductive layers, low-reflective layers, and a substrate. Each of the second conductive layers includes conductive parts and connecting parts.
08/14/14
20140225855
Touch sensitive film, touch sensing device, and electronic device
A touch sensitive film (1) includes a conductive layer (2) having a touch sensing region (3), and a user input surface (4). The user input surface of the touch sensitive film includes a tactilely distinguishable surface feature (5) deviating from the general nature of the user input surface (4) for identifying the location of the touch sensing region (3) by sensing the tactilely distinguishable surface feature..
08/14/14
20140225698
Integrated transformer balun with enhanced common-mode rejection for radio frequency, microwave, and millimeter-wave integrated circuits
Apparatus and method example embodiments provide an improved common mode rejection ratio in high frequency transformer baluns. According to an example embodiment of the invention, an apparatus comprises a first winding of at least one turn forming a primary coil, having first and second differential leads oriented in a first direction, the primary coil formed in a first conductive layer over a substrate and the first differential lead of the primary coil being grounded; and a second winding of at least one turn forming a secondary coil, having a third and fourth differential leads oriented in a second direction offset by an angle of greater than zero degrees and less than 180 degrees from the first direction, the secondary coil formed in a second conductive layer separated by an insulating layer from the first conductive layer..
08/14/14
20140225464
Rotating electric machine
A rotating electric machine includes a rotation body driven to rotate, an accommodation body housing the rotation body, a first power-supply member electrically connected to a positive electrode of a power source, a second power-supply member electrically connected to a negative electrode of the power source, an insulation layer contacting outer peripheral surfaces of the first and second power-supply members, and a conductive layer contacting the insulation layer on an opposite side of the insulation layer from the outer peripheral surfaces of the first and second power-supply members. The conductive layer is electrically connected to the accommodation body..
08/14/14
20140225279
Semiconductor device and method of forming insulating layer in notches around conductive tsv for stress relief
A semiconductor device has a plurality of conductive vias formed into a semiconductor wafer. A portion of the semiconductor wafer is removed so the conductive vias extend above a surface of the semiconductor wafer.
08/14/14
20140225266
Semiconductor device and manufacturing method for same
The present invention is directed to a semiconductor device including a semiconductor substrate, a through hole penetrating the semiconductor substrate, a base film covering the through hole, a conductive layer disposed on the base film, an insulating film formed on the side wall of the through hole, and a conductive material embedded in the through hole via the insulating film, in which the base film has a stepped portion formed by an opening pattern that selectively exposes the conductive layer therethrough into the through hole, and in which the conductive material is connected electrically to the conductive layer through the opening pattern.. .
08/14/14
20140225262
Electrical contact
An electrical contact includes a substrate, at least an insulation layer, a metal layer, a conductive layer, and a metal silicide layer. The substrate includes at least a silicon region.
08/14/14
20140225256
Semiconductor device with conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate
A semiconductor device has a semiconductor die and conductive pillar with a recess or protrusion formed over a surface of the semiconductor die. The conductive pillar is made by forming a patterning layer over the semiconductor die, forming an opening with a recess or protrusion in the patterning layer, depositing conductive material in the opening and recess or protrusion, and removing the patterning layer.
08/14/14
20140225254
Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
A method of making a semiconductor die includes forming a trench around a conductive stud extending from the first side to a second side of a substrate to expose a portion of the stud and then forming a conductive layer inside the trench and in electrical contact with the stud.. .
08/14/14
20140225237
Chip scale package structure and manufacturing method thereof
A chip scale package structure includes a chip, a dam unit, a board body, a plurality of first conductors, an encapsulating glue, a plurality of first conductive layers, an isolation layer, and a plurality of first electrodes. The dam unit is disposed on the surface of the chip.
08/14/14
20140225224
Metal-insulator-metal capacitor under redistribution layer
A metal-insulator-metal (mim) capacitor reduces a number of masks and processing steps compared to conventional techniques. A first conductive layer of a mim capacitor is deposited on a semiconductor chip and patterned using a mim conductive layer mask.
08/14/14
20140225223
Metal-insulator-metal capacitor over conductive layer
A method of fabricating a metal-insulator-metal (mim) capacitor reduces the number of masks and processing steps compared to conventional techniques. A conductive redistribution layer (rdl) is patterned on a semiconductor chip.
08/14/14
20140225197
Finfet transistor structure and method for making the same
A finfet transistor structure includes a substrate, a fin structure, an insulating layer and a gate structure. The fin structure is disposed on the substrate and directly connected to the substrate.
08/14/14
20140225183
Three-dimensional semiconductor memory device
A three-dimensional semiconductor device includes a stacked structure including a plurality of conductive layers stacked on a substrate, a distance along a first direction between sidewalls of an upper conductive layer and a lower conductive layer being smaller than a distance along a second direction between sidewalls of the upper conductive layer and the lower conductive layer, the first and second directions crossing each other and defining a plane parallel to a surface supporting the substrate, and vertical channel structures penetrating the stacked structure.. .
08/14/14
20140225150
Light-emitting diode and method for manufacturing the same
The disclosure provides a light-emitting diode and a method for manufacturing the same. The light-emitting diode comprises a n-type metal electrode, a n-type semiconductor layer contacted with the n-type metal electrode, a p-type semiconductor layer, a light-emitting layer interposed between the n-type semiconductor layer and the p-type semiconductor layer, a low-contact-resistance material layer positioned on the p-type semiconductor layer, a transparent conductive layer covered the low-contact-resistance material layer and the p-type semiconductor layer, and a p-type metal electrode positioned on the transparent conductive layer..
08/14/14
20140225142
Semiconductor light emitting device
According to one embodiment, a semiconductor light emitting device includes a metal layer, a stacked structural body, a first electrode, a pad electrode, a first conductive layer, a second conductive layer and an insulating layer. The metal layer includes a major surface having a first region, a second region, a third region and a fourth region.
08/14/14
20140225071
Organic light-emitting display apparatus and method of manufacturing the same
An organic light-emitting display apparatus includes an active layer of a thin film transistor (tft), a gate electrode including a transparent conductive material or a metal that on the active layer, a first insulating layer on the substrate, source and drain electrodes electrically connected to the active layer, a second insulating layer between the gate electrode and the source and drain electrodes, a first conductive layer of a transparent conductive material on the first insulating layer, a second conductive layer on the first conductive layer, the second conductive layer being a metal, a third conductive layer on the second conductive layer, the third conductive layer being made of a same material as the source and drain electrodes, and being connected to the first conductive layer; and a protection layer that includes a transparent conductive oxide, the protection layer being on the third conductive layer.. .
08/14/14
20140224670
Anode, corrosion-protecting structure for concrete constructions using this, and corrosion protection method
To provide an anode, corrosion-protecting structure of a concrete constructions using this, and a corrosion protection method capable of protecting electrical corrosion, with little generation of gas due to electrolysis of water or chlorine compounds, by decreasing as far as possible the amount of processing performed on the structural body in on-site construction work and suppressing the voltage that is conducted therethrough to a low level. [solution] a corrosion-protecting structure (1) is constituted by attaching an anode (10) to the surface layer (3) of a corrosion-protecting body (4) through a first electrolyte layer (12) on one face of a conductive layer (11) formed as a sheet.
08/14/14
20140224500
Well emergency separation tool for use in separating a tubular element
A method of separating a tubular element, comprising providing a tubular element having an inner and an outer surface, a circumference of said outer surface, a longitudinal axis and a first end and a second end; radially surrounding said tubular element with an explosive shaped charge material, wherein said shaped charge explosive material is capable of generating a high-velocity plasma jet in response to an activation signal, and wherein said explosive material comprises an electrically conductive layer; transmitting said activation signal to said explosive material; generating said high-velocity plasma jet; and separating said tubular element into a first portion comprising said first end and a second portion comprising said second end when said high-velocity plasma jet penetrates said outer surface of said tubular element and exits said inner surface of said tubular element.. .
08/14/14
20140224322
Transparent electrode, organic electronic element, and method for producing transparent electrode
A transparent electrode (1) comprises a transparent substrate (2); a metal conductive layer (4) composed of a metal thin line pattern; and a polymer conductive layer (6) including a conductive polymer containing a polymer acid. The metal conductive layer (4) is formed on/over the transparent substrate (2) and the metal conductive layer (4) is covered with the polymer conductive layer (6).
08/14/14
20140223710
One-sided capacitor foils and methods of making one-sided capacitor foils
Removing at least a portion of the high surface area on the first side of the core; and forming a conductive layer on the dielectric.. .
08/07/14
20140221184
Electrophotographic member, process cartridge and electrophotographic apparatus
The electrophotographic member is an electrophotographic member including an electro-conductive mandrel and an electro-conductive layer, wherein the electro-conductive layer has a resin having a structure represented by the following structural formula (1), and an anion.. .
08/07/14
20140220826
Electrical connector
An electrical connector includes a body, a soldering portion, an insertion arm, a through hole, and a conductive layer. The soldering portion is disposed on the body.
08/07/14
20140220790
Electrical hinge assembly and electric device using the same
The invention relates to an electrical hinge assembly and an electric device using the same. The electric device includes the electrical hinge assembly, a first slab and a second slab.
08/07/14
20140220771
Worm memory device and process of manufacturing the same
A process of manufacturing a write-once-read-many-times memory, at least includes the following steps: (a) providing a substrate as a lower electrode; (b) depositing a first oxide layer on the substrate; (c) depositing at least one or more silicon/germanium (si/ge) layers on the first oxide layer; (d) depositing a second oxide layer on the at least one or more si/ge layers; (e) carrying out a rapid thermal annealing to form sige nanocrystals embedded in the first dioxide layer and the second oxide layer; and (f) depositing a conductive layer on the second oxide layer as an upper electrode. The sige nanocrystals embedded in the al2o3 bilayer as the active layer of the worm memory offers high thermal stability, so that low operating voltage, fast writing, ideal reading durability, persistence at high temperature, and the highly reliable memory performance for effectively reading data at high temperature can be achieved..
08/07/14
20140220708
Mr enhancing layer (mrel) for spintronic devices
The performance of an mr device has been improved by inserting one or more magneto-resistance enhancing layers (mrels) into approximately the center of one or more of the magnetic layers such as an inner pinned (ap1) layer, spin injection layer (sil), field generation layer (fgl), and a free layer. An mrel is a layer of a low band gap, high electron mobility semiconductor such as zno or a semimetal such as bi.
08/07/14
20140220697
Chemical sensor with conductive cup-shaped sensor surface
A system includes a sensor including a sensor pad and a well wall structure defining a well operatively coupled to the sensor pad. The well is further defined by a lower surface disposed over the sensor pad.
08/07/14
20140220385
Mr enhancing layer (mrel) for spintronic devices
The performance of an mr device has been improved by inserting one or more magneto-resistance enhancing layers (mrels) into approximately the center of one or more of the magnetic layers such as an inner pinned (ap1) layer, spin injection layer (sil), field generation layer (fgl), and a free layer. An mrel is a layer of a low band gap, high electron mobility semiconductor such as zno or a semimetal such as bi.
08/07/14
20140218871
Substrate and terminals for power module and power module including the same
According to example embodiments, a substrate for a power module includes first to third parts spaced apart from each other, where the third part surrounds the first and second parts, and a conductive layer on the first to third parts. A terminal of a first polarity is connected to the first part, and a terminal of a second polarity is connected to the second part.
08/07/14
20140218841
Low acoustic noise capacitors
The described embodiments relate generally to a capacitor assembly for mounting on a printed circuit board (pcb) and more specifically to designs for mechanically isolating the capacitor assembly from the pcb to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the pcb. Termination elements in the capacitor assembly, including a porous conductive layer in the capacitor assembly may reduce an amount of vibrational energy transferred from the capacitor to the pcb.
08/07/14
20140218795
Power scalable multi-pass faraday rotator
Transparent heat-conductive layers of significant thickness are bonded or adhered to opposing optical faces of a faraday optic to form a faraday optic structure that can be used with beam-folding mirrors and an external magnetic field to form a multi-pass faraday rotator with minimal thermal gradient across the beam within the faraday optic. The transparent heat conductive layers conduct heat through the faraday optic substantially parallel to the beam propagation axis for each pass through the faraday optic structure and thereby reduce thermal gradients across the beam cross section that would otherwise contribute to thermal lens focal shifts and thermal birefringence in the faraday optic structure.
08/07/14
20140218738
Plasmonic interferometer biosensors
An optical device includes a transparent substrate and a conductive layer disposed over an upper surface of the transparent substrate. The conductive layer defines at least one groove inwardly extending from an upper surface and includes an aperture that is spaced apart from the at least one groove.
08/07/14
20140218640
Glass keyboard
A glass keyboard includes a patterned glass sheet having a plurality of glass keys arranged in a keyboard layout. Each of the glass keys includes one or more cantilevered glass tabs integrally formed in the patterned glass sheet.
08/07/14
20140218638
Touch screen panel and method of manufacturing the same
A method of manufacturing a touch screen panel includes patterning a first conductive layer formed on a substrate to form first sensing electrodes connected in a first direction, sequentially forming an insulating layer and a second conductive layer on the substrate where the first sensing electrode are formed, and patterning the insulating layer and the second conductive layer together to overlap each other so that second electrodes connected in a second direction that intersects the first direction are formed. A touch screen panel comprises a substrate, first sensing electrodes formed on the substrate and connected to each other in a first direction, second sensing electrodes connected to each other in a second direction intersecting the first direction, and an insulating layer formed between the first sensing electrodes and the second sensing electrodes and overlapping the second sensing electrodes..
08/07/14
20140218637
Conductive film, manufacturing method thereof, and touch screen including the conducting film
A conductive film includes a substrate, a first conductive layer, a matrix layer, and a second conductive layer. The substrate includes a first surface and an oppositely arranged second surface.
08/07/14
20140218636
Monitor, touchscreen sensing module thereof, and method for manufacturing the touchscreen sensing module
A touchscreen sensing module includes a first baseplate, a first conductive layer, a second baseplate, a second conductive layer, and a supporting substrate. A first groove in a predetermined shape is defined on a side of the first baseplate.
08/07/14
20140218635
Conductive film, method for manufacturing the same and touch screen having the same
A conductive film is disclosed in the present disclosure, which includes: a substrate having a first surface and a second surface opposite to each other; and a first conductive layer laid on the first surface, the first conductive layer includes a plurality of first conductive areas and first insulating areas, the first conductive areas include a metal mesh formed by a metal, the first insulating areas include an insulating mesh formed by an insulating metal sulfide, the insulating metal sulfide is obtained from a reaction between the metal and hydrogen sulfide. Accordingly, the problem of producing lots of wastewater of the metal salts and heavy metal pollution can be avoided, the insulating areas include the insulating mesh having a transmittance close to the metal mesh, benefit for reach a uniform transmittance of the touch screen, and avoid forming alternating light and dark color patches..
08/07/14
20140218634
Touch sensing element and touch panel having the same
A touch sensing element is provided comprising an insulating substrate and a conductive layer located on a surface of the insulating substrate. The conductive layer comprises: a plurality of first conductive traces arranged at intervals along a first direction, each first conductive trace extending along a second direction; and a plurality of second conductive traces arranged to form second conductive trace columns, each second conductive trace column comprises a plurality of second conductive traces arranged at intervals along the second direction, each second conductive trace column is correspondingly located corresponding to a lateral direction of the first conductive trace.
08/07/14
20140218277
Electrophoretic display and method of operating an electrophoretic display
An electrophoretic display includes an electrophoretic panel, a substrate, and a processor. The electrophoretic panel includes a plurality of charged particles.
08/07/14
20140218252
Compact balanced embedded antenna
A planar antenna, such as included as a portion of printed circuit board assembly, can include a balanced configuration comprising a first conductive layer. The first conductive layer can include a first arm having a footprint extending in a first direction and a second arm having a footprint extending in a direction opposite the first direction.
08/07/14
20140218053
Plastic film and touch sensor
Disclosed is a plastic film and a touch module produced therefrom. The module is constructed from two conductive layers with an insulation layer in between, as are used in capacitive touch pads and/or touch screens, for example.


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Conductive Layer topics: Conductive Layer, Ultrasound, Radiograph, Attenuation, Electronic Device, Photoelectric Conversion, Electric Conversion

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