|| List of recent Conductive Layer-related patents
|Subgasket design to dissipate thermal energy generated from catalytic combustion experienced in a pem fuel cell|
A fuel cell component includes a sub-gasket including a structural component and a thermally conductive layer. The sub-gasket defines a central opening while the structural component includes a first side and a second side.
|Loudspeaker constructed from sheets|
A loudspeaker designed with a large area having sandwich-like layer structure includes a plurality of conductive and nonconductive layers which form an active sound-radiating loudspeaker surface. The plurality of conductive and nonconductive layers include a first diaphragm sheet coated with an electrically conductive layer, a second diaphragm sheet coated with an electrically conductive layer, a static high-voltage supply, which generates an electric field between the first electrically conductive layer and the second electrically conductive layer, and an audio source which influences the high-voltage fields between the first electrically conductive layer and the second electrically conductive layer via a capacitor.
|Vehicle window with shade|
A window assembly for a vehicle includes inner and outer window panels and a spacer element disposed between the window panels to establish an interpane cavity, with a roller shade disposed therein having an end fixedly attached at an anchor stop. A dielectric layer is disposed between the roller shade and a conductive layer at the inner window panel.
|Method for manufacturing a memory cell, a method for manufacturing a memory cell arrangement, and a memory cell|
A method for manufacturing a memory cell in accordance with various embodiments may include: forming at least one charge storing memory cell structure over a substrate, the charge storing memory cell structure having a first sidewall and a second sidewall opposite the first sidewall; forming an electrically conductive layer over the substrate and the charge storing memory cell structure; patterning the electrically conductive layer to form a spacer at the first sidewall and a blocking structure at the second sidewall of the charge storing memory cell structure; implanting first dopant atoms to form a first doped region in the substrate proximate the spacer, wherein the first dopant atoms are blocked by the blocking structure; removing the blocking structure after implanting the first dopant atoms; implanting second dopant atoms to form a second doped region in the substrate proximate the second sidewall of the charge storing memory cell structure.. .
|Apparatus for holding semiconductor wafers|
Apparatus for holding semiconductor wafers during semiconductor manufacturing processes are disclosed. In one embodiment, the apparatus comprises a heat-conductive layer disposed on a supporting base.
|Method of forming a transparent conductive layer on a substrate|
The present invention provides a method of forming a transparent conductive layer on a substrate, including: applying a conductive composition containing a conductive polymer onto the substrate to form the transparent conductive layer thereon, forming a patterned protection layer on the transparent conductive layer to define a transparent conductive layer region covered by the protection layer and a transparent conductive layer region not covered by the protection layer; performing a wet etching process on the transparent conductive layer region not covered by the protection layer; and removing the protection layer, wherein an annealing process is performed on the transparent conductive layer before or after the wet etching process. The method of the present invention can reduce the chromatic aberration between the etched transparent conductive layer and the un-etched transparent conductive layer.
|Wiring substrate and method for producing the same|
Embodiments of the present wiring substrate include a stacked body including one or more insulation layers and one or more conductive layers, wherein the wiring substrate has a plurality of connection terminals formed on the stacked body, each connection terminal has a top surface whose area is smaller than that of each of opposite side surfaces thereof, and a filling member provided in a filling manner between the connection terminals. The top surface of each connection terminal has an area larger than that of a portion of each side surfaces portion exposed from the filling member, and a bonding layer containing a solder is formed on the top surface..
|Light emitting device and method of forming the same|
A light-emitting device includes a transparent substrate, a transparent adhesive layer on the transparent substrate, a first transparent conductive layer on the transparent adhesive layer, a multi-layer epitaxial structure and a first electrode on the transparent conductive layer, and a second electrode on the multi-layer epitaxial structure. The multi-layer epitaxial structure includes a light-emitting layer.
|Photoelectric conversion element and photoelectric conversion element module|
There are provided a photoelectric conversion element and a photoelectric conversion element module including the photoelectric conversion element, the photoelectric conversion element including a transparent substrate, a transparent conductive layer arranged on the transparent substrate, a photoelectric conversion layer arranged on the transparent conductive layer, a porous insulating layer arranged in contact with the photoelectric conversion layer, a reflective layer arranged in contact with the porous insulating layer, and a catalyst layer and a counter conductive layer that are arranged on the reflective layer, in which the photoelectric conversion layer contains a porous semiconductor, a carrier-transport material, and a photosensitizer, and in which the area of the orthogonal projection of the porous insulating layer onto the transparent substrate and the area of the orthogonal projection of the reflective layer onto the transparent substrate are each larger than the area of the orthogonal projection of the photoelectric conversion layer onto the transparent substrate.. .
|Film laminate body for pressure sensitive fingerprint sensor|
To provide a film laminate body for a pressure sensitive fingerprint sensor that can provide an accurate pressure distribution corresponding to the degree of ridges and valleys of a fingerprint, and thereby can clearly recognize the shape of the fingerprint. A film laminate body for a pressure sensitive fingerprint sensor containing a base film with a first surface and a second surface, and a conductive layer formed by a dry film forming process provided on the first surface, and an elastic layer provided on the second surface, which is a side opposite the first surface of the base film, wherein the base film has a thickness of 6 μm or less, and the elastic layer has a thickness no less than the base film, and has elasticity of 108 pa or less..
|Manufacturing method of substrate structure|
A manufacturing method of substrate structure is provided. The base material having a core layer and a first and second copper foil layers located at a first and second surfaces of the core layer is provided.
|Enhancing adhesion of cap layer films|
The present invention provides methods and apparatuses for improving adhesion of dielectric and conductive layers on a substrate to the underlying layer. The methods involve passing a process gas through a plasma generator downstream of the substrate to create reactive species.
|Self-aligned method of forming a semiconductor memory array of floating gate memory cells with single poly layer|
A method of forming a semiconductor memory cell that includes forming the floating and control gates from the same poly layer. Layers of insulation, conductive and second insulation material are formed over a substrate.
|Printed circuit board, and method and apparatus for drilling printed circuit board|
The present invention relates to a method for drilling a printed circuit board, comprising: drilling down in an initial position, and when contacting a live superficial conductive layer of a pcb, acquiring a first conductive position and acquiring a first height difference between the initial position and the first conductive position; drilling onward after the first drill bit of the driller drills through the superficial conductive layer and when contacting another conductive layer of the pcb, acquiring a second conductive position and acquiring a second height difference between the initial position and the second conductive position; calculating a difference between the second and the first height difference to obtain a third height difference; and performing back-drilling, according to the third height difference, in a position that needs back-drilling. The present invention acquires precise depth information through a test blind via and reduces stub length of back-drilling..
|Electrophotographic photosensitive member, process cartridge, and electrophotographic apparatus|
An electrophotographic photosensitive member that can not easily cause charging lines even where it is an electrophotographic photosensitive member employing as a conductive layer a layer containing metal oxide particles is disclosed. Also disclosed are a process cartridge and an electrophotographic apparatus which have such an electrophotographic photosensitive member.
|Capacitive touch panel and display device|
A capacitive touch panel is disclosed. The touch panel includes a substrate, and a black matrix formed on the substrate, where the black matrix includes a plurality of light-permeable regions.
|Transparent conductive substrate and touch panel having the same|
A transparent conductive substrate used for the detection of a touched position in a touch screen panel and a touch panel having the same. The transparent conductive substrate includes a base substrate, a transparent conductive layer formed on the base substrate, the transparent conductive layer including a pattern part which includes a transparent conductive film coating the base substrate and a non-pattern part through which the base substrate is exposed, and a polymer resin layer containing a resin that has a refractive index from 1.4 to 1.6, the polymer resin layer being formed on the transparent conductive layer while filling the non-pattern part, the thickness of the polymer resin layer from the pattern part ranging from 1 to 1000 μm.
A touch panel includes a transparent substrate and a touch module disposed thereon. The touch module includes a first stack structure that includes the following elements.
|Laminate constructs for micro-fluid ejection devices|
A micro-fluid ejection head has an ejection chip to expel fluid. It connects to a laminate construct.
|Touch panel and method for producing same|
The invention relates to a touch panel. The touch panel includes a plastic film substrate, whose two surfaces are provided in sequence with at least two undercoat layers and a patterned transparent conductive layer and further provided with a patterned metal circuit layer, respectively.
|Near-closed polygonal chain microstrip antenna|
A microstrip antenna includes a substrate having a first surface and an opposing second surface, a ground plane disposed at the first surface of the dielectric layer, and a conductive layer disposed at the second surface of the substrate. The conductive layer includes a continuous conductive trace comprising a plurality of linear segments arranged in a near-closed polygonal chain.
|Fine pitch interface for probe card|
A probe card interface for interfacing a probe head with a first circuit. The probe card interface includes an impedance control element to interface a first set of pins of the probe head with the first circuit.
|Artificial defect for eddy current inspection|
A flex circuit for creating artificial defects uses a thin conductive layer with rectangular slots therein representing defects. A thin insulating over-layer is used to protect the conductive layer as well as an eddy current probe.
|Semiconductor device and method of depositing encapsulant along sides and surface edge of semiconductor die in embedded wlcsp|
A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer.
|High density second level interconnection for bumpless build up layer (bbul) packaging technology|
An apparatus including a die including a device side; and a build-up carrier including a body including a plurality of alternating layers of conductive material and dielectric material disposed on the device side of the die, an ultimate conductive layer patterned into a plurality of pads or lands; and a grid array including a plurality of conductive posts disposed on respective ones of the plurality of pads of the ultimate conductive layer of the body, at least one of the posts coupled to at least one of the contact points of the die through at least a portion of the conductive material of the body. A method including forming a body of a build-up carrier including a die, the body of the build-up carrier including an ultimate conductive layer and forming a grid array including a plurality of conductive posts on the ultimate conductive layer of the body..
A method for fabricating a semiconductor device is described. A stacked gate dielectric is formed over a substrate, including a first dielectric layer, a second dielectric layer and a third dielectric layer from bottom to top.
|Semiconductor device and method for manufacturing semiconductor device|
The semiconductor device includes a driver circuit including a first thin film transistor and a pixel including a second thin film transistor over one substrate. The first thin film transistor includes a first gate electrode layer, a gate insulating layer, a first oxide semiconductor layer, a first oxide conductive layer, a second oxide conductive layer, an oxide insulating layer which is in contact with part of the first oxide semiconductor layer and which is in contact with peripheries and side surfaces of the first and second oxide conductive layers, a first source electrode layer, and a first drain electrode layer.
|Electrical device with teeth joining layers and method for making the same|
A multilayer electrical device, such as a printed circuit board, having a tooth structure including a metal layer set in a dielectric. The device includes a base; a conductive layer adjacent to the base; a dielectric material adjacent to conductive layer; a tooth structure including a metal layer set in the dielectric material to join the dielectric material to the metal layer; and wherein the metal layer forms a portion of circuitry..
|Wafer level chip scale packaging|
An improved wafer level chip scale packaging technique is described which does not use an encapsulated via to connect between a redirection layer and a pad within the pad ring on the semiconductor die. In an embodiment, a first dielectric layer is formed such that it terminates on each die within the die's pad ring.
|Method for the contact separation of electrically-conducting layers on the back contacts of solar cells and corresponding solar cell|
A method for fabricating a solar cell including a semiconductor substrate is proposed where electrical contacting is made on the back side of the semiconductor substrate. The back side of the semiconductor substrate has locally doped regions.
|Display device and method of manufacturing the same|
A display device and a method of manufacturing the same. In one embodiment, a display device includes a substrate having a pixel region, a transistor region and a capacitor region, a transistor arranged within the transistor region of the substrate and a capacitor arranged within the capacitor region of the substrate, wherein the capacitor includes a lower electrode arranged on the substrate, a gate insulating layer arranged on the lower electrode and an upper electrode arranged on the gate insulating layer and overlapping the lower electrode, the upper electrode includes a first conductive layer and a second conductive layer arranged on the first conductive layer, wherein the first conductive layer is opaque..
|Conductive porous layer for batteries and fabrication method for same|
The conductive porous layer for batteries according to the present invention comprises a laminate comprising a first conductive layer and a second conductive layer. The first conductive layer includes at least a conductive carbon material and a polymer.
Resin compositions which contain an epoxy resin, an alkoxy oligomer, and an inorganic filler provide insulating layers that have a surface with not only low arithmetic mean roughness but also low root mean square roughness in a wet roughening step and that are capable of forming thereon a plated conductive layer having a sufficient peel strength that can be formed while maintaining the glass transition temperature and thermal expansion coefficient.. .
|Electronic module and method for same|
An electronic module includes a circuit board, a plurality of electronic components, a plurality of molding layers, at least one first conductive layer, at least one insulating filler, and one second conductive layer. The circuit board has a first plane and at least one grounding pad on the first plane.
|Electronic device and plug and play unit thereof|
A plug and play unit is provided. The plug and play unit includes a unit housing, a joint, a substrate and a heat conductive member.
|Transparent conductive laminate and transparent touch panel|
The purpose of the present invention is to provide a transparent conductive laminate that will not break by being bent. Another purpose of the present invention is to provide a transparent touch panel comprising such a transparent conductive laminate.
|Tapered slot antenna|
The tapered slot antenna element according to the invention comprises a tapered slot with a narrow inner part. The tapered slot antenna element further comprises a cavity for receiving a feeding probe.
|Low-noise magnetic sensors|
Magnetic sensors are disclosed, as well as methods for fabricating and using the same. In some embodiments, an emr effect sensor includes a semiconductor layer.
|Semiconductor device and method of forming integrated passive device over semiconductor die with conductive bridge and fan-out redistribution layer|
A semiconductor device has a first semiconductor die. A first inductor is formed over the first semiconductor die.
According to one embodiment, an igbt region includes: a collector layer of a first conductivity type, a drift layer of a second conductivity type, a body layer of the first conductivity type, and a second electrode extending to the drift layer and the body layer via a first insulating film in a stacking direction of a first electrode and the collector layer. A diode region includes: a cathode layer of the second conductivity type, the drift layer, an anode layer of the first conductivity type, and a conductive layer extending to the drift layer and the anode layer via a second insulating film in the stacking direction.
|Method for manufacturing thin-film transistor active device and thin-film transistor active device manufactured with same|
The present invention provides a method for manufacturing thin-film transistor active device and a thin-film transistor active device manufactured with the method. The method includes providing a substrate; forming a gate terminal on the substrate through sputtering and masking operations; forming a gate insulation layer on the gate terminal through cvd; forming an oxide semiconductor layer on the gate insulation layer through sputtering and masking operations; forming a first protection layer on the oxide semiconductor layer through cvd, forming a metal layer on the first protection layer through sputtering, and forming a data line electrode through masking operation; forming a second protection layer on the first protection layer and the data line electrode through cvd and forming first, second, and third bridging holes through masking operation; forming a transparent conductive layer on the second protection layer through sputtering and patternizing the transparent conductive layer through masking operation..
|Thin film transistor and display device|
According to one embodiment, a display device includes a thin film transistor. The thin film transistor includes a gate insulating film, a semiconductor layer, a gate electrode, first and second channel protection films, first and second conductive layers, and a passivation film.
|Organic electroluminescence element|
The organic electroluminescence element in accordance with the present invention includes: a light-emitting layer; a first electrode layer disposed on a first surface in a thickness direction of the light-emitting layer; a second electrode layer disposed on a second surface in the thickness direction of the light-emitting layer; and an electrically conductive layer. The light-emitting layer is configured to emit light when a predetermined voltage is applied between the first electrode layer and the second electrode layer.
|Coated articles and/or devices with optical out-coupling layer stacks (ocls), and/or methods of making the same|
Certain example embodiments relate to organic light emitting diode (oled) inclusive devices, and/or methods of making the same. A substrate supports a transparent conductive coating (tcc) based layer, and first and second organic layers disposed thereon.
|Organic light-emitting diode using bandgap matching dye as co-host|
The present invention relates to an organic light-emitting diode using an bandgap matching dye as a co-host, comprising: a first conductive layer, a hole injection layer, a hole transport layer, a host light-emitting layer, a first dye, a second dye, an electronic transport layer, an electronic injection layer, and a second conductive layer; wherein the host energy gap of the host light-emitting layer is greater than the energy gap of the first dye, and the energy gap of the first dye is greater than the energy gap of the second dye; therefore the first dye can be a co-host light-emitting layer opposite to the host light-emitting layer, and the energy of the first dye can be effectively conducted to the second dye, such that the luminous efficiency of the light emitted by the second dye through the host light-emitting layer is largely enhanced.. .
|Conductive pattern formation|
A system and method for forming conductive lines on a substrate comprising depositing a precursor onto at least a portion of the substrate, depositing a thin layer of conductive material over the precursor, forming a negative-patterned mask over a portion of the thin layer of conductive material to form an exposed pattern, forming conductive lines in the exposed pattern, removing the patterned mask thereby uncovering an exposed portion of the conductive layer that substantially corresponds to the negative pattern portion, and removing the exposed portion of the conductive layer so as to uncover substrate that substantially corresponds to the exposed portion.. .
|Printed wiring board and method for manufacturing printed wiring board|
A printed wiring board includes an outermost interlayer resin insulation layer, n outermost conductive layer formed on the outermost interlayer resin insulation layer and including multiple alignment marks, a connection wiring structure connecting the alignment marks, and a solder-resist layer formed on the outermost interlayer resin insulation layer and the outermost conductive layer. The solder-resist layer has openings exposing the alignment marks, respectively, and each of the alignment marks has an electroless plated film formed on each of the alignment marks..
|Printed wiring board and method for manufacturing printed wiring board|
A printed wiring board includes multiple insulating layers laminated on each other and each including resin and core, the insulating layers having first-surface sides and second-surface sides on the opposite side, respectively, and including multiple first insulating and second insulating layers, multiple first-surface-side conductive layers formed on the first-surface sides of the first insulating layers, respectively, multiple second-surface-side conductive layers formed on the second-surface sides of the second insulating layers, respectively. The insulating layers include one or more insulating layer having the core positioned such that the core is shifted toward the first-surface side from the center in the thickness direction, the insulating layers include a central insulating layer positioned in the center of the insulating layers, and the first-surface-side and second-surface-side conductive layers are formed such that the first-surface side conductive layers have the total area which is set smaller than the total area of the second-surface-side conductive layers..
|Manufacturing method for printed circuit board|
A printed circuit board is manufactured by forming on a top surface of a support base, in a pattern having a predetermined width, a first metal layer for defining boundary ends between adjacent printed circuit boards in a printed circuit board assembly, forming on top of the first metal layer a wiring structure portion having an insulating layer and a conductive layer for each printed circuit board in the printed circuit board assembly, forming, in the wiring structure portion, grooves having a pattern corresponding to the pattern of the first metal layer to expose the first metal layer, forming a second metal layer on the wall surface of the grooves in the wiring structure portion, and cutting the first metal layer on the bottom surface of the grooves to separate each printed circuit board.. .
|Semiconductor structure and method for making same|
An embodiment relates to a method of forming a semiconductor structure, comprising: forming a first semiconductor layer; forming a second semiconductor layer over the first semiconductor layer; forming a third semiconductor layer over the second semiconductor layer; forming an opening in the first, second and third semiconductor layers; forming a conductive region within the first, the and third semiconductor layer, the conductive region surrounding the opening, the conductive region being electrically coupled to the first semiconductor layer; forming a dielectric layer in the opening and over the conductive region; and forming a conductive layer over the dielectric layer in the opening.. .
|Liquid crystal display device and method for manufacturing the same, and liquid crystal television receiver|
At least one or more of a conductive layer which forms a wiring or an electrode and a pattern necessary for manufacturing a display panel such as a mask for forming a predetermined pattern is formed by a method capable of selectively forming a pattern to manufacture a liquid crystal display device. A droplet discharge method capable of forming a predetermined pattern by selectively discharging a droplet of a composition in accordance with a particular object is used as a method capable of selectively forming a pattern in forming a conductive layer, an insulating layer, or the like..
|Fluid handling apparatus|
Microchannel chip (100) has film (120) adhered on the second surface of base (110) having a through-hole (111), and conductive layer (130). Film (120) has hole (121) and covers a second opening of the through-hole (111).
|Semiconductor memory device having vertical transistors|
A device includes first and second regions including first and second amplifiers, respectively and a memory cell array region formed between the first and second regions and includes first and second conductive layers each extending in a first direction, and a plurality of first pillar elements arranged in line in the first direction on the first conductive layer, each of the first pillar elements being coupled to the first conductive layer at one end thereof, and the first pillar elements comprising a plurality of first elements and a second element, and a plurality of second pillar elements arranged in line in the first direction on the second conductive layer, each of the second pillar elements being coupled to the second conductive layer at one end thereof, and the second pillar elements comprising a plurality of third elements and a fourth element.. .
|Composite laminate having a flexible circuit bridge and method of manufacture thereof|
In a composite component having a laminate body, a conductive layer and a connector can be joined to one another using an intermediate flexible circuit. Among other things, this flexible circuit places the conductive layer and the connector in electrical communication with one another.
A display device includes a first substrate, a second substrate, a plurality of pixel units, a driving unit, and column insulation structure. The first substrate has a display area and a non-display area outside of the display area.
|Transparent conductive laminate and touch panel|
A transparent conductive laminate includes a coating film including a first transparent resin film and a coating layer or layers provided on one or both sides of the first transparent resin film; a transparent conductive film including a second transparent resin film and a transparent conductive layer provided on one side of the second transparent resin film; and a pressure-sensitive adhesive layer interposed between the coating film and the transparent conductive film, wherein the coating layer of the coating film is laminated with the pressure-sensitive adhesive layer to a side of the transparent conductive film where the transparent conductive layer is not provided, the pressure-sensitive adhesive layer has a storage elastic modulus of 80,000 pa or less at 120° c., and the adhesive strength between the pressure-sensitive adhesive layer and the coating layer is from 5 n/25 mm to 20 n/25 mm.. .
|Capacitor bank, laminated bus, and power supply apparatus|
A capacitor bank includes a laminated bus bar having a high potential conductive layer and a low potential conductive layer disposed in close proximity at opposing surfaces of an intervening insulation layer. The bank also includes a plurality of bus capacitors electrically connected to the laminated bus bar.
|Semiconductor device and method of forming dual-sided interconnect structures in fo-wlcsp|
A semiconductor device has a substrate including first and second conductive layers formed over first and second opposing surfaces of the substrate. A plurality of wire studs or stud bumps is formed over the substrate.
|Semiconductor device and method of forming dual-sided interconnect structures in fo-wlcsp|
A semiconductor device has a substrate with first and second conductive layers formed over first and second opposing surfaces of the substrate. A plurality of bumps is formed over the substrate.
|Waveguide-based energy converters, and energy conversion cells using same|
A layered waveguide stack radiant energy converter array having a plurality of superposed waveguides, each waveguide having a core layer having a radiant energy converter disposed therein, and two cladding layers disposed on opposing sides of the core. In some embodiments the conductive layers are electrically coupled to the converter and act as charge carriers for it, and in other wires are provided for individual converters.
|Integrated circuits including metallic gate layers|
An integrated circuit includes an nmos and a pmos disposed over a substrate. The nmos transistor includes a first gate dielectric structure over the substrate, a first work function metallic layer over the first gate dielectric structure, a conductive layer over the first work function metallic layer, and a silicide layer over the conductive layer.
|Semiconductor device and method of manufacturing same|
A semiconductor device includes an element region and an end region, the element region having a semiconductor element formed therein, and the end region surrounding the element region. The semiconductor device includes a semiconductor substrate, a trench, an insulating layer, and a field plate conductive layer.
|Semiconductor light emitting device and method for manufacturing the same|
According to one embodiment, a semiconductor light emitting device includes first and second conductive layers, a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light emitting part. The second semiconductor layer is provided between the first conductive layer and the first semiconductor layer.
|Thin film transistor, array substrate and method for manufacturing the same, display device|
There is provided a thin film transistor, comprising a substrate (1) and a gate layer (3), a gate insulating layer (4), an active layer (5), an electrode metal layer (8) and a passivation layer (9) which are formed on the substrate (1) in sequence; the electrode metal layer (8) comprises a source electrode (8a) and a drain electrode (8b), which are separated from each other with a channel region being defined therebetween; between the gate layer (3) and the substrate (1), there is formed a first transparent conductive layer (2); between the active layer (5) and the electrode metal layer (8), there is formed a second transparent conductive layer (7). The transparent conductive layers (2, 7) are added so that adhesive force between the gate metal layer (3) and the substrate (1) is enhanced, diffusion of the electrode metal to the active layer (5) is prevented..
A semiconductor device includes first and second conductive layers over an insulating surface, a first insulating layer over the first and second conductive layers, first and second oxide semiconductor layers over the first insulating layer, third and fourth conductive layers over the first oxide semiconductor layer, a second insulating layer over the third and fourth conductive layers, and a fifth conductive layer over the second insulating layer. In the semiconductor device, the third conductive layer is electrically connected to the second conductive layer, the fifth conductive layer is electrically connected to the fourth conductive layer, the first oxide semiconductor layer has a region overlapping with the first conductive layer, the second oxide semiconductor layer has a region overlapping with the fifth conductive layer, and the second oxide semiconductor layer has a region intersecting with the second conductive layer..
|Organic electroluminescence display unit, method of manufacturing organic electroluminescence display unit, and color filter substrate|
A display device includes a first electrode, an organic layer including a light emitting region, and a second electrode. The display device also includes a conductive layer electrically connected to the second electrode and including an opening corresponding to the light emitting region..
|Water-soluble electrically conductive polymers|
Water-soluble electrically conductive polymers and a composition comprising such polymers are provided. Also, an electrically conductive layer or film formed from the composition, and articles comprising the electrically conductive layer or film are provided.
|Flexible data cable|
A multi-layered cable consisting of three or more conductive layers separated by layers of dielectric and/or adhesive material. The bottom layer and the top layer may act as return path for the transmitted signals and as a shield to prevent interference between these and external electrical signals.
|Transparent electrode and manufacturing method of the same|
Disclosed is a transparent electrode containing a transparent support having thereon: a conductive layer a having a conductive fiber; and a conductive layer b having a conductive polymer, wherein the conductive layer a and the conductive layer b are disposed adjacent each other and the conductive layer a is located nearer to the transparent support than the conductive layer b; and a first surface of the conductive layer b contacting with the conductive layer a has a smoothness ra(b): ra(b)≦30 nm.. .
|Sense and hold circuit for hose assembly|
A monitoring circuit for detecting degradation of a hose assembly a hose assembly and a hose assembly incorporating such a monitoring circuit are disclosed. The monitoring circuit includes a voltage source connected to a first connection location of a hose assembly.
|Implantable lead and medical device using the same|
An implantable lead includes a pipe, a flexible conductive layer, at least one connector, at least one contactor and at least one wire. The pipe includes a first end portion, a second end portion opposite to the first end portion, and a middle portion connecting the first end portion and the second end portion.
|Renal nerve modulation balloon and methods of making and using the same|
An expandable medical balloon for transmitting radiofrequency energy, the medical balloon comprising at least one polymeric electrically-insulating layer and at least one polymeric electrically-conductive layer, wherein at least portions of the polymeric electrically-insulating layer are moveable relative to the polymeric electrically-conductive in said at least one pressurizable expanded state.. .