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Conductive Layer

Conductive Layer-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Heater for windshield wiper park position
Illionois Tool Works Inc.
January 11, 2018 - N°20180014362

A windshield wiper park position heater employs an area-type heater construction having a flexible substrate supporting a high resistance heater material between electrodes of a lower resistance electrode material. The high length-to-width of the heater element is accommodated through a bus structure that orients current flow along the shortest dimension of the heater and by supplying power at a midpoint ...
Heating device, in particular a semi-transparent heating device
Universite De Nantes
January 11, 2018 - N°20180014359

The present invention relates to a heating device comprising: a base substrate; an electrically conductive layer, referred to as the heating layer, carried by the substrate, formed from at least one percolating network of nano-objects comprising metal nanowires; and a thermal diffusion layer made from aluminum nitride, covering all or part of the heating layer. The invention also concerns a ...
Transparent electrode and electronic device
Konica Minolta, Inc.
January 11, 2018 - N°20180013090

An object of the present invention is to provide a transparent electrode including a substrate having thereon a conductive layer containing silver as a main component, wherein the transparent electrode has an organic functional layer between the substrate and the conductive layer; and the organic functional layer contains a first organic compound represented by formula (1) and a second organic compound ...
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Josephson junction using molecular beam epitaxy
Ambature, Inc.
January 11, 2018 - N°20180013053

According to various implementations of the invention, a vertical josephson junction device may be realized using molecular beam epitaxy (mbe) growth of ybco and pbco epitaxial layers in an a-axis crystal orientation. Various implementations of the invention provide improved vertical jj devices using sic or lsgo substrates; gan, aln, or mgo buffer layers; ybco or lsgo template layers; ybco conductive ...
Semiconductor device
Semiconductor Energy Laboratory Co., Ltd.
January 11, 2018 - N°20180013011

It is an object of the present invention to connect a wiring, an electrode, or the like formed with two incompatible films (an ito film and an aluminum film) without increasing the cross-sectional area of the wiring and to achieve lower power consumption even when the screen size becomes larger. The present invention provides a two-layer structure including an upper ...
Semiconductor device and method of manufacturing the same
Sk Hynix Inc.
January 11, 2018 - N°20180012905

Disclosed is a method of manufacturing a semiconductor device, including: forming a slacked structure including first material layers and second material layers alternately stacked on each other; forming a pillar passing through the stacked structure, the pillar including a protruding portion protruding above an uppermost surface of the stacked structure; forming a conductive layer surrounding the protruding portion of the ...
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Conductive Layer Patent Applications
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  • 1100+ full patent PDF documents of Conductive Layer-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Integrated circuits
Hewlett-packard Development Company, L.p.
January 11, 2018 - N°20180012900

The present subject matter relates to an integrated circuit comprising an erasable programmable read only memory (eprom) array having a plurality of eprom cells disposed in rows and columns, wherein one or more eprom cells located at predetermined positions in the eprom array are selectively dischargeable. The one or more eprom cells comprise a eprom transistor having a first conductive ...
Method of manufacturing integrated circuit device
Samsung Electronics Co., Ltd.
January 11, 2018 - N°20180012894

A method of manufacturing an integrated circuit device includes forming multilayered stack structures that extend parallel to and separated from one another on a substrate, followed by forming a buried conductive layer including a plurality of conductive line patterns that extend parallel to an extending direction of the multilayered stack structures and alternate with the multilayered stack structures; removing portions ...
Array substrate, display device and manufacturing method of array substrate
Boe Technology Group Co., Ltd.
January 11, 2018 - N°20180012885

Embodiments of the invention provide an array substrate, a display device and a manufacturing method of the array substrate. The array substrate comprises a substrate (10) and a plurality of electrostatic discharge short-circuit rings (20) provided on the substrate. Each of the electrostatic discharge short-circuit rings (20) comprises a gate electrode (22), a gate insulating layer (26), an active layer (21), a source electrode (23), a drain ...
Antenna in embedded wafer-level ball-grid array package
Stats Chippac Pte. Ltd.
January 11, 2018 - N°20180012851

A semiconductor device has a semiconductor die and an encapsulant deposited over the semiconductor die. A first conductive layer is formed with an antenna over a first surface of the encapsulant. A second conductive layer is formed with a ground plane over a second surface of the encapsulant with the antenna located within a footprint of the ground plane. A ...
Hybrid interconnects and method of forming the same
International Business Machines Corporation
January 11, 2018 - N°20180012841

A method for manufacturing a semiconductor device includes forming a trench in at least one dielectric layer; and forming an interconnect structure in the trench, wherein forming the interconnect structure includes forming a first conductive layer on a bottom surface of the trench, and partially filling the trench, and forming a second conductive layer on the first conductive layer, and ...
Semiconductor devices, via structures and methods for forming the same
Vanguard International Semiconductor Corporation
January 11, 2018 - N°20180012823

A semiconductor device includes a via structure penetrating through a substrate, a top metal layer and an electronic component over the via structure, and a bottom metal layer and another electronic component below the via structure. The via structure includes a through hole penetrating from a first surface to an opposite second surface of a substrate, a filling insulating layer ...
Semiconductor device and a method for fabricating the same
Taiwan Semiconductor Manufacturing Co., Ltd.
January 11, 2018 - N°20180012806

In a method of manufacturing a semiconductor device, a dummy gate structure is formed over a substrate. A first insulating layer is formed over the dummy gate structure. The dummy gate structure is removed so as to form a gate space in the first insulating layer. A first conductive layer is formed in the gate space so as to form ...
Conductive Layer Patent Pack
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Conductive Layer Patent Applications
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For professional research & prior art discovery
inventor
  • 1100+ full patent PDF documents of Conductive Layer-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Electronic package and manufacturing method thereof
Globalfoundries Singapore Pte. Ltd.
January 11, 2018 - N°20180012774

An electronic package including a middle patterned conductive layer, a first redistribution circuitry disposed on a first surface of the middle patterned conductive layer and a second redistribution circuitry disposed on a second surface of the middle patterned conductive layer is provided. The middle patterned conductive layer has a plurality of middle conductive pads. The first redistribution circuitry includes a ...
Display device
Innolux Corporation
January 11, 2018 - N°20180012549

A display device is provided. The display device includes a substrate having a first surface and a second surface opposite to the first surface. The display device also includes a first conductive layer disposed on the first surface and a second conductive layer disposed on the second surface. The display device further includes a processing unit disposed on the second ...
Touch display device with tactile feedback function and driving method thereof
Wuhan China Star Optoelectronics Technology Co. Ltd.
January 11, 2018 - N°20180011572

Disclosed is a touch display device with tactile feedback function, including a first substrate (10), a second substrate (20), a liquid crystal layer (30), a patterned conductive layer (50) and an insulation layer (40); the patterned conductive layer (50) comprises a plurality of first signal lines (1) which are separately arranged in parallel and extended along a horizontal direction, and a plurality of second signal lines (2) which ...
Transparent conductive coating for capacitive touch panel with additional functional film(s)
Guardian Glass, Llc
January 11, 2018 - N°20180011567

A multi-layer conductive coating is substantially transparent to visible light, contains at least one conductive layer comprising silver that is sandwiched between at least a pair of dielectric layers, and may be used as an electrode and/or conductive trace in a capacitive touch panel. The multi-layer conductive coating may contain a dielectric layer of or including zirconium oxide (e. ...
Display device having a connection member secured in place by a conductive layer
Samsung Display Co., Ltd.
January 11, 2018 - N°20180011369

A display device includes a pad portion disposed on a first substrate, a connection member disposed on the pad portion, and an anisotropic conductive layer disposed between the pad portion and the connection member, the anisotropic conductive layer including conductive particles. The pad portion includes a pad, the pad including a first pad electrode and a second pad electrode. A ...
Display device
Japan Display Inc.
January 11, 2018 - N°20180011366

A liquid crystal display device includes a first substrate having a pixel electrode and a common electrode provided thereon; a second substrate formed of a resin material; a liquid crystal layer provided between the first substrate and the second substrate; an optical film facing the liquid crystal layer with the second substrate being provided between the optical film and the ...
Device for the regulation of light transmission
Merck Patent Gmbh
January 11, 2018 - N°20180011359

The present application discloses a switchable device, comprising a switching layer and a first conductive layer and a second conductive layer, where the switching layer is positioned between the first and the second conductive layer, and where at least one of the first and the second conductive layers comprises a plurality of isolating sections and a plurality of conductive sections, ...
Waveguide type optical element
Sumitomo Osaka Cement Co., Ltd
January 11, 2018 - N°20180011348

To effectively prevent the acceleration of the drift phenomenon generated by the application of a high electric field to a substrate through a bias electrode in a waveguide type optical element. A waveguide type optical element includes a substrate (100) having an electro-optic effect, two optical waveguides (104 and 106) disposed on a surface of the substrate, a non-conductive layer (120) which is disposed ...
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