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Conductive Layer

Conductive Layer-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Transparent emi shielding/absorbing film
Korea Institute Of Science And Technology
September 14, 2017 - N°20170265338

A transparent emi shielding/absorbing film is provided. The transparent emi shielding/absorbing film includes a transparent substrate having a top surface on which a pattern having a plurality of engraved grooves is disposed, a conductive layer disposed in the grooves, and a conductive nanowire layer disposed on the top surface of the transparent substrate and electrically connected with the ...
Trench cutting with laser machining
Ubeam Inc.
September 14, 2017 - N°20170265308

Systems and techniques are provided for trench cutting with laser machining. A laminate material including a conductive layer and a non-conductive layer may be cut with a first cut using a uv-laser. The cutting of a second cut, using the uv-laser, may be started at a top electrode of the non-conductive layer based on the location of the first cut, ...
Antennas including dual radiating elements for wireless electronic devices
Sony Mobile Communications Inc.
September 14, 2017 - N°20170264008

A wireless electronic device includes first and second conductive layers arranged in a face-to-face relationship. The first and second conductive layers are separated from one another by a first dielectric layer. The wireless electronic device includes a first radiating element and a second radiating element. The first conductive layer includes a slot. The second conductive layer includes a stripline. The ...
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Semiconductor memory device having local bit line with insulation layer formed therein
Kabushiki Kaisha Toshiba
September 14, 2017 - N°20170263681

According to one embodiment, a semiconductor memory device includes first conductive layers extending in a first direction and stacked in a second direction intersecting the first direction, a first semiconductor layer extending in the second direction and including a material having one of a first conductivity type and a second conductivity type, a first insulation layer disposed inside the first ...
Semiconductor memory device and method of manufacturing the same
Kabushiki Kaisha Toshiba
September 14, 2017 - N°20170263624

A semiconductor memory device according to an embodiment comprises: a semiconductor substrate; a semiconductor layer provided extending in a first direction above the semiconductor substrate, on the semiconductor substrate; a first insulating layer provided on a side surface of the semiconductor layer; a charge accumulation layer provided on a side surface of the first insulating layer; a block insulating layer ...
Memory device and manufacturing method thereof
Sk Hynix Inc.
September 14, 2017 - N°20170263620

There are provided a memory device and a manufacturing method thereof. A method of manufacturing a memory device may include forming, on a substrate, a conductive layer, a sacrificial layer, and a stack structure. The method may include forming a plurality of vertical holes by etching a portion of the stack structure. The method may include forming a memory layer ...
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Conductive Layer Patent Applications
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Method for making a shielded integrated circuit (ic) package with an electrically conductive polymer layer
Stmicroelectronics, Inc
September 14, 2017 - N°20170263566

A method for making shielded integrated circuit (ic) packages includes providing spaced apart ic dies carried by a substrate and covered by a common encapsulating material, and cutting through the common encapsulating material between adjacent ic dies to define spaced apart ic packages carried by the substrate. An electrically conductive layer is positioned over the spaced apart ic packages and ...
Power and ground routing of integrated circuit devices with improved ir drop and chip performance
Mediatek Inc.
September 14, 2017 - N°20170263559

An integrated circuit chip includes a semiconductor substrate having thereon a plurality of inter-metal dielectric (imd) layers and a plurality of first conductive layers embedded in respective said plurality of imd layers, wherein said first conductive layers comprise copper; a first insulating layer overlying said plurality of imd layers and said plurality of first conductive layers; at least a first ...
Semiconductor package and manufacturing method thereof
Amkor Technology, Inc.
September 14, 2017 - N°20170263544

A semiconductor device with enhanced interposer quality, and method of manufacturing thereof. For example and without limitation, various aspects of the present disclosure provide an interposer die that comprises a first signal distribution structure comprising at least a first dielectric layer and a first conductive layer, wherein the signal distribution structure is protected at lateral edges by a protective layer. ...
Semiconductor device and method of forming embedded conductive layer for power/ground planes in fo-ewlb
Stats Chippac Pte. Ltd.
September 14, 2017 - N°20170263470

A semiconductor device has a first conductive layer and a semiconductor die disposed adjacent to the first conductive layer. An encapsulant is deposited over the first conductive layer and semiconductor die. An insulating layer is formed over the encapsulant, semiconductor die, and first conductive layer. A second conductive layer is formed over the insulating layer. A first portion of the ...
Electronic component and manufacturing method for the same
Murata Manufacturing Co., Ltd.
September 14, 2017 - N°20170263383

In an electronic component, a first outer electrode includes a first conductive layer provided on a first end surface. A second outer electrode includes a second conductive layer provided on a second end surface. A first inner electrode passes through the first conductive layer. A second inner electrode passes through the second conductive layer.
Magnetic memory device
Murata Manufacturing Co., Ltd.
September 14, 2017 - N°20170263296

Furthermore, the magnetic memory device further includes a fourth magnetic layer being in contact with the first and second magnetoresistive elements or in contact with conductive layers on the first and second magnetoresistive elements.
Liquid crystal display panel and device
Wuhan China Star Optoelectronics Technology Co., Ltd.
September 14, 2017 - N°20170263200

A liquid crystal display (lcd) panel and an lcd device are provided. The panel has: a first transparent conductive layer configured to introduce a first polarity electric charge accumulated on a first substrate, a second transparent conductive layer configured to introduce a second polarity electric charge accumulated on a second substrate, and a connecting component disposed on the first substrate ...
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Conductive Layer Patent Applications
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  • 1100+ full patent PDF documents of Conductive Layer-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Electro-optical device and electronic device
Seiko Epson Corporation
September 14, 2017 - N°20170261786

An electro-optical device may include a first substrate including a pixel area in which a plurality of pixels are aligned, a second substrate, a seal member disposed between the first substrate and the second substrate so as to bond the first substrate and the second substrate together, the seal member being disposed in a seal region defined around the pixel ...
Polymeric electrode films
Phase2 Microtechnologies Inc.
September 14, 2017 - N°20170261461

This application describes microelectronic ph sensors that can include indicating electrodes having a substrate, an electrode disposed on the substrate, a reactive layer disposed on a portion of the electrode, and a conductive layer disposed on the reactive material and reference electrodes having similar architecture.
Rolling bearing comprising an electric circuit, and method for producing an electric circuit for a ...
Schaeffler Technologies Ag & Co. Kg
September 14, 2017 - N°20170261037

A rolling bearing including an electric circuit is disclosed. According to the invention, a first electrically insulating layer is applied directly to at least one surface portion of the rolling bearing. A first electrically conductive layer which includes a plurality of conductor paths with contact points for electrically contacting electrical components is provided on top of the first electrically insulating ...
Mems device and mems vacuum microphone
Infineon Technologies Ag
September 14, 2017 - N°20170260040

In accordance with an embodiment, a mems device includes a first membrane element, a second membrane element spaced apart from the first membrane element, a low pressure region between the first and second membrane elements, the low pressure region having a pressure less than an ambient pressure, and a counter electrode structure comprising a conductive layer, which is at least ...
Surgical tool with flex circuit ultrasound sensor
Covidien Lp
September 14, 2017 - N°20170258439

A medical instrument includes a printed ultrasound sensor, a surface, at least one non-conductive material, and at least one pair of contacts. The ultrasound sensor includes an array of ultrasound transducers printed on a non-conductive surface of the medical instrument. The medical instrument contains multiple conductive and nonconductive layers. The at least one pair of contacts are electrically coupled to ...
Conductive device substrate, method for manufacturing conductive device substrate, and display panel
Au Optronics Corporation
September 07, 2017 - N°20170256738

The disclosure provides a method for manufacturing a conductive device substrate. First, a carrier substrate is provided and an organic pillar is formed on the carrier substrate. Subsequently, a conductive layer is formed. The conductive layer covers the organic pillar to form a conductive pillar. The conductive pillar has a first surface and a second surface opposite to each other. ...
Method for manufacturing electrode and resistive random access memory
Winbond Electronics Corp.
September 07, 2017 - N°20170256712

A method for manufacturing an electrode including the following steps is provided. A conductive layer is formed on a base material. A radio frequency physical vapor deposition (rf pvd) transition metal compound layer is formed on the conductive layer by using a rf pvd. A sacrificial layer is formed on the rf pvd transition metal compound layer. A planarization process ...
Light-emitting element having a reflective structure with high efficiency
Epistar Corporation
September 07, 2017 - N°20170256678

A light-emitting device comprises a light-emitting stack; a reflective structure comprising a reflective layer on the light-emitting stack and a first insulating layer covering the reflective layer; and a first conductive layer on the reflective structure; wherein the first insulating layer isolates the reflective layer from the first conductive layer.
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