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Conductive Layer

Conductive Layer-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Stacked filters
Raytheon Company
July 13, 2017 - N°20170200998

A filter assembly in a multi-layer printed wiring board. One or more conductors is formed on an internal layer of a printed wiring board. Surrounding dielectric layers and ground layers form, together with the conductors of the internal layer, microstrip or stripline transmission lines and distributed element filters. The filter assembly may include a plurality of internal conductive layers, each ...
Method for manufacturing semiconductor device
Semiconductor Energy Laboratory Co., Ltd.
July 13, 2017 - N°20170200828

In a semiconductor device including a transistor in which an oxide semiconductor layer, a gate insulating layer, and a gate electrode layer on side surfaces of which sidewall insulating layers are provided are stacked in this order, a source electrode layer and a drain electrode layer are provided in contact with the oxide semiconductor layer and the sidewall insulating layers. ...
Manufacturing method of metal oxide semiconductor thin film transistor
Chunghwa Picture Tubes, Ltd.
July 13, 2017 - N°20170200814

A manufacturing method of a metal oxide semiconductor thin film transistor is provided. The manufacturing method includes following steps. A gate, a gate insulating layer, a patterned metal oxide semiconductor layer and a conductive layer are formed on a substrate first. Next, a first patterned photoresist layer and two second patterned photoresist layers are formed on the conductive layer. Next, ...
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Flip-chip image sensor package
Omnivision Technologies, Inc.
July 13, 2017 - N°20170200755

A flip-chip image-sensor package includes a substrate, a coverglass, a conductive layer, and an image sensor. The substrate has an aperture therethrough and a first region and a second region each at least partially surrounding the aperture. The aperture has a first width defined by a boundary of the first region, and a second width defined by a boundary of ...
Semiconductor memory device and method for manufacturing same
Kabushiki Kaisha Toshiba
July 13, 2017 - N°20170200731

According to an embodiment, a semiconductor memory device includes a stacked body, a semiconductor pillar, a memory film, a first structure body, and a first connection portion. The stacked body includes a first conductive layer and a second conductive layer. The semiconductor pillar extends in the first direction through the stacked body. The memory film provides between the stacked body ...
Power and ground design for through-silicon via structure
Advanced Semiconductor Engineering, Inc.
July 13, 2017 - N°20170200702

In one or more embodiments, a semiconductor device includes a substrate, a first dielectric layer and a first conductive layer. The substrate includes a first surface and a second surface opposite the first surface. The first dielectric layer is on the first surface of the substrate. The first conductive layer is on the first surface of the substrate and includes ...
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Conductive Layer Patent Applications
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  • 1100+ full patent PDF documents of Conductive Layer-related inventions.
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Integrated circuit heat dissipation using nanostructures
International Business Machines Corporation
July 13, 2017 - N°20170200665

An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer. The method additionally includes forming a plurality of nanowire structures on a surface of the electrically conductive layer
Semiconductor device having work-function metal and method of forming the same
Samsung Electronics Co., Ltd.
July 13, 2017 - N°20170200652

In a semiconductor device, a first active area, a second active area, and a third active area are formed on a substrate. A first gate electrode is formed on the first active area, a second gate electrode is formed on the second active area, and a third gate electrode is formed on the third active area. The first gate electrode ...
Through electrode, manufacturing method thereof, and semiconductor device and manufacturing method thereof
National Institute Of Advanced Industrial Science And Technology
July 13, 2017 - N°20170200644

Embodiments provided are a through electrode that can be manufactured by a method not including the step of removing a side-wall insulating film formed at the bottom part of the through hole and so having improved electrical characteristics and mechanical reliability and a manufacturing method thereof as well as a semiconductor device and a manufacturing method thereof. A through electrode ...
Method for forming semiconductor device structure
Taiwan Semiconductor Manufacturing Co., Ltd.
July 13, 2017 - N°20170200612

A method for forming a semiconductor device structure is provided. The method includes forming a dielectric layer over a semiconductor substrate. The dielectric layer has a first recess. The method includes forming a first conductive material layer over an inner wall and a bottom of the first recess. The first conductive material layer is partially filled in the first recess. ...
Inductor and manufacturing method of the same
Samsung Electro-mechanics Co., Ltd.
July 13, 2017 - N°20170200551

An inductor includes a body including a coil, the coil including a plurality of coil patterns connected by a via, is disposed, wherein the via includes a first conductive layer and a second conductive layer, formed on the first conductive layer, and the second conductive layer includes a conductive powder and an organic material.
Stretchable interconnects for flexible electronic surfaces
Alpha Assembly Solutions Inc.
July 13, 2017 - N°20170200527

A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
Touch-controlled panel, method of manufacturing the same, and display device
Hefei Xinsheng Optoelectronics Technology Co., Ltd.
July 13, 2017 - N°20170199615

Embodiments of the present invention discloses a touch-controlled panel and a method of manufacturing the same, and a display device, to reduce the number of masks and production cost. The method of manufacturing a touch-controlled panel includes: forming a first electrode and a second electrode on a substrate through a patterning process, the first electrode and the second electrode being ...
Conductive Layer Patent Pack
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Conductive Layer Patent Applications
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For professional research & prior art discovery
inventor
  • 1100+ full patent PDF documents of Conductive Layer-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
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Conductive layered structure and methods of making same
3m Innovative Properties Company
July 13, 2017 - N°20170199591

A device including a transparent or semitransparent substrate and at least one layered structure disposed on a first major surface of the substrate is described. The layered structure includes a first ito layer on the substrate, a silicon dioxide layer on the first ito layer opposite the substrate, and a second ito layer on the silicon dioxide layer opposite the ...
Liquid crystal display device
Japan Display Inc.
July 13, 2017 - N°20170199415

A liquid crystal display device includes a first substrate having a pixel electrode and a common electrode provided thereon; a second substrate formed of a resin material; a liquid crystal layer provided between the first substrate and the second substrate; an optical film facing the liquid crystal layer with the second substrate being provided between the optical film and the ...
Formulations comprising metal nanowires and pedot
Heraeus Deutschland Gmbh & Co. Kg
July 13, 2017 - N°20170198155

The present invention relates to a composition comprising i) particles comprising a conductive polymer, ii) metal nanowires, and iii) at least one solvent, wherein at least one of the following conditions is satisfied: α1) the particles comprising the conductive polymer are characterized by a weight average particle diameter of less than 100 nm; α2) the content of cations of ...
Container of consumer goods having a wirelessly powered electronic device
Philip Morris Products S.a.
July 13, 2017 - N°20170197777

There is provided a container (30) of consumer goods, the container (30) comprising a wrapped bundle of consumer goods (10) comprising a wrapper (16) wrapped around one or more consumer goods. The wrapper (16) comprises a folded laminar blank comprising at least one carrier layer (12) and at least one conductive layer (13), the at least one conductive layer (13) forming at least one power transfer receiver coil (14) ...
Chafing dish
Catalytic Burners Limited
July 13, 2017 - N°20170196402

The present invention relates to a more efficient chafing dish basin or bain marie for the hotel/catering and hospitality industry, that has a first exterior basin with a heating element, a second basin comprising an insulating base, one or more heat conductive layers and a third food basin. The first exterior basin has a heating element that extends through ...
Device for preventing data theft, use of false identity, and fraud during contactless data transmission ...
Catalytic Burners Limited
July 06, 2017 - N°20170196129

The application relates to a receptacle comprising a plurality of inside pockets for holding objects, each of which is equipped with an rfid or nfc chip. At least two surfaces of the receptacle which include at least one of the plurality of inside pockets are provided with an electrically conductive layer so that the at least one of the plurality ...
Laminated antenna
Advanced-connectek Inc.
July 06, 2017 - N°20170194700

A laminated antenna includes a bases board having a grounding port and a feed-in port, a feed-in portion on the base board, a dielectric layer, a conductive layer, and a second winding portion. The feed-in portion has opposite first and second ends. The first end is connected to the feed-in port. The dielectric layer has a covering surface covering the ...
Dual-layer sturctured cathode and electrochemical cell
U.s. Government As Represented By The Secretary Of The Army
July 06, 2017 - N°20170194644

The present invention relates to dual-layered structured sulfur cathodes comprising (a) an electroactive layer and (b) a non-electroactive conductive layer, wherein the non-electroactive conductive layer adsorbs soluble polysulfides and provides reaction sites for the reduction of polysulfides. The present invention also relates to method of making dual-layered structured sulfur cathodes and electrochemical cells.
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