|| List of recent Circuit Board-related patents
|Configuring a trusted platform module|
A method includes storing configuration data for a trusted platform module (tpm) in a pre-boot environment such as unified extensible firmware interface (uefi), reading the configuration data, and automatically configuring the tpm based upon the configuration data. The configuring includes storing values of tpm parameters in non-volatile memory of the tpm.
|Resource mapping in a hardware emulation environment|
A system and method is disclosed in an emulation environment that dynamically remaps user designs. In one embodiment, a request is received to load an integrated circuit design to be emulated in a desired partition within the emulator.
|Electrical connectors and printed circuits having broadside-coupling regions|
An electrical connector that includes a circuit board having a board substrate that has opposite board surfaces and a thickness measured along an orientation axis that extends between the opposite board surfaces. The circuit board has associated pairs of input and output terminals and signal traces that electrically connect the associated pairs of input and output terminals.
|Contact configuration for undertaking tests on circuit board|
An electronic structure (for example a reliability board or a cycling control module) has a body including a body portion insertable into a connector. A plurality of contact structures are provided on a side of the body portion, each contact structure comprising a first contact and a second contact spaced from the first contact, with the first and second contacts of each contact structure being aligned in the direction of insertion of the body portion into the connector.
|Microwave coaxial connector, intended notably to link two printed circuit boards together|
The present invention relates to a novel microwave coaxial connector that allows for a board-to-board connection over a very short distance, typically less than or equal to 2 mm, with relatively high tolerances in relative value terms but low tolerances in absolute value terms, typically equal to 0.2 mm, and at the same time ensuring a good electrical contact between all the tracks of the printed circuits to be connected.. .
|Externally serviceable it memory dimms for server/tower enclosures|
An electronic component carrier and method for mounting the electronic component to a circuit board includes a frame including a header having opposing attachment arms extending outwardly therefrom for seating an electronic component within the frame. A latching mechanism of the frame includes latching members at a distal end of each of the attachment arms for releaseably seating the electronic component between the attachment members.
|Speaker mechanism having a conforming circuit board|
A device removeably attachable to a case for an electronic device for delivering sound includes a housing having a speaker means and a printed circuit board assembly mounted in the housing. The printed circuit board assembly is in electronic communication with the speaker means.
|Light emitting module applied to display device|
A light emitting module includes a first circuit board, a driver chip, two connectors, a second circuit board and a plurality of light emitting units. The driver chip is disposed on the first circuit board.
|Led-based lighting with reflector mounted on pcb|
An led-based lighting component is disclosed. It comprises of a plurality of leds mounted to a printed circuit board.
|Circuit board element having at least one led|
The invention relates to a circuit board element (1) comprising a substrate (2), on which at least one dielectric layer (7) is arranged, and at least one led (light-emitting diode) (10), wherein at least one channel-shaped waveguide cavity (11) leading away from the led (10) is provided in the dielectric layer (7), which waveguide cavity leads to at least one integrated light-sensitive component (12), preferably a photo-diode or photocell, arranged for examining the light emission, wherein the led (10) is preferably also arranged in a cavity (9) that is connected to the waveguide cavity (11). The invention further relates to a method for producing such a circuit board element (1)..
|Backlight assembly and method of assembling the same and liquid crystal display including backlight assembly|
A backlight assembly includes a light source unit including a circuit board, a light source disposed on a first plane of the circuit board, and at least one connection unit disposed on a second plane opposite to the first plane of the circuit board and electrically connected to the light source, a receiving container having a bottom plate and sidewalls extending from edges of the bottom plate and receiving the light source unit, the bottom plate including at least one opening portion in which the connection unit is inserted and exposed to the outside, and at least one driving unit disposed at a rear surface of the receiving container and connected to the connection unit for driving the light source unit.. .
|Carrier board for attachment of integrated circuit to circuit board|
An electronics system includes a main circuit board; main circuitry located on the main circuit board; a carrier board located on top of the main circuit board; an integrated circuit (ic) located on the carrier board, wherein the ic is electrically connected to the main circuitry on the main circuit board; and a layer of adhesive located between the carrier board and the main circuit board.. .
|Audio and video reproduction apparatus having main board on which surface mount type connectors are mounted|
Provided is a video and audio reproduction apparatus including a display unit; a speaker unit; a main board; and a power supply unit, and the main board includes a printed circuit board; a first connector area which is formed on a front side of the printed circuit board; a second connector area which is formed on the front side of the printed circuit board; and a main chip which is surface-mounted on a back side of the printed circuit board.. .
|Circuit board assembly using metal plates as conducting medium embedded therein|
A circuit board assembly includes metal plates to be used as conducting medium, an encapsulation enclosing therein the metal plates and provided with holes defined in the encapsulation to allow extension of the metal plates out of the encapsulation for electrical connection and electronic components securely mounted on the encapsulation and electrically connected to the metal plates to form a closed loop.. .
|Mounting structure for printed circuit board, and semiconductor device using such structure|
A mounting structure for a printed circuit board, includes a printed circuit board to which a heavy material is fixed; a fixing member fixed to the printed circuit board immediately below the heavy material; and a receiving member fixed to a main body. A bottom portion of the fixing member is disposed in the receiving member, and fixed to the receiving member by a resin adhesive..
An electronic component is provided that includes a spatial light modulator device, and a circuit board comprising a first major surface, at least one electrically conductive redistribution layer and a first cavity positioned in the first major surface. The spatial light modulator device is positioned within the cavity and is electrically connected to the redistribution layer..
A display module includes a panel frame, a display panel, a system frame, and a printed circuit board. The panel frame includes a baseplate having at least one edge, at least one sidewall located on the edge, at least one top wall adjacent to the sidewall, and a support element.
|Multiple antenna system|
A multiple antenna module suitable for use in small sized mobile computing devices includes at least a first antenna extending beyond a lateral edge of and coplanar with a printed circuit board assembly and connected to the printed circuit board assembly via a first antenna ground contact and a first antenna feed contact. The multiple antenna module also includes a second antenna located proximate to the first antenna and configured in a plane perpendicular to the plane continuing the first antenna and the printed circuit board.
A mobile terminal includes: a terminal body having a battery and an antenna module; a printed circuit board having one or more processors disposed between the battery and the antenna module, and mounted to the terminal body; a partition wall formed at the terminal body such that a region for mounting the antenna module is partitioned from a region for mounting the printed circuit board; and a shielding member coupled to the partition wall, such that electromagnetic interference of an antenna device due to an operation of the processor is prevented.. .
|Mobile wireless communications device with electrically conductive continuous ring and related methods|
A mobile wireless communications device may include a portable housing that may include an electrically conductive continuous ring defining a perimeter of the portable housing. The electrically conductive continuous ring may be configured to function as an antenna.
|Remote controlled pricing information|
A coordinated system of printed circuit board (pcb) assemblies for displaying information, such as advertising and pricing information. Each individual pcb assembly may display a unit price, such as a price for particular type of gasoline or other product.
|Relay assembly with fastening clip|
A relay assembly comprises a relay mounted on a board. The relay may be a single or individual relay or a polyphasic relay.
|Crystal oscillation device and semiconductor device|
A wiring pattern for oscillation input signal and a wiring pattern for oscillation output signal are provided on a printed circuit board, and a wiring pattern for ground power source voltage is arranged in a region therebetween. A quartz crystal unit is connected between the wiring pattern for oscillation input signal and the wiring pattern for oscillation output signal and one ends of capacitors serving as load capacitors thereof are connected to the wiring pattern for ground power source voltage.
|Rf power amplifier and method of assembly for same|
In general, an rf power amplifier comprises a controller, a driver, a splitter, a final stage, and a combiner coupled together to function as the rf power amplifier. One or more of the above components are arranged on one or more motherboards, e.g., a printed circuit board (pcb).
|Multi-purpose integrated circuit device contactor|
A contactor uses a pogo block in a first configuration as a direct integrated circuit test socket and the contactor can be reconfigured to provide a pogo block assembly to interface between a main test printed circuit board (pcb) and a daughter card that is dedicated to a specific device handler and/or a specific package type that can be different from the main test pcb. A pogo block is inserted into a thick frame with an alignment plate for contactor use in which a device under test fits into a recess in the frame through an alignment plate to align the device under test to make contact with electrical contacts of the contactor.
|Portable motion activated cell phone charger utilizing a shelled torus permanent magnet generator|
A portable motion activated cell phone charger utilizing a shelled torus permanent magnet generator to generates electricity by kinetic energy imparted by the user if strapped to the arm or leg when jogging or may also be waved in the hand in an oscillating motion to generate electricity which is stored in a rechargeable battery within the charger assembly of which has a control circuit board with universal serial port attached and accessible from the exterior body casing allowing the user to connect a cell phone or small electronic devices with a universal serial bus cable to power the device or charge a battery within said device.. .
|Reduced size power inverter suitable for a vehicle|
A power inverter comprises at least a box-shaped housing; and a power module, a smoothing capacitor, a base plate made of a flat plate, and a rotating electric machine control circuit board arranged in order in the housing. The base plate is arranged with the fringes fixed to the inner wall surfaces of the housing, and the smoothing capacitor and rotating electric machine control circuit board are fixed..
|Brush holder for an electric motor, and gear mechanism drive unit having a brush holder|
A brush holder (100) for an electric motor (12a; 12b), having a brush holder main body (20) which has a passage opening (25) for an armature shaft to pass through, having a first receiving region (37) for fastening a printed circuit board (35), on which electrical or electronic components are mounted, to the brush holder main body (20), wherein the first receiving region (37) extends as far as into a region between an outer boundary (23, 24) of the brush holder main body (20) and the passage opening (25), and wherein the first receiving region (37) for the printed circuit board (35) is designed to arrange the printed circuit board (35) on the brush holder main body (20) at least substantially perpendicularly to the plane of the brush holder main body (20), and having components (26, 33) which are arranged on the brush holder main body (20) and which are mechanically and/or electrically connected at least indirectly to the printed circuit board (35).. .
In a clamping device, a detection mechanism detects a state of clamping/unclamping and includes: a detected body that moves together with a piston and a piston rod; a circuit board disposed to face the detected body and capable of detecting the position of the detected body; and an indicator lamp that is connected to the circuit board and is lit/extinguished depending on the state of clamping/unclamping. By pressing a setting button provided on the detection mechanism when the rotation angle of the arm is changed, the second detection position of the circuit board for detecting the unclamped state is changed, making it possible to detect the detected body at a newly set detection position..
|Stacked type semiconductor device and printed circuit board|
The printed circuit board (100) includes the interposer (2) where the semiconductor element (1) is mounted and the electrode pad (8) is formed on one surface, the printed wiring board (3) where the electrode pad (9) is formed on one surface facing the interposer (2), and the joint material (70) for bonding the electrode pads (8) and (9). The joint material (70) includes the solder layer (60) formed by the solder material (11) and the metal layers (50), (50) provided to the electrode pads (8) and (9).
|Millimeter wave wafer level chip scale packaging (wlcsp) device and related method|
Various embodiments include wafer level chip scale package (wlcsp) structures and methods of tuning such structures. In some embodiments, the wlcsp structure includes: a printed circuit board (pcb) trace connection including at least one pcb ground connection connected with a pcb ground plane; a set of ground solder balls each contacting the printed circuit board trace connection; a set of chip pads contacting each of the ground solder balls in the set of ground solder balls; a chip ground plane connecting the set of chip pads; and a signal interconnect interposed between two of the set of ground solder balls, the signal interconnect including: a signal trace connection electrically isolated from the pcb ground plane; a signal ball contacting the signal pcb trace connection; a chip pad contacting the signal ball, and a signal trace connection on a chip contacting the chip pad..
|Semiconductor chip package structure|
A method for fixing a semiconductor chip on a circuit board is provided, which includes following steps. The circuit board is provided, which sequentially includes a substrate having a chip connecting portion, at least one metal wire and an insulating layer.
|Antenna, method of manufacturing the antenna, and wireless ic device|
An antenna includes first and second radiation portions including one lead wire that is folded back into a loop shape to define a folded-back portion and that includes a first power feed portion at a first end and a second power feed portion at a second end. The lead wire portion extending toward the folded-back portion and the lead wire portion extending through the folded-back portion are close enough to each other near each of the first and second power feed portions in the first and second radiation portions, respectively, to be electromagnetically coupled to each other.
|Method of manufacturing electronic component unit|
An electronic component unit manufacturing method includes: preparing a circuit board including a heat generating element mounted thereon and a bonding metal foil layer formed thereon, a heat transfer board including an insulative layer formed on one face thereof and a heat transfer metal foil layer formed on the insulative layer, and a heat sink; applying a cream solder to form a solder layer on the board bonding metal foil layer or the heat transfer metal foil layer; superimposing the bonding metal foil layer and the heat transfer metal foil layer with each other via the solder layer; re-melting the solder layer to solder the bonding metal foil layer and the heat transfer metal foil layer; and superimposing the other face of the heat transfer board with the heat sink to thereby assemble the circuit board with the heat sink via the heat transfer board.. .
|Remote controlled drilling rig|
A remote controlled drilling rig that is fully functional includes a drilling rig, an electrical assembly, and a remote. The drilling rig includes a truck for towing a semi-trailer on which is positioned a derrick and a drilling assembly.
|Electromagnetic interference shield|
An assembly configured to protect a circuit board from electromagnetic interference. The assembly includes a metal shield and an enclosure.
|Multi-finish printed circuit board|
A multi-finish printed circuit board may include one or more electrically conductive elements, such as through hole pads, that may have a first surface finish and one or more electrically conductive elements, such as surface mount pads, that may have a second surface finish that is different from the first surface finish. The first surface finish may be a hot air solder leveling (hasl) surface finish or a lead-free hot air solder leveling (lf hasl) surface finish and the second surface finish may be an organic surface protector (osp) surface finish.
|Base material for forming electroconductive pattern, circuit board, and method for producing each|
The present invention pertains to: a base material for forming an electroconductive pattern, adapted to form an electroconductive pattern and obtain a circuit board; the circuit board obtained therefrom; and a method for producing each. The base material for forming an electroconductive pattern, adapted to obtain a circuit board, includes a supporter, and a holding region for holding a fluid body for obtaining an electroconductive pattern, the holding region being formed atop one end surface of the supporter and exhibiting a proper wettability for the fluid body.
|Thermoplastic liquid crystal polymer film, and laminate and circuit board using same|
Where ∈r1 denotes the relative dielectric constant before the heating, ∈r2 denotes the relative dielectric constant after the heating. These relative dielectric constants are measured at the same frequency in a range of 1 to 100 ghz..
|Epoxy resin compound and radiant heat circuit board using the same|
An epoxy resin composition having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of chemical formula.
|Flexible circuit board and ground line strucure|
A ground line structure adapted to a flexible circuit board is provided. The ground line structure includes a plurality of ground line structure units located on the flexible circuit board to form a meshed pattern.
|Systems and methods for potted shock isolation|
Systems and methods for potted shock isolation are provided. In once embodiment a shock isolation system comprises an isolator comprising an outer ring for mounting to an external housing, and an inner ring connected to the outer ring via an isolating element; and an inertial sensing assembly comprising: at least one circuit board secured to the inner ring of the isolator, the at least one circuit board further comprising a triad of gyroscopes and a triad of accelerometers; and a low durometer highly dampened supporting material encapsulating a first surface of the at least one circuit board..
|Lift off process for conductor foil layer|
A flex-circuit or a rigid printed circuit board is formed by depositing an adhesive pattern on a top surface of a substrate. The adhesive pattern corresponds to a copper foil pattern to be formed for interconnecting electronic components.
|In-circuit test structure for printed circuit board|
A printed circuit board, an in-circuit test structure and a method for producing the in-circuit test structure thereof are disclosed. The in-circuit test structure comprises a via and a test pad.
|Reconfigurable modular computing device|
A configurable computing device comprising a housing, a printed circuit board disposed within the housing, a first microcontroller and a second microcontroller each coupled to the pcb, wherein the first microcontroller and the second microcontroller are in electrical signal communication with each other, a computer-on-module (com) coupled to the pcb, wherein the com is in electrical signal communication with the first microcontroller and the second microcontroller, and one or more peripheral modules coupled to the pcb, wherein, the peripheral modules are each in electrical signal communication with the first microcontroller and wherein, the peripheral modules are each in electrical signal communication with the com via the second microcontroller.. .
|Wearable device for a user|
The wearable device for sensing a body status is placed on the user. The wearable device includes a flexible printed circuit board and a semi-cured sheet encapsulatingly conforms to the shape of the flexible printed circuit board.
|Sensor array package|
Various methods for forming a low profile assembly are described. The low profile assembly may include an integrated circuit.
|Method, system for manufacturing a circuit board, and the circuit board thereof|
The present invention provides a method and a system for manufacturing a circuit board for use during fabrication of leds. The method includes individual processes (in no particular order) like continuous contacting of various layers of the circuit board, b-staging of an adhesive used in the circuit board, pre-heating of the various layers when the various layers are arranged in an adjacent manner to each other, applying pressure to the circuit board when the various layers are arranged in an adjacent manner to each other, thermal curing of the adhesive and singulating the circuit board..
|Drilling apparatus with a decoupled force frame and metrology frame for enhanced positioning|
A printed circuit board (pcb) drilling apparatus that greatly increases the speed, accuracy and depth of the drilling process as well as increasing the life of the drill bits by decoupling the reactionary forces encountered in the positioning and drilling functions of the apparatus in the x,y and z axes from the components that accomplish the positioning, measuring and drilling of the stacked printed circuit boards. The part of the apparatus that moves and drills as well as the feedback position sensors are mounted to a set of vibration isolation pads that absorb the vibrations that would disturb the feedback sensors.
|Image forming apparatus|
An image forming apparatus may include exposure members, a drum supporting member, guide members configured to support the drum supporting member, a main body circuit board and a relay board. The drum supporting member may include a pair of side walls spaced apart from each other and configured to support photoconductor drums and the exposure members therebetween.
|Capacitive microphone with integrated cavity|
A capacitive microphone and method of fabricating the same are provided. One or more holes can be formed in a first printed circuit board (pcb).
|Ported speaker and circuit board|
The inventive subject matter provides a reflex tube or port that includes a circuit board and a speaker enclosure that incorporates such a reflex tube. The circuit board is mounted about the reflex tube and can be configured so as to form a resonance chamber with an interior wall of a speaker enclosure to form a resonance chamber.
|Communication modem, electrical product, and method for controlling same|
Provided is an electric product. The electric product includes: a communication modem including a printed circuit board; a first communication unit installed at the printed circuit board and performing communication by using a first communication type; and a second communication unit installed at the printed circuit board and performing communication by using a second communication type different from the first communication type; a control unit transmitting/receiving a signal to/from the communication modem; and a load receiving power and controlled by the control unit; wherein the first communication unit and the second communication unit are installed at different corners of the printed circuit board..
|Bendable circuit board for led mounting and interconnection|
This invention is directed to bendable circuit substrate structures useful for led mounting and interconnection.. .
|Led flat lighting device|
The present invention relates to an led flat lighting device which facilitates heat emission, while being used in a small and medium imaging device for taking a picture or an image, and which is also formed into a thin and small size. The led flat lighting device includes an led module which emits light toward the front side; a flat-shaped first housing which is spaced apart from the led module so as to form a convection part for discharging heat generated from the led module; a fixing member which couples the led module and the first housing to each other; and a circuit board which controls the led module and which is installed at the first housing spaced apart from the led module so that the convection part is interposed therebetween..
|Led lighting device|
A led lighting device comprises a lampshade, a thin aluminum heat dissipating plate, and a led lighting component. The lampshade has an opening portion.
|Application-specific led module and associated led point source luminaires|
Led downlight and other point source luminaires contain one or more application-specific led modules with integrated optical, mechanical, and heat dissipation systems; a fluted extruded metal housing acts as a heat sink as well as the luminaire housing containing the as-led module(s) or receiving a rotatable spherical housing that contains the as-led module, printed circuit board units, and wires; mounting brackets; and a remote led driver. The extruded aluminum housing (and heat sink) may be comprised of a single cylinder or multiple concentric cylinders.
|Luminescent keyboard and light-guide board thereof|
A luminescent keyboard includes a light-guide board, a thin-film circuit board, a key module and at least one light-emitting component. The thin-film circuit board is disposed on the light-guide board.
|Electronic circuit unit capable of external connection|
An electronic circuit unit includes a circuit board (10) with conductors for connection (14) on an edge (12), a case (20) for housing the circuit board (10) and a connector (c). The case (20) includes an opening (21) that allows the circuit board (10) to be inserted in a board inserting direction and holds the circuit board (10) at a specific board holding position.
A portable terminal includes: a casing; a circuit board; a display device; and a fixing portion which fixes the circuit board to the casing to allow the circuit board to move within a given range along a surface direction of the circuit board. The portable terminal further includes: a battery housing portion provided at a position in the casing located along a thickness direction of the circuit board; a battery pack housed in the battery housing portion through a battery opening provided in the casing; a board-side connecting portion provided at the circuit board; a battery-side connecting portion provided at the battery pack and connected to the board-side connecting portion; and a restraining member which restrains a movement of the battery pack with respect to the circuit board along a surface direction of the circuit board..
|Printed circuit board and printed wiring board|
A memory system is provided with a motherboard, and a memory controller and a plurality memory devices mounted on the motherboard. The motherboard comprises a unicursal-shape main wiring, and branch wirings branched from the main wiring to the respective memory devices.
|Liquid crystal display device|
Provided is a technology that, in a liquid crystal display device, reduces the effect on display quality of heat that an ic or the like generates. A sheet group 50 and a backlight chassis 60 are arranged essentially in close contact.
|Touch panel and display device including same|
The present invention relates to a touch panel, comprising a screen part, a router part, a flexible printed circuit board (fpcb) part, a first pad part comprising two or more router connection regions connecting the screen part and the router part, and a second pad part comprising two or more fpcb connection regions connecting the router part and the flexible printed circuit board (fpcb) part, in which at least some regions of the two or more fpcb connection regions comprise a conductive pattern having opening regions.. .
|Remote control for electronic display apparatus and electronic display apparatus|
This disclosure provides a remote control for an electronic display apparatus, includes an operation panel disposed on a surface of the remote control, and a circuit board located inside the remote control. The circuit board includes a control module and a signal emitting module.
|Power supply for television and television including the same|
A power supply for a television and a television including the same, the power supply including: a rectifier which rectifies input ac power; a converter which converts the rectified power into dc power through a switching control; a circuit board on which at least one of the rectifier and the converter is mounted; and an input connector which receives the ac power and is mounted on the circuit board such that a projecting height of the input connector projecting from the circuit board is substantially equal to or smaller than a projecting height of at least one of the rectifier and the converter.. .
|Mountable antenna elements for dual band antenna|
A mountable antenna element is constructed as an object from a single piece of material and can be configured to transmit and receive rf signals, achieve optimized impedance values, and operate in a concurrent dual-band system. The mountable antenna element may have one or more legs, an rf signal feed, and one or impedance matching elements.
|Terminal having hf transmission line using printed circuit board|
Provided is a terminal including a high frequency (hf) communication line using a flexible printed circuit board (fpcb). The terminal includes a base board, a main board, an antenna, a battery, and an fpcb connected between the main board and the antenna and formed with an hf communication line for radio frequency (rf) communication.
|Radio system for long-range high speed wireless communication|
One embodiment of the present invention provides a radio assembly. The radio assembly includes an antenna housing unit that houses a pair of reflectors which are situated on a front side of the antenna housing unit, a printed circuit board (pcb) that includes at least a transmitter and a receiver, and a backside cover.
|Global positioning system speedometer|
A gps speedometer comprising: a housing; a circuit board located in the housing; a microprocessor located on the circuit board; a gps module located on the circuit and in signal communication with the micro-processor; a gps antenna located on the circuit board and in signal communication with gps module; and a readable speedometer display located on the housing and in signal communication with the microprocessor, where the readable speedometer display is configured to display the current speed of the vessel or vehicle calculated by the microprocessor based on data from a global positioning system. A gps speedometer system comprising: a vessel, the vessel comprising an instrument panel; a gps speedometer located on the instrument panel, the gps speedometer comprising: a housing; a circuit board located in the housing; a microprocessor located on the circuit board; a gps module located on the circuit and in signal communication with the micro-processor; a gps antenna located on the circuit board and in signal communication with gps module; a readable speedometer display located on the housing and in signal communication with the microprocessor, where the readable speedometer display is configured to display the current speed of the vessel or vehicle calculated by the microprocessor based on data from a global positioning system; and a global positioning satellite in signal communication with the gps antenna..
|Dual capacitively coupled coaxial cable to air microstrip transition|
A transmission line transition that couples rf energy between a coaxial cable and an air dielectric microstrip is provided. In some embodiments, the transition can combine a thin printed circuit board substrate and an insulating surface to form an effective capacitive coupling transition that can couple rf energy from the center conductor of a coaxial cable to an air microstrip.
|High bandwidth signal probe tip|
A high bandwidth signal probe device and a method of probing a high bandwidth signal are provided. The high bandwidth signal probe device includes a probe tip for probing a stub of a backdrilled via of a printed circuit board.
|Test systems with a probe apparatus and index mechanism|
A probe apparatus has probe wires with a contact pattern on one side. The contact pattern is for contacting a respective contact pattern on another test equipment or component, such as a circuit board.
|Inductive position sensor|
This inductive position sensor includes: a primary winding, and at least two secondary windings (4, 6) each constituted by several turns (8) produced on two layers of a printed circuit board. A secondary winding has turns (8) each having substantially the same shape, aligned in a direction referred to as longitudinal, each time with an offset between them.
|Automotive rotary electric machine|
The automotive rotary electric machine according to the present invention includes: a rectifier and a voltage regulator that are disposed outside a first axial end of a casing; and a resin protective cover that is formed so as to have a cup shape that is constituted by a bottom portion and a cylindrical peripheral wall portion, and that is mounted onto a casing so as to cover the rectifier and the voltage regulator. The protective cover is held by a circuit board of the rectifier by coupling by snap-fitting a plurality of projections that are disposed so as to protrude from an inner circumferential wall surface of the peripheral wall portion to a plurality of projection-engaging portions that are formed on an outer peripheral wall surface of the circuit board so as to be separated circumferentially..
|Electronic device and package structure thereof|
A package structure is disclosed, which includes: a carrier having a recessed portion formed on a lower side thereof and filled with a dielectric material; a semiconductor element disposed on an upper side of the carrier and electrically connected to the carrier; and an encapsulant formed on the upper side of the carrier for encapsulating the semiconductor element. Therein, the dielectric material is exposed from the encapsulant.