|| List of recent Circuit Board-related patents
| Computing device and method for generating component module files of circuit diagram|
A circuit diagram includes a plurality of components. Each component corresponds to a module number and a component number.
| Implantable medical device for minimally-invasive insertion|
In one aspect, containment devices are provided that include a microchip element having one or more containment reservoirs that are configured to be electrically activated to open; an electronic printed circuit board (pcb) or a silicon substrate positioned adjacent to the microchip element; one or more electronic components associated with the microchip element or the pcb/silicon substrate; and a first inductive coupling device associated with the microchip element or the pcb/silicon substrate, wherein the first inductive coupling device is in operable communication with the one or more electronic components. In another aspect, implantable drug delivery devices are provided that include a body housing at least one drug payload for actively controlled release, wherein the ratio of the volume of the at least one drug payload to the total volume of the implantable drug delivery device is from about 75 μl/cc to about 150 μl/cc..
| Electronic endoscope and method of manufacturing electronic endoscope|
The electronic endoscope includes: an image pickup element that receives incident light; a circuit board on which the image pickup element and a drive circuit component for the image pickup element are mounted; a plurality of internal signal lines electrically connected to the circuit board; an airtight structure including an airtight container and an airtight terminal through which a plurality of terminal pins penetrate, the airtight structure airtightly sealing therein the image pickup element, the circuit board, and the plurality of internal signal lines; and a signal line cable including a plurality of signal lines, the signal line cable being placed outside of the airtight structure. The electronic endoscope further includes a pipe-shaped electrically conductive member that electrically connects each of the plurality of signal lines of the signal line cable and each of the plurality of terminal pins placed outside of the airtight structure..
| Dual band antenna pair with high isolation|
A dual band printed antenna pair operates simultaneously at both wlan frequency bands (2.4 ghz/5 ghz). The antenna pair provides high isolation between both antennas while having an efficient over the air performance.
| High speed bypass cable for use with backplanes|
A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a chip, or processor mounted on a circuit board to a backplane. The bypass cable assembly has a structure that maintains the geometry of the cable in place from the chip to the connector and then through the connector.
| Latching mechanisms for pluggable electronic devices|
Latching mechanisms for pluggable electronic devices when received within a host cage of a host device. In one example embodiment, the host cage is configured to be connected to a host printed circuit board and configured to at least partially surround a host connector.
| Flip chip packaging method, and flux head manufacturing method applied to the same|
Flip chip packaging methods, and flux head manufacturing methods used in the flip chip packaging methods may be provided. In particular, a flip chip packaging method including printing flux on a pad of a printed circuit board (pcb), mounting the die in a flip chip manner on the pcb such that a bump of the die faces the pad of the pcb, and bonding the bump of the die to the pad of the pcb using the flux may be provided..
| Cable assembly with cable attach structure having off-axis fiber routing|
A cable attach structure for attaching a fiber-optic cable to a rear end and a connector to a front end is disclosed. In one embodiment, the cable attach structure is a portion of a fiber optic cable assembly having a fiber optic cable with at least one optical fiber and a connector attached to the optical fiber.
| Acoustic sensor apparatus and acoustic camera for using mems microphone array|
An acoustic camera for using a mems microphone array comprises: an acoustic sensor apparatus (30) comprising a print circuit board (20) on which the plural of mems microphone (10) are mounted, to send signals for the detected sound to a data collection unit (40); a data collection unit (40) connected to the acoustic sensor apparatus (30), which samples analog signals related to sound transmitted from the acoustic sensor apparatus (30) to transform into digital signals and transmit them to the central processing unit (40); a central processing unit (50) connected to the data collection unit (40), which calculates noise level based on digital signals related to sound transmitted from the data collection unit (40); and a display unit (60) which is connected to the central processing unit (50), which displays in color the noise level calculated at the central processing unit.. .
| Bridge device architecture for connecting discrete memory devices to a system|
A composite memory device including discrete memory devices and a bridge device for controlling the discrete memory devices in response to global memory control signals having a format or protocol that is incompatible with the memory devices. The discrete memory devices can be commercial off-the-shelf memory devices or custom memory devices which respond to native, or local memory control signals.
| Device and method for coupling a light source to a printed circuit board in lamps|
A lamp includes a collar with internal and outer surfaces, where two or more connection pins extend from the internal surface of the collar. At least two connection pins have a head portion distal from the collar internal surface.
| Electronic device|
Provided is an electronic device that is provided with a filter circuit that suppresses the effects of electromagnetic noise propagated through space from a circuit board and reduces parasitic inductance, and can output a voltage with adequately reduced noise. To solve the above problem, in an electronic device provided with a cabinet (101), a circuit board (132) provided in the cabinet, an output terminal (122) that passes through a through hole provided in the cabinet and outputs the output of the circuit board to the outside, the present invention constructs a loop composed of a filter means (142) having a filter capacitor (142a), an output terminal, a cabinet, and wires (142b, 142c) for connecting these parts.
| Compact media player|
An electronic device such as a media player may be formed from electrical components such as integrated circuits, buttons, and a battery. Electrical input-output port contacts may be used to play audio and to convey digital signals.
| Flexible display device and method of manufacturing the same|
Disclosed is a flexible display device. The flexible display device includes a display panel configured to include a first substrate that includes a plurality of pixels and a second substrate that is facing-coupled to the first substrate, and a first flexible circuit board connected to the first substrate.
| Housing and construction kit for a control apparatus|
The present invention among other things relates to a housing and a construction kit for a control apparatus, e.g. In the form of a controller for a window lifter of a motor vehicle.
| Electronic module|
The invention relates to an electronic module comprising at least one electronic or electric component (3), a base plate (4), and a support plate (2), in particular a printed circuit board or a substrate. Said support plate (2) is arranged on the base plate (4) and comprises conductor paths.
| Detecting presence of an object in the vicinity of a touch interface of a device|
In an embodiment, a system includes a controller situated on a circuit board and a touch sensor coupled to the controller. The touch sensor includes a plurality of electrodes configured to capacitively coupled to a surface.
| Electronic device with keyboard|
An electronic device includes circuit board and a keyboard. The keyboard includes a main body, a plurality of key caps, and an antenna module.
| Test apparatus having a probe card and connector mechanism|
A test apparatus for testing a semiconductor device includes a circuit board having a contact pattern on one side and an opening therethrough, and a probe card supporting a probe needle array. The probe needle array is insertable into the opening of the circuit board and is configured to probe a device under test.
| Concept for extracting a signal being exchanged between a device under test and an automatic test equipment|
A printed circuit board has first terminals for contacting terminals of a socket, second terminals for contacting terminals of a test fixture of an automatic test equipment, which are adapted for contacting the terminals of the socket of a device under test, transmission lines for connecting the first terminals and the terminals, and an extracting circuit electrically coupled to one of the transmission lines and configured to extract the signal being exchanged between the device under test and the automatic test equipment. The extracting circuit has a resistor or an electrical resistor network, wherein a loss added on the signal being exchanged between the device under test and the automatic test equipment over the one transmission line due to the presence of the printed circuit board is smaller than 6 db..
| Capacitive sensor|
One example disclosed wearable device includes a first housing portion having a conductive section and a non-conductive section. The conductive section is connected to ground.
| Debugging circuit and circuit board using same|
A debugging circuit outputs a plurality of control signals to a chip, the chip outputs a data signal according to the plurality of control signals. The debugging circuit comprises a resistor unit and an adjusting unit.
| Apparatus and method for in-field magnetic measurements|
A magnetic field verifier apparatus includes a magnetic field detection element configured to produce a voltage signal in response to an applied magnetic field wherein the voltage signal corresponds to the strength of the applied magnetic field. Substantially identical circuit boards or units are connected to a central unit or mother board to place magnetic field detection elements of each board or unit in an mutually approximately orthogonal relationship.
| Wireless charger|
A wireless charger includes an anti-slippery charger mat having a mat, inductive charger, power circuit board, and a plug, and a portable charging connector of the wireless charger including a casing, power inductor, receiving hole, indicator, and a connector terminal. The plug of the mat is inserted into a power socket of a vehicle, and the portable charging connector is inserted into the inductive charger of the mat through the receiving hole so that a device connected to the connector terminal of the portable charging connector can be powered or charged.
| Dim to warm lighting module|
The present invention is a lighting module, in particular, a lighting module that emits warmer color light as it dims. The lighting module preferably has a dimmable power source and a printed circuit board having at least two series of leds.
| Wafer level chip scale package and process of manufacture|
Power wafer level chip scale package (csp) and process of manufacture are enclosed. The power wafer level chip scale package includes all source, gate and drain electrodes located on one side of the device, which is convenient for mounting to a printed circuit board (pcb) with solder paste..
| Led back end assembly and method of manufacturing|
An led device and method of manufacture including separately coupling a thin flexible interposer and an led die to a heat sink structure and then electrically coupling the interposer and the led die together with a wirebond. A specifically shaped perimeter of an aperture within the interposer negates the need for a cavity or alignment markings within the heat sink structure by limiting the orientation in which the die fits within the aperture.
| Driving circuit board, method of manufacturing the same, display unit, and electronic apparatus|
There are provided a driving circuit board and a method of manufacturing the same as well as a display unit and an electronic apparatus in which a number of forming steps is small and usage efficiency of materials is improved. The display unit according to the present disclosure includes: a pair of source-drain electrodes; an organic semiconductor layer forming a channel region, and provided in contact with the source-drain electrodes; an insulating layer formed of one or more layers, the insulating layer having a through hole penetrating to the source-drain electrodes, and the insulating layer being provided on the organic semiconductor layer and the source-drain electrodes; a gate electrode provided at a position corresponding to the channel region; and a pixel electrode electrically connected to the source-drain electrodes through the through hole, the pixel electrode being made of a same material as the gate electrode with a same film thickness as the gate electrode, and the pixel electrode being provided on the insulating layer..
| Display device|
A display device includes a display panel including a display area to display an image, and a non-display area adjacent to the display area and having an opening; a driver on a rear of the display panel; and a flexible printed circuit board (fpcb) connecting the non-display area to the driver through the opening, and is bent at an angle less than 90 degrees from the non-display area to the driver.. .
| Displays with shared flexible substrates|
An electronic device may be provided with a display such as an organic light-emitting diode display. The display may include an array of display pixels formed on a polymer substrate layer.
| Damper with integrated electronics|
A damper system for a vehicle comprises an electrically adjustable hydraulic shock absorber and a printed circuit board assembly. The printed circuit board assembly includes power drive electronics, and is electrically coupled to the shock absorber.
| Systems and methods for frequency shifting resonance of an unused via in a printed circuit board|
In accordance with embodiments of the present disclosure, a circuit board may include a first trace formed in a first layer of the circuit board, a second trace formed in a second layer of the circuit board, a via, and a termination pad. The via may be configured to electrically couple the first trace to the second trace, the via comprising a via stub corresponding to a first portion of a length of the via not within a second portion of the via between a first location in which the first trace is electrically coupled to the via and a second location in which the second trace is electrically coupled to the via.
| Printed circuit board structure with heat dissipation function|
A printed circuit board (pcb) structure with a heat dissipation function is provided, including: a package substrate; a landing pad formed over a portion of the package substrate from a first surface thereof, wherein the landing pad has a rectangular configuration and has a plurality of corners; a plurality of ground traces formed over various portions of the package substrate, physically connecting to the bond pad from at least two of the corners thereof, respectively; a first through hole formed through the landing pad and the package substrate from substantially a center portion of the bonding pad; and a plurality of second through holes formed through the landing pad and the package substrate from substantially one of the corners of the bonding pad, wherein the second through holes are adjacent to the ground traces, respectively.. .
| External moisture barrier package for circuit board electrical component|
Moisture barrier packages for electrical components mountable to a circuit board include a cover and a base configured to provide a metal to metal joint that hermitically seals an electrical component in an enclosure defined by the cover and the base. The base may include patterned metallizations using circuit board printing techniques that facilitate connection of the electrical component to the circuit board.
| Fabrication of three-dimensional printed circuit board structures|
A method of fabricating components for a three-dimensional circuit structure includes providing a printed circuit board (pcb) having a top surface, an opposing bottom surface, and an end section. A first angled channel is formed in the top surface at the end section, with the first angled channel extending to an edge of the end section and dividing the end section into a first end portion and a second end portion.
| Portable curing device for fingernails|
There is provided a portable curing device for fingernails that dries and cures a curable material painted on fingernails or toenails by emitting ultraviolet rays to the fingernails or toenails. In a conventional ultraviolet curing device, since a volume of the ultraviolet lamps is large, it is not easy to carry, and since a size of a space into which the finger is inserted is constant, the conventional ultraviolet curing device is not variously used.
| Extrusion process for manufacturing a z-directed component for a printed circuit board|
A method for manufacturing a z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes extruding a substrate material according to the shape of the z-directed component. A conductive material is then selectively applied to the extruded substrate material and the z-directed component is formed from the extruded substrate material..
| Stiffener frame fixture|
Methods and apparatus for coupling a stiffener frame to a circuit board are disclosed. In one aspect, an apparatus for engaging a stiffener frame and a circuit board positioned in a fixture is provided.
| Led lighting assemblies with thermal overmolding|
One or more light emitting diode diodes (leds) are attached to a printed circuit board. The attached leds are connectable with a power source via circuitry of the printed circuit board.
|Configuring a trusted platform module|
A method includes storing configuration data for a trusted platform module (tpm) in a pre-boot environment such as unified extensible firmware interface (uefi), reading the configuration data, and automatically configuring the tpm based upon the configuration data. The configuring includes storing values of tpm parameters in non-volatile memory of the tpm.
|Resource mapping in a hardware emulation environment|
A system and method is disclosed in an emulation environment that dynamically remaps user designs. In one embodiment, a request is received to load an integrated circuit design to be emulated in a desired partition within the emulator.
|Electrical connectors and printed circuits having broadside-coupling regions|
An electrical connector that includes a circuit board having a board substrate that has opposite board surfaces and a thickness measured along an orientation axis that extends between the opposite board surfaces. The circuit board has associated pairs of input and output terminals and signal traces that electrically connect the associated pairs of input and output terminals.
|Contact configuration for undertaking tests on circuit board|
An electronic structure (for example a reliability board or a cycling control module) has a body including a body portion insertable into a connector. A plurality of contact structures are provided on a side of the body portion, each contact structure comprising a first contact and a second contact spaced from the first contact, with the first and second contacts of each contact structure being aligned in the direction of insertion of the body portion into the connector.
|Microwave coaxial connector, intended notably to link two printed circuit boards together|
The present invention relates to a novel microwave coaxial connector that allows for a board-to-board connection over a very short distance, typically less than or equal to 2 mm, with relatively high tolerances in relative value terms but low tolerances in absolute value terms, typically equal to 0.2 mm, and at the same time ensuring a good electrical contact between all the tracks of the printed circuits to be connected.. .
|Externally serviceable it memory dimms for server/tower enclosures|
An electronic component carrier and method for mounting the electronic component to a circuit board includes a frame including a header having opposing attachment arms extending outwardly therefrom for seating an electronic component within the frame. A latching mechanism of the frame includes latching members at a distal end of each of the attachment arms for releaseably seating the electronic component between the attachment members.
|Speaker mechanism having a conforming circuit board|
A device removeably attachable to a case for an electronic device for delivering sound includes a housing having a speaker means and a printed circuit board assembly mounted in the housing. The printed circuit board assembly is in electronic communication with the speaker means.
|Light emitting module applied to display device|
A light emitting module includes a first circuit board, a driver chip, two connectors, a second circuit board and a plurality of light emitting units. The driver chip is disposed on the first circuit board.
|Led-based lighting with reflector mounted on pcb|
An led-based lighting component is disclosed. It comprises of a plurality of leds mounted to a printed circuit board.
|Circuit board element having at least one led|
The invention relates to a circuit board element (1) comprising a substrate (2), on which at least one dielectric layer (7) is arranged, and at least one led (light-emitting diode) (10), wherein at least one channel-shaped waveguide cavity (11) leading away from the led (10) is provided in the dielectric layer (7), which waveguide cavity leads to at least one integrated light-sensitive component (12), preferably a photo-diode or photocell, arranged for examining the light emission, wherein the led (10) is preferably also arranged in a cavity (9) that is connected to the waveguide cavity (11). The invention further relates to a method for producing such a circuit board element (1)..
|Backlight assembly and method of assembling the same and liquid crystal display including backlight assembly|
A backlight assembly includes a light source unit including a circuit board, a light source disposed on a first plane of the circuit board, and at least one connection unit disposed on a second plane opposite to the first plane of the circuit board and electrically connected to the light source, a receiving container having a bottom plate and sidewalls extending from edges of the bottom plate and receiving the light source unit, the bottom plate including at least one opening portion in which the connection unit is inserted and exposed to the outside, and at least one driving unit disposed at a rear surface of the receiving container and connected to the connection unit for driving the light source unit.. .
|Carrier board for attachment of integrated circuit to circuit board|
An electronics system includes a main circuit board; main circuitry located on the main circuit board; a carrier board located on top of the main circuit board; an integrated circuit (ic) located on the carrier board, wherein the ic is electrically connected to the main circuitry on the main circuit board; and a layer of adhesive located between the carrier board and the main circuit board.. .
|Audio and video reproduction apparatus having main board on which surface mount type connectors are mounted|
Provided is a video and audio reproduction apparatus including a display unit; a speaker unit; a main board; and a power supply unit, and the main board includes a printed circuit board; a first connector area which is formed on a front side of the printed circuit board; a second connector area which is formed on the front side of the printed circuit board; and a main chip which is surface-mounted on a back side of the printed circuit board.. .
|Circuit board assembly using metal plates as conducting medium embedded therein|
A circuit board assembly includes metal plates to be used as conducting medium, an encapsulation enclosing therein the metal plates and provided with holes defined in the encapsulation to allow extension of the metal plates out of the encapsulation for electrical connection and electronic components securely mounted on the encapsulation and electrically connected to the metal plates to form a closed loop.. .
|Mounting structure for printed circuit board, and semiconductor device using such structure|
A mounting structure for a printed circuit board, includes a printed circuit board to which a heavy material is fixed; a fixing member fixed to the printed circuit board immediately below the heavy material; and a receiving member fixed to a main body. A bottom portion of the fixing member is disposed in the receiving member, and fixed to the receiving member by a resin adhesive..
An electronic component is provided that includes a spatial light modulator device, and a circuit board comprising a first major surface, at least one electrically conductive redistribution layer and a first cavity positioned in the first major surface. The spatial light modulator device is positioned within the cavity and is electrically connected to the redistribution layer..
A display module includes a panel frame, a display panel, a system frame, and a printed circuit board. The panel frame includes a baseplate having at least one edge, at least one sidewall located on the edge, at least one top wall adjacent to the sidewall, and a support element.
|Multiple antenna system|
A multiple antenna module suitable for use in small sized mobile computing devices includes at least a first antenna extending beyond a lateral edge of and coplanar with a printed circuit board assembly and connected to the printed circuit board assembly via a first antenna ground contact and a first antenna feed contact. The multiple antenna module also includes a second antenna located proximate to the first antenna and configured in a plane perpendicular to the plane continuing the first antenna and the printed circuit board.
A mobile terminal includes: a terminal body having a battery and an antenna module; a printed circuit board having one or more processors disposed between the battery and the antenna module, and mounted to the terminal body; a partition wall formed at the terminal body such that a region for mounting the antenna module is partitioned from a region for mounting the printed circuit board; and a shielding member coupled to the partition wall, such that electromagnetic interference of an antenna device due to an operation of the processor is prevented.. .
|Mobile wireless communications device with electrically conductive continuous ring and related methods|
A mobile wireless communications device may include a portable housing that may include an electrically conductive continuous ring defining a perimeter of the portable housing. The electrically conductive continuous ring may be configured to function as an antenna.
|Remote controlled pricing information|
A coordinated system of printed circuit board (pcb) assemblies for displaying information, such as advertising and pricing information. Each individual pcb assembly may display a unit price, such as a price for particular type of gasoline or other product.
|Relay assembly with fastening clip|
A relay assembly comprises a relay mounted on a board. The relay may be a single or individual relay or a polyphasic relay.
|Crystal oscillation device and semiconductor device|
A wiring pattern for oscillation input signal and a wiring pattern for oscillation output signal are provided on a printed circuit board, and a wiring pattern for ground power source voltage is arranged in a region therebetween. A quartz crystal unit is connected between the wiring pattern for oscillation input signal and the wiring pattern for oscillation output signal and one ends of capacitors serving as load capacitors thereof are connected to the wiring pattern for ground power source voltage.
|Rf power amplifier and method of assembly for same|
In general, an rf power amplifier comprises a controller, a driver, a splitter, a final stage, and a combiner coupled together to function as the rf power amplifier. One or more of the above components are arranged on one or more motherboards, e.g., a printed circuit board (pcb).
|Multi-purpose integrated circuit device contactor|
A contactor uses a pogo block in a first configuration as a direct integrated circuit test socket and the contactor can be reconfigured to provide a pogo block assembly to interface between a main test printed circuit board (pcb) and a daughter card that is dedicated to a specific device handler and/or a specific package type that can be different from the main test pcb. A pogo block is inserted into a thick frame with an alignment plate for contactor use in which a device under test fits into a recess in the frame through an alignment plate to align the device under test to make contact with electrical contacts of the contactor.
|Portable motion activated cell phone charger utilizing a shelled torus permanent magnet generator|
A portable motion activated cell phone charger utilizing a shelled torus permanent magnet generator to generates electricity by kinetic energy imparted by the user if strapped to the arm or leg when jogging or may also be waved in the hand in an oscillating motion to generate electricity which is stored in a rechargeable battery within the charger assembly of which has a control circuit board with universal serial port attached and accessible from the exterior body casing allowing the user to connect a cell phone or small electronic devices with a universal serial bus cable to power the device or charge a battery within said device.. .
|Reduced size power inverter suitable for a vehicle|
A power inverter comprises at least a box-shaped housing; and a power module, a smoothing capacitor, a base plate made of a flat plate, and a rotating electric machine control circuit board arranged in order in the housing. The base plate is arranged with the fringes fixed to the inner wall surfaces of the housing, and the smoothing capacitor and rotating electric machine control circuit board are fixed..
|Brush holder for an electric motor, and gear mechanism drive unit having a brush holder|
A brush holder (100) for an electric motor (12a; 12b), having a brush holder main body (20) which has a passage opening (25) for an armature shaft to pass through, having a first receiving region (37) for fastening a printed circuit board (35), on which electrical or electronic components are mounted, to the brush holder main body (20), wherein the first receiving region (37) extends as far as into a region between an outer boundary (23, 24) of the brush holder main body (20) and the passage opening (25), and wherein the first receiving region (37) for the printed circuit board (35) is designed to arrange the printed circuit board (35) on the brush holder main body (20) at least substantially perpendicularly to the plane of the brush holder main body (20), and having components (26, 33) which are arranged on the brush holder main body (20) and which are mechanically and/or electrically connected at least indirectly to the printed circuit board (35).. .
In a clamping device, a detection mechanism detects a state of clamping/unclamping and includes: a detected body that moves together with a piston and a piston rod; a circuit board disposed to face the detected body and capable of detecting the position of the detected body; and an indicator lamp that is connected to the circuit board and is lit/extinguished depending on the state of clamping/unclamping. By pressing a setting button provided on the detection mechanism when the rotation angle of the arm is changed, the second detection position of the circuit board for detecting the unclamped state is changed, making it possible to detect the detected body at a newly set detection position..
|Stacked type semiconductor device and printed circuit board|
The printed circuit board (100) includes the interposer (2) where the semiconductor element (1) is mounted and the electrode pad (8) is formed on one surface, the printed wiring board (3) where the electrode pad (9) is formed on one surface facing the interposer (2), and the joint material (70) for bonding the electrode pads (8) and (9). The joint material (70) includes the solder layer (60) formed by the solder material (11) and the metal layers (50), (50) provided to the electrode pads (8) and (9).
|Millimeter wave wafer level chip scale packaging (wlcsp) device and related method|
Various embodiments include wafer level chip scale package (wlcsp) structures and methods of tuning such structures. In some embodiments, the wlcsp structure includes: a printed circuit board (pcb) trace connection including at least one pcb ground connection connected with a pcb ground plane; a set of ground solder balls each contacting the printed circuit board trace connection; a set of chip pads contacting each of the ground solder balls in the set of ground solder balls; a chip ground plane connecting the set of chip pads; and a signal interconnect interposed between two of the set of ground solder balls, the signal interconnect including: a signal trace connection electrically isolated from the pcb ground plane; a signal ball contacting the signal pcb trace connection; a chip pad contacting the signal ball, and a signal trace connection on a chip contacting the chip pad..
|Semiconductor chip package structure|
A method for fixing a semiconductor chip on a circuit board is provided, which includes following steps. The circuit board is provided, which sequentially includes a substrate having a chip connecting portion, at least one metal wire and an insulating layer.
|Antenna, method of manufacturing the antenna, and wireless ic device|
An antenna includes first and second radiation portions including one lead wire that is folded back into a loop shape to define a folded-back portion and that includes a first power feed portion at a first end and a second power feed portion at a second end. The lead wire portion extending toward the folded-back portion and the lead wire portion extending through the folded-back portion are close enough to each other near each of the first and second power feed portions in the first and second radiation portions, respectively, to be electromagnetically coupled to each other.
|Method of manufacturing electronic component unit|
An electronic component unit manufacturing method includes: preparing a circuit board including a heat generating element mounted thereon and a bonding metal foil layer formed thereon, a heat transfer board including an insulative layer formed on one face thereof and a heat transfer metal foil layer formed on the insulative layer, and a heat sink; applying a cream solder to form a solder layer on the board bonding metal foil layer or the heat transfer metal foil layer; superimposing the bonding metal foil layer and the heat transfer metal foil layer with each other via the solder layer; re-melting the solder layer to solder the bonding metal foil layer and the heat transfer metal foil layer; and superimposing the other face of the heat transfer board with the heat sink to thereby assemble the circuit board with the heat sink via the heat transfer board.. .
|Remote controlled drilling rig|
A remote controlled drilling rig that is fully functional includes a drilling rig, an electrical assembly, and a remote. The drilling rig includes a truck for towing a semi-trailer on which is positioned a derrick and a drilling assembly.
|Electromagnetic interference shield|
An assembly configured to protect a circuit board from electromagnetic interference. The assembly includes a metal shield and an enclosure.
|Multi-finish printed circuit board|
A multi-finish printed circuit board may include one or more electrically conductive elements, such as through hole pads, that may have a first surface finish and one or more electrically conductive elements, such as surface mount pads, that may have a second surface finish that is different from the first surface finish. The first surface finish may be a hot air solder leveling (hasl) surface finish or a lead-free hot air solder leveling (lf hasl) surface finish and the second surface finish may be an organic surface protector (osp) surface finish.
|Base material for forming electroconductive pattern, circuit board, and method for producing each|
The present invention pertains to: a base material for forming an electroconductive pattern, adapted to form an electroconductive pattern and obtain a circuit board; the circuit board obtained therefrom; and a method for producing each. The base material for forming an electroconductive pattern, adapted to obtain a circuit board, includes a supporter, and a holding region for holding a fluid body for obtaining an electroconductive pattern, the holding region being formed atop one end surface of the supporter and exhibiting a proper wettability for the fluid body.
|Thermoplastic liquid crystal polymer film, and laminate and circuit board using same|
Where ∈r1 denotes the relative dielectric constant before the heating, ∈r2 denotes the relative dielectric constant after the heating. These relative dielectric constants are measured at the same frequency in a range of 1 to 100 ghz..
|Epoxy resin compound and radiant heat circuit board using the same|
An epoxy resin composition having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of chemical formula.
|Flexible circuit board and ground line strucure|
A ground line structure adapted to a flexible circuit board is provided. The ground line structure includes a plurality of ground line structure units located on the flexible circuit board to form a meshed pattern.