|| List of recent Circuit Board-related patents
| Method of manufacturing a sensor insole|
A method for manufacturing a sensor insole includes connecting wires of force sensors to a printed circuit board. The printed circuit board and the force sensors are positioned on a felt layer in a predetermined configuration, and placed in the mold.
| Hand held electromechanical surgical system including battery compartment diagnostic display|
An electromechanical surgical system is provided and includes a hand-held surgical device. The surgical device includes a device housing defining a connecting portion for selectively connecting with an adapter assembly, the housing being configured to removably receive a battery therein; at least one drive motor supported in the device housing and being configured to rotate a drive shaft; and a circuit board disposed within the housing for controlling power delivered from a battery to the motor.
| Interface card with multiple subscriber identity modules|
An interface card includes a circuit board having an interface unit, a communication operation processing unit mounted on the circuit board, a sim card slot mounted on the circuit board, and a m2m sim mounted on the circuit board. The interface unit is coupled with an interface card slot of an external electronic equipment.
| Integrated package insertion and loading mechanism (ipilm)|
A holding member and system including a first holding member and a second holding member, wherein each of the first holding member and the second holding member are coupled to opposite sides of a load plate of a socket. A holding member includes a body including a pair of arms extending from a first side of the body and spaced to accommodate a portion of an integrated circuit chip package therebetween and at least one clip extending from a second side opposite the first side.
| Compliant pin with improved insertion capabilities|
A compliant pin for use with a shielding cage or electrical connector is disclosed that has improved insertion capabilities that increase the resistance of the compliant pin to buckling during mounting of the cage or connector to a circuit board. The pin has a base and tip portion that are interconnected together by a body portion.
| Central processing unit socket assembly|
A central processing unit socket assembly includes a socket mounted on a circuit board, a locking apparatus, and a cover. The cover includes a main plate, a resilient first locking portion formed on a first end of a first surface of the main plate, a second locking portion formed on a second end of the first surface of the main plate opposite to the first locking portion, and a number of connecting pins protruding out from a second surface of the main plate opposite to the first surface of the main plate.
| Rechargeable battery|
A rechargeable battery including a case in which an electrode assembly is accommodated; a cap plate coupled with the case; a protection circuit board coupled with the cap plate, the protection circuit board being electrically connected with a first electrode of the electrode assembly; and a protection element coupled with the cap plate, the protection element electrically coupling a second electrode of the electrode assembly with the protection circuit board.. .
| One-component, dual-cure conformal coating compositions|
Disclosed are one-component compositions that include: (1) an isocyanate-functional urethane acrylate and (2) a polyisocyanate containing allophanate and/or uretdione groups, wherein the one-component composition has a viscosity of less than or equal to about 500 mpas and an isocyanate content of greater than about 5% by weight, based on the weight of the one-component composition. Also disclosed are circuit boards and electronic components that are coated with such compositions..
| Optical connector with printed circuit board and lens element bonded to each other|
An optical connector includes a substrate and a lens element. The lens element includes a first bottom surface contacting with the substrate, and the lens element defines a groove in the bottom surface..
| Optical connector with printed circuit board and lens element bonded to each other|
An optical connector includes a printed circuit board, a photoelectric element, a lens element, and an adhesive. The photoelectric element is positioned on and electrically connected to the printed circuit board.
| Photoelectric conversion device and optical fiber coupling connector|
A photoelectric conversion device includes a circuit board, light-emitting modules arranged on the circuit board in a first straight line, light-receiving modules arranged on the circuit board in a second straight line, and an optical coupling module. The optical coupling module includes a first optical surface, a second optical surface perpendicular to the first optical surface, a reflecting surface obliquely relative to the first and second optical surfaces, first converging lenses arranged on the first optical surface in a third straight line, second converging lenses arranged on the first optical surface in a fourth straight line, third converging lenses arranged on the second optical surface in a fifth straight line, and fourth converging lenses arranged on the second optical surface in a sixth straight line.
| Optical connector with high light-coupling efficiency|
An optical connector includes a printed circuit board, a photoelectric element positioned on and electrically connected to the printed circuit board, a lens element, and an optical fiber. The lens element defines a cutout having a sidewall and a blind hole in the sidewall.
| Wireless earphone|
A wireless earphone comprises a fixing module including a lower cover and a fixing element disposed at the center thereof; a rotating case having a rotating base and an upper cover fixed to the rotating base, the rotating base includes a cup portion and an annular plate extending therefrom, the fixing element passes through the cup portion, and the rotating case rotates about the fixing element; an electronic module disposed between the upper cover and the rotating base; a tape spring having one end attached to the cup portion and the other end to the fixing element; at least one earphone cable wound around the cup portion having one end connected to the circuit board and the other end passing through the lower cover; and a fastening module disposed between the rotating base and the lower cover, for retaining the relative position there-between.. .
| Circuit board and flat panel display including the same|
Provided are a circuit board for irradiating light to a light guide plate and a flat panel display having a structure for efficiently fixing the circuit board and the light guide plate, the circuit board, including: a support substrate comprising a first area and a second area, the second area being bent from the first area; a plurality of light emitting device mounting parts disposed in the first area; and a protective member connecting part of an outer side of the plurality of light emitting device mounting parts.. .
| Lighting base of the led lamp and its stamping mold|
The present invention's technical method is that the top surface of the lighting base is surrounded with several axial-protruding raised pillars, with a circuit board placed on the top of the lighting base. This circuit board is equipped with vents that can fit tightly with the raised pillars, and the raised pillars can fit tightly with the openings after being squeezed from stamping through the mold, preventing the circuit board from loosening from said lighting base..
| Connecting system of circuit boards|
First and second tapered holes are provided at facing positions of the first and second circuit boards. The elastic spacer including first and second spacers is attached between them to couple the two in parallel and thereby facilitate attachment of the two to a back panel.
| Printed circuit board stack|
Provided is a printed circuit board stack having a structure that connects between printed wirings of printed circuit boards that are arranged so as to face each other across a gap. A first printed circuit board and a second printed circuit board are arranged so as to face each other across a gap; a first fork terminal soldered to a printed wiring is vertically provided on the first printed circuit board, whereas a second fork terminal soldered to a printed wiring is vertically provided on the second printed circuit board.
| Electrical junction box|
An electrical junction box is provided in which a printed circuit board is accommodated in a case so as to configure an internal circuit, the electrical junction box achieving downsizing/densification with high space efficiency and simplified routing of electric cables of connectors. As the internal circuit, a printed circuit board stack is used in which a first printed circuit board and a second printed circuit board are arranged so as to face each other.
| Printed circuit board and magnetic field or current sensor|
A printed circuit has a creep suppressor and a stack of metallization layers separated by electrically insulating layers. A metallization layer arranged above the insulating layer at least partially covers a cavity formed in the latter's top face.
| Low profile inductors for high density circuit boards|
An inductor includes a core formed of a magnetic material and a foil winding wound at least partially around or through at least a portion of the core. A first end of the winding extends away from the core to form an extended output tongue configured and arranged to supplement or serve as a substitute for a printed circuit board foil trace.
| Set top box having snap-in heat sink and smart card reader with a hold down for retaining the heat sink|
A hold down for an electronic device is provided that includes a bottom frame, a circuit board mounted above the bottom frame, a thermal pad mounted on the circuit board, and a heat sink associated with the thermal pad. The hold down includes a frame that defines a perimeter having a plurality of retainers that are configured to engage with a plurality of mating locations defined on at least a bottom frame to provide a biasing force that retains the heat sink against a circuit board that is positioned between the bottom frame and the hold down..
| Integrated power module packaging structure|
An integrated power module packaging structure includes a plastic housing having a cavity; a plurality of step-shaped pins embedded in the plastic housing, a first printed circuit board disposed in the cavity, and a second printed circuit board disposed above the first printed circuit board in the cavity. Each of the step-shaped pins includes a first l-shaped bending portion and a second l-shaped bending portion connected to each other.
| Matrix thermal sensing circuit and heat dissipation system|
A heat-dissipation system and a matrix thermal sensing circuit are provided. The heat-dissipation is used in an electronic device.
| Solder assembly temperature monitoring process|
An apparatus according to the invention may include one or more fuses placed on a printed circuit board on which an printed circuit board assembly is formed. Each fuse changes in response to ambient thermal conditions beyond a threshold temperature.
| Projector with fan and heat sinks|
A projector includes a case, an optical engine, a heat sink, a circuit board, and a fan. The case includes two sidewalls, and each sidewall defines an air hole.
| Electronic device having opening-and-closing unit|
An electronic device includes a housing, an opening-and-closing unit disposed on a side surface of the housing, and configured to be openable and closable to the housing, a hinge unit configured to have a cam groove formed thereon and to openably and closably couple the opening-and-closing unit with the housing, an electronic circuit board arranged inside the housing and having a switch which outputs a signal corresponding to a state of the switch, and a movable member that moves in conjunction with the cam groove formed in the hinge unit, along with the opening and closing of the opening-and-closing unit, the movable member being movable in a direction parallel to the side surface of the housing to change the state of the switch.. .
| Shutter for thermal imaging camera|
Various embodiments of shutters for thermal imaging cameras, cameras comprising such shutters, and methods for providing such shutters are disclosed. The shutter may include a substrate with various layers and components thereon, such as a temperature sensor.
| Vehicular video-recording module|
A flat vehicular video-recording module has a housing being transversely elongated and having a circuit board therein. The housing further has a photo-sensing element thereon to align with the circuit board, a connector extending outwards from the housing and sticking plasters thereon.
| Multi-camera sensor for three-dimensional imaging of a circuit board|
A system for sensing a three-dimensional topology of a circuit board is provided. An illumination source projects an illumination pattern from a first angle of incidence.
| Mobile device with two antennas and antenna switch modules|
A mobile device includes a system circuit board, a ground element, a communication module, a first antenna, a second antenna, a first asm (antenna switch module), and a second asm. The first antenna is configured to receive or transmit a first signal in a first frequency band.
| Filter antenna|
A multi-pole filter antenna may include aperture-coupled non-dominant mode cavity resonators, and an aperture-coupled dominant mode patch antenna. The filter antenna may be implemented in a multilayer printed circuit board or similar structure.
| Antenna device|
An antenna device is provided and includes a circuit board, a first linear antenna, and a second linear antenna. The circuit board includes a grounding pattern and a feeding point insulated from the grounding pattern.
| Transformer assemblies with moveable terminal blocks|
A transformer assembly includes a first circuit board, a transformer electrically coupled to the first circuit board, and a terminal block moveably connected to the transformer and moveable relative to the transformer in at least a first direction. The terminal block includes a terminal.
| Printed circuit board and manufacturing method of printed circuit board|
A printed circuit board includes a plurality of wiring layers and a plurality of differential signal vias to establish connections between the plurality of wiring layers through via pairs and to be disposed so that paired-vias possessed by a specified differential signal via for transmitting a differential signal different from a signal of another differential signal via adjacent thereto are arranged on a locus of a point distanced equally from each of the paired-vias possessed by another differential signal via.. .
| Test equipment for testing semiconductor device and methods of testing semiconductor device using the same|
A method of testing a semiconductor device using the test equipment includes loading an undivided printed circuit board (pcb) including unit pcbs in a test equipment. A semiconductor device is mounted in each of the unit pcbs.
| Light emitting element, backlight module, liquid crystal display device|
A light emitting element comprises: a printed circuit board, a chip disposed on a first face of the printed circuit board, a first encapsulation body and a second encapsulation body. The first encapsulation body covers the chip, and the second encapsulation body covers a second face of the printed circuit board or a part of the second face of the printed circuit board.
| Circuit board and display device|
A source and drain electrode layer (3s/3d) of an oxide tft element (3) is formed by a first conductive layer. A gate electrode (3g) of the oxide tft element (3) and a gate electrode (5g) of an a-si tft element (5) are formed by a single conductive layer, that is, a second conductive layer.
| X-ray line detector and method for the production thereof|
An x-ray line detector includes a housing and a predefined number of carrier modules having the same width disposed in the housing. A one-piece printed circuit board, on which a photodiode is arranged, is attached to each carrier module.
| Resilient adherent emi shielding member|
In order to prevent emi leakage from various openings formed in module-receiving receptacles, a flexible, conductive shield member is provided. The shield member may have multiple layers but includes at least a conductive layer and an adhesive layer.
| Multi-layered capacitor and circuit board mounted with multi-layered capacitor|
Disclosed herein is a multi-layered capacitor, including: an element formed by alternately multi-layering a dielectric layer and an internal electrode; and external terminals disposed at both ends of the element, wherein the dielectric layer disposed at an upper end u and a lower end l of the element is formed of a paraelectric material and the dielectric layer disposed at a central part c of the element is formed of a ferroelectric material.. .
| Thermoelectric power generation unit|
A thermoelectric power generation unit includes: a bottom plate and a heat exchange member which are made of a thermal conductor; a thermoelectric power generation module and a spacer which are interposed between the bottom plate and the heat exchange member; and a side wall provided to cover a gap between the bottom plate and the heat exchange member. Moreover, a circuit board on which a circuit that is driven by electric power obtained by the thermoelectric power generation module is mounted is stored in a space surrounded by the bottom plate, the heat exchange member, and the side wall..
| Press cushion|
The invention relates to a press cushion for a one level or multi level heating press including a flat contexture made from threads or fibers; and a silicon elastomeric material made by crosslinking silicon rubber and/or a copolymer made by crosslinking silicon rubber and fluor silicon rubber and/or a copolymer made by crosslinking silicon rubber and fluor rubber. In order to overcome quality issues and to comply with stringent cleanliness requirements when producing circuit boards for electrical applications it is proposed that the silicon elastomeric material and/or the copolymer are addition crosslinked..
| Electronic component mounting apparatus|
An electronic component mounting apparatus includes a loading unit which loads a printed circuit board. This apparatus includes a first substrate moving unit which moves the printed circuit board, loaded by the loading unit, in the y-direction.
|System and method for checking signal transmission line|
A method for checking signal transmission lines of a printed circuit board (pcb) layout includes determining differential pairs to be checked and dividing the differential pairs to be checked into a first group and a second group. A first reference distance between differential pairs belonging to the same group and a second reference distance between differential pairs belonging to different groups are set.
|Modular jack having inlined printed circuit board|
A modular jack (100) includes an insulative housing (1), a printed circuit board assembly (3), a set of mating terminals (2) and a set of footer pins (4). The insulative housing (1) defines a mating port (16) and a mounting port (19) located behind thereof.
|Modular control apparatus|
A control apparatus has a module having first and second module parts, which can be mechanically and electrically combined to form a combined arrangement. The first and second module parts each comprise a housing having a boundary surface opposite one another in the combined arrangement that define a boundary plane.
|Lower profile card edge connector|
A card edge connector for being retained into a notch of a print circuit board includes an insulative housing defining a central slot extending along a longitudinal direction, a first wall and a second wall located on the opposite sides of the central slot and a fitting portion extending downwardly into the notch from a bottom portion of the first wall, the fitting portion defining a plurality of first terminal slots and the second wall defining a plurality of second terminal slots. A plurality of first terminals are received in the first terminal slots, and a plurality of second terminals are received in the second terminal slots.
|Electrical connector with shieldingthereof|
An electrical connector for mating with a plug and mounting to a printed circuit board, includes an insulative housing with a forwardly extending mating tongue thereof. A terminal module includes an insulator associated with a plurality of contacts commonly assembled into the housing.
An optical module includes: a first circuit board on which a connector socket is mounted, an optical transceiver module that is electrically connected to the first circuit board via the connector socket; a heat sink; and a heat dissipating sheet. The optical transceiver module includes: a second circuit board on which an e/o converter, a drive circuit for the e/o converter, an o/e converter, and a current-to-voltage conversion circuit for the o/e converter are mounted; and an optical waveguide that guides an optical signal generated by the e/o converter to an output end of the optical transceiver module, and that guides an input optical signal to the o/e converter.
|Cable assembly with electrical-optical hybrid cable|
A cable assembly comprises: an insulative housing; a plurality of contacts received into the insulative housing; a printed circuit board located behind the insulative housing and electrically connected with the plurality of contacts; a metallic shell enclosing the insulative housing and the printed circuit board; an insulative shell enclosing a rear portion of the metallic shell; and a cable having a plurality of optical fibers coupled to a top surface of the printed circuit board and a plurality of copper wires electrically connected to a bottom surface of the printed circuit board.. .
|Ear bud retraction module having optimal microphone placement|
A retractable ear bud module has a housing with an ear bud cable retractable mounted in the housing. The ear bud cable has at least one ear bud and a microphone, and a fixed end attached to a circuit board including a wireless receiver mounted.
|Self-adaptive led fluorescent lamp|
The invention discloses an self-adaptive led fluorescent lamp, comprising: a housing comprising a lampshade and a radiator fastened with each other, a printed circuit board (pcb) consisting of one or more led lamp sets and led driving control units, and lamp caps sleeved on two sides of the housing; the led driving control unit comprises a voltage detection module, an intelligent switching module and a linear constant current module; the voltage detection module comprises a first resistor and a second resistor, which are connected between two output ends of the rectifier filter module for voltage division, and a first capacitor connected with the second resistor in parallel; the intelligent switching module is connected with a common end of the first resistor and the second resistor, the output of the intelligent switching module is connected with a plurality of led lamp sets, and each of the led lamps is connected with a compensation resistor in series; and the linear constant current module consists of two ic linear driving chips. In the invention, the number of the led lamps in serial connection is automatically changed by automatically detecting the output voltage of the rectifier, to reach the optimal driving efficiency, so as to ensure normal operating under any voltage..
|Backlight module, printed circuit board used for backlight module, and manufacturing method for the same|
The present invention discloses a backlight module, a printed circuit board used for a backlight module, and a manufacturing method for the same. The printed circuit board comprises a light bar region and a heat dissipating region.
|Mobile wireless communications device with rf shield and related methods|
A mobile wireless communications device may include a housing, an antenna carried by the housing, and a circuit board carried by the housing. The mobile wireless communications device may also include a power amplifier carried by the circuit board, an antenna switch carried by the circuit board and configured to selectively couple the power amplifier to the antenna, a first radio frequency (rf) shield covering the power amplifier and the antenna switch, and a second rf shield within the first rf shield and covering the antenna switch..
|Reducing impedance of a printed circuit board through a square wave pattern of plated-through holes|
Disclosed are a method and system to reduce impedance of printed circuit boards through an interconnecting of printed circuit boards using a square wave pattern of plated-through holes. A method of connecting a first printed circuit board to a second printed circuit board comprises forming a square wave pattern of the first printed circuit board and the second printed circuit board and adjoining the first printed circuit board and the second printed circuit board.
|Semiconductor device and printed circuit board|
Provided is a compact semiconductor device having high joint reliability of multiple first ball electrodes arrayed on one surface of a first interposer. On a surface (233a) of a second interposer (233) facing a first interposer (213), second ball electrodes (235) are arranged at grid points at which multiple first straight lines extending in one direction are intersected with multiple second straight lines extending in a direction different from the multiple first straight lines.
|Movable socket and related electronic device|
A movable socket disposed between a casing and a circuit board is disclosed. An opening structure is disposed on the casing.
|Circuit substrate structure and method for manufacturing thereof|
The invention provides a circuit substrate structure and a method for manufacturing thereof. The circuit substrate structure includes a substrate, a pixel array layer, a display unit, a peripheral circuit layer, at least one integrated circuit chip, a flexible printed circuit board, at least one flattening material layer and a passivation layer.
|Circuitry arrangement for reducing a tendency towards oscillations|
A circuitry arrangement includes several electronic parts mounted to a circuit board, at least one conductor section extending between the electronic parts within a first conductor layer, and a closed conductor loop comprising at least one loop section running in parallel to the at least one conductor section within a second conductor layer neighboring the first conductor layer. The closed conductor loop is configured to reduce a tendency towards oscillations of a current flowing through the conductor section in operation of the circuitry arrangement.
|Storage system and printed circuit board|
In the present invention, generation of occurrence of a wiring area is prevented, and a reflection by an inconsistency of a characteristic impedance of a high-speed signal line and a through hole connecting portion. By doing so, a conductor pattern of a raised shape is formed on each of front and back of a through hole, on a gnd layer closest to the high-speed signal line in the vicinity of the connecting portion of the high-speed signal line and the through hole.
The flexible printed circuit board includes a base material with a connection terminal and a signal wiring formed thereon, a first cover layer disposed on a first side of the base material, and a second cover layer disposed on a second side different from the first side. The display panel is connected to the connection terminal.
|Flexible circuit routing|
Flexible circuits for routing signals of a device, such as a touch sensor panel of a touch sensitive device, are provided. The flexible circuit can include a first set of traces for routing a first set of lines and a second set of traces for routing a second set of lines.
A camera module according to an embodiment of the present invention may include a first printed circuit board (pcb) configured to have an image sensor mounted thereon; a housing unit disposed over the first pcb; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have first coils wound on its outer circumferential face and to include at least lens therein; a second pcb combined with the bottom surface of the holder module; a third pcb disposed over the holder module; a plurality of wire springs each configured to have one end connected to the second pcb and the other end connected to the third pcb; and buffer units provided at the connection units of the wire springs and the third pcb and configured to surround the connection units of the wire springs and the third pcb.. .
|Device and method for enhancing covert operations in hostile environments by reducing bandwidth and power requirements|
A compact sensor system with intelligent processing capabilities to reduce power usage and transmission bandwidth requirements is disclosed. The compact sensor system comprises a housing containing at least one sensor, processor, and processor readable media.
|Liquid jet head and liquid jet recording apparatus|
The liquid jet head includes an ejecting portion which has a first head chip and a second chip which are laminated with each other, a circuit board which outputs a drive signal for driving the ejecting portion, a first connection board which electrically connects the first head chip and the circuit board to each other, and a second connection board which electrically connects the second head chip and the circuit board to each other. A bend portion is provided in the circuit board.
|Graphic processor based accelerator system and method|
An accelerator system is implemented on an expansion card comprising a printed circuit board having (a) one or more graphics processing units (gpu), (b) two or more associated memory banks (logically or physically partitioned), (c) a specialized controller, and (d) a local bus providing signal coupling compatible with the pci industry standards (this includes but is not limited to pci-express, pci-x, usb 2.0, or functionally similar technologies). The controller handles most of the primitive operations needed to set up and control gpu computation.
|Printed circuit board including electromagnetic bandgap structure|
Embodiments of the present invention provide a printed circuit board, which includes an electromagnetic bandgap structure disposed around an antenna, so as to prevent noise from being transmitted to the antenna. The printed circuit board includes an antenna, a circuit chip, a plurality of metal layers and a plurality of dielectric layers, a pair of transmission lines for transmitting a signal to the antenna, and an electromagnetic bandgap structure disposed between the antenna and the circuit chip and for preventing an electromagnetic wave from being transmitted from the circuit chip to the antenna..
|Circuit board for supporting semiconductor light-emitting device mounted thereon, light-emitting module, lighting apparatus, and lighting system|
The present invention provides a technology related to an improvement in the performance of releasing heat generated in a semiconductor light-emitting device. In a light-emitting module including a semiconductor light-emitting device provided with at least a semiconductor light-emitting element and a phosphor, and a circuit board, on the circuit board, at least a semiconductor light-emitting device including a plurality of semiconductor light-emitting elements each having a different path of a drive current to be supplied thereto, or a plurality of semiconductor light-emitting devices each having a different path of a drive current to be supplied to the semiconductor light-emitting elements is mounted.
|Electric motor, in particular a radiator fan motor, and a contact|
An electric motor, in particular a radiator fan motor of a motor vehicle, has a stator which is fitted with a rotating-field winding, and a rotor which is mounted such that it can rotate in relation to the stator. A converter electronics system is provided, wherein a number of contact elements for insulation-free or enamel-insulated connection contacts of at least one component of the converter electronics system and/or for enamel-insulated winding ends of the rotating-field winding are mounted on a printed circuit board.
|Potting method for lamp chain|
A potting method for a lamp chain includes a) providing a mold having a potting groove; b) providing a fixing support which is fixedly kept in the potting groove; c) fixedly keeping a printed circuit board provided with a light emitting assembly in the fixed support; d) potting a potting material into the potting groove and curing the potting material; and e) removing the mold.. .
|Embedded package in pcb build up|
An apparatus including a printed circuit board including a body of a plurality of alternating layers of conductive material and insulating material; and a package including a die disposed within the body of the printed circuit board. A method including forming a printed circuit board including a core and a build-up section including alternating layers of conductive material and insulating material coupled to the core; and coupling a package including a die to the core of the printed circuit board such that at least a portion of a sidewall of the package is embedded in at least a portion of the build-up section.
|Method of fabricating land grid array semiconductor package|
A fan-out wafer level package is provided with a semiconductor die embedded in a reconstituted wafer. A redistribution layer is positioned over the semiconductor die, and includes a land grid array on a face of the package.