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Chip-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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NEW Laminar phased array antenna
Anokiwave, Inc.
August 17, 2017 - N°20170237180

A phased array has a laminar substrate, a plurality of elements on the front side of the substrate, and a plurality of integrated circuits also on the front side of the substrate. This structure is arranged to form a patch phased array. The plurality of integrated circuits, which are configured to control receipt and/or transmission of signals by the ...
NEW Packaging method for ultraviolet light emitting diode
Unistars Corporation
August 17, 2017 - N°20170236973

The invention provides a packaging method for ultraviolet light emitting diode, comprising: (s1) providing a carrier, connected to an electrode; (s2) fixing an uv led chip on the carrier and electrically connecting the uv led chip to the electrodes; (s3) covering the uv led chip with transparent silicon-and-oxygen-containing solution; and (s4) performing a thermal curing process.
NEW Multichip modules and methods of fabrication
Invensas Corporation
August 17, 2017 - N°20170236794

In a multi-chip module (mcm), a “super” chip (110n) is attached to multiple “plain” chips (110f′ “super” and “plain” chips can be any chips). The super chip is positioned above the wiring board (wb) but below at least some of plain chips (110f). ...
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NEW Radio ic device
Murata Manufacturing Co., Ltd.
August 17, 2017 - N°20170236049

A radio ic device includes an electromagnetic coupling module includes a radio ic chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The ...
NEW Non-contact data receiving/transmitting body
Toppan Forms Co., Ltd.
August 17, 2017 - N°20170236048

A non-contact data receiving/transmitting body is provided which includes an ic chip, a first antenna to which the ic chip is connected, and a second antenna for use as a booster that resonates with the first antenna in a non-contact manner. The first antenna is a ring-shaped antenna having at least three straight portions. The second antenna has a ...
NEW Device for spectroscopic detection and monitoring of biologically relevant molecules
The Texas A&m University System
August 17, 2017 - N°20170234799

There is a need in the point-of-care diagnostic community for an efficient and portable method for testing blood and other biological fluids that can be easily translated across multiple applications. An aspect of the invention described involves monitoring the optical properties of molecularly-mediated nanoparticle assemblies though an optically transparent and magnetically active microfluidic chip, which has recently emerged as an ...
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  • 242+ full patent PDF documents of Chip-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
NEW Devices and methods for fluid sample collection and diagnostic testing
Hoope Technologies Corporation
August 17, 2017 - N°20170231539

A medical device including a housing, and a diagnostic cartridge removably coupled to the housing, the diagnostic cartridge including a retractable needle mechanism disposed within the diagnostic cartridge, the retractable needle mechanism configured to extract a fluid sample, a fluid collection chamber disposed the retractable needle mechanism, the fluid collection chamber configured to collect the fluid sample extracted by the ...
Light emitting device with beam shaping structure and manufacturing method of the same
Maven Optronics Co., Ltd.
August 10, 2017 - N°20170229621

A chip scale packaging (csp) light emitting diode (led) device includes a flip-chip led semiconductor die and a beam shaping structure (bss) to form a monochromatic csp led device. A photoluminescent structure can be disposed on the led semiconductor die to form a phosphor-converted white-light csp led device. The bss is fabricated by dispersing light scattering particles with concentration equal ...
Method and apparatus of applying light and heat to quantum dots to increase quantum yield
Pacific Light Technologies Corp.
August 10, 2017 - N°20170229619

A method of increasing photo-luminescent quantum yield (plqy) of qds to be used as down-converters placed directly on an led chip includes synthesizing a plurality of quantum dots, applying energy to the plurality of quantum dots to increase plqy of the plurality of quantum dots, dispensing the plurality of quantum dots onto the led chip, and curing the led chip.
Flip chip light emitting diode having transparent material with surface features
Bridgelux, Inc.
August 10, 2017 - N°20170229607

Flip chip leds include a transparent substrate or carrier having an active material attached thereto and having a number of electrodes disposed along a common surface of the active material. The substrate may include a number of surface features disposed along a first surface adjacent the active material for improving light extraction from the active material, and includes a number ...
Integrated circuit (ic) with offset gate sidewall contacts and method of manufacture
International Business Machines Corporation
August 10, 2017 - N°20170229479

A method of forming logic cell contacts, forming cmos integrated circuit (ic) chips including the fets and the ic chips. After forming replacement metal gates (rmg) on fin field effect transistor (finfet) pairs, gates are cut on selected pairs, separating pfet gates from nfet gates. An insulating plug formed between the cut gates isolates the pairs of cut gates from ...
Power converter monolithically integrating transistors, carrier, and components
Texas Instruments Incorporated
August 10, 2017 - N°20170229435

A power converter (100) comprising a semiconductor chip (101) with a first (101a) and a parallel second (101b) surface, and through-silicon vias (tsvs, 110). The chip embedding a high-side (hs) field-effect transistor (fet) interconnected with a low side (ls) fet. Surface (101a) includes first metallic pads (111) as inlets of the tsvs, and an attachment site for an integrated circuit (ic) chip (150). Surface (101b) ...
Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
Texas Instruments Incorporated
August 10, 2017 - N°20170229408

A millimeter wave integrated circuit (ic) chip. The ic chip comprises an ic die and a wire bond ball grid array package encapsulating the ic die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the ...
Chip Patent Pack
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Chip Patent Applications
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inventor
  • 242+ full patent PDF documents of Chip-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Verification low power collateral generation
Netspeed Systems
August 10, 2017 - N°20170228481

Aspects of the present disclosure relate to methods, systems, and computer readable mediums for generating transition state specifications that include information regarding low power behavior of a system on chip (soc) and/or a network on chip (noc). Such transition state specifications can enable verification of switching behavior when elements/components of a soc/noc or a subset thereof switch ...
Method and apparatus for updating a system on chip (soc) image from a host computer ...
Hgst Netherlands B.v.
August 10, 2017 - N°20170228302

Embodiments of the present disclosure relate to systems and methods for updating a system on chip (soc) image without using direct memory access (dma) programming. A target soc monitors a target mailbox to determine reception of a data packet of an soc image received from a host computer, wherein the soc image includes a plurality of data packets. The target ...
Method and apparatus for virtualization
Cavium, Inc.
August 10, 2017 - N°20170228183

A virtual system on chip (vsoc) is an implementation of a machine that allows for sharing of underlying physical machine resources between different virtual systems. A method or corresponding apparatus of the present invention relates to a device that includes a plurality of virtual systems on chip and a configuring unit. The configuring unit is arranged to configure resources on ...
Method and apparatus for managing global chip power on a multicore system on chip
Cavium, Inc.
August 10, 2017 - N°20170228007

According to at least one example embodiment, a method and corresponding apparatus for controlling power in a multi-core processor chip include: accumulating, at a controller within the multi-core processor chip, one or more power estimates associated with multiple core processors within the multi-core processor chip. A global power threshold is determined based on a cumulative power estimate, the cumulative power ...
Biochips to diagnose hemoglobin disorders and monitor blood cells
Case Western Reserve University
August 10, 2017 - N°20170227495

A biochip compatible with very small blood sample volumes is used for delecting for detecting hemoglobin disorders and monitoring disorders associated with aberrant blood cell deformability and adhesion, including disease severity, upcoming pain crisis, treatment response, and treatment effectiveness in a clinically meaningful way.
Neuromuscular junction: nmj-on-chip
Cedars-sinai Medical Center
August 10, 2017 - N°20170226478

The invention relates to culturing motor neuron cells together with skeletal muscle cells in a fluidic device under conditions whereby the interaction of these cells mimic the structure and function of the neuromuscular junction (nmj) providing a nmj-on-chip. Good viability, formation of myo-fibers and function of skeletal muscle cells on fluidic chips allow for measurements of muscle cell contractions. Embodiments ...
Epoxy mold making and micromilling for microfluidics
Bio-rad Laboratories, Inc.
August 10, 2017 - N°20170225363

A method for efficiently manufacturing and fabricating microfluidic chips, where a base mold is formed to have positive-relief features used to cast an intermediary template chip with negative-relief features having dimensions of a scale in the micron range. The intermediary template chip is used to case a production mold, which is formed of a reinforced epoxy resin that, once hardened ...
Methods for rapid multiplexed amplification of target nucleic acids
Netbio, Inc.
August 10, 2017 - N°20170225164

A fast, multiplexed pcr system is described that can rapidly generate amplified nucleic acid products, for example, a full str profile, from a target nucleic acid. Such systems include, for example, microfluidic biochips and a custom built thermal cycler, which are also described. The resulting str profiles can satisfy forensic guidelines for signal strength, inter-loci peak height balance, heterozygous peak ...
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