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Chip patents

      

This page is updated frequently with new Chip-related patent applications.




 Integrated circuit chip extractor and  operating the same patent thumbnailnew patent Integrated circuit chip extractor and operating the same
The present disclosure relates to an ic chip extractor for removing an ic chip from a panel. The ic chip extractor includes a base plate and a heating head arranged on the base plate.
Hefei Boe Optoelectronics Technology Co., Ltd.


 Lighted door knob with lighted keyhole and lighted door frame and including motion detector and music or sounds patent thumbnailnew patent Lighted door knob with lighted keyhole and lighted door frame and including motion detector and music or sounds
An illuminated doorknob and keyhole brightens when in motion. The illumination level is dependent both on the ambient light level and on the motion of the doorknob.

 Apparatus and methods for quantum key distribution patent thumbnailnew patent Apparatus and methods for quantum key distribution
Systems, apparatus, and methods using an integrated photonic chip capable of operating at rates higher than a gigahertz for quantum key distribution are disclosed. The system includes two identical transmitter chips and one receiver chip.

 Integration of area efficient antennas for phased array or wafer scale array antenna applications patent thumbnailnew patent Integration of area efficient antennas for phased array or wafer scale array antenna applications
Package structures are provided for integrally packaging antennas with semiconductor rfic (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter-wave and terahertz frequency ranges. For example, a package structure includes an rfic chip, and an antenna package bonded to the rfic chip.
International Business Machines Corporation


 Magnetic shielding for mtj device or bit patent thumbnailnew patent Magnetic shielding for mtj device or bit
Emerging memory chips and methods for forming an emerging memory chip are presented. For example, magnetic random access memory (mram) chip magnetic shielding and methods of forming a magnetic shield processed at the device-level are disclosed.
Globalfoundries Singapore Pte. Ltd.


 Package support, fabrication method and led package patent thumbnailnew patent Package support, fabrication method and led package
A light-emitting diode (led) package, including: a substrate with front and back surfaces, including: at least two metal blocks; an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and an electrical insulation region between the at least two metal blocks; an led chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and a package encapsulant disposed over the led chip surface and covering at least a portion of the substrate; wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate.. .
Xiamen Sanan Optoelectronics Technology Co., Ltd.


 Package structure and  manufacturing same patent thumbnailnew patent Package structure and manufacturing same
The present disclosure relates to a method for manufacturing a led package structure. First, a support plate including a top surface is provided.
Zhen Ding Technology Co., Ltd.


 Method and  chip-on board flexible light emitting diode patent thumbnailnew patent Method and chip-on board flexible light emitting diode
A lighting device is disclosed having a plurality of led chips mounted on a single planar flexible substrate, wherein the single planar flexible substrate is disposed in an arcuate orientation. A heat sink having an arcuate surface shaped to approximate the arcuate orientation of the flexible substrate is coupled to the flexible substrate between complementary arcuate surfaces.
Alliance Sports Group, L.p.


 Copper structures with intermetallic coating for integrated circuit chips patent thumbnailnew patent Copper structures with intermetallic coating for integrated circuit chips
An integrated circuit (ic) chip includes a copper structure with an intermetallic coating on the surface. The ic chip includes a substrate with an integrated circuit.
Monolithic Power Systems, Inc.


 Integrated circuit module for a dual-interface smart card patent thumbnailnew patent Integrated circuit module for a dual-interface smart card
An integrated circuit (ic) module for a dual-interface smart card includes a planar, non-conductive module tape that is plated on its top surface to define a plurality of conductive contact pads. An ic chip is mounted on the bottom surface of the module tape and is electrically connected to each of the contact pads by a wire, the underside of each contact pad being exposed for bonding with the wire by punching a hole through the tape.
American Banknote Corporation


new patent

System on chip including clock management unit and operating the system on chip

In one embodiment, the clock management circuitry includes a first master clock controller configured to provide a first command to a first slave clock controller via a first channel based on a received first clock request. The clock management circuitry also includes the first slave clock controller configured to control outputting a first clock signal based on the first command..
Samsung Electronics Co., Ltd.

new patent

Micro heat pipe cooling system

At least one hollow metal body with a plurality of micro heat pipes embedded in the hollow metal body is used as a heat sink to remove heat from memory chips in a memory device.. .
Corsair Memory, Inc.

new patent

Electro-optic device with dichroic mirror and related methods

An electro-optic device may include a photonic chip having an optical grating at a surface, and an ic coupled to the photonic chip. The electro-optic device may include an optical element defining an optical path above the optical grating, and a dichroic mirror above the optical grating and aligned with the optical path..
Stmicroelectronics S.r.l.

new patent

Method and system for coupling optical signals into silicon optoelectronics chips

A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a cmos photonic chip comprising photonic, electronic, and optoelectronic devices. The devices may be integrated in a front surface of the chip and one or more optical couplers may receive the optical signals in the front surface of the chip.
Luxtera, Inc.

new patent

Semiconductor light emitting diode chip and light emitting device having the same

A semiconductor light emitting device includes a wiring board including a mounting surface on which a first wiring electrode and a second wiring electrode are disposed; a semiconductor light emitting diode (led) chip including a first surface on which a first electrode and a second electrode are disposed, the first surface facing the mounting surface, the semiconductor led chip further including a second surface positioned opposite to the first surface, and side surfaces positioned between the first and second surfaces, the first and second electrodes being connected to the first and second wiring electrodes, respectively; and a reflective layer disposed on at least one of the second surface and the side surfaces of the semiconductor led chip.. .

new patent

Light source modules and the backlight modules with the light source module

A light source module is disclosed. The light source includes: a power supply board; a plurality of led chips arranged on a surface of the power supply board in a matrix; and a light guiding housing arranged above the power supply board, a bottom surface of the light guiding housing is bonded with a surface of the power supply board so as to encapsulate the led chips between the light guiding housing and the power supply board.
Shenzhen China Star Optoelectronics Technology

new patent

High-sensitivity lateral-flow immunochromatographic chip using enzyme-mimic inorganic nanoparticles and detection method using same

This invention relates to a method of manufacturing a lateral-flow immunochromatographic chip using the protein enzyme-simulating catalytic activity of inorganic nanoparticles and, more particularly, to a method of fixing an antibody, which is capable of detecting an analyte, to nanoparticles of iron oxide (fe3o4) and platinum (pt), and amplifying a chromogenic signal using an enzyme-substrate reaction of the resulting nanoparticles, and a lateral-flow immunochromatographic chip manufactured using the same. The lateral-flow immunochromatographic chip is used to manufacture a bio-chip for detecting component materials with high sensitivity.
Postech Academy-industry Foundation

Directional two-dimensional router and interconnection network for field programmable gate arrays, and other circuits and applications of the router and network

A configurable directional 2d router for networks on chips (nocs) is disclosed. The router, which may be bufferless, is designed for implementation in programmable logic in fpgas, and achieves theoretical lower bounds on fpga resource consumption for various applications.
Gray Research Llc

Vertically stacked image sensor

A vertically stacked image sensor having a photodiode chip and a transistor array chip. The photodiode chip includes at least one photodiode and a transfer gate extends vertically from a top surface of the photodiode chip.
Apple Inc.

Apparatus having dice to perorm refresh operations

Some embodiments include an apparatus that comprise an interface chip having an oscillator to produce an original clock signal, a first memory chip having first memory cells, and a second memory chip having second memory cells. The first memory cells may be refreshed in response to a first clock signal based on the original clock signal.
Micron Technology, Inc.

Multi-frequency radio frequency identification tag

Embodiments described herein provide various designs of multi-frequency radio frequency identification (rfid) tags which are compact in size and tamper-proofing. In one aspect, a proposed multi-frequency rfid tag includes both a high frequency (hf) subsystem and an ultra high frequency (uhf) subsystem.
Neology, Inc.

Electronic device and hard disk device of electronic device

A hard disk device includes a storage module, a control chip, an encryption chip, and a power switching module to power the storage module. The control chip controls a display interface to prompt a user to enter a password, and outputs the password to the encryption chip, when a central processing unit accesses the storage module through the control chip.
Hon Hai Precision Industry Co., Ltd.

System on chip for reducing wake-up time, operating same, and computer system including same

A system on chip (soc) includes an internal read-only memory (rom) configured to store a first boot loader; a first internal static random access memory (sram) configured to receive a second boot loader output from a booting device, store the second boot loader, and perform a booting sequence according to control of the first boot loader; a second internal sram configured to receive a third boot loader output from the booting device, store the third boot loader, and perform a wake-up sequence according to control of the first boot loader; and a dynamic random access memory (dram) controller configured to load an operating system (os) from the booting device into a dram according to control of the second boot loader.. .
Samsung Electronics Co., Ltd.

Axial alignment of a lensed fiber in a silica v-groove

A v-groove assembly is used to edge couple a lensed fiber (e.g., an optical fiber made of silica) with a waveguide in a photonic chip. The v-groove assembly is made from fused silica.
Skorpios Technologies, Inc.

Fiber coupling device

A fiber coupling device comprising a mounting substrate, at least one optoelectronic and/or photonic chip and at least one first fiber coupling element for coupling an optical fiber to the fiber coupling device is disclosed. The optoelectronic and/or photonic chip has a main surface and comprises an optoelectronic and/or photonic active element couplable to a fiber end-piece of a respective optical fiber.
Corning Optical Communications Llc

Voltage contrast based fault and defect inference in logic chips

A voltage contrast imaging defect detection system includes a voltage contrast imaging tool and a controller coupled to the voltage contrast imaging tool. The controller is configured to generate one or more voltage contrast imaging metrics for one or more structures on a sample, determine one or more target areas on the sample based on the one or more voltage contrast imaging metrics, receive a voltage contrast imaging dataset for the one or more target areas on the sample from the voltage contrast imaging tool, and detect one or more defects based on the voltage contrast imaging dataset..
Kla-tencor Corporation

Microfluidic devices with integrated resistive heater electrodes including controlling and measuring the temperatures of such heater electrodes

The invention relates to methods and devices for control of an integrated thin-film device with a plurality of microfluidic channels. In one embodiment, a microfluidic device is provided that includes a microfluidic chip having a plurality of microfluidic channels and a plurality of multiplexed heater electrodes, wherein the heater electrodes are part of a multiplex circuit including a common lead connecting the heater electrodes to a power supply, each of the heater electrodes being associated with one of the microfluidic channels.
Canon U.s. Life Sciences, Inc.

Led lighting apparatus

Provided is a light-emitting diode (led) lighting apparatus including: a printed circuit board (pcb) having a planar structure; a led chip mounted on a surface of the pcb; a support coupled to another surface of the pcb; and a heat sink that is coupled to the support and dissipates heat generated in the led chip, wherein the support comprises a discontinuous through hole extending through two surfaces of the support, and the heat sink is coupled to the support when a portion of the heat sink inserted from a surface of the support into the through hole contacts the pcb.. .
Icepipe Corporation

Parallel wire light string and manufacturer

A light set and method of manufacturer with first and second spaced apart conducting wire conducting wires with one of the wires having an insulated coating and the other bare uninsulated. An led chip is surfaced mounted at intervals along the wires.
Seasonal Specialties, Llc

White-light led modules

A white-light led module is disclosed. The white-light led module includes a substrate, and a red-light led chip string, a blue-light led chip string, and a green-light led chip string arranged on the substrate.
Shenzhen China Star Optoelectronics Technology Co., Ltd.

Generation and trapping of aqueous droplets in a microfluidic chip with an air continuous phase

The invention relates to a method and system for generating droplets of an aqueous solution on a microfluidic chip with an air continuous phase. Specifically, the droplet generator according to the present invention is integrated into a microfluidic chip to generate and introduce droplets of an aqueous solution into the microfluidic chip.
University Of Maryland

Backlight module with mjt led and backlight unit including the same

A display device includes a display panel and a backlight unit configured to provide light towards the display panel. The backlight unit includes a backlight module including multi junction technology (mjt) light emitting diodes (leds) disposed on blocks disposed on a printed circuit board, an operating power generator configured to generate a dc voltage based on an input voltage, and an operation controller configured to independently control an operation of each of the blocks, the operation controller disposed in an ic of drive circuits.
Seoul Semiconductor Co., Ltd.

Built-in redundancy scheme for communication system on chip

In an example, the present invention includes an integrated system on chip device. The device has a redundancy block is configured to add at least redundancy bit as a function of one or more data bits associated with data for data error detection and correction data.
Inphi Corporation

Led package structure

An led package structure includes a base, an led chip disposed on the base, at least one metal wire, a phosphor sheet, and an encapsulation resin disposed in the base and encapsulating the led chip, the metal wire, and the phosphor sheet. The led chip has at least one electrode thereon.
Lite-on Technology Corporation

Quantum platelet converter

In one aspect a light emitting device includes a light emitting diode (led) chip, and an encapsulant covering the led chip. The encapsulant is embedded with a downconverter.
Seoul Semiconductor Co., Ltd.

Semiconductor light-emitting device

A semiconductor light-emitting device includes a substrate, an led chip, a control element, a conductive layer and an insulating layer. The substrate, made of a semiconductor material, has an obverse surface and a reverse surface spaced apart from each other in the thickness direction of the substrate.
Rohm Co., Ltd.

Printable inorganic semiconductor structures

The present invention provides structures and methods that enable the construction of micro-led chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-leds useful, for example, in display systems.
X-celeprint Limited

Dynamic security codes, tokens, displays, cards, devices, multi-card devices, systems and methods

A dynamic code of a transaction device may be validated by a remote processor by comparing the dynamic code to a verification code generated using a timestamp and identification data received from the transaction device. A static code may replace the dynamic code for authorization processing.
Dynamics Inc.

Card reader having discriminator contact

A card reader for a point-of-sale system that is configured to accept both magnetic strip-type and integrated circuit (ic) chip-type payment cards. The card reader is a component of a point-of-sale system including a portable computing device in communication with the card reader that is configured to present a first graphical user interface (gui) when a magnetic stripe-type card is detected and a second gui when an ic chip-type card is detected in the card reader.
Square, Inc.

Card reader having discriminator contact

A card reader for a point-of-sale system that is configured to accept both magnetic strip-type and integrated circuit (ic) chip-type payment cards. The card reader is a component of a point-of-sale system including a portable computing device in communication with the card reader that is configured to present a first graphical user interface (gui) when a magnetic stripe-type card is detected and a second gui when an ic chip-type card is detected in the card reader.
Square, Inc.

Apparatus and methods for providing a reconfigurable bidirectional front-end interface

An apparatus and methods are disclosed for a bidirectional front-end circuit included within a system on chip (soc). The bidirectional front-end circuit includes a differential bidirectional terminal for receiving and transmitting signals.
Qualcomm Incorporated

Systems, methods, and controlling the power-on or boot sequence of an integrated circuit based on power harvesting conditions

In some embodiments, an apparatus includes an integrated circuit such as a system on chip that operates in part from harvested power and that uses information about power harvesting conditions to alter a power-on sequence or boot sequence based on that information. In some embodiments, a method uses information about power harvesting and energy harvesting conditions to alter a power-on sequence or boot sequence..
Psikick, Inc.

Sol composition for sol-gel biochip to immobilize probe on substrate without surface treatment and method and screening thereof

The present invention relates to a method for screening a sol composition for sol-gel biochips, which is used to immobilize a probe on a surface-untreated substrate, also relates to a sol composition screened by said method and a sol-gel biochip comprising said sol composition immobilized thereon. The sol composition screened by the disclosed method can be mixed with a probe, and the sol mixture can be integrated on 96-well plates, which are widely used in existing bioassays, without surface treatment.

Output-current detection chip for diode sensors, and diode sensor device

The present invention relates to an output-current detection ic chip for diode sensors and a diode sensor device, which reduce the influence by a leak current of a protection circuit. The present invention is equipped with a sensor unit in which anodes of n (n being an integer of 2 or more) diode sensors are connected to each other, a common terminal connected to a connection portion where the anodes are connected to each other, n input terminals connected to cathodes of the diode sensors, n+1 protection circuits connected to the input terminals and the common terminal, an i-v conversion circuit which converts an output current of each diode sensor into a voltage, a chopper circuit which switches the polarity of the output current and inputs the same to the i-v conversion circuit, and a dummy protection circuit connected to the input of the i-v conversion circuit..
Asahi Kasei Microdevices Corporation

System and device for high throughput generation of combinatorial droplets and methods of use

The present invention is directed to a microfluidic system comprising a microfluidic chip and a method of performing a chemical assay wherein a sample is processed into multiple daughter droplets and said daughter droplets are incubated with varying reagents. The properties of these droplets can be detected to provide assay data..
The Johns Hopkins University

Light emitting diode drive device and illumination device

To provide a circuit for reducing an afterglow of secondary light, a circuit includes an led (11) which includes an led chip (13) and a ksf phosphor (15), and a first output circuit (5) and a second output circuit (6) which are coupled to a cathode (11c). When a pwm signal goes to “h”, the first output circuit is driven thereby making if flow from the cathode.
Sharp Kabushiki Kaisha

System on chip, display system including the same, and operating the display system

A system on chip includes a video codec configured to output syntax information and data information, which correspond to each of a plurality of blocks included in each frame of image data, based upon a result of encoding or decoding the image data. A map generator is configured to determine whether each of the blocks is an update block based upon the syntax information and to generate a mapping table based upon a determination result.
Samsung Electronics Co., Ltd.





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This listing is a sample listing of patent applications related to Chip for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Chip with additional patents listed. Browse our RSS directory or Search for other possible listings.


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