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Chip patents



      

This page is updated frequently with new Chip-related patent applications.




Date/App# patent app List of recent Chip-related patents
05/19/16
20160143110 
 Monolithic led chip in an integrated control module with active circuitry patent thumbnailnew patent Monolithic led chip in an integrated control module with active circuitry
A lighting device includes a monolithic led chip flip-chip mounted onto an interconnect structure. The monolithic chip includes led junctions formed from a single led junction.
Bridgelux, Inc.


05/19/16
20160141477 
 Led module patent thumbnailnew patent Led module
An led module a1 includes an led chip 1, a lead group 4 including a lead 4a on which the led chip 1 is mounted and a lead 4b spaced apart from the lead 4a, a resin package 2 covering part of the lead group 4, and mounting terminals 41 and 42 provided by part of the lead group 4 that is exposed from the resin package 2 and spaced apart from each other in direction x. The led module further includes a mounting terminal 43 spaced apart from the mounting terminal 41 in direction y, and a mounting terminal 44 spaced apart from the mounting terminal 42 in direction y.
Rohm Co., Ltd.


05/19/16
20160141324 
 Semiconductor image sensor module,  manufacturing the same as well as camera and  manufacturing the same patent thumbnailnew patent Semiconductor image sensor module, manufacturing the same as well as camera and manufacturing the same
A semiconductor image sensor module 1 at least includes a semiconductor image sensor chip 2 having a transistor forming region on a first main surface of a semiconductor substrate and having a photoelectric conversion region with a light incident surface formed on a second main surface on the side opposite to the first main surface and an image signal processing chip 3 for processing image signals formed in the semiconductor image sensor chip 2, wherein a plurality of bump electrodes 15a are formed on a first main surface, a plurality of bump electrodes 15b are formed on the image signal processing chip 3, both the chips 2 and 3 are formed to be laminated through heat dissipating means 4 and the plurality of bump electrodes 15a of the semiconductor image sensor chip 2 and the plurality of bump electrodes 15b on the image signal processing chip 3 are electrically connected.. .
Sony Corporation


05/19/16
20160141276 
 Light-emitting structure for providing predetermined whiteness patent thumbnailnew patent Light-emitting structure for providing predetermined whiteness
A light-emitting structure for providing a predetermined whiteness includes a substrate and a light-emitting unit. The light-emitting unit includes a plurality of first and second light-emitting groups disposed on the substrate.
Lite-on Technology Corporation


05/19/16
20160141033 
 Memory system and assembling  memory system patent thumbnailnew patent Memory system and assembling memory system
According to one embodiment, each memory chip included in a memory package includes a first storage unit that stores therein first information that is n-bit information and is a comparison target of a chip address, and is used for identifying its own memory chip, a second storage unit that stores therein second information for determining an effective bit of the n-bit first information, and a control unit that determines an effective bit of the n-bit first information and an effective bit of the chip address based on the second information.. .
Kabushiki Kaisha Toshiba


05/19/16
20160141005 
 Semiconductor integrated circuit and  driving the same patent thumbnailnew patent Semiconductor integrated circuit and driving the same
Provided is a semiconductor integrated circuit including a plurality of memory chips stacked therein, each of the memory chips may include: a pumping enable signal control unit suitable for generating a pumping enable signal in response to a power-up signal or a trigger signal received from a first adjacent memory chip, delaying the pumping enable signal by a given time, and outputting the delayed pumping enable signal to a second adjacent memory chip; and a pumping unit suitable for generating a pumping voltage by performing a pumping operation in response to the pumping enable signal.. .
Sk Hynix Inc.


05/19/16
20160140918 
 Display device patent thumbnailnew patent Display device
Provided is to secure a data-writing period to a source line and reduce the number of the ic chips used. N image data (e.g., three image data, rgb) are sequentially input to one input terminal.
Semiconductor Energy Laboratory Co., Ltd.


05/19/16
20160140368 
 Rfid tag and rfid system patent thumbnailnew patent Rfid tag and rfid system
An rfid tag includes a base part, a loop antenna around the base part including a first antenna element and a second antenna element, and a loop-length shorter than a wavelength of a resonant frequency, and an ic chip at a first surface side of the base part. The ic chip is connected between a first terminal disposed on a first end of the first antenna element and a second terminal disposed on a first end of the second antenna element.
Fujitsu Limited


05/19/16
20160140366 
 Card reader and control method therefor patent thumbnailnew patent Card reader and control method therefor
Provided is a card reader that accepts and processes the short side of a substantially rectangular ic card conforming to international and jis standards, said card reader being capable of easily determining whether or not the orientation of the inserted ic card is correct. This card reader comprises: an insertion port wherein a card having a built-in ic chip is inserted; a metal detection mechanism for detecting an external connection terminal of the ic chip formed in the card; and a tip detection mechanism for detecting the tip, in the insertion direction, of the card inserted from the insertion port.
Nidec Sankyo Corporation


05/19/16
20160140281 
 System on chip i/o connectivity verification in presence of low power design considerations patent thumbnailnew patent System on chip i/o connectivity verification in presence of low power design considerations
Formal verification of connectivity of a circuit, for example, a circuit representing a system on chip i/o ring is performed with low power considerations. The formal verification determines whether the connectivity of a circuit remains valid when low power design specification is introduced.
Synopsys, Inc.


05/19/16
20160139350 
new patent

Inverted 45 degree mirror for photonic integrated circuits


Inverted 45° semiconductor mirrors as vertical optical couplers for pic chips, particularly optical receivers and transmitters. An inverted 45° semiconductor mirror functions to couple light between a plane in the pic chip defined by thin film layers and a direction normal to a top surface of the pic chip where it may be generated or collected by an off-chip component, such as a wire terminal.

05/19/16
20160138765 
new patent

Led lighting device with improved light distribution


A lighting device and a lighting unit comprising a reflector and a lighting device, or led lamp are described. The led lamp have a first and a second led assembly.
Koninklijke Philips N.v.


05/19/16
20160135426 
new patent

A communicating with an electronic device and an electronic device locatable on or in an animal


An electronic monitoring device (20) for attaching to an animal (21) for determining a plurality of states of an animal (21). The monitoring device (20) comprises an nfc module (31) which facilitates wireless communication between a smart phone (32) and the monitoring device (20).
Dairymaster


05/12/16
20160134450 

Non-contact communication apparatus


Provided is a non-contact communication apparatus which uses a conventional ic chip without any change, while eliminating the need to transmit power to the ic chip and allowing an increase in communication range. A non-contact communication apparatus connectable to an ic chip includes an antenna section, a first detection section that retrieves a first detection signal from a signal received by the antenna section, an amplitude modulating section that amplitude-modulates a clock signal using the first detection signal retrieved by the first detection section and that inputs the amplitude-modulated signal to the ic chip, a second detection section that retrieves a second detection signal from an output signal from the ic chip, a load modulating section that load-modulates a carrier retrieved from the antenna section using the second detection signal retrieved by the second detection section and that inputs the load-modulated carrier to the antenna section, and a power supply section..
Jr East Mechatronics Co., Ltd.


05/12/16
20160133811 

High-power led lamp cooling device and manufacturing the same


A high-power led lamp cooling device and its manufacturing method, which includes: manufacturing a semiconductor crystal bar in advance into cone-shaped crystal bar with one end having large diameter and the other having small diameter, making color mark on each wafer as the large-diameter end surface of the tail end when the cone-shaped semiconductor crystal bar is cut into slices; cutting and pelletizing the conical surface to obtain polygonal cylindrical n-type or p-type semiconductor elements, arranging them in a matrix form between two beryllium-oxide ceramic chips provided with conductive circuits, connecting head end of n-type semiconductor elements to tail end of the p-type semiconductor elements in series to manufacture high-power led lamp cooling device. The high-power led lamp cooling device can achieve: good cooling effect, high working efficiency, low energy consumption and capable of reducing light failure of led lamp, and prolonging service life of the high-power led lamp..
Suzhou Weiyuan New Material Technology Co., Ltd.


05/12/16
20160133797 

Smd type led package device, manufacturing the same, and light-emitting apparatus


Disclosed is a smd type led package device, a method for manufacturing the same, and a light-emitting apparatus, wherein the surface-mount-device (smd) type light-emitting diode (led) package device comprises an assembly of an led chip, two metal supporting frames, and a packaging body. The two metal supporting frames of the assembly are spaced apart from each other and disposed in parallel along the first axis.
Powerled Electronic Co., Ltd.


05/12/16
20160133616 

Photo-sensitive silicon package embedding self-powered electronic system


A self-powered electronic system comprises a first chip (401) of single-crystalline semiconductor embedded in a second chip (302) of single-crystalline semiconductor shaped as a container bordered by ridges. The assembled chips are nested and form an electronic device assembled, in turn, in a slab of weakly p-doped low-grade silicon shaped as a container (330) bordered by ridges (331).
Texas Instruments Incorporated


05/12/16
20160133615 

Semiconductor light emitting device and semiconductor light emitting device package including the same


There is provided a semiconductor light-emitting device which includes a light-emitting diode (led) chip having a first plane on which first and second electrodes are disposed and a second plane disposed opposite to the first plane, first and second solder bumps disposed in bonding areas of the first and second electrodes, respectively, and a protective device electrically connected to the first and second electrodes and mounted on the first plane of the led chip. The protective device has the substantially same thickness as each of the first and second solder bumps..
Samsung Electronics Co., Ltd.


05/12/16
20160133612 

Led module with led chips


Various embodiments may relate to an led module, including a number of first inherently unpackaged led chips, which are in each case designed to emit light of a first color at a respective light emission area, and a number of second inherently unpackaged led chips, which are in each case designed to emit light of a second color, different than the first color, at a respective light emission area. The led chips are provided jointly in a housing, and the respective light emission area of a second led chip is at least 25% smaller than the respective light emission area of a first led chip.
Osram Gmbh


05/12/16
20160133610 

Light emitting diode (led) components and methods


Light emitting diode (led) components and related methods are disclosed. Led components include a submount, at least one led chip on a first surface of the submount, and a non-reflective, light permeable structure or dam.
Cree, Inc.


05/12/16
20160133517 

Self-limited, anisotropic wet etching of transverse vias in microfluidic chips


The present invention is notably directed to a method of fabrication of a microfluidic chip (1). Comprising: providing (s10-s20) a wafer (10, 12) of semiconductor material having a diamond cubic crystal structure, exhibiting two opposite main surfaces (s1, s2), one on each side of the wafer, and having, each, a normal in the <100> or <110> direction; and performing (s30) self-limited, anisotropic wet etching steps on each of the two main surfaces on each side of the wafer, to create a via (20, 20a) extending transversely through the thickness of the wafer, at a location such that the resulting via connects an in-plane microchannel (31) on a first one (51) of the two main surfaces to a second one (s2) of the two main surfaces, the via exhibiting slanted sidewalls (20s) as a result of the self-limited wet etching.
International Business Machines Corporation


05/12/16
20160132451 

System on chip having semaphore function and implementing semaphore function


A system on chip, semiconductor device, and/or method are provided that include a plurality of masters, an interface, and a semaphore unit. The interface interfaces the plurality of masters with a slave device.

05/12/16
20160132409 

Mirroring in three-dimensional stacked memory


A method for mirroring in three-dimensional-stacked memory includes receiving a plurality of thermal profiles from a plurality of memory chips. The method also includes ranking the plurality of memory chips in a first ranked list of memory chips as a function of the plurality of thermal profiles and forming a first group of memory chips from the plurality of memory chips based on the first ranked list of memory chips.
International Business Machines Corporation


05/12/16
20160132408 

Mirroring in three-dimensional stacked memory


A method for mirroring in three-dimensional-stacked memory includes receiving a plurality of thermal profiles from a plurality of memory chips. The method also includes ranking the plurality of memory chips in a first ranked list of memory chips as a function of the plurality of thermal profiles and forming a first group of memory chips from the plurality of memory chips based on the first ranked list of memory chips.
International Business Machines Corporation


05/12/16
20160131862 

Electronic/photonic chip integration and bonding


An optical waveguide device comprising: one or more photonic chips, the one or more photonic chips including: a first portion of a photonic chip comprising an array of first components, each of the first components having an optical input and an electrical output; and a second portion of a photonic chip comprising an array of second components, each of the second components configured to receive an electrical input; the optical waveguide device further comprising: an integrated circuit; the integrated circuit forming an electrical bridge between the electrical outputs of the first components and respective electrical inputs of the second components; wherein the integrated circuit is directly mounted onto the one or more photonic chips; and/or wherein the integrated circuit is located between the first portion of a photonic chip and the second portion of a photonic chip.. .
Rockley Photonics Limited


05/12/16
20160131669 

Visualized biochip and simultaneously detecting a variety of antibiotics, illegal additives and biotoxins


The present invention provides a biochip for simultaneously detecting a variety of antibiotics, illegal additives and biotoxins in a visualized manner, wherein the biochip comprises a chip carrier fixed with a group of detection target antigens, the detection targets are the antibiotics, the illegal additives and the biotoxins, and the biochip is prepared by the following method: enabling the bovine serum albumin and the detection target antigens to perform sample application operation on the chip carrier through a biochip preparation system by taking bovine serum albumin as blank control, and then fixing in a water bath at 20-37° c. For 0.5-4 h for preparation.
Nanjing Xiangzhong Biotechnology Co., Ltd


05/12/16
20160131590 

Biochip for measuring blood glucose levels, and blood glucose meter for smartphone, containing same


Disclosed are a biochip for measuring blood glucose levels and a blood glucose meter for a smartphone including the same. The biochip for measuring blood glucose levels includes: a substrate, one surface of which is provided with a blood glucose inflow region into which blood glucose flows and with a reaction region that is connected to the blood glucose inflow region and has a recess formed therein, a porous separator disposed on the blood glucose inflow region to face the surface of the substrate, and silica nanoparticles and a reaction reagent distributed on the reaction region of the substrate.
Gachon University Industry Academic Cooperation Foundation


05/12/16
20160131313 

Light emitting device


A light emitting device includes a plurality of led strings connected in parallel, wherein: each of the led strings includes a plurality of led chips connected in series to each other; in the led string, ultraviolet light led chips and blue led chips or violet led chips and blue led chips are connected in series to each other; and the number of the ultraviolet light led chips or the number of the violet led chips is the same as the number of the blue led chips in each of the plurality of led strings.. .
Toyoda Gosei Co., Ltd.


05/12/16
20160130543 

Modular microtube network for vascularized organ-on-a-chip models


A perfusable, microtube-based flow system for microdevice models of human tissues and organs includes a microfluidic chip with a network of microtubes passing through at least one common chamber space suitable to hold cells of an appropriate organ and/or a biocompatible support matrix. The microtube model network can be used to create model tissues and organs for study and research..
The Government Of The United States Of America, As Represented By The Secretary Of The Navy


05/05/16
20160128120 

Method of transmitting and receiving data of electronic device and electronic device using the method


A method of operating an electronic device, an electronic device, and a chip set are provided. The method includes detecting a generation of an event based on at least one of a signal received externally and an internal operation, by the electronic device including a cellular communication module, a first short range wireless communication module and a second short range wireless communication module; determining at least one state of a connection between the electronic device and a first external electronic device that has been connected to the electronic device using the first short range wireless communication module, by the electronic device; and transmitting a signal related to the event, using at least one of the cellular communication module, the first short range wireless communication module and the second short range wireless communication module, based on at least one of the at least one state of the connection between the electronic device and the first external electronic device, by the electronic device..
Samsung Electronics Co., Ltd.


05/05/16
20160126436 

P-n separation metal fill for flip chip leds


A light emitting diode (led) structure has semiconductor layers, including a p-type layer, an active layer, and an n-type layer. The p-type layer has a bottom surface, and the n-type layer has a top surface through which light is emitted.
Koninklijke Philips N.v.


05/05/16
20160126427 

An led module and its manufacturing process


The present invention relates to the technical field of illuminating lamp, especially to an led module and its manufacturing process. The led module of the present invention includes a lens group, an led illuminant, a circuit board and a heat sink; the led illuminant includes an led chip and a heat sink holder; the led chip is attached to the heat sink holder which is disposed on the circuit board by surface mounted technology; the lens group covers the heat sink, and is located above the led chip; encapsulant is filled in a confined space formed between the lens group and the heat sink through a process of injection.
Hangzhou Hpwinner Opto Corporation


05/05/16
20160125930 

Method and calibrating write timing in a memory system


A system that calibrates timing relationships between signals involved in performing write operations is described. This system includes a memory controller which is coupled to a set of memory chips, wherein each memory chip includes a phase detector configured to calibrate a phase relationship between a data-strobe signal and a clock signal received at the memory chip from the memory controller during a write operation.
Rambus Inc.


05/05/16
20160125207 

Card reader


A card reader may include a card passage, a magnetic head to abut with a magnetic stripe of the card, and an ic contact block having ic contact springs to contact with external connection terminals of an ic chip of the card. The magnetic head is disposed in a front side portion of the card reader so that a gap of the magnetic head faces the card passage from a lower side, and the ic contact block is disposed in a rear side portion of the card reader so that the ic contact springs face the card passage from an upper side.
Nidec Sankyo Corporation


05/05/16
20160124851 

Memory system and soc including linear remapper and access window


A system on chip which is connected with a plurality of memory chips includes first and second processors, a first access window, a first linear remapper, and a memory controller. The first and second processors are configured to provide an address for using the plurality of memory chips.

05/05/16
20160124807 

Multi-chip device and storing data


A multi-chip device and method for storing input data. The multi-chip device includes: a plurality of memory chips being adapted to store encoded input data, wherein each of the plurality of memory chips includes a detection unit that outputs detection information; an evaluation unit being adapted to perform an evaluation of the detection information from each of the plurality of memory chips, and to adapt the detection algorithm of any of the detection units depending on the performed evaluation; a combination unit being adapted to receive the detected bits and to combine the detected bits; and a decoding unit being adapted to output decoded data by decoding the combined detected bits.
International Business Machines Corporation


05/05/16
20160124654 

System and distributed computing in non-volatile memory


A system and method are disclosed for incorporating mathematical and/or logical functionality within a memory system (such as a solid state drive (ssd)). The mathematical and/or logical functionality may comprise an arithmetic logic unit (alu).
Sandisk Technologies Inc.


05/05/16
20160123978 

Biochip, antigen bouquet, optical reader and detecting and monitoring diseases


The present invention comprises a biochip with specifically-designed configuration and microfluidic properties that increases the speed and effectiveness of the whole process of detection and monitoring diseases. This biochip is to be read in a specifically adapted optical reader for which an algorithm was developed and implemented to provide faster and more selective results, with a revealing method using quantum dots.
Stab Vida-investigaÇÄo E ServiÇos Em CiÊncias BiolÓgicas Lda Pt


04/28/16
20160120003 

White light emitting device


A white light emitting device includes an led chip capable of emitting light with a peak wavelength of 390 to 430 nm, and a wavelength conversion layer including first, second and third fluorescent materials. The first fluorescent material is capable of being excited to emit light with a peak wavelength of 450 to 470 nm.
Lite-on Technology Corp.


04/28/16
20160119153 

Zero standby power for powerline communication devices


An embodiment is an integrated system on chip (soc) including a communication interface configured to implement a communication protocol including functional blocks that are energized or de-energized individually so that a minimum power consumption is used to receive and detect a signal, and a receiver identification (id) detection function configured to determine whether the signal is intended for the device in which the soc resides. The soc further includes a power management function configured to control which functions in the soc and/or device in which the soc resides are energized or de-energized depending on the results of the receiver id detection function, and a power source capable of energizing a minimum number of the functional blocks required to receive and detect a signal, wherein the power source can be used in a low power state and switched over to a main power supply when the soc is energized..
Stmicroelectronics, Inc.


04/28/16
20160118569 

Portable generation and lighting device based on temperature difference


A portable lighting device with thermoelectric power generation which includes a thermoelectric power generation module (001), a mounting top panel (004), a light emitting unit (003) on the mounting top panel (004), an adjustment rod (002) connecting between the thermoelectric power generation module (001) and the mounting top panel (004). The thermoelectric power generation module (001), having a hot and a cold sides, includes a heat dissipation unit (100) proximal to the cold side, a thermoelectric power generation chip set (110), a heat supply box (120) proximal to the hot side and a combustion chamber (130) connected to the bottom of the heat supply box.
Dongguan Hewang Electric Co., Ltd


04/28/16
20160118565 

Led support assembly and led module


An led support assembly and an led module are provided. The led support assembly includes: a metal heat sink, a first ceramic substrate and a second ceramic substrate, the metal heat sink defines an upper surface; the first ceramic substrate is adapted to support a led chip and disposed on the upper surface of the metal heat sink; the second ceramic substrate is adapted to support electrodes of the led chip and surrounds the first ceramic substrate..
Byd Company Limited


04/28/16
20160118564 

Light emitting diode chip having electrode pad


Disclosed herein is an led chip including electrode pads. The led chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer.
Seoul Viosys Co., Ltd.


04/28/16
20160118319 

Semiconductor package and method therefor


In one embodiment, an electronic package structure includes a lead having a first width. An electronic chip having a conductive bump on a major surface, the conductive bump has a second width greater than the first width.
Amkor Technology, Inc.


04/28/16
20160118311 

Thin film rdl for ic package


A package substrate comprising a thin film redistribution layer (rdl) with a plurality of metal pillar configured on chip side is disclosed to thin the thickness of an ic package before mounting to a circuit board. The height of metal pillar keeps a proper distance between the ic chip and the package substrate so that an underfill material can be filled in between to ensure the reliability of the ic package..

04/28/16
20160118194 

Solid electrolytic chip capacitor and manufacturing method thereof


A solid electrolytic chip capacitor is provided which comprises a substrate layer, an electrical insulating block, a conductive polymer layer, a patterned reinforcement layer, and an electrode layer. The electrical insulating block is formed on the substrate layer to define an anode region and a cathode region on the substrate layer.
Apaq Technology Co., Ltd.


04/28/16
20160118097 

Bipolar logic gates on mos-based memory chips


A system uses both mos-based and bipolar-based decoding circuitry in an address decoder for mos-based memory. The system includes a mos-based memory, which includes an array of a plurality of memory cells configured to store data, and an address decoder including mos-based circuitry and bipolar logic circuitry.
Elwha Llc


04/28/16
20160118088 

Storage device including a plurality of nonvolatile memory chips


A storage device includes first and second nonvolatile memory groups that respectively include first and second nonvolatile memory chips, a memory controller connected to the first and second nonvolatile memory groups in common through input/output lines and at least one control line, and a group select circuit connected to the memory controller through the at least one control line and chip enable lines. The group select circuit is connected to the first and second nonvolatile memory groups through a plurality of first and second chip enable lines, respectively.
Samsung Electronics Co., Ltd.


04/28/16
20160117264 

Systems and methods for preventing data remanence in memory


A system for preventing data remanence in memory is provided. The system includes a computing device, a memory chip coupled to the computing device and including memory, and a heater, the heater configured to prevent data remanence in a memory by providing heat to at least a portion of the memory.
Elwha Llc


04/28/16
20160116689 

Arrangement of photonic chip and optical adaptor for coupling optical signals


An apparatus includes an optical adaptor having monolithically integrated optical elements and first micro-mechanical features, the latter defining at least a first horizontal reference surface and a first vertical reference surface; wherein the first horizontal reference surface is perpendicular to an optical plane, the latter being perpendicular the optical axis of the optical elements; and wherein the first vertical reference surface is perpendicular to the first horizontal reference surface and parallel to the optical axis.. .
International Business Machines Corporation


04/28/16
20160116526 

Method and quantifying defects due to through silicon vias in integrated circuits


A device and method to control the heating of an ic chip in a wafer form for measuring various parameters associated therewith are provided. Embodiments include a device having a silicon layer with an upper surface, and on a plastic carrier; a plurality of devices in the silicon layer and electrically coupled through the upper surface to a test control system; a through silicon via (tsv) extending into the silicon layer; and a parallel heating structure adjacent to the plurality of devices electrically coupled to the test control system..
Global Foundries Inc.


04/21/16
20160113127 

Electronic module having an electrically insulating structure with material having a low modulus of elasticity


Electronic module comprising at least one electronic chip, an encapsulation structure in which the at least one electronic chip is at least partially encapsulated, an electrically conductive structure for the electrically conductive contacting of the at least one electronic chip, and an electrically insulating structure which is at least partially formed from a material having a low modulus of elasticity, wherein a variation of the value of the modulus of elasticity is at the most 10 gpa in a temperature range between −40° c. And +150° c..

04/21/16
20160113088 

Lighting system and method to control a lighting system


An led lighting system is disclosed, which generally consists of an enclosure, one or more led modules, one or more transformers, and one or more drivers. A lamp assembly is disclosed, which generally consists of one or more vertically oriented led chips, thermally conductive shells, and a thermally dissipating means positioned at the back of the led chips.

04/21/16
20160112808 

Mems microphone modules and wafer-level techniques for fabricating the same


A method of fabricating a plurality of mems microphone modules by providing a first substrate wafer 62 on which are mounted a plurality of sets comprising an led 102, an ic chip 22 and a mem microphone device 24, where the led 102 and ic chip 22 are surrounded and separated by first spacers 104, 64a, 64, the spacer 104 being much taller, attaching a second substrate on top of the first spacer elements above the ic chip 22, mounting a mems microphone device 24 to the second substrate 60, the second substrate not extending over the led 102, surrounding the mems microphone device by second spacers 32a, 32, attaching a cover wafer 28 across the whole first substrate wafer 62 covering all the plurality of sets, forming openings 30 to the mems cavities, dividing the substrate wafer 62 into individual mems microphone modules through the width of the separating spacers 104, 32, 64. Conductive traces may extend through the spacers.

04/21/16
20160111617 

Light emitting diode package


A light emitting diode (led) package includes an led chip, a first lead frame and a second lead frame electrically connected to the led chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame..

04/21/16
20160111607 

Phosphor sheet, light-emitting device having the phosphor sheet and manufacturing the same


A light-emitting device includes a substrate including a first electrode and a second electrode, a light-emitting diode (led) chip electrically connected to the first and the second electrodes, and a phosphor sheet disposed on an upper surface of the led chip, a first transparent part disposed under the phosphor sheet, and a second transparent part disposed between the phosphor sheet and the led chip. The first transparent part contacts the second transparent part..

04/21/16
20160111363 

Electrical connections for chip scale packaging


Electrical connections for chip scale packaging are disclosed. In one embodiment, a semiconductor device includes a post-passivation layer disposed over a substrate, the substrate having a first direction of coefficient of thermal expansion mismatch.

04/21/16
20160110639 

Passive smart cards, metal cards, payment objects and smart jewelry


Rfid devices comprising (i) a transponder chip module (tcm, 1410) having an rfic chip (ic) and a module antenna (ma), and (ii) a coupling frame (cf) having an electrical discontinuity comprising a slit (s) or non-conductive stripe (ncs). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna.

04/21/16
20160109932 

System-on-chip including a power path controller and electronic device


A system on chip (soc) includes a plurality of function circuits including a plurality of logic circuits and a plurality of function circuits each of which includes a logic circuit and a memory, and a plurality of power path controllers respectively coupled to a plurality of first power sources at first input terminals, commonly coupled to a second power source at second input terminals, and respectively coupled to the memories at output terminals. The logic circuits are respectively coupled to the first power sources, and configured to be supplied with a plurality of first power supply voltages from the first power sources, respectively.

04/21/16
20160109668 

Direct printed circuit routing to stacked opto-electrical ic packages


An optical transmitter may include a chip stack that includes an electrical ic that is mounted using solder balls to a photonic chip. These solder connections permit the electrical ic and the photonic chip to communicate.

04/21/16
20160109659 

Stacked photonic chip coupler for soi chip-fiber coupling


Embodiments are provided for an optical coupler created by bonded photonic chip coupler for silicon-on-insulator (soi) chip-fiber coupling. System and apparatus embodiments for a bonded photonic chip coupler for soi chip-fiber coupling provide for reduced mismatch between fiber and chip, increased coupling efficiency, and lower photonics device insertion loss.

04/14/16
20160105626 

Retail demo mode on gps or ip reverse look up


A device such as a television automatically determines, on initial power up, its geographical location. If the television is determined to be residing in a retail store location it will automatically default to retail mode where picture and audio quality will be set to pre-specified settings conducive to a retail environment where the ambient light and sound levels are not what would typically be found in a residential environment.

04/14/16
20160105297 

Joint transmitter and receiver map algorithm for enhancing filtering tolerance in a bandwidth-limited system


A system for optimizing signal quality in an optical communication system is provided including a transmitter for converting digital signals to optical signals, the transmitter including a transmitter digital signal processing chip including a pre-distortion logic and a transmitter look-up table (lut). A receiver is operatively coupled to the transmitter for receiving and converting the optical signals from the transmitter to digital signals.

04/14/16
20160104065 

Dual ic card


A dual ic card of the present invention includes: an ic module having a contact terminal portion contacting an external machine, a connecting coil configuring a contactless terminal portion by electromagnetic coupling, and an ic chip having a contact communication function and a contactless communication function; an antenna formed along a coil wiring path that defines an inductance and having a coupling coil portion electromagnetically coupling with the connecting coil of the ic module, a main coil portion formed along a coil wiring path that defines an inductance and connected to the coupling coil portion for performing contactless communication with the external machine, and a resistance-increasing portion provided in a section that forms the coil wiring path of at least one of the coupling coil portion and the main coil portion increase electrical resistance in the section; and a plate-like card body in which the antenna is arranged.. .

04/14/16
20160104064 

Ic module, dual ic card, and manufacturing ic module


An ic module of the present invention includes: a sheet-like base having a first surface and a second surface and having a first through hole and a second through hole spaced apart from the first through hole; an ic chip provided to the first surface, having a contact communication function and a contactless communication function, and having two terminals formed thereon; a connecting coil formed on the first surface and having two ends; a contact terminal portion provided to the second surface and configured to contact an external contact machine; bridge wiring provided to the second surface, provided at a position overlapping with the first and second through holes, and electrically insulated from the contact terminal portion; a first conductive wire inserted through the first through hole and connecting the first terminal of the ic chip to the bridge wiring; a second conductive wire inserted through the second through hole and connecting the bridge wiring to the first end of the connecting coil; and a third conductive wire connecting the second end of the connecting coil to the second terminal of the ic chip.. .

04/14/16
20160104063 

Contact smart card


A contact smart card has a smart card contact pad and an ic chip. The smart card contact pad includes a circuit substrate, a card-reader contact element on a first side of the circuit substrate, and a connection element on a second side of the circuit substrate.

04/14/16
20160103723 

System-on-chip verification


Disclosed herein are method, system and computer program product embodiments for improving the verification process of a system on chip (soc). An embodiment operates by employing an active interconnect (aic) between a processing subsystem (e.g., a central processing unit or cpu) and a plurality of peripherals, wherein the processing subsystem is linked to a plurality of applications via a plurality of drivers, and implementing a common set of software codes by at least one of the applications for a software development process and a hardware verification process.

04/14/16
20160103152 

Testing apparatus


A test apparatus for testing a first flash memory chip is provided. The testing apparatus includes: an interface printed circuit board (pcb), a separate pcb, and a socket device.

04/14/16
20160103023 

Voltage and temperature sensor for a serializer/deserializer communication application


The present invention relates generally to integrated circuits. More particularly, the present invention provides a circuit and method for sensing a voltage and/or temperature from an integrated circuit device such as a serializer/deserializer (serdes) integrated circuit device.

04/14/16
20160102854 

Cooling mechanism for led light using 3-d phase change heat transfer


Novel 3-d super-thermal conducting heat management design and delayed cooling using phase change materials are adopted to lower the temperature inside leds and other devices. The cooling mechanism uses a fin structure with hollow fins to dissipate heat to the environment.

04/07/16
20160099393 

Using mems fabrication incorporating into led device mounting and assembly


Led chip packaging assembly that facilitates an integrated method for mounting led chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. Led chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the led chips, respectively.
Imec Taiwan Co.


04/07/16
20160099387 

Semiconductor light emitting device


A semiconductor light emitting device includes a package body having first and second surfaces being opposed to each other, first and second external terminal blocks disposed in opposite end portions of the package body, respectively, and having portions exposed to surfaces of the package body, respectively. A wavelength converting material layer is disposed between the first and second external terminal blocks and has a first surface substantially coplanar with the first surface of the package body, and a second surface opposing the first surface of the wavelength converting material layer.
Samsung Electronics Co., Ltd.


04/07/16
20160099219 

Semiconductor device having features to prevent reverse engineering


It is desirable to design and manufacture electronic chips that are resistant to modern reverse engineering techniques. Disclosed is a method and device that allows for the design of chips that are difficult to reverse engineer using modern teardown techniques.
Secure Silicon Layer, Inc.


04/07/16
20160099211 

System on chip


Systems on chips are provided. A system on chip (soc) includes a first gate line, a second gate line and a third gate line extending in a first direction, a gate isolation region cutting the first gate line, the second gate line and the third gate line and extending in a second direction across the first direction, a first gate contact formed on the second gate line arranged between the first gate line and the third gate line, and electrically connecting the cut second gate line, a second gate contact formed on the first gate line, a third gate contact formed on the third gate line, a first metal line electrically connecting the second gate contact and the third gate contact, and a second metal line electrically connected to the first gate contact..

04/07/16
20160099077 

Test system simultaneously testing semiconductor devices


Individual memory chips are simultaneously tested by a tester using selectively enabled stress modules that apply a corresponding stress test to memory cells, wherein each stress test is associated with a corresponding failure attribute for the memory cells. Built-in self-test (bist)/built-in self-stress (biss) circuitry is provided in each stress module and may configured to selectively apply one or more stress test(s) during the simultaneous testing of a plurality of memory chips..





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