|| List of recent Chip-related patents
| Application-specific led module and associated led point source luminaires|
Led downlight and other point source luminaires contain one or more application-specific led modules with integrated optical, mechanical, and heat dissipation systems; a fluted extruded metal housing acts as a heat sink as well as the luminaire housing containing the as-led module(s) or receiving a rotatable spherical housing that contains the as-led module, printed circuit board units, and wires; mounting brackets; and a remote led driver. The extruded aluminum housing (and heat sink) may be comprised of a single cylinder or multiple concentric cylinders.
| Light emitting device and display device|
There are provided a light-emitting device for use in a backlight unit of a display apparatus equipped with a display panel, which can be made lower in profile and is capable of applying light to the display panel with uniformity in the brightness of the display panel in the planar direction of the display panel, as well as a display apparatus equipped with the light-emitting device. A backlight unit includes a printed substrate, a plurality of light-emitting sections each having a base support, an led chip and a lens, and a reflective member surrounding the light-emitting section.
| Mtj three-axis magnetic field sensor and encapsulation method thereof|
The present invention discloses a mtj triaxial magnetic field sensor, comprising an x-axis bridge sensor that has a sensing direction along an x-axis, a y-axis bridge sensor that has a sensing direction along a y-axis, a z-axis sensor that has a sensing direction along a z-axis, and an asic chip connected with and matched to the x-axis, y-axis, and z-axis sensor chips. The z-axis sensor includes a substrate and mtj magnetoresistive elements deposited on the substrate.
| Light-emitting apparatus and method for manufacturing same|
A light-emitting apparatus including: a substrate; an led chip mounted on a first surface of the substrate; a fluorescent material-containing layer containing a first fluorescent material, which fluorescent material-containing layer is provided above the first surface of the substrate so as to cover the led chip; and a color-adjusting fluorescent layer that contains a second fluorescent material, which color-adjusting fluorescent material layer is formed in a layer provided on an outer side of the fluorescent material-containing layer in an emission direction, the color-adjusting fluorescent layer being formed in dots. Thus, the present invention provides a light-emitting apparatus and a method for manufacturing the same, each making it possible to carry out fine color adjustment so as to prevent a subtle color shift that occurs due to a factor such as a difference in concentration of a fluorescent material or the like..
| Solar powered ic chip|
A self-powered circuit package includes a substrate and an integrated circuit (ic). The ic is mounted on a surface of the substrate.
| Rfid tag|
Provided is an rfid tag, wherein a communication distance of several centimeter or more can be secured and the cost of which can be reduced in comparison to conventional on-chip antennas, even when being compact in size (square shaped with a side of 1.9 to 13 mm). The rfid tag (80) comprises an antenna (20), an ic chip (30) connected to the antenna (20), and a sealing material (10) that seals the ic chip (30) and the antenna (20).
| Composite ic card|
Provided is a composite ic card including: a card base having a recess; an antenna sheet arranged inside the card base; an ic module arranged in the recess of the card base. The ic module includes an ic chip having a module substrate provided with an external terminal, and a first coupling coil.
| Magneto cyclist power sensor|
This device is a sensor whose output can be used for providing the cyclist with a display of the power he/she is delivering to the wheels of the bicycle while he/she is riding. It can also be used to determine bike gear selection and bike ground speed.
|System on chip with embedded security module|
An embedded security module includes a security processor, volatile and non-volatile memory, and an interface. The security processor includes transistors formed in one or more semiconductor layers of a semiconductor die, and implements one or more security-related functions on data and/or code accessed by the security processor.
It is an object of the invention to improve the production efficiency in sealing a thin film integrated circuit and to prevent the damage and break. Further, it is another object of the invention to prevent a thin film integrated circuit from being damaged in shipment and to make it easier to handle the thin film integrated circuit.
|Method for manufacturing light emitting diode package having a voltage stabilizing module consisting of two doping layers|
A method for manufacturing an led (light emitting diode) package comprises following steps: providing an electrically insulated base, the base having a first surface and a second surface opposite thereto; an annular voltage stabilizing module is formed on the first surface; a first electrode is formed on the first surface, wherein the first electrode is attached to and encircled by the voltage stabilizing module; a second electrode is formed on the first surface, wherein the second electrode is attached to and encircles the voltage stabilizing module; an led chip is mounted on the first electrode, wherein the led chip is electrically connected to the first and second electrodes, and the led chip and the voltage stabilizing module are connected in reverse parallel. Finally, an encapsulative layer is brought to encapsulate the led chip..
|Biochip substrate and method for producing same|
A substrate for biochips, which does not induce autofluorescence, which can immobilize a biologically relevant substance(s) easily, which can prevent the undesirable spread of a liquid spot which is added dropwise on the biochips when using the biochips, in which the adhesion between a carbon-containing layer and an aluminum material is high, and which can be produced at lower cost than the known substrate for biochips; a method for producing the substrate; and a biochip including the substrate are disclosed. The substrate for biochips comprises a carbon-coated aluminum material, wherein the carbon-coated aluminum material comprises an aluminum material and a carbon-containing layer formed on at least one surface of the aluminum material, and further comprises an interposing layer which is formed between the aluminum material and the carbon-containing layer, and which interposing layer contains aluminum element and carbon element..
|Processors including key management circuits and methods of operating key management circuits|
A system on chip includes a central processing unit and a key manager coupled to the central processing unit. The key manager includes a random number generator configured to generate a key and a key memory configured to store the key and a user setting value associated with the key..
|Heat sink module and omnidirectional led lamp holder assembly using same|
An omnidirectional led lamp holder assembly includes a heat sink module including a heat sink base and radiation fins around the heat sink base, a lampshade and an electrical connector respectively mounted at opposing top and bottom sides of the heat sink module. The heat sink base is a one-piece extruded member defining a tubular heat-transfer base portion, a broad platform and a hollow protruding mount for holding led chips at different angles.
|System on chip for updating partial frame of image and method of operating the same|
A system on chip (soc) and a method of operating the same are provided. The soc includes a central processing unit (cpu) controlling a memory operation and a display operation on a current frame of an image based on generation of the image and an interrupt signal; an image generator requesting data of the current frame from a memory according to control of the cpu; a ud unit determining whether the current frame is updated, detecting whether an update region is a partial frame based on virtual addresses included in a request of the image generator, and outputting the interrupt signal corresponding to the update region to the cpu; a memory controller storing the update region in the memory according to the control of the cpu; and a display controller accessing the memory and outputting the update region to a display device according to the control of the cpu..
|Surface mount device-type low-profile oscillator|
A surface mount device-type low-profile oscillator is provided. A main surface of an ic chip unit is joined to a bottom surface where the external terminals of a crystal unit section are formed.
|Wafer leveled chip packaging structure and method thereof|
A wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias.. .
A package-on-package device includes memory chips side-by-side on a package substrate. Accordingly, it is possible to reduce a thickness of a semiconductor package.
|Led package and metallic frame thereof|
A light emitting diode package includes a metallic frame, and an led chip disposed on the metallic frame. The metallic frame includes first and second metal plates arranged side by side with a space therebetween, and two support arms extending integrally and respectively from two opposite ends of the second metal plate to a level higher than the second top surface and that further extend toward the first metal plate at a level higher than the first top surface crossing the space.
|Submount-free light emitting diode (led) components and methods of fabricating same|
Light emitting devices include a light emitting diode (led) chip having an anode contact and a cathode contact on a face thereof. A solder mask extends from the gap between the contacts onto one or both of the contacts.
|Light emitting devices and methods|
Light emitting devices and methods such as light emitting diodes (leds) are disclosed for use in higher voltage applications. Variable arrangements of leds are disclosed herein.
|Light emitter devices and methods for light emitting diode (led) chips|
Light emitter devices for light emitting diodes (led chips) and related methods are disclosed. In one embodiment a light emitter device includes a substrate and a chip on board (cob) array of led chips disposed over the substrate.
|Removal of electronic chips and other components from printed wire boards using liquid heat media|
Systems and methods for the removal of electronic chips and other components from pwbs using liquid heat media are generally described. The systems and methods described herein can be used to remove solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components from pwbs.
|Welding method for substrate and membrane of membrane mobile polymer microfluidic chip|
The present invention discloses a welding method for substrate and membrane of membrane mobile polymer microfluidic chip, which relates to the manufacturing technology of membrane mobile polymer microfluidic chip and comprises the following steps: before the welding, the substrate is fixed, the surface of the substrate is covered with the membrane; the membrane is pressed against the surface of the substrate, and in the course of welding, the laser irradiates the welding area on the substrate through the membrane, and the welding area fuses and then welds the substrate and membrane together. The present invention realizes the firm welding between membrane and substrate of membrane mobile polymer microfluidic chip, and ensures that the weld face is flat and uniform..
|Data processing device with serial bus that needs initialization before use|
A data processing device 1 comprises: first processors (2-i (i=1, 2, . .
Embodiments of the invention relate to a function-level simulator for modeling a neurosynaptic chip. One embodiment comprises simulating a neural network using an object-oriented framework including a plurality of object-oriented classes.
|Gan type light emitting diode device and method of manufacturing the same|
The present invention relates to a gan type led device and a method of manufacturing the same. More particularly, there are provided a gan type led device including an led chip; and a submount eutectic-bonded with the led chip through an adhesive layer, wherein the adhesive layer is configured by soldering a plurality of metallic layers in which a first metallic layer and a second metallic layer are sequentially stacked, and the second metallic layer is formed in a paste form.
|Resin application apparatus, optical property correction apparatus and method, and method for manufacturing led package|
A resin application apparatus includes: an optical property measurement unit measuring an optical property of light emitted from a light emitting diode (led) chip which is mounted on a package body and to which transparent resin is not applied; and a resin application unit applying light conversion material-containing transparent resin to the led chip in accordance with a resin application amount which is decided depending on the optical property measured by the optical measurement unit.. .
|Managing packet flow in a switch faric|
In a method for managing packet flow in a switch fabric comprising a plurality of fabric chips, wherein a packet comprises a counter, a determination as to whether the packet has been detoured around an unavailable fabric link and a determination as to whether the packet is making forward progress are made. In addition, a value of the counter in the packet is modified in response to a determination that the packet has been detoured around an unavailable fabric link and a determination that forward progress is not being made..
|Creating multiple noc layers for isolation or avoiding noc traffic congestion|
Systems and methods described herein are directed to solutions for network on chip (noc) interconnects that automatically and dynamically determines the number of layers needed in a noc interconnect system based on the bandwidth requirements of the system traffic flows. The number of layers is dynamically allocated and minimized by performing load balancing of the traffic flows between the channels and routes of different noc layers as they are mapped.
|Implementing a switch fabric responsive to an unavailable path|
In a method for implementing a switch fabric, in a first fabric chip, a packet comprising an identification of a destination node chip is received from a source fabric chip, and a determination that a first path in the switch fabric along which the packet is to be communicated toward the destination node chip is unavailable is made. In addition, a determination as to whether another path along which the packet is to be communicated toward the destination node chip that does not include the source fabric chip is available is made.
|Nonvolatile logic array with built-in test drivers|
A system on chip (soc) provides a nonvolatile memory array that is configured as n rows by m columns of bit cells. Each of the bit cells is configured to store a bit of data.
|Nonvolatile logic array with built-in test result signal|
A system on chip (soc) provides a nonvolatile memory array that is configured as n rows by m columns of bit cells. Each of the bit cells is configured to store a bit of data.
|Two capacitor self-referencing nonvolatile bitcell|
A system on chip (soc) provides a memory array of self referencing nonvolatile bitcells. Each bit cell includes two ferroelectric capacitors connected in series between a first plate line and a second plate line, such that a node q is formed between the two ferroelectric capacitors.
|Four capacitor nonvolatile bit cell|
A system on chip (soc) provides a memory array of nonvolatile bitcells. Each bit cell includes two ferroelectric capacitors connected in series between a first plate line and a second plate line, such that a node q is formed between the two ferroelectric capacitors.
|Light-emitting device and method for compensating chromaticity of light-emitting device|
An object of the present invention is to provide a light-emitting device having a temperature compensation function implemented with simple circuitry, and a method of temperature compensation in such a light-emitting device. More specifically, the invention provides a light-emitting device and a method of temperature compensation using a light-emitting device, wherein the light-emitting device includes a substrate, a first led chip which is arranged on the substrate, and which has a characteristic such that Δx and Δy, each representing an amount of displacement on an xy chromaticity diagram, both are negative as temperature rises, and a second led chip which is arranged on the substrate, and which has a characteristic such that Δx and Δy, each representing an amount of displacement on an xy chromaticity diagram, both are positive as temperature rises..
|Wireless apparatus and method for manufacturing same|
A wireless apparatus has a board, a power amplifier high-frequency ic chip, and a process variations detector. The process variations detector monitors a circuit characteristic variation amount due to process variations.
|Hand-held wireless platform and optics for measurement of dna, rna, micrornas, and other markers of pathogens, genetic diseases, and cancer|
The present invention provides compositions for making and methods of using a hand-held nucleic acid amplification device, comprising a disposable biochip with a series of sample wells, each sample well having a novel optical arrangement that includes a light-emitting diode (led) and a single light capturing element (e.g. A photodiode) for quickly measuring light emissions from biological samples such as nucleic acid amplification reactions.
|Vertically stacked image sensor|
A vertically stacked image sensor having a photodiode chip and a transistor array chip. The photodiode chip includes at least one photodiode and a transfer gate extends vertically from a top surface of the photodiode chip.
|Signal level conversion in nonvolatile bitcell array|
A system on chip (soc) includes one or more core logic blocks that are configured to operate on a lower supply voltage and a memory array configured to operate on a higher supply voltage. Each bitcell in the memory has two ferroelectric capacitors connected in series between a first plate line and a second plate line to form a node q.
|Error detection in nonvolatile logic arrays using parity|
A system on chip (soc) has a nonvolatile memory array of n rows by m columns coupled to one or more of the core logic blocks. M is constrained to be an odd number.
|Led illuminator apparatus, using multiple luminescent materials dispensed onto an array of leds, for improved color rendering, color mixing, and color temperature control|
An led array includes three or more strings of bare leds mounted in close proximity to each other on a substrate. The strings of leds emit light of one or more wavelengths of blue, indigo and/or violet light, with peak wavelengths that are less than 490 nm.
|Redundant light supply for silicon photonic chip|
A system includes an external light supply to a silicon photonic chip. The light supply includes a primary light source, a secondary light source, an optical coupler, an optical splitter, and a dark sensor.
|Phosphor-containing sheet, led light emitting device using the same, and method for manufacturing led|
A phosphor-containing sheet having a storage modulus of 0.1 mpa or more at 25° c. And a storage modulus of less than 0.1 mpa at 100° c., wherein a resin main component of the phosphor-containing sheet is a crosslinked product formed by subjecting a crosslinkable silicone composition containing a specific composition to a hydrosilylation reaction.
|Led lighting assembly and an led retrofit lamp having the led lighting assembly|
An led lighting assembly may include a printed circuit board with an led chip, and a heat sink thermally conducted with the printed circuit board, wherein the led lighting assembly further comprises a light guide body configured as a bulb, the light guide body having an end surface as a light incidence surface of light from the led chip, an outer surface as a light emergent surface and an inner surface, wherein the inner surface is structured so as to form a reflecting surface, reflecting at least part of light from the end surface to the outer surface.. .
A led module includes a substrate, a led chip supported on the substrate, a metal wiring installed on the substrate, the metal wiring including a mounting portion on which the led chip is mounted, an encapsulating resin configured to cover the led chip and the metal wiring, and a clad member configured to cover the metal wiring to expose the mounting portion, the encapsulating resin arranged to cover the clad member.. .
|Light emitting diode package and method for manufacturing the same|
An led package includes a lens, an led chip securely received and engaged in the lens, and a base with an electrode assembly thereon. A bottom surface of the led chip is bare.
|White led apparatus|
Provided is a white led device. The white led device includes a blue led chip configured to emit blue light of a wavelength range of about 440 nm to 490 nm, a yellow phosphor formed on the blue led chip and excited by the blue light to emit yellow light of a wavelength range of about 560 nm to 615 nm, a green led chip configured to emit green light of a wavelength range of about 500 nm to 560 nm, and a red phosphor formed on the green led chip and excited by the green light to emit red light of a wavelength range of about 615 nm to about 670 nm..
|Package-free and circuit board-free led device and method for fabricating the same|
The present invention discloses a package-free and circuit board-free led device and a method for fabricating the same. The led device is exempted from the semiconductor package substrate and the printed circuit board and comprises at least one led chip having two electrodes able to directly connect with external wires and at least one chip unit.
|White light emitting diodes package containing plural blue light-emitting diodes|
A white light-emitting diode (led) package containing plural blue led chips is disclosed. The white led package includes a transparent plate, plural blue led chips bonded on a front surface of the transparent plate, a front fluorescent glue layer covering the plural blue led chips, and a rear transparent glue layer covering a rear surface of the transparent plate and located at a position aligned with the front fluorescent glue layer.
|Rfid tag and fuse|
An rfid tag includes an antenna, a first ic chip connected to the antenna, and a first fuse inserted between the antenna and the first ic chip, or inserted in series with the antenna. In the rfid tag, the first fuse becomes electrically conductive at a first temperature or above, and remains in an electrical conductive state after having become electrically conductive..
|Adaptive service controller, system on chip and method of controlling the same|
A system on chip (soc) includes a slave device, a plurality of master devices, an interconnect device and a plurality of service controllers. The master devices generate requests to demand services from the slave device.
|Network interface on a chip with an adaptive system to trigger data forwarding|
A network interface for a network on chip resource having a communication controller including recording means, and designed to transmit data to another network interface when a quantity of data present in the recording means reaches a predetermined threshold, and where the communication controller also includes means to force a transmission of data present in the said recording means when the quantity of this data is below the predetermined threshold.. .
|Characterization of biochips containing self-assembled monolayers|
The present invention relates to a method of characterizing biochips with matrix-assisted laser desorption/ionization and time of flight mass spectrometry (maldi-tof ms).. .
|Nanochannel arrays and their preparation and use for high throughput macromolecular analysis|
Nanochannel arrays that enable high-throughput macromolecular analysis are disclosed. Also disclosed are methods of preparing nanochannel arrays and nanofluidic chips.
|Electromagnetically actuated droplet microfluidic chip and system|
A microfluidic system includes a microfluidic cartridge and an electromagnetic droplet actuator arranged proximate the microfluidic cartridge. The microfluidic cartridge includes a plurality of droplet wells with topological barrier structures between adjacent wells.
|Qos in heterogeneous noc by assigning weights to noc node channels and using weighted arbitration at noc nodes|
Systems and methods described herein are directed to solutions for noc interconnects that provide end-to-end uniform- and weighted-fair allocation of resource bandwidths among various contenders. The example implementations are fully distributed and involve computing weights for various channels in a network on chip (noc) based on the bandwidth requirements of flows at the channels.
|Flash memory module for realizing high reliability|
A flash memory module may include a plurality of flash memory chips. The memory chips may include one or more blocks.
|Dram compression scheme to reduce power consumption in motion compensation and display refresh|
Systems and methods of operating a memory controller may provide for receiving a write request from a motion compensation module, wherein the write request includes video data. A compression of the video data may be conducted to obtain compressed data, wherein the compression of the video data is transparent to the motion compensation module.
|Composite high reflectivity layer|
A high efficiency light emitting diode with a composite high reflectivity layer integral to said led to improve emission efficiency. One embodiment of a light emitting diode (led) chip comprises an led and a composite high reflectivity layer integral to the led to reflect light emitted from the active region.
|Apparatus for producing ic chip package|
An ic chip package production apparatus of this invention comprises a conveyance portion which conveys a film substrate, and an ic chip mounting portion which mounts ic chips on the film substrate. The ic chip mounting portion comprises a mounting roller, on the outer face of which are formed a chip holding groove and a suction-clamping hole, which mounts ic chips on the film substrate by holding ic chips and rotating; an ic chip supply portion, having a supply path which supplies a plurality of ic chips successively; and a linear feeder which, with one supply end of the supply path opposing the chip holding groove and suction-clamping hole, feeds ic chips from the supply end to the chip-holding groove.
|Automating integrated circuit device library generation in model based metrology|
Various embodiments include computer-implemented methods, computer program products and systems for generating an integrated circuit (ic) library for use in a scatterometry analysis. In some cases, approaches include: obtaining chip design data about at least one ic chip; obtaining user input data about the at least one ic chip; and running an ic library defining program using the chip design data in its original format and the user input data in its original format, the running of the ic library defining program including: determining a process variation for the at least one ic chip based upon the chip design data and the user input data; converting the process variation into shape variation data; and providing the shape variation data in a text format to a scatterometry modeling program for use in the scatterometry analysis..
|Functionally integrated device for multiplex genetic identification|
A biochip for multiplex genetic identification is disclosed. An biochip for separating and detecting a plurality of dna fragments includes a set of inputs and chambers for receiving a sample matrix of genetic material and reagents needed to conduct a polymerase chain reaction amplification of the genetic material.
|Managing a switch fabric|
In a method for managing a switch fabric comprising a plurality of fabric chips, each of said plurality of fabric chips comprising a plurality of port interfaces, a first configuration set and a second configuration set, each comprising a plurality of configuration registers for the port interfaces to use in calculating a port resolution for an incoming packet, are generated. In addition, a determination as to which of the first configuration set and the second configuration set the plurality of fabric chips are to use is made an instruction is communicated to each of the fabric chips to use the determined one of the first configuration set and the second configuration set..
|Wavelength conversion chip for a light emitting diode, and method for manufacturing same|
There is provided a method of manufacturing a wavelength converted led chip, including attaching a plurality of led chips to a chip alignment region of an upper surface of a temporary support plate, forming a conductive bump on the electrode of the respective led chips, forming a phosphor-containing resin encapsulation part in the chip alignment region to cover the conductive bump, polishing the phosphor containing resin encapsulation part, forming the wavelength converted led chips by cutting the provided phosphor containing resin encapsulation part between the led chips, the wavelength converted led chip including a wavelength conversion layer obtained from the phosphor containing resin encapsulation part and formed on lateral surfaces and an upper surface of the wavelength converted led chip, and removing the temporary support plate from the wavelength converted led chip.. .
|Package structure and method for manufacturing thereof|
The invention provides an electronic device package and method for manufacturing thereof. The electronic device package includes a substrate, an electronic chip, a bonding pad, a first passivation layer, a conductive layer, a second passivation layer, and a solder ball.
|Shields for magnetic memory chip packages|
Chip packages are described with soft-magnetic shields that are included inside or attached externally to the package containing a mram chip. In one group of embodiments a single shield with vias for bonding wires is affixed to the surface of the mram chip having the contact pads.
|Light emitting device|
The light emitting device (10a) includes an led chip (12) and a ceramic support body (14) where the led chip (12) is placed. The ceramic support body (14) includes a placement surface (14d) where the led chip (12) is placed, internal terminals (22a, 22b) disposed on the placement surface (14d), a back surface (14c) that face the placement surface (14d), a mounting surface (14b) between the placement surface (14d) and the back surface (14c), and external terminals (28a, 28b) disposed on the mounting surface (14b).
|Led device having improved luminous efficacy|
There are provided a light emitting diode (led) device including an led chip emitting light within a specific wavelength region, a transparent resin layer covering a light emission surface of the led chip, and a color conversion layer formed to be spaced apart from the led chip by the transparent resin layer to cover the transparent resin layer and including at least one type of phosphor converting light emitted from the led chip into light within a different wavelength region, wherein a mean free path of phosphor particles included in the color conversion layer is 0.8 mm or more at a temperature of 5500 k.. .
|Light emitting diode device and method for manufacturing heat dissipation substrate|
The light emitting diode (led) device includes a substrate formed with at least one electrode; an led chip disposed on the substrate, and formed with at least one solder pad; at least one wire electrically connected between the solder pad and the electrode; and a fluorescent material layer covering the led chip. Thermal conductivity of the substrate is 80˜120 w/mk and a color rendering index of the led device under correlated color temperatures 2600k˜3700k is greater than 90..
|Light emitting device|
A light emitting device includes: a ceramic substrate; a plurality of led chips; a printed resistor(s) connected in parallel with the plurality of led chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of leds, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency..