|| List of recent Chip-related patents
| Method for booting icon lockout|
The present invention relates to a method for booting icon lockout and comprises steps as follows: (1) configure a display mode of a host computer's graphic chip as “graphic” in order to define memory addresses in the host computer to be a memory pool for icon display; (2) decompress the zip file for a customized booting icon which is saved in the bios chip as one file; (3) load the file to the memory pool and map the file to the graphic chip's memories for displaying the customized booting icon on a monitor; (4) change content of the call function (int10h) in order to smoothly display nothing except the identical customized booting icon on a monitor by int10h in a boot process from power-on self-test to desktop display before os is completely loaded.. .
| Memory system|
According to one embodiment, a memory system according to one embodiment is equipped with several nonvolatile memory chips and a memory controller that controls the nonvolatile memory chips based on a firmware. The firmware is written in a nonvolatile memory chip positioned the farthest distance from the memory controller..
| Microfluidic large scale integration|
High-density microfluidic chips contain plumbing networks with thousands of micromechanical valves and hundreds of individually addressable chambers. These fluidic devices are analogous to electronic integrated circuits fabricated using large scale integration (lsi).
| Microfluidic chip, device and system for the generation of aqueous droplets in emulsion oil for nucleic acid amplification|
A microfluidic chip, device, system, the use thereof and method for the generation of aqueous droplets in emulsion oil for nucleic acid amplification.. .
| Memory device interface methods, apparatus, and systems|
Apparatus and systems for memory system are provided. In an example, an interface chip can include a memory controller configured to couple to a processor and to couple to a plurality of stacked memory arrays using a data bus and a maintenance bus, wherein the data bus is separate from the maintenance bus, the plurality of stacked memory arrays forming two or more memory chips, the memory controller configured to control access to memory locations within the plurality of stacked memory arrays..
| Multiple wavelength led array illuminator for fluorescence microscopy|
One embodiment provides light along an optical axis. It comprises a substrate and at least one array of multiple led chips without individual packaging supported by the substrate.
| Direct backlight module and led encapsulation thereof|
The present invention discloses an led encapsulation for direct backlight module, which includes a base, which is mounted to an led chip set on a backplane of the direct backlight module; and a support section, which extends from a surface of the base for supporting and fixing a diffusion board of the backlight module. The present invention also discloses a direct backlight module.
| Sectional dynamic-driving backlight module and head-up display device thereof|
Led chip, a blue-light led chip, and a white-light led chip, and these led chips may be controlled by a controlling pcb for lighting respectively or simultaneously, so as to achieve a sectional dynamic display.. .
| Semiconductor memory device, memory controller and memory system having on die termination and on die termination controlling method|
A semiconductor memory device includes a first memory chip including a first on die termination (odt) unit electrically connected to a first pad, the first pad being connected to a first terminal to receive a first signal, and a second memory chip including a second odt unit electrically connected to a second pad, the second pad being connected to the first terminal to receive the first signal, the first odt unit being configured to turn on/off according to a memory operation, the second odt unit being configured to turn off regardless of the memory operation, and the first and second odt units are switchable.. .
| Fan speed control circuit|
A fan speed control circuit is provided. The circuit includes a control chip.
| P-n separation metal fill for flip chip leds|
A light emitting diode (led) structure (10) has semiconductor layers, including a p-type layer, an active layer, and an n-type layer. The p-type layer has a bottom surface, and the n-type layer has a top surface through which light is emitted.
| Ultraviolet light emitting diode package|
An ultraviolet light emitting diode package for emitting ultraviolet light is disclosed. The ultraviolet light emitting diode package comprises an led chip emitting light with a peak wavelength of 350 nm or less, and a protective member provided so that surroundings of the led chip is covered to protect the led chip, the protective member having a non-yellowing property to energy from the led chip..
| Led based lighting system|
An led device comprises an led chip or led chip array for emitting light of a color spectrum, the led chip or array being mounted on a component having a component surface. At least one color is applied to the component surface where the color is selected to reflect light to color tune the light emitted from the led device to obtain a desired cri..
| Light-emitting device and method of manufacturing the same|
A light-emitting device may comprise a substrate, an electric wire fixed to the substrate, and a plurality of light-emitting diodes mounted to the electric wire. According to one embodiment, each of the plurality of light-emitting diodes is an led chip, and the light-emitting diodes on the substrate are sealed individually or collectively by one or more sealing members.
| Light emitting diode package and method for manufcturing the same|
An led package includes a substrate, an led chip mounted on the substrate, and a lens formed on the substrate and encapsulating the led chip therein. The lens includes a top surface and a bottom surface connecting a bottom end of the top surface.
| Light emitting device using gan led chip|
A light emitting device is constituted by flip-chip mounting a gan-based led chip. The gan-based led chip includes a light-transmissive substrate and a gan-based semiconductor layer formed on the light-transmissive substrate, wherein the gan-based semiconductor layer has a laminate structure containing an n-type layer, a light emitting layer and a p-type layer in this order from the light-transmissive substrate side, wherein a positive electrode is formed on the p-type layer, the electrode containing a light-transmissive electrode of an oxide semiconductor and a positive contact electrode electrically connected to the light-transmissive electrode, and the area of the positive contact electrode is half or less of the area of the upper surface of the p-type layer..
| Card payment system|
In one example embodiment, a card payment apparatus includes a member having a magnetic strip reader configured to read account information from a magnetic strip of a first payment card and an integrated chip (ic) reader configured to read account information from an ic chip of a second payment card; a sliding face configured to allow the first payment card to slide thereon, when the magnetic strip reader reads the account information from the magnetic strip; and a card receptacle configured to receive the second payment card, when the ic reader reads the account information from the ic chip.. .
| Risk-managed, single-use, pre-calibrated, pre-sterilized sensors for use in bio-processing applications|
Single-use, pre-sterilized, and pre-calibrated, pre-validated sensors are provided. These sensors are designed to store sensor-specific information, such as calibration and production information, in a non-volatile memory chip on the sensor or in a barcode printed on the sensor.
|Method and apparatus for generating emergency alert notifications on mobile devices|
An efficient method and apparatus to receive broadcasted emergency alerts using portable handheld devices or mobile devices that are operable to provide a user with relevant alerts based on the user's relevant position, in a low-powered, always-on manner are presented. Using the always on partitions of both the receiver and the system on chip (soc) of a mobile device, embodiments of the present invention are capable of determining whether or not the remainder of the circuits of a mobile device need to be powered on in order to record audio data associated with an alert, when the alert is received.
|Resistive memory device performing selective refresh and method of refreshing resistive memory device|
A method of operating a resistive memory device, includes; performing a data retention time test on a resistive memory cell array of a memory chip, determining a number of bad memory blocks of the resistive memory cell array on the basis of the data retention time test, determining on the basis of the number of bad memory blocks whether the memory chip is a refresh memory chip or a good memory chip, and upon determining that the memory chip is a refresh memory chip, performing at least one refresh operation on at least one bad memory block of the refresh memory chip.. .
An led housing unit is described wherein the housing unit will have a chambered section connected to a mounting section. The mounting section will be mountable onto a base, such as a pcb mounting in a light fixture.
|Liquid crystal display device|
In a liquid crystal display device having a configuration in which one pixel is divided into a plurality of sub-pixels to improve the view angle characteristic, the number of ic chips for driving a panel is reduced more than that in the conventional technique. A gate driver is provided with a first shift register (20a) corresponding to first gate bus lines (glai) (i=1 to n), a second shift register (20b) corresponding to second gate bus lines (glbi), and and operation circuits (andi) each outputting a signal indicating and between an output signal (qai) from the first shift register (20a) and an output signal (qbi) from the second shift register (20b).
|Three-dimensional multichip module|
A three-dimensional multichip module includes a first integrated circuit chip having at least one first high-temperature functional area and one first low-temperature functional area, and at least one second integrated circuit chip having a second high-temperature functional area and a second low-temperature functional area. The second high-temperature functional area is arranged opposite the first low-temperature functional area.
|Structures and methods for making nand flash memory|
A nand flash memory chip includes wide openings in an inter-poly dielectric layer through which gaps are later etched to define structures such as select gates. Such select gates are asymmetric, with inter-poly dielectric on a side adjacent to a memory cell and no inter-poly dielectric on a side away from a memory cell.
|Light-emitting diode devices|
An led device includes an led chip having a sapphire substrate, a first-type semiconductor layer on the substrate, a second-type semiconductor layer disposed on the first-type semiconductor layer, a first via hole passing through the sapphire substrate and the first-type semiconductor layer, a second via hole passing through the sapphire substrate, and an insulation layer coated on an inner wall of the first via hole; a transparent conductive layer made of electrically conductive material and formed on the second-type semiconductor layer; a cover layer formed on the transparent conductive layer; electrical conductors, each disposed within one of the via holes, wherein the electrical conductor in the first via hole is electrically connected to the second-type semiconductor layer and the electrical conductor in the second via hole is electrically connected to the first-type semiconductor layer; and two linkers for connection to external circuitry, formed on a surface of the sapphire.. .
|Memory system and bus switch|
A memory system includes a nonvolatile memory having a plurality of nonvolatile memory chips incorporated therein, a control circuit that controls the nonvolatile memory, an mpu that controls the control circuit, and an interface circuit that communicates with a host, all of which are mounted on a board of the memory system, and the memory system further includes a bus switch that switches connection of a signal line between the control circuit and the nonvolatile memory chips.. .
|Payment module, payment method, program, and information recording medium|
Provided is a payment module capable of allowing a total amount of money dispersedly recharged for a plurality of kinds of prepaid values to be used for a payment regardless of which of the prepaid values is used for the payment. An ic chip (22) stores a plurality of kinds of electronic values, and subtracts an amount of money that is equal to or more than a difference between a balance of an electronic value of the plurality of kinds of electronic values that is used for a payment and a payment amount as a total from balances of electronic values of the plurality of kinds of electronic values that are not used for the payment.
|Payment module, payment method, program and information recording medium|
Provided is a payment module capable of making a payment with a total amount of money recharged for one or more electronic values. An ic chip (22) stores balances of the one or more electronic values and a utility electronic value exchangeable from each of the one or more electronic values.
|Electronic device with two circuit boards dedicated for ic chip and connector|
An exemplary electronic device with integrated circuit chips being on one circuit board and required connector circuits being on another, connectable, circuit board provides modularization and interchangeability for ease of adaptation in manufacture of electronic products utilizing the electronic device. In particular, the ic chips are mounted on a first circuit board, and the connector circuits are mounted on a second circuit board.
|Multichip electronic packages and methods of manufacture|
A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier.
|Method of manufacturing encapsulation structure for encapsulating led chip|
A method of manufacturing an encapsulation structure for encapsulating an led chip includes the following steps: providing a first encapsulation defining a receiving room for receiving the led chip therein and a second encapsulation defining a receiving space for receiving the first encapsulation therein; providing a mounting tablet defining an entrance therein, mounting the first encapsulation and the second encapsulation on the mounting tablet with a clearance defined therebetween communicating with the entrance; injecting a liquid transparent resin with phosphorous compounds disturbed therein into the clearance via the entrance; and solidifying the liquid transparent resin to form a transparent resin layer interconnecting the first encapsulation and the second encapsulation.. .
|Multilayer hydrodynamic sheath flow structure|
A microfabricated sheath flow structure for producing a sheath flow includes a primary sheath flow channel for conveying a sheath fluid, a sample inlet for injecting a sample into the sheath fluid in the primary sheath flow channel, a primary focusing region for focusing the sample within the sheath fluid and a secondary focusing region for providing additional focusing of the sample within the sheath fluid. The secondary focusing region may be formed by a flow channel intersecting the primary sheath flow channel to inject additional sheath fluid into the primary sheath flow channel from a selected direction.
|Light beam adjusting structure for light emitting diode (led) lamp|
A light beam adjusting structure for a light emitting diode (led) lamp includes a rotary sleeve and a lens fixing base which are mounted in a containing trough of a housing of the led lamp. The rotary sleeve has at least one longitudinal slot and an annular boss.
|Led lighting device with improved light distribution|
A lighting device and a lighting unit comprising a reflector (52) and a lighting device, or led lamp (10) are described. The led lamp have a first and a second led assembly (30, 32).
|Fire pump system and system controller|
A fire suppression and control system includes a unique fire pump controller which uses advanced technologies in a manner consistent with the need for high reliability in the fire protection industry. A preferred controller includes three pic chips including a control pic for controlling operation of the water pump, a power monitor pic for receiving all voltage and current inputs to the controller, and a data recorder pic for collection and storage of data relevant to the system.
|Data storage device|
A data storage device may include a first memory board having multiple memory chips and a controller board that is arranged and configured to operably connect to the first memory board. The controller board may include an interface to a host and a controller that is arranged and configured to control command processing for multiple different types of memory chips, automatically recognize a type of the memory chips on the first memory board, receive commands from the host using the interface, and execute the commands using the memory chips..
|Payment module, payment method, program, information-recording medium, payment device, and method for controlling payment device|
Provided is a payment module capable of reducing the probability that a balance of each electronic value that is usable for a payment becomes insufficient when the payment is made. An ic chip (22) stores one or more electronic values and a utility electronic value exchangeable from each of the one or more electronic values.
|Opto-electronic system having flip-chip substrate mounting|
An opto-electronic system includes a system substrate, a lens, a bridging device, and an opto-electronic chip mounted in a cavity in the system substrate. The bridging device, which can be another chip, a lens block, or an interposer, is mounted in flip-chip orientation to the opto-electronic chip and provides electrical interconnection with signal conductors of the system substrate..
In a semiconductor device of a stacked structure type having a control chip and a plurality of controlled chips, wherein the control chip allocates different i/o sets to the respective controlled chips and processes the i/o sets within the same access cycle, the controlled chip close to the control chip and positioned to a lower position in the stacked structure has i/o penetrating through substrate vias connected to penetrating through interconnections. The penetrating through interconnections are extended to an upper one of the controlled chips that not use the penetrating through interconnections and, as a result, all of the penetrating through interconnections have the same lengths as each other..
A semiconductor apparatus includes a memory chip which includes: a memory area; a data input/output block configured to communicate with the memory area; and a data transmission/reception block configured to connect one of a plurality of channels and a pad to the data input/output block, wherein the plurality of channels are configured to input and output normal data to and from another chip, and the pad is configured to input and output test data.. .
|Omnidirectional led light bulb|
An omnidirectional led light bulb comprising a lamp base (1), a heat sink housing (2), a circuit board (5), an led light source (3) and a bulb (4) is provided. The heat sink housing (2) is provided with a protruded platform (6) on which the light source (3) in a column shape of polygonal prism head is arranged.
|System architecture design for time-of-flight system having reduced differential pixel size, and time-of-flight systems so designed|
Embodiments of the present invention provide methods to produce a high performance, feature rich tof system, phase-based or otherwise using small tof pixels, single-ended or preferably differential, as well as tof systems so designed. Ic chip area required for pixels is reduced by intelligently off-loading or removing from within the pixel certain components and/or functionality.
|Fine pitch package-on-package structure|
A package-on-package (pop) device including a substrate having an array of contact pads arranged around a periphery of the substrate, a logic chip mounted to the substrate inward of the array of contact pads, and non-solder bump structures mounted on less than an entirety of the contact pads available.. .
|Lead frame package and method for manufacturing the same|
In one embodiment, a lead frame package structure includes a lead frame having sides that surround a die paddle and on which a plurality of leads are formed. An electronic chip is attached to the die paddle and a case is attached to the lead frame to seal the leads and the electronic chip.
|Solid-state imaging apparatus and camera using the same|
A solid-state imaging device and one or more bare ics disposed on a back face of a solid-state imaging apparatus. The bare ics are sealed by a resin.
|Wireless ic device|
A wireless ic device includes a wireless ic chip arranged to process a radio signal, a power-supply circuit board that is connected to the wireless ic chip and that includes a power supply circuit including at least one coil pattern, and a radiation plate arranged to radiate a transmission signal supplied from the power-supply circuit board and/or receiving a reception signal to supply the reception signal to the power-supply circuit board. The radiation plate includes an opening provided in a portion thereof and a slit connected to the opening.
|Information processing system|
An information processing system, an information processing method for use with the system, an information providing system, and information providing method for use with the system, an information processing apparatus, an information processing method for use with the apparatus, a doll, an object, a program storage medium, and a program for authenticating users reliably are provided. A user acquires beforehand a doll called pochara the good friend incorporating an ic chip that stores a user id for authenticating the user.
|Nanometer-size-particle production apparatus, nanometer-size-particle production process, nanometer-size particles, zinc/zinc oxide nanometer-size particles, and magnesium hydroxide nanometer-size particles|
The present invention is a nanometer-size-particle production apparatus for synthesizing nanometer-size particles in a liquid by means of plasma in liquid, and comprises: a container for accommodating the liquid therein; an electromagnetic-wave generation device for generating a high-frequency wave, or a microwave; an electrode conductor whose leading end makes contact with the liquid to supply the high-frequency wave or the microwave to the liquid; a covering portion being disposed into the liquid so as to cover a leading-end upside of the electrode conductor; a metallic chip being composed of a metal making a raw material of nanometer-size particles, and having a leading end that is disposed to face to a leading-end section of the electrode conductor; and a feed device for feeding out the leading end of the metallic chip with respect to the leading-end section of the electrode conductor; the leading end of the electrode conductor having a configuration that is a non-edge configuration; and the electrode conductor, except for the leading end, having an axially-orthogonal cross-sectional area that is larger than an axially-orthogonal cross-sectional area of the metallic chip.. .
|A simple and affordable method for immunophenotyping using a microfluidic chip sample preparation with image cytometry|
The enumeration of cells in fluids by flow cytometry is widely used across many disciplines such as assessment of leukocyte subsets in different bodily fluids or of bacterial contamination in environmental samples, food products and bodily fluids. For many applications the cost, size and complexity of the instruments prevents wider use, for example, cd4 analysis in hiv monitoring in resource-poor countries.
|Electrical pump apparatus|
An electrical pump apparatus is provided in which a situation where a failure detection circuit becomes inoperative before detection of a failure of an electric system can be avoided, and the certainty of failure detection can be enhanced. An attaching portion which is to be attached to a vehicle body is formed so that, in a state where an electrical pump apparatus is attached to the vehicle body, a circuit board of a control device is perpendicular to the horizontal direction.
|High contrast water-proof led lamp|
The present invention discloses a high contrast water-proof led lamp, including: a casing provided with a reflective cup (10), a pcb (12) disposed on the bottom surface of the casing, an led chip (1) disposed inside the reflective cup (10), and a light-guiding packaging adhesive (4). The casing is composed of a light color layer (8) in the lower part and a dark color layer (9) in the upper part, and a top surface of the pcb (12) and an outer surface of the light color layer (8) of the casing are provided with black water-proof adhesive sealant (11).
|Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same|
A semiconductor image sensor module 1 at least includes a semiconductor image sensor chip 2 having a transistor forming region on a first main surface of a semiconductor substrate and having a photoelectric conversion region with a light incident surface formed on a second main surface on the side opposite to the first main surface and an image signal processing chip 3 for processing image signals formed in the semiconductor image sensor chip 2, wherein a plurality of bump electrodes 15a are formed on a first main surface, a plurality of bump electrodes 15b are formed on the image signal processing chip 3, both the chips 2 and 3 are formed to be laminated through heat dissipating means 4 and the plurality of bump electrodes 15a of the semiconductor image sensor chip 2 and the plurality of bump electrodes 15b on the image signal processing chip 3 are electrically connected.. .
|Composite high reflectivity layer|
A high efficiency light emitting diode with a composite high reflectivity layer integral to said led to improve emission efficiency. One embodiment of a light emitting diode (led) chip comprises an led and a composite high reflectivity layer integral to the led to reflect light emitted from the active region.
|Led lighting assembly integrated with dielectric liquid lens|
An led lighting assembly integrated with dielectric liquid lens, including: a heat dissipation substrate; an led chip, located on the heat dissipation substrate; a transparent material, covering the heat dissipation substrate and the led chip and having a curved surface; a transparent liquid, located above the transparent material; a transparent layer, located above the transparent liquid; a first dielectric liquid, located above the transparent layer; a second dielectric liquid, located above the first dielectric liquid and having a curved surface, wherein the second dielectric liquid has a second dielectric constant smaller than a first dielectric constant of the first dielectric liquid; a transparent electrode layer, located above the second dielectric liquid for applying a control voltage to generate a dielectric force on the second dielectric liquid; and an enclosing body.. .
|Light-emitting diode structure and method for manufacturing the same|
A light-emitting diode (led) structure and a method for manufacturing the same. The led structure includes an insulation substrate, a plurality of led chips and a plurality of interconnection layers.
|Semiconductor memory structure and its manufacturing method thereof|
The present invention belongs to the technical field of microelectronic devices, specifically relates to a semiconductor memory structure and its manufacturing method thereof. The semiconductor memory structure which carries out erasing, writing and reading operation on the phase change memory or the resistance change memory through a tunneling field-effect transistor is formed, for one hand, the high current passed through the tunneling field-effect transistor when the p-n junction the biased positively, meeting the high current requirements for erasing of and writing of the phase change memory and the resistance change memory, and on the other hand, vertical structure of the field-effect transistor can greatly improve the density of memory devices arrays.
|Ceramic water control valve with ceramic chips having pressing leak-proof functions|
A ceramic water control valve with ceramic chips having pressing leak-proof functions is provided with a pressing ceramic chip and a pressing seal ring. The sliding ceramic chip is in a directional positioning state and can be pressed to be abutted with the fixed ceramic chip more tightly and durably, so as to enhance the leak-proof effect on top of the shell.
|Chip set-up and high-accuracy nucleic acid sequencing|
The present disclosure provides devices, systems and methods for sequencing nucleic acid molecules. Nucleic acid molecules can be sequenced with a high accuracy (e.g., greater than 97% in a single pass) using a chip comprising an array of independently addressable nanopore sensors at a density of at least about 500 sites per 1 mm2.
|System on chip and temperature control method thereof|
A temperature control method of a semiconductor device is provided. The temperature control method includes detecting a temperature of the semiconductor device; activating a reverse body biasing operation in which a body bias voltage applied to a function block of the semiconductor device is regulated, when the detected temperature is greater than a first temperature level; and activating a thermal throttling operation in which at least one of a frequency of a driving clock provided to a function block of the semiconductor device and a driving voltage applied to the function block of the semiconductor device is regulated, when the detected temperature is greater than a second temperature level that is different than the first temperature level..
|Serum-based mirna microarray and its use in diagnosis and treatment of barrett's esophagus (be) and esophageal adenocarcinoma (eac)|
Robust and reliable molecular diagnostic screening tools for early detection of esophageal and gastrointestinal tract cancers and pre-cancerous lesions, such as barrett's esophagus, and esophageal adenocarcinoma are provided. Included in the invention is an array of mirna probes specific for identifying, diagnosing and prognosticating esophageal and gastrointestinal tract cancers and pre-cancerous lesions in subjects from blood or serum samples.
|Electro-optical assembly for silicon photonic chip and electro-optical carrier|
An electro-optical device and method of assembly is disclosed. A first unit of the electro-optical device is positioned with respect to a second unit of the electro-optical device to pre-align an optical communication pathway between the first unit and the second unit.
|System on chip and electronic system including the same|
A system on chip (soc) includes a first display subsystem configured to perform first and second imaging functions and a second display subsystem configured to only perform the first imaging function. The soc is configured to activate one of the display subsystems and deactivate the other display subsystem based on a comparison of a current frame of image data and a previous frame of image data..
|Monolithic integrated circuit chip integrating multiple devices|
A monolithic integrated circuit (ic) chip containing a plurality of transistors, including: a substrate; a first transistor on the substrate; and a second transistor integrally formed on the substrate with the first transistor, the second transistor having a different structure than the first transistor, wherein the first transistor includes a first material system and the second transistor includes a second material system different from the first material system. The monolithic ic chip may further include a third transistor integrally formed on the substrate with the first and second transistors.
|Semiconductor package including an integrated waveguide|
Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate.
|Multichip electronic packages and methods of manufacture|
A multi-chip electronic package and methods of manufacture are provided. The method includes adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier.
|Microelectronic device with integrated energy source|
An apparatus including an electronic device having a plurality of substantially collocated components, the plurality of components including an integrated circuit (ic) chip, an energy supply operable to electrically power the ic chip, and an energy harvesting (eh) device operable to convert non-electrical energy to electrical energy supplied to the energy supply. A material substantially encloses at least a portion of at least one of the ic chip, the energy supply, and the eh device..