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Chip-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).

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Display device and shooting display method therefor
Guang Dong Oppo Mobile Telecommunications Corp., Ltd
May 18, 2017 - N°20170142342

The present disclosure relates to a display device and a method for shooting and displaying an image. The display device includes a displayer and a camera installed in the displayer and configured to shoot images of an external object directly facing the displayer. The camera includes a plurality of lens components installed at intervals on a surface of the displayer, ...
Built-in self test for loopback on communication system on chip
Inphi Corporation
May 18, 2017 - N°20170141843

In an example, the present invention includes an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing ...
Silicon photonic chip with integrated electro-optical component and lens element
International Business Machines Corporation
May 18, 2017 - N°20170141533

Embodiments include a silicon photonic chip having a substrate, an optical waveguide on a surface of the substrate and a cavity. The cavity includes an electro-optical component, configured for emitting light perpendicular to said surface and a lens element arranged on top of the electro-optical component. The lens is configured for collimating light emitted by the electro-optical component. The chip ...
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Epitaxial buffer layers for group iii-n transistors on silicon substrates
Intel Corporation
May 18, 2017 - N°20170141219

Embodiments include epitaxial semiconductor stacks for reduced defect densities in iii-n device layers grown over non-iii-n substrates, such as silicon substrates. In embodiments, a metamorphic buffer includes an alxin1-xn layer lattice matched to an overlying gan device layers to reduce thermal mismatch induced defects. Such crystalline epitaxial semiconductor stacks may be device layers for hemt or led fabrication, for ...
Semiconductor package
Samsung Electronics Co., Ltd.
May 18, 2017 - N°20170141092

A semiconductor package includes a logic chip mounted on a substrate, a first memory chip disposed on the logic chip, which includes a first active surface, and a second memory chip disposed on the first memory chip. The second memory chip is disposed on the first memory chip in such a way that the first memory chip and second memory ...
System on chip (soc) based on neural processor or microprocessor
Samsung Electronics Co., Ltd.
May 18, 2017 - N°20170140821

System on chips (socs) based a microprocessor or a neural processor (e. G., brain-inspired processor) electrically coupled with electronic memory devices and/or optically coupled with an optical memory device, along with embodiment(s) of building block (an element) of the microprocessor/neural processor, electronic memory device and optical memory device are disclosed. It should be noted that a microprocessor ...
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Photonic chip with an evanescent coupling interface
Cisco Technology, Inc.
May 18, 2017 - N°20170139142

Embodiments herein describe a photonic chip which includes a coupling interface for evanescently coupling the chip to a waveguide on an external substrate. In one embodiment, the photonic chip includes a tapered waveguide that aligns with a tapered waveguide on the external substrate. The respective tapers of the two waveguides are inverted such that as the width of the waveguide ...
Silicon photonic chip with through vias
Cisco Technology ,inc.
May 18, 2017 - N°20170139132

The embodiments herein describe a photonic chip (formed from a soi structure) which includes an optical interface for coupling the optical components in the photonic chip to an external optical device. In one embodiment, the optical interface is formed on a separate substrate which is later joined to the photonic chip. Through oxide vias (tovs) and through silicon vias (tsvs) ...
Backlight unit and display device
Wuhan China Star Optoelectronics Technology Co., Ltd.
May 18, 2017 - N°20170139103

A backlight unit includes a light guide plate (lgp), led chips, and an optical film. The lgp has an lgp body and a groove disposed on a light incident side of the lgp body. The led chips are electrically connected to and packaged in the groove. The present invention also proposes a display device having the backlight unit. The lgp ...
System on chip and secure debugging method
Samsung Electronics Co., Ltd.
May 18, 2017 - N°20170139008

A system on chip (soc) is provided. The system on chip includes a multiprocessor that includes multiple processors, a debugging controller that includes a debug port and retention logic configured to store an authentication result of a secure joint test action group system, and a power management unit configured to manage power supplied to the multiprocessor and the debugging controller. ...
Interface board, a multichip package (mcp) test system including the interface board, and an mcp ...
Samsung Electronics Co., Ltd.
May 18, 2017 - N°20170139004

In an interface board for testing a multichip package, the multichip package includes a first type semiconductor chip and a second type semiconductor chip, the interface board includes a first surface facing the multichip package and a second surface facing a test apparatus, the first surface includes upper terminals that are electrically connected to terminals of the multichip package, the ...
Monitoring the structural health of columns
The Aluminium Lighting Company Ltd
May 18, 2017 - N°20170138978

A method and apparatus for monitoring the structural health of a stock of columns such as lighting columns and/or columns within that stock each of which is connected to receive power from an external source or otherwise. The method comprises the steps of locating on an upper surface of each or a plurality of columns within the stock to ...
Method of transferring beads
Spinchip Diagnostics As
May 18, 2017 - N°20170138939

The present invention provides a method of transferring beads in a fluidic chip comprising an internal fluid circuit through which various reactants, in which at least one of the reactants are beads, may be moved by use of centrifugal force, the method comprises the steps of: providing beads (8) having a density equal to, or lower than, m1 in a section (7, 15) ...
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Microfluidic devices with integrated resistive heater electrodes including systems and methods for controlling and measuring ...
Canon U.s. Life Sciences, Inc.
May 18, 2017 - N°20170136466

The invention relates to methods and devices for control of an integrated thin-film device with a plurality of microfluidic channels. In one embodiment, a microfluidic device is provided that includes a microfluidic chip having a plurality of microfluidic channels and a plurality of multiplexed heater electrodes, wherein the heater electrodes are part of a multiplex circuit including a common lead ...
Delta-sigma adc with wait-for-sync feature
Texas Instruments Incorporated
May 11, 2017 - N°20170134039

An integrated circuit (ic) chip containing a delta-sigma (ΔΣ) filter module for a ΔΣ analog-to-digital converter and a method of providing analog to digital conversion are disclosed. The ic chip includes a ΔΣ filter that is connected to receive a digital data stream created by a ΔΣ modulator, provide a multibit data ...
Semiconductor device and manufacturing method thereof
Semiconductor Energy Laboratory Co., Ltd.
May 11, 2017 - N°20170133409

As a display device has higher definition, the number of pixels is increased and thus, the number of gate lines and signal lines is increased. When the number of gate lines and signal lines is increased, it is difficult to mount ic chips including driver circuits for driving the gate lines and the signal lines by bonding or the like, ...
System on chip
Samsung Electronics Co., Ltd.
May 11, 2017 - N°20170133367

Systems on chips are provided. A system on chip (soc) includes a first gate line, a second gate line and a third gate line extending in a first direction, a gate isolation region cutting the first gate line, the second gate line and the third gate line and extending in a second direction across the first direction, a first gate ...
Preventive measures for adaptive flash tuning
Samsung Electronics Co., Ltd.
May 11, 2017 - N°20170133107

The present invention includes embodiments of systems and methods for increasing the operational efficiency and extending the estimated operational lifetime of a flash memory storage device (and its component flash memory chips, luns and blocks of flash memory) by monitoring the health of the device and its components and, in response, adaptively tuning the operating parameters of flash memory chips ...
Length-adjustable storage device
Kabushiki Kaisha Toshiba
May 11, 2017 - N°20170131748

A storage device includes a base board and a memory chip package. The base board includes, on a first edge, a connector that is connectable to a host device and through which the storage device communicates with the host device, on a second edge that is opposite to the first edge, a first engaging portion by which the base board ...
Circuit board, display panel, and display device
Sharp Kabushiki Kaisha
May 11, 2017 - N°20170131586

An array circuit board 11b includes a glass substrate, an ic chip 20, two acfs 30, and a resin film 32. The ic chip 20 is disposed on the glass substrate. The acfs 30 are disposed between the glass substrate and the ic chip 20 for electrically connecting the glass substrate and the ic chip 20 together. The acfs 30 are separated from each other. The resin film 32 ...
Led filament
Zhejiang Super Lighting Electric Appliance Co., Ltd
May 11, 2017 - N°20170130906

An led filament configured to emit omnidirectional light includes a linear array of led chips operably interconnected to emit light upon energization and a conductive electrode. The linear array of led chips is electrically connected with the conductive electrode. A light conversion coating encloses the linear array of the led chip and the conductive electrode. The light conversion layer includes ...