|| List of recent Chip-related patents
|Marine medaka genes responding to the exposure of endocrine-disrupting chemicals, and method for diagnosing an aquatic eco-system contamination using same|
The present invention relates to marine medaka genes responding to the exposure of endocrine-disrupting chemicals, and a method for diagnosing an aquatic eco-system contamination using the marine medaka genes. Specifically, the method for diagnosing an aquatic eco-system contamination, according to the present invention, makes use of marine medaka genes of which the expression amount changes according to 17β-estradiol, or marine medaka genes of which the expression amount changes according to bisphenol a.
|Microfluidic chips for acquiring sperms with high motility, productions and applications thereof|
This invention relates to microfluidic chips for and their applications in acquiring sperms with high velocity and/or motility. The microfluidic chip comprises an inlet region, a first flow channel, a divergent channel, an optional block structure with rounded corners and one or more outlet region(s).
|System on chip including dual power rail and voltage supply method thereof|
A system on chip includes an sram. The sram includes at least one memory cell and a peripheral circuit accessing the at least memory cell.
|Content addressable memory chip|
A content addressable memory chip which can perform a high speed search with less error is provided. A match amplifier zone determines coincidence or non-coincidence of search data with data stored in the content addressable memory cells in an entry of a cam cell array, according to the voltage of a match line.
|Method for assembling a microelectronic chip device in a fabric, chip device, and fabric incorporating a crimped chip device|
The method for assembling a microelectronic chip device (101) in a fabric (104) comprises the following steps: providing a microelectronic chip device (101) comprising a base (102) and a protruding element (103) rising from a face of the base (102), said protruding element (103) comprising a free end opposite the base (102); inserting into the fabric (104) the chip device (101) by the free end of the protruding element; deforming the protruding element (105) at its free end so as to ensure the securing of the chip device (101) with the fabric (104) by forming a crimping bead (106).. .
|Led illuminating device|
An led illuminating device includes a printed circuit board, at least one led chip group arranged on the printed circuit board, and a lens assembly, wherein the led illuminating device further includes a reflector provided between the led chip group and the lens assembly, wherein the reflector is configured to diffusely reflect light from the led chip group so that the light is uniformized and emerges in a direction of the lens assembly.. .
|The strip led|
A strip led comprises an led chip, an embedded resistor, a magnet, a magnetic material, a strip encapsulation bracket and a power source. An installation bracket for the embedded resistor and the led chip is provided between connection brackets.
|Multiplex fluorescent particle detection using spatially distributed excitation|
A chip-scale optical approach to performing multi-target detection is based on molecular biosensing using fiber-optic based fluorescence or light scattering detection in liquid-core waveguides. Multiplexing methods are capable of registering individual nucleic acids and other optically responsive particles, and are ideal for amplification-free detection in combination with the single molecule sensitivity of optofluidic chips.
|Brightness control device and method|
A brightness control device includes a back light panel, a controller, and an image signal processing chip. The back light panel includes a blue light led module and a green light led module.
|Led light strip comprising two or more independent circuits meeting separate power consumption and illumination output requirements|
A vending machine includes a controller coupled to at least one light emitting diode (led) light strip mounted within the vending machine and illuminating an interior thereof. The led light strip includes an input terminal that receives one or more signals corresponding to a mode of the led light strip, an led mounting board supports a plurality of led chips forming a plurality of independent circuits each including a serially-connected subset of the led chips, and electrical circuit components (resistor, input terminal, and/or output terminal) that cause the respective circuit to function independently from remaining circuits in the led light strip.
|Method of manufacturing wiring board unit, method of manufacturing insertion base, wiring board unit, and insertion base|
A method of manufacturing a wiring board unit, the wiring board unit including a semiconductor package that includes a memory chip, a wiring board on which the semiconductor package is mounted, and an insertion base inserted between the wiring board and the semiconductor package, the method includes: forming a plurality of connection portion groups in a base material, the connection portion groups each including a plurality of connection portions that each electrically connect a board-side pad of the wiring board and an external terminal of the semiconductor package to each other; forming the insertion base such that resistances of the connection portions included in the connection portion groups are adjusted in accordance with types of target memory chips; and connecting the external terminals and the board-side pads to one another by using the connection portion group selected in accordance with the type of the memory chip.. .
|Memory cell floating gate replacement|
A nand flash memory chip is formed by depositing two n-type polysilicon layers. The upper n-type polysilicon layer is then replaced with p-type polysilicon and barrier layer in the array area only, while maintaining the upper n-type polysilicon layer in the periphery.
|Led module packaging structure with an ic chip|
An improved led module packaging structure with an ic chip includes a power input end in a packaging groove of a carrier stand connected to a zener diode and a power input port of the ic chip acquiring an operating power from the zener diode, so that the led module applied to a full-color or self-color illuminant of central control utilizes the zener diode connected to the power input end within the packaging groove of the carrier stand to lower or modulate the voltage of an external power. While the ic chip receives a data signal from the data signal input end, the ic chip receives a matched operating voltage via the zener diode to drive the led chip to shine, thereby attaining a long transmission of the central control easily..
|Led display and manufacturing method thereof|
A manufacturing method of a led display is provided. A temporary substrate is provided, wherein the temporary substrate has a first adhesive layer and a plurality of first, second and third led chips mounted on the first adhesive layer.
|Light emitting diode package and method for fabricating the same|
An led package allows a fluorescent material to be uniformly distributed around an led chip on a base when a filling space inside a transparent wall surrounding the led chip is filled with the fluorescent material. The led package includes a base, at least one led chip mounted on the base, a transparent wall formed on the base and having a filling space around the led chip, and a fluorescent material, with which the filling space is filled to cover the led chip..
|Semiconductor memory device|
According to one embodiment, a semiconductor memory device includes semiconductor memory chips in which data requested to be written. The data has one or more pieces of first data in a predetermined unit.
|Semiconductor memory device|
According to one embodiment, a semiconductor memory device includes semiconductor memory chips in which data requested to be written. The data has one or more pieces of first data in a predetermined unit.
|Method for producing particulate clusters|
A method for producing particulate clusters comprises passing a core through an array of matrix-supported coating particles. Particulate clusters produced by the method may find application as catalytic particles, components of novel electronic and photonic materials and sensors, and as binding sites for protein molecules in biochips..
|Light emitting device|
A light emitting device includes a light emitting diode (led) module and a rotatable wavelength converting structure. The led module includes a substrate and a plurality of led chips.
|Dustproof and waterproof multipurpose led-light power source assembly and dustproof and waterproof led light|
A dustproof and waterproof multipurpose led-light power source assembly comprises a heat sink, a heat-dispersal fan, a circuit board driver module, an led light source module, a power-source casing top cover and a power-source casing bottom cover. The led light source module comprises plural led chips and an led heat-dispersing substrate.
|Lighting method and device enabling aquatics to look bright and beautiful|
A lighting device for an aquarium includes a sealed waterproof lamp shell and a light string arranged and connected with led lamps, the light string positioned inside the sealed waterproof lamp shell. Select led chips (4r,4g and 4b) shooting red, green and blue light respectively, which are assembled or directly inject-formed into an integrated led lamp, synthetic light shot from the led lamp is slightly reddish violet, luminous flux Φ for three base colors red, green and blue are respectively Φr from 32% to 41%, Φg from 47% to 54% and Φb from 12% to 14%.
|Led package and method for fabricating the same|
A light emitting diode (led) package according to an exemplary embodiment of the present invention includes a base including a first lead terminal and a second lead terminal, an led chip disposed on the base, a housing disposed on the base, the housing having a cavity in which the led chip is disposed, and an encapsulation member having a side surface contacting the housing. The first lead terminal and the second lead terminal each have a first surface and a second surface opposite the first surface, and have an unbent form, respectively.
|Light source module|
A light source module including a substrate, a plurality of first light emitting diode (led) chips, and at least one second led chip is provided. The substrate has an upper surface.
|Optical semiconductor lighting apparatus|
An optical semiconductor lighting apparatus including: a substrate in which a single led chip or a plurality of led chips are disposed; a first mold portion disposed on the substrate to cover the plurality of led chips; and a second mold portion extending from an edge of the first mold portion and disposed on the substrate. The respective led chips can improve adhesive strength with respect to the substrate through the first and second mold portions.
|Contact smart card|
A contact smart card has a smart card contact pad and an ic chip. The smart card contact pad includes a circuit substrate, a card-reader contact element on a first side of the circuit substrate, and a connection element on a second side of the circuit substrate.
|Automatic passive control of liquid positioning in microfluidic chips|
A device for controlling liquid motion includes a substrate (10) of material having piezoelectric properties, and a system for controlling the motion of a quantity of liquid placed in contact with the substrate. The control system includes at least one interdigitated transducer (t1, t3, t5, t7), applied to the substrate (10) and designed for selectively generating a surface acoustic wave adapted to propagate on the substrate (10) and interact with the quantity of liquid.
The storage system includes a plurality of flash memory devices, each of the flash memory devices including a flash memory controller and flash memory chips, which are configured as a raid group and a storage controller, coupled to the plurality of flash memory devices, configured to receive data from a computer and send the data to a first flash memory device of the plurality of flash memory devices. The flash memory controller of the flash memory device is configured to receive the data from the storage controller and execute a parity operation using the data..
|Fcoc (flip chip on chip) package and manufacturing method thereof|
A manufacturing method for flip chip on chip (fcoc) package based on multi-row quad flat no-lead (qfn) package is provided wherein the lower surface of plate metallic base material are half-etched to form grooves. Insulation filling material is filled in the half-etched grooves.
|Multiple heterogeneous noc layers|
Systems and methods described herein are directed to solutions for network on chip (noc) interconnects that automatically and dynamically determines the topology of different noc layers and maps system traffic flows to various routes in various noc layers that satisfies the latency requirements of the flows. The number of layers and their topology is dynamically allocated and optimized by performing load balancing of the traffic flows between the channels and routes of different noc layers and updating the topology of the noc layers as they are mapped.
|Multi-array led chip for embodying cut-off line and head lamp having the same|
The present invention relates to a multi-array led chip for embodying a cut-off line, and the multi-array led chip includes: a plurality of led modules which emits light; and at least one low beam led module which emits light, in which the led module and the low beam led module are disposed to match a cut-off line, and the led module and the low beam led module are individually turned on and off such that a low beam is emitted. Accordingly, a direct type of light is emitted, and thus a low beam, which complies with regulations regarding the cut-off line, is embodied, and light efficiency does not deteriorate..
|Easily assembled led tube lamp structure|
An led tube lamp structure includes a heat-transferring and light-pervious glass tube; a slightly curved elongated heat-dissipation metal base internally bonded to the glass tube via a thermal adhesive; an led chip circuit board fitted to a front side of the heat-dissipation metal base; and two electrode covers fitted on two open ends of the glass tube and respectively having a fixing dummy pin and a through hole. The heat-dissipation metal base has two end portions inserted into insertion sections in the electrode covers to generate an upward tension for tightly contacting with the glass tube; and the led chip circuit board has two contact pins at two ends for extending through the through holes.
|Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof|
A manufacturing method of a light emitting diode (led) and a manufacturing method of an led module are provided. The manufacturing method of the led may include manufacturing a plurality of led chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of led chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of led chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of led chips are mounted, into units including individual led chips..
|Light emitting diode package|
A light emitting diode (led) package including a substrate unit, a light emitting unit and an encapsulant. The substrate unit includes a metal substrate and a circuit board.
According to one embodiment, a memory chip, which is connected to a controller that controls reading and writing of data in response to a request from an external device, includes: a memory including a special area that is a predetermined data storage area; a key storage unit that stores therein a second key that corresponds to a first key used by the external device to convert the data; a converting unit that receives, from the controller, data to be written into the special area and generates converted data by converting the data to be written using the second key; and a writing unit that writes the converted data into the special area.. .
|Electronic circuit for and method of executing an application program stored in a one-time-programmable (otp) memory in a system on chip (soc)|
A method and apparatus for executing an application program stored in an one-time-programmable, otp, memory in a system on chip (soc) is described. The soc has ram, a cpu and an otp controller.
|Nucleic acid ligand diagnostic biochip|
A nucleic acid ligand “biochip” is disclosed, consisting of a solid support to which one or more specific nucleic acid ligands is attached in a spatially defined manner. Each nucleic acid ligand binds specifically and avidly to a particular target molecule contained within a test mixture, such as a bodily fluid.
|Method of manufacturing light-emitting device|
A method of manufacturing a light-emitting device includes providing a case including an annular sidewall and an led chip including a chip substrate and a crystal layer and mounted in a region surrounded by the sidewall of the case, and dripping a droplet of an electrically-charged phosphor-containing resin so as to fill a space between the sidewall and the led chip. The droplet is attracted toward the sidewall by an electrostatic force during the dripping..
|Fetal red blood cell detection|
A device for analyzing a maternal blood sample for quantification of the percentage of fetal red blood cells present with respect to the number of maternal red blood cells includes reagents for mixing with the biological sample, a microfluidic chip, 5 fluid reservoirs, a pumping system, an image acquisition system, an image analysis system, and an electronic control board. The microfluidic channel can confine the objects of interest to a monolayer, and may trap them in an organized array for analysis.
|Cartridge interface module|
A cartridge interface module (cim), configured to engage with a removable microfluidic cartridge in a nucleic acid analyzer system can include a fluidics component, which is configured to initiate and support a liquid extraction of nucleic acids from a biological sample contained in the removable microfluidic cartridge. The cim also includes a polymerase chain reaction (pcr) assembly component which can be configured to initiate and support amplification of the extracted nucleic acids.
A biochip includes a flat carrier and an array of spots containing catcher molecules which are arranged on the carrier. Each spot is associated with a microelectrode arrangement for impedance spectroscopic detection of binding events occurring between the catcher molecules and the target molecules applied via an analyte solution.
|Image forming apparatus|
The image forming apparatus (1) includes a toner cartridge (71) between a front frame (78) or an front inside cover (79) and a front housing, and a cartridge attaching section (65) includes a shutter stopping section (65i) for opening a shutter (71c) by attachment of the toner cartridge (71) to the toner cartridge attaching section (65), and an ic chip fitting section (65c) to which an ic chip (75) is attached.. .
|Image blurring avoiding method and image processing chip thereof|
An image blurring avoiding method for a camera includes obtaining a motion data of the camera; and capturing a picture only when the camera is substantially motionless according to the motion data.. .
|Memory with refresh logic to accomodate low-retention storage rows|
An apparatus is disclosed that includes a memory controller chip and memory chips packaged with the memory controller chip. Each memory chip includes normal-retention storage rows that exhibit retention times greater or equal to a first time interval, and having been tested to generate information identifying low-retention storage rows that exhibit retention times less than the first time interval.
|Ink cartridge and method of producing the same|
An ink cartridge includes a cartridge body defining an ink chamber, an ink supply portion provided at the cartridge body, an air flow path provided in the cartridge body, a cover, and a memory chip disposed on the cover. The cartridge body has an outer surface oriented in a first direction and an air communication port opened on the outer surface.
|Silicon chip of a monolithic construction for use in implementing multiple graphic cores in a graphics processing and display subsystem|
A graphics processing chip includes multiple graphics pipeline cores and multi-pipeline core logic circuitry to process graphic data streams received from a processor and to drive multiple gpus on the multiple graphics pipeline cores.. .
|Method of driving led chips of different specifications|
A method of driving led chips, wherein the led chips have different specifications, includes the steps of: a. Defining a plurality of setting currents; b.
|Driving apparatus for led chips of different specifications|
A driving apparatus for led chips includes: a driving unit, a voltage measuring unit, and a feedback control module. The driving unit provides a driving voltage and a driving current to a led chip; the voltage measuring unit measures the driving voltage; the feedback control module is built-in with a default power; according to the driving voltage measured by the voltage measuring unit and the default power, the feedback control module controls the driving unit to maintain the driving current at a working current, wherein the working current matches the rated current of the led chip.
|Light emitting diode device and method for manufacturing same|
An led device includes a substrate having a top surface and a bottom surface. The substrate defines a through hole at a center thereof.
|Light emitting diode device|
A light emitting diode (led) device includes: a substrate having a central portion; an led chip unit formed on the central portion of the substrate; a circuit pattern having a positive electrode and a negative electrode that are formed on the substrate, each of the positive electrode and the negative electrode including an arc portion and at least one extending portion that extends from the arc portion toward the central portion; a wire unit connecting the led chip unit to the extending portions; a glass layer disposed on the substrate, covering the arc portions and including an opening unit that is aligned with the central portion of the substrate; a dam structure formed on the glass layer and extending along the arc portions; and an encapsulated body disposed substantially within the dam structure to cover the extending portions, the wire unit and the led chip unit.. .
|Phosphor film, method of manufacturing the same, coating method of phosphor layer, method of manufacturing led package and led package manufactured thereby|
There are provided a phosphor film, a method of manufacturing the same, and a method of coating an led chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer..
|Rfid tag, rfid system, and package including rfid tag|
Disclosed is an rfid tag to be attached to a metal member including a slit, the rfid tag including conductive members attached to a surface of the metal member at corresponding sides of the slit in a width direction of the slit through an isolator; and an ic chip that receives power through the conductive members. When a frequency of radio waves is f, the power induced between the sides the slit is wa, voltage induced between the sides of the slit is v, an area of each of the conductive members is s, thickness of the isolator is d, a dielectric constant of the isolator is ∈r, a dielectric constant of vacuum is ∈0, and a minimum value of the power required for the ic chip to operate is wmin, an inequality wmin≦wa−4πf·s·∈0·∈r·v2/d is satisfied..
|Method of manufacturing a data carrier provided with a microcircuit|
The present invention consists to a method of manufacturing a data carrier (1), comprising a data carrier body (3) and a module (5) fixed above a cavity in said data carrier body (3), said method comprising the following steps:—a first step (101) of providing a module (5),—a second step (102) of applying a preformed first layer (31) on the dielectric substrate (53) of said module (5), said first layer (31) having a hole (33) to receive the electronic chip (55), its wires (57) and the dielectric resin protection (59),—a third step (103) of applying a second layer (35) on the first layer (31), recovering the hole (33) of the first layer (35),—a fourth step (104) of laminating of the module (5), the first and second layers (31, 35),—a fifth step (105) of cutting or pre-cutting at the data carrier format.. .
|Integrated circuit (ic) chip and method of verifying data thereof|
Provided are an ic chip and a method of verifying data thereof. The present invention verifies integrity of data by comparing an integrity verifying value generated from data using an integrity verifying value generating algorithm before a write operation for storing data in a storing unit is performed and an integrity verifying value generated from data stored in the storing unit using the integrity verifying value generating algorithm after the write operation is completed.
|Memory system and constructing method of virtual block|
According to one embodiment, a virtual block is constructed according to configuration conditions that, when a plurality of physical blocks included in the virtual block are selected, the sum of the number of physical block pairs and the number of single blocks allocated from the same memory chip to one virtual block is less than or equal to a first value.. .
|Semiconductor chip and semiconductor device|
When a memory chip is mounted over a logic chip, a recognition range including a recognition mark formed at a back surface of the logic chip is imaged and a shape of the recognition range is recognized, alignment of a plurality of bumps of the logic chip and a plurality of projection electrodes of the above-described memory chip is performed based on a result of the recognition, and the above-described memory chip is mounted over the logic chip. At this time, the shape of the recognition range is different from any portion of an array shape of the bumps, as a result, the recognition mark in the shape of the recognition range can be reliably recognized, and alignment of the bumps of the logic chip and the projection electrodes of the above-described memory chip is performed with high accuracy..
|System and memory module|
A system includes: a controller, a first memory module connected to the controller through a first data bus, and a second memory module connected to the controller through a second data bus, wherein the first memory module includes: first and second memory chips; a first data terminal connected to the first data bus, and a first switch unit that electrical connects the first data terminal with either the first memory chip and the second memory chip, and the second module includes: third and fourth memory chips; a second data terminal connected to the second data bus, and a second switch unit that switches over electrical connection of the second data terminal with either the third memory chip or the fourth memory chip.. .
|Dual-use light fixture having ac and dc leds|
A dual-use light fixture having ac and dc leds includes a heat-dissipating housing, a printed circuit board located on a first end of the heat-dissipating housing, ac and dc led chips located on the printed circuit board, and a power supply pedestal coupled to a second end of the heat-dissipating housing. The power supply pedestal includes an ac plug, a dc driving unit, and a thread connector.
|Low-height multilayer ceramic capacitor|
A low-height multilayer ceramic capacitor offering excellent flexure strength meets the condition “t11c<t12b,” where t11c represents the thickness of each protective dielectric layer provided on respective top and bottom sides of a dielectric chip, and t12b represents the thickness of a wraparound part of each external electrode provided at least part of both top and bottom faces of the dielectric chip.. .
|Light-emitting diode module and method for operating a light-emitting diode module|
In at least one embodiment of the led module (10), said led module comprises a first led chip (1) that is based on the alingan material system and designed to emit a first radiation type in the blue spectral range. Furthermore, the led module (10) comprises at least one second led chip (2) that is based on the ingaalp material system and designed to emit a second radiation type in the red spectral range.