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Chip patents

      

This page is updated frequently with new Chip-related patent applications.




Date/App# patent app List of recent Chip-related patents
08/18/16
20160242236 
 Radio-frequency integrated circuit (rfic) chip(s) for providing distributed antenna system functionalities, and related components, systems, and methods patent thumbnailRadio-frequency integrated circuit (rfic) chip(s) for providing distributed antenna system functionalities, and related components, systems, and methods
Radio-frequency (rf) integrated circuit (rfic) chip(s) allow for the integration of multiple electronic circuits on a chip to provide distributed antenna system functionalities. Rfic chips are employed in central unit and remote unit components, reducing component cost and size, increasing performance and reliability, while reducing power consumption.
Corning Optical Communications Wireless Ltd


08/18/16
20160240746 
 Semiconductor light-emitting device patent thumbnailSemiconductor light-emitting device
A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor led chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor led chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.. .
Samsung Electronics Co., Ltd.


08/18/16
20160240512 
 Multichip stacking package structure and  manufacturing the same patent thumbnailMultichip stacking package structure and manufacturing the same
The present invention relates to a multichip stacking package structure and a method for manufacturing the same, wherein the multichip stacking package structure comprises a substrate including a plurality of electrical connecting pad; a first chip with a lower surface stacked on the substrate; a second chip stacked on an upper surface of the first chip by a interlaced reciprocation stacking way; a spacer stacked on an upper surface of the second chip by the interlaced reciprocation stacking way; and third chip stacked on the an upper surface of the spacer by the interlaced reciprocation stacking way, so that a first spacing is formed between an end of the third and an end of the spacer. Thereby, a position of a stress point is changed to reduce a risk of the chip crack during wire bonding..
Dawning Leading Technology Inc.


08/18/16
20160240313 
 Cog dielectric composition for use with nickel electrodes patent thumbnailCog dielectric composition for use with nickel electrodes
Multilayer ceramic chip capacitors which satisfy cog requirements and which are compatible with reducing atmosphere sintering conditions so that non-noble metals such as nickel and nickel alloys may be used for internal and external electrodes are disclosed. The capacitors exhibit desirable dielectric properties (high capacitance, low dissipation factor, high insulation resistance), excellent performance on highly accelerated life testing, and very good resistance to dielectric breakdown.
Ferro Corporation


08/18/16
20160239691 
 Tone-based wake up circuit for card reader patent thumbnailTone-based wake up circuit for card reader
A card reader for a point-of-sale system that is configured to accept both magnetic strip-type and integrated circuit (ic) chip-type payment cards. The card reader is a component of a point-of-sale system including a portable computing device in communication with the card reader that is configured to present a first graphical user interface (gui) when a magnetic stripe-type card is detected and a second gui when an ic chip-type card is detected in the card reader.
Square, Inc.


08/18/16
20160239442 
 Scheduling volatile memory maintenance events in a multi-processor system patent thumbnailScheduling volatile memory maintenance events in a multi-processor system
Systems, methods, and computer programs are disclosed for scheduling volatile memory maintenance events. One embodiment is a method comprising: a memory controller determining a time-of-service (tos) window for executing a maintenance event for a volatile memory device coupled to the memory controller via a memory data interface; the memory controller providing a signal to each of a plurality of processors on a system on chip (soc) for scheduling the maintenance event; each of the plurality of processors independently generating in response to the signal a corresponding schedule notification for the maintenance event; and the memory controller determining when to execute the maintenance event in response to receiving one or more of the schedule notifications generated by the plurality of processors and based on a processor priority scheme..
Qualcomm Incorporated


08/18/16
20160239208 
 Extended capacity memory module with dynamic data buffers patent thumbnailExtended capacity memory module with dynamic data buffers
A memory module uses dynamic data buffers for providing extended capacity for computing systems. The memory module comprises an external interface having a first set of data pins and a second set of data pins.
Rambus Inc.


08/18/16
20160238199 
 Light bulb with led symbols patent thumbnailLight bulb with led symbols
A light bulb with led symbols includes a light bulb shell, at least one led light source, a driver, and an electrical connector. The led light source includes electrodes and at least one led substrate with led chips mounted thereon.
Gean Technology Co. Limited


08/18/16
20160235912 
 Miniaturized electrothermal flow induced infusion pump patent thumbnailMiniaturized electrothermal flow induced infusion pump
A micropump that pumps liquid using electrothermally-induced flow is described, along with a corresponding self-regulating pump and infusion pump. The micropump has applications in microfluidic systems, such as biochips.
Cfd Research Corporation


08/11/16
20160233927 
 Unidirectional induction type near field communication device patent thumbnailUnidirectional induction type near field communication device
A unidirectional induction type near field communication device includes an induction layer having an ic chip embedded therein and an induction coil located on a front surface thereof, a wave-absorbing layer of laminated structure made of a mixture of polyester and a high-permeability metal material and bonded to a back surface of the induction layer opposite to the induction coil, and a metal barrier layer bonded to one side of the wave-absorbing layer opposite to the induction layer for enabling the induction layer to achieve a unidirectional nfc based wireless communication with an external mobile electronic device.. .
Winso Technology Company Limited


08/11/16
20160233204 

Method of manufacturing semiconductor device


To improve the reliability in applying a tape to the rear surface of a substrate while securing the heat resistance of the tape applied to the rear surface of the substrate. There is a gap between a bottom surface of a ditch provided in a support member and an upper surface of a driver ic chip.
Renesas Electronics Corporation


08/11/16
20160233201 

Composite protection circuit, composite protection element, and led device for illumination


A zener diode used as an esd protection element is connected in parallel to a circuit to be protected, for example an led chip. The zener diode is connected in parallel to an antifuse element.
Murata Manufacturing Co., Ltd.


08/11/16
20160231223 

Fluidic chip for flow cytometry and methods of use


The present disclosure in some embodiments provides a flow cell sorting system, a focus detection method, as well as a fluidic chip. In one aspect, the fluidic chip comprises a cover sheet and one or more substrate layers, and one or more channels in each of the fluidic chips.
Tsinghua University


08/11/16
20160231179 

Infrared detecting device


An infrared detecting device includes: an infrared sensor that has one or more infrared detection elements arranged in one or more columns; and an ic chip that performs signal processing on a signal output from the infrared sensor. The infrared sensor and the ic chip are generally juxtaposed in a direction along a scan rotation axis of the infrared sensor..
Panasonic Intellectual Property Management Co., Ltd.


08/11/16
20160231101 

Swept-source optical coherence tomography (ss-oct) system with silicon photonic signal processing element having matched path lengths


Aspects of the present disclosure are directed to architectures, methods and systems and structures having application to an interferometric optical system such as a swept-source optical coherence tomography (ss-oct) system including an optical processing element having dual-polarization and dual-balanced in-phase and quadrature processing and photodetection paths on a single integrated photonic chip wherein lengths of the paths are less than or equal to the spatial resolution of a laser source.. .

08/11/16
20160230026 

Metal powder paste and producing same


A method for producing a surface-treated metal powder, which comprises: a step for preparing a metal powder dispersion liquid by mixing a metal powder with an aqueous solution of a coupling agent having an amino group; a step for recovering, as a residue, the metal powder from the metal powder dispersion liquid; and a step for cleaning the metal powder, which has been re-covered as a residue, with use of an aqueous solvent. This method for producing a surface-treated metal powder provides a method for producing a surface-treated copper powder or metal powder which has excellent sintering delaying properties and is suitable for use in the production of an electrode for multilayer ceramic chip capacitors..
Jx Nippon Mining & Metals Corporation


08/11/16
20160227869 

Revolutionz the ultimate shoe


A workout system is provided. The workout system includes a pair of shoes and a handheld device.

08/04/16
20160227301 

Transponder aggregator photonic chip with common design for both directions


An optical transponder aggregator includes a plurality of photonic switch cells configured to collectively implement switching functions for either an add transponder aggregator or a drop transponder aggregator, a plurality of tap-monitors for control of the photonic switch cells; and a controller configured to change control roles of the tap-monitors, depending on whether the plurality of photonic switch cells collectively implements switching functions for the add transponder aggregator or for the drop transponder aggregator.. .

08/04/16
20160226581 

Bi-directional tap-monitor for optical add-drop photonic chip


A bidirectional optical tap-monitor is described for detecting an optical signal power carried by a through waveguide. The tap-monitor comprises a tap waveguide placed near the through waveguide, and a single waveguide-type photodetector for detecting a fraction of the optical signal power coupled from the tap waveguide.

08/04/16
20160225959 

Led packaging structure and manufacturing the same


An led package having a substrate, an led chip, a phosphor sheet and a first resin is provided. The led chip is disposed on the substrate.
Everlight Electronics Co., Ltd.


08/04/16
20160225740 

Method for manufacturing semiconductor display panel


A manufacturing method includes: attaching a film onto a bonding surface of a wafer; performing laser cutting on the wafer to obtain a plurality of semiconductor light-emitting eutectic chips; attaching light-emitting surfaces of the plurality of eutectic chips on to an expansion film; detaching films from bonding surfaces of the plurality of eutectic chips; performing wafer expansion on the expansion film so that the plurality of eutectic chips have the same intervals as chip loading spaces on a substrate; attaching the expansion film onto a tray, and moving the tray so that positions of the plurality of eutectic chips correspond to that of the chip loading spaces; moving the tray so that the plurality of eutectic chips approach the chip loading spaces on the substrate; and embedding the plurality of eutectic chips into the chip loading spaces so that the plurality of eutectic chips are electrically connected to the substrate.. .

08/04/16
20160225737 

Sintering materials and attachment methods using same


Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process.
Alpha Metals, Inc.


08/04/16
20160225687 

Packaged electronic device having reduced parasitic effects and method


In one embodiment, an electronic package includes a substrate having a die pad plurality of lands embedded within substrate encapsulant. An electronic chip including an electronic component is connected to the die pad.
Amkor Technology, Inc.


08/04/16
20160225414 

Memory module with packages of stacked memory chips


An apparatus is provided that includes a plurality of array dies and at least two die interconnects. The first die interconnect is in electrical communication with a data port of a first array die and a data port of a second array die and not in electrical communication with data ports of a third array die.
Netlist, Inc.


08/04/16
20160224700 

Method for determining the sizing of the transistors of an analog circuit


A method for determining electrical parameter values of the transistors of an analog circuit of a system on chip includes breaking the circuit down into a set of blocks connected to one another; establishing the wiring diagram of said circuit; defining a set of electrical constraints that are specific to said circuit, blocks and transistors of each block; defining electrical parameters of the circuit, block and transistors; selecting for each transistor of the circuit an operator for calculating the electrical parameter values of said transistor; generating structured diagrams of each block of the circuit from the defined constraints and the chosen operators; assembling said structured diagrams of blocks into a general diagram of the circuit; identifying whether there is any conflict; and, if so, emitting an alarm signal.. .
Universite Pierre Et Marie Curie (paris 6)


08/04/16
20160224257 

Method for managing storage system using flash memory, and computer


To facilitate the management of a storage system that uses a flash memory as a storage area. A controller of the storage system provided with a flash memory chip manages a surplus capacity value of the flash memory chip, and transmits a value based on the surplus capacity value to a management server, on the basis of at least one of a definition of a parity group, a definition of an internal lu, and a definition of a logical unit.
Hitachi, Ltd.


08/04/16
20160224099 

System on chip power management


An implementation of a system disclosed herein provides an apparatus, comprising a system on chip, wherein the system on chip is configured to receive a sleep command from a host and in response to the sleep command, calculate a primary checksum of a block of data from a low latency memory such as a tightly coupled memory (tcm), copy the primary checksum and the block of data into a volatile storage media, preserve interface variables of the system on chip in the volatile storage media, operate the volatile storage media in a self-refresh mode, and shut down power to other components on the system on chip.. .
Seagate Technology Llc


08/04/16
20160223907 

Negative chemically-amplified photoresist and imaging method thereof


Provided are a novel negative chemically-amplified photoresist and an imaging method thereof. The negative chemically-amplified photoresist comprises phenol resin, a photo-acid generator, a cross-linking agent, an alkaline additive, a sensitizing agent and a photoresist solvent, wherein the phenol resin is a host material of the novel negative chemically-amplified photoresist; the photo-acid generator is capable of generating an acid with a certain strength under illumination; and the cross-linking agent can undergo a condensation reaction with a phenolic hydroxyl group or an ortho-/para-hydroxymethyl functional group.
Kempur Microelectronics, Inc.


08/04/16
20160223703 

Borehole while drilling electromagnetic tomography advanced detection apparatus and method


A borehole while-drilling electromagnetic tomography advanced detection apparatus includes a site host, a drilling rig, a detecting pipe screwed coupling on one end to a drilling stem of the drilling rig, a drilling bit screwed coupling to the other end of the detecting pipe, wherein the detecting pipe is provided with a probe comprising a transmitting coil, a receiving coil, an electromagnetic transmitting module, an electromagnetic receiving module, a scm (single chip microcomputer), a 3d electronic compass, a network interface of the probe and a first memory, in which the memory port of the scm is connected to the first memory, and the network interface of the probe can be data-communicated with the site host.. .
Wuhan Changsheng Mine Security Technology Limited


08/04/16
20160223534 

Device and detecting, while using a microfluidic chip, the resistance of bacteria to an active substance to be analyzed


A device for detecting resistant bacteria includes a microfluidic chip, a detector and an analyzer. The microfluidic chip includes fluidic structures having a fluid inlet and an interaction chamber fluidically connected to the fluid inlet, and a labeled substrate that is immobilized inside the interaction chamber and enters into a verifiable interaction with bacterial factors of bacteria, so that by introducing a culture medium containing an active substance to be analyzed and the bacteria into the interaction chamber and by detecting the result of the verifiable interaction, it can be ascertained whether the bacteria are resistant to the active substance to be analyzed.
Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.


08/04/16
20160223464 

Micro-fluidic chip to perform surface plasmon resonance assays


A micro-fluidic chip comprises a chip base, a hemispherical or curved lens, and a securing portion. The chip base has a flow cell and a micro-fluidic channel defined therein.
Hitech Analytical And Diagnostic Solutions, Llc


08/04/16
20160223301 

Igniter assembly, airbag system, and detection system and detection same


An igniter assembly for which an igniter and a conductive igniter collar are integrated via an insulating layer, wherein the igniter comprises a metal eyelet, a metal cover that retains the eyelet therein, an ignition charge that is disposed in the cover and in a space in contact with an end face of the eyelet, a heating body that is connected to the end face of the eyelet, and a conductive pin that passes through the insulating layer and is electrically connected to the heating body. The other end of the conductive pin is exposed from the insulating layer so that a current supplying circuit is connected.
Daicel Corporation


07/28/16
20160219377 

Mems microphone


The present disclosure discloses a mems microphone including a mems chip, an asic chip and an injection molding package. The mems chip is stacked on and connected to the asic chip by a tsv connector.
Aac Technologies Pte. Ltd.


07/28/16
20160218540 

Master monitoring system for charging of super capacitor


A monitoring system for charging of a super capacitor, comprising three parts, i.e. A power line, monomer super capacitor monitoring subsystems and a master monitoring system, wherein the master monitoring system comprises a charging circuit (2), a power supply unit (7), a master single chip microcomputer (4), a carrier communication module (3), a human-machine interface module (5), a storage unit (6) and an rs-232 module (8); and each of the monomer super capacitor monitoring subsystems comprises a monomer super capacitor (1), a power supply unit (7), a slave single chip microcomputer (11), a carrier communication module (3), a voltage, current and temperature detection unit (9) and a storage unit (6).
China University Of Mining And Technology


07/28/16
20160218262 

Light-emitting device


Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of led chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion.
Panasonic Intellectual Property Management Co., Lt D.


07/28/16
20160218255 

White light emitting device having high color rendering


The present invention relates to a white light emitting device having high color rendering, and the white light emitting device is a white light emitting lamp comprising a blue led chip having an excitation wavelength of 440-460 nm, and a phosphor layer covering a light emitting surface of the blue led chip and excited by the excitation wavelength of the blue led chip so as to emit light, wherein the phosphor layer comprises a first phosphor having an emission peak wavelength of 480-499 nm; a second phosphor having an emission peak wavelength of 500-560 nm; and a third phosphor having an emission peak wavelength of 600-650 nm. According to aspects of the present invention, a white led chip having high color rendering can be provided, and particularly, the white light emitting device having high color rendering for specific colors such as r9 and r12 can be provided..
Glbtech Co., Ltd.


07/28/16
20160218096 

Led chip having esd protection


Disclosed herein is a light emitting diode chip having esd protection. An exemplary embodiment provides a flip-chip type light emitting diode chip, which includes a light emitting diode part aligned on a substrate, and a reverse-parallel diode part disposed on the substrate and connected to the light emitting diode part.
Seoul Viosys Co., Ltd


07/28/16
20160217363 

Microelectronic chip with multiple contacts


Said third antenna (3c) is connected in series with said second antenna (3) between the second contact (p2) and the fourth contact (p4) for transmitting the captured energy to the microelectronic chip (1) and coupled with the first antenna (3a) for transferring to the microelectronic chip (1) through the first antenna (3a) the energy captured by the second antenna (3b).. .

07/28/16
20160217099 

Data storage device and integrated bridge firmware to be retrieved from a storage system on chip (soc)


A data storage device may comprise a first non-volatile memory, configured to store storage system-on-chip (soc) data and protocol bridge data; a storage soc comprising circuitry configured to control the data storage device and to, upon power-on, retrieve the storage soc data from the first non-volatile memory and configure itself according to the retrieved storage soc data; a bus coupled to the storage soc; and a protocol bridge coupled to the bus and comprising circuitry configured to translate between a first and a second communication protocol and to, upon power-on, retrieve the protocol bridge data from the first non-volatile memory via the storage soc and the bus and configure itself according to the retrieved protocol bridge data.. .
Western Digital Technologies, Inc.


07/28/16
20160216752 

System on chip, managing power thereof, and electronic device


A system on chip includes an event manager configured to receive an event from an external source, an event analyzer configured to analyze the event received by the event manager to determine a voltage, a frequency, and power gating corresponding to the analyzed event, a power manager configured to set power on or off and to set a voltage, a clock manager configured to set a clock frequency, a power gating (pg) manager configured to set power gating, a main controller configured to include at least one modules and a central processing unit (cpu), and a wakeup controller configured to control the power manager, the clock manager, and the pg manager, to transmit power having a starting voltage and a clock signal having a starting clock frequency, and to transmit a power gating signal to apply power only to one of the at least one modules operating so as to start the main controller.. .
Samsung Electronics Co., Ltd.


07/28/16
20160216749 

Solid state memory thermal regulation


A chassis for a storage system contains a digital chamber that houses conventional electronic components and a thermal chamber that houses non-volatile solid state memory such as flash memory. A temperature regulating system monitors temperature within the digital chamber to keep the components therein below their maximum junction temperature.
Skyera, Inc.


07/28/16
20160216450 

Systems and methods for coupling electromagnetic radiation from fiber arrays into waveguides and photonic chips


Systems and methods for coupling electromagnetic radiation from fiber arrays into waveguides and photonic chips are disclosed. In one aspect of the disclosed subject matter, systems for coupling electromagnetic radiation from an optical fiber into a waveguide are provided.
The Trustees Of Columbia University In The City Of New York


07/28/16
20160216254 

Biochip substrate


A substrate for biochips, in which contamination of a biologically relevant substance(s) to be immobilized does not occur even when reaction spots on the substrate for biochips are highly densified; and a biochip comprising the same are provided. The substrate for biochips comprises a substrate and a plurality of reaction spots disposed on the substrate.
Nippon Light Metal Company, Ltd.


07/28/16
20160215940 

Light source assembly, backlight module and display device


The disclosure discloses a light source assembly, a backlight module and a display device and relates to the field of display technologies, and the light source assembly includes a printed circuit board, an led chip, and a glass tube in which a quantum dot material is filled, wherein a concave groove, on the bottom of which the led chip is arranged, is arranged on the surface of the printed circuit board, a part or all of the glass tube is accommodated in the concave groove, and the glass tube is fixed in the concave groove.. .
Hisense Electric Co., Ltd.


07/28/16
20160214908 

High temperature withstand silver plated surface structure for heat dissipation ceramic substrate


Disclosed is a high temperature withstand silver plated surface structure for heat dissipation ceramic substrate used to provide a surface for mounting a led die unit on the surface of the substrate. The surface of the substrate is covered with a silver cover layer composed of a reduction nickel layer, a reduction palladium layer and a reduction silver layer stacked in order, or a reduction nickel layer, a reduction palladium layer and a replacement silver layer stacked in order.
Ta-i Technology Co., Ltd.


07/28/16
20160214113 

Biochip holder, manufacturing biochip holder, biochip retainer, and biochip holder kit


The purpose of this invention is to provide a biochip holder and holding kit that make it possible to efficiently process large numbers of biochips that have detection samples exposed on both sides. This invention provides a biochip holder characterized by having the following: a concavity (24) that accommodates a biochip (10); and support parts (26) that are provided at the edges of said concavity and support the biochip accommodated inside the concavity such that said biochip is substantially horizontal and the underside thereof is above the bottom surface (24a) of the concavity with a gap therebetween..
Mitsubishi Rayon Co., Ltd.


07/21/16
20160212853 

Led package for lamp of vehicle


Disclosed is a light emitting diode (led) package for a lamp of a vehicle. The led package includes a printed circuit board (pcb) which includes a metal layer, an insulating layer formed on the metal layer, and an electric wiring layer formed on the insulating layer; an led circuit unit which includes an led chip mounted on the electric wiring layer; and a connector which is mounted on the electric wiring layer to be connected with the led chip.
Hyundai Mobis Co., Ltd


07/21/16
20160212549 

Mems microphone device


A micro-electro-mechanical system (mems) microphone device is provided in the present disclosure. The mems microphone device includes a first electromagnetic shielding cover defining a first accommodating space; a second electromagnetic shielding cover received in the first accommodating space and defining a second accommodating space; a mems chip and an application specific integrated circuit (asic) chip received in the second accommodating space.
Aac Acoustic Technologies (shenzhen) Co.,ltd.


07/21/16
20160211420 

High efficiency leds and methods of manufacturing


Simplified led chip architectures or chip builds are disclosed that can result in simpler manufacturing processes using fewer steps. The led structure can have fewer layers than conventional led chips with the layers arranged in different ways for efficient fabrication and operation.
Cree, Inc.


07/21/16
20160211230 

Chip comprising a phase change material based protecting device and a manufacturing the same


An electronic chip including an integrated circuit arranged a face of a substrate, and a protection device arranged partially facing the integrated circuit is provided. The protection device includes a capacitor having a first electrode and a second electrode between which a layer of phase change material is disposed changing locally from a first resistive state to a second resistive state different from the first state by penetration of a beam.
Commissariat A L'energie Atomique Et Aux Energies Alternatives


07/21/16
20160211189 

Chip carrier laminate with high frequency dielectric and thermomechanical buffer


A chip carrier for carrying an encapsulated electronic chip, wherein the chip carrier comprises a laminate structure formed as a stack of a plurality of electrically insulating structures and a plurality of electrically conductive structures, and a chip coupling area at an exposed surface of the laminate structure being configured for electrically and mechanically coupling the encapsulated electronic chip, wherein one of the electrically insulating structures is configured as high frequency dielectric made of a material being compatible with low-loss transmission of a high-frequency signal, and wherein at least one of another one of the electrically insulating structures and one of the electrically conductive structures is configured as a thermomechanical buffer for buffering thermally induced mechanical load.. .
Infineon Technologies Ag


07/21/16
20160211079 

Miniature wire-bondable capacitor


A multi-layer ceramic capacitor (mlcc) device includes a ceramic chip having electrically conductive layers embedded within the chip that form one or more capacitors connected by one or more vias to one or more upwardly facing wire-bondable pads on the top side of the device. One embodiment includes electrically conductive layers that form at least two stacked capacitors connected by vias to multiple upwardly facing wire-bondable pads on the top side, whereby the mlcc device has a reduced footprint while avoiding solder fillets.
Eulex Corp.


07/14/16
20160204578 

Ring-modulated laser


An optical source is described. This optical source includes a semiconductor optical amplifier, with a semiconductor other than silicon, which provides a gain medium.
Oracle International Corporation


07/14/16
20160204314 

Light emitting diode package


A light emitting diode (led) package includes: a package substrate having a first electrode structure and a second electrode structure; an led chip disposed above a first surface of the package substrate and having a first electrode attached to the first electrode structure and a second electrode attached to the second electrode structure; a reflective layer disposed above the first surface of the package substrate to be separated from the led chip, having a thickness less than a thickness of the led chip, and configured to reflect light emitted from the led chip to a given direction, wherein the wavelength converter has an upper surface substantially parallel to the first surface of the package substrate and a side surface inclined towards the upper surface of the wavelength converter.. .
Samsung Electronics Co., Ltd.


07/14/16
20160204090 

Led packaging structure


A light emitting diode (led) packaging structure including a metal pad, an electric static discharge (esd) protection element and an led chip is provided. The metal pad has a first pad portion having a first top surface with a first concave configured thereon and a second pad portion having a second top surface with a second concave configured thereon.
Everlight Electronics Co., Ltd.


07/14/16
20160203913 

Multi-layered ceramic electronic device, making same


A multi-layered ceramic electronic device is made by attaching respective inner bonding surfaces of two lead frames to two opposite electrode junctions of a multi-layered ceramic chip in such a manner that a predetermined buffer space is defined between respective bottom bonding portions of the lead frames and the bottom side of the multi-layered ceramic chip, and then applying a conductive polymer adhesive to bond the inner bonding surfaces of the lead frames to the electrode junctions of the multi-layered ceramic chip at a predetermined low bonding temperature and to electrically conduct the leaf frames to the electrode junctions of the multi-layered ceramic chip.. .
Holy Stone Enterprise Co., Ltd


07/14/16
20160203396 

Antenna module


An antenna module includes a base including two opposing mounting surfaces, an antenna coil provided on or in the base so as to define an opening, the antenna coil having a shape that is symmetrical or substantially symmetrical with respect to a reference plane, and an ic chip and a plurality of electronic components mounted on one of the mounting surfaces and electrically coupled to the antenna coil, the ic chip and the electronic components being arranged inside the opening when viewed in plan from a normal direction of the mounting surface. At least two of the plurality of electronic components are arranged so as to be symmetrical or substantially symmetrical to each other with respect to the reference plane when viewed in plan from the normal direction..
Murata Manufacturing Co., Ltd.


07/14/16
20160203099 

System on chip for packetizing multiple bytes and data processing system including the same


A system on chip includes a display serial interface (dsi) which includes a phy protocol interface (ppi) used for communication between a dsi host controller and a d-phy. The dsi host controller includes a register configured to store first indicator data indicating a ppi packetizing method and a lane distributor configured to determine a size of a symbol to be transmitted to the ppi and an order of first processing units to be included in the symbol based on the first indicator data..
Samsung Electronics Co., Ltd.


07/14/16
20160202315 

System on chip capable of being debugged in abnormal operating state and debugging system on chip


A system on chip capable of being debugged in an abnormal operation state and a debugging method for system on chip are provided. A switch unit is connected to a function module through a first path and is connected to a test connection interface of a processor through a second path.
Ali Corporation


07/14/16
20160202248 

Immunolipoplex nanoparticle biochip containing molecular probes for capture and characterization of extracellular vesicles


The present invention disclosed a method of fabricating an antibody immunolipoplex nanoparticle (ab-iln) biochip and antibody tethered lipoplex nanoparticle (ab-tln) biochip. The aforementioned antibody-based lipoplex nanoparticle biochip or the related array contains molecular probes and is applied for detecting the presence of a disease or condition in a subject obtaining a body fluid sample by capturing and identifying both membrane protein and intra-vesicular dna/rna/proteins of extracellular vesicles (evs)..
Nanomaterial Innovation Ltd.


07/14/16
20160200777 

Methionyl trna synthetase for biosynthesis of photomethionine-labeled protein and preparing photoactive protein g variant using same


Provided is a methionyl trna synthase (mrs) for the biosynthesis of a photomethionine-labeled protein and a method for preparing a photoactivatable protein g variant using same and, more particularly, to an mrs variant in which alanine at the position of 12th is substituted with glycine, leucine at the position of 13th by serine, tyrosine at the position of 260th by phenylalanine, isoleucine at the position of 297th by valine, and histidine at the position of 301st by leucine from the n-terminal of the amino acid sequence of a wild-type escherichia coli methionyl trna synthase. The mrs variant effectively confirms the biosynthesis of a photomethionine (pm)-labeled target protein and thus can be utilized for the biosynthesis of a pm-labeled target protein.
Korea Research Institute Of Bioscience And Biotechnology


07/14/16
20160199225 

Micro-droplet delivery device and methods


Micro-droplet delivery devices and methods are described where the device may comprise a piezoelectric actuator having a piezoelectric chip that is operatively coupled to a drug package under a preloading force. The actuator is configured to generate an acoustic pressure within the drug package to dispense droplets of an agent from an aperture, e.g., to the corneal surface of the eye.

07/07/16
20160198095 

Image sensor modules, methods of manufacturing the same, and image processing systems including the image sensor modules


An image sensor module is provided. The image sensor module includes a printed circuit board (pcb), an image sensor chip disposed on a first plane of the pcb and electrically connected to the pcb, and an image signal processing chip disposed on the first plane of the pcb and electrically connected to the pcb.

07/07/16
20160197960 

Ic chip, information processing apparatus, system, method, and program


An ic chip, an information processing apparatus, system, method, and program are provided. An ic chip includes an authentication control unit configured to authenticate a request using authentication information.
Felica Networks, Inc.


07/07/16
20160197225 

Device of monolithically integrated optoelectrics


A method is disclosed for fabricating optoelectronic component structures and traditional circuit elements on a single silicon substrate. Specific examples of optoelectronic components include, but are not limited to: photodiode structures, light emitter structures and waveguide structures.

07/07/16
20160197166 

Semiconductor device and manufacturing the same


As a display device has a higher definition, the number of pixels, gate lines, and signal lines are increased. When the number of the gate lines and the signal lines are increased, a problem of higher manufacturing cost, because it is difficult to mount an ic chip including a driver circuit for driving of the gate and signal lines by bonding or the like.
Semiconductor Energy Laboratory Co., Ltd.


07/07/16
20160196989 

Baseplate for an electronic module and manufacturing the same


Various embodiments provide methods for manufacturing a baseplate for an electronic module and an electronic module comprising a baseplate, wherein the baseplate comprises a conductive material; and a recess formed in one main surface of the baseplate and being adapted to accommodate an electronic chip.. .
Infineon Technologies Ag


07/07/16
20160196486 

Non-contact ic label


A non-contact ic label of the present invention includes an ic chip disposed on a magnetic sheet, a first antenna section and a second antenna section each connected to the ic chip, a circuit section which connects a first end portion of the first antenna section and a first end portion of the second antenna section to the ic chip, a first auxiliary antenna section which is disposed to project from a side on the second end portion of the first antenna section and a second auxiliary antenna section which is disposed to project from a side on the second end portion of the second antenna section, wherein the first antenna section and the second antenna section are formed in the same rectangular shape in a plan view.. .
Toppan Printing Co., Ltd.


07/07/16
20160196227 

System on chip (soc), mobile electronic device including the same, and operating the soc


A system on chip (soc) is present that includes a plurality of master interfaces, a plurality of slave interfaces, and an interface circuit which is connected between the plurality of master interfaces and the plurality of slave interfaces and includes a plurality of components. When a first master interface among the plurality of master interfaces and a first slave interface among the plurality of slave interfaces are paired, a first group of the components which forms a first signal path between the first master interface and the first slave interface among the plurality of components is enabled according to a control of the first master interface..

07/07/16
20160194213 

Nanometer-size-particle production apparatus, nanometer-size-particle production process, nanometer-size particles, zinc/zinc oxide nanometer-size particles, and magnesium hydroxide nanometer-size particles


The present invention is a nanometer-size-particle production apparatus for synthesizing nanometer-size particles in a liquid by means of plasma in liquid, and comprises: a container for accommodating the liquid therein; an electromagnetic-wave generation device for generating a high-frequency wave, or a microwave; an electrode conductor whose leading end makes contact with the liquid to supply the high-frequency wave or the microwave to the liquid; a covering portion being disposed into the liquid so as to cover a leading-end upside of the electrode conductor; a metallic chip being composed of a metal making a raw material of nanometer-size particles, and having a leading end that is disposed to face to a leading-end section of the electrode conductor; and a feed device for feeding out the leading end of the metallic chip with respect to the leading-end section of the electrode conductor; the leading end of the electrode conductor having a configuration that is a non-edge configuration; and the electrode conductor, except for the leading end, having an axially-orthogonal cross-sectional area that is larger than an axially-orthogonal cross-sectional area of the metallic chip.. .

07/07/16
20160193608 

Biochip support member, manufacturing biochip support member, biochip package, screening device, and screening method


A biochip support member is provided that comprises a base material, and a columnar member different member from the base material having a support area that can support a biochip formed of a biomolecule provided at one end, and is attached to the base material through an attaching part at the other end.. .
Nikon Corporation


07/07/16
20160192839 

Bio-chips and nano-biochips


A biochip device, or a system of biochips, providing diagnostic testing, sensing and therapeutic functionality useful in diagnosis and treatment of a variety of physiological maladies.. .
International Business Machines Corporation


07/07/16
20160192601 

Plant cultivation device


A plant cultivation device includes a case (100), a temperature control module (200), and a circulation fan (310). A cultivation room (110) is formed in the case (100).
Cal-comp Biotech Co., Ltd.


07/07/16
20160192588 

Operating assembly for harvesting


An operating assemblage to harvest agricultural crops at a peak of ripeness comprising a mobility component configured to navigate through an agricultural field; at least one vacuum motor calibrated to generate necessary and sufficient suction to successfully harvest a harvestable ripe unit of a crop such as a fruit, berry, nut, or vegetable using a collection hose ending in a collection nozzle of a size appropriate to the crop; the collection nozzle housing an array of sensors; and a collection and storage receptacle for harvested produce. The assemblage is configured by an operator inputting parameters to calibrate the array of sensors to trigger the vacuum motor to apply sufficient suction to harvest agricultural produce at a specified degree of ripeness.

06/30/16
20160191769 

Electronic device and image building module thereof


An image building module includes an image builder, a signal-shielding flexible film, and a signal shielding cover. The image builder includes a first image capturing element and a processing chip.

06/30/16
20160191151 

Integrated driver redundancy for a silicon photonics device


In an example, the present invention includes an integrated system on chip device. At least a pair of laser devices are associated with a channel and coupled to a switch to select one of the pair of laser devices to be coupled to an optical multiplexer to provide for a redundant laser device..

06/30/16
20160190673 

Ic-package interconnect for millimeter wave systems


Consistent with an example embodiment, a system on chip (soc) device operates in millimeter wave frequencies. The soc device comprises, a silicon device having at least one differential pair pad, the at least one differential pair pad having a shunt inductor coupled thereon.

06/30/16
20160190198 

Image sensor


An image sensor includes a pixel array chip, a logic chip, and an interposed layer. The interposed layer is disposed on the pixel array chip.

06/30/16
20160190117 

Slim bezel and display having the same


A bezel of a display includes source lines with a same length, gate in panel (gip) lines, and at least two customized integrated circuit (ic) chips arranged along a straight line in a lateral direction. Each of the customized ic chips is coupled to at least one of the source lines or the gip lines.

06/30/16
20160190109 

Stack semiconductor package


A stack semiconductor package includes a first semiconductor package having a first package substrate and a first semiconductor chip mounted on the first package substrate. The first semiconductor chip includes first chip pads arranged along a side portion thereof.

06/30/16
20160188910 

Automated manufacturing system with adapter security mechanism and manufacture thereof


A method of operation of an automated assembly system includes: detecting a socket adapter having an adapter identifier and an adapter cryptographic chip; calculating a primary key hash based on a primary key in a programming cryptographic chip; calculating an adapter hash based on the adapter identifier using the adapter cryptographic chip; matching the primary key hash to the adapter hash to update an authentication token with the adapter identifier for authenticating the socket adapter on the device programming system; and programming programmable devices in the socket adapter based on the authentication token.. .

06/30/16
20160188503 

Virtual legacy wire


In an example, a system on chip (soc) includes virtual legacy wire (vlw) functionality. The vlw signal virtualizes a physical interrupt existing in legacy systems to enable a peripheral to cause a processor to enter an interrupt handling routine relevant to the peripheral.

06/30/16
20160188216 

Hard disk and management method


A hard disk includes a manager, a managed component, a management interface a network interface, and a system on chip (soc). The management interface receives an external management command.

06/30/16
20160187904 

Low power ideal diode control circuit


A circuit that operates as a low-power ideal diode is disclosed, as well as an ic chip that contains the ideal diode circuit. The circuit includes a first p-channel transistor connected to receive an input voltage on a first terminal and to provide an output voltage on a second terminal, a first amplifier connected to receive the input voltage and the output voltage and to provide a first signal that dynamically biases a gate of the first p-channel transistor as a function of the voltage across the first p-channel transistor, and a second amplifier connected to receive the input voltage and the output voltage and to provide a second signal that acts to turn off the gate of the first p-channel transistor responsive to the input voltage being less than the output voltage..

06/30/16
20160187581 

Coupling optical signals into silicon optoelectronic chips


A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a silicon photonic chip through a light path in a region where silicon is removed from said silicon photonic chip, wherein photonic devices may be integrated in layers on a front surface of the silicon photonic chip. Optical couplers, such as grating couplers, may receive the optical signals in the front surface.

06/30/16
20160187344 

Method of measuring cancer related substances by raman spectroscopy


A method for measuring cancer related substances including cancer cell-derived free dna by raman spectroscopy, involving steps for preparing a biochip having a meso-crystal region of silver oxides containing a silver peroxide, adding a blood serum or a biological sample solution dropwise onto the meso-crystal region of said biochip, selectively trapping the cancer-related substances having a positive charge in the sample, irradiating the trapped cancer-related substance with an exciting laser light and detecting a surface enhanced raman scattering therefrom, wherein cancer diseases are evaluated on the basis of the intensity of the surface enhance raman scattering (sers). In the carbon-specific d band and g band in the raman scattering spectrum, a characteristic peak spectrum of the cancer-related substance can be detected in the proximity of the methyl group characteristic of 2900 cm−1..

06/30/16
20160186978 

Lamp with led chips cooled by a phase transformation loop


An apparatus includes an led light source positioned within an envelope, a porous fluid transporting material coating the envelope, providing a path between the led light source and the envelope, and a cooling medium conducted through the fluid transporting material toward the led light source in a liquid phase and conducted from the led light source to the envelope in a vapor phase for removing heat from the led light source.. .

06/30/16
20160186952 

Motor vehicle headlamp having a two-chamber reflection system


A motor vehicle headlamp having a first reflection module, including a first reflector, a first group of led chips and a second group of led chips, having a second reflection module, which comprises a second reflector, a third group of led chips and a fourth group of led chips, and having a control circuit, which is configured to control the current flow through the light emitting diodes, and which is configured to activate the led chips of the first group together with the led chips of the fourth group, wherein the led chips of the second group and the led chips of the third group are deactivated. The control circuit activates the led chips of the second group together with the led chips of the third group, wherein the led chips of the first group and the led chips of the fourth group are deactivated..

06/30/16
20160186236 

Real time quantitative and qualitative analysis biosubstance


A method of quantitatively and qualitatively analyzing a biomaterial in real-time, the method comprising preparing a device for detecting a biomaterial, feeding a complex of first and second probes, a forward primer, a reverse primer, a sample comprising deoxynucleotide triphosphate, a polymerase having exonuclease activity, and a sample comprising target genes, and a reaction solution comprising a buffer into the reaction container, performing polymerase chain reaction comprising denaturation of the target genes in the sample, hybridization of the target genes, the complex, and the forward and reverse primers in the sample, and elongation of the primers through the polymerase having exonuclease activity, allowing for elongation of the second probe on the third probe by the polymerase after hybridizing the released second probe and the third probe fixed to the biochip, detecting a first fluorescence signal by the first phosphor and a second fluorescence signal by the second phosphor.. .

06/23/16
20160183377 

Dielectric filmless electronic module and manufacturing same


The invention relates to an electronic module comprising a first metal layer including at least one contact pad or a conductive pad for connection or interconnection, an insulating layer that is electrically connected to the metal layer via a first surface, a second metal layer connected to the insulating layer on the opposite surface thereof, a chip location or an electronic chip electrically connected to the at least one contact pad through openings in the insulating layer, characterized in that the insulating layer is an adhesive.. .

06/23/16
20160181490 

Light emitting diode packaging structure


A packaging structure of a vertical led chip includes at least a support system, a glue cup that connects to periphery of the support system, a led chip with light absorption substrate over the support system and packaging glue distributed in periphery of the led chip. The light absorption substrate has a side forming a bubble structure at an interface with the packaging glue.

06/23/16
20160181322 

System on chip (soc) based on phase transition and/or phase change material


System on chips (socs) of a microprocessor electrically connected with electronic memory devices and/or optically connected with a optical memory device are disclosed along with various embodiments of building block of the microprocessor and the electronic memory devices, wherein the microprocessor can comprise digital unit and/or neural networks based unit.. .

06/23/16
20160181214 

Stacked memory chip having reduced input-output load, memory module and memory system including the same


A stacked memory chip includes a chip input-output pad unit, a first semiconductor die and a second semiconductor die. The chip input-output pad unit includes a chip command-address pad unit, a lower chip data pad unit and an upper chip data pad unit that are to be connected to an external device.

06/23/16
20160181173 

Integrated circuit barrierless microfluidic channel


A structure and method for fabricating a continuous cooling channel in the back end of line wiring levels of an integrated circuit (ic) chip is provided. This continuous cooling channel may provide a path for a cooling source such as a fluid pumped from an external fluidic-cooling circulation driver to make physical contact locally with and cool the back end levels within the ic chip that may generate heat as a byproduct of the ic device's routine operations.

06/23/16
20160181166 

Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness


Disclosed is a method of manufacturing integrated circuit (ic) chips. In the method, wafers are received and the backside roughness levels of these wafers are determined.

06/23/16
20160181153 

Integrated circuit barrierless microfluidic channel


A structure and method for fabricating a continuous cooling channel in the back end of line wiring levels of an integrated circuit (ic) chip is provided. This continuous cooling channel may provide a path for a cooling source such as a fluid pumped from an external fluidic-cooling circulation driver to make physical contact locally with and cool the back end levels within the ic chip that may generate heat as a byproduct of the ic device's routine operations.





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