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 Backlight module with mjt led and backlight unit incluing the same patent thumbnailBacklight module with mjt led and backlight unit incluing the same
A backlight unit including a backlight module and a backlight control module. The backlight module includes a printed circuit board including blocks, and light emitting diode (led) chips disposed on the blocks, and the backlight control module is configured to perform a dimming control of the led chips.
Seoul Semiconductor Co., Ltd.


 Light emitting diode chip having electrode pad patent thumbnailLight emitting diode chip having electrode pad
Disclosed herein is an led chip including electrode pads. The led chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer.
Seoul Viosys Co., Ltd.


 Packaging optoelectronic components and cmos circuitry using silicon-on-insulator substrates for photonics applications patent thumbnailPackaging optoelectronic components and cmos circuitry using silicon-on-insulator substrates for photonics applications
Package structures and methods are provided to integrate optoelectronic and cmos devices using soi semiconductor substrates for photonics applications. For example, a package structure includes an integrated circuit (ic) chip, and an optoelectronics device and interposer mounted to the ic chip.
International Business Machines Corporation


 Light emitting device patent thumbnailLight emitting device
The color purities of blue-green light and yellow or yellow-green light are enhanced. A light emitting device (100) configured to emit at least blue-green light and yellow or yellow-green light includes a substrate (51), an led chip group, and a sealing resin part (50) collectively sealing the led chip group, wherein the led chip group at least includes a green led chip (gb), a green led chip (gy), a blue led chip (b), and a red led chip (r), and the green led chip (gb) has a dominant wavelength shorter than a dominant wavelength of the green led chip (gy)..
Sharp Kabushiki Kaisha


 Ceramic electronic component and  producing the same patent thumbnailCeramic electronic component and producing the same
There is provided a ceramic electronic component including: a ceramic chip having a first surface, a second surface facing the first surface, and a third surface connecting the first surface to the second surface; a first electrode unit disposed on the first surface; a second electrode unit disposed on the second surface apart from the first electrode unit; and a modified zone disposed on the third surface, and modified by irradiation of a high energy beam.. .
Taiyo Yuden Co., Ltd.


 Smoke detection unit with light-emitting diode and photo-detector, and with an led chip arranged in the light-emitting diode and with a photosensor for determining a degree of aging and/or a compensation value for a light current, as well as a light-emitting diode patent thumbnailSmoke detection unit with light-emitting diode and photo-detector, and with an led chip arranged in the light-emitting diode and with a photosensor for determining a degree of aging and/or a compensation value for a light current, as well as a light-emitting diode
An optical smoke detection unit for a danger alarm includes a light-emitting diode (led) including at least one led chip in an led housing and connection contacts contacting the led chip and running out of the led housing. The smoke detection unit may include a photo-detector spectrally sensitive to emitted light for detecting smoke and a control unit for controlling the led and for evaluating a sensor signal of the photo-detector for characteristic fire magnitudes.
Siemens Schweiz Ag


 Flash memory controller and memory device for accessing flash memory module, and associated method patent thumbnailFlash memory controller and memory device for accessing flash memory module, and associated method
A method for accessing a flash memory module includes: sequentially writing nth-(n+k)th data to a plurality of flash memory chips of the flash memory module, and encoding the nth-(n+k)th data to generate nth-(n+k)th eccs, respectively, where the nth-(n+k) th eccs are used to correct errors of the nth-(n+k)th data, respectively, and n and k are positive integers; and writing the (n+k+1)th data to the plurality of flash memory chips of the flash memory module, and encoding the (n+k+1)th data with at least one of the nth-(n+k)th eccs to generate the (n+k+1)th ecc.. .
Silicon Motion Inc.


 Read distribution in a three-dimensional stacked memory based on thermal profiles patent thumbnailRead distribution in a three-dimensional stacked memory based on thermal profiles
A memory controller may receive a plurality of thermal profiles from a plurality of three-dimensional (3d)-stacked memory chips, where the plurality of thermal profiles include thermal profile data for the memory chips, where the thermal profile data includes a memory chip usage data and a location data for each of the memory chips, and where the memory chips include a first memory chip and a second memory chip. The memory controller may generate a first predicted memory chip usage data and location data by analyzing the usage data and location data of the thermal profile data.
International Business Machines Corporation


 Cpu bist testing of integrated circuits using serial wire debug patent thumbnailCpu bist testing of integrated circuits using serial wire debug
A method of simultaneously built in self-testing (bist) a sub circuit in a plurality of integrated circuit (ic) chips by embedded microprocessor (cpu) and sram memory using 2 to 4 digital pins per ic chip on automatic test equipment (ate) using a serial wire debug testing protocol. A method of simultaneously built in self-testing (bist) an embedded nonvolatile memory in a plurality of integrated circuit (ic) chips by embedded microprocessor (cpu) and sram memory using 2 to 4 digital pins per ic chip on automatic test equipment (ate) using a serial wire debug testing protocol..
Texas Instruments Incorporated


 Washing/drying apparatus, screening apparatus, washing/drying method, and screening method patent thumbnailWashing/drying apparatus, screening apparatus, washing/drying method, and screening method
There is a possibility that an arrangement of a cleaning device and a drying device may result in an inefficient usage of a space for an installation. A cleaning and drying apparatus 30 for a plate including a biochip is provided with: a cleaning device 310 that is configured to clean the plate 60; and a drying device 320 that is configured to dry the plate 60, the drying device 320 is arranged above the cleaning device 310..
Nikon Corporation


Polymer microfluidic biochip fabrication

Provided are microfluidic devices and methods for fabricating and bonding such devices. Also provided are kits for analyzing analyte-containing samples and for lysing cells..
Fluidigm Corporation

Silicon speaker

The present invention provides a silicon speaker comprising an mems acoustoelectric chip and a pcb substrate, wherein the mems acoustoelectric chip comprises a corrugated diaphragm on a silicon substrate; and one side surface of the mems acoustoelectric chip is metalized, and the metalized side surface of the mems acoustoelectric chip is connected with the pcb substrate. The corrugated diaphragm is electrically conductive and interconnected with metal paths on mems acoustoelectric chip, which is led out to a first pcb metal path as one electrode.
Goertek Inc.

Light-emitting apparatus and illumination apparatus

A light-emitting apparatus includes: a substrate; an led chip disposed on the substrate; and a sealing member that contains a yellow phosphor and a cerium oxide, and seals the led chip. An amount of the cerium oxide contained in the sealing member depends on a peak wavelength of a light emission spectrum of the led chip, and when the peak wavelength of the light emission, spectrum of the led chip is 470 nm or less, the amount of the cerium oxide contained in the sealing member is 0.100 wt % or less..
Panasonic Intellectual Property Management Co., Ltd.

Led assembly

This disclosure discloses an led assembly. The led assembly includes a transparent mount with a top surface and a bottom surface opposite to the top surface, an led chip arranged on the top surface, an electrode plate, a first phosphor layer having a first phosphor, and a second phosphor layer having a second phosphor, wherein the transparent mount and the electrode plate substantially have a same width.
Interlight Optotech Corporation

Method of producing a multicolor led display

A method produces a multicolor led display, the display including an led luminous unit having a multiplicity of pixels. First subpixels, second subpixel and third subpixels contain an led chip that emits radiation of a first color, wherein a first conversion layer that converts the radiation into a second color is arranged at least above the second subpixels and a second conversion layer that converts the radiation into a third color is arranged above the third subpixels.
Osram Opto Semiconductors Gmbh

Contact smart card and forming such

Contact smart card has a smart card contact pad and an ic chip. The smart card contact pad has a circuit substrate with a plurality of via holes there through, a card-reader contact element on a first side of the circuit substrate, and a plurality of chip connection elements on a second side of the circuit substrate.
Johnson Electric S.a.

Enhanced advanced driver assistance system (adas) system on chip

A system on chip (soc) having an integrated circuit (ic) integrating into a single chip advance driver assistance systems (adas) processing unit(s), application processing unit(s), at least one memory storing adas code comprising adas computer instructions adapted to be executed on the adas processing unit(s) for processing vehicle sensor data and vm code for executing vm(s) on the application processing unit(s) and a hypervisor which manages an execution of at least one operation system of the vm(s) and an access to a processor shared memory of the adas processing unit(s) for acquiring an outcome of executing the adas computer instructions for the completion of an adas enhancing function by the execution of the vm(s) on the application processing unit(s).. .
Ionroad Technologies Ltd.

Memory chips and data protection methods

A memory chip coupled to a host includes a memory and a controller. The memory is pre-loaded with a plurality of boot images, wherein the boot images have the same content.
Via Technologies, Inc.

Clock management unit, integrated circuit including the clock management unit, system on chip, and operating the system on chip

In one embodiment, the integrated circuit includes a clock generator configured to selectively generate a first clock; a processor configured to perform operations; and a clock management circuit. The clock management circuit is configured to receive clock management information from the processor and selectively generate a second clock based on the clock management information and the first clock.
Samsung Electronics Co., Ltd.

Electro-optic device with dichroic mirror and related methods

An electro-optic device may include a photonic chip having an optical grating at a surface, and an ic coupled to the photonic chip. The electro-optic device may include an optical element defining an optical path above the optical grating, and a dichroic mirror above the optical grating and aligned with the optical path..
Stmicroelectronics S.r.l.

Centrifugal microfluidic chip control

A technique is provided for incorporating pneumatic control in centrifugal microfluidics. The technique involves providing a chip controller that has pressurized fluid supply lines for coupling one or more pressurized chambers of the controller with ports of a microfluidic chip.
National Research Council Of Canada

Data processing for led television, and led television

The disclosure discloses a data processing method and device for a light emitting diode (led) television (tv), and an led tv, wherein the data processing device includes: a signal processing chip configured to perform mode conversion on a received tv signal so as to obtain a first video signal of a preset mode; and a video processing chip connected to the signal processing chip and configured to perform clock synchronization processing on the first video signal so as to obtain a second video signal and output the second video signal to an led display. By means of the disclosure, the problem in the prior art that an led tv can only display a tv signal of a single mode is solved, thereby achieving the effect that the led tv can display videos of various modes and various formats..
Leyard Optoelectronic

Multichip, battery protection apparatus, and battery pack

A multichip in which a protection ic for detecting at least one of overcharge, over discharge, and overcurrent of a secondary battery and a monitoring ic for monitoring a battery state of the secondary battery are integrated in a package. The protection ic and the monitoring ic are not overlapped in a plan view.
Mitsumi Electric Co., Ltd.

Portable light-emitting device without pre-stored power sources and led package structure thereof

An led package structure without pre-stored power sources includes a substrate unit and a led chip. The substrate unit includes a carrier substrate, a positive conductive pin, and a negative conductive pin.
Harvatek Corporation

Light-emitting device and lighting device provided with the same

A light-emitting device capable of ensuring an electric connection between a light-emitting element and an electrode without generating any problem in practical use, by both connecting methods with a solder and a connector, and a lighting device provided with the light-emitting device are provided. The light-emitting device according to the present invention has a plurality of led chips, and a soldering electrode land and a connector connecting electrode land electrically connected to the chips, on a ceramic substrate.
Sharp Kabushiki Kaisha

Radio frequency identification tag

A radio frequency identification (rfid) tag, includes: a substrate; an antenna formed on a first surface of the substrate; an ic chip electrically coupled to the antenna; an adhesive applied to a first area of the substrate to fix the ic chip and the antenna to each other, and a first laminate layer formed on a second surface of the substrate opposite to the first surface thereof, wherein at least a part of the first laminate layer is missing within a second area, which corresponds to the first area, on the second surface.. .
Fujitsu Limited

Ic tag

Provided is an ic tag favorably applicable even to linen products. An ic tag 100 using a magnetic field type tag unit 110 in which an ic chip and a coil antenna to be electrically connected to the ic chip are embedded inside a hard resin material.
Nok Corporation

Stacked chip layout and making the same

A stacked chip layout includes a central processing chip; and a first active circuit block over the central processing chip. The stacked chip layout further includes a second active circuit block over the first active circuit.
Taiwan Semiconductor Manufacturing Company, Ltd.

Dual-bus semiconductor chip processor architecture

A semiconductor chip processor structure comprises a main bus which allows for direct control of internal functional blocks by a micro controller unit (mcu); a sub bus whose clock frequency is higher than the main bus; a memory access which carries out direct memory access actions and controls the external peripherals; an image processing unit which causes transmission of compressed image data to the external peripherals; and an audio processing unit that causes transmission of audio data input from an external audio codec unit to external peripherals or audio data transmitted from external peripherals to be transmitted to the external audio codec unit. Using an additional 8-bit high speed bus to transmit ≧1 megapixel images ≧12 frames per second through an 8-bit micro controller operating with an organic combination of multifunctional image sensor functions for iot system on chip processors makes high performance image processing in 8-bit mcus possible..
Seloco, Inc.

Use of glycan as biomarkers for autoimmune diseases

The present invention discloses a method of determining the presence of autoimmune disease with the use of glycan biomarkers. A method of improving the detection sensitivity of trace glycans from a mixture of glycans and a microfluidic chip therefor are also disclosed..
Macau University Of Science And Technology

Method and means to evenly distribute ambient illumination and to avoid bright led beam directly into human eyes

An energy-saving led-based device with improved support structure for high-brightness led chips for room illumination. The improved support structure positions the led chips in such a way that the light is emitted towards the ceiling, the floor, or any other surface, along such a path that human eyes are unlikely to cross the light path.

Temperature control valve

A temperature control valve includes a main body, a metal valve assembly and a thermoelectric chip unit. The main body has a first inlet and a first outlet.

Radio-frequency integrated circuit (rfic) chip(s) for providing distributed antenna system functionalities, and related components, systems, and methods

Radio-frequency (rf) integrated circuit (rfic) chip(s) allow for the integration of multiple electronic circuits on a chip to provide distributed antenna system functionalities. Rfic chips are employed in central unit and remote unit components, reducing component cost and size, increasing performance and reliability, while reducing power consumption.
Corning Optical Communications Wireless Ltd

3d mram with through silicon vias or through silicon trenches magnetic shielding

Emerging memory chips and methods for forming an emerging memory chip are presented. For example, magnetoresistive random access memory (mram) chip magnetic shielding and vertical stacking capabilities processed at the wafer-level are disclosed.
Globalfoundries Singapore Pte. Ltd.

Photoluminescence material coating of led chips

A photoluminescence sheet comprises a polymer sheet having particles of at least one photoluminescence material homogeneously distributed throughout its volume. The polymer sheet comprises a uv-curable polymer that is partially cured and which is thermally re-flowable before being fully cured by exposure to uv light..
Intematix Corporation

Optoelectronic semiconductor element, optoelectronic semiconductor device and producing a plurality of optoelectronic semiconductor elements

An optoelectronic semiconductor element may include at least one led chip which emits infrared radiation via a top side during operation. The radiation has a global intensity maximum at wavelengths between 800 nm and 1100 nm.
Osram Opto Semiconductors Gmbh

Mram chip magnetic shielding

Emerging memory chips and methods for forming an emerging memory chip are presented. For example, magnetic random access memory (mram) chip magnetic shielding and methods of forming a magnetic shield processed at the wafer-level are disclosed.
Globalfoundries Singapore Pte. Ltd.

Semiconductor light emitting device

A semiconductor light emitting device includes an led chip, which includes an n-type semiconductor layer, active layer, and p-type semiconductor layer stacked on a substrate. The led chip further includes an anode electrode connected to the p-type semiconductor, and a cathode connected to the n-type semiconductor.
Rohm Co., Ltd.

Light emitting device

A light emitting device including a first work circuit and a second work circuit is provided. The first work circuit includes a first led chip and a first bonding adhesive.
Everlight Electronics Co., Ltd.

Multi-die package structures

Package assemblies for and methods of packaging integrated circuit chips are described. Disclosed package assemblies have spacers and recessed regions comprising ic chips.
Intel Corporation

Multichip module, on board computer, sensor interface substrate, and the multichip module manufacturing method

A multichip module includes a plurality of semiconductor substrates and a plurality of surface mounting parts. The plurality of semiconductor substrates each have a wiring line region which contains a wiring line to pierce from one of the surfaces to the other surface.
Mitsubishi Heavy Industries, Ltd

Information processing apparatus, program, and information processing system

An information processing apparatus includes a reading unit that reads, from a memory area of an ic chip, identification information of a service including at least any one of a wire communication service via an external wire communication or a wireless communication service via an external wireless communication, which use the memory area of the ic chip. The information processing apparatus also includes an acquisition unit that acquires service information to allow a user to use a service from an external server by transmitting the identification information of the service which the reading unit has read to the external server, and includes a display unit that displays to allow the user to use the service based on the service information which the acquisition unit has acquired..
Felica Networks, Inc.

Wireless ic device

A wireless ic device includes a wireless ic chip arranged to process a radio signal, a power-supply circuit board that is connected to the wireless ic chip and that includes a power supply circuit including at least one coil pattern, and a radiation plate arranged to radiate a transmission signal supplied from the power-supply circuit board and/or receiving a reception signal to supply the reception signal to the power-supply circuit board. The radiation plate includes an opening provided in a portion thereof and a slit connected to the opening.
Murata Manufacturing Co., Ltd.

Method and virtualization

A virtual system on chip (vsoc) is an implementation of a machine that allows for sharing of underlying physical machine resources between different virtual systems. A method or corresponding apparatus of the present invention relates to a device that includes a plurality of virtual systems on chip and a configuring unit.
Cavium, Inc.

Memory system and operating memory system

A memory system may include: a memory device including a plurality of pages having a plurality of memory cells coupled to a plurality of word lines and suitable for storing read data and write data requested from a host, a plurality of memory blocks each including the pages, a plurality of planes each including the memory blocks, and a plurality of memory chips each including the planes; and a controller suitable for searching map data of the read data corresponding to a read command received from the host on a basis of a plurality of segments, triggering memory chips corresponding to the map data searched through the searches of the respective segments, reading data stored in the triggered memory chips, and transferring the read data to the host.. .
Sk Hynix Inc.

Led mechanical lighting fixture

An led light unit which creates an air movement over a metal surface by way of convection. This keeps the led unit significantly cooler than with just fins alone.

Led tube grow light

A led tube luminaire for growing plants in greenhouse and indoor horticulture comprising individual leds on a substrate with higher linear density, no focusing optics on led, a glass tube, the end cups, electronics, and electrical contactors. The led tube luminaire has high light intensity, random direction white light with different color temperature for grow and bloom.

Methods and systems of algorithmically controlling automotive functions

In one aspect, a computerized system for controlling automotive functions of a vehicle, includes a multi-core system on chip; a hypervisor including a multi-core synchronization function for a plurality of cores on the system on chip; and a plurality of automotive function modules in communication with the plurality of cores through the hypervisor.. .

Microfluidic chip and real-time analysis device using same

The present invention relates to a microfluidic chip and a real-time analysis device using same, and more specifically, to a microfluidic chip and a real-time analysis device using same capable of securing reliability of measurement results by appropriately preventing reduction of optical signal sensitivity due to bubbles included in a fluid. According to one embodiment of the present invention, the microfluidic chip is provided.
Nanobiosys Inc.





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This listing is a sample listing of patent applications related to Chip for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Chip with additional patents listed. Browse our RSS directory or Search for other possible listings.


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