|| List of recent Chip-related patents
| Technique for establishing an audio socket debug connection|
A debug controller monitors a tip-ring-ring-shield (trrs) socket, within a form factor device, to detect whether a debug unit is transmitting a request for a trrs socket debug connection. The form factor device also includes a system on chip (soc), a switch, and an audio codec.
| Method and managing global chip power on a multicore system on chip|
According to at least one example embodiment, a method and corresponding apparatus for controlling power in a multi-core processor chip include: accumulating, at a controller within the multi-core processor chip, one or more power estimates associated with multiple core processors within the multi-core processor chip. A global power threshold is determined based on a cumulative power estimate, the cumulative power estimate being determined based at least in part on the one or more power estimates accumulated.
| System and conserving memory power using dynamic memory i/o resizing|
Systems and methods are disclosed for conserving power consumption in a memory system. One such system comprises a dram memory system and a system on chip (soc).
| Sound processing system and related method|
A sound processing system is provided and is executed by a processor. The processor acquires a video/audio file from video/audio files.
Hon Hai Precision Industry Co., Ltd.
| Marker sequences for rheumatoid arthritis and use thereof|
The present invention relates to new marker sequences for rheumatoid arthritis and the diagnostic use thereof together with a method for screening of potential active substances for rheumatoid arthritis by means of these marker sequences. Furthermore, the invention relates to a diagnostic device containing such marker sequences for rheumatoid arthritis, in particular a protein biochip and the use thereof..
| Method of using microfluidic chip for nucleic acid hybridization|
The present invention relates to method of using a microfluidic chip for rapid nucleic acid hybridization, comprising: activating a porous substrate with positive charges; injecting a mixed solution of a test nucleic acid and a nucleic acid probe into the microfluidic chip for maintaining the test nucleic acid hybridized to the nucleic acid probe being absorbed to the periphery of the substrate; continuously washing the microfluidic chip with an anionic surfactant; and detecting the hybridization signals on the substrate after washing for a predetermined time; wherein the activation of the substrate with positive charges allows the test nucleic acid hybridized to the nucleic acid probe to form a micelle during washing and the diffusion of such from the periphery toward the center of the substrate to accelerate. Thus, it is possible to accomplish detection in a very short time for application of specific dna complementary hybridization..
| Microfluidic chips with micro-to-macro seal and a manufacturing microfluidic chips with micro-to-macro seal|
A microfluidic chip for a microfluidic system includes a micro-to-macro seal. The microfluidic chip has a substrate, at least one microfluidic pathway in the substrate, and a pdms seal layer on the substrate and above the microfluidic pathway.
| Flash memory module for realizing high reliability|
A flash memory module may include a plurality of flash memory chips. The memory chips may include one or more blocks.
| Light source module, fabrication method therefor, and backlight unit including the same|
A light source module, a fabrication method therefore, and a slim backlight unit including the same. The light source module includes a light emitting diode (led) chip electrically connected to a substrate through a lower surface thereof, a wavelength conversion layer formed on the led chip and enclosing at least the light exit face of the led chip, and a reflector formed on a region of the led chip excluding the light exit face..
Seoul Semiconductor Co., Ltd.
| System for lighting apparatus utilizing light active sheet material with integrated light emitting diode, window with lighting apparatus, conveyance with lighting apparatus, and providing lighting apparatus|
A dual lighting apparatus includes a principal substrate, a first lighting device and a second lighting device. The first lighting device is integrated into a first plane of the principal substrate, the first lighting device having one or more first light emitting diode (led) chips embedded therein.
Grote Industries, Llc
Passive circuit for improved failure mode handling in power electronics modules
A power electronics module for enhancing short circuit failure mode (scfm) transitions. The module is adapted to disconnect a gate unit from the module using a first switch, upon a failure of at least one of a plurality of semiconductor chips during which the failed chip enters an scfm, and connect a passive circuit arrangement, including at least one capacitor and at least one resistor, to the module using a second switch.
Abb Research Ltd
An oscillator according to the disclosure includes a crystal unit, an ic chip, an adhesive agent flow prevention film, and a lead frame. The lead frame is disposed in a peripheral area of the pair of crystal terminals and the ic chip in an approximately same surface as the one surface of the flat container of the crystal unit.
Nihon Dempa Kogyo Co., Ltd.
Methods of controlling clocks in system on chip including function blocks, systems on chips and semiconductor systems including the same
A system-on-chip includes a clock controller configured to decrease an operating frequency of at least one function block based on a change in an operating state of the at least one function block from an active state to an idle state. In a method of operating a system-on-chip including at least one function block, an operating frequency of the at least one function block is decreased based on a change in an operating state of the at least one function block from an active state to an idle state.
Semiconductor device having plural memory chip
A semiconductor device includes a stacked plurality of memory chips. The memory chips each include a plurality of memory banks, a plurality of read/write buses that are assigned to the respective memory banks, and a plurality of penetration electrodes that are assigned to the respective read/write buses and arranged through the memory chip.
Ps4 Luxco S.a.r.l.
Led package structures for preventing lateral light leakage and manufacturing the same
An led package structure for preventing lateral light leakage includes a substrate unit, a light-emitting unit, a light-transmitting unit and a light-shielding unit. The substrate unit includes a circuit substrate.
Brightek Optoelectronic Co., Ltd.
The light-emitting device of the disclosure includes at least one led chip and a mounting substrate. The mounting substrate includes: a ceramic substrate; a reflection layer situated on a second surface on the opposite side of the ceramic substrate from a first surface; and a gas barrier layer covering the reflection layer.
Vertical led chip package on tsv carrier
A light-emitting device (led) package component includes a carrier wafer. The carrier wafer includes a first through-substrate via (tsv) configured to electrically connecting features on opposite sides of the carrier wafer.
Tsmc Solid State Lighting Ltd.
Secure data exchange method, and communication device and system implementing same
The invention relates to a method for securely exchanging data (5) between a communication device (1) and a server (8) of a service provider (2) via a communication network (3), the communication device (1) enabling at least one user (13) of the communication device (1) to use the services (4) provided by said service provider (2), said method being characterized in that it includes the following steps for exchanging data (5) between the communication device (1) and at least one server (8) of the service provider (2): in order to send the data (5), encrypting at least a portion of the sent data (5) using a physical key (7) which is known to the service provider (2) and which is physically written in a read-only memory of an electronic chip (6) of the communication device (1); and, upon receiving the data (5), decrypting the received data using said physical key (7).. .
Methods and systems for using built-in standard curve to measure molecular numbers of biological components
Methods and devices are disclosed, which perform absolute quantification assay of functional components of biological specimens. The present application relates to manufacture built-in standard curve(s) and computational analysis.
W2 Biosolutions, Llc
Method and the isolation of motile sperm
A system for separating motile and non-motile sperm comprises a microvolume into which a fluid containing sperm is delivered, at least partly defined by a wall which includes a termination or a change in angle away from the microvolume, defining an exit from the microvolume. Sperm delivered into the microvolume in a fluid that are motile move entrained along the wall and leave the wall at the termination with an outward turn to or towards a collection reservoir or passage from the microvolume.
Auckland Uniservices Limited
Microfluidic chips with optically transparent glue coating and a manufacturing microfluidic chips with optically transparent glue coating for a microfluidic device
A microfluidic chip for a microfluidic system includes a pdms substrate having a first thickness, at least one microfluidic pathway in the substrate, a coating along the microfluidic pathway, and a glass layer having a second thickness on the substrate and above the microfluidic pathway, wherein the coating contains an optically transparent material, and the first thickness is greater than the second thickness. The coating includes cyanoacrylates, an uv curable epoxy adhesive, a gel epoxy or epoxy under trade name of epo-tek 0g175, masterbond ep30lv-1 or locite 0151..
Method of continuously manufacturing microfluidic chips with bopet film for a microfluidic device and microfluidic chips with bopet film
A microfluidic chip includes a thin biaxially-oriented polyethylene terephthalate (“bopet”) film and a micro-channel in the bopet film. A method for manufacturing a microfluidic chip includes coating uv epoxy on a first side of a bopet film, placing the bopet film on a first substrate with the first side facing the first substrate, curing the uv epoxy on the first side of the bopet film to attach the bopet film on the first substrate; forming at least one microfluidic pathway in the bopet film, coating uv epoxy on a first side of a second substrate, placing the second substrate on the bopet film with the first side of the second substrate facing a second side of the bopet film, and curing the uv epoxy on the first side of the second substrate to attach the bopet film to the second substrate.
Memory chip, memory device, and reading method
A memory chip includes a memory cell array having a plurality of memory cells connected to word lines and bit lines, and a sense amplifier configured to detect data stored in a memory cell that is connected to a selected one of the word lines and a selected one of the bit lines, and a control circuit configured to read data from the memory cell in a first read mode when a first command is received and in a second read mode when a second command is received. A peak or an average value of an operation current that is flowing between power supply and ground terminals of the memory chip during a read operation in the first read mode is less than a peak or an average value of the operation current during a read operation in the second read mode..
Kabushiki Kaisha Toshiba
Memory module and manufacturing method thereof
A memory module includes a printed circuit board; first memory chips disposed in parallel with a long axis of the printed circuit board along a first column; second memory chips disposed in parallel with the long axis of the printed circuit board along a second column; and passive elements disposed between the first memory chips and the second memory chips, wherein the passive elements are connected between input/output pins of each of the first and second memory chips and tap pins.. .
Samsung Electronics Co., Ltd.
Led module, lighting device, and lamp
An led module includes: an opaque substrate on which a wiring circuit is provided; a submount bonded to a surface of the opaque substrate with a first bond; an led chip bonded with a second bond to an opposite side of the submount from the opaque substrate; and wires electrically connecting the led chip to patterned wiring circuit. In the led module, the first bond and the second bond each allow light emitted from the led chip to pass therethrough.
Multichip module with stiffening frame and associated covers
A multichip module includes a carrier, a stiffening frame, a plurality of semiconductor chips, and a plurality of covers. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard.
International Business Machines Corporation
There is disclosed current-mode time-interleaved sampling circuitry configured to be driven by substantially sinusoidal clock signals. Such circuitry may be incorporated in adc circuitry, for example as integrated circuitry on an ic chip.
Fujitsu Semiconductor Limited
Method of driving led chips of same power but different rated voltages and currents
A method of driving led chips of same power but different rated voltages and currents includes the following steps: set a predetermined power; provide a led chip which has a rated power accordant to the predetermined power; measure the led chip to obtain a working current thereof while the led chip is operated; provides a driving current to the led chip, and maintain the driving current the same as the working current.. .
Hep Tech Co., Ltd.
Packaging dram and soc in an ic package
An integrated circuit package including a first substrate, a first die, a second die, a second substrate, and a system on chip. The first substrate includes a first portion including first connections, a second portion including no connections, a third portion including second connections, a first opening between the first portion and the second portion, and a second opening between the second portion and the third portion.
Marvell World Trade Ltd.
The present optical module includes a sensor configured to pick up an image of an image pickup object, and a memory chip configured to store pixel data read out from the sensor and having the sensor joined thereto. The memory chip is connected to a substrate by a connection portion by flip-chip connection.
System on chip including built-in self test circuit and built-in self test method thereof
A system on chip is provided which performs a built-in self-test operation using an error access pattern. The system on chip includes a master device and a slave device.
Samsung Electronics Co., Ltd.
Memory controller, memory module and memory system
A memory module, comprising: a first pin, arranged to receive a first signal; a second pin, arranged to receive second signal; a first conducting path, having a first end coupled to the first pin; at least one memory chip, coupled to the first conducting path for receiving the first signal; a predetermined resistor, having a first terminal coupled to a second end of the first conducting path; and a second conducting path, having a first end coupled to second pin for conducting the second to a second terminal of the predetermined resistor; wherein the first signal and the second are synchronous and configured to be a differential signal, for enabling a selected memory chip from the at least one memory chip to be accessed.. .
Method for managing storage system using flash memory, and computer
To facilitate the management of a storage system that uses a flash memory as a storage area. A controller of the storage system provided with a flash memory chip manages a surplus capacity value of the flash memory chip, and transmits a value based on the surplus capacity value to a management server, on the basis of at least one of a definition of a parity group, a definition of an internal lu, and a definition of a logical unit.
Nonvolatile memory package and nonvolatile memory chip
A nonvolatile memory package of an embodiment includes: a data terminal configured to receive a write command for a data; a first ce terminal; a second ce terminal; a ce selection terminal; and a selector coupled to the first ce terminal and the second ce terminal. The selector outputs one of a first chip-enable signal and a second chip-enable signal based on a ce selection signal.
Kabushiki Kaisha Toshiba
Accessing independently addressable memory chips
A method of accessing rows and columns stored in a memory system that include memory chips that can be individually addressed and accessed is described. In order to leverage this capability, prior to performing a row-write request on the memory system, a computer system may transform the rows and the columns in a matrix.
Oracle International Corporation
Projection lens for use in an led module for a motor vehicle headlamp, and an led module and motor vehicle headlamp having a projection lens of this type
The invention relates to a projection lens for use in an led module of a motor vehicle headlamp. The led module has a light source in the form of an led matrix including numerous led chips disposed in a matrix adjacent to and/or above one another, a primary lens including numerous primary lens elements disposed in a matrix adjacent to and/or above one another for bundling light emitted from the light source, and a projection lens.
Automotive Lighting Reutlingen Gmbh
Light source board unit
Provided is an light source board unit enabling improved freedom in the shape and material for a resin part, suppression of increased costs, and compatibility of optical characteristics and physical characteristics. This light source substrate unit (1) is provided with a plurality of led chips (2) and a base material (10) having a plurality of recesses (10a) in which the led chips are mounted.
Sharp Kabushiki Kaisha
Disclosed are led assemblies and their applications. An example led assembly has an led chip, a supportive structure and a transparent structure.
Interlight Optotech Corporation
Flexible chip set encapsulation structure
A flexible chip set encapsulation structure includes a chip set. The chip set comprises a plurality of spaced chips and a fixing film.
Ghi Fu Technology Co., Ltd.
Semiconductor device and memory device
A semiconductor device includes a substrate, a controller chip, and memory chips. Wiring is formed on the substrate.
Kabushiki Kaisha Toshiba
Radiation hardened microelectronic chip packaging technology
A novel radiation hardened chip package technology protects microelectronic chips and systems in aviation/space or terrestrial devices against high energy radiation. The proposed technology of a radiation hardened chip package using rare earth elements and mulitlayered structure provides protection against radiation bombardment from alpha and beta particles to neutrons and high energy electromagnetic radiation..
U.s.a., As Represented By The Administrator Of The National Aeronautics And Space Administration
Light-emitting diode chip
An led chip is disclosed. The led chip includes a substrate and a semiconductor element formed on the substrate.
Lextar Electronics Corporation
Flexible led assemblies and led light bulbs
Disclosure has led assemblies and related led light bulbs. An led assembly comprises a flexible, transparent substrate, an led chip on the first surface and electrically connected to two adjacent conductive sections, and a first wavelength conversion layer, formed on the first surface to substantially cover the led chip.
Interlight Optotech Corporation
Light emitting diode package
A light emitting diode (led) package includes a substrate, a first electrode and a second electrode mounted on opposite sides of the substrate, an led chip mounted on a top surface of one of the electrodes and electrically connecting the first electrode and the second electrode by wire bonding, and a reflecting cup enclosing an outer periphery of the first electrode and the second electrode to expose top surfaces of the first electrode and the second electrode and bottom surfaces of the first electrode and the second electrode.. .
Advanced Optoelectronic Technology, Inc.
Led package and manufacturing process of same
A led package is formed of a substrate, an led chip, an insulated layer, and a fluorescent adhesive layer. The substrate includes a positive contact and a negative contact.
Lingsen Precision Industries, Ltd
A light-emitting structure includes a substrate and a light-emitting unit. The substrate has a first meander conductive track and a second meander conductive track.
Lite-on Technology Corporation
Polyimide film and wiring board
A polyimide film for production of a wiring board having a metal wiring, which is formed by forming a metal layer on one side (side b) of the polyimide film, and etching the metal layer; the polyimide film is curled toward the side (side a) opposite side b; and the curling of the polyimide film is controlled so as to reduce the drooping of the wiring board having a metal wiring formed thereon. The handling characteristics and productivity in ic chip mounting may be improved by the use of the polyimide film..
Ube Industries, Ltd.
Controller, memory system, and method
According to the embodiments, a controller includes an arbiter, a command fetch unit, and a processing unit. The arbiter executes a retrieval process.
Kabushiki Kaisha Toshiba
According to one embodiment, the memory controller outputs a first command, then outputs n pieces of second commands to first and second memory chips, and reads out the read data from the first and second memory chips. First time is for reading out the read data from a memory cell array to a buffer, and second time is for transferring data of the one-nth of the read data from the buffer to the memory controller.
Kabushiki Kaisha Toshiba
Multichip power semiconductor device
An electronic device includes a first chip carrier and a second chip carrier isolated from the first chip carrier. A first power semiconductor chip is mounted on and electrically connected to the first chip carrier.
Infineon Technologies Ag
Microfluidic-based gene synthesis
A method for synthesizing long dna constructs from oligonucleotide precursors directly within a microfluidic device uses several oligonucleotides at once. A precursor mix containing at least two oligonucleotide precursors with at least partial base complementarity is introduced into an input of a microfluidic chip and at least one cycle of at least one gene synthesis protocol is applied to fabricate a dna construct containing the sequence of at least two oligonucleotide precursors.
Massachusetts Institute Of Technology
An light emitting diode (led) module includes a circuit board, a plurality of led chips arranged on and electrically connected to the circuit board, and an encapsulant arranged on the circuit board and covering the led chips, a plurality of first recesses defined in a first surface of the circuit board.. .
Advanced Optoelectronic Technology, Inc.
Light emitting diode devices and methods with reflective material for increased light output
Light emitter devices and methods are provided herein. In some aspects, emitter devices and methods provided herein are for light emitting diode (led) chips and can include providing a substrate, a conductive trace over the substrate, and at least one or more direct attach led chip over the substrate.
Printed circuit board
Disclosed herein is a printed circuit board of a build-up structure in which an insulating layer and a circuit layer are stacked on a core layer, the core layer including: an electronic chip cavity in which an electronic chip is accommodated; and a dummy chip cavity in which a dummy chip is accommodated to offset warpage by the electronic chip.. .
Samsung Electro-mechanics Co., Ltd.
Overmolded substrate-chip arrangement with heat sink
An electronic device comprises a substrate, at least one electronic chip mounted on and electrically connected to the substrate and being configured as a system control unit for controlling a connected system, a heat removal structure thermally connected to the at least one electronic chip and configured for removing heat generated by the at least one electronic chip upon operation of the electronic device, and an overmolding structure configured for at least partially encapsulating at least the at least one electronic chip and the substrate.. .
Infineon Technologies Ag
Light emitting diode assembly and liquid crystal display device including the same
A liquid crystal display device includes a liquid crystal panel; and a backlight unit disposed under the liquid crystal panel and including an led assembly, wherein the led assembly includes a frame portion, led chips arranged in the frame portion in a line and spaced apart from each other, connecting portions each disposed between adjacent led chips and connected to adjacent led chips through wire bonding, and a sealing portion including a fluorescent substance and covering the led chips and the connecting portions, and wherein the sealing portion changes light emitted from the led chips into a linear light source.. .
Lg Display Co., Ltd.
Multichip package structure
A multichip package structure includes a metal substrate, a circuit substrate and a light-emitting module. The metal substrate has a first mirror plane area and a second mirror plane area.
Paragon Semiconductor Lighting Technology Co., Ltd.
Semiconductor arrangement, producing a semiconductor module, producing a semiconductor arrangement and operating a semiconductor arrangement
A semiconductor arrangement includes upper and lower contact plates and basic chip assemblies. Each chip assembly has a semiconductor chip having a semiconductor body with upper and lower spaced apart sides.
Infineon Technologies Ag
Stacked chip layout and making the same
A stacked chip layout includes a central processing chip has a first area and a first active circuit block over the central processing chip, the first active circuit block has a second area. The stacked chip layout further includes a second active circuit block over the first active circuit block, the second active circuit block has a third area, the second active circuit block partially overlaps the first active circuit block and exposes a portion of the first active circuit block.
Taiwan Semiconductor Manufacturing Company, Ltd.
Dense-pitch small-pad copper wire bonded double ic chip stack packaging piece and preparation method therefor
A dense-pitch small-pad copper wire bonded double ic chip stack package comprises a plastic package body, in which a lead frame carrier and a frame lead inner pin are arranged; the upper surface of the lead frame carrier is fixedly connected with a first ic chip; a second ic chip is stacked on the first ic chip; the upper surface of the first ic chip and the upper surface of the second ic chip are respectively provided with a plurality of pads which are arranged as two lines of pad groups in parallel; the two pad groups are respectively a first pad group and a second pad group; a metal ball is implanted on each pad; each metal ball is connected with a first copper bonding ball; and a third copper bonding wire is formed by looping and arching on a corresponding metal ball between the second ic chip and the first ic chip. The preparation process of the present invention comprises thinning, scribing, loading the chip, performing pressure welding, plastic packaging and post-curing, trimming, electroplating, printing, forming and separating, and packaging.
Huatian Technology (xi'an) Co., Ltd.
Functionalised redistribution layer
An electronic device which comprises at least one interconnect, a semiconductor chip comprising at least one electric chip pad, an encapsulant structure packaging at least a part of the semiconductor chip, and an electrically conductive redistribution layer arranged between and electrically coupled with the at least one interconnect and the at least one chip pad, wherein the redistribution layer comprises at least one adjustment structure configured for adjusting radio frequency properties of a transition between the semiconductor chip and its periphery.. .
Infineon Technologies Ag
An light emitting diode (led) module includes a circuit board, a set of led chips formed on and electrically connected to the circuit board, and an encapsulant arranged on the circuit board and covering the led chips, a set of first recesses defined in a top surface of the encapsulant.. .
Advanced Optoelectronic Technology, Inc.
Ceramic circuit board and led package module using the same
A ceramic circuit board includes a substrate made of al2o3 or aln and having an exterior surface and a groove recessed from the exterior surface. The groove has a bottom surface provided with a roughness ra of 1-20 μm, a plurality of crests and a plurality of troughs.
Ibis Innotech Inc.
Package of light emitting diode chips
The present invention provides a package of led chips. The package comprises a transparent plate having a front surface and a rear surface, a plurality of led chips disposed on the front surface, two opposite front surface reflective walls disposed on the front surface and located at two opposite outsides of the plurality of led chips, a front surface phosphor gel filling between the two opposite front surface reflective walls, two opposite rear surface reflective walls disposed on the rear surface and a rear surface phosphor gel filling between the two opposite rear surface reflective walls.
An antenna module includes a base including two opposing mounting surfaces, an antenna coil provided on or in the base so as to define an opening, the antenna coil having a shape that is symmetrical or substantially symmetrical with respect to a reference plane, and an ic chip and a plurality of electronic components mounted on one of the mounting surfaces and electrically coupled to the antenna coil, the ic chip and the electronic components being arranged inside the opening when viewed in plan from a normal direction of the mounting surface. At least two of the plurality of electronic components are arranged so as to be symmetrical or substantially symmetrical to each other with respect to the reference plane when viewed in plan from the normal direction..
Murata Manufacturing Co., Ltd.
An rfid tag including an inlay having a sheet-like shape and including an antenna and an ic chip electrically connected to the antenna, an outer covering member that covers the inlay, the outer covering member having a planar shape and including a main surface and a rear surface, and a frame part arranged on at least one of the main surface and the rear surface. The frame part is erected in a thickness direction of the outer covering member.