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 Power supply system patent thumbnailnew patent Power supply system
A chip set is configured such that a first overcurrent signal that is output at the time when there is an overcurrent in a first semiconductor switch or a third semiconductor switch and a second overcurrent signal that is output at the time when there is an overcurrent in a second semiconductor switch or a fourth semiconductor switch are input to input ports of an arithmetic processing unit.. .
Toyota Jidosha Kabushiki Kaisha


 Device including magnetoresistive element and memory chip patent thumbnailnew patent Device including magnetoresistive element and memory chip
According to one embodiment, a device including a magnetoresistive element is disclosed. The device includes a substrate, a second layer provided on the substrate and including a magnetic material, and a third layer provided on a top or bottom of the second layer and including a material having a negative coefficient of thermal expansion..
Kabushiki Kaisha Toshiba


 Light emitting device and illumination device patent thumbnailnew patent Light emitting device and illumination device
A light emitting device which emits a secondary light with high color purity and has a fast response speed is obtained. A ksf phosphor (15) which absorbs a part of blue light and emits red light and a casn phosphor (16) are distributed in a resin (14) which seals an led chip (13) which emits the blue light.
Sharp Kabushiki Kaisha


 Package of led chip and manufacturing method thereof patent thumbnailnew patent Package of led chip and manufacturing method thereof
The present invention discloses a package of the led chip and the related manufacturing method. The present invention is related to the led package process.
Shanghai Oppellighting Co., Ltd.


 Memory system and operating method thereof patent thumbnailnew patent Memory system and operating method thereof
A memory system includes a memory device including a plurality of memory chips each including a plurality of memory blocks grouped as one or more super blocks, wherein the memory blocks each include a plurality of pages suitable for storing write data requested from a host, and a controller suitable for checking a size of the write data and free pages of the super blocks, determining a first super block corresponding to the checked size of the write data based on the checked free pages among the super blocks, and programming the write data in memory blocks of the first super block.. .
Sk Hynix Inc.


 Sealed infrared imagers and sensors patent thumbnailnew patent Sealed infrared imagers and sensors
The architecture, design and fabrication of array of suspended micro-elements with individual seals are described. Read out integrated circuit is integrated monolithically with the suspended elements for low parasitics and high signal to noise ratio detection of changes of their electrical resistance.

 Serum/plasma micrornas and uses thereof patent thumbnailnew patent Serum/plasma micrornas and uses thereof
This invention provides a combination of micrornas for evaluating the physiological and/or pathological condition of a subject, wherein the combination comprises all detectable micrornas stably existing in the serum/plasma of a subject; and a method for evaluating the physiological and/or pathological condition of a subject, wherein the method includes determining all detectable micrornas stably existing in the serum/plasma of a subject; and a kit for evaluating the physiological and/or pathological condition of a subject, wherein the kit contains the tools for determining all detectable micrornas that stably existing in the serum/plasma of a subject; and a biochip for evaluating the physiological and/or pathological condition of a subject, wherein the biochip contains the components for determining all detectable micrornas stably existing in the serum/plasma of a subject. The aforementioned combination, method, kit and biochip can be used for diagnosis as well as differentially diagnosis of diseases including various tumors; various acute/chronic infectious diseases, e.g.
Jiangsu Mingma Biotech Co., Ltd.


 Apparatus and  generating a network on chip in an electronic device patent thumbnailApparatus and generating a network on chip in an electronic device
According to an exemplary embodiment of the present disclosure, a method of generating a network-on-chip (noc) in an electronic device includes clustering a plurality of cores based on total communication energy comprising first communication energy between a plurality of voltage-frequency-islands (vfis) and second communication energy inside the plurality of vfis.. .
Research & Business Foundation Sungkyunkwan University


 System on chip (soc) and devices having the soc patent thumbnailSystem on chip (soc) and devices having the soc
A system on chip structured in a second network device is provided. The system on chip includes: a first resource which is structured as at least one of hardware and software; a resource management module; and a processor configured to control or execute the resource management module to monitor a state of the first resource, and manage a sharing condition of the first resource to be shared by a first network device and the second network device and shared information of at least one second resource which is hardware and/or software, currently shared by the second network device and a third network device..
Samsung Electronics Co., Ltd.


 Semiconductor device comprising analog to digital converters sharing reference capacitor and system on chip comprising the same patent thumbnailSemiconductor device comprising analog to digital converters sharing reference capacitor and system on chip comprising the same
Provided are a semiconductor device and a system on chip (soc). The semiconductor device includes a reference capacitor that receives a reference voltage from a reference voltage generator, a first successive approximation register analog-to-digital converter (sar adc), for converting a first analog signal into a first digital signal, using a first sampling capacitor that has a first capacitance and is connected to the reference capacitor through a first switching element, and a second sampling capacitor that has a second capacitance that is less than that of the first sampling capacitor, connected to the reference capacitor through a second switching element, a second sar adc, for converting a second analog signal into a second digital signal, using a third sampling capacitor that has a third capacitance, connected to the reference capacitor through a third switching element, and a fourth sampling capacitor that has a fourth capacitance that is less than that of the third sampling capacitance connected to the reference capacitor through a fourth switching element, and a controller configured to connect the first switching element and the third switching element to the reference capacitor at different times..

Led cap containing quantum dot phosphors


An led device has a cap containing one or more quantum dot (qd) phosphors. The cap may be sized and configured to be integrated with standard led packages.
Nanoco Technologies Ltd.


Printed wiring board for package-on-package


A printed wiring board for package-on-package includes a first insulating layer, a wiring layer including a conductor pattern and formed on first surface of the first insulating layer, a second insulating layer formed on first surface side of the first insulating layer, electrodes formed in through holes of the first insulating layer respectively such that the electrodes electrically connect to the conductor pattern and have exposed surfaces exposed from second surface of the first insulating layer, first pads formed on the second insulating layer and positioned to connect an ic chip in center portion of the second insulating layer, second pads formed on the second insulating layer and positioned in outer edge portion of the second insulating layer to connect a second printed wiring board, and via conductors formed in the second insulating layer such that the via conductors electrically connect the first and second pads to the conductor pattern.. .
Ibiden Co., Ltd.


Reduced load memory module


An apparatus relates generally to a reduced load memory module. In such an apparatus, there is a circuit platform with a plurality of memory chips coupled to the circuit platform.
Invensas Corporation


Stack memory device and operating same


The present invention provides a stack memory device and a method for operating same. The stack memory device, according to the present invention, is provided with: a first memory chip in which first type memory cells are repeatedly arranged in row direction and column direction, and which comprises one or more cell arrays, in which a dump line is connected to the each first type memory cell; and a second memory chip in which second type memory cells are repeatedly arranged in row direction and column direction, and which comprises one or more cell arrays, in which a dump line is connected to the each second type memory cell, wherein first pads are connected to the dump lines of the first type memory cells and second pads are connected to the dump lines of the second type memory cells, the first pads and the second pads having one-to-one correspondence..
Siliconfile Technologies Inc.


Payment card storing tokenized information


Provided are a payment card, system and method for storing and reading tokenized payment account information from a payment card. In an exemplary embodiment, a payment card may include a substrate forming a body of the payment card, and an electronic chip attached to or included in the substrate.
Mastercard International Incorporated


Ic module, ic card, and ic module substrate


Provided are an ic module, an ic card, and an ic module substrate that can reduce the manufacturing cost without degrading the external appearance of a contact terminal. An ic module includes a contact terminal (10) provided on a front surface (1a) of a base member (1) and having a contact surface, for contact with an external terminal, formed of a gold plating layer (14); an ic chip (55) attached to a back surface (1b) of the base member (1); a conductive member (a wire (60), a first conductive layer (20), and a second conductive layer (30)) connecting the ic chip (55) and the contact terminal (10) to each other through a through hole (3) opened at the front surface (1a) and the back surface (1b) of the base member (1); and an insulating surface material (40) partially covering the front surface (1a).
Toppan Printing Co., Ltd.


Design and verification of a multichip coherence protocol


A system includes a formal verification engine running on a host and a protocol checking engine. The formal verification engine automatically generates and formally verifies a reference specification that includes a plurality of extended state tables for an integrated circuit (ic) design protocol of a chip at architectural level.
Cavium, Inc.


Memory system


A memory system includes a memory and a controller. The memory includes a first memory chip and a second memory chip.
Kabushiki Kaisha Toshiba


System and distributed computing in non-volatile memory


A system and method are disclosed for incorporating mathematical and/or logical functionality within a memory system (such as a solid state drive (ssd)). The mathematical and/or logical functionality may comprise an arithmetic logic unit (alu).
Sandisk Technologies Llc


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Multichip dual write


Identical data is written to multiple nonvolatile memory chips connected to a memory bus by sending address information to a first nonvolatile memory chip and a second nonvolatile memory chip, selecting the first and second nonvolatile memory chips, while the first nonvolatile and second nonvolatile memory chips are both selected, sending user data over the memory bus to the first and second nonvolatile memory chips in parallel, and programming the user data in the first nonvolatile memory chip and the second nonvolatile memory chip in parallel.. .
Sandisk Technologies Inc.


Channel scan architecture for multiple stimulus multi-touch sensor panels


A channel scan architecture for detecting touch events on a touch sensor panel is disclosed. The channel scan architecture can combine drive logic, sense channels and channel scan logic on a single monolithic chip.
Apple Inc.


Sample preparation analysis of platelet proteins


The present invention provides a novel method of in vitro sample preparation for the analysis of proteins. In a first aspect, the present invention is a method comprising the separation and individual treatment of blood platelets and platelet-poor plasma obtained from a platelet-rich plasma sample.
Randox Laboratories Ltd


Nucleic acid ligand diagnostic biochip


A nucleic acid ligand “biochip” is disclosed, consisting of a solid support to which one or more specific nucleic acid ligands is attached in a spatially defined manner. Each nucleic acid ligand binds specifically and avidly to a particular target molecule contained within a test mixture, such as a bodily fluid.
Somalogic, Inc.


Positive temperature coefficient heating assembly and defroster for a vehicle


A positive temperature coefficient heating assembly includes a heating core including a first metal electrode plate, a second metal electrode plate and a plurality of ptc ceramic chips; an insulating layer coated on the heating core; and a metal tube; the ptc ceramic chip includes a positive electrode layer, a negative electrode layer, and a ceramic sintered layer; a plurality of first limit grooves are formed in the first metal electrode plate, a plurality of second limit grooves are formed in the second metal electrode plate, a first end of each of the ptc ceramic chips is embedded in one of the first limit grooves, and a second end of each of the ptc ceramic chips is embedded in one of the second limit grooves.. .
Byd Company Limited


Integrated control for silicon photonics


In an example, the present invention includes an integrated system on chip device. The device is configured on a single silicon substrate member.
Inphi Corporation


Led package structure and manufacturing method thereof


A manufacturing method of an led package structure includes the steps of providing a base; disposing an led chip on the base; electrically connecting the base and the led chip by at least one metal wire, wherein the metal wire has an apex, and a height between the apex and a top surface of the led chip is defined as a loop height; adhering a first phosphor sheet to the led chip by a b-stage resin of the first phosphor sheet, wherein the first phosphor sheet covers the top surface, the side surface, and the electrode of the led chip, the thickness of the first phosphor sheet is smaller than the loop height, and the apex of the metal wire is exposed from the first phosphor sheet; and disposing an encapsulation resin in the base to encapsulate the led chip, the metal wire, and the first phosphor sheet.. .
Lite-on Technology Corporation


Led light source and manufacturing method thereof


The present invention is related to a led light source and its manufacturing method. It is related to the led technology field.
Shanghai Oppellighting Co., Ltd.


Led module


An led module includes a mount board and an led chip. The mount board includes: an insulation substrate that includes resin and glass; a first conductor, a second conductor and a third conductor; and a white resist layer.
Panasonic Intellectual Property Management Co., Ltd.


Removal of integrated circuit chips from a wafer


Upon a wafer, integrated circuit (ic) chips are separated by a kerf that includes a through kerf via (tkv). The chips are removed from the wafer and separated from each other by removing the tkv.
Globalfoundries Inc.


Led lighting apparatus


An led lighting apparatus includes an led light-emitting unit, a radar detector, a controller, and a translucent cover. The led light-emitting unit has a plurality of led chips.
Rohm Co., Ltd.


Non-magnified led for high center-beam candle power


Light emitting diode components are disclosed that utilize a thin, substantially flat or undomed encapsulant in order to achieve the desired emission profile to increase luminance and/or center beam candle power. Some embodiments of the devices include encapsulants, which result in an apparent source image, which does not exceed 2× the source size.
Cree, Inc.


Led emitter packages with high cri


A color-tunable led emitter with high cri can be made by mounting multiple led chips onto a ceramic substrate that has been patterned with metal contacts and paths so as to connect the led chips into multiple independently addressable led groups. Each led group can produce light of a different color, allowing the color of the emitter to be tuned by adjusting the relative amount of operating current supplied to each led group.
Ledengin, Inc.


Compartment shielding in flip-chip (fc) module


Ground shielding is achieved by a conductor shield having conductive surfaces that immediately surround individual chips within a multichip module or device, such as a multichip module or device with flip-chip (fc) bumps. Intra-module shielding between individual chips within the multichip module or device is achieved by electromagnetic or radio-signal (rf) isolation provided by the surfaces of the conductor shield immediately surrounding each of the chips.
Qualcomm Incorporated


Integrated circuit barrierless microfluidic channel


A structure and method for fabricating a continuous cooling channel in the back end of line wiring levels of an integrated circuit (ic) chip is provided. This continuous cooling channel may provide a path for a cooling source such as a fluid pumped from an external fluidic-cooling circulation driver to make physical contact locally with and cool the back end levels within the ic chip that may generate heat as a byproduct of the ic device's routine operations.
International Business Machines Corporation


Dynamic approximate storage for custom applications


A memory chip for dynamic approximate storage includes an array of memory cells associated with at least two regions. The chip further includes at least one threshold register for storing values for thresholds for memory cells corresponding to each of the at least two regions; and control logic to programmatically adjust the values for the thresholds for the memory cells.
Microsoft Technology Licensing, Llc


Front/back control of integrated circuits for flash dual inline memory modules


In one implementation, flash memory chips are provided with an operating power supply voltage to substantially match a power supply voltage expected at an edge connector of a dual inline memory module. The one or more of the flash memory chips and a memory support application integrated circuit (asic) may be mounted together into a multi-chip package for integrated circuits.
Virident Systems, Inc.


Integrated circuit board and display apparatus


There is provided an ic board and a display apparatus. Switching components (01; 02) are added between the internal interfaces (j1, j2 .
K-tronics (su Zhou) Technology Co., Ltd.


Reconfigurable sensor unit for electronic device


An electronic device includes a printed circuit board (pcb) having at least one conductive trace thereon. A system on chip (soc) is mounted on the pcb and electrically coupled to the conductive trace.
Stmicroelectronics, Inc.


Led lighting apparatus


Provided is a light emitting diode (led) lighting apparatus. The led lighting apparatus includes a printed circuit board (pcb) having a plate-shaped structure with an opened center portion; an led chip mounted on a surface of the pcb; a ventilation unit including an end portion having an opening, other end portion coupled to the opened center portion of the pcb, and an air flowing passage connecting the opening and the opened center region of the pcb to each other; a heat sink coupled to the other surface of the pcb so as to cool down heat generated from the led chip; a cover member including an air flowing hole corresponding to a location of the opening and covering partially the pcb, the led chip, the ventilation unit, and the heat sink; and a base including a ventilation hole that is capable of connecting to the air flowing path and coupled to the cover ember so as to cover remaining parts of the pcb, the led chip, the ventilation unit, and the heat sink..
Icepipe Corporation


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Addition-curable silicone resin composition and die attach material for optical semiconductor device


An addition-curable silicone resin composition includes (a-1) a linear organopolysiloxane having at least two alkenyl groups per molecule, (a-2) a terminal alkenyl group-containing branched organopolysiloxane having at least two alkenyl groups per molecule, (b) an organohydrogenpolysiloxane with a content of low-molecular-weight siloxane having a degree of polymerization of up to 10 and one or more terminal sih group per molecule of 5 wt % or less, and (c) an addition reaction catalyst. The composition can be cured to form a product which, when used as a die attach material for optical semiconductor devices, minimizes contamination of the gold electrode pads on led chips and imparts a good wire bondability..
Shin-etsu Chemical Co., Ltd.


Led integrated packaging structure and method


An led integrated packaging structure is disclosed including a base; at least one led chip which is fixedly connected on the base, the led chip having positive and negative electrodes; an insulation layer which is disposed on surfaces of the base and the led chip and the, wherein surfaces of the positive and negative electrodes of the led chip are exposed from the insulation layer; at least two connecting electrodes which are disposed on the base and the led chip.. .
Dm Lighting Technologies Inc.


Semiconductor chip stacking assemblies


Embodiments of the invention provide semiconductor chip stacking assemblies that provide direct attachment of a first semiconductor device with a second semiconductor device. An assembly comprises a first semiconductor chip that has a first and a second set of electrical interconnect regions disposed on its surface and a second semiconductor chip.
Intel Corporation


Light-emitting diode chip package


A light-emitting diode chip package is provided. The light-emitting diode chip package includes a substrate; a light-emitting diode chip set (led chip set) disposed over the substrate, wherein the led chip set is formed by a plurality of light-emitting diode chips (led chips) in one piece; and at least two electrodes disposed over the substrate and electrically connected to the led chip set..
Lextar Electronics Corporation


Information processing system, control information processing device, and program


There is provided an information processing system that includes an information processing terminal equipped with an ic chip capable of non-contact communication with a reader/writer, a data provider device that stores a first data record for creating service data, and a control information processing device that creates the service data and transmits the service data to the information processing terminal. The information processing terminal includes a terminal communication portion that acquires the first data record from the data provider device and transmits the first data record to the control information processing device.
Felica Networks, Inc.


Stereoscopic display device, lcd panel, and array substrate


A stereoscopic display device, an lcd panel, and an array substrate are provided. The array substrate includes gate lines, share lines, and a switching circuit including a vertical switching circuit, a first switch, a second switch, and an inverter.
Shenzhen China Star Optoelectronics Technology Co. , Ltd.


Photonic chip surface grating coupler (sgc)-based optical splitter and optical combiner


An optical device comprising an optical interface comprising an optical waveguide disposed on a surface of a substrate, wherein the optical waveguide comprises a wide middle portion that tapers to two opposite narrow ends along a first direction and a second direction of light propagation opposite to the first direction, a diffraction grating disposed at about the wide middle portion of the optical waveguide, and an optical fiber in optical communication with the optical waveguide and the diffraction grating, wherein the optical fiber is positioned at about perpendicular to the surface and directed towards the diffraction grating to cause an incoming light signal from the optical fiber to split into a first portion and a second portion through a diffraction at the diffraction grating, and wherein the diffraction causes the first portion to propagate along the first direction and the second portion to propagate along the second direction.. .
Huawei Technologies Co., Ltd.


Biological chip systems


A biological chip system is provided in which execution, cleaning, scanning, and/or drying are all integrated and automated. According to one embodiment, the system employs an execution system, a first mobile structure movable, a second mobile structure, a third mobile structure, at least two fluid paths, a fluid control system, a cleaning device, a biochip scanning system, and/or a computer control system.

Capillary device for separation and analysis, microfluidic chip for separation and analysis, analysis proteins or peptides, electrophoresis instrument, and microfluidic chip electrophoresis instrument for separation and analysis


A method for analyzing a protein and a peptide, includes: providing a capillary for isoelectric focusing; providing a capillary device for separation and analysis having the capillary and a solid-phase extraction column being unified as a single tube-like structure; providing an electrophoresis instrument having the capillary device and the mechanism regulating the pressure difference at both ends of the capillary device; introducing a sample containing a target protein or peptide into the solid-phase extraction column to let the target protein or peptide be adsorbed on the column, and filling the capillary device with a carrier ampholyte solution; starting separation by isoelectric focusing after eluting the target protein or peptide by filling the solid-phase extraction column with electrode solution or acid or base solution, or after firstly eluting the target protein or peptide with an eluting solution containing carrier ampholyte and secondly filling the solid-phase extraction column with electrode solution or acid or base solution; and focusing the eluted target protein or peptide in the capillary for isoelectric focusing.. .
Nichiei Industry Co., Ltd.


Airflow heatsink for led devices


Disclosed is an led lighting system with improved airflow and heat dissipation qualities. In one embodiment, the system comprises a heatsink mounted to an led chip, and a fan assembly blowing air into the heatsink.

Multi-refraction led lamp


Disclosed is a multi-refraction led lamp composed of a lamp holder, a lamp body, a heat sink member, a circuit board, an aluminium substrate, an led chip, a light-permeable cover and a glass shell, wherein the lamp holder is tightly fixed at a lower end of the lamp body, the heat sink member is integrally injection-moulded on an inner wall of the lamp body, the circuit board is mounted in the lamp body, the aluminium substrate is snap-fastened inside the lamp body and located above the circuit board, the led chip is mounted on the aluminium substrate, the light-permeable cover is fixed in the lamp body and covers the aluminium substrate, the glass shell is fixed on the lamp body and covers the light-permeable cover, and the lamp holder is electrically connected to the led chip via the circuit board.. .
Star Electrical Equipment Co., Ltd.


Diagnostic apparatus and diagnostic method using the same


Provided is a diagnostic apparatus. The diagnostic apparatus includes a microfluidic chip including first and second measurement parts for respectively measuring an amount of hemoglobin and an active degree of an enzyme within a blood sample.
Access Bio, Inc.


Microfluidics sorter for cell detection and isolation


An interface comprising: a plurality of external ports configured to fluidically communicate with a plurality of ports of a fluidic delivery platform; and a plurality of engaging conduits configured to fluidically communicate with a plurality of ports of a microfluidic biochip, wherein a tolerance of both the plurality of external ports and/or the plurality of engaging conduits is significantly tighter than a tolerance of the plurality of ports of the microfluidic biochip.. .
Clearbridge Biomedics Pte Ltd


Radio-frequency integrated circuit (rfic) chip(s) for providing distributed antenna system functionalities, and related components, systems, and methods


Radio-frequency (rf) integrated circuit (rfic) chip(s) allow for the integration of multiple electronic circuits on a chip to provide distributed antenna system functionalities. Rfic chips are employed in central unit and remote unit components, reducing component cost and size, increasing performance and reliability, while reducing power consumption.
Corning Optical Communications Wireless Ltd


Semiconductor light-emitting device


A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor led chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor led chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.. .
Samsung Electronics Co., Ltd.


Multichip stacking package structure and manufacturing the same


The present invention relates to a multichip stacking package structure and a method for manufacturing the same, wherein the multichip stacking package structure comprises a substrate including a plurality of electrical connecting pad; a first chip with a lower surface stacked on the substrate; a second chip stacked on an upper surface of the first chip by a interlaced reciprocation stacking way; a spacer stacked on an upper surface of the second chip by the interlaced reciprocation stacking way; and third chip stacked on the an upper surface of the spacer by the interlaced reciprocation stacking way, so that a first spacing is formed between an end of the third and an end of the spacer. Thereby, a position of a stress point is changed to reduce a risk of the chip crack during wire bonding..
Dawning Leading Technology Inc.


Cog dielectric composition for use with nickel electrodes


Multilayer ceramic chip capacitors which satisfy cog requirements and which are compatible with reducing atmosphere sintering conditions so that non-noble metals such as nickel and nickel alloys may be used for internal and external electrodes are disclosed. The capacitors exhibit desirable dielectric properties (high capacitance, low dissipation factor, high insulation resistance), excellent performance on highly accelerated life testing, and very good resistance to dielectric breakdown.
Ferro Corporation


Tone-based wake up circuit for card reader


A card reader for a point-of-sale system that is configured to accept both magnetic strip-type and integrated circuit (ic) chip-type payment cards. The card reader is a component of a point-of-sale system including a portable computing device in communication with the card reader that is configured to present a first graphical user interface (gui) when a magnetic stripe-type card is detected and a second gui when an ic chip-type card is detected in the card reader.
Square, Inc.


Scheduling volatile memory maintenance events in a multi-processor system


Systems, methods, and computer programs are disclosed for scheduling volatile memory maintenance events. One embodiment is a method comprising: a memory controller determining a time-of-service (tos) window for executing a maintenance event for a volatile memory device coupled to the memory controller via a memory data interface; the memory controller providing a signal to each of a plurality of processors on a system on chip (soc) for scheduling the maintenance event; each of the plurality of processors independently generating in response to the signal a corresponding schedule notification for the maintenance event; and the memory controller determining when to execute the maintenance event in response to receiving one or more of the schedule notifications generated by the plurality of processors and based on a processor priority scheme..
Qualcomm Incorporated


Extended capacity memory module with dynamic data buffers


A memory module uses dynamic data buffers for providing extended capacity for computing systems. The memory module comprises an external interface having a first set of data pins and a second set of data pins.
Rambus Inc.


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Light bulb with led symbols


A light bulb with led symbols includes a light bulb shell, at least one led light source, a driver, and an electrical connector. The led light source includes electrodes and at least one led substrate with led chips mounted thereon.
Gean Technology Co. Limited


Miniaturized electrothermal flow induced infusion pump


A micropump that pumps liquid using electrothermally-induced flow is described, along with a corresponding self-regulating pump and infusion pump. The micropump has applications in microfluidic systems, such as biochips.
Cfd Research Corporation


Unidirectional induction type near field communication device


A unidirectional induction type near field communication device includes an induction layer having an ic chip embedded therein and an induction coil located on a front surface thereof, a wave-absorbing layer of laminated structure made of a mixture of polyester and a high-permeability metal material and bonded to a back surface of the induction layer opposite to the induction coil, and a metal barrier layer bonded to one side of the wave-absorbing layer opposite to the induction layer for enabling the induction layer to achieve a unidirectional nfc based wireless communication with an external mobile electronic device.. .
Winso Technology Company Limited


Method of manufacturing semiconductor device


To improve the reliability in applying a tape to the rear surface of a substrate while securing the heat resistance of the tape applied to the rear surface of the substrate. There is a gap between a bottom surface of a ditch provided in a support member and an upper surface of a driver ic chip.
Renesas Electronics Corporation


Composite protection circuit, composite protection element, and led device for illumination


A zener diode used as an esd protection element is connected in parallel to a circuit to be protected, for example an led chip. The zener diode is connected in parallel to an antifuse element.
Murata Manufacturing Co., Ltd.


Fluidic chip for flow cytometry and methods of use


The present disclosure in some embodiments provides a flow cell sorting system, a focus detection method, as well as a fluidic chip. In one aspect, the fluidic chip comprises a cover sheet and one or more substrate layers, and one or more channels in each of the fluidic chips.
Tsinghua University


Infrared detecting device


An infrared detecting device includes: an infrared sensor that has one or more infrared detection elements arranged in one or more columns; and an ic chip that performs signal processing on a signal output from the infrared sensor. The infrared sensor and the ic chip are generally juxtaposed in a direction along a scan rotation axis of the infrared sensor..
Panasonic Intellectual Property Management Co., Ltd.


Swept-source optical coherence tomography (ss-oct) system with silicon photonic signal processing element having matched path lengths


Aspects of the present disclosure are directed to architectures, methods and systems and structures having application to an interferometric optical system such as a swept-source optical coherence tomography (ss-oct) system including an optical processing element having dual-polarization and dual-balanced in-phase and quadrature processing and photodetection paths on a single integrated photonic chip wherein lengths of the paths are less than or equal to the spatial resolution of a laser source.. .

Metal powder paste and producing same


A method for producing a surface-treated metal powder, which comprises: a step for preparing a metal powder dispersion liquid by mixing a metal powder with an aqueous solution of a coupling agent having an amino group; a step for recovering, as a residue, the metal powder from the metal powder dispersion liquid; and a step for cleaning the metal powder, which has been re-covered as a residue, with use of an aqueous solvent. This method for producing a surface-treated metal powder provides a method for producing a surface-treated copper powder or metal powder which has excellent sintering delaying properties and is suitable for use in the production of an electrode for multilayer ceramic chip capacitors..
Jx Nippon Mining & Metals Corporation


Revolutionz the ultimate shoe


A workout system is provided. The workout system includes a pair of shoes and a handheld device.

Transponder aggregator photonic chip with common design for both directions


An optical transponder aggregator includes a plurality of photonic switch cells configured to collectively implement switching functions for either an add transponder aggregator or a drop transponder aggregator, a plurality of tap-monitors for control of the photonic switch cells; and a controller configured to change control roles of the tap-monitors, depending on whether the plurality of photonic switch cells collectively implements switching functions for the add transponder aggregator or for the drop transponder aggregator.. .

Bi-directional tap-monitor for optical add-drop photonic chip


A bidirectional optical tap-monitor is described for detecting an optical signal power carried by a through waveguide. The tap-monitor comprises a tap waveguide placed near the through waveguide, and a single waveguide-type photodetector for detecting a fraction of the optical signal power coupled from the tap waveguide.

Led packaging structure and manufacturing the same


An led package having a substrate, an led chip, a phosphor sheet and a first resin is provided. The led chip is disposed on the substrate.
Everlight Electronics Co., Ltd.


Method for manufacturing semiconductor display panel


A manufacturing method includes: attaching a film onto a bonding surface of a wafer; performing laser cutting on the wafer to obtain a plurality of semiconductor light-emitting eutectic chips; attaching light-emitting surfaces of the plurality of eutectic chips on to an expansion film; detaching films from bonding surfaces of the plurality of eutectic chips; performing wafer expansion on the expansion film so that the plurality of eutectic chips have the same intervals as chip loading spaces on a substrate; attaching the expansion film onto a tray, and moving the tray so that positions of the plurality of eutectic chips correspond to that of the chip loading spaces; moving the tray so that the plurality of eutectic chips approach the chip loading spaces on the substrate; and embedding the plurality of eutectic chips into the chip loading spaces so that the plurality of eutectic chips are electrically connected to the substrate.. .

Sintering materials and attachment methods using same


Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process.
Alpha Metals, Inc.


Packaged electronic device having reduced parasitic effects and method


In one embodiment, an electronic package includes a substrate having a die pad plurality of lands embedded within substrate encapsulant. An electronic chip including an electronic component is connected to the die pad.
Amkor Technology, Inc.


Memory module with packages of stacked memory chips


An apparatus is provided that includes a plurality of array dies and at least two die interconnects. The first die interconnect is in electrical communication with a data port of a first array die and a data port of a second array die and not in electrical communication with data ports of a third array die.
Netlist, Inc.


Method for determining the sizing of the transistors of an analog circuit


A method for determining electrical parameter values of the transistors of an analog circuit of a system on chip includes breaking the circuit down into a set of blocks connected to one another; establishing the wiring diagram of said circuit; defining a set of electrical constraints that are specific to said circuit, blocks and transistors of each block; defining electrical parameters of the circuit, block and transistors; selecting for each transistor of the circuit an operator for calculating the electrical parameter values of said transistor; generating structured diagrams of each block of the circuit from the defined constraints and the chosen operators; assembling said structured diagrams of blocks into a general diagram of the circuit; identifying whether there is any conflict; and, if so, emitting an alarm signal.. .
Universite Pierre Et Marie Curie (paris 6)


Method for managing storage system using flash memory, and computer


To facilitate the management of a storage system that uses a flash memory as a storage area. A controller of the storage system provided with a flash memory chip manages a surplus capacity value of the flash memory chip, and transmits a value based on the surplus capacity value to a management server, on the basis of at least one of a definition of a parity group, a definition of an internal lu, and a definition of a logical unit.
Hitachi, Ltd.


System on chip power management


An implementation of a system disclosed herein provides an apparatus, comprising a system on chip, wherein the system on chip is configured to receive a sleep command from a host and in response to the sleep command, calculate a primary checksum of a block of data from a low latency memory such as a tightly coupled memory (tcm), copy the primary checksum and the block of data into a volatile storage media, preserve interface variables of the system on chip in the volatile storage media, operate the volatile storage media in a self-refresh mode, and shut down power to other components on the system on chip.. .
Seagate Technology Llc


Negative chemically-amplified photoresist and imaging method thereof


Provided are a novel negative chemically-amplified photoresist and an imaging method thereof. The negative chemically-amplified photoresist comprises phenol resin, a photo-acid generator, a cross-linking agent, an alkaline additive, a sensitizing agent and a photoresist solvent, wherein the phenol resin is a host material of the novel negative chemically-amplified photoresist; the photo-acid generator is capable of generating an acid with a certain strength under illumination; and the cross-linking agent can undergo a condensation reaction with a phenolic hydroxyl group or an ortho-/para-hydroxymethyl functional group.
Kempur Microelectronics, Inc.


Borehole while drilling electromagnetic tomography advanced detection apparatus and method


A borehole while-drilling electromagnetic tomography advanced detection apparatus includes a site host, a drilling rig, a detecting pipe screwed coupling on one end to a drilling stem of the drilling rig, a drilling bit screwed coupling to the other end of the detecting pipe, wherein the detecting pipe is provided with a probe comprising a transmitting coil, a receiving coil, an electromagnetic transmitting module, an electromagnetic receiving module, a scm (single chip microcomputer), a 3d electronic compass, a network interface of the probe and a first memory, in which the memory port of the scm is connected to the first memory, and the network interface of the probe can be data-communicated with the site host.. .
Wuhan Changsheng Mine Security Technology Limited


Device and detecting, while using a microfluidic chip, the resistance of bacteria to an active substance to be analyzed


A device for detecting resistant bacteria includes a microfluidic chip, a detector and an analyzer. The microfluidic chip includes fluidic structures having a fluid inlet and an interaction chamber fluidically connected to the fluid inlet, and a labeled substrate that is immobilized inside the interaction chamber and enters into a verifiable interaction with bacterial factors of bacteria, so that by introducing a culture medium containing an active substance to be analyzed and the bacteria into the interaction chamber and by detecting the result of the verifiable interaction, it can be ascertained whether the bacteria are resistant to the active substance to be analyzed.
Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.


Micro-fluidic chip to perform surface plasmon resonance assays


A micro-fluidic chip comprises a chip base, a hemispherical or curved lens, and a securing portion. The chip base has a flow cell and a micro-fluidic channel defined therein.
Hitech Analytical And Diagnostic Solutions, Llc


Igniter assembly, airbag system, and detection system and detection same


An igniter assembly for which an igniter and a conductive igniter collar are integrated via an insulating layer, wherein the igniter comprises a metal eyelet, a metal cover that retains the eyelet therein, an ignition charge that is disposed in the cover and in a space in contact with an end face of the eyelet, a heating body that is connected to the end face of the eyelet, and a conductive pin that passes through the insulating layer and is electrically connected to the heating body. The other end of the conductive pin is exposed from the insulating layer so that a current supplying circuit is connected.
Daicel Corporation


Mems microphone


The present disclosure discloses a mems microphone including a mems chip, an asic chip and an injection molding package. The mems chip is stacked on and connected to the asic chip by a tsv connector.
Aac Technologies Pte. Ltd.


Master monitoring system for charging of super capacitor


A monitoring system for charging of a super capacitor, comprising three parts, i.e. A power line, monomer super capacitor monitoring subsystems and a master monitoring system, wherein the master monitoring system comprises a charging circuit (2), a power supply unit (7), a master single chip microcomputer (4), a carrier communication module (3), a human-machine interface module (5), a storage unit (6) and an rs-232 module (8); and each of the monomer super capacitor monitoring subsystems comprises a monomer super capacitor (1), a power supply unit (7), a slave single chip microcomputer (11), a carrier communication module (3), a voltage, current and temperature detection unit (9) and a storage unit (6).
China University Of Mining And Technology


Light-emitting device


Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of led chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion.
Panasonic Intellectual Property Management Co., Lt D.


White light emitting device having high color rendering


The present invention relates to a white light emitting device having high color rendering, and the white light emitting device is a white light emitting lamp comprising a blue led chip having an excitation wavelength of 440-460 nm, and a phosphor layer covering a light emitting surface of the blue led chip and excited by the excitation wavelength of the blue led chip so as to emit light, wherein the phosphor layer comprises a first phosphor having an emission peak wavelength of 480-499 nm; a second phosphor having an emission peak wavelength of 500-560 nm; and a third phosphor having an emission peak wavelength of 600-650 nm. According to aspects of the present invention, a white led chip having high color rendering can be provided, and particularly, the white light emitting device having high color rendering for specific colors such as r9 and r12 can be provided..
Glbtech Co., Ltd.


Led chip having esd protection


Disclosed herein is a light emitting diode chip having esd protection. An exemplary embodiment provides a flip-chip type light emitting diode chip, which includes a light emitting diode part aligned on a substrate, and a reverse-parallel diode part disposed on the substrate and connected to the light emitting diode part.
Seoul Viosys Co., Ltd


Microelectronic chip with multiple contacts


Said third antenna (3c) is connected in series with said second antenna (3) between the second contact (p2) and the fourth contact (p4) for transmitting the captured energy to the microelectronic chip (1) and coupled with the first antenna (3a) for transferring to the microelectronic chip (1) through the first antenna (3a) the energy captured by the second antenna (3b).. .

Data storage device and integrated bridge firmware to be retrieved from a storage system on chip (soc)


A data storage device may comprise a first non-volatile memory, configured to store storage system-on-chip (soc) data and protocol bridge data; a storage soc comprising circuitry configured to control the data storage device and to, upon power-on, retrieve the storage soc data from the first non-volatile memory and configure itself according to the retrieved storage soc data; a bus coupled to the storage soc; and a protocol bridge coupled to the bus and comprising circuitry configured to translate between a first and a second communication protocol and to, upon power-on, retrieve the protocol bridge data from the first non-volatile memory via the storage soc and the bus and configure itself according to the retrieved protocol bridge data.. .
Western Digital Technologies, Inc.


System on chip, managing power thereof, and electronic device


A system on chip includes an event manager configured to receive an event from an external source, an event analyzer configured to analyze the event received by the event manager to determine a voltage, a frequency, and power gating corresponding to the analyzed event, a power manager configured to set power on or off and to set a voltage, a clock manager configured to set a clock frequency, a power gating (pg) manager configured to set power gating, a main controller configured to include at least one modules and a central processing unit (cpu), and a wakeup controller configured to control the power manager, the clock manager, and the pg manager, to transmit power having a starting voltage and a clock signal having a starting clock frequency, and to transmit a power gating signal to apply power only to one of the at least one modules operating so as to start the main controller.. .
Samsung Electronics Co., Ltd.


Solid state memory thermal regulation


A chassis for a storage system contains a digital chamber that houses conventional electronic components and a thermal chamber that houses non-volatile solid state memory such as flash memory. A temperature regulating system monitors temperature within the digital chamber to keep the components therein below their maximum junction temperature.
Skyera, Inc.


Systems and methods for coupling electromagnetic radiation from fiber arrays into waveguides and photonic chips


Systems and methods for coupling electromagnetic radiation from fiber arrays into waveguides and photonic chips are disclosed. In one aspect of the disclosed subject matter, systems for coupling electromagnetic radiation from an optical fiber into a waveguide are provided.
The Trustees Of Columbia University In The City Of New York


Biochip substrate


A substrate for biochips, in which contamination of a biologically relevant substance(s) to be immobilized does not occur even when reaction spots on the substrate for biochips are highly densified; and a biochip comprising the same are provided. The substrate for biochips comprises a substrate and a plurality of reaction spots disposed on the substrate.
Nippon Light Metal Company, Ltd.






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