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Chip patents



      
           
This page is updated frequently with new Chip-related patent applications. Subscribe to the Chip RSS feed to automatically get the update: related Chip RSS feeds. RSS updates for this page: Chip RSS RSS


Pressure sensitive assemblies for limiting movements adverse to health or surgical recovery

Pressure sensitive assemblies for limiting movements adverse to health or surgical recovery

Multiplexed olfactory receptor-based microsurface plasmon polariton detector

Multiplexed olfactory receptor-based microsurface plasmon polariton detector

Multiplexed olfactory receptor-based microsurface plasmon polariton detector

Method for creating a 3d stacked multichip module

Date/App# patent app List of recent Chip-related patents
12/11/14
20140365782
 Method and system for providing password-free, hardware-rooted, asic-based authentication of a human to a mobile device using biometrics with a protected, local template to release trusted credentials to relying parties patent thumbnailMethod and system for providing password-free, hardware-rooted, asic-based authentication of a human to a mobile device using biometrics with a protected, local template to release trusted credentials to relying parties
Biometric data, which may be suitably transformed are obtained from a biometric input device contained within a stand-alone computer or a mobile device, which may contain an asic chip connected to or incorporated within the stand-alone computer or mobile device and which includes the capability for capturing one or more biometric samples and for biometric feature extraction, matching and encryption. For extra security, the biometric matching is used in conjunction with a pin to authenticate the user to the stand-alone computer or mobile device.
12/11/14
20140364771
 Pressure sensitive assemblies for limiting movements adverse to health or surgical recovery patent thumbnailPressure sensitive assemblies for limiting movements adverse to health or surgical recovery
Pressure sensitive devices, systems and methods for alerting a user of movements potentially adverse to health or surgical recovery are disclosed. The pressure sensitive device may include a force sensor placed along the anterior aspect of a hand; and a vibration motor in communication with the force sensor in close proximity to the user, e.g., along the posterior aspect of the wrist.
12/11/14
20140364330
 Multiplexed olfactory receptor-based microsurface plasmon polariton detector patent thumbnailMultiplexed olfactory receptor-based microsurface plasmon polariton detector
The invention provides a bio-sensing nanodevice comprising: a stabilized g-protein coupled receptor on a support, a real time receptor-ligand binding detection method, a test composition delivery system and a test composition recognition program. The g-protein coupled receptor can be stabilized using surfactant peptide.
12/11/14
20140363922
 Method for creating a 3d stacked multichip module patent thumbnailMethod for creating a 3d stacked multichip module
A 3d stacked multichip module comprises a stack of w ic die. Each die has a patterned conductor layer, including an electrical contact region with electrical conductors and, in some examples, device circuitry over a substrate.
12/11/14
20140362572
 Led lighting device with high-low beams patent thumbnailLed lighting device with high-low beams
A led lighting device includes a cooling base having an assembling surface defined at a bottom thereof, a first led chip and a second led chip assembled on the assembling surface, a reflecting member facing the assembling surface, the reflecting member having a high beam reflector and a low beam reflector, the high beam reflector and the low beam reflector respectively corresponding to the second led chip and the first led chip, and a curvature of the high beam reflector being different from a curvature of the low beam reflector. Wherein, light beams from the second led chip are reflected by the high beam reflector toward a far region relative to the led lighting device of the present invention; light beams from the first led chip are reflected by the low beam reflector toward a close region relative to the led lighting device of the present invention..
12/11/14
20140362550
 Selective wetting process to increase solder joint standoff patent thumbnailSelective wetting process to increase solder joint standoff
One embodiment of the invention sets forth a packaging system, which includes a first package substrate, an electrically conductive pad formed on a surface of the first package substrate, and a supporting structure formed on the electrically conductive pad. The supporting structure has a top surface and a side surface, and only the top surface of the supporting structure is coupled to a solder joint to establish an electrical connection between the first package substrate and an adjacent, parallel second package substrate.
12/11/14
20140362524
 Mounting structure and method for dissipating heat from a computer expansion card patent thumbnailMounting structure and method for dissipating heat from a computer expansion card
A mounting structure adapted for mounting an expansion card within a computer enclosure and configured to directly absorb and conduct heat from a heat source (such as an ic chip) on the card to the ambient atmosphere surrounding the enclosure. The mounting structure includes a mounting bracket, a heat sink adapted to contact a surface of the heat source on the expansion card, an extension interconnecting the heat sink and the mounting bracket, one or more features for conducting heat from the heat sink to the mounting bracket, and one or more features associated with the mounting bracket for dissipating heat from the mounting structure to the ambient atmosphere surrounding the enclosure..
12/11/14
20140361245
 Led chip and method of manufacturing the same patent thumbnailLed chip and method of manufacturing the same
A method of manufacturing an led chip includes: providing a laminated structure with a nanoimprinted material coated thereon; providing an imprinted mold with a patterned structure for pressing and curing the nanoimprinted material, removing the imprinted mold, etching the nanoimprinted material and the laminated structure; and forming electrodes on the etched laminated structure. An led chip is also provided..
12/11/14
20140361090
 Rfid tag and rfid tag manufacturing method patent thumbnailRfid tag and rfid tag manufacturing method
An rfid tag that includes a spacer made of a first member having flexibility and elasticity, the spacer having a top surface, a lateral surface and a bottom surface, an antenna made of a conductive material having flexibility and elasticity and disposed on the top surface, the lateral surface and the bottom surface of the spacer, and an ic chip electrically connected to the antenna.. .
12/11/14
20140361089
 Rfid tag patent thumbnailRfid tag
An rfid tag includes a substrate; first antenna elements formed on one side of the substrate; an ic chip connected between the first antenna elements; a second antenna element formed on another side of the substrate; first connection parts formed between the first antenna elements and the second antenna element, the first connection parts forming a first loop with the first antenna elements, the ic chip, and the second antenna element; and second connection parts formed between the first antenna elements and the second antenna element, the second connection parts forming a second loop, which is longer than the first loop, with the first antenna elements, the ic chip, and the second antenna element. A length of the first loop and a length of the second loop are respectively shorter than a wavelength in a usable frequency..
12/11/14
20140360013
Integration of electronic chips onto a photonic chip
Methods, structures, apparatus, devices, and materials to facilitate the integration of electronic integrated circuits (chips) including drivers, amplifiers, microcontrollers, etc., onto/into photonic integrated circuits (chips) using recessed windows exhibiting controlled depths onto/into the photonic chip. The electronic chips are positioned into the recessed windows and electrical connections between the electronic chips and the photonic chip are achieved by flip-chip techniques with predefined traces at a bottom of the recessed windows or direct wire bonding.
12/04/14
20140359622
Method and apparatus for a virtual system on chip
A virtual system on chip (vsoc) is an implementation of a machine that allows for sharing of underlying physical machine resources between different virtual systems. A method or corresponding apparatus of the present invention relates to a method that includes a plurality of virtual systems on chip and a configuring unit.
12/04/14
20140359621
Method and apparatus for a virtual system on chip
A virtual system on chip (vsoc) is an implementation of a machine that allows for sharing of underlying physical machine resources between different virtual systems. A method or corresponding apparatus of the present invention relates to a device that includes a plurality of virtual systems on chip and a configuring unit.
12/04/14
20140359200
High performance system topology for nand memory systems
A topology for memory circuits of a non-volatile memory system reduces capacitive loading. For a given channel, a single memory chip can be connected to the controller, but is in turn connected to multiple other memory devices that fan out in a tree-like structure, which can also fan back in to a single memory device.
12/04/14
20140357021
Multi-chip module with stacked face-down connected dies
A microelectronic assembly can include a substrate having first and second surfaces, at least two logic chips overlying the first surface, and a memory chip having a front surface with contacts thereon, the front surface of the memory chip confronting a rear surface of each logic chip. The substrate can have conductive structure thereon and terminals exposed at the second surface for connection with a component.
12/04/14
20140357020
Methods for high precision microelectronic die integration
The subject matter of the present description relates to methods for the precise integration of microelectronic dice within a multichip package which substantially reduce or eliminate any misalign caused by the movement of the microelectronic dice during the integration process. These methods may include the use of a temporary adhesive in conjunction with a carrier having at least one recess for microelectronic die alignment, the use of a precision molded carrier for microelectronic die alignment, the use of magnetic alignment of microelectronic dice on a reusable carrier, and/or the use of a temporary adhesive with molding processes on a reusable carrier..
12/04/14
20140355370
Semiconductor system and semiconductor package
A semiconductor system includes a plurality of memory chips. Each of the memory chips includes an oscillator suitable for generating a periodic wave in a self refresh mode, and a delay unit suitable for delaying the periodic wave to generate a refresh pulse and for setting a delay value based on a corresponding chip identification..
12/04/14
20140355363
Memory chip and semiconductor package including the same
A memory chip includes a data processing block suitable for serial-parallel converting data inputted and for parallel-serial converting data to be outputted, a write data transmitting unit suitable for transmitting the data serial-parallel converted by the data processing block to a write data interlayer channel, a write data receiving unit suitable for receiving data from the write data interlayer channel, the data to be written to a core area, a read data receiving unit suitable for receiving data from a read data interlayer channel, the data to be parallel-serial converted by the data processing block, and a read data transmitting unit suitable for transmitting data read from the core area to the read data interlayer channel.. .
12/04/14
20140355325
Packaging of high performance system topology for nand memory systems
A topology for memory circuits of a non-volatile memory system reduces capacitive loading. For a given channel, a single memory chip can be connected to the controller, but is in turn connected to multiple other memory devices that fan out in a tree-like structure, which can also fan back in to a single memory device.
12/04/14
20140354312
Test handler, test carrier and test method thereof
The present invention provides a test handler for various ic tests, which includes a chamber and a test carrier. The chamber is controllable to present a dry status.
12/04/14
20140353697
Led module and led dot matrix display
An led module a1 includes led chips 3r, 3g, 3b, and a module substrate 1 on which the led chips 3r, 3g, 3b are mounted. A wire 4r is connected to the led chip 3r, and the led chips 3g and 3b are arranged to face each other across the wire 4r.
12/04/14
20140353687
Led module and image sensor module
An led module includes first through third led chips and two zener diodes for preventing excessive voltage application to the first and the second led chips. A first lead includes a mount portion on which the first through third led chips and the two zener diodes are mounted.
12/04/14
20140353516
Optical sensors for monitoring biopharmaceutical solutions in single-use containers
Disposable, pre-sterilized, and pre-calibrated, pre-validated sensors are provided. The sensor comprises a disposable fluid conduit or bioreactor bag and a reusable sensor assembly.
11/27/14
20140351828
Apparatus and method for controlling multi-core system on chip
An apparatus and method for controlling a multi-core soc including a main core and at least one sub-core are disclosed. The apparatus includes a determination unit, a storage unit, and a control unit.
11/27/14
20140351779
Integrated circuit (ic) design method with enhanced circuit extraction models
A method is provided for designing an ic chip. The method includes receiving data from a pre-layout design process for the ic chip, routing a plurality of interconnecting wires to connect various devices of the ic chip, and extracting various circuit parameters.
11/27/14
20140351525
Efficient method for memory accesses in a multi-core processor
A method of providing memory accesses for a multi-core processor includes reserving a group of pins of a multi-core processor to transmit either data or address information in communication with one or more memory chips, receiving memory access requests from the plurality of processor cores, determining granularity of the memory access requests by a memory controller, and dynamically adjusting the number of pins in the group of pins to be used to transmit address information based with the granularity of the memory access requests.. .
11/27/14
20140350415
Method and circuit for storing and providing historical physiological data
Embodiments of the present invention include systems and methods that relate to pulse oximetry. Specifically, one embodiment includes an oximeter sensor comprising a light emitting element configured to emit light, a light detector configured to detect the light, and a memory chip having a built-in trimmed resistor, the trimmed resistor having a resistance value that is detectable by a monitor..
11/27/14
20140349708
Computing device with removable processing unit
A handheld tablet computing device with a removable central processor module has a first plurality of user interface elements comprising at least a screen, a keyboard, and a pointing device, a first communications link software module resident in a read-only firmware memory chip; a first docking port located on an interior surface of a void extending inward from one of the exterior surfaces of the handheld computing device; and a user-removable processing unit comprising at least a central processor module, a data storage module, a second communications link software module, a second docking port, and a second plurality of user interface elements, the user-removable processing unit being removably coupled to the handheld computing device via connection between the first docking port and the second docking port and adapted to be removable while running.. .
11/27/14
20140349383
Fluorescent sensor and sensor system
A fluorescent sensor includes a detecting substrate, an indicator, a filter layer, a light blocking layer, and an led chip. In the detecting substrate, a pd element for converting fluorescence into electric signals is positioned on wall surfaces of a through-hole which penetrates a first main surface and a second main surface.
11/27/14
20140347944
Methods and apparatuses for stacked device testing
Various embodiments include apparatus, systems, and methods having multiple dies arranged in a stack in which the dies or a logic chip in communication with the dies stores a flag for indicating whether a threshold number of cells of the dies have failed during test operations.. .
11/27/14
20140347809
Semiconductor device
A memory card has a wiring board, four memory chips stacked on a main surface of the wiring board, and a controller chip and an interposer mounted on a surface of the memory chip of the uppermost layer. The memory chips are stacked on the surface of the wiring board so that their long sides are directed in the same direction as that of the long side of the wiring board.
11/27/14
20140346684
Connection method, connection structure, insulating adhesive member, electronic component having adhesive member, and method for manufacturing same
An insulating adhesive film is formed by laminating a first insulating adhesive layer which contains a filler in an insulating adhesive composition and a second insulating adhesive layer which contains no filler in an insulating adhesive composition. H/2<tf<h≦tf+tn is satisfied, wherein h is the height of the bump of the ic chip, tf is the thickness of the first insulating adhesive layer, and the tn is the thickness of the second insulating adhesive layer.
11/27/14
20140346549
Phosphor sheet, light-emitting device having the phosphor sheet and method of manufacturing the same
Disclosed herein is a light emitting device including: a substrate; a light emitting diode (led) chip disposed on the substrate; and a phosphor sheet disposed on an upper portion of the led chip and including alignment members formed on a lower surface thereof. The alignment members contact the led chip, such that the phosphor sheet is aligned with the led chip..
11/27/14
20140346378
Microfluidic valve module and system for implementation
An improved microfluidic system with an improved microfluidic valve module is disclosed. The microfluidic system includes a microfluidic chip and one or more valve modules.
11/20/14
20140344501
Network-on-chip architecture for multi-processor soc designs
A system and method embodying some aspects for communicating between nodes in a network-on-chip are provided. The system comprises a microprocessing chip and a plurality of connection paths.
11/20/14
20140343375
Method and circuit for storing and providing historical physiological data
Embodiments of the present invention include systems and methods that relate to pulse oximetry. Specifically, one embodiment includes an oximeter sensor comprising a light emitting element configured to emit light, a light detector configured to detect the light, and a memory chip having a built-in trimmed resistor, the trimmed resistor having a resistance value that is detectable by a monitor..
11/20/14
20140342609
Interface card apparatus
An interface card apparatus is provided. The interface card includes a transmission interface, an interface converter, a system on chip, a first connector, a bus switch, a network connector, and a power switch.
11/20/14
20140342348
Optically induced cell lysis biochip
The present invention provides an optically induced cell lysis biochip, which comprises: an upper substrate made of a transparent, electrically conductive material; a lower substrate made of a transparent, electrically conductive material; a photoconductive layer formed under the lower surface of the upper substrate or on the upper surface of the lower substrate; and a chamber formed between the upper substrate and the lower substrate. When there is an electric potential difference between the upper and lower substrates, a light spot illuminated on the photoconductive layer can cause the impedance of the illuminated area to decrease, thereby causing the electric current to center on the illuminated area of the photoconductive layer.
11/20/14
20140340890
Light emitting apparatus and method for manufacturing same
A light emitting apparatus of the present invention is configured such that first and second light emitting sections are provided on a substrate (101) so as to be adjacent to each other, the first light emitting section being made up of (i) at least one blue led chip (102) and (ii) a resin layer which covers the at least one blue led chip (102) and in which a red phosphor is dispersed that emits red light upon receipt of excitation light from the at least one blue led chip (102), the second light emitting section being made up of at least one led chip (102). This makes it possible to easily adjust, with a simple and compact configuration, a ratio between a quantity of blue light and a quantity of red light..
11/20/14
20140340887
Led module and method of manufacturing the same
A compact led module and a method of manufacturing such an led module are provided. The led module includes a first-pole first lead, a first-pole second lead, a first-pole third lead, a second-pole first lead, a second-pole second lead, a second-pole third lead, a first led chip, a second led chip, a third led chip, and a housing.
11/20/14
20140340198
Package including rfid tag, the rfid tag, and rfid system
A package includes a package structure and a radio frequency identification tag. The package structure includes a metal film and a resin film, and the metal film includes a slit.
11/20/14
20140339955
Base metal combination electrode of electronic ceramic component and manufacturing method thereof
The present invention provides a base metal combination electrode of electronic ceramic component and manufacturing method thereof, wherein said base metal combination electrode comprises a first base metal electrode layer covering on two sides of said electronic ceramic chip and a second base metal electrode layer covering on said first base metal electrode layer, the manufacturing method for base metal combination electrode of electronic ceramic component comprises using thermal spray equipment to spray the electrode material to the surface of electronic ceramic chip. Comparing with using silver paste or copper paste only, it reduces the cost of electrode material without destroying the function of the electrode.
11/20/14
20140339688
Techniques for the cancellation of chip scale packaging parasitic losses
The present invention generally relates to techniques and structures that cancel or mitigate rf coupling from the rf circuit to the silicon die. To cancel or mitigate the rf coupling, a conductive coating may be formed over the rf-mems device.
11/20/14
20140339595
Led module
An led module is provided with a lead, an led chip mounted on the obverse surface of the lead, and a case covering at least a part of the lead. The case has a side wall surrounding the led chip.
11/20/14
20140339582
Resin sheet laminate, method for manufacturing the same and method for manufacturing led chip with phosphor-containing resin sheet
In order to improve the color and luminance uniformity of an led chip with a phosphor-containing resin sheet obtained by adhering the phosphor-containing resin sheet to the led chip, improve the ease of production, and improve the degree of freedom in design, etc., provided is a resin sheet laminate provided with a phosphor-containing resin sheet on a base material, wherein the phosphor-containing resin sheet is divided into a plurality of sections.. .
11/20/14
20140339440
Optoelectronic module comprising a lens system
The invention relates to an optoelectronic module (112), more particularly to an optoelectronic chip-on-board module (114). The optoelectronic module (112) comprises a substrate (116), wherein the substrate (116) has a planar design.
11/20/14
20140339308
Rfid tag and automatic recognition system
An rfid tag having a resin substrate, an ic chip positioned in the center section on the substrate, a single-layer antenna for forming an electric closed circuit by connecting with the ic chip and positioned in the peripheral section of the ic chip, and a sealing material for sealing the ic chip and the antenna, wherein the antenna is a coil antenna or a loop antenna, the resonant frequency (f0) of the antenna is the operating frequency of the ic chip or thereabouts, the operating frequency of the ic chip is 13.56 mhz-2.45 ghz, or 0.86-0.96 ghz, and the size of the rfid tag is 13 mm or less in length, 13 mm or less in width, and 1.0 mm or less in height; and an automatic recognition system using the same.. .
11/13/14
20140337898
Dvb-s receiver device, adapter for interconnecting a tuner and a scart connector of the dvb-s receiver device, and method for automatically detecting an output voltage of the tuner
A digital video broadcasting-satellite (dvb-s) receiver device includes a tuner, a scart (syndicat des constructeurs d'appareils radiorécepteurs et téléviseurs) connector and a system on chip (soc). The tuner is for generating an output voltage.
11/13/14
20140337681
Data writing method, memory storage device, and memory controller
A data writing method, a memory storage device, and a memory controller for controlling a rewritable non-volatile memory module are provided. The rewritable non-volatile memory module includes at least one memory chip, and each memory chip includes a plurality of physical erasing units.
11/13/14
20140337579
Entertainment memory device
A digital memory device comprising: stick shaped memory chip; and read only memory. The digital memory device provides a means to store digital audio and video files for playback..
11/13/14
20140336081
Biochip substratum and method for production thereof
A substrate for biochips which has a high probe loading amounts and a uniform immobilization density, and which further has a high detection sensitivity and a high reproducibility by preventing a non-specific adsorption of proteins, when used as a substrate for biochips for immobilizing probes composed of biologically relevant substances such as proteins and nucleic acids, is disclosed. Amino groups can be bound to the surface of the substrate uniformly, at a high density and stably by covalently immobilizing an amino group-containing polymer on the surface of the substrate.
11/13/14
20140336067
Method for finding bioactive peptides
The present invention relates to a method for discovering bioactive peptides, and a use thereof. The present invention relates to a method for discovering a peptide which has an effect on tissue regeneration or a peptide which adheres to a biomaterial, by searching the smallest bioactive domain from a protein.
11/13/14
20140334165
Light emitting diode (led) assembly and method of manufacturing the same
The present invention relates to an improved light emitting diode (led) assembly and method of manufacture which enables the fixing of led chips to a much broader range of surfaces or objects, amongst other benefits. In particular, the invention relates to a metal core printed circuit board (mcpcb) including on a first surface an led die, and on a second surface a heat spreader substrate.
11/13/14
20140334161
Focusing structure for led lamp
A focusing structure for an led lamp is provided. Led chips are provided in a main body of the led lamp, a front end of the main body 1 is provided with a lens assembly.
11/13/14
20140334137
Bidirectional light sheet
A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare led chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode.
11/13/14
20140334097
Electronic device comprising elements managed by different standardised protocols and method for managing communication between those elements
The embodiments of this invention relate to an electronic device (9) intended to be installed in a portable device (1), which electronic device comprises: a microcontroller (13) configured to communicate with a first interface (5) of the portable device in accordance with a first protocol, the said first interface (5) supplying power voltage to the microcontroller, the said power voltage being standardised by the said first protocol, a secure electronic chip component (15) configured to communicate with a second interface (7) of the portable device in accordance with a second protocol, the said second interface (7) supplying power voltage to the secure component, the said power voltage being standardised by the said second protocol, means for communication (17) between the secure component (15) and the microcontroller (13), in which the means for communication comprise a module for voltage adaptation (19) depending on the power voltages supplied by the first and second interfaces.. .
11/13/14
20140333779
Apparatus for distributing bus traffic of multiple camera inputs of automotive system on chip and automotive system on chip using the same
An apparatus for distributing the bus traffic of the multiple camera inputs of an automotive system on chip (soc) and an automotive soc using the apparatus are disclosed. The plurality of camera data caches stores data from the plurality of cameras in corresponding internal buffers, measures the data storage status of the buffers, and transmits the data to memory.
11/13/14
20140332975
Multichip integration with through silicon via (tsv) die embedded in package
Embodiments of the present disclosure are directed to integrated circuit (ic) package assemblies with three-dimensional (3d) integration of multiple dies, as well as corresponding fabrication methods and systems incorporating such 3d ic package assemblies. A bumpless build-up layer (bbul) package substrate may be formed on a first die, such as a microprocessor die.
11/13/14
20140332956
Integrated circuit package with spatially varied solder resist opening dimension
An integrated circuit (ic) package stack with a first and second substrate interconnected by solder further includes solder resist openings (sro) of mixed lateral dimension are spatially varied across an area of the substrates. In embodiments, sro dimension is varied between at least two different diameters as a function of an estimated gap between the substrates that is dependent on location within the substrate area.
11/06/14
20140331302
Method for securing an electronic document
The object of this invention is a method for securing an electronic document. In particular, this invention relates to a method that prevents the forging of documents in which an electronic chip is incorporated.
11/06/14
20140331192
Semiconductor device and method for making the same using semiconductor fin density design rules
A method for designing a semiconductor ic chip includes dividing the chip into functional blocks such as a core portion and one or more other functional cells and applying design rules concerning the spatial arrangement of semiconductor fins to the core portion but not to the other functional cells. The design guidelines include the application of design rules to some but not all functional blocks of the chip, may be stored on a computer-readable medium and the design of the semiconductor ic chip and the generation of a photomask set for manufacturing the semiconductor ic chip may be carried out using a cad or other automated design system.
11/06/14
20140331064
Key revocation in system on chip devices
Methods and apparatus relating to key revocation in system on chip (also referred to as soc or soc) devices are described. In an embodiment, a storage device stores an identifier of an original equipment manufacturer (oem) and key versioning information corresponding to the oem.
11/06/14
20140331005
Memory system and bus switch
A memory system includes a nonvolatile memory having a plurality of nonvolatile memory chips incorporated therein, a control circuit that controls the nonvolatile memory, an mpu that controls the control circuit, and an interface circuit that communicates with a host, all of which are mounted on a board of the memory system, and the memory system further includes a bus switch that switches connection of a signal line between the control circuit and the nonvolatile memory chips.. .
11/06/14
20140330877
Electronic calculator and control method thereof
An electronic calculator and a control method thereof are provided. The electronic calculator includes a display module, a key array, and a processing chip.
11/06/14
20140330761
Neuromorphic chip and method and apparatus for detecting spike event
Disclosed are a method and an apparatus for detecting spike event or transmitting spike event information generated in a neuromorphic chip. The apparatus for detecting spike event generated in a neuromorphic chip may detect spike event information for a plurality of neurons included in the neuromorphic chip based on a neuron group..
11/06/14
20140328733
Simplified gating method for sealing and flow control in micro and nano devices
A biochip for multiplex genetic identification is disclosed. An biochip for separating and detecting a plurality of dna fragments includes a set of inputs and chambers for receiving a sample matrix of genetic material and reagents needed to conduct a polymerase chain reaction amplification of the genetic material.
11/06/14
20140328208
Heterogeneous soc ip core placement in an interconnect to optimize latency and interconnect performance
Systems and methods described herein are directed to solutions for network on chip (noc) interconnects that automatically and dynamically determines the position of hosts of various size and shape in a noc topology based on the connectivity, bandwidth and latency requirements of the system traffic flows and certain performance optimization metrics such as system interconnect latency and interconnect cost. The example embodiments selects hosts for relocation consideration and determines a new possible position for them in the noc based on the system traffic specification, shape and size of the hosts and by using probabilistic function to decide if the relocation is carried out or not.
11/06/14
20140328104
Semiconductor device
A logic chip and memory chip stacked over the logic chip, the logic chip having a first surface facing the memory chip and a second surface opposite to the first surface and including: first and second internal input/output circuit units for exchanging signals; first external input/output circuit unit for exchanging signals through first external input/output pads formed according to an external interface standard of a first memory over the second surface; and second external input/output circuit unit for exchanging signals through second external input/output pads formed according to an external interface standard of a second memory over the second surface, wherein semiconductor device operates in one of a first mode in which the first internal input/output circuit unit and the first external input/output circuit unit are enabled and a second mode in which the first and second internal input/output circuit units and the second external input/output circuit unit are enabled.. .


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