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Chip patents



      
           
This page is updated frequently with new Chip-related patent applications. Subscribe to the Chip RSS feed to automatically get the update: related Chip RSS feeds. RSS updates for this page: Chip RSS RSS


Electrically insulating thermal interface on the discontinuity of an encapsulation structure

Infineon Technologies Ag

Electrically insulating thermal interface on the discontinuity of an encapsulation structure

Quad flat no lead package and production method thereof

Tianshui Huatian Technology

Quad flat no lead package and production method thereof

Quad flat no lead package and production method thereof

Smartcard interface conversion device, embedded system having the same device and method for transferring data signal…

Date/App# patent app List of recent Chip-related patents
04/16/15
20150106861
 Interactive intelligent set-top box and systems and methods thereof patent thumbnailnew patent Interactive intelligent set-top box and systems and methods thereof
An interactive intelligent set-top box electrically connected to a television, the set-top box comprising a control chip, an audio processing chip, a memory, a network interface, a camera electrically connected to the control chip, at least one loudspeaker, at least one microphone wherein the microphone and the loudspeaker electrically connected to the audio processing chip, and a housing containing at least the control chip, audio processing chip, memory, network interface, and camera, wherein the housing is removably couplable to a bracket shaped to removably attach the housing to a television. The network interface is electrically connected to a network by which it receives live video and audio data from at least one remote location.
04/16/15
20150106778
 System for designing network on chip interconnect arrangements patent thumbnailnew patent System for designing network on chip interconnect arrangements
A system for designing network-on-chip interconnect arrangements includes a network-on-chip backbone with a plurality of backbone ports and a set of functional clusters of aggregated ips providing respective sets of system-on-chip functions. The functional clusters include respective sub-networks attachable to any of the backbone ports and to any other functional cluster in the set of functional clusters independently of the source map of the network-on-chip backbone..
Stmicroelectronics S.r.l.
04/16/15
20150106678
 Semiconductor device and semiconductor system including the same patent thumbnailnew patent Semiconductor device and semiconductor system including the same
A semiconductor system includes a memory configured to output a parity bit during a read operation and receive a data mask (dm) signal during a write operation. The semiconductor system also includes a system on chip (soc) configured to detect errors by decoding the parity bit during the read operation, and output the dm signal to the memory during the write operation.
Sk Hynix Inc.
04/16/15
20150106648
 Smartcard interface conversion device, embedded system having the same device and  transferring data signal used in the same device patent thumbnailnew patent Smartcard interface conversion device, embedded system having the same device and transferring data signal used in the same device
According to an exemplary embodiment of the present invention, an interface conversion device communicating between a processor and a smartcard ic chip includes: an input/output signal conversion logic configured to transfer a signal between a first interface of the processor and a second interface of the smartcard ic chip; a clock generator configured to generate a clock signal driving the smartcard ic chip depending on a first control signal received from the processor and provide the generated clock signal to the smartcard ic chip; and a reset controller configured to generate a reset signal depending on a second control signal received from the processor and provide the generated reset signal to the smartcard ic chip.. .
04/16/15
20150105074
 Multimode terminal and service implementation  multimode terminal patent thumbnailnew patent Multimode terminal and service implementation multimode terminal
Provided are a multimode terminal and a service implementation method for a multimode terminal. The multimode terminal includes: a master controller, a slave controller, a subscriber identity module card, a first radio frequency chip, a first antenna, a second radio frequency chip and a second antenna.
Zte Corporation
04/16/15
20150103822
 Noc interface protocol adaptive to varied host interface protocols patent thumbnailnew patent Noc interface protocol adaptive to varied host interface protocols
Systems and methods described herein are directed to solutions for network on chip (noc) interconnects that support a variety of different component protocols each having different sets of data and/or metadata even after the noc is designed and finalized. Example implementations include, automatically changing format of packets received from an originating soc component by an originating bridge based on a noc interface protocol and then transmitting the packet across the noc interconnect to a destination bridge.
Netspeed Systems
04/16/15
20150103547
 Light emitting device assembly and headlamp including the same patent thumbnailnew patent Light emitting device assembly and headlamp including the same
An led assembly according to an embodiment of the present invention may improve dark regions generated between led chips by employing a first reflective layer between the led chips. By employing a transparent optical layer or an optical layer including a scattering particle between an led chip and a phosphor layer, direct contact between the led chip and the phosphor layer may be avoided, thereby preventing a low light extraction efficiency.
Samsung Electronics Co., Ltd.
04/16/15
20150102748
 Liquid crystal display device patent thumbnailnew patent Liquid crystal display device
A liquid crystal display device includes a backlight unit including an led assembly, wherein the led assembly includes: a plurality of led packages; an led pcb on which the plurality of led packages are arranged being spaced apart from each other; and an led driving circuit board that is connected to the led pcb and includes a led driving circuit, wherein the led package includes first and second led chips emitting two colors, respectively, out of red, green and blue, and a fluorescent substance emitting the other one color out of the red, green and blue, wherein a temperature sensor is formed in the led pcb, and wherein the first or second led chip is supplied with a compensated voltage according to temperature change by the temperature sensor.. .
Lg Display Co., Ltd.
04/16/15
20150102479
 Electrically insulating thermal interface on the discontinuity of an encapsulation structure patent thumbnailnew patent Electrically insulating thermal interface on the discontinuity of an encapsulation structure
Method for manufacturing an electronic semiconductor package, in which method an electronic chip (100) is coupled to a carrier, the electronic chip is at least partially encapsulated by means of an encapsulation structure having a discontinuity, and the carrier is partially encapsulated, and at least one part of the discontinuity and a volume connected thereto adjoining an exposed surface section of the carrier are covered by an electrically insulating thermal interface structure, which electrically decouples at least one part of the carrier with respect to its surroundings.. .
Infineon Technologies Ag
04/16/15
20150102476
 Quad flat no lead package and production method thereof patent thumbnailnew patent Quad flat no lead package and production method thereof
The present invention discloses a quad flat no lead package and a production method thereof. The quad flat no lead package comprises a lead frame carrier consisting of a carrier pit and three circles of leads arranged around the carrier pit, wherein the three circles of leads respectively consist of a plurality of leads that are disconnected mutually; an ic chip is adhered in the carrier pit; and an inner lead chemical nickel and porpezite plated layer is plated on all the leads; the inner lead chemical nickel and porpezite plated layer is arranged in the same direction as the ic chip; the ic chip is connected with the inner lead chemical nickel and porpezite plated layer through a bonding wire; and the ic chip, the ends of all the leads plated with the inner lead chemical plating nickel and palladium metal layers and the bonding wire are all packaged in a plastic package.
Tianshui Huatian Technology Co., Ltd.
04/16/15
20150102373
new patent

Light emitting diode package and manufacturing the same


There is provided a light emitting diode (led) package. The led package includes a package body.
Samsung Electronics Co., Ltd.
04/16/15
20150102235
new patent

Universal uv sterilizer


Disclosed is a uv sterilizer. The uv sterilizer includes a body including a top surface and a sidewall, at least one first uv led chip disposed on the top surface of the body, and at least one second uv led chip disposed on the sidewalls of the body.
Seoul Viosys Co., Ltd.
04/16/15
20150102147
new patent

Chipper truck and trailer


A chipper truck and trailer assembly for tree trimming and removal includes a truck having a cab and a bed frame. The truck also has a chipper box mounted thereon and open at an end thereof.
04/16/15
20150102105
new patent

Item comprising a barcode with an electromagnetic signature


The present invention relates to a set of security documents. Each security document within the set having an optical code, notably a barcode, which is neither connected nor coupled to any electronic chip that may be carried by the security document.
Institut Polytechnique De Grenoble
04/09/15
20150100936

Register clustering for clock network topology generation


In some embodiments, in a method, a physical netlist of a placed ic chip design is received. The physical netlist comprises a plurality of registers.
Taiwan Semiconductor Manufacturing Company Ltd.
04/09/15
20150100721

Storage system and control for storage system


The storage system includes a plurality of storage devices and a storage controller. The storage controller stores a data request quantity indicating the data quantity of write data written to the target area in a specific period, and estimates, based on the quantity of request data and relationship information received from storage devices, the estimated data quantity written to the nonvolatile semiconductor memory chips based on the write data written to the target area in the specific period.
Hitachi, Ltd.
04/09/15
20150099662

Method for the urinary detection of bladder cancer


The invention relates to the diagnosis of bladder cancer and more specifically to the detection in urine samples of bladder carcinomas of the transitional type. The detection method according to the present invention enables, through the utilization of a dna chip designed for this purpose, to determine the grade of the detected tumors..
Array Genomics
04/09/15
20150099363

Method of fabricating iii-nitride based semiconductor on partial isolated silicon substrate


A semiconductor is fabricated on a silicon (si) substrate. The semiconductor is iii-nitride based.
National Tsing Hua University
04/09/15
20150099320

Light-emitting diode assembly and fabrication method thereof


Disclosed embodiments include a manufacturing method for an led assembly. Providing a first carrier, wherein several led chips are formed on the first carrier, and providing a second carrier.
Interlight Optotech Corporation
04/09/15
20150098864

Microfluidic chip with flow-guiding body and applications thereof


A microfluidic chip (100) with a flow-guiding body (111) and the applications thereof in biochemistry, immunology, and molecule detection. The flow-guiding body (111) is disposed in a solution tank (101) of the microfluidic chip (100), the surface of the flow-guiding body (111) is enclosed by the antigen or antibody, and the gap between the flow-guiding body (111) and a wall (105) of the solution tank is 0 mm to 1.5 mm..
Beijing Bohui Innovation Technology Co., Ltd.
04/09/15
20150098677

Hybrid-integrated photonic chip package


A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each other on the same side of a substrate in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth.
Oracle International Corporation
04/09/15
20150097631

Crystal oscillator


A crystal oscillator is configured by accommodating a crystal blank that functions as a crystal unit and an ic chip that includes at least an oscillator circuit using the crystal blank into a container in an integrated manner. In the ic chip, the oscillator circuit is connected to the crystal unit via a pair of crystal connecting terminals, an output from the oscillator circuit is supplied to a plurality of output buffers.
Nihon Dempa Kogyo Co., Ltd.
04/09/15
20150097287

Electrical connections for chip scale packaging


Electrical connections for chip scale packaging are disclosed. In one embodiment, a semiconductor device includes a post-passivation layer disposed over a substrate, the substrate having a first direction of coefficient of thermal expansion mismatch.
Taiwan Semiconductor Manufacturing Company, Ltd.
04/09/15
20150097199

Led assembly


This disclosure discloses an led assembly. The led assembly comprises a transparent substrate; a first phosphor layer; a transparent mount, having a plurality of trenches substantially in parallel to each other, wherein the first phosphor layer is positioned between the transparent substrate and the transparent mount; an led chip, mounted on an area of the transparent mount, wherein the area is located substantially between the trenches; and a second phosphor layer inside the trenches..
Interlight Optotech Corporation
04/02/15
20150095556

Memory system


A memory system includes a first memory chip, a second memory chip, and a memory controller. The first memory chip and the second memory chip are connected to the memory controller via a plurality of data lines including a first data line and a second data line.
Kabushiki Kaisha Toshiba
04/02/15
20150095274

Method and producing programmable probability distribution function of pseudo-random numbers


Certain aspects of the present disclosure provide methods and apparatus for producing programmable probability distribution function of pseudo-random numbers that can be utilized for filtering (dropping and passing) neuron spikes. The present disclosure provides a simpler, smaller, and lower-power circuit than that typically used.
Qualcomm Incorporated
04/02/15
20150093751

Primers for diagnosing avellino corneal dystrophy


The present invention relates to a real-time pcr primer pair and probe for diagnosing avellino corneal dystrophy, and more particularly to a real-time pcr primer pair and probe for diagnosing avellino corneal dystrophy, which can accurately diagnose the presence or absence of a mutation in exon 4 of bigh3 gene, which is responsible for avellino corneal dystrophy. The use of the primer pair and probe according to the invention can diagnose avellino corneal dystrophy in a more rapid and accurate manner than a conventional method that uses a dna chip or pcr..
Avellino Co., Ltd.
04/02/15
20150092509

Semiconductor apparatus and chip id generation method thereof


Provided is a semiconductor apparatus including a plurality of memory chips which are sequentially stacked. Each of the memory chips includes: a temperature sensor configured to sense the temperature of the memory chip; and a chip id output unit configured to generate a chip id for the memory chip based on an output of the temperature sensor..
Sk Hynix Inc.
04/02/15
20150092417

Tubular luminaire


A luminaire having a tubular body that fits into a ceiling mounted sleeve that allows azimuthal rotation of a light beam. The luminaire features an upright tubular heat sink connected to a fixed base having a downward portion inclined at an angle where an led chip is affixed.
04/02/15
20150092356

Printed wiring board, manufacturing printed wiring board and package-on-package


A method for manufacturing a printed wiring board includes forming a removable layer over first pads in central portion of an interlayer insulation layer to mount ic chip, forming on the interlayer and removable layers a resin insulation layer having openings exposing second pads in peripheral portion of the interlayer layer to connect second substrate, forming a seed layer on the resin layer, in the openings and on the second pads, forming on the seed layer a plating resist having resist openings exposing the openings of the resin layer with diameters greater than the openings, filling the resist openings with electrolytic plating such that metal posts are formed in the resist openings, removing the resist, removing the seed layer exposed on the resin layer, and removing the removable layer and the resin layer on the removable layer such that cavity exposing the first pads is formed in the resin layer.. .
Ibiden Co., Ltd.
04/02/15
20150091916

System on chip including configurable image processing pipeline and system including the same


A system on chip (soc) including a configurable image processing pipeline is provided. The soc includes a bus; a first image processing module configured to be connected to the bus and to process image data; a first image processing stage configured to transmit either first image data or second image data received from the bus to at least one of the bus and the first image processing module through a first bypass path in response to first control signals; and a second image processing stage configured to transmit either third image data received from the first image processing module or fourth image data received from the bus to the bus through one of a second bypass path and a second scaler path in response to second control signals..
04/02/15
20150091623

Clock multiplexing and repeater network


A system on chip (soc) includes a clock generator to provide one or more on-chip reference clocks to a number of physical medium attachments (pmas) across a common clock bus. The clock generator receives one or more external, off-chip clock lines, from which it generates the on-chip reference clocks.
Cavium, Inc.
04/02/15
20150091432

Substrate for led, led module, and led bulb


Led substrate of the present invention includes: translucent substrate body-in which an led chip is disposed on a front face; and heat dissipation path provided in substrate body to dissipate heat generated in the led chip. Substrate body includes a through hole that penetrates through the substrate body from the front face on which the led chip is provided to a back face.
Panasonic Corporation
04/02/15
20150091034

Light emitting diode package


A light-emitting diode (led) package structure includes a lead frame, a led chip, a package body, n opaque spacer and n+1 encapsulating glues. The led chip is disposed on the lead frame; the package body covers the lead frame and exposes the led chip.
Lextar Electronics Corporation
04/02/15
20150091019

White led chip and white led packaging device


A white led chip includes a p-type layer, a tunneling structure, an n-type layer, an n-type electrode, and a p-type electrode. The tunneling structure is disposed over the p-type layer.
Opto Tech Corporation
04/02/15
20150090990

Display device and manufacturing display device


A display device according to the invention includes: a first substrate that includes a flexible substrate, is segmented into a display area and a non-display area outside the display area, and includes a thin film transistor and an electroluminescent light-emitting element formed on the display area of the flexible substrate; and an ic chip that is bonded on the non-display area of the first substrate via an anisotropic conductive film, wherein the first substrate includes, between the flexible substrate and the anisotropic conductive film, at least one or more support layers whose plan view shape is larger than that of the ic chip and whose hardness is higher than that of the flexible substrate, and the ic chip is located inside the at least one or more support layers in a plan view.. .
Japan Display Inc.
04/02/15
20150090801

Non-contact ic label and nameplate


A non-contact ic label includes a magnetic sheet, a gap retention member including a dielectric material, and a communication section provided between the magnetic sheet and the gap retention member. The communication section includes an ic chip and a first antenna section and a second antenna section which are connected to the ic chip.
Toppan Printing Co., Ltd.
04/02/15
20150090596

Microfluidic process monitor for industrial solvent extraction system


The present invention provides a system for solvent extraction utilizing a first electrode with a raised area formed on its surface, which defines a portion of a microfluidic channel; a second electrode with a flat surface, defining another portion of the microfluidic channel that opposes the raised area of the first electrode; a reversibly deformable substrate disposed between the first electrode and second electrode, adapted to accommodate the raised area of the first electrode and having a portion that extends beyond the raised area of the first electrode, that portion defining the remaining portions of the microfluidic channel; and an electrolyte of at least two immiscible liquids that flows through the microfluidic channel. Also provided is a system for performing multiple solvent extractions utilizing several microfluidic chips or unit operations connected in series..
Uchicago Argonne, Llc
03/26/15
20150089288

Technique for establishing an audio socket debug connection


A debug controller monitors a tip-ring-ring-shield (trrs) socket, within a form factor device, to detect whether a debug unit is transmitting a request for a trrs socket debug connection. The form factor device also includes a system on chip (soc), a switch, and an audio codec.
Nvidia Corporation
03/26/15
20150089251

Method and managing global chip power on a multicore system on chip


According to at least one example embodiment, a method and corresponding apparatus for controlling power in a multi-core processor chip include: accumulating, at a controller within the multi-core processor chip, one or more power estimates associated with multiple core processors within the multi-core processor chip. A global power threshold is determined based on a cumulative power estimate, the cumulative power estimate being determined based at least in part on the one or more power estimates accumulated.
Cavium, Inc.
03/26/15
20150089112

System and conserving memory power using dynamic memory i/o resizing


Systems and methods are disclosed for conserving power consumption in a memory system. One such system comprises a dram memory system and a system on chip (soc).
Qualcomm Incorporated
03/26/15
20150088513

Sound processing system and related method


A sound processing system is provided and is executed by a processor. The processor acquires a video/audio file from video/audio files.
Hon Hai Precision Industry Co., Ltd.
03/26/15
20150087548

Marker sequences for rheumatoid arthritis and use thereof


The present invention relates to new marker sequences for rheumatoid arthritis and the diagnostic use thereof together with a method for screening of potential active substances for rheumatoid arthritis by means of these marker sequences. Furthermore, the invention relates to a diagnostic device containing such marker sequences for rheumatoid arthritis, in particular a protein biochip and the use thereof..
Protagen Aktiengesellschaft
03/26/15
20150086983

Method of using microfluidic chip for nucleic acid hybridization


The present invention relates to method of using a microfluidic chip for rapid nucleic acid hybridization, comprising: activating a porous substrate with positive charges; injecting a mixed solution of a test nucleic acid and a nucleic acid probe into the microfluidic chip for maintaining the test nucleic acid hybridized to the nucleic acid probe being absorbed to the periphery of the substrate; continuously washing the microfluidic chip with an anionic surfactant; and detecting the hybridization signals on the substrate after washing for a predetermined time; wherein the activation of the substrate with positive charges allows the test nucleic acid hybridized to the nucleic acid probe to form a micelle during washing and the diffusion of such from the periphery toward the center of the substrate to accelerate. Thus, it is possible to accomplish detection in a very short time for application of specific dna complementary hybridization..
03/26/15
20150086443

Microfluidic chips with micro-to-macro seal and a manufacturing microfluidic chips with micro-to-macro seal


A microfluidic chip for a microfluidic system includes a micro-to-macro seal. The microfluidic chip has a substrate, at least one microfluidic pathway in the substrate, and a pdms seal layer on the substrate and above the microfluidic pathway.
Fluxergy, Llc
03/26/15
20150085577

Flash memory module for realizing high reliability


A flash memory module may include a plurality of flash memory chips. The memory chips may include one or more blocks.
Hitachi, Ltd.
03/26/15
20150085527

Light source module, fabrication method therefor, and backlight unit including the same


A light source module, a fabrication method therefore, and a slim backlight unit including the same. The light source module includes a light emitting diode (led) chip electrically connected to a substrate through a lower surface thereof, a wavelength conversion layer formed on the led chip and enclosing at least the light exit face of the led chip, and a reflector formed on a region of the led chip excluding the light exit face..
Seoul Semiconductor Co., Ltd.
03/26/15
20150085488

System for lighting apparatus utilizing light active sheet material with integrated light emitting diode, window with lighting apparatus, conveyance with lighting apparatus, and providing lighting apparatus


A dual lighting apparatus includes a principal substrate, a first lighting device and a second lighting device. The first lighting device is integrated into a first plane of the principal substrate, the first lighting device having one or more first light emitting diode (led) chips embedded therein.
Grote Industries, Llc
03/26/15
20150085415

Passive circuit for improved failure mode handling in power electronics modules


A power electronics module for enhancing short circuit failure mode (scfm) transitions. The module is adapted to disconnect a gate unit from the module using a first switch, upon a failure of at least one of a plurality of semiconductor chips during which the failed chip enters an scfm, and connect a passive circuit arrangement, including at least one capacitor and at least one resistor, to the module using a second switch.
Abb Research Ltd
03/26/15
20150084706

Oscillator


An oscillator according to the disclosure includes a crystal unit, an ic chip, an adhesive agent flow prevention film, and a lead frame. The lead frame is disposed in a peripheral area of the pair of crystal terminals and the ic chip in an approximately same surface as the one surface of the flat container of the crystal unit.
Nihon Dempa Kogyo Co., Ltd.
03/26/15
20150084675

Methods of controlling clocks in system on chip including function blocks, systems on chips and semiconductor systems including the same


A system-on-chip includes a clock controller configured to decrease an operating frequency of at least one function block based on a change in an operating state of the at least one function block from an active state to an idle state. In a method of operating a system-on-chip including at least one function block, an operating frequency of the at least one function block is decreased based on a change in an operating state of the at least one function block from an active state to an idle state.
03/26/15
20150084166

Semiconductor device having plural memory chip


A semiconductor device includes a stacked plurality of memory chips. The memory chips each include a plurality of memory banks, a plurality of read/write buses that are assigned to the respective memory banks, and a plurality of penetration electrodes that are assigned to the respective read/write buses and arranged through the memory chip.
Ps4 Luxco S.a.r.l.
03/26/15
20150084072

Led package structures for preventing lateral light leakage and manufacturing the same


An led package structure for preventing lateral light leakage includes a substrate unit, a light-emitting unit, a light-transmitting unit and a light-shielding unit. The substrate unit includes a circuit substrate.
Brightek Optoelectronic Co., Ltd.
03/26/15
20150084071

Light-emitting device


The light-emitting device of the disclosure includes at least one led chip and a mounting substrate. The mounting substrate includes: a ceramic substrate; a reflection layer situated on a second surface on the opposite side of the ceramic substrate from a first surface; and a gas barrier layer covering the reflection layer.
Panasonic Corporation
03/26/15
20150083996

Vertical led chip package on tsv carrier


A light-emitting device (led) package component includes a carrier wafer. The carrier wafer includes a first through-substrate via (tsv) configured to electrically connecting features on opposite sides of the carrier wafer.
Tsmc Solid State Lighting Ltd.
03/19/15
20150082018

Secure data exchange method, and communication device and system implementing same


The invention relates to a method for securely exchanging data (5) between a communication device (1) and a server (8) of a service provider (2) via a communication network (3), the communication device (1) enabling at least one user (13) of the communication device (1) to use the services (4) provided by said service provider (2), said method being characterized in that it includes the following steps for exchanging data (5) between the communication device (1) and at least one server (8) of the service provider (2): in order to send the data (5), encrypting at least a portion of the sent data (5) using a physical key (7) which is known to the service provider (2) and which is physically written in a read-only memory of an electronic chip (6) of the communication device (1); and, upon receiving the data (5), decrypting the received data using said physical key (7).. .
03/19/15
20150080240

Methods and systems for using built-in standard curve to measure molecular numbers of biological components


Methods and devices are disclosed, which perform absolute quantification assay of functional components of biological specimens. The present application relates to manufacture built-in standard curve(s) and computational analysis.
W2 Biosolutions, Llc
03/19/15
20150079676

Method and the isolation of motile sperm


A system for separating motile and non-motile sperm comprises a microvolume into which a fluid containing sperm is delivered, at least partly defined by a wall which includes a termination or a change in angle away from the microvolume, defining an exit from the microvolume. Sperm delivered into the microvolume in a fluid that are motile move entrained along the wall and leave the wall at the termination with an outward turn to or towards a collection reservoir or passage from the microvolume.
Auckland Uniservices Limited
03/19/15
20150079665

Microfluidic chips with optically transparent glue coating and a manufacturing microfluidic chips with optically transparent glue coating for a microfluidic device


A microfluidic chip for a microfluidic system includes a pdms substrate having a first thickness, at least one microfluidic pathway in the substrate, a coating along the microfluidic pathway, and a glass layer having a second thickness on the substrate and above the microfluidic pathway, wherein the coating contains an optically transparent material, and the first thickness is greater than the second thickness. The coating includes cyanoacrylates, an uv curable epoxy adhesive, a gel epoxy or epoxy under trade name of epo-tek 0g175, masterbond ep30lv-1 or locite 0151..
Fluxergy, Llc
03/19/15
20150078971

Method of continuously manufacturing microfluidic chips with bopet film for a microfluidic device and microfluidic chips with bopet film


A microfluidic chip includes a thin biaxially-oriented polyethylene terephthalate (“bopet”) film and a micro-channel in the bopet film. A method for manufacturing a microfluidic chip includes coating uv epoxy on a first side of a bopet film, placing the bopet film on a first substrate with the first side facing the first substrate, curing the uv epoxy on the first side of the bopet film to attach the bopet film on the first substrate; forming at least one microfluidic pathway in the bopet film, coating uv epoxy on a first side of a second substrate, placing the second substrate on the bopet film with the first side of the second substrate facing a second side of the bopet film, and curing the uv epoxy on the first side of the second substrate to attach the bopet film to the second substrate.
Fluxergy, Llc
03/19/15
20150078094

Memory chip, memory device, and reading method


A memory chip includes a memory cell array having a plurality of memory cells connected to word lines and bit lines, and a sense amplifier configured to detect data stored in a memory cell that is connected to a selected one of the word lines and a selected one of the bit lines, and a control circuit configured to read data from the memory cell in a first read mode when a first command is received and in a second read mode when a second command is received. A peak or an average value of an operation current that is flowing between power supply and ground terminals of the memory chip during a read operation in the first read mode is less than a peak or an average value of the operation current during a read operation in the second read mode..
Kabushiki Kaisha Toshiba
03/19/15
20150078055

Memory module and manufacturing method thereof


A memory module includes a printed circuit board; first memory chips disposed in parallel with a long axis of the printed circuit board along a first column; second memory chips disposed in parallel with the long axis of the printed circuit board along a second column; and passive elements disposed between the first memory chips and the second memory chips, wherein the passive elements are connected between input/output pins of each of the first and second memory chips and tap pins.. .
Samsung Electronics Co., Ltd.
03/19/15
20150077982

Led module, lighting device, and lamp


An led module includes: an opaque substrate on which a wiring circuit is provided; a submount bonded to a surface of the opaque substrate with a first bond; an led chip bonded with a second bond to an opposite side of the submount from the opaque substrate; and wires electrically connecting the led chip to patterned wiring circuit. In the led module, the first bond and the second bond each allow light emitted from the led chip to pass therethrough.
Panasonic Corporation
03/19/15
20150077944

Multichip module with stiffening frame and associated covers


A multichip module includes a carrier, a stiffening frame, a plurality of semiconductor chips, and a plurality of covers. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard.
International Business Machines Corporation
03/19/15
20150077278

Sampling


There is disclosed current-mode time-interleaved sampling circuitry configured to be driven by substantially sinusoidal clock signals. Such circuitry may be incorporated in adc circuitry, for example as integrated circuitry on an ic chip.
Fujitsu Semiconductor Limited
03/19/15
20150077020

Method of driving led chips of same power but different rated voltages and currents


A method of driving led chips of same power but different rated voltages and currents includes the following steps: set a predetermined power; provide a led chip which has a rated power accordant to the predetermined power; measure the led chip to obtain a working current thereof while the led chip is operated; provides a driving current to the led chip, and maintain the driving current the same as the working current.. .
Hep Tech Co., Ltd.


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