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Chip patents



      

This page is updated frequently with new Chip-related patent applications.




Date/App# patent app List of recent Chip-related patents
02/04/16
20160036493 
 System and  low data-rate communication over a carrier current patent thumbnailSystem and low data-rate communication over a carrier current
The invention relates to a system for low data-rate communication over a modulated direct carrier current, having one or more communication transmitters (6, 8), a communication receiver (10), and a wire bus (12) forming a shared transmission channel. Each communication transmitter (6, 8) is configured to form a first raw staggered transmission frame according to a second staggered transmission frame, said staggered transmission frames using a set of separate basic chip-encoding sequences.
Mersen France Sb Sas


02/04/16
20160035946 
 Light emitting diode package structure, backlight module and display device patent thumbnailLight emitting diode package structure, backlight module and display device
The present disclosure provides a light emitting diode (led) package structure, a backlight module and a display device, and relates to the field of display technologies. The led package structure includes an encapsulation housing and an led chip encapsulated in the encapsulation housing.
Beijing Boe Display Technology Co., Ltd.


02/04/16
20160035945 
 White led chip and  manufacture patent thumbnailWhite led chip and manufacture
The present invention discloses a white led chip and method of manufacturing the same. The white led chip includes a flip blue led chip and a preformed conversion layer for light conversion, the method of manufacturing the white led chip includes the steps of preparing for a preformed conversion layer for light conversion, setting up at least one cavity on the conversion layer, for receiving a blue led chip(s), attaching the blue led chip into the cavity; and cutting the conversion layer into a single white led chip based on each cavity that received a blue led chip.
Apt Electronics Ltd.


02/04/16
20160035711 
 Stacked package-on-package memory devices patent thumbnailStacked package-on-package memory devices
3d stacked memory devices with copper pillars electrically connecting the package units are disclosed. A stacked package-on-package memory device includes a base chip package unit having a logic processing chip disposed on a base substrate; and a memory chip stack overlying the base chip unit.

02/04/16
20160035710 
 Light-emitting device and lighting device provided with the same patent thumbnailLight-emitting device and lighting device provided with the same
A light-emitting device capable of ensuring an electric connection between a light-emitting element and an electrode without generating any problem in practical use, by both connecting methods with a solder and a connector, and a lighting device provided with the light-emitting device are provided. The light-emitting device according to the present invention has a plurality of led chips, and a soldering electrode land and a connector connecting electrode land electrically connected to the chips, on a ceramic substrate.
Sharp Kabushiki Kaisha


02/04/16
20160035658 
 Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure patent thumbnailEncapsulated electronic chip device with mounting provision and externally accessible electric connection structure
An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, at least one electric connection structure mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and partially encapsulating the at least one electric connection structure so that part of a surface of the at least one electric connection structure is exposed to an environment, and a mounting provision configured for mounting the electronic device at a periphery device.. .
Infineon Technologies Ag


02/04/16
20160034670 
 Information-gathering device patent thumbnailInformation-gathering device
To provide a user-friendly information-gathering device enabling users to select buttons easily. An information-gathering device has a plurality of selection buttons, a communication module, and a cancel button.
Dai Nippon Printing Co., Ltd.


02/04/16
20160034411 
 Subsystem peripheral ownership scheduling and reconfiguration for highly integrated system on chips patent thumbnailSubsystem peripheral ownership scheduling and reconfiguration for highly integrated system on chips
Herein disclosed are systems, methods, and apparatus for dynamic switching of bus ownership, and in particular, for dynamic switching of peripheral bus ownership as well as all subsystems and/or peripherals on the bus. A peripheral bus access manager is distributed across multiple subsystems and controls access to a peripheral bus controller.
Qualcomm Innovation Center, Inc.


02/04/16
20160034206 
 Adaptive flash tuning patent thumbnailAdaptive flash tuning
The present invention includes embodiments of systems and methods for increasing the operational efficiency and extending the estimated operational lifetime of a flash memory storage device (and its component flash memory chips, luns and blocks of flash memory) by monitoring the health of the device and its components and, in response, adaptively tuning the operating parameters of flash memory chips during their operational lifetime, as well as employing other less extreme preventive measures in the interim, via an interface that avoids the need for direct access to the test modes of the flash memory chips. In an offline characterization phase, “test chips” from a batch of recently manufactured flash memory chips are used to simulate various usage scenarios and measure the performance effects of writing and attempting to recover (read) test patterns written with different sets of operating parameters over time (simulating desired retention periods)..

02/04/16
20160033975 
 Systems and methods for reducing leakage power of a system on chip with integrated thermoelectric cooling patent thumbnailSystems and methods for reducing leakage power of a system on chip with integrated thermoelectric cooling
Systems, methods, and computer programs are disclosed for reducing leakage power of a system on chip (soc). One such method comprises monitoring a plurality of temperature differentials across a respective plurality of thermoelectric coolers on a system on chip (soc).
Qualcomm Incorporated


02/04/16
20160033353 

Method of automatically inspecting internal gas leak and manufacturing led chip


A method of inspecting an internal gas leak in a gas line includes providing an internal gas leak inspection device including a main valve and a pressure gauge in a main line between a first valve and a second valve in the gas line, forming an airtight space in the main line by shielding the main valve and the second valve, measuring a pressure variation of the airtight space using the pressure gauge, and determining whether or not the gas leak occurs, based on the measured pressure variation.. .
Samsung Electronics Co., Ltd.


02/04/16
20160032347 

Novel for whole-cell bacterial bio-capacitor chip for detecting cellular stress induced by toxic chemicals


The present invention is directed to methods and a bio-capacitor sensing device for the detection of toxic chemicals using bacteria. The sensing platform comprises gold interdigitated capacitor with a defined geometry, a layer of carboxy-cnts immobilized with viable e.
Sabanci Universitesi


01/28/16
20160029489 

Production component-embedded substrate, and component-embedded substrate


A component-embedded substrate includes a cavity including through-holes penetrating through resin sheets in a stacked body of resin sheets having flexibility. An electronic chip component including external electrodes is disposed in the cavity.
Murata Manufacturing Co., Ltd.


01/28/16
20160029454 

Ac white led device


An alternate current (ac) white light-emitting diode (led) device is provided, which belongs to the technical field of white led manufacturing. The problem to be solved by the present invention is to low-costly overcome a series of deficiencies such as the stroboflash of an ac driven led, and the heat dissipation difficulty caused by an integrated packaging of multiple leds.
Changchun Institute Of Applied Chemistry, Chinese Academy Of Science


01/28/16
20160027977 

Light emitting diode package and lighting device using the same


A light emitting diode (led) package may include a package body provided with a pair of lead frames, and an led chip mounted on the package body and electrically connected to the lead frames through wire bonding. Each lead frame may include a first reflective layer disposed on a mounting surface on which the led chip is disposed and a second reflective layer disposed on the first reflective layer.
Samsung Electronics Co. Ltd.


01/28/16
20160026592 

Unified converged network, storage and compute system


A unified converged network, storage and compute system (ucnscs) converges functionalities of a network switch, a network router, a storage array, and a server in a single platform. The ucnscs includes a system board, interface components free of a system on chip (soc) such as a storage interface component and a network interface component operably connected to the system board, and a unified converged network, storage and compute application (ucnsca).
Stornetware Systems Pvt. Ltd.


01/28/16
20160025744 

Plasmonic substrate for multiplex assessment of type 1 diabetes


Disclosed are methods and materials providing fluorescence detection of autoantibodies present in individuals who have developed or are at risk for type 1 diabetes. Provided is a plasmonic chip capable of fluorescence-enhancement of >100-fold.
The Board Of Trustees Of The Leland Stanford Junior University


01/28/16
20160022899 

Diabetes regulator


An implantable device that continuously regulates the blood glucose levels of a type 1 diabetes mellitus patient is provided. The device which is implanted in the bloodstream, relies on a microfluidic chip and a microsieve that efficiently separate leukocytes away from an amount of blood received and an islet compartment made up of multiple islets (beta and alpha cells) from at least one compatible donor pancreas source.

01/28/16
20160021865 

Insect trap using uv led lamp


The present disclosure relates to an insect trap using an ultraviolet light-emitting diode (uv led) lamp, and more particularly, to an insect trap using, in place of a conventional uv light source lamp, a uv led lamp that significantly increases the insect trapping efficiency. The insect trap according to the present disclosure includes: a duct including a suction fan therein; a uv led lamp disposed in the air inlet portion of the duct and comprising a printed circuit board (pcb) that has a uv led chip mounted thereon; and a trapping portion provided in the air outlet portion of the duct..
Seoul Viosys Co., Ltd.


01/28/16
20160021864 

Insect trap using uv led lamp


The present disclosure relates to an insect trap using an ultraviolet light-emitting diode (uv led) lamp, and more particularly, to an insect trap using, in place of a conventional uv light source lamp, a uv led lamp that significantly increases the insect trapping efficiency. The insect trap according to the present disclosure includes: a uv led lamp disposed in an air inlet portion of the duct, and including a printed circuit board (pcb) that has a uv led chip mounted thereon; an installing portion for installing the uv led lamp on; and a trapping portion provided near the installing portion..
Seoul Viosys Co., Ltd.


01/21/16
20160020373 

Light-emitting device


A light-emitting device includes a base having an insulating part and a metal block; a light-emitting diode (led) chip over the base; a water soluble paste between the led chip and the base metal block for chip fixing and heat conduction; packaging glue covering the led chip; and the led chip bottom, water soluble paste and the base metal block form an all-metal thermal conducting path to achieve low a thermal resistance.. .
Xiamen Sanan Optoelectronics Technology Co., Ltd.


01/21/16
20160020371 

Chip-on-board uv led package and production method therefor


Disclosed is a chip-on-board uv led package. The chip-on-board uv led package comprises: a board in which electrode patterns are formed; a plurality of uv light sources which respectively comprise one or more uv led chip and a correspondingly provided encapsulating material or lens, and are arrayed in a predetermined array on the board; and a reflecting means which is provided on the board so as to increase the focal length of the light emerging from the plurality of uv light sources.
Uver Corporation Ltd.


01/21/16
20160018351 

Biochip comprising covalently immobilized bioactive molecules through organic couplers thereon


The present invention relates to a biochip comprising an electrode having a titania coating layer on its surface; an organic coupler comprising two or more carboxylic acid groups and capable of transporting electrons; and bioactive molecules, wherein the organic coupler is covalently bonded to a hydroxyl group of titania on the electrode surface through one carboxylic acid group, and to the bioactive molecules through other one or more carboxylic acid groups, a method for analyzing target molecules using the biochip, a method for diagnosing the development of diseases using the biochip, an electrode provided with a titania coating layer on its surface to which an organic coupler, comprising 2 or more carboxylic acid groups and capable of transporting electrons, is bound, wherein the organic coupler is covalently bonded to a hydroxyl group of titania on the electrode surface through one carboxylic acid group, and a method for preparing the electrode provided with a mesoporous titania coating layer, the method comprising coating a mixed solution of a titania precursor and a template polymer on the top of the electrode, and calcinating the coated electrode under an air flow condition.. .
Kyungpook National University Industry-academic Cooperation Foundation


01/14/16
20160014885 

Network device, system and method having a rotated chip floorplan


An information processing system including a support structure supporting a plurality of blade boards configured to detachably couple to an electronic interface of the structure. The blade boards each include a printed circuit board having a front board edge, one or more optical interface modules positioned on the front edge of the circuit board and a processing chip coupled to the circuit board and having a plurality of pin outs that are each electrically coupled to at least one of the optical interface modules via one or more traces on the circuit board.
Xpliant, Inc.


01/14/16
20160013629 

Fault detection protecting circuit


In a fault detection protecting circuit, an overheat detection unit is provided for each of communication channels on an ic chip, and detects the temperature in each communication channel as the detected temperature. A chip temperature detection unit detects the temperature at an arbitrary position on the ic chip as a reference temperature.
Denso Corporation


01/14/16
20160013361 

Light-emitting device and manufacturing method thereof


A manufacturing method of light-emitting device is disclosed. The method includes providing an led wafer comprising a substrate and a semiconductor stack formed on the substrate, wherein the semiconductor stack has a lower surface; providing a first laser to the led wafer to cut through the semiconductor stack with a depth into the substrate; providing and focusing a second laser on an interior of the substrate to form a plurality of textured areas in the substrate; and providing force on the led wafer to separate the led wafer into a plurality of led chips..
Epistar Corporation


01/14/16
20160013164 

Light emitter devices and methods for light emitting diode (led) chips


Light emitter devices for light emitting diodes (led chips) and related methods are disclosed. In one embodiment a light emitter device includes a substrate and a chip on board (cob) array of led chips disposed over the substrate.
Cree, Inc.


01/14/16
20160012865 

Semiconductor device having interconnection in package and manufacturing the same


A semiconductor device includes a first die connected to a first channel, the first die comprising a first memory chip; and a second die connected to a second channel, the second die comprising a second memory chip, the first and second channels being independent of each other and a storage capacity and a physical size of the second die being the same as those of the first die. The first and second dies are disposed in one package, and the package includes an interconnection circuit disposed between the first die and the second die to transfer signals between the first memory chip and the second memory chip..

01/14/16
20160012328 

Method for manufacturing sealing key, sealing key, and sealing device


A sealing key includes a container and an ic tag component fixed inside the container. The container has a shape that includes a body part and an insertion part that protrudes from the body part.
Toppan Printing Co., Ltd.


01/14/16
20160011781 

Memory chip, memory system, and accessing the memory chip


A memory chip, a memory system, and a method of accessing the memory chip. The memory chip includes a substrate, a first storage unit, and a second storage unit.
Samsung Electronics Co., Ltd.


01/14/16
20160011148 

Apparatus and evaluating characteristics of target molecules


Arrangements are described for evaluating characteristics of target molecules. A biochip is received which includes a substrate to which charged probe molecules are attached.
Dynamic Biosensors Gmbh


01/14/16
20160010807 

Led backlight apparatus and method


Backlit video display systems where the backlights (for example, led backlights) are controlled based at least in part on the content of the video signal of the video that is being displayed by the backlit video display system. The system can provide specific control of the three primary colors (for example, red, green and blue leds).
University Of Central Florida Research Foundation, Inc.


01/14/16
20160008704 

Multi-player casino table and dice game with side bets


Method and apparatus for original table (10) and dice game for casino play is disclosed. Game expands childhood pastime tic-tac-toe for multiple players.

01/07/16
20160007419 

Led illuminator apparatus, using multiple luminescent materials dispensed onto an array of leds, for improved color rendering, color mixing, and color temperature control


An led array includes three or more strings of bare leds mounted in close proximity to each other on a substrate. The strings of leds emit light of one or more wavelengths of blue, indigo and/or violet light, with peak wavelengths that are less than 490 nm.
Dicon Fiberoptics, Inc.


01/07/16
20160005938 

Led lighting module


Disclosed is an led lighting module (100) including a substrate (110), a (+) slug layer (121) and a (−) slug layer (123) formed on the substrate and spaced apart from each other at regular intervals, and at least one led chip (130) formed on the (+) slug layer or the (−) slug layer to have p-type and n-type electrodes, in which the (+) slug layer and the (−) slug layer each include an electrode layer formed on the substrate and a reflection layer covering the electrode layer, and the led chip is formed on the reflection layer.. .
Clphotonics Co., Ltd.


01/07/16
20160005933 

Led structure applied to backlight source


An led structure is applied to a backlight source to set a white light of a backlight module at a standard d65 position of the cie1931 chromaticity coordinates and used together with a display module. A red phosphor for emitting a red light, a yellow phosphor for emitting a yellow light, and a blue light led chip are provided.
Unity Opto Technology Co., Ltd.


01/07/16
20160005701 

Chip with shelf life


A semiconductor structure including a recess within a silicon substrate of an integrated circuit (ic) chip, wherein the recess is located near a circuit of the ic chip, and a metal layer in a bottom portion of the recess, wherein a portion of the silicon substrate is located below the metal layer in the bottom portion of the recess and above the circuit.. .

01/07/16
20160005675 

Double sided cooling chip package and manufacturing the same


A double sided cooling chip package is provided, wherein the package comprises a first heat sink; a second heat sink; a stacked chip arrangement comprising a first electronic chip, a second electronic chip and an interfacing substrate arranged between the first electronic chip and the second electronic chip and comprising electric circuitry on at least one main surface, wherein one of the first electronic chip and the second electronic chip is electrically connected to the electric circuitry of the interfacing substrate; and wherein the first electronic chip is attached to the first heat sink and the second electronic chip is attached to the second heat sink.. .
Infineon Technologies Ag


01/07/16
20160005451 

Fram cell with cross point access


A system on chip (soc) may have an array ferroelectric bit cells. The array may include a plurality of bit cells organized into a plurality of rows and columns.
Texas Instruments Incorporated


01/07/16
20160004807 

Method of making stacked chip layout


A method of making a stacked chip layout includes placing a first active circuit block over a central processing chip having a first area, the first active circuit block having a second area less than the first area. The method further includes placing a second active circuit block over the first active circuit block, the second active circuit block having a third area less than the first area, wherein the second active circuit block partially overlaps the first active circuit block and exposes a portion of the first active circuit block.
Taiwan Semiconductor Manufacturing Company, Ltd.


01/07/16
20160004647 

Method and circuit arrangement for accessing slave units in a system on chip in a controlled manner


A circuit arrangement and method for accessing slave units in a system on chip in a controlled manner, wherein an access of a master unit of the system on chip to one of the slave units is performed via a network-on-chip bus system using an access address, where a memory protection unit is integrated between the at least one master unit and the network-on-chip bus system, and access authorization of the master unit to a slave unit is checked by the memory protection unit by comparing the access address with specified address sections, and when an unauthorized access of the master unit to a slave unit is identified, the access address is modified by the memory protection unit such that the unauthorized access is terminated in the network-on-chip bus system.. .
Siemens Aktiengesellschaft


01/07/16
20160004011 

Method for polishing photonic chips


A method for polishing photonic chips is described. A gauge is placed in a photonic chip adjacent to an edge to be polished.
Bae Systems Information And Electronic Systems Integration Inc.


01/07/16
20160003424 

White led lamp secondary encapsulation structure capable of reducing blue-light hazards


A white led lamp secondary encapsulation structure capable of reducing blue-light hazards has a substrate (3), a blue light led chip (4) fixed on the substrate (3), and a yag yellow fluorescent powder layer (6) overlaid on the blue light led chip (4). A fluorescent outer lampshade (1) covering the blue light led chip (4) and the yag yellow fluorescent powder layer (6) is further fixed on the substrate (3).

01/07/16
20160000241 

Picture hanger


Systems and methods for securing an object to a surface are disclosed herein. The system includes a mounting block having a first section with a first cutout for receiving a ferromagnetic chip, a second section with a second cutout, and a panel.

12/31/15
20150382426 

Monolithic led chip in an integrated control module with active circuitry


A lighting device includes a monolithic led chip flip-chip mounted onto an interconnect structure. The monolithic chip includes led junctions formed from a single led junction.
Bridgelux, Inc.


12/31/15
20150381177 

Communication cell for an integrated circuit operating in contact and contactless mode, electronic chip comprising the communication cell, electronic system including the chip, and test apparatus


A communication cell for an integrated circuit includes a physical interface configured to supply an input signal (for example, a capacitive signal or an ohmic signal). A receiver circuit operates to receive the capacitive signal and generate a first intermediate signal.
Stmicroelectronics S.r.l.


12/31/15
20150380618 

Flip chip package structure and wafer level package structure


A flip chip package structure includes a package base and a led chip. The package base includes a first substrate, a first and a second electrodes disposed on the first substrate and a bonding layer disposed on the first substrate.
Playnitride Inc.


12/31/15
20150380389 

Red flip chip light emitting diode, package, and making the same


Flip chip leds comprise a transparent carrier and an active material layer such as alingap bonded to the carrier and that emits light between about 550 to 650 nm. The flip chip led has a first electrical terminal in contact with a first region of the active material layer, and a second electrical terminal in contact with a second region of the active material layer, wherein the first and second electrical terminals are positioned along a common surface of the active material layer.
Bridgelux, Inc.


12/31/15
20150380387 

Stacked chips attached to a heat sink having bonding pads


An integrated circuit comprises a heat sink devoid of electronic components and interposed between a back side of a bottom electronic chip and an upper exterior side of an encapsulation, the sink comprising a front side placed on the back side of the bottom electronic chip. The back side of the bottom electronic chip comprises pads and the front side of the sink comprises pads mechanically fastened to facing pads of the back side of the bottom electronic chip..
Commissariat à I'énergie Atomique Et Aux énergies Alternatives


12/31/15
20150380078 

Memory chip and layout design for manufacturing same


A static random access memory (sram) chip including a plurality of sram cells and a plurality of cell current tracking cells. Each of the sram cells include a source voltage reference conductor, a first ground reference conductor, two cross-coupled inverters, and two pass-gate devices.
Taiwan Semiconductor Manufacturing Company, Ltd.


12/31/15
20150379993 

Method of providing voice command and electronic device supporting the same


An electronic device, a method, and a chip set are provided. The electronic device includes a memory configured to store at least one of audio feature data of audio data and speech recognition data obtained by speech recognition of audio data; and a control module connected to the memory, wherein the control module is configured to update a voice command that is set to execute a function through voice, the function being selected based on at least one of the audio feature data, the speech recognition data, and function execution data executed in relation to the audio data..
Samsung Electronics Co., Ltd.


12/31/15
20150379388 

Golf ball incorporating ic chip


A golf ball includes an rfid tag provided with an ic chip and an antenna. A protective layer surrounds the outer periphery of the rfid tag.
Bridgestone Sports Co., Ltd.


12/31/15
20150379184 

Layout printed circuit board


A printed circuit board (pcb) is provided. The pcb has a specific routing module, having a first chip, a memory chip, and a plurality of traces designed for interconnection between the first chip and the memory chip according to a routing configuration between the first chip and the memory chip.
Mediatek Inc


12/31/15
20150379180 

Layout printed circuit board


A layout method for a printed circuit board (pcb) is provided. The method obtains a memory type of a dynamic random access memory (dram) to be mounted on the pcb, obtains a module group from a database according to the memory type of the dram, wherein the module group comprises a plurality of routing modules, obtains a plurality of pcb parameters, selects a specific routing module from the module group according to the pcb parameters, and implements the specific routing module into a layout design for pcb fabrication.
Mediatek Inc


12/31/15
20150378818 

Memory chip with error detection and retry modes of operation


A memory system includes a link having at least one signal line and a controller. The controller includes at least one transmitter coupled to the link to transmit first data, and a first error protection generator coupled to the transmitter.
Rambus Inc.


12/31/15
20150378613 

Storage device


A storage device comprises plural memory units and a storage controller that controls the memory units as a raid group. Each memory unit is provided with a nonvolatile semiconductor memory (e.g.
Hitachi, Ltd.


12/31/15
20150377885 

A determining acute respiratory distress syndrome (ards) related biomarkers, a method to monitor the development and treatment of ards in a patient


This invention concerns methods for monitoring the development of and for treatment of ards in a patient. The method for monitoring the development of ards is based on comparing the level or activity of the biomarkers obtained in a sample drawn at a later point of time to the levels or activities of the same biomarkers in a sample drawn at a previous point of time.
Turun Patenttitoimisto Oy


12/31/15
20150377574 

Magazine based, firearm safety modifying existing firearms employing a digital, close proximity communications system and a low power electro-permanent magnet interlock system


A magazine-based firearm interlock that can be added to a commercial firearm, with a release/locking device on the firing mechanisms enabled by an electro-permanent magnet, control electronics in the removable magazine, and authorized through a wearable authorization device. Modifications are applied to the trigger bar or sear mechanism which enables it to be changed to an unlocked state, which allows a shot to be fired, and to a locked state, which prevents a shot from being fired.
Anfcs, Llc


12/31/15
20150377472 

Overmolded replaceable light emitting diode lamp


Provided is an overmolded replaceable, light emitting diode (led) lamp that includes a light engine having an led chip mounted thereon and configured to generate and emit light, driver electronics in communication with the light engine, and configured to supply energy to the light engine for generating the light, and one or more connecting portions disposed within a base surface of the led lamp configured to connect the led lamp to a connection receiving portion of an external light device for operation thereof. The light engine, the driver electronics and the one or more connecting portions are overmolded by an overmolding material comprising a thermally conductive polymer material which forms a structural component of the led lamp, and mechanically and electrically connects the light engine, the driver electronics and the one or more connecting portions together..
General Electric Company


12/31/15
20150377426 

Surface light-emitting unit


A surface light-emitting unit of the present invention is an led module (30) for emitting light from an led chip (6) of a light-emitting element part (1) via a light flux control section (22) of a light flux control part (2), the light flux control section (22) being fixed by a plurality of columnar sections (21) above a fixing surface of a substrate (4) on which fixing surface the light-emitting element part (1) is fixed. This provides an appropriate gap between the light-emitting element part (1) and the light flux control section (22) for heat release..
Sharp Kabushiki Kaisha


12/31/15
20150377423 

Modularized led lamp tube


The led lamp tube contains a tubular body, a lighting module, end circuit boards, positioning elements, and caps. The lighting module contains a circuit board attached to a metallic base, led chips on the circuit board, and first connectors at the ends of the circuit board.
Taiwan Advance El Technology Ltd.


12/31/15
20150377421 

Omni-directional led bulb lamp


The present invention provides an omni-directional led bulb lamp, wherein the omni-directional led bulb lamp mainly consists of: a main body, a standard connector, a led disposing body, a copper circuit layer, an anti-soldering layer, a plurality of led chips, and a cover. Particularly, the led disposing body is designed to comprise a main disposing portion, a first folding portion and a second folding portion; moreover, the first folding portion and the main disposing portion have a first included angle, and the second folding portion and the first folding portion have a second included angle.
Formosa Optronics Co., Ltd.


12/31/15
20150376684 

Test kit and rapidly detecting live bacterium and test kit and rapidly determining appropriate antibiotic


A test kit for rapidly detecting a live bacterium is disclosed. The test kit for rapidly detecting a live bacterium includes ethidium monoazide, a magnetic bead, a first primer pair and a microfluidic chip.
National Tsing Hua University


12/31/15
20150375229 

Floating thermal contact enabled pcr


The present invention generally pertains to a system which utilizes floating thermal contact to enable pcr, in a thermal management device. Comprised of multiple thermal zones attached to a framework, each zone an individually actuated, isolated sub-assembly.
Gnubio, Inc.


12/24/15
20150373834 

Mounting block and a mounting assembly that incorporates the mounting block


A mounting block is provided that has a multi-level upper surface that is used to mount one or more ic chips and the printed circuit board (pcb) thereon at heights that allow the lengths of the bond wires interconnecting the chips with the pcb and/or with the other ic chips to be reduced. The distances between the levels of the multi-level surface are preselected based at least in part on the known height of the pcb and the known height of at least one of the ic chips such that when the chip and the pcb are mounted on the mounting block, the distance between the contact pads of the pcb and the contact pads of the ic chip is very small, thereby allowing the lengths of the bond wires to be kept very short..
Avago Technologies General Ip (singapore) Pte. Ltd


12/24/15
20150373446 

Multi-floor type mems microphone


A multi-floor type mems microphone includes a housing formed by a stack of circuit boards and provided with a first cavity, a second cavity in vertical communication with the first cavity, and a sound hole in communication with the second cavity. The second cavity has a vertical cross-sectional area smaller than that of the first cavity.
Merry Electronics (shenzhen) Co., Ltd.


12/24/15
20150372504 

Electromagnetic-coupling-module-attached article


An electromagnetic-coupling module including a radio ic chip and a feeder circuit board on which the radio ic chip is mounted and a feeder circuit including a resonant circuit having a predetermined resonant frequency is attached to an article. The article has a radiation element that radiates a transmission signal supplied from the feeder circuit of the electromagnetic-coupling module via electromagnetic coupling and that supplies a received reception signal to the feeder circuit via the electromagnetic coupling..
Murata Manufacturing Co., Ltd.


12/24/15
20150371976 

Display apparatus, display module and pixel structure thereof


A pixel structure located on a periphery of a display module includes a substrate, a flexible circuit board and a plurality of led chips. The substrate has at least one scribing tolerance reserving zone and a display unit mounting zone.
E Ink Holdings Inc.


12/24/15
20150371932 

Thin film rdl for nanochip package


A high density film adapted for nanochip package comprises three redistribution layers. A bottom redistribution circuit has a plurality of first bottom pads adapted for a nanochip to mount; and has a plurality of first top pads.

12/24/15
20150371927 

Combination of tsv and back side wiring in 3d integration


The embodiments of the present invention relate generally to the fabrication of integrated circuits, and more particularly to a structure and method for fabricating a 3d integration scheme for multiple semiconductor wafers using an arrangement of intra-wafer through silicon vias (tsvs) to electrically connect the front side of a first integrated circuit (ic) chip to large back side wiring on the back side of the first ic chip and inter-wafer tsvs to electrically connect the first ic chip to a second ic chip.. .
International Business Machines Corporation


12/24/15
20150371701 

Memory chip and layout design for manufacturing same


An embedded synchronous random access memory (sram) chip, includes a first single-port (sp) sram macro and a second sp macro. The first macro includes a first periphery circuit, and a plurality of first sram cells.
Taiwan Semiconductor Manufacturing Company, Ltd.


12/24/15
20150371202 

Credit card self-paying system using mobile communications terminal and method therefor


A credit card paying method comprises the steps of: firstly designating a mobile communications terminal capable of reading the information of a credit card from the magnetic and ic chip thereof for a virtual credit card paying terminal; and directly contacting a credit card with the mobile communications terminal designated as the virtual credit card paying terminal in order to pay a bill for an online or offline purchase made by the user of the mobile communications terminal, thereby preventing the credit card information of the user from being undesirably exposed to a third party because the payment for a purchase can be made by directly contacting the credit card with the mobile communications terminal.. .
Hankooknkc Co., Ltd.


12/24/15
20150371060 

System on chip


In a system on chip responder units comprise one or more responder elements and is associated with one or more protection units. A request analysis unit is arranged to receive from a requesting requestor unit a request for access to one or more target responder elements among responder elements within a target responder unit among the responder units.

12/24/15
20150370669 

Implementing enhanced wear leveling in 3d flash memories


A method, system and computer program product are provided for implementing enhanced wear leveling in a stack of flash memory chips. A flash memory includes plurality of flash memory chips including a number n data chips and one or more spare chips.
International Business Machines Corporation


12/24/15
20150370635 

Implementing enhanced wear leveling in 3d flash memories


A method, system and computer program product are provided for implementing enhanced wear leveling in a stack of flash memory chips. A flash memory includes plurality of flash memory chips including a number n data chips and one or more spare chips.
International Business Machines Corporation


12/24/15
20150369997 

Light source module and backlight unit including the same


Provided are a light source module and a backlight unit. According to an embodiment, the light source module comprises a circuit board, at least one led chip electrically connected onto the circuit board, a reflective surface on an upper surface of the led chip configured to reflect light, and a fluorescent surface on at least one side surface of the led chip configured to emit the light..
Samsung Display Co., Ltd.


12/24/15
20150369806 

Detection of viral diseases using a biochip that contains gold nanoparticles


A sensor for detecting molecular interactions between a target and a binding domain by electrochemical impedance spectroscopy. The sensor includes an anodic aluminum oxide barrier layer having a gold-coated array of regularly spaced nano-hemispheres and gold nanoparticles coated with a binding domain attached thereto.
Academia Sinica


12/24/15
20150369634 

Surfaces with embedded sensing and actuation networks using complementary-metal-oxide-semiconductor (cmos) sensing chips


A device and method for area sensing and actuation comprises highly scalable sensing and actuation network that can control a high density of sensing and actuation elements over a physical area. The device comprises a matrix of cmos sensing chips that each comprise a plurality of sensing electrodes arranged in a matrix of columns and rows along horizontal wires and vertical wires.
Indian Institute Of Science


12/24/15
20150369464 

Multipurpose multicolor led light strip


A multipurpose multicolor led light strip contains at least one bulb and two power cords, each bulb includes three wicks for illuminating three-color lights and a control chip for controlling the three wicks; the three wicks and the control chip are covered in a cavity of each bulb by a transparent medium; the two power cords are electrically connected with each bulb. The three wicks include a first wick for illuminating red light, a second wick for illuminating blue light, and a third wick for illuminating green light.

12/24/15
20150368705 

Method for sequencing a template nucleic acid immobilized on a substrate


The present invention is directed to sequencing of nucleic acids. A method is provided for sequencing based on immobilized nucleic acid on a surface.
Dynamic Biosensors Gmbh


12/24/15
20150366703 

Alternating hot and cold therapy apparatus


An alternating hot and cold therapy apparatus that applies alternating heat and cold to a pain affected area. The apparatus includes a housing, a therapy pad, and a flexible hose connecting the housing to the therapy pad.

12/17/15
20150365108 

System and module comprising an electrically erasable programmable memory chip


A controller includes a link interface that is to couple to a first link to communicate bi-directional data and a second link to transmit unidirectional error-detection information. An encoder is to dynamically add first error-detection information to at least a portion of write data.
Rambus Inc.


12/17/15
20150364816 

Millimeter wave integrated circuit with ball grid array package including transmit and receive channels


A millimeter wave integrated circuit (ic) chip. The ic chip comprises an ic die and a wire bond ball grid array package encapsulating the ic die.
Texas Instruments Incorporated


12/17/15
20150364657 

Method of manufacturing light-emitting device


A method of manufacturing a light-emitting device includes providing an led chip mounted on a base substrate, and dripping a droplet of a phosphor-containing resin to cover the led chip. The droplet is dot-printed on the base substrate and/or the led chip by inkjet printing..
Toyoda Gosei Co., Ltd.


12/17/15
20150364656 

Led packaging structure and method, display device and illuminating device


According to an led packaging structure and packaging method thereof provided by the present disclosure, the led may comprise a support having a cavity and at least one led chip placed in the cavity. After the cavity is filled with a fluorescent adhesive, at least one concave lens structure may be formed at a light emitting side of the led chip..
Boe Optical Science And Technology Co., Ltd.


12/17/15
20150364457 

Wafer leveled chip packaging structure and method thereof


A wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias.. .
Invensas Corporation


12/17/15
20150364452 

Led light-emitting device


Provided is a led light-emitting device including: a carrier, which is a transparent body, and on a carrying surface of which conductors are provided; a plurality of led chips, which are electrically connected to the conductors by way of eutectic bonding, so as to realize electrical connection among the plurality of led chips; an encapsulation structural member, which is a transparent body and encapsulates on the periphery of the carrier and the led chips; and a pair of electrodes, wherein positive electrode/negative electrodes in the pair of electrodes are electrically connected to the led chips located at the most upstream/most downstream of a current transmission in the plurality of led chips by means of the conductors, and extend to the outside of the encapsulation structural member.. .

12/17/15
20150364401 

Double-sided segmented line architecture in 3d integration


Embodiments of the present invention relate generally to electronic components such as semiconductor wafers and more particularly, to a double-sided three-dimensional (3d) hierarchal architecture scheme for multiple semiconductor wafers using an arrangement of through silicon vias (tsvs) and backside wiring. In an embodiment a first word line architecture may be formed on a front side of an ic chip and connected to a second word line architecture formed on a back side of the ic chip through intra-wafer, tsvs, thereby relocating required wiring to the back side of the ic chip..
International Business Machines Corporation


12/17/15
20150364206 

Memory system and control method


A memory system according to embodiments comprises a memory chip that includes a memory cell array having a plurality of memory cells, a first writing unit that writes first data in a first memory cell in the memory cell array, and a second writing unit that writes second data in a second memory cell which is adjacent to the first memory cell. The second data is used in adjusting a threshold value of the first memory cell..
Kabushiki Kaisha Toshiba


12/17/15
20150362975 

Selective retransmission in near threshold network on chip


A method is provided for each router to individually manage retransmissions at run time in a single chip computer die or a single computer that includes cores or compute nodes and routers that interconnect the cores or the compute nodes. Each router compares static energy saving and dynamic energy increase from turning off a retransmission buffer of the router in a monitoring phase.
Empire Technology Development Llc


12/17/15
20150362554 

System on chip


A system on chip (soc) is provided. The system on chip (soc) includes: at least one core including a plurality of scan chains operated by a trigger signal; a delay controller generating a delay target selection signal selecting at least one of the plurality of scan chains and a delay depth control signal indicating a delay depth of the trigger signal; and a delay signal generating unit delaying the trigger signal based on the delay target selection signal and the delay depth control signal and providing the delayed trigger signal to the plurality of scan chains..
Samsung Electronics Co., Ltd.


12/17/15
20150362487 

Multi-diagnosis parallel-type linear biochip


The present invention is related to a parallel line biochip for multiplex diagnosis. The parallel line biochip for multiplex diagnosis includes a plurality of line strips disposed in parallel, and a well configured to immobilize the line strips.
Proteometech Inc.


12/17/15
20150362149 

Solid state bidirectional light sheet having vertical orientation


A solid state, bidirectional light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare led chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode.
Quarkstar Llc


12/17/15
20150361419 

Microfluidic chip for extracting nucleic acids, device for extracting nucleic acids comprising same, and extracting nucleic acids using same


The present invention relates to a microfluidic chip for extracting nucleic acids, a nucleic acid extraction device having the same, and a nucleic acid extraction method using the same that can provide micro-miniaturization and ultra high speed, while maintaining and/or improving reliable nucleic acid extraction efficiencies, unlike the existing nucleic acid extraction device and method.. .
Nanobiosys Inc.


12/10/15
20150358791 

System architecture for multiple antenna/services remote radio head


One embodiment of the present invention provides a remote radio head (rrh) for a wireless communication system. The rrh includes a first integrated circuit (ic) chip that comprises multiple functional blocks, a second ic chip that comprises at least a frequency up-converter for up-converting outputs of the dac block to a radio frequency (rf) domain and a frequency down-converter for down-converting rf signals received from one or more antennas, and a plurality of rf front-end components that are packaged into a system in a package (sip) module.
Aviacomm Inc.






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