|| List of recent Chip-related patents
| Semiconductor memory device|
A crc code is generated from an original data, a bch code is generated with respect to the original data and the crc code, and the original data, the crc code, and the bch code are recorded in pages selected from different planes of a plurality of memory chips. An rs code is generated from the original data across pages, a crc code is generated with respect to the rs code, a bch code is generated with respect to the rs code and the crc code, and the rs code, the crc code, the bch code are recorded in a memory chip different from a memory chip including the original data.
| Data protection in near field communications (nfc) transactions|
Described herein are architectures, platforms and methods for protecting sensitive data that are utilized during near field communications (nfc) communications or transactions and more particularly, a system on chip (soc) microcontroller that is configured to control processing of the sensitive data during the nfc transactions is described. The sensitive data may include, but not limited to, personal information, financial information, or business identification numbers..
| Method for aligning a biochip|
A method of aligning a semiconductor chip includes forming a semiconductor chip with a light-activated circuit including at least one photosite, positioning the semiconductor chip relative to a device, and illuminating the positioned semiconductor chip. The method further includes generating an rf signal with an rf circuit based upon illumination of the at least one photosite, and determining the position of the photosite with respect to the device based upon the generated rf signal..
| Sample liquid injection jig set|
A liquid injecting jig is provided. The liquid injecting jig includes a jig configuration including a plurality of parts adapted to be in cooperative engagement so as to position a channel within the jig configuration, wherein the jig configuration is adapted to fit an opening through which the channel is adapted to be received so as to expose the channel from the jig configuration.
| Mimo-ofdm system for robust and efficient neuromorphic inter-device communication|
A multiple input multiple output (mimo) orthogonal frequency division multiplexing (ofdm) system for inter-device communication is described. Information data from each neuromorphic chip is coded and modulated, on the basis of destination, into different channels.
| Light emitting apparatus, and light irradiation apparatus provided with light emitting apparatus|
A light emitting device (1) includes (i) a surface-mounted light emitting section (10a), (ii) a lens section (30) which is provided on a light exit side of the surface-mount light emitting section (10a), and (iii) a frame section (40) which fixes a periphery of the lens section (30). In the surface-mounted light emitting section (10a), a resin layer (17) that contains a red fluorescent material (17b) covers at least one (1) blue led chip (14a).
| Thermal regulation for solid state memory|
A chassis for a storage system contains a digital chamber that houses conventional electronic components and a thermal chamber that houses non-volatile solid state memory such as flash memory. A temperature regulating system monitors temperature within the digital chamber to keep the components therein below their maximum junction temperature.
| Process control monitoring for biochips|
The present disclosure provides a biosensor device wafer testing and processing methods, system and apparatus. The biosensor device wafer includes device areas separated by scribe lines.
| Electronic device, package, electronic apparatus, and moving object|
A physical quantity sensor includes an ic chip and a package base mounted with the ic chip. The package base includes a first wiring layer provided with bonding pads connected to the ic chip via a bonding wire, a second wiring layer overlapping the first wiring layer in plan view, and an insulating layer provided between the first wiring layer and the second wiring layer.
| Light emitting device, light emitting element mounting method, and light emitting element mounter|
Disclosed is a light emitting device including: a light emitting element including an led chip and a phosphor layer provided at the light emitting side of the led chip; and a substrate on which the light emitting element is bonded by an adhesive material. The adhesive material is an anisotropic conductive material..
| Light emitting diode backlight module|
A light emitting diode (led) backlight module includes a transparent conductive substrate that has an electrode-bearing surface and a plurality of transparent conductive electrodes disposed on the electrode-bearing surface, an led chip that is welded on the transparent conductive electrodes by flip-chip packaging techniques, and a reflecting member that is spaced apart from and that corresponds in position to the led chip so as to reflect light generated from the led chip to the transparent conductive substrate.. .
| Light emitter components and methods having improved performance|
Light emitter components and methods having improved performance and related methods are disclosed. In one embodiment, a light emitter component can include a submount and at least one light emitting diode (led) chip disposed over the submount.
| Lighting device, backlight module and illumination module|
Various examples of a lighting device, backlight module and illumination module are described. A lighting device includes a carrier component, an led chip, a thermistor, and a plurality of metal wires.
| Sealed infrared imagers|
The architecture, design and fabrication of array of suspended micro-elements with individual seals are described. Read out integrated circuit is integrated monolithically with the suspended elements for low parasitics and high signal to noise ratio detection of changes of their electrical resistance.
| Method of designing & manufacturing an anti-counterfeiting rfid tag, the anti-counterfeiting rfid tag and the anti-counterfeiting package|
The invention relates to a method of designing & manufacturing anti-counterfeiting rfid tags, the anti-counterfeiting rfid tags obtained and the anti-counterfeiting package related. The invention belongs to application of radio frequency identification technology.
|Test control using existing ic chip pins|
An apparatus and method are provided for testing normal circuitry in an integrated circuit, the method including writing test protocols into a plurality of test registers using an enable pin and a switch pin in a first mode, storing a logic high signal in one of the plurality of test registers once the writing is completed, switching from the first mode to a second mode if the one of the plurality of test registers stores the logic high signal, and testing the normal circuitry using the enable pin and the switch pin in the second mode.. .
|Compression status bit cache and backing store|
One embodiment of the present invention sets forth a technique for increasing available storage space within compressed blocks of memory attached to data processing chips, without requiring a proportional increase in on-chip compression status bits. A compression status bit cache provides on-chip availability of compression status bits used to determine how many bits are needed to access a potentially compressed block of memory.
|Microfluidic interface for highly parallel addressing of sensing arrays|
Disclosed is a spotter device and methods for the formation of microassays, biochips, biosensors, and cell cultures. The spotter may be used to deposit highly concentrated spots of protein or other materials on a microarray slide, wafer, or other surface.
|Large receive offload functionality for a system on chip|
Various aspects provide large receive offload (lro) functionality for a system on chip (soc). A classifier engine is configured to classify one or more network packets received from a data stream as one or more network segments.
A plurality of memory chips each have an alert terminal that notifies the outside that the memory chip has detected a predetermined error. The plurality of memory chips are mounted on memory module 100.
A semiconductor device has a first controlled chip, including a first replica output circuit having the same configuration as a first output circuit, a first zq terminal connected to the first replica output circuit, a first through electrode connected to the first zq terminal, and a first control circuit which sets the impedance of the first replica output circuit. A control chip includes a second zq terminal connected to the first through electrode, a comparator circuit which compares a voltage of the second zq terminal with a reference voltage, and a second control circuit 123 which performs a process based on a comparison by the comparator circuit.
|Core module for wireless sensing system|
A core module of wireless sensing system is provided for receiving, processing and delivering environmental information, inclusive of a rf front-end circuit, a power control circuit, an analog front-end detection circuit and a baseband signal processor. A soc (system on chip) may be designed by including an electronic tag antenna, an impedance variation circuit and a sensor to form the wireless sensing system with the combination of a remote reader, such that the core module may be applied for wirelessly sensing the environmental information, such as physiological information of human heartbeat response, to achieve the effect of compactness, power saving and error detection..
|Millimeter wave wafer level chip scale packaging (wlcsp) device and related method|
Various embodiments include wafer level chip scale package (wlcsp) structures and methods of tuning such structures. In some embodiments, the wlcsp structure includes: a printed circuit board (pcb) trace connection including at least one pcb ground connection connected with a pcb ground plane; a set of ground solder balls each contacting the printed circuit board trace connection; a set of chip pads contacting each of the ground solder balls in the set of ground solder balls; a chip ground plane connecting the set of chip pads; and a signal interconnect interposed between two of the set of ground solder balls, the signal interconnect including: a signal trace connection electrically isolated from the pcb ground plane; a signal ball contacting the signal pcb trace connection; a chip pad contacting the signal ball, and a signal trace connection on a chip contacting the chip pad..
|Led chip resistant to electrostatic discharge and led package including the same|
A light emitting diode chip and a light emitting diode package including the same. The light emitting diode chip includes a substrate, a light emitting diode section disposed on the substrate, an inverse parallel diode section disposed on the substrate and connected inversely parallel to the light emitting diode section.
An led module has an electrically insulating main body, a base surface and a mounting surface located opposite the base surface. A number of electrical connection contacts are arranged at the mounting surface.
|Led chip and method for manufacturing the same|
The invention provides a substrate structure used for manufacturing a light-emitting diode and a method for manufacturing the light-emitting diode. The substrate structure includes a substrate having a first surface and a second surface opposite to the first surface and a plurality of grooving structure formed on the first surface of the substrate.
A light-emitting device includes a plurality of led chips arranged in series and each including a chip substrate and a crystal layer including a light-emitting layer. One of the plurality of led chips is configured such that the chip substrate thereof includes a side surface facing another adjacent led chip of the plurality of led chips.
An led device is disclosed in which an led chip is encapsulated in a encapsulant. The led device includes an led chip mounted on a support and electrically connected and an encapsulant encapsulating the led chip, wherein the encapsulant is a transparent amorphous solid made of a metal oxide, and the solid contains as a major component at least one metal oxide selected from the group consisting of al2o3, mgo, zro, la2o3, ceo, y2o3, eu2o3, and sco..
|Multichip wafer level package (wlp) optical device|
Optical devices are described that integrate multiple heterogeneous components in a single, compact package. In one or more implementations, the optical devices include a carrier substrate having a surface that includes two or more cavities formed therein.
|Antenna, method of manufacturing the antenna, and wireless ic device|
An antenna includes first and second radiation portions including one lead wire that is folded back into a loop shape to define a folded-back portion and that includes a first power feed portion at a first end and a second power feed portion at a second end. The lead wire portion extending toward the folded-back portion and the lead wire portion extending through the folded-back portion are close enough to each other near each of the first and second power feed portions in the first and second radiation portions, respectively, to be electromagnetically coupled to each other.
|Geographic chip locator|
A system obtains and transmits and stores information, including location information of an article associated with a chip. The system may contain at least: an article intimately associated with an electromagnetically interrogatable chip; a hand-held information receiving and transmitting device that can interrogate the chip, the hand-held information receiving and transmitting device comprising an rfid and/or nfc reader to electromagnetically interrogate the chip; the chip containing communicable information relating to the article; a distal server in wireless two-way communication with the hand-held information receiving and transmitting device, the distal server capable of receiving, storing and transmitting information from the chip transmitted through the hand-held device.
|Application-specific led module and associated led point source luminaires|
Led downlight and other point source luminaires contain one or more application-specific led modules with integrated optical, mechanical, and heat dissipation systems; a fluted extruded metal housing acts as a heat sink as well as the luminaire housing containing the as-led module(s) or receiving a rotatable spherical housing that contains the as-led module, printed circuit board units, and wires; mounting brackets; and a remote led driver. The extruded aluminum housing (and heat sink) may be comprised of a single cylinder or multiple concentric cylinders.
|Light emitting device and display device|
There are provided a light-emitting device for use in a backlight unit of a display apparatus equipped with a display panel, which can be made lower in profile and is capable of applying light to the display panel with uniformity in the brightness of the display panel in the planar direction of the display panel, as well as a display apparatus equipped with the light-emitting device. A backlight unit includes a printed substrate, a plurality of light-emitting sections each having a base support, an led chip and a lens, and a reflective member surrounding the light-emitting section.
|Mtj three-axis magnetic field sensor and encapsulation method thereof|
The present invention discloses a mtj triaxial magnetic field sensor, comprising an x-axis bridge sensor that has a sensing direction along an x-axis, a y-axis bridge sensor that has a sensing direction along a y-axis, a z-axis sensor that has a sensing direction along a z-axis, and an asic chip connected with and matched to the x-axis, y-axis, and z-axis sensor chips. The z-axis sensor includes a substrate and mtj magnetoresistive elements deposited on the substrate.
|Light-emitting apparatus and method for manufacturing same|
A light-emitting apparatus including: a substrate; an led chip mounted on a first surface of the substrate; a fluorescent material-containing layer containing a first fluorescent material, which fluorescent material-containing layer is provided above the first surface of the substrate so as to cover the led chip; and a color-adjusting fluorescent layer that contains a second fluorescent material, which color-adjusting fluorescent material layer is formed in a layer provided on an outer side of the fluorescent material-containing layer in an emission direction, the color-adjusting fluorescent layer being formed in dots. Thus, the present invention provides a light-emitting apparatus and a method for manufacturing the same, each making it possible to carry out fine color adjustment so as to prevent a subtle color shift that occurs due to a factor such as a difference in concentration of a fluorescent material or the like..
|Solar powered ic chip|
A self-powered circuit package includes a substrate and an integrated circuit (ic). The ic is mounted on a surface of the substrate.
Provided is an rfid tag, wherein a communication distance of several centimeter or more can be secured and the cost of which can be reduced in comparison to conventional on-chip antennas, even when being compact in size (square shaped with a side of 1.9 to 13 mm). The rfid tag (80) comprises an antenna (20), an ic chip (30) connected to the antenna (20), and a sealing material (10) that seals the ic chip (30) and the antenna (20).
|Composite ic card|
Provided is a composite ic card including: a card base having a recess; an antenna sheet arranged inside the card base; an ic module arranged in the recess of the card base. The ic module includes an ic chip having a module substrate provided with an external terminal, and a first coupling coil.
|Magneto cyclist power sensor|
This device is a sensor whose output can be used for providing the cyclist with a display of the power he/she is delivering to the wheels of the bicycle while he/she is riding. It can also be used to determine bike gear selection and bike ground speed.
|System on chip with embedded security module|
An embedded security module includes a security processor, volatile and non-volatile memory, and an interface. The security processor includes transistors formed in one or more semiconductor layers of a semiconductor die, and implements one or more security-related functions on data and/or code accessed by the security processor.
It is an object of the invention to improve the production efficiency in sealing a thin film integrated circuit and to prevent the damage and break. Further, it is another object of the invention to prevent a thin film integrated circuit from being damaged in shipment and to make it easier to handle the thin film integrated circuit.
|Method for manufacturing light emitting diode package having a voltage stabilizing module consisting of two doping layers|
A method for manufacturing an led (light emitting diode) package comprises following steps: providing an electrically insulated base, the base having a first surface and a second surface opposite thereto; an annular voltage stabilizing module is formed on the first surface; a first electrode is formed on the first surface, wherein the first electrode is attached to and encircled by the voltage stabilizing module; a second electrode is formed on the first surface, wherein the second electrode is attached to and encircles the voltage stabilizing module; an led chip is mounted on the first electrode, wherein the led chip is electrically connected to the first and second electrodes, and the led chip and the voltage stabilizing module are connected in reverse parallel. Finally, an encapsulative layer is brought to encapsulate the led chip..
|Biochip substrate and method for producing same|
A substrate for biochips, which does not induce autofluorescence, which can immobilize a biologically relevant substance(s) easily, which can prevent the undesirable spread of a liquid spot which is added dropwise on the biochips when using the biochips, in which the adhesion between a carbon-containing layer and an aluminum material is high, and which can be produced at lower cost than the known substrate for biochips; a method for producing the substrate; and a biochip including the substrate are disclosed. The substrate for biochips comprises a carbon-coated aluminum material, wherein the carbon-coated aluminum material comprises an aluminum material and a carbon-containing layer formed on at least one surface of the aluminum material, and further comprises an interposing layer which is formed between the aluminum material and the carbon-containing layer, and which interposing layer contains aluminum element and carbon element..
|Processors including key management circuits and methods of operating key management circuits|
A system on chip includes a central processing unit and a key manager coupled to the central processing unit. The key manager includes a random number generator configured to generate a key and a key memory configured to store the key and a user setting value associated with the key..
|Heat sink module and omnidirectional led lamp holder assembly using same|
An omnidirectional led lamp holder assembly includes a heat sink module including a heat sink base and radiation fins around the heat sink base, a lampshade and an electrical connector respectively mounted at opposing top and bottom sides of the heat sink module. The heat sink base is a one-piece extruded member defining a tubular heat-transfer base portion, a broad platform and a hollow protruding mount for holding led chips at different angles.
|System on chip for updating partial frame of image and method of operating the same|
A system on chip (soc) and a method of operating the same are provided. The soc includes a central processing unit (cpu) controlling a memory operation and a display operation on a current frame of an image based on generation of the image and an interrupt signal; an image generator requesting data of the current frame from a memory according to control of the cpu; a ud unit determining whether the current frame is updated, detecting whether an update region is a partial frame based on virtual addresses included in a request of the image generator, and outputting the interrupt signal corresponding to the update region to the cpu; a memory controller storing the update region in the memory according to the control of the cpu; and a display controller accessing the memory and outputting the update region to a display device according to the control of the cpu..
|Surface mount device-type low-profile oscillator|
A surface mount device-type low-profile oscillator is provided. A main surface of an ic chip unit is joined to a bottom surface where the external terminals of a crystal unit section are formed.
|Wafer leveled chip packaging structure and method thereof|
A wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias.. .
A package-on-package device includes memory chips side-by-side on a package substrate. Accordingly, it is possible to reduce a thickness of a semiconductor package.
|Led package and metallic frame thereof|
A light emitting diode package includes a metallic frame, and an led chip disposed on the metallic frame. The metallic frame includes first and second metal plates arranged side by side with a space therebetween, and two support arms extending integrally and respectively from two opposite ends of the second metal plate to a level higher than the second top surface and that further extend toward the first metal plate at a level higher than the first top surface crossing the space.
|Submount-free light emitting diode (led) components and methods of fabricating same|
Light emitting devices include a light emitting diode (led) chip having an anode contact and a cathode contact on a face thereof. A solder mask extends from the gap between the contacts onto one or both of the contacts.
|Light emitting devices and methods|
Light emitting devices and methods such as light emitting diodes (leds) are disclosed for use in higher voltage applications. Variable arrangements of leds are disclosed herein.
|Light emitter devices and methods for light emitting diode (led) chips|
Light emitter devices for light emitting diodes (led chips) and related methods are disclosed. In one embodiment a light emitter device includes a substrate and a chip on board (cob) array of led chips disposed over the substrate.
|Removal of electronic chips and other components from printed wire boards using liquid heat media|
Systems and methods for the removal of electronic chips and other components from pwbs using liquid heat media are generally described. The systems and methods described herein can be used to remove solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components from pwbs.
|Welding method for substrate and membrane of membrane mobile polymer microfluidic chip|
The present invention discloses a welding method for substrate and membrane of membrane mobile polymer microfluidic chip, which relates to the manufacturing technology of membrane mobile polymer microfluidic chip and comprises the following steps: before the welding, the substrate is fixed, the surface of the substrate is covered with the membrane; the membrane is pressed against the surface of the substrate, and in the course of welding, the laser irradiates the welding area on the substrate through the membrane, and the welding area fuses and then welds the substrate and membrane together. The present invention realizes the firm welding between membrane and substrate of membrane mobile polymer microfluidic chip, and ensures that the weld face is flat and uniform..
|Data processing device with serial bus that needs initialization before use|
A data processing device 1 comprises: first processors (2-i (i=1, 2, . .
Embodiments of the invention relate to a function-level simulator for modeling a neurosynaptic chip. One embodiment comprises simulating a neural network using an object-oriented framework including a plurality of object-oriented classes.
|Gan type light emitting diode device and method of manufacturing the same|
The present invention relates to a gan type led device and a method of manufacturing the same. More particularly, there are provided a gan type led device including an led chip; and a submount eutectic-bonded with the led chip through an adhesive layer, wherein the adhesive layer is configured by soldering a plurality of metallic layers in which a first metallic layer and a second metallic layer are sequentially stacked, and the second metallic layer is formed in a paste form.
|Resin application apparatus, optical property correction apparatus and method, and method for manufacturing led package|
A resin application apparatus includes: an optical property measurement unit measuring an optical property of light emitted from a light emitting diode (led) chip which is mounted on a package body and to which transparent resin is not applied; and a resin application unit applying light conversion material-containing transparent resin to the led chip in accordance with a resin application amount which is decided depending on the optical property measured by the optical measurement unit.. .
|Managing packet flow in a switch faric|
In a method for managing packet flow in a switch fabric comprising a plurality of fabric chips, wherein a packet comprises a counter, a determination as to whether the packet has been detoured around an unavailable fabric link and a determination as to whether the packet is making forward progress are made. In addition, a value of the counter in the packet is modified in response to a determination that the packet has been detoured around an unavailable fabric link and a determination that forward progress is not being made..
|Creating multiple noc layers for isolation or avoiding noc traffic congestion|
Systems and methods described herein are directed to solutions for network on chip (noc) interconnects that automatically and dynamically determines the number of layers needed in a noc interconnect system based on the bandwidth requirements of the system traffic flows. The number of layers is dynamically allocated and minimized by performing load balancing of the traffic flows between the channels and routes of different noc layers as they are mapped.
|Implementing a switch fabric responsive to an unavailable path|
In a method for implementing a switch fabric, in a first fabric chip, a packet comprising an identification of a destination node chip is received from a source fabric chip, and a determination that a first path in the switch fabric along which the packet is to be communicated toward the destination node chip is unavailable is made. In addition, a determination as to whether another path along which the packet is to be communicated toward the destination node chip that does not include the source fabric chip is available is made.
|Nonvolatile logic array with built-in test drivers|
A system on chip (soc) provides a nonvolatile memory array that is configured as n rows by m columns of bit cells. Each of the bit cells is configured to store a bit of data.
|Nonvolatile logic array with built-in test result signal|
A system on chip (soc) provides a nonvolatile memory array that is configured as n rows by m columns of bit cells. Each of the bit cells is configured to store a bit of data.
|Two capacitor self-referencing nonvolatile bitcell|
A system on chip (soc) provides a memory array of self referencing nonvolatile bitcells. Each bit cell includes two ferroelectric capacitors connected in series between a first plate line and a second plate line, such that a node q is formed between the two ferroelectric capacitors.
|Four capacitor nonvolatile bit cell|
A system on chip (soc) provides a memory array of nonvolatile bitcells. Each bit cell includes two ferroelectric capacitors connected in series between a first plate line and a second plate line, such that a node q is formed between the two ferroelectric capacitors.
|Light-emitting device and method for compensating chromaticity of light-emitting device|
An object of the present invention is to provide a light-emitting device having a temperature compensation function implemented with simple circuitry, and a method of temperature compensation in such a light-emitting device. More specifically, the invention provides a light-emitting device and a method of temperature compensation using a light-emitting device, wherein the light-emitting device includes a substrate, a first led chip which is arranged on the substrate, and which has a characteristic such that Δx and Δy, each representing an amount of displacement on an xy chromaticity diagram, both are negative as temperature rises, and a second led chip which is arranged on the substrate, and which has a characteristic such that Δx and Δy, each representing an amount of displacement on an xy chromaticity diagram, both are positive as temperature rises..
|Wireless apparatus and method for manufacturing same|
A wireless apparatus has a board, a power amplifier high-frequency ic chip, and a process variations detector. The process variations detector monitors a circuit characteristic variation amount due to process variations.
|Hand-held wireless platform and optics for measurement of dna, rna, micrornas, and other markers of pathogens, genetic diseases, and cancer|
The present invention provides compositions for making and methods of using a hand-held nucleic acid amplification device, comprising a disposable biochip with a series of sample wells, each sample well having a novel optical arrangement that includes a light-emitting diode (led) and a single light capturing element (e.g. A photodiode) for quickly measuring light emissions from biological samples such as nucleic acid amplification reactions.
|Vertically stacked image sensor|
A vertically stacked image sensor having a photodiode chip and a transistor array chip. The photodiode chip includes at least one photodiode and a transfer gate extends vertically from a top surface of the photodiode chip.