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Chip patents



      
           
This page is updated frequently with new Chip-related patent applications. Subscribe to the Chip RSS feed to automatically get the update: related Chip RSS feeds. RSS updates for this page: Chip RSS RSS


Light-emitting diode chip

Light-emitting diode chip

Date/App# patent app List of recent Chip-related patents
07/02/15
20150188847
 Streaming bridge design with host interfaces and network on chip (noc) layers patent thumbnailnew patent Streaming bridge design with host interfaces and network on chip (noc) layers
Systems and methods described herein are directed to streaming bridge design implementations that help interconnect and transfer transaction packets between multiple source and destination host interfaces through a network on chip (noc) interconnect, which includes a plurality of noc router layers and virtual channels (vcs) connecting the router layers. Implementations are configured to support a variety of different traffic profiles, each having a different set of traffic flows.
07/02/15
20150188765
 Multimode gaming server patent thumbnailnew patent Multimode gaming server
Aspects of the present invention relate to a multimode gaming server with different types of computing resources provided within the server. The different computing resources can be optimized for different computing tasks.
07/02/15
20150188361
 Bypass type 220v grid voltage sag prevention device and control method therefor patent thumbnailnew patent Bypass type 220v grid voltage sag prevention device and control method therefor
Provided are a bypass type 220v grid voltage sag prevention device and a control method therefor. The bypass type 220v grid voltage sag prevention device comprises an ac-to-dc energy storage unit, a single chip microcomputer (scm) control and display unit, and an inverter output unit.
07/02/15
20150187997
 Light-emitting diode chip patent thumbnailnew patent Light-emitting diode chip
A light-emitting diode (led) chip is disclosed. The led chip includes a substrate and a led stack on the substrate.
07/02/15
20150187733
 Combination of tsv and back side wiring in 3d integration patent thumbnailnew patent Combination of tsv and back side wiring in 3d integration
The embodiments of the present invention relate generally to the fabrication of integrated circuits, and more particularly to a structure and method for fabricating a 3d integration scheme for multiple semiconductor wafers using an arrangement of intra-wafer through silicon vias (tsvs) to electrically connect the front side of a first integrated circuit (ic) chip to large back side wiring on the back side of the first ic chip and inter-wafer tsvs to electrically connect the first ic chip to a second ic chip.. .
07/02/15
20150187682
 Semiconductor device patent thumbnailnew patent Semiconductor device
A semiconductor device is reduced in size. The semiconductor device includes a die pad, a plurality of leads arranged around the die pad, a memory chip and a power source ic chip mounted over the die pad, a logic chip mounted over the memory chip, a plurality of down bonding wires for connecting the semiconductor chip to the die pad, a plurality of lead wires for connecting the semiconductor chip to leads, and a plurality of inter-chip wires.
07/02/15
20150187642
 Double-sided segmented line architecture in 3d integration patent thumbnailnew patent Double-sided segmented line architecture in 3d integration
Embodiments of the present invention relate generally to electronic components such as semiconductor wafers and more particularly, to a double-sided three-dimensional (3d) hierarchal architecture scheme for multiple semiconductor wafers using an arrangement of through silicon vias (tsvs) and backside wiring. In an embodiment a first word line architecture may be formed on a front side of an ic chip and connected to a second word line architecture formed on a back side of the ic chip through intra-wafer, tsvs, thereby relocating required wiring to the back side of the ic chip..
07/02/15
20150187410
 Testing a wide functional interface of a device integrated on an sip without dedicated test pins patent thumbnailnew patent Testing a wide functional interface of a device integrated on an sip without dedicated test pins
A test interface mode over general purpose input/output peripheral connectors of a multichip package (mcp) or system in package (sip) for an integrated device chip having a wide functional interface. The wide functional interface has more signals than there are available external connectors on the sip package.
07/02/15
20150187399
 Pulse mechanism for memory circuit interruption patent thumbnailnew patent Pulse mechanism for memory circuit interruption
In a memory system where multiple memory chips communicate their ready/busy status on a shared bus line, a pulse mechanism is used for the individual memory chips to indicate their ready/busy status to the controller. In one example, the controller assigns pulse durations of differing lengths to the memory dies to allow the controller to distinguish between them.
07/02/15
20150186770
 Composite container lid with ic tag patent thumbnailnew patent Composite container lid with ic tag
A composite container lid for a packing container, which comprises an inner cap 30 fitted onto the container mouth portion 20, an over-cap 40 fitted onto the inner cap 30, and an ic tag 10, wherein an engaging means is provided between the inner surface of a skirt 42 of the over-cap 40 and the outer surface of a cylindrical wall 32 of the inner cap 30, the ic tag 10 comprises a resin film 1 that includes an ic chip 3, an antenna 5 and an unsealing detector circuit 9, and the ic tag 10 is attached to the inner cap 30 or to the over-cap 40 in a manner that the unsealing detector circuit 9 is broken by the motion of the over-cap 40 relative to the inner cap 30 caused in the step of unsealing the inner cap 30.. .
07/02/15
20150185895
new patent

Inclined photonic chip package for integrated optical transceivers & optical touchscreen assemblies


An optical touchscreen assembly may employ a photonic chip packaged with a chip surface at an angle inclined between horizontal and vertical orientations. An inclined paddle sawn flat no-leads (ipsfn) package may be affixed to a cover glass surface along a perimeter of a display.
07/02/15
20150182966
new patent

Field deployable small format fast first result microfluidic system


A field-deployable small format microfluidic system includes simplified, low-cost system control elements, optics, fluid control, and thermal control. An embodiment of a microfluidic chip includes a first plate having reagent wells and pneumatic ports formed therein, a second plate with reaction wells and microfluidic channels connecting each reaction well with one reagent well and one pneumatic port formed therein, and a printed circuit board with heater elements, a temperature sensor, and thermal vias providing thermal transfer through the pcb.
06/25/15
20150180994

Asymmetric chip-to-chip interconnect


Methods and apparatus apparatuses to transfer data between a first device and a second device are disclosed. In various embodiments, an apparatus includes a first device and a second device.
Micro Technology, Inc.
06/25/15
20150180650

Synchronisation for transmit and receive symbols of all-digital receiver


A synchronisation method and device for transmit and receive symbols of an all-digital receiver. The method comprises the steps of: after receiving a sampling signal sent by a baseband processing chip, the clock signal of which is provided by a second clock source, a digital signal processor (dsp), the clock signal of which is provided by a first clock source, measuring a phase shift between a local sampling symbol and an air interface symbol, and acquiring the phase shift amount; according to the phase shift amount, adjusting a sampling opportunity for the sampling of a digital-analogue/analogue-digital converter; and when the sampling opportunity for the sampling of the digital-analogue/analogue-digital converter has been adjusted, adjusting an interface clock for data transmitting and receiving of the dsp so as to enable the data transmitting and receiving of the dsp to be synchronised with the sampling..
Hytera Communications Corp., Ltd.
06/25/15
20150180540

Zero standby power for powerline communication devices


An embodiment is an integrated system on chip (soc) including a communication interface configured to implement a communication protocol including functional blocks that are energized or de-energized individually so that a minimum power consumption is used to receive and detect a signal, and a receiver identification (id) detection function configured to determine whether the signal is intended for the device in which the soc resides. The soc further includes a power management function configured to control which functions in the soc and/or device in which the soc resides are energized or de-energized depending on the results of the receiver id detection function, and a power source capable of energizing a minimum number of the functional blocks required to receive and detect a signal, wherein the power source can be used in a low power state and switched over to a main power supply when the soc is energized..
Stmicroelectronics, Inc.
06/25/15
20150180429

Power amplifier and transmission device


An scpa includes a pad, capacitative elements, amplifiers on an ic chip. The capacitative elements are disposed on a first circle whose center is located on the pad.
Panasonic Corporation
06/25/15
20150179905

Light emitting device, display device, and manufacturing light emitting device


A light emitting device in which a plurality of led chips are arranged. Each of the plurality of led chips include a light emitting region that is formed on a substrate, a first pad electrode that is formed on the substrate, and a through-hole that penetrates the substrate.
Panasonic Intellectual Property Management Co., Ltd.
06/25/15
20150179902

Led package


The present invention is related to a light emitting diode (led) package. The led package includes a blue led chip, a first electrode, a second electrode and a phosphor layer.
Advanced Optoelectronic Technology, Inc.
06/25/15
20150179901

Method of fabricating white led devices


A light emitting device and a method of fabricating the same is provided. The device includes an led chip having a first main surface, a second main surface opposing the first main surface, and one or more side surfaces extending between the first and second main surfaces.
06/25/15
20150179898

Led module


A led module includes a substrate, a led chip supported on the substrate, a metal wiring installed on the substrate, the metal wiring including a mounting portion on which the led chip is mounted, an encapsulating resin configured to cover the led chip and the metal wiring, and a clad member configured to cover the metal wiring to expose the mounting portion, the encapsulating resin arranged to cover the clad member.. .
Rohm Co., Ltd.
06/25/15
20150179897

Light emitter components and methods having improved performance


Light emitter components and methods having improved performance and related methods are disclosed. In one embodiment, a light emitter component can include a submount and at least one light emitting diode (led) chip disposed over the submount.
Cree, Inc.
06/25/15
20150179676

Display device


With an increase in the definition of a display device, the number of pixels is increased, and thus the numbers of gate lines and signal lines are increased. Due to the increase in the numbers of gate lines and signal lines, it is difficult to mount an ic chip having a driver circuit for driving the gate and signal lines by bonding or the like, which causes an increase in manufacturing costs.
Semiconductor Energy Laboratory Co., Ltd.
06/25/15
20150179623

Method for manufacturing semiconductor device


A semiconductor chip is conveyed onto a chip mounting region of a wiring board by means of a bonding jig to electrically couple the semiconductor chip and the wiring board to each other. The bonding jig for mounting the semiconductor chip on the wiring board is equipped with a retention portion for adsorbing and retaining a logic chip, a pressing portion for pressing against the back surface of the semiconductor chip, and a sealing portion to be firmly attached to the peripheral edge portion of the back surface of the semiconductor chip.
06/25/15
20150179285

Detecting defective connections in stacked memory devices


A method for testing a stacked memory device having a plurality of memory chips connected to and arranged on top of a logic chip for a connection defect is disclosed. The method may include testing a memory chip by writing a data value into a first location in the memory chip, reading a data value from the first location, detecting a first bit error and recording a bit number of the first bit error.
International Business Machines Corporation
06/25/15
20150179280

Detecting defective connections in stacked memory devices


A method for testing a stacked memory device having a plurality of memory chips connected to and arranged on top of a logic chip for a connection defect is disclosed. The method may include testing a memory chip by writing a data value into a first location in the memory chip, reading a data value from the first location, detecting a first bit error and recording a bit number of the first bit error.
International Business Machines Corporation
06/25/15
20150178435

Automatic pipelining of noc channels to meet timing and/or performance


Systems and methods for automatically generating a network on chip (noc) interconnect architecture with pipeline stages are described. The present disclosure includes example implementations directed to automatically determining the number and placement of pipeline stages for each channel in the noc.
Netspeed Systems
06/25/15
20150178197

Addressing auto address assignment and auto-routing in nand memory network


A topology for memory circuits of a non-volatile memory system reduces capacitive loading. For a given channel, a single memory chip can be connected to the controller, but is in turn connected to multiple other memory devices that fan out in a tree-like structure, which can also fan back in to a single memory device.
Sandisk Technologies Inc.
06/25/15
20150178187

Single command, multiple column-operation memory device


A memory access command, column address and plurality of write data values are received within an integrated-circuit memory chip via external signaling links. In response to the memory access command, the integrated-circuit memory chip (i) decodes the column address to select address-specified sense amplifiers from among a plurality of sense amplifiers that constitute a sense amplifier bank, (ii) reads first data, constituted by a plurality of read data values, out of the address-specified sense amplifiers, and (iii) overwrites the first data within the address-specified sense amplifiers with second data constituted by one or more of the write data values and by one or more of the read data values..
Rambus Inc.
06/25/15
20150177993

Memory system and bank interleaving method


According to embodiments, a memory system includes a plurality of memory chips configuring banks, an instruction generator, and a memory controller. The instruction generator generates a plurality of instructions.
Kabushiki Kaisha Toshiba
06/25/15
20150177116

Magnetic chip detector / collector


A magnetic chip device such as a chip detector or chip collector, comprising a horseshoe magnet held within a housing and having two adjacent tips protruding from the housing, and having a plurality of portions extending sequentially from one of the tips to the other, the plurality of portions including two end portions, each one of the two end portions extending to a corresponding one of the tips, and a rare-earth magnet portion made of a rare earth magnet material and positioned between the two end portions in the sequence.. .
Pratt & Whitney Canada Corp.
06/25/15
20150176783

Columnar light emitting device and manufacturing the same


In an led columnar light emitting device 1 in which a plurality of two conductive regions 2 and 3 corresponding to the ± polarities are provided in the columnar direction on a film wiring board, each light emitting element is connected to and installed on the plurality of two conductive regions 2 and 3, and each led chip 6, as each light emitting element, is sealed above with a transparent sealing resin 8, notch sections 9 and 9a are formed on both outer sides of two plated lines 4 as opening sections between the two conductive regions 2 and 3 and another two conductive regions 2 and 3 adjacent thereto in the columnar direction.. .
06/18/15
20150171141

Light emitting device


A light emitting device includes: a ceramic substrate; a plurality of led chips; a printed resistor(s) connected in parallel with the plurality of led chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of leds, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency..
Sharp Kabushiki Kaisha
06/18/15
20150171067

Multichip integration with through silicon via (tsv) die embedded in package


Embodiments of the present disclosure are directed to integrated circuit (ic) package assemblies with three-dimensional (3d) integration of multiple dies, as well as corresponding fabrication methods and systems incorporating such 3d ic package assemblies. A bumpless build-up layer (bbul) package substrate may be formed on a first die, such as a microprocessor die.
Intel Corporation
06/18/15
20150171066

Semiconductor device


This invention is to improve performance of a semiconductor integrated circuit device. A semiconductor device has a peripheral circuit chip and a logic chip mounted over a wiring substrate.
Renesas Electronics Corporation
06/18/15
20150171031

Three-dimension (3d) integrated circuit (ic) package


A three-dimension (3d) integrated circuit (ic) package is disclosed. The 3d ic package has a package substrate having a surface.
Amazing Microelectronic Corp.
06/18/15
20150170989

Three-dimensional (3d) integrated heat spreader for multichip packages


Embodiments of the present disclosure describe thermal management solutions for multichip package assemblies and methods of fabricating multichip package assemblies utilizing the thermal management solutions. These embodiments include multi-level heat spreaders and alleviate issues caused by dimensional variability in die-packages utilized in multichip package assemblies.
06/18/15
20150170018

Radio-frequency identification device


A radio-frequency identification device of the non-contact type, suitable for fixing to an object to be identified that includes a module with at least one electronic chip and at least one electrical and/or magnetic so-called primary antenna used to supply signals to the at least one electronic chip, and an electrical and/or magnetic so-called secondary antenna. The secondary antenna is a conductive element that forms part of the object or is produced by modifying a constituent of the object, the secondary antenna being coupled to the primary antenna without an electrical connection..
Tagsys
06/18/15
20150168359

Derivatization reaction gas chromatographic chip


Provided is a derivatization reaction gas chromatographic chip including: an analysis solution inlet allowing an analysis solution containing an analysis target to be introduced therethrough; a derivative inlet allowing a reaction solution containing a derivative chemically reacting with the analysis target to be introduced therethrough; a guide channel connecting one end of a first micro-channel to each of the analysis solution inlet and the derivative inlet; the first micro-channel in which a fluid flows and the analysis target in the fluid is vaporized; a first outlet connected to the other end of the first micro-channel; a gas phase inlet communicating with the first outlet; a second micro-channel having one end connected to the gas phase inlet and having a stationary phase formed therein; and a second outlet connected to the other end of the second micro-channel.. .
Korea Basic Science Institute
06/18/15
20150165270

Walk weight with safety features


A walking weight has a body with a cavity having two ends. A rechargeable power source is positioned in the body.
06/11/15
20150163441

Imaging sensor and imaging device


An imaging sensor comprising: an imaging chip in which a plurality of pixel are arranged in a matrix; and a signal processing chip that is each provided for one or more pixel columns or one or more pixel rows, has a device that performs signal processing on a pixel signal output from a pixel, and is stacked with the imaging chip is provided. For example, the device that performs signal processing is an a/d converter that converts a pixel signal output from the pixel into a digital signal, and when a pixel signal output from the pixel is converted into a digital signal, at least two or more a/d converters among the a/d converters are controlled in parallel..
Nikon Corporation
06/11/15
20150162514

Slim led package


Disclosed herein is a slim led package. The slim led package includes first and second lead frames separated from each other, a chip mounting recess formed on one upper surface region of the first lead frame by reducing a thickness of the one upper surface region below other upper surface regions of the first lead frame, an led chip mounted on a bottom surface of the chip mounting recess and connected with the second lead frame via a bonding wire, and a transparent encapsulation material protecting the led chip while supporting the first and second lead frames..
Seoul Semiconductor Co., Ltd.
06/11/15
20150162491

Method for manufacturing led chip with groove


A method for manufacturing an led chip, comprising steps: making a substrate and an epitaxy structure formed on the substrate, the epitaxy structure comprising a first semiconductor layer, a light emitting layer and a second semiconductor layer; defining a plurality of grooves in the epitaxy structure to expose the light emitting layer; and filling a transparent insulative material in the plurality of grooves; wherein the plurality of grooves comprise a plurality of first grooves and a plurality of second grooves different from the plurality of first grooves, wherein the plurality of second grooves are spaced differently from the plurality of first grooves.. .
Hon Hai Precision Industry Co., Ltd.
06/11/15
20150162323

Semiconductor integrated circuit device


In ic chips for display device driving, an operational amplifier is widely used in input and output circuits, and a capacitor in a medium withstanding voltage chip is used as a compensation capacitor. As for this product area, cost competitiveness is very important.
Synaptics Display Devices Kk
06/11/15
20150160975

Voltage droop mitigation in 3d chip system


The present invention relates to a multichip system and a method for scheduling threads in 3d stacked chip. The multichip system comprises a plurality of dies stacked vertically and electrically coupled together; each of the plurality of dies comprising one or more cores, each of the plurality of dies further comprising: at least one voltage violation sensing unit, the at least one voltage violation sensing unit being connected with the one or more cores of each die, the at least one voltage sensing unit being configured to independently sense voltage violation in each core of each die; and at least one frequency tuning unit, the at least one frequency tuning unit being configured to tune the frequency of each core of each die, the at least one frequency tuning unit being connected with the at least one voltage violation sensing unit.
Advanced Micro Devices, Inc.
06/11/15
20150160666

Circuit and optimizing input voltage range of ic chip


The present invention relates to a circuit and method for optimizing an input voltage range of an ic chip. In the circuit, a pull-up unit, receives an input voltage and then outputs a corresponding voltage level; a trigger unit compares the voltage level output by the pull-up unit with a given threshold voltage, and outputs an enabling signal of corresponding level to an enabling end of the ic chip based on the comparison result, so as to control the ic chip to start/stop; and a voltage stabilizing unit receives the voltage levels output by the pull-up unit and the trigger unit, and then outputs a voltage of corresponding level to the pull-up unit based on the voltage levels output by the pull-up unit and the trigger unit, so that the voltage level output by the pull-up unit is higher than or equal to the threshold voltage and thereby the ic chip starts operation, or so that the voltage level output by the pull-up unit is maintained to be higher than or equal to the threshold voltage and thereby the operation of the ic chip is not affected by variations of the input voltage.
Shenzhen China Star Optoelectronics Technology Co. Ltd.
06/11/15
20150160500

Display device


A tip edge (31) of an fpc (30e) bonded at a most outward position in an arrangement direction (30d) of a plurality of fpcs (30) has an edge (32) inclined relative to an edge (3e) of a terminal region (3t) to face a center of a display panel (x). An ic chip (20e) facing the tip edge (31) of the fpc (30e) bonded at the most outward position is arranged parallel to the inclined edge (32) of the fpc (30e)..
Sharp Kabushiki Kaisha
06/11/15
20150159825

Rechargeable light device


A rechargeable lighting device is provided comprising a threaded base configured to fit in a standard light bulb receptacle, a rechargeable battery, a logic chip, led lights, light/motion sensor and a threaded receptacle configured to receive and power a standard light bulb. The threaded based allows the device to be screwed into an powered by a conventional light socket, and the threaded receptacle serves as a conventional light socket to provide passive power to a standard light bulb.
06/04/15
20150155459

Led illumination module and led illumination apparatus


An led illumination module in which led bare chips are mounted on a mounting substrate at a high density, the module comprising many led bare chips having the same specifications, the mounting substrate at least a surface of which is metal, and a reflection region in which the led bare chips are sealed off with resin, wherein a surface of the reflection region of the mounting substrate is covered with an inorganic white insulating layer that functions as a reflection member, a unit led chip group including a plurality of led bare chips connected in series is disposed plural, the plural unit led chip groups being connected in parallel, overall light flux is 10,000 lumens or more, and a mounting area density of the led bare chips in the reflection region is 15 mm2/cm2 or more. An led illumination apparatus including the led illumination module is also provided..
Shikoku Instrumentation Co., Ltd.
06/04/15
20150155453

Optoelectronic chip-on-board module


A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, uv-resistant, and temperature-resistant coating made of one or more silicones. A corresponding optoelectronic chip-on-board module and a system having multiple optoelectronic chip-on-board modules are also provided.
Heraeus Noblelight Gmbh
06/04/15
20150155435

Light emitting device and illumination system having the same


A light emitting device may include a substrate having a circuit pattern and at least one light emitting diode (led) chip. The led chip may include electrode pads provided on one surface thereof disposed on the circuit pattern to be electrically connected to the circuit pattern.
Samsung Electronics Co., Ltd.
06/04/15
20150155377

Semiconductor device and manufacturing the same


A semiconductor device and a method of manufacturing the semiconductor device are provided. The semiconductor device is a half bridged field effect transistor having a monolithic chip, and includes a semiconductor substrate with a 2-dimensional electron gas layer formed therein; a drain electrode formed on the semiconductor substrate; a first gate electrode, an output electrode, a second gate electrode, and a source electrode.
Samsung Electronics Co., Ltd.
06/04/15
20150155325

Semiconductor module, mos type solid-state image pickup device, camera and manufacturing camera


A back-illuminated type mos (metal-oxide semiconductor) solid-state image pickup device 32 in which micro pads 34, 37 are formed on the wiring layer side and a signal processing chip 33 having micro pads 35, 38 formed on the wiring layer at the positions corresponding to the micro pads 34, 37 of the mos solid-state image pickup device 32 are connected by micro bumps 36, 39. In a semiconductor module including the mos type solid-state image pickup device, at the same time an image processing speed can be increased, simultaneity within the picture can be realized and image quality can be improved, a manufacturing process can be facilitated, and a yield can be improved.
Sony Corporation
06/04/15
20150155267

Electronic component with sheet-like redistribution structure


An electronic component comprising an electrically conductive chip carrier comprising an electrically insulating core structure at least partially covered with electrically conductive material, at least one electronic chip each having a first main surface attached to the chip carrier, and a sheet-like redistribution structure attached to a second main surface of the at least one electronic chip and configured for electrically connecting the second main surface of the at least one electronic chip with the chip carrier.. .
Infineon Technologies Ag
06/04/15
20150155227

Semiconductor device


In a multichip thin package requiring a thickness of submillimeter region, it is difficult to thin the package if the chips are mounted over a usual die pad. According to a technique of the present application, in a manufacturing method of a semiconductor device of a thin resin sealed multichip rectangular package having wire connection between the chips, at least one chip is fixed to a die pad thinned more than a die pad support lead, the die pad is supported by die pad support leads arranged to respectively connect a pair of long sides of the rectangle, and sealing resin is introduced from one side of the pair of long sides when resin molding is performed..
Renesas Electronics Corporation
06/04/15
20150155042

Semiconductor memory device


A nand dc-dc converter includes two output terminals. Each output terminal is connected to several multi-chip packages in each of which a plurality of nand flash memory chips are provided.
Kabushiki Kaisha Toshiba
06/04/15
20150155020

Semiconductor apparatus


A semiconductor apparatus includes a logic memory chip including a transmission block which outputs input signals and a strobe signal; and a plurality of memory chips stacked with the logic memory chip. At least one of the plurality of memory chips includes a plurality of reception blocks.
Sk Hynix Inc.
06/04/15
20150154341

Systems and methods for specifying. modeling, implementing and verifying ic design protocols


A new approach is proposed that contemplates systems and methods to support a hybrid verification framework (hvf) to design, verify, and implement design protocols for an integrated circuit (ic) chip such as a system-on-chip (soc) and/or an application-specific integrated circuit (asic) chip. The framework creates a plurality of specifications in form of extended state transition tables for different phases of a design flow of the ic chip.
Cavium, Inc.
06/04/15
20150154129

Memory system having a plurality of types of memory chips and a memory controller for controlling the memory chips


A memory controller converts controller output signals output from a controller into memory input signals according to the operation specifications of memory chips to operate, and outputs the resultant to the memory chips through a common bus. The memory controller also receives memory output signals output from the memory chips through the common bus, and converts the received signals into controller input signals receivable to the controller.
Fujitsu Semiconductor Limited
06/04/15
20150153445

Multichip automotive radar system, a radar chip for such a system, and a operating such a system


A multichip radar system is disclosed, comprising a plurality of configurable ics, and a digital interface therebetween, each configurable ic being configurable to operate as a master ic and as a slave ic. The configurable ics may be similar or identical, and have an allocated measurement range.
Nxp B.v.
06/04/15
20150153393

System on chip circuits and related systems and methods of operating the same


Methods of operating a system on chip including a first power domain and a second power domain are provided. The method includes measuring at least one of a voltage and a current, which are applied to the first power domain in analog mode to obtain a measurement result; calculating a first power consumed in the first power domain based on the measurement result; calculating a second power consumed in the second power domain in digital mode based on an activity of the second power domain; and controlling a total power of the system on chip based on the first power and the second power.
Samsung Electronics Co., Ltd.
06/04/15
20150153302

Process for biosensor well formation


A biochip for molecular detection and sensing is disclosed. The biochip includes a substrate.
Genia Technologies, Inc.
06/04/15
20150153300

Integrated type microfluidic electrochemical biosensor rapid biochemical analysis


The present invention provides an integrated type microfluidic electrochemical biosensor system for rapid biochemical analysis and the usage of the system. The system comprising: a continuous feeding unit for sequentially conveying lead eluent, sample solution, sample eluent, signal probe solution, signal probe eluent and electrochemical detection buffer solution; a microfluidic chip consists of one or more micro-channel network, the microfluidic chip covers the electrode array to form a channel system, capture probes which have interaction with the said sample solution fixed on the surface of the electrode array, said channel system is connected with the continuous feed unit; and a power system for providing power to said continuous feeding unit.
Shanghai Institute Of Applied Physics, Chinese Academy Of Sciences
06/04/15
20150152494

Methods for forming lipid bilayers on biochips


This disclosure provides a biochip comprising a plurality of wells. The biochip includes a membrane that is disposed in or adjacent to an individual well of the plurality of wells.
Genia Technologies, Inc.
06/04/15
20150152206

Polymer monoliths for solvent exchange in continuous flow microfluidic device


The present disclosure relates to the novel multistep procedure for preparation of polymer monoliths for use in solvent exchange, such as methods to exchange and activate fluoride ions on a flow through microfluidic chip for subsequent chemical synthesis. Methods according to the present disclosure include the application of such microfluidic platforms for rapid f18 radiosynthesis on a flow through microfluidic chip with high efficiency, followed by a subsequent nucleophilic fluorination reaction.
The Regents Of The University Of California


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