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Chip patents



      
           
This page is updated frequently with new Chip-related patent applications. Subscribe to the Chip RSS feed to automatically get the update: related Chip RSS feeds. RSS updates for this page: Chip RSS RSS


Semiconductor light emitting device and multiple lead frame for semiconductor light emitting device

Sharp

Semiconductor light emitting device and multiple lead frame for semiconductor light emitting device

Biochip micro-porous sensor

Shenzhen Createcare Medical Instrument ltd.

Biochip micro-porous sensor

Biochip micro-porous sensor

Aviacomm

Simple and flexible interface architecture for controlling rf front-end components

Date/App# patent app List of recent Chip-related patents
02/26/15
20150058664
 Dynamic memory cell replacement using column redundancy patent thumbnailnew patent Dynamic memory cell replacement using column redundancy
A memory chip comprises a main memory array having a plurality of memory columns, a redundancy memory column associated with the main memory array, and a hit logic circuitry configured to generate a plurality of hit logic signals by a plurality of hit logic units in the hit logic circuitry to enable dynamic replacement of a defective memory cell in one of the memory columns for dynamic replacement by the redundancy memory column when the memory array is in operation.. .
Taiwan Semiconductor Manufacturing Co., Ltd.
02/26/15
20150055720
 Simple and flexible interface architecture for controlling rf front-end components patent thumbnailnew patent Simple and flexible interface architecture for controlling rf front-end components
One embodiment of the present invention provides a system for controlling at least one rf front-end component. During operation, the system receives, at a programmable logic chip from a baseband chip, a command; identifies the rf front-end component based on an address indicated by the command; and sends a control signal included in the command to the identified rf front-end component via the second interface.
Aviacomm Inc.
02/26/15
20150055419
 Controller, memory system, and method patent thumbnailnew patent Controller, memory system, and method
According to one embodiment, a memory system includes a memory chip and a controller. The controller is configured to count a first elapsed time from a start of an erase process when causing the memory chip to execute the erase process.
Kabushiki Kaisha Toshiba
02/26/15
20150055274
 Method for manufacturing terminal-strip-equipped electronic component and terminal-strip-equipped electronic component patent thumbnailnew patent Method for manufacturing terminal-strip-equipped electronic component and terminal-strip-equipped electronic component
A method for manufacturing a terminal-strip-equipped electronic component in which terminal strips made of a metal plate are bonded with solder to terminal electrodes of an electronic chip component on two opposing end surfaces. Solder cream is applied to outer surfaces of the terminal electrodes.
Murata Manufacturing Co., Ltd.
02/26/15
20150054022
 Semiconductor light emitting device and multiple lead frame for semiconductor light emitting device patent thumbnailnew patent Semiconductor light emitting device and multiple lead frame for semiconductor light emitting device
A semiconductor light emitting device that is excellent in radiating heat and that can be molded into a sealing shape having intended optical characteristics by die molding is provided. The semiconductor light emitting device includes: a lead frame including a plate-like semiconductor light emitting element mounting portion having an led chip mounted on a main surface, and a plate-like metal wire connecting portion extending over a same plane as the semiconductor light emitting element mounting portion; a metal wire electrically connecting the led chip and the metal wire connecting portion; a thermosetting resin molded by die molding or dam-sheet molding so as to completely cover the led chip and the metal wire; and a resin portion provided to surround the lead frame and having the thickness not greater than the thickness of the lead frame..
Sharp Kabushiki Kaisha
02/26/15
20150054017
 Led chip package patent thumbnailnew patent Led chip package
An led chip package having a topographical glass coating on top surface for enhancing heat dissipation is disclosed. A circular wall is optionally built to surround the led chip for reflecting light beams from the led chips; the glass coating further extends to cove the inner wall surface of the circular wall.
Prolight Opto Technology Corporation
02/26/15
20150053976
 Display device and  manufacturing the same patent thumbnailnew patent Display device and manufacturing the same
With an increase in the definition of a display device, the number of pixels is increased, and thus the numbers of gate lines and signal lines are increased. The increase in the numbers of gate lines and signal lines makes it difficult to mount an ic chip having a driver circuit for driving the gate line and the signal line by bonding or the like, which causes an increase in manufacturing costs.
Semiconductor Energy Laboratory Co., Ltd.
02/26/15
20150053804
 Brush chipper assembly with counter-rotating feeder rollers and chipping heads patent thumbnailnew patent Brush chipper assembly with counter-rotating feeder rollers and chipping heads
A brush chipper assembly has a housing and a feeder subassembly connected to the housing. The feeder subassembly includes opposed, first and second feeder rollers.
Gyro-trac Corporation
02/26/15
20150053556
 Biochip micro-porous sensor patent thumbnailnew patent Biochip micro-porous sensor
An improved biochip micro-porous sensor includes a substrate, in which a micro-pore, sensing electrodes and micro-channels are disposed. At least one transition channel is disposed at one side of the micro-pore, and at least one reservoir is connected with the micro-channel.
Shenzhen Createcare Medical Instrument Co.,ltd.
02/19/15
20150052410
 System on chip for debugging a cluster regardless of power state of the cluster,  operating the same, and system having the same patent thumbnailSystem on chip for debugging a cluster regardless of power state of the cluster, operating the same, and system having the same
A system on chip includes a debugging controller, a plurality of clusters, and a power management unit (pmu). The debugging controller is included in a first power domain and a joint test action group (jtag) interface is included in the first power domain.
Samsung Electronics Co., Ltd.
02/19/15
20150049758

Hot carrier injection tolerant network on chip router architecture


For a hot carrier injection tolerant network on chip (noc) router architecture, a coupling module modifies couplings of connecting wires to input buffer data bits in an noc data channel. A connection module modifies connection points of an input buffer to the connecting wires..
Utah State University
02/19/15
20150049498

Glass based multichip package


In implementations, a glass-based multichip package includes a photodefinable glass-based substrate, at least one electronic component disposed on the photodefinable glass-based substrate, and a portion of the photodefinable glass-based substrate that has been exposed to ultraviolet light, where the portion of the photodefinable glass-based substrate includes ceramic. Additionally, the sensor package may include additional electronic components, a glass touch panel, and/or a printed circuit board.
Maxim Integrated Products, Inc.
02/19/15
20150048521

Semiconductor package


According to example embodiments, a semiconductor package includes a first and a second semiconductor package. The first semiconductor package includes a first package substrate, first and second memory chips spaced apart from each other on the first package substrate in a first direction, third and fourth memory chips on the first and second memory chips, respectively, and first and second jumper chips on the first and second memory chips, respectively.
02/19/15
20150048412

Led module


A lead 1 includes a die-bonding portion 11 with an opening 11a penetrating in a thickness direction. Another lead 2 is spaced from the lead 1.
Rohm Co., Ltd.
02/19/15
20150048409

Light emission device and illumination device


A light emission device includes: an insulating substrate; a light emitting section including a plurality of led chips mounted on the insulating substrate; and land electrodes for supplying power to the led chips. At least a surface of each of the land electrodes is made of a conductive material which is harder than au and ag and which has sulfurization resistance to such an extent that secures conduction of each land electrode when a current in a working current range is applied on the land electrode..
Sharp Kabushiki Kaisha
02/19/15
20150048407

Optoelectronic chip-on-board module


A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement. The optoelectronic chip-on-board module is coated with a transparent, uv-resistant, and temperature-resistant coating made of silicone by the following steps: (a) casting a liquid silicone into a mold open towards the top and having outer dimensions corresponding to or exceeding outer dimensions of the substrate; (b) inserting the substrate into the mold, wherein the optoelectronic component(s) are immersed completely into the silicone and a surface of the substrate contacts the silicone completely or the substrate immerses into the silicone at least partially with full surface contact; (c) curing and cross-linking the silicone with the optoelectronic component(s) and the substrate; and (d) removing the substrate from the mold with the coating of cured silicone..
Heraeus Noblelight Gmbh
02/19/15
20150048402

Light-emitting device


A light-emitting device in accordance with the present invention includes a mounting substrate; an led chip bonded to a surface of the mounting substrate with a bond; and an encapsulating portion covering the led chip. The bond transmits light from the led chip.
Panasonic Corporation
02/19/15
20150048393

High density multi-chip led devices


High density multi-chip led devices are described. Embodiments of the present invention provide high-density, multi-chip led devices with relatively high efficiency and light output in a compact size.
Cree, Inc
02/19/15
20150048171

Information processing system


An information processing system, an information processing method for use with the system, an information providing system, and information providing method for use with the system, an information processing apparatus, an information processing method for use with the apparatus, a doll, an object, a program storage medium, and a program for authenticating users reliably are provided. A user acquires beforehand a doll called pochara the good friend incorporating an ic chip that stores a user id for authenticating the user.
Sony Corporation
02/12/15
20150046692

System on chip for reducing wake-up time, operating same, and computer system including same


A system on chip (soc) includes an internal read-only memory (rom) configured to store a first boot loader; a first internal static random access memory (sram) configured to receive a second boot loader output from a booting device, store the second boot loader, and perform a booting sequence according to control of the first boot loader; a second internal sram configured to receive a third boot loader output from the booting device, store the third boot loader, and perform a wake-up sequence according to control of the first boot loader; and a dynamic random access memory (dram) controller configured to load an operating system (os) from the booting device into a dram according to control of the second boot loader.. .
02/12/15
20150046612

Memory device formed with a semiconductor interposer


A packaged memory device includes a semiconductor interposer, a first memory stack, a second memory stack, and a buffer chip that are all coupled to the semiconductor interposer. The first memory stack and the second memory stack each include multiple memory chips that are configured as a single stack.
Nvidia Corporation
02/12/15
20150044864

Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip


Structures and methods of making a flip chip package that employ polyimide pads of varying heights at a radial distance from a center of an integrated circuit (ic) chip for a flip chip package. The polyimide pads may be formed under electrical connectors, which connect the ic chip to a chip carrier of the flip chip package, so that electrical connectors formed on polyimide pads of greater height are disposed at a greater radial distance from the center of the ic chip, while electrical connectors formed on polyimide pads of a lesser height are disposed more proximately to the center of the ic chip.
International Business Machines Corporation
02/12/15
20150044787

Semiconductor test and monitoring structure to detect boundaries of safe effective modulus


A method of testing an integrated circuit (ic) chip and a related test structure are disclosed. A test structure includes a monitor chain proximate to at least one solder bump pad, the monitor chain including at least one metal via stack, each metal via stack extending from a lower metal layer in the ic chip to an upper metal layer in the ic chip, such that the monitor chain forms a continuous circuit proximate to the at least one solder bump pad, and where each metal via stack is positioned substantially under the solder bump.
International Business Machines Corporation
02/12/15
20150043573

Telephone network access device


A telephone network access device switchable between a voip service and a pstn service includes an rj-11 port, a voice splitter, a first relay, a second relay, a slic chip, a cpu, and a ring detection unit. The ring detection unit outputs a first switch signal in response to detecting a ring signal of a pstn communication.
Hon Hai Precision Industry Co., Ltd.
02/12/15
20150043227

Edge mounted led light


An edge mounted led light includes an led chip having an led chip first terminal and an led chip second terminal. A layer assembly has conduction layers, namely a first conduction layer and a second conduction layer that sandwich an insulation layer between them.
02/12/15
20150043176

Circuit board and display device having the same


A display device includes a display panel including a curved surface bent along a first direction, a circuit board coupled to the display panel, the circuit board being bent along the first direction in correspondence to the curved surface of the display panel, and an integrated circuit (ic) chip on the circuit board, a short side of the ic chip extending along the first direction.. .
Samsung Display Co., Ltd.
02/12/15
20150043169

Electronic module and manufacturing the same


According to an exemplary aspect an electronic module is provided, wherein the electronic module comprises an electronic chip comprising at least one electronic component, a spacing element comprising a main surface arranged on the electronic chip and being in thermally conductive connection with the at least one electronic component, and a mold compound at least partially enclosing the electronic chip and the spacing element, wherein the spacing element comprises a lateral surface which is in contact to the mould compound and comprises surface structures.. .
Infineon Technologies Ag
02/12/15
20150043161

Thermal energy storage, dissipation and emi suppression for integrated circuits using porous graphite sheets and phase change material


Mobile platforms and methods may provide for an integrated circuit such as a system on chip (soc), a first heat spreader thermally coupled to the integrated circuit and a phase change material configuration thermally coupled to the first heat spreader. The integrated circuit may include logic to operate the integrated circuit in a performance burst mode according to a duty cycle, wherein the performance burst mode causes a phase change material to enter a liquid state within a graphite matrix of the phase change material configuration..
02/12/15
20150042879

Image processing device, image processing chip and image processing method


An image processing device for processing an image signal is provided. The image processing device includes a circuit board, a slot and an image processing module.
Mstar Semiconductor, Inc.
02/12/15
20150041835

Light-emitting device and lighting device provided with the same


A light-emitting device capable of ensuring an electric connection between a light-emitting element and an electrode without generating any problem in practical use, by both connecting methods with a solder and a connector, and a lighting device provided with the light-emitting device are provided. The light-emitting device according to the present invention has a plurality of led chips, and a soldering electrode land and a connector connecting electrode land electrically connected to the chips, on a ceramic substrate.
Sharp Kabushiki Kaisha
02/12/15
20150041195

Electronic chip component and board having the same mounted thereon


An electronic chip component includes a ceramic body; external electrodes formed on end portions of the ceramic body; an interposer supporting the ceramic body and electrically connected to the external electrodes, wherein the interposer includes a first electrode pad formed on a surface thereof and having the external electrodes disposed thereon, a second electrode pad formed on an opposing surface thereof, and a connection electrode pad connecting the first electrode pad to the second electrode pad and formed on a lateral surface between the surface and the opposing surface of the interposer, the first electrode pad is divided into first and second electrode patterns disposed at ends of the interposer based on a space formed therebetween, a non-electrode margin portion is formed between ends of the first electrode pad and ends of the interposer, and the connection electrode pad is formed on the lateral surface of the interposer.. .
Samsung Electro-mechanics Co., Ltd.
02/05/15
20150039921

Memory system and memory chip


A memory system includes a memory which asserts a high-power-consumption operation output when an amount of the power consumption is high in internal operations in respective operations, and a controller which has an interface function between a host and the memory and receives the high-power-consumption operation output. The controller switches an operation mode thereof to a low power consumption mode when the high-power-consumption operation output is asserted..
Kabushiki Kaisha Toshiba
02/05/15
20150039897

Information processing apparatus, program, storage medium and information processing system


Provided is an information processing apparatus including a reception unit that receives a request for access to an ic chip from an application having access right information for accessing to the ic chip, an acquisition unit that acquires an authentication information for authenticating the application from an external server based on the access right information contained the request for access received by the reception unit, an authentication unit that authenticates the application based on the authentication information obtained by the acquisition unit, and a control unit that controls an access of the application to the ic chip based on an authentication result by the authentication unit.. .
Felica Networks, Inc.
02/05/15
20150039820

Flash memory storage system and controller and data writing method thereof


A flash memory storage system having a flash memory controller and a flash memory chip is provided. The flash memory controller configures a second physical unit of the flash memory chip as a midway cache physical unit corresponding to a first physical unit and temporarily stores first data corresponding to a first host write command and second data corresponding to a second host write command in the midway cache physical unit, wherein the first and second data corresponding to slow physical addresses of the first physical unit.
Phison Electronics Corp.
02/05/15
20150039753

System and capacity planning for systems with multithreaded multicore multiprocessor resources


A method for expressing a hierarchy of scalabilities in complex systems, including a discrete event simulation and an analytic model, for analysis and prediction of the performance of multi-chip, multi-core, multi-threaded computer processors is provided. Further provided is a capacity planning tool for migrating data center systems from a source configuration which may include source systems with multithreaded, multicore, multichip central processing units to a destination configuration which may include destination systems with multithreaded, multicore and multichip central processing units, wherein the destination systems may be different than the source systems.
Ca, Inc.
02/05/15
20150038185

Radio-frequency integrated circuit (rfic) chip(s) for providing distributed antenna system functionalities, and related components, systems, and methods


Radio-frequency (rf) integrated circuit (rfic) chip(s) allow for the integration of multiple electronic circuits on a chip to provide distributed antenna system functionalities. Rfic chips are employed in central unit and remote unit components, reducing component cost and size, increasing performance and reliability, while reducing power consumption.
Corning Optical Communications Wireless Ltd
02/05/15
20150037913

Millimeter wave wafer level chip scale packaging (wlcsp) device and related method


Various embodiments include wafer level chip scale package (wlcsp) structures and methods of tuning such structures. In some embodiments, the wlcsp structure includes: a printed circuit board (pcb) trace connection including at least one pcb ground connection connected with a pcb ground plane; a set of ground solder balls each contacting the printed circuit board trace connection; a set of chip pads contacting each of the ground solder balls in the set of ground solder balls; a chip ground plane connecting the set of chip pads; and a signal interconnect interposed between two of the set of ground solder balls, the signal interconnect including: a signal trace connection electrically isolated from the pcb ground plane; a signal ball contacting the signal pcb trace connection; a chip pad contacting the signal ball, and a signal trace connection on a chip contacting the chip pad..
International Business Machines Corporation
02/05/15
20150037799

Biochip and target dna quantitative method


A biochip used for quantitative analysis of a target dna contained in a sample. The biochip includes a type i chamber that includes a primer designed to bind to the target dna, an internal standard dna of a first amount that has a sequence different from a sequence of the target dna, and is amplifiable with the primer, and a fluorescent probe that is designed to bind to a part of a pcr product of the target dna and to a part of a pcr product of the internal standard dna.
Seiko Epson Corporation
02/05/15
20150036956

Bearing assembly and bearing seal having rfid function


A bearing assembly having an rfid (radio frequency identification) function, which can be compactized and contributes to reduction in labor and cost and which can also implements a favorable communication and has a capability of accomplishing information communication on a non-contact basis. This bearing assembly includes an inlet (14), including an ic chip (16) and an antenna (17) connected with such ic chip (16), and a magnetic sheet (15), both of which are embedded in overlapped relation to each other in a bearing seal (5) for sealing a bearing space..
Ntn Corporation
02/05/15
20150036341

Led light-emitting column and led light using the same


The present invention discloses a led light-emitting column and a led light using the same. The led light-emitting column comprises a high thermal conductivity tube and at least one series of led chips disposed on an outer surface of the high thermal conductivity tube.
Zhejiang Ledison Optoelectronics Co., Ltd.
02/05/15
20150036114

Optoelectronic module with improved optical system


The invention relates to an optoelectronic module (112), more particularly to an optoelectronic chip-on-board module (114). The optoelectronic module (112) comprises a substrate (116), wherein the substrate (116) has a planar design.
Heraeus Noblelight Gmbh
02/05/15
20150035207

Composition and producing a textured acrylic surface


A composition for making a cast, thermoformable sheet or slab, comprising: a syrup comprising: about 30-40% ssi—acrylic pre-polymerized syrup at 20% solids; about 30-40% mma—methyl methacrylate; about 2-3% ba—butyl acrylate; about 1-15% acrylic chips; and about 1-15% rigid particles with a mean diameter of about 0.5-2000 μm. The rigid particles may preferably comprise a polymeric material such as poly allyl diglycol carbonate particles.
Aristech Surfaces Llc
02/05/15
20150035170

Multichip device including a substrate


A device includes a substrate including an electrically insulating core, a first electrically conductive material arranged over a first main surface of the substrate, and a second electrically conductive material arranged over a second main surface of the substrate opposite to the first main surface. The device further includes an electrically conductive connection extending from the first main surface to the second main surface and electrically coupling the first electrically conductive material and the second electrically conductive material, a first semiconductor chip arranged over the first main surface and electrically coupled to the first electrically conductive material, and a second semiconductor chip arranged over the second main surface and electrically coupled to the second electrically conductive material..
Infineon Technologies Ag
02/05/15
20150035145

Millimeter wave wafer level chip scale packaging (wlcsp) device


Various embodiments include wafer level chip scale package (wlcsp) structures and methods of tuning such structures. In some embodiments, the wlcsp structure includes: a printed circuit board (pcb) trace connection including at least one pcb ground connection connected with a pcb ground plane; a set of ground solder balls each contacting the printed circuit board trace connection; a set of chip pads contacting each of the ground solder balls in the set of ground solder balls; a chip ground plane connecting the set of chip pads; and a signal interconnect interposed between two of the set of ground solder balls, the signal interconnect including: a signal trace connection electrically isolated from the pcb ground plane; a signal ball contacting the signal pcb trace connection; a chip pad contacting the signal ball, and a signal trace connection on a chip contacting the chip pad..
International Business Machines Corporation
02/05/15
20150035142

Multi-chip package


A multi-chip package may include a package substrate, a connecting substrate, a plurality of semiconductor chips and a logic chip. The package substrate may have an opening.
Samsung Electronics Co., Ltd.
02/05/15
20150034993

Semiconductor light-emitting device


A semiconductor light-emitting device includes a substrate, an led chip mounted on the substrate, and a resin package covering the led chip. The substrate includes a base and a wiring pattern formed on the base.
Rohm Co., Ltd.
02/05/15
20150034978

Light emitter devices and methods for light emitting diode (led) chips


Light emitter devices and methods are provided herein. In some aspects, emitter devices and methods provided herein are for light emitting diode (led) chips, and can include providing a substrate and a plurality of led chips over the substrate.
Cree, Inc.
02/05/15
20150034976

Led chip-on-board type flexible pcb and flexible heat spreader sheet pad and heat-sink structure using the same


A chip-on-board led structure having multiple of led dies, includes a flexible heat spreading pad for spreading heat and having a planar area; a top flexible foil on the flexible heat spreading pad; a dielectric layer on the first flexible foil; a flexible metal film on the dielectric layer; and an led die array mounted on and covering a first area of the flexible metal film, wherein the planar area of the flexible heat spreading pad is at least four times larger than the first area of the flexible metal film.. .
Led Folio Corporation
02/05/15
20150034144

Power conversion module for use with optical energy transfer and conversion system


A power conversion system for converting optical energy received from a fiber optic line to electrical energy, the system comprises a housing, a heat sink within the housing, a high power connector coupled to the line and having an end positioned within the housing, beam forming optics within the interior space positioned proximal to the connector, and a partially spherical end array and annular arrays of photovoltaic chips.. .
Piedra - Sombra Corporation, Inc.
01/29/15
20150032794

End-to-end flow control in system on chip interconnects


Provided is an end-to-end flow control management for a system on chip interface. As tokens are injected into agents arranged in a computer network, the input point for the token is dynamically changed such that tokens are not always injected into the same agent.
Applied Micro Circuits Corporation
01/29/15
20150032437

System level simulation in network on chip architecture


Systems and methods for performing multi-message transaction based performance simulations of soc ip cores within a network on chip (noc) interconnect architecture by accurately imitating full soc behavior are described. The example implementations involve simulations to evaluate and detect noc behavior based on execution of multiple transactions at different rates/times/intervals, wherein each transaction can contain one or more messages, with each message being associated with a source agent and a destination agent.
Netspeed Systems
01/29/15
20150031587

Biochip and target dna quantitative method


A biochip used for quantitative analysis of a target dna contained in a sample. The biochip includes a type i chamber that includes a primer designed to bind to the target dna, an internal standard dna of a first amount that has a sequence different from a sequence of the target dna, and is amplifiable with the primer, and a fluorescent probe that is designed to bind to a part of a pcr product of the target dna and to a part of a pcr product of the internal standard dna.
Seiko Epson Corporation
01/29/15
20150029491

Apparatus for microfluid detection


A apparatus for microfluid detection for detecting a sample fluid including a plurality of magnetic particles is provided. The apparatus for microfluid detection includes a microfluidic chip and a magnetic generating module.
Industrial Technology Research Institute
01/29/15
20150028919

Wafer-level stacked chip assembly and chip layer utilized for the assembly


Disclosed is a wafer-level stacked chip assembly, comprising a plurality of chip layers vertically stacked together with vertically electrical interconnections between the adjacent chip layers realized by tsvs (through silicon via). Each chip layer includes a switching mechanism for selectively bypassing chip coding sequence to deactivate failed ic area and its chip coding sequence, thereby the interconnection relationship among the chip layers can be re-defined and the function and chip code of the failed ic area can be deactivated.
01/29/15
20150028754

Zero energy storage driver integrated in led chip carrier


Led devices are provided that include led chips on led chip carriers. The led device can in turn be housed in a package, such as a small-outline transistor (sot) package or a radial led device package.
Osram Sylvania Inc.
01/29/15
20150028517

Identification device for a pneumatic spring


An identification device (1) for a pneumatic spring (2) includes an rfid transponder (8), which is completely embedded into the elastomer matrix (13) of the flexible member (4). An electromagnetic field is generated by a read device (9), wherein the energy necessary for supplying the rfid transponder (8) is taken from the electromagnetic field generated by the read device (9).
Contitech Luftfedersysteme Gmbh
01/29/15
20150028366

Light emitting diode chip


An led chip for use in an led chip array forming a continuous array of leds. The led chip comprises an array of leds on a substrate.
University College Cork, National University Of Ireland, Cork
01/29/15
20150028192

Coupling optical signals into silicon optoelectronic chips


A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a cmos photonic chip in a photonic transceiver, wherein photonic, electronic, or optoelectronic devices may be integrated in layers on a front surface of the cmos photonic chip. Optical couplers, such as grating couplers, may receive the optical signals in the front surface.
Luxtera, Inc.
01/22/15
20150024962

Marker sequences for multiple sclerosis and use thereof


The present invention relates to new marker sequences for multiple sclerosis and the diagnostic use thereof together with a method for screening of potential active substances for multiple sclerosis by means of these marker sequences. Furthermore, the invention relates to a diagnostic device containing such marker sequences for multiple sclerosis, in particular a protein biochip and the use thereof..
Protagen Ag
01/22/15
20150024730

Application providing system, portable terminal devices, server device, application providing method and computer programs


An application providing system is provided. The application providing system includes a portable terminal device having an ic chip configured to perform radio communications; and a server device; the application providing system connecting the portable terminal device and the server device through a communication network, wherein the portable terminal device includes a transmitted message receiver section, an application determination section, an application transmission request generation section, and an application storage section, wherein the server device includes a transmitted message generation section, a transmitted message sender section, an application transmission request receiver section, an application storage section, and an application sender section..
Felica Networks, Inc.
01/22/15
20150024591

On-chip rf shields with backside redistribution lines


Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, a method of fabricating the system on chip includes forming a through substrate opening from a back surface of a substrate, the through substrate opening disposed between a first and a second region, the first region comprising devices for rf circuitry and the second region comprising devices for other circuitry.
Infineon Technologies Ag
01/22/15
20150024589

Method for assembling a microelectronic chip element on a wire element, and installation enabling assembly to be performed


Method for assembling includes: providing a system to transfer wire element from wire element supply device to wire element storage device; stretching wire element between supply and storage devices by tensioning; providing an individualized reservoir and separated chip elements, each including a connection terminal including a top with free access facing in which chip element is not present; transporting the chip element from reservoir to an assembly area between supply and storage devices in which wire element is tightly stretched in assembly area; fixing electrically conducting wire element to chip element connection terminal in assembly area; and adding electrically insulating material on chip element after latter has been fixed to wire element forming a cover, the addition of material being performed on surface of chip element including connection terminal fixed to wire element to cover at least the connection terminal and portion of wire element at fixing point of latter.. .
Commissariat A L'energie Atomique Aux Energies Alternatives
01/22/15
20150024524

Methods for manufacturing isolated deep trench and high-voltage led chip


A method for manufacturing a deep isolation trench (221) and a method for manufacturing a high-voltage led chip. Steps of the method for manufacturing a deep isolation trench (221) are as follows: forming a mask layer (202) on a substrate (200), and forming, in the mask layer, through etching, multiple windows (204) isolated from each other, the bottom of each window exposing the substrate; with epitaxial lateral overgrowth, forming an epitaxial structure (212) inside each window and a part of the mask layer around the window, respectively, each epitaxial structure having a trapezoidal cross section with a long bottom and a short top, and a gap between adjacent epitaxial structures forming a first deep trench (214); etching each epitaxial structure, forming a first shoulder (218) and a second shoulder (221) at both sides of each epitaxial structure, respectively, and forming a deep isolation trench above the mask layer between the adjacent epitaxial structures.
Enraytek Optoelectronics Co., Ltd
01/22/15
20150024373

Microfluidic chip


A microfluidic chip orients and isolates components in a sample fluid mixture by two-step focusing, where sheath fluids compress the sample fluid mixture in a sample input channel in one direction, such that the sample fluid mixture becomes a narrower stream bounded by the sheath fluids, and by having the sheath fluids compress the sample fluid mixture in a second direction further downstream, such that the components are compressed and oriented in a selected direction to pass through an interrogation chamber in single file formation for identification and separation by various methods. The isolation mechanism utilizes external, stacked piezoelectric actuator assemblies disposed on a microfluidic chip holder, or piezoelectric actuator assemblies on-chip, so that the actuator assemblies are triggered by an electronic signal to actuate jet chambers on either side of the sample input channel, to jet selected components in the sample input channel into one of the output channels..
Premium Genetics (uk) Ltd.
01/22/15
20150024204

Novel process of preparing nano metal and the products thereof


The present invention relates a process of preparing a nanopowder by using a natural source starting material wherein the nano powder is a nano metal or nano alloy or nano metal oxide or nano metal carbide or nano compound or nano composite or nanofluid. The nano product produced by the process has novel properties such as enhanced hardness, antibacterial properties, thermal properties, electrical properties, abrasive resistant, wear resistant, superior frictional properties, sliding wear resistance, enhanced tensile strength, compression strengths, enhanced load bearing capacity and corrosion properties.
01/22/15
20150023016

Led lighting apparatus


An led lighting apparatus includes an led substrate, a led chip, a sealing resin member, and a reflecting face. The led substrate has a main surface.
Rohm Co., Ltd.
01/22/15
20150022094

Lighting system and method to control a lighting system


An led lighting system is disclosed, which generally consists of an enclosure, one or more led modules, one or more transformers, and one or more drivers. A lamp assembly is disclosed, which generally consists of one or more vertically oriented led chips, thermally conductive shells, and a thermally dissipating means positioned at the back of the led chips.
J2 Light Inc.
01/22/15
20150021761

Multi-chip package


A multi-chip package may include a package substrate, a plurality of semiconductor chips stacked stepwise on the package substrate, a logic chip and a first conductive wire. The logic chip may include a conductive bump electrically connected to the package substrate.
Samsung Electronics Co., Ltd.
01/22/15
20150021733

Semiconductor wafer, semiconductor ic chip and manufacturing the same


A semiconductor wafer includes circuit integration regions each incorporating an integrated circuit and guard rings disposed to surround the circuit integration regions, respectively. A scribe region disposed between every adjacent two of the guard rings.
Renesas Sp Drivers Inc.
01/22/15
20150021635

White light emitting led device


A white light emitting led device comprises: base, blue light led chips, light reflector and transparent substrate covered with a phosphor coating; two ends of the light reflector connect the base and the transparent substrate, respectively, the inner surface of the light reflector is covered with a light-reflecting coating; blue light led chips are set on the surface of the base pointing to the transparent substrate, and the electrode leads of blue light led chips pass through the base; blue light led chip is a single chip, or a group of chips connected in series, or in parallel, or in a mixed manner; the transparent substrate has the shape of a plane, or a convex, or a semi-cylinder. The present invention gets the white light by utilizing the blue lights emitted by the blue light led chips to irradiate the transparent substrate which is covered with a phosphor coating..
01/22/15
20150021633

Light-emitting diode package and light-emitting device


An led package is disclosed, which includes a heat dissipation plate, a composite structure, an led chip, and an encapsulant. The heat dissipation plate has a chip bonding area, a circuit area, and a first dam disposed at the boundary between the chip bonding area and the circuit area, wherein the first dam is formed by punching or bending the heat dissipation plate.
Lextar Electronics Corporation
01/22/15
20150021547

Gan based led epitaxial structure and manufacturing the same


A gan based led epitaxial structure and a method for manufacturing the same. The gan based led epitaxial structure may include: a substrate; and a gan based led epitaxial structure grown on the substrate, wherein the substrate is a substrate containing a photoluminescence fluorescent material.
Fujian Institute Of Research On The Structure Of Matter, Chinese Academy Of Sciences


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