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Chip-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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NEW Display apparatus and manufacturing method thereof
Lg Display Co., Ltd.
May 24, 2018 - N°20180146578

The present aspects provide a display apparatus including a chip-on-film (cof), which may include: a plastic substrate configured to have at least one through-hole formed in one area thereof and a conductor inserted into the through-hole; a display part configured to be disposed in another area on an upper surface of the plastic substrate; a first pad part configured to ...
NEW Plug-in multifunctional led power system
Self Electronics Usa Corporation
May 24, 2018 - N°20180146525

A plug-in multifunctional led power system includes a power supply module, at least one output terminal, a switch module, a trigger conversion module, a compatible circuit module, and a replaceable control chip module. The trigger conversion module includes a first, second and third resistors connected in series from a high level output terminal to a ground.
NEW Power adaptation based on error rate
Apple Inc.
May 24, 2018 - N°20180146435

A host device is configured to increase the power output by an internal amplifier of its wireless chipset in response to requests from a remote device. Once the internal amplifier has reached its maximum power, further requests for power increases from the remove device do not similarly lead to automatic power increases being delivered by a external amplifier of the ...
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NEW Systems and methods for streaming media
Fasetto, Llc
May 24, 2018 - N°20180146378

A content storage system is provided. The content storage system may include a portable content repository device comprising a processor, a storage module, and a communication module.
NEW Systems and methods for processing audio signals based on user device parameters
May 24, 2018 - N°20180146317

In various applications, the system provides a method for processing audio signals, including: receiving a request for audio content; receiving an identifier encoded in a personal audio device comprising a transducer for playing audio; retrieving at least one parameter associated with the identifier; and processing the audio content using at least the request, the identifier and the at least one ...
NEW System for continuous monitoring of body sounds
International Business Machines Corporation
May 24, 2018 - N°20180146272

A wearable monitoring system includes a microelectromechanical (mems) microphone to receive acoustic signal data through skin of a user. An integrated circuit chip is bonded to and electrically connected to the mems microphone.
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  • 242+ full patent PDF documents of Chip-related inventions.
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NEW Link control method and apparatus
Sanechips Technology Co.,ltd.
May 24, 2018 - N°20180145912

Disclosed are a link control method and apparatus. The method includes that: link information and/or machine frame information in a system is acquired; and link control is performed according to the acquired link information and/or machine frame information.
NEW Distributed control synchronized ring network architecture
Degirum Corporation
May 24, 2018 - N°20180145849

A ring network architecture includes multiple communication nodes configured in a ring. Wave pipelining is used to provide for high bandwidth and low latency on-chip communications.
NEW Method and apparatus for despreading in optical domain
Huawei Technologies Co., Ltd.
May 24, 2018 - N°20180145767

An apparatus for despreading in an optical domain configured to split a received optical signal into a first optical signal and a second optical signal, perform phase deflection on the second optical signal, output a third optical signal, perform phase deflection on the first optical signal and the third optical signal, output a fourth optical signal and a fifth optical ...
NEW Phased array antenna panel having reduced passive loss of received signals
Movandi Corporation
May 24, 2018 - N°20180145422

A phased array antenna panel includes a first plurality of antennas, a first radio frequency (rf) front end chip, a second plurality of antennas, a second rf front end chip, and a combiner rf chip. The first and second rf front end chips receive respective first and second input signals from the first and second pluralities of antennas, and produce ...
NEW Phased array antenna panel with enhanced isolation and reduced loss
Movandi Corporation
May 24, 2018 - N°20180145421

A phased array antenna panel includes a central radio frequency (rf) front end chip, neighboring rf front end chips, and an antenna. The antenna has a proximal probe and a distal probe.
NEW Optoelectronic semiconductor component, optoelectronic arrangement and method for producing an optoelectronic semiconductor component
Osram Opto Semiconductors Gmbh
May 24, 2018 - N°20180145235

An optoelectronic semiconductor component comprises an optoelectronic semiconductor chip (c1) having an electrically conductive substrate (t), an active part (at) containing epitaxially grown layers, and an intermediate layer (zs) which is arranged between the substrate (t) and the active part (at) and contains a solder material. The optoelectronic semiconductor component further comprises an electrical connection point, which at least partially ...
NEW Method of producing optoelectronic semiconductor components, and optoelectronic semiconductor component
Osram Opto Semiconductors Gmbh
May 24, 2018 - N°20180145234

A method of producing optoelectronic semiconductor components includes providing a carrier with a carrier underside and a carrier top, wherein the carrier has a metallic core material and at least on the carrier top a metal layer and following this a dielectric mirror are applied to the core material, forming at least two holes through the carrier, producing a ceramic ...
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inventor
  • 242+ full patent PDF documents of Chip-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
NEW Optoelectronic semiconductor chip and optoelectronic module
Osram Opto Semiconductors Gmbh
May 24, 2018 - N°20180145225

An optoelectronic semiconductor chip includes a carrier and a semiconductor body arranged on the carrier with a semiconductor layer sequence, wherein the semiconductor layer sequence includes an active region arranged between a first semiconductor layer and a second semiconductor layer and generates or receives electromagnetic radiation, the first semiconductor layer connects to a first contact in an electrically-conductive manner, the ...
NEW Bonding electrode structure of flip-chip led chip and fabrication method
Xiamen Sanan Optoelectronics Technology Co., Ltd.
May 24, 2018 - N°20180145220

A bonding electrode structure of a flip-chip led chip includes: a substrate; a light-emitting epitaxial layer over the substrate; a bonding electrode over the light-emitting epitaxial layer, wherein the bonding electrode structure includes a metal laminated layer having a bottom layer and an upper surface layer from bottom up. The bottom layer structure is oxidable metal and the side wall ...
NEW Optoelectronic arrangement and depth measuring system
Osram Opto Semiconductors Gmbh
May 24, 2018 - N°20180145211

An optoelectronic arrangement that produces a light pattern includes a light-emitting diode chip configured to emit electromagnetic radiation on its upper side and forming a first two-dimensional pattern on the upper side of the light-emitting diode chip, and an optically imaging element configured to project electromagnetic radiation emitted by the light-emitting diode chip into an environment of the optoelectronic arrangement.. .
NEW Field effect transistor (fet) or other semiconductor device with front-side source and drain contacts
Microchip Technology Incorporated
May 24, 2018 - N°20180145171

An integrated circuit (ic) structure may include one or more trench-based semiconductor devices, e.g., field-effect transistors (trench fets), having a front-side drain contact. Each semiconductor device may include an epitaxy layer, a doped source region in the epitaxy layer, a front-side source contact coupled to the source region, a poly gate formed in a trench in the epitaxy layer, ...
NEW Method of forming a field-effect transistor (fet) or other semiconductor device with front-side source and ...
Microchip Technology Incorporated
May 24, 2018 - N°20180145170

A method is provided for forming an integrated circuit (ic) structure including trench-based semiconductor devices, e.g., trench fets, having front-side drain contacts. The method may include forming an epitaxy region, forming a poly gate trench in the epitaxy region, forming a drain contact trench through the poly gate trench and extending below the poly gate trench, forming a poly ...
NEW Image sensor package
Samsung Electronics Co., Ltd.
May 24, 2018 - N°20180145104

An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip.
NEW Fingerprint sensing chip packaging method and fingerprint sensing chip package
China Wafer Level Csp Co., Ltd.
May 24, 2018 - N°20180145102

A fingerprint sensing chip packaging method and package are provided. The method includes: providing a cover plate, providing a fingerprint sensing chip, where a fingerprint sensing region and contact pads at periphery of the region are arranged on a front surface of the chip, electrically connecting the contact pads to a back surface of the chip, forming a first conductive ...
NEW Image sensor chip
Stmicroelectronics (crolles 2) Sas
May 24, 2018 - N°20180145100

An image sensor chip includes a semiconductor layer intended to receive illumination on a back face and comprising a matrix of pixels on a front face. An interconnection structure is arranged on the front face and a carrier is attached to the interconnection structure with a first face of the carrier facing the front face.
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