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Chip patents



      

This page is updated frequently with new Chip-related patent applications.




Date/App# patent app List of recent Chip-related patents
06/23/16
20160183377 
 Dielectric filmless electronic module and  manufacturing same patent thumbnailDielectric filmless electronic module and manufacturing same
The invention relates to an electronic module comprising a first metal layer including at least one contact pad or a conductive pad for connection or interconnection, an insulating layer that is electrically connected to the metal layer via a first surface, a second metal layer connected to the insulating layer on the opposite surface thereof, a chip location or an electronic chip electrically connected to the at least one contact pad through openings in the insulating layer, characterized in that the insulating layer is an adhesive.. .

06/23/16
20160181490 
 Light emitting diode packaging structure patent thumbnailLight emitting diode packaging structure
A packaging structure of a vertical led chip includes at least a support system, a glue cup that connects to periphery of the support system, a led chip with light absorption substrate over the support system and packaging glue distributed in periphery of the led chip. The light absorption substrate has a side forming a bubble structure at an interface with the packaging glue.

06/23/16
20160181322 
 System on chip (soc) based on phase transition and/or phase change material patent thumbnailSystem on chip (soc) based on phase transition and/or phase change material
System on chips (socs) of a microprocessor electrically connected with electronic memory devices and/or optically connected with a optical memory device are disclosed along with various embodiments of building block of the microprocessor and the electronic memory devices, wherein the microprocessor can comprise digital unit and/or neural networks based unit.. .

06/23/16
20160181214 
 Stacked memory chip having reduced input-output load, memory module and memory system including the same patent thumbnailStacked memory chip having reduced input-output load, memory module and memory system including the same
A stacked memory chip includes a chip input-output pad unit, a first semiconductor die and a second semiconductor die. The chip input-output pad unit includes a chip command-address pad unit, a lower chip data pad unit and an upper chip data pad unit that are to be connected to an external device.

06/23/16
20160181173 
 Integrated circuit barrierless microfluidic channel patent thumbnailIntegrated circuit barrierless microfluidic channel
A structure and method for fabricating a continuous cooling channel in the back end of line wiring levels of an integrated circuit (ic) chip is provided. This continuous cooling channel may provide a path for a cooling source such as a fluid pumped from an external fluidic-cooling circulation driver to make physical contact locally with and cool the back end levels within the ic chip that may generate heat as a byproduct of the ic device's routine operations.

06/23/16
20160181166 
 Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness patent thumbnailMethod of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness
Disclosed is a method of manufacturing integrated circuit (ic) chips. In the method, wafers are received and the backside roughness levels of these wafers are determined.

06/23/16
20160181153 
 Integrated circuit barrierless microfluidic channel patent thumbnailIntegrated circuit barrierless microfluidic channel
A structure and method for fabricating a continuous cooling channel in the back end of line wiring levels of an integrated circuit (ic) chip is provided. This continuous cooling channel may provide a path for a cooling source such as a fluid pumped from an external fluidic-cooling circulation driver to make physical contact locally with and cool the back end levels within the ic chip that may generate heat as a byproduct of the ic device's routine operations.

06/23/16
20160180117 
 Electronic data security apparatus patent thumbnailElectronic data security apparatus
An apparatus for providing security for an integrated circuit (ic) chip is disclosed. The apparatus may include the ic chip, attached to a surface of a printed circuit board (pcb).

06/23/16
20160180001 
 System on chip configuration metadata patent thumbnailSystem on chip configuration metadata
A topology metadata file is identified that describes a topology of a system on chip (soc) to be created, where the topology includes a plurality of computing blocks to be interconnected by a fabric. A corresponding computing block metadata file is identified for each of the plurality of computing blocks, where each of the computing block metadata files is to describe attributes of the corresponding computing block.

06/23/16
20160179697 
 Memory system and operating method thereof patent thumbnailMemory system and operating method thereof
A memory system includes a plurality of memory chips each including memory regions and page buffers; an address table suitable for storing mapping information for mapping physical addresses and logical addresses; a target table suitable for storing sequential physical addresses and sequential logical addresses; a selective output block suitable for selecting the memory regions as pages under selection by units of a page according to a preset order, based on the sequential physical addresses, and outputting data stored in page buffers of memory chips under selection corresponding to the pages under selection; and an expected read block suitable for reading data stored in selection-expected pages, which is to be selected following the pages under selection according to the preset order, to store in page buffers of selection-expected memory chips corresponding to the selection-expected pages, while the data stored in the page buffers under selection are outputted.. .

06/23/16
20160179431 

Individual identification device, storage device, individual identification system, individual identification, and program product


An individual identification device (1) according to embodiments may identify a storage device (100) including one or more memory chips (40). The device comprises a first storage (40), a region allocator (15), and a hardware fingerprint generator (12).

06/23/16
20160179161 

Decode information library


For each of a plurality of ports to be defined for an interconnect fabric, a respective computing block is identified to be connected to the port. One or more entries in a library of decode information is identified for each of the identified computing blocks.

06/23/16
20160178186 

Led unit


An led unit (100) includes a base unit (1). The led unit further includes a light emitting device (3) including: a package substrate (3b); and a light emitting portion (3a) provided in the package substrate and having led chips, the light emitting device being placed on a front surface of the base unit.

06/23/16
20160178174 

Lighting device


A lighting device includes a substrate and a planar light source portion including a plurality of led chips arrayed on the substrate. The planar light source portion faces an illumination space (space to be illuminated) by a predetermined opening area.

06/23/16
20160178133 

Led lead frame array for general illumination


An led lead frame assembly includes a circuit strip assembly, a plastic dam member overmoulded onto the circuit strip assembly and a led chip assembly disposed in a pocket of the plastic dam member. The led chip assembly is electrically coupled to the circuit strip assembly to power the led chip assembly..

06/23/16
20160177387 

Novel electrochemical dna biosensor using graphene biochip for species identification


This study describes about a new electrochemical biosensor using dna-redox electrostatic interaction and their subsequent non-specific adsorption on graphene screen-printed electrode or biochip. The ruthenium hexamine molecule [ru(nh3)6]3+, or ruhex, was observed to form complexes with free dna in solution that adsorbed onto graphene surfaces, enabling the development of a rapid, high-sensitivity dna biosensor.

06/16/16
20160172563 

Led module


A lead 1 includes a die-bonding portion 11 with an opening 11a penetrating in a thickness direction. Another lead 2 is spaced from the lead 1.
Rohm Co., Ltd.


06/16/16
20160172340 

Light-emitting diode display screen


A light emitting diode (led) display screen includes: an led display screen substrate (200), an output end of the driving circuit includes: a first positive electrode (202) and a first negative electrode (204) and the first positive electrode (202) and the first negative electrode (204) are located on a first surface of the led display screen substrate (200); an led chip (210), located on the first surface, and the second surface is opposite to the first surface; a first jointing part (222) and a second jointing part (204). The led display screen solves the technical problem in the related art that the minimum dot pitch of an led display screen is excessively large due to a limited size of a support in a conventional encapsulated lamp bead..
Leyard Optoelectronic Co., Ltd.


06/16/16
20160172259 

Customized module lid


A method of forming a custom module lid. The method may include placing a multichip module (mcm) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components..
International Business Machines Corporation


06/16/16
20160172058 

System and handling memory repair data


In a system on chip (soc) device, continuity of a memory repair signature chain, which is accessible by all enabled memory systems, is provided, even when certain memory systems are gated (off) for certain soc configurations. A mechanism for converting between compressed and uncompressed memory repair data within the repair chain is provided so that memory systems that support either uncompressed memory repair data (such as ternary content addressable memories) or compressed memory repair data can be incorporated in the soc..

06/16/16
20160171176 

Medication management health and health related facilities


A system and method for control of prescription drug packaging and dispensing machines located in an in-patient health care facility including centralized control and enhanced communication between system components. Delay and errors in processing item data in the prescription dispensing system are reduced by using concise id data incorporated into each canister memory chip and storing canister contents data elsewhere.
Cerx Pharmacy Partners, Lp


06/16/16
20160170656 

Implementing enhanced performance flash memory devices


A method and apparatus for implementing enhanced performance in a flash memory system in a computer system. A flash memory chip includes a function engine performing garbage collection and scrub operations using an internal bus for data movement, preserving i/o bandwidth.
International Business Machines Corporation


06/16/16
20160170646 

Implementing enhanced performance flash memory devices


A method and apparatus for implementing enhanced performance in a flash memory system in a computer system. A flash memory chip includes a function engine performing garbage collection and scrub operations using an internal bus for data movement, preserving i/o bandwidth.
International Business Machines Corporation


06/16/16
20160170158 

Hybrid integration of edge-coupled chips


A technique for fabricating a hybrid optical source is described. During this fabrication technique, a iii-v compound-semiconductor active gain medium is integrated with a silicon-on-insulator (soi) chip (or wafer) using edge coupling to form a co-planar hybrid optical source.
Oracle International Corporation


06/09/16
20160165358 

Mems microphone package


An mems microphone package includes a substrate, an mems microphone, an ic chip and an electrically conductive cover. The substrate includes a first hole, an upper surface, a bottom surface, a side surface, a first electrically conductive layer and a second electrically conductive layer.
Industrial Technology Research Institute


06/09/16
20160165020 

Pair of integrated wireless earphone for a mobile communication device


A pair of integrated wireless earphone for a mobile communication device. Particularly, the application provides a pair of integrated wireless earphone for a mobile communication device, comprising a pair of collapsible silicon ear channel stopper/holder; a system on chip (soc); a speaker driver; a mic; and a charging contact..
Plastoform Industries Limited


06/09/16
20160164948 

Communication device, information processing device, program, and reader/writer providing system


A communication device includes an ic (integrated circuit) chip storing information in a predetermined area and functioning as a reader/writer that reads out or writes information stored in another ic chip. Also, the communication device downloads an agent from an information processing device connected to the network.
Felica Networks, Inc.


06/09/16
20160164725 

Wireless system package and communication wireless system package and communication device


A wireless system package includes a substrate, an external non-volatile memory, a first integrated circuit, and a second integrated circuit. The first integrated circuit includes a system on chip unit, a bus, a first clock unit, a first terminal, a second terminal, and a third terminal.
Cyntec Co., Ltd.


06/09/16
20160164417 

Dc-dc converter module


A dc-dc converter module includes a module substrate on which switching transistors and a controller ic chip are mounted, stud terminals mounted on a surface of the module substrate, and an inductor attached to the stud terminals such that the inductor faces the module substrate. In a plan view, the switching transistors are arranged within an area where the inductor overlaps the module substrate, whereas at least a portion of the controller ic chip is arranged outside the area..
Panasonic Intellectual Property Management Co., Ltd.


06/09/16
20160163650 

Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies


Die (110) and/or undiced wafers and/or multichip modules (mcms) are attached on top of an interposer (120) or some other structure (e.g. Another integrated circuit) and are covered by an encapsulant (160).
Invensas Corporation


06/09/16
20160163609 

Methods and testing auxiliary components in a multichip package


Ways for testing a multichip package while reducing the required test pin count are provided. The multichip package may include a main die coupled to multiple daughter components.
Altera Corporation


06/09/16
20160162415 

Systems and methods for providing improved latency in a non-uniform memory architecture


Systems, methods, and computer programs are disclosed for allocating memory in a portable computing device having a non-uniform memory architecture. One embodiment of a method comprises: receiving from a process executing on a first system on chip (soc) a request for a virtual memory page, the first soc electrically coupled to a second soc via an interchip interface, the first soc electrically coupled to a first local volatile memory device via a first high-performance bus and the second soc electrically coupled to a second local volatile memory device via a second high-performance bus; determining whether a number of available physical pages on the first and second local volatile memory devices exceeds a minimum threshold for initiating replication of memory data between the first and second local volatile memory devices; and if the minimum threshold is exceeded, allocating a first physical address on the first local volatile memory device and a second physical address on the second local volatile memory device to a single virtual page address..
Qualcomm Incorporated


06/09/16
20160162399 

Systems and methods for providing improved latency in a non-uniform memory architecture


Systems, methods, and computer programs are disclosed for allocating memory in a portable computing device having a non-uniform memory architecture. One embodiment of a method comprises: receiving from a process executing on a first system on chip (soc) a request for a virtual memory page, the first soc electrically coupled to a second soc via an interchip interface, the first soc electrically coupled to a first local volatile memory device via a first high-performance bus and the second soc electrically coupled to a second local volatile memory device via a second high-performance bus; determining a free physical page pair comprising a same physical address available on the first and second local volatile memory devices; and mapping the free physical page pair to a single virtual page address..
Qualcomm Incorporated


06/09/16
20160161968 

Semiconductor apparatus including multichip package


A semiconductor apparatus including a multichip package is disclosed. The semiconductor apparatus includes a slave chip having a slave region and a master region.
Sk Hynix Inc.


06/09/16
20160161862 

Mqw devices & methods for semiconductor patterning systems


Mqw devices, ic chips and methods may be used in semiconductor lithography patterning systems. An mqw device includes an array of pixels that have transmission elements and associated support circuits.
Samsung Electronics Co., Ltd.


06/09/16
20160161064 

Solid state light sheet having wide support substrate and narrow strips enclosing led dies in series


A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare led chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode.
Quarkstar Llc


06/09/16
20160158751 

Microfluidic chip for analysis of cell motility and methods for using same


The present invention describes an integrated apparatus that enables identification of migratory cells directly from a specimen. The apparatus only requires a small number of cells to perform an assay and includes novel topographic features which can reliably differentiate between migratory and non-migratory cell populations in a sample.
University Of Maryland, Baltimore


06/02/16
20160157359 

Customized module lid


A method of forming a custom module lid. The method may include placing a multichip module (mcm) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components..
International Business Machines Corporation


06/02/16
20160156999 

Methods and systems for board level photonic bridges


As photonics evolves closer and closer to the electronic processing elements in order to meet the demands of speed, latency of evolving data communications networks and data centres the inventors, rather than seeking direct monolithically integrated cmos based processing photonic and electronic elements, have established a different route. Namely replace the computer hubs/electrical bridges interconnecting the multiple core logic chipset elements with a photonic bridge.

06/02/16
20160156632 

System on chip and method therefor


A system on chip comprises a responder unit comprising a set of responder elements and an access control unit 484 associated with an authorization list and the responder unit. An entry of the authorization list defines a set of access requirements in relation to an address space identifying at least part of the responder unit.
Freescale Semiconductor, Inc.


06/02/16
20160156572 

Integrated noc for performing data communication and noc functions


The present disclosure is directed to a noc interconnect that consolidates one or more network on chip functions into one network on chip. The present disclosure is further directed to a network on chip (noc) interconnect comprising a plurality of first agents, wherein each agent can be configured to communicate with other ones of the plurality of first agents.
Netspeed Systems


06/02/16
20160155918 

Semiconductor light emitting device


A semiconductor light emitting device includes an led chip, which includes an n-type semiconductor layer, active layer, and p-type semiconductor layer stacked on a substrate. The led chip further includes an anode electrode connected to the p-type semiconductor, and a cathode connected to the n-type semiconductor.

06/02/16
20160155901 

Highly reflective flip chip led die


An led die (40) includes an n-type layer (18), a p-type layer (22), and an active layer (20) epitaxially grown over a first surface of a transparent growth substrate (46). Light is emitted through a second surface of the substrate opposite the first surface and is wavelength converted by a phosphor layer (30).
Koninklijke Philips N.v.


06/02/16
20160155039 

Electronic chip card


A semiconductor component (19) that is designed to evaluate the signals from the biometric sensor (18) and to store biometric data, wherein the semiconductor component (19) is electrically conductively connected to one or more interconnects (2) of the system carrier (1). It is the object of the invention to provide an electronic chip card having a biometric sensor (18), which electronic chip card allows a relatively large number of electronic components to be accommodated on the system carrier (1) of the chip card.

06/02/16
20160154449 

System on chips for controlling power using workloads, methods of operating the same, and computing devices including the same


A system on chip may include: a master device configured to execute a dynamic voltage and frequency scaling (dvfs) program; a slave device configured to communicate with the master device; and/or a performance monitoring unit configured to receive first events generated while instructions are being processed by the master device, configured to generate a first count value by counting a number of second events corresponding to a total number of the instructions related with the first events and configured to generated a second count value counting a number of third events related with first instructions that can be processed by interaction between the master device and the slave device among the first events. The dvfs program may be configured to generate a control signal for controlling dvfs of at least one of the master device and the slave device based on the first count value and the second count value..

06/02/16
20160153905 

Scattered-light smoke detector with a two-color light-emitting diode


A scattered-light smoke detector includes a detector unit that operates according to the scattered-light principle. The detector unit includes a light-emitting diode (led) to irradiate particles to be detected and a spectrally sensitive photosensor to detect the light scattered by the particles.
Siemens Schweiz Ag


06/02/16
20160153622 

Led lamp


The present invention discloses an led lamp, which includes an led light source module including at least one group of led light source components, and further includes three drive circuits and a control circuit. The led light source components include a first, a second, and a third led light source.
Shenzhen University


06/02/16
20160152050 

Sheet processing apparatus and image forming system


A sheet processing apparatus includes a trimming section, a container, a detector and a control section. The trimming section performs trimming to trim a sheet or sheet set.
Konica Minolta, Inc.


05/26/16
20160150229 

Codec, system on chip (soc) including the same, and data processing system including the soc


A codec according to an exemplary embodiment includes a codec processor which receives a current frame, determines a type of a received current frame, and sets rate control parameters of the current frame, and a bit-rate estimator which allocates total target bits to a first group of picture (gop) including the current frame, and allocates a target bit to each of frames included in the first gop based on a determined type of the current frame and set rate control parameters.. .
Samsung Electronics Co., Ltd.


05/26/16
20160150185 

Switch system for video conference


A switch system for video conference includes a video signal processing chip, an internal video interface, an external video interface, and a switch unit. The video signal processing chip includes a second gpio pin and a third gipo pin.
Hon Hai Precision Industry Co., Ltd.


05/26/16
20160148910 

Semiconductor device having plural memory chip


A semiconductor device includes a stacked plurality of memory chips. The memory chips each include a plurality of memory banks, a plurality of read/write buses that are assigned to the respective memory banks, and a plurality of penetration electrodes that are assigned to the respective read/write buses and arranged through the memory chip.
Ps4 Luxco S.a.r.l.


05/26/16
20160148877 

Qfn package with improved contact pins


According to an embodiment of the present disclosure, a method for manufacturing an integrated circuit (ic) device may include mounting an ic chip onto a center support structure of a leadframe, bonding the ic chip to at least some of the plurality of pins, encapsulating the leadframe and bonded ic chip, sawing a step cut into the encapsulated leadframe, plating the exposed portion of the plurality of pins, and cutting the ic package free from the bar. The leadframe may include a plurality of pins extending from the center support structure and a bar connecting the plurality of pins remote from the center support structure.
Microchip Technology Incorporated


05/26/16
20160148876 

Flat no-leads package with improved contact pins


According to an embodiment of the present disclosure, a leadframe for an integrated circuit (ic) device may comprise a center support structure for mounting an ic chip, a plurality of pins extending from the center support structure, and a bar connecting the plurality of pins remote from the center support structure. Each pin of the plurality of pins may include a dimple..
Microchip Technology Incorporated


05/26/16
20160148768 

Control circuit of diode contact protection combination switch and relay control method


A diode contact protection combination switch and a specific implementation method. The combination switch comprises a primary contact protection circuit formed by a primary switch contact of a primary relay, diodes parallel connected at two ends of the primary switch contact, and a contact of a secondary relay.
Gyrk International Technology Co., Ltd.


05/26/16
20160148656 

Address-remapped memory chip, memory module and memory system including the same


A memory chip includes a chip input-output pad unit, a plurality of semiconductor dies. The chip input-output pad unit includes a plurality of input-output pins connected to an external device and the plurality of semiconductor dies are connected commonly to the chip input-output pad unit and having a full memory capacity respectively.
Samsung Electronics Co., Ltd.


05/26/16
20160148084 

Package with radio ic tag and manufacturing package with radio ic tag


A package with a radio ic tag includes a package unit including a metal sheet and a resin sheet, the metal sheet having a predetermined slot pattern formed therein; and an ic chip unit including an ic chip and an electrode member, the electrode member supplying electric power to the ic chip. An end of the slot pattern is disposed in a corner field of the package unit..

05/26/16
20160148023 

Card reader having discriminator contact


A card reader for a point-of-sale system that is configured to accept both magnetic strip-type and integrated circuit (ic) chip-type payment cards. The card reader is a component of a point-of-sale system including a portable computing device in communication with the card reader that is configured to present a first graphical user interface (gui) when a magnetic stripe-type card is detected and a second gui when an ic chip-type card is detected in the card reader.
Square, Inc.


05/26/16
20160147689 

Processor apparatus with programmable multi port serial communication interconnections


A computing and communication chip architecture is provided wherein the interfaces of processor access to the memory chips are implemented as a high-speed packet switched serial interface as part of each chip. In one embodiment, the interface is accomplished through a gigabit ethernet interface provided by protocol processor integrated as part of the chip.
Psimast, Inc


05/26/16
20160147455 

Memory system with selective access to first and second memories


A memory system includes a nonvolatile memory having a plurality of nonvolatile memory chips incorporated therein, a control circuit that controls the nonvolatile memory, an mpu that controls the control circuit, and an interface circuit that communicates with a host, all of which are mounted on a board of the memory system, and the memory system further includes a bus switch that switches connection of a signal line between the control circuit and the nonvolatile memory chips.. .
Kabushiki Kaisha Toshiba


05/26/16
20160146850 

Micromechanical sensor device and corresponding manufacturing method


A micromechanical sensor device, and a corresponding method, including an asic substrate having first front and rear sides, a first rewiring element on the first front side; a mems substrate having a second front side, and a second rear side having a base substrate and a second rewiring element formed thereon; a micromechanical functional layer having at least one movable sensor structure, and which is on the second front side of the second rewiring element; a capping element having third front and rear sides, the third rear side being applied to the second front side for capping the sensor structure; and a recess formed in the base substrate on the second rear side, or in the capping element on the third front side, and within which the asic substrate is suspended on a flexible layered first suspension element via the first rewiring element, forming a cavity surrounding the asic chip.. .
Robert Bosch Gmbh


05/26/16
20160146823 

Methods, compositions and systems for microfluidic assays


Provided herein, among other aspects, are methods and apparatuses for analyzing particles in a sample. In some aspects, the particles can be analytes, cells, nucleic acids, or proteins and contacted with a tag, partitioned into aliquots, detected by a ranking device, and isolated.
University Of Washington Through Its Center For Commercialization


05/26/16
20160146436 

Led unit and led module having the same


An led module includes a flexible printed circuit board including two bonding pads, an led unit and a glue layer including two first glue portions and two second glue portions. The led unit includes an insulating casing having a bottom surface that has a periphery region, an led chip, and two conducting elements.
Changshu Sunrex Technology Co., Ltd.


05/26/16
20160144368 

Plate, manufacturing plate, observing biochip, and screening


This plate (100) is provided with a board (130) having a first surface, and partitioned member (120) in which a plurality of partitions are formed by dividing walls (22). Gaps (28) are formed to the first surface side between neighboring dividing walls (22).
Nikon Corporation


05/19/16
20160143110 

Monolithic led chip in an integrated control module with active circuitry


A lighting device includes a monolithic led chip flip-chip mounted onto an interconnect structure. The monolithic chip includes led junctions formed from a single led junction.
Bridgelux, Inc.


05/19/16
20160141477 

Led module


An led module a1 includes an led chip 1, a lead group 4 including a lead 4a on which the led chip 1 is mounted and a lead 4b spaced apart from the lead 4a, a resin package 2 covering part of the lead group 4, and mounting terminals 41 and 42 provided by part of the lead group 4 that is exposed from the resin package 2 and spaced apart from each other in direction x. The led module further includes a mounting terminal 43 spaced apart from the mounting terminal 41 in direction y, and a mounting terminal 44 spaced apart from the mounting terminal 42 in direction y.
Rohm Co., Ltd.


05/19/16
20160141324 

Semiconductor image sensor module, manufacturing the same as well as camera and manufacturing the same


A semiconductor image sensor module 1 at least includes a semiconductor image sensor chip 2 having a transistor forming region on a first main surface of a semiconductor substrate and having a photoelectric conversion region with a light incident surface formed on a second main surface on the side opposite to the first main surface and an image signal processing chip 3 for processing image signals formed in the semiconductor image sensor chip 2, wherein a plurality of bump electrodes 15a are formed on a first main surface, a plurality of bump electrodes 15b are formed on the image signal processing chip 3, both the chips 2 and 3 are formed to be laminated through heat dissipating means 4 and the plurality of bump electrodes 15a of the semiconductor image sensor chip 2 and the plurality of bump electrodes 15b on the image signal processing chip 3 are electrically connected.. .
Sony Corporation


05/19/16
20160141276 

Light-emitting structure for providing predetermined whiteness


A light-emitting structure for providing a predetermined whiteness includes a substrate and a light-emitting unit. The light-emitting unit includes a plurality of first and second light-emitting groups disposed on the substrate.
Lite-on Technology Corporation


05/19/16
20160141033 

Memory system and assembling memory system


According to one embodiment, each memory chip included in a memory package includes a first storage unit that stores therein first information that is n-bit information and is a comparison target of a chip address, and is used for identifying its own memory chip, a second storage unit that stores therein second information for determining an effective bit of the n-bit first information, and a control unit that determines an effective bit of the n-bit first information and an effective bit of the chip address based on the second information.. .
Kabushiki Kaisha Toshiba


05/19/16
20160141005 

Semiconductor integrated circuit and driving the same


Provided is a semiconductor integrated circuit including a plurality of memory chips stacked therein, each of the memory chips may include: a pumping enable signal control unit suitable for generating a pumping enable signal in response to a power-up signal or a trigger signal received from a first adjacent memory chip, delaying the pumping enable signal by a given time, and outputting the delayed pumping enable signal to a second adjacent memory chip; and a pumping unit suitable for generating a pumping voltage by performing a pumping operation in response to the pumping enable signal.. .
Sk Hynix Inc.


05/19/16
20160140918 

Display device


Provided is to secure a data-writing period to a source line and reduce the number of the ic chips used. N image data (e.g., three image data, rgb) are sequentially input to one input terminal.
Semiconductor Energy Laboratory Co., Ltd.


05/19/16
20160140368 

Rfid tag and rfid system


An rfid tag includes a base part, a loop antenna around the base part including a first antenna element and a second antenna element, and a loop-length shorter than a wavelength of a resonant frequency, and an ic chip at a first surface side of the base part. The ic chip is connected between a first terminal disposed on a first end of the first antenna element and a second terminal disposed on a first end of the second antenna element.
Fujitsu Limited


05/19/16
20160140366 

Card reader and control method therefor


Provided is a card reader that accepts and processes the short side of a substantially rectangular ic card conforming to international and jis standards, said card reader being capable of easily determining whether or not the orientation of the inserted ic card is correct. This card reader comprises: an insertion port wherein a card having a built-in ic chip is inserted; a metal detection mechanism for detecting an external connection terminal of the ic chip formed in the card; and a tip detection mechanism for detecting the tip, in the insertion direction, of the card inserted from the insertion port.
Nidec Sankyo Corporation


05/19/16
20160140281 

System on chip i/o connectivity verification in presence of low power design considerations


Formal verification of connectivity of a circuit, for example, a circuit representing a system on chip i/o ring is performed with low power considerations. The formal verification determines whether the connectivity of a circuit remains valid when low power design specification is introduced.
Synopsys, Inc.


05/19/16
20160139350 

Inverted 45 degree mirror for photonic integrated circuits


Inverted 45° semiconductor mirrors as vertical optical couplers for pic chips, particularly optical receivers and transmitters. An inverted 45° semiconductor mirror functions to couple light between a plane in the pic chip defined by thin film layers and a direction normal to a top surface of the pic chip where it may be generated or collected by an off-chip component, such as a wire terminal.

05/19/16
20160138765 

Led lighting device with improved light distribution


A lighting device and a lighting unit comprising a reflector and a lighting device, or led lamp are described. The led lamp have a first and a second led assembly.
Koninklijke Philips N.v.


05/19/16
20160135426 

A communicating with an electronic device and an electronic device locatable on or in an animal


An electronic monitoring device (20) for attaching to an animal (21) for determining a plurality of states of an animal (21). The monitoring device (20) comprises an nfc module (31) which facilitates wireless communication between a smart phone (32) and the monitoring device (20).
Dairymaster


05/12/16
20160134450 

Non-contact communication apparatus


Provided is a non-contact communication apparatus which uses a conventional ic chip without any change, while eliminating the need to transmit power to the ic chip and allowing an increase in communication range. A non-contact communication apparatus connectable to an ic chip includes an antenna section, a first detection section that retrieves a first detection signal from a signal received by the antenna section, an amplitude modulating section that amplitude-modulates a clock signal using the first detection signal retrieved by the first detection section and that inputs the amplitude-modulated signal to the ic chip, a second detection section that retrieves a second detection signal from an output signal from the ic chip, a load modulating section that load-modulates a carrier retrieved from the antenna section using the second detection signal retrieved by the second detection section and that inputs the load-modulated carrier to the antenna section, and a power supply section..
Jr East Mechatronics Co., Ltd.


05/12/16
20160133811 

High-power led lamp cooling device and manufacturing the same


A high-power led lamp cooling device and its manufacturing method, which includes: manufacturing a semiconductor crystal bar in advance into cone-shaped crystal bar with one end having large diameter and the other having small diameter, making color mark on each wafer as the large-diameter end surface of the tail end when the cone-shaped semiconductor crystal bar is cut into slices; cutting and pelletizing the conical surface to obtain polygonal cylindrical n-type or p-type semiconductor elements, arranging them in a matrix form between two beryllium-oxide ceramic chips provided with conductive circuits, connecting head end of n-type semiconductor elements to tail end of the p-type semiconductor elements in series to manufacture high-power led lamp cooling device. The high-power led lamp cooling device can achieve: good cooling effect, high working efficiency, low energy consumption and capable of reducing light failure of led lamp, and prolonging service life of the high-power led lamp..
Suzhou Weiyuan New Material Technology Co., Ltd.


05/12/16
20160133797 

Smd type led package device, manufacturing the same, and light-emitting apparatus


Disclosed is a smd type led package device, a method for manufacturing the same, and a light-emitting apparatus, wherein the surface-mount-device (smd) type light-emitting diode (led) package device comprises an assembly of an led chip, two metal supporting frames, and a packaging body. The two metal supporting frames of the assembly are spaced apart from each other and disposed in parallel along the first axis.
Powerled Electronic Co., Ltd.


05/12/16
20160133616 

Photo-sensitive silicon package embedding self-powered electronic system


A self-powered electronic system comprises a first chip (401) of single-crystalline semiconductor embedded in a second chip (302) of single-crystalline semiconductor shaped as a container bordered by ridges. The assembled chips are nested and form an electronic device assembled, in turn, in a slab of weakly p-doped low-grade silicon shaped as a container (330) bordered by ridges (331).
Texas Instruments Incorporated


05/12/16
20160133615 

Semiconductor light emitting device and semiconductor light emitting device package including the same


There is provided a semiconductor light-emitting device which includes a light-emitting diode (led) chip having a first plane on which first and second electrodes are disposed and a second plane disposed opposite to the first plane, first and second solder bumps disposed in bonding areas of the first and second electrodes, respectively, and a protective device electrically connected to the first and second electrodes and mounted on the first plane of the led chip. The protective device has the substantially same thickness as each of the first and second solder bumps..
Samsung Electronics Co., Ltd.


05/12/16
20160133612 

Led module with led chips


Various embodiments may relate to an led module, including a number of first inherently unpackaged led chips, which are in each case designed to emit light of a first color at a respective light emission area, and a number of second inherently unpackaged led chips, which are in each case designed to emit light of a second color, different than the first color, at a respective light emission area. The led chips are provided jointly in a housing, and the respective light emission area of a second led chip is at least 25% smaller than the respective light emission area of a first led chip.
Osram Gmbh


05/12/16
20160133610 

Light emitting diode (led) components and methods


Light emitting diode (led) components and related methods are disclosed. Led components include a submount, at least one led chip on a first surface of the submount, and a non-reflective, light permeable structure or dam.
Cree, Inc.


05/12/16
20160133517 

Self-limited, anisotropic wet etching of transverse vias in microfluidic chips


The present invention is notably directed to a method of fabrication of a microfluidic chip (1). Comprising: providing (s10-s20) a wafer (10, 12) of semiconductor material having a diamond cubic crystal structure, exhibiting two opposite main surfaces (s1, s2), one on each side of the wafer, and having, each, a normal in the <100> or <110> direction; and performing (s30) self-limited, anisotropic wet etching steps on each of the two main surfaces on each side of the wafer, to create a via (20, 20a) extending transversely through the thickness of the wafer, at a location such that the resulting via connects an in-plane microchannel (31) on a first one (51) of the two main surfaces to a second one (s2) of the two main surfaces, the via exhibiting slanted sidewalls (20s) as a result of the self-limited wet etching.
International Business Machines Corporation


05/12/16
20160132451 

System on chip having semaphore function and implementing semaphore function


A system on chip, semiconductor device, and/or method are provided that include a plurality of masters, an interface, and a semaphore unit. The interface interfaces the plurality of masters with a slave device.

05/12/16
20160132409 

Mirroring in three-dimensional stacked memory


A method for mirroring in three-dimensional-stacked memory includes receiving a plurality of thermal profiles from a plurality of memory chips. The method also includes ranking the plurality of memory chips in a first ranked list of memory chips as a function of the plurality of thermal profiles and forming a first group of memory chips from the plurality of memory chips based on the first ranked list of memory chips.
International Business Machines Corporation


05/12/16
20160132408 

Mirroring in three-dimensional stacked memory


A method for mirroring in three-dimensional-stacked memory includes receiving a plurality of thermal profiles from a plurality of memory chips. The method also includes ranking the plurality of memory chips in a first ranked list of memory chips as a function of the plurality of thermal profiles and forming a first group of memory chips from the plurality of memory chips based on the first ranked list of memory chips.
International Business Machines Corporation






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