Popular terms

Follow us on Twitter
twitter icon@FreshPatents

Web & Computing
Cloud Computing
Ecommerce
Search patents
Smartphone patents
Social Media patents
Video patents
Website patents
Web Server
Android patents
Copyright patents
Database patents
Programming patents
Wearable Computing
Webcam patents

Web Companies
Apple patents
Google patents
Adobe patents
Ebay patents
Oracle patents
Yahoo patents

[SEARCH]

Chip patents



      

This page is updated frequently with new Chip-related patent applications.




Date/App# patent app List of recent Chip-related patents
04/28/16
20160120003 
 White light emitting device patent thumbnailWhite light emitting device
A white light emitting device includes an led chip capable of emitting light with a peak wavelength of 390 to 430 nm, and a wavelength conversion layer including first, second and third fluorescent materials. The first fluorescent material is capable of being excited to emit light with a peak wavelength of 450 to 470 nm.
Lite-on Technology Corp.


04/28/16
20160119153 
 Zero standby power for powerline communication devices patent thumbnailZero standby power for powerline communication devices
An embodiment is an integrated system on chip (soc) including a communication interface configured to implement a communication protocol including functional blocks that are energized or de-energized individually so that a minimum power consumption is used to receive and detect a signal, and a receiver identification (id) detection function configured to determine whether the signal is intended for the device in which the soc resides. The soc further includes a power management function configured to control which functions in the soc and/or device in which the soc resides are energized or de-energized depending on the results of the receiver id detection function, and a power source capable of energizing a minimum number of the functional blocks required to receive and detect a signal, wherein the power source can be used in a low power state and switched over to a main power supply when the soc is energized..
Stmicroelectronics, Inc.


04/28/16
20160118569 
 Portable generation and lighting device based on temperature difference patent thumbnailPortable generation and lighting device based on temperature difference
A portable lighting device with thermoelectric power generation which includes a thermoelectric power generation module (001), a mounting top panel (004), a light emitting unit (003) on the mounting top panel (004), an adjustment rod (002) connecting between the thermoelectric power generation module (001) and the mounting top panel (004). The thermoelectric power generation module (001), having a hot and a cold sides, includes a heat dissipation unit (100) proximal to the cold side, a thermoelectric power generation chip set (110), a heat supply box (120) proximal to the hot side and a combustion chamber (130) connected to the bottom of the heat supply box.
Dongguan Hewang Electric Co., Ltd


04/28/16
20160118565 
 Led support assembly and led module patent thumbnailLed support assembly and led module
An led support assembly and an led module are provided. The led support assembly includes: a metal heat sink, a first ceramic substrate and a second ceramic substrate, the metal heat sink defines an upper surface; the first ceramic substrate is adapted to support a led chip and disposed on the upper surface of the metal heat sink; the second ceramic substrate is adapted to support electrodes of the led chip and surrounds the first ceramic substrate..
Byd Company Limited


04/28/16
20160118564 
 Light emitting diode chip having electrode pad patent thumbnailLight emitting diode chip having electrode pad
Disclosed herein is an led chip including electrode pads. The led chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer.
Seoul Viosys Co., Ltd.


04/28/16
20160118319 
 Semiconductor package and method therefor patent thumbnailSemiconductor package and method therefor
In one embodiment, an electronic package structure includes a lead having a first width. An electronic chip having a conductive bump on a major surface, the conductive bump has a second width greater than the first width.
Amkor Technology, Inc.


04/28/16
20160118311 
 Thin film rdl for ic package patent thumbnailThin film rdl for ic package
A package substrate comprising a thin film redistribution layer (rdl) with a plurality of metal pillar configured on chip side is disclosed to thin the thickness of an ic package before mounting to a circuit board. The height of metal pillar keeps a proper distance between the ic chip and the package substrate so that an underfill material can be filled in between to ensure the reliability of the ic package..

04/28/16
20160118194 
 Solid electrolytic chip capacitor and manufacturing method thereof patent thumbnailSolid electrolytic chip capacitor and manufacturing method thereof
A solid electrolytic chip capacitor is provided which comprises a substrate layer, an electrical insulating block, a conductive polymer layer, a patterned reinforcement layer, and an electrode layer. The electrical insulating block is formed on the substrate layer to define an anode region and a cathode region on the substrate layer.
Apaq Technology Co., Ltd.


04/28/16
20160118097 
 Bipolar logic gates on mos-based memory chips patent thumbnailBipolar logic gates on mos-based memory chips
A system uses both mos-based and bipolar-based decoding circuitry in an address decoder for mos-based memory. The system includes a mos-based memory, which includes an array of a plurality of memory cells configured to store data, and an address decoder including mos-based circuitry and bipolar logic circuitry.
Elwha Llc


04/28/16
20160118088 
 Storage device including a plurality of nonvolatile memory chips patent thumbnailStorage device including a plurality of nonvolatile memory chips
A storage device includes first and second nonvolatile memory groups that respectively include first and second nonvolatile memory chips, a memory controller connected to the first and second nonvolatile memory groups in common through input/output lines and at least one control line, and a group select circuit connected to the memory controller through the at least one control line and chip enable lines. The group select circuit is connected to the first and second nonvolatile memory groups through a plurality of first and second chip enable lines, respectively.
Samsung Electronics Co., Ltd.


04/28/16
20160117264 

Systems and methods for preventing data remanence in memory


A system for preventing data remanence in memory is provided. The system includes a computing device, a memory chip coupled to the computing device and including memory, and a heater, the heater configured to prevent data remanence in a memory by providing heat to at least a portion of the memory.
Elwha Llc


04/28/16
20160116689 

Arrangement of photonic chip and optical adaptor for coupling optical signals


An apparatus includes an optical adaptor having monolithically integrated optical elements and first micro-mechanical features, the latter defining at least a first horizontal reference surface and a first vertical reference surface; wherein the first horizontal reference surface is perpendicular to an optical plane, the latter being perpendicular the optical axis of the optical elements; and wherein the first vertical reference surface is perpendicular to the first horizontal reference surface and parallel to the optical axis.. .
International Business Machines Corporation


04/28/16
20160116526 

Method and quantifying defects due to through silicon vias in integrated circuits


A device and method to control the heating of an ic chip in a wafer form for measuring various parameters associated therewith are provided. Embodiments include a device having a silicon layer with an upper surface, and on a plastic carrier; a plurality of devices in the silicon layer and electrically coupled through the upper surface to a test control system; a through silicon via (tsv) extending into the silicon layer; and a parallel heating structure adjacent to the plurality of devices electrically coupled to the test control system..
Global Foundries Inc.


04/21/16
20160113127 

Electronic module having an electrically insulating structure with material having a low modulus of elasticity


Electronic module comprising at least one electronic chip, an encapsulation structure in which the at least one electronic chip is at least partially encapsulated, an electrically conductive structure for the electrically conductive contacting of the at least one electronic chip, and an electrically insulating structure which is at least partially formed from a material having a low modulus of elasticity, wherein a variation of the value of the modulus of elasticity is at the most 10 gpa in a temperature range between −40° c. And +150° c..

04/21/16
20160113088 

Lighting system and method to control a lighting system


An led lighting system is disclosed, which generally consists of an enclosure, one or more led modules, one or more transformers, and one or more drivers. A lamp assembly is disclosed, which generally consists of one or more vertically oriented led chips, thermally conductive shells, and a thermally dissipating means positioned at the back of the led chips.

04/21/16
20160112808 

Mems microphone modules and wafer-level techniques for fabricating the same


A method of fabricating a plurality of mems microphone modules by providing a first substrate wafer 62 on which are mounted a plurality of sets comprising an led 102, an ic chip 22 and a mem microphone device 24, where the led 102 and ic chip 22 are surrounded and separated by first spacers 104, 64a, 64, the spacer 104 being much taller, attaching a second substrate on top of the first spacer elements above the ic chip 22, mounting a mems microphone device 24 to the second substrate 60, the second substrate not extending over the led 102, surrounding the mems microphone device by second spacers 32a, 32, attaching a cover wafer 28 across the whole first substrate wafer 62 covering all the plurality of sets, forming openings 30 to the mems cavities, dividing the substrate wafer 62 into individual mems microphone modules through the width of the separating spacers 104, 32, 64. Conductive traces may extend through the spacers.

04/21/16
20160111617 

Light emitting diode package


A light emitting diode (led) package includes an led chip, a first lead frame and a second lead frame electrically connected to the led chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame..

04/21/16
20160111607 

Phosphor sheet, light-emitting device having the phosphor sheet and manufacturing the same


A light-emitting device includes a substrate including a first electrode and a second electrode, a light-emitting diode (led) chip electrically connected to the first and the second electrodes, and a phosphor sheet disposed on an upper surface of the led chip, a first transparent part disposed under the phosphor sheet, and a second transparent part disposed between the phosphor sheet and the led chip. The first transparent part contacts the second transparent part..

04/21/16
20160111363 

Electrical connections for chip scale packaging


Electrical connections for chip scale packaging are disclosed. In one embodiment, a semiconductor device includes a post-passivation layer disposed over a substrate, the substrate having a first direction of coefficient of thermal expansion mismatch.

04/21/16
20160110639 

Passive smart cards, metal cards, payment objects and smart jewelry


Rfid devices comprising (i) a transponder chip module (tcm, 1410) having an rfic chip (ic) and a module antenna (ma), and (ii) a coupling frame (cf) having an electrical discontinuity comprising a slit (s) or non-conductive stripe (ncs). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna.

04/21/16
20160109932 

System-on-chip including a power path controller and electronic device


A system on chip (soc) includes a plurality of function circuits including a plurality of logic circuits and a plurality of function circuits each of which includes a logic circuit and a memory, and a plurality of power path controllers respectively coupled to a plurality of first power sources at first input terminals, commonly coupled to a second power source at second input terminals, and respectively coupled to the memories at output terminals. The logic circuits are respectively coupled to the first power sources, and configured to be supplied with a plurality of first power supply voltages from the first power sources, respectively.

04/21/16
20160109668 

Direct printed circuit routing to stacked opto-electrical ic packages


An optical transmitter may include a chip stack that includes an electrical ic that is mounted using solder balls to a photonic chip. These solder connections permit the electrical ic and the photonic chip to communicate.

04/21/16
20160109659 

Stacked photonic chip coupler for soi chip-fiber coupling


Embodiments are provided for an optical coupler created by bonded photonic chip coupler for silicon-on-insulator (soi) chip-fiber coupling. System and apparatus embodiments for a bonded photonic chip coupler for soi chip-fiber coupling provide for reduced mismatch between fiber and chip, increased coupling efficiency, and lower photonics device insertion loss.

04/14/16
20160105626 

Retail demo mode on gps or ip reverse look up


A device such as a television automatically determines, on initial power up, its geographical location. If the television is determined to be residing in a retail store location it will automatically default to retail mode where picture and audio quality will be set to pre-specified settings conducive to a retail environment where the ambient light and sound levels are not what would typically be found in a residential environment.

04/14/16
20160105297 

Joint transmitter and receiver map algorithm for enhancing filtering tolerance in a bandwidth-limited system


A system for optimizing signal quality in an optical communication system is provided including a transmitter for converting digital signals to optical signals, the transmitter including a transmitter digital signal processing chip including a pre-distortion logic and a transmitter look-up table (lut). A receiver is operatively coupled to the transmitter for receiving and converting the optical signals from the transmitter to digital signals.

04/14/16
20160104065 

Dual ic card


A dual ic card of the present invention includes: an ic module having a contact terminal portion contacting an external machine, a connecting coil configuring a contactless terminal portion by electromagnetic coupling, and an ic chip having a contact communication function and a contactless communication function; an antenna formed along a coil wiring path that defines an inductance and having a coupling coil portion electromagnetically coupling with the connecting coil of the ic module, a main coil portion formed along a coil wiring path that defines an inductance and connected to the coupling coil portion for performing contactless communication with the external machine, and a resistance-increasing portion provided in a section that forms the coil wiring path of at least one of the coupling coil portion and the main coil portion increase electrical resistance in the section; and a plate-like card body in which the antenna is arranged.. .

04/14/16
20160104064 

Ic module, dual ic card, and manufacturing ic module


An ic module of the present invention includes: a sheet-like base having a first surface and a second surface and having a first through hole and a second through hole spaced apart from the first through hole; an ic chip provided to the first surface, having a contact communication function and a contactless communication function, and having two terminals formed thereon; a connecting coil formed on the first surface and having two ends; a contact terminal portion provided to the second surface and configured to contact an external contact machine; bridge wiring provided to the second surface, provided at a position overlapping with the first and second through holes, and electrically insulated from the contact terminal portion; a first conductive wire inserted through the first through hole and connecting the first terminal of the ic chip to the bridge wiring; a second conductive wire inserted through the second through hole and connecting the bridge wiring to the first end of the connecting coil; and a third conductive wire connecting the second end of the connecting coil to the second terminal of the ic chip.. .

04/14/16
20160104063 

Contact smart card


A contact smart card has a smart card contact pad and an ic chip. The smart card contact pad includes a circuit substrate, a card-reader contact element on a first side of the circuit substrate, and a connection element on a second side of the circuit substrate.

04/14/16
20160103723 

System-on-chip verification


Disclosed herein are method, system and computer program product embodiments for improving the verification process of a system on chip (soc). An embodiment operates by employing an active interconnect (aic) between a processing subsystem (e.g., a central processing unit or cpu) and a plurality of peripherals, wherein the processing subsystem is linked to a plurality of applications via a plurality of drivers, and implementing a common set of software codes by at least one of the applications for a software development process and a hardware verification process.

04/14/16
20160103152 

Testing apparatus


A test apparatus for testing a first flash memory chip is provided. The testing apparatus includes: an interface printed circuit board (pcb), a separate pcb, and a socket device.

04/14/16
20160103023 

Voltage and temperature sensor for a serializer/deserializer communication application


The present invention relates generally to integrated circuits. More particularly, the present invention provides a circuit and method for sensing a voltage and/or temperature from an integrated circuit device such as a serializer/deserializer (serdes) integrated circuit device.

04/14/16
20160102854 

Cooling mechanism for led light using 3-d phase change heat transfer


Novel 3-d super-thermal conducting heat management design and delayed cooling using phase change materials are adopted to lower the temperature inside leds and other devices. The cooling mechanism uses a fin structure with hollow fins to dissipate heat to the environment.

04/07/16
20160099393 

Using mems fabrication incorporating into led device mounting and assembly


Led chip packaging assembly that facilitates an integrated method for mounting led chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. Led chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the led chips, respectively.
Imec Taiwan Co.


04/07/16
20160099387 

Semiconductor light emitting device


A semiconductor light emitting device includes a package body having first and second surfaces being opposed to each other, first and second external terminal blocks disposed in opposite end portions of the package body, respectively, and having portions exposed to surfaces of the package body, respectively. A wavelength converting material layer is disposed between the first and second external terminal blocks and has a first surface substantially coplanar with the first surface of the package body, and a second surface opposing the first surface of the wavelength converting material layer.
Samsung Electronics Co., Ltd.


04/07/16
20160099219 

Semiconductor device having features to prevent reverse engineering


It is desirable to design and manufacture electronic chips that are resistant to modern reverse engineering techniques. Disclosed is a method and device that allows for the design of chips that are difficult to reverse engineer using modern teardown techniques.
Secure Silicon Layer, Inc.


04/07/16
20160099211 

System on chip


Systems on chips are provided. A system on chip (soc) includes a first gate line, a second gate line and a third gate line extending in a first direction, a gate isolation region cutting the first gate line, the second gate line and the third gate line and extending in a second direction across the first direction, a first gate contact formed on the second gate line arranged between the first gate line and the third gate line, and electrically connecting the cut second gate line, a second gate contact formed on the first gate line, a third gate contact formed on the third gate line, a first metal line electrically connecting the second gate contact and the third gate contact, and a second metal line electrically connected to the first gate contact..

04/07/16
20160099077 

Test system simultaneously testing semiconductor devices


Individual memory chips are simultaneously tested by a tester using selectively enabled stress modules that apply a corresponding stress test to memory cells, wherein each stress test is associated with a corresponding failure attribute for the memory cells. Built-in self-test (bist)/built-in self-stress (biss) circuitry is provided in each stress module and may configured to selectively apply one or more stress test(s) during the simultaneous testing of a plurality of memory chips..

04/07/16
20160098332 

Dynamic multi-purpose external access points connected to core interfaces within a system on chip (soc)


An integrated circuit device comprises multiple cores each comprising one or more separate input and output interfaces, the multiple cores integrated within the integrated circuit device to function as a single computer system. Internal inter-chip connection links are disposed on the integrated circuit device for connecting one or more cores with at least one other core via the one or more separate input and output interfaces.
Globalfoundries Inc.


04/07/16
20160097491 

Led lamp


An led lamp a includes a plurality of led modules 2 each including an led chip 21, and a support member 1 including a support surface 1a on which the led modules 2 are mounted. The led modules 2 include a plurality of kinds of led modules, or a first through a third led modules 2a, 2b and 2c different from each other in directivity characteristics that represent light intensity distribution with respect to light emission directions.
Rohm Co., Ltd.


04/07/16
20160097027 

Engineering of a novel breast tumor microenvironment on a microfluidic chip


A microfluidic device for more accurately modeling the in vitro environment in which cancer occurs is disclosed. The device comprises a surface defining one or more microfluidic channels that may further comprise one or more endothelial cells, a first three dimensional scaffold comprising one or more cancer cells that is spatially separated from the one or more microfluidic channels, and a second three dimensional scaffold comprising one or more stromal cells, at least a portion of which is interposed between the one or more microfluidic channels and the first three dimensional scaffold.

03/31/16
20160093787 

Light emitting diode array constructions and packages


Light emitting diode packages as disclosed herein comprise a monolithic chip including at least a first and a second light emitting diode (led) that are electrically coupled in series, wherein the first and the second leds each include at least one electrical terminal configured to be electrically coupled to a power source. The monolithic chip is mounted onto a connection substrate having first and second landing pads formed from metallic material and electrically isolated from each other.
Bridgelux, Inc.


03/31/16
20160093768 

Light emitting diode constructions and making the same


Flip chip leds comprise a transparent substrate or carrier having an active material attached thereto and having a number of electrodes disposed along a common surface of the active material. The substrate may include a number of surface features disposed along a first surface adjacent the active material for improving light extraction from the active material, and includes a number of surface features along a second surface opposite the first surface for minimizing internal reflection of light through the substrate, thereby improving light extraction from the transparent substrate.
Bridgelux, Inc.


03/31/16
20160093378 

Semiconductor memory device


A semiconductor memory device may include a plurality of memory chips stacked upon one another, and electrically coupled to one another through a plurality of first tsvs. The semiconductor memory device may include a plurality of second memory chips stacked separately from the first memory chips, and the plurality of second memory chips electrically coupled to one another through a plurality of second tsvs.
Sk Hynix Inc.


03/31/16
20160093008 

Next-generation secure electronic real estate and personal property title (timmop)


A new generation of secure title to electronic device comprising a card (1) of title, on which information about at least one owner and at least one property and or personal property are engraved, the professional card (3), on which the information about a professional engraved, the device is characterized in that said card (1) comprises an electronic chip (2) secured to contain confidential information of said owner and said personal property and/or real property and access rights to such information. Said professional card (3) includes an electronic chip (4) secure for containing information of said professional and professional access the said rights to the information of the card (1) of title, in the presence of the owner of the property and said card (1).

03/31/16
20160091679 

Optical connector module


An optical connector module includes a substrate including a base disposed on an upper surface of the substrate; an electronic chip disposed on the upper surface of the substrate; an optical component disposed on the base and electrically connected to the electronic chip; a socket fixed on the substrate for coving the optical component, and including at least one guide hole and a light transmitting window; a fixing block including at least one guide pin and at least one opening, wherein the guide pin is inserted into the guide hole to fix the fixing block on the socket and to orient the opening to the optical component via the light transmitting window; and an optical fiber with one end running through the opening of the fixing block to orient the end to the optical component via the light transmitting window.. .
Optomedia Technology Inc


03/31/16
20160091427 

Method for manufacturing biochip having improved fluorescent signal sensing properties and biochip manufactured by the same


A method for manufacturing a biochip having improved fluorescent signal sensing properties, and a biochip manufactured by the manufacturing method. A filter layer is provided between a bio-layer and a light sensor layer so as to remove noise generated by stray light during a bio-reaction process.
Optolane Technologies Inc.


03/24/16
20160088740 

Inclined photonic chip package for integrated optical transceivers & optical touchscreen assemblies


An optical touchscreen assembly may employ a photonic chip packaged with a chip surface at an angle inclined between horizontal and vertical orientations. An inclined paddle sawn flat no-leads (ipsfn) package may be affixed to a cover glass surface along a perimeter of a display.
Intel Corporation


03/24/16
20160087183 

Semiconductor light-emitting device, producing same, and display device


A semiconductor light-emitting device (101) includes an led chip (4), a lead (1) having a main surface (11) on which the led chip (4) is mounted, and a resin package (5) covering the led chip (4). The main surface (11) is roughened, and the main surface (11) is held in contact with the resin package (5).
Rohm Co., Ltd.


03/24/16
20160087175 

Light emitting diode package and light source module and backlight unit using the same


Disclosed is a light emitting diode (led) package, which can be used for, for example, a light source module, a backlight unit and a display device, that may, for example, include an led chip in a body portion of the led package; first and second lead frames separated from each other in the body portion, each of the first and second lead frames including first and second leads that are electrically connected to the led chip and are used as one of anode and cathode leads; and first and second dummy lead frames separated from each other in the body portion and electrically insulated from the first and second lead frames.. .
Lg Display Co., Ltd.


03/24/16
20160087173 

Self-aligned floating mirror for contact vias


Described herein are led chips incorporating self-aligned floating mirror layers that can be configured with contact vias. These mirror layers can be utilized to reduce dim areas seen around the contact vias due to underlying material layers without the need for the mirror layer to be designed at some tolerance distance from the electrical via.
Cree, Inc.


03/24/16
20160087166 

Led luminous structure for backlight source


Disclosed is an led luminous structure for backlight source with good light emitting efficiency and color light rendering and capable of preventing oxidation or affects overall light quality. The led luminous structure includes a base, a blue led chip, a green led chip, a red phosphor and an encapsulation.
Unity Opto Technology Co., Ltd.


03/24/16
20160087165 

Led display and manufacturing method thereof


A manufacturing method of a led display is provided. A temporary substrate is provided, wherein the temporary substrate has a first adhesive layer and a plurality of first, second and third led chips mounted on the first adhesive layer.
Lextar Electronics Corporation


03/24/16
20160087162 

Light emitting device and tv back-light module with wide color gamut


The present invention provide an light emitting device (led) with wide color gamut (high ntsc), and a led backlight module with the light emitting device, the light emitting device includes at least one led chip, wherein the led chip is a blue or ultraviolet (uv) led chip, the light-out surface of the led chip is covered by a phosphor-converted layer which consists of phosphor converted materials and thermosetting colloid materials, the phosphor converted materials contain green-converted phosphor, red-converted phosphor and a special phosphor material that has strong light-absorbing properties in the wavelength range of 460-510 nm. The present invention can reduce the stringent requirements of phosphor fwhm that needs to meet for conventional high ntsc solution..
Apt Electronics Ltd.


03/24/16
20160086928 

Light-emitting device having a plurality of concentric light transmitting areas


The light-emitting device of the present invention includes led chips provided on a ceramic substrate and a sealing material in which the led chips are embedded. The sealing material contains a fluorescent substance and divided into a first fluorescent-substance-containing resin layer and a second fluorescent-substance-containing resin layer by a first resin ring and a second resin ring..
Sharp Kabushiki Kaisha


03/24/16
20160086565 

Display driving circuit, operating display driving circuit, and system on chip


A display driving circuit includes a frame buffer that stores a plurality of pieces of line data, and a buffer controller. The buffer controller receives a data packet, and outputs first line data included in the data packet or second line data stored in the frame buffer as grayscale data based on flag information included in the data packet..

03/24/16
20160085670 

Memory access method, buffer scheduler and memory module


The present invention discloses a memory access method, a buffer scheduler, and a memory module, which can support multiple application scenarios without changing the memory module or a memory chip. The method includes: receiving an operation request message for memory access data, where the operation request message includes tag information of the memory access data, operation information of the memory access data, and a memory address of the memory access data; and performing, according to at least one of the tag information of the memory access data, a memory address of the memory access data, and the operation information of the memory access data, an operation on the tag of the memory access data and/or the memory access data stored in the memory module.
Huawei Technologies Co., Ltd.


03/24/16
20160084750 

Microfluidic hydrodynamic microvortical cell rotation in live-cell computed tomography


Microfluidic devices for 3d hydrodynamic microvortical rotation of at least one live single cell or cell cluster, systems incorporating the devices, and methods of fabricating and using the devices and systems, are provided. A microfluidic chip rotates at least one live single cell or cell cluster in a microvortex about a stable rotation axis perpendicular to an optical axis within a chamber having a trapezoidal cross-sectional shape located below a flow channel.
Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Ariz


03/17/16
20160081142 

Light emitting apparatus and lighting apparatus


Light emitting apparatus including: substrate; led chips on substrate; first sealing layer sealing led chips; second sealing layer above first sealing layer; and phosphor layer containing yellow phosphor, disposed between first sealing layer and second sealing layer, wherein phosphor layer contains the yellow phosphor in higher density than first sealing layer and second sealing layer.. .
Panasonic Intellectual Property Management Co., Ltd.


03/17/16
20160080746 

Codec and devices including the same


A method, codec device, and system on chip (soc) are provided for coding a region of interest (roi) object of a frame. A current frame, which includes the roi object is received, and a type of the current frame is determined.
Samsung Electronics Co., Ltd.


03/17/16
20160079492 

Light emitting apparatus and lighting apparatus


Light emitting apparatus including: substrate; led chips on substrate; sealing member sealing led chips; buffer layer on substrate; and dam material on the top surface of buffer layer, for holding back sealing member, wherein the adhesive strength of buffer layer to substrate and the adhesive strength of dam material to buffer layer are higher than the adhesive strength of dam material to substrate.. .
Panasonic Intellectual Property Management Co., Ltd.


03/17/16
20160079472 

Semiconductor devices and related methods


Semiconductor devices and related methods are disclosed. In one aspect, a semiconductor device includes a substrate and an active area disposed over the substrate.
Cree, Inc.


03/17/16
20160079219 

Semiconductor device


According to one embodiment, there is provided a semiconductor device including an interposer, a logic chip, a memory chip, and a package substrate. In the interposer, first via is configured to electrically connect a signal terminal of the logic chip and a signal terminal of the memory chip to each other through a substrate.
Kabushiki Kaisha Toshiba


03/17/16
20160079211 

Method for manufacturing light-emitting device


A method for manufacturing a light-emitting device of the present invention includes a step in which solid-state sealing resin (17) containing a phosphor (18) and the solid-state sealing resin (17) containing a phosphor (19) are arranged in recesses in package resin (14) having led chips placed thereon, are thereafter melted by heating, and, in addition, are cured by heating.. .
Sharp Kabushiki Kaisha


03/17/16
20160077905 

Low power debug architecture for system-on-chips (socs) and systems


In an embodiment, a debug architecture for a processor/system on chip (soc) etc., includes a central debug unit to receive one or more functional debug signals, the central debug unit further configured to receive debug information from at least one firmware source, at least one software source, and at least one hardware source, and to output compressed debug information; a system trace module to receive the compressed debug information and to time stamp the compressed debug information; a parallel trace interface to receive the time stamped compressed debug information and to parallelize the time stamped compressed debug information; and an output unit to output the parallelized time stamped compressed debug information on one of a plurality of output paths. Other embodiments are described and claimed..
Intel Corporation


03/17/16
20160077572 

System on chip (soc), and dynamic voltage frequency scaling (dvfs) verification method thereof


A dynamic voltage and frequency scaling (dvfs) verification method of a system on chip according to an exemplary embodiment of the disclosed subject matter includes extracting, by a dvfs state extraction module, a dvfs state conversion code from a code, analyzing the extracted dvfs state conversion code, and generating a dvfs state value according to a result of the analysis, generating, by a valid state extraction module, valid state values which satisfy an operation voltage condition and an operation frequency condition capable of operating the system on chip, and determining, by a stability determination module, stability of the dvfs state value according to whether or not the dvfs state value is equal to one of the valid state values.. .
Samsung Electronics Co., Ltd.


03/17/16
20160077043 

Biochip and device for measuring biochip


There is provided a biochip including: a first substrate having a first surface in which a plurality of grooves are provided to accommodate at least one type of culture medium therein, and including a first electrode which is connected to the plurality of grooves; and a second substrate having a first surface in which a plurality of biomaterial fixing parts are provided to attach at least one type of biomaterial thereto, and including a second electrode which is connected to the plurality of biomaterial fixing parts. The biochip can rapidly and precisely measure a reaction of the biomaterial..
Samsung Electro-mechanics Co., Ltd.


03/17/16
20160076726 

Surface light-emitting uv led lamp and manufacturing method thereof


The present disclosure relates to a uv led lamp, and more particularly, to a uv led lamp which converts uv led light from a point light source into surface light using the simplest structure and emits the surface light. The uv led lamp comprises: a uv led chip; a pcb board having the uv led chip mounted thereon; and a cover disposed at a distance from the uv led chip and configured to convert point uv light, emitted from the uv led chip, into surface light, the cover having an inner surface facing the uv led chip and an outer surface opposite the inner surface, wherein the inner surface and outer surface of the cover are roughened, and the amount of total reflection from the roughened inner surface is greater than the amount of total reflection from the roughened outer surface..
Seoul Viosys Co., Ltd.


03/17/16
20160076712 

Light emitting apparatus, lighting light source, and lighting apparatus


Light emitting apparatus includes: substrate; red led chip on substrate; blue led chip on substrate, blue led chip being connected in series with red led chip and having an emission color different from red led chip; and second sealing member that includes green phosphor and yellow phosphor and seals at least blue led chip, and light-emission by red led chip, blue led chip, green phosphor, and yellow phosphor produces white light.. .
Panasonic Intellectual Property Management Co., Ltd.


03/17/16
20160074864 

Fluid interface cartridge for a microfluidic chip


An interface cartridge for a microfluidic chip, with microfluidic process channels and fluidic connection holes at opposed ends of the process channels, provides ancillary fluid structure, including fluid flow channels and input and/or waste wells, which mix and/or convey reaction fluids to the fluidic connection holes and into the process channels of the microfluidic chip.. .
Canon U.s. Life Sciences, Inc.


03/10/16
20160072731 

Tunneling within a network-on-chip topology


Systems and methods relate to a network on chip (noc) which includes one or more channels configured to carry data packets in a first direction, the first direction having an upstream end and a downstream end. A tunnel is configured between an upstream element at the upstream end and a downstream element at the downstream end.
Qualcomm Technologies Inc.


03/10/16
20160072621 

Semiconductor device


A semiconductor device, in which a plurality of ic chips that perform the same cipher calculation in parallel are laminated or stacked, performs data processing including the cipher calculation. A chip that compares and verifies results of the cipher calculations performed by the plurality of chips is laminated in an intermediate layer whose element surface is covered by another chip.

03/10/16
20160072026 

Light emitting device utilizing semiconductor and manufacturing the same


An led light emitting apparatus 1 includes a base substrate 2, a blue led chip 3, a circuit pattern 4, a transmissive protection layer 5, a first fluorescent layer 6, and a second fluorescent layer 7.. .
Ns Materials Inc.


03/10/16
20160071830 

Light emitting device


A light emitting device includes a substrate having a top surface, upper and lower metal layers, multiple led chips, at least one zener diode, multiple conductive wires and an encapsulant. The top surface includes a central region bounded by an imaginary boundary with a profile conforming to an outline of a circle stacked with a polygon.
Lite-on Technology Corp.


03/10/16
20160071818 

Multichip modules and methods of fabrication


In a multi-chip module (mcm), a “super” chip (110n) is attached to multiple “plain” chips (110f′ “super” and “plain” chips can be any chips). The super chip is positioned above the wiring board (wb) but below at least some of plain chips (110f).
Invensas Corporation


03/10/16
20160071798 

Semiconductor device


A semiconductor device including a multiplicity of large current power elements with each power element divided into a multiplicity of divisional elements and arranged such that the power elements belonging to different power elements are arranged in a repetitive sequential order. The ic chip of the semiconductor device is formed to have output wires extending from the respective divisional elements connected to corresponding output pads without crossing other output wires.
Rohm Co., Ltd.


03/10/16
20160070933 

Protecting chip settings using secured scan chains


Some embodiments include a method for processing a scan chain in an integrated circuit, the method comprising receiving, in the integrated circuit, the scan chain, wherein the scan chain includes a secret key pattern; separating the secret key pattern from the scan chain; storing the scan chain in a first plurality of latches; storing the secret key pattern in a second plurality of latches; comparing the secret key pattern to a reference key pattern, the reference key pattern stored in a third plurality of latches; determining, based on the comparing the secret key pattern to the reference key pattern, that the secret key pattern does not match the reference key pattern; and generating a signal indicating that the secret key pattern does not match the reference key pattern.. .
International Business Machines Corporation


03/10/16
20160070667 

System for designing network on chip interconnect arrangements


A system for designing network-on-chip interconnect arrangements includes a network-on-chip backbone with a plurality of backbone ports and a set of functional clusters of aggregated ips providing respective sets of system-on-chip functions. The functional clusters include respective sub-networks attachable to any of the backbone ports and to any other functional cluster in the set of functional clusters independently of the source map of the network-on-chip backbone..
Stmicroelectronics S.r.l.


03/10/16
20160070506 

Device and storing data in a plurality of multi-level cell memory chips


A device for storing data in a plurality of multi-level cell memory chips. The device includes a scrambling unit to generate a plurality of candidate scrambled sequences of data by performing a plurality of scrambling operations on a sequence of data to be stored, a calculation unit to calculate a cost function for each of the plurality of candidate scrambled sequences of data, the result of each cost function being indicative of a balancing degree of subsequences of a candidate scrambled sequence, when the subsequences of the candidate scrambled sequence are written to the plurality of multi-level cell memory chips, a selection unit to select one of the candidate scrambled sequences of data based on the results of the cost functions, and a storing unit to store the selected candidate scrambled sequence of data in the multi-level cell memory chips by storing the subsequences across the multi-level memory chips..
International Business Machines Corporation


03/10/16
20160070418 

Data communication device and program


The present invention is to enable data communication between a portable terminal and a data communication device (reader terminal) using a simple method without using an ic chip for contactless communication. The data communication device includes: a memory, multiple photodetectors for detecting light in multiple regions on a touch screen of the portable terminal; a data generation unit for generating reception data based on the output of the multiple photodetectors and storing the reception data in the memory; an input device for performing touch input on the touch screen according to a control signal; and a control signal generation unit for generating the control signal for the input device..

03/10/16
20160070313 

Data storage and transfer device


A data storage/transfer device includes at least a data storage component, such as a integrated memory chip or a card reader for data storage, at least a connector on one end, e.g., a usb type a or usb type c connector, and at least one connector on the other end, preferably, a different type of connector, e.g., a micro-b usb or a lightning connector. Users may use embodiments of the present invention as a data storage device and/or data transferring cable and/or charging cable.

03/10/16
20160070068 

Top coupled photonic chip alignment package


The present invention provides an improved coupling and improved alignment of top-coupled photonic chips. The present invention includes a method to package and align top-coupling photonic chips using a holographic grating coupler and v-groove placement comprising the steps of: preparing the photonic chip with grating couplers, preparing the fibers by polishing the ends, preparing the cap chip by defining v-grooves to complement the photonic chip, attaching the fibers to the v-block cap chip, and top-cladding the cap chip to the photonic chip.
Bae Systems Information And Electronic Systems Integration Inc.


03/10/16
20160069913 

Microfluidic chip-based, universal coagulation assay


A microfluidic, chip-based assay device has been developed for measuring physical properties of an analyte (particularly, whole blood or whole blood derivatives). The technologies can be applied to measure clotting times of whole blood or blood derivatives, determine the effects of anticoagulant drugs on the kinetics of clotting/coagulation, as well as evaluate the effect of anticoagulant reversal agents.
Perosphere Inc.


03/10/16
20160069546 

Led 3d curved lead frame of illumination device


A 3d curved structure and led 3d curved lead frame for a curved surface illumination of an illumination device. First of all, draw illumination circuit with banded structure of multilayer lead frame on 3d illumination curved surface, then spread these curved circuit into plane circuit, dismantle the banded structure of multilayer lead frame of circuit into circuit pattern of single layers, use process the prototype of circuit patterns of each layer with conductive metal charge tape, and produce the prototype of banded structure of multilayer conductive frame through repeated accumulation of multi-disc charge tapes, and install the led chip on the installation seat to get led flat lead frame, then flex the conductive metal into led 3d curved lead frame with jig and paste on the luminous curved surface, and package them with transparent material..
Longwide Technology Inc.


03/10/16
20160069545 

Led 3d curved lead frame of illumination device


A 3d curved structure and led 3d curved lead frame for a curved surface illumination of an illumination device. First of all, draw illumination circuit with banded structure of multilayer lead frame on 3d illumination curved surface, then spread these curved circuit into plane circuit, dismantle the banded structure of multilayer lead frame of circuit into circuit pattern of single layers, use process the prototype of circuit patterns of each layer with conductive metal charge tape, and produce the prototype of banded structure of multilayer conductive frame through repeated accumulation of multi-disc charge tapes, and install the led chip on the installation seat to get led flat lead frame, then flex the conductive metal into led 3d curved lead frame with jig and paste on the luminous curved surface, and package them with transparent material..
Longwide Technology Inc.


03/10/16
20160069544 

Led 3d curved lead frame of illumination device


A 3d curved structure and led 3d curved lead frame for a curved surface illumination of an illumination device. First of all, draw illumination circuit with banded structure of multilayer lead frame on 3d illumination curved surface, then spread these curved circuit into plane circuit, dismantle the banded structure of multilayer lead frame of circuit into circuit pattern of single layers, use process the prototype of circuit patterns of each layer with conductive metal charge tape, and produce the prototype of banded structure of multilayer conductive frame through repeated accumulation of multi-disc charge tapes, and install the led chip on the installation seat to get led flat lead frame, then flex the conductive metal into led 3d curved lead frame with jig and paste on the luminous curved surface, and package them with transparent material..
Longwide Technology Inc.


03/10/16
20160069517 

Led lighting apparatus


An led lighting apparatus is disclosed. The led lighting apparatus includes a board having a principal surface, a plurality of led chips mounted on the principal surface of the board, and a wiring pattern which is formed on the principal surface of the board and makes electrical conduction with the plurality of led chips.
Rohm Co., Ltd.


03/10/16
20160067908 

Biochip and making the same


A biochip includes a substrate and a patterned polymer layer molded over the substrate and formed with at least one recess that is adapted to receive biological analytes to be detected using a reader. The patterned polymer layer is bonded to the substrate through molding techniques and has structural characteristics indicative of the patterned polymer layer being formed by molding techniques.
Taiwan Green Point Enterprises Co., Ltd.


03/03/16
20160065876 

Imaging device


An imaging device has a sensor chip and a signal processing chip. The sensor chip includes a pixel array in which a plurality of pixels are arranged in a 2-dimensional matrix and a data output terminal group made up of a plurality of data output terminals which output analog signals of pixels for each pixel column of the pixel array.
Nikon Corporation


03/03/16
20160065215 

Clock monitor and system on chip including the same


A system on chip includes a plurality of function blocks configured to perform predetermined functions, respectively, a clock control unit configured to generate a plurality of operating clock signals that are provided to the plurality of function blocks, respectively, a clock monitor configured to monitor frequencies of the operating clock signals to generate an interrupt signal, and a processor configured to control the frequencies of the operating clock signals based on the interrupt signal. The clock monitor includes a selector configured to select one of the operating clock signals to provide a selected clock signal, a frequency detector configured to detect a frequency of the selected clock signal to provide a detection frequency, and an interrupt generator configured to generate the interrupt signal based on the detection frequency, where the interrupt signal indicates a frequency abnormality of the operating clock signal corresponding to the selected clock signal..
Samsung Electronics Co., Ltd.


03/03/16
20160064816 

Apparatus with multi-directional radiation capability using multiple antenna elements


An apparatus for reducing interference and improving communication quality for rf communications over mm-wave frequency bands between wireless communications devices. In one embodiment, for example, the apparatus comprises a plurality of high-gain directional antenna elements each configured to maximally radiate in different directions relative to the apparatus.
Nitero Pty Ltd.


03/03/16
20160064630 

Flip chip led package


A flip chip light emitting diode (led) package includes an led die having a first substrate, a p-type region and an n-type region including an active layer in between, a metal contact on the p-type region (anode contact) and a metal contact on the n-type region (cathode contact). A package substrate or lead frame includes a dielectric material that has a first metal through via (first metal post) and second metal through via (second metal post) spaced apart from one another and embedded in the dielectric material.
Texas Instruments Incorporated


03/03/16
20160064619 

Light emitting device and optical device


The present invention provides a light emitting device which is capable of enhancing the radiant intensity on a single direction. The light emitting device comprises a substrate, a lens bonded to the substrate, and an led chip bonded to the substrate and exposed in a gap clipped between the substrate and the lens, wherein the lens has a light output surface which bulges in a direction that is defined from the substrate toward the led chip and is contained in a thickness direction of the substrate to transmit the light emitted from the led chip..
Rohm Co., Ltd.


03/03/16
20160064604 

Flip chip light emitting diode packaging structure


A flip chip light emitting diode (led) packaging structure, including a substrate, an led chip including a p electrode and a n electrode. A protruding platform is formed in a center of the substrate.
Advanced Optoelectronic Technology, Inc.


03/03/16
20160064595 

Method for manufacturing light emitting diode package


A method for manufacturing a light emitting diode (led) package, the method includes providing an led chip and forming electrodes on a top surface of the led chip; forming a first electric insulation layer on the top surface of the led chip, the first electric insulation layer adapted to enclose the electrodes therein; etching the first electric insulation layer to define a plurality of second through holes; forming a substrate on a top surface of the first electric insulation layer, the substrate adapted to fill in the plurality of second through holes, the substrate directly contacting the electrodes; dividing the substrate into a plurality of spaced heat dissipation parts; and forming a packaging layer on a bottom surface of the substrate, the packaging layer adapted to enclose the led chip therein.. .
Advanced Optoelectronic Technology, Inc.


03/03/16
20160064306 

Liquid cooled compliant heat sink and related method


A heat sink and method for using the same for use in cooling an integrated circuit (ic) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system.
International Business Machines Corporation


03/03/16
20160064298 

Embedding additive particles in encapsulant of electronic device


An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and a plurality of capsules in the encapsulant, wherein the capsules comprise a core comprising an additive and comprise a shell, in particular a crackable shell, enclosing the core.. .
Infineon Technologies Ag


03/03/16
20160064063 

Semiconductor device


A semiconductor device capable of controlling a memory while preventing the functional deterioration of the memory and reducing the power consumption of the semiconductor device is provided. The semiconductor device includes a first semiconductor chip (logic chip) and a second semiconductor chip (memory chip).
Renesas Electronics Corporation






Follow us on Twitter
twitter icon@FreshPatents

###

This listing is a sample listing of patent applications related to Chip for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Chip with additional patents listed. Browse our RSS directory or Search for other possible listings.


1.757

4686

469274 - 0 - 103