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Chip-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Semiconductor light source
Epistar Corporation
December 07, 2017 - N°20170352792

A light source may comprise a thermally conductive frame comprising a base and a faceted portion extending from the base. The faceted portion may comprise a plurality of facets spaced circumferentially thereabout. Additionally, a hollow passageway may extend through the base and axially through the faceted portion. A plurality of led chips may be arranged on the plurality of facets ...
Preparation method for high-voltage led device integrated with pattern array
Dura Chip (suzhou) Ltd.
December 07, 2017 - N°20170352699

The invention disclosed a preparation method for a high-voltage led device integrated with a pattern array, comprising the following process steps: providing a substrate, and forming a n-type gan limiting layer, an epitaxial light-emitting layer and a p-type gan limiting layer on the substrate in sequence; isolating the n-gan limiting layer, the epitaxial light-emitting layer and the p-gan limiting layer ...
Rfid tag
Fujitsu Frontech Limited
December 07, 2017 - N°20170351945

An rfid tag includes: a flexible, sheet-shaped substrate; an antenna pattern that is formed on the substrate; an ic chip that is mounted on the substrate and that is connected to the antenna pattern; an adhesive member that adheres the ic chip to the substrate; and a reinforcement member that covers the ic chip and the adhesive, and that is ...
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Chip Patent Applications
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  • 242+ full patent PDF documents of Chip-related inventions.
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System and method for reducing power delivery network complexity through local power multiplexers
Qualcomm Incorporated
December 07, 2017 - N°20170351315

A power delivery network (pdn) including a battery, a set of regulators for generating supply voltages, and an integrated circuit (ic) including power rails configured to receive the supply voltages. The ic further includes an ic chip having a set of cores. The power rails includes a larger rail configured to provide a full range of currents, and the other ...
Passive fiber optic butt coupling using a semiconductor etched feature
Cisco Technology, Inc.
December 07, 2017 - N°20170351031

Embodiments herein include an optical system that passively aligns a fiber array connector (fac) to a waveguide in a photonic chip. A substrate of the fac is machined or etched to include multiple grooves along a common axis or plane to hold optical waveguides, or more specifically, the fibers of the optical cables in the fac. To align the fibers ...
High-throughput detection method for dna synthesis product
Bgi Shenzhen
December 07, 2017 - N°20170349945

Disclosed is a high-throughput detection method for a dna synthesis product. According to the method of the present invention, a high-throughput sequencing technology is applied to detection of a dna chip synthesis product through a mixed library construction strategy, so that costs of product detection and accurate product screening are reduced.
Chip Patent Pack
Download 242+ patent application PDFs
Chip Patent Applications
Download 242+ Chip-related PDFs
For professional research & prior art discovery
inventor
  • 242+ full patent PDF documents of Chip-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Biochip storage wells
Seiko Epson Corporation
December 07, 2017 - N°20170348692

An assay assembly comprising the cap of the invention and a biochip storage is disclosed. Methods of sealing a biochip storage well using a cap of the invention are also disclosed.
Built-in self test for loopback on communication system on chip
Inphi Corporation
November 30, 2017 - N°20170346552

In an example, the present invention includes an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing ...
Light-emitting device and light-emitting apparatus comprising the same
Epistar Corporation
November 30, 2017 - N°20170345983

The present application discloses a light-emitting device comprising a light-emitting unit and a flexible carrier supporting the light-emitting unit. The light-emitting unit comprises a led chip, a first reflective layer on the led chip and an optical diffusion layer formed between the first reflective layer and the led chip.
Method of manufacturing led package thereof
Lite-on Technology Corporation
November 30, 2017 - N°20170345979

An led package structure includes a carrier mounted with a plurality of led chips, a first glue-layer, a second glue-layer and an encapsulation resin filled within the first and the second glue-layers. The first glue-layer is formed on a top surface of the carrier and has a thin-film structure which is substantially flat on a top surface thereof. The second ...
Substrate based light emitter devices, components, and related methods
Cree, Inc.
November 30, 2017 - N°20170345866

Substrate based light emitter devices, components, and related methods are disclosed. In some aspects, light emitter components can include a substrate and a plurality of light emitter devices provided over the substrate. Each device can include a surface mount device (smd) adapted to mount over an external substrate or heat sink. In some aspects, each device of the plurality of ...
Led module
Rohm Co., Ltd.
November 30, 2017 - N°20170345800

An led module includes: a substrate having a main surface and a back surface which face in opposite directions from each other in a thickness direction; a first led chip including a first electrode pad bonded to a surface facing the same direction as the main surface; a first wire having one end bonded to the first electrode pad; and ...
Electronic device with stacked electronic chips
Stmicroelectronics (grenoble 2) Sas
November 30, 2017 - N°20170345796

An electronic device includes a carrier substrate, a first electronic chip and a second chip. The first chip is mounted on the carrier substrate via interposed electrical connection elements electrically connecting a front electrical connection network of the first chip and an electrical connection network of the carrier substrate. The second chip is mounted on the first chip via interposed ...
Chip Patent Pack
Download 242+ patent application PDFs
Chip Patent Applications
Download 242+ Chip-related PDFs
For professional research & prior art discovery
inventor
  • 242+ full patent PDF documents of Chip-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Secure system on chip
Wind River Systems, Inc.
November 30, 2017 - N°20170344261

A secure soc ic is disclosed herein. In embodiments, a soc ic for computing may comprise a plurality of processor cores, wherein each processor core has at least one level of private cache and its own private memory to securely execute one or more applications. Further, the soc ic may include a plurality of isochronous memory disposed between selected pairs ...
Secondary battery cell, battery pack, and electricity consumption device
Wind River Systems, Inc.
November 30, 2017 - N°20170343611

A secondary battery cell 20 of the present invention includes an integrated circuit (an ic chip) 60 having a measuring function to measure a battery status, the battery pack has a plurality of secondary battery cells of the present invention, and the electric power consumption device includes the battery pack of the present invention having the plurality of secondary battery cells of ...
Nanochannel arrays and their preparation and use for high throughput macromolecular analysis
The Trustees Of Princeton University
November 30, 2017 - N°20170343509

Nanochannel arrays that enable high-throughput macromolecular analysis are disclosed. Also disclosed are methods of preparing nanochannel arrays and nanofluidic chips. Methods of analyzing macromolecules, such as entire strands of genomic dna, are also disclosed, as well as systems for carrying out these methods.
Multiplex bead array assay
Chipcare Corporation
November 30, 2017 - N°20170343466

The present disclosure relates to a system, method, and kit for particle detection and analysis. Devices disclosed herein may include at least an optical source, a fludic chip containing a multiplex bead array, and a detection module, wherein the sample flows within the fludic chip past a detection window, where the cells or particles are imaged by an image acquisition ...
Flexible modular hierarchical adaptively controlled electronic-system cooling and energy harvesting for ic chip packaging, printed ...
Chipcare Corporation
November 30, 2017 - N°20170343254

A system for adaptive cooling and energy harvesting comprising at least one thermoelectric device capable of acting as a thermoelectric cooler and as a thermoelectric generator, a hierarchical multiple-level control system, and electronics controlled by the control system and connected to the thermoelectric device. The electronics selectively configure the thermoelectric device in at least in a thermoelectric cooler operating mode ...
Microfluidics sensing system
Hewlett-packard Development Company, L.p.
November 30, 2017 - N°20170341076

Example implementations relate to a microfluidics sensing system. For example, a microfluidics sensing system may include a portable computing device to execute a microfluidics application, a microfluidic chip coupled to the portable computing device, the microfluidic chip including a microfluidic pumping and sensing region to perform a test on a biologic sample, and a printed circuit board (pcb) on a ...
Emotion sensing smart terminal and emotion sensing method
Shenzhen Goodix Technology Co., Ltd.
November 30, 2017 - N°20170340258

The present invention relates to the technical field of emotion sensing, and in particular, relates to an emotion sensing smart terminal and a sensing method thereof. The emotion sensing smart terminal includes: a processing chip, a measuring electrode unit and a human body physiological parameter measuring circuit, wherein the processing chip and the human body physiological parameter measuring circuit are ...
Semiconductor device and motor apparatus
Jtekt Corporation
November 23, 2017 - N°20170339789

A semiconductor device is provided that allows an ic chip and a heat sink to be prevented from being short-circuited even if facing surfaces of the ic chip and the heat sink are located closest to each other due to manufacturing variations and other variations. A controller for a motor apparatus includes a substrate on which mosfets are mounted and ...
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