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Chip patents



      
           
This page is updated frequently with new Chip-related patent applications. Subscribe to the Chip RSS feed to automatically get the update: related Chip RSS feeds. RSS updates for this page: Chip RSS RSS


Device and system for implementing advance directives


Date/App# patent app List of recent Chip-related patents
08/27/15
20150245491 
 Integrated circuit structures having off-axis in-hole capacitor patent thumbnailnew patent Integrated circuit structures having off-axis in-hole capacitor
Various embodiments include integrated circuit structures having an off-axis in-hole capacitor. In some embodiments, an integrated circuit (ic) structure includes: a substrate layer having an upper surface; an ic chip at least partially contained within the substrate layer and aligned with a minor axis perpendicular to the upper surface of the substrate layer; an aperture in the substrate layer, the aperture physically separated from the ic chip; and a capacitor in the aperture and at least partially contained within the substrate layer, the capacitor being physically isolated from the ic chip, wherein the capacitor is aligned with an axis perpendicular to the upper surface of the substrate layer and offset from the minor axis of the ic chip..
International Business Machines Corporation


08/27/15
20150243852 
 Led chip-on-board component and lighting module patent thumbnailnew patent Led chip-on-board component and lighting module
An object of the present invention is to provide a light emitting diode (led) construction. It is an object of certain embodiments of the present invention to provide an led chip-on-board (cob) construction comprising, a thermally and electrically conductive substrate, at least one semiconductor light emitting die or diode and an electrically insulating material.
Lumichip Limited


08/27/15
20150243605 
 Method for manufacturing semiconductor device patent thumbnailnew patent Method for manufacturing semiconductor device
To improve the assemblability of a semiconductor device. When a memory chip is mounted over a logic chip, a recognition range including a recognition mark formed at a back surface of the logic chip is imaged and a shape of the recognition range is recognized, alignment of a plurality of bumps of the logic chip and a plurality of projection electrodes of the above-described memory chip is performed based on a result of the recognition, and the above-described memory chip is mounted over the logic chip.
Renesas Electronics Corporation


08/27/15
20150243347 
 Semiconductor device preventing multiword state patent thumbnailnew patent Semiconductor device preventing multiword state
To prevent a multiword state in which a plurality of word lines are active in a same memory bank, the semiconductor device includes a plurality of memory chips commonly receiving an access command, in which each of the plurality of memory chips are provided with a control circuit ignoring an new access command when the bank address information in the new access command is the same as the bank address information for the specified memory bank even if the new access command received before reading/writing data from/to the specified memory bank of the selected memory chip is completed contains chip selection information selecting another memory chip.. .
Ps5 Luxco S.a.r.l.


08/27/15
20150243343 
 Method and  calibrating write timing in a memory system patent thumbnailnew patent Method and calibrating write timing in a memory system
A system that calibrates timing relationships between signals involved in performing write operations is described. This system includes a memory controller which is coupled to a set of memory chips, wherein each memory chip includes a phase detector configured to calibrate a phase relationship between a data-strobe signal and a clock signal received at the memory chip from the memory controller during a write operation.
Rambus Inc.


08/27/15
20150242812 
 Device and system for implementing advance directives patent thumbnailnew patent Device and system for implementing advance directives
The invention provides a system for effectively implementing a patient's specific wishes (advance directives) regarding medical care even in a setting where the patient is incapacitated or is unable to communicate directly with care providers. In one implementation an advance directives portable combined identification unit device or equivalent device is employed to register and access a patient's wishes concerning limitations on health care measures to be applied when the patient is unresponsive.

08/27/15
20150242554 
 Partial parameters and projection thereof included within statistical timing analysis patent thumbnailnew patent Partial parameters and projection thereof included within statistical timing analysis
Systems and methods for improving timing closure of new and existing ic chips by breaking at least one parameter of interest into two or more partial parameters. More specifically, a method is provided for that includes propagating at least one timing analysis run for a semiconductor product.
International Business Machines Corporation


08/27/15
20150242343 
 System on chip and  operating a system on chip patent thumbnailnew patent System on chip and operating a system on chip
A method of operating a system on chip is also described.. .

08/27/15
20150241476 
 Method of forming surface protrusions on an article and the article with the protrusions attached patent thumbnailnew patent Method of forming surface protrusions on an article and the article with the protrusions attached
A method of forming surface protrusions on an article, and the article with the protrusions attached. The article may be an integrated circuit (ic) chip, a test probe for the ic chip or any suitable substrate or nanostructure.
International Business Machines Corporation


08/27/15
20150241002 
 Strong light light-emitting diode (led) light source module and production process thereof patent thumbnailnew patent Strong light light-emitting diode (led) light source module and production process thereof
A production process of a strong light led light source module, including the following steps: step a: prepare an integral led chip, and on a non-electrode surface having a large size in the led chip, coat a film having a high refractive index; step b: cut the led chip coated with the film having a high refractive index into individual led chips as required; step c: fix the individual led chips on the surface of a substrate, wherein a surface coated with the film having a high refractive index is in contact with the substrate and the individual led chips are connected through welding wires; step d: coat a film having a high refractive index on five remaining surfaces of the individual led chips; step e: assemble or encapsulate a compete led light source module as required.. .
Dongguan Meisheng Electrical Products, Co., Ltd.


08/27/15
20150238967 
new patent

Methods, systems, and applications for solar-thermal microfluidic pcr


Disclosed are methods and apparatus for solar-thermal microfluidic polymerase chain reaction. A device comprises a microfluidic chip including at least one pcr region, an energy absorption layer disposed adjacent to the microfluidic chip, a solar energy concentrator adapted to produce a plurality of temperature profiles on the microfluidic chip adapted to facilitate pcr, and a photomask disposed between the solar energy concentrator and the microfluidic chip..
Cornell University


08/27/15
20150238960 
new patent

Microfluidic nucleic acid analysis


Nucleic acid from cells and viruses sampled from a variety of environments may purified and expressed utilizing microfluidic techniques. In accordance with one embodiment of the present invention, individual or small groups of cells or viruses may be isolated in microfluidic chambers by dilution, sorting, and/or segmentation.
California Institute Of Technology


08/27/15
20150238918 
new patent

Automated radiopharmaceutical production and quality control system


An automated radiopharmaceutical production and quality control system includes a particle accelerator, a radiopharmaceutical micro-synthesis subsystem, and quality control subsystem. The micro-accelerator of the improved biomarker generator is optimized for producing radioisotopes useful in synthesizing radiopharmaceuticals in quantities on the order of multiple unit doses, allowing for significant reductions in size, power requirements, and weight when compared to conventional radiopharmaceutical cyclotrons.
Abt Molecular Imaging, Inc.


08/20/15
20150237712 

Radio frequency module


A radio frequency module includes a plurality of insulating base material layers made of a thermoplastic resin defining a multilayer circuit board and including a cavity inside thereof, an ic chip disposed in the cavity and including a noise generation source, and planar ground conductive bodies provided in the multilayer circuit board. The planar ground conductive bodies are disposed on a layer not exposed to the inner surface of the cavity, and include inter-layer connection conductive bodies protruding in the direction of the noise generation source from the planar ground conductive bodies..
Murata Manufacturing Co., Ltd.


08/20/15
20150237438 

Headphone driver for attenuating pop and click noises and system on chip having the same


A headphone driver includes a pre-main amplifier and a main amplifier. The pre-main amplifier receives an input signal from first and second node and outputs the input signal to a third node.
Samsung Electronics Co., Ltd.


08/20/15
20150236963 

Qos in a system with end-to-end flow control and qos aware buffer allocation


The present disclosure is directed to quality of service (qos) and handshake protocols to facilitate endpoint bandwidth allocation among one or more agents in a network on chip (noc) for an endpoint agent. The qos policy and handshake protocols may involve the use of credits for buffer allocation which are sent to agents in the noc to compel the acceptance of data and the allocation of an appropriate buffer.
Netspeed Systems


08/20/15
20150236870 

Asynchronous interface in a system on chip and a operating the same


A mobile system includes a first interface configured to transmit a payload in synchronization with a first clock signal through a first channel at a first transfer rate; and a second interface that includes: a payload storage connected to the first channel and configured to receive the payload from the first channel; and a payload receiver connected to the payload storage and configured to receive the payload from the payload storage in synchronization with a second clock at a second transfer rate through a second channel. A length of the second channel is shorter than a length of the first channel, and the first clock signal is asynchronous with the second clock signal..

08/20/15
20150236218 

Led module


An led module includes: an led chip; and a resin case having a reflective surface surrounding the led chip. An area contact inhibitor to inhibit area contact with an adjacent led module is formed on an outer surface of the resin case..
Rohm Co., Ltd.


08/20/15
20150236210 

Light emitting diode chip having electrode pad


Disclosed herein in an led chip including electrode pads. The led chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer, a first electrode pad located on the second conductive type semiconductor layer opposite to the second conductive type semiconductor layer, a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer, a second electrode pad electrically connected to the second conductive type semiconductor layer, and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer.
Seoul Viosys Co., Ltd.


08/20/15
20150236002 

Multi-chip module with stacked face-down connected dies


A microelectronic assembly can include a substrate having first and second surfaces, at least two logic chips overlying the first surface, and a memory chip having a front surface with contacts thereon, the front surface of the memory chip confronting a rear surface of each logic chip. The substrate can have conductive structure thereon and terminals exposed at the second surface for connection with a component.
Tessera, Inc.


08/20/15
20150235997 

Light emitting diode package and manufacturing the same


A light emitting diode package including a package body with a cavity, a plurality of light emitting diode (led) chips in the cavity, a plurality of wires connected to the plurality of led chips, and a plurality of lead frames in the package body, wherein the lead frames comprise a first lead frame electrically connected to a first electrode of a first led chip, a second lead frame electrically connected to a second electrode of the first led chip and a second electrode of a second led chip, a third lead frame electrically connected to a first electrode of the second led chip, and fourth lead frame electrically connected to a second electrode of a third led chip. Further, ends of the lead frames are exposed outside of the package body and penetrate the package body, and the first electrodes are p electrodes and the second electrodes are n electrodes..
Lg Innotek Co., Ltd.


08/20/15
20150235996 

Led module


An led module includes a substrate, one or more led chips supported by a main surface of the substrate, and wirings. The substrate has one or more through holes penetrating from the main surface to a rear surface.
Rohm Co., Ltd.


08/20/15
20150235976 

Electrical connection for chip scale packaging


A system and method for providing a post-passivation and underbump metallization is provided. An embodiment comprises a post-passivation layer that is larger than an overlying underbump metallization.
Taiwan Semiconductor Manufacturing Company, Ltd.


08/20/15
20150235970 

Chip with shelf life


A method of forming a semiconductor structure includes forming a recess within a silicon substrate of an ic chip near a circuit of the ic chip. A metal layer is formed in the recess and the ic chip is exposed to an oxygen-containing environment to initiate the oxidation of a portion of the silicon substrate below the metal layer and adjacent to the circuit.
International Business Machines Corporation


08/20/15
20150235715 

Stacked semiconductor memory apparatus and test circuit therefor


A stacked semiconductor memory apparatus includes a memory module including a plurality of memory chips; and a logic circuit block with the memory module stacked thereon, configured to be electrically coupled with an interface substrate through a first terminal group and a second terminal group and to communicate with a controller, and to include a test circuit that receives a first test signal through the first terminal group from the controller and outputs the first test signal through the second terminal group in a test mode.. .
Sk Hynix Inc.


08/20/15
20150235714 

Semiconductor device for parallel bit test and test method thereof


A semiconductor device includes a plurality of memory chips and a plurality of signal selection units respectively corresponding to the plurality of memory chips, and suitable for commonly transferring test data signals from an external to a corresponding one of the plurality of memory chips during a common test mode, wherein one or more of the plurality of signal selection units may transfer the test data signals from the external to corresponding ones of the plurality of memory chips during an individual test mode, and wherein the semiconductor device may be set to the common test mode when a common test signal is enabled, and set to the individual test mode when both the common test signal and a test control signal are enabled.. .
Sk Hynix Inc.


08/20/15
20150235063 

Object identification device with rfid tag of small size


A device for the identification of at least one object includes at least one contactless rfid tag arranged in proximity to the object, the object being present on an object support or a rack, each tag containing an electronic chip and a magnetic antenna connected to the chip. The device also includes an electric antenna is present in the object support and is arranged in the latter in such a way as to establish electromagnetic coupling between the electric antenna and the magnetic antenna of the tag.
Tagsys


08/20/15
20150235053 

System on chip, operating the same, and devices including the system on chip


A method of operating a system on chip (soc) includes converting plain data into cipher data by using an encryption key and transmitting the cipher data directly to a memory controller which controls an operation of a non-volatile memory. The encryption key may be output by a one-time programmable (otp) memory..

08/20/15
20150234752 

Memory chip


According to one embodiment, a memory chip, which is connected to a controller that controls reading and writing of data in response to a request from an external device, includes: a memory including a special area that is a predetermined data storage area; a key storage unit that stores therein a second key that corresponds to a first key used by the external device to convert the data; a converting unit that receives, from the controller, data to be written into the special area and generates converted data by converting the data to be written using the second key; and a writing unit that writes the converted data into the special area.. .
Kabushiki Kaisha Toshiba


08/20/15
20150234737 

Test system of system on chip and test method thereof


A test system method for testing software of each of a plurality of system on chips (socs) are provided. The test system includes: a plurality of test units configured to test the plurality of socs according to a plurality of test cases, respectively; a power supplier configured to supply, to each of the plurality of test units, power of a level corresponding to a corresponding test case, among the plurality of test cases; a temperature controller configured to provide, to each of the plurality of test units, a temperature control signal according to the corresponding test case, and to monitor a measurement temperature, provided from each of the plurality of test units, of each of the plurality of socs; and an analyzer configured to analyze at least one of a driving voltage, a driving current, and a driving frequency of each of the plurality of socs..
Samsung Electronics Co., Ltd.


08/20/15
20150234705 

Semiconductor memory device


A crc code is generated from an original data, a bch code is generated with respect to the original data and the crc code, and the original data, the crc code, and the bch code are recorded in pages selected from different planes of a plurality of memory chips. An rs code is generated from the original data across pages, a crc code is generated with respect to the rs code, a bch code is generated with respect to the rs code and the crc code, and the rs code, the crc code, the bch code are recorded in a memory chip different from a memory chip including the original data.
Kabushiki Kaisha Toshiba


08/20/15
20150233907 

Microfluidic chip for multi-analyte detection


A microfluidic chip and compatible bio-sensor are provided to detect and/or quantify an analyte in a sample fluid, and preferably to simultaneously quantify multiple analyte(s) in a sample fluid volume. A fluid volume containing microbeads is flowed through an elongate planar sample chamber of the microfluidic chip.
Nanospeed Diagnostics Inc.


08/20/15
20150233903 

Solid phase glycan and glycopeptide analysis and microfluidic chip for glycomic extraction, analysis and methods for using same


Highly specific and novel solid phase methods for analyzing glycans and proteoglycans using a solid phase system are provided. The present invention also provides an integrated apparatus and methods of use which comprises a high-throughput glycan isolation and reverse-phase liquid chromatography (rplc) for on-chip glycan extraction, modification and separation.
The Johns Hopkins University


08/20/15
20150233894 

Self-powered blood coagulation chip for inr value and hematocrit determination


A point-of-test diagnostic chip that is capable of simultaneous evaluation of blood coagulation time (inr value) and hematocrit level. A finger prick volume of blood is placed at the inlet of the device, and the residual vacuum contained within the device provides a pressure gradient to drive the flow of whole blood.
The Regents Of The University Of California


08/20/15
20150233837 

Method and device for the quantitative libs measurement of bio-molecular targets on a biochip


A process, for the quantitative analysis by optical emission spectroscopy of a plasma induced by a laser beam of at least one target included in a biochip, involves the use of an adjuvant allowing the formation of a dry matrix capable of being ablated simultaneously with the at least one target, the dry matrix being configured to improve the analytical properties of plasma, the adjuvant having an emission spectrum whose lines have wavelengths distinct from the wavelengths of the spectral lines used for the quantitative analysis of said at least one target.. .
Commissariat A L'energie Atomique Et Aux Energies Alternatives


08/20/15
20150233813 

Optical detector for a particle sorting system


An optical system for acquiring fast spectra from spatially channel arrays includes a light source for producing a light beam that passes through the microfluidic chip or the channel to be monitored, one or more lenses or optical fibers for capturing the light from the light source after interaction with the particles or chemicals in the microfluidic channels, and one or more detectors. The detectors, which may include light amplifying elements, detect each light signal and transducer the light signal into an electronic signal.
Cytonome/st, Llc


08/20/15
20150233571 

Flow controlled effective led based lighting system


A lighting system has a heat sink for removing the heat released by led chips by means of natural convection and thermal radiation. A center opening formed between air and heat sink fins enables the transfer of heat generated by leds, electronic driver circuit and phosphor on said heat sink fins to the flowing air inside and removing from the system, and increases the contact surface of heat sink fins with the air that enables to transfer the heat effectively from heat sink fins to flowing air and also with effective radiative heat transfer.
Ozyegin Universitesi


08/20/15
20150233564 

Preferred optothermal led lighting embodiment for high lumen extraction and extended lifetime


A lighting system has a dielectric cooling fluid which directly contacts with an led chip; contacts with the heat sink base by moving towards the heat sink base, i.e. Upwards, with the decreasing density as a result of the increased temperature due to the high temperature formed in the led chip; at the same time the temperature thereof decreasing upon contacting with the heat sink base; moves towards the led chip, and reduces the temperature of the led chip by contacting the led chip upon said movement; and movement channels through which the cooling fluid in gaseous or liquid phase passes during the movement of said cooling fluid..
Ozyegin Univertitesi


08/20/15
20150233559 

Integrated illumination part and lead frame of umbrella


The manufacturing method of the integrated illumination part used in the present invention is to install annular lead frame with luminous led chip on main part body of the umbrella, then package into one unity with transparent material such as plastic or silica gel, for example, slip ring, installation seat, handle and other parts can be used to produce the part. The purpose of the present aims at innovating the structure of annular lead frame made of sheet metal whereby to increase the mass production of integrated illumination part and diversity of light source, and fully to utilize high heat dissipation capacity of umbrella parts.
Longwide Technology Inc.


08/20/15
20150233545 

Light source with a pleasant light


Light source with a pleasant light, similar to natural light, for leds, such as led arrays, singlechip or multichip leds, oleds and remote phosphor leds, having an emission spectrum (10) defined by a curve that is a function of the wavelength (x) and light intensity (i) and provided with three emission peaks (r, g, b) disposed in correspondence to the wavelengths (x) that are at least relative respectively to the colors red, green and blue.. .
Martini Spa


08/20/15
20150231660 

Atomizing sprayer


An atomizing sprayer includes a vapor tube, a front washer, an ultrasonic chip, a porous plate holder, a porous plate, a rear washer, and a chip holder. The chip holder has an opening hole at its center.
Quatek Holding Inc.


08/20/15
20150231633 

Gel-based bio chip for electrochemical synthesis and electrical detection of polymers


An embodiment of the invention relates to a biochip comprising at least two measurement electrodes, a synthesis electrode, a ground electrode, a gap between the at least two measurement electrodes, a porous dielectric isolation layer and a gel comprising a probe in the gap, wherein the porous dielectric isolation layer is between the synthesis electrode and the gel. Yet other embodiments relate to the method of manufacturing the biochip and using the biochip for electrical detection of bio-species..
Intel Corporation


08/13/15
20150229969 

Method and encoding and decoding image


An image encoding apparatus based on a system on chip (soc) which encodes a residual block of a current block including a first value calculator configured to calculate a first value for the residual block in a space domain, a comparator configured to decide whether to transform the residual block into a transform domain according to a size of the first value, and a transform unit configured to transform the residual block into the transform domain according to a decision on whether to transform.. .

08/13/15
20150228876 

Multi-segment monolithic led chip


Described herein are led chips comprising pluralities of active regions on the same submount. These active regions are individually addressable, such that beam output from the leds can be controlled simply by selectively activating the desired active region in the plurality without resorting to incorporation of advanced optics and reflectors comprising complex moving parts.
Cree, Inc.


08/13/15
20150228677 

Semiconductor device and manufacturing the same


As a display device has a higher definition, the number of pixels, gate lines, and signal lines are increased. When the number of the gate lines and the signal lines are increased, a problem of higher manufacturing cost, because it is difficult to mount an ic chip including a driver circuit for driving of the gate and signal lines by bonding or the like.
Semiconductor Energy Laboratory Co., Ltd.


08/13/15
20150228629 

Dimmable light-emitted diode (led) packaging structure


A dimmable light-emitted diode (led) packaging structure is described. The dimmable led packaging structure employs a plurality of first fluorescent layers respectively positioned on some of a plurality of first types of led chips to solve the problems of color temperature and light mixing uniformity.
Edison Opto Crporation


08/13/15
20150228505 

Moulding producing an electronic housing


The invention concerns a method for producing a smart card or telecommunication module electronic housing, comprising an electronic chip in the housing, a face comprising at least one set of conductive metal platings, said method comprising the following steps: providing or producing at least one set of metal platings comprising conductive circuit pads or tracks, on one side of a substrate, transferring and connecting a chip to each set of platings, overmoulding each chip with the set of metal platings of same on the substrate with a moulding material in order to produce at least one housing, separating the housing from the substrate thereof, wherein the side of the substrate in contact with the metal platings comprises an adhesive or has low adhesiveness and in that the overmoulding is carried out at the final dimensions of the housing. The invention also concerns a moulding apparatus and the housing obtained..
Gemalto Sa


08/13/15
20150228227 

Backlight control method, backlight control device and display apparatus


The present invention provides a backlight control method, a backlight control device and a display apparatus. The backlight control method comprises steps of: acquiring a backlight information and writing the backlight information into a backlight register of system on chip; obtaining a backlight adjusting data based on the backlight information in the backlight register; sending the backlight adjusting data to a backlight control register of a field-programmable gate array, so that the backlight control register obtains a corresponding backlight control register value based on the backlight adjusting data; and adjusting backlight according to the backlight control register value.
Beijing Boe Vision-electronic Technology Co., Ltd.


08/13/15
20150228171 

Smoke alarm according to the scattered light principle having a two-color light-emitting diode with different sizes of led chips


An optical smoke alarm contains a detector unit that works according to the scattered light principle with a light-emitting diode to irradiate particles to be detected and a photo sensor which is spectrally sensitive thereto to detect the light scattered by the particles. The light-emitting diode contains a first led chip being a surface-emitting radiator for emitting a first light bundle with light in a first wavelength range of from 350 nm to 500 nm.
Siemens Schweiz Ag


08/13/15
20150226995 

Display device and producing same


In a display device (s), in which an ic chip (30), which has an output and an input bump group (31g, 33g), is mounted onto a display panel (10) via an acf (34), and a total area of end surfaces (31s) of output bumps (31) that form the output bump group (31g) is larger than a total area of end surfaces (33s) of input bumps (33) that form the input bump group (33g), a concentration of conductive particles (37) in a portion (35a) of the acf (34) corresponding to the output bump group (31g) is lower than a concentration of conductive particles (37) in a portion (35b) of the acf (34) corresponding to the input bump group (33g).. .
Sharp Kabushiki Kaisha


08/13/15
20150226418 

Led light emitting device


A led light emitting device includes a heat dissipating substrate, a heat reflective layer disposed on the heat dissipating substrate, a circuit unit disposed on the heat dissipating substrate and spaced apart from the heat reflective layer, and a led chip unit insulatively disposed on the heat reflective layer and electrically connected to the circuit unit.. .
Dst Technology Co., Ltd.


08/13/15
20150226400 

Light-emitting device, illuminating apparatus, and display apparatus


The invention provides a light-emitting device for use in a backlight unit of a display apparatus including a display panel, which is capable of applying light to an illumination object with uniformity in brightness in the planar direction of the illumination object and can be made lower in profile, as well as an illuminating apparatus and a display apparatus including the light-emitting device. A backlight unit (1) is provided with a printed circuit board (12), a plurality of light-emitting portions (111) disposed on the printed circuit board (12) and having a base support (111b), an led chip (111a) and a lens (112), and a reflective member (118) disposed around each light-emitting portion (111) and having a first reflecting member (1131) and a second reflecting member (1132)..
Sharp Kabushiki Kaisha


08/13/15
20150225874 

Method for growing zirconium nitride crystal


According to the present invention, if a zirconium nitride lattice is grown by a method for growing zirconium nitride using a metal-organic vapor phase epitaxy method, the lattice binding efficiency of zrn and gan can enable a low cost preparation of an led having high performance and it is very advantageous to grow a green led by a direct band gap in the presence of zr3n4. In addition, inzr3n4 can be substituted for in when growing a mqw in an led, and thus it is very advantageous to prepare green and red leds.
Sm Technology


08/06/15
20150221778 

Semiconductor device and manufacturing the same


As a display device has a higher definition, the number of pixels, gate lines, and signal lines are increased. When the number of the gate lines and the signal lines are increased, there occurs a problem that it is difficult to mount an ic chip including a driver circuit for driving the gate and signal lines by bonding or the like, whereby manufacturing cost is increased.
Semiconductor Energy Laboratory Co., Ltd.


08/06/15
20150221614 

High-bandwidth dram using interposer and stacking


Embodiments of the present disclosure provide a packaging arrangement that comprises an interposer and a system on chip (soc) die disposed on the interposer. The packaging arrangement also comprises a plurality of memory dies stacked on one another to provide a stack of memory dies.

08/06/15
20150221569 

Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate


Electronic module (100), which comprises a first substrate (102), a first dielectric layer (104) on the first substrate (102), at least one electronic chip (106), which is mounted with a first main surface (108) directly or indirectly on partial region of the first dielectric layer (104), a second substrate (110) over a second main surface (114) of the at least one electronic chip (106), and an electrical contacting (116) for the electric contact of the at least one electronic chip (106) through the first dielectric layer (104), wherein the first adhesion layer (104) on the first substrate (102) extends over an area, which exceeds the first main surface (108).. .
Infineon Technologies Ag


08/06/15
20150220470 

Method, apparatus and system for a source-synchronous circuit-switched network on a chip (noc)


In an embodiment, a router includes multiple input ports and output ports, where the router is of a source-synchronous hybrid network on chip (noc) to enable communication between routers of the noc based on transitions in control flow signals communicated between the routers. Other embodiments are described and claimed..

08/06/15
20150219328 

Led lighting fixture


A led lighting fixture includes a control circuit board, a plurality of lighting modules and a light reflective shield. Each one of the lighting modules includes a transparent substrate disposed of a plurality of led chips; each one of the transparent substrates is electrically connected to the control circuit board, and the led chips are electrically connected to the control circuit board via the transparent substrate.
Lediammond Opto Corporation


08/06/15
20150219288 

Light-emitting diode package and manufacturing the same


A light-emitting diode (led) package and a method of manufacturing the same are provided. The led package includes a package mold, an led chip located on a surface of the package mold, and a wavelength converter located on the surface of the package mold and separated from the led chip.
Samsung Display Co., Ltd.


08/06/15
20150217290 

Microfluidic chip and application thereof


Provided is a microfluidic chip, which comprises a substrate and a cover sheet, wherein a microreactor array is arranged on the substrate and comprises at least one main channel (401) and at least two micro cells (402) connected to the main channel (401). The microfluidic chip also comprises at least one local temperature control device, which is used for heating the main channel (401) or cooling the micro cells (402).
Tsinghua University


07/30/15
20150216020 

Led lamp


An led lamp includes led chips, a translucent cover housing the led chips, a motion sensor unit, a condensing lens, and a power unit. The motion sensor unit includes a light receiving element for light of a predetermined wavelength.
Rohm Co., Ltd.


07/30/15
20150214442 

Light emitting diode package structure and method thereof


A light emitting diode (led) package structure is provided. The led package structure comprises a substrate, at least one led chip, an encapsulating compound and a curing material.
Lextar Electronics Corporation


07/30/15
20150214441 

Light emitting diode package and illuminating device


A led package including a transparent substrate, at least one led chip, a first sealing layer and a second sealing layer is provided. The transparent substrate has a first surface and a second surface opposite the first surface.
Chunghwa Picture Tubes, Ltd.


07/30/15
20150214438 

Led module and manufacturing the same


An led module and method for manufacturing the same are disclosed. The led module of the present invention comprises a substrate, at least one led chip, and a buffer layer.
Wisetop Technology Co., Ltd.


07/30/15
20150214209 

Method of manufacturing semiconductor device


To improve the reliability in applying a tape to the rear surface of a substrate while securing the heat resistance of the tape applied to the rear surface of the substrate. There is a gap between a bottom surface of a ditch provided in a support member and an upper surface of a driver ic chip.
Renesas Electronics Corporation


07/30/15
20150214197 

Light-emitting device


A light-emitting device includes: a plurality of led chips each having a light-emitting region, and a first electrode and a second electrode that are electrically connected to light-emitting region; a plurality of substrates each being provided on each of the plurality of led chips; a plurality of through-holes each penetrating through each of the plurality of substrates; and, a plurality of wires each passing through a first through-hole penetrated through a first substrate of the plurality of the substrates and a second through-hole penetrated through a second substrate adjacent to the first substrate. The one of the plurality of the wires is electrically connected the first electrode or the second electrode of a first led chip corresponding to the first substrate, to the first electrode or the second electrode of a second led chip corresponding to the second substrate..
Panasonic Intellectual Property Management Co., Ltd.


07/30/15
20150214040 

Thin epitaxial silicon carbide wafer fabrication


Techniques for fabricating thin epitaxial sic device wafers are described. A bulk sic wafer is used to provide a seed layer of a thin layer of sic for epitaxially growing sic.
Rutgers, The State University Of New Jersey


07/30/15
20150213841 

Memory chip and memory storage device


A memory chip is disclosed. The memory comprises a substrate and a plurality of memory pads.
Eorex Corporation


07/30/15
20150213182 

Common template for electronic article


One or more techniques or systems for incorporating a common template into a system on chip (soc) design are provided herein. For example, a common template mask set is generated based on a first set of polygon positions from a first vendor and a second set of polygon positions from a second vendor.
Taiwan Semiconductor Manufacturing Company Limited


07/30/15
20150212795 

Interfacing with a buffer manager via queues


Embodiments include a system on chip (soc) comprising: a cache; a buffer manager configured to manage a plurality of buffer locations; and a processing core configured to issue a buffer allocation request to the buffer manager to request the buffer manager to allocate one or more buffer locations to the processing core, the buffer manager being further configured to, in response to receiving the buffer allocation request, allocate a first buffer location to the processing core by writing a first buffer pointer associated with the first buffer location to the cache, and the processing core being further configured to obtain the allocation of the first buffer location by reading the first buffer pointer from the cache.. .
Marvell Israel (m.i.s.l) Ltd.


07/30/15
20150212263 

Led decorative lighting


A led decorative lighting is provided. A lamp holder has a case.

07/30/15
20150212154 

Methods and debugging lowest power states in system-on-chips


Methods and apparatus for debugging finite state machine are disclosed. The method includes implementing a debug logic circuit and connecting the debug logic circuit to a system on chip (soc) voltage source.
Nvidia Corporation


07/30/15
20150211690 

Light source device


A light source device including a light emitting diode (led) chip and a molding lens is provided. The molding lens is directly formed on the led chip and includes a center of a bottom where the led chip located at and a light exiting surface formed corresponding to the center.
Formosa Epitaxy Incorporation


07/30/15
20150209782 

Apparatus and system for measuring asphaltene content of crude oil


A system for measuring asphaltene content of crude oil, includes a microfluidic chip, the microfluidic chip having a crude oil sample inlet port, a solvent port, a mixer and reactor section in fluid communication with the crude oil sample inlet port and the solvent port, and a filter in fluid communication with the mixer and reactor section, the filter having an inlet side and an outlet side, a waste port in fluid communication with the inlet side of the filter, and a product port in fluid communication with the outlet side of the filter. The system further includes an optical cell in fluid communication with the product port..
Schlumberger Technology Corporation


07/30/15
20150209781 

Apparatus and system for measuring asphaltene content of crude oil


A system for measuring asphaltene content of crude oil, includes a microfluidic chip, the microfluidic chip having a crude oil sample inlet port, a solvent port, a mixer and reactor section in fluid communication with the crude oil sample inlet port and the solvent port, and a filter in fluid communication with the mixer and reactor section, the filter having an inlet side and an outlet side, a waste port in fluid communication with the inlet side of the filter, and a product port in fluid communication with the outlet side of the filter. The system further includes an optical cell in fluid communication with the product port..
Schlumberger Technology Corporation


07/30/15
20150209687 

Microfluidic chip for steam distillation


A microfluidic chip for steam distillation includes a chip body and a condenser. The chip body includes a steam inlet and a steam outlet.
National Pingtung University Of Science & Technology


07/23/15
20150208510 

Thin low profile strip dual in-line memory module


A low profile strip dual in-line memory module (200) includes a passive interposer support structure (90) with patterned openings (91-97) formed between opposing top and bottom surfaces, a plurality of memory chips (d1-d8) attached to the top and bottom surfaces, and vertical solder ball conductors (98) extending through the patterned openings to electrically connect the plurality of memory chips, where each memory chip has an attachment surface facing the passive interposer structure and a patterned array of horizontal conductors (e.g., 82-86) formed on the attachment surface with contact pads electrically connected to the plurality of vertical conductors to define at least one bus conductor that is electrically connected to each memory die in the first and second plurality of memory die.. .
Freescale Semiconductor, Inc.


07/23/15
20150208124 

Smart television system and turn-on and turn-off method thereof


A smart television, and a turn-off method and a turn-on method for the smart television system are provided. The smart television system includes a remote controller and a smart television.
Mstar Semiconductor, Inc.




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