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Chip patents



      

This page is updated frequently with new Chip-related patent applications.




Date/App# patent app List of recent Chip-related patents
07/21/16
20160212853 
 Led package for lamp of vehicle patent thumbnailLed package for lamp of vehicle
Disclosed is a light emitting diode (led) package for a lamp of a vehicle. The led package includes a printed circuit board (pcb) which includes a metal layer, an insulating layer formed on the metal layer, and an electric wiring layer formed on the insulating layer; an led circuit unit which includes an led chip mounted on the electric wiring layer; and a connector which is mounted on the electric wiring layer to be connected with the led chip.
Hyundai Mobis Co., Ltd


07/21/16
20160212549 
 Mems microphone device patent thumbnailMems microphone device
A micro-electro-mechanical system (mems) microphone device is provided in the present disclosure. The mems microphone device includes a first electromagnetic shielding cover defining a first accommodating space; a second electromagnetic shielding cover received in the first accommodating space and defining a second accommodating space; a mems chip and an application specific integrated circuit (asic) chip received in the second accommodating space.
Aac Acoustic Technologies (shenzhen) Co.,ltd.


07/21/16
20160211420 
 High efficiency leds and methods of manufacturing patent thumbnailHigh efficiency leds and methods of manufacturing
Simplified led chip architectures or chip builds are disclosed that can result in simpler manufacturing processes using fewer steps. The led structure can have fewer layers than conventional led chips with the layers arranged in different ways for efficient fabrication and operation.
Cree, Inc.


07/21/16
20160211230 
 Chip comprising a phase change material based protecting device and a  manufacturing the same patent thumbnailChip comprising a phase change material based protecting device and a manufacturing the same
An electronic chip including an integrated circuit arranged a face of a substrate, and a protection device arranged partially facing the integrated circuit is provided. The protection device includes a capacitor having a first electrode and a second electrode between which a layer of phase change material is disposed changing locally from a first resistive state to a second resistive state different from the first state by penetration of a beam.
Commissariat A L'energie Atomique Et Aux Energies Alternatives


07/21/16
20160211189 
 Chip carrier laminate with high frequency dielectric and thermomechanical buffer patent thumbnailChip carrier laminate with high frequency dielectric and thermomechanical buffer
A chip carrier for carrying an encapsulated electronic chip, wherein the chip carrier comprises a laminate structure formed as a stack of a plurality of electrically insulating structures and a plurality of electrically conductive structures, and a chip coupling area at an exposed surface of the laminate structure being configured for electrically and mechanically coupling the encapsulated electronic chip, wherein one of the electrically insulating structures is configured as high frequency dielectric made of a material being compatible with low-loss transmission of a high-frequency signal, and wherein at least one of another one of the electrically insulating structures and one of the electrically conductive structures is configured as a thermomechanical buffer for buffering thermally induced mechanical load.. .
Infineon Technologies Ag


07/21/16
20160211079 
 Miniature wire-bondable capacitor patent thumbnailMiniature wire-bondable capacitor
A multi-layer ceramic capacitor (mlcc) device includes a ceramic chip having electrically conductive layers embedded within the chip that form one or more capacitors connected by one or more vias to one or more upwardly facing wire-bondable pads on the top side of the device. One embodiment includes electrically conductive layers that form at least two stacked capacitors connected by vias to multiple upwardly facing wire-bondable pads on the top side, whereby the mlcc device has a reduced footprint while avoiding solder fillets.
Eulex Corp.


07/14/16
20160204578 
 Ring-modulated laser patent thumbnailRing-modulated laser
An optical source is described. This optical source includes a semiconductor optical amplifier, with a semiconductor other than silicon, which provides a gain medium.
Oracle International Corporation


07/14/16
20160204314 
 Light emitting diode package patent thumbnailLight emitting diode package
A light emitting diode (led) package includes: a package substrate having a first electrode structure and a second electrode structure; an led chip disposed above a first surface of the package substrate and having a first electrode attached to the first electrode structure and a second electrode attached to the second electrode structure; a reflective layer disposed above the first surface of the package substrate to be separated from the led chip, having a thickness less than a thickness of the led chip, and configured to reflect light emitted from the led chip to a given direction, wherein the wavelength converter has an upper surface substantially parallel to the first surface of the package substrate and a side surface inclined towards the upper surface of the wavelength converter.. .
Samsung Electronics Co., Ltd.


07/14/16
20160204090 
 Led packaging structure patent thumbnailLed packaging structure
A light emitting diode (led) packaging structure including a metal pad, an electric static discharge (esd) protection element and an led chip is provided. The metal pad has a first pad portion having a first top surface with a first concave configured thereon and a second pad portion having a second top surface with a second concave configured thereon.
Everlight Electronics Co., Ltd.


07/14/16
20160203913 
 Multi-layered ceramic electronic device,  making same patent thumbnailMulti-layered ceramic electronic device, making same
A multi-layered ceramic electronic device is made by attaching respective inner bonding surfaces of two lead frames to two opposite electrode junctions of a multi-layered ceramic chip in such a manner that a predetermined buffer space is defined between respective bottom bonding portions of the lead frames and the bottom side of the multi-layered ceramic chip, and then applying a conductive polymer adhesive to bond the inner bonding surfaces of the lead frames to the electrode junctions of the multi-layered ceramic chip at a predetermined low bonding temperature and to electrically conduct the leaf frames to the electrode junctions of the multi-layered ceramic chip.. .
Holy Stone Enterprise Co., Ltd


07/14/16
20160203396 

Antenna module


An antenna module includes a base including two opposing mounting surfaces, an antenna coil provided on or in the base so as to define an opening, the antenna coil having a shape that is symmetrical or substantially symmetrical with respect to a reference plane, and an ic chip and a plurality of electronic components mounted on one of the mounting surfaces and electrically coupled to the antenna coil, the ic chip and the electronic components being arranged inside the opening when viewed in plan from a normal direction of the mounting surface. At least two of the plurality of electronic components are arranged so as to be symmetrical or substantially symmetrical to each other with respect to the reference plane when viewed in plan from the normal direction..
Murata Manufacturing Co., Ltd.


07/14/16
20160203099 

System on chip for packetizing multiple bytes and data processing system including the same


A system on chip includes a display serial interface (dsi) which includes a phy protocol interface (ppi) used for communication between a dsi host controller and a d-phy. The dsi host controller includes a register configured to store first indicator data indicating a ppi packetizing method and a lane distributor configured to determine a size of a symbol to be transmitted to the ppi and an order of first processing units to be included in the symbol based on the first indicator data..
Samsung Electronics Co., Ltd.


07/14/16
20160202315 

System on chip capable of being debugged in abnormal operating state and debugging system on chip


A system on chip capable of being debugged in an abnormal operation state and a debugging method for system on chip are provided. A switch unit is connected to a function module through a first path and is connected to a test connection interface of a processor through a second path.
Ali Corporation


07/14/16
20160202248 

Immunolipoplex nanoparticle biochip containing molecular probes for capture and characterization of extracellular vesicles


The present invention disclosed a method of fabricating an antibody immunolipoplex nanoparticle (ab-iln) biochip and antibody tethered lipoplex nanoparticle (ab-tln) biochip. The aforementioned antibody-based lipoplex nanoparticle biochip or the related array contains molecular probes and is applied for detecting the presence of a disease or condition in a subject obtaining a body fluid sample by capturing and identifying both membrane protein and intra-vesicular dna/rna/proteins of extracellular vesicles (evs)..
Nanomaterial Innovation Ltd.


07/14/16
20160200777 

Methionyl trna synthetase for biosynthesis of photomethionine-labeled protein and preparing photoactive protein g variant using same


Provided is a methionyl trna synthase (mrs) for the biosynthesis of a photomethionine-labeled protein and a method for preparing a photoactivatable protein g variant using same and, more particularly, to an mrs variant in which alanine at the position of 12th is substituted with glycine, leucine at the position of 13th by serine, tyrosine at the position of 260th by phenylalanine, isoleucine at the position of 297th by valine, and histidine at the position of 301st by leucine from the n-terminal of the amino acid sequence of a wild-type escherichia coli methionyl trna synthase. The mrs variant effectively confirms the biosynthesis of a photomethionine (pm)-labeled target protein and thus can be utilized for the biosynthesis of a pm-labeled target protein.
Korea Research Institute Of Bioscience And Biotechnology


07/14/16
20160199225 

Micro-droplet delivery device and methods


Micro-droplet delivery devices and methods are described where the device may comprise a piezoelectric actuator having a piezoelectric chip that is operatively coupled to a drug package under a preloading force. The actuator is configured to generate an acoustic pressure within the drug package to dispense droplets of an agent from an aperture, e.g., to the corneal surface of the eye.

07/07/16
20160198095 

Image sensor modules, methods of manufacturing the same, and image processing systems including the image sensor modules


An image sensor module is provided. The image sensor module includes a printed circuit board (pcb), an image sensor chip disposed on a first plane of the pcb and electrically connected to the pcb, and an image signal processing chip disposed on the first plane of the pcb and electrically connected to the pcb.

07/07/16
20160197960 

Ic chip, information processing apparatus, system, method, and program


An ic chip, an information processing apparatus, system, method, and program are provided. An ic chip includes an authentication control unit configured to authenticate a request using authentication information.
Felica Networks, Inc.


07/07/16
20160197225 

Device of monolithically integrated optoelectrics


A method is disclosed for fabricating optoelectronic component structures and traditional circuit elements on a single silicon substrate. Specific examples of optoelectronic components include, but are not limited to: photodiode structures, light emitter structures and waveguide structures.

07/07/16
20160197166 

Semiconductor device and manufacturing the same


As a display device has a higher definition, the number of pixels, gate lines, and signal lines are increased. When the number of the gate lines and the signal lines are increased, a problem of higher manufacturing cost, because it is difficult to mount an ic chip including a driver circuit for driving of the gate and signal lines by bonding or the like.
Semiconductor Energy Laboratory Co., Ltd.


07/07/16
20160196989 

Baseplate for an electronic module and manufacturing the same


Various embodiments provide methods for manufacturing a baseplate for an electronic module and an electronic module comprising a baseplate, wherein the baseplate comprises a conductive material; and a recess formed in one main surface of the baseplate and being adapted to accommodate an electronic chip.. .
Infineon Technologies Ag


07/07/16
20160196486 

Non-contact ic label


A non-contact ic label of the present invention includes an ic chip disposed on a magnetic sheet, a first antenna section and a second antenna section each connected to the ic chip, a circuit section which connects a first end portion of the first antenna section and a first end portion of the second antenna section to the ic chip, a first auxiliary antenna section which is disposed to project from a side on the second end portion of the first antenna section and a second auxiliary antenna section which is disposed to project from a side on the second end portion of the second antenna section, wherein the first antenna section and the second antenna section are formed in the same rectangular shape in a plan view.. .
Toppan Printing Co., Ltd.


07/07/16
20160196227 

System on chip (soc), mobile electronic device including the same, and operating the soc


A system on chip (soc) is present that includes a plurality of master interfaces, a plurality of slave interfaces, and an interface circuit which is connected between the plurality of master interfaces and the plurality of slave interfaces and includes a plurality of components. When a first master interface among the plurality of master interfaces and a first slave interface among the plurality of slave interfaces are paired, a first group of the components which forms a first signal path between the first master interface and the first slave interface among the plurality of components is enabled according to a control of the first master interface..

07/07/16
20160194213 

Nanometer-size-particle production apparatus, nanometer-size-particle production process, nanometer-size particles, zinc/zinc oxide nanometer-size particles, and magnesium hydroxide nanometer-size particles


The present invention is a nanometer-size-particle production apparatus for synthesizing nanometer-size particles in a liquid by means of plasma in liquid, and comprises: a container for accommodating the liquid therein; an electromagnetic-wave generation device for generating a high-frequency wave, or a microwave; an electrode conductor whose leading end makes contact with the liquid to supply the high-frequency wave or the microwave to the liquid; a covering portion being disposed into the liquid so as to cover a leading-end upside of the electrode conductor; a metallic chip being composed of a metal making a raw material of nanometer-size particles, and having a leading end that is disposed to face to a leading-end section of the electrode conductor; and a feed device for feeding out the leading end of the metallic chip with respect to the leading-end section of the electrode conductor; the leading end of the electrode conductor having a configuration that is a non-edge configuration; and the electrode conductor, except for the leading end, having an axially-orthogonal cross-sectional area that is larger than an axially-orthogonal cross-sectional area of the metallic chip.. .

07/07/16
20160193608 

Biochip support member, manufacturing biochip support member, biochip package, screening device, and screening method


A biochip support member is provided that comprises a base material, and a columnar member different member from the base material having a support area that can support a biochip formed of a biomolecule provided at one end, and is attached to the base material through an attaching part at the other end.. .
Nikon Corporation


07/07/16
20160192839 

Bio-chips and nano-biochips


A biochip device, or a system of biochips, providing diagnostic testing, sensing and therapeutic functionality useful in diagnosis and treatment of a variety of physiological maladies.. .
International Business Machines Corporation


07/07/16
20160192601 

Plant cultivation device


A plant cultivation device includes a case (100), a temperature control module (200), and a circulation fan (310). A cultivation room (110) is formed in the case (100).
Cal-comp Biotech Co., Ltd.


07/07/16
20160192588 

Operating assembly for harvesting


An operating assemblage to harvest agricultural crops at a peak of ripeness comprising a mobility component configured to navigate through an agricultural field; at least one vacuum motor calibrated to generate necessary and sufficient suction to successfully harvest a harvestable ripe unit of a crop such as a fruit, berry, nut, or vegetable using a collection hose ending in a collection nozzle of a size appropriate to the crop; the collection nozzle housing an array of sensors; and a collection and storage receptacle for harvested produce. The assemblage is configured by an operator inputting parameters to calibrate the array of sensors to trigger the vacuum motor to apply sufficient suction to harvest agricultural produce at a specified degree of ripeness.

06/30/16
20160191769 

Electronic device and image building module thereof


An image building module includes an image builder, a signal-shielding flexible film, and a signal shielding cover. The image builder includes a first image capturing element and a processing chip.

06/30/16
20160191151 

Integrated driver redundancy for a silicon photonics device


In an example, the present invention includes an integrated system on chip device. At least a pair of laser devices are associated with a channel and coupled to a switch to select one of the pair of laser devices to be coupled to an optical multiplexer to provide for a redundant laser device..

06/30/16
20160190673 

Ic-package interconnect for millimeter wave systems


Consistent with an example embodiment, a system on chip (soc) device operates in millimeter wave frequencies. The soc device comprises, a silicon device having at least one differential pair pad, the at least one differential pair pad having a shunt inductor coupled thereon.

06/30/16
20160190198 

Image sensor


An image sensor includes a pixel array chip, a logic chip, and an interposed layer. The interposed layer is disposed on the pixel array chip.

06/30/16
20160190117 

Slim bezel and display having the same


A bezel of a display includes source lines with a same length, gate in panel (gip) lines, and at least two customized integrated circuit (ic) chips arranged along a straight line in a lateral direction. Each of the customized ic chips is coupled to at least one of the source lines or the gip lines.

06/30/16
20160190109 

Stack semiconductor package


A stack semiconductor package includes a first semiconductor package having a first package substrate and a first semiconductor chip mounted on the first package substrate. The first semiconductor chip includes first chip pads arranged along a side portion thereof.

06/30/16
20160188910 

Automated manufacturing system with adapter security mechanism and manufacture thereof


A method of operation of an automated assembly system includes: detecting a socket adapter having an adapter identifier and an adapter cryptographic chip; calculating a primary key hash based on a primary key in a programming cryptographic chip; calculating an adapter hash based on the adapter identifier using the adapter cryptographic chip; matching the primary key hash to the adapter hash to update an authentication token with the adapter identifier for authenticating the socket adapter on the device programming system; and programming programmable devices in the socket adapter based on the authentication token.. .

06/30/16
20160188503 

Virtual legacy wire


In an example, a system on chip (soc) includes virtual legacy wire (vlw) functionality. The vlw signal virtualizes a physical interrupt existing in legacy systems to enable a peripheral to cause a processor to enter an interrupt handling routine relevant to the peripheral.

06/30/16
20160188216 

Hard disk and management method


A hard disk includes a manager, a managed component, a management interface a network interface, and a system on chip (soc). The management interface receives an external management command.

06/30/16
20160187904 

Low power ideal diode control circuit


A circuit that operates as a low-power ideal diode is disclosed, as well as an ic chip that contains the ideal diode circuit. The circuit includes a first p-channel transistor connected to receive an input voltage on a first terminal and to provide an output voltage on a second terminal, a first amplifier connected to receive the input voltage and the output voltage and to provide a first signal that dynamically biases a gate of the first p-channel transistor as a function of the voltage across the first p-channel transistor, and a second amplifier connected to receive the input voltage and the output voltage and to provide a second signal that acts to turn off the gate of the first p-channel transistor responsive to the input voltage being less than the output voltage..

06/30/16
20160187581 

Coupling optical signals into silicon optoelectronic chips


A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a silicon photonic chip through a light path in a region where silicon is removed from said silicon photonic chip, wherein photonic devices may be integrated in layers on a front surface of the silicon photonic chip. Optical couplers, such as grating couplers, may receive the optical signals in the front surface.

06/30/16
20160187344 

Method of measuring cancer related substances by raman spectroscopy


A method for measuring cancer related substances including cancer cell-derived free dna by raman spectroscopy, involving steps for preparing a biochip having a meso-crystal region of silver oxides containing a silver peroxide, adding a blood serum or a biological sample solution dropwise onto the meso-crystal region of said biochip, selectively trapping the cancer-related substances having a positive charge in the sample, irradiating the trapped cancer-related substance with an exciting laser light and detecting a surface enhanced raman scattering therefrom, wherein cancer diseases are evaluated on the basis of the intensity of the surface enhance raman scattering (sers). In the carbon-specific d band and g band in the raman scattering spectrum, a characteristic peak spectrum of the cancer-related substance can be detected in the proximity of the methyl group characteristic of 2900 cm−1..

06/30/16
20160186978 

Lamp with led chips cooled by a phase transformation loop


An apparatus includes an led light source positioned within an envelope, a porous fluid transporting material coating the envelope, providing a path between the led light source and the envelope, and a cooling medium conducted through the fluid transporting material toward the led light source in a liquid phase and conducted from the led light source to the envelope in a vapor phase for removing heat from the led light source.. .

06/30/16
20160186952 

Motor vehicle headlamp having a two-chamber reflection system


A motor vehicle headlamp having a first reflection module, including a first reflector, a first group of led chips and a second group of led chips, having a second reflection module, which comprises a second reflector, a third group of led chips and a fourth group of led chips, and having a control circuit, which is configured to control the current flow through the light emitting diodes, and which is configured to activate the led chips of the first group together with the led chips of the fourth group, wherein the led chips of the second group and the led chips of the third group are deactivated. The control circuit activates the led chips of the second group together with the led chips of the third group, wherein the led chips of the first group and the led chips of the fourth group are deactivated..

06/30/16
20160186236 

Real time quantitative and qualitative analysis biosubstance


A method of quantitatively and qualitatively analyzing a biomaterial in real-time, the method comprising preparing a device for detecting a biomaterial, feeding a complex of first and second probes, a forward primer, a reverse primer, a sample comprising deoxynucleotide triphosphate, a polymerase having exonuclease activity, and a sample comprising target genes, and a reaction solution comprising a buffer into the reaction container, performing polymerase chain reaction comprising denaturation of the target genes in the sample, hybridization of the target genes, the complex, and the forward and reverse primers in the sample, and elongation of the primers through the polymerase having exonuclease activity, allowing for elongation of the second probe on the third probe by the polymerase after hybridizing the released second probe and the third probe fixed to the biochip, detecting a first fluorescence signal by the first phosphor and a second fluorescence signal by the second phosphor.. .

06/23/16
20160183377 

Dielectric filmless electronic module and manufacturing same


The invention relates to an electronic module comprising a first metal layer including at least one contact pad or a conductive pad for connection or interconnection, an insulating layer that is electrically connected to the metal layer via a first surface, a second metal layer connected to the insulating layer on the opposite surface thereof, a chip location or an electronic chip electrically connected to the at least one contact pad through openings in the insulating layer, characterized in that the insulating layer is an adhesive.. .

06/23/16
20160181490 

Light emitting diode packaging structure


A packaging structure of a vertical led chip includes at least a support system, a glue cup that connects to periphery of the support system, a led chip with light absorption substrate over the support system and packaging glue distributed in periphery of the led chip. The light absorption substrate has a side forming a bubble structure at an interface with the packaging glue.

06/23/16
20160181322 

System on chip (soc) based on phase transition and/or phase change material


System on chips (socs) of a microprocessor electrically connected with electronic memory devices and/or optically connected with a optical memory device are disclosed along with various embodiments of building block of the microprocessor and the electronic memory devices, wherein the microprocessor can comprise digital unit and/or neural networks based unit.. .

06/23/16
20160181214 

Stacked memory chip having reduced input-output load, memory module and memory system including the same


A stacked memory chip includes a chip input-output pad unit, a first semiconductor die and a second semiconductor die. The chip input-output pad unit includes a chip command-address pad unit, a lower chip data pad unit and an upper chip data pad unit that are to be connected to an external device.

06/23/16
20160181173 

Integrated circuit barrierless microfluidic channel


A structure and method for fabricating a continuous cooling channel in the back end of line wiring levels of an integrated circuit (ic) chip is provided. This continuous cooling channel may provide a path for a cooling source such as a fluid pumped from an external fluidic-cooling circulation driver to make physical contact locally with and cool the back end levels within the ic chip that may generate heat as a byproduct of the ic device's routine operations.

06/23/16
20160181166 

Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness


Disclosed is a method of manufacturing integrated circuit (ic) chips. In the method, wafers are received and the backside roughness levels of these wafers are determined.

06/23/16
20160181153 

Integrated circuit barrierless microfluidic channel


A structure and method for fabricating a continuous cooling channel in the back end of line wiring levels of an integrated circuit (ic) chip is provided. This continuous cooling channel may provide a path for a cooling source such as a fluid pumped from an external fluidic-cooling circulation driver to make physical contact locally with and cool the back end levels within the ic chip that may generate heat as a byproduct of the ic device's routine operations.

06/23/16
20160180117 

Electronic data security apparatus


An apparatus for providing security for an integrated circuit (ic) chip is disclosed. The apparatus may include the ic chip, attached to a surface of a printed circuit board (pcb).

06/23/16
20160180001 

System on chip configuration metadata


A topology metadata file is identified that describes a topology of a system on chip (soc) to be created, where the topology includes a plurality of computing blocks to be interconnected by a fabric. A corresponding computing block metadata file is identified for each of the plurality of computing blocks, where each of the computing block metadata files is to describe attributes of the corresponding computing block.

06/23/16
20160179697 

Memory system and operating method thereof


A memory system includes a plurality of memory chips each including memory regions and page buffers; an address table suitable for storing mapping information for mapping physical addresses and logical addresses; a target table suitable for storing sequential physical addresses and sequential logical addresses; a selective output block suitable for selecting the memory regions as pages under selection by units of a page according to a preset order, based on the sequential physical addresses, and outputting data stored in page buffers of memory chips under selection corresponding to the pages under selection; and an expected read block suitable for reading data stored in selection-expected pages, which is to be selected following the pages under selection according to the preset order, to store in page buffers of selection-expected memory chips corresponding to the selection-expected pages, while the data stored in the page buffers under selection are outputted.. .

06/23/16
20160179431 

Individual identification device, storage device, individual identification system, individual identification, and program product


An individual identification device (1) according to embodiments may identify a storage device (100) including one or more memory chips (40). The device comprises a first storage (40), a region allocator (15), and a hardware fingerprint generator (12).

06/23/16
20160179161 

Decode information library


For each of a plurality of ports to be defined for an interconnect fabric, a respective computing block is identified to be connected to the port. One or more entries in a library of decode information is identified for each of the identified computing blocks.

06/23/16
20160178186 

Led unit


An led unit (100) includes a base unit (1). The led unit further includes a light emitting device (3) including: a package substrate (3b); and a light emitting portion (3a) provided in the package substrate and having led chips, the light emitting device being placed on a front surface of the base unit.

06/23/16
20160178174 

Lighting device


A lighting device includes a substrate and a planar light source portion including a plurality of led chips arrayed on the substrate. The planar light source portion faces an illumination space (space to be illuminated) by a predetermined opening area.

06/23/16
20160178133 

Led lead frame array for general illumination


An led lead frame assembly includes a circuit strip assembly, a plastic dam member overmoulded onto the circuit strip assembly and a led chip assembly disposed in a pocket of the plastic dam member. The led chip assembly is electrically coupled to the circuit strip assembly to power the led chip assembly..

06/23/16
20160177387 

Novel electrochemical dna biosensor using graphene biochip for species identification


This study describes about a new electrochemical biosensor using dna-redox electrostatic interaction and their subsequent non-specific adsorption on graphene screen-printed electrode or biochip. The ruthenium hexamine molecule [ru(nh3)6]3+, or ruhex, was observed to form complexes with free dna in solution that adsorbed onto graphene surfaces, enabling the development of a rapid, high-sensitivity dna biosensor.

06/16/16
20160172563 

Led module


A lead 1 includes a die-bonding portion 11 with an opening 11a penetrating in a thickness direction. Another lead 2 is spaced from the lead 1.
Rohm Co., Ltd.


06/16/16
20160172340 

Light-emitting diode display screen


A light emitting diode (led) display screen includes: an led display screen substrate (200), an output end of the driving circuit includes: a first positive electrode (202) and a first negative electrode (204) and the first positive electrode (202) and the first negative electrode (204) are located on a first surface of the led display screen substrate (200); an led chip (210), located on the first surface, and the second surface is opposite to the first surface; a first jointing part (222) and a second jointing part (204). The led display screen solves the technical problem in the related art that the minimum dot pitch of an led display screen is excessively large due to a limited size of a support in a conventional encapsulated lamp bead..
Leyard Optoelectronic Co., Ltd.


06/16/16
20160172259 

Customized module lid


A method of forming a custom module lid. The method may include placing a multichip module (mcm) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components..
International Business Machines Corporation


06/16/16
20160172058 

System and handling memory repair data


In a system on chip (soc) device, continuity of a memory repair signature chain, which is accessible by all enabled memory systems, is provided, even when certain memory systems are gated (off) for certain soc configurations. A mechanism for converting between compressed and uncompressed memory repair data within the repair chain is provided so that memory systems that support either uncompressed memory repair data (such as ternary content addressable memories) or compressed memory repair data can be incorporated in the soc..

06/16/16
20160171176 

Medication management health and health related facilities


A system and method for control of prescription drug packaging and dispensing machines located in an in-patient health care facility including centralized control and enhanced communication between system components. Delay and errors in processing item data in the prescription dispensing system are reduced by using concise id data incorporated into each canister memory chip and storing canister contents data elsewhere.
Cerx Pharmacy Partners, Lp


06/16/16
20160170656 

Implementing enhanced performance flash memory devices


A method and apparatus for implementing enhanced performance in a flash memory system in a computer system. A flash memory chip includes a function engine performing garbage collection and scrub operations using an internal bus for data movement, preserving i/o bandwidth.
International Business Machines Corporation


06/16/16
20160170646 

Implementing enhanced performance flash memory devices


A method and apparatus for implementing enhanced performance in a flash memory system in a computer system. A flash memory chip includes a function engine performing garbage collection and scrub operations using an internal bus for data movement, preserving i/o bandwidth.
International Business Machines Corporation


06/16/16
20160170158 

Hybrid integration of edge-coupled chips


A technique for fabricating a hybrid optical source is described. During this fabrication technique, a iii-v compound-semiconductor active gain medium is integrated with a silicon-on-insulator (soi) chip (or wafer) using edge coupling to form a co-planar hybrid optical source.
Oracle International Corporation


06/09/16
20160165358 

Mems microphone package


An mems microphone package includes a substrate, an mems microphone, an ic chip and an electrically conductive cover. The substrate includes a first hole, an upper surface, a bottom surface, a side surface, a first electrically conductive layer and a second electrically conductive layer.
Industrial Technology Research Institute


06/09/16
20160165020 

Pair of integrated wireless earphone for a mobile communication device


A pair of integrated wireless earphone for a mobile communication device. Particularly, the application provides a pair of integrated wireless earphone for a mobile communication device, comprising a pair of collapsible silicon ear channel stopper/holder; a system on chip (soc); a speaker driver; a mic; and a charging contact..
Plastoform Industries Limited


06/09/16
20160164948 

Communication device, information processing device, program, and reader/writer providing system


A communication device includes an ic (integrated circuit) chip storing information in a predetermined area and functioning as a reader/writer that reads out or writes information stored in another ic chip. Also, the communication device downloads an agent from an information processing device connected to the network.
Felica Networks, Inc.


06/09/16
20160164725 

Wireless system package and communication wireless system package and communication device


A wireless system package includes a substrate, an external non-volatile memory, a first integrated circuit, and a second integrated circuit. The first integrated circuit includes a system on chip unit, a bus, a first clock unit, a first terminal, a second terminal, and a third terminal.
Cyntec Co., Ltd.


06/09/16
20160164417 

Dc-dc converter module


A dc-dc converter module includes a module substrate on which switching transistors and a controller ic chip are mounted, stud terminals mounted on a surface of the module substrate, and an inductor attached to the stud terminals such that the inductor faces the module substrate. In a plan view, the switching transistors are arranged within an area where the inductor overlaps the module substrate, whereas at least a portion of the controller ic chip is arranged outside the area..
Panasonic Intellectual Property Management Co., Ltd.


06/09/16
20160163650 

Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies


Die (110) and/or undiced wafers and/or multichip modules (mcms) are attached on top of an interposer (120) or some other structure (e.g. Another integrated circuit) and are covered by an encapsulant (160).
Invensas Corporation


06/09/16
20160163609 

Methods and testing auxiliary components in a multichip package


Ways for testing a multichip package while reducing the required test pin count are provided. The multichip package may include a main die coupled to multiple daughter components.
Altera Corporation


06/09/16
20160162415 

Systems and methods for providing improved latency in a non-uniform memory architecture


Systems, methods, and computer programs are disclosed for allocating memory in a portable computing device having a non-uniform memory architecture. One embodiment of a method comprises: receiving from a process executing on a first system on chip (soc) a request for a virtual memory page, the first soc electrically coupled to a second soc via an interchip interface, the first soc electrically coupled to a first local volatile memory device via a first high-performance bus and the second soc electrically coupled to a second local volatile memory device via a second high-performance bus; determining whether a number of available physical pages on the first and second local volatile memory devices exceeds a minimum threshold for initiating replication of memory data between the first and second local volatile memory devices; and if the minimum threshold is exceeded, allocating a first physical address on the first local volatile memory device and a second physical address on the second local volatile memory device to a single virtual page address..
Qualcomm Incorporated


06/09/16
20160162399 

Systems and methods for providing improved latency in a non-uniform memory architecture


Systems, methods, and computer programs are disclosed for allocating memory in a portable computing device having a non-uniform memory architecture. One embodiment of a method comprises: receiving from a process executing on a first system on chip (soc) a request for a virtual memory page, the first soc electrically coupled to a second soc via an interchip interface, the first soc electrically coupled to a first local volatile memory device via a first high-performance bus and the second soc electrically coupled to a second local volatile memory device via a second high-performance bus; determining a free physical page pair comprising a same physical address available on the first and second local volatile memory devices; and mapping the free physical page pair to a single virtual page address..
Qualcomm Incorporated


06/09/16
20160161968 

Semiconductor apparatus including multichip package


A semiconductor apparatus including a multichip package is disclosed. The semiconductor apparatus includes a slave chip having a slave region and a master region.
Sk Hynix Inc.


06/09/16
20160161862 

Mqw devices & methods for semiconductor patterning systems


Mqw devices, ic chips and methods may be used in semiconductor lithography patterning systems. An mqw device includes an array of pixels that have transmission elements and associated support circuits.
Samsung Electronics Co., Ltd.


06/09/16
20160161064 

Solid state light sheet having wide support substrate and narrow strips enclosing led dies in series


A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare led chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode.
Quarkstar Llc


06/09/16
20160158751 

Microfluidic chip for analysis of cell motility and methods for using same


The present invention describes an integrated apparatus that enables identification of migratory cells directly from a specimen. The apparatus only requires a small number of cells to perform an assay and includes novel topographic features which can reliably differentiate between migratory and non-migratory cell populations in a sample.
University Of Maryland, Baltimore


06/02/16
20160157359 

Customized module lid


A method of forming a custom module lid. The method may include placing a multichip module (mcm) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components..
International Business Machines Corporation


06/02/16
20160156999 

Methods and systems for board level photonic bridges


As photonics evolves closer and closer to the electronic processing elements in order to meet the demands of speed, latency of evolving data communications networks and data centres the inventors, rather than seeking direct monolithically integrated cmos based processing photonic and electronic elements, have established a different route. Namely replace the computer hubs/electrical bridges interconnecting the multiple core logic chipset elements with a photonic bridge.

06/02/16
20160156632 

System on chip and method therefor


A system on chip comprises a responder unit comprising a set of responder elements and an access control unit 484 associated with an authorization list and the responder unit. An entry of the authorization list defines a set of access requirements in relation to an address space identifying at least part of the responder unit.
Freescale Semiconductor, Inc.


06/02/16
20160156572 

Integrated noc for performing data communication and noc functions


The present disclosure is directed to a noc interconnect that consolidates one or more network on chip functions into one network on chip. The present disclosure is further directed to a network on chip (noc) interconnect comprising a plurality of first agents, wherein each agent can be configured to communicate with other ones of the plurality of first agents.
Netspeed Systems


06/02/16
20160155918 

Semiconductor light emitting device


A semiconductor light emitting device includes an led chip, which includes an n-type semiconductor layer, active layer, and p-type semiconductor layer stacked on a substrate. The led chip further includes an anode electrode connected to the p-type semiconductor, and a cathode connected to the n-type semiconductor.

06/02/16
20160155901 

Highly reflective flip chip led die


An led die (40) includes an n-type layer (18), a p-type layer (22), and an active layer (20) epitaxially grown over a first surface of a transparent growth substrate (46). Light is emitted through a second surface of the substrate opposite the first surface and is wavelength converted by a phosphor layer (30).
Koninklijke Philips N.v.


06/02/16
20160155039 

Electronic chip card


A semiconductor component (19) that is designed to evaluate the signals from the biometric sensor (18) and to store biometric data, wherein the semiconductor component (19) is electrically conductively connected to one or more interconnects (2) of the system carrier (1). It is the object of the invention to provide an electronic chip card having a biometric sensor (18), which electronic chip card allows a relatively large number of electronic components to be accommodated on the system carrier (1) of the chip card.

06/02/16
20160154449 

System on chips for controlling power using workloads, methods of operating the same, and computing devices including the same


A system on chip may include: a master device configured to execute a dynamic voltage and frequency scaling (dvfs) program; a slave device configured to communicate with the master device; and/or a performance monitoring unit configured to receive first events generated while instructions are being processed by the master device, configured to generate a first count value by counting a number of second events corresponding to a total number of the instructions related with the first events and configured to generated a second count value counting a number of third events related with first instructions that can be processed by interaction between the master device and the slave device among the first events. The dvfs program may be configured to generate a control signal for controlling dvfs of at least one of the master device and the slave device based on the first count value and the second count value..

06/02/16
20160153905 

Scattered-light smoke detector with a two-color light-emitting diode


A scattered-light smoke detector includes a detector unit that operates according to the scattered-light principle. The detector unit includes a light-emitting diode (led) to irradiate particles to be detected and a spectrally sensitive photosensor to detect the light scattered by the particles.
Siemens Schweiz Ag


06/02/16
20160153622 

Led lamp


The present invention discloses an led lamp, which includes an led light source module including at least one group of led light source components, and further includes three drive circuits and a control circuit. The led light source components include a first, a second, and a third led light source.
Shenzhen University


06/02/16
20160152050 

Sheet processing apparatus and image forming system


A sheet processing apparatus includes a trimming section, a container, a detector and a control section. The trimming section performs trimming to trim a sheet or sheet set.
Konica Minolta, Inc.


05/26/16
20160150229 

Codec, system on chip (soc) including the same, and data processing system including the soc


A codec according to an exemplary embodiment includes a codec processor which receives a current frame, determines a type of a received current frame, and sets rate control parameters of the current frame, and a bit-rate estimator which allocates total target bits to a first group of picture (gop) including the current frame, and allocates a target bit to each of frames included in the first gop based on a determined type of the current frame and set rate control parameters.. .
Samsung Electronics Co., Ltd.


05/26/16
20160150185 

Switch system for video conference


A switch system for video conference includes a video signal processing chip, an internal video interface, an external video interface, and a switch unit. The video signal processing chip includes a second gpio pin and a third gipo pin.
Hon Hai Precision Industry Co., Ltd.


05/26/16
20160148910 

Semiconductor device having plural memory chip


A semiconductor device includes a stacked plurality of memory chips. The memory chips each include a plurality of memory banks, a plurality of read/write buses that are assigned to the respective memory banks, and a plurality of penetration electrodes that are assigned to the respective read/write buses and arranged through the memory chip.
Ps4 Luxco S.a.r.l.


05/26/16
20160148877 

Qfn package with improved contact pins


According to an embodiment of the present disclosure, a method for manufacturing an integrated circuit (ic) device may include mounting an ic chip onto a center support structure of a leadframe, bonding the ic chip to at least some of the plurality of pins, encapsulating the leadframe and bonded ic chip, sawing a step cut into the encapsulated leadframe, plating the exposed portion of the plurality of pins, and cutting the ic package free from the bar. The leadframe may include a plurality of pins extending from the center support structure and a bar connecting the plurality of pins remote from the center support structure.
Microchip Technology Incorporated


05/26/16
20160148876 

Flat no-leads package with improved contact pins


According to an embodiment of the present disclosure, a leadframe for an integrated circuit (ic) device may comprise a center support structure for mounting an ic chip, a plurality of pins extending from the center support structure, and a bar connecting the plurality of pins remote from the center support structure. Each pin of the plurality of pins may include a dimple..
Microchip Technology Incorporated


05/26/16
20160148768 

Control circuit of diode contact protection combination switch and relay control method


A diode contact protection combination switch and a specific implementation method. The combination switch comprises a primary contact protection circuit formed by a primary switch contact of a primary relay, diodes parallel connected at two ends of the primary switch contact, and a contact of a secondary relay.
Gyrk International Technology Co., Ltd.


05/26/16
20160148656 

Address-remapped memory chip, memory module and memory system including the same


A memory chip includes a chip input-output pad unit, a plurality of semiconductor dies. The chip input-output pad unit includes a plurality of input-output pins connected to an external device and the plurality of semiconductor dies are connected commonly to the chip input-output pad unit and having a full memory capacity respectively.
Samsung Electronics Co., Ltd.


05/26/16
20160148084 

Package with radio ic tag and manufacturing package with radio ic tag


A package with a radio ic tag includes a package unit including a metal sheet and a resin sheet, the metal sheet having a predetermined slot pattern formed therein; and an ic chip unit including an ic chip and an electrode member, the electrode member supplying electric power to the ic chip. An end of the slot pattern is disposed in a corner field of the package unit..

05/26/16
20160148023 

Card reader having discriminator contact


A card reader for a point-of-sale system that is configured to accept both magnetic strip-type and integrated circuit (ic) chip-type payment cards. The card reader is a component of a point-of-sale system including a portable computing device in communication with the card reader that is configured to present a first graphical user interface (gui) when a magnetic stripe-type card is detected and a second gui when an ic chip-type card is detected in the card reader.
Square, Inc.






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