|| List of recent Chip-related patents
|Automating integrated circuit device library generation in model based metrology|
Various embodiments include computer-implemented methods, computer program products and systems for generating an integrated circuit (ic) library for use in a scatterometry analysis. In some cases, approaches include: obtaining chip design data about at least one ic chip; obtaining user input data about the at least one ic chip; and running an ic library defining program using the chip design data in its original format and the user input data in its original format, the running of the ic library defining program including: determining a process variation for the at least one ic chip based upon the chip design data and the user input data; converting the process variation into shape variation data; and providing the shape variation data in a text format to a scatterometry modeling program for use in the scatterometry analysis..
|Functionally integrated device for multiplex genetic identification|
A biochip for multiplex genetic identification is disclosed. An biochip for separating and detecting a plurality of dna fragments includes a set of inputs and chambers for receiving a sample matrix of genetic material and reagents needed to conduct a polymerase chain reaction amplification of the genetic material.
|Managing a switch fabric|
In a method for managing a switch fabric comprising a plurality of fabric chips, each of said plurality of fabric chips comprising a plurality of port interfaces, a first configuration set and a second configuration set, each comprising a plurality of configuration registers for the port interfaces to use in calculating a port resolution for an incoming packet, are generated. In addition, a determination as to which of the first configuration set and the second configuration set the plurality of fabric chips are to use is made an instruction is communicated to each of the fabric chips to use the determined one of the first configuration set and the second configuration set..
|Wavelength conversion chip for a light emitting diode, and method for manufacturing same|
There is provided a method of manufacturing a wavelength converted led chip, including attaching a plurality of led chips to a chip alignment region of an upper surface of a temporary support plate, forming a conductive bump on the electrode of the respective led chips, forming a phosphor-containing resin encapsulation part in the chip alignment region to cover the conductive bump, polishing the phosphor containing resin encapsulation part, forming the wavelength converted led chips by cutting the provided phosphor containing resin encapsulation part between the led chips, the wavelength converted led chip including a wavelength conversion layer obtained from the phosphor containing resin encapsulation part and formed on lateral surfaces and an upper surface of the wavelength converted led chip, and removing the temporary support plate from the wavelength converted led chip.. .
|Package structure and method for manufacturing thereof|
The invention provides an electronic device package and method for manufacturing thereof. The electronic device package includes a substrate, an electronic chip, a bonding pad, a first passivation layer, a conductive layer, a second passivation layer, and a solder ball.
|Shields for magnetic memory chip packages|
Chip packages are described with soft-magnetic shields that are included inside or attached externally to the package containing a mram chip. In one group of embodiments a single shield with vias for bonding wires is affixed to the surface of the mram chip having the contact pads.
|Light emitting device|
The light emitting device (10a) includes an led chip (12) and a ceramic support body (14) where the led chip (12) is placed. The ceramic support body (14) includes a placement surface (14d) where the led chip (12) is placed, internal terminals (22a, 22b) disposed on the placement surface (14d), a back surface (14c) that face the placement surface (14d), a mounting surface (14b) between the placement surface (14d) and the back surface (14c), and external terminals (28a, 28b) disposed on the mounting surface (14b).
|Led device having improved luminous efficacy|
There are provided a light emitting diode (led) device including an led chip emitting light within a specific wavelength region, a transparent resin layer covering a light emission surface of the led chip, and a color conversion layer formed to be spaced apart from the led chip by the transparent resin layer to cover the transparent resin layer and including at least one type of phosphor converting light emitted from the led chip into light within a different wavelength region, wherein a mean free path of phosphor particles included in the color conversion layer is 0.8 mm or more at a temperature of 5500 k.. .
|Light emitting diode device and method for manufacturing heat dissipation substrate|
The light emitting diode (led) device includes a substrate formed with at least one electrode; an led chip disposed on the substrate, and formed with at least one solder pad; at least one wire electrically connected between the solder pad and the electrode; and a fluorescent material layer covering the led chip. Thermal conductivity of the substrate is 80˜120 w/mk and a color rendering index of the led device under correlated color temperatures 2600k˜3700k is greater than 90..
|Light emitting device|
A light emitting device includes: a ceramic substrate; a plurality of led chips; a printed resistor(s) connected in parallel with the plurality of led chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of leds, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency..
|Processing system including a plurality of cores and method of operating the same|
A system and method of allocating resources among cores in a multi-core system is disclosed. The system and method determine cores that are able to process tasks to be performed, and use history of usage information to select a core to process the tasks.
|System on chip including memory management unit and memory address translation method thereof|
A system on chip (soc) including a memory management unit (mmu) and a memory address translation method thereof are provided. The soc includes a master intellectual property (ip) configured to output a request corresponding to each of a plurality of working sets; an mmu module comprising a plurality of mmus, each of which is allocated for one of the working sets and translates virtual addresses corresponding to the request into physical addresses; a first bus interconnect configured to connect the mmu module with a memory device and to transmit the request, on which address translation has been performed in at least one of the mmus, to the memory device; and a second bus interconnect configured to connect the master ip with the mmu module and to allocate one of the mmus for each of the working sets..
|Storage system which realizes asynchronous remote copy using cache memory composed of flash memory, and control method thereof|
The first storage apparatus provides a primary logical volume, and the second storage apparatus has a secondary logical volume. When the first storage apparatus receives a write command to the primary logical volume, a package processor in a flash package allocates first physical area in the flash memory chip to first cache logical area for write data and stores the write data to the allocated first physical area.
|Integrated multiplex target analysis|
This invention provides biochip cartridges and instrument devices for the detection and/or analysis of target analytes from patient samples.. .
|Stacked memory device, memory system including the same and method for operating the same|
A stacked memory device includes a plurality of interconnected memory chips and a controller to control the plurality of memory chips to perform refresh operations during non-overlapping time periods. Each memory chip includes a plurality of ranks, and each rank includes at least one memory bank.
|Light-emitting device and luminaire|
A light-emitting device and a luminaire that can reduce glare are provided. A light-emitting device according to an embodiment includes a substrate, an led chip mounted on the lower surface of the substrate, a light reflecting member arranged downward and on one side when viewed from the led chip and opened on the other side, a surface of the light reflecting member opposed to the led chip being a light reflecting surface, and an optical member configured to guide light emitted from the led chip and reflected by the light reflecting member downward..
|Bumps for chip scale packaging|
A chip scale semiconductor device comprises a semiconductor die, a first bump and a second bump. The first bump having a first diameter and a first height is formed on an outer region of the semiconductor die.
|Light emitting module|
In a light emitting module, a red phosphor is contained in a second phosphor layer so that the wavelength of a second phosphor layer after the wavelength conversion is longer than that of a first phosphor layer. And a blue phosphor and a yellow-green phosphor are contained in the first phosphor layer.
|Light emitting semiconductor structure|
The invention provides a light emitting semiconductor structure, which includes a substrate; a first led chip formed on the substrate; an adhesion layer formed on the first led chip; and a second light emitting diode chip formed on the adhesion layer, wherein the second led chip has a first conductive wire which is electrically connected to the substrate.. .
|Conductor track unit for a motor vehicle|
The invention relates to a conductor track unit, in particular for a motor vehicle. The conductor track unit is provided with conductor tracks which are embedded in an electrically insulating material.
|Data storage device and method for operating the same|
A data storage device and a method for operating the same are provided. In the data storage device and the method for operating the same, a predetermined number of memory chips are operated based on a usable power limitation when a power supply is supplied from a finite power supply source such as a battery, and as many memory chips as possible are operated in parallel.
|Memory device and a memory module having the same|
A memory device is provided. The memory device includes a plurality of memory chips, and a buffer chip connected to the plurality of memory chips.
|Flash memory interface using split bus configuration|
A system having a split bus flash memory and a method for operating the split bus flash memory is disclosed. The system may include a controller, a non-volatile memory (including first and second non-volatile memory chips) and the system bus.
|Sharing serial peripheral interface flash memory in a multi-node server system on chip platform environment|
Methods and apparatus related to sharing serial peripheral interface (spi) flash memory in a multi-node server soc (system on chip) platform environment are described. In one embodiment, multi-port non-volatile memory is shared by a plurality of system on chip (soc) devices.
|System on chip and method for accessing device on bus|
The present invention discloses a system on a chip and a method for accessing a device on a bus, and belongs to the electronics field. The system includes: a primary device, configured to send an access request; an extension module, configured to receive the access request sent by the primary device, and extend the id signal in the access request according to the number of primary devices; a parsing module, configured to parse the access request output by the extension module to obtain an access response instruction; and a secondary device, configured to respond to the extended access request according to the access response instruction.
|Display device being possible to detect bonding defect|
A bonding-defect-detectable display device is disclosed which includes: a display panel defined into an active area used to display images and a pad area in which pads is formed; driver ic (integrated circuit) chip loaded on a pad region of the display panel; a flexible printed circuit board mounted to the pad region of the display panel; and a bonding resistance detection unit disposed into the driver ic chip. The display panel includes: first and second bonding portions formed in an occupation region of the driver ic chip within the pad area of the display panel; and third and fourth bonding portions formed in an occupation region of the flexible printed circuit board with the pad area of the display panel..
|Method of manufacturing light emitting device and spray coating machine|
A method of manufacturing a light emitting device, using a spray coating method, a fluorescent material can be easily adhered on corner portions and side surfaces of an led chip, a lens-shaped light transmissive resin member surface, an optical lens surface, etc., and a spray coating machine used in the method. The method includes mounting an led chip on a substrate member, applying a spray coating to a coating object including the led chip by spraying a powder-containing solution.
|Configurable-width memory channels for stacked memory structures|
The disclosed embodiments provide a chip package that facilitates configurable-width memory channels. In this chip package, a semiconductor die is electrically connected to two or more memory chips.
|Multi-channel memory module|
Embodiments of the invention further describe a memory module having a memory card housing, first and second pluralities of memory chips/devices included in the housing, and first and second pluralities of memory module electrical i/o terminals for coupling the first and second pluralities of memory chips/devices to pcb, respectively. In embodiments of the invention, the above described first and second pluralities electrical i/o connectors are disposed on different sides of the housing..
|Low-voltage ic test for defect screening|
System and method using low voltage current measurements to measure voltage network currents in an integrated circuit (ic). In one aspect, a low voltage current leakage test is applied voltage networks for the ic or microchip via one or more ic chip connectors.
|Outdoor led lamp with heated cover|
An outdoor led lamp assembly includes a light transmissive cover disposed over at least one led chip of the lamp assembly. A heating element is provided for providing heat to the cover.
|Systems and methods for a light emitting diode chip|
Provided is a light emitting diode (led) chip. The led chip includes a substrate and a mesa structure formed from a heterostructure grown on the substrate.
|Stacked multi-chip package and method of making same|
Stacked multichip packages and methods of making multichip packages. A method includes using a boat having different depth openings corresponding to the length of column interconnections of the completed multichip package and masks to place proper length columns in the corresponding depth openings; placing an integrated circuit chip on the boat and attaching exposed upper ends of the columns to respective chip pads of the integrated circuit using a first solder reflow process and attaching a preformed package substrate integrated circuit chip stack to the integrated circuit and attached columns using a second solder reflow process..
|Optoelectronic package and method of manufacturing the same|
An optoelectronic package includes an optoelectronic chip, a transparent protection layer and a plurality of pads. The optoelectronic chip has an upper surface and an active area defined on the upper surface.
|Light emitting diode package|
An led package includes a substrate, an led chip arranged on the substrate, and a light transmission layer arranged on a light output path of the led chip. The substrate includes a first electrode and a second electrode separated and electrically insulated from the first electrode.
The present invention provides an illumination apparatus. The illumination apparatus comprises a body having a lower portion coupled to a standard metallic lamp adaptor and an upper portion; a light source module comprising an led array of led chips connected in series, a phosphor powder layer encapsulating the led chips, and a pair of conductive wires electrically connected to the led chips for transmitting electric power to the led chips; and a transparent housing coupled to the upper portion of the body, so that the led chips are enveloped within the transparent housing..
|Led chip unit and manufacturing method thereof, and led module|
An led chip unit and manufacturing method thereof, a led module, an illuminating device and a display device. The led chip unit includes a plurality of led cores which are electrically isolated from each other.
|Light-emitting module board and manufacturing method of the light-emitting module board|
A light-emitting module board includes a metal board provided with an insulating layer, a light-emitting part and a white insulating film. The light-emitting part includes plural led chips mounted on the metal board, and a white reflecting film of a ceramic coating formed in a light-emitting area on the metal board on which the plural led chips are mounted.
|High-voltage flip-chip led structure and manufacturing method thereof|
A high-voltage flip-chip led structure and a manufacturing method thereof are disclosed. The manufacturing method includes: providing a die substrate, depositing a first passivation layer, forming a co-electrical-connecting layer, depositing a second passivation layer, depositing a mirror layer, forming two conductive tunnels by etching, and providing two connecting metal layers.
|Formation of a microfluidic array|
Using said fluidic structure as a mould to form said microfluidic array by solidification or hardening of a second liquid (11) deposited on the microfluidic chip and hugging the shape of said fluidic structure.. .
|System on chip including boot shell debugging hardware and driving method thereof|
A system on chip (soc) includes a first memory configured to store a primary bootloader for providing an environment in which a boot shell is to be executed; and a processor configured to execute the primary bootloader to initialize hardware. The boot shell includes at least one instruction for debugging the hardware, and the processor executes the boot shell and debugs the hardware before a platform is loaded..
|Prefetching functionality on a logic die stacked with memory|
Prefetching functionality on a logic die stacked with memory is described herein. A device includes a logic chip stacked with a memory chip.
|Marker sequences for diagnosing prostate cancer, and use thereof|
The present invention relates to novel marker sequences for prostate carcinoma while excluding inflammatory prostate diseases or diabetes or polymorbidity and relates to their diagnostic use including a method for screening potential active substances for such prostate diseases by means of these marker sequences. The invention furthermore relates to a diagnostic device including such marker sequences for prostate carcinoma, in particular a protein biochip and its use..
|Light-emitting diode manufacturing method|
A light-emitting diode manufacturing method comprises steps of: providing a flexible material layer having a flexible reflective layer and phosphor glue in the flexible reflective layer; providing a hard material layer having a substrate and an led chip on the substrate; combining the flexible material layer and the hard material layer together wherein the led chip inserts into the phosphor glue and is surrounded by the flexible reflective layer; and solidifying the flexible reflective layer and the phosphor glue to form a reflective cup and a phosphor layer, respectively.. .
|Method for manufcturing light emitting diode package|
A method for manufacturing an led package comprising following steps: providing a substrate and an led chip mounted on the substrate; providing glue and arranging the glue on a periphery of the substrate and drying the glue to form a blocking loop to enclose the led chip therein; and injecting the glue in the blocking loop, and drying the glue to form a packaging layer to encapsulate the led chip therein. Light emitted from the led chip travels through a top surface of the packaging layer, a periphery of the packaging layer, and the blocking loop to illuminate..
|Method for manufcturing backlight module|
A method for manufacturing a backlight module comprises following steps: providing a substrate; providing a flip chip led and mounting the flip chip led on a top surface of the substrate to electrically connect with two electrodes via flip chip bonding; providing a frame and mounting the frame on the top surface of the substrate, wherein the frame defines a through hole which receives the flip chip led therein; and providing a phosphor layer and mounting the phosphor layer on a top end of the frame away from the substrate to make the phosphor layer cover a top end of the through hole and the flip chip led.. .
|Method for dispensing glue on led chip|
A method for dispensing glue on an led chip includes following steps: providing a glue dispensing device which includes a syringe, a needle head communicating with the syringe, and a valve mounted on the needle head for controlling flowing of content in the syringe out of the syringe, wherein the valve has an aperture, and a diameter of the aperture is adjustable; providing glue and injecting the glue into the syringe; providing an led chip which is mounted a circuit board and orientating the needle head of the glue dispensing device towards the led chip, wherein the needle head is spaced from the led chip, and the diameter of the aperture of the valve is adjusted to a predetermined size; squeezing the glue out of the syringe under a predetermined pressure and a predetermined time, wherein the glue dispensed on the led chip forms an encapsulation structure.. .
|Cell processing method and device for switch fabric chip|
A cell processing method and device for a switch fabric (sf) chip are disclosed, which belong to the field of communications. The sf chip includes a unicast route table, which is multiplexed in two working modes and is looked up according to a unicast cell, and a multicast route table, which is multiplexed in the two working modes and is looked up according to a multicast cell.
|Multi-level memory array having resistive elements for multi-bit data storage|
A resistor array for multi-bit data storage without the need to increase the size of a memory chip or scale down the feature size of a memory cell contained within the memory chip is provided. The resistor array incorporates a number of discrete resistive elements to be selectively connected, in different series combinations, to at least one memory cell or memory device.
|Led module and method for manufacturing the same|
An led module includes an led unit having an led chip, a lens covering the led chip, and a diffusing film. The lens includes a light-incident face facing the led chip, a light-emitting face opposite to the light-incident face, and a connecting face connecting the light-incident face to the light-emitting face.
|Light emitting module and light source device|
A light emitting module is a light emitting module including a substrate, a first area in which led chips are mainly arranged and mounted in a longitudinal direction of the substrate in an area on one side of the longitudinal direction, a second area in which non-light emitting components are mainly mounted in an area on another side of the longitudinal direction of the substrate and a notch portion which is between the first area and the second area and formed on the substrate. The non-light emitting components are mountable across the notch portion between the first area and the second area.
|Light emitting diode light bar for use in a backlight module|
An led (light emitting diode) light bar is for use as a light source of a backlight module of an lcd (liquid crystal display). The led light bar includes a printed circuit board having a circuit therein, a plurality of led chips located on the printed circuit board and an encapsulation layer sealing the plurality of led chips.
|Aligning module and method for assembling light-emitting diode with lens using the same|
An exemplary aligning module for aligning a lens with a light-emitting diode (led) chip includes a controlling module, a first image sensing module and a second image sensing module controlled by the controlling module, and a gripping module controlled also by the controlling module. The controlling module controls the first image sensing module and the second image sensing module to sense the light center of the led chip and the geometric center of the lens, respectively.
|Led device and liquid crystal display device|
An led device includes an led chip, a fluorescent layer and a lens. The fluorescent layer has phosphor powder diffused therein.
|Backlight unit and liquid crystal display device including the same|
A backlight unit according to an embodiment includes: a light guide plate; a light emitting diode (led) assembly supplying a light to the light guide plate; and a reflecting plate under the light guide plate, wherein the led assembly includes: an led printed circuit board (pcb) disposed at a side of the light guide plate; a plurality of led chips over the led pcb, the plurality of led chips spaced apart from each other; a plurality of first lead frames electrically connecting the led pcb and the plurality of led chips; and an led housing surrounding the plurality of led chips and the plurality of first lead frames.. .
|Wearable projector for portable display|
Described herein are technologies related to a wearable projector to project images, information, multimedia, etc. In a portable display.
|Led light assembly and system|
An led based light assembly and lighting system is disclosed. The lighting system includes at least one light assembly comprising a plurality of led chips, a controller and a power supply module.
|Automotive headlamp apparatus|
An automotive headlamp apparatus includes a light source, in which a plurality of led chips are arranged at intervals from each other, and a projection lens for projecting the light, emitted from the light source, toward a front area of a vehicle as a light source image. The semiconductor light-emitting elements may be located within than a focal point of the projection lens.
|Wireless switching circuit|
A wireless switching circuit includes a charging capacitor, a voltage converter, an infrared sensor unit, a single chip microcomputer (scm), a zero trigger circuit, and a thyristor. The charging capacitor is used to store and supply power.
|Microvalve using surface tension, microfluidic chip comprising same, and method for manufacturing same|
The present disclosure relates to a microvalve using surface tension, a microfluidic chip including same and a method for manufacturing same. More particularly, the present disclosure relates to a microvalve using surface tension, a microfluidic chip including same and a method for manufacturing same, wherein the microvalve can be manufactured through a simple process and the microvalve and a coaxial sample channel are not separated, and thus the microvalve may be easily installed not only in an existing quadrangular channel but also in the coaxial channel so as to control the flow and amount of a microfluid (sample)..
|Method for welding gold-silicon eutectic chip, and transistor|
Relating to electronic components, the present disclosure provides a method for welding a gold-silicon eutectic chip, and a transistor. The method for welding a gold-silicon eutectic chip includes: electroplating a gold layer with a thickness smaller than or equal to 1 micron on surfaces of a chip carrier; bonding multiple gold protrusions on the gold layer in a welding region; and rubbing a chip in the welding region at a eutectic temperature to form a welding layer.
|Led package structure, dam structure thereof, and method of manufacturing led package thereof|
An led package structure includes a carrier mounted with a plurality of led chips, a first glue-layer, a second glue-layer and an encapsulation resin filled within the first and the second glue-layers. The first glue-layer is formed on a top surface of the carrier and has a thin-film structure which is substantially flat on a top surface thereof.
|Light emitting diode|
An led includes an led chip, a substrate, a first electrode and a second electrode formed on the led chip, and a first solder layer and a second solder layer formed on a top face of the substrate. The first solder layer is soldered on the first electrode and sandwiched between the led chip and the substrate.
|Led chip unit with current baffle|
An led chip unit includes a base and a chip mounted on the base. The chip includes a substrate, a first semiconductor layer, a light emitting layer, a second semiconductor layer and an electrode.
|Led chip with groove and method for manufacturing the same|
An led chip includes a substrate and an epitaxy structure formed on the substrate. The epitaxy structure includes a first semiconductor layer, a light emitting layer and a second semiconductor layer.
|Light emitting diode package|
An led package includes a first electrode, a second electrode, a reflecting cup connecting the first electrode and the second electrode, and an led chip. The first electrode includes a first main portion and a first connecting portion extending outwardly from the first main portion.
|Light emitting diode package|
An led package includes a first electrode, a second electrode electrically insulated from the first electrode, a reflecting cup connecting the first electrode and the second electrode, and an led chip. The first electrode includes an elongated first main portion and a first connecting portion bending downwardly from an end of the first main portion.
|Light emitting diode package with light reflecting cup internally slanted|
An exemplary led package includes a base, electrodes formed on the base, an led chip electrically connecting the electrodes, and a reflecting cup mounted on the base and surrounding the led chip therein. The reflecting cup includes a bottom surface and an inner surface recessed up from the bottom surface and slantwise oriented towards a top end of the reflecting cup.
|Method for manufacturing light emitting diode package|
A method for manufacturing an led package includes following steps: providing a eutectic bonding apparatus comprising a heating device, a supporting platform located in the heating device, and a nozzle; providing a resistance measuring device comprising a probe, an electrical power, and a controlling unit; providing an led chip; providing a substrate and positioning the substrate on the supporting platform of the eutectic bonding apparatus; moving the nozzle to catch the led chip onto the substrate; and heating the substrate and the led chip to form a eutectic bonding process. The probe of the resistance measuring device is electrically connected to the led chip, a total resistance of the led chip and the substrate is measured by the resistance measuring device in real-time, when the total resistance is equal to a predetermined value, the heating device is ordered to stop heating by the controlling unit..