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Chip-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Video server device and writing/reading data method
Kabushiki Kaisha Toshiba
June 15, 2017 - N°20170170848

According to one embodiment, a video server device includes: a memory; and a memory controller. The memory controller includes: a first ecc encoding unit configured to add a first ecc code to each of first data units of the data block, each of the first data units written to memory chips in parallel; a second ecc encoding unit configured to ...
Led module
Rohm Co., Ltd.
June 15, 2017 - N°20170170374

An led module 100 includes led chips 21, 22 spaced apart from each other, and an led chip 23 offset from a straight line connecting the led chips 21 and 22 and located between the led chips 21, 22 in the direction in which the led chips 21, 22 are spaced. The module further includes a lead 31 with a bonding portion 31a and a mounting terminal surface 31d, a lead 32 ...
Semiconductor device and method for manufacturing the same
Semiconductor Energy Laboratory Co., Ltd.
June 15, 2017 - N°20170170328

As a display device has a higher definition, the number of pixels, gate lines, and signal lines are increased. When the number of the gate lines and the signal lines are increased, a problem of higher manufacturing cost, because it is difficult to mount an ic chip including a driver circuit for driving of the gate and signal lines by ...
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Semiconductor package
Samsung Electronics Co., Ltd.
June 15, 2017 - N°20170170156

A semiconductor package is provided. The semiconductor package may include a plurality of memory chips, which are mounted on a top surface of a package substrate, and a plurality of controller chips, which are vertically stacked on at least one of top and bottom surfaces of the package substrate.
Reduced-height memory system and method
Intel Corporation
June 15, 2017 - N°20170170147

A computer memory module can include a molded layer disposed on a dram substrate. The molded layer can encapsulate a dram die and wire bonds that connect the dram die to the dram substrate, and can be shaped to include at least one cavity having a footprint sized to accommodate a system on chip (soc) die. The dram module can ...
Systems, methods, and computer programs for resolving dram defects
Qualcomm Incorporated
June 15, 2017 - N°20170169902

Systems, methods, and computer programs are disclosed for resolving dynamic random access memory (dram) defects. One embodiment is a system comprising a dynamic random access memory (dram) system electrically coupled to a system on chip (soc). The soc comprises a cache and a cache controller. The cache controller is configured to store corrected data for a failed physical codeword address ...
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Chip Patent Applications
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  • 242+ full patent PDF documents of Chip-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Single-stage arbiter/scheduler for a memory system comprising a volatile memory and a shared cache
Qualcomm Incorporated
June 15, 2017 - N°20170168727

Systems, methods, and computer programs are disclosed for scheduling memory transactions. An embodiment of a method comprises determining future memory state data of a dynamic random access memory (dram) for a predetermined number of future clock cycles. The dram is electrically coupled to a system on chip (soc). Based on the future memory state data, one of a plurality of ...
Chip-to-chip interconnect with embedded electro-optical bridge structures
Intel Corporation
June 15, 2017 - N°20170168235

Techniques and mechanisms for providing a bridge between integrated circuit (ic) chips. In an embodiment, the bridge device comprises a semiconductor substrate having disposed thereon contacts to couple the bridge device to two ic chips. Circuit structures and photonic structures of a bridge link are integrated with the substrate. The structures include an optical waveguide coupled between an electrical-to-optical signal ...
Microfluidic system and method with focused energy apparatus
Premium Genetics (uk) Ltd.
June 15, 2017 - N°20170167966

An apparatus and method of identifying objects includes: a microfluidic chip in which are disposed a plurality of channels, the micro-fluidic chip including: a main fluid channel into which a sample fluid mixture of objects to be identified is introduced; a plurality of sheath fluid channels into which sheath fluids are introduced, the sheath fluids which orient the objects in ...
Substrate and display device
Hefei Xinsheng Optoelectronics Technology Co., Ltd .
June 15, 2017 - N°20170167924

A substrate and a display device are disclosed. The substrate includes: a base substrate; a first temperature sensing section disposed on the base substrate; and a first processing chip connected with the first temperature sensing section. The substrate includes a peripheral area and a central area; one part of the first temperature sensing section is disposed in the peripheral area ...
Lens unit, led module with the lens unit, and light fixture with the led module
Panasonic Intellectual Property Management Co., Ltd.
June 15, 2017 - N°20170167668

A lens unit includes: lens cores configured to be provided one-to-one in front of leds with different luminous colors; and a main body that holds the lens cores. The lens cores is held by the main body so that respective distances of the lens cores from respective light-emitting surfaces of led chips in the leds are equal to each other.
Microfluidic pump
Funai Electric Co., Ltd.
June 15, 2017 - N°20170167481

A microfluidic pump on a monolithic chip. A closed length of channel is disposed on the chip, with a plurality of energizers disposed along the length of the channel. Each energizer is associated with a unique energizer designation. An onboard controller and energizer fire control lines are also disposed on the chip. One each of the energizer fire control lines ...
Brush chipper assembly with counter-rotating feeder rollers and actuating chipping heads
Funai Electric Co., Ltd.
June 15, 2017 - N°20170164563

A brush chipper assembly has a housing and a feeder subassembly connected to the housing. The feeder subassembly includes opposed, first and second feeder rollers. When the feeder subassembly is actuated, the first feeder roller is operable to rotate in a first direction and the second feeder roller is operable to rotate in a second direction (opposite to the first ...
Chip Patent Pack
Download 242+ patent application PDFs
Chip Patent Applications
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  • 242+ full patent PDF documents of Chip-related inventions.
  • Exact USPTO filing data with full-text, images, drawings & claims.
  • Index pages: Table View and Image-Grid View layouts. All images in each PDF.
Apparatus to inhibit misuse of an electrically powered device
The Trustees Of Columbia University In The City Of New York
June 08, 2017 - N°20170164267

A system includes an electrical device comprising a power supply and circuitry and a supplemental device integrated into the electrical device. The supplemental device includes a tracker chip to receive current location data of the electrical device. The supplemental device also includes a switch with one side connected to the power supply and another side connected to the circuitry of ...
Information processing apparatus, information processing method, information processing program and information processing system
Felica Networks, Inc.
June 08, 2017 - N°20170163426

An information processing apparatus according to the present application includes a first application allowed to access the ic chip, including an ic chip in which predetermined data is recorded, an ic chip reading unit that reads the data recorded in the ic chip, and a signature data generation unit that generates signature data by performing encryption processing on the recorded ...
Heat-dissipation device of led
Felica Networks, Inc.
June 08, 2017 - N°20170162772

Disclosed is a heat-dissipation device of an led. The device comprises one or a plurality of heat conducting material silks; a heat-dissipation housing of an led chip is contacted with one end of the heat conducting material silks through heat conducting materials or in a direct manner, in order to transmit the heat to the heat conducting material silks and ...
Semiconductor light-emitting device, method for producing same, and display device
Rohm Co., Ltd.
June 08, 2017 - N°20170162769

A semiconductor light-emitting device (101) includes an led chip (4), a lead (1) having a main surface (11) on which the led chip (4) is mounted, and a resin package (5) covering the led chip (4). The main surface (11) is roughened, and the main surface (11) is held in contact with the resin package (5). These configurations contribute to the downsizing of the semiconductor light-emitting device (101).
Light emitting device, illumination device and liquid crystal television
Sharp Kabushiki Kaisha
June 08, 2017 - N°20170162759

A light emitting device which emits a secondary light with high color purity and has a fast response speed is obtained. A ksf phosphor (15) which absorbs a part of blue light and emits red light and a casn phosphor (16) are distributed in a resin (14) which seals an led chip (13) which emits the blue light. The ksf phosphor (15) absorbs the blue ...
Method for improving defect-free rate of led light source, phosphor powder, and led light source
Sichuan Sunfor Light Co., Ltd.
June 08, 2017 - N°20170162757

A method for improving optical performance of an led light source, a light conversion filter obtained by using the method, and the corresponding led light source. In the method, an led chip is packaged by using a light wavelength conversion component, and the light wavelength conversion component is at least provided with two types of light conversion filters with light ...
Method of component partitions on system on chip and device thereof
Taiwan Semiconductor Manufacturing Co., Ltd.
June 08, 2017 - N°20170161420

A partition method includes sorting the plurality of components into a plurality of partitions according to a set of partition criteria and sorting the plurality of components of each partition into a first stack and a second stack according to a set of stack criteria, and the first stack includes a plurality of higher pitch metal layers and the second ...
Systems and methods for a hybrid parallel-serial memory access
Qualcomm Incorporated
June 08, 2017 - N°20170160928

Systems and methods are disclosed for a hybrid parallel-serial memory access by a system on chip (soc). The soc is electrically coupled to the memory by both a parallel access channel and a separate serial access channel. A request for access to the memory is received. In response to receiving the request to access the memory, a type of memory ...
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