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Chip patents



      
           
This page is updated frequently with new Chip-related patent applications. Subscribe to the Chip RSS feed to automatically get the update: related Chip RSS feeds. RSS updates for this page: Chip RSS RSS


Led decorative lighting

Led decorative lighting

Light emitting diode package and illuminating device

Chunghwa Picture Tubes

Light emitting diode package and illuminating device


Date/App# patent app List of recent Chip-related patents
07/30/15
20150216020 
 Led lamp patent thumbnailnew patent Led lamp
An led lamp includes led chips, a translucent cover housing the led chips, a motion sensor unit, a condensing lens, and a power unit. The motion sensor unit includes a light receiving element for light of a predetermined wavelength.
Rohm Co., Ltd.


07/30/15
20150214442 
 Light emitting diode package structure and method thereof patent thumbnailnew patent Light emitting diode package structure and method thereof
A light emitting diode (led) package structure is provided. The led package structure comprises a substrate, at least one led chip, an encapsulating compound and a curing material.
Lextar Electronics Corporation


07/30/15
20150214441 
 Light emitting diode package and illuminating device patent thumbnailnew patent Light emitting diode package and illuminating device
A led package including a transparent substrate, at least one led chip, a first sealing layer and a second sealing layer is provided. The transparent substrate has a first surface and a second surface opposite the first surface.
Chunghwa Picture Tubes, Ltd.


07/30/15
20150214438 
 Led module and  manufacturing the same patent thumbnailnew patent Led module and manufacturing the same
An led module and method for manufacturing the same are disclosed. The led module of the present invention comprises a substrate, at least one led chip, and a buffer layer.
Wisetop Technology Co., Ltd.


07/30/15
20150214209 
 Method of manufacturing semiconductor device patent thumbnailnew patent Method of manufacturing semiconductor device
To improve the reliability in applying a tape to the rear surface of a substrate while securing the heat resistance of the tape applied to the rear surface of the substrate. There is a gap between a bottom surface of a ditch provided in a support member and an upper surface of a driver ic chip.
Renesas Electronics Corporation


07/30/15
20150214197 
 Light-emitting device patent thumbnailnew patent Light-emitting device
A light-emitting device includes: a plurality of led chips each having a light-emitting region, and a first electrode and a second electrode that are electrically connected to light-emitting region; a plurality of substrates each being provided on each of the plurality of led chips; a plurality of through-holes each penetrating through each of the plurality of substrates; and, a plurality of wires each passing through a first through-hole penetrated through a first substrate of the plurality of the substrates and a second through-hole penetrated through a second substrate adjacent to the first substrate. The one of the plurality of the wires is electrically connected the first electrode or the second electrode of a first led chip corresponding to the first substrate, to the first electrode or the second electrode of a second led chip corresponding to the second substrate..
Panasonic Intellectual Property Management Co., Ltd.


07/30/15
20150214040 
 Thin epitaxial silicon carbide wafer fabrication patent thumbnailnew patent Thin epitaxial silicon carbide wafer fabrication
Techniques for fabricating thin epitaxial sic device wafers are described. A bulk sic wafer is used to provide a seed layer of a thin layer of sic for epitaxially growing sic.
Rutgers, The State University Of New Jersey


07/30/15
20150213841 
 Memory chip and memory storage device patent thumbnailnew patent Memory chip and memory storage device
A memory chip is disclosed. The memory comprises a substrate and a plurality of memory pads.
Eorex Corporation


07/30/15
20150213182 
 Common template for electronic article patent thumbnailnew patent Common template for electronic article
One or more techniques or systems for incorporating a common template into a system on chip (soc) design are provided herein. For example, a common template mask set is generated based on a first set of polygon positions from a first vendor and a second set of polygon positions from a second vendor.
Taiwan Semiconductor Manufacturing Company Limited


07/30/15
20150212795 
 Interfacing with a buffer manager via queues patent thumbnailnew patent Interfacing with a buffer manager via queues
Embodiments include a system on chip (soc) comprising: a cache; a buffer manager configured to manage a plurality of buffer locations; and a processing core configured to issue a buffer allocation request to the buffer manager to request the buffer manager to allocate one or more buffer locations to the processing core, the buffer manager being further configured to, in response to receiving the buffer allocation request, allocate a first buffer location to the processing core by writing a first buffer pointer associated with the first buffer location to the cache, and the processing core being further configured to obtain the allocation of the first buffer location by reading the first buffer pointer from the cache.. .
Marvell Israel (m.i.s.l) Ltd.


07/30/15
20150212263 
new patent

Led decorative lighting


A led decorative lighting is provided. A lamp holder has a case.

07/30/15
20150212154 
new patent

Methods and debugging lowest power states in system-on-chips


Methods and apparatus for debugging finite state machine are disclosed. The method includes implementing a debug logic circuit and connecting the debug logic circuit to a system on chip (soc) voltage source.
Nvidia Corporation


07/30/15
20150211690 
new patent

Light source device


A light source device including a light emitting diode (led) chip and a molding lens is provided. The molding lens is directly formed on the led chip and includes a center of a bottom where the led chip located at and a light exiting surface formed corresponding to the center.
Formosa Epitaxy Incorporation


07/30/15
20150209782 
new patent

Apparatus and system for measuring asphaltene content of crude oil


A system for measuring asphaltene content of crude oil, includes a microfluidic chip, the microfluidic chip having a crude oil sample inlet port, a solvent port, a mixer and reactor section in fluid communication with the crude oil sample inlet port and the solvent port, and a filter in fluid communication with the mixer and reactor section, the filter having an inlet side and an outlet side, a waste port in fluid communication with the inlet side of the filter, and a product port in fluid communication with the outlet side of the filter. The system further includes an optical cell in fluid communication with the product port..
Schlumberger Technology Corporation


07/30/15
20150209781 
new patent

Apparatus and system for measuring asphaltene content of crude oil


A system for measuring asphaltene content of crude oil, includes a microfluidic chip, the microfluidic chip having a crude oil sample inlet port, a solvent port, a mixer and reactor section in fluid communication with the crude oil sample inlet port and the solvent port, and a filter in fluid communication with the mixer and reactor section, the filter having an inlet side and an outlet side, a waste port in fluid communication with the inlet side of the filter, and a product port in fluid communication with the outlet side of the filter. The system further includes an optical cell in fluid communication with the product port..
Schlumberger Technology Corporation


07/30/15
20150209687 
new patent

Microfluidic chip for steam distillation


A microfluidic chip for steam distillation includes a chip body and a condenser. The chip body includes a steam inlet and a steam outlet.
National Pingtung University Of Science & Technology


07/23/15
20150208510 

Thin low profile strip dual in-line memory module


A low profile strip dual in-line memory module (200) includes a passive interposer support structure (90) with patterned openings (91-97) formed between opposing top and bottom surfaces, a plurality of memory chips (d1-d8) attached to the top and bottom surfaces, and vertical solder ball conductors (98) extending through the patterned openings to electrically connect the plurality of memory chips, where each memory chip has an attachment surface facing the passive interposer structure and a patterned array of horizontal conductors (e.g., 82-86) formed on the attachment surface with contact pads electrically connected to the plurality of vertical conductors to define at least one bus conductor that is electrically connected to each memory die in the first and second plurality of memory die.. .
Freescale Semiconductor, Inc.


07/23/15
20150208124 

Smart television system and turn-on and turn-off method thereof


A smart television, and a turn-off method and a turn-on method for the smart television system are provided. The smart television system includes a remote controller and a smart television.
Mstar Semiconductor, Inc.


07/23/15
20150207565 

Interface circuit for transmitting and receiving signals between electronic devices, and semiconductor memory chip and operation processing device including the same


An interface circuit configured to transmit and receive signals between electronic devices is provided. The interface circuit includes an optical connection protocol manager configured to serialize a parallel transmission packet electrical signal generated based on output data to generate a serialized transmission packet electrical signal, parallelize a serial reception packet electrical signal to generate a parallelized reception packet electrical signal, and parse the parallelized reception packet electrical signal according to whether there is an error in the parallelized reception packet electrical signal to generate input data; and an electro-optical converter configured to convert the serialized transmission packet electrical signal into a transmission packet optical signal to output the transmission packet optical signal, receive a reception packet optical signal, and convert the reception packet optical signal into the serial reception packet electrical signal to provide the serial reception packet electrical signal to the optical connection protocol manager..
Electronics And Telecommunications Research Institute


07/23/15
20150207432 

System on chip with power switches


According to an exemplary implementation, an integrated circuit (ic) includes a logic circuit monolithically formed on the ic. The logic circuit is configured to generate modulation signals for controlling power switches of a power inverter.
International Rectifier Corporation


07/23/15
20150207049 

Led device and led lamp using the same


A led device is provided. The led comprises a frame, a housing, a led chip and a protection component.
Lextar Electronics Corporation


07/23/15
20150207048 

Light emitting device


A light emitting device includes: a ceramic substrate; a plurality of led chips; a printed resistor(s) connected in parallel with the plurality of led chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of leds, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency..
Sharp Kabushiki Kaisha


07/23/15
20150207043 

Method of producing a multicolor led display


A method produces a multicolor led display, the display including an led luminous unit having a multiplicity of pixels. First subpixels, second subpixel and third subpixels contain an led chip that emits radiation of a first color, wherein a first conversion layer that converts the radiation into a second color is arranged at least above the second subpixels and a second conversion layer that converts the radiation into a third color is arranged above the third subpixels.
Osram Opto Semiconductors Gmbh


07/23/15
20150207032 

Methods and devices for light extraction from a group iii-nitride volumetric led using surface and sidewall roughening


Embodiments of the present disclosures are directed to improved approaches for achieving high-performance light extraction from a group iii-nitride volumetric led chips. More particularly, disclosed herein are techniques for achieving high-performance light extraction from a group iii-nitride volumetric led chip using surface and sidewall roughening..
Soraa, Inc.


07/23/15
20150206866 

Semiconductor package and methods of forming same


An embodiment package-on-package (pop) device includes a fan-out structure, one or more memory chips, and a plurality of connectors bonding the one or more memory chips to the fan-out structure. The fan-out structure includes a logic chip, a molding compound encircling the logic chip, and a plurality of conductive pillars extending through the molding compound..
Taiwan Semiconductor Manufacturing Company, Ltd.


07/23/15
20150206865 

Integrated circuit package and methods of forming same


An embodiment package-on-package (pop) device includes a package structure, a package substrate, and a plurality of connectors bonding the package structure to the package substrate. The package structure includes a logic chip bonded to a memory chip, a molding compound encircling the memory chip, and a plurality of conductive studs extending through the molding compound.
Taiwan Semiconductor Manufacturing Company, Ltd.


07/23/15
20150206849 

System-in-package module and manufacture a system-in-package module


A system-in-package module includes a non-memory chip, a bundled memory, and an encapsulation package material. The non-memory chip has a plurality of pads.
Etron Technology, Inc.


07/23/15
20150206631 

Anisotropic bonded magnets


The present invention provides an anisotropic bonded magnet and a method for fabricating the anisotropic bonded magnet by producing anisotropic chips by ball milling a rare-earth polycrystalline material with a surfactant in presence of a first magnetic field, mixing the anisotropic chips with one or more binding agents, and forming the anisotropic bonded magnet by compacting the mixture of anisotropic chips and binding agents in presence of a second magnetic field.. .
Board Of Regents, The University Of Texas System


07/23/15
20150206105 

Information processing device, information processing method, and information processing program product


An object is to provide a mechanism for giving an instruction to transfer value by an operation which is close to exchange of cash in terms of sense. A portable terminal incorporates a general-purpose ic chip storing a terminal-side value balance and can connect to an electronic money server via the internet.
Rakuten Edy, Inc.


07/23/15
20150206044 

Rfid wrist band


The rfid wrist band includes an elastic block section including an airtight storage part, an elastic band section connected to the elastic block section to form an annular shape, and an inlay stored in the storage part and including a base substrate, an antenna on the base substrate, and an ic chip connected electrically with the antenna. The inlay is not fixed to an inner wall of the storage part, and the storage part is larger than a volume occupied by the inlay..
Sato Holdings Kabushiki Kaisha


07/23/15
20150204786 

Emission intensity measuring device


An emission intensity measuring device includes a light receiving unit that is disposed opposed to a biochip having a plurality of compartments in which a sample is housed, and includes a plurality of light receiving elements that are arranged, and a determining section that determines a weighting rate of each of the light receiving elements based on a noise characteristic of the light receiving element, acquired in advance. The emission intensity measuring device further includes a multiplying section that multiplies the output of each of the light receiving elements by the weighting rate to calculate a weighted output of each of the light receiving elements, and an adding section that adds the weighted outputs of the light receiving elements opposed to a respective one of the compartments..
Sony Corporation


07/23/15
20150204521 

Method for constructing universal led bulb, flange inner snap ring type led bulb and lamp


The present invention discloses a method for constructing a universal led bulb, a flange snap ring type led bulb and a lamp. A heat conductive bracket (3) with a flange is used as a structure supporting main body of the bulb to establish an optical engine core member of the led bulb.
Guizhou Gzgps Co., Ltd


07/23/15
20150203899 

Diagnosis of active tuberculosis by determining the mrna expression levels of marker genes in blood


The present disclosure relates to a method of distinguishing active tb in the presence of a complicating factor, for example, latent tb and/or co-morbidities, such as those that present similar symptoms to tb, such as hiv. The method employs a 27 gene signature to distinguish active tuberculosis from latent tb infection, a 44 gene signature to distinguish active tb from other diseases such as hiv and/or a 53 gene signature to discriminate active tb from latent tb and other diseases.
Imperial Innovations Limited


07/23/15
20150202626 

Biochip device


A biochip device comprising a plastic substrate, an ic chip, and a sealing cover is disclosed in this invention. The plastic substrate comprises a variety of microfluidic structures including an inlet region of loading the fluidic sample, a separation structure, a microfluidic channel, a structure for slowing the flow of the fluidic sample, a reaction region, a detection zone groove, and a closed area for collecting the fluidic sample, wherein the microfluidic channel is connected from the inlet region, the separation structure, the structure for slowing the flow of the fluidic sample, the reaction region to the closed area for collecting the fluidic sample; and at least one golden fingers located at an edge of the plastic substrate and extended with convergent spacing to the edge of the detection zone groove.

07/23/15
20150201880 

Integrated injection system and communication device


An integrated system for injection including an injection device (10) in electronic connection with a communication device (a) is provided. The external communication device may be a handheld electronic device such as a smartphone or a dedicated reader such as a reader capable of reading information contained on an rfid tag.
Becton Dickinson France S.a.s.


07/16/15
20150200150 

Thermal management in electronic apparatus with phase-change material and silicon heat sink


Embodiments of an electronic apparatus with a thermal management technique utilizing a silicon heat sink and/or a phase-change material, as well as an assembling method thereof, are described. In one aspect, the electronic apparatus comprises a main unit, a phase-change material and an enclosure enclosing the main unit and the phase-change material.

07/16/15
20150200067 

Ceramic chip fuse with offset fuse element


An improved ceramic chip fuse with offset fuse element comprising a plurality of non-conductive layers; a fuse element disposed between ones of the plurality of non-conductive layers such that more non-conductive layers are above the fuse element than below the fuse element relative to a vertical axis of the fuse; first and second conductive terminals electrically connected to the fuse element to connect the fuse to a circuit to be protected and a source of power.. .
Littelfuse, Inc.


07/16/15
20150200008 

Semiconductor package and electronic apparatus


According to one embodiment, a semiconductor package includes a package substrate, a controller chip, a semiconductor memory chip, a temperature sensor, a seal portion, and a plurality of solder balls. The controller chip and the semiconductor memory chip are provided on a first surface of the package substrate.
Kabushiki Kaisha Toshiba


07/16/15
20150199266 

3dic memory chips including computational logic-in-memory for performing accelerated data processing


This disclosure relates to a three-dimensional (3d) integrated circuit (3dic) memory chip including computational logic-in-memory (lim) for performing accelerated data processing. Related memory systems and methods are also disclosed.
Carnegie Mellon University


07/16/15
20150198763 

Backlight module and liquid crystal display device using same


The present invention provides a backlight module and a liquid crystal display device using the backlight module. The backlight module includes a backplane (2), a light guide plate (4) arranged in the backplane (2), a backlight source (6) arranged in the backplane (2), and a heat dissipation plate (8) arranged between the backlight source (6) and the backplane (2).
Shenzhen China Star Optoelectronics Technology Co., Ltd.


07/16/15
20150198292 

Light emitting diode (led) devices, systems, and methods for providing customized beam shaping


Light emitting diode (led) devices, systems, and methods for targeted beam shaping are provided. In some aspects, led devices and methods include providing a submount and a light emission area disposed over the submount.
Cree, Inc.


07/16/15
20150197820 

Marker sequences for inflammatory prostate diseases, prostate carcinoma and their use


The present invention relates to novel marker sequences for inflammatory prostate diseases, prostate carcinoma and the diagnostic use thereof together with a method for screening of potential active substances for inflammatory prostate diseases, prostate carcinoma by means of these marker sequences. Furthermore, the invention relates to a diagnostic device containing such marker sequences for inflammatory prostate diseases, prostate carcinoma, in particular a protein biochip and the use thereof..
Protagen Ag


07/16/15
20150197791 

Ultra-rapid and sensitive dna detection using dnazyme and on-chip isotachophoresis


A dna detection method combines dnazyme reactions and on-chip isotachophoresis (itp). A mixture of sample containing a target dna and a dnazyme sensor which is either (1) a catalytic molecular beacon or (2) a binary dnazyme and a probe is loaded into a trailing electrolyte (te) reservoir of a microfluidic chip.
Konica Minolta Laboratory U.s.a., Inc.


07/16/15
20150196913 

Microfluidic chip for capturing cells and preparing method thereof


A microfluidic chip (100) for capturing cells (200) and preparing method thereof. The chip (100) comprises an upper rigid material (10) and a lower rigid material (20), a channel (30) provided between the upper rigid material (10) and the lower rigid material (20).
Wuhan Yzy Biopharma Co., Ltd.


07/09/15
20150195919 

Intelligent power module process


The present invention is an improved packaging process of intelligent motion control platform (imp), which regards to the imp improved process to change the manufacturing, assembling, and packaging process of printed circuit board (pcb) and electromagnetic compatibility (emc). It is an improved manufacturing process to prevent from detecting the defects after imp finishes packaging.

07/09/15
20150195914 

Integrated circuit structures having off-axis in-hole capacitor and methods of forming


Various embodiments include integrated circuit structures having an off-axis in-hole capacitor. In some embodiments, an integrated circuit (ic) structure includes: a substrate layer having an upper surface; an ic chip at least partially contained within the substrate layer and aligned with a minor axis perpendicular to the upper surface of the substrate layer; an aperture in the substrate layer, the aperture physically separated from the ic chip; and a capacitor in the aperture and at least partially contained within the substrate layer, the capacitor being physically isolated from the ic chip, wherein the capacitor is aligned with an axis perpendicular to the upper surface of the substrate layer and offset from the minor axis of the ic chip..
International Business Machines Corporation


07/09/15
20150195655 

High performance linear moving coil magnetic drive system


A linear moving coil magnetic drive system includes a continuous loop coil of flat, thin, rigid construction which levitates inside a quadrupole permanent magnet assembly with minimum gap. The linear coil may be a flat, racetrack-shaped, continuous loop, which may be constructed with single or multilayers pcb, flex-circuit, or other membrane process.
Wall Audio Inc.


07/09/15
20150195085 

Encryption device and defending a physical attack


Provided are a security device and a method for operating same. The security device may conceal an encryption key used for an encryption algorithm in an encryption module in correspondence to security attacks such as reading information on where the encryption key is stored in a memory by disassembling an ic chip, or extracting said information through microprobing.

07/09/15
20150194572 

Light-emitting diode package


A light-emitting diode (“led”) package includes a substrate, an led chip on the substrate, and a light exit surface adjuster. The light exit surface adjuster includes a light-transmitting surface which transmits light and a light-blocking surface which is around the light-transmitting surface and blocks the light.
Samsung Display Co., Ltd.


07/09/15
20150194466 

Light-emitting device having a plurality of concentric light transmitting areas


The light-emitting device of the present invention includes led chips provided on a ceramic substrate and a sealing material in which the led chips are embedded. The sealing material contains a fluorescent substance and divided into a first fluorescent-substance-containing resin layer and a second fluorescent-substance-containing resin layer by a first resin ring and a second resin ring..
Sharp Kabushiki Kaisha


07/09/15
20150194374 

Package with terminal pins with lateral reversal point and laterally exposed free end


A package (120), wherein the package (120) has at least one electronic chip (124), an encapsulation body (138) that encapsulates the electronic chip(s) (124), and a plurality of terminal pins (122) to connect the electronic chip(s) (124), wherein each of the said terminal pins (122) has an encapsulated section (126), which is encapsulated at least partially by the encapsulation body (138) and has an exposed section (128) that protrudes from the encapsulation body (138), and wherein at least a portion of the exposed sections (128) laterally extends from the encapsulation body (138) up to a reversal point (130) and laterally extends back from the reversal point (130) to the encapsulation body (138), so that a free end (132) of the exposed sections (128) is laterally aligned with or to a corresponding side wall (134) of the encapsulation body (138) or is spaced from the corresponding side wall (134) of the encapsulation body (138) laterally outwardly.. .
Iinfineon Technologies Ag


07/09/15
20150193641 

Card reader


A card reader may include a conveying passage; a magnetic head structured to abut with a magnetic stripe on the card; a head moving mechanism structured to move the magnetic head in a widthwise direction of the conveying passage between an abutting position and a retreated position; an ic contact block having a plurality of ic contact springs to contact a plurality of external connection terminals of an ic chip formed on the card; and a contact block moving mechanism structured to move the ic contact block between a contact position retreated position. The conveying passage may be formed with an opening part through which the magnetic head is passed.
Nidec Sankyo Corporation


07/09/15
20150193371 

Observing an internal link via an existing port for system on chip devices


Methods and apparatus relating to observing an internal link via an existing port for system on chip (soc) devices are described. In one embodiment, a logic within an soc device may allow an external logic analyzer to observe communication between a first and second component of the soc through an existing (e.g., shared and/or non-dedicated) interface.
Intel Corporation


07/09/15
20150193362 

Method, upper computer and system for programming nodes in a bus network


A method, an upper computer and a system for programming nodes in a bus network are provided. The method comprises: analyzing a program file to be programmed to obtain data of the program file and a storage address corresponding to the data; broadcasting a routing request message and receiving responding messages returned from a plurality of lower computers, each lower computer corresponding to one node in the bus network; analyzing the responding messages to obtain an operating state of each node among the plurality of layers of nodes; receiving a selected node to be programmed, activating the selected node and transmitting the data and the storage address to a single chip microcomputer corresponding to the selected node when the operating state of each node is a forwarding state; and storing corresponding to the selected node the data in a memory of the single chip microcomputer according to the storage address..
Shenzhen Byd Auto R & D Company Limited


07/09/15
20150193308 

Memory chips and data protection methods


A memory chip coupled to a host includes a memory and a controller. Multiple boot images having the same content are pre-loaded in the memory.
Via Technologies, Inc.


07/09/15
20150193149 

Library apparatus, storage medium initialization method and library controller


A library apparatus includes an initialization processing unit and an operation processing unit. The initialization processing unit, when accepting an initialization request to initialize a storage medium to which a wireless communication device is added, the wireless communication device including an ic chip with management information and including an electronic paper with a display unit for displaying the management information, stores a label name of the storage medium and data in the management information, the label name being acquired through the initialization request, and the data being written to a block used as an index label of the storage medium.
Fujitsu Limited


07/09/15
20150192281 

Light emission device, and illumination device


The light emission device (1a) includes an insulating substrate (2) and a light-emitting section (5) which is provided on a main surface of the insulating substrate (2) and has an led chip (3) and a wiring pattern (4). In an edge area of the main surface of the insulating substrate (2), a wall pattern (7a) made of an insulating material is provided so as to surround the light-emitting section (5)..
Sharp Kabushiki Kaisha


07/09/15
20150192278 

Led support, led and backlight module


The invention discloses a led support comprising an opaque housing. A mounting face for placing at least one led chip is provided inside the housing.
Beijing Boe Chatani Electronics Co., Ltd.


07/02/15
20150188847 

Streaming bridge design with host interfaces and network on chip (noc) layers


Systems and methods described herein are directed to streaming bridge design implementations that help interconnect and transfer transaction packets between multiple source and destination host interfaces through a network on chip (noc) interconnect, which includes a plurality of noc router layers and virtual channels (vcs) connecting the router layers. Implementations are configured to support a variety of different traffic profiles, each having a different set of traffic flows.
Netspeed Systems


07/02/15
20150188765 

Multimode gaming server


Aspects of the present invention relate to a multimode gaming server with different types of computing resources provided within the server. The different computing resources can be optimized for different computing tasks.
Microsoft Corporation


07/02/15
20150188361 

Bypass type 220v grid voltage sag prevention device and control method therefor


Provided are a bypass type 220v grid voltage sag prevention device and a control method therefor. The bypass type 220v grid voltage sag prevention device comprises an ac-to-dc energy storage unit, a single chip microcomputer (scm) control and display unit, and an inverter output unit.
Northeastern University


07/02/15
20150187997 

Light-emitting diode chip


A light-emitting diode (led) chip is disclosed. The led chip includes a substrate and a led stack on the substrate.
Lextar Electronics Corporation


07/02/15
20150187733 

Combination of tsv and back side wiring in 3d integration


The embodiments of the present invention relate generally to the fabrication of integrated circuits, and more particularly to a structure and method for fabricating a 3d integration scheme for multiple semiconductor wafers using an arrangement of intra-wafer through silicon vias (tsvs) to electrically connect the front side of a first integrated circuit (ic) chip to large back side wiring on the back side of the first ic chip and inter-wafer tsvs to electrically connect the first ic chip to a second ic chip.. .
International Business Machines Corporation


07/02/15
20150187682 

Semiconductor device


A semiconductor device is reduced in size. The semiconductor device includes a die pad, a plurality of leads arranged around the die pad, a memory chip and a power source ic chip mounted over the die pad, a logic chip mounted over the memory chip, a plurality of down bonding wires for connecting the semiconductor chip to the die pad, a plurality of lead wires for connecting the semiconductor chip to leads, and a plurality of inter-chip wires.
Renesas Electronics Corporation


07/02/15
20150187642 

Double-sided segmented line architecture in 3d integration


Embodiments of the present invention relate generally to electronic components such as semiconductor wafers and more particularly, to a double-sided three-dimensional (3d) hierarchal architecture scheme for multiple semiconductor wafers using an arrangement of through silicon vias (tsvs) and backside wiring. In an embodiment a first word line architecture may be formed on a front side of an ic chip and connected to a second word line architecture formed on a back side of the ic chip through intra-wafer, tsvs, thereby relocating required wiring to the back side of the ic chip..
International Business Machines Corporation


07/02/15
20150187410 

Testing a wide functional interface of a device integrated on an sip without dedicated test pins


A test interface mode over general purpose input/output peripheral connectors of a multichip package (mcp) or system in package (sip) for an integrated device chip having a wide functional interface. The wide functional interface has more signals than there are available external connectors on the sip package.

07/02/15
20150187399 

Pulse mechanism for memory circuit interruption


In a memory system where multiple memory chips communicate their ready/busy status on a shared bus line, a pulse mechanism is used for the individual memory chips to indicate their ready/busy status to the controller. In one example, the controller assigns pulse durations of differing lengths to the memory dies to allow the controller to distinguish between them.
Sandisk Technologies Inc.


07/02/15
20150186770 

Composite container lid with ic tag


A composite container lid for a packing container, which comprises an inner cap 30 fitted onto the container mouth portion 20, an over-cap 40 fitted onto the inner cap 30, and an ic tag 10, wherein an engaging means is provided between the inner surface of a skirt 42 of the over-cap 40 and the outer surface of a cylindrical wall 32 of the inner cap 30, the ic tag 10 comprises a resin film 1 that includes an ic chip 3, an antenna 5 and an unsealing detector circuit 9, and the ic tag 10 is attached to the inner cap 30 or to the over-cap 40 in a manner that the unsealing detector circuit 9 is broken by the motion of the over-cap 40 relative to the inner cap 30 caused in the step of unsealing the inner cap 30.. .
Nippon Closures Co., Ltd.


07/02/15
20150185895 

Inclined photonic chip package for integrated optical transceivers & optical touchscreen assemblies


An optical touchscreen assembly may employ a photonic chip packaged with a chip surface at an angle inclined between horizontal and vertical orientations. An inclined paddle sawn flat no-leads (ipsfn) package may be affixed to a cover glass surface along a perimeter of a display.

07/02/15
20150182966 

Field deployable small format fast first result microfluidic system


A field-deployable small format microfluidic system includes simplified, low-cost system control elements, optics, fluid control, and thermal control. An embodiment of a microfluidic chip includes a first plate having reagent wells and pneumatic ports formed therein, a second plate with reaction wells and microfluidic channels connecting each reaction well with one reagent well and one pneumatic port formed therein, and a printed circuit board with heater elements, a temperature sensor, and thermal vias providing thermal transfer through the pcb.
Canon U.s. Life Sciences, Inc.


06/25/15
20150180994 

Asymmetric chip-to-chip interconnect


Methods and apparatus apparatuses to transfer data between a first device and a second device are disclosed. In various embodiments, an apparatus includes a first device and a second device.
Micro Technology, Inc.


06/25/15
20150180650 

Synchronisation for transmit and receive symbols of all-digital receiver


A synchronisation method and device for transmit and receive symbols of an all-digital receiver. The method comprises the steps of: after receiving a sampling signal sent by a baseband processing chip, the clock signal of which is provided by a second clock source, a digital signal processor (dsp), the clock signal of which is provided by a first clock source, measuring a phase shift between a local sampling symbol and an air interface symbol, and acquiring the phase shift amount; according to the phase shift amount, adjusting a sampling opportunity for the sampling of a digital-analogue/analogue-digital converter; and when the sampling opportunity for the sampling of the digital-analogue/analogue-digital converter has been adjusted, adjusting an interface clock for data transmitting and receiving of the dsp so as to enable the data transmitting and receiving of the dsp to be synchronised with the sampling..
Hytera Communications Corp., Ltd.


06/25/15
20150180540 

Zero standby power for powerline communication devices


An embodiment is an integrated system on chip (soc) including a communication interface configured to implement a communication protocol including functional blocks that are energized or de-energized individually so that a minimum power consumption is used to receive and detect a signal, and a receiver identification (id) detection function configured to determine whether the signal is intended for the device in which the soc resides. The soc further includes a power management function configured to control which functions in the soc and/or device in which the soc resides are energized or de-energized depending on the results of the receiver id detection function, and a power source capable of energizing a minimum number of the functional blocks required to receive and detect a signal, wherein the power source can be used in a low power state and switched over to a main power supply when the soc is energized..
Stmicroelectronics, Inc.


06/25/15
20150180429 

Power amplifier and transmission device


An scpa includes a pad, capacitative elements, amplifiers on an ic chip. The capacitative elements are disposed on a first circle whose center is located on the pad.
Panasonic Corporation


06/25/15
20150179905 

Light emitting device, display device, and manufacturing light emitting device


A light emitting device in which a plurality of led chips are arranged. Each of the plurality of led chips include a light emitting region that is formed on a substrate, a first pad electrode that is formed on the substrate, and a through-hole that penetrates the substrate.
Panasonic Intellectual Property Management Co., Ltd.


06/25/15
20150179902 

Led package


The present invention is related to a light emitting diode (led) package. The led package includes a blue led chip, a first electrode, a second electrode and a phosphor layer.
Advanced Optoelectronic Technology, Inc.


06/25/15
20150179901 

Method of fabricating white led devices


A light emitting device and a method of fabricating the same is provided. The device includes an led chip having a first main surface, a second main surface opposing the first main surface, and one or more side surfaces extending between the first and second main surfaces.

06/25/15
20150179898 

Led module


A led module includes a substrate, a led chip supported on the substrate, a metal wiring installed on the substrate, the metal wiring including a mounting portion on which the led chip is mounted, an encapsulating resin configured to cover the led chip and the metal wiring, and a clad member configured to cover the metal wiring to expose the mounting portion, the encapsulating resin arranged to cover the clad member.. .
Rohm Co., Ltd.


06/25/15
20150179897 

Light emitter components and methods having improved performance


Light emitter components and methods having improved performance and related methods are disclosed. In one embodiment, a light emitter component can include a submount and at least one light emitting diode (led) chip disposed over the submount.
Cree, Inc.


06/25/15
20150179676 

Display device


With an increase in the definition of a display device, the number of pixels is increased, and thus the numbers of gate lines and signal lines are increased. Due to the increase in the numbers of gate lines and signal lines, it is difficult to mount an ic chip having a driver circuit for driving the gate and signal lines by bonding or the like, which causes an increase in manufacturing costs.
Semiconductor Energy Laboratory Co., Ltd.


06/25/15
20150179623 

Method for manufacturing semiconductor device


A semiconductor chip is conveyed onto a chip mounting region of a wiring board by means of a bonding jig to electrically couple the semiconductor chip and the wiring board to each other. The bonding jig for mounting the semiconductor chip on the wiring board is equipped with a retention portion for adsorbing and retaining a logic chip, a pressing portion for pressing against the back surface of the semiconductor chip, and a sealing portion to be firmly attached to the peripheral edge portion of the back surface of the semiconductor chip.

06/25/15
20150179285 

Detecting defective connections in stacked memory devices


A method for testing a stacked memory device having a plurality of memory chips connected to and arranged on top of a logic chip for a connection defect is disclosed. The method may include testing a memory chip by writing a data value into a first location in the memory chip, reading a data value from the first location, detecting a first bit error and recording a bit number of the first bit error.
International Business Machines Corporation


06/25/15
20150179280 

Detecting defective connections in stacked memory devices


A method for testing a stacked memory device having a plurality of memory chips connected to and arranged on top of a logic chip for a connection defect is disclosed. The method may include testing a memory chip by writing a data value into a first location in the memory chip, reading a data value from the first location, detecting a first bit error and recording a bit number of the first bit error.
International Business Machines Corporation




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