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Chip patents



      
           
This page is updated frequently with new Chip-related patents. Subscribe to the Chip RSS feed to automatically get the update: related Chip RSS feeds.

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Date/App# patent app List of recent Chip-related patents
04/17/14
20140109108
 Real-time communications client architecture patent thumbnailnew patent Real-time communications client architecture
A distributed services modular client architecture may be used to implement ip-based real time communication services in a flexible manner among a wide variety of different types of chip sets and systems-on-chip. The various services are distributed among one or more processor cores, at least one of which is a low power core, in accordance with a number of factors, including power consumption, media latency, on-time, performance, and other considerations.
04/17/14
20140109035
 Layout method for printed circuit board patent thumbnailnew patent Layout method for printed circuit board
A layout method for a printed circuit board (pcb) is provided. A memory type of a dynamic random access memory (dram) to be mounted on the pcb is obtained.
04/17/14
20140108825
 System and method for hardware based security patent thumbnailnew patent System and method for hardware based security
An asset management system is provided, which includes a hardware module operating as an asset control core. The asset control core generally includes a small hardware core embedded in a target system on chip that establishes a hardware-based point of trust on the silicon die.
04/17/14
20140108708
 Raid configuration in a flash memory data storage device patent thumbnailnew patent Raid configuration in a flash memory data storage device
A method of storing data in a flash memory data storage device that includes a plurality of memory chips is disclosed. The method includes determining a number of memory chips in the data storage device, defining, via a host coupled to the data storage device, a first partition of the data storage device, where the first partition includes a first subset of the plurality of memory chips and defining a second partition of the data storage device via a host coupled to the data storage device, where the second partition includes a second subset of the plurality of memory chips.
04/17/14
20140108683
 Memory system that utilizes a wide input/output (i/o) interface to interface memory storage with an interposer patent thumbnailnew patent Memory system that utilizes a wide input/output (i/o) interface to interface memory storage with an interposer
A memory system is provided in which at least one memory chip and a memory controller chip are mounted in a side-by-side relationship on an interposer. The memory chip is connected to the interposer via a wide i/o interface to enable the memory chip and the memory controller chip to communicate with each other via the wide i/o interface.
04/17/14
20140105601
 Optical module used in optical communication systems, method of updating firmware of optical module used in optical communication systems, and trouble tracing system patent thumbnailnew patent Optical module used in optical communication systems, method of updating firmware of optical module used in optical communication systems, and trouble tracing system
An optical module includes: an optical device driven by a driving voltage; an arithmetic processing chip including an arithmetic processing circuit that operates according to predetermined firmware and generates an electrical control signal indicating a magnitude of the driving voltage; a voltage generating unit provided outside the arithmetic processing chip, and including an input terminal that receives the control signal from the arithmetic processing chip and an output terminal that provides the driving voltage of a magnitude corresponding to the control signal to the optical device; and a voltage holding unit that holds an output voltage from the output terminal of the voltage generating unit at a constant voltage regardless of an operation state of the arithmetic processing circuit, when the firmware is updated.. .
04/17/14
20140105535
 Lens standoff and protection for optical communication systems patent thumbnailnew patent Lens standoff and protection for optical communication systems
An opto-electronic system includes a substrate, an opto-electronic chip mounted on the substrate, a frame, and a lens device retained in the frame. A frame mounting portion of the frame is in contact with an upper surface of the opto-electronic chip.
04/17/14
20140105246
 Temperature controlled structured asic manufactured on a 28 nm cmos process lithographic node patent thumbnailnew patent Temperature controlled structured asic manufactured on a 28 nm cmos process lithographic node
A temperature control for a structured asic chip, manufactured using a cmos process is shown. A circuit employing temperature feedback using a microprocessor and active heating elements, that in a preferred embodiment uses decoupling cell capacitors, is employed to actively heat a die when the temperature of the die drops below a predetermined minimum temperature, in order to achieve timing closure in the chip..
04/17/14
20140104946
 On-chip hv and lv capacitors acting as the second back-up supplies for nvsram auto-store operation patent thumbnailnew patent On-chip hv and lv capacitors acting as the second back-up supplies for nvsram auto-store operation
Two on-chip capacitors including one hv capacitor vppcap and one lv vcc capacitor vcccap are built over a nvsram memory chip as a back-up second power supplies for each nvsram cell, regardless of 1-poly, 2-poly, pmos or nmos flash cell structures therein. The on-chip hv and lv capacitors are preferably made from one or more mim or mip layers for achieving required capacitance.
04/17/14
20140104920
 Semiconductor device patent thumbnailnew patent Semiconductor device
According to one embodiment, a semiconductor device includes a processor chip, and a memory chip stacked on the processor chip with bumps and including a memory cell unit and a memory logic unit. The bumps are arranged on the memory logic unit.
04/17/14
20140104917
new patent Semiconductor memory device including plurality of memory chips
A semiconductor memory device includes a plurality of memory chips each including a chip identification (id) generation circuit. The chip id generation circuits of the respective memory chips are operatively connected together in a cascade configuration, and the chip id generation circuits are activated in response to application of a power supply voltage the memory device to sequentially generate respective chip id numbers of the plurality of device chips.
04/17/14
20140104610
new patent Biochip detecting device and light source detecting method thereof
A biochip detecting device for detecting a biochip is provided. The biochip receives an incident light to produce an excitation light.
04/17/14
20140104471
new patent Semiconductor module, mos type solid-state image pickup device, camera and manufacturing method of camera
A back-illuminated type mos (metal-oxide semiconductor) solid-state image pickup device 32 in which micro pads 34, 37 are formed on the wiring layer side and a signal processing chip 33 having micro pads 35, 38 formed on the wiring layer at the positions corresponding to the micro pads 34, 37 of the mos solid-state image pickup device 32 are connected by micro bumps 36, 39. In a semiconductor module including the mos type solid-state image pickup device, at the same time an image processing speed can be increased, simultaneity within the picture can be realized and image quality can be improved, a manufacturing process can be facilitated, and a yield can be improved.
04/17/14
20140103985
new patent Digitally controlled delay line for a structured asic having a via configurable fabric for high-speed interface
A digitally controlled delay line (dcdl) for a structured asic chip is used to delaying input or output signals into or out of core logic in a structured asic. The dcdl has a multi-stage configuration that in a preferred embodiment comprises two fine delay stages for fine tuning the delay using sub-gate delay through an inverter whose delay can be adjusted with parallel cmos transistors whose gates are biased with a voltage control signal that is thermometer coded.
04/17/14
20140103959
new patent Architectural floorplan for a structured asic manufactured on a 28 nm cmos process lithographic node or smaller
A floorplan for a structured asic chip is shown having a core region containing memory and vclb logic cells surrounded by a plurality of io connection fabrics that include a first io connection fabric comprising io sub-banks connecting the core of the chip to pins for external signals to the core, a first high-speed routing fabric disposed along the east-west vertical top of the core and connects the core to high-speed io such as serdes; a network-aware connection fabric connects the core to a microcontroller primarily for testing and repair of the memory in the core; and a second-high speed routing fabric is disposed on the north-south vertical sides of the core and communicates with the io sub-banks. The vclb structured asic chip is manufactured on a 28 nm cmos process lithographic node or smaller, having several metal layers and preferably is programmed on a single via layer..
04/17/14
20140103386
new patent Light emitting diode package and method of manufacturing the same
Provided is an led package including a metal substrate that has one or more via holes formed therein; an insulating layer that is formed on a surface of the metal substrate including inner surfaces of the via holes; a plurality of metal patterns that are formed on the insulating layer and are electrically isolated from one another; and an led chip that is mounted on a metal pattern among the plurality of metal patterns.. .
04/17/14
20140103370
new patent Semiconductor light emitting device
A semiconductor light emitting device includes an led chip, which includes an n-type semiconductor layer, active layer, and p-type semiconductor layer stacked on a substrate. The led chip further includes an anode electrode connected to the p-type semiconductor, and a cathode connected to the n-type semiconductor.
04/17/14
20140103117
new patent Rfid tag
There is provided an rfid tag, which includes: a first substrate having flexibility and configured to include an antenna provided on a first surface of the first substrate; a second substrate; an ic chip mounted on a first surface of the second substrate; an anisotropic conductive rubber configured to contact the first substrate to the second substrate with the ic chip facing the first surface of the first substrate and to contact a terminal of the ic chip to the antenna; and an exterior rubber configured to cover the first substrate, the second substrate, and the ic chip.. .
04/10/14
20140101630
Computer system for generating an integrated and unified view of ip-cores for hierarchical analysis of a system on chip (soc) design
In order to realize some of the advantages described above, there is provided a computer system for verification of an intellectual property (ip) core in a system-on-chip (soc). The system generates a plurality of verification specific abstracted views of the ip core, each of the plurality of verification specific abstracted views having a plurality of verification specific attributes at an input/output (i/o) interface of each of the abstracted view of the ip-core.
04/10/14
20140101368
Binding microprocessor to memory chips to prevent re-use of microprocessor
A processor is provided that binds itself to a circuit such that the processor cannot be subsequently reused in other circuits. On a first startup of the processor, a memory segment of an external volatile memory device is read to obtain information prior to initialization of the memory segment.
04/10/14
20140100141
Compartementalized integrated biochips
An integrated microfluidic biochip is provided that includes a microfluidic device, where the microfluidic device includes hollow structures, where at least one the hollow structure includes an output at a bottom surface of the microfluidic device, and a sensor plate, where the sensor plate comprises a plurality of independent surface sensors, where the microfluidic device is sealably attachable to the sensor plate, where the hollow structure output abuts the surface sensor when the microfluidic device is attached to the sensor plate.. .
04/10/14
20140099815
Memory module connector with auxiliary power
An apparatus includes a socket that receives a memory module that includes a card having card edge voltage pads along the lower card edge, auxiliary voltage pads along at least one of the vertical card edges, and one or more persistent, solid-state memory chips on one or both card faces. A latch pivotally coupled to the socket is movable between a latched position and an unlatched position.
04/10/14
20140099243
Photosensitive resin composition for forming biochip, and biochip
It is intended to obtain a photosensitive resin composition that is capable of forming a highly fine pattern with a high aspect ratio while attaining the high adhesion of the pattern to a substrate, having low autofluorescence, and being exceedingly suitable for producing a biochip that causes exceedingly low damage on cultured cells. The photosensitive resin composition for forming a biochip of the present invention contains: an epoxy compound (a1) of a particular structure having an oxycyclohexane skeleton having an epoxy group; an epoxy compound (a2) of a particular structure which is a polyvalent carboxylic acid derivative having an epoxidized cyclohexenyl group; a cationic photoinitiator (b); and a solvent (c)..
04/10/14
20140098810
Fabric chip having a port resolution module
A fabric chip includes a plurality of port interfaces, wherein each of the plurality of port interfaces includes a network chip interface (nci) block having a port resolution module, and wherein the port resolution module is to determine which of the port interfaces is to receive a packet from the nci block, and a crossbar block communicatively coupled with each of the nci blocks in the plurality of port interfaces.. .
04/10/14
20140098529
Light emitting device, lighting device
The light-emitting device includes a substrate and a plurality of light-emitting sections. A first light-emitting section is made up of led chips and a first fluorescent-substance-containing resin layer, and a second light-emitting section is made up of led chips and a second fluorescent-substance-containing resin layer.
04/10/14
20140098480
Memory module connector with auxiliary power cable
A memory module includes persistent-storage memory chips and an auxiliary voltage connector for powering the persistent-storage memory chips. An auxiliary power cable has a first end coupled to an electronic power source on the system board and has a second end having connector that plugs in to the auxiliary voltage connector on the memory module to provide power to the persistent-storage memory chips.
04/10/14
20140097694
Method and apparatus for regulator control
Aspects of the disclosure provide an integrated circuit (ic) chip that includes a feedback control circuit and a detecting circuit. The feedback control circuit is configured to govern a feedback signal to a first regulator that regulates a first power supply to the ic chip based on the feedback signal.
04/10/14
20140097532
Thermally enhanced package-on-package (pop)
A method and structure for providing improved thermal management in multichip and package on package (pop) applications. A first substrate attached to a second smaller substrate wherein the second substrate is encircled by a heat ring attached to the first substrate, the heat ring comprising heat conducting materials and efficient heat dissipating geometries.
04/10/14
20140097482
Full metal gate replacement process for nand flash memory
A nand flash memory chip is made by forming sacrificial control gate structures and sacrificial select structures, and subsequently replacing these sacrificial structures with metal. Filler structures are formed between sacrificial control gate structures and are subsequently removed to form air gaps between neighboring control gate lines and between floating gates..
04/10/14
20140097460
Led device
An led device comprises a substrate, an led chip and a luminescent conversion layer. The substrate comprises a first electrode, a second electrode and a reflector located on top faces of the first and the second electrodes.
04/10/14
20140097452
Luminescence device
A luminescence device used in a backlight unit for lighting or displaying may include: a substrate including at least two electrode patterns and led chips which are provided over the substrate and include a phosphor provided thereon. A dam is provided over the substrate, and an encapsulation layer is provided over the substrate.
04/10/14
20140097253
Process for manufacturing a contactless smartcard having a transparent logo
A multilayer contactless smartcard 10 including an electronic chip embedded in the card, the chip being connected to an antenna 22 printed on a carrier layer 20, and two card bodies, one on each side of the carrier, each including at least one plastic layer 40 and 60. The antenna carrier is opaque and includes a first cut-out forming a void 23 filled with a transparent plastic; and the plastic layers of the two card bodies each include a second cut-out forming two identical voids 43 and 63 the outlines of which superimpose, in order to make a transparent zone appear in the thickness of the card, forming a transparent logo in the shape of the cut-out.
04/10/14
20140096615
Pressure transducer using ceramic diaphragm
A pressure transducer using a ceramic diaphragm which is not easily damaged so that there is no risk of leakage of a target medium to be measured, having a superior mass-production capability and a reduced volume and enabling low-price by simplifying a flexible cable and a printed circuit board (pcb) to connect the transducer and a signal processing chip. The pressure transducer includes the ceramic diaphragm formed as a rectangular planar ceramic diaphragm and having a surface having formed thereon a pattern made of an electrically conductive material and strain gages; a base plate configured to face the surface of the ceramic diaphragm having formed thereon the pattern; and an adhesive layer configured to be formed along edges of a contacting surface of the ceramic diaphragm and the base plate so as to bond the ceramic diaphragm and the base plate and form a space for the strain gages..
04/03/14
20140094383
Tethered lipoplex nanoparticle biochips and methods of use
Disclosed are compositions and methods for the use of lipoplex nanoparticle chips and arrays in the detection of/diagnosis of a disease or condition.. .
04/03/14
20140094223
Epitaxial buffer layers for group iii-n transistors on silicon substrates
Embodiments include epitaxial semiconductor stacks for reduced defect densities in iii-n device layers grown over non-iii-n substrates, such as silicon substrates. In embodiments, a metamorphic buffer includes an alxin1-xn layer lattice matched to an overlying gan device layers to reduce thermal mismatch induced defects.
04/03/14
20140093993
Device of monolithically integrated optoelectrics
A method is disclosed for fabricating optoelectronic component structures and traditional circuit elements on a single silicon substrate. Specific examples of optoelectronic components include, but are not limited to: photodiode structures, light emitter structures and waveguide structures.
04/03/14
20140093431
Microfluidic systems and methods
The systems and methods disclosed herein include a microfluidic system, comprising a pneumatic manifold having a plurality of apertures, and a chip manifold having channels disposed therein for routing pneumatic signals from respective ones of the apertures to a plurality of valves in a microfluidic chip, wherein the channels route the pneumatic signals in accordance with a configuration of the plurality of valves in the microfluidic chip.. .
04/03/14
20140093213
Arrangement of photonic chip and optical adaptor for coupling optical signals
An apparatus includes an optical adaptor having monolithically integrated optical elements and first micro-mechanical features, the latter defining at least a first horizontal reference surface and a first vertical reference surface; wherein the first horizontal reference surface is perpendicular to an optical plane, the latter being perpendicular the optical axis of the optical elements; and wherein the first vertical reference surface is perpendicular to the first horizontal reference surface and parallel to the optical axis.. .
04/03/14
20140093207
Arrangement of photonic chip and optical adaptor for coupling optical signals
An apparatus includes an optical adaptor having monolithically integrated optical elements and first micro-mechanical features, the latter defining at least a first horizontal reference surface and a first vertical reference surface; wherein the first horizontal reference surface is perpendicular to an optical plane, the latter being perpendicular the optical axis of the optical elements; and wherein the first vertical reference surface is perpendicular to the first horizontal reference surface and parallel to the optical axis.. .
04/03/14
20140092740
Adaptive packet deflection to achieve fair, low-cost, and/or energy-efficient quality of service in network on chip devices
Methods and apparatus for provision of adaptive packet deflection to achieve fair, low-cost, and/or energy-efficient quality of service (qos) in network-on-chip (noc) devices are described. In some embodiments, it is determined whether a target port of a packet has reached a threshold utilization value and the packet is routed to an alternate port in response to a deflection probability value that is to be determined based on a utilization value of the target port and a priority level value of the packet.
04/03/14
20140092719
Radio transceiver on a chip
An entire radio transceiver can be compeltely integrated into one ic chip. In order to integrate the if filters on the chip, directly modulated vco is used for both up-conversion during transmission, and down-conversion during reception.
04/03/14
20140092584
Light-emitting device, illuminating apparatus, and display apparatus
The invention provides a light-emitting device a light-emitting device for use in a backlight unit of a display apparatus including a display panel, which is capable of applying light to an illumination object with uniformity in brightness in a planar direction of the illumination object and can be made lower in profile. A backlight unit (1) is provided with: a printed circuit board (12); a plurality of light-emitting portions (111) disposed on the printed circuit board (12) and having a base support (111b), an led chip (111a) and a lens (112); and a first reflective member (118) disposed on a periphery of each light-emitting portion (111) and having a first reflecting portion (1181) and a second reflecting portion (1182)..
04/03/14
20140091845
High breakdown voltage iii-n depletion mode mos capacitors
Iii-n high voltage mos capacitors and system on chip (soc) solutions integrating at least one iii-n mos capacitor capable of high breakdown voltages (bv) to implement high voltage and/or high power circuits. Breakdown voltages over 4v may be achieved avoiding any need to series couple capacitors in an rfic and/or pmic.
04/03/14
20140091409
Applications of contact-transfer printed membranes
The disclosed embodiments provide sensitive pixel arrays formed using solvent-assisted or unassisted release processes. Exemplary devices include detectors arrays, tunable optical instruments, deflectable mirrors, digital micro-mirrors, digital light processing chips, tunable optical micro-cavity resonators, acoustic sensors, acoustic actuators, acoustic transducer devices and capacitive zipper actuators to name a few..
04/03/14
20140091354
Light emitting diode having two separated substrate parts connected together by encapsulation
A light emitting diode includes a substrate consisting two separated parts with a gap therebetween. A first electrical connecting portion is fixed to one of the two separated parts of the substrate and adjacent to the gap.
04/03/14
20140091345
Luminescence device
A luminescence device used in a backlight unit for lighting or displaying may include a substrate having a first electrode and a second electrode, and an led chip disposed on the first electrode. A dam is disposed on the substrate.
04/03/14
20140091330
Led package structure with transparent electrodes
The present invention discloses a led package structure with transparent electrodes. The electrode layers the semiconductor layers inside the led chip and the protection layer are all transparent to visible and invisible lights.
03/27/14
20140089729
Storage system and storage control method
A storage system includes a plurality of nonvolatile memory devices that each includes a plurality of nonvolatile memory chips, and a storage controller configured to perform input and output of data to and from a raid group comprised by storage areas of the plurality of nonvolatile memory devices. A nonvolatile memory device identifies a failure occurrence area that is a storage area in which a failure occurred in the plurality of nonvolatile memory chips, excludes the failure occurrence area from a storage area allocated to the raid group, and transmits failure occurrence information that is information relating to the failure that has occurred in the nonvolatile memory device to the storage controller.
03/27/14
20140089548
Systems, methods, and articles of manufacture to stream data
Systems and methods for streaming data. Systems allow read/write across multiple or n device modules.
03/27/14
20140088947
On-going reliability monitoring of integrated circuit chips in the field
Disclosed is an integrated circuit (ic) chip with a built-in self-test (bist) architecture that allows for in the field accelerated stress testing. The ic chip can comprise an embedded processor, which selectively alternates operation of an on-chip test block between a stress mode and a test mode whenever the ic chip is powered-on such that, during the stress mode, the test block operates at a higher voltage level than an on-chip functional block and such that, during the test mode, the test block operates at a same voltage level as the functional block and is subjected to testing.
03/27/14
20140087676
On-chip distributed power amplifier and on-chip or in-package antenna for performing chip-to-chip and other communications
A transmitter front-end for wireless chip-to-chip communication, and potentially for other, longer range (e.g., several meters or several tens of meters) device-to-device communication, is disclosed. The transmitter front-end includes a distributed power amplifier capable of providing an output signal with sufficient power for wireless transmission by an on-chip or on-package antenna to another nearby ic chip or device located several meters or several tens of meters away.
03/27/14
20140087521
Wafer level chip scale packaging
An improved wafer level chip scale packaging technique is described which does not use an encapsulated via to connect between a redirection layer and a pad within the pad ring on the semiconductor die. In an embodiment, a first dielectric layer is formed such that it terminates on each die within the die's pad ring.
03/27/14
20140087520
Method of manufacturing semiconductor device
To improve the reliability in applying a tape to the rear surface of a substrate while securing the heat resistance of the tape applied to the rear surface of the substrate. There is a gap between a bottom surface of a ditch provided in a support member and an upper surface of a driver ic chip.
03/27/14
20140087498
Method of manufacturing light-emitting device
A method of manufacturing a light-emitting device includes mounting an led chip on a bottom surface of a recessed portion of a case, and after mounting the led chip, forming a highly-reflective sidewall so as to be in contact with side surfaces and the bottom surface of the recessed portion and to be spaced from the led chip. The highly-reflective sidewall includes a higher light reflectance than the side surfaces of the recessed position of the case and an outwardly convex surface as a surface exposed in the recessed portion..
03/27/14
20140087370
Sample treatment device, sample treatment method, and reaction container for use therein
Reaction containers (110) each comprising a plurality of treatment parts (wells) (501-506) are placed side by side in a reaction container set so as to be movable independently of each other in the direction of arrangement of the treatment parts (wells). A plurality of stems (401) correspond to the respective reaction containers (110) and are disposed above the reaction containers to be vertically movable and disposed in the direction crossing the direction of movement of the reaction containers.
03/27/14
20140087359
Methods and devices for sample lysis
Disclosed herein are methods and systems for use in preparing a sample. The methods and systems may be used for lysing one or more structures in a sample (e.g., cells, viral particles, etc.).
03/27/14
20140085927
Linear light source and planar light source
A linear light source includes a plurality of led chips that are linearly arranged along a first direction, and a reflector including a first tapered sidewall sandwiching the led chips in the first direction and a second tapered sidewall sandwiching the led chips in a second direction intersecting with the first direction. The led chips are surrounded by first tapered sidewall and second tapered sidewall, and the second tapered sidewall is lower than the first tapered sidewall..
03/27/14
20140085884
Led lighting apparatus
An led lighting apparatus is disclosed. The led lighting apparatus includes a board having a principal surface, a plurality of led chips mounted on the principal surface of the board, and a wiring pattern which is formed on the principal surface of the board and makes electrical conduction with the plurality of led chips.
03/27/14
20140085349
Source driver ic chip
A source driver ic chip, designed to prevent flicker in images displayed on a display panel while suppressing power consumption and heat generation, includes: a reference gradation voltage generating part (220) configured to generate a reference gradation voltage based on a first or second gamma characteristic of the display panel, using first and second power supply voltages (vh) and (vl) inputted through first and second external terminals (pa2, pa3); and a third external terminal (pa4) for externally outputting said reference gradation voltage. The source driver ic chip further includes first and second gradation voltage generating parts configured to generate first and second gradation voltages respectively, using a reference gradation voltage based on a first gamma characteristic inputted through a fourth external terminal and a reference gradation voltage having a second gamma characteristic inputted through a fifth external terminal respectively..
03/27/14
20140084453
Overcoming chip warping to enhance wetting of solder bumps and flip chip attaches in a flip chip package
Structures and methods for forming good electrical connections between an integrated circuit (ic) chip and a chip carrier of a flip chip package include forming one of: a tensile layer on a front side of the ic chip, which faces a tops surface of the chip carrier, and a compressive layer on the backside of the ic chip. Addition of one of: a tensile layer to the front side of the ic chip and a compressive layer the backside of the ic chip, may reduce or modulate warpage of the ic chip and enhance wetting of opposing solder surfaces of solder bumps on the ic chip and solder formed on flip chip (fc) attaches of a chip carrier during making of the flip chip package..
03/27/14
20140084434
Semiconductor device
A semiconductor device is reduced in size. The semiconductor device includes a die pad, a plurality of leads arranged around the die pad, a memory chip and a power source ic chip mounted over the die pad, a logic chip mounted over the memory chip, a plurality of down bonding wires for connecting the semiconductor chip to the die pad, a plurality of lead wires for connecting the semiconductor chip to leads, and a plurality of inter-chip wires.
03/27/14
20140084326
Light-emitting diode and manufacturing method thereof
A light-emitting diode includes a ceramic substrate, an electrode group setting on the substrate and co-fired with the ceramic substrate, an led chip setting on the substrate and electrically connecting the electrode group. The electrode includes a first electrode and a second electrode spacing from the first electrode.
03/27/14
20140084315
Light emitting diode package and method for manufacturing the same
An exemplary light-emitting diode (led) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of led chips electrically connecting with the electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes.
03/27/14
20140084313
Light emitting diode package and method for manufacturing the same
An exemplary light-emitting diode (led) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of led chips electrically connecting with electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes.
03/27/14
20140084312
Light emitting diode package and method for manufacturing the same
An light-emitting diode (led) package includes a substrate, a electrode structure embedded in the substrate, and a plurality of led chips electrically connecting with the electrode structure. The substrate includes a main portion and a protruding portion extending from a bottom surface of the main portion.
03/27/14
20140084311
Light-emitting device
The present invention provides a light-emitting device which includes a plurality of led chips mounted on a chip mount surface of a substrate provided with a wiring pattern. In the light-emitting device, the wiring pattern is provided so as to meet the following conditions (a), (b), and (c).


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