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Chip-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Light-emitting diode (led) light sets
October 12, 2017 - N°20170295622

Apparatuses and systems are provided for changing the spectrum of light emission from a light-emitting diode (led) light set. The led light set may include leds, each of which having at least a first led chip and a second led chip configured to emit light at differing wavelengths. The first and second led chips may be connected in series with ...
Package with integrated infrared and flash leds
Peel Technologies, Inc.
October 12, 2017 - N°20170295340

Disclosed is an integrated led package for a client device. The integrated led package includes a flash led chip, an ir led chip, and an optional reflective element. The ir led chip includes an ir led that emits a cone of ir light, for example, to send commands to another client device such as a tv, to control the tv. ...
Methods and apparatus for processing in a network on chip (noc)
Advanced Micro Devices, Inc.
October 12, 2017 - N°20170295111

Methods and apparatus of delegating instructions or data from a cu to an noc node in a network on chip (noc) is disclosed. The noc node executes the delegated instructions or processes the delegated data. An noc controller (ncc), which is operatively coupled to the cu and the noc node, facilitates delegating the instructions or data from the cu to ...
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Led module
Rohm Co., Ltd.
October 12, 2017 - N°20170294567

An led module according to the present invention includes an led unit 2 and a case 1, where the led unit includes an led chip 21, and the case 1 includes a main body 11 made of a ceramic material and a pad 12a on which the led unit 2 is mounted. The outer edge 121a of the pad 12a is positioned inward of the outer ...
Light-emission device
Sharp Kabushiki Kaisha
October 12, 2017 - N°20170294562

An led light-emission device includes a substrate, an led chip, a phosphor-containing resin containing a phosphor and covering the led chip, and a diffusing agent-containing resin containing a diffusing agent that diffuses light emitted from the phosphor-containing resin and sealing the phosphor-containing resin. The led chip, the phosphor-containing resin, and the diffusing agent-containing resin are placed on a same flat ...
Manufacturing method of light-emitting device
Epistar Corporation
October 12, 2017 - N°20170294553

A manufacturing method of light-emitting device is disclosed. The method includes providing an led wafer comprising a substrate and a semiconductor stack formed on the substrate, wherein the semiconductor stack has a lower surface facing the substrate and an upper surface opposite to the lower surface; providing a first laser to the led wafer and irradiating the led wafer from ...
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Chip Patent Applications
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  • 242+ full patent PDF documents of Chip-related inventions.
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Method of producing optoelectronic modules and an assembly having a module
Osram Opto Semiconductors Gmbh
October 12, 2017 - N°20170294428

A method produces a plurality of optoelectronic modules, and includes: a) providing a metallic carrier assembly with a plurality of carrier units; b) applying a logic chip, each having at least one integrated circuit, to the carrier units; c) applying emitter regions that generate radiation, which can be individually electrically controlled; d) covering the emitter regions and the logic chips ...
Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate
Infineon Technologies Ag
October 12, 2017 - N°20170294403

Electronic module (100), which comprises a first substrate (102), a first dielectric layer (104) on the first substrate (102), at least one electronic chip (106), which is mounted with a first main surface (108) directly or indirectly on partial region of the first dielectric layer (104), a second substrate (110) over a second main surface (114) of the at least one electronic chip (106), and an electrical contacting (116) for the ...
Flat no-leads package with improved contact pins
Microchip Technology Incorporated
October 12, 2017 - N°20170294367

According to an embodiment of the present disclosure, a method for manufacturing an integrated circuit (ic) device may include mounting an ic chip onto a center support structure of a leadframe. The leadframe may include: a plurality of pins extending from the center support structure; a groove running perpendicular to the individual pins of the plurality of pins around the ...
Single command, multiple column-operation memory device
Rambus Inc.
October 12, 2017 - N°20170293552

A memory access command, column address and plurality of write data values are received within an integrated-circuit memory chip via external signaling links. In response to the memory access command, the integrated-circuit memory chip (i) decodes the column address to select address-specified sense amplifiers from among a plurality of sense amplifiers that constitute a sense amplifier bank, (ii) reads first ...
Particle manipulation and trapping in microfluidic devices using two-dimensional material
International Business Machines Corporation
October 12, 2017 - N°20170292934

Method, apparatus, and computer program product for a microfluidic channel having a cover opposite its bottom and having electrodes with patterned two-dimensional conducting materials, such as graphene sheets integrated into the top of its bottom. Using the two-dimensional conducting materials, once a fluid sample is applied into the channel, highly localized modulated electric field distributions are generated inside the channel ...
Control infrastructure for automotive applications
Infineon Technologies Ag
October 12, 2017 - N°20170292467

Embodiments of the present disclosure relate to a control infrastructure and relates systems and devices for controlling automotive components associated with a first domain of automotive components. In accordance with one exemplary embodiment the system comprises a performance cluster chip, at least a first peripheral integrated circuit (ic) chip, and a digital real-time communication link connecting the performance cluster chip ...
Insect trap using uv led lamp
Seoul Viosys Co., Ltd.
October 12, 2017 - N°20170290320

The present disclosure relates to an insect trap using an ultraviolet light-emitting diode (uv led) lamp, and more particularly, to an insect trap using, in place of a conventional uv light source lamp, a uv led lamp that significantly increases the insect trapping efficiency. The insect trap according to the present disclosure includes: a uv led lamp disposed in an ...
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Led package structure and led light-emitting device
Kaistar Lighting (xiamen) Co., Ltd.
October 05, 2017 - N°20170288099

The present disclosure provides a led package structure and a led light-emitting device. The led package structure comprises a led chip and a wavelength converting layer covering the led chip. The wavelength converting layer contains red phosphor, which has lower amount in edge portion than in center portion. It is possible to avoid direct or indirect excitation for generating red ...
Display device and display module
Wuhan China Star Optoelectronics Technology Co., Ltd.
October 05, 2017 - N°20170288097

A display device and a display module. The display module includes: a blue led chip, a yellow phosphor layer and a colour filter. A peak wavelength of a blue light emitted from the blue led chip is in a range of 460±5 nm. The blue led chip excites the yellow phosphor layer to emit a white light. The colour filter ...
Led lighting apparatus
Rohm Co., Ltd.
October 05, 2017 - N°20170287884

An led lighting apparatus includes an led substrate, a led chip, a sealing resin member, and a reflecting face. The led substrate has a main surface. The led chip is mounted on the main surface of the led substrate. The sealing resin member is made of a material that transmits light from the led chip. The sealing resin member covers ...
Baseplate for an electronic module and method of manufacturing the same
Infineon Technologies Ag
October 05, 2017 - N°20170287798

Various embodiments provide an electronic module comprising a baseplate. A recess is formed in one main surface of the baseplate, wherein the recess is adapted to accommodate an electronic chip. The electronic chip is attached to a substrate or carrier and is placed in the recess.
Method and circuit for self-training of a reference voltage and memory system including the same
Samsung Electronics Co., Ltd.
October 05, 2017 - N°20170287535

A semiconductor device, includes at least a first memory chip, which includes at least a first buffer connected to receive an input signal and a reference voltage; at least a first reference voltage generator configured to output a reference voltage based on a first control code; and at least a first self-training circuit for determining an operational reference voltage to ...
Adjustable backlight module
Wuhan China Star Optoelectronics Technology Co., Ltd.
October 05, 2017 - N°20170287412

An adjustable backlight module comprises an image data gathering device; a user data gathering device; a data analyzing device connected to the image data gathering device and the user data gathering device; a controller connected to the data analyzing device; and a lcd backlight source connected to the controller. Based on the user's demands on the image brightness and color ...
Storage device
Kabushiki Kaisha Toshiba
October 05, 2017 - N°20170286000

According to one embodiment, there is provided a storage device including a control chip and a plurality of memory chips. The control chip has an input buffer common to the control chip and the plurality of memory chips and electrically connected to an external terminal. A first transmission path going through the input buffer and a second transmission path not ...
Mqw devices & methods for semiconductor patterning systems
Samsung Electronics Co., Ltd.
October 05, 2017 - N°20170285486

Mqw devices, ic chips and methods may be used in semiconductor lithography patterning systems. An mqw device includes an array of pixels that have transmission elements and associated support circuits. The support circuits have preliminary memory cells and final memory cells. The final memory cells store transmittance values that control transmittances of the associated transmission elements. This way, exposure of ...
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