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Caps patents



      
           
This page is updated frequently with new Caps-related patent applications. Subscribe to the Caps RSS feed to automatically get the update: related Caps RSS feeds. RSS updates for this page: Caps RSS RSS


Panel-molded electronic assemblies

Vlt

Panel-molded electronic assemblies

Electronic module subassemblies and methods for fabricating the same

Charles Stark Draper Laboratory

Electronic module subassemblies and methods for fabricating the same

Electronic module subassemblies and methods for fabricating the same

Telefonaktiebolaget L M Ericsson (publ)

Enhanced multiplexing for single rlc entity

Date/App# patent app List of recent Caps-related patents
06/25/15
20150181727
 Panel-molded electronic assemblies patent thumbnailPanel-molded electronic assemblies
A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g.
Vlt, Inc.
06/25/15
20150181719
 Panel-molded electronic assemblies patent thumbnailPanel-molded electronic assemblies
A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g.
Vlt, Inc.
06/25/15
20150181709
 Electronic module subassemblies and methods for fabricating the same patent thumbnailElectronic module subassemblies and methods for fabricating the same
An electronic module subassembly including a substrate. The substrate includes a bottom laminate, a middle laminate coupled to the bottom laminate, and a top laminate coupled to the middle laminate.
The Charles Stark Draper Laboratory, Inc.
06/25/15
20150181468
 Enhanced multiplexing for single rlc entity patent thumbnailEnhanced multiplexing for single rlc entity
A method and apparatus for interrupting the lower priority packet transmission/reception for higher priority packet transmission/reception within the context of a common rlc entity is provided herein. The transmission/reception of lower priority data blocks containing data segments of a first higher layer packet is interrupted to transmit/receive higher priority data blocks containing data segments of a second higher layer packet.
Telefonaktiebolaget L M Ericsson (publ)
06/25/15
20150181457
 Enhanced multiplexing for single rlc entity patent thumbnailEnhanced multiplexing for single rlc entity
A method and apparatus for interrupting the lower priority packet transmission/reception for higher priority packet transmission/reception within the context of a common rlc entity is provided herein. The transmission/reception of lower priority data blocks containing data segments of a first higher layer packet is interrupted to transmit/receive higher priority data blocks containing data segments of a second higher layer packet.
Telefonaktiebolaget L M Ericsson (publ)
06/25/15
20150181309
 Bit indexed explicit replication for professional media networks patent thumbnailBit indexed explicit replication for professional media networks
Various systems and methods for performing bit indexed explicit replication (bier). For example, one method involves receiving a first bit string at a node, encapsulating a packet with the first bit string, and forwarding the packet.
Cisco Technology, Inc.
06/25/15
20150180959
 Network interface controller supporting network virtualization patent thumbnailNetwork interface controller supporting network virtualization
A network interface device includes a host interface for connection to a host processor having a memory. A network interface is configured to transmit and receive data packets over a data network, which supports multiple tenant networks overlaid on the data network.
Mellanox Technologies Ltd.
06/25/15
20150180663
 Method and  performing secure voice call patent thumbnailMethod and performing secure voice call
A method and apparatus for performing a secure voice call is provided. The method includes generating an encryption key to be used in the secure voice call, encapsulating the encryption key using a pre-agreed upon master key, generating at least one dedicated frame including the encapsulated encryption key, transmitting the at least one dedicated frame in place of at least one voice frame generated by a vocoder to a counterpart user equipment (ue), receiving an acknowledgement (ack) frame indicating successful reception of the encryption key from the counterpart ue, encrypting the at least one voice frame generated by the vocoder using the encryption key and transmitting the encrypted at least one voice frame to the counterpart ue, after receiving the ack frame, and decrypting the at least one voice frame received from the counterpart ue using the encryption key, after receiving the ack frame..
Samsung Electronics Co., Ltd.
06/25/15
20150179989
 Flexible battery pack patent thumbnailFlexible battery pack
The present invention belongs to the technical field of batteries, and more particularly, relates to a flexible battery pack, comprising a packaging film, an electrolyte filled in the packaging film, and at least two electrically-connected cells encapsulated in the packaging film, wherein at least one of the cells is a flexible cell. Compared with the prior art, the flexible battery pack in the present invention is provided with a flexible cell that serves as the flexible part, so that cell bends at the flexible part so as to avoid the effect of stress on the performances of the cells, improve the stability of the cells and improve the bendability of the battery pack.
Dongguan Amperex Technology Limited
06/25/15
20150179970
 Encapsulation structure and encapsulating  oled device patent thumbnailEncapsulation structure and encapsulating oled device
An encapsulation structure for oled device comprises a glass substrate, a glass cover plate, an oled device and a sealing layer. The glass substrate has a recessed portion, the glass cover plate is located at an opening of the recessed portion, and a periphery of the glass cover plate and the glass substrate are bonded through a frit barricade formed by melted glass powders, so that the glass cover plate and the glass substrate have an integral structure, a closed cavity is formed by the glass cover plate and the recessed portion, and both the oled device and the sealing layer are located within the closed cavity.
Boe Technology Group Co., Ltd.
06/25/15
20150179903

Led package with multiple element light source and encapsulant having curved and/or planar surfaces


Led packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The led package are also directed to features or arrangements that allow for improved or tailored emission characteristic for led packages according to the present invention.
Cree, Inc.
06/25/15
20150179898

Led module


A led module includes a substrate, a led chip supported on the substrate, a metal wiring installed on the substrate, the metal wiring including a mounting portion on which the led chip is mounted, an encapsulating resin configured to cover the led chip and the metal wiring, and a clad member configured to cover the metal wiring to expose the mounting portion, the encapsulating resin arranged to cover the clad member.. .
Rohm Co., Ltd.
06/25/15
20150179645

Semiconductor device with epitaxial structures


A semiconductor device includes at least two fin-shaped structures, a gate structure, at least two epitaxial structures and a cap. The fin-shaped structures are disposed on a substrate and are covered by the gate structure.
United Microelectronics Corp.
06/25/15
20150179626

Method of making stacked multi-chip packaging structure


A stacked multi-chip packaging structure comprises a lead frame, a first semiconductor chip mounted on the lead frame, a second semiconductor chip flipped-chip mounted on the lead frame, a metal clip mounted on top of the first and second semiconductor chips and a third semiconductor chip stacked on the metal clip; bonding wires electrically connecting electrodes on the third semiconductor chip to the first and second semiconductor chips and the pins of the lead frame; plastic molding encapsulating the lead frame, the chips and the metal clip.. .
Alpha And Omega Semiconductor Incorporated
06/25/15
20150179620

Semiconductor device


A semiconductor element is sandwiched between a lower and upper surface of a cooling body. A connection circuit and a communication device are provided on the lower surface of the cooling body.
Mitsubishi Electric Corporation
06/25/15
20150179616

Semiconductor device and forming build-up interconnect structures over a temporary substrate


A semiconductor device has a first build-up interconnect structure formed over a substrate. The first build-up interconnect structure includes an insulating layer and conductive layer formed over the insulating layer.
Stats Chippac, Ltd.
06/25/15
20150179611

Three-dimensional package structure and the method to fabricate thereof


The present invention discloses a three-dimensional package structure which can achieve a relatively high utilization of an internal space thereof, so that the size of electronic package structure can be reduced. The three-dimensional package structure comprises a substrate, a first plurality of discrete conductive components and a connecting structure.
Cyntec Co., Ltd.
06/25/15
20150179609

Method for interconnecting die and substrate in an electronic package


A method for interconnecting a die on a substrate of an electronic package. The method includes the steps of forming a plurality of free-end wire bonds on the die, wherein the free-end wire bonds are upstanding from the die, and encapsulating the free-end wire bonds in an encapsulation layer.
The Charles Stark Draper Laboratory, Inc.
06/25/15
20150179597

Semiconductor package and fabrication method thereof


A semiconductor package is provided, which includes: a first electronic element; a plurality of conductive elements formed on the first electronic element; a second electronic element having a plurality of conductive bumps and disposed on the first electronic element through the conductive bumps, wherein the conductive bumps are correspondingly electrically connected to the conductive elements; and an underfill formed between the second electronic element and the first electronic element for encapsulating the conductive bumps and the conductive elements, wherein the underfill contains a plurality of conductive particles having a particle size between 0.1 and 1 um, a plurality of insulating particles having a particle size between 1 and 10 um and a polymer. The invention overcomes the conventional drawback of poor electrical connection between the second electronic element and the first electronic element through the conductive particles so as to enhance the electrical performance of the semiconductor package..
Siliconware Precision Industries Co., Ltd
06/25/15
20150179587

Semiconductor device and forming stress relief layer between die and interconnect structure


A semiconductor device is made by forming a first conductive layer over a sacrificial carrier. A conductive pillar is formed over the first conductive layer.
Stats Chippac, Ltd.
06/25/15
20150179570

Semiconductor device and forming fine pitch rdl over semiconductor die in fan-out package


A semiconductor device has a first conductive layer including a plurality of conductive traces. The first conductive layer is formed over a substrate.
Stats Chippac, Ltd.
06/25/15
20150179544

Semiconductor device and wafer thinning involving edge trimming and cmp


A semiconductor device has a substrate including a plurality of conductive vias formed vertically and partially through the substrate. An encapsulant is deposited over a first surface of the substrate and around a peripheral region of the substrate.
Stats Chippac, Ltd.
06/25/15
20150179515

Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches


Embodiments of the invention describe low capacitance interconnect structures for semiconductor devices and methods for manufacturing such devices. According to an embodiment of the invention, a low capacitance interconnect structure comprises an interlayer dielectric (ild).
06/25/15
20150179482

Producing encapsulating layer-covered semiconductor element and producing semiconductor device


A method for producing an encapsulating layer-covered semiconductor element includes a disposing step of disposing a semiconductor element on a support, an encapsulating step of embedding and encapsulating the semiconductor element by an encapsulating layer in an encapsulating sheet including a peeling layer and the encapsulating layer laminated below the peeling layer and made from a thermosetting resin before complete curing, and a heating step of heating and curing the encapsulating layer after the encapsulating step. The heating step includes a first heating step in which the encapsulating sheet is heated under a normal pressure at a first temperature, a peeling step in which the peeling layer is peeled from the encapsulating layer after the first heating step, and a second heating step in which the encapsulating layer is heated at a second temperature that is higher than the first temperature after the peeling step..
Nitto Denko Corporation
06/25/15
20150179481

Semiconductor device and making embedded wafer level chip scale packages


A semiconductor device includes a carrier and a plurality of semiconductor die disposed over the carrier. An encapsulant is deposited over the semiconductor die.
Stats Chippac, Ltd.
06/25/15
20150179477

Packaged ic devices and associated ic device packaging methods


A method of making packaged integrated circuit (ic) devices includes mixing a waste thermoset polymer material with a thermosetting polymer to form a mixed thermosetting polymer and packaging ic devices in a molding operation using the mixed thermosetting polymer to thereby recycle the waste thermoset polymer material. A packaged ic device includes an ic device and an encapsulating material surrounding the ic device.
Stmicroelectronics, Inc.
06/25/15
20150179425

Adapter for replaceable lamp


Embodiments of the present disclosure generally relate to an improved adapter for simplified lamps for use as a source of heat radiation in a rapid thermal processing (rtp) chamber. In one embodiment, a lamp assembly is provided.
Applied Materials, Inc.
06/25/15
20150179034

Capsule camera with onboard data storage and same


A capsule camera with onboard data storage includes a camera capable of capturing images including an initial image frame and a next image frame. The onboard data storage is capable of storing image data associated with the images.
Omnivision Technologies, Inc.
06/25/15
20150178536

Indicia reading terminals and methods employing light field imaging


A terminal for decoding decodable indicia includes a plenoptic imaging subsystem comprising an image sensor array and plenoptic imaging optics operable to project a plenoptic image of a space containing the decodable indicia onto the image sensor array, a hand held housing encapsulating a least a portion of the plenoptic imaging subsystem, a trigger for initiating operation of the plenoptic imaging subsystem to obtain plenoptic image data of the decodable indicia, and an illumination source for projecting illumination onto the decodable indicia; an aimer for projecting an aimer pattern onto the decodable indicia. The terminal is operable, responsive to detecting that the trigger has been actuated by an operator, to obtain plenoptic image data from the image sensor array, to obtain first rendered image data based on at least a portion of the plenoptic image data, and to attempt to decode the decodable indicia represented in the rendered image data..
Hand Held Products, Inc.
06/25/15
20150177588

Recording medium, image recording device, and image recording set


To provide a recording medium, which contains: a first base; a second base; and an image recording layer disposed between the first base and the second base, wherein the image recording layer has insulating properties, and the image recording layer contains a plurality of microcapsules or cells, each of which encapsulates: electrophoretic particles, or magnetophoretic particles, or a combination thereof; a dispersion medium having a boiling point of 50° c. Or higher; and a thermoreversible gelling agent containing an amide bond (—nhco—) in a molecule thereof..
06/25/15
20150177028

Sensor package and portable terminal having the same


A sensor package may allow a fluid to flow smoothly to thus increase response characteristics. The sensor package may include: a terminal part; at least one electronic element electrically connected to the terminal part through a bonding wire; and a molded part encapsulating the bonding wire and the electronic element and including a sensing portion partially exposing the electronic element and at least one guide portion guiding an ambient fluid to the sensing portion..
Samsung Electro-mechanics Co., Ltd.
06/25/15
20150176770

Led lamp


A tube that is at least partially optically transmissive. An led mounted on a substrate is positioned in the tube and is operable to emit light through the tube when energized through an electrical path.
Cree, Inc.
06/25/15
20150176291

Methods for encapsulating a substrate and products produced from same


Described herein are methods for encapsulating a fiberglass substrate using a calendered film; along with products produced from same. The methods improve the efficiency of the manufacturing process and provide a product with improved performance characteristics..
Armstrong World Industries, Inc.
06/25/15
20150176275

Methods for preparing multilayer composites using calendered films and products produced from same


Described herein are methods for preparing multilayer composites comprising a fiberglass substrate encapsulated, at least in part, by a calendered film; along with products produced from same. The methods improve the efficiency of the manufacturing process and provide a product with improved performance characteristics..
Armstrong World Industries, Inc.
06/25/15
20150175972

Three dimensional matrix for cancer stem cells


Synthetic inert 3d gel culture systems are described that can be finely tuned to exhibit desired and predetermined physical, chemical, mechanical, and biochemical properties. The culture system can be utilized to study the effect of microenvironmental factors on cancer cell response, and in particular on cancer stem cell (csc) response.
University Of South Carolina
06/25/15
20150175800

Epoxy resin composition for semiconductor encapsulation and manufacturing semiconductor device


There are provided an epoxy resin composition for encapsulation, which is particularly suitable for use in resin pre-setting type flip-chip mounting of a cu post chip, and which is capable of suppressing defects due to the generation of voids; and a method for manufacturing a semiconductor device using a cu post chip. The present invention provides an epoxy resin composition for semiconductor encapsulation for flip-chip mounting, which contains an epoxy resin (a), a curing agent (b), a curing accelerator (c), and 3 to 64 parts by weight, relative to 100 parts by weight of the component (a), of thermally thickening resin particles (d) having a volume-average primary particle diameter of 0.2 to 10 μm; and a method for manufacturing a semiconductor device by resin pre-setting type flip-chip mounting of a cu post chip using the composition..
Nagase Chemtex Corporation
06/25/15
20150175528

Macromolecules for treating atherosclerosis


The invention includes compounds of the formula i and formula ii and salts thereof, as well as methods for using the compounds of formula i and formula ii for treating atherosclerosis. The invention also includes compounds of formula iii and (2l) and salts thereof, as well as methods of using the compounds of formula iii and (2l) for treating atherosclerosis.
Rutgers, The State University Of New Jersey
06/25/15
20150175495

Crystal encapsulated nanoparticles methods and compositions


The invention provides methods for encapsulating nanometric particles inside of micro-sized crystals. An exemplary embodiment involves crystallizing a solution including nanometric particles, a micelle-forming material, a nonpolar dispersant for the micelle-forming material and a crystal-forming material to form crystal-encapsulated nanometric particles.
06/25/15
20150175408

Method for thin film encapsulation (tfe) of a microelectromechanical system (mems) device and the mems device encapsulated thereof


A method for thin film encapsulation (tfe) of a microelectromechanical system (mems) device, including providing a substrate; forming a mems device on the substrate; forming one or more etching channels adjacent to the mems device; providing one or more cavities below the mems device; and forming one or more cavities above the mems device.. .
Agency For Science, Technology And Research
06/25/15
20150175347

Portion capsule and producing a beverage by means of a portion capsule


The invention relates to a portion capsule for producing a beverage, comprising a capsule body, which has a capsule bottom and a lid, wherein a cavity for accommodating a powdery or liquid beverage substrate is formed between the capsule bottom and the lid and wherein a filter element is arranged in the cavity. The invention further relates to a method for producing a portion capsule and the use of the portion capsule to produce a beverage..
K-fee System Gmbh
06/25/15
20150175326

Foil capsule, bottle, machine and making score lines in a foil capsule


The machine for making score lines in a foil capsule comprises a rotary element (30) configured for being inserted in the capsule such that the capsule rotates on a longitudinal axis of the capsule when the rotary element (30) rotates, and at least two cutting elements (31, 32), arranged to make the corresponding cutting lines as the rotary element rotates. The cutting elements (31, 32) are arranged in a mounting (33) configured such that it can rock in a plane about a pivoting axis (35), said longitudinal axis being perpendicular to said plane..
06/25/15
20150175289

Activating device for screw caps


A device for activating a screw cap of a container comprises a first holding device for holding the screw cap, and a drive for activating the first holding device, wherein the first holding device is movable in a plane. The first holding device comprises a coupling device for the coupling of an external drive, and therefore the first holding device is movable in the plane..
Ctc Analytics Ag
06/25/15
20150175279

Tamping punch station and filling capsules in a tamping punch station


A tamping punch station for filling capsules in a capsule filling machine is described. The machine includes a rotatably drivable dosing disk with bore holes and a filling device for filling the bore holes.
Fette Engineering Gmbh
06/25/15
20150175115

Cover for inflatable object


The present invention discloses a cover material for an inflatable object such as an air bag. Generally, the cover surrounds the entire inflatable object.
Ccl Label, Inc.
06/25/15
20150174568

Molecularly imprinted catalysts and methods of making and using the same


Molecularly imprinted catalysts are disclosed. The catalysts can include a core and a layer at least partially encapsulating the core.
Empire Technology Development Llc
06/25/15
20150174533

Woven membrane module with controlled tubesheet epoxy wicking


A gas separation membrane module is formed from a woven fabric of weft membrane hollow fibers and warp yarns. The membrane module includes an active hollow fiber region spanning the inner edges of the two tubesheets.
L'air Liquide, Societe Anonyme Pour L'etude Et Exploitation Des Procedes Georges Claude
06/25/15
20150174400

Swallowable capsule and stimulating incretin production within the intestinal tract


Embodiments of the invention provide apparatus and methods for stimulating l cells in the intestinal tract to produce incretins for the treatment of conditions including diabetes and obesity. Many embodiments provide a method and apparatus for the treatment of diabetes by electrically stimulating l-cells to secrete incretins to stimulate or otherwise modulate the production of insulin.
Incube Labs, Llc
06/25/15
20150174318

Microfabricated nanopore device for sustained release of therapeutic agent


A drug delivery device that includes a capsule for implantation into the body; the capsule further includes a reservoir for containing a substance such as a therapeutic agent, at least one port for allowing the substance to diffuse from or otherwise exit the reservoir, and a nanopore membrane in communication with the capsule at or near the exit port for controlling the rate of diffusion of the substance from the exit port. The device also includes an optional screen for providing structural stability to the nanopore membrane and for keeping the pores of the nanopore membrane clear.
Delpor, Inc.
06/25/15
20150174260

Amine-containing transfection reagents and methods for making and using same


There are provided for herein novel amine-containing transfection compounds and methods for making and using same. The compounds are generally obtained by reacting a primary amine with an unsaturated compound.
Life Technologies Corporation
06/25/15
20150174259

Multivalent meningococcal polysaccharide-protein conjugate vaccine


The present invention describes a combined vaccine that offers broad protection against meningococcal disease caused by the pathogenic bacteria neisseria meningitidis. The vaccine is comprised of four distinct polysaccharide-protein conjugates that are formulated as a single dose of vaccine.
Sanofi Pasteur Inc.
06/25/15
20150174220

Novel pharmaceutical preparation for preeclampsia, eclampsia, and toxemia and their related symptoms and related disorders of pregnancy


A therapeutic agent for the treatment of toxemia, preeclampsia and eclampsia and a method for preparing the therapeutic agent are disclosed. The therapeutic agent is a stable pharmaceutical preparation containing, but not limited to, digestive/pancreatic enzymes.
Curemark, Llc
06/25/15
20150174219

Pharmaceutical preparation for the treatment of the symptoms of addiction and diagnosing same


A therapeutic agent for the treatment of the symptoms of addiction and the method for preparing the therapeutic agent is disclosed. The therapeutic agent is a stable pharmaceutical preparation containing, but not limited to, digestive/pancreatic enzymes.
Curemark, Llc
06/25/15
20150174216

Methods for treating adhesive capsulitis


The invention relates to the discovery that collagenase injections are effective in lyse the collagenous adhesions in the shoulder and treat the disorder, adhesive capsulitis. As such, the invention relates to methods of treating or preventing adhesive capsulitis, or frozen shoulder, in a patient in need of such treatment comprising injecting or otherwise delivering an effective amount of collagenase to the collagenous adhesions in the shoulder.
The Research Foundation For The State University Of New York
06/25/15
20150174189

Use of pharmaceutical compositions in preparing pharmaceuticals for treating diabetic ulcer


The use of pharmaceutical compositions in preparing pharmaceuticals for treating diabetic ulcer in limb or on body surface, or in preparing medical dressing. The pharmaceutical compositions consist of (a) 3 to 15% by weight of edible beeswax and (b) 85 to 97% by weight of sesame oil extract of scutellaria root, coptis root, phellodendron bark, earthworm and poppy capsule, based on the total weight of the pharmaceutical compositions.
06/25/15
20150174187

Topical treatment compositions comprising benzoin and olive fruit extract


Disclosed are treatment compositions adapted for application to mammalian skin, which treatment compositions are effective initiators for the generation of human keratinocytes on or within the treated skin, particularly in the locus of the skin wherein the treatment composition has been applied, which treatment composition comprises benzoin and an olive oil extract which contains hydroxytyrosol and/or hydroxytyrosol. In certain preferred embodiments the benzoin and the olive oil extract and/or hydroxytyrosol are microencapsulated..
06/25/15
20150174176

Preparation and the prophylaxis and treatment of osteoporosis and bone fractures


The method for preventing and treating osteoporosis and bone fractures and the preparation for preventing and treating osteoporosis and bone fractures relates to medicine, in particular to agents for the treatment and prevention of conditions associated with various forms of osteoporosis. The method is characterised in that it involves taking between 10 mg and 1000 mg per day of drone brood, between 50 iu and 1,000,000 iu per day of vitamin d or vitamins of this group and/or the active metabolites thereof, and between 25 mg and 3000 mg per day of a calcium compound, so as to be simultaneously supplied to the body daily, and the preparation composed of between 10 mg and 1000 mg of drone brood, between 50 iu and 1,000,000 iu of vitamin d or vitamins of this group and/or the active metabolites thereof and between 25 mg and 3000 mg of a calcium compound, can be in powder, tablet or capsule form.
Obschestvo S Ogranichennoj Otvetsvennost'ju "parafarm"
06/25/15
20150174070

Liposome suspensions, preparing the same, and application thereof


A method for preparing the liposome suspensions comprising liposomes with small particle size and uniform particle size distribution by performing an injection process in combination with a one-step extrusion, and further the liposome suspensions obtainable by this method as well as drug-encapsulating liposomes as well as a system for preparing the said liposome suspensions are disclosed.. .
Pharmosa Limited
06/25/15
20150174018

Fabric and fibre conditioning additives


A fabric, fibre, hair or skin conditioning additive for use in a liquid cleaning product is encapsulated within a shell comprising a silicon-containing polymer network.. .
Dow Corning Corporation
06/25/15
20150174017

Process for preparing silicate shell microcapsules


A process for preparing silicate shell microcapsules comprises adding a water reactive silicon compound to an oil in water emulsion, thereby condensing and polymerizing the water reactive silicon compound to form silicate shell microcapsules having a core comprising the oil phase of the said emulsion. The water reactive silicon compound comprises a tetraalkoxysilane and an alkoxysilane having an amino or quaternary ammonium substituted alkyl group..
Dow Corning Corporation
06/25/15
20150174009

Multi-layer capsule and manufacture method thereof


The present invention provides multi-layer capsules and manufacture methods thereof different materials are added in sequence into a capsule to form a multi-layer capsule without diffusion and/or interaction between layers.. .
Orient Pharma Co., Ltd.
06/25/15
20150174008

Apparatus and process for encapsulating microparticles with liquid in soft gel capsules


The invention provides an apparatus for producing soft gel capsules having encapsulated therein microparticles, nanoparticles and fluids, said apparatus comprising: (a) two spreader boxes; (b) two casting drums; (c) a pair of rotary dies; (d) a liquid fill system (medicine pump system); (e) a wedge for heating gelatine ribbons and feeding said fill; and (f) one or more microgranule or nanogranule feeders located on each side of the rotary dies, said feeders being synchronized to rotate at the same tangential speed as the rotary dies.. .
Procaps Sas


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