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Caps

Caps-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Method for decreasing air leakage between adjacent elements in a data center
Technoguard Inc.
October 12, 2017 - N°20170295674

A method of at least partially filling a gap between adjacent elements in a data center having a hot aisle and a cold aisle to decrease air leakage between the hot aisle and the cold aisle through the gap is provided. The method includes providing a gap filler having a compressible material and an outer layer having an outer surface ...
Multi-phase heat dissipating device for an electronic device
Qualcomm Incorporated
October 12, 2017 - N°20170295671

A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall ...
Plasma arc cutting system, including retaining caps, and other consumables, and related operational methods
Hypertherm, Inc.
October 12, 2017 - N°20170295637

The invention features an inner cap for a liquid-cooled plasma arc torch. The inner cap includes a body having a longitudinal axis, a first end, and a second end. The first end includes an annular portion disposed proximate a torch tip. A liquid passage is formed within the body, is shaped to convey a liquid therethrough, and has a first ...
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Smartphone fraud-proof authorization and authentication for secure interactions
Avaya Inc.
October 12, 2017 - N°20170295157

Mobile devices and other devices used in transactions or interactions with other computer systems can be identified by an abstract composite of information unique to the device. For example, the device can record and store when a user first started the device (a date and time of first use), how the device is configured (including any hardware/software identifications, versions, ...
Virtual tunnel endpoints for congestion-aware load balancing
Nicira, Inc.
October 12, 2017 - N°20170295100

Example methods are provided for a source virtual tunnel endpoint (vtep) to perform congestion-aware load balancing in a data center network. The method may comprise the source vtep learning congestion state information associated with multiple paths provided by respective multiple intermediate switches connecting the source vtep with a destination vtep. The method may also comprise the source vtep receiving second ...
Asymmetric multi-destination traffic replication in overlay networks
Cisco Technology, Inc.
October 12, 2017 - N°20170295093

Presented herein are hybrid approaches to multi-destination traffic forwarding in overlay networks that can be used to facilitate interoperability between head-end-replication-support network devices (i. E., those that only use head-end-replication) and multicast-support network devices (i. E., those that only use native multicast). By generally using existing tunnel end-points (teps) supported functionality for sending multi-destination traffic and enhancing the teps to ...
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Conductor unit for rotating electrical machine and rotating electrical machine
Honda Motor Co.,ltd.
October 12, 2017 - N°20170294815

The present invention provides a conductor unit, which hardly generates an insulation-related fault, for a rotating electrical machine, and a rotating electrical machine. A supply line unit (30) of the rotating electrical machine comprises a conductor (35) and a resin part (32) that encapsulates at least a part of the conductor (35), where the resin portion has an air removing portion (51) leading to the ...
Magnetic memory device and techniques for forming
Varian Semiconductor Equipment Associates, Inc.
October 12, 2017 - N°20170294569

A method may include: providing a device stack, the device stack comprising sidewall portions and extending above a substrate base, the device stack further including a plurality of metal layers; depositing an interface layer conformally over the device stack using an atomic layer deposition process, the interface layer comprising a first insulator material; depositing an encapsulation layer on the interface ...
Semiconductor package device and method of manufacturing the same
Advanced Semiconductor Engineering, Inc.
October 12, 2017 - N°20170294564

A semiconductor package device includes an electronic device. The electronic device includes a first carrier, a first electronic component, a second carrier, a second electronic component, an encapsulant, and a lens. The first electronic component is disposed on the first carrier. The second carrier defines an aperture and is disposed on the first carrier. The aperture is positioned over the ...
Semiconductor device package and a method of manufacturing the same
Advanced Semiconductor Engineering, Inc.
October 12, 2017 - N°20170294560

At least some embodiments of the present disclosure relate to a lid for covering an optical device. The lid includes a metal member and a transparent encapsulant. The metal member includes a top surface, a first bottom surface, and a second bottom surface between the top surface and the first bottom surface. The transparent encapsulant is surrounded by the metal ...
Display device and method of manufacturing the same
Lg Display Co., Ltd.
October 12, 2017 - N°20170294493

Disclosed are an organic light emitting display device and a method of manufacturing the same, which reduce a loss of light emitted from an organic light emitting device, increase a lifetime of the organic light emitting device, and decrease consumption power of the organic light emitting display device. The organic light emitting display device includes a first electrode disposed on ...
Package on package (pop) device comprising thermal interface material (tim) in cavity of an encapsulation ...
Qualcomm Incorporated
October 12, 2017 - N°20170294422

A package on package (pop) device includes a first package, a thermal interface material, and a second package coupled to the first package. The first package includes a first integrated device and a first encapsulation layer that at least partially encapsulates the first integrated device, where the first encapsulation layer includes a first cavity located laterally with respect to the ...
Microelectronic packages having stacked die and wire bond interconnects
Invensas Corporation
October 12, 2017 - N°20170294410

A microelectronic package includes at least one microelectronic element having a front surface defining a plane, the plane of each microelectronic element parallel to the plane of any other microelectronic element. An encapsulation region overlying edge surfaces of each microelectronic element has first and second major surfaces substantially parallel to the plane of each microelectronic element and peripheral surfaces between ...
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Semiconductor package structure, package on package structure and packaging method
Advanced Semiconductor Engineering, Inc.
October 12, 2017 - N°20170294389

A semiconductor package structure includes a substrate, a first semiconductor device, a first encapsulant and a second encapsulant. The substrate has a first coefficient of thermal expansion cte1. The first semiconductor device is disposed adjacent to a first surface of the substrate. The first encapsulant is disposed on the first surface of the substrate, and covers at least a portion ...
Fabrication method of semiconductor package
Siliconware Precision Industries Co., Ltd.
October 12, 2017 - N°20170294372

A semiconductor package is provided, which includes: a dielectric layer made of a material used for fabricating built-up layer structures; a conductive trace layer formed on the dielectric layer; a semiconductor chip is mounted on and electrically connected to the conductive trace layer; and an encapsulant formed over the dielectric layer to encapsulate the semiconductor chip and the conductive trace ...
Flat no-leads package with improved contact pins
Microchip Technology Incorporated
October 12, 2017 - N°20170294367

According to an embodiment of the present disclosure, a method for manufacturing an integrated circuit (ic) device may include mounting an ic chip onto a center support structure of a leadframe. The leadframe may include: a plurality of pins extending from the center support structure; a groove running perpendicular to the individual pins of the plurality of pins around the ...
Embedded coil assembly and method of making
Texas Instruments Incorporated
October 12, 2017 - N°20170294263

An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of ...
System and method for navigating drivers to service transportation requests having surge pricing multipliers and ...
Gt Gettaxi Limited
October 12, 2017 - N°20170293925

In one embodiment, a method comprises receiving, at a server comprising at least one processor, a transportation request from a computing device of a passenger, the transportation request specifying a pickup location; and determining, by the server, a surge pricing multiplier and a surge pricing cap for the transportation request based on the pickup location, the surge pricing cap representing ...
Multi-phase heat dissipating device for an electronic device
Qualcomm Incorporated
October 12, 2017 - N°20170293329

A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall ...
Binary ink developer assembly including slots having a slot angle corresponding to a pressure angle
Hewlett-packard Development Company, L.p.
October 12, 2017 - N°20170293244

A binary ink developer assembly includes a plurality of rollers, gears, and end caps. The rollers are in contact with each other to form a nip. Each roller includes a plurality of bearings. The gears include gear teeth. A respective gear has an involute tooth profile and applies a gear force at a pressure angle corresponding to the involute tooth ...
Eye-mountable device to provide automatic accommodation and method of making same
Verily Life Sciences Llc
October 12, 2017 - N°20170293161

An eye-mountable device (emd) includes a lens enclosure, liquid crystal material, first and second electrodes, a substrate, and a controller. The lens enclosure includes a first encapsulation layer and a second encapsulation layer sealed to the first encapsulation layer. The liquid crystal material is disposed across a central region of the lens enclosure. The first electrode is disposed within the ...
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