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Caps patents



      
           
This page is updated frequently with new Caps-related patent applications. Subscribe to the Caps RSS feed to automatically get the update: related Caps RSS feeds. RSS updates for this page: Caps RSS RSS


Implantable transient nerve stimulation device

Robust laser cutting methods for ophthalmic surgery

Date/App# patent app List of recent Caps-related patents
07/17/14
20140200644
 Bioelectric battery for implantable device applications patent thumbnailBioelectric battery for implantable device applications
A bioelectric battery may be used to power implantable devices. The bioelectric battery may have an anode electrode and a cathode electrode separated by an insulating member comprising a tube having a first end and a second end, wherein said anode is inserted into said first end of said tube and said cathode surrounds said tube such that the tube provides a support for the cathode electrode.
07/17/14
20140200626
 Implantable transient nerve stimulation device patent thumbnailImplantable transient nerve stimulation device
The invention generally relates to an implantable, tunable, and bioresorbable medical device for nerve stimulation within a body of a patient for pain management. The medical device includes a substrate, a circuit configured to provide stimulation to a target tissue, and a material surrounding the substrate and the circuit.
07/17/14
20140200563
 Robust laser cutting methods for ophthalmic surgery patent thumbnailRobust laser cutting methods for ophthalmic surgery
A method and apparatus for performing ophthalmic laser surgery using a pulsed laser beam is provided. The method includes establishing an initial cutting pattern comprising a plurality of original photodisruption points, establishing an enhanced cutting pattern comprising a plurality of enhanced photodisruption points selected to decrease potential adverse effects due to patient movement and having increased density over a fixed area as compared with the plurality of original photodisruption points, and performing an ocular surgical procedure according to the enhanced cutting pattern.
07/17/14
20140200516
 Buccal, polar and non-polar spray or capsule containing drugs for treating metabolic disorders patent thumbnailBuccal, polar and non-polar spray or capsule containing drugs for treating metabolic disorders
Buccal aerosol sprays or capsules using polar and non-polar solvent have now been developed which provide biologically active compounds for rapid absorption through the oral mucosa, resulting in fast onset of effect. The buccal polar compositions of the invention comprise formulation i: aqueous polar solvent, active compound, and optional flavoring agent; formulation ii; aqueous polar solvent, active compound, optionally flavoring agent, and propellant; formulation iii: non-polar solvent, active compound, and optional flavoring agent; and formulation iv: non-polar solvent, active compound, optional flavoring agent, and propellant..
07/17/14
20140200509
 Dissolvable microneedles comprising one or more encapsulated cosmetic ingredients patent thumbnailDissolvable microneedles comprising one or more encapsulated cosmetic ingredients
An applicator for applying cosmetic agents into human skin, comprising: (a) a base, (b) a plurality of dissolvable microneedles fixed to said base and projecting therefrom a distance sufficient to penetrate into the skin, said microneedles being made of a material that is capable of disintegration and dispersion into the skin, (c) a cosmetic agent carried by said microneedles for delivery by said microneedles into the skin, and (d) wherein said dissolvable microneedles are configured as a dissolvable exterior shell and said shell encapsulates one or more cosmetic agents.. .
07/17/14
20140200425
 Encapsulated electronics patent thumbnailEncapsulated electronics
An eye-mountable device includes an electrochemical sensor embedded in a polymeric material configured for mounting to a surface of an eye. The electrochemical sensor includes a working electrode and a reference electrode that reacts with an analyte to generate a sensor measurement related to a concentration of the analyte in a fluid to which the eye-mountable device is exposed.
07/17/14
20140200424
 Encapsulated electronics in an eye-mountable device patent thumbnailEncapsulated electronics in an eye-mountable device
An eye-mountable device includes an electrochemical sensor embedded in a polymeric material configured for mounting to a surface of an eye. The electrochemical sensor includes a working electrode and a reference electrode that reacts with an analyte to generate a sensor measurement related to a concentration of the analyte in a fluid to which the eye-mountable device is exposed.
07/17/14
20140200418
 Methods and systems for acoustic data transmission patent thumbnailMethods and systems for acoustic data transmission
A method of communicating with an ingestible capsule includes detecting the location of the ingestible capsule, focusing a multi-sensor acoustic array on the ingestible capsule, and communicating an acoustic information exchange with the ingestible capsule via the multi-sensor acoustic array. The ingestible capsule includes a sensor that receives a stimulus inside the gastrointestinal tract of an animal, a bidirectional acoustic information communications module that transmits an acoustic information signal containing information from the sensor, and an acoustically transmissive encapsulation that substantially encloses the sensor and communications module, wherein the acoustically transmissive encapsulation is of ingestible size.
07/17/14
20140200315
 Microencapsulated curing agent patent thumbnailMicroencapsulated curing agent
A microencapsulated curing agent for use in curing a thermosetting resin is provided. The microencapsulated curing agent includes an organic peroxide curing agent and a polyurethane resin encapsulating the organic peroxide curing agent.
07/17/14
20140200141
 Herbicidal formulation patent thumbnailHerbicidal formulation
A capsule suspension formulation comprising microencapsulated pendimethalin comprising a herbicidally effective amount of pendimethalin being encapsulated within a polymeric wall, said polymeric wall being in-situ formed by an interfacial polymerization reaction occurring between a first phase dispersed in a second phase, at least one of said first and second phases being characterized in comprising a pre-defined amount of at least one alkali or alkaline earth metal salt of an organic acid; and a herbicidally effective amount of a second herbicide.. .
07/17/14
20140200103
Basketball electronics support
A game ball supports electronics. In one implementation, the electronics sense motion of the game ball and are encapsulated by potting compound which forms an encapsulating body sized and shaped to fit within a cavity of the game ball.
07/17/14
20140199800
Luminescent materials that emit light in the visible range or the near infrared range and methods of forming thereof
Luminescent materials and methods of forming such materials are described herein. A method of forming a luminescent material includes: (1) providing a source of a and x, wherein a is selected from at least one of elements of group 1, and x is selected from at least one of elements of group 17; (2) providing a source of b, wherein b is selected from at least one of elements of group 14; (3) subjecting the source of a and x and the source of b to vacuum deposition to form a precursor layer over a substrate; (4) forming an encapsulation layer over the precursor layer to form an assembly of layers; and (5) heating the assembly of layers to a temperature theat to form a luminescent material within the precursor layer..
07/17/14
20140199796
Semiconductor light emitting device and method of manufacturing the same
A method of manufacturing a semiconductor light emitting device includes forming a plurality of semiconductor light emitting devices on a substrate, the semiconductor light emitting devices having at least one electrode pad formed on upper surfaces thereof; forming a conductive bump by forming a bump core on the electrode pad of each of the semiconductor light emitting devices and forming a reflective bump layer enclosing the bump core; forming a resin encapsulating part containing a phosphor on the plurality of semiconductor light emitting devices to encompass the conductive bump; polishing the resin encapsulating part to expose the bump core of the conductive bump to an upper surface of the resin encapsulating part; and forming individual semiconductor light emitting devices by cutting the resin encapsulating part between the semiconductor light emitting devices.. .
07/17/14
20140199452
Liquid flow control and beverage preparation apparatuses, methods and systems
Apparatuses, methods and systems for liquid flow control and beverage preparation are disclosed. The apparatuses, methods and systems of the present invention include liquid flow control and beverage preparation capsules, pods, cartridges, pouches, systems, and modules for controlling and directing flow streams of liquid through a beverage preparation process.
07/17/14
20140199442
Capsule part for a coffee capsule
A coffee capsule which contains a capsule part is configured to receive roasted and ground coffee and is suitable for preparing an espresso beverage using pressurized hot water in an espresso machine. The capsule part is a frustoconical plastics part with a conical side wall and an outwardly protruding peripheral flange integrally formed on the large frustoconical diameter.
07/17/14
20140199433
Polydiorganosiloxane-encapsulated active ingredient, method for the preparation thereof, and chewing gum comprising same
Delayed release in chewing gum of an active ingredient, such as a sweetener or a food acid, is provided by encapsulating solid particles of the active ingredient in a polydiorganosiloxane. The resulting polydiorganosiloxane-encapsulated active ingredient includes a continuous phase with the polydiorganosiloxane and a disperse phase with the solid particles of the active ingredient.
07/17/14
20140199384
Facile route to the synthesis of resorcinarene nanocapsules
Described is a direct method for the fabrication of resorcinarene nanocapsules by photopolymerization of compounds of formula (i), such as resorcinarene tetraalkene tetrathiol (rtatt), in the absence of any template or preorganization. Further, by varying the polymerization media, a variety of other polymeric architectures like lattices, fibrous networks, and nanoparticles were obtained.
07/17/14
20140199374
Methods for preparation of lipid-encapsulated therapeutic agents
Fully lipid-encapsulated therapeutic agent particles of a charged therapeutic agent are prepared by combining a lipid composition containing preformed lipid vesicles, a charged therapeutic agent, and a destabilizing agent to form a mixture of preformed vesicles and therapeutic agent in a destabilizing solvent. The destabilizing solvent is effective to destabilize the membrane of the preformed lipid vesicles without disrupting the vesicles.
07/17/14
20140199297
Triterpene glycoside and triterpene compositions and methods of using same
In the present invention, different strategies are used to improve the bioavailability of triterpene glycosides and triterpenes including, for example, (a) a covalent approach involving modification with polyethylene glycol and (b) a formulation approach involving non-covalent encapsulation in antibody targeted pol(dl-lactic acid) nanoparticles.. .
07/17/14
20140199276
Inkjet printing of tissues and cells
Provided herein is an apparatus for printing cells which includes an electrospinning device and an inkjet printing device operatively associated therewith. Methods of making a biodegradable scaffold having cells seeded therein are also provided.
07/17/14
20140199241
Liposomes comprising polymer-conjugated lipids and related uses
The present invention provides liposomes comprising a lipid bilayer and a polymer-conjugated lipid, wherein said polymer-conjugated lipid is incorporated into said lipid bilayer. The present invention also provides methods of producing the liposomes as well as a method of delivering a nucleic acid to a subject comprising the step of administering said nucleic acid encapsulated in a mixed liposome, a method for performing diagnostic imaging in a subject, comprising the step of administering a diagnostic agent encapsulated in a mixed liposome, and methods for treating, inhibiting, or suppressing a pathological condition in a subject comprising administering to said subject a mixed liposome..
07/17/14
20140198943
Headphone device
A headphone device including a driver unit, and an ear-hook hanger of a loop shape that is integrated with the driver unit and supports an entire circumference of an ear capsule is provided.. .
07/17/14
20140198728
Information transmission method, packet data gateway, and policy and charging rules function
Disclosed are an information transmission method, a packet data gateway, and a policy and charging rules function. The method includes: after receiving a mobile ipv6 support for dual stack hosts and routers (dsmipv6) binding update signaling, a packet data network gateway (p-gw) notifying a source user datagram protocol (udp) port number of the dsmipv6 binding update signaling to a policy and charging rules function (pcrf); and the pcrf notifying the source udp port number of the dsmipv6 binding update signaling to a fixed broadband access network.
07/17/14
20140198528
Wavelength conversion chip for a light emitting diode, and method for manufacturing same
There is provided a method of manufacturing a wavelength converted led chip, including attaching a plurality of led chips to a chip alignment region of an upper surface of a temporary support plate, forming a conductive bump on the electrode of the respective led chips, forming a phosphor-containing resin encapsulation part in the chip alignment region to cover the conductive bump, polishing the phosphor containing resin encapsulation part, forming the wavelength converted led chips by cutting the provided phosphor containing resin encapsulation part between the led chips, the wavelength converted led chip including a wavelength conversion layer obtained from the phosphor containing resin encapsulation part and formed on lateral surfaces and an upper surface of the wavelength converted led chip, and removing the temporary support plate from the wavelength converted led chip.. .
07/17/14
20140198497
Led lamp with light-diffusing end cap
An led lamp includes a plurality of led modules arranged in direction x, a tubular enclosure for housing the led modules that is open at ends spaced from each other in direction x, and end caps respectively closing the ends of the tubular enclosure in direction x. Each of the end caps is configured to diffuse light from the led modules while transmitting the light, and includes an emission surface for emitting light in a direction z perpendicular to direction x.
07/17/14
20140198485
Apparatus and method for encapsulating tritium
A module comprising: one or more vials containing tritium; one or more tritium covers; and an open space within the one or more tritium covers, wherein the one or more vials containing tritium are located within the open space of the one or more tritium covers so that the one or more tritium covers protect the one or more vials containing tritium, and wherein the one or more tritium covers are made from a material that exhibits sufficient strength so that the module protects the one or more vials containing tritium from damage when dropped from a distance of 1 m or more.. .
07/17/14
20140197572
Method for producing a tubular hollow body, and tubular hollow body
The invention relates to a method for producing a tubular hollow body (1) with at least three pipe openings, partly or completely consisting of plastics material. It is provided that a lost core pipe (9), which has a connection opening (13, 14) on each of its ends and has at least one docking opening (11) along its length, is produced, that the core pipe (9) is introduced into a cavity of a mould, with two non-lost core pieces (17, 18) being arranged with one of their ends (3, 4) respectively against the connection openings (13, 14) in a sealing manner and a non-lost core part (19) being arranged with one end against the docking opening (11) in a sealing manner, in that plastics material (25) is then introduced into the mould cavity to encapsulate the core pipe (9), the core pieces (17, 18) and the core part (19) and that, once the plastics material (25) has cured, the core pieces (17, 18) and the core part (19) are withdrawn from the hollow body (1) created.
07/17/14
20140197552
Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit
A chip arrangement is provided, the chip arrangement, including a carrier; at least one chip electrically connected to a carrier top side; an encapsulation material at least partially surrounding the at least one chip and the carrier top side, wherein the encapsulation material is formed on one or more lateral sides of the carrier; and a ceramic material disposed on a carrier bottom side, and on at least one side of the encapsulation material.. .
07/17/14
20140197551
Method for fabricating a semiconductor chip panel
The method comprises providing a carrier, providing a plurality of semiconductor chips, the semiconductor chips each comprising a first main face and a second main face opposite to the first main face and side faces connecting the first and second main faces, placing the semiconductor chips on the carrier with the second main faces facing the carrier, and applying an encapsulation material to the side faces of the semiconductor chips.. .
07/17/14
20140197548
Integrated circuit packaging system with molded grid-array mechanism and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: providing a lead-frame having a metal connector mounted thereon and having a peripheral mounting region; forming an insulation cover on the lead-frame and on the metal connector; connecting an integrated circuit die over the insulation cover; forming a top encapsulation on the integrated circuit die with the peripheral mounting region exposed from the top encapsulation; forming a routing layer, having a conductive land, from the lead-frame; and forming a bottom encapsulation partially encapsulating the routing layer and the insulation cover.. .
07/17/14
20140197536
Package structure and method for manufacturing thereof
The invention provides an electronic device package and method for manufacturing thereof. The electronic device package includes a substrate, an electronic chip, a bonding pad, a first passivation layer, a conductive layer, a second passivation layer, and a solder ball.
07/17/14
20140197526
Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
Methods for making semiconductor devices are disclosed herein. A method configured in accordance with a particular embodiment includes forming a spacer material on an encapsulant such that the encapsulant separates the spacer material from an active surface of a semiconductor device and at least one interconnect projecting away from the active surface.
07/17/14
20140197524
Die package structure
A die packaged structure includes a pad on the central region of the die. A packaged substrate with an opening disposed in the central region, and a connecting terminal is passed through the packaged substrate and disposed around the opening.
07/17/14
20140197523
Chip arrangement and a method for forming a chip arrangement
A chip arrangement is provided, the chip arrangement, including: a carrier; at least one chip including at least one contact pad disposed over the carrier; an encapsulation material at least partially surrounding the at least one chip and the carrier; and at least one low temperature co-fired ceramic sheet disposed over a side of the carrier.. .
07/17/14
20140197444
Light emitting element, backlight module, liquid crystal display device
A light emitting element comprises: a printed circuit board, a chip disposed on a first face of the printed circuit board, a first encapsulation body and a second encapsulation body. The first encapsulation body covers the chip, and the second encapsulation body covers a second face of the printed circuit board or a part of the second face of the printed circuit board.
07/17/14
20140197430
Substrate free led package
A method of fabricating a substrate free light emitting diode (led), includes arranging led dies on a tape to form an led wafer assembly, molding an encapsulation structure over at least one of the led dies on a first side of the led wafer assembly, removing the tape, forming a dielectric layer on a second side of the led wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual led wafer assembly, and singulating the virtual led wafer assembly into predetermined regions including at least one led. The tape can be a carrier tape or a saw tape.
07/17/14
20140197427
A display apparatus substrate having a plurality of organic and inorganic layers stacked
A display apparatus and a method of manufacturing the same includes a substrate including a plurality of organic layers and a plurality of inorganic layers, a display unit formed on the substrate and an encapsulation unit formed on the display, wherein the plurality of organic layers and the plurality of inorganic layers comprise at least a first organic layer, a first inorganic layer, a second organic layer, and a second inorganic layer which are sequentially stacked, and wherein an interfacial adhesion strength of the second organic layer is higher than an interfacial adhesion strength of the first organic layer.. .
07/17/14
20140197355
Method of encapsulating a phase change material with a metal oxide
Storage systems based on latent heat storage have high-energy storage density, which reduces the footprint of the system and the cost. However, phase change materials (pcms), such as nano3, nacl, kno3, have very low thermal conductivities.
07/17/14
20140197177
Apparatus for preserving cooked food palatability
An encapsulated environment is an air-circulation-restricted volume, preferably just large enough to hold a single serving of a cooked, protein containing food product. Restricting the air circulation reduces the evaporation of gases and liquids that are normally lost over time.
07/17/14
20140197094
Filter medium and breather filter structure
Thermoplastic bicomponent binder fiber can be combined with other media, fibers and other filtration components to form a thermally bonded filtration media. The filtration media can be used in filter units, such as breather caps.
07/17/14
20140197067
Multi-level compartmentalized insert for a food holding cabinet having at least one independent sliding compartmentalized tray and cover for same
An insert for a food holding cabinet provides multiple, individual food holding compartments, which can be operated as encapsulated environments. The insert is made from an elongated tray formed to have at least one food product holding compartment, which is formed at one end of the elongated tray.
07/17/14
20140197061
Method and apparatus for beverage capsule storage
A beverage capsule storage apparatus and method of use is described. Embodiments of the beverage capsule storage apparatus are typically comprised substantially of a resilient foam panel having a rectangular shape.
07/17/14
20140197001
Presentation case for transporting, storing and displaying presentation material
A presentation capsule is provided for the display, transport and protection of a2 or a3 sized documents including: a rigid body including at least two body portions configured for opening and closing in locking engagement with each other; a handle portion having different material to the body and formed into and extending from the body; a base also being of different material to the body and formed into and extending from the body; wherein, in combination, the handle portion and base are configured for self-supporting the case on a surface without contact of the body with the surface.. .


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This listing is a sample listing of patent applications related to Caps for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Caps with additional patents listed. Browse our RSS directory or Search for other possible listings.
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