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Caps

Caps-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Multilayer bus board
Interplex Industries, Inc.
February 15, 2018 - N°20180049310

A multilayer bus board comprising a multilayer stacked assembly including a plurality of electrically conductive first layers, and at least one second dielectric layer disposed between adjacent first layers; and a frame formed of a dielectric material, the frame encapsulating at least a portion of the multilayer stacked assembly and mechanically maintaining the first and second layers in secure aligned ...
Camera module and manufacturing method thereof
Ningbo Sunny Opotech Co., Ltd.
February 15, 2018 - N°20180048798

A camera module includes a circuit board, an optical lens, an insulating member, a photosensitive sensor, and an integral encapsulating support structure. The insulating member is disposed on the periphery of a photosensitive area of the photosensitive sensor to prevent the photosensitive sensor from contacting to and being damaged by the formation mold during the forming process of the integral ...
Co-existence of routable and non-routable rdma solutions on the same network interface
Cisco Technology, Inc.
February 15, 2018 - N°20180048569

An example method for simultaneously supporting, on a single vic adapter (i. E. On a single network interface), rdma transport according to multiple roce versions is disclosed. The method includes providing the vic adapter with an indication of a roce version used for a particular rdma connection between two compute nodes identified by a certain qp identifier, and then automatically ...
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Electronic component and method for producing an electronic component
Osram Oled Gmbh
February 15, 2018 - N°20180047936

In various embodiment examples, an electronic component is provided, the electrical component comprising an electrically active area, having a first contact pad; a second contact pad; an organic functional layer structure between the first contact pad and the second contact pad; at least one electrical connection, which is coupled to the first contact pad or to the second contact pad, ...
Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device ...
Lumens Co., Ltd.
February 15, 2018 - N°20180047884

Disclosed herein are a light emitting device package, a backlight unit, an illumination apparatus, and a method of manufacturing a light emitting device package capable of being used for a display application or an illumination application. The light emitting device package includes: a flip-chip type light emitting device having a first terminal and a second terminal installed therebeneath; a substrate ...
Photovoltaic module
Lg Electronics Inc.
February 15, 2018 - N°20180047863

A photovoltaic module includes: a solar laminated assembly; a first glass adhered to one surface of the solar laminated assembly; a back sheet or a second glass adhered to the other surface of the solar laminated assembly; and encapsulant layers adhering the first glass to the solar laminated assembly and adhering the back sheet or the second glass to the ...
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Organic light-emitting display apparatus and method of manufacturing the same
Samsung Display Co., Ltd.
February 15, 2018 - N°20180047793

An organic light-emitting display apparatus includes: an organic light-emitting device including a plurality of sub-pixels respectively emitting lights of different colors; a color filter formed on the organic light-emitting device in a region corresponding to each of the sub-pixels; a spacer color filter formed in the color filter between red, green, and blue color filters at locations corresponding to non-emitting ...
3d ctf integration using hybrid charge trap layer of sin and self aligned sige nanodot
Applied Materials, Inc.
February 15, 2018 - N°20180047743

Provided are an improved memory device and a method of manufacturing the same. In one embodiment, the memory device may include a vertical stack of alternating oxide layer and nitride layer, the vertical stack having a channel region formed therethrough, a plurality of nanostructures selectively formed on nitride layer of the vertical stack, and a gate oxide layer disposed on ...
Light source module, method of manufacturing the module, and backlight unit including the light source ...
Samsung Electronics Co., Ltd.
February 15, 2018 - N°20180047712

Provided are a light source module and a backlight unit (blu) including the same. The light source module includes a substrate including a base plate extending in a first direction and a pair of dam structures stacked on opposing sides of the base plate along a second direction, orthogonal to the first direction, and extending along the base plate in ...
Single-shot encapsulation
Semtech Corporation
February 15, 2018 - N°20180047688

A semiconductor device includes a semiconductor wafer. A plurality of pillar bumps is formed over the semiconductor wafer. A solder is deposited over the pillar bumps. The semiconductor wafer is singulated into a plurality of semiconductor die after forming the pillar bumps while the semiconductor wafer is on a carrier. An encapsulant is deposited around the semiconductor die and pillar ...
Fan-out semiconductor package
Samsung Electro-mechanics Co., Ltd.
February 15, 2018 - N°20180047683

A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface disposed to oppose the active surface; a dummy chip disposed in the through-hole and spaced apart from the semiconductor chip; a second connection member disposed on the ...
Package comprising switches and filters
Qualcomm Incorporated
February 15, 2018 - N°20180047673

A package includes a redistribution portion, a first portion, and a second portion. The first portion is coupled to the redistribution portion. The first portion includes a first switch comprising a plurality of switch interconnects, and a first encapsulation layer that at least partially encapsulates the first switch. The second portion is coupled to the first portion. The second portion ...
Support terminal integral with die pad in semiconductor package (as amended)
Rohm Co., Ltd.
February 15, 2018 - N°20180047659

A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. ...
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Engineered substrate structure and method of manufacture
Quora Technology
February 15, 2018 - N°20180047618

A substrate includes a polycrystalline ceramic core; a first adhesion layer encapsulating the polycrystalline ceramic core; a conductive layer encapsulating the first adhesion layer; a second adhesion layer encapsulating the conductive layer; a barrier layer encapsulating the second adhesion layer, and a bonding layer coupled to the barrier layer, and a substantially single crystalline silicon layer coupled to the bonding ...
Fabrication method of electronic package
Siliconware Precision Industries Co., Ltd.
February 15, 2018 - N°20180047610

An electronic package is provided, including: a circuit structure having opposite first and second surfaces, wherein first and second circuit layers are formed on the first and second surfaces of the circuit structure, respectively, the first circuit layer having a minimum trace width less than that of the second circuit layer; a separation layer formed on the first surface of ...
Support ring with encapsulated light barrier
Applied Materials, Inc.
February 15, 2018 - N°20180047597

Embodiments described herein provide a thermal processing apparatus with a heat source and a rotating substrate support opposite the heat source, the rotating substrate support comprising a support member with a light blocking member. The light blocking member may be an encapsulated component, or may be movably disposed inside the support member. The light blocking member may be opaque and/...
Lead carrier structure and packages formed therefrom without die attach pads
Eoplex Limited
February 15, 2018 - N°20180047588

A lead carrier includes a continuous sheet of mold compound having a top side and an opposing back side, and forms an array of package sites corresponding to semiconductor packages. Each package site when fabricated includes a semiconductor die having a top side, and an opposing treated base exposed at the back side of the continuous sheet of mold compound; ...
Polycrystalline ceramic substrate and method of manufacture
Quora Technology, Inc.
February 15, 2018 - N°20180047557

A method of fabricating a ceramic substrate structure includes providing a ceramic substrate, encapsulating the ceramic substrate in a barrier layer, and forming a bonding layer coupled to the barrier layer. The method further includes removing a portion of the bonding layer to expose at least a portion of the barrier layer and define fill regions, and depositing a second ...
Muon-catalyzed fusion on thin-atmosphere planets or moons using cosmic rays for muon generation
February 15, 2018 - N°20180047464

In various units, a coating of chips or pellets comprising a deuterium-containing micro-fusion fuel material produce energetic reaction products and/or em radiation in the presence of an ambient flux of cosmic rays and muons generated from the cosmic rays. The chips may contain solid li6d or encapsulate liquid or frozen d2o. Micro-fusion reactions proceed via muon-catalyzed fusion, ...
Heating plasma for fusion power using electromagnetic waves
Lockheed Martin Corporation
February 15, 2018 - N°20180047463

In one embodiment, a fusion reactor includes two internal magnetic coils suspended within an enclosure, a center magnetic coil coaxial with the two internal magnetic coils and located proximate to a midpoint of the enclosure, a plurality of encapsulating magnetic coils coaxial with the internal magnetic coils, and two mirror magnetic coil coaxial with the internal magnetic coils. The fusion ...
Encapsulating magnetic fields for plasma confinement
Lockheed Martin Corporation
February 15, 2018 - N°20180047462

In one embodiment, a fusion reactor includes an enclosure, an open-field magnetic system comprising one or more internal magnetic coils suspended within the enclosure, and one or more encapsulating magnetic coils coaxial with the one or more internal magnetic coils of the open-field magnetic system. The one or more encapsulating magnetic coils form a magnetosphere around the open-field magnetic system. ...
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