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Caps

Caps-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Info coil on metal plate with slot
Taiwan Semiconductor Manufacturing Company, Ltd.
June 15, 2017 - N°20170171979

A structure includes an encapsulating material, and a coil including a through-conductor. The through-conductor is in the encapsulating material, with a top surface of the through-conductor coplanar with a top surface of the encapsulating material, and a bottom surface of the through-conductor coplanar with a bottom surface of the encapsulating material. A metal plate is underlying the encapsulating material. A ...
Method for manufacturing tracer-encapsulated solid pellet for magnetic-confinement fusion
Hamamatsu Photonics K.k.
June 15, 2017 - N°20170171956

The present invention relates to a method for manufacturing a tracer-encapsulated solid pellet for magnetic-confinement fusion, the method comprising a liquid droplet formation step of discharging an organic liquid containing an organic solvent into a stabilizing liquid to thereby form liquid droplets 12, and an organic solvent removal step of removing the organic solvent from the liquid droplets 12a. The organic ...
Guitar amplifier microphone unit
Sennheiser Electronic Gmbh & Co. Kg
June 15, 2017 - N°20170171653

Thus there is provided a guitar amplifier microphone unit including at least one microphone capsule having a respective microphone capsule holder and a frame for holding the at least one microphone capsule holder. The at least one microphone capsule holder is arranged displaceably and/or rotatably on the frame.
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Method for encoding and decoding scheme using time stamp
Nippon Hoso Kyokai
June 15, 2017 - N°20170171365

An encoding device performing an encoding process according to an encoding scheme using a cts indicating time at which presentation or reproduction is performed, comprising: an encapsulator that generates a media unit in which one or more access units encoded by the encoding scheme are capsulated, and a transmitter that transmits information indicating an absolute time of an access unit ...
Method, device, and computer program for encapsulating hevc layered media data
Canon Kabushiki Kaisha
June 15, 2017 - N°20170171282

The invention relates to a method for encapsulating multi-layer partitioned timed media data in a server, the multi-layer partitioned timed media data comprising timed samples, each timed sample being encoded into a first layer and at least one second layer, at least one timed sample comprising at least one subsample, each subsample being encoded into the first layer or the ...
Co-existence of routable and non-routable rdma solutions on the same network interface
Cisco Technology, Inc.
June 15, 2017 - N°20170171075

An example method for simultaneously supporting, on a single vic adapter (i. E. On a single network interface), rdma transport according to multiple roce versions is disclosed. The method includes providing the vic adapter with an indication of a roce version used for a particular rdma connection between two compute nodes identified by a certain qp identifier, and then automatically ...
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Apparatus for transmitting broadcast signals, apparatus for receiving broadcast signals, method for transmitting broadcast signals ...
Lg Electronics Inc.
June 15, 2017 - N°20170171009

A method is provided for receiving broadcast signals. The broadcast signals are received. The received broadcast signals are demodulated by an orthogonal frequency division multiplex (ofdm) scheme, a signal frame is parsed from the demodulated broadcast signals, data is decoded in the parsed signal frame to output baseband packets, the baseband packets are output-processed to output link layer packets, and ...
Method and system for virtual and physical network integration
Nicira, Inc.
June 15, 2017 - N°20170170989

The disclosure herein describes a virtual extensible local area network (vxlan) gateway. During operation, the vxlan gateway receives, from a physical host, an ethernet packet destined for a virtual machine residing in a remote layer-2 network broadcast domain that is different from a local layer-2 network broadcast domain where the physical host resides. The vxlan gateway then determines a vxlan ...
Foldable fabric-based packaging solution
Intel Corporation
June 15, 2017 - N°20170170676

Methods, systems, and apparatuses for a foldable fabric-based semiconductor package (ffp) that can assist with charging a secondary cell are described. An ffp includes: a ground plane; a first component over the ground plane; a second component adjacent to the ground plane; a third component adjacent to the second component; a molding compound encapsulating the ground plane, the first component, ...
Anode compositions and alkali metal batteries comprising same
Ramot At Tel-aviv University Ltd.
June 15, 2017 - N°20170170473

A composition-of-matter comprising a plurality of particles is disclosed herein, the particles comprising a compound (e. G., an element or a mixture of elements) which forms an alloy with an alkali metal and/or an alloy of an alkali metal with said compound. The alloy is characterized by reversibly releasing the alkali metal and absorbing the alkali metal. Some or ...
Display apparatus and apparatus for and method of manufacturing the display apparatus
Research & Business Foundation Sungkyunkwan University
June 15, 2017 - N°20170170429

A display apparatus and an apparatus for and method of manufacturing the display apparatus. The display apparatus includes: a substrate; a display unit formed on the substrate; and a thin film encapsulation layer formed on the display unit. The thin film encapsulation layer includes an inorganic layer, and the inorganic layer includes a first sub-inorganic layer including a compound oxide ...
Encapsulation film and organic electronic device including the same( as amended)
Lg Chem, Ltd.
June 15, 2017 - N°20170170427

Provided are an encapsulation film, an organic electronic device (oed) comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects ...
Encapsulation film and organic electronic device including the same (as amended)
Lg Chem, Ltd.
June 15, 2017 - N°20170170426

Provided are an encapsulation film, an organic electronic device (oed) comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects ...
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Carrier, carrier leadframe, and light emitting device and method for manufacturing same
Everlight Electronics Co., Ltd.
June 15, 2017 - N°20170170376

A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light ...
Light emitting diode package structure and manufacturing method thereof
Everlight Electronics Co., Ltd.
June 15, 2017 - N°20170170368

A light emitting diode package structure including a base, a light emitting diode and an encapsulant is provided. The light emitting diode is disposed on a surface of the base and is adapted to generate and emit a light. The encapsulant is disposed on the base and encapsulates the light emitting diode. The encapsulant has a surface parallel to the ...
Silicon-on-nothing transistor semiconductor structure with channel epitaxial silicon-germanium region
Stmicroelectronics, Inc.
June 15, 2017 - N°20170170299

An improved transistor with channel epitaxial silicon and methods for fabrication thereof. In one aspect, a method for fabricating a transistor includes: forming a gate stack structure on an epitaxial silicon region, a width dimension of the epitaxial silicon region approximating a width dimension of the gate stack structure; encapsulating the epitaxial silicon region under the gate stack structure with ...
Flexible display apparatus
Samsung Display Co., Ltd.
June 15, 2017 - N°20170170255

A flexible display apparatus includes a display substrate including a light-emitting area, and a non-emitting area including a bending area foldable in a folding direction outside of the light-emitting area, and a pad area outside of the bending area, a thin film encapsulation layer over the light-emitting area, and a driver inside a curvature portion of the display substrate at ...
Display device
Samsung Display Co., Ltd.
June 15, 2017 - N°20170170253

A display device is disclosed. In one aspect, the display device includes a flexible substrate including a first region, a second region separated from the first region, and a bending region positioned between the first and second regions. The bending region is configured to be bent so as to have a plurality of different curvatures depending on degrees of bending ...
Organic light-emitting display device
Lg Display Co., Ltd.
June 15, 2017 - N°20170170247

Described herein is an organic light-emitting display (oled) device, comprising: a first substrate comprising an array of pixels; a second substrate facing the first substrate and comprising a color layer corresponding to each pixel in the array of pixels, and comprising a black matrix separating each pixel in the array of pixels from one another; a filler layer between the ...
Display device and manufacturing method of the same
Samsung Display Co., Ltd.
June 15, 2017 - N°20170170242

A display device includes a first substrate including a first area and a second area, light emitting elements arranged in the first area, connecting pads arranged in the second area, a thin film encapsulation layer arranged on the light emitting elements, a second substrate including a third area and a fourth area, sensing pads arranged in the fourth area, a ...
Semiconductor device and method
Taiwan Semiconductor Manufacturing Company, Ltd.
June 15, 2017 - N°20170170155

A method and device are provided wherein a first semiconductor device and a via are encapsulated with an encapsulant. A redistribution layer connects the first semiconductor device to a second semiconductor device. In a particular embodiment the first semiconductor device is an integrated voltage regulator and the second semiconductor device is a logic device such as a central processing unit.
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