Follow us on Twitter
twitter icon@FreshPatents


Caps patents

      

This page is updated frequently with new Caps-related patent applications.




 Method for the electrical passivation of electrode arrays and/or conductive paths in general, and a  producing stretchable electrode arrays and/or stretchable conductive paths in general patent thumbnailMethod for the electrical passivation of electrode arrays and/or conductive paths in general, and a producing stretchable electrode arrays and/or stretchable conductive paths in general
A method produces a conductive paste comprising 15-20% by weight of pdms and 80-85% by weight of metallic micro-nano particles, wherein the conductive paste is obtained by repeated addition of singular doses of pdms to a heptane diluted pdms low viscosity liquid containing the metallic micro-nano particles, wherein the heptane fraction is allowed to evaporate after addition of each of the singular doses of pdms. A method forms a conductive path on a support layer, wherein the conductive path is encapsulated by an encapsulation layer comprising at least one via through which at least one portion of the conductive path is exposed, the method comprising filling the at least one via with the conductive paste..
Ecole Polytechnique Federale De Lausanne (epfl)


 Radio network control method and radio network controller patent thumbnailRadio network control method and radio network controller
A radio network control method and a radio network controller are described. The radio network controller includes: a measurement control unit, adapted to receive radio network information sent by a network node, where the radio network information includes radio channel information and service serving information; a radio network information management unit, adapted to determine, according to the radio network information received by the measurement control unit, a radio network function that needs to be triggered and an algorithm corresponding to the radio network function, and encapsulate radio network information required by the algorithm into a radio network information combination for the algorithm; an algorithm management unit, adapted to determine an execution policy of the algorithm; and a procedure management unit, adapted to generate execution control signaling and send the execution control signaling to the network node..
Huawei Technologies Co., Ltd.


 Charging of wireless earbuds patent thumbnailCharging of wireless earbuds
A storage and charging capsule for a pair of wireless earbuds is presented. The storage and charging capsule has a base part, an elongate intermediate part, the intermediate part having a longitudinal major axis, and a cover part being retractable over the intermediate part.
Earin Ab


 Techniques for a switch to receive network controller sideband interface control packets patent thumbnailTechniques for a switch to receive network controller sideband interface control packets
Examples may include receiving, at a switch, an ethernet frame having an ethernet header that may indicate the ethernet frame includes a network controller sideband interface (nc-si) control packet from a management controller at a compute node coupled to the switch. In some examples, a response to a command included in a received nc-si control packet that was encapsulated in an ethernet frame may be processed at the switch and sent to the management controller..
Intel Corporation


 Virtual port channel bounce in overlay network patent thumbnailVirtual port channel bounce in overlay network
Aspects of the subject disclosure provide methods for avoiding a packet bounce event in a virtual port channel (vpc). A method of the technology can include steps for detecting a link failure event (e.g., between a first network device and a destination node), and receiving a data packet addressed to the destination node.
Cisco Technology, Inc.


 Modular light bar messaging system patent thumbnailModular light bar messaging system
Techniques for communicating lighting commands through a controller area network (can) bus of a light bar system include generating a light code message. The light code message has a metadata portion and a value portion.

 Devices and dispensers for sterile coverings for tablet computers and mobile phones patent thumbnailDevices and dispensers for sterile coverings for tablet computers and mobile phones
A sterile cover for a touchscreen device is provided that includes a transparent, electrically conductive screen area adapted to cover a screen of the touchscreen device and including a first sterile material. The sterile cover also includes a perimeter area surrounding the screen region and having an opening adapted to receive the touchscreen device and including a second sterile material.

 Encapsulated semiconductor device package with heatsink opening, and methods of manufacture thereof patent thumbnailEncapsulated semiconductor device package with heatsink opening, and methods of manufacture thereof
Embodiments include packaged semiconductor devices and methods of manufacturing packaged semiconductor devices. A semiconductor die includes a conductive feature coupled to a bottom surface of the die.
Freescale Semiconductor, Inc.


 High temperature spectrally selective thermal emitter patent thumbnailHigh temperature spectrally selective thermal emitter
The present invention enables elective emission from a heterogeneous metasurface that can survive repeated temperature cycling at high temperatures (e.g., greater than 1300 k). Simulations, fabrication and characterization were performed for an exemplary cross-over-a-backplane metasurface consisting of platinum and alumina layers on a sapphire substrate.
Physical Sciences Inc.


 Continuous circuit and fuse protection in high voltage applications exposed to chemically harsh environments patent thumbnailContinuous circuit and fuse protection in high voltage applications exposed to chemically harsh environments
A battery pack, a device for sensing individual battery voltages in a battery pack and protecting the battery pack in the event of a circuit-breaking event, and a method for forming an encapsulant for the voltage-sensing circuit for use in a battery-powered automobile propulsion system. The battery pack includes numerous voltage sensing circuits with surface-mounted fuses and an encapsulant formed around each of the fuses.
Gm Global Technology Operations Llc


Wafer-capped rechargeable power source

Embodiments of the present invention may provide a wafer-capped rechargeable power source. The wafer-capped rechargeable power source may comprise a device wafer, a rechargeable power source disposed on a surface of the device wafer, and a capping wafer to encapsulate the rechargeable power source.
Analog Devices, Inc.

Encapsulation layer thickness regulation in light emitting device

An ink jet process is used to deposit a material layer to a desired thickness. Layout data is converted to per-cell grayscale values, each representing ink volume to be locally delivered.
Kateeva, Inc.

Method for cutting display panel

A method for cutting a display panel is provided by the disclosure. The display panel includes a substrate, a cover plate provided opposite to the substrate, multiple display components sandwiched between the substrate and the cover plate, and encapsulation glue sandwiched between the substrate and the cover plate and surrounding the multiple display components.
Everdisplay Optronics (shanghai) Limited

Touch control organic light-emitting display panel

The present disclosure relates to an organic light-emitting display panel. A dielectric layer having a specific bragg reflector layer structure is disposed between a polarizer and an organic light-emitting diode device or between a polarizer and a touch control panel.
Everdisplay Optronics (shanghai) Limited

Encapsulation structure, encapsulating organic light-emitting diode device, and flexible display device

The present disclosure provides an encapsulation structure, a method for encapsulating an oled device, and a flexible display device. The encapsulation structure includes: a flexible substrate; an oled device arranged on the flexible substrate; a thin film encapsulation layer covering the oled device and including a plurality of first inorganic films and a plurality of organic polymer films arranged alternately; and a second inorganic film having a nanowire structure and covering the thin film encapsulation layer..
Boe Technology Group Co., Ltd.

Display device

Discussed herein is an organic light-emitting display (oled) device that may include an organic light-emitting element layer disposed on a substrate; and an encapsulation layer covering the organic light-emitting element layer to block moisture and/or oxygen from permeating, wherein the encapsulation layer includes a barrier film having at least one transmittance adjusting layer that adjusts a ratio at which light emitted from the organic light-emitting element layer exits the oled device, whereby the use of a polarizer is avoided.. .
Lg Display Co., Ltd.

Optoelectronic component and producing an optoelectronic component

An optoelectronic component may include a carrier, above which a first electrode is formed. An optically functional layer structure is formed above the first electrode.
Osram Oled Gmbh

Magnetresistive random-access memory and fabrication method thereof

Provided are exemplary circuits including a magnetoresistive random-access memory (mram) and methods for fabricating the circuits. In an example, a circuit includes an mram.
Qualcomm Incorporated

Light emitting device package structure and manufacturing method thereof

A light emitting device package structure includes at least one light emitting device, a wavelength conversion adhesive layer, and a protection element. The light emitting device has an upper surface, a lower surface opposite to the upper surface, and a side surface connecting the upper surface and the lower surface.
Genesis Photonics Inc.

Led with remote phosphor and shell reflector

The present disclosure provides a configuration and technique of fabricating remote phosphor optics (such as lenses) for downconverting leds, replacing the prior art solid hemispherical lenses with a novel thin-shell hemispherical lens that can be used with a wide range of encapsulating materials, including low index materials such as air and methyl silicones. The present disclosure further provides a configuration and technique whereby the remote phosphor lenses can be used with an led array..
3m Innovative Properties Company

Thermally enhanced fully molded fan-out module

A method of making a semiconductor device can include providing a temporary carrier with adhesive. A first semiconductor die and a second semiconductor die can be mounted face up to the temporary carrier such that back surfaces of the first semiconductor die and the second semiconductor die are depressed within the adhesive.
Deca Technologies Inc.

Localized redistribution layer structure for embedded component package and method

An embedded component package includes an embedded component substrate. The embedded component substrate includes an electronic component having an active surface including bond pads and a package body encapsulating the electronic component.
Freescale Semiconductor, Inc.

Integrated fan-out stacked sip and the methods of manufacturing

A method includes forming a first through-via from a first conductive pad of a first device die, and forming a second through-via from a second conductive pad of a second device die. The first and second conductive pads are at top surfaces of the first and the second device dies, respectively.
Taiwan Semiconductor Manufacturing Company, Ltd.

Microelectronic package debug access ports

A microelectronic package may be fabricated with debug access ports formed either at a side or at a bottom of the microelectronic package. In one embodiment, the debug access ports may be formed within an encapsulation material proximate the microelectronic package side.
Intel Corporation

Integrated fan-out package and the methods of manufacturing

A method includes forming a through-via from a first conductive pad of a first device die. The first conductive pad is at a top surface of the first device die.
Taiwan Semiconductor Manufacturing Company, Ltd.

Fabricating process for package substrate

A core substrate is prepared first, a bottom redistribution layer rdl1 is formed. Any warpage of the rdl1 is suppressed by the core substrate.

Semiconductor device and manufacture

A device comprising a semiconductor device, a conductive via laterally separated from the semiconductor, an encapsulant between the semiconductor device and the conductive via, and a mark. The mark is formed from characters that are either cross-free characters or else have a overlap count of less than two.
Taiwan Semiconductor Manufacturing Company, Ltd.

Semiconductor package, semiconductor device using the same and manufacturing method thereof

A semiconductor package includes a package substrate, a first electronic component and a second package body. The package substrate includes a first conductive layer, a first pillar layer, a first package body and a second conductive layer, wherein the first pillar layer is formed on the first conductive layer, the first package body encapsulates the first conductive layer and the first pillar layer, and the second conductive layer electrically connects to the first pillar layer.
Mediatek Inc.

Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies

Die (110) and/or undiced wafers and/or multichip modules (mcms) are attached on top of an interposer (120) or some other structure (e.g. Another integrated circuit) and are covered by an encapsulant (160).
Invensas Corporation

Package substrate and manufacturing method thereof

A package substrate includes an encapsulating layer; a circuit pattern having an end embedded in the encapsulating layer; and a conductor disposed on a portion of the encapsulating layer, externally exposed, and electrically connected to the at least one end of the circuit pattern embedded in the encapsulating layer.. .
Samsung Electro-mechanics Co., Ltd.

Semiconductor device and forming repassivation layer for robust low cost fan-out semiconductor package

A semiconductor device comprises a semiconductor die including a conductive layer. A first insulating layer is formed over the semiconductor die and conductive layer.
Stats Chippac Pte. Ltd.

Semiconductor package and manufacturing same

A semiconductor die is electrically connected to the leads of a flagless lead frame and is fully encapsulated by encapsulant to form a semiconductor package. A method of manufacturing the semiconductor package entails encapsulating a flagless lead frame with a first encapsulant such that a top surface of the leads of the flagless lead frame are exposed from the first encapsulant.
Freescale Semiconductor, Inc.

Stacked semiconductor device structure and method

A stacked semiconductor device structure includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a recessed surface portion bounded by opposing sidewall portions extending outward to define a recessed region.
Semiconductor Components Industries, Llc

Semiconductor package

A semiconductor package including an insulating layer, a chip, a thermal interface material, a heat-dissipating cover and a re-distribution layer is provided. The insulating layer has an accommodating opening.
Powertech Technology Inc.

Wafer level chip scale package with encapsulant

A method of processing a semiconductor wafer includes forming a plurality of die in the semiconductor wafer. The semiconductor wafer has a first brittleness.
Freescale Semiconductor, Inc.

Semiconductor device with graphene encapsulated metal and method therefor

A method for forming a semiconductor structure includes forming a first metal layer over a first dielectric layer, forming a first graphene layer on at least one major surface of the first metal layer, and forming a second dielectric layer over the first metal layer and the first graphene layer. The method further includes forming an opening in the second dielectric layer which exposes the first metal layer, forming a second metal layer over the second dielectric layer and within the opening, and forming a second graphene layer on at least one major surface of the second metal layer, wherein the second graphene layer is also formed within the opening..
Freescale Semiconductor, Inc.

Chip fuse and producing same

Provided is a chip fuse and a method for producing the same, which is improved to facilitate balanced release of impact and vapor generated upon fusion. The chip fuse includes a fuse body having a pair of facing upper and lower ceramic substrates, a fuse wire support having a vertical through hole in its center and held between the ceramic substrates, and a fuse wire mounted between the two ends of the fuse wire support across the through hole, and a pair of metal caps fitted on the two ends of the fuse body, wherein the upper ceramic substrate and the fuse wire support, and the lower ceramic substrate and the fuse wire support, are respectively adhered together on their mutually facing surfaces to hermetically close the through hole, partially leaving a non-adhered region on the adhered surfaces..
Kamaya Electric Co., Ltd.

Circuit interrupting device

A vacuum interrupter (1) includes a tubular insulating case (3, 4) extending along a longitudinal axis (aa), two conducting caps (51, 52) each securely fixed at an open end of the tubular insulating case (3, 4) at a sealing area (7) to form a tightly sealed chamber (2). The vacuum interrupter is characterised in that the tubular insulating case (3, 4) is shaped so as to enclose the conducting caps (51, 52) and extend beyond the caps (51, 52) along its longitudinal axis (aa)..
Secheron Sa

Optical fingerprint sensor package

Disclosed are optical sensors, optical fingerprint sensor packages, and methods for forming same. An optical sensor comprises: a substrate; an image sensor disposed over the substrate; a light source disposed over the substrate; a light guide disposed over the image sensor; and, an encapsulant disposed over the light source, wherein the encapsulant is coupled to the light guide and comprises a surface positioned to reflect light emitted from the light source and direct the reflected light into the light guide..
Synaptics Incorporated

Multi-variable signature verification

A database accesses data encapsulating an electronic representation of a signature. The electronic representation includes coordinates that represent the signature.
Biometrics Technology International Inc.

Display panel and display device

A display panel and a display device are disclosed. The display panel includes a first substrate; a first electrode and a second electrode sequentially formed on the first substrate, an organic light emitting layer being interposed between the first electrode and the second electrode and the second electrode being multiplexed as a first pressure detection electrode; a thin film encapsulation layer formed on the first pressure detection electrode, the thin film encapsulation layer comprising at least one organic layer; and a second pressure detection electrode formed on the thin film encapsulation layer, the second pressure detection electrode being multiplexed as a touch detection electrode..
Tianma Micro-electronics Co., Ltd.





Follow us on Twitter
twitter icon@FreshPatents

###

This listing is a sample listing of patent applications related to Caps for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Caps with additional patents listed. Browse our RSS directory or Search for other possible listings.


0.291

file did exist - 2268

1 - 1 - 54