This page is updated frequently with new Caps-related patent applications.
| Multimedia streaming synchronization|
A multimedia system includes a source device for providing a media stream and a sink device for playing the media stream. The source device encapsulates the media stream into data packets with corresponding timestamps associated with a first wall time, and transmits the data packets to the sink device based on the timestamps and the first wall time.
Freescale Semiconductor, Inc.
| Large scale residential cloud based application centric infrastructures|
A first customer edge network device receives an encapsulated packet that includes inner headers comprising source address information for a first service running on a first computing apparatus in a first home cloud and destination address information for a second service running on a second computing apparatus in a second home cloud. The customer edge network device inserts a predetermined portion of bits of a virtual domain identifier of the encapsulated packet into a label to form a virtual domain label for label-based routing.
Cisco Technology, Inc.
| Measuring performance of a network using mirrored probe packets|
Functionality is described herein for measuring the performance of a network. The functionality operates by generating a probe packet and injecting the probe packet into the network.
Microsoft Technology Licensing, Llc
| Network service insertion|
Network service insertion includes determining a tunnel interface corresponding to a service entity to which an incoming packet is to be directed, the tunnel interface being determined based on software defined network (sdn) flow rules. Further, the incoming packet can be encapsulated based on a tunnel configuration corresponding to the tunnel interface to generate an encapsulated packet such that the encapsulated packet includes media access control (mac) address headers and a virtual local area network (vlan) tag associated with the incoming packet.
Hewlett-packard Development Company, L.p.
| Partial cqi feedback in wireless networks|
A lead frame (410) including a die pad (100) for mounting at least one integrated circuit (405) thereon and a plurality of lead fingers (413). The die pad (100) includes a metal including substrate (105) having a periphery that includes a plurality of sides (111-114), an intersection of the sides forming corners (115).
Texas Instruments Incorporated
| Power circuit module|
A power circuit module is provided. The encapsulated power circuit module comprises: a pressure plate comprising a protrusion body; a frame; and a substrate bearing a power circuit, the power circuit comprising at least a power switching device; the frame is provided between the substrate and the pressure plate, the frame supports the pressure plate, and a substantially closed space is formed by the substrate, the pressure plate and the frame; and when an external force is applied on the pressure plate, the protrusion body press against the substrate and is in insulation contact with the substrate, and the external force is transmitted evenly on the substrate..
| Semiconductor device header and semiconductor device|
A semiconductor device header is provided with a base including a main body and a heat sink. A lead is inserted through a through hole extending through the main body.
Shinko Electric Industries Co., Ltd.
| Gelated ionic liquid film-coated surfaces and uses thereof|
The invention relates to an assembly comprising a first gelated ionic liquid film in contact with a first electrically conductive surface, wherein the first gelated ionic liquid film comprises a first ionic liquid encapsulated within a gel matrix; and a second gelated ionic liquid film in contact with a second electrically conductive surface, wherein the second gelated ionic liquid film comprises a second ionic liquid encapsulated within a gel matrix; wherein the first and second gelated ionic liquid films are in contact with each other. There is also described an electrochemical cell comprising an assembly according to the invention, and methods for producing same..
Gelion Technologies Pty Ltd
| Plasma curing of pecvd hmdso film for oled applications|
Methods for forming an oled device are described. An encapsulation layer having a buffer layer sandwiched between barrier layers is deposited over an oled structure.
Applied Materials, Inc.
| Flexible organic light emitting diode display device|
Embodiments relate to a flexible organic light emitting diode (oled) display device and a method for manufacturing the flexible oled display device. The display device includes a multi-layered encapsulation film coving pixel regions of the display device, and a metal layer on or within at least a portion of the encapsulation film, the portion in a bending region of the flexible substrate.
Lg Display Co., Ltd.
Package support, fabrication method and led package
A light-emitting diode (led) package, including: a substrate with front and back surfaces, including: at least two metal blocks; an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and an electrical insulation region between the at least two metal blocks; an led chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and a package encapsulant disposed over the led chip surface and covering at least a portion of the substrate; wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate.. .
Xiamen Sanan Optoelectronics Technology Co., Ltd.
Semiconductor light-emitting device package
A semiconductor light-emitting device package includes: a light-emitting structure having a first surface, a second surface opposite to the first surface and side surfaces disposed between the first and the second surfaces, the light-emitting structure comprising a first light-emitting laminate and a second light-emitting laminate, each of the first and the second light emitting laminates including: a first conductivity-type semiconductor layer; an active layer, and a second conductivity-type semiconductor layer, an interconnector provided on the second surface of the light-emitting structure and configured to electrically connect the first and the second light-emitting laminates; a metal guide surrounding the side surfaces of the light-emitting structure; and an encapsulant surrounding the metal guide and the second and the side surfaces of the light-emitting structure and exposing the first surface of the light-emitting structure.. .
Method and selectively forming nitride caps on metal gate
A sacrificial cap is grown on an upper surface of a conductor. A dielectric spacer is against a side of the conductor.
Package-on-package device and cavity formation by solder removal for package interconnection
In an electronic package that includes an electronic component, a method of forming one or more cavities in the electronic package includes depositing solder material on at least one terminal of the electronic component, encapsulating the electronic component and the solder material in an encapsulant, exposing a top surface of the solder material from the encapsulant, and removing the solder material such that a cavity remains at a location in the encapsulant where the solder material was removed. The solder material can be removed by a hot air solder removal process to yield one or more cavities having a consistent size and shape.
Freescale Semiconductor, Inc.
A semiconductor package includes a support substrate; a stress relaxation layer provided on a main surface of the support substrate; a semiconductor device located on the stress relaxation layer; an encapsulation material covering the semiconductor device, the encapsulation material being formed of an insulating material different from that of the stress relaxation layer; a line running through the encapsulation material and electrically connected to the semiconductor device; and an external terminal electrically connected to the line. Where the support substrate has an elastic modulus of a, the stress relaxation layer has an elastic modulus of b, and the encapsulation material has an elastic modulus of c under a same temperature condition, the relationship of a>c>b or c>a>b is obtained..
Device, package structure and forming the same
Device, package structure and method of forming the same are disclosed. The device includes a die encapsulated by an encapsulant, a conductive structure aside the die, and a dielectric layer overlying the conductive structure.
Taiwan Semiconductor Manufacturing Co., Ltd.
Chip package structure and forming chip package
The present disclosure relates to a chip package structure and a method for forming a chip package. A package unit is formed from the chip and an encapsulant surrounding the chip to have an increased area.
Silergy Semiconductor Technology (hangzhou) Ltd.
Package structures and methods of forming the same
Package structures and methods of forming the same are disclosed. A package structure includes a die, a dielectric layer, an encapsulant and a plurality of supports.
Taiwan Semiconductor Manufacturing Co., Ltd.
Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by the same
An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device encapsulated by the epoxy resin composition, the composition including a base resin; a filler; a colorant; and a thermochromic pigment, wherein a color of the thermochromic pigment is irreversibly changed when a temperature thereof exceeds a predetermined temperature.. .
Samsung Sdi Co., Ltd.
Semiconductor device and balancing surfaces of an embedded pcb unit with a dummy copper pattern
A semiconductor device has a substrate. A conductive via is formed through the substrate.
Stats Chippac Pte. Ltd.
A display device is disclosed. In one aspect, the device includes a substrate including a display area and a non-display area surrounding the display area and a plurality of pixels formed in the display area.
Samsung Display Co., Ltd.
Integrated circuit module for a dual-interface smart card
An integrated circuit (ic) module for a dual-interface smart card includes a planar, non-conductive module tape that is plated on its top surface to define a plurality of conductive contact pads. An ic chip is mounted on the bottom surface of the module tape and is electrically connected to each of the contact pads by a wire, the underside of each contact pad being exposed for bonding with the wire by punching a hole through the tape.
American Banknote Corporation
Automated management of endpoints
Techniques for packaging executable code are described. The techniques involve encapsulating the executable code into an extension that has a generated manifest structure that includes a human readable manifest and a machine readable version of the human readable manifest.
Global storage solution with logical cylinders and capsules
Example apparatus and methods control a data storage system to store data in a self-describing logical data storage capsule using a logical cylindrical recording format. Example apparatus and methods assign a searchable, globally unique identifier to the capsule and associate the globally unique identifier with a user.
Light source modules and the backlight modules with the light source module
A light source module is disclosed. The light source includes: a power supply board; a plurality of led chips arranged on a surface of the power supply board in a matrix; and a light guiding housing arranged above the power supply board, a bottom surface of the light guiding housing is bonded with a surface of the power supply board so as to encapsulate the led chips between the light guiding housing and the power supply board.
Shenzhen China Star Optoelectronics Technology
Light guide plate assembly, side-type backlight source module and display device
A light guide plate assembly comprising: a first substrate which is transparent and positioned on a light-emitting side of the light guide plate assembly; a second substrate which is disposed opposite to the first substrate; and a plurality of light modulation units which are disposed between the first substrate and the second substrate, wherein each of the light modulation units comprises: a first electrode which is disposed adjacent to the first substrate; a second electrode which is disposed adjacent to the second substrate, wherein the first electrode and the second electrode are configured to generate an electric field therebetween; and an electrophoretic capsule layer which is positioned between the first electrode and the second electrode and comprises an electrophoretic capsule containing white electrophoretic particles and black electrophoretic particles which are dispersed in transparent dispersing medium and are oppositely charged.. .
Hefei Xinsheng Optoelectronics Technology Co., Ltd.
Quantum dot films, lighting devices, and lighting methods
Light-emitting quantum dot films, quantum dot lighting devices, and quantum dot-based backlight units are provided. Related compositions, components, and methods are also described.
Combustor liners with rotatable air guiding caps
A combustion liner includes air guiding caps which are respectively engaged to a mounting member and are turned in a flow direction of air so as to collect a fluid flowing around the combustion liner and feed it to the combustion liner, thereby smoothly introducing cooling air into the combustion liner. The combustion liner includes a plurality of through-holes which are formed in a surface of the combustion liner; and a plurality of air guiding caps provided on the combustion liner in plural rows arranged at regular intervals in a circumferential direction.
Doosan Heavy Industries & Construction Co., Ltd.
Led-based light with canted outer walls
An led-based light has an elongate housing having a longitudinal axis and a vertical axis, the housing defined by a base and two canted outer walls meeting opposite the base, the housing defining a cavity. An led circuit board on which a plurality of leds are located is positioned within the cavity.
Fiber-reinforced polymer shell encapsulating piles with concrete columns extending below the earth's surface
Generally, the disclosed technology regards a novel auger annulus adjoinable to a shell useful in encapsulating structural piles to below the earth's surface. The disclosed technology further regards a jacket and auger annulus system useful in encapsulating structural piles.
West Virginia University
Coated articles and methods of making the same
During an example coating method, a metallic substrate is provided. A foundation coat precursor is applied on the metallic substrate.
Gm Global Technology Operations Llc
Hybrid ceramic showerhead
Various implementations of hybrid ceramic faceplates for substrate processing showerheads are provided. The hybrid ceramic showerhead faceplates may include an electrode embedded within the ceramic material of the faceplate, as well as a pattern of through-holes.
Novellus Systems, Inc.
Hepatitis b virus capsid assembly
Cell-free translation and assembly systems allow for hbv capsid assembly under cell-free conditions that also mimic the physiological salt and protein concentrations. These hepatitis virus capsid assembly systems utilize the c-terminal domain (ctd) and n-terminal domain (ntd) of the hepatitis capsid protein in capsid assembly.
The Penn State Research Foundation
High-efficiency perfume capsules
The present application relates to high efficiency particles and compositions, such as consumer products, comprising such high efficiency particles as well as processes for making and using such high efficiency particles and compositions comprising such high efficiency particles. Such high efficiency particles and compositions provide enhanced benefit agent delivery to a situs that is treated with such high efficiency particles and compositions..
The Procter & Gamble Company
Fluid fabric enhancer compositions
Fluid fabric enhancer compositions comprising microcapsules having a cationic, nonionic and/or anionic coating, a formaldehyde source that can comprise components of said microcapsules and a formaldehyde scavenger, as well as processes for making and using such fluid fabric enhancer compositions. Such fluid fabric enhancer compositions contain a formaldehyde scavenging system that provides more consistent formaldehyde scavenging over time..
The Procter & Gamble Company
Encapsulated polymerization initiators, polymerization systems and methods using the same
A polymerizable system includes a curable composition and one or more encapsulated initiator particles. The curable composition can include one or more 1,1-disubstituted alkene compounds and the encapsulated initiator particles can include one or more polymerization initiators encapsulated by a cured composition.
Neisseria meningitidis composition and methods thereof
In one aspect, the invention relates to an isolated polypeptide comprising an amino acid sequence that is at least 95% identical to seq id no: 68. In another aspect, the invention relates to an immunogenic composition including an isolated non-lipidated, non-pyruvylated orf2086 polypeptide from neisseria meningitidis serogroup b, and at least one conjugated capsular saccharide from a meningococcal.
Dissolvable cementitious composite ingredient packet
A packaged composition may include a package made from a water-soluble polymer material. The package may be configured to contain a cementitious composition.
Integrated circuit package with sensor and making
An integrated circuit (“ic”) package comprising an ic die having a top surface and a bottom surface, an elongate member having opposite first and second end portions and a mid portion. The mid portion is positioned proximate the top surface of the ic die.
Texas Instruments Incorporated
A winch system for controlling the elevation of an aerostats restrained by a cable is provided. The system includes a capstan arrangement configured for reducing the tension in a segment of a cable extending between an aerostats side and a drum side thereof; a spool drum configured for wrapping therearound a segment of the cable extending from the drum side of the capstan arrangement; a first drive mechanism configured to selectively activate the capstan arrangement in a released mode, in which the cable is let out towards the aerostats, and a pulling mode in which the cable is pulled in towards the spool drum; and a second drive mechanism configured to rotate the spool drum in the released mode and in the pulling mode such that the segment of the cable extending from the drum side of the capstan arrangement is pulled in a counter direction to the direction of the tension exerted on the cable..
Closure device for bottles with evidence of first opening
The present invention relates to a closure device for bottles with evidence of first opening where before the first opening the closure shows a capsule with a perimetral line, and after the first opening, a separation line visually evidencing said first opening now appears where the perimetral line was previously located.. .
CompaÑÍa De Tapones Irrellenables, S.a.
Metallic screw cap for bottle
The present application describes a metallic screw cap for bottles that comprises a cork section with truncated cone shape joined to the inner surface of the upper end of said cap. The metallic screw cap for bottles described in this invention allows easy implementation, i.e.
Americo Coelho Relvas, Sucessores, S.a.
Unit and filling containers forming single-use capsules for extraction or infusion beverages
Described is a unit for filling containers (2) forming single-use capsules (3) with a dose (33) of product for extraction or infusion beverages, comprising: a line (4) for transport of the containers (2); a station (sr) for filling the containers (2) with a dose (33) of product and comprising: a first containing seat (s1) designed to receive a dose (33) of product; a device (10) for moving the first seat (s); a device (11) for adjusting the position of the first containing seat (s1) between a position (p1) for receiving the dose and a position (p2) for releasing the dose; a substation (st1) for forming the dose (33) inside the first containing seat (s1); a substation (st3) for releasing the dose (33) of product from the first containing seat (s1) to a container (2) transported by the transport line (4), the adjusting device (11) being configured to place the first containing seat (s1) in the receiving position (p1) at the substation (st1) for forming the dose (33) and in the release position (p2) at the substation (st3) for releasing the dose (33).. .
Unit and releasing product for extraction or infusion beverages in containers forming single-use capsules or pods
Described is a unit for releasing product for extraction or infusion beverages in containers (2) forming single-use capsules (3) comprising: at least one seat (s1) for containing a predetermined dose (33) of product having side walls; a device (6) for feeding the product in the containing seat (s1) to define the dose (33); a device (70) for compressing the product in the containing seat (s1); a device (10) for moving the seat (s1) along a closed path (ps); a device (71) for ejecting the dose from the containing seat (s1); a unit (15) for controlling and operating the compacting device (70) and the ejection device (71); the control and operating unit (15) being configured for controlling the compacting device (70) with a force such as to produce a compression which causes a coupling of the dose (33) with the side walls of the containing seat (s1) which prevents, in the operating condition of the unit, the escape of the dose from the containing seat (s1) in the absence of actions mechanical for pushing on the dose.. .
Tie rod arms and steering arms with integrated grease seal caps
A tie rod arm is provided for incorporation into a vehicle steering assembly. The tie rod arm has a grease cap portion with a steering knuckle connection formation and a grease seal cap.
Hendrickson Usa, L.l.c.
Marker cap connector
A cap connector is provided. The cap connector includes an elongated cord.
Pellet-based fused deposition modeling 3-d print process for production manufacturing
A device and method manufacture an object for a user by fused deposition. A screw conveyor conveys a plurality of solid thermoplastic pellets from a hopper to a barrel.
Jkm Technologies, Llc