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Caps patents



      
           
This page is updated frequently with new Caps-related patent applications. Subscribe to the Caps RSS feed to automatically get the update: related Caps RSS feeds. RSS updates for this page: Caps RSS RSS


Arrangements for monitoring network traffic on a cloud-computing environment and methods thereof

Leads with x-ray fluorescent capsules for electrode identification and methods of manufacture and use

Method and apparatus for patterned plasma-mediated laser trephination of the lens capsule and three dimensional…

Date/App# patent app List of recent Caps-related patents
08/14/14
20140230102
 New pepper plants and fruits with improved nutritional value patent thumbnailNew pepper plants and fruits with improved nutritional value
The present invention concerns capsicum annuum plants producing pepper fruits, exhibiting new physicochemical characteristics of the pepper fruit in relation with chlorophyll a & b, lutein as well as violaxanthin. The pepper fruits of the plants according to the present invention also exhibit a characteristic extreme dark green color at immature stage which color is linked to the content in pigment of the said fruit.
08/14/14
20140229605
 Arrangements for monitoring network traffic on a cloud-computing environment and methods thereof patent thumbnailArrangements for monitoring network traffic on a cloud-computing environment and methods thereof
A method for monitoring data associated with a virtual computing environment is provided. The method includes receiving virtually-originated data, wherein the virtually-originated data originated from a virtual server in the virtual computing environment and transmitted in the form of data packets.
08/14/14
20140228921
 Leads with x-ray fluorescent capsules for electrode identification and methods of manufacture and use patent thumbnailLeads with x-ray fluorescent capsules for electrode identification and methods of manufacture and use
An implantable lead for an electrical stimulation system includes a lead body having a distal end, a proximal end, a longitudinal length, and a circumference; a plurality of electrodes disposed along the distal end of the lead body in an electrode array; a plurality of terminals disposed along the proximal end of the lead body; a plurality of conductors electrically coupling the plurality of electrodes to the plurality of terminals; and at least one capsule including an x-ray fluorescent material and disposed along the distal end of the lead body relative to the electrode array to indicate, when viewed fluoroscopically, an orientation of the electrode array. The plurality of electrodes includes a plurality of segmented electrodes.
08/14/14
20140228827
 Method and apparatus for patterned plasma-mediated laser trephination of the lens capsule and three dimensional phaco-segmentation patent thumbnailMethod and apparatus for patterned plasma-mediated laser trephination of the lens capsule and three dimensional phaco-segmentation
System and method for making incisions in eye tissue at different depths. The system and method focuses light, possibly in a pattern, at various focal points which are at various depths within the eye tissue.
08/14/14
20140228826
 Method and apparatus for patterned plasma-mediated laser trephination of the lens capsule and three dimensional phaco-segmentation patent thumbnailMethod and apparatus for patterned plasma-mediated laser trephination of the lens capsule and three dimensional phaco-segmentation
System and method for making incisions in eye tissue at different depths. The system and method focuses light, possibly in a pattern, at various focal points which are at various depths within the eye tissue.
08/14/14
20140228809
 Double-lock sterile entry intravenous port and syringe system patent thumbnailDouble-lock sterile entry intravenous port and syringe system
Patients continue to acquire infections from healthcare facilities such as hospitals at an alarming rate. These infections can be transmitted when drugs or other medical materials are delivered from a syringe system into an iv line through an iv port.
08/14/14
20140228773
 Needleless connector and access port disinfection cleaner and antimicrobial protection cap patent thumbnailNeedleless connector and access port disinfection cleaner and antimicrobial protection cap
A protective cap having a first cap and a second cap that are removably coupled together for use in short-term and long-term antimicrobial treatment of needleless connectors and access ports of an infusion system. The instant invention further provides a protective cap having a first cap and a second cap that each coupled to a different surface of a component of an infusion system, such as a syringe.
08/14/14
20140228664
 Wearable device for a user patent thumbnailWearable device for a user
The wearable device for sensing a body status is placed on the user. The wearable device includes a flexible printed circuit board and a semi-cured sheet encapsulatingly conforms to the shape of the flexible printed circuit board.
08/14/14
20140228641
 Diagnostic capsules, delivery / retrieval systems, kits and methods patent thumbnailDiagnostic capsules, delivery / retrieval systems, kits and methods
Diagnostic capsules, a variety of diagnostic capsule delivery systems for delivering a diagnostic capsule into an animal or human body cavity (e.g., into an animal or human bladder through a urethra), a variety of diagnostic capsule retrieval systems, a variety of kits that include diagnostic capsule delivery and retrieval systems and diagnostic capsules, and methods of using the same are described herein.. .
08/14/14
20140228499
 Resin composition, resin pellet, method for producing resin pellet, and solar cell encapsulant patent thumbnailResin composition, resin pellet, method for producing resin pellet, and solar cell encapsulant
Wherein the ethylene-unsaturated ester copolymer comprises structural units derived from ethylene and structural units derived from an unsaturated ester and the content of the structural units derived from the unsaturated ester is 20 to 35% by weight where the total content of the structural units derived from ethylene and the structural units derived from the unsaturated ester is taken as 100% by weight, and the resin composition comprises 0.001 to 5 parts by weight of the metakaolin per 100 parts by weight of the ethylene-unsaturated ester copolymer.. .
08/14/14
20140228442
Grease-like gel for repelling rodents
Grease-like compositions are provided for repelling rodents. The compositions utilize nontoxic mineral, synthetic, or vegetable oil based gels containing silica, clay, urea, polytetrafluoroethylene, or metallic soap thickeners and capsaicin..
08/14/14
20140228437
Pharmaceutical composition
A pharmaceutical formulation comprising at least one omega-3 polyunsaturated fatty acid in free acid form or a pharmacologically acceptable derivative thereof is contained in a soft gelatin capsule characterised in that the capsule comprises gelatin extracted by an extraction process comprising acid pre-treatment of a collagen source. One advantage of the present invention over a soft gelatin capsule containing the same formulation but comprising gelatin extracted by an extraction process comprising alkali pre-treatment of the collagen source is that the present invention does not harden significantly over time and thus has a longer shelf life..
08/14/14
20140227834
Method for incorporating stress sensitive chip scale components into reconstructed wafer based modules
Techniques for constructing an electronic module are provided herein. For example, the techniques include orienting at least one die having a top side (e.g., a first side), a bottom side (e.g., a second side) and one or more side walls, on a substrate with the top side of the die proximate the substrate, coating the bottom side and each of the side walls of the die with a stress buffer material, forming a reconstructed wafer by encapsulating the coated die within a mold compound, and removing the substrate to expose the top side of the die..
08/14/14
20140227830
Method for fabricating quad flat non-leaded package structure with electromagnetic interference shielding function
A quad flat non-leaded (qfn) package structure with an electromagnetic interference (emi) shielding function is proposed, including: a lead frame having a die pad, a plurality of supporting portions connecting to the die pad and a plurality of leads disposed around the periphery of the die pad without connecting to the die pad; a chip mounted on the die pad; bonding wires electrically connecting the chip and the leads; an encapsulant for encapsulating the chip, the bonding wires and the lead frame and exposing the side and bottom surfaces of the leads and the bottom surface of the die pad; and a shielding film disposed on the top and side surfaces of the encapsulant and electrically connecting to the supporting portions for shielding from emi. A method of fabricating the package structure as described above is further proposed..
08/14/14
20140227816
Method to package multiple mems sensors and actuators at different gases and cavity pressures
A method for fabricating a multiple mems device. A semiconductor substrate having a first and second mems device, and an encapsulation wafer with a first cavity and a second cavity, which includes at least one channel, can be provided.
08/14/14
20140227804
System and process to remove film from semiconductor devices
Embodiments of the present disclosure are a method of forming a semiconductor device, a method of forming a magnetic tunnel junction (mtj) device, and a process tool. An embodiment is a process tool comprising an ion beam etch (ibe) chamber, an encapsulation chamber, a transfer module interconnecting the ibe chamber and the encapsulation chamber, the transfer module being capable of transferring a workpiece from the ibe chamber to the encapsulation chamber without exposing the workpiece to an external environment..
08/14/14
20140227796
Devices and methods for the collection and detection of substances
The present invention provides a single self-contained device for collecting, extracting, on-site testing, and transferring for forensic confirmatory analysis, a wide variety of substances including, but not limited to, drugs of abuse, explosives, weapons of mass destruction, food toxins and industrial wastes. Samples can be obtained from a surface by swabbing a suspect area or the testing of solid materials (pills, capsules, powders), air samples and biological and non-biological fluids by placing the substance in the device.
08/14/14
20140227414
Capsule for preparing a beverage by centrifugation in a beverage preparation device and device adapted therefore
Capsule insert able in a beverage production device for preparing a beverage from a substance contained in the capsule by introducing liquid in the capsule and passing liquid through the substance using centrifugal forces for producing the beverage which is centrifuged peripherally in the capsule relatively to a central axis of the capsule corresponding to an axis of rotation during the centrifuging operation comprising: an enclosure containing a predetermined amount of beverage substance, a cup-like shaped body, an upper wall for closing the body, wherein it comprises a flange-like rim extending outwardly from the body which comprises an annular raising portion forming a restriction for the centrifuged liquid how path when said portion is engaged by a pressing surface of the beverage production device.. .
08/14/14
20140227357
Fill formulations and capsules and method of use to avoid migration of fill into or through the shell
The present disclosure relates to fill formulations comprising at least one polymer and at least one fill component wherein the at least one fill component in the absence of the at least one polymer will migrate into or through a capsule shell. The present disclosure also relates to capsules comprising fill formulations according to the present disclosure.
08/14/14
20140227356
Composite formulation comprising a tablet encapsulated in a hard capsule
The present invention relates to a hard capsule composite formulation comprising a capsule having a hemispherical closure at each end and an interior space; and one or more tablets encapsulated in the capsule, wherein the tablet or the tablets as a whole have a shape conforming to the internal space of the capsule. The hard capsule composite formulation can efficiently charge pharmaceutical compositions inside the limited interior space of the capsule, and hence, it allows packing a high-dose of pharmaceutical composition in a relatively small-sized capsule, which increases productivity and patient compliance.
08/14/14
20140227352
Oral aphrodisiac herbal composition and capsule
A herbal composition comprising extracts or particulate material from the plants epimedium grandiflorum, turnera diffusa var. Aphrodisiaca, ilex paraguariensis, and sarsaparilla with an admixture of an emulsifying agent and a dispersing agent serves as a female aphrodisiac herbal composition, in particular for women suffering from lack of sexual desire and arousal disorders..
08/14/14
20140227330
Capsule whose envelope is separately imperceptible during the topical use thereof
A capsule for cosmetic and/or dermatological ingredients and processes for the production thereof. The capsule comprises an envelope which is solid, semisolid and/or dimensionally stable and comprises one or more substances which are selected from waxes, emulsifiers, and natural and synthetic polymers.
08/14/14
20140227329
Microcapsules having an envelope composed essentially of silsesquioxane homopolymers or copolymers
A microcapsule having a reservoir that includes a core containing at least one active principle, the core being surrounded by a polymer shell, is presented. The polymer shell contains 50% to 100% by weight of a silsesquioxane compound with respect to the total weight of the shell.
08/14/14
20140227328
Delivery particles
The present application relates to encapsulated benefit agents, compositions comprising such encapsulated benefit agents and processes for making and using compositions comprising such encapsulated benefit agents. Such encapsulated benefit agents eliminate or minimize one or more of the drawbacks of current encapsulated benefit agents and thus provide formulators with additional perfume delivery opportunities..
08/14/14
20140227147
Microfluidic device and method
A microfluidic device includes a semiconductor chip having a main chip surface. The microfluidic device further includes an encapsulation body embedding the semiconductor chip, the encapsulation body having a main body surface.
08/14/14
20140227144
Disinfection cap for disinfecting a male luer end of an infusion therapy device
The present invention extends to a disinfection cap for disinfecting a male luer end of an infusion therapy device. The disinfection cap can include an internal reservoir containing an antimicrobial or saline solution which is sealed with a flexible septum to prevent the solution from evaporating.
08/14/14
20140227141
Vaporizing device
A vaporizing device includes a reservoir defining a receiving space. A wick is engaged in the receiving space.
08/14/14
20140227131
Aluminum alloy products having improved property combinations and method for artificially aging same
Aluminum alloy products about 4 inches thick or less that possesses the ability to achieve, when solution heat treated, quenched, and artificially aged, and in parts made from the products, an improved combination of strength, fracture toughness and corrosion resistance, the alloy consisting essentially of: about 6.8 to about 8.5 wt. % zn, about 1.5 to about 2.00 wt.
08/14/14
20140227093
Low profile thermally free blind liner hanger attachment for complex shapes
A hanger system for connecting components in a gas turbine engine has a first spaced component, a second spaced component arranged a desired distance from the first spaced component, and a plurality of spacers arranged between the first spaced component and the second spaced component. A t-bar having a shaft portion and a crossbar is arranged between the components.
08/14/14
20140226663
Method, device, and system to prioritize encapsulating packets in a plurality of logical network connections
Methods, network devices, and systems which transmit and receive packets with priority by receiving a packet via one of the plurality of network interfaces; determining a global sequence number and a priority level of the packet; storing the packet; encapsulating the packet in encapsulating packets; transmitting the encapsulating packets via a plurality of logical network connections to the second network device according to the global sequence number and the priority level; receiving the encapsulating packets; decapsulating the packet from the encapsulating packets; and transmitting the packet to the intended receiver according to the global sequence number and the priority level.. .
08/14/14
20140226659
Systems and methods for ethernet frame translation to internet protocol over infiniband
Systems and methods for ethernet frame translation to internet protocol over infiniband (ipoib). An example method may comprise receiving, by a computer system, a network frame comprising a payload and a header including a destination address, determining an ib link layer address corresponding to the destination address, and encapsulating the payload into an infiniband over internet protocol (ipoib) frame including the ib link layer address..
08/14/14
20140226653
Management of a remote digital terminal
Existing telecommunications equipment may require network connectivity for data transfer but may have no external interfaces except for the tdm voice circuits to which they are connected. Thus on most newer systems, an additional local management interface is provided for proprietary maintenance functions.
08/14/14
20140226298
Apparatus for securely displaying an electronic device
An apparatus for securely displaying an electronic device is disclosed. The apparatus comprises a support, a frame coupled to the support, a case, and a securing device removably coupled to the frame.
08/14/14
20140225678
Atomic oscillator, method of detecting coherent population trapping resonance and magnetic sensor
An atomic oscillator includes an alkali metal cell encapsulating an alkali metal atom; a light source that emits laser light; a light detector that detects light which has passed through the alkali metal cell; and a polarizer arranged between the alkali metal cell and the light detector. A modulation frequency in the light source is controlled, according to a coherent population trapping resonance which is a light absorption characteristic of a quantum interference effect for two kinds of resonant lights, by modulating the light source to generate sidebands and injecting laser lights with the sidebands into the alkali metal cell.
08/14/14
20140225605
Mtj three-axis magnetic field sensor and encapsulation method thereof
The present invention discloses a mtj triaxial magnetic field sensor, comprising an x-axis bridge sensor that has a sensing direction along an x-axis, a y-axis bridge sensor that has a sensing direction along a y-axis, a z-axis sensor that has a sensing direction along a z-axis, and an asic chip connected with and matched to the x-axis, y-axis, and z-axis sensor chips. The z-axis sensor includes a substrate and mtj magnetoresistive elements deposited on the substrate.
08/14/14
20140225594
Integrated galvanically isolated meter devices and methods for making integrated galvanically isolated meter devices
An integrated galvanically isolated meter devices and method for making integrated meter devices are disclosed. An embodiment of an integrated meter device includes a carrier, a control chip disposed on the carrier, a first measuring device chip disposed on the carrier, the first measuring device chip galvanically isolated from the control chip and configured to measure at least one first parameter of a first wire of a power line and a package encapsulating the control chip and the first measuring device chip..
08/14/14
20140225271
Panelized packaging with transferred dielectric
Panelized packaging is described in which a plurality of die units are placed on a dielectric film. The dielectric film is then cured to lock the plurality of die unit in place, which are then encapsulated.
08/14/14
20140225267
Solderless die attach to a direct bonded aluminum substrate
A dba-based power device includes a dba (direct bonded aluminum) substrate. An amount of silver nanoparticle paste of a desired shape and size is deposited (for example by micro-jet deposition) onto a metal plate of the dba.
08/14/14
20140225259
Semiconductor module system having encapsulated through wire interconnect (twi)
A semiconductor module system includes a module substrate and a semiconductor substrate having a through wire interconnect bonded to an electrode on the module substrate. The through wire interconnect includes a via, a wire in the via having a first end bonded to a substrate contact on the semiconductor substrate and a polymer layer at least partially encapsulating the wire.
08/14/14
20140225244
Method for embedding a chipset having an intermediary interposer in high density electronic modules
A method for creating a high density electronic module including the steps of coupling a die to an interposer for form a chipset, mounting the chipset to a substrate, coupling a wafer to the substrate so that the chipset is within a window formed in the wafer, filling the window with encapsulant to encapsulate the chipset, removing the substrate to create a reconstructed wafer, and providing an interconnection structure on the interposer to form the high density electronic module.. .
08/14/14
20140225241
Electronic device and package structure thereof
A package structure is disclosed, which includes: a carrier having a recessed portion formed on a lower side thereof and filled with a dielectric material; a semiconductor element disposed on an upper side of the carrier and electrically connected to the carrier; and an encapsulant formed on the upper side of the carrier for encapsulating the semiconductor element. Therein, the dielectric material is exposed from the encapsulant.
08/14/14
20140225240
Manufacturing method of semiconductor device, and semiconductor device
To suppress the reduction in reliability of a resin-sealed semiconductor device. A first cap (member) and a second cap (member) with a cavity (space formation portion) are superimposed and bonded together to form a sealed space.
08/14/14
20140225239
Resin-encapsulated semiconductor device and method of manufacturing the same
A resin-encapsulated semiconductor device includes a semiconductor element mounted on a die pad portion, a plurality of lead portions arranged so that leading end portions thereof are opposed to the die pad portion, and thin metal wires for connecting together electrodes of the semiconductor element and the lead portions. Those members are partially encapsulated by a resin.
08/14/14
20140225237
Chip scale package structure and manufacturing method thereof
A chip scale package structure includes a chip, a dam unit, a board body, a plurality of first conductors, an encapsulating glue, a plurality of first conductive layers, an isolation layer, and a plurality of first electrodes. The dam unit is disposed on the surface of the chip.
08/14/14
20140225211
Solar powered ic chip
A self-powered circuit package includes a substrate and an integrated circuit (ic). The ic is mounted on a surface of the substrate.
08/14/14
20140225136
Light emitting diode, display device including the same, and method of manufacturing display device
A light emitting diode (led), includes: a substrate; a first electrode connection line disposed on the substrate; a second electrode connection line disposed on the substrate; a first contact metal layer disposed on the first electrode connection line; a second contact metal layer disposed on the second electrode connection line; a light emitting unit disposed on the first contact metal layer and the second contact metal layer; a partition disposed on the substrate and about the light emitting unit; and an encapsulation layer covering the light emitting unit. The encapsulation layer includes a light conversion material..
08/14/14
20140225125
Composite wafer and a method for manufacturing same
A composite wafer includes a substrate and a sic-based functional layer. The substrate includes a porous carbon substrate core and an encapsulating layer encapsulating the substrate core.
08/14/14
20140225116
Deuterated film encapsulation of nonvolatile charge trap memory device
Nonvolatile charge trap memory devices with deuterium passivation of charge traps and methods of forming the same are described. In one embodiment, the device includes a channel formed from a semiconducting material overlying a surface on a substrate connecting a source and a drain of the memory device.
08/14/14
20140225098
Substrate for organic electronic device
The present application relates to a substrate for an organic electronic device, an organic electronic device, a method of preparing the substrate or the device, and a lighting apparatus. The substrate for an organic electronic device of the present application may, for example, be used to fabricate an organic electronic device, to which foreign substances such as moisture and oxygen are not permeated, and which has enhanced durability and superior light extraction efficiency.
08/14/14
20140225093
Permeable electrodes for high performance organic electronic devices
Improved electrode types and device configurations for organic electronic devices are disclosed. This improvement can be achieved by facilitating gettering or desiccating action of impurities, such as water, oxygen or residual solvents from the active layers of the device.
08/14/14
20140225084
Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same
Provided is an organic electroluminescent display device, including a substrate, an organic light-emitting device on the substrate, and an encapsulation layer formed on the organic light-emitting device and the substrate. The encapsulation layer includes an inorganic layer and a polymer organic layer alternatingly stacked with an intermediate layer formed of a first organic monomer between the inorganic layer and the polymer organic layer, and one surface of the intermediate layer is bonded to the inorganic layer through bonding sites on a surface of the inorganic layer and another surface of the intermediate layer is bonded to the organic layer by polymerization..
08/14/14
20140225077
Organic light emitting diode display
An organic light emitting diode display includes a lower substrate having an organic light emitting diode thereon, an upper substrate on the lower substrate, an encapsulator between the lower substrate and an upper substrate to encapsulate the organic light emitting diode, the organic light emitting diode being encapsulated between the upper substrate and the lower substrate, a plurality of spacers between the lower substrate and the upper substrate, the plurality of spacers being disposed outside the encapsulator, a dummy metal provided between the spacers and the lower substrate, and a reinforcer on the dummy metal, the reinforcer wrapping the spacers.. .


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This listing is a sample listing of patent applications related to Caps for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Caps with additional patents listed. Browse our RSS directory or Search for other possible listings.
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