|| List of recent Caps-related patents
| Multi-tenant system and control method of multi-tenant system|
A management device allocates a first identifier that identifies, from among tenants included in a multi-tenant system, a tenant that uses virtual machines running on the multi-tenant system. The management device performs the following process, for each terminating device, from among tenants in the multi-tenant system, on virtual machines that are running on a second network in which terminating devices are installed.
| Capsulotomy device with suction cup compression chamber|
A surgical device and procedure are provided for smoothly and easily accessing tissue to perform microsurgery, including a capsulotomy of a lens capsule of an eye. The device includes a handpiece with a tip for insertion into an incision in the cornea of the eye.
| Methods for effectively and rapidly desensitizing allergic patients|
Methods and compositions for delivering antigens to the lymphatic system in doses that desensitize patients to future exposure to antigens have been developed. Rapid desensitization is achieved by introducing small quantities of antigen into the lymphatic system.
| Aqueous-triggered color-appearing inks|
The invention describes a color-developing composition that contains at least four major components: (1) a leuco dye or a combination of leuco dyes, (2) an electron-withdrawing color-developer agent or a combination of color-developers that can form colored complexes with the leuco dyes, (3) a separator or combination of separators that when present in sufficient amounts, can prevent the formation of the colored complexes between the color-developer and leuco dyes, all contained within (4) an encapsulation matrix that includes at least one film-forming and one aqueous-insoluble polymer. All of the foregoing components are dissolved together in a volatile organic solvent medium to form a homogeneous solution that can be applied as an ink on substrates, which can be incorporated as part of absorbent articles or personal care products..
| Optical capsule and spectroscopic method for treating and diagnosing the intestinal tract|
A device and method for mapping, diagnosing and treating disorders or other diseases, disorders or conditions (e.g., bleeding, ischemic or necrotic tissue, and presence of certain chemicals or substances) of the intestinal tract is provided using a capsule passing through the intestinal tract and sensing optical characteristics as the capsule passes through. Further, a capsule tracking system is provided for tracking a capsule's location along the length of an intestinal tract as various treatment and/or sensing modalities are employed.
| Sulfamoylbenzamide derivatives as antiviral agents against hbv infection|
Pharmaceutical compositions of the invention comprise sulfamoylbenzamide derivative useful as pregenomic rna encapsidation inhibitors, useful for the treatment of hepatitis b virus (hbv) infection.. .
| Benefit agent delivery particles comprising non-ionic polysaccharides|
The invention provides a composition comprising a benefit agent delivery particle comprising at least one of hydroxylpropyl methyl cellulose, hydroxylethyl methyl cellulose, hydroxylpropyl guar, hydroxylethyl ethyl cellulose or methyl cellulose. The benefit agent delivery particle may further comprise a non-polysaccharide polymer, preferably an aminoplast polymer.
| Methods of forming a poruous insulator, and related methods of forming semiconductor device structures|
Semiconductor devices with porous insulative materials are disclosed. The porous insulative materials may include a consolidated material with voids dispersed therethrough.
| Semiconductor device comprising a passive component of capacitors and process for fabrication|
A semiconductor device includes a wafer having a frontside and a backside. The wafer is formed from at least one integrated circuit chip having an electrical connection frontside co-planar with the wafer frontside and a backside co-planar with the wafer backside.
| Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device|
The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator..
| Fabrication method of semiconductor package having electrical connecting structures|
A semiconductor package having electrical connecting structures includes: a conductive layer having a die pad and traces surrounding the die pad; a chip; bonding wires; an encapsulant with a plurality of cavities having a depth greater than the thickness of the die pad and traces for embedding the die pad and the traces therein, and the cavities exposing the die pad and the traces; a solder mask layer formed in the cavities and having a plurality of openings for exposing the trace ends and a portion of the die pad; and solder balls formed in the openings and electrically connected to the trace ends. Engaging the solder mask layer with the encapsulant enhances adhesion strength of the solder mask layer so as to prolong the moisture permeation path and enhance package reliability..
| Flip-chip wafer level package and methods thereof|
An electronic package includes a flip-chip component having a first die coupled to a flip-chip substrate, second die stacked on the first die, an encapsulation compound formed around the first die and the second die, a set of through encapsulant vias (tevs) providing a set of electrical connections from a first side of the electronic package to a second side of the electronic package through the encapsulation compound to the flip-chip substrate, and a redistribution layer electrically connecting a set of contacts on the second die to the set of tevs on the first side of the electronic package.. .
| Pressure sensor and method of packaging same|
A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame.
| Universal aligning adaptor system and methods|
A system for dental implant restoration is provided. It includes universal aligning adaptors and prosthetic components having co-operable indices, which together form a translational, integrating system which aligns, synchronizes, and references the prosthetic components about an implant's central axis of rotation.
| Graphene hybrid structures for energy storage applications|
Aspects of the invention are directed to a method for forming a hybrid structure. Initially, a wire is received and an encapsulating film is deposited on the wire.
| Use of hydrophobic epoxide resin system for encapsulation of a instrument transformer|
Disclosed is the use of a curable composition for padding-free encapsulation of instrument transformers comprising (a) a cycloaliphatic epoxy resin, (b) a polyoxyalkylene diglycidylether (c) an oh-terminated polysiloxane, (d) a cyclic polysiloxane and (e) a non-ionic, fluoroaliphatic surface-active reagent, (f) a filler, (g) a hardener selected from anhydrides, (h) a curing accelerator selected from accelerators for anhydride curing of epoxy resins.. .
| Dicing-tape-integrated adhesive sheet, semiconductor device, multilayered circuit board and electronic component|
According to the present invention, a dicing-tape-integrated adhesive sheet is provided in which connection between terminals of opposing members and encapsulating of voids between the members can be simultaneously performed and thus excellent workability is achieved. The dicing-tape-integrated adhesive sheet of the present invention has a laminated structure including an adhesive film which has a first terminal of a support body and a second terminal of an adherend that are electrically connected using solder and by which the support body and the adherend are adhered to each other and a dicing tape.
| Coffee capsule|
A coffee capsule is configured to receive roasted and ground coffee and is suitable for preparing an espresso beverage using pressurised hot water in an espresso machine. It includes a capsule part and a membrane attached thereto.
| Synthesis and use of polyhydroxyalkanoate (pha) nanocapsules as a protein carrier|
A method of synthesizing pha nanocapsules as a protein carrier, particularly, the synthesis of pha nanocapsules synthesized by a modified precipitation/solvent evaporation technique with neutralization. Specifically, the method comprises the steps of sonicating a first solution comprising a triblock pha copolymer, stirring the first solution into a second solution to give a third solution, the second solution containing a protein, and the second solution being acidic.
| Direct compression formulation and process|
Dipeptidylpeptidase iv inhibitor (herein referred to as dpp-iv) that may be 98.5-100% pure is a high-dose drug capable of direct compressed with specific excipients into sold form dosage forms, such as tablets and capsules having desired, hardness, disintegrating ability and acceptable dissolution characteristics. Dpp-iv is not inherently compressible and thus present formulation problems.
| System and method for differentially timed local delivery of a combination pharmaceutical preparation for oral therapy|
The present invention is directed to a system and method for treating oral diseases in a subject. This method comprises the following steps; diagnosing the subject, and choosing one or a combination of medications, their dosing and desired time course and then delivering the medications to the desired site in the periodontal pocket by administering a plurality of microcapsules, capsules, the microcapsules comprising one or more pharmaceutical agent(s) that are released in a predetermined manner and in accordance with the pathophysiology of the targeted disease..
| Formulation for retinoid-containing soft gelatin capsules|
A new pharmaceutical formulation for retinoid-containing soft gelatin capsules is disclosed. The new formulation comprises a soft gelatin capsule filled with a fill mass comprising a retinoid as an active ingredient, a natural vegetable oil, a partially hydrogenated natural vegetable oil and medium chain triglycerides.
| Method for cosmetically treating caspase-14 deficiency|
A method of cosmetic care comprising activating capsase-14 expression in skin deficient in caspase-14 expression by applying, on at least one skin zone in need thereof, an effective amount of a plant extract selected from the group consisting of litchi, glasswort, peach, soja seed, sweet basil, cucumber, chanterelle, leek, kiwi fruit, rhubarb, grapefruit, wheat, raspberry, plum, and mixtures thereof, to activate caspase-14 expression in said skin.. .
| Rig mat sprayed with polyurea systems|
A containment mat generally including matting tiles and a polyuria/polyurethane coating. Matting tiles are preferably formed from composite recycled rubber and are arranged in a first layer and a second layer with overlapping edges forming a shiplap design.
| Finger sensor including encapsulating layer over sensing area and related methods|
A fingerprint sensor may include a substrate, and a finger sensing ic on the substrate and including a finger sensing area on an upper surface thereof for sensing an adjacent finger. The fingerprint sensor may include an encapsulating material on the finger sensing ic and covering the finger sensing area, and a bezel adjacent the finger sensing area and on an uppermost surface of the encapsulating layer..
| Explosion-proof led module|
An explosion-proof led module has at least one light-emitting diode, a heat sink connected to this and an led cover that covers the led at least in the emission direction. The led cover extends into an insertion recess of the heat sink.
| Method of forming a power module with a magnetic device having a conductive clip|
A method of forming a power module located on a conductive substrate by providing power conversion circuitry. The method of providing the power conversion circuitry includes forming a magnetic device by placing a magnetic core proximate a conductive substrate with a surface thereof facing a conductive substrate, and placing a conductive clip proximate a surface of the magnetic core.
| Connector / cable assembly|
A high voltage connector assembly includes a plurality of pin assemblies, each of the plurality of pin assemblies having a first end and a second end. The first end of each of the plurality of pin assemblies is configured to releasably electrically engage a load board.
| Electronic package, fabrication method thereof and adhesive compound|
An electronic package is provided, which includes: a substrate, a charging module and a coil module disposed on the substrate, and an encapsulant formed on the substrate for encapsulating the charging module and the coil module. The coil module has a plurality of coils having an opening, an adhesive compound formed on the coils in a manner that the opening of the coils is exposed from the adhesive compound, and a magnet inserted in the opening of the coils.
| Light emitting device package|
A light emitting device package includes a substrate, a light emitting device disposed on the substrate, a reflector surrounding the light emitting device, and an encapsulant encapsulating the light emitting device. The reflector includes a silicon-based polymer which is a main body portion, and a silicon oxide layer disposed at least on a portion of a surface of the silicon-based polymer..
| Semiconductor package and method of fabricating the same|
A semiconductor package is provided, including a substrate having a top surface, a bottom surface opposing the top surface, a via communicating the top surface with the bottom surface, and a stator set formed by circuits; an axial tube axially installed in the via of the substrate; a plurality of electronic components mounted on the top surface of the substrate and electrically connected to the substrate; an encapsulant formed on the top surface of the substrate for encapsulating the electronic components and the axial tube; and an impeller axially coupled to the axial tube via the bottom surface of the substrate. In the semiconductor package, the stator set is formed in the substrate by a patterning process.
| Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core|
A semiconductor device is made by providing a sacrificial substrate and depositing an adhesive layer over the sacrificial substrate. A first conductive layer is formed over the adhesive layer.
| Semiconductor device including cooler|
A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member.
| Integrated circuit structures, semiconductor structures, and semiconductor die|
Methods for fabricating integrated circuit devices on an acceptor substrate devoid of circuitry are disclosed. Integrated circuit devices are formed by sequentially disposing one or more levels of semiconductor material on an acceptor substrate, and fabricating circuitry on each level of semiconductor material before disposition of a next-higher level.
| Semiconductor package and method of manufacturing the same|
A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes: a substrate having a plurality of conductive lands and a plurality of bonding pads surrounding the conductive lands formed on a surface thereof; a plurality of passive devices mounted on the conductive lands; an insulation layer formed on the surface and having a portion of the passive devices embedded therein; a semiconductor chip mounted on a top surface of the insulation layer; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; an encapsulant formed on the surface of the substrate to encapsulate the insulation layer, the bonding wires and the semiconductor chip, wherein a region of the semiconductor chip projected onto the substrate covers a portion of an outermost one of the passive devices.
| Chip package comprising a microphone structure and a method of manufacturing the same|
In various embodiments, a method for manufacturing a chip package is provided. The method includes arranging a chip over a substrate, the chip including a microphone structure and an opening to the microphone structure; and encapsulating the chip with encapsulation material such that the opening is kept at least partially free from the encapsulation material..
| Primer composition and optical semiconductor apparatus using same|
The invention provides a primer composition which adheres a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device, includes (a) silazane compound or polysilazane compounds that has one or more silazane bonds in the molecule, (b) acrylic resin containing either one or both of acrylate ester and methacrylate ester that contains one or more sih groups in the molecule, and (c) solvent. There can be provided a primer composition in which the adhesion between a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device can be improved, the corrosion of a metal electrode on the substrate can be prevented, and the heat resistance and flexibility of a primer can be improved..
| Photon extraction from nitride ultraviolet light-emitting devices|
In various embodiments, a rigid lens is attached to a light-emitting semiconductor die via a layer of encapsulant having a thickness insufficient to prevent propagation of thermal expansion mismatch-induced strain between the rigid lens and the semiconductor die.. .
| Modular manifold for an electrolyzed water processor|
An electrolyzed water processor chamber with an anodic chamber having an anode plate held in an anode tray, and a cathodic chamber having a cathode plate held within a cathode tray. The plates are charged by an electrical current, to separate an incoming water stream into its electromagnetically ionized alkaline and acidic components, across an ion exchange membrane sandwiched between the anode and cathode plate trays.
| Device for treating manhole electrical fires|
A device for protecting a lineman or firefighter from an electrical fire that occurs while working within a manhole. The device dispenses a non-conductive amount of hydrated super absorbent polymer having fire suppression and extinguishing properties without creating an electrically conductive environment.
| Method and device for suppressing electrical fires in underground conduit|
A method and device for suppressing an electrical fire within an electrical wire carrying conduit. The device is a flexible receptacle containing an admixture of super absorbent polymer and water having substantially superior fire suppression and extinguishing properties that does not provide an electrically conductive environment.
| Encapsulaton of high temperature molten salts|
The present disclosure relates to a method of encapsulating microcapsules containing relatively high temperature phase change materials and the microcapsules so produced. The microcapsules are coated with an inorganic binder, film former and an inorganic filler.
| Thin film solar cell and method of manufacturing the same|
A thin film solar cell includes a first substrate, a first electrode on the first substrate, and divided by a first dividing groove, a light absorbing layer disposed on the first electrode, and divided by a second dividing groove parallel with the first dividing groove, a second electrode disposed on the light absorbing layer, divided by a third dividing groove that parallel with the first and second dividing grooves, a second substrate disposed on the second electrode, facing the first substrate, and a metal foil attached to the first substrate and the second substrate to encapsulate a gap between the first substrate and the second substrate, a first end portion of the metal foil being attached to a first surface of the first substrate using a metal material, and a second end portion of the metal foil being attached to the second substrate.. .
| Machine for assembling, filling and sealing portioned beverage capsules|
The machine for assembling, filling and sealing capsules for portioned beverages comprises a station for loading the capsules to be assembled, a station for unloading the assembled, filled and sealed capsules, a plurality of processing stations comprising at least one station for metering a product into the capsules and at least one station for sealing the capsules filled with the product, and an intermittent conveyor for conveying the capsules sequentially along a feed path to the unloading station through the processing stations, the feed path having at least a first stretch which extends along a first lateral longitudinal side of the machine and at least a second stretch which extends along a second lateral longitudinal side of the machine opposite the first lateral side.. .