This page is updated frequently with new Caps-related patent applications.
|| List of recent Caps-related patents
| Linear led illumination device with improved color mixing|
A linear multi-color led illumination device that produces uniform color throughout the output light beam without the use of excessively large optics or optical losses is disclosed herein. Embodiments for improving color mixing in the linear illumination device include, but are not limited to, a shallow dome encapsulating a plurality of emission leds within an emitter module, a unique arrangement of a plurality of such emitter modules in a linear light form factor, and special reflectors designed to improve color mixing between the plurality of emitter modules.
| Methods and centralized and decentralized emergency alert messaging|
Apparatus and methods for providing emergency alert system (eas) data to subscribers of a content-based network for multiple locations including via mobile devices. In one embodiment, the apparatus comprises a server performing real-time receipt and encapsulation of the eas data, transport of the eas data to client devices over an ip or other packet-switched network, and use of applications running on the client devices to decode and display the eas data.
Time Warner Cable Enterprises Llc
| Compact camera module arrangements that facilitate dam-and-fill and similar encapsulation techniques|
Compact camera module can include auxiliary spacers to facilitate use of dam-and-fill encapsulation techniques. An encapsulant disposed on side edges of the auxiliary spacer can close off a gap between the auxiliary spacer and a support on which an image sensor is mounted so as to substantially seal off an area in which bond wires or other components are located.
Heptagon Micro Optics Pte. Ltd.
| Multicast-unicast protocol converter|
A protocol converter includes a processor configured to receive a request for content from a client system. The processor is further configured to determine if the protocol converter is currently receiving the content through the multicast session, and join the multicast session if the protocol converter is not currently receiving the content.
At&t Intellectual Property I, Lp
| Display apparatus|
A display apparatus includes a substrate, a display layer on the substrate and including a plurality of display devices, and an encapsulation layer on the substrate and including a first inorganic layer, a second inorganic layer, and an organic layer between the first inorganic layer and the second inorganic layer, wherein the organic layer includes a first organic layer patterned to have a plurality of islands and a second organic layer filling gaps between the plurality of islands.. .
Samsung Display Co., Ltd.
| Flip-chip light emitting diode and manufacturing the same|
This invention relates to a flip-chip light-emitting diode and a method for manufacturing the same. The flip-chip light-emitting diode comprises a packaging body and a conductor layer.
| Light emitting diode package and method thereof|
The present disclosure provides a light emitting diode package including a substrate, a first electrode and a second electrode located on a first surface of the substrate, a plurality of light emitting diodes (leds) located between the first electrode and the second electrode, a plurality of retaining ring located on the first surface of the substrate. The leds are surrounded by the retaining ring therein.
Advanced Optoelectronic Technology, Inc.
| Optoelectronic component and production thereof|
An optoelectronic component includes a housing body, wherein a cavity is formed on the upper side of the housing body, and a channel extending from the cavity to an outer edge of the upper side of the housing body is formed on the upper side of the housing body; and a method of producing an optoelectronic component including providing a flat panel of a multiplicity of housing bodies, each housing body having a cavity opening onto an upper side of the panel wherein the cavities of neighboring housing bodies connect by channels and open onto the upper side of the panel, arranging an encapsulation material in the cavities of the housing bodies, and dividing the panel.. .
Osram Opto Semiconductors Gmbh
| Process for encapsulating a solar cell in a polymer matrix|
The present invention relates to a process for encapsulating one or more solar cell(s) in a polymer matrix, said process comprising: (a) applying a matrix composition comprising at least one polymerizable compound to the surface of a first solid carrier material, the matrix composition being a structurally viscous liquid having a yield point; (b) placing the one or more solar cell(s) onto the matrix composition applied to the surface of the first carrier material; (c) applying the matrix composition to the surface of the solar cell; (d) placing a second solid carrier material onto the matrix composition applied to the surface of the solar cell; (e) pressing the structure composed of solar cell, matrix composition, and first and second carrier materials, such that the one or more solar cell(s) is/are surrounded by a continuous layer of matrix composition; and (f) polymerizing the matrix composition in order to form the polymer matrix, and to the use of this process for producing solar modules and to the solar modules obtainable by means of this process.. .
Solarworld Innovations Gmbh
| Systems and methods for assembling two-dimensional materials|
Heterostructures can include multilevel stacks with an electrical contact on a one-dimensional edge of a two-dimensional active layer. A multilevel stack can be provided having a first two-dimensional layer encapsulated between a second layer and a third layer.
The Trustees Of Columbia University In The City Of New York
Organic light emitting diode display device
An organic light emitting diode (oled) display device includes: a first substrate comprising red, green, and blue pixel areas; a first electrode on the first substrate; red, green, and blue organic light emitting layers on the first electrode at the red, green, and blue pixel areas, respectively; a second electrode on the red, green, and blue organic light emitting layers; a capping layer on the second electrode, and having a greater thickness at the red and green pixel areas than a thickness at the blue pixel area; a thin film encapsulation layer on the capping layer; and a red color filter on the thin film encapsulation layer at the red pixel area.. .
Samsung Display Co., Ltd.
High-performance radiation detectors and methods of fabricating thereof
A method of fabricating a solid state radiation detector method includes mechanically lapping and polishing the first and the second surfaces of a semiconductor wafer using a plurality of lapping and polishing steps. The method also includes growing passivation oxide layers by use of oxygen plasma on the top of the polished first and second surfaces in order to passivate the semiconductor wafer.
Redlen Technologies, Inc.
Package structures and methods of forming the same
Packages structure and methods of forming them are discussed. A structure includes a first die, a first encapsulant at least laterally encapsulating the first die, and a redistribution structure on the first die and the first encapsulant.
Taiwan Semiconductor Manufacturing Company, Ltd.
Packaged semiconductor devices
A packaged semiconductor device is provided, which includes a substrate comprising a contact pad; a passivation layer disposed on the substrate, where the passivation layer covers part of the contact pad; an under bump metallization (ubm) layer disposed on the substrate, where the ubm layer is coupled to the contact pad; a conductive bump disposed on the ubm layer, where the conductive bump comprises a column connecting the ubm layer and a cap disposed on top of the column; and a solder ball encapsulating the conductive bump. The cap includes a bottom area larger than a cross-sectional area of the column, and a bottom of the cap is distant from an upper surface of the passivation layer by a space..
Chipmos Technologies (bermuda) Ltd.
Rf package with non-gaseous dielectric material
An rf package including: an rf circuit; a non-gaseous dielectric material coupled to the rf circuit, and having a thickness based on a magnetic field in the rf circuit; and an encapsulant material coupled to cover the rf circuit and non-gaseous dielectric material on at least one side of the rf circuit. A package manufacturing method, including: identifying an rf circuit; dispensing a non-gaseous dielectric material upon the rf circuit, wherein at least a portion of the non-gaseous dielectric material has a thickness based on a magnetic field in the rf circuit; and covering the rf circuit and non-gaseous dielectric material with an encapsulant material on at least one side of the rf circuit..
Noise cancellation for a magnetically coupled communication link utilizing a lead frame
An integrated circuit package includes an encapsulation and a lead frame with a portion of the lead frame disposed within the encapsulation. The lead frame includes first and second conductive loops.
Power Integrations, Inc.
Metal oxide layered structure and methods of forming the same
Some embodiment structures and methods are described. A structure includes an integrated circuit die at least laterally encapsulated by an encapsulant, and a redistribution structure on the integrated circuit die and encapsulant.
Taiwan Semiconductor Manufacturing Company, Ltd.
Electronic package and fabrication method thereof
A method for fabricating an electronic package is provided, including the steps of: providing at least a packaging structure, wherein the packaging structure has a packaging substrate having opposite first and second sides, an electronic element disposed on the first side of the packaging substrate and a plurality of conductors formed on the first side of the packaging substrate; encapsulating the packaging structure with an insulating layer, wherein the insulating layer covers the packaging substrate; and forming an rdl (redistribution layer) structure on the insulating layer, wherein the rdl structure is electrically connected to the conductors. Therefore, the area of the insulating layer is not required to correspond to the area of the packaging substrate, thus allowing the area of the packaging substrate to be reduced according to the practical need so as to reduce the width of the electronic package..
Siliconware Precision Industries Co., Ltd.
Semiconductor packages with sub-terminals and related methods
A semiconductor device package includes a substrate having first and second opposing surfaces. A first surface of a die couples to the second surface of the substrate, and a first surface of an electrically conductive sub-terminal electrically couples with an electrical contact of the die and physically couples to the second surface of the substrate.
Semiconductor Components Industries, Llc
Method for electrophoretically depositing a film on an electronic assembly
A packaged component and a method for making a packaged component are disclosed. In an embodiment the packaged component includes a component carrier having a component carrier contact and a component disposed on the component carrier, the component having a component contact.
Infineon Technologies Ag
An example package comprising: an rf circuit having a first portion and a second portion; a cavity structure positioned only over the first portion of the rf circuit; and an encapsulant material coupled to cover the rf circuit and cavity structure on at least one side of the rf circuit. An example method of package manufacture, comprising: identifying an rf circuit; forming a cavity structure upon the rf circuit, wherein at least a portion of the cavity structure has a height based on a level of magnetic field in the rf circuit; and covering the rf circuit and cavity structure with an encapsulant material on at least one side of the rf circuit..
Ampleon Netherlands B.v.
Method for moulding and surface processing electronic components and electronic component produced with this method
The invention relates to a method for moulding and surface processing electronic components wherein a grid of electronic components is attached on a carrier; subsequently foil is placed against the side of the electronic components opposite to the carrier and are the electronic components partially encapsulated. After moulding the foil is removed from the electronic components and a free side of the components is surface processed.
Besi Netherlands B.v.
A substrate structure is provided, which includes: a first dielectric layer having a magnetic material; a circuit layer having an inductor circuit and a plurality of conductive traces; and a second dielectric layer bonded to the first dielectric layer and encapsulating the circuit layer. As such, the inductance value of the inductor circuit is increased due to the magnetic material of the first dielectric layer, thereby eliminating the need to increase the number of coils of the inductor circuit..
Siliconware Precision Industries Co., Ltd.
Image transfer product including a phase change material
An image transfer product is provided which includes a phase change material in one or more layers of the product to regulate the temperature of the product during printing operations. The image transfer product may be in the form of a printing blanket, printing sleeve, electrophotographic/xerographic transfer blanket, image transfer belt, or roller which includes a print surface layer and at least one layer underlying the printing surface layer.
Day International, Inc.
The present application discloses a lighting device, which comprises a light source (110), a connection structure (120) comprising a cap (122, 124) provided at an end thereof, and a transmission mechanism (130); the cap is electrically connected with the light source; the transmission mechanism comprises a driving component (132) movably connected to a rotation component (134) on which the cap is mounted, wherein a movement of the driving component relative to the rotation component causes the rotation component with the cap to rotate. Just by touching, pressing, sliding or rotating a button (155) set on the surface of the panel (150), the rotation component is driven to rotate, and then the two pins of the two caps are quickly inserted into the corresponding sockets..
Philips Lighting Holding B.v.
A process for chemical and/or biological transformation
The invention relates to a process for chemical and/or biological transformation of at least one starting material dissolved in a liquid phase using at least one immobilized enzyme, cell fragments, and/or encapsulated whole cell microorganism trapped in a rotating flow distributor having an inlet for receiving liquid phase comprising starting material as well as immobilized enzyme(s)/encapsulated cell(s), a cavity for trapping said immobilized enzyme(s), cell fragment(s), and/or encapsulated whole cell microorganism(s), and outlet openings on the rotating periphery of the flow distributor.. .
Heat-expandable microspheres, process for producing the same, and application thereof
Heat-expandable microspheres composed of a thermoplastic resin shell and a thermally-vaporizable blowing agent encapsulated therein, and having an average particle size ranging from 1 to 100 μm. The amount of dmf-insoluble matter (g1) and the amount of dmf-mek-insoluble matter (g2) constituting the heat-expandable microspheres satisfy 1.05<g2/g1.
Matsumoto Yushi-seiyaku Co., Ltd.
Pack of single use capsule or pod, packaging machine and method thereof
A pack including at least one single-use capsule or pod for a portioned beverage which has two opposite bases, and a side wall connecting the two bases defining therewith a chamber for containing an aromatic substance; the pack has a sealed container for containing the capsule or pod housed in a protective inert gas atmosphere; more specifically the sealed container copies at least in part the shape of the capsule or pod.. .
Azionaria Costruzioni Macchine Automatiche A.c.m.a. S.p.a.
Multi-compartment roll-up container
A multi-compartment container structure has individual containers connected together. All the individual containers can have the same size and shape, and each has a flat base wall.
Silica microcapsules, process of making the same and uses thereof
The present document describes a microcapsule having silica shells, processes for making the same, processes for functionalizing said microcapsules and processes for encapsulating active agent in said microcapsules.. .
Les Innovations Materium Inc.
Use of bacterial polysaccharides for biofilm inhibition
A method comprises preventing or inhibiting bacterial adhesion and/or bacterial biofilm development by treating a substrate with a composition of a soluble group ii capsular polysaccharide obtained from a bacterial strain.. .
Centre National De La Recherche Scientifique
Antimycotic polymerisable bone cement and a the production thereof
The invention describes a bone cement with antimycotic efficacy based on organic polymers, such as polymethylmethacrylate. The bone cement comprises an antimycotic agent, in particular amphotericin b, that is released from the polymerised bone cement in the presence of water or aqueous media, such as body fluids.
Heraeus Medical Gmbh
Micro-particulated nanocapsules containing lopinavir with enhanced oral bioavailability and efficacy
The present disclosure provides controlled-release delivery systems for oral delivery of active agents, e.g. Lopinavir, comprising micro-particulated with enhanced oral bioavailability and efficacy, which may be used for treating hiv..
Yissum Research Development Company Of The Hebrew University Of Jerusalem Ltd.
Photosensitive capsules and cosmetic and pharmaceutical use thereof
The invention relates to capsules of core/shell type, the core comprising an active agent; the shell comprising one or more concentric and alternating layers of a first photosensitive anionic amino polymer and of a second cationic polymer. The invention also relates to a cosmetic or pharmaceutical composition comprising such capsules.
Delivery capsule with threshold release
A capsule includes a compressible reservoir and a gas generating unit disposed in a housing. A threshold valve seals an opening in the housing, through which contents of the reservoir may exit the capsule.
Medimetrics Personalized Drug Delivery, B.v.
Modular intraocular lens designs and methods
A modular iol system including intraocular primary and secondary components, which, when combined, form an intraocular optical correction device, wherein the secondary component is placed on the primary component within the perimeter of the capsulorhexis, thus avoiding the need to touch or otherwise manipulate the capsular bag. The secondary component may be manipulated, removed, and/or exchanged for a different secondary component for correction or modification of the optical result, on an intra-operative or post-operative basis, without the need to remove the primary component and without the need to manipulate the capsular bag.
The Regents Of The University Of Colorado, A Body Corporate
Prosthetic capsular devices, systems, and methods
A prosthetic capsular device configured to be inserted in an eye includes a housing structure and a ring structure. The housing structure includes a first side, a second side opposite the first side, a third side, a fourth side opposite the third side, a posterior side including a refractive surface, an anterior side opposite the posterior side, and a longitudinal axis.
Omega Ophthalmics Llc
Curvature-changing, accommodative intraocular lenses with expandable peripheral reservoirs
An intraocular lens includes a deformable outer shell having a distal end and a proximal end, a fluid optic having at least one elastic membrane surface positioned to traverse an optical axis of a patient's eye and at least partially defining an internal chamber to hold an optical fluid, and an inner shell associated with the fluid optic having a distal end and a proximal end. Each end is joined to a corresponding end of the outer shell to define a reservoir between the inner and outer shells, the reservoir at least partially disposed about a circumference of the fluid optic and in fluid communication with the internal chamber.
Semi-flexible posteriorly vaulted acrylic intraocular lens for the treatment of presbyopia
An intraocular lens having an optic and at least one semi-rigid, haptic connected to the optic, both of which may be acrylic. The intraocular lens can have a fixed longitudinal length, e.g., the same fixed length pre-operatively and post-operatively.
Tissue incision device and method
A minimally invasive tissue incision system for creating joint capsulotomies and releasing/incising various tendon and fibrous band structures. The system contains a penetrating needle which is retractable so as to expose a cutting element, and which may be used as a penetrating needle to pierce the skin and other soft tissue structures.
Release Medical, Inc.
Provided is a capsule endoscope in which an objective lens unit includes, at the extreme object side, a lens which is a meniscus lens having negative power and disposed with the convex surface thereof towards the object side, so that the convex surface thereof faces the exterior. An illumination unit includes a light source and an illumination window member.
Laminated mat with endcap
An improved laminated mat is disclosed and includes a plurality of layers and end caps. The plurality of layers may be formed of wood, synthetic materials, wood, metal, or a combination of such materials.
The Modern Group, Ltd.
Fabrication of core/shell capsules of different geometries and treatment therafter
Multi-shelled capsules are made by co-extruding a first liquid flavorant composition and a first shell-forming polymeric material to form droplets which are hardened to form an inner shell containing a first liquid flavorant composition, and then coated with a second shell-forming polymeric material which is hardened to form an outer shell. The result is a capsule where the inner surface of the outer shell is separate and/or separable from the outer surface of the inner shell to define a space, wherein a second liquid flavorant composition may be located..
Altria Client Services Inc.
Sweetener composition, sweetener products, and methods of sweetening
A method of reducing oral cavity and tongue coating adherence and tongue numbing effects of a sweetener composition and imparting a more sugar-like temporal and flavor profile to a high potency sweetener, that includes providing to a person a sweetener composition that includes an encapsulated high potency sweetener or a high potency sweetener included in an emulsified mixture. The high potency sweetener is selected from the group consisting of: mogroside iv, mogroside v, luo han guo sweetener, siamenoside, monatin and its salts (monatin ss, ra rs, sr).
Almendra Americas, Llc
Process for producing flavoured food particles
The present invention is in the field of the flavouring of foods. In particular, the present invention is directed to a process for the encapsulation of flavours and/or aromas.
Core and kibble-like product
A liquid core and shell product is provided. The product can have at least three layers: a solid food based material, a liquid-based substance, and an encapsulate material.
Tree treatment capsule
A capsule (1) for insertion into a bore of a porous element to apply treatment substance to the interior of the element and having a container (2), with at least one internal cavity (3) for receiving treatment substance and an outer stop flange (8), and a plug (4) received in and fixed to the container through a common interconnecting land (5). A first container shank portion (6) that extends from a first insertion end (1a) of the capsule and up to the area of the interconnecting land has a uniform, generally cylindrical shape, a second container shank portion (7) extending away from said container first shank portion, from the area of the inter- connecting land towards the outer stop flange, at least at an inner surface (7b) thereof has an outwardly slightly diverging, conical shape and at an outer surface (7a) thereof, separated a short distance from the outer stop flange has a first circumferential beveled edge (9) serving as a transition to an outer increased diameter section (7c).
Systems and methods for aerial seeding
Reforestation capsules composed of biodegradable materials are operable to be used in aerial reforestation operations. Capsules may contain one or more seedlings, compacted fertilizer, soil, and/or nutrients.
New Jersey Institute Of Technology
An improved enclosure for hermetical encapsulated electronics
Provided is an enclosure for encapsulating one or more printed circuit boards (pcbs) configured for having electronic devices mounted thereon. The enclosure includes a main chassis body including a bottom portion and an outer wall including connectable panels for encasing the main chassis body.
Ge Intelligent Platforms, Inc.
Electronic device with cover
An electronic device is provided. The electronic device includes a front glass cover forming a front face of the electronic device, a rear glass cover forming a rear face of the electronic device, a metal bezel encapsulating a space formed by the front glass cover and the rear glass cover, and a display device disposed in the space and that includes a screen region exposed through the front glass cover.
Samsung Electronics Co., Ltd.
Heater cable having a tapered profile
A self-regulating heater cable includes a ptc core formed of positive temperature coefficient material and disposed in electrical contact with at least two bus wires. The ptc core may encapsulate the bus wires and space the bus wires apart a predetermined distance via a connecting portion of the ptc core.
Pentair Thermal Management Llc
Method and apparatus of lwa pdu routing
Apparatus and methods are provided for lwa pdu routing. In one novel aspect, lte pdu packets are routed through a wlan ap to a ue by encapsulation of the data packets.
Molded interconnect mircoelectromechanical system (mems) device package
A microelectromechanical system (mems) device package for encapsulating a mems device a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms either side walls or a divider of the mems device package and is adapted to route electrical connections from the mems device to either the substrate or a second mems device package via the substrate..
Robert Bosch Gmbh
Certain embodiments may take the form of an electronic device having a main housing encapsulating operative circuitry for the device. The electronic device includes an attachment member moveably coupled to the metal housing.
Hybrid codec scalable video
A hybrid codec scalable video bitstream comprises first encapsulation units carrying video data of a base layer and encoded according to a first video coding standard and second encapsulation units carrying video data of at least one enhancement layer and encoded according to a second video coding standard. A prefix syntax element is added to each second encapsulation unit.
Telefonaktiebolaget L M Ericsson (publ)
Method for migrating service of data center, apparatus, and system
A method for migrating a service of a data center is disclosed. When an active data center is faulty, a tunnel processing device disables a locally-saved tunnel entry of a server in the active data center.
Huawei Technologies Co.,ltd.
Methods and systems for transmitting and receiving packets
A method carried out at a network node for managing aggregated virtual private network (vpn) connection. The network node establishes an aggregated vpn connection with a network element and determines a first uplink bandwidth limit and/or a first downlink bandwidth limit.
Pismo Labs Technology Limited
Interoperability for distributed overlay virtual environment
A method includes receiving tunnel information and end point information in response to a request to a distributed cluster. A common tunnel type supported by a source switch and a destination switch is selected.
International Business Machines Corporation
Magnetically coupled galvanically isolated communication using lead frame
An integrated circuit package includes an electromagnetic communication link formed by a portion of a lead frame within an encapsulation. The lead frame includes a first conductor forming a first conductive loop a second conductor forming a second conductive loop galvanically isolated from the first conductive loop.
Power Integrations, Inc.
Integrated hybrid laser source compatible with a silicon technology platform, and fabrication process
A photonic integrated circuit includes a first insulating region encapsulating at least one metallization level, a second insulating region at least partially encapsulating a gain medium of a laser source, and a stacked structure placed between the two insulating regions. The stacked structure includes a first polycrystalline or single-crystal silicon layer, a second polycrystalline or single-crystal silicon layer, an intermediate layer optically compatible with the wavelength of the laser source and selectively etchable relative to silicon and that separates the first layer from a first portion of the second layer, and the gain medium facing at least one portion of the first layer.
Stmicroelectronics (crolles 2) Sas
Cavity filter and rf communication device with the cavity filter
A cavity filter and a rf communication device including the cavity filter are disclosed. The cavity filter includes a cavity body, a cover plate, a resonance rod, a tuning screw, and a supporting member.
Shenzhen Tatfook Technology Co., Ltd
Flexible display device
A flexible display device includes: a flexible substrate; a display unit on the flexible substrate and including a display area capable of displaying an image; and a thin film encapsulating layer encapsulating the display unit and including at least one inorganic encapsulating film and at least one organic encapsulating film, where the organic encapsulating film includes at least one first organic region including a first organic material and at least one second organic region including a second organic material that is different from the first organic material, and the at least one first organic region extends in a first direction, the at least one first organic region and the at least one second organic region are aligned with each other, and a first young's modulus of the at least one first organic region is different from a second young's modulus of the least one second organic region.. .
Samsung Display Co., Ltd.
Organic light emitting diode display
An organic light emitting diode display includes a display substrate including an organic light emitting element and a driving circuit part, an encapsulation substrate sealing the display substrate, and a sealing portion between the display substrate and the encapsulation substrate, the sealing portion including a plurality of sealing frame portions around the display substrate, and a first sealing frame portion of the plurality of sealing frame portions being adjacent to a pad portion, wherein at least one of a width of an edge of the sealing portion and a width of the first sealing frame portion is wider than a width of a sealing frame portion other than the first sealing frame portion.. .
Samsung Display Co., Ltd.
Light emitting device and resin composition
Provided a light emitting device comprising: a package; a light emitting element disposed in the package; an encapsulation member that covers the light emitting element, the encapsulation member being formed from a resin composition that contains a fluorescent material, a resin, and nanoparticles selected from at least one of the group consisting of aluminum oxide nanoparticles, titanium oxide nanoparticles, zinc oxide nanoparticles, zirconium oxide nanoparticles, and silicon oxide nanoparticles, wherein when the resin composition includes silicon oxide nanoparticles, the content of the silicon oxide nanoparticles is 0.02 to 5 mass parts relative to 100 mass parts of the resin; and wherein the fluorescent material is a red-light emitting fluorescent material including a fluoride material having a chemical composition that includes tetravalent manganese, at least one selected from the group consisting of alkali metal elements and nh4+, and at least one selected from the group consisting of elements from group 4 of the periodic table and elements from group 14 of the periodic table.. .
Organic light-emitting display apparatus
An organic light-emitting display apparatus includes: a display substrate; at least one thin film transistor (tft) on the display substrate; an organic light-emitting diode (oled) electrically connected to the tft, the oled including: a first electrode on each sub-pixel on the display substrate; an intermediate layer on the first electrode; and a second electrode on the intermediate layer; an encapsulation substrate covering the oled; a filler filling a space between the display substrate and the encapsulation substrate, the filler including scatterers having optical anisotropy; and a color filter between the encapsulation substrate and the filler, the color filter including a color filter electrode at a surface of the color filter.. .
Samsung Display Co., Ltd.
Method for fabricating semiconductor package
A method for fabricating a semiconductor package is provided, which includes the steps of: providing a first substrate having a plurality of first conductive posts on a surface thereof and providing a second substrate having a third surface having a chip disposed thereon and a fourth surface opposite to the third surface; disposing the first substrate on the third surface of the second substrate through the first conductive posts; forming an encapsulant between the first substrate and the second substrate, wherein the encapsulant has a first surface adjacent to the first substrate and a second surface opposite to the first surface; and removing the first substrate, thereby effectively preventing solder bridging from occurring.. .
Siliconware Precision Industries Co., Ltd.
Semiconductor package using a coreless signal distribution structure
A semiconductor package using a coreless signal distribution structure (csds) is disclosed and may include a csds comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface. The semiconductor package may also include a first semiconductor die having a first bond pad on a first die surface, where the first semiconductor die is bonded to the first surface of the csds via the first bond pad, and a second semiconductor die having a second bond pad on a second die surface, where the second semiconductor die is bonded to the second surface of the csds via the second bond pad.
Amkor Technology, Inc.
Package structure and fabrication method thereof
A package structure is provided, which includes: a dielectric layer having opposite first and second surfaces; a circuit sub-layer formed in the dielectric layer; an electronic element disposed on the first surface of the dielectric layer and electrically connected to the circuit sub-layer; a plurality of conductive posts formed on the first surface of the dielectric layer and electrically connected to the circuit sub-layer; and an encapsulant formed on the first surface of the dielectric layer and encapsulating the electronic element and the conductive posts. Upper surfaces of the conductive posts are exposed from the encapsulant so as to allow another electronic element to be disposed on the conductive posts and electrically connected to the circuit sub-layer through the conductive posts, thereby overcoming the conventional drawback that another electronic element can only be disposed on a lower side of a package structure and improving the functionality of the package structure..
Siliconware Precision Industries Co., Ltd.
Semiconductor package using a contact in a pleated sidewall encapsulant opening
A semiconductor package, and a method of manufacturing thereof, comprising a contact in a plated sidewall encapsulant opening, substantially as shown in and/or described in connection with at least one of the figures, as set forth more completely in the claims.. .
Amkor Technology, Inc.
Wafer level semiconductor package and manufacturing methods thereof
A semiconductor package includes at least one semiconductor die having an active surface, an interposer element having an upper surface and a lower surface, a package body, and a lower redistribution layer. The interposer element has at least one conductive via extending between the upper surface and the lower surface.
Advanced Semiconductor Engineering, Inc.
Semiconductor device and forming 3d dual side die embedded build-up semiconductor package
A semiconductor device has a plurality of semiconductor die. A substrate is provided with bumps disposed over the substrate.
Stats Chippac, Ltd.
Electronic component, semiconductor package, and electronic device using the same
An electronic component, a semiconductor package, and an electronic device including the electronic component and/or the semiconductor package are provided. The electronic component includes an electronic element; an encapsulation member that encapsulates the electronic element and has a first surface and a second surface substantially parallel to each other; and a lead electrically connected to the electronic element and extending outward from the encapsulation member.
Semiconductor chip package having contact pins at short side edges
A semiconductor chip package includes a semiconductor chip, an encapsulation body encapsulating the semiconductor chip, a chip pad, and electrical contact elements connected with the semiconductor chip and extending outwardly. The encapsulation body has six side faces and the electrical contact elements extend exclusively through two opposing side faces which have the smallest surface areas from all the side faces.
Infineon Technologies Austria Ag
Methods for forming package-on-package structures having buffer dams
Package-on-package (pop) structures and methods of forming the same are disclosed. In some embodiments, a method of forming a pop structure may include: plating at least one through-assembly via (tav) over a peripheral region of a conductive seed layer; forming a dam member over a central region of the conductive seed layer; and placing a die over the central region of the conductive seed layer.
Taiwan Semiconductor Manufacturing Company, Ltd.