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Caps patents

      

This page is updated frequently with new Caps-related patent applications.




Date/App# patent app List of recent Caps-related patents
08/18/16
20160242255 
 Linear led illumination device with improved color mixing patent thumbnailnew patent Linear led illumination device with improved color mixing
A linear multi-color led illumination device that produces uniform color throughout the output light beam without the use of excessively large optics or optical losses is disclosed herein. Embodiments for improving color mixing in the linear illumination device include, but are not limited to, a shallow dome encapsulating a plurality of emission leds within an emitter module, a unique arrangement of a plurality of such emitter modules in a linear light form factor, and special reflectors designed to improve color mixing between the plurality of emitter modules.
Ketra, Inc.


08/18/16
20160241930 
 Methods and  centralized and decentralized emergency alert messaging patent thumbnailnew patent Methods and centralized and decentralized emergency alert messaging
Apparatus and methods for providing emergency alert system (eas) data to subscribers of a content-based network for multiple locations including via mobile devices. In one embodiment, the apparatus comprises a server performing real-time receipt and encapsulation of the eas data, transport of the eas data to client devices over an ip or other packet-switched network, and use of applications running on the client devices to decode and display the eas data.
Time Warner Cable Enterprises Llc


08/18/16
20160241749 
 Compact camera module arrangements that facilitate dam-and-fill and similar encapsulation techniques patent thumbnailnew patent Compact camera module arrangements that facilitate dam-and-fill and similar encapsulation techniques
Compact camera module can include auxiliary spacers to facilitate use of dam-and-fill encapsulation techniques. An encapsulant disposed on side edges of the auxiliary spacer can close off a gap between the auxiliary spacer and a support on which an image sensor is mounted so as to substantially seal off an area in which bond wires or other components are located.
Heptagon Micro Optics Pte. Ltd.


08/18/16
20160241679 
 Multicast-unicast protocol converter patent thumbnailnew patent Multicast-unicast protocol converter
A protocol converter includes a processor configured to receive a request for content from a client system. The processor is further configured to determine if the protocol converter is currently receiving the content through the multicast session, and join the multicast session if the protocol converter is not currently receiving the content.
At&t Intellectual Property I, Lp


08/18/16
20160240817 
 Display apparatus patent thumbnailnew patent Display apparatus
A display apparatus includes a substrate, a display layer on the substrate and including a plurality of display devices, and an encapsulation layer on the substrate and including a first inorganic layer, a second inorganic layer, and an organic layer between the first inorganic layer and the second inorganic layer, wherein the organic layer includes a first organic layer patterned to have a plurality of islands and a second organic layer filling gaps between the plurality of islands.. .
Samsung Display Co., Ltd.


08/18/16
20160240760 
 Flip-chip light emitting diode and  manufacturing the same patent thumbnailnew patent Flip-chip light emitting diode and manufacturing the same
This invention relates to a flip-chip light-emitting diode and a method for manufacturing the same. The flip-chip light-emitting diode comprises a packaging body and a conductor layer.

08/18/16
20160240752 
 Light emitting diode package and method thereof patent thumbnailnew patent Light emitting diode package and method thereof
The present disclosure provides a light emitting diode package including a substrate, a first electrode and a second electrode located on a first surface of the substrate, a plurality of light emitting diodes (leds) located between the first electrode and the second electrode, a plurality of retaining ring located on the first surface of the substrate. The leds are surrounded by the retaining ring therein.
Advanced Optoelectronic Technology, Inc.


08/18/16
20160240747 
 Optoelectronic component and  production thereof patent thumbnailnew patent Optoelectronic component and production thereof
An optoelectronic component includes a housing body, wherein a cavity is formed on the upper side of the housing body, and a channel extending from the cavity to an outer edge of the upper side of the housing body is formed on the upper side of the housing body; and a method of producing an optoelectronic component including providing a flat panel of a multiplicity of housing bodies, each housing body having a cavity opening onto an upper side of the panel wherein the cavities of neighboring housing bodies connect by channels and open onto the upper side of the panel, arranging an encapsulation material in the cavities of the housing bodies, and dividing the panel.. .
Osram Opto Semiconductors Gmbh


08/18/16
20160240712 
 Process for encapsulating a solar cell in a polymer matrix patent thumbnailnew patent Process for encapsulating a solar cell in a polymer matrix
The present invention relates to a process for encapsulating one or more solar cell(s) in a polymer matrix, said process comprising: (a) applying a matrix composition comprising at least one polymerizable compound to the surface of a first solid carrier material, the matrix composition being a structurally viscous liquid having a yield point; (b) placing the one or more solar cell(s) onto the matrix composition applied to the surface of the first carrier material; (c) applying the matrix composition to the surface of the solar cell; (d) placing a second solid carrier material onto the matrix composition applied to the surface of the solar cell; (e) pressing the structure composed of solar cell, matrix composition, and first and second carrier materials, such that the one or more solar cell(s) is/are surrounded by a continuous layer of matrix composition; and (f) polymerizing the matrix composition in order to form the polymer matrix, and to the use of this process for producing solar modules and to the solar modules obtainable by means of this process.. .
Solarworld Innovations Gmbh


08/18/16
20160240692 
 Systems and methods for assembling two-dimensional materials patent thumbnailnew patent Systems and methods for assembling two-dimensional materials
Heterostructures can include multilevel stacks with an electrical contact on a one-dimensional edge of a two-dimensional active layer. A multilevel stack can be provided having a first two-dimensional layer encapsulated between a second layer and a third layer.
The Trustees Of Columbia University In The City Of New York


08/18/16
20160240589 
new patent

Organic light emitting diode display device


An organic light emitting diode (oled) display device includes: a first substrate comprising red, green, and blue pixel areas; a first electrode on the first substrate; red, green, and blue organic light emitting layers on the first electrode at the red, green, and blue pixel areas, respectively; a second electrode on the red, green, and blue organic light emitting layers; a capping layer on the second electrode, and having a greater thickness at the red and green pixel areas than a thickness at the blue pixel area; a thin film encapsulation layer on the capping layer; and a red color filter on the thin film encapsulation layer at the red pixel area.. .
Samsung Display Co., Ltd.


08/18/16
20160240584 
new patent

High-performance radiation detectors and methods of fabricating thereof


A method of fabricating a solid state radiation detector method includes mechanically lapping and polishing the first and the second surfaces of a semiconductor wafer using a plurality of lapping and polishing steps. The method also includes growing passivation oxide layers by use of oxygen plasma on the top of the polished first and second surfaces in order to passivate the semiconductor wafer.
Redlen Technologies, Inc.


08/18/16
20160240508 
new patent

Package structures and methods of forming the same


Packages structure and methods of forming them are discussed. A structure includes a first die, a first encapsulant at least laterally encapsulating the first die, and a redistribution structure on the first die and the first encapsulant.
Taiwan Semiconductor Manufacturing Company, Ltd.


08/18/16
20160240500 
new patent

Packaged semiconductor devices


A packaged semiconductor device is provided, which includes a substrate comprising a contact pad; a passivation layer disposed on the substrate, where the passivation layer covers part of the contact pad; an under bump metallization (ubm) layer disposed on the substrate, where the ubm layer is coupled to the contact pad; a conductive bump disposed on the ubm layer, where the conductive bump comprises a column connecting the ubm layer and a cap disposed on top of the column; and a solder ball encapsulating the conductive bump. The cap includes a bottom area larger than a cross-sectional area of the column, and a bottom of the cap is distant from an upper surface of the passivation layer by a space..
Chipmos Technologies (bermuda) Ltd.


08/18/16
20160240491 
new patent

Rf package with non-gaseous dielectric material


An rf package including: an rf circuit; a non-gaseous dielectric material coupled to the rf circuit, and having a thickness based on a magnetic field in the rf circuit; and an encapsulant material coupled to cover the rf circuit and non-gaseous dielectric material on at least one side of the rf circuit. A package manufacturing method, including: identifying an rf circuit; dispensing a non-gaseous dielectric material upon the rf circuit, wherein at least a portion of the non-gaseous dielectric material has a thickness based on a magnetic field in the rf circuit; and covering the rf circuit and non-gaseous dielectric material with an encapsulant material on at least one side of the rf circuit..
Nxp B.v.


08/18/16
20160240489 
new patent

Noise cancellation for a magnetically coupled communication link utilizing a lead frame


An integrated circuit package includes an encapsulation and a lead frame with a portion of the lead frame disposed within the encapsulation. The lead frame includes first and second conductive loops.
Power Integrations, Inc.


08/18/16
20160240480 
new patent

Metal oxide layered structure and methods of forming the same


Some embodiment structures and methods are described. A structure includes an integrated circuit die at least laterally encapsulated by an encapsulant, and a redistribution structure on the integrated circuit die and encapsulant.
Taiwan Semiconductor Manufacturing Company, Ltd.


08/18/16
20160240466 
new patent

Electronic package and fabrication method thereof


A method for fabricating an electronic package is provided, including the steps of: providing at least a packaging structure, wherein the packaging structure has a packaging substrate having opposite first and second sides, an electronic element disposed on the first side of the packaging substrate and a plurality of conductors formed on the first side of the packaging substrate; encapsulating the packaging structure with an insulating layer, wherein the insulating layer covers the packaging substrate; and forming an rdl (redistribution layer) structure on the insulating layer, wherein the rdl structure is electrically connected to the conductors. Therefore, the area of the insulating layer is not required to correspond to the area of the packaging substrate, thus allowing the area of the packaging substrate to be reduced according to the practical need so as to reduce the width of the electronic package..
Siliconware Precision Industries Co., Ltd.


08/18/16
20160240452 
new patent

Semiconductor packages with sub-terminals and related methods


A semiconductor device package includes a substrate having first and second opposing surfaces. A first surface of a die couples to the second surface of the substrate, and a first surface of an electrically conductive sub-terminal electrically couples with an electrical contact of the die and physically couples to the second surface of the substrate.
Semiconductor Components Industries, Llc


08/18/16
20160240449 
new patent

Method for electrophoretically depositing a film on an electronic assembly


A packaged component and a method for making a packaged component are disclosed. In an embodiment the packaged component includes a component carrier having a component carrier contact and a component disposed on the component carrier, the component having a component contact.
Infineon Technologies Ag


08/18/16
20160240448 
new patent

Rf package


An example package comprising: an rf circuit having a first portion and a second portion; a cavity structure positioned only over the first portion of the rf circuit; and an encapsulant material coupled to cover the rf circuit and cavity structure on at least one side of the rf circuit. An example method of package manufacture, comprising: identifying an rf circuit; forming a cavity structure upon the rf circuit, wherein at least a portion of the cavity structure has a height based on a level of magnetic field in the rf circuit; and covering the rf circuit and cavity structure with an encapsulant material on at least one side of the rf circuit..
Ampleon Netherlands B.v.


08/18/16
20160240397 
new patent

Method for moulding and surface processing electronic components and electronic component produced with this method


The invention relates to a method for moulding and surface processing electronic components wherein a grid of electronic components is attached on a carrier; subsequently foil is placed against the side of the electronic components opposite to the carrier and are the electronic components partially encapsulated. After moulding the foil is removed from the electronic components and a free side of the components is surface processed.
Besi Netherlands B.v.


08/18/16
20160240302 
new patent

Substrate structure


A substrate structure is provided, which includes: a first dielectric layer having a magnetic material; a circuit layer having an inductor circuit and a plurality of conductive traces; and a second dielectric layer bonded to the first dielectric layer and encapsulating the circuit layer. As such, the inductance value of the inductor circuit is increased due to the magnetic material of the first dielectric layer, thereby eliminating the need to increase the number of coils of the inductor circuit..
Siliconware Precision Industries Co., Ltd.


08/18/16
20160238968 
new patent

Image transfer product including a phase change material


An image transfer product is provided which includes a phase change material in one or more layers of the product to regulate the temperature of the product during printing operations. The image transfer product may be in the form of a printing blanket, printing sleeve, electrophotographic/xerographic transfer blanket, image transfer belt, or roller which includes a print surface layer and at least one layer underlying the printing surface layer.
Day International, Inc.


08/18/16
20160238219 
new patent

Lighting device


The present application discloses a lighting device, which comprises a light source (110), a connection structure (120) comprising a cap (122, 124) provided at an end thereof, and a transmission mechanism (130); the cap is electrically connected with the light source; the transmission mechanism comprises a driving component (132) movably connected to a rotation component (134) on which the cap is mounted, wherein a movement of the driving component relative to the rotation component causes the rotation component with the cap to rotate. Just by touching, pressing, sliding or rotating a button (155) set on the surface of the panel (150), the rotation component is driven to rotate, and then the two pins of the two caps are quickly inserted into the corresponding sockets..
Philips Lighting Holding B.v.


08/18/16
20160237391 
new patent

A process for chemical and/or biological transformation


The invention relates to a process for chemical and/or biological transformation of at least one starting material dissolved in a liquid phase using at least one immobilized enzyme, cell fragments, and/or encapsulated whole cell microorganism trapped in a rotating flow distributor having an inlet for receiving liquid phase comprising starting material as well as immobilized enzyme(s)/encapsulated cell(s), a cavity for trapping said immobilized enzyme(s), cell fragment(s), and/or encapsulated whole cell microorganism(s), and outlet openings on the rotating periphery of the flow distributor.. .
Spinchem Ab


08/18/16
20160237234 
new patent

Heat-expandable microspheres, process for producing the same, and application thereof


Heat-expandable microspheres composed of a thermoplastic resin shell and a thermally-vaporizable blowing agent encapsulated therein, and having an average particle size ranging from 1 to 100 μm. The amount of dmf-insoluble matter (g1) and the amount of dmf-mek-insoluble matter (g2) constituting the heat-expandable microspheres satisfy 1.05<g2/g1.
Matsumoto Yushi-seiyaku Co., Ltd.


08/18/16
20160236842 
new patent

Pack of single use capsule or pod, packaging machine and method thereof


A pack including at least one single-use capsule or pod for a portioned beverage which has two opposite bases, and a side wall connecting the two bases defining therewith a chamber for containing an aromatic substance; the pack has a sealed container for containing the capsule or pod housed in a protective inert gas atmosphere; more specifically the sealed container copies at least in part the shape of the capsule or pod.. .
Azionaria Costruzioni Macchine Automatiche A.c.m.a. S.p.a.


08/18/16
20160236821 
new patent

Multi-compartment roll-up container


A multi-compartment container structure has individual containers connected together. All the individual containers can have the same size and shape, and each has a flat base wall.

08/18/16
20160236165 
new patent

Silica microcapsules, process of making the same and uses thereof


The present document describes a microcapsule having silica shells, processes for making the same, processes for functionalizing said microcapsules and processes for encapsulating active agent in said microcapsules.. .
Les Innovations Materium Inc.


08/18/16
20160235894 
new patent

Use of bacterial polysaccharides for biofilm inhibition


A method comprises preventing or inhibiting bacterial adhesion and/or bacterial biofilm development by treating a substrate with a composition of a soluble group ii capsular polysaccharide obtained from a bacterial strain.. .
Centre National De La Recherche Scientifique


08/18/16
20160235883 
new patent

Antimycotic polymerisable bone cement and a the production thereof


The invention describes a bone cement with antimycotic efficacy based on organic polymers, such as polymethylmethacrylate. The bone cement comprises an antimycotic agent, in particular amphotericin b, that is released from the polymerised bone cement in the presence of water or aqueous media, such as body fluids.
Heraeus Medical Gmbh


08/18/16
20160235749 
new patent

Micro-particulated nanocapsules containing lopinavir with enhanced oral bioavailability and efficacy


The present disclosure provides controlled-release delivery systems for oral delivery of active agents, e.g. Lopinavir, comprising micro-particulated with enhanced oral bioavailability and efficacy, which may be used for treating hiv..
Yissum Research Development Company Of The Hebrew University Of Jerusalem Ltd.


08/18/16
20160235685 
new patent

Photosensitive capsules and cosmetic and pharmaceutical use thereof


The invention relates to capsules of core/shell type, the core comprising an active agent; the shell comprising one or more concentric and alternating layers of a first photosensitive anionic amino polymer and of a second cationic polymer. The invention also relates to a cosmetic or pharmaceutical composition comprising such capsules.
L'oreal


08/18/16
20160235663 
new patent

Delivery capsule with threshold release


A capsule includes a compressible reservoir and a gas generating unit disposed in a housing. A threshold valve seals an opening in the housing, through which contents of the reservoir may exit the capsule.
Medimetrics Personalized Drug Delivery, B.v.


08/18/16
20160235587 
new patent

Modular intraocular lens designs and methods


A modular iol system including intraocular primary and secondary components, which, when combined, form an intraocular optical correction device, wherein the secondary component is placed on the primary component within the perimeter of the capsulorhexis, thus avoiding the need to touch or otherwise manipulate the capsular bag. The secondary component may be manipulated, removed, and/or exchanged for a different secondary component for correction or modification of the optical result, on an intra-operative or post-operative basis, without the need to remove the primary component and without the need to manipulate the capsular bag.
The Regents Of The University Of Colorado, A Body Corporate


08/18/16
20160235524 
new patent

Prosthetic capsular devices, systems, and methods


A prosthetic capsular device configured to be inserted in an eye includes a housing structure and a ring structure. The housing structure includes a first side, a second side opposite the first side, a third side, a fourth side opposite the third side, a posterior side including a refractive surface, an anterior side opposite the posterior side, and a longitudinal axis.
Omega Ophthalmics Llc


08/18/16
20160235523 
new patent

Curvature-changing, accommodative intraocular lenses with expandable peripheral reservoirs


An intraocular lens includes a deformable outer shell having a distal end and a proximal end, a fluid optic having at least one elastic membrane surface positioned to traverse an optical axis of a patient's eye and at least partially defining an internal chamber to hold an optical fluid, and an inner shell associated with the fluid optic having a distal end and a proximal end. Each end is joined to a corresponding end of the outer shell to define a reservoir between the inner and outer shells, the reservoir at least partially disposed about a circumference of the fluid optic and in fluid communication with the internal chamber.
Novartis Ag


08/18/16
20160235520 
new patent

Semi-flexible posteriorly vaulted acrylic intraocular lens for the treatment of presbyopia


An intraocular lens having an optic and at least one semi-rigid, haptic connected to the optic, both of which may be acrylic. The intraocular lens can have a fixed longitudinal length, e.g., the same fixed length pre-operatively and post-operatively.

08/18/16
20160235431 
new patent

Tissue incision device and method


A minimally invasive tissue incision system for creating joint capsulotomies and releasing/incising various tendon and fibrous band structures. The system contains a penetrating needle which is retractable so as to expose a cutting element, and which may be used as a penetrating needle to pierce the skin and other soft tissue structures.
Release Medical, Inc.


08/18/16
20160235282 
new patent

Capsule endoscope


Provided is a capsule endoscope in which an objective lens unit includes, at the extreme object side, a lens which is a meniscus lens having negative power and disposed with the convex surface thereof towards the object side, so that the convex surface thereof faces the exterior. An illumination unit includes a light source and an illumination window member.
Olympus Corporation


08/18/16
20160235234 
new patent

Laminated mat with endcap


An improved laminated mat is disclosed and includes a plurality of layers and end caps. The plurality of layers may be formed of wood, synthetic materials, wood, metal, or a combination of such materials.
The Modern Group, Ltd.


08/18/16
20160235114 
new patent

Fabrication of core/shell capsules of different geometries and treatment therafter


Multi-shelled capsules are made by co-extruding a first liquid flavorant composition and a first shell-forming polymeric material to form droplets which are hardened to form an inner shell containing a first liquid flavorant composition, and then coated with a second shell-forming polymeric material which is hardened to form an outer shell. The result is a capsule where the inner surface of the outer shell is separate and/or separable from the outer surface of the inner shell to define a space, wherein a second liquid flavorant composition may be located..
Altria Client Services Inc.


08/18/16
20160235102 
new patent

Sweetener composition, sweetener products, and methods of sweetening


A method of reducing oral cavity and tongue coating adherence and tongue numbing effects of a sweetener composition and imparting a more sugar-like temporal and flavor profile to a high potency sweetener, that includes providing to a person a sweetener composition that includes an encapsulated high potency sweetener or a high potency sweetener included in an emulsified mixture. The high potency sweetener is selected from the group consisting of: mogroside iv, mogroside v, luo han guo sweetener, siamenoside, monatin and its salts (monatin ss, ra rs, sr).
Almendra Americas, Llc


08/18/16
20160235095 
new patent

Process for producing flavoured food particles


The present invention is in the field of the flavouring of foods. In particular, the present invention is directed to a process for the encapsulation of flavours and/or aromas.
Symrise Ag


08/18/16
20160235091 
new patent

Core and kibble-like product


A liquid core and shell product is provided. The product can have at least three layers: a solid food based material, a liquid-based substance, and an encapsulate material.
Mars, Incorporated


08/18/16
20160235015 
new patent

Tree treatment capsule


A capsule (1) for insertion into a bore of a porous element to apply treatment substance to the interior of the element and having a container (2), with at least one internal cavity (3) for receiving treatment substance and an outer stop flange (8), and a plug (4) received in and fixed to the container through a common interconnecting land (5). A first container shank portion (6) that extends from a first insertion end (1a) of the capsule and up to the area of the interconnecting land has a uniform, generally cylindrical shape, a second container shank portion (7) extending away from said container first shank portion, from the area of the inter- connecting land towards the outer stop flange, at least at an inner surface (7b) thereof has an outwardly slightly diverging, conical shape and at an outer surface (7a) thereof, separated a short distance from the outer stop flange has a first circumferential beveled edge (9) serving as a transition to an outer increased diameter section (7c).
Mertec Ab


08/18/16
20160234997 
new patent

Systems and methods for aerial seeding


Reforestation capsules composed of biodegradable materials are operable to be used in aerial reforestation operations. Capsules may contain one or more seedlings, compacted fertilizer, soil, and/or nutrients.
New Jersey Institute Of Technology


08/11/16
20160234964 

An improved enclosure for hermetical encapsulated electronics


Provided is an enclosure for encapsulating one or more printed circuit boards (pcbs) configured for having electronic devices mounted thereon. The enclosure includes a main chassis body including a bottom portion and an outer wall including connectable panels for encasing the main chassis body.
Ge Intelligent Platforms, Inc.


08/11/16
20160234949 

Electronic device with cover


An electronic device is provided. The electronic device includes a front glass cover forming a front face of the electronic device, a rear glass cover forming a rear face of the electronic device, a metal bezel encapsulating a space formed by the front glass cover and the rear glass cover, and a display device disposed in the space and that includes a screen region exposed through the front glass cover.
Samsung Electronics Co., Ltd.


08/11/16
20160234884 

Heater cable having a tapered profile


A self-regulating heater cable includes a ptc core formed of positive temperature coefficient material and disposed in electrical contact with at least two bus wires. The ptc core may encapsulate the bus wires and space the bus wires apart a predetermined distance via a connecting portion of the ptc core.
Pentair Thermal Management Llc


08/11/16
20160234752 

Method and apparatus of lwa pdu routing


Apparatus and methods are provided for lwa pdu routing. In one novel aspect, lte pdu packets are routed through a wlan ap to a ue by encapsulation of the data packets.
Mediatek Inc.


08/11/16
20160234604 

Molded interconnect mircoelectromechanical system (mems) device package


A microelectromechanical system (mems) device package for encapsulating a mems device a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms either side walls or a divider of the mems device package and is adapted to route electrical connections from the mems device to either the substrate or a second mems device package via the substrate..
Robert Bosch Gmbh


08/11/16
20160234585 

Speaker clip


Certain embodiments may take the form of an electronic device having a main housing encapsulating operative circuitry for the device. The electronic device includes an attachment member moveably coupled to the metal housing.
Apple Inc.


08/11/16
20160234517 

Hybrid codec scalable video


A hybrid codec scalable video bitstream comprises first encapsulation units carrying video data of a base layer and encoded according to a first video coding standard and second encapsulation units carrying video data of at least one enhancement layer and encoded according to a second video coding standard. A prefix syntax element is added to each second encapsulation unit.
Telefonaktiebolaget L M Ericsson (publ)


08/11/16
20160234059 

Method for migrating service of data center, apparatus, and system


A method for migrating a service of a data center is disclosed. When an active data center is faulty, a tunnel processing device disables a locally-saved tunnel entry of a server in the active data center.
Huawei Technologies Co.,ltd.


08/11/16
20160234039 

Methods and systems for transmitting and receiving packets


A method carried out at a network node for managing aggregated virtual private network (vpn) connection. The network node establishes an aggregated vpn connection with a network element and determines a first uplink bandwidth limit and/or a first downlink bandwidth limit.
Pismo Labs Technology Limited


08/11/16
20160234033 

Interoperability for distributed overlay virtual environment


A method includes receiving tunnel information and end point information in response to a request to a distributed cluster. A common tunnel type supported by a source switch and a destination switch is selected.
International Business Machines Corporation


08/11/16
20160233774 

Magnetically coupled galvanically isolated communication using lead frame


An integrated circuit package includes an electromagnetic communication link formed by a portion of a lead frame within an encapsulation. The lead frame includes a first conductor forming a first conductive loop a second conductor forming a second conductive loop galvanically isolated from the first conductive loop.
Power Integrations, Inc.


08/11/16
20160233641 

Integrated hybrid laser source compatible with a silicon technology platform, and fabrication process


A photonic integrated circuit includes a first insulating region encapsulating at least one metallization level, a second insulating region at least partially encapsulating a gain medium of a laser source, and a stacked structure placed between the two insulating regions. The stacked structure includes a first polycrystalline or single-crystal silicon layer, a second polycrystalline or single-crystal silicon layer, an intermediate layer optically compatible with the wavelength of the laser source and selectively etchable relative to silicon and that separates the first layer from a first portion of the second layer, and the gain medium facing at least one portion of the first layer.
Stmicroelectronics (crolles 2) Sas


08/11/16
20160233567 

Cavity filter and rf communication device with the cavity filter


A cavity filter and a rf communication device including the cavity filter are disclosed. The cavity filter includes a cavity body, a cover plate, a resonance rod, a tuning screw, and a supporting member.
Shenzhen Tatfook Technology Co., Ltd


08/11/16
20160233453 

Flexible display device


A flexible display device includes: a flexible substrate; a display unit on the flexible substrate and including a display area capable of displaying an image; and a thin film encapsulating layer encapsulating the display unit and including at least one inorganic encapsulating film and at least one organic encapsulating film, where the organic encapsulating film includes at least one first organic region including a first organic material and at least one second organic region including a second organic material that is different from the first organic material, and the at least one first organic region extends in a first direction, the at least one first organic region and the at least one second organic region are aligned with each other, and a first young's modulus of the at least one first organic region is different from a second young's modulus of the least one second organic region.. .
Samsung Display Co., Ltd.


08/11/16
20160233452 

Organic light emitting diode display


An organic light emitting diode display includes a display substrate including an organic light emitting element and a driving circuit part, an encapsulation substrate sealing the display substrate, and a sealing portion between the display substrate and the encapsulation substrate, the sealing portion including a plurality of sealing frame portions around the display substrate, and a first sealing frame portion of the plurality of sealing frame portions being adjacent to a pad portion, wherein at least one of a width of an edge of the sealing portion and a width of the first sealing frame portion is wider than a width of a sealing frame portion other than the first sealing frame portion.. .
Samsung Display Co., Ltd.


08/11/16
20160233396 

Light emitting device and resin composition


Provided a light emitting device comprising: a package; a light emitting element disposed in the package; an encapsulation member that covers the light emitting element, the encapsulation member being formed from a resin composition that contains a fluorescent material, a resin, and nanoparticles selected from at least one of the group consisting of aluminum oxide nanoparticles, titanium oxide nanoparticles, zinc oxide nanoparticles, zirconium oxide nanoparticles, and silicon oxide nanoparticles, wherein when the resin composition includes silicon oxide nanoparticles, the content of the silicon oxide nanoparticles is 0.02 to 5 mass parts relative to 100 mass parts of the resin; and wherein the fluorescent material is a red-light emitting fluorescent material including a fluoride material having a chemical composition that includes tetravalent manganese, at least one selected from the group consisting of alkali metal elements and nh4+, and at least one selected from the group consisting of elements from group 4 of the periodic table and elements from group 14 of the periodic table.. .
Nichia Corporation


08/11/16
20160233274 

Organic light-emitting display apparatus


An organic light-emitting display apparatus includes: a display substrate; at least one thin film transistor (tft) on the display substrate; an organic light-emitting diode (oled) electrically connected to the tft, the oled including: a first electrode on each sub-pixel on the display substrate; an intermediate layer on the first electrode; and a second electrode on the intermediate layer; an encapsulation substrate covering the oled; a filler filling a space between the display substrate and the encapsulation substrate, the filler including scatterers having optical anisotropy; and a color filter between the encapsulation substrate and the filler, the color filter including a color filter electrode at a surface of the color filter.. .
Samsung Display Co., Ltd.


08/11/16
20160233205 

Method for fabricating semiconductor package


A method for fabricating a semiconductor package is provided, which includes the steps of: providing a first substrate having a plurality of first conductive posts on a surface thereof and providing a second substrate having a third surface having a chip disposed thereon and a fourth surface opposite to the third surface; disposing the first substrate on the third surface of the second substrate through the first conductive posts; forming an encapsulant between the first substrate and the second substrate, wherein the encapsulant has a first surface adjacent to the first substrate and a second surface opposite to the first surface; and removing the first substrate, thereby effectively preventing solder bridging from occurring.. .
Siliconware Precision Industries Co., Ltd.


08/11/16
20160233196 

Semiconductor package using a coreless signal distribution structure


A semiconductor package using a coreless signal distribution structure (csds) is disclosed and may include a csds comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface. The semiconductor package may also include a first semiconductor die having a first bond pad on a first die surface, where the first semiconductor die is bonded to the first surface of the csds via the first bond pad, and a second semiconductor die having a second bond pad on a second die surface, where the second semiconductor die is bonded to the second surface of the csds via the second bond pad.
Amkor Technology, Inc.


08/11/16
20160233194 

Package structure and fabrication method thereof


A package structure is provided, which includes: a dielectric layer having opposite first and second surfaces; a circuit sub-layer formed in the dielectric layer; an electronic element disposed on the first surface of the dielectric layer and electrically connected to the circuit sub-layer; a plurality of conductive posts formed on the first surface of the dielectric layer and electrically connected to the circuit sub-layer; and an encapsulant formed on the first surface of the dielectric layer and encapsulating the electronic element and the conductive posts. Upper surfaces of the conductive posts are exposed from the encapsulant so as to allow another electronic element to be disposed on the conductive posts and electrically connected to the circuit sub-layer through the conductive posts, thereby overcoming the conventional drawback that another electronic element can only be disposed on a lower side of a package structure and improving the functionality of the package structure..
Siliconware Precision Industries Co., Ltd.


08/11/16
20160233187 

Semiconductor package using a contact in a pleated sidewall encapsulant opening


A semiconductor package, and a method of manufacturing thereof, comprising a contact in a plated sidewall encapsulant opening, substantially as shown in and/or described in connection with at least one of the figures, as set forth more completely in the claims.. .
Amkor Technology, Inc.


08/11/16
20160233169 

Wafer level semiconductor package and manufacturing methods thereof


A semiconductor package includes at least one semiconductor die having an active surface, an interposer element having an upper surface and a lower surface, a package body, and a lower redistribution layer. The interposer element has at least one conductive via extending between the upper surface and the lower surface.
Advanced Semiconductor Engineering, Inc.


08/11/16
20160233168 

Semiconductor device and forming 3d dual side die embedded build-up semiconductor package


A semiconductor device has a plurality of semiconductor die. A substrate is provided with bumps disposed over the substrate.
Stats Chippac, Ltd.


08/11/16
20160233156 

Electronic component, semiconductor package, and electronic device using the same


An electronic component, a semiconductor package, and an electronic device including the electronic component and/or the semiconductor package are provided. The electronic component includes an electronic element; an encapsulation member that encapsulates the electronic element and has a first surface and a second surface substantially parallel to each other; and a lead electrically connected to the electronic element and extending outward from the encapsulation member.

08/11/16
20160233149 

Semiconductor chip package having contact pins at short side edges


A semiconductor chip package includes a semiconductor chip, an encapsulation body encapsulating the semiconductor chip, a chip pad, and electrical contact elements connected with the semiconductor chip and extending outwardly. The encapsulation body has six side faces and the electrical contact elements extend exclusively through two opposing side faces which have the smallest surface areas from all the side faces.
Infineon Technologies Austria Ag


08/11/16
20160233113 

Methods for forming package-on-package structures having buffer dams


Package-on-package (pop) structures and methods of forming the same are disclosed. In some embodiments, a method of forming a pop structure may include: plating at least one through-assembly via (tav) over a peripheral region of a conductive seed layer; forming a dam member over a central region of the conductive seed layer; and placing a die over the central region of the conductive seed layer.
Taiwan Semiconductor Manufacturing Company, Ltd.






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