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Caps

Caps-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Smart textile product and method for fabricating the same
Universiteit Gent
August 10, 2017 - N°20170231089

The present disclosure relates to a smart textile product and a method for manufacturing a smart textile product. The smart textile product is provided with a flexible and/or stretchable textile fabric (10) comprising a plurality of electrically conductive threads (11, 12) and at least one rigid electronic or optoelectronic component (20) comprising at least one electrically conductive pad (21, 22), which is in electrical contact ...
Method and apparatus for processing service node ability, service classifier and service controller
Zte Corporation
August 10, 2017 - N°20170230246

A service node capability processing method and apparatus, a service classifier and service controller are described. The method includes: determining an exchange information set of service nodes on a service function chaining for processing a data packet, wherein the exchange information set includes an intersection of capabilities of the service nodes on the service function chaining; and encapsulating the exchange ...
Dynamic network service overlay establishment in hub-and-spoke packet switching networks
Cisco Technology, Inc., A Corporation Of California
August 10, 2017 - N°20170230199

In one embodiment, a packet switching device is configured to operate as a spoke or a hub in a dynamic multipoint virtual private network (dmvpn) using one or more initially negotiated service overlay capabilities including service encapsulation to use in communicating service overlay data packets between the packet switching device and another device (e. G., spoke, hub) of the dmvpn ...
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Rotor assembly manufacturing technique and resultant structure
Atieva, Inc.
August 10, 2017 - N°20170229932

A rotor fabrication method is provided, along with the resultant rotor assembly. The rotor uses pre-fabricated conductive rotor bars in which the ends have been shaped and sized to fit within corresponding end cap receptacles. After assembly, the structure is compressed, thereby achieving mechanical and electrical coupling between the conductive rotor bars and the end caps. Locking members disposed at ...
Positive electrode composition, a positive electrode of a lithiumion electrochemical cell, and a method of ...
Gm Global Technology Operations Llc
August 10, 2017 - N°20170229705

A positive electrode composition includes a binder material; an electrically conductive material dispersible in the binder material and comprising a plurality of conductive carbon particles; an active material dispersible in the binder material and comprising a plurality of active particles; and a coating agent comprising one of a non-lithiated polymer, an at least partially-lithiated polymer, and a fully-lithiated polymer. The ...
Transparent electrode materials and methods for forming same
Flinders Partners Pty Ltd
August 10, 2017 - N°20170229668

A transparent electrode material including a conductive layer having an active surface and a second surface, and an adjacent base layer, wherein: ∘ the conductive layer includes a conductive network formed by metallic nanowires and carbon nanotubes encapsulated in a conductive material; ∘ the second surface of the conductive layer has encapsulated nanowires and/or nanotubes projecting therefrom; and ∘ ...
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Method for producing semiconductor light-emitting device
Sumitomo Chemical Company, Limited
August 10, 2017 - N°20170229622

A method for producing a semiconductor light-emitting device involves applying a silicone resin composition to a surface of a semiconductor light-emitting element and forming an encapsulating portion covering the surface of the light-emitting element by heat curing the applied resin composition. The silicone resin composition contains at least 60% by mass of a silicone resin in which the constituent silicon atoms ...
Method for manufacturing solar cell module and apparatus for manufacturing solar cell module
Panasonic Intellectual Property Management Co., Ltd.
August 10, 2017 - N°20170229605

A method for manufacturing a solar cell module comprises: a step for manufacturing a multilayer by stacking and heat-pressing solar cells, an encapsulant, and protection members; a heat treatment step for heating the entire multilayer and, after the heating ends, cooling the multilayer to a prescribed temperature; and a light radiation step for radiating light with a maximum peak wavelength ...
Organic light emitting display panel and method for manufacturing the same
Tianma Micro-electronics Co., Ltd.
August 10, 2017 - N°20170229522

An organic light emitting display panel and a method for manufacturing the same are provided. The organic light emitting display panel includes: an organic light emitting element array substrate; a thin film encapsulation layer covering the organic light emitting element array substrate and including at least one inorganic layer and at least one organic layer; a wettability adjustment layer disposed ...
Packages and methods of forming packages
Taiwan Semiconductor Manufacturing Company, Ltd.
August 10, 2017 - N°20170229436

Various packages and methods of forming packages are discussed. According to an embodiment, a package includes a processor die at least laterally encapsulated by an encapsulant, a memory die at least laterally encapsulated by the encapsulant, and a redistribution structure on the encapsulant. The processor die is communicatively coupled to the memory die through the redistribution structure. According to further ...
Semiconductor device and method of manufacture
Taiwan Semiconductor Manufacturing Company, Ltd.
August 10, 2017 - N°20170229434

A semiconductor device and method for providing an enhanced removal of heat from a semiconductor die within an integrated fan out package on package configuration is presented. In an embodiment a metal layer is formed on a backside of the semiconductor die, and the semiconductor die along and through vias are encapsulated. Portions of the metal layer are exposed and ...
Fan-out back-to-back chip stacked packages and the method for manufacturing the same
Powertech Technology Inc.
August 10, 2017 - N°20170229426

Disclosed is a fan-out back-to-back chip stacked package, comprising a back-to-back stack of a first chip and a second chip, an encapsulant, a plurality of vias disposed in the encapsulant, a first redistribution layer and a second redistribution layer. The encapsulant encapsulates the sides of the first chip and the sides of the second chip simultaneously and has a thickness ...
Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
Texas Instruments Incorporated
August 10, 2017 - N°20170229408

A millimeter wave integrated circuit (ic) chip. The ic chip comprises an ic die and a wire bond ball grid array package encapsulating the ic die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the ...
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Fabrication method of semiconductor package
Siliconware Precision Industries Co., Ltd.
August 10, 2017 - N°20170229364

A fabrication method of a semiconductor package includes the steps of: forming a release layer on a carrier having concave portions; disposing chips on the release layer in the concave portions of the carrier; forming an encapsulant on the chips and the release layer; forming a bonding layer on the encapsulant; removing the release layer and the carrier so as ...
Corrosion resistant chip sidewall connection with crackstop and hermetic seal
Globalfoundries Inc.
August 10, 2017 - N°20170229362

The present disclosure relates to semiconductor structures and, more particularly, to corrosion resistant chip sidewall connections with crackstop structures with a hermetic seal, and methods of manufacture. The structure includes: a guard ring structure surrounding an active region of an integrated circuit chip; an opening formed in the guard ring structure; and a hermetic seal encapsulating the opening and a ...
Method of manufacturing semiconductor device having semiconductor chip mounted on lead frame
Sii Semiconductor Corporation
August 10, 2017 - N°20170229355

A semiconductor device uses a lead frame, in which an outer lead is electrically connected to an inner lead suspension lead via an inner lead. An encapsulating resin covers the inner lead and part of the outer lead, and a plated film is formed on an outer lead cut surface so that a solder layer is easily formed on all ...
Protected capacitor system and method
Mjg Innovations, Llc
August 10, 2017 - N°20170229242

A protected capacitor system/method implementing enhanced transient over-voltage suppression is disclosed. The system/method incorporates one or more surge suppression devices (ssds) proximally located and in parallel with a capacitor structure to produce an overall protected capacitor structure having enhanced reliability and simultaneous ability to resist transient overvoltage conditions. The ssds are formed from series combinations of transient voltage ...
Protected capacitor system and method
Mjg Innovations, Llc
August 10, 2017 - N°20170229241

A protected capacitor system/method implementing enhanced transient over-voltage suppression is disclosed. The system/method incorporates one or more surge suppression devices (ssds) proximally located and in parallel with a capacitor structure to produce an overall protected capacitor structure having enhanced reliability and simultaneous ability to resist transient overvoltage conditions. The ssds are formed from series combinations of transient voltage ...
An inductor with an electrode structure
Cyntec Co., Ltd.
August 10, 2017 - N°20170229234

An inductor having a magnetic body, wherein a recess is formed in the magnetic body; a coil, formed by a conductive wire and disposed in the magnetic body, wherein a first terminal part of the conductive wire is placed on a bottom surface of the recess, wherein a first portion of the first terminal part is embedded inside the recess, ...
Reuseable holder for a radioactive source capsule
Illinois Tool Works Inc.
August 10, 2017 - N°20170229200

This disclosure pertains to a holder for a radioactive source capsule with pivoting first and second parts, with redundant mechanisms for retention of the capsule during transportation and handling. These retaining mechanisms include a set screw in the first pivoting part to engage the capsule and to prevent radial movement of the capsule, a locking shelf in the second pivoting ...
Image processing apparatus, capsule endoscope system, and endoscope system
Olympus Corporation
August 10, 2017 - N°20170228879

An image processing apparatus performs image processing based on image data and ranging data output from an image sensor. The ranging data represents a distance between the image sensor and a subject. The image sensor is configured to receive reflected light of illumination light reflected from the subject and to output the image data and the ranging data. The image ...
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