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Caps patents



      

This page is updated frequently with new Caps-related patent applications.




Date/App# patent app List of recent Caps-related patents
02/04/16
20160037609 
 Flexible display panel and display apparatus including the same patent thumbnailnew patent Flexible display panel and display apparatus including the same
A flexible display panel and a display apparatus including the flexible display panel are disclosed. The flexible display panel includes an encapsulated panel, a first protective film on one side of the encapsulated panel, and a second protective film on another side of the encapsulated panel.
Samsung Display Co., Ltd.


02/04/16
20160037583 
 Heated roll patent thumbnailnew patent Heated roll
A heated roll with a circular cylindrical casing tube 1 made from thermally conductive metal, which is closed at its end faces with caps 2, 3. One or more electric heating mats 8 are arranged inside the casing tube 1.
Robert Burkle Gmbh


02/04/16
20160037267 
 Encapsulated thermoacoustic projector based on freestanding carbon nanotube film patent thumbnailnew patent Encapsulated thermoacoustic projector based on freestanding carbon nanotube film
A suspended nanotube film (or films) producing sound by means of the thermoacoustic (ta) effect is encapsulated between two plates, at least one of which vibrates, to enhance sound generation efficiency and protect the film. To avoid the oxidation of carbon nanotubes at elevated temperatures and reduce the thermal inertia of surrounding medium the enclosure is filled with inert gas (preferably with high heat capacity ratio, γ=cp/cv, and low heat capacity, cp).
The Board Of Regents, The University Of Texas System


02/04/16
20160037082 
 Reconstruction of images from an in vivo multi-camera capsule patent thumbnailnew patent Reconstruction of images from an in vivo multi-camera capsule
Method and apparatus of reconstruction of images from an in vivo multi-camera capsule are disclosed. In one embodiment of the present invention, the capsule comprises two cameras with overlapped fields of view (fovs).
Capso Vision, Inc.


02/04/16
20160036774 
 Global vlan services patent thumbnailnew patent Global vlan services
One embodiment of the present invention provides a switch in a network of interconnected switches. The switch includes a forwarding domain apparatus and a forwarding apparatus.
Brocade Communications Systems, Inc.


02/04/16
20160036728 
 Method and system for vtep redundancy in a multichassis link aggregation domain patent thumbnailnew patent Method and system for vtep redundancy in a multichassis link aggregation domain
A method for transmitting mac frames. The method includes receiving, by a first switch in the mlag domain, a first media access control (mac) frame from an external device, wherein the external device is directly connected to the first switch, where the mlag domain consists of the first switch and the second switch.
Arista Networks, Inc


02/04/16
20160036702 
 Forwarding packets patent thumbnailnew patent Forwarding packets
A first access switch in the first fabric receives a notification sent by a second access switch in the first fabric, and the notification includes a nickname of the second access switch. The first access switch identifies an egress interface to a trill path from the first access switch to an access switch corresponding to the nickname in the notification.
Hangzhou H3c Technologies Co., Ltd.


02/04/16
20160036002 
 Organic light-emitting display apparatus patent thumbnailnew patent Organic light-emitting display apparatus
An organic light-emitting display apparatus includes a capping layer above an organic emission layer, an encapsulating layer encapsulating the capping layer and the organic emission layer, and a deposition layer above the capping layer and below the encapsulating layer, the deposition layer including a surface on which a plurality of cylinders are located.. .
Samsung Display Co., Ltd.


02/04/16
20160036001 
 Composite film and manufacturing method thereof, and encapsulation structure including the composite film patent thumbnailnew patent Composite film and manufacturing method thereof, and encapsulation structure including the composite film
The present invention discloses a composite film, a manufacturing method thereof and an encapsulation structure comprising the composite film. The composite film comprises at least one matrix membrane, each of which comprises at least one waterproof film.
Boe Technology Group Co., Ltd.


02/04/16
20160035946 
 Light emitting diode package structure, backlight module and display device patent thumbnailnew patent Light emitting diode package structure, backlight module and display device
The present disclosure provides a light emitting diode (led) package structure, a backlight module and a display device, and relates to the field of display technologies. The led package structure includes an encapsulation housing and an led chip encapsulated in the encapsulation housing.
Beijing Boe Display Technology Co., Ltd.


02/04/16
20160035842 
new patent

Semiconductor device including a trench at least partially filled with a conductive material in a semiconductor substrate and manufacturing a semiconductor device


A semiconductor device includes a semiconductor substrate and a first trench extending into or through the semiconductor substrate from a first side. The first trench is at least partially filled with a conductive material and electrically connected to the semiconductor substrate via a doped semiconductor layer at a sidewall of the first trench.
Infineon Technologies Austria Ag


02/04/16
20160035712 
new patent

Microelectronic package with stacked microelectronic units and manufacture thereof


A microelectronic package may include a first microelectronic unit including a semiconductor chip having first chip contacts, an encapsulant contacting an edge of the semiconductor chip, and first unit contacts exposed at a surface of the encapsulant and electrically connected with the first chip contacts. The package may include a second microelectronic unit including a semiconductor chip having second chip contacts at a surface thereof, and an encapsulant contacting an edge of the chip of the second unit and having a surface extending away from the edge.
Invensas Corporation


02/04/16
20160035700 
new patent

Chip package and chip assembly


A chip package is provided. The chip package may include an electrically conductive carrier; at least one first chip including a first side and a second side opposite of the first side, with its second side being electrically contacted to the electrically conductive carrier; an insulating layer over at least a part of the electrically conductive carrier and over at least a part of the first side of the chip; at least one second chip arranged over the insulating layer and next to the first chip; encapsulating material over the first chip and the second chip; and electrical contacts which extend through the encapsulation material to at least one contact of the at least one first chip and to at least one contact of the at least one second chip..
Infineon Technologies Ag


02/04/16
20160035696 
new patent

Method for forming package structure


A method for forming a package structure is provided, which includes: providing a pre-packaged panel including a first encapsulation layer, which includes multiple integrating units each including at least one semiconductor chip with multiple first pads, and first metal bumps are disposed on the first pads; providing a circuit board including a first surface and a second surface, where the circuit board includes multiple carrying units each including multiple input pads on the first surface and multiple output pads on the second surface; mounting the pre-packaged panel on the first surface to form multiple package units; forming a filling layer by filling a space between the first surface and the pre-packaged panel; forming second metal bumps on the output pads on the second surface; cutting the structure based on the multiple package units to form multiple independent package structures. Accordingly, the package structure improves package efficiency..
Nantong Fujitsu Microelectronics Co., Ltd.


02/04/16
20160035677 
new patent

Method for forming a package arrangement and package arrangement


A method for forming a package arrangement is provided, which may include: arranging at least one chip over a carrier; at least partially encapsulating the at least one chip with encapsulation material, wherein the encapsulation material is formed such that at least a portion of the carrier is uncovered by the encapsulation material; forming an electrically conductive structure over the encapsulation material and on the portion of the carrier uncovered by the encapsulation material; removing the carrier; and then forming a redistribution structure over the chip and the electrically conductive structure, wherein the redistribution structure electrically couples the electrically conductive structure and the chip.. .
Infineon Technologies Ag


02/04/16
20160035664 
new patent

Semiconductor package on package structure and forming the same


A package on package structure may be formed by fabricating or providing a bottom package having a substrate, at least one die on top of the substrate, and bonding pads on the top of the substrate. Next, a frame is formed on the bonding pads and connected to the bonding pads.
Qualcomm Incorporated


02/04/16
20160035663 
new patent

Semiconductor package system and method


A first protective layer is formed on a first die and a second die, and openings are formed within the first protective layer. The first die and the second die are encapsulated such that the encapsulant is thicker than the first die and the second die, and vias are formed within the openings.
Taiwan Semiconductor Manufacturing Company, Ltd.


02/04/16
20160035658 
new patent

Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure


An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, at least one electric connection structure mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and partially encapsulating the at least one electric connection structure so that part of a surface of the at least one electric connection structure is exposed to an environment, and a mounting provision configured for mounting the electronic device at a periphery device.. .
Infineon Technologies Ag


02/04/16
20160035651 
new patent

Leadless semiconductor package and method


A method of forming semiconductor devices on a leadframe structure. The leadframe structure comprising an array of leadframe sub-structures each having a semiconductor die arranged thereon.
Nxp B.v.


02/04/16
20160035645 
new patent

Exposed, solderable heat spreader for flipchip packages


A flipchip package may include a semiconductor die, a heat spreader, and encapsulation material. The semiconductor die may contain an electronic circuit and exposed electrical connections to the electronic circuit.
Linear Technology Corporation


02/04/16
20160035644 
new patent

Exposed, solderable heat spreader for integrated circuit packages


An integrated circuit package may include a semiconductor die, a heat spreader, and encapsulation material. The semiconductor die may contain an electronic circuit and exposed electrical connections to the electronic circuit.
Linear Technology Corporation


02/04/16
20160035641 
new patent

Semiconductor device including passivation layer encapsulant


A method of fabricating a semiconductor device includes forming a passivation layer on a least one capping layer of the semiconductor device, and forming an encapsulant layer on the passivation layer. The method further includes patterning the encapsulant layer to expose a portion of the passivation layer and forming a final via opening in the passivation layer.
Globalfoundries Inc.


02/04/16
20160035638 
new patent

Support base-attached encapsulant, encapsulated substrate having semiconductor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, semiconductor apparatus, and manufacturing semiconductor apparatus


Support base-attached encapsulant for collectively encapsulating a semiconductor device mounting surface of a substrate or semiconductor device forming surface of a wafer, containing a support base having one fibrous film or a plurality of the fibrous films being laminated, the fibrous film subjected to surface treatment with an organosilicon compound, and a resin layer of thermosetting resin formed on one surface of the support base. The support base-attached encapsulant inhibit the substrate or wafer from warping and semiconductor devices from peeling away from the substrate, and collectively encapsulate the semiconductor device mounting surface of the substrate or the semiconductor device forming surface of the wafer even when a large-diameter wafer or large-area substrate is encapsulated.
Shin-etsu Chemical Co., Ltd.


02/04/16
20160035618 
new patent

Ultrathin superlattice of mno/mn/mnn and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects


An electrical device including an opening in a low-k dielectric material, and a copper including structure present within the opening for transmitting electrical current. A liner is present between the opening and the copper including structure.
International Business Machines Corporation


02/04/16
20160035590 
new patent

System-in-packages and methods for forming same


One or more embodiments are directed to a system-in-package (sip) that includes a plurality of semiconductor chips and an interposer that that are molded in an encapsulation layer together. That is, a single processing step may be used to encapsulate the semiconductor chips and the interposer in the encapsulation layer.
Stmicroelectronics Pte Ltd


02/04/16
20160035530 
new patent

Display sealing apparatus and manufacturing display apparatus by using the same


A method of manufacturing a display apparatus includes forming a display device on a display area of a rear substrate, aligning the rear substrate and an encapsulation substrate, such that the display device is between the rear substrate and the encapsulation substrate, disposing a sealant between the rear substrate and the encapsulation substrate, such that the sealant is outside the display area and surrounds the display area; and rotating a laser beam along a closed curve while irradiating the laser beam onto an outer surface of the rear substrate or the encapsulation substrate, such that the rear substrate and the encapsulation substrate are sealed.. .
Samsung Display Co., Ltd.


02/04/16
20160033840 
new patent

Defect-mitigation layers in electrochromic devices


Electrochromic devices and methods may employ the addition of a defect-mitigating insulating layer which prevents electronically conducting layers and/or electrochromically active layers from contacting layers of the opposite polarity and creating a short circuit in regions where defects form. In some embodiments, an encapsulating layer is provided to encapsulate particles and prevent them from ejecting from the device stack and risking a short circuit when subsequent layers are deposited.
View, Inc.


02/04/16
20160033713 
new patent

Backlight assembly with brightness enhancing arrangement


A backlight assembly is provided with an upper reflective layer including a plurality of first openings; a lower reflective layer secured to the upper reflective layer; a light guide plate disposed between the upper and lower reflective layers; an opaque shading layer disposed on the upper reflective layer and including a circuit and a plurality of second openings; and a light source disposed under the lower reflective layer. The first openings are aligned with the second openings and communicate therewith.

02/04/16
20160033497 
new patent

Luminescence methods and reagents for analyte detection


The present invention relates to chemiluminescent method and regent to detect analyte. One aspect of the current invention relates to using first analyte binding molecule labeled solid phase support encapsulated with chemiluminescent dye and chemiluminescent reaction generating molecule or enzyme coupled with second analyte binding molecules such as antibody hrp conjugate to detect specific analyte molecules.

02/04/16
20160033412 
new patent

Partially encapsulated waveguide based sensing chips, systems and methods of use


Optical readers and alignment tools for detecting the level of an analyte. Described herein are small, disposable partially-encapsulated sensing chips for detecting an analyte level from a fluid sample (e.g., a blood sample) having an edge of the integrated sensing chip exposed to directly expose a plurality of excitation and a collection waveguides, as well as optical readers and methods of operating them.

02/04/16
20160033249 
new patent

Hot hole charge system and related methods


An apparatus, method and insulation medium for inserting and insulating a charge medium within a borehole includes a charge tube comprised of an elongate tube having a length and diameter sufficient for containing a desired quantity of a charge medium. A charge medium in a pumpable form is provided for substantially filling the charge tube.

02/04/16
20160033089 
new patent

Non-uniform lens array for illumination profile modification


Embodiments of a light source include a substrate having a first end and a second end opposite the first end. A plurality of solid state light emitting diodes (leds) form an array, with the plurality of leds mounted on the substrate in a row between the first end and the second end.
Excelitas Canada, Inc.


02/04/16
20160033081 
new patent

Gas storage modules, apparatus, systems and methods utilizing adsorbent materials


A gas storage module includes a two-dimensional body and a heat exchanging structure. The body includes a packed adsorbent having a composition and porosity effective for adsorbing a gas such as methane.
Research Triangle Institute


02/04/16
20160032992 
new patent

Light weight backing plate for a brake pad


A backing plate for a brake assembly includes a first face sheet, a second face sheet generally parallel to the first face sheet, and a metal foam core at least partially encapsulated between the first and second face sheets.. .
Robert Bosch Gmbh


02/04/16
20160032654 
new patent

Encapsulated explosives for drilling wellbores


Systems and methods for drilling operations may use encapsulated explosives to complement the performance of downhole cutting tools. An exemplary method may include drilling a wellbore penetrating a subterranean formation with a downhole cutting tool; circulating a drilling fluid in the wellbore, wherein the drilling fluid comprises a base fluid and an encapsulated explosive having an average diameter of about 10 nm to about 20 microns; triggering detonation of the encapsulated explosive; and detonating the encapsulated explosive proximal to a portion of the subterranean formation adjacent the downhole cutting tool..
Halliburton Energy Services, Inc.


02/04/16
20160032356 
new patent

Quantitative assessment for cap efficiency of messenger rna


The present invention provides, among other things, methods of quantitating mrna capping efficiency, particularly for mrna synthesized in vitro. In some embodiments, the methods comprise chromatographic methods of quantifying capping efficiency and methylation status of the caps..
Shire Human Genetic Therapies, Inc.


02/04/16
20160032271 
new patent

Encapsulation of bacteria and viruses in electrospun fibers


A method of preserving organisms in viable form, the method comprising: suspending organisms in a solution of electrospinnable polymer; drawing droplets of said solution through a spinneret; applying an electrostatic field to said droplets under electrospinning conditions; so as to form fibers having a diameter no greater than about 5 μm within which distinct organisms are encapsulated in viable form.. .
Technion Research & Development Foundation Limited


02/04/16
20160032270 
new patent

Apparatus and process for production of an encapsulated cell product


A process for production of an encapsulated cell product, the process comprises the steps of concentrating cells from a propagation medium using a tangential flow filtration system. Mixing the concentrated cells with an encapsulation medium to form a cell encapsulation mixture.
Geosynfuels, Llc


02/04/16
20160032148 
new patent

A making an optical assembly comprising depositing a solid silicone-containing hot melt composition in powder form and forming an encapsulant thereof


Methods of making optical assemblies and electronic devices comprising, depositing a solid silicone-containing hot melt composition in powder form onto an optical surface of an optical device; and forming, from the silicone-containing hot melt composition, an encapsulant that substantially covers the optical surface of the optical device. In some embodiments, the silicone containing hot melt composition is a reactive or unreactive silicone-containing hot melt.
Dow Corning Toray Co., Ltd.


02/04/16
20160032124 
new patent

Encapsulated fluorescent and photochromic dye polyurethane dispersion


The present disclosure provides an encapsulated dye dispersion and an inkjet ink comprising an ink vehicle and an encapsulated dye dispersion thereof. In particular, the encapsulated dye dispersion includes a fluorescent and/or photochromic dye.
Xerox Corporation


02/04/16
20160032123 
new patent

Encapsulated visible light absorbing dye polyurethane dispersion


The present disclosure provides an encapsulated visible light absorbing dye dispersion, and the process for producing the same. The present disclosure further provides an inkjet ink comprising an ink vehicle and an encapsulated visible light absorbing dye dispersion thereof, and the process for producing the same..
Xerox Corporation


02/04/16
20160032121 
new patent

Encapsulated titanium dioxide, fluorescent pigments, and pigmented polyurethane dispersion


The present disclosure provides an encapsulated pigment dispersion and an inkjet ink comprising an ink vehicle and an encapsulated pigment dispersion thereof. In particular, the encapsulated pigment dispersion includes a pigment selected from tio2 pigment, fluorescent pigment, phosphorescent pigment, and mixtures thereof.
Xerox Corporation


02/04/16
20160032064 
new patent

Encapsulant sheet for solar cell


An encapsulant sheet for a solar cell contains not less than 91% but less than 99% by mass of an ethylene-unsaturated ester copolymer (a), more than 1% but not more than 9% by mass of an olefin resins (b), 0.001 parts to 5 parts by mass of silicon dioxide and 0.001 to 0.5 parts by mass of a silane coupling agent, where the sum total of the content of the ethylene-unsaturated ester copolymer (a) and the content of the olefin resin (b) is taken as 100% by mass. The content of the silicon dioxide and the content of the silane coupling agent are relative to the total content of the ethylene-unsaturated ester copolymer (a) and the content of the olefin resin (b) being taken as 100% by mass.
Sumitomo Chemical Company, Limited


02/04/16
20160031945 
new patent

Materials and suppressing inflammatory and neuropathic pain


N-type voltage-gated calcium channels (cav2.2) are critical mediators of neurotransmitter release and are thought to be involved with transmission of nociception. The use of conventional cav2.2 blockers in pain therapeutics is limited by side effects.
Indiana University Research And Technology Corp.


02/04/16
20160031765 
new patent

Polyurethane encapsulate


Embodiments relate to a polyurethane coating film that has improved water barrier properties combined with mechanical strength. According to embodiments, a polyurethane encapsulate includes a polyurethane film that is a reaction product of an aromatic isocyanate and a polyol, and the polyol includes a butylene oxide based polyether polyol in an amount of at least 35 wt % based on a total weight of the polyol.
Dow Global Technologies Llc


02/04/16
20160031305 
new patent

Retractable truck bed cover having slat array with flexible joiner members and shielded seams


A retractable truck bed cover having an array of parallel aluminum slats joined together by connective hinges including leading and trailing edge configuration for improving the security of the cover by covering and concealing the seam between adjacent slats while improving the connective hinge's resistance to the effects of aging and/or exposure to temperature fluctuations. The truck bed cover connective hinge slat is designed to be in an array of discrete slats, which are joined to one another by means of joiner members secured at each end to slat end caps.

02/04/16
20160030935 
new patent

Microencapsulated catalyst-ligand system


A microencapsulated catalyst-ligand system is provided comprising a catalyst and a ligand microencapsulated within a permeable polymer microcapsule shell, wherein the ligand is a polymeric ligand. Processes for the preparation of said microencapsulated catalyst-ligand system are also provided..
Reaxa Limited


02/04/16
20160030891 
new patent

Single-stage water treatment system


A single-stage water treatment system may include a fine filtration module configured for receiving process material with a high suspended and/or dissolved solids content and for producing a concentrate and a permeate. The fine filtration module may include an elongate housing member, a plurality of tubular membranes arranged within the elongate housing member and comprising elongate tubular members having membranous sidewalls with a selected permeability, a pair of end caps configured for controlling the flow of the process material within the plurality of tubular membranes, and an adjustment mechanism configured to adjust the elongation of the plurality of tubular membranes thereby adjusting the permeability thereof..
Clark Technology, Llc


02/04/16
20160030731 
new patent

Apparatus with unencapsulated reinforcement


In various examples, a therapy delivery element for at least partial implantation in a patient includes an elongate body. The elongate body includes a substantially tubular braided structure that extends from proximate a proximal end to proximate a distal end of the elongate body.
Greatbatch Ltd.


02/04/16
20160030629 
new patent

Peptide-albumin hydrogel properties and its applications


Peptide-albumin hydrogels having a self-assembling, 3-dimensional nanofiber matrix are described. The nanofiber matrix comprises an amphiphilic peptide and albumin.
Kansas State University Research Foundation


02/04/16
20160030596 
new patent

Gas-filled stabilized particles and methods of use


Provided herein are various gas-filled particles having a stabilized membrane that encapsulates the gas. Pharmaceutical compositions, methods of use and treatment, and methods of preparation are also described..
Children's Medical Center Corporation


02/04/16
20160030590 
new patent

Vectors for delivery of agents across biological membranes


The disclosure provides for peptide-based bolaamphiphile vectors that are capable of encapsulating a variety of agents, including peptides, proteins, nucleic acids, and drugs. The disclosure further provides for delivering these agents across biological membranes using the peptide-based bolaamphiphile vectors..
The Regents Of The University Of California


02/04/16
20160030543 
new patent

Neisseria meningitidis compositions and methods thereof


In one aspect, the invention relates to an isolated polypeptide comprising an amino acid sequence that is at least 95% identical to seq id no: 71. In another aspect, the invention relates to an immunogenic composition including an isolated non-lipidated, non-pyruvylated orf2086 polypeptide from neisseria meningitidis serogroup b, and at least one conjugated capsular saccharide from a meningococcal serogroup..
Pfizer Inc.


02/04/16
20160030402 
new patent

Sustained-release nanoparticle compositions and methods for using the same


The present invention is a composition composed of a therapeutic agent encapsulated in a copolymer of an n-alkylacrylamide, a vinyl monomer, and a polyethylene glycol (peg) conjugate and a method for using the same in the treatment or prevention of a disease or condition.. .
Board Of Regents Of The University Of Nebraska By And Behalf Of The University Of Nebraska Medical


02/04/16
20160030361 
new patent

Cholestosome vesicles for incorporation of molecules into chylomicrons


The present invention is directed to a cargo-loaded cholesteryl ester nanoparticle with a hollow compartment (“cholestosome”) consisting essentially of at least one non-ionic cholesteryl ester and one or more encapsulated active molecules which cannot appreciably pass through an enterocyte membrane in the absence of said molecule being loaded into said cholestosome, the cholestosome having a neutral surface and having the ability to pass into enterocytes in the manner of orally absorbed nutrient lipids using cell pathways to reach the golgi apparatus. Pursuant to the present invention, the novel cargo loaded cholestosomes according to the present invention are capable of depositing active molecules within cells of a patient or subject and effecting therapy or diagnosis of the patient or subject..

02/04/16
20160030360 
new patent

Modified alginates for anti-fibrotic materials and applications


Covalently modified alginate polymers, possessing enhanced biocompatibility and tailored physiochemical properties, as well as methods of making and use thereof, are disclosed herein. The covalently modified alginates are useful as a matrix for coating of any material where reduced fibrosis is desired, such as encapsulated cells for transplantation and medical devices implanted or used in the body..
Massachusetts Institute Of Technology


02/04/16
20160030359 
new patent

Multi-layer hydrogel capsules for encapsulation of cells and cell aggregates


Biomedical devices for implantation with decreased pericapsular fibrotic overgrowth are disclosed. The device includes biocompatible materials and has specific characteristics that allow the device to elicit less of a fibrotic reaction after implantation than the same device lacking one or more of these characteristic that are present on the device.
Massachusetts Institute Of Technology


02/04/16
20160030351 
new patent

Sustained release microspheres and producing same


A method of making a sustained release microsphere formulation, wherein the release rate of a bioactive ingredient is manipulated by controlling the crystallinity of said bioactive ingredient, includes the steps of combining the active ingredient and an encapsulating polymer in at least one solvent, or mixtures thereof, to form a dispersed phase and processing the dispersed phase without filtering, filtering the combined dispersed phase with a hydrophobic or a hydrophilic filter, or filtering the active ingredient and encapsulating polymer individually with a hydrophobic or hydrophilic filter before combining them to form the dispersed phase. The dispersed phase is then combined with a continuous phase to form the microsphere formulation..
Oakwood Laboratories


02/04/16
20160030344 
new patent

Compositions including apolipoprotein and methods using focused acoustics for preparation thereof


The present disclosure relates to a composition that includes an apolipoprotein and a lipid bilayer, and methods and systems for preparing the composition. The apolipoprotein may be incorporated within at least a portion of the lipid bilayer.
Covaris, Inc.


02/04/16
20160030343 
new patent

Preparation and characterization of bone-targeted vancomycin-loaded liposomes for osteomyelitis treatment


A treatment method, system, and compound comprise directly targets osteomyelitis-infected bone tissue with one or more surface-modified liposomes. The surface-modified liposome(s) includes an alendronate targeting moiety utilized to modify the surface of the liposome.
Texas Tech University System


02/04/16
20160030295 
new patent

Slow release endodontic paste


The present invention discloses a root canal dental paste that has include a first portion made from at least one antibiotic compound and partially set calcium based cement which forms a matrix to at least partially encapsulate the antibiotic compound. The first portion is then ground and combined with a second portion being a non-setting material and an antibiotic to form a paste..

02/04/16
20160030289 
new patent

Manufacture of peanut formulations for oral desensitization


The present application relates to a method for managing the development and manufacturing process of a therapeutically effective formulation. Peanut proteins are characterized from peanut flour and encapsulated formulations made using the peanut flour for oral immunotherapy of peanut allergies..
Aimmune Therapeutics, Inc.


02/04/16
20160030241 
new patent

Opthalmic device for cell removal


In described embodiments, an ophthalmic device provides for cell removal. In one embodiment, the ophthalmic device is introduced into the eye to remove cells on the underside of the anterior capsular membrane and the posterior capsular surface that can grow and block vision in an eye following cataract surgery.

02/04/16
20160030221 
new patent

Internal covering membrane of duodenum


A duodenum internal covering membrane is disclosed. The covering membrane is made of a biocompatible material and mainly comprises an elastic ampulla and a tubular part, wherein the ampulla is positioned in the duodenal bulb, the tubular part can extend to the jejunum, the ampulla contains a wavy or v-shaped or trapezoidal or city wall-shaped elastic ring which is continuously encircled, the elastic ring is made of a memory or non-memory biocompatible material, peaks, valleys and bent angles of the elastic ring are single-circle coil springs with outward anchor hooks, the single-circle coil springs on the lower edge are penetrated and wound with recovery threads, the upper edge of the ampulla is a wavy or v-shaped or trapezoidal or city wall-shaped elastic membrane, the elastic ring and the ampulla comply with the motion of the duodenum and the bulb as a whole, and the ampulla and the tubular part can be closed up or folded into the shape of a ball or cylinder or capsule or spindle.

02/04/16
20160030106 
new patent

Surgical tools for spinal facet therapy to alleviate pain and related methods


Methods and surgical tools for treating back pain use a spinal facet debridement tool with cautery and denuding action and minimally invasive protocol that can denude and cauterize soft tissue associated with a synovial capsule of the spinal facet joint.. .
Medovex Corp.


02/04/16
20160029832 
new patent

Dispensing device with barrier properties


A device for controlled dispensing of capsules containing beverage ingredients, as well as a system and a beverage preparation machine that include the device, are disclosed. Methods of use of the device are also disclosed.
Nestec S.a.


02/04/16
20160029724 
new patent

Energy absorbing and displacing structure for body protective padding


This invention is an improved padding used by athletes and others to prevent or greatly reduce the instances of injury due to blows to the body. This is accomplished through the utilization of a radial expanding and contracting structure encapsulated in a foam type material..

02/04/16
20160029705 
new patent

Dual layer slipper sock and manufacturing same


A slipper sock is formed from an outer pouch and an inner pouch shaped to receive and encapsulate a person's foot. A border around an opening in the inner pouch is placed over a border around an opening in the outer pouch.
Jacques Moret, Inc.


02/04/16
20160029668 
new patent

Palatant compositions from fats, oils or fatty acids


A palatant composition can be derived from cocoa butter or a fat blend with a similar compositional profile and can be combined with a food composition to enhance the palatability of the food composition. Alternatively or additionally, a mixture of different fatty acids can be used.
Nestec Sa


01/28/16
20160028837 

Enabling mobile applications to acquire a mac address for obtaining location information


Techniques are presented to enable a network element in a network to receive a request from an application on a device, the request being encapsulated in a packet that includes a header that contains a physical layer identifier of the device to which the application does not have access. The physical layer identifier at the network element may be obtained.
Cisco Technology, Inc.


01/28/16
20160028695 

System and routing-based internet security


Method and system for improving the security of storing digital data in a memory or its delivery as a message over the internet from a sender to a receiver using one or more hops is disclosed. The message is split at the sender into multiple overlapping or non-overlapping slices according to a slicing scheme, and the slices are encapsulated in packets each destined to a different relay server as an intermediate node according to a delivery scheme.
May Patents Ltd.


01/28/16
20160028683 

Using a virtual internet protocol address to represent dually connected hosts in an internet protocol overlay network


Techniques are presented herein for distributing address information of host devices in a network. At a first router device, a packet is received from a first host device that is destined for a second host device.
Cisco Technology, Inc.


01/28/16
20160028654 

Servers, switches, and systems with virtual interface to external network connecting hardware and integrated networking driver


Methods, systems, and computer programs are presented for networking communications. One method includes an operation for receiving a packet in a first format by a virtual driver providing a communications interface of a first type (ci1), the first format being for ci1.
Pluribus Networks, Inc.


01/28/16
20160028178 

Electric connector


The present disclosure relates to an improved structure of an electric connector. Each of terminals has a butt joint part and is vertically linked with a joint part, and each joint part has an arch-shaped necked-down section with two grooves , and other side of joint part is linked with a positioning section which has an accommodating cavity and a protruding body separately formed at two opposite side surfaces thereof and is linked with an extension arm by other side.
Riidea International Corp.


01/28/16
20160028043 

Display device and manufacturing method thereof


A display device includes: a substrate; a plurality of pixels on the substrate; an organic encapsulation layer covering a pixel area including at least one pixel; a first inorganic encapsulation layer on the organic encapsulation layer and having a first crack at a pixel area gap; and a second inorganic encapsulation layer on the first inorganic encapsulation layer and filling the first crack.. .
Samsung Display Co., Ltd.






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