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Caps

Caps-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Connecting a flexible circuit to other structures
Microsoft Technology Licensing, Llc
April 12, 2018 - N°20180103544

One example provides a circuit structure comprising a liquid metal conductive path enclosed in an encapsulant, a polymer circuit support comprising a polymer having a functional species available for a condensation reaction, and a cross-linking agent covalently bonding the encapsulant to the polymer circuit support via the functional species.
Method and apparatus for supporting data transmission of network node in wireless communication system
Lg Electronics Inc.
April 12, 2018 - N°20180103495

A method of supporting data transmission of a network node in a wireless communication system includes: receiving downlink data from a data network (dn); encapsulating the downlink data with an ip address of an user equipment (ue) based on whether the dn is an internet protocol (ip) based network or a non-ip based network; not encapsulating, if the dn is ...
Systems and methods for transporting and retaining video header information for video content
Disney Enterprises, Inc.
April 12, 2018 - N°20180103301

There is provided a device comprising a non-transitory memory storing an executable code, a hardware processor executing the executable code to receive internet protocol (ip) packets encapsulating a video content, the ip packets including a frame having a header storing header information relating to the video content, retrieve at least one portion of the header information relating to the video ...
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Systems and methods of generating and processing files for partial decoding and most interested regions
Qualcomm Incorporated
April 12, 2018 - N°20180103199

Techniques and systems are provided for processing video data. For example, 360-degree video data can be obtained for processing by an encoding device or a decoding device. The 360-degree video data includes pictures divided into motion-constrained tiles. The 360-degree video data can be used to generate a media file including a plurality of tracks. Each of the plurality of tracks ...
Data transmission method and apparatus in optoelectronic hybrid network
Huawei Technologies Co., Ltd.
April 12, 2018 - N°20180102978

The present disclosure relates to a data transmission method and apparatus in an optoelectronic hybrid network. The method is: receiving an rdma transmission request, and determining an rdma transmission type and a to-be-transmitted data volume for data transmission according to the rdma transmission request; determining a preset encapsulation format corresponding to the rdma transmission type for data transmission and the ...
Application wire
Global Innovation Aggregators Llc.
April 12, 2018 - N°20180102970

Data is transferred from a plurality of ingress application flows over an mpls network. Application flow control information is identified from the unencapsulated headers of the ingress data streams and a flow parameter is appended to the header stack. Application outbound load balancing identifies multiple equal cost network bound paths and utilizes application flow parameters to distribute data streams over ...
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Indium phosphide wafer, photoelectric conversion element, and method for producing a monocrystalline indium phosphide
Jx Nippon Mining & Metals Corporation
April 12, 2018 - N°20180102446

In this photoelectric conversion element wherein group iii-iv compound semiconductor single crystals containing zinc as an impurity are used as a substrate, the substrate is increased in size without lowering conversion efficiency. A heat-resistant crucible is filled with raw material and a sealant, and the raw material and sealant are heated, thereby melting the raw material into a melt, softening ...
Fan-out semiconductor package
Samsung Electro-mechanics Co., Ltd.
April 12, 2018 - N°20180102332

A fan-out semiconductor package includes: a first interconnection member having a through-hole; a processor chip disposed in the through-hole; a memory chip disposed in the through-hole and including a plurality of dies stacked on each other; an encapsulant encapsulating at least portions of the first interconnection member, the memory chip, and the processor chip; and a second interconnection member disposed ...
Semiconductor device and lead frame with high density lead array
Nxp Usa, Inc.
April 12, 2018 - N°20180102305

A semiconductor device includes a lead frame having leads arranged in an array that has columns extending in a first direction and rows extending in a second direction. Each lead includes a bond pad portion and a solder pad portion down-set from the bond pad portion. The solder pad portion horizontally extends from the bond pad portion in the first ...
Electronic module and method for encapsulation thereof
Zf Friedrichshafen Ag
April 12, 2018 - N°20180102304

An electronic module of a control device of a vehicle includes at least one interconnect device, with electronic structural elements as the control unit, and at least one electronic component electrically connected to the interconnect device via a connecting region, wherein the structural elements of the interconnect device and each connecting region between the interconnect device and each dedicated electronic ...
Connectable package extender for semiconductor device package
Infineon Technologies Ag
April 12, 2018 - N°20180102300

A semiconductor packaging system includes a semiconductor device package having a semiconductor chip with two or more terminals and a protective structure encapsulating and electrically insulating the semiconductor chip. Two or more electrical conductors that are each electrically connected to one of the terminals extend to an outer surface of the protective structure. A first surface feature is on an ...
Semiconductor device
Mediatek Inc.
April 12, 2018 - N°20180102298

A semiconductor device includes a substrate, a body structure and an electronic component. The body structure is disposed above the substrate and includes a semiconductor die, a molding compound, a conductive component and a lower redistribution layer (rdl). The semiconductor die has an active surface. The molding compound encapsulates the semiconductor die and has a lower surface, an upper surface ...
Fan-out semiconductor package and photosensitive resin composition
Samsung Electro-mechanics Co., Ltd.
April 12, 2018 - N°20180102297

A fan-out semiconductor package includes: a semiconductor chip having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a first connection member disposed on the active surface of the semiconductor chip, wherein the encapsulant is a cured photosensitive resin composition including a ...
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Caps Patent Applications
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Database processing method, apparatus, and electronic device
Alibaba Group Holding Limited
April 12, 2018 - N°20180101563

Embodiments of the disclosure provide a database processing method, a database processing apparatus, and an electronic device. The database processing method can include: providing a plurality of transactions to a transaction queue, wherein each transaction of the plurality of transactions includes an encapsulated write request for writing data into a database; generating auto-increment identifiers (ids) for data rows of the ...
Enclosure-encapsulated raid rebuild
International Business Machines Corporation
April 12, 2018 - N°20180101456

A method for recovering data in a redundant array of independent disks (raid) is disclosed. In one embodiment, such a method includes implementing a raid in a storage architecture comprising a raid controller and a storage enclosure containing a set of storage drives belonging to the raid. The raid controller is configured to detect a failure condition associated with at ...
Backlight modules and liquid crystal devices
Shenzhen China Star Optoelectronics Technology Co., Ltd.
April 12, 2018 - N°20180101063

The present disclosure relates to a backlight module and a liquid crystal device. The backlight module includes a led light source and a lens bar. The led light source is arranged on the led substrate and includes a plurality of led lamps encapsulated by csp. The lens bar is arranged in the front of the led light source and includes ...
Semiconductor chip package having optical interface
Giparang Co., Ltd.
April 12, 2018 - N°20180100977

A semiconductor package including: a chip including a pad; an optical device including a pad; a mold configured to encapsulate the optical device and the chip; a wiring pattern configured to electrically connect the optical device and the chip; and an external connection terminal configured to electrically connect the semiconductor package to the outside. The chip includes at least one ...
Dust caps having coding system for facilitating installing a fiber optic network
Commscope Technologies Llc
April 12, 2018 - N°20180100974

The present disclosure relates to a fiber optic network including first and second optical components desired to be optically coupled together, and third and fourth optical components desired to be couple together. The first and second optical components include first and second de-mateable connection locations having dust caps with first coordinated indicia. The third and fourth optical components include third ...
Led tube lamp
Jiaxing Super Lighting Electric Appliance Co., Ltd
April 12, 2018 - N°20180100644

A ballast-bypass type led tube lamp is provided herein, which implements the safety function for protecting the user from electric shock since it conducts only when both ends thereof have been correctly installed into a lamp socket. The ballast-bypass type led tube lamp includes a lamp tube, two end caps, an led module and a power supply module. The power ...
Case with ballistic liner
United Technologies Corporation
April 12, 2018 - N°20180100408

A case for a gas turbine engine includes a plurality of distinct case sections in axial series. The case sections include, in axial order, a flange section, a forward shell section, a containment section, and an aft shell section. The forward shell section, the containment section, and the aft shell section are formed of a plurality of unidirectional roving fiber ...
Ink compositions
International Business Machines Corporation
April 12, 2018 - N°20180100077

An ink composition includes a fluid and a plurality of microcapsules suspended in the fluid. The fluid includes a first chemical compound that exhibits a first color characteristic in a first ph range and exhibits a second color characteristic in a second ph range, where the first color characteristic is visually distinct from the second color characteristic. A second chemical ...
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