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Caps patents



      

This page is updated frequently with new Caps-related patent applications.




Date/App# patent app List of recent Caps-related patents
04/07/16
20160100368 
 Method and system for planar, multi-function, multi-power sourced, long battery life radio communication appliance patent thumbnailMethod and system for planar, multi-function, multi-power sourced, long battery life radio communication appliance
Some embodiments provide multifunctional device that provides two or more of the following functions: a) ekey; b) ecall capability; c) body electric field measurement; d) body proximity measurement; e) external electric field measurement; f) one or two way voice announcement; g) motion sensor. Some embodiments provide an ekey that operates from battery energy and energy harvested by one or more of the following transducers: a) photo voltaic cell; b) radio frequency antenna; c) mechanical vibration, flexing; c) thermo-electric transducer.
Secureall Corporation


04/07/16
20160100260 
 Systems, devices, components and methods for providing acoustic isolation between microphones and transducers in bone conduction magnetic hearing aids patent thumbnailSystems, devices, components and methods for providing acoustic isolation between microphones and transducers in bone conduction magnetic hearing aids
Disclosed are various embodiments of systems, devices, components and methods for reducing feedback between a transducer and a microphone in a magnetic bone conduction hearing aid. Such systems, devices, components and methods include providing encapsulation compartments for the transducer and/or the microphone, and providing an acoustically-isolating housing for the microphone that is separate and apart from the main housing of the hearing aid..
Sophono, Inc.


04/07/16
20160099919 
 System and  providing a secure one-time use capsule based personalized and encrypted on-demand communication platform patent thumbnailSystem and providing a secure one-time use capsule based personalized and encrypted on-demand communication platform
A secure one-time use capsule based personalized and encrypted on-demand communication platform enables encrypted personalized secure on-demand stateless single-use capsuled communication channels over the internet. Using the personalized capsuled secure communication system, a greater degree of communication security can be achieved than in the existing conventional methods.

04/07/16
20160099861 
 Systems and methods for performing layer one link aggregation over wireless links patent thumbnailSystems and methods for performing layer one link aggregation over wireless links
A first layer one link aggregation master comprises a first port coupled to receive customer traffic; a first channel; a second channel; an aggregation engine coupled to the first and second channels; a first switch circuit coupled to the first port and to the first channel, and configured to communicate the customer traffic from the first port over the first channel to the aggregation engine, the aggregation engine including a splitter circuit configured to use layer one information to segment at least a portion of the customer traffic into a first virtual container and a second virtual container, the aggregation engine further including an encapsulation circuit configured to encapsulate the second virtual container using ethernet standards for transport over the second channel; a radio access card configured to generate an air frame based on the first virtual container for wireless transmission over a first wireless link of a link aggregation group to the receiver; and a second switch circuit coupled to the second channel, and configured to communicate the ethernet-encapsulated second virtual container over an ethernet cable to a slave for wireless transmission over a second wireless link of the link aggregation group to the receiver.. .
Aviat U.s., Inc.


04/07/16
20160099632 
 Motor housing with integral gear housing patent thumbnailMotor housing with integral gear housing
A motor assembly is provided that utilizes a single piece drive gear and bearing enclosure configured so that the end wall of the enclosure also serves as one of the motor's end caps, thereby helping to minimize coaxial misalignment between the input drive shaft of the primary drive gear and the motor's rotor shaft. To further minimize misalignment, three coaxial bearing assemblies are used, where the first and second bearing assemblies support the rotor shaft and the second and third bearing assemblies support the input drive shaft..
Atieva, Inc.


04/07/16
20160099433 
 Flexible display apparatus and  manufacturing the same patent thumbnailFlexible display apparatus and manufacturing the same
A flexible display apparatus including: a first film including a first surface and a second surface that are opposite each other, and a first groove formed in the first surface, the first film having a first rigidity; a third film on the second surface of the first film; a fourth film facing the third film; an emission display unit between and encapsulated by the third film and the fourth film; and a second film on the fourth film and facing the first film, the second film having a second rigidity that is less than the first rigidity.. .
Samsung Display Co., Ltd.


04/07/16
20160099428 
 Flexible organic light-emitting display device and  manufacturing the same patent thumbnailFlexible organic light-emitting display device and manufacturing the same
A flexible organic light-emitting display device and a method of manufacturing the flexible organic light-emitting display device are provided. The flexible organic light-emitting display device comprises a lower flexible substrate assembly and an upper flexible substrate assembly that are bonded by a bonding layer.
Lg Display Co., Ltd.


04/07/16
20160099373 
 Wafer level packaging, optical detection sensor and  forming same patent thumbnailWafer level packaging, optical detection sensor and forming same
An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure.
Stmicroelectronics Pte Ltd


04/07/16
20160099342 
 Structure and method to increase contact area in unmerged epi integration for cmos finfets patent thumbnailStructure and method to increase contact area in unmerged epi integration for cmos finfets
Source/drain contact structures with increased contact areas for a multiple fin-based complementary metal oxide semiconductor field effect transistor (cmosfet) having unmerged epitaxial source/drain regions and methods for forming such source/drain contact structures are provided by forming wrap-around source/drain contact structures for both n-type finfets and p-type finfets. Each of first source/drain contact structures for the n-type finfets includes at least one first conductive plug encapsulating epitaxial first source/drain regions on one side of a gate structure, while each of second source/drain contact structures for the p-type finfets includes at least a contact metal layer portion encapsulating epitaxial second source/drain regions on one side of the gate structure, and a second conductive plug located over a top surface of the contact metal layer portion..
International Business Machines Corporation


04/07/16
20160099332 
 Partial sacrificial dummy gate with cmos device with high-k metal gate patent thumbnailPartial sacrificial dummy gate with cmos device with high-k metal gate
A gate structure in a semiconductor device includes: a gate stack formed on a substrate with three sections, a bottom portion, a top portion, and a sacrificial cap layer over the top portion; gate spacers, source and drain regions, a nitride encapsulation over top and sidewalls of the gate stack after removal of the sacrificial cap layer, an organic planarizing layer over the nitride encapsulation, planarizing the encapsulation, and silicidation performed over the source and drain regions and the bottom portion after removal of the nitride encapsulation, the organic planarizing layer, and the top portion of the gate stack.. .
International Business Machines Corporation


04/07/16
20160099246 

Structure and method to increase contact area in unmerged epi integration for cmos finfets


Source/drain contact structures with increased contact areas for a multiple fin-based complementary metal oxide semiconductor field effect transistor (cmosfet) having unmerged epitaxial source/drain regions and methods for forming such source/drain contact structures are provided by forming wrap-around source/drain contact structures for both n-type finfets and p-type finfets. Each of first source/drain contact structures for the n-type finfets includes at least one first conductive plug encapsulating epitaxial first source/drain regions on one side of a gate structure, while each of second source/drain contact structures for the p-type finfets includes at least a contact metal layer portion encapsulating epitaxial second source/drain regions on one side of the gate structure, and a second conductive plug located over a top surface of the contact metal layer portion..
International Business Machines Corporation


04/07/16
20160099235 

Method of manufacturing a single light-emitting structure


The instant disclosure provides a light-emitting module and a method of manufacturing a single light-emitting structure. The light-emitting module includes two identical light-emitting structures disposed on the same plane.
Lite-on Electronics (guangzhou) Limited


04/07/16
20160099232 

Fingerprint recognition semiconductor device and semiconductor device


A fingerprint recognition semiconductor device includes an insulation layer, a wiring pattern formed on a lower surface of the insulation layer, and a sensor element flip-chip-connected to the wiring pattern. The sensor element includes an active surface, including a sensor portion that recognizes a fingerprint, and a rear surface, located at a side opposite to the active surface.
Shinko Electric Industries Co., Ltd.


04/07/16
20160099218 

Semiconductor package and manufacturing the same


Provided is a method of manufacturing a semiconductor package. The method includes mounting a semiconductor device on a substrate; disposing a mold on the substrate, wherein the mold is formed to cover the semiconductor device such that at least one inner side surface of the mold has a slope; providing a molding material into the mold to encapsulate the semiconductor device; removing the mold from the substrate; and forming an electromagnetic shielding (ems) layer to cover a top surface and side surfaces of the molding material..
Samsung Electronics Co., Ltd.


04/07/16
20160099214 

Flexible electronic circuits with embedded integrated circuit die and methods of making and using the same


Flexible integrated circuit (ic) modules, flexible ic devices, and methods of making and using flexible ic modules are presented herein. A flexible integrated circuit module is disclosed which includes a flexible substrate and a semiconductor die attached to the flexible substrate.
Mc10, Inc.


04/07/16
20160099212 

Through package circuit in fan-out wafer level package


A method and apparatus are provided for manufacturing a packaged electronic device (3) having pre-formed and placed through package circuit devices (35) which include an embedded circuit component (39) and conductor terminals (37a, 37b) extending from a molded package (38) embedding the circuit component (39). The through package circuit devices (35) are placed on end with integrated circuit die (34) and encapsulated in a molded device package (32) which leaves exposed the one or more conductor terminals (37a, 37b) positioned on first and second surfaces of the through package circuit device, where the conductor terminals (37a, 37b) and embedded circuit component (39) form a circuit path through the molded device package..
Freescale Semiconductor, Inc.


04/07/16
20160099207 

Electronic module comprising a plurality of encapsulation layers and a producing it


An electronic module includes a first insulation layer, at least one carrier having a first main surface, a second main surface situated opposite the first main surface, and side surfaces connecting the first and second main surfaces to one another, at least one semiconductor chip arranged on the second main surface of the carrier, wherein the semiconductor chip has contact elements, and a second insulation layer, which is arranged on the carrier and the semiconductor chip.. .
Infineon Technologies Austria Ag


04/07/16
20160099200 

Aluminum alloy lead frame for a semiconductor device and corresponding manufacturing process


Described herein is a semiconductor device provided with: a die of semiconductor material; a lead frame, defining a support plate, which is designed to carry the die, and leads, which are designed to be electrically coupled to the die; and a package, of encapsulating material, which is designed to encapsulate the die and partially coming out of which are the leads. The lead frame has as constituent material an aluminum alloy comprising a percentage of silicon ranging between 1% and 1.5%..
Stmicroelectronics S.r.l.


04/07/16
20160099189 

Semiconductor packages and modules with integrated ferrite material


A semiconductor package includes a lead frame having a die paddle and a plurality of leads including a gate lead spaced apart from the die paddle. The semiconductor package further includes a semiconductor die attached to the die paddle and having a plurality of pads including a gate pad, a plurality of electrical conductors connecting the pads to the leads, an encapsulant encasing the semiconductor die and a portion of the leads such that part of the leads are not covered by the encapsulant, and a ferrite material embedded in the encapsulant and surrounding a portion of the electrical conductor that connects the gate pad to the gate lead.
Infineon Technologies Ag


04/07/16
20160098944 

Eye surgery training simulator


The present invention provides an eye surgery training simulator that can reduce learning cost and simulate the eyes in a more real way to allow surgery performers in practice to increase the success rate of surgery. The surgery training simulator compromise: a base with the accommodating tank, a hollow sphere inside said accommodating tank with a punched hole at the center of its top to simulate the eyeball rotation; a thin film covering the punched hole of said hollow sphere to simulate anterior capsule; a positioning sheet attached to the top surface of the hollow sphere with a hole corresponding to the punched hole; a positioning plug-in at the side of said punched hole that can limit the displacement of the capsulorhexis forceps; and at least an elastic component that can simulate eyeball muscle by pulling the hollow sphere and restore it after the rotation of the hollow sphere..
Universal Vision Biotechnology Co., Ltd.


04/07/16
20160097897 

Low modulus primary coatings for optical fibers


A coated optical fiber includes an optical fiber; and a primary coating encapsulating the optical fiber, the primary coating having an in-situ modulus of about 0.12 mpa or less at a thickness of about 32.5 μm, a young's modulus as a cured film of about 0.7 mpa or less, and a tg of about −22° c. Or below, wherein the primary coating is the cured reaction product of a primary curable composition having a gel-time ratio relative to c1 of less than about 2..
Corning Incorporated


04/07/16
20160097790 

Apparatuses, systems, and methods for accelerometers


According to one example, a system includes a flexural beam having a first face and a second face opposite the first face and a first coil of optical fiber coupled to the first face, where the first coil of optical fiber is encapsulated by a cured encapsulation composition, wherein the encapsulation composition has a viscosity from 30 to 300 millipascal-second at 25° c.. .
Pgs Geophysical As


04/07/16
20160096993 

Semiconductor structure having nanocrystalline core and nanocrystalline shell pairing with compositional transition layer


Semiconductor structures having a nanocrystalline core and nanocrystalline shell pairing with compositional transition layers are described. In an example, a semiconductor structure includes a nanocrystalline core composed of a first semiconductor material.
Pacific Light Technologies Corp.


04/07/16
20160096973 

Coatings for wellbore tools, components having such coatings, and related methods


A component of a wellbore tool comprises a plurality of compartments disposed over a body of the component and a coating disposed over at least a portion of a surface of the body. Each compartment comprises a healing agent formulated to form or catalyze the formation of a barrier upon release from the compartment.
Baker Hughes Incorporated


04/07/16
20160096956 

Catalyst-lean, microcapsule-based self-healing materials via ring-opening metathesis polymerization (romp)


A self-healing composite material includes a polymer matrix, microcapsules filled with a ring-opening metathesis-active monomer (e.g., norbornene, norbornene derivatives such as ethylidene norbornene, or cyclooctadiene), and polymeric particles comprised of a polymer that is soluble in the monomer with which the microcapsules are filled and having catalytic endgroups derived from an olefin metathesis catalyst, such as a grubbs'-type catalyst. In some embodiments, the polymer having catalytic endgroups is synthesized via solution polymerization of a ring-opening metathesis-active monomer (e.g., norbornene, norbornene derivatives, or cyclooctadiene) in the presence of an olefin metathesis catalyst (e.g., grubbs' 1st generation catalyst).
International Business Machines Corporation


04/07/16
20160096723 

Mems die and methods with multiple-pressure sealing


The present subject matter relates to systems and methods for sealing one or more mems devices within an encapsulated cavity. A first material layer can be positioned on a substrate, the first material layer comprising a first cavity and a second cavity that each have one or more openings out of the first material layer.
Wispry


04/07/16
20160096681 

Beverage preparation capsules


A beverage preparation capsule comprising a capsule body having a beverage preparation ingredient hermetically sealed therein, wherein a beverage outlet region of said capsule comprises: front and back sheets of air-and water-impermeable flexible film material arranged in face-to-face relationship along an edge; a folded strip of flexible film material in the form of a gusset extending inwardly from said edge, wherein at least a central region of said strip is provided with a plurality of perforations or a zone of weakness.. .
Mars, Incorporated


04/07/16
20160096105 

Direct thermal variable printing substrate


The recorded non-visible information is revealed by removing the scratch-off layer using applied pressure thereby rupturing the microcapsules enabling the dye precursor to contact the acidic developer material and form a visible color in the discrete area where the barrier layer was melted by application of heat using a thermal printhead or laser.. .

04/07/16
20160095944 

Novel multimodal ct/optical agents


The present application relates to compositions comprising an iodinated contrast agent and indocyanine green co-encapsulated inside a liposomal carrier, various uses thereof as well as methods for their preparation.. .
University Health Network


04/07/16
20160095924 

Amino lipids and methods for the delivery of nucleic acids


The present invention provides superior compositions and methods for the delivery of therapeutic agents to cells. In particular, these include novel lipids and nucleic acid-lipid particles that provide efficient encapsulation of nucleic acids and efficient delivery of the encapsulated nucleic acid to cells in vivo.
Tekmira Pharmaceuticals Corporation


04/07/16
20160095884 

Method for stabilising suspensions of red blood cells encapsulating an active ingredient, the suspensions obtained


A method for obtaining a stabilised suspension of red blood cells encapsulating an active ingredient, from resealed rbcs incorporating the active ingredient, the method comprising the incubation of the resealed rbcs in an incubation solution at an osmolality of no less than 280 m osmol/kg, for a time of 30 minutes or more, the incubation solution being a solution that does not contain an agent which is denaturating for the rbc membrane, the liquid medium is then removed from the incubated suspension and the rbcs obtained are placed in suspension in a solution allowing the injection of the suspension in a patient. The suspensions obtained are particularly characterized by an extracellular haemoglobin level maintained at 0.5 or lower, in particular 0.2 g/dl or lower and/or a haemolysis rate maintained at 2 or less, in particular 1% or less, at 72 h after placing in suspension in a preservation solution and at a temperature of between 2 and 8° c..
Erytech Pharma


04/07/16
20160095829 

Trpv1 compounds in a biodegradable polymer carrier


Effective treatments of pain for extended periods of time are provided. Through the administration of an effective amount of a trpv1 compound (e.g., capsaicinoid compound) at or near a target site, one can relieve pain caused by diverse sources, including but not limited to, postoperative pain, spinal disc herniation (i.e.
Warsaw Orthopedic, Inc.


04/07/16
20160095696 

Gore-tex covered breast implants to minimize capsular reaction and infection while reducing palpability


This invention relates generally to a breast implant having an eptfe layer, a silicone layer of a breast implant core, and an interface between the eptfe layer and the silicone layer.. .

04/07/16
20160095694 

Ligament-tensioning device and method


A ligament-tensioning device and method for activation of the ligament and/or capsule system in the implantation of a joint implant. The device includes a distal bearing plate for bearing against a distal skeletal part, and also includes first and second proximal bearing plates, each of which partially overlaps the distal bearing plate in a first in-use position, for bearing against a proximal skeletal part.
Smith And Nephew Orthopaedics Ag


04/07/16
20160095631 

Methods and devices for polyaxial screw alignment


Devices and methods for aligning the components of polyaxial screws are described herein. In one embodiment, an alignment instrument includes an elongate frame having a longitudinal axis and a plurality of connection caps slidably disposed along the elongate frame.
Depuy Synthes Products, Inc.


04/07/16
20160095611 

Explantation accessory for an intracorporeal capsule


An explantation accessory includes a catheter with a steerable head carrying a tubular receptacle adapted to accommodate the proximal portion of the capsule. The explantation accessory further includes a lasso having a flexible wire extending along the catheter to and forming at its distal end a deformable loop.
Sorin Crm Sas


04/07/16
20160095515 

Systems and methods for measuring position and boundary of lens capsule and implanted intraocular lens in eye imaging


Embodiments of this invention generally relate to systems and methods for eye imaging, and more particularly to measuring the size and position of the lens capsule and of the implanted intraocular lens. In one embodiment, a method for measuring the size and position of the lens capsule and of the implanted intraocular lens comprises generating and emitting one or more light beams at an angle adjacent to the eye, generating one or more eye images, and detecting the position and/or boundary of a lens capsule from its shadow casted by reflected light on the iris..
Abbott Medical Optics Inc.


04/07/16
20160095499 

Colon capsule with textured structural coating for improved colon motility


The present invention discloses a capsule device with textured structural surface so that the capsule device has desired surface properties when it travels through designated regions in the gastrointestinal tract. The capsule device according to the present invention comprises a sensor and a capsule housing, where the sensor is sealed in the capsule housing.
Capso Vision, Inc.


04/07/16
20160095429 

Modular reconfigurable carcass system for furniture


At least two vertical supports have vertical arrays of edge shelf-receiving protrusions and notches that support shelving in the notches with bottom recessions to fit over the protrusions. Top tabs and bottom tab receiving caps enable vertical expansion of the vertical supports in vertically stacked arrays.

04/07/16
20160095347 

Methods and compositions for producing hydrogel capsules coated for low permeability and physical integrity


Methods and compositions for producing hydrogel capsules enveloped with at least one coating layer is disclosed. The coating formulations deposited on the surface of the capsules can improve the physical integrity and the water-retention properties of the alginate beads.
Philip Morris Usa Inc.


04/07/16
20160095320 

Mixture to increase the effectiveness of antiseptics and/or disinfectants, an agent containing the mixture, and the use of this mixture


The invention relates to the increase (improvement) of the effectiveness of antiseptics and/or disinfectants administered in a mixture with hydrolytic or proteolytic enzymes to a mucous membrane, a skin of a mammal or inanimate surfaces in the form of a solution, gel, paste, capsules or other as an agent. The use of the mixture is also stated..
Wald Pharmaceuticals S.r.o.


04/07/16
20160095311 

Gel formulations for extended release of volatile compounds


Disclosed are packing material/matrix and methods of making thereof for slow or extended release of at least one active volatile compound(s). Provided are gel matrix polymerized from particular pre-polymer, and optionally initiators are added during polymerization.
Agrofresh Inc.


03/31/16
20160095225 

Inductor system for multi-phase power management integrated circuits


A semiconductor device includes a first integrated circuit chip, a second integrated circuit chip, a coupled inductor system, and a semiconductor package. The first integrated circuit chip is connected to a substrate and configured to process digital data.
Qualcomm Incorporated


03/31/16
20160095172 

Flexible organic light emitting display device


Provided is a flexible organic light emitting display device including a pixel area and a bezel area that includes a first inorganic encapsulation layer on an organic light emitting element of the pixel area; a second inorganic encapsulation layer that is relatively flatter than the first inorganic encapsulation layer and encapsulates a plurality of foreign matter compensation layers by contacting the first inorganic encapsulation layer in the bezel area; and a foreign matter compensation layer structure in which the plurality of foreign matter compensation layers are stacked between the first inorganic encapsulation layer and the second inorganic encapsulation layer.. .
Lg Display Co., Ltd.


03/31/16
20160094688 

Methods for exchanging network management messages using udp over http protocol


A network access device (nad) receives a udp packet from a client to be transmitted to a management server over internet, the udp packet including a management message. The nad is one of nads managed by the management server.
Cisco Technology, Inc.


03/31/16
20160094325 

Data transmission method and apparatus


A data transmission method and apparatus are provided, which includes: determining, by a transmitting device, a long training sequence set; determining at least one receiving device set, where the receiving device set includes at least one receiving device in a communications system; determining a first mapping relationship, where the first mapping relationship is a mapping relationship between the at least one receiving device set and at least one set-use long training sequence in the long training sequence set; determining, according to a target receiving device set and the first mapping relationship, a target set-use long training sequence corresponding to the target receiving device set, and performing encapsulation processing on first data to generate a first data packet, where a long training sequence field in a physical layer of the first data packet carries a first long training sequence symbol.. .
Huawei Technologies Co., Ltd.


03/31/16
20160094272 

Signal routing with reduced crosstalk


Generally, this disclosure provides systems and devices for reduction of crosstalk between routed signals. A system may include a first pair of signal lines and a second pair of signal lines and each of the pairs of signal lines include a positive signal line and a negative signal line to transmit a differential signal.
Intel Corporation


03/31/16
20160093831 

Thin film encapsulation unit, organic light emitting diode display including the same and manufacturing method thereof


A thin film encapsulation unit including an inorganic layer, a first organic layer on the inorganic layer and including a light-blocking unit and a light-transmitting unit, and a reflection-preventing layer on the first organic layer.. .
Samsung Display Co., Ltd.


03/31/16
20160093830 

Encapsulation film and encapsulating organic electronic device using same


Provided are an encapsulation film, a product for encapsulating an organic electronic device (oed) using the same, and a method of encapsulating an oed. The encapsulation film may effectively block moisture or oxygen permeating into the oed from an external environment, provide high reliability due to increases in a lifespan and durability of the oed, and minimize align errors in a process of attaching the film to a substrate..
Lg Chem, Ltd.


03/31/16
20160093828 

Organic light-emitting diode display and manufacturing method thereof


An organic light-emitting diode display includes an organic light-emitting display device including a first electrode, an intermediate layer including an organic emission layer, and a second electrode; a first inorganic encapsulation layer on the second electrode; a second inorganic encapsulation layer on the first inorganic encapsulation layer; and an organic encapsulation layer on the second inorganic encapsulation layer. A refractive index of the first inorganic encapsulation layer is higher than a refractive index of the second inorganic encapsulation layer.
Samsung Display Co., Ltd.


03/31/16
20160093827 

Organic light-emitting display device


An organic light-emitting display device is provided. The device can include a display area having an organic light-emitting element on a lower substrate; a bezel area surrounding the display area; a transparent encapsulation unit having first and second encapsulation layers, and a first particle cover; and a first buffer layer.
Lg Display Co., Ltd.


03/31/16
20160093825 

Curable organo polysiloxane composition, encapsulant, and electronic device


A curable organo polysiloxane composition, an encapsulant, and an electronic device, the composition including at least one compound represented by the following chemical formula 1 and having a number average molecular weight of less than about 4,000, at least one first siloxane compound including a silicon-bonded hydrogen; and at least one second siloxane compound including a silicon-bonded alkenyl group:. .
Samsung Sdi Co., Ltd.


03/31/16
20160093766 

Method for manufacturing light emitting unit


A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided.
Genesis Photonics Inc.


03/31/16
20160093682 

Thin film encapsulation unit, organic light emitting diode display including the same and manufacturing method thereof


A thin film encapsulation unit including an inorganic layer, a first organic layer on the inorganic layer and including a light-blocking unit and a light-transmitting unit, and a reflection-preventing layer on the first organic layer.. .
Samsung Display Co., Ltd.


03/31/16
20160093582 

Fan out package structure and methods of forming


An embodiment is a structure comprising a die having a pad on a surface and an encapsulant at least laterally encapsulating the die. The pad is exposed through the encapsulant.
Taiwan Semiconductor Manufacturing Company, Ltd.


03/31/16
20160093580 

Semiconductor device and method comprising redistribution layers


A method of making a semiconductor package can include forming a plurality of redistribution layer (rdl) traces disposed over active surfaces of a plurality of semiconductor die and electrically connected to contact pads on the plurality of semiconductor die. The method can include disposing an encapsulant material over the active surfaces, contacting at least four side surfaces of each of the plurality of semiconductor die, and disposed over the plurality of rdl traces.
Deca Technologies Inc.


03/31/16
20160093576 

Semiconductor package and related method


A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another..
Siliconware Precision Industries Co., Ltd.


03/31/16
20160093556 

Quad-flat non-lead package structure and packaging the same


A quad-flat non-lead package structure includes a film layer, a conducting layer, a die, an encapsulant, and a plurality of metal bumps. The film layer has a plurality of through holes.
Lingsen Precision Industries, Ltd.


03/31/16
20160093547 

Epoxy resin composition for encapsulating semiconductor device and semiconductor package encapsulated using the same


An epoxy resin composition for encapsulating a semiconductor device and a semiconductor package, the composition including an epoxy resin; a polyorganosiloxane resin represented by formula 3, below; a curing agent; a curing accelerator; and an inorganic filler:. .
Samsung Sdi Co., Ltd.


03/31/16
20160093427 

Removable fluid barrier


A removable fluid barrier comprises a generally planar flexible body fabricated of at least one resilient material and encapsulating a plurality of permanent magnets. The flexible body has an outer face defining a sealing surface of the removable fluid barrier..

03/31/16
20160092505 

Framework for handling wrapper procedures


A framework for handling a wrapper procedure is provided herein. In accordance with one aspect, a user definition of a wrapper procedure encapsulating a stored procedure is received.

03/31/16
20160092463 

Synchronizing configuration of partner objects across distributed storage systems using transformations


A configuration for a component of a primary node is synchronized with a configuration for a component of a partner node in a different cluster by replicating the primary node configuration with the partner node. A baseline configuration replication comprises a snapshot of a component configuration on the primary.
Netapp, Inc.


03/31/16
20160091367 

Solid state broad band near-infrared light source


A light source for near-infrared transmission and reflection spectroscopy can be constructed from a combination of a high power blue or blue-green light emitting diode (led) and a phosphor element based on an inorganic material. The phosphor element absorbs the led light and, in response to the led excitation, emits luminescence that continuously covers the 700-1050 nm range.
Innovative Science Tools, Inc.


03/31/16
20160091364 

Optical sensing module and manufacturing the same


An optical sensing module includes a substrate, a cover, a plurality of light-emitting chips, a light-receiving chip, and a plurality of encapsulants. The cover is disposed on the substrate.
Lingsen Precision Industries, Ltd.


03/31/16
20160091240 

Personal cooling device


A personal cooling device that provides cooling to a user, e.g., a wearer's feet, assuring even temperature distribution across contoured surfaces irrespective of the orientation of the personal cooling device and regardless of the pull of gravity. The personal cooling device includes a flexible non-porous upper component, a flexible non-porous lower component, a porous absorbent carrier component, at least one dry chemical reactant and at least one containment including at least one liquid reactant.

03/31/16
20160091214 

Nested heat transfer system


A novel nested heat transfer system comprises a plurality of chained enhanced entrochemical cells with nested structures. Each enhanced entrochemical cell includes a first chamber containing desiccant, or a higher concentration solution, and a second chamber containing refrigerant, or a lower concentration solution.

03/31/16
20160091179 

Led tube light


An led tube light having a substantially uniform exterior diameter from end to end is disclosed. It has a glass light tube with narrowly curved end regions at ends for engaging with end caps, in which outer diameter of each end cap is equal to outer diameter of light tube.
Jiaxing Super Lighting Electric Appliance Co., Ltd


03/31/16
20160091149 

Led replacement lighting element


A light emitting diode (led) light element includes a support portion, and a led assembly mounted to the support portion. The led assembly includes a plurality of leds mounted thereto and conductors extending therefrom.
Green Lumens Llc






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