Caps

Caps-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).

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Intrinsically safe mobile device
Aegex Technologies, Llc
May 18, 2017 - N°20170142840

An intrinsically safe mobile device having a form factor, speed, and functionality comparable to a conventional non-intrinsically safe mobile device, includes non-intrinsically safe electronic components mounted on an unprotected part of a printed circuit board (pcb) contained within the mobile device, the non-intrinsically safe electronic components are encapsulated to reduce risk of sparking and to minimize surface heating to enable ...
Small cell base station system, and related devices and data processing methods
Comba Telecom Systems (china) Ltd.
May 18, 2017 - N°20170142598

The invention discloses a small cell base station system, and related devices and data processing methods, and the small cell base station system includes an extended small cell base station and at least one distributed component, where the extended small cell base station includes a network protocol processing module, an upper layer protocol processing module, a physical layer protocol processing ...
Optical network device with integrated port mirroring
Calix, Inc.
May 18, 2017 - N°20170142506

Techniques are described for obtaining, by an optical network device (ond) coupled to an optical network, physical layer data of the optical network; generating, by the ond, an encapsulated representation of the physical layer data of the optical network; and outputting the encapsulated representation of the physical layer data to a diagnostic device.
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Acoustic resonator devices
Qualcomm Incorporated
May 18, 2017 - N°20170141756

A device includes an acoustic resonator embedded within an encapsulating structure that at least partially encapsulates the acoustic resonator. The device includes an inductor electrically connected to the acoustic resonator. At least a portion of the inductor is embedded in the encapsulating structure.
Multi-drive common control bus connector system
Rockwell Automation Technologies, Inc.
May 18, 2017 - N°20170141524

An electrical bus assembly includes a frame and a plurality of bus bar carriers connected to the frame. The bus bars are supported by the bus bar carriers in parallel spaced-apart relation. A first retainer cap is secured to a first one of the plurality of bus bar carriers located adjacent a first end of the frame. A second retainer ...
Graphene-encapsulated electroactive material for use in a lithium ion electrochemical cell
Sinode Systems, Inc.
May 18, 2017 - N°20170141387

An electrochemically active material including composite particles that each include a graphene-based material shell surrounding nanoparticles of a core material. The composite particles may include a bet surface area of less than about 75 m2/g. The electrochemically active material may be formed into an electrode incorporated within a lithium ion electrochemical cell.
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Encapsulation of an organic optoelectronic component
Microoled
May 18, 2017 - N°20170141354

An encapsulated device comprises: an organic optoelectronic component exhibiting at least one sensitive surface protected from oxygen and/or water vapor; and a multilayer encapsulation structure covering the sensitive surface, comprising at least one layer made of organic material interposed between first and second barrier layers made of nonmetallic inorganic material impermeable to oxygen and water vapor; wherein the barrier ...
Calibration of layer thickness and ink volume in fabrication of encapsulation layer for light emitting ...
Kateeva, Inc.
May 18, 2017 - N°20170141353

An ink jet process is used to deposit a material layer to a desired thickness. Layout data is converted to per-cell grayscale values, each representing ink volume to be locally delivered. The grayscale values are used to generate a halftone pattern to deliver variable ink volume (and thickness) to the substrate. The halftoning provides for a relatively continuous layer (e. ...
Display structure of display device with block members having different haights
Samsung Display Co., Ltd.
May 18, 2017 - N°20170141352

A display device and a method of manufacturing the display device are disclosed. In one aspect, the display device includes a substrate including a display region and a peripheral region. A first block member is in the peripheral region and surrounding display structures, the first block member having a first height. A second block member is spaced apart from the ...
Reduced process degradation of spin torque magnetoresistive random access memory
International Business Machines Corporation
May 18, 2017 - N°20170141299

A method of making a magnetic random access memory (mram) device includes forming a magnetic tunnel junction (mtj) on an electrode, the mtj including a reference layer positioned in contact with the electrode, a free layer, and a tunnel barrier layer arranged between the reference layer and the free layer; and depositing an encapsulating layer on and along sidewalls of ...
Optical device
Heptagon Micro Optics Pte. Ltd.
May 18, 2017 - N°20170141241

Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include ...
Finfet isolation structure and method for fabricating the same
Taiwan Semiconductor Manufacturing Co., Ltd.
May 18, 2017 - N°20170141108

A semiconductor device includes a semiconductor substrate, a first semiconductor fin, a second semiconductor fin, an air gap and a dielectric cap layer. The first semiconductor fin is disposed on the semiconductor substrate, and the second semiconductor fin is disposed on the semiconductor substrate. The air gap is located between the first semiconductor fin and the second semiconductor fin, and ...
Microelectronic package with stacked microelectronic units and method for manufacture thereof
Invensas Corporation
May 18, 2017 - N°20170141094

A microelectronic package may include a first microelectronic unit including a semiconductor chip having first chip contacts, an encapsulant contacting an edge of the semiconductor chip, and first unit contacts exposed at a surface of the encapsulant and electrically connected with the first chip contacts. The package may include a second microelectronic unit including a semiconductor chip having second chip ...
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Distribution of electronic circuit power supply potentials
Stmicroelectronics (rousset) Sas
May 18, 2017 - N°20170141069

An integrated circuit includes peripheral conductive pads interconnected by a peripheral conductive track within an integrated circuit chip. The integrated circuit chip further includes internal conductive pads interconnected by an internal conductive track within the integrated circuit chip. A conductive bonding wire external to the integrated circuit chip connects the one peripheral conductive pad to one internal conductive pad. A ...
Semiconductor device with an electromagnetic interference (emi) shield
Amkor Technology, Inc.
May 18, 2017 - N°20170141046

A method for forming a semiconductor device with an electromagnetic interference shield is disclosed and may include coupling a semiconductor die to a first surface of a substrate, encapsulating the semiconductor die and portions of the substrate using an encapsulant, placing the encapsulated substrate and semiconductor die on an adhesive tape, and forming an electromagnetic interference (emi) shield layer on ...
Semiconductor package and method of manufacturing the same
Nepes Co., Ltd.
May 18, 2017 - N°20170141043

Disclosed are a semiconductor package including a through via and a method of manufacturing the same. The semiconductor package includes a frame having an accommodation part and configured to transmit an electrical signal between upper and lower portions thereof through a through via provided around the accommodation part, one or more semiconductor chips accommodated in the accommodation part, a wiring ...
Structure and formation method for chip package
Taiwan Semiconductor Manufacturing Co., Ltd.
May 18, 2017 - N°20170141040

Structures and formation methods of a chip package are provided. The chip package includes a semiconductor die and a package layer partially or completely encapsulating the semiconductor die. The chip package also includes a polymer layer over the semiconductor die and the package layer. The chip package further includes a dielectric layer over the polymer layer. The dielectric layer is ...
Stiffened wires for offset bva
Invensas Corporation
May 18, 2017 - N°20170141020

A component can include a generally planar element, a reinforcing dielectric layer overlying the generally planar element, an encapsulation overlying the reinforcing dielectric layer, and a plurality of wire bonds. Each wire bond can have a tip at a major surface of the encapsulation. The wire bonds can have first portions extending within the reinforcing dielectric layer. The first portions ...
Semiconductor package with integrated heatsink
Stmicroelectronics, Inc.
May 18, 2017 - N°20170141014

One or more embodiments are directed to semiconductor packages having an integrated heatsink and methods of forming same. In one embodiment, a package includes a plurality of leads that support and enclose periphery portions of the semiconductor die. The leads have first and second, opposing surfaces that form outer surfaces of the package. The first surface of the leads may ...
Fabrication of thin-film encapsulation layer for light emitting device
Kateeva, Inc.
May 18, 2017 - N°20170140999

An ink jet process is used to deposit a material layer to a desired thickness. Layout data is converted to per-cell grayscale values, each representing ink volume to be locally delivered. The grayscale values are used to generate a halftone pattern to deliver variable ink volume (and thickness) to the substrate. The halftoning provides for a relatively continuous layer (e. ...
Encapsulated semiconductor package and method of manufacturing thereof
Amkor Technology, Inc.
May 18, 2017 - N°20170140988

Encapsulated semiconductor packages and methods of production thereof. As a non-limiting example, a semiconductor package may be produced by partially dicing a wafer, molding the partially diced wafer, and completely dicing the molded and partially diced wafer.