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Caps patents



      

This page is updated frequently with new Caps-related patent applications.




Date/App# patent app List of recent Caps-related patents
06/23/16
20160182927 
 Method, device, and computer program for encapsulating partitioned timed media data using a generic signaling for coding dependencies patent thumbnailMethod, device, and computer program for encapsulating partitioned timed media data using a generic signaling for coding dependencies
The invention relates to encapsulating partitioned timed media data in a server, the partitioned timed media data comprising timed samples, each timed sample comprising a plurality of subsamples. After having selected at least one subsample from amongst the plurality of subsamples of one of the timed samples, one partition track comprising the selected subsample and one corresponding subsample of each of the other timed samples is created for each selected subsample.

06/23/16
20160182587 
 In-band quality data patent thumbnailIn-band quality data
A method of transmitting data in a media stream in accordance with a media streaming protocol includes generating data of a first type associated with a first type identifier in accordance with the protocol, encapsulating the generated data in a data structure defined by the protocol, the data structure including a type identifier field for specifying a type of data contained within the data structure, setting the type identifier field to a second type identifier different than the first type identifier, forming a packet comprising the first data structure, and transmitting the packet in the media stream.. .

06/23/16
20160182536 
 Adapting user terminal application operation responsive to measured user behavior patent thumbnailAdapting user terminal application operation responsive to measured user behavior
User profile information is generated which characterizes measured user's interaction with an application program that is encapsulated by the computer readable program code and processed by a processor of user terminal. Operation of the application program is adapted based on the user profile information..

06/23/16
20160182357 
 Internet control message protocol for completing a secondary protocol transaction patent thumbnailInternet control message protocol for completing a secondary protocol transaction
In one implementation, an endpoint or client device sends a control message into a network to control how a subsequent flow from the endpoint is handled by one or more nodes in the network. A node in the network receives the control message including an encapsulated command and a counter value and modifies the counter value.

06/23/16
20160182336 
 Hybrid cloud network monitoring system for tenant use patent thumbnailHybrid cloud network monitoring system for tenant use
Network traffic in a cloud computing system is monitored in response to a request to capture network traffic of a tenant port of a first virtual machine (vm) executing in the cloud computing system, wherein the first vm is associated with a first tenant organization different from a second organization managing the cloud computing system. A decapsulating vm having a first network interface and a second network interface is instantiated, wherein the decapsulating vm is inaccessible to the first tenant organization.

06/23/16
20160182322 
 Controlling reporting by an instrument encapsulation module encapsulating an application program on a user terminal patent thumbnailControlling reporting by an instrument encapsulation module encapsulating an application program on a user terminal
A method includes performing operations as follows on a processor that include receiving metrics reported by user terminals via a data network. The metrics indicating a measured operation of an application program processed by the user terminals.

06/23/16
20160182277 
 Systems and methods for broadband backup patent thumbnailSystems and methods for broadband backup
A method and system for providing a payment network via a plurality of multiprotocol label switching networks using a network interface device are provided. The method includes receiving, a first network message containing financial transaction data from a first one of a plurality of multiprotocol label switching networks, determining a destination of the financial transaction data from the network message, transmitting the financial transaction data to a second one of the plurality of multiprotocol label switching networks using a second network containing the financial transaction data, where at least one of the first one and the second one of the plurality of multiprotocol label switching networks is an internet-based network that provides back-up access for transmitting the financial transaction data between a payment card interchange network and at least one of an issuer bank and a merchant bank using a generic routing encapsulation (gre) tunnel inside an ipsec connection..

06/23/16
20160182218 
 Frame synchronization for data transmission over an optical network patent thumbnailFrame synchronization for data transmission over an optical network
We disclose an interface device configured to inter-convert cpri data frames and optical transport units (otus). The interface device acquires frame synchronization by temporarily storing data in a buffer bank such that translated sync characters are placed at respective predetermined locations within the buffer bank.

06/23/16
20160181971 
 Ac conversion on the solar cell level patent thumbnailAc conversion on the solar cell level
A solar power system may comprise a back sheet that comprises an interconnect circuit coupling a plurality of cell tiles. A tiled solar cell, comprising a solar cell and encapsulating and glass layers, is inserted into the cell tiles of the back sheet.

06/23/16
20160181905 
 Capsule-type actuator patent thumbnailCapsule-type actuator
A capsule-type actuator includes a first capsule-shaped part, a second capsule-shaped part, and a connecting part. The interior of the connecting part is provided with a rotating member.

06/23/16
20160181572 

Flexible display apparatus and manufacturing the same


A flexible display apparatus including: a first film including a first surface and a second surface that are opposite each other, and a first groove formed in the first surface, the first film having a first rigidity; a third film on the second surface of the first film; a fourth film facing the third film; an emission display unit between and encapsulated by the third film and the fourth film; and a second film on the fourth film and facing the first film, the second film having a second rigidity that is less than the first rigidity.. .

06/23/16
20160181571 

Organic light-emitting device and manufacturing method therefor


The present invention relates to an organic light emitting device and a method of preparing the same. More particularly, the organic light emitting device according to the present invention includes: a substrate; an organic light emitting unit in which a first electrode, an organic material layer, and a second electrode are sequentially stacked on the substrate; and an encapsulating unit configured to seal an external side of the organic light emitting unit, in which a protecting unit is provided on at least a partial region of the substrate, on which the organic light emitting unit and the encapsulating unit are not provided, and at least a partial region in a lateral surface region of the substrate..

06/23/16
20160181568 

Display device and manufacturing the same


A display apparatus includes a substrate, an encapsulation substrate that faces the substrate, a display unit on the substrate, the display unit including a display device to display an image, and a sealing unit bonding the substrate and the encapsulation substrate to each other, the sealing unit being separated from the display unit and including silicon oxide and glass frit.. .

06/23/16
20160181567 

Organic light-emitting diode display with glass encapsulation and peripheral welded plastic seal


A display may have thin-film transistor circuitry that includes organic light-emitting diodes. The thin-film transistor circuitry may be formed on a substrate.

06/23/16
20160181487 

Photon extraction from nitride ultraviolet light-emitting devices


In various embodiments, a rigid lens is attached to a light-emitting semiconductor die via a layer of encapsulant having a thickness insufficient to prevent propagation of thermal expansion mismatch-induced strain between the rigid lens and the semiconductor die.. .

06/23/16
20160181486 

Light output device and manufacture


A light output device and manufacturing method in which an array of leds is embedded in an encapsulation layer. An array of cavities (or regions of different refractive index) is formed in the encapsulation layer.

06/23/16
20160181485 

Wavelength conversion film and light emitting device package including the same


A wavelength conversion film is provided and may include a first layer including a wavelength conversion material and an encapsulant encapsulating the wavelength conversion material, and a second layer attached to the first layer and having a refractive index less than a refractive index of the encapsulant and greater than a refractive index of air.. .

06/23/16
20160181454 

Solar cell module and manufacturing the same


A solar cell module and a method for manufacturing the same are discussed. The solar cell module includes a front transparent substrate and a back substrate positioned opposite each other, a plurality of solar cells positioned between the front transparent substrate and the back substrate, each solar cell including a semiconductor substrate and first and second electrodes, the first and second electrodes being separated from each other on a back surface of the semiconductor substrate and each extending in a first direction, a first conductive line connected to the first electrode included in the each solar cell through a conductive adhesive, a second conductive line connected to the second electrode included in the each solar cell through the conductive adhesive, a first encapsulant positioned between the solar cells and the front transparent substrate, and a second encapsulant positioned between the solar cells and the back substrate..

06/23/16
20160181446 

Photovoltaic module


A photovoltaic module includes an encapsulated photovoltaic element and an infrared-transmissive decorative overlay simulating conventional roofing.. .

06/23/16
20160181445 

Silicon photonics integration method and structure


Approaches for silicon photonics integration are provided. A method includes: forming at least one encapsulating layer over and around a photodetector; thermally crystallizing the photodetector material after the forming the at least one encapsulating layer; and after the thermally crystallizing the photodetector material, forming a conformal sealing layer on the at least one encapsulating layer and over at least one device.

06/23/16
20160181342 

Display device


A display device is disclosed. In one aspect, the display device includes a substrate, a display unit formed over the substrate and a thin film encapsulation layer covering the display unit.

06/23/16
20160181206 

Semiconductor package having a metal paint layer


Disclosed are devices and methods related to a conductive paint layer configured to provide radio-frequency (rf) shielding for a packaged semiconductor module. Such a module can include a packaging substrate, one or more rf components mounted on the packaging substrate, a ground plane disposed within the packaging substrate, and a plurality of rf-shielding wirebonds disposed on the packaging substrate and electrically connected to the ground plane.

06/23/16
20160181193 

Package stucture and fabricating the same


A package structure and a method of fabricating the same are provided. The method includes forming a first wiring layer on a carrier board, forming a plurality of first conductors on the first wiring layer, encapsulating the first wiring layer and the first conductors with a first insulating layer, forming a second wiring layer on the first insulating layer, forming a plurality of second conductors on the second wiring layer, encapsulating the second wiring layer and the second conductors with a second insulating layer, and forming at least one opening in the second insulating layer.

06/23/16
20160181187 

Semiconductor device and lead frame


A semiconductor device includes a lead frame having terminals, a semiconductor chip electrically coupled to the terminals, and a resin part configured to encapsulate the semiconductor chip such as to expose part of the terminals, wherein a given one of the terminals includes a first lead and a second lead welded together such that an upper face of the first lead is placed against a lower face of the second lead, wherein the lower face of the second lead extends further than the upper face of the first lead toward the semiconductor chip in a longitudinal direction of the terminal, and also extends further sideways than the upper face of the first lead in a transverse direction of the terminal, and wherein an area of the lower face of the second lead is covered with the resin part, the area extending further than the upper face of the first lead.. .

06/23/16
20160181185 

Semiconductor package structure


A semiconductor package structure includes a lead frame, a chip and a molding compound. The lead frame includes a tray pad and a plurality of leads.

06/23/16
20160181138 

Method of manufacturing a semiconductor component and semiconductor component


Various embodiments provide method of manufacturing a semiconductor component, wherein the method comprises providing a layer stack comprising a carrier and a thinned wafer comprising a metallization layer on one side, wherein the thinned wafer is placed on a first side of the carrier; forming an encapsulation encapsulating the layer stack at least partially; and subsequently thinning the carrier from a second side of the carrier, wherein the second side is opposite to the first side of the carrier.. .

06/23/16
20160181126 

Method for manufacturing multi-chip package


A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided..

06/23/16
20160181003 

Embedded coil assembly and making


An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface.

06/23/16
20160180399 

Adapting user terminal advertisements responsive to measured user behavior


User profile information is generated which characterizes measured user interaction with an application program that is encapsulated by the computer readable program code and processed by the processor. Operation of an advertisement displayed while the application program is being processed is controlled based on the user profile information..

06/23/16
20160180096 

Static analysis based on abstract program representations


An application analysis platform enables automatic generation of abstract program representations (aprs) that are amenable to static analyses for finding security vulnerabilities. The apr is generated automatically, preferably from an existing build system or a source repository, and then encapsulated into a binary archival format for consumption by a static analysis tool, which operates on-premises or in the cloud.

06/23/16
20160180070 

Processing identity authentication with mobile terminal based on iris recognition


A processing method and system for identity authentication with a mobile terminal based on iris recognition is provided. The iris characteristic data of the user is encapsulated as iris identification data, which is further established as a unique identifier of the user for identity authentication.

06/23/16
20160179500 

Firmware variable update method


A firmware variable update method for bios of a computer system is provided. The firmware variable update method includes writing an update capsule file and a firmware update command into a memory according to a first system management interrupt signal and performing a shutdown process, triggering a second system management interrupt signal and accordingly writing a variable update command into the memory, switching the computer system into a sleep state before the shutdown process is completed and activating a timer, performing a first reboot process when the timer expires, utilizing the update capsule file to update an original capsule file of the bios according to the firmware update command during the first reboot process, and performing a second reboot process and utilizing an update variable file to update an original variable file of the bios according to the variable update command during the second reboot process..

06/23/16
20160178944 

Display device and manufacturing method thereof


A manufacturing method of a display device includes: forming a thin film transistor on a substrate; forming a pixel electrode connected to the thin film transistor in at least one of the plurality of pixel areas on the substrate; forming a sacrificial layer on the pixel electrode; forming an opening in the sacrificial layer by removing at least a part of the sacrificial layer; forming a roof layer on the sacrificial layer and forming a support member in the opening; forming an injection hole by patterning the roof layer to expose at least a part of the sacrificial layer; forming a microcavity between the pixel electrode and the roof layer by removing the sacrificial layer; forming a liquid crystal layer in the microcavity by injecting a liquid crystal material through the injection hole; and forming an encapsulation layer on the roof layer to seal the microcavity.. .

06/23/16
20160178941 

Liquid crystal display device including nanocapsule liquid crystal layer


Discussed is a liquid crystal display device that includes a substrate having a pixel electrode and a common electrode formed thereon, a first polarizing plate on a bottom surface of the substrate, and having a polarizing axis of a first direction, a nanocapsule liquid crystal layer on the pixel electrode and the common electrode, and including a buffer layer and nanocapsules, each nanocapsules being filled with liquid crystal molecules, being oil-soluble, and being dispersed in the buffer layer, and a second polarizing plate on the nanocapsule liquid crystal layer, and having a polarizing axis of a second direction perpendicular to the first direction.. .

06/23/16
20160178857 

Coding system for facilitating installing a fiber optic network


The present disclosure relates to a fiber optic network including first and second optical components desired to be optically coupled together, and third and fourth optical components desired to be couple together. The first and second optical components include first and second de-mateable connection locations having dust caps with first coordinated indicia.

06/23/16
20160178709 

Sensor unit and magnetic collector module including the same


A magnetic sensor of a sensor unit includes magnetic sensing elements, an encapsulating portion, a primary terminal group and a secondary terminal group. Another magnetic sensor includes magnetic sensing elements, an encapsulating portion, a primary terminal group and a secondary terminal group.

06/23/16
20160178510 

A coating composition comprising a dye and a method to detect moisture in objects


The present invention relates to a coating composition comprising a system comprising a dye encapsulated in a matrix of a polymer, wherein the dye only shows absorption in a non-visible part of the light spectrum, wherein the encapsulated system is able to undergo a detectable change in the absorption properties under the influence of moisture. The invention further describes a method to detect moisture in objects, the method comprising the steps of (a) providing an object with a signalling layer, said signalling layer showing light absorption in a non-visible part of the light spectrum and a change in this light absorption under the influence of moisture, and (b) measuring the light absorption or reflectance of the coated object in the non-visible part of the light spectrum..

06/23/16
20160178472 

Leak testing apparatus and method


In leak testing by an accumulation method, it is possible to reliably detect accumulated inspection gas, and the reliability of leak testing is enhanced by reduction in background or impurity gas. At least an openable/closeable part 29 of a capsule 20 is housed inside a chamber 10 of a leak testing apparatus 1.

06/23/16
20160178305 

Less-lethal force device impact ratio


Improvements in a less-lethal force device are disclosed. The less-lethal projectile device generally comprising a projectile, such as a rubber-encapsulated metal block, that is mated to a docking base by way of a mounting pins or base.

06/23/16
20160178136 

Led fluorescent tube


The present invention provides an led fluorescent tube. In this led fluorescent tube, at least one flexible pcb is particularly used for carrying the led driving unit, wherein the flexible pcb can be accommodated in end caps of the led fluorescent tube by a bend form.

06/23/16
20160177984 

Clamp for standing seam


A clamp assembly (100), and a mounting assembly (150), that may be used for securing a device (160) (e.g. A solar panel, roof mounted displays, satellite dishes, conduit and piping, snow-retention system, hvac etc.) to a raised portion of a standing seam (103) of a metal roof, panel or tile (119) building surface.

06/23/16
20160177516 

Environmentally resistant encapsulated mat construction


An industrial mat that includes a core construction that provides strength and rigidity to the mat, with the core construction including various layers or plies of components at least some of which are typically made of wood or engineered wood; and a durable skin that surrounds and encapsulates at least the wood components of the mat or the entire core construction. The skin has a thickness sufficient to provide environmental resistance to the wood components or to the core construction to which it is applied.

06/23/16
20160177299 

Compositions and methods using capsids resistant to hydrolases


Novel processes and compositions are described which use viral capsid proteins resistant to hydrolases to prepare virus-like particles to enclose and subsequently isolate and purify target cargo molecules of interest including nucleic acids such as sirnas and shrnas, mirnas, messenger rnas, small peptides and bioactive molecules.. .

06/23/16
20160177241 

Fabric conditioners comprising encapsulated active material


A fabric conditioning composition comprising: (a) at least 8 wt % of a fabric conditioning active; (b) a first capsule containing an active material, wherein the first capsule comprises a cured polymeric wall and a core; and (c) a second capsule containing an active material wherein the second capsule comprises a cured polymeric wall and a core; wherein the first and second capsules differ in properties due to their polymer walls having been made using the same polymer and different cure temperatures, curing times, or a combination thereof.. .

06/23/16
20160177221 

Coated microcapsules


Accordingly, there are provided coated microcapsules including a microcapsule, said microcapsules including a polymeric shell and a liquid core material encapsulated therein; and a metallic coating surrounding said microcapsules; wherein the metallic coating includes particles of a first metal adsorbed on said polymeric shell and a film of a second metal formed thereon; and wherein the metallic coating has a maximum thickness of 1000 nm; and methods and formulations related thereto.. .

06/23/16
20160177156 

Thermally conducting capsules comprising a phase change material


The invention relates to a thermally conducting capsule which has a core-shell structure and in which the core, which is surrounded by a tight single-layer or multilayer shell, is loaded with at least one phase change material (pcm). The invention is characterized in that the capsule also contains particles made of an additional conducting material at least in the shell, said particles made of the additional conducting material having a thermal conductivity greater than 100 w/m/k.

06/23/16
20160177124 

Co-crosslinker systems for encapsulation films comprising ethylene glycol di(meth)acrylate compounds


A first composition (a) contains (i) at least one compound (i) selected from the group consisting of triallyl isocyanurate, and triallyl cyanurate, wherein the compound (i) is preferably triallyl isocyanurate, and (ii) at least one ethylene glycol di(meth)acrylate compound. In addition, a second composition (b) contains the first composition (a) and at least one polyolefin copolymer.

06/23/16
20160177103 

Particles for electrophoretic displays


This invention relates to particles comprising a pigment core particle encapsulated by a polymer, a process for their preparation, electrophoretic fluids comprising such particles, and electrophoretic display devices comprising such fluids.. .

06/23/16
20160177061 

Additive for a silicone encapsulant


An additive for a silicone encapsulant has the structure: formula (i) wherein r1 and r2 are each —o—si(r4)(r5)(r6) and each of r4, r5, and r6 is independently chosen from c1-c10 hydrocarbyl groups, c1-c10 alkyl groups, c2-c10 alkenyl groups, and c6-c10 aryl groups, and wherein r3 is independently chosen from c1-c10 hydrocarbyl groups, c1-c10 alkyl groups, c2-c10 alkenyl groups, and c6-c10 aryl groups. The additive is formed using a method that includes the step of reacting iron metal or an iron (iii) compound with a hydroxyl functional organosiloxane.

06/23/16
20160177045 

Foamed caps and closure seal comprising polyethylene foam


The invention is directed to foamed caps and closure seals comprising as one of the layers polyethylene foam. The polyethylene foam is obtained by foaming of low density polyethylene copolymer obtained by a high pressure polymerisation process in the presence of 1,4-butanediol dimethacrylate..

06/23/16
20160177039 

Antimicrobial and bacteriostatic-modified polymers for cellulose fibres


Polysaccharide fibres, such as cellulose or starch, modified by grafting an amino-containing antimicrobial polymer (acp) onto the fibres or starch using a co-polymerization reaction, exhibits high antimicrobial activity. For example, the presence of 1.0% by weight grafted polymer in the cellulose fibres or starch fibres results in excellent antimicrobial activity (over 99% inhibition).

06/23/16
20160177015 

Dispersion for simple use in the production of encapsulation films


A dispersion (d) contains (i) at least one polyolefin copolymer (i) as continuous phase; and (ii) at least one (meth)acrylamide compound dispersed in the polyolefin copolymer (i). The dispersion (d) is used for the production of a film for encapsulation of an electronic device, especially a solar cell..

06/23/16
20160177014 

Co-crosslinker systems for encapsulation films comprising (meth)acrylamide compounds


A first composition (z) contains (i) at least one compound (i) selected from the group consisting of triallyl isocyanurate, and triallyl cyanurate, and (ii) at least one (meth)acrylamide compound. In addition, a second composition (b) contains the first composition (z) and at least one polyolefin copolymer.

06/23/16
20160177013 

Co-crosslinker systems for encapsulation films comprising urea compounds


A first composition (a) contains (i) at least one compound (i) selected from the group consisting of triallyl isocyanurate, and triallyl cyanurate, wherein the compound (i) is preferably triallyl isocyanurate; and (ii) at least one urea compound. A second composition (b) contains the first composition (a) and at least one polyolefin copolymer.

06/23/16
20160177007 

Co-crosslinker systems for encapsulation films comprising bis(alkenylamide) compounds


A first composition (a) contains (i) at least one compound (i) selected from the group consisting of triallyl isocyanurate, and triallyl cyanurate, wherein the compound (i) is preferably triallyl isocyanurate, and (ii) at least one bis(alkenylamide) compound. A second composition (b) contains the first composition (a) and at least one polyolefin copolymer.

06/23/16
20160177002 

Hydrogel fibers and preparation thereof


This invention provides a polymer fiber and polymer optical fiber (pof) wherein said polymer is a hydrogel. This invention further provides a process for preparing water-absorbent and superabsorbent acrylate polymer fibers and polymer optical fibers, and provides encapsulated, biodegradable, renewable and functional hydrogel fibers and hydrogel optical fibers prepared according to the process of this invention..

06/23/16
20160176725 

Amorphous alumina silicate mixture and method


A method of removing contaminants from an aqueous solution includes providing a mixture of amorphous alumina silicate granules having a plurality of predefined sieve grades, where the mixture has enhanced molecular encapsulation compared to alumina silicate granules of a single sieve grade. An aqueous solution containing contaminant molecules is passed through the mixture of amorphous alumina silicate.

06/23/16
20160176706 

Systems and methods for forming mems assemblies incorporating getters


Systems and methods for forming mems assemblies incorporating getters are described. One such method for forming and bonding to a microelectromechanical systems (mems) assembly includes providing a first mems wafer including a metal layer on an inner surface and one or more cavities for forming a mems component, attaching a mems capping wafer, having at least one through hole via, to the inner surface of the first mems wafer thereby forming at least one encapsulated mems component within the first mems wafer, and bonding a wire to the metal layer through an open end of the at least one through hole via..

06/23/16
20160176705 

Systems and methods for forming mems assemblies incorporating getters


Systems and methods for forming mems assemblies incorporating getters are described. One such method for forming and bonding to a microelectromechanical systems (mems) assembly includes providing a first mems wafer including a metal layer on an inner surface and one or more cavities for forming a mems component, attaching a mems capping wafer, having at least one through hole via, to the inner surface of the first mems wafer thereby forming at least one encapsulated mems component within the first mems wafer, and bonding a wire to the metal layer through an open end of the at least one through hole via..

06/23/16
20160176703 

Multi-level getter structure and encapsulation structure comprising such a multi-level getter structure


One first opening crossing through at least the second layer of getter material and emerging into the first space.. .

06/23/16
20160176624 

Food or beverage capsule with built-in foaming capabilities


The present invention is directed to a container (c) for the preparation of flowable food or beverage compositions, adapted to be functionally inserted in a food or beverage preparation machine (m), said container comprising walls defining at least one cavity (27) for containing at least one precursor ingredient, and a dispensing channel (15) through which the food or beverage composition can flow to a consumer receptacle, characterized in that it further comprises a foaming whisk element (29) located at least partially into the dispensing channel (15) so as to be able to whip said product when the latter exits said channel (15).. .

06/23/16
20160176607 

Container


The decorative and protective display case, for a fragile or expensive good(s) for example, typically a bottled liquid such as wine or spirits that not only provides adequate protection, but also provides a way to showcase or display an item of value. The generally tubular display material is circular or polygonal and made from materials that can withstand high levels of shock.

06/23/16
20160176555 

Machine for packaging single use capsules for beverages


A machine for packaging single use capsules (1) for extraction or infusion beverages, such as coffee, milk, chocolate, tea, or combinations thereof, includes: a transport element (8) for transporting rigid bodies (2) of the capsules (1) and closed in a loop around movement organs (9) with vertical axis (z9), to move the transport element (8) continuously, the transport element (8) being configured to define a plurality of seats (10) for the rigid bodies (2), arranged in succession one after the other and having a vertical development axis (z10); a plurality of stations, arranged along an advancement path (p) followed by the transport element (8), configured to operate continuously and in phase with the transport element (8) and including: a feeding station (11) for feeding the rigid bodies (2) within the corresponding seats (10) of the transport element (8); a dosing station (12); a closing station (13); an outfeed station (14).. .

06/23/16
20160176544 

Polymeric foam composite for vehicle arresting system


Embodiments of the present invention relate to composite materials for use as a vehicle arresting system (also referred to as an engineered material arresting system (emas). Specific embodiments may use modified polymeric foams composites.

06/23/16
20160176497 

Improved fuel tank access door gasket with reinforced seal


An annular elastomeric emi shielding gasket includes a metallic mesh embedded in an elastomeric sheet for sealing and protecting aircraft fuel tanks and panels. In one embodiment, the gasket has a central region with a protruding portion to prevent leakage of fluid under the dynamic loading of the wing assembly experienced during flight.

06/23/16
20160176095 

Variable-thickness elecriplast moldable capsule and manufacture


A moldable capsule device (1) includes a bundle of micron conductive fiber (3) and a resin-based material layer (5) overlying the bundle along the length (l) of the capsule wherein thickness of the resin-based material layer is not uniform (t1 and t2), a method (100) to form a moldable capsule (1) including extruding/pultruding resin-based material layer (5) onto the length (l) of a bundle of micron conductive fiber (3), the resin-based material layer (5) has a first thickness (t1) and a second thickness (t2), the first thickness (t1) is disposed around multiple first surfaces (7) of the bundle. The second thickness (t2) is .disposed around multiple second surfaces (9) of the bundle.

06/23/16
20160176088 

Semiconductor manufacturing apparatus


A lower mold (2) of a set of upper and lower molds for resin encapsulation of a lead frame having a semiconductor chip mounted thereon is provided with a tapered positioning pin (3) to be engaged with a positioning hole formed in the lead frame. A columnar portion of the tapered positioning pin has an outer diameter larger than an inner diameter of a positioning hole.

06/23/16
20160176078 

Flexible polymer-based material for hot isostatic pressing or warm isostatic pressing molds


There is disclosed a sealable, flexible membrane for encapsulating a part to be isostatically pressed at an elevated temperature. The membrane includes at least one first layer of polymeric film having a melting point above the elevated temperature, and at least one second layer disposed on the first layer.





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