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Caps

Caps-related patent applications - as published by the U.S. Patent and Trademark Office (USPTO).


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Carbon nanotube yarn heater
Goodrich Corporation
June 14, 2018 - N°20180168002

A heating element includes a bottom layer, a web consisting of a carbon nanotube (cnt) yarn wherein the web is affixed to a first side of the bottom layer, and an encapsulating layer positioned on the web and the first side of the bottom layer. A method for making a heating element includes providing a bottom layer, inserting a plurality ...
Device and method of handling data transmissions in a wireless communication system
Htc Corporation
June 14, 2018 - N°20180167859

A first communication device for communicating with a second communication device according to a cellular network/wireless local area network (wlan) radio level integration with internet protocol security (ipsec) tunnel (cwip) comprises a storage device for storing instructions and a processing circuit coupled to the storage device. The processing circuit is configured to execute the instructions stored in the storage ...
Data packet forwarding
New H3c Technologies Co., Ltd.
June 14, 2018 - N°20180167320

A sdn controller obtains and stores a nat mapping relationship between a private network address and a public network of a host computer in each sdn; receives a flow table request for a data packet from a vtep device, searching for a nat mapping relationship corresponding to a target ip address of the data packet when determining that the data ...
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System and method for stator slot encapsulation using injected polymer
American Axle & Manufacturing, Inc.
June 14, 2018 - N°20180166951

A method for improving thermal conduction in a stator having electrically conductive windings wound in a plurality of gaps formed between adjacent pairs of a plurality of teeth of the stator. A plurality of interstitial spaces are formed within each of the gaps during winding of the electrically conductive windings around the teeth.
Microfabricated optical apparatus with grounded metal layer
Innovative Micro Technology
June 14, 2018 - N°20180166850

A microfabricated optical apparatus that includes a light source driven by a waveform, wherein the waveform is delivered to the light source by at least one through silicon via. The microfabricated optical apparatus may also include a light-sensitive receiver which generates an electrical signal in response to an optical signal.
Connector for zero-force contacting on a printed circuit board
Harting Electronics Gmbh
June 14, 2018 - N°20180166815

A connector for installation on a printed circuit board a contacting part has which includes at least two contact elements, each of which can be connected, on the connection side, to an individual conductor and, on the plug-in side, to a conductive track of the printed circuit board, wherein the connector a connection part which encloses the individual conductors and, ...
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Energy storage apparatus
City University Of Hong Kong
June 14, 2018 - N°20180166662

An energy storage apparatus and a method for fabricating the energy storage apparatus. The energy storage apparatus includes a pair of electrodes including an anode and a cathode; an electrolyte at least partially surrounding each of the pair of electrodes; and an encapsulation arranged to encapsulate the electrodes and the electrolyte; wherein the combination of the electrodes, the electrolyte and ...
Power unit using flexible conductive member
Stmicroelectronics (tours) Sas
June 14, 2018 - N°20180166659

An electronic device includes a flexible conductive member having a first length, and a battery substrate having a second length shorter or equal than the first length. There is an active battery on the battery substrate.
Semiconductor device with air-spacer
Taiwan Semiconductor Manufacturing Co., Ltd.
June 14, 2018 - N°20180166553

A method includes forming a gate structure on a substrate, forming a seal spacer covering a sidewall of the gate structure, forming a sacrificial spacer covering a sidewall of the seal spacer, forming source/drain regions sandwiching a channel region that is under the gate structure, and depositing a contact etch stop layer covering a sidewall of the sacrificial spacer. ...
Electronic device
Lg Display Co., Ltd.
June 14, 2018 - N°20180166507

An electronic device can include: a pixel array layer disposed on a substrate and including a plurality of pixels, each of the plurality of pixels including a thin film transistor and an organic light emitting device; an encapsulation layer covering the pixel array layer; a shielding layer disposed on the encapsulation layer; and a touch sensing layer disposed on the ...
Semiconductor package
Nanya Technology Corporation
June 14, 2018 - N°20180166419

A semiconductor package includes a first device; a second device laterally adjacent to the first device; a molding member encapsulating the first device and the second device; and a lateral bump structure implementing a lateral signal path between the first device and the second device. A portion of the molding member is disposed between the first device and the second ...
Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires
Mediatek Inc.
June 14, 2018 - N°20180166414

A semiconductor package includes a carrier substrate having a top surface, a semiconductor die mounted on the top surface, a plurality of bonding wires connecting an active surface of the semiconductor die to the top surface of the carrier substrate, an insulating material encapsulating the plurality of bonding wires, a component mounted on the insulating material, and a molding compound ...
Wireless package and fabrication method thereof
Cyntec Co., Ltd.
June 14, 2018 - N°20180166404

A wireless package includes a package substrate, a rfic chip, a resilient connector, a molding compound encapsulating the rfic chip, the resilient connector, and the top surface of the package substrate, and an antenna disposed on a top surface of the molding compound. The resilient connector has a terminal bonded to a pad on the top surface of the package ...
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Semiconductor devices including exposed opposing die pads
Infineon Technologies Austria Ag
June 14, 2018 - N°20180166366

A semiconductor device includes a first lead frame, a second lead frame, a first semiconductor chip, and an encapsulation material. The first lead frame includes a first die pad having a first surface and a second surface opposite to the first surface.
Electronic package structure
Amkor Technology, Inc.
June 14, 2018 - N°20180166365

A method for providing an electronic package structure includes providing a substrate having a die pad having a die pad top surface and an opposing die pad bottom surface, leads laterally spaced apart from the die pad, and a substrate encapsulant interposed between the die pad and the leads and includes a substrate top surface and an opposing substrate bottom ...
Self-aligned contact cap
International Business Machines Corporation
June 14, 2018 - N°20180166336

A method for forming a semiconductor device includes recessing a gate conductor in a gate structure to form a first divot, forming a gate cap in the first divot and recessing a dielectric fill that encapsulates the gate structures to a position below a top of the gate cap. An extension layer is deposited over the dielectric fill and the ...
Self-aligned middle of the line (mol) contacts
Globalfoundries Inc.
June 14, 2018 - N°20180166335

Disclosed are methods and integrated circuit (ic) structures. The methods enable formation of a gate contact on a gate above (or close thereto) an active region of a field effect transistor (fet) and provide protection against shorts between the gate contact and metal plugs on source/drain regions and between the gate and source/drain contacts to the metal plugs.
Methods and apparatus for preventing counter-doping during high temperature processing
Texas Instruments Incorporated
June 14, 2018 - N°20180166280

In a described example method, semiconductor wafer with a backside silicon nitride layer is encapsulated with a diffusion barrier layer prior to a high temperature anneal greater than about 1000 degrees celsius. After the high temperature anneal the diffusion barrier layer and the backside silicon nitride layers are stripped..
Electronic module
Cyntec Co., Ltd.
June 14, 2018 - N°20180166200

The present invention discloses an electronic module. The electronic module comprises: a substrate, having a top surface and a bottom surface; a plurality of coils on the top surface of the substrate, wherein each coil comprises a corresponding first end and a corresponding second end; and a molding body, disposed on the substrate to encapsulate said coils, wherein said corresponding ...
Electrically conductive and insulative composite
Kitty Hawk Corporation
June 14, 2018 - N°20180166183

An electrically conductive and insulative composite (ecic) is disclosed. In various embodiments, an ecic as disclosed herein may include an electrically conductive structural element and one or more electrically insulative structural elements adhesively bonded to the conductive structural element to form a unitized structure having a design shape and one or more significant mechanical properties.
Legacy card
June 14, 2018 - N°20180165778

This invention is directed toward a card that is used by a person wishing to leave a tangible or intangible item to a future recipient and beneficiary(ies). The user creates a moment online, which is then sealed in a moment capsule by a company owning or licensing this invention.
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