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Caps patents



      

This page is updated frequently with new Caps-related patent applications.




Date/App# patent app List of recent Caps-related patents
05/19/16
20160143094 
 Display device patent thumbnailDisplay device
A display device includes a circular display panel, an encapsulation substrate on the circular display panel, and an optical element interposed between the circular display panel and the encapsulation substrate, the optical element including a light guide member having a ring shape to correspond to a boundary of the circular display panel, the light guide member configuring a boundary of the optical element.. .
Samsung Display Co., Ltd.


05/19/16
20160142290 
 Service path allocation method, router and service execution entity patent thumbnailService path allocation method, router and service execution entity
Embodiments of the present invention provide a service path allocation method, a router, and a service execution entity. In the method provided in the embodiments, a router obtains a user identifier and ip 5-tuple information after receiving a packet, queries for a corresponding target service processing path according to the user identifier and the ip 5-tuple information, and, after encapsulating the service packet, sends the service packet to the first-hop service execution entity in the service path for corresponding service processing.
Huawei Technologies Co., Ltd.


05/19/16
20160142220 
 Method and  processing multicast packet on network virtualization over layer 3 (nvo3) network patent thumbnailMethod and processing multicast packet on network virtualization over layer 3 (nvo3) network
A first multihoming network virtualization edge (nve) configured to receive a first multicast packet sent by a multihomed tenant end system (tes), acquire an ingress port of the first multicast packet and a virtual local area network (vlan) identifier (id) of the first multicast packet, acquire a virtual overlay network (vn) id of the first multicast packet according to the ingress port and the vlan id, determine whether the ingress port is a designated forwarder (df) of the vn id, encapsulate the first multicast packet with an extended nvo3 header when the ingress port is not the df of the vn id, and send the first multicast packet that is encapsulated with the extended nvo3 header to another nve that includes a second multihoming nve, where the extended nvo3 header carries the vn id and a link aggregation group (lag) id that corresponds to the ingress port.. .
Huawei Technologies Co., Ltd.


05/19/16
20160142137 
 Method for implementing dimming, and dimming apparatus patent thumbnailMethod for implementing dimming, and dimming apparatus
A method and apparatus for implementing dimming are disclosed. The method includes: at an mac layer, dividing an msdu into two or more sub-msdus with a same length; encapsulating each sub-msdu obtained after dividing into a separate mpdu, and generating a compensation frame for each mpdu; and aggregating the mpdus and the compensation frames with the same addresses into a psdu part of a ppdu and transmitting a physical frame..
Zte Corporation


05/19/16
20160141777 
 Electrical connection arrangement patent thumbnailElectrical connection arrangement
An electrical connection arrangement between at least one flat conductor or conductor portion and a cable, the flat conductor or conductor portion leading to a pane, or laminated pane, with electric or electronic components, the cable being an integral part of an external connection. The flat conductor or conductor portion is further formed on a carrier film, or polyimide film, and includes an encapsulation as a plastic injection overmolding at least in an area of the electric contacting point of cable and flat conductor or conductor portion.
Few Fahrzeugelektrikwerk Gmbh & Co. Kg


05/19/16
20160141773 
 Composite and nanowire conduit patent thumbnailComposite and nanowire conduit
An electrical wiring system comprises a plurality of electrical conduits, each of which comprises a plurality of electrically conductive wires, a carrier encapsulating and electrically insulating the wires from each other, the carrier being composed of a rigid material, and at least connector carried by the carrier in electrical communication with the wires. The electrical wiring system further comprises a junction box comprising a plurality of interconnecting wires and a plurality of connectors electrically coupled together by the interconnecting wires.
The Boeing Company


05/19/16
20160141714 
 Paper-based lithium-ion batteries patent thumbnailPaper-based lithium-ion batteries
A method for fabricating a paper lithium ion cell including depositing a first lithium-metal oxide composition onto a first electrically conducting microfiber paper substrate to define a cathode, depositing a second, different lithium-metal oxide composition onto a second electrically conducting coated microfiber paper substrate to define an anode, separating the cathode and the anode with a barrier material, infusing the cathode and the anode with electrolytes, and encapsulating the anode, the cathode, and the barrier material in a housing.. .
Indiana University Research And Technology Corp.


05/19/16
20160141594 
 Battery protection circuit module package, battery pack and electronic device including same patent thumbnailBattery protection circuit module package, battery pack and electronic device including same
Provided are a battery protection circuit module package capable of achieving high integration and size reduction, and a battery pack and an electronic device including the same. The battery protection circuit module package includes a lead frame including a plurality of leads space apart from each other, and capable of being coupled and electrically connected to electrode tabs of a battery cell, battery protection circuit devices mounted on the lead frame and including a positive temperature coefficient (ptc) structure, and an encapsulant for encapsulating the battery protection circuit devices to expose a part of the lead frame..
Itm Semiconductor Co., Ltd


05/19/16
20160141577 
 Energy storage device with an encapsulated electrode patent thumbnailEnergy storage device with an encapsulated electrode
Aspects of the disclosure can relate to an energy storage device including at least two electrodes (e.g., an anode and a cathode). At least one of the two electrodes can be formed from lithium or a lithium alloy.
Schlumberger Technology Corporation


05/19/16
20160141551 
 Organic light-emitting diode (oled) display, electronic device including the same, and  manufacturing the oled display patent thumbnailOrganic light-emitting diode (oled) display, electronic device including the same, and manufacturing the oled display
An organic light-emitting diode (oled) display, electronic device including the same and method of manufacturing the oled display are disclosed. In one aspect, the oled display includes a first plastic layer, a first barrier layer formed over the first plastic layer and a first intermediate layer formed over the first barrier layer.
Samsung Display Co., Ltd.


05/19/16
20160141485 

Piezoelectric actuator and capsule endoscope including the same


A capsule endoscope includes a power supply operably coupled to a piezoelectric element. The power supply is configured to provide an alternating electric signal to the piezoelectric element.
Samsung Electro-mechanics Co., Ltd.


05/19/16
20160141476 

Package structure and manufacture thereof, and carrier


The present disclosure provides a method of manufacturing a package structure. The method includes: providing a plurality of conductive portions and a light emitting element; encapsulating the light emitting element and the conductive portions by an encapsulant with a lateral surface of the light emitting element electrically insulated from the conductive portions; electrically connecting the light emitting element to the conductive portions by a conductive element.
Achrolux Inc.


05/19/16
20160141463 

Composite having semiconductor structures embedded in a matrix


Semiconductor structures having a nanocrystalline core and corresponding nanocrystalline shell and insulator coating, wherein the semiconductor structure includes an anisotropic nanocrystalline core composed of a first semiconductor material, and an anisotropic nanocrystalline shell composed of a second, different, semiconductor material surrounding the anisotropic nanocrystalline core. The anisotropic nanocrystalline core and the anisotropic nanocrystalline shell form a quantum dot.

05/19/16
20160141320 

Wafer-level encapsulated semiconductor device, and fabricating same


A method of encapsulating semiconductor devices formed on a device wafer includes forming an assembly including a carrier wafer and a plurality of dams thereon. After the step of forming, the method attaches the plurality of dams to the device wafer to form a respective plurality of encapsulated semiconductor devices..

05/19/16
20160141275 

Semiconductor power module using discrete semiconductor components


An electronic power module is disclosed. The module includes a baseplate and a plurality of internally isolated discrete electronic devices mounted to the baseplate such that their electrical leads are oriented away from the baseplate.
Littelfuse, Inc.


05/19/16
20160141268 

Method for manufacturing semiconductor apparatus and semiconductor apparatus


A method for manufacturing a semiconductor-apparatus, including an encapsulating step of a device mounting surface of a substrate having semiconductor-devices mounted thereon with a base-attached encapsulant having a base and a thermosetting resin layer formed on one surface of the base, the semiconductor-devices being mounted by flip-chip bonding, the encapsulating step including a unifying stage of the substrate having the semiconductor-devices mounted thereon and the base-attached encapsulant under a reduced pressure condition with a vacuum of 10 kpa or less and a pressing stage of the unified substrate with a pressure of 0.2 mpa or more. A method for manufacturing a semiconductor-apparatus that can inhibit warping even when a thin substrate with a large area is encapsulated, sufficiently perform underfilling of semiconductor-devices mounted by flip-chip bonding, and provide a semiconductor-apparatus excellent in encapsulating performance such as heat and moisture resistance reliabilities without void and non-filling portion of the encapsulating layer..
Shin-etsu Chemical Co., Ltd.


05/19/16
20160141265 

Bumpless build-up layer package including a release layer


An example includes a die package including a microelectronic die having a lower die surface, an upper die surface parallel to the lower die surface, and a die side, the microelectronic die including an active region and an inactive region. The example optionally includes a release layer having a lower release layer surface, an upper release layer surface parallel to the lower release layer surface, and at least one release layer side, the release layer coupled with the upper surface of the microelectronic die in thermal communication with the inactive region of the die and electrically insulated from the active region.
Intel Corporation


05/19/16
20160141258 

Multiple barrier layer encapsulation stack


A process for encapsulating an apparatus to restrict environmental element permeation between the apparatus and an external environment includes applying multiple barrier layers to the apparatus and preceding each layer application with a separate cleaning of the presently-exposed apparatus surface, resulting in an apparatus which includes an encapsulation stack, where the encapsulation stack includes a multi-layer stack of barrier layers. Each separate cleaning removes particles from the presently-exposed apparatus surface, exposing gaps in the barrier layer formed by the particles, and the subsequently-applied barrier layer at least partially fills the gaps, so that a permeation pathway through the encapsulation stack via gap spaces is restricted.
Sage Electrochromics, Inc.


05/19/16
20160141255 

Semiconductor package and fabrication method thereof


A semiconductor package is provided, which includes: a circuit structure having a first bottom surface and a first top surface opposite to the first bottom surface; at least a semiconductor element disposed on the first top surface of the circuit structure and electrically connected to the circuit structure; an encapsulant formed on the first top surface of the circuit structure to encapsulate the semiconductor element, wherein the encapsulant has a second bottom surface facing the first top surface of the circuit structure and a second top surface opposite to the second bottom surface; and a strengthening layer formed on the second top surface of the encapsulant, or formed between the circuit structure and the encapsulant, or formed on the first bottom surface of the circuit structure, thereby effectively preventing the encapsulant from warping and the semiconductor element from cracking.. .
Siliconware Precision Industries Co., Ltd.


05/19/16
20160141244 

Integrated device package comprising an electromagnetic (em) passive device in an encapsulation layer, and an em shield


Some novel features pertain to an integrated device package that includes a die, an electromagnetic (em) passive device, an encapsulation layer covering the die and the em passive device, and a redistribution portion coupling the die and the em passive device. In some implementations, the em passive device includes an electromagnetic (em) passive device.
Qualcomm Incorporated


05/19/16
20160141238 

Semiconductor device and forming a low profile embedded wafer level ball grid array molded laser package (ewlb-mlp)


A semiconductor device has a semiconductor die with an encapsulant deposited over and around the semiconductor die. An interconnect structure is formed over a first surface of the encapsulant.
Stats Chippac, Ltd.


05/19/16
20160141233 

First-packaged and later-etched normal chip three dimension system-in-package metal circuit board structure and processing method thereof


The present invention relates to a first-packaged and later-etched normal chip three dimension-on-chip metal circuit board structure and a processing method for manufacturing the same, the structure includes: metal substrate frame (1); a lead (3) provided in the metal substrate frame (1); a conductive pillar (4) provided in a top surface of the lead (3); a chip is mounted normally on a top surface of the metal circuit frame (1) or between the leads (3); a metal wire (6) via which a top surface of the chip (5) is connected to a top surface of the lead (3); a molding material (8) with which a periphery region of the lead (3), the conductive pillar (4), the chip (5) and the metal wire (6) is encapsulated, with the molding material (8) being flushed with a top of the conductive pillar (4).. .
Jiangsu Changjiang Electronics Technology Co., Ltd


05/19/16
20160141232 

Integrated circuit package


An integrated circuit package comprising a semiconductor die, a lead frame lying in a first plane, at least one conductive pillar structure extending outwardly from the first plane, wherein the lead frame and the at least one conductive pillar structure are formed of sintered conductive material, encapsulation material which encapsulates the semiconductor die, the lead frame and the at least one conductive pillar structure, a conductive layer on an upper face of the package, the conductive layer conductively connecting to the at least one conductive pillar. Methods of manufacturing are also disclosed..
Cambridge Silicon Radio Limited


05/19/16
20160141230 

Semiconductor device and lead frame having vertical connection bars


A semiconductor device includes a lead frame having a die support area and a plurality of inner and outer row leads surrounding the die support area, and a semiconductor die mounted on the die support area and electrically connected to the leads with bond wires. A molding material encapsulates the semiconductor die, the bond wires, and the leads, and defines a package body.

05/19/16
20160141227 

Package structure and fabrication method thereof


A method for fabricating a package structure is provided, which includes: providing a first carrier having a circuit layer thereon; forming a plurality of conductive posts on the circuit layer and disposing at least an electronic element on the first carrier; forming an encapsulant on the first carrier to encapsulate the conductive posts, the circuit layer and the electronic element; and removing the first carrier, thereby dispensing with the conventional hole opening process for forming the conductive posts and hence reducing the fabrication costs.. .
Siliconware Precision Industries Co., Ltd.


05/19/16
20160141217 

Electronic package and fabrication method thereof


A method for fabricating an electronic package, including the steps of: providing a substrate having a plurality of electronic elements and a plurality of separation portions formed between the electronic elements, wherein each of the electronic elements has an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface; forming at least an opening in each of the separation portions from a side corresponding to the inactive surfaces of the electronic elements, wherein the at least an opening does not penetrate the separation portion; forming an encapsulant in the opening; and singulating the electronic elements along the opening from a side corresponding to the active surfaces of the electronic elements. As such, each of the electronic elements has a side surface adjacent to and connecting the active and inactive surfaces of the electronic element and the side surface is partially covered by the encapsulant for protection..
Siliconware Precision Industries Co., Ltd.


05/19/16
20160141198 

Process for transferring layers


The invention relates to a process for transferring an active layer to a final substrate using a temporary substrate, the active layer comprises a first side having a three-dimensional surface topology, the process comprising: a first step of bonding the first side of the active layer to one side of the temporary substrate; a second step of bonding a second side of the active layer to the final substrate; and a third step of separating the active layer and the temporary substrate; the process being characterized in that the side of the temporary substrate possesses a surface topology complementary to the surface topology of the first side of the active layer, so that the surface topology of the temporary substrate encapsulates the surface topology of the first side of the active layer in the bonding first step.. .
Soitec


05/19/16
20160141186 

Decapsulation method and decapsulation system for plastic molded ic package


A plastic mold decapsulation method and decapsulation system is provided for decapsulating a semiconductor device molded by plastic. A plastic mold decapsulation method and decapsulation system for decapsulating a plastic molded semiconductor device includes decapsulating the molded semiconductor device using a solution having dissolved metal in a liquid including acid.
Nippon Scientific Co., Ltd.


05/19/16
20160141127 

Dc voltage switch for high voltage electrical systems


A dc voltage switch for high-voltage on-board electrical systems having a housing, at least two stationary contacts, and a moving contact, wherein, in each case, a first contact region of the stationary contacts is routed out of the housing and, in each case, a second contact region of the stationary contacts is arranged in a switching chamber of the housing with the moving contact, wherein the housing is hermetically encapsulated, wherein a cooling chamber which is separated from the switching chamber by a partition wall is arranged above the switching chamber, wherein the partition wall has at least one outlet opening and at least one inlet opening.. .
Volkswagen Ag


05/19/16
20160141087 

Packaging structure of a magnetic device


An inductor is disclosed, the inductor comprising: a t-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein the volume of the base is v1 and the volume of the pillar is v2; a coil wound on the pillar; and a magnetic body encapsulating the pillar, the coil and a portion of the base, wherein the ratio of v1 to v2 (v1/v2) is configured in a pre-determined range so as to reduce the total core loss of the inductor with the equivalent permeability of the inductor being between 28.511 and 52.949.. .
Cyntec Co., Ltd.


05/19/16
20160140432 

Hand tool having an electronic identification device


Disclosed is a tool (300) having a body comprising two outer strips (305,306) and a recessed middle strip (307), wherein a top cap (309) and bottom cap (312) disposed either side of the middle strip, and attached to one another by dowels (311,314), pins and rings, form a cavity for encapsulating an electronic identification device such as an rfid tag (109). The electronic identification device may be protected by internal webbing or a flexible cellular or elastomeric component and may by in contact with the metal body (302) of the tool.
Stanley Works (europe) Gmbh


05/19/16
20160138918 

Level including removable end caps


A level includes a frame supporting a plurality of vials and having an aperture disposed on an end of the level. The level also includes an end cap assembly detachably coupled to the end of the frame.
Milwaukee Electric Tool Corporation


05/19/16
20160138587 

G-rotor pump assembly


A g-rotor pump assembly is disclosed. The assembly makes use of a housing having a pump/motor housing portion and a laterally projecting housing portion.
American Axle & Manufacturing, Inc.


05/19/16
20160138041 

Identification of a xanthomonas euvesicatoria resistance gene from pepper (capsicum annuum) and generating plants with resistance


The present invention relates to the identification of the xcv-1 gene, which is responsible for a recessive resistance to xanthomonas euvesicatoria, by genetic mapping-based cloning from capsicum annuum. In addition, the invention relates to methods for generating plants resistant to an abiotic or biotic factor, in particular to xanthomonas euvesicatoria, and the plants themselves, in particular tomato plants..
Soft Flow Hungary KutatÓ FejlesztÖ Kft


05/19/16
20160138028 

Glucan-encapsulated sirna for treating type 2 diabetes mellitus


Compositions comprising glucan-encapsulated sirna directed against a region of the gene encoding the human cb1 receptor for use in the treatment of type 2 diabetes mellitus in a human subject. Additionally, methods for treating type 2 diabetes mellitus in a subject, comprising administering to the subject a composition comprising glucan-encapsulated sirna directed against the cb1 receptor..
University Of Massachusetts


05/19/16
20160137973 

Fermentation processes for cultivating streptococci and purification processes for obtaining cps therefrom


This invention is in the field of bacterial cultures and specifically relates to the optimization of culture conditions to improve the production of bacterial capsular polysaccharides from streptococcus strains in fed batch culture and to novel purification methods suitable for production scale purification of bacterial capsular polysaccharides from streptococcus strains resulting in higher levels of purity than previously obtained for production scale.. .
Glaxosmithkline Biologicals Sa


05/19/16
20160137864 

Supramolecular encrypted fluorescent security ink compositions


Fluorescent dyes, ink compositions comprising the dyes, methods and devices for printing the ink compositions, images printed using the ink compositions and methods for authenticating the printed images are provided. The fluorescent dyes are heterorotaxanes that include large macrocyclic rings around fluorophores and are capable of emitting solid-state fluorescence.
Innotune Llc


05/19/16
20160137808 

Epoxy resin composition for encapsulating semiconductor package and semiconductor package encapsulated using the same


Disclosed herein is an epoxy resin composition for encapsulating semiconductor devices, the epoxy resin composition including an epoxy resin, a curing agent, inorganic fillers, and a colorant, the colorant including a hydrate.. .
Samsung Sdi Co., Ltd.


05/19/16
20160137785 

Poly(beta-amino alcohols), their preparation, and uses thereof


A new class of poly(beta-amino alcohols) (pbaas) has been prepared using combinatorial polymerization. The inventive pbaas may be used in biotechnology and biomedical applications as coatings (such as coatings of films or multilayer films for medical devices or implants), additives, materials, excipients, non-biofouling agents, micropatterning agents, and cellular encapsulation agents.
Massachusetts Institute Of Technology


05/19/16
20160137775 

Methoxypolyethylene glycol-polylactic acid block copolymer and preparation method thereof


A methoxypolyethylene glycol-polylactic acid block copolymer is disclosed, the methoxypolyethylene glycol-polylactic acid block copolymer being a block copolymer formed by ring opening polymerization of d,l-lactide and methoxypolyethylene glycol. A mass ratio of the methoxypolyethylene glycol to the d,l-lactide is 1:0.55-0.65 or 1:0.73-0.89 or 1:0.91-0.99.
Suzhou High-tech Bioscience Co., Ltd.


05/19/16
20160137723 

Monoclonal antibodies that react with the capsule of bacillus anthracis


The present disclosure relates to monoclonal antibodies that bind poly-γ-d-glutamic acid (γdpga), which is present on the surface of bacillus anthracis. The disclosure also provides chimeric forms of the monoclonal antibodies, humanized forms of the monoclonal antibodies, and fragments thereof, as well as nucleic acids encoding the antibodies and fragments thereof.
The United States Of America, As Represented By The Secretary, Department Of Health And Human


05/19/16
20160137488 

Method and apparatus of making mems packages


Mems packages and modules are described. In an embodiment, a module includes a package mounted within an opening in a module board.
Apple Inc.


05/19/16
20160137473 

Continuous packaging process using ultraviolet c light to sterilize bottles


Continuous packaging process, in aseptic conditions, which uses uv-c light to sterilise bottles and closure caps which are intended to contain alimentary, cosmetic and pharmaceutical products, wherein the entire internal surface of the bottles is innovatively sterilised by means of lamps specially formed to be introduced through the mouth of the bottles, thus preventing irradiation blind spots, along with preliminary bottle preparation and formation, cap removal, filling and closing stages.. .

05/19/16
20160137403 

Cover for a beverage capsule


The invention concerns a capsule (1) for the preparation of a beverage or food in a beverage or food preparation machine comprising: an enclosure (2) containing one or more beverage or food ingredients, said enclosure presenting an opening (21), a sealing cover (3) closing the opening of the enclosure.. .
Nestec S.a.


05/19/16
20160137402 

Capsule for beverage preparation


The present invention is directed to container (11) for food or beverage preparation, comprising walls (12) defining at least one compartment adapted for containing at least one precursor ingredient, said walls (12) comprising at least one fluid connection portion (20) for fluidly coupling to a cooperating fluid connection portion (31) of a food or beverage preparation machine (1) having at least one source (3, 28) of a fluid mixing ingredient, whereby a food or beverage product is prepared within said compartment (11) by mixing said mixing ingredient with said precursor ingredient, said container (11) further comprising at least one food or beverage delivery wall (16, 17), characterized in that said container (11) comprises built-in pump means (10, 13, 14, 21, 22, 23, 29) suitable for pumping said mixing ingredient from said source (3, 28) when said container (11) is fluidly connected to said machine (1), and for generating a fluid circulation within said at least one compartment, such that a food or beverage product is prepared and expelled through said delivery wall (16, 17).. .
Nestec S.a.


05/19/16
20160137401 

A capsule for food or beverage preparation


A food or beverage capsule (200), comprises: a capsule body (201) 408 comprising a cavity (202) and an open end (204) in communication with the cavity (202); an injection wall (205) disposed upon the open end (204) so as to enclose the cavity (202), the injection wall (205) thereby comprising an interior side (206) facing the cavity (202); and a quantity of a food or beverage ingredient disposed within the cavity (202). The capsule (200) further comprises a sealing membrane (207) fabricated from a flexible material and disposed upon the interior side (206) of the injection wall (205), the sealing membrane (207) being attached to the interior side (206) of the injection wall (205) over at least one fixed region (208) of the sealing membrane (207), at least one free region (209) of the sealing membrane (207) extending freely from an edge of said at least one fixed region (208)..
Nestec S.a.


05/19/16
20160137371 

Integral hot melt adhesive packaging films and use thereof


Propylene polymer based packaging films for encapsulating hot melt adhesives are disclosed. The packaging films are readily miscible with the various hot melt adhesive chemistries during the melting stage without deleteriously affecting the adhesive properties, making the packaging film particularly well suited for packaging hot melt adhesives in a pillow, cylinder, pouch, block, cartridge and like forms..
Henkel Ip & Holding Gmbh


05/19/16
20160136679 

Paint roller system


The present invention is a paint roller system comprising a frame, a paint roller that may be supported by the frame. The frame may not include any moving parts.
Nour Trading House Inc.


05/19/16
20160136668 

Reusable spray bottle


Rechargeable containers and dispensers, in particular spray bottle dispensers including structures such as strips, pouches, pills, capsules and the like for providing concentrates of chemical agents for charging or recharging the spray bottle dispenser, preferably, individual chemical refill charges containing chemical concentrate are deployed within the spray bottle dispenser to fully contain any inadvertent spillage of chemicals, and to insure a high degree of safety against accidental spills or ingestion. The device is specifically designed for reuse, having a wider opening which is easier to fill, clean and refill without spills, readily accommodates concentrate inserts in any format, minimizes trigger failure, and has a wide base for stability..

05/19/16
20160136403 

Device and inserting lubricating capsule


An applicator for insertion and lubrication of a body lumen is disclosed having an elongate, hollow, cylindrical outer sheath including a receiving cup at a distal end for receiving a lubrication capsule; and a plunger slidingly received within the elongate, hollow cylindrical outer sheath, the plunger including a piercing element at a distal end adapted to extend into the receiving cup. A liquid-filled soft gel capsule is placed in the receiving cup, and the piercing element is used to puncture the capsule located in the receiving cup prior to insertion of the applicator into the body lumen, and wherein the plunger can be depressed once the applicator is inserted into the body lumen to eject the pierced capsule into the body lumen..

05/19/16
20160136401 

Helical coil delivery device for active agent


A delivery device including a substrate formed in a coil comprising a plurality of loops, an active agent deposited between an inner surface and an outer surface of the substrate formed in the coil, and a pair of end caps, each end cap disposed on a corresponding end of the coil.. .
International Business Machines Corporation


05/19/16
20160136335 

Enhancement of antimicrobial silver, silver coatings, or silver platings


Antimicrobial metal ion coatings. In particular, described herein are coatings including an anodic metal (e.g., silver and/or zinc and/or copper) that is co-deposited with a cathodic metal (e.g., palladium, platinum, gold, molybdenum, titanium, iridium, osmium, niobium or rhenium) on a substrate (including, but not limited to absorbable/resorbable substrates) so that the anodic metal is galvanically released as antimicrobial ions when the apparatus is exposed to a bodily fluid.

05/19/16
20160136334 

Stents modified with material comprising amnion tissue and corresponding processes


A stent scaffold combined with amniotic tissue provides for a biocompatible stent that has improved biocompatibility and hemocompatibility. The amnion tissue can be variously modified or unmodified form of amnion tissue such as non-cryo amnion tissue, solubilized amnion tissue, amnion tissue fabric, chemically modified amnion tissue, amnion tissue treated with radiation, amnion tissue treated with heat, or a combination thereof.
Peytant Solutions, Inc.


05/19/16
20160136224 

Method for preparing a camellia nitidissima chi lipid-lowering and hypoglycemic agent


The present invention discloses a method for preparing a camellia nitidissima chi lipid-lowering and hypoglycemic agent. Active components such as tea polysaccharides, tea polyphenols, and flavones are extracted from camellia nitidissima chi and purified, which are then mixed with pharmaceutical excipients such as hydroxypropyl methyl cellulose, polyvinylpyrrolidone, and triethyl citrate to prepare various pills, tablets, capsules, granules, etc.
Shenzhen Violin Technology Co.,ltd.


05/19/16
20160136120 

Transdermal delivery kits


Provided are kits containing a base composition and an active pharmaceutical ingredient for transdermal delivery of active pharmaceutical ingredients. Examples of active pharmaceutical ingredients include amitriptyline, baclofen, cyclobenzaprine hcl, ibuprofen, lidocaine hcl, naproxen, and tramadol, ketoprofen, diclofenac, phenylbutazone, mefenamic acid, flubiprofen, piroxicam, guaifenasin, prilocaine, bupivicaine, tetracaine, nifedipine, verapamil, orphenadrine, imipramine, ketamine, gabapentin, carbamazepine, menthol, capsaicin, clonidine, dexamethasone, dextromethorphan, testosterone, progesterone, and estrogens..
Asclemed Usa, Inc. Dba Enovachem Manufacturing


05/19/16
20160136104 

Wireless communications system integrating electronics into orally ingestible products for controlled release of active ingredients


Various embodiments of the present disclosure include a consumable capsule containing an active ingredient in at least one compartment movably sealed by a stimuli responsive actuator, and an activation device configured to communicate with the consumable capsule. The activation device is configured to emit a wireless signal to activate the stimuli responsive actuator of the consumable capsule, and the consumable capsule is configured to release the active ingredient into an external environment based on the activation of the stimuli responsive actuator..
Nano Pharmaceutical Laboratories, Llc


05/19/16
20160136101 

Gastro-resistant soft shell capsule and process for its manufacture


The invention relates to gastro-resistant soft shell capsules having a capsule shell comprising high acyl gellan gum, at least one starch and at least one plasticizer, wherein the capsules fulfil pharmacopoeial disintegration tests characterizing the capsules as gastro-resistant dosage forms. The invention further relates to a method for manufacturing such gastro-resistant soft shell capsules..
Swiss Caps Rechte Und Lizenzen Ag


05/19/16
20160136100 

Multi-phase, multi-compartment, capsular delivery using same


A multi-compartment capsule, comprising, a first receiving chamber comprising at least one ingredient having a first physical state, wherein said ingredient is selected from the group consisting of a nutraceutical, a vitamin, a dietary supplement and a mineral; and a second receiving chamber comprising at least one ingredient having a second physical state, wherein said ingredient is selected from the group consisting of a nutraceutical, a vitamin, a dietary supplement and a mineral; wherein said first physical state of said ingredient of said first receiving chamber being different from said second physical state of said ingredient of said second receiving chamber; and said ingredient of said first receiving chamber being different from said ingredient of said second receiving chamber.. .
Innercap Technologies, Inc.


05/19/16
20160136088 

Silica hydrogel composite


This invention relates to a silica hydrogel composite obtainable by mixing silica particles, comprising an encapsulated agent, with a silica sol, wherein obtained hydrogel composite is shear-thinning. The present invention also relates to use of the silica hydrogel composite according to the invention for an injectable, flowing or extrudable formulation.
Delsitech Oy


05/19/16
20160135919 

Medicine ingestion state management method, medicine and medicine ingestion state management device


Disclosed is a medicine ingestion state management method capable of objectively managing medicine ingestion states of patients. The medicine ingestion state management method involves an operation of prescribing medicine (10) encapsulating, together with a medicament, a medicine information transmitting unit (20) having a function of transmitting medicine information capable of specifying a type and a quantity of the medicament to each individual patient, and an operation of grasping the medicine ingestion state of each patient by collecting the medicine information from each medicine information transmitting unit (20) in each patient..
Fujitsu Limited


05/19/16
20160135918 

Medicine ingestion state management method, medicine and medicine ingestion state management device


Disclosed is a medicine ingestion state management method capable of objectively managing medicine ingestion states of patients. The medicine ingestion state management method involves an operation of prescribing medicine (10) encapsulating, together with a medicament, a medicine information transmitting unit (20) having a function of transmitting medicine information capable of specifying a type and a quantity of the medicament to each individual patient, and an operation of grasping the medicine ingestion state of each patient by collecting the medicine information from each medicine information transmitting unit (20) in each patient..
Fujitsu Limited


05/19/16
20160135889 

Method for depilation by photothermolysis with melanin


Improved melanin-enhanced photothermolysis hair removal method, which includes the application of liposome-encapsulated melanin solutions as a chromophore onto the skin and the use of mechanical devices having microneedles to favor absorption thereof by the hair follicles.. .
Dermopartners,s.l.


05/19/16
20160135720 

Optical capsule and spectroscopic treating and diagnosing the intestinal tract


A device and method for mapping, diagnosing and treating disorders or other diseases, disorders or conditions (e.g., bleeding, ischemic or necrotic tissue, and presence of certain chemicals or substances) of the intestinal tract is provided using a capsule passing through the intestinal tract and sensing optical characteristics as the capsule passes through. Further, a capsule tracking system is provided for tracking a capsule's location along the length of an intestinal tract as various treatment and/or sensing modalities are employed.
Entrack, Inc.


05/19/16
20160135638 

Tea brewing containment device


A device and method for preparing a cup of tea from a tea bag or tea leaves, for reusing the tea bag or tea leaves, and for handling and containing the spent tea bag or leaves is disclosed. The device is configured to remotely dip a tea bag or tea leaves into a hot cup of water, retrieve the tea bag or tea leaves after dipping, and apply pressure onto the spent tea bag or tea leaves to squeeze out undiffused flavor.

05/19/16
20160135637 

Method for preparing a beverage or liquid food and system using brewing centrifugal force


A method and system for preparing a beverage or liquid from a food substance contained in a filtering receptacle by passing water through the substance using brewing centrifugal forces. The method includes feeding water into the receptacle, and driving the receptacle in centrifugal rotation to force water to flow through the substance in a centrifugal flow path to the outlet of the receptacle.
Nestec S.a.


05/19/16
20160135493 

Apparatus, manufacturing food using additive manufacturing 3d printing technology


A 3d printer system that uses the am method to print a product using a plurality of materials, each of which is contained in a respective capsule. The capsules are removably inserted into respective capsule holders, each of which includes a heating device for adjusting the temperature of the material, and is releasably held in one of a plurality of stations.
Natural Machines, Inc.


05/19/16
20160135395 

Modular hydroponic growing system


A hydroponic system has multiple interconnecting components, including a reservoir, a manifold that fills and drains the hydroponic system, a trunk that extends from the manifold, one or more branches that extend from the trunk, end caps that close the ends of the trunk and the branches, and optionally, extension sections for both the trunk and the branches. The trunk and the branches are constructed from a plurality of tubular sections that interconnect with one another using a levered locking system.

05/12/16
20160135299 

Package structure and fabricating the same


A method of fabricating a package structure is provided, including forming a plurality of openings by removing a portion of the material on one side of a conductive layer, forming an insulating material as an insulating layer in the openings, removing a portion of the material on the other side of the conductive layer to serve as a wiring layer, disposing an electronic component on the wiring layer, and forming an encapsulating layer to cover the electronic component, thereby allowing the single wiring layer to be connected to the electronic component on one side and connected to solder balls on the other side thereof to shorten the signal transmission path. The present invention further provides a package structure thus fabricated..
Phoenix Pioneer Technology Co., Ltd


05/12/16
20160135074 

Method for enabling control of data packet flows belonging to different access technologies


The present invention relates to embodiments of nodes and methods in a node in a data telecommunication network. The method and embodiments thereof enables control of data packet traffic belonging to different access technologies to be sent with the same quality of service class over an aggregated encrypted internet security tunnel, ipsec tunnel.
Telefonaktiebolaget L M Ericsson (publ)






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