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 Cold row encapsulation for server farm cooling system patent thumbnailnew patent Cold row encapsulation for server farm cooling system
An apparatus includes an enclosure defining an interior space and includes a server-rack port configured to engage one or more of racks such that one or more servers installed in each rack are contiguous to the interior space. The enclosure is inside of a room and each server includes a fan that draws air from the interior space into the server and expels the air outside of the enclosure into the room.
Yahoo! Inc.


 Liquid-encapsulation heat dissipation member patent thumbnailnew patent Liquid-encapsulation heat dissipation member
A liquid-encapsulation heat dissipation member is prepared by encapsulating a thermally conductive fluid in a closed container nd dissipates heat transferred from an electronic device in contact with the closed container, wherein the closed container includes an elastic portion composed of a thin elastomer serving as a surface to come into contact with the electronic device and following the shape of the electronic device and a heat dissipation portion composed of a hard material for dissipating heat, and the thermally conductive fluid contains a thermally conductive powder and has a viscosity of 200,000 mpa·s to 3,000,000 mpa·s.. .
Polymatech Japan Co., Ltd.


 Distributed data transmission method, transmission apparatus, system and user terminal patent thumbnailnew patent Distributed data transmission method, transmission apparatus, system and user terminal
In a distributed data transmission method, through acquiring the ip address of a user terminal in a first network and a physical address of the user terminal in a second network access module, according to the acquired addresses, when downlink service of the user terminal is distributed from the first network to the second network, an ip message whose destination address is the ip address of the user terminal in the first network is encapsulated to a message in a format corresponding to the medium access layer of the second network and afterwards is transmitted to the user terminal through the second network, and since the ip address bound to the user application is not changed, it is able to achieve seamless switch of the downlink service from the first network to the second network, avoiding problems of unnecessary interruption and restart of the user application and improving user experiences.. .
Chengdu Skspruce Technology, Inc.


 Firewall  industrial systems patent thumbnailnew patent Firewall industrial systems
Selectively enabling communication of dual protocol packets from a source device directed to a service of an object class at target devices is provided. Steps can include providing an access control database including an entry correlating a source device, an object class and a service of the object class; from a source device, receiving a dual protocol packet including a frame and a field according to a first network communication protocol and an encapsulated packet of a second network communication protocol; obtaining from the frame, an identification of the source device; obtaining from the encapsulated packet, an identification and a service of an object class to which the encapsulated packet is directed; comparing the identification of the source device, the identification and service of the object class, and the entry of the access control database; and selectively transmitting the dual protocol packet as a function of the comparison..
Rockwell Automation Technologies, Inc.


 Shortest path bridge with mpls labels patent thumbnailnew patent Shortest path bridge with mpls labels
A method is implemented by a node for enabling shortest path bridging in a network that is scalable to support sixteen million virtual local area network (vlan) identifiers using multiprotocol label switching (mpls) encapsulation. The method comprises allocating a tunnel label using a distributed tunnel label allocation algorithm, allocating a source label using a distributed source label allocation algorithm, assigning a bridge instance a service label, and distributing the tunnel label, source label and service label to other nodes in the mpls network..
Telefonaktiebolaget L M Ericsson (publ)


 Flow entry delivery method and communication system patent thumbnailnew patent Flow entry delivery method and communication system
A flow entry delivery method and a communication system are provided. The communication system includes a controller and n switches.
Huawei Technologies Co., Ltd.


 Snubber circuit patent thumbnailnew patent Snubber circuit
A snubber circuit is provided. The snubber circuit includes a transistor structure and a first capacitor.
Fsp Technology Inc.


 Thin film encapsulation structure and organic light emitting device having the same patent thumbnailnew patent Thin film encapsulation structure and organic light emitting device having the same
The present disclosure provides a thin film encapsulation structure for encapsulating a functional device on a substrate, including: a mixing layer thin film covering the functional device, and an inorganic layer thin film located above the mixing layer thin film, wherein the mixing layer thin film is mainly composed of amorphous aluminum oxide and a crystalline oxide. The present disclosure also provides an organic light emitting device, including a substrate, an oled device located on the substrate, and the thin film encapsulation structure as mentioned above..
Everdisplay Optronics (shanghai) Limited


 Organic light emitting device, manufacturing method thereof and display device patent thumbnailnew patent Organic light emitting device, manufacturing method thereof and display device
The present invention provides an organic light emitting device, a manufacturing method thereof and a display device. In the organic light emitting device provided by the present invention, a first inorganic thin film entirely covers a pre-encapsulation layer and an organic light emitting unit, and the first inorganic thin film has a denser molecular structure compared with the pre-encapsulation layer, thereby more effectively preventing water and oxygen from invading the organic light emitting unit via the pre-encapsulation layer to influence the service life of the organic light emitting unit..
Boe Technology Group Co., Ltd.


 Display panel and manufacturing method therof and display device patent thumbnailnew patent Display panel and manufacturing method therof and display device
The present invention discloses a display panel, a manufacturing method thereof and a display device. The display panel comprises a first substrate divided into a display area and a non-display area surrounding the display area, a plurality of sub-pixel units are provided on a part of the first substrate corresponding to the display area, a photo spacer is provided between two adjacent sub-pixel units and comprises a base and a plurality of protruding structures provided on the base, and the base is made from material including in+ ions which are replaceable with h+ ions.
Boe Technology Group Co., Ltd.


new patent

Method of forming an on-pitch self-aligned hard mask for contact to a tunnel junction using ion beam etching


A method of forming a memory device that in one embodiment may include forming a magnetic tunnel junction on a first electrode using an electrically conductive mask and subtractive etch method. Following formation of the magnetic tunnel junction, at least one dielectric layer is deposited to encapsulate the magnetic tunnel junction.
Crocus Technology


new patent

Light emitting diode structure and manufacturing the same


An edge lighting light emitting diode (led) structure and a method of manufacturing the same are provided. The edge lighting led structure includes a substrate, an electrode pattern, a chip, an encapsulation layer and a fluorescent layer.
Genesis Photonics Inc.


new patent

Chip package structure and manufacturing the same


A chip package structure and method of manufacturing the same are provided. The chip package structure includes a substrate with a carrier surface, a chip having a first surface and a second surface positioned oppositely and a side surface connecting the first surface and the second surface, an encapsulation layer and a fluorescent layer.
Genesis Photonics Inc.


new patent

Electronic devices comprising two encapsulant films


An electronic device comprises a first encapsulating film in direct contact with a light-receiving and transmitting film and a second encapsulating film in direct contact with a back sheet. The first encapsulating film has a zero shear viscosity greater than that of the second encapsulating film.
Dow Global Technologies Llc


new patent

Solar panel


A solar panel includes a protection plate, a back cover, photovoltaic battery cells, a conductive member that electrically connects the photovoltaic battery cells to one another, and an encapsulant that is integrated with and located between the protection plate and the back cover. The encapsulant encapsulates the photovoltaic battery cells and the conductive member and fixes the photovoltaic battery cells and the conductive member to the protection plate and the back cover.
Toyota Jidosha Kabushiki Kaisha


new patent

Photocoupler package


The invention provides a photocoupler package. The photocoupler package includes a light-emitting diode (led) mounted on a first lead frame, electrically connected to the first lead frame.
Lextar Electronics Corporation


new patent

Integrated circuit package having wirebonded multi-die stack


Embodiments of the present disclosure are directed towards an integrated circuit (ic) package including a first die at least partially embedded in a first encapsulation layer and a second die at least partially embedded in a second encapsulation layer. The first die may have a first plurality of die-level interconnect structures disposed at a first side of the first encapsulation layer.
Intel Corporation


new patent

Semiconductor device and forming pop semiconductor device with rdl over top package


A pop semiconductor device has a top semiconductor package disposed over a bottom semiconductor package. The top semiconductor package has a substrate and a first semiconductor die disposed over the substrate.
Stats Chippac, Ltd.


new patent

Reducing defects in wafer level chip scale package (wlcsp) devices


Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein.
Nxp B.v.


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new patent

Semiconductor package and mobile device using the same


According to an embodiment, a semiconductor package includes a semiconductor chip mounted on an interposer board, a encapsulant sealing the semiconductor chip, and a conductive shielding layer covering the encapsulant and at least part of a side surface of the interposer board. The interposer board has plural vias through an insulating substrate.
Kabushiki Kaisha Toshiba


new patent

Semiconductor device


A semiconductor device includes a semiconductor chip, an electrically insulating element separated from the semiconductor chip by a space, and encapsulation material disposed in the space. The semiconductor chip includes a first face having a contact, and the electrically insulating element defines at least one through-hole.
Infineon Technologies Ag


new patent

Semiconductor device and forming an embedded sop fan-out package


A semiconductor device includes a bga package including first bumps. A first semiconductor die is mounted to the bga package between the first bumps.
Stats Chippac Pte. Ltd.


new patent

Electronic package and fabrication method thereof and substrate structure


A substrate structure is provided, which includes: a substrate body having opposite first and second surfaces; a plurality of conductive posts formed on the first surface of the substrate body and electrically connected to the substrate body; and a dielectric layer formed on the first surface of the substrate body for encapsulating the conductive posts, wherein one end surfaces of the conductive posts are exposed from the dielectric layer. Therefore, the present invention replaces the conventional silicon substrate with the dielectric layer so as to eliminate the need to fabricate the conventional tsvs (through silicon vias) and thereby greatly reduce the fabrication cost.
Siliconware Precision Industries Co., Ltd.


new patent

Lead frames with wettable flanks


A method of producing wettable fillets in electronic packages. A matrix of unsingulated lead frames is provided, each including a plurality of lead elements and a chip pad.
Unisem (m) Berhad


new patent

Semiconductor device and forming stacked vias within interconnect structure for fo-wlcsp


A semiconductor device has a semiconductor die mounted to a carrier. An encapsulant is deposited over the semiconductor die and carrier.
Stats Chippac Pte. Ltd.


new patent

Semiconductor device and forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package


A semiconductor device includes a semiconductor die. An encapsulant is formed around the semiconductor die.
Stats Chippac Pte. Ltd.


new patent

Method of forming a molded substrate electronic package and structure


In one embodiment, an electronic package includes a substrate having a plurality of lands embedded within an insulating layer. Conductive patterns are disposed on at least a portion of a respective land top surface.
Amkor Technology, Inc.


new patent

Semiconductor device and forming build-up interconnect structures over carrier for testing at interim stages


A semiconductor device has a first interconnect structure formed over the carrier. A semiconductor die is disposed over the first interconnect structure after testing the first interconnect structure to be known good.
Stats Chippac Pte. Ltd.


new patent

Reduction of defects in wafer level chip scale package (wlcsp) devices


Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein.
Nxp B.v.


new patent

Dopant precursors for mono-layer doping


A doping process is described, which includes applying to a substrate a film of dopant material that bonds to the substrate by at least one of hydrogen bonding and covalent bonding; encapsulating the film on the substrate with an encapsulant material, and subjecting the encapsulated film to rapid thermal processing to cause dopant from the dopant material to migrate into the substrate. The film of dopant material is applied from a dopant composition selected from among: (i) dopant compositions comprising an aqueous or glycol solution comprising an inorganic dopant compound; (ii) dopant compositions comprising an arsenic, phosphorus, boron, or antimony compound in which ligands or moieties coordinated to an arsenic, phosphorus, boron, or antimony central atom have coordination bond energies that are lower than those associated with coordinating bonds of said central atom to oxygen or carbon; (iii) dopant compositions comprising a coordinated moiety that selectively and covalently bonds to the substrate; (iv) dopant compositions comprising a compound that undergoes hydrolysis and alcoholysis to covalently bond a dopant functionality to the substrate in said film of dopant material; (v) dopant compositions comprising precursor vapor of an organodopant compound; (vi) dopant compositions interactive with a surface functionality of the substrate to bind the dopant composition to the substrate, wherein the substrate comprises a silicon surface comprising said surface functionality; (vii) dopant compositions interactive with the substrate to covalently bond with a pretreated and/or modified silicon surface thereof; and (viii) dopant compositions interactive with the substrate to bond with the substrate on a silicon surface thereof that has been modified by a treatment comprising at least one of: (a) contacting the silicon surface with a chemical solution; (b) exposing the silicon surface to plasma; and (c) exposing the silicon surface to ultraviolet radiation..
Entegris, Inc.


new patent

Simulating an industrial system


System and method for simulating an industrial system with a plurality of industrial processes in communication with each other directly or indirectly. The systems and method include: simulating a plurality of industrial processes by providing a set of simulation components, wherein each simulation component simulates one or more industrial processes; defining, for each simulation component, a corresponding encapsulating simulation component; and simulating the industrial system..
Siemens Product Lifecycle Management Software Inc.


new patent

Mobile application creation system


A computer implemented method and system for creating a mobile application provides a mobile application development software (mads) and pre-coded software components (pcscs) encapsulated in a mobile application creation interface (maci). The mads dynamically maps data to be rendered in the mobile application with one or more data sources and launches the maci.

new patent

Archery bow cam


In at least one embodiment, an archery bow includes a rotatable member comprising a cam track, a capstan and a terminal. A drawstring extends from the first rotatable member.
Mcp Ip, Llc


new patent

Roll mount using magnetorheological fluid


A roll mount using a magnetorheological fluid may include a bracket which has a mounting portion having a pipe shape, an insulator made of an elastic material and fitted into the mounting portion, the insulator having therein two liquid chambers that are in communication with each other through flow paths and having a core coupled to a center thereof, and a coil which is wound around an outside of the insulator, in which a magnetorheological fluid is encapsulated in the liquid chambers, the magnetorheological fluid flows while the insulator is elastically deformed by a load applied to the core, and a flow rate of the magnetorheological fluid is adjusted depending on an amount of electric current applied to the coil.. .
Hyundai Motor Company


new patent

Lifting device and method


A hydraulic lifting apparatus and a method is described that raises and lowers caps, such as night caps, lift caps, and other similar items, about a cap sub engaged to a wellhead. The apparatus includes a cap sub, vertical support member, a horizontal support member, a base member, and a hydraulic cylinder.

new patent

Water resistant door threshold and system


The present invention provides a self-draining threshold assembly which comprises a sill cover for mounting on a sill support. A chambered covering attaches to the upper portion of the sill cover and includes an interior vertical wall, an exterior vertical wall, a lower member, an upper member and end caps, which define therein a reservoir chamber.
Fenovation Limited


new patent

Method of manufacturing fiber reinforced barrier coating


A method of manufacturing a fiber reinforced coating. The method includes providing a substrate and plasma spraying a ceramic matrix having fibers encapsulated in a precursor material onto the substrate..
United Technologies Corporation


new patent

Multilayer polymer composite for encapsulating quantum dots


Wherein r1 is hydrogen or methyl and r2 is a c6-c20 aliphatic polycyclic substituent.. .

new patent

Mineral-encapsulated tracers


The invention provides controlled-release compositions comprising at least one encapsulating compound and at least one tracer and/or oil-field chemical, wherein the encapsulating compound is in the form of synthetic crystals having inclusions, and wherein said tracer and/or oil-field chemical is encapsulated within said inclusions. The invention further provides methods for the use of such composition including in tracking the flow, ph and/or salinity of at least one fluid within a geothermal reservoir or a reservoir for petroleum production, as well as in monitoring the integrity of cap and other barriers to fluid flow within the reservoir.
Institutt For Energiteknikk


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new patent

Cellulosic fibers having enhanced reversible thermal properties and methods of forming thereof


A viscose fiber comprises a fiber body including a regenerated cellulosic material and a plurality of microcapsules dispersed in the regenerated cellulosic material. The regenerated cellulosic material is derived from an organic plant material and the plurality of microcapsules containing a phase change material has a transition temperature in the range of 0° c.
Outlast Technologies, Llc


new patent

Double initiated fast crosslinking eva adhesive film


The invention provides a dual-initiated and fast cross-linked eva (ethylene/vinyl acetate copolymer) film for the encapsulation of solar modules, which greatly enhances the speed of the encapsulation. The eva film is mainly prepared from the following raw materials: 100 parts by mass of ethylene/vinyl acetate copolymer, 0.01 to 1.5 parts by mass of a free-radical photoinitiator, 0.01 to 1.5 parts by mass of a free-radical thermal initiator, 0.5 to 10 parts by mass of an auxiliary cross-linking agent, 0.1 to 5 parts by mass of a tackifier and 0.01 to 5 parts by mass of a light stabilizer.
Hangzhou First Pv Material Co.ltd.


new patent

Polyethylene compositions and closures made from them


A dual reactor solution process gives high density polyethylene compositions containing a first ethylene copolymer and a second ethylene copolymer and which have good processability, stiffness, and environmental stress crack resistance. The polyethylene compositions are suitable for compression molding or injection molding applications and are particularly useful in the manufacture of caps and closures for bottles..
Nova Chemicals (international) S.a.


new patent

Filler-containing silicone compositions


Corrosion of electrical and electronic components by sulfur and sulfur-containing compounds is achieved by coating, sealing, or encapsulating the component with an addition curable organopolysiloxane composition containing silicatic hollow microbeads with a metallic silver coating.. .
Wacker Chemie Ag


new patent

Polymers containing s-vinylthio alkanols


Process for preparing polymers comprising s-vinylthioalkanol as monomer by radical polymerization, the polymerization being carried out in aqueous solution, with the proviso that no n-vinylpyrrolidone as monomer is used for preparing the polymers, and also polymers prepared by such processes. Copolymer consisting of s-vinyl-2-thioethan-1-ol and one or more ethylenically unsaturated monomers selected from the group consisting of acrylic acid, itaconic acid, maleic acid, maleic anhydride, and vinylphosphonic acid.
Basf Se


new patent

Procedure for obtaining seaweed sheets by heat treatment with addition of salt and bentonite for making covers of pens or pencils with encapsulated seeds at the end of their structure


The process for the production of films made from algae by heat treatment with the addition of salt and bentonite for making covers of pencil or pen comprises the following steps: i) boiling seaweed containing collagen for gelatinization together with salt and bentonite; ii) poring the gelatinized algae into the bowl and dip a graphite for writing; iii) subjecting to temperature for drying the algae and obtaining sheets; iv) cutting the sheets, according to the size of graphite for writing, leaving a space at the rear end to place the seeds; and iv) wrapping the graphite for writing with pieces of wet sheets to obtain a particular shape.. .

new patent

Lid member for press-through package and press-through package packing body


A lid member for a press-through package, and a press-through package packing body using the same in which the lid member is not to be inadvertently torn, while tablets or capsules as its contents can be taken out under a uniform opening strength by a predetermined force or more using fingers. The lid member of the packing body includes a resin film, an adhesive, an aluminum foil, and a thermal adhesive layer, in which tapered through holes are formed in the resin film.
Toyo Aluminium Kabushiki Kaisha


new patent

Handheld machine tool


A handheld machine tool is disclosed. The tool has a tool receiving area and a striking mechanism.
Hilti Aktiengesellschaft


new patent

Spot welding cap changer


The invention relates to a spot welding cap changer (1) with a cap puller (2) and two cap magazines (3, 3a), the cap puller (2) having a gripper (20) with spring-loaded, pivotable jaws (21, 22), which in response to a turning and axial pulling-off movement detaches a spot welding cap (k) of a pincer spot welding head introduced into it from a shaft of the pincer welding head in such a way that it is clamped to prevent it twisting, and the cap magazines (3, 3a) holding spot welding caps respectively in a round cap carrier (31) such that they are circularly arranged in a directed and oriented manner and are respectively transported individually one after the other into an access position against a stop (32) by an advancing force (p).. .
002152706 Ontario Ltd.


new patent

Microfluidic device for high-volume production of monodisperse emulsions


A high volume microfluidic system for producing emulsions includes a fluid distribution network to produce uniformly sized emulsions and encapsulates.. .
King Abdullah University Of Science And Technology


new patent

Connection-free filter capsule apparatus


Disclosed is a tube/tube connector/capsule port assembly that eliminates a connection point in a filter capsule apparatus. A relatively soft tube is thermally or sonically bonded to a relatively hard tube connector that may have a tube receiving bore, frustoconical tube receiving channel or straight tube receiving channel.
Saint-gobain Performanc Plastics Corporation


new patent

Active implantable medical device comprising a connector-free capsule, permanently connected to a microlead


The device comprises a sealed body housing electronic circuits, and extending from said body, a microlead comprising microcables connected to remote electrodes. The device has no connector between the microlead and the electronic circuits.
Sorin Crm Sas


new patent

In situ implantation accessory for an autonomous intracardiac capsule


This accessory comprises a remotely steerable catheter (40) extended by a tip (50) comprising a base (52) to which the catheter (40) connects to and a cylindrical portion (54) defining a volume (56) suitable for housing the capsule (10). A sub-catheter (30) and the capsule are telescopically extendable with respect to the catheter between i) a retracted position and a deployed position wherein the capsule is removed from the connector and is carried by the distal end of the sub-catheter, and the distal end of sub-catheter and the proximal region (18) of the capsule being provided with disconnectable means of attachment (20, 36).
Sorin Crm Sas


new patent

Nucleic acid nanostructures for in vivo agent delivery


The present disclosure provides, in some aspects, nucleic acid nanostructures subsaturated with polyamine polymers. The present disclosure also provides, in some aspects, nucleic acid nanocapsules that include a first nucleic acid nanostructure bound to a second nucleic acid nanostructure through a ph-sensitive interface, thereby forming a nanocapsule having an exterior surface and an interior compartment having an interior surface..
Dana-farber Cancer Institute, Inc.


new patent

Immunosuppresive treatments, formulations and methods


The present disclosure provides inventive methods and formulations for immunosuppressive therapy for dry eye and other related immune mediated eye diseases. The formulations can comprise one or more immunomodulatory drugs such as parenterally administered liposome encapsulated rapamycin and topically administered tacrolimus.

new patent

Polymer nanoparticles containing multiple agents and methods thereof


Disclosed herein are polymer nanoparticles comprising i. A nano-precipitated bioactive compound, wherein the nano-precipitate is encapsulated by a lipid, and ii.
The University Of North Carolina At Chapel Hill


new patent

Ionic gelation on solids


The invention relates to a method for ionic gelation on solids for encapsulating water-insoluble solids. The method uses negatively charged macromolecules and soluble salts of polyvalent cations as shell-forming materials having a high adsorption on the surface of the solid when subjected to thermal treatment.
Universidad De Antioquia (udea)


new patent

Shell-forming compositions for soft capsules and soft capsules


A shell-forming composition for a soft capsule comprising a non-gelatin component as the chief component, wherein the shell-forming composition is able to inhibit a decrease in physical strength (breaking strength) of the capsule when a phospholipid-containing oil with a phospholipid concentration of 20% or more by mass is used as the core of the capsule. The shell-forming composition for the soft capsule comprises (a) starch and/or dextrin, (b) a gelatinizer, (c) glycerin and (d) sorbitol, and the mass ratio of (c) glycerin:(d) sorbitol ranges from 100:30 to 100:120..
R.p. Scherer Technologies, Llc


new patent

A nanostructured conditioning cosmetic composition, the use thereof in cosmetic preparations, and a conditioning shampoo


The present invention relates to conditioning cosmetic compositions comprising a nanostructured system formed by lipidic nanoparticles based on at least one from oil, butter and wax, which encapsulate at least one cationic surfactant, as well as the use thereof in cosmetic preparations. Besides, the invention relates to a conditioning shampoo comprising said cosmetic composition..
Natura CosmÉticos S.a.


new patent

Capsule device having variable specific gravity


An endoscopy capsule having an image collecting capacity includes a deformable member configured to inflate when exposed to body liquid. The deformable member includes an effervescent material.
Capsovision, Inc.


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new patent

Capsule endoscope


Provided is a capsule endoscope including a capsule body, a fin portion, and a sack portion, the capsule endoscope being capable of moving easily even in a situation where the movement thereof is likely to be obstructed. This capsule endoscope 1 includes: a capsule body 3 including a forward imaging element that images a forward side and a backward imaging element that images a backward side; a fin portion 4 in which a magnet that is displaced in response to an alternating magnetic field is mounted and which vibrates by being elastically deformed by the displacement of the magnet; and a sack portion 5 to which a front end 4b of the fin portion 4 is bonded at a position shifted downward from an axial line of the capsule body 3, and which is attached to the capsule body 3 in such a way that a rear end side of the capsule body 3 is inserted into the sack portion 5 and the sack portion 5 is elastically deformed to make close contact with the periphery of the rear end side, the sack portion 5 being provided with an opening of a hollow portion near the front end of the fin portion 4.
Mu Ltd.


new patent

Device and brewing a beverage


A capsule holder (20) for receiving a capsule (30) containing tea material, adapted for use with an automated beverage brewing device, the holder comprising a filter (25) for permitting the passage of prepared beverage but preventing the passage of unwanted coarse solid tea material, an inlet for receiving infused beverage above the filter, a means for supporting a capsule within the capsule holder, a chamber (70) beneath the filter (25) into which strained beverage passes during use, the chamber (70) having an outlet (21, 29) for dispensing the prepared beverage, characterised in that, the chamber (70) and the space above the filter (25) are in gaseous communication by means of at least one channel (27, 76).. .
Conopco, Inc., D/b/a Unilever


Low-profile space-efficient shielding for sip module


Readily manufactured structures for sealing or encapsulating devices in system-in-a-package modules, such that the modules are easily assembled, have a low-profile, and are space efficient. One example may provide readily manufactured covers for sip modules.
Apple Inc.


Flexible display device


A flexible display device is disclosed. In one aspect, the display device includes a display substrate and a display element layer formed over the display substrate and including a matrix of pixels.
Samsung Display Co., Ltd.


Stereo headset, terminal, and audio signal processing methods thereof


A audio signal processing method includes: sampling and holding, in a time sharing manner, an audio-left channel analog signal output by an audio-left channel microphone of a stereo headset and an audio-right channel analog signal output by an audio-right channel microphone; performing analog-to-digital conversion on the audio-left channel analog signal and audio-right channel analog signal that are sampled and held, so as to obtain a corresponding audio-left channel digital signal and an audio-right channel digital signal; performing data encapsulation on the audio-left channel digital signal and the audio-right channel digital signal to obtain a serial digital signal; and receiving and demodulating, by a terminal, the serial digital signal to obtain an audio-left channel digital signal and an audio-right channel digital signal.. .
Huawei Technologies Co., Ltd.


Microphone capable of actively counteracting noise attributed to undesired vibration


A microphone includes a capsule module including a carrier, a primary transducer unit and a secondary transducer unit. The carrier includes a hollow part mounted to a handle unit, and first and second carrier parts extending oppositely from the hollow part.
Taiwan Carol Electronics Co., Ltd.


A receiver and a processing a broadcast signal including a broadcast content and an application related to the broadcast content


The receiver comprising a receiving device for receiving a data structure that encapsulates a questionnaire which represent individual questions that can be answered by the receiver, a pdi engine for acquiring the questionnaire from the data structure, receiving a setting option of a user for the application identified by the application identifier, and storing the setting option in relation to the data structure, an application signaling parser for parsing a trigger which is a signaling element to establish timing of playout of the application, and a processor for parsing a second application identifier from the trigger, acquiring the stored setting option in relation to the data structure of which a value of the first application identifier matches to a value of the second application identifier, and determining whether process the application to be launched or not based on the setting option is disclosed. .
Lg Electronics Inc.


Terminal cover body and terminal


The present invention embodiment provides a terminal cover body and a terminal, said terminal cover body being used for covering the device body of the terminal and encapsulating electronic components on the device body. The terminal cover body comprises: a casing body, wherein a slide-groove is provided in the casing body and a slide-block is provided in the slide groove; a lock engagement component which comes into contact with the slide-block; pushing the slide-block causes the lock engagement component to move between a first state and a second state, wherein, in the first state the lock engagement component is engaged with the device body and the casing body is tightly connected to the device body; in the second state, the lock engagement component is detached from the device body and the casing body can be separated from the device body..
Zte Corporation


System and optimized delivery of live abr media


A method of providing live adaptive bitrate (abr) video to a premises includes receiving live abr transport stream based content for a channel from a content server; encapsulating transport stream (ts) packets for the content in rtp packets to form rtp content packets; encapsulating in rtp packets an aggregate manifest for a plurality of abr streams for the content to form rtp manifest packets; multiplexing the rtp content packets and the rtp manifest packets; and transmitting the multiplexed rtp packets as a multicast stream.. .
Telefonaktiebolaget L M Ericsson (publ)


System and delivering inline interactive objects encapsulated in a message


A system and method for delivering text, media, and inline interactive data (called message content) encapsulated in a message-based conversation has been devised. Content of multiple types are rendered and manipulated using interactive program code objects, downloaded when first needed from a repository, present on the message device.

Transmitting multi-destination packets in overlay networks


In an embodiment, a network adapter receives a request from a first virtual switch of an overlay network to transmit a multi-destination packet to each of one or more virtual switches of the overlay network identified in a list stored in the network adapter. For each of the one or more virtual switches identified in the list, the network adapter creates a head-end replication of the multi-destination packet, obtains tunneling endpoint information for the identified virtual switch, encapsulates the created head-end replication of the multi-destination packet with a header specific to a tunneling protocol identified in the obtained tunneling endpoint information, and transmits the encapsulated packet to a receiver hosted on the identified virtual switch..
International Business Machines Corporation


Packet forwarding method and apparatus


The present application discloses a packet forwarding method and apparatus. An access device receives a first packet, where the first packet is an ethernet packet, searches an equal-cost multi-path forwarding entry for a matched equal-cost path according to a destination mac address of the ethernet packet, where the equal-cost multi-path forwarding entry includes: a virtual mac address corresponding to a gateway aggregation group, an identifier of each gateway device in the gateway aggregation group, and an outbound interface corresponding to the identifier of each gateway device, where the identifier is used to uniquely identify a gateway device in a large layer 2 network; and if n matched equal-cost paths are found, encapsulates the first packet into a second packet according to a first path in the n matched equal-cost paths, and forwards the second packet according to an outbound interface of the first path..
Huawei Technologies Co., Ltd.


Conductive gasket assembly for a corrugated roof of a train car


An electrically conductive assembly for providing a low electrical resistance contact between an antenna and the corrugated roof of a train. The assembly comprises a gel and skeletal gasket member which has an electrically conductive skeleton encapsulated in a tacky gel.
Aviation Devices & Electronic Components, Llc


Organic light emitting diode display device and manufacturing the same


A method of manufacturing an organic light emitting diode (oled) display device includes: providing a substrate including a display area and a non-display area; forming an organic light emitting diode element in the display area; forming a barrier wall around the display area and spaced apart from the organic light emitting diode element; performing a plasma treatment on the substrate on which the organic light emitting diode element is formed; and forming a thin film encapsulation layer for coating the organic light emitting diode element, wherein forming the thin film encapsulation layer includes: forming at least one inorganic layer; and forming at least one organic layer inwardly of the barrier wall.. .
Samsung Display Co., Ltd.


Organic light-emitting display device


An organic light-emitting display device includes: a substrate; a display on the substrate and comprising a display region and a non-display region at a perimeter of the display region; a thin-film encapsulation layer sealing the display; a voltage line at the non-display region and surrounding the display region; and a dam unit overlapping an edge of an outer side of the voltage line, wherein the voltage line comprises: a first voltage line at one side of the display region; and a second voltage line surrounding a pair of first end portions of the first voltage line and other sides of the display region, and an outer side of the first voltage line and an outer side of the second voltage line are on a same line outside the one side of the display region.. .
Samsung Display Co., Ltd.


Quantum dots with multiple insulator coatings


Fabricating a semiconductor structure including forming a nanocrystalline core from a first semiconductor material, forming a nanocrystalline shell from a second, different, semiconductor material that at least partially surrounds the nanocrystalline core, wherein the nanocrystalline core and the nanocrystalline shell form a quantum dot. Fabrication further involves forming an insulator layer encapsulating the quantum dot to create a coated quantum dot, and forming an additional insulator layer on the coated quantum dot using an atomic layer deposition (ald) process..

Active matrix organic light-emitting diode panel and producing cross


An amoled panel and a method for producing the amoled panel. The amoled panel includes a touch control cover with a detecting function.
Everdisplay Optronics (shanghai) Ltd.


A white light oled display and an encapsulation method thereof


The invention provides a white light oled display, which comprises: a glass cover, a color filter layer coated on the glass cover; a transparent protective layer covering on the color filter layer; a desiccant layer positioned on the transparent protective layer; and a tft substrate of a white light oled layer; the color filter layer, the transparent protective layer and the desiccant layer positioned between the glass cover and the tft substrate of the white light oled layer. The white light oled display provided by the invention can protect the color filter layer every well by positioned the transparent protective layer on the color filter layer, and further influence display effect of the white light oled display..
Shenzhen China Star Optoelectronics Technology Co., Ltd.


Packaging module and substrate structure thereof


A substrate structure is provided, including a first insulating layer, a first circuit layer embedded in and bonded to the first insulating layer; a plurality of first conductive posts formed in the first insulating layer and electrically connected to the first circuit layer, a second circuit layer formed on the first insulating layer and electrically connected to the first circuit layer through the first conductive posts, a plurality of second conductive posts and a plurality of conductive bumps formed on the second circuit layer, and a second insulating layer formed on the first insulating layer and encapsulating the second circuit layer, the second conductive posts and the conductive bumps. The second insulating layer has a cavity exposing the conductive bumps.
Phoenix Pioneer Technology Co., Ltd.


High-current fuse with endbell assembly


A fuse including a fuse body defining an inner cavity and having at least one fuse body aperture formed therethrough, a fuse element including a first terminal and a second terminal, a first endbell and a second endbell coupled to the fuse element, the first endbell having at least two grooves formed in a surface thereof and having a first o-ring seal disposed in at least one of the grooves, the second endbell having at least two grooves formed in a surface thereof and having a second o-ring seal disposed in at least one of the grooves, an adhesive securing the first and second endbells to the fuse body, an arc quenching material disposed within the inner cavity and contacting at least a portion of the fuse element, and end caps coupled to the fuse body, the end caps sealing a portion of the fuse element within the fuse body.. .
Littelfuse, Inc.


Thermally conductive encapsulant material for a capacitor assembly


A capacitor assembly that comprises a housing, a capacitor element that is hermetically sealed within the housing, and a thermally conductive material that at least partially encapsulates the capacitor element is provided. The capacitor element includes a sintered anode body, a dielectric overlying the anode body, and a solid electrolyte overlying the dielectric.
Avx Corporation


Transfer mold compound mixture for fabricating an electronic circuit


A transfer mold compound mixture for use in a transfer mold device to encapsulate electronic components. A ferromagnetic material is mixed into a mold compound to produce a mixed mold compound having an increased permeability over the mold compound..
Texas Instruments Incorporated






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