Bonds patents

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Date/App#	List of recent Bonds-related patents
04/17/14 20140108295	Methods and apparatus for generating purified minimum risk portfolios The quantitative construction of investment portfolios of securities such as stocks, bonds, or the like using optimization is addressed. More specifically, during optimization, constraints on non-target factor exposures are automatically converted to constraints on the exposure of the projections of the non-target factors that are orthogonal to a specified target factor.
04/17/14 20140107368	Amide derivative, pest control agent containing the amide derivative, and pest controlling method A pest control agent containing a compound represented by the following formula (1), wherein a represents a carbon atom, a nitrogen atom, or the like, k represents a non-metal atom group necessary for forming a cyclic linking group derived from a 5- or 6-membered aromatic ring, in combination with a and two carbon atoms to which a bonds, x represents a hydrogen atom, a halogen atom, or the like, n represents an integer of from 0 to 4, t represents —c(=g1)-q1 (wherein g1 and g2 represent an oxygen atom or the like, q1 represents a phenyl group which may have a substituent, a heterocyclic group which may have a substituent, or the like), or the like, q2 represents a phenyl group or the like, g3 represents an oxygen atom or the like, and r1 and r2 each independently represent a hydrogen atom, a c1-c6 alkyl group, or a group represented by -l-d, or the like (provided that at least either r1 or r2 represents a group represented by -l-d); as an active ingredient exhibits an excellent effect.. .
04/17/14 20140107294	Extended film and the manufacturing method thereof An extended film and a manufacturing method thereof are provided. The extended film includes a poly(lactic acid) and a block copolymer, wherein the block polymer includes a first block, a second block and a third block that connected with each other by chemical bonds.
04/17/14 20140106511	Flip-chip packaging techniques and configurations Embodiments of the present disclosure flip-chip packaging techniques and configurations. An apparatus may include a package substrate having a plurality of pads formed on the package substrate, the plurality of pads being configured to receive a corresponding plurality of interconnect structures formed on a die and a fluxing underfill material disposed on the package substrate, the fluxing underfill material comprising a fluxing agent configured to facilitate formation of solder bonds between individual interconnect structures of the plurality of interconnect structures and individual pads of the plurality of pads and an epoxy material configured to harden during formation of the solder bonds to mechanically strengthen the solder bonds.
04/17/14 20140106161	Surface-coated metallic pigment, water base paint containing the same, and coated product to which water base paint has been applied A surface-coated metallic pigment according to the present invention includes base particles and a coating layer constituted of one layer, or two or more layers formed on a surface of the base particles, the coating layer having an outermost layer composed of a first compound obtained by polymerizing one monomer or oligomer, or two or more monomers or oligomers having one or more polymerizable double bonds, the outermost layer having a surface to which one surface modifier or two or more surface modifiers is/are bonded, and the surface modifier being a monomer or an oligomer having a bridged ring structure containing 9 to 12 carbon atoms and having one or more polymerizable double bonds.. .
04/17/14 20140104728	Head suspension having actuator in which piezoelectric element is bonded with bonding tape, actuator and method of attaching piezolectric element with bonding tape A head suspension includes a base to be attached to a carriage, a load beam having a rigid part and a resilient part that connects the rigid part to the base, the load beam applying load onto a read/write head, a flexure attached to the load beam and supporting the head, an actuator attaching part located between the base and the head, and a piezoelectric element being deformable in response to a voltage applied thereto to move the head in a sway direction relative to the base. For the head suspension, it bonds the piezoelectric element with a bonding tape to the actuator attaching part and applies an adhesive to fix the piezoelectric element to the actuator attaching part..
04/17/14 20140104216	Electronic device An electronic device 100 includes a display unit 165 including a display part 160 having a display region 160a on which to display an image, a panel member 130 to be touched by a user, and a first adhesive part 150 which is provided so as to cover the display region 160a and which bonds the panel member 130 and the display part 160 together; a vibration part 140 which causes flexural vibration of the display unit 165; and a second adhesive part 155 which bonds the vibration part to the display unit. The rigidity of the first adhesive part 150 is lower than the rigidity of the second adhesive part 155..
04/17/14 20140103573	Golf balls including a crosslinked thermoplastic polyurethane cover layer having improved scuff resistance This disclosure relates to golf balls having a cover layer made from a crosslinked thermoplastic polyurethane elastomer. The crosslinked thermoplastic polyurethane elastomer includes crosslinks located in the hard segments, where the crosslinks being the reaction product of unsaturated bonds located in the hard segments catalyzed by a free radical initiator.
04/17/14 20140103535	Stub minimization for assemblies without wirebonds to package substrate A microelectronic package can include a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may intersect the face along a line in the first direction and centered relative to the columns of element contacts.
04/17/14 20140103514	Power quad flat no-lead (pqfn) package having bootstrap diodes on a common integrated circuit (ic) According to an exemplary implementation, a power quad flat no-lead (pqfn) package includes a multi-phase inverter situated on a leadframe. The pqfn package further includes drivers situated on the leadframe and configured to drive the multi-phase inverter.
04/17/14 20140103500	Microelectronic assembly with impedance controlled wirebond and conductive reference element A microelectronic assembly can include a microelectronic device having device contacts exposed at a surface thereof and an interconnection element having element contacts and having a face adjacent to the microelectronic device. Conductive elements, e.g., wirebonds connect the device contacts with the element contacts and have portions extending in runs above the surface of the microelectronic device.
04/17/14 20140103447	Power rf amplifiers A power transistor circuit uses first and second power transistors in differential mode. An inductor arrangement of inductors is formed by wire bonds between the drains.
04/17/14 20140102901	Negative dielectrophoresis for selective elution of immumo-bound particles The procedure of dielectric electrophoresis (dielectrophoresis or dep) utilizes field-polarized particles that move under the application of positive (attractive) and/or negative (repulsive) applied forces. This invention uses negative dielectric electrophoresis (negative dielectrophoresis or ndep) within a microchannel separation apparatus to make particles move (detached) or remain stationary (attached).
04/17/14 20140102636	Fabrication method of microfluidic devices Fabrication method of microfluidic devices consisting of a sheet (1) which is 200 micrometre thick or less and a rigid part (3), both made of thermoplastic polymeric material includes degasification of a polymeric sheet of thermoplastic material (1), an auxiliary rigid part (2), and a polymeric rigid part of thermoplastic material (3). A temporary bonding procedure, of the degassed thermoplastic polymeric sheet (1) to a degassed auxiliary rigid part (2), is conducted producing a sheet-auxiliary part set (4).
04/17/14 20140102594	Method of plasma preparation of metallic contacts to enhance mechanical and electrical integrity of subsequent interconnect bonds A method of removing oxidation from certain metallic contact surfaces utilizing a combination of relatively simple and inexpensive off-the-shelf equipment and specific chemistry. The method being a very rapid dry process which does not require a vacuum or containment chamber, or toxic gasses/chemicals, and does not damage sensitive electronic circuits or components.
04/10/14 20140100349	Silicic acid (hetero) polycondensates comprising organically polymerisable groups and either sulphonate groups or sulphate groups, organic polymerisates produced therefrom, and a method for producing said polycondensates The invention relates to silicic acid (hetero) polycondensates consisting of at least one silane that has a group bonded to silicon by a carbon atom and that carries an organically polymerisable c═c double bond, and at least one silane that has a group bonded to silicon by a carbon atom and that carries a sulphonate group or a sulphate group of the formula —(o)d-so3m wherein d=0 or 1 and m=hydrogen, or a monovalent metal cation, or the corresponding quantity of a polyvalent metal cation, yet not including polycondensates in which the c═c double bonds are formed exclusively by methacrylic esters that are bound, in the form of a methylene acryl ester group, to the groups bonded to silicon by carbon. The invention also relates to composites that consist of such silicic acid (hetero) polycondensates in combination with fillers, and to polymers produced by organically polymerising the c═c double bonds in the polycondensates or composites.
04/10/14 20140099506	Biodegradable polymers with sulfenamide bonds for drug delivery applications The present invention provides polysulfenamides and methods of making same.. .
04/10/14 20140099461	Self-bonding fluoropolymers and methods of producing the same A method of making expanded fluoropolymer articles thermally bonds portions of expanded fluoropolymers together, without using an adhesive or crushing force, to produce stronger bonds at the joint between the expanded fluoropolymers than the bonds within the constituent expanded fluoropolymers. The method involves placing the portions of expanded fluoropolymers to be thermally bonded together in intimate contact with each other after wet-stretching the expanded fluoropolymers, and removing the wetting agent used to wet-stretch the expanded fluoropolymers, without subsequent expansion or stretching, to yield an expanded fluoropolymer article exhibiting unexpected and superior properties that can be used in a variety of medical and industrial applications..
04/10/14 20140099457	Light-permeable housing having metal layer and texture of specific material and method for making the same The present invention is to provide a light-permeable housing, which includes a metal layer evenly formed with a plurality of apertures and a bonding layer made from a mixture of a light-permeable bonding material and a solid material (such as mineral or glass powder) with a particle size smaller than the diameter of each aperture. The bonding layer is formed on the metal layer and bonds tightly thereto through the apertures to form the light-permeable housing, allow passage of light projected from a lamp inside the light-permeable housing, and thereby impart light-permeability to the light-permeable housing.
04/10/14 20140099371	Medicinal carriers, and preparation method and uses thereof A medicinal carrier is provided. The medicinal carrier comprises a first component, which is a biocompatible polymer with an amino group (—nh2); a saccharide; and a second component which is a biocompatible material.
04/10/14 20140097116	Respiratory face mask dispensed from a continuous roll and method of making the same A respirator mask dispensing system is provided. It includes a carrier material and a plurality of respirator masks mounted in parallel on the carrier material by an adhesive.
04/10/14 20140097083	Transient stimulated three body association reactions for controlling reaction rates and reaction branches A transient distribution of electron quasiparticles with elevated effective mass is created by adding a targeted range of both crystal momentum and electron energy in a conductor to place electrons into regions of the electronic band structure diagram having a chosen, desired curvature. Effective mass scales as the inverse of curvature.
04/10/14 20140096645	Surfactant removal from palladium nanoparticles A method for removing a surfactant from a palladium nanoparticle includes exposing the palladium nanoparticle to hydrogen and removing the surfactant from the palladium nanoparticle. A method includes synthesizing a palladium nanoparticle using a surfactant.
04/10/14 20140096369	Method for manufacturing registration template A method for manufacturing a registration template for use in medical navigation system-guided surgery, comprising: producing a registration template having a surface, which precisely surface-bonds to a surface of a bone at a surgical target site of a patient, and having three or more registration points, from stereoscopic surface data ensuring precise surface bonding to the surface of the bone at the surgical target site of the patient, based on stereoscopic surface data created from tomography information on the bone of the surgical target site of the patient; and providing a pedestal (4) for mounting optical tracking balls (7), which are used for three-dimensional position detection for a medical navigation system, at the center of the registration points. By using the template having curves surfaces which three-dimensionally precisely and intimately contact the bone surface of the patient, high-precision registration can be performed, and an operator's man-hours immediately before surgery in an operating room can be reduced to shorten the surgery time..
04/10/14 20140096307	Method for modifying the surface of an elastomer product The invention relates to a method for modifying the surface of an elastomer product with unsaturated carbon-carbon bonds, in particular a glove, whereby the unsaturated carbon-carbon bonds in the region of the surface are at least partially saturated by a photochemical reaction with at least one thiol or by applying or dipping to apply a layer of latex to at least certain regions of the surface of the elastomer product, the unsaturated carbon-carbon bonds of which in the region of its surface are at least partially saturated by a photochemical reaction with at least one thiol.. .
04/03/14 20140095409	Web platform with customized agents for automated investment management services A web platform for automated investment management services is provided. The platform may enable the automated management of client funds, invested in stocks and other traded assets such as commodities and gold, as well as other traded securities and financial instruments like stock options, stock funds, stock indexes, bonds and structured products.
04/03/14 20140093450	Pretargeting kit for imaging or therapy comprising a trans-cyclooctene dienophile and a diene Described is a pretargeting method, and related kits, for targeted medical imaging and/or therapeutics, wherein use is made of abiotic reactive chemical groups that exhibit bio-orthogonal reactivity towards each other. The invention involves the use of [4+2] inverse electron demand (retro) diels-alder chemistry in providing the coupling between a pre-targeting probe and an effector probe.
04/03/14 20140093443	Storage material and method for obtaining h-silanes therefrom A storage material for obtaining h-silanes which is present in the form of a hydrogenated polysilane (hps), as a pure compound or as a mixture of compounds having on average at least six direct si—si bonds, the substituenis of which predominantly consist of hydrogen and in the composition of which the atomic ratio of sabstitueot to silicon is at least 1:1.. .
04/03/14 20140091379	Fluorocarbon coating having low refractive index A fluorocarbon coating comprises an amorphous structure with cf2 bonds present in an atomic percentage of at least about 15%, and having a refractive index of less than about 1.4. The fluorocarbon coating can be deposited on a substrate by placing the substrate in a process zone comprising a pair of process electrodes, introducing a deposition gas comprising a fluorocarbon gas into the process zone, and forming a capacitively coupled plasma of the deposition gas by coupling energy to the process electrodes..
04/03/14 20140091256	Transition-metal free reductive cleavage of aromatic c-o, c-n, and c-s bonds by activated silanes The present invention describes chemical systems and methods for reducing c—o, c—n, and c—s bonds, said system comprising a mixture of (a) at least one organosilane and (b) at least one strong base, said system being substantially free of a transition-metal compound, and said system optionally comprising at least one molecular hydrogen donor compound, molecular hydrogen, or both.. .
03/27/14 20140088535	Article with soft nonwoven layer An article having as a component a nonwoven material, which includes a layer of spunbond fibers. The fibers of the nonwoven material are made of a composition that includes a first polyolefin, a second polyolefin that is a propylene copolymer and is different from the first polyolefin and a softness enhancer additive.
03/27/14 20140088246	Aqueous polyurethane resin dispersion and coating composition comprising the same The present invention is to provide an aqueous polyurethane resin dispersion in which a polyurethane resin s dispersed in an aqueous medium, wherein the polyurethane resin is obtained by reacting (a) a polyurethane prepolymer which is obtained by reacting (a) a polyisocyanate compound, (b) a polyol compound containing a polycarbonate polyol having a number average molecular weight of 800 to 3500, and (c) an acidic group-containing polyol compound, and (b) a chain extender, being dispersed in an aqueous medium, (b) the chain extender contains a polyamine compound having three or more in total of an amino group(s) and/or an imino group(s) per molecule, and the polyurethane resin has, each based on a solid content, a content of urethane bonds of 5 to 10% by weight, a content of urea bonds of 2 to 7% by weight, a content of carbonate bonds of 15 to 40% by weight, has neither ether bond nor ester bond, has a density of cross-linking points of 1.0×10−4 to 1.0×10−3 mol/g, an acid value of 12 to 20 mg koh/g, and a weight average molecular weight of 100,000 or more.. .
03/27/14 20140088216	Highly branched lipophilic polymer, and photopolymerizable composition containing the same There is provided a highly branched lipophilic polymer that is excellent in blending and dispersing properties in a matrix resin, and is possible to provide surface modification properties such as excellent lipophilicity (anti-fingerprint property) and the like to a coating that is obtained from the resin composition while the intrinsic transparency of the resin is not impaired; and a photopolymeizable composition comprising the highly branched lipophilic polymer. A highly branched lipophilic polymer obtained by polymerizing a monomer a containing two or more radically polymerizable double bonds per molecule and a monomer b containing a c6-30 alkyl group or a c3-30 alicyclic group and at least one radically polymerizable double bond per molecule in the presence of 5 to 200 mol % of a polymerization initiator c relative to the number of moles of the monomer a.
03/27/14 20140087633	Systems and methods related to ablation during manufacture of radio-frequency modules Disclosed are systems and methods related to removal of materials by techniques such as ablation during manufacture of radio-frequency (rf) modules. Such modules can be manufactured in an array on a panel, and an overmold structure can be formed on the panel.
03/27/14 20140087197	Oleophobic coating on sapphire A component comprises a substrate having an alumina base layer, a transition layer, and a surface coating. The transition layer comprises alumina and silica, and the surface coating preferentially bonds to the silica as compared to the alumina..
03/27/14 20140086854	Polymers based on sulfonic acids, amides and special cross-linking agents The invention relates to water-soluble or water-swellable polymers that contain a) 20.0 to 98.97 mole-% of one or more repeating structural units originating from special monomers with sulfonic acid groups or the salts thereof such as e.g. 2-acrylamido-2-methyl-propanesulfonic acid or the salts thereof, b) 1.0 to 60.0 mole-% of one or more repeating structural units containing an amide group and d) 0.01 to 8.0 mole-% of one or more repeating structural units originating from special crosslinking agents with at least three polymerizable double bonds.
03/27/14 20140084305	Photocoupler and semiconductor light emitting element A photocoupler includes: a light emitting element; a light receiving element; and a bonding layer. The light emitting element includes a semiconductor stacked body, and a first and a second electrode.
03/27/14 20140083608	Method for increasing the adhesive properties of pressure-sensitive adhesive compounds on substrates by way of plasma treatment A process increases adhesion between a layer of pressure-sensitive adhesive and a substrate, wherein the layer of pressure-sensitive adhesive has a first surface facing away from the substrate and a second surface facing toward the substrate and a third surface of the substrate. The process treats (i) the second surface of the layer of pressure-sensitive adhesive that faces toward the substrate and (ii) the third surface of the substrate with atmospheric-pressure plasma, and adhesive bonds the layer of pressure-sensitive adhesive to the third surface of the substrate..
03/27/14 20140083491	Pigment for photoelectric converter, and photoelectric conversion film, electrode, and solar cell using same Provided is a pigment for a photoelectric converter that has broad absorption from the visible to the near infrared regions. The pigment for a photoelectric converter comprises at least molecules that contain elemental phosphorus and form coordinate bonds at least at these phosphorus atoms and one type of metal complex that forms coordinate bonds with a terpyridine derivative that has at least one adsorbing group capable of being adsorbed by a metal oxide.
03/27/14 20140083461	Method of removing damaged epoxy from electrostatic chuck A method of removing an epoxy band from an electrostatic chuck includes securing the electrostatic chuck in a servicing fixture, applying a thermal source to the epoxy band to breakdown a plurality of adhesive bonds securing the epoxy band to the electrostatic chuck, forming a hole in the epoxy band and pulling the epoxy band from the electrostatic chuck. A system for removing an epoxy band from an electrostatic chuck is also described..
03/27/14 20140082961	Smooth shoe uppers and methods for producing them Shoe uppers having smooth seams and methods for producing them are disclosed. In one embodiment the upper uses thermoplastic seam tape which forms bonds between contiguous upper sections after being subjected to heat and/or pressure.
03/20/14 20140081889	Purifying portfolios using orthogonal non-target factor constraints The quantitative construction of investment portfolios of securities such as stocks, bonds, or the like using optimization is addressed. More specifically, during optimization constraints on non-target factor exposures are automatically converted to constraints on the exposure of the projections of the non-target factors that are orthogonal to a specified target factor.
03/20/14 20140081382	Stents with attached looped ends An open frame prosthesis is formed with looped end terminations at its proximal and distal ends. At one end of the prosthesis, the filaments or strands are welded together in pairs to form strand couplings.
03/20/14 20140079746	Fullerenes and other cage molecular structures in a special hydrated state The invention relates to fullerenes and other fullerene-like caged molecular structures in a special hydrated state. The above-mentioned hydrated compounds can be described by the following general formulae: (xai@cnbjm)@{m(oh)−nh2o}m−mh+, (xai@cnbjm)y@{m(oh)−nh2o}m−mh+, where x≧0, n>0, m≧0 or x≧0, n≧0, m>0, m >1, n>1, y>1.
03/20/14 20140078606	Lens module having opaque adhesive members A lens module includes a lens barrel, a first lens, a second lens, a first opaque adhesive member, and a second opaque adhesive member. The first lens is received in the lens barrel and includes a first image-side surface and a first object-side surface.
03/20/14 20140077132	Particle aggregate, manufacturing method for particle aggregate, fluorescence enhancing element, and device using photochemical reactions Provided is a hollow particle aggregate formed by aggregating a plurality of self-organizable particles, wherein a metal core is modified by a surface modifier for a metal core comprising a first segment comprising an optionally branched fluorinated alkylene glycol group, an optionally branched fluorinated alkylene group, or an optionally branched fluorinated azaalkylene group; a second segment comprising at least one hydrophilic group and bonding to one of the ends of a main chain of the first segment; and a functional group that bonds directly or indirectly to the another end of the main chain of the first segment and is able to bond to the metal core.. .
03/20/14 20140076465	Method of alloying reactive components Metal ingots for forming single-crystal shape-memory alloys (smas) may be fabricated with high reliability and control by alloying thin layers of material together. In this method, a reactive layer (e.g., aluminum) is provided in thin flat layers between layers of other materials (e.g., copper and layers of nickel).
03/13/14 20140072774	Substrate bonding apparatus, substrate holding apparatus, substrate bonding method, substrate holding method, multilayered semiconductor device, and multilayered substrate Substrates are aligned and then bonded to each other. A substrate bonding apparatus includes a deformer that deforms at least a first one of two substrates that are to be bonded to each other in order to correct misalignment between the two substrates, a holder that holds the deformed first substrate in the deformed state achieved by the deformer, a transporter that transports the holder from a position at which the deformed first substrate is held by the holder while the first substrate remains deformed, and a bonder that bonds the first substrate that has been transported by the transporter to the second substrate.
03/13/14 20140072387	Bonding fastener with environmental seals A bonding fastener having two components which electrically bonds metallic surfaces through serrated metal teeth on the underside of the head of the first component and on the inside surface of the second component which embed into each metal surface as a fastener is tightened. In one embodiment, the fastener is a nut and bolt combination, and in another embodiment the fastener is a two-part rivet.
03/13/14 20140070397	High power semiconductor package subsystems A method and apparatus for incorporation of high power device dies into smaller system packages by embedding metal “coins” having high thermal conductivity into package substrates, or printed circuit boards, and coupling the power device dies onto the metal coins is provided. In one embodiment, the power device die can be attached to an already embedded metal coin in the package substrate or pcb.
03/13/14 20140070391	Lead carrier with print-formed terminal pads A lead carrier provides support for an integrated circuit chip and associated leads during manufacture as packages containing such chips. The lead carrier includes a temporary support member with multiple package sites.
03/13/14 20140070383	Pre-molded mems device package with conductive shell A mems lead frame package body encloses a mems device enclosed in an internal cavity formed by the mold body and cover. A conductive internal shell with a connection window sits in the cavity.
03/13/14 20140070235	Wire bonds and light emitter devices and related methods Improved wire bonds and light emitting devices and related methods are disclosed. In one aspect, an improved wire bond can include a shaped wire bond, where at least a portion of the wire bond includes a negative kink and/or a concave shape with respect to an underlying substrate..
03/13/14 20140069927	Package for a fluid The present invention provides a package (1) for a fluid. The package (1) comprises a container body (2) provided with an opening (26) and, near said opening (26), a flanged edge (5) provided with a recessed outflow channel (12).
03/13/14 20140069822	Electrochemical reduction of disulfide bonds in proteinaceous substances and electrochemical cell for carrying out such reduction A method of cleaving disulfide bonds is provided, which comprises: (a) introducing a liquid sample having disulfide bonds (e.g., proteins) into an electrochemical cell; and (b) subjecting the sample to a reducing potential to reduce the disulfide bonds, wherein the electrochemical cell comprises (i) a working electrode that contains titanium and (ii) an auxiliary electrode. An electrochemical flow cell for processing a sample fluid is also provided, which comprises: (a) a body comprising a flow path having inlet and an outlet; (b) a working electrode in fluid communication with the flow path; and (c) an auxiliary electrode; wherein the working electrode comprises at least 20 wt.
03/13/14 20140069696	Methods and apparatus for attaching multi-layer flex circuits to substrates Multi-layer acf flex circuits can be bonded to multiple, separate and distinct circuits on substrates. The multi-layer acf bonds are formed by aligning each of multiple circuits with a separate portion of a multi-layer acf flex circuit and then forming acf bonds using a single or multiple thermodes.
03/13/14 20140069585	Plasma etching apparatus Disclosed is a plasma etching apparatus which includes: a base formed of a metal that has a lower expansion coefficient than aluminum; an electrostatic chuck disposed on a mounting surface of the base and configured to mount an object to be processed; a bonding layer which bonds the base to the electrostatic chuck; and a heater provided within the electrostatic chuck. In the plasma etching apparatus, the base is provided with a metal portion that is formed through a cold spraying by using a metal that has a higher thermal conductivity than the metal for forming the base..
03/13/14 20140069487	Solar module and manufacturing method therefor Provided is a highly reliable solar module. The solar module (1) includes a sealing member (14), a plurality of solar cells (10), a wiring member (11), and a resin adhesive (15).
03/13/14 20140069050	Composite panels and methods and apparatus for manufacture and installtion thereof Panels usable for construction of a surface, to provide the surface with a desired appearance, durability, water, air, and fire resistance, dimensions, and weight include a layer of substrate material having first and second sides. Finish elements are positioned on the first side, while a backing material is positioned on the second side, such that the substrate bonds the finish elements to the backing material.
03/13/14 20140068930	Air-tight and water-tight electrical bonding device A bonding device electrically bonds metallic surfaces through serrated metal teeth which embed into each metal surface as a fastener is tightened. A sealing material circumferentially outward and inward from the teeth create an air-tight and water-tight seal around the teeth, protecting the bonding location.
03/06/14 20140067717	Methods and systems for identifying overvalued, undervalued, and correctly valued financial returns Methods and systems for identifying and reporting an index of overvaluation and undervaluation of a financial instrument due to behavioral bias of traders, including but not limited to stocks, bonds, mutual funds, and options by producing a fundamental valuation index that equals zero when the actual returns equal the fundamental economic returns of the instrument as predicted by the model, and that does not equal zero when the returns are overvalued or undervalued, to enable an investor to formulate optimal investment strategies.. .
03/06/14 20140066589	Method for the preparation of poly(disulfide) polymers and gels High molecular weight disulfide polymers are synthesized in aqueous media by exposing dithiol compounds to a mild oxidizing environment in the presence of a tertiary amine catalyst. The unique oxidizing system polymerizes monomers through the formation of sulfur-sulfur bonds between dithiol compounds.
03/06/14 20140066314	Coated high-temperature superconducting wire and high-temperature superconducting coil including the same In a coated high-temperature superconducting wire 1 in which a superconducting yttrium-based wire (high-temperature superconducting wire) 2 having a rectangular cross section is coated by an insulating layer 6, the insulating layer 6 is an electrodeposited film made of block copolymerized polyimide which contains siloxane bonds in a polyimide main chain and which has molecules with anionic groups. A coil formed from the superconducting yttrium-based wire 2 is impregnated with epoxy resin, and the epoxy resin is cured.
03/06/14 20140065425	Graft-copolymer stabilized metal nanoparticles There is provided a method of preparing nanoparticles and novel nanoparticles. The nanoparticle preparation comprises the generation of a mixture comprising a plurality of metal-containing compounds and a copolymer of a polyethylene glycol and an amine-containing polyamino acid such as polylysine where a metal core and polymer shell nanoparticle is formed.
03/06/14 20140065389	Method for manufacturing electronic devices and electronic devices thereof In some embodiments, a method of manufacturing electronic devices including providing a carrier substrate having a first side, a second side, and a first adhesive at the first side; providing a first flexible substrate; and bonding the first flexible substrate to the first side of the carrier substrate. The first adhesive bonds the first flexible substrate to the first side of the carrier substrate.
03/06/14 20140065067	Radiopaque iodinated products intended for use medical imaging and their methods Wherein ag1 represents an unsaturated (c8-c52) aliphatic hydrocarbon chain found in fatty acids having specific location of double bonds, the chain including at least one iodine atom directly linked to a carbon atom of a non-conjugated double bond by a covalent link, the second carbon atom of the double bond bearing a halogen atom different from a iodine atom, x represents a polyethylene glycol including 1 to 50 ethylene glycol groups, r represents a hydrogen atom or a group ag2 being identical to or different from ag1, ag1, x, r and ag2 being selected so that the amphiphilic compound has a hydrophilic/lipohilic balance included between 4 and 30.. .
03/06/14 20140063682	Electrostatic chuck To provide an electrostatic chuck, including: a ceramic dielectric substrate having a first major surface on which an object to be processed is mounted, and a second major surface on a side opposite the first major surface, the ceramic dielectric substrate being a polycrystalline ceramic sintered body; and an electrode layer interposed between the first major surface and the second major surface of the ceramic dielectric substrate, the electrode layer being integrally sintered with the ceramic dielectric substrate, and the electrode layer includes a first portion having conductivity, and a second portion that bonds the first dielectric layer and the second dielectric layer, and the mean grain size of crystals included in the second portion is smaller than the mean grain size of crystals included in the ceramic dielectric substrate.. .
03/06/14 20140061895	Multi-chip module and method of manufacture A multi-chip module and a method for manufacturing the multi-chip module that mitigates wire breakage. A first semiconductor chip is mounted and wirebonded to a support substrate.
03/06/14 20140061885	Power quad flat no-lead (pqfn) package Some exemplary embodiments of a multi-chip module (mcm) power quad flat no-lead (pqfn) semiconductor package utilizing a leadframe for electrical interconnections have been disclosed. One exemplary embodiment comprises a pqfn semiconductor package comprising a leadframe, a driver integrated circuit (ic) coupled to the leadframe, a plurality of vertical conduction power devices coupled to the leadframe, and a plurality of wirebonds providing electrical interconnects, including at least one wirebond from a top surface electrode of one of the plurality of vertical conduction power devices to a portion of the leadframe, wherein the portion of the leadframe is electrically connected to a bottom surface electrode of another of the plurality of vertical conduction power devices.
02/27/14 20140058148	Process for production of distillate fuel The present invention is directed to preparing distillate fuel having almost no oxygen and no carbon-to-carbon double bonds. The method comprises passing biodiesel and/or lipids derived from vegetable oils, algae oils, and/or animal fats over a bio-feedstock, or lipids, conversion catalyst that performs the hydrocarbon isomerization function, removes oxygen from the feedstock, cracks off the c3 backbone, and saturates double bonds.
02/27/14 20140058147	Process for production of distillate fuel The present invention is directed to preparing distillate fuel having almost no oxygen and no carbon-to-carbon double bonds. The method comprises passing biodiesel and/or lipids derived from vegetable oils, algae oils, and/or animal fats over bio-feedstock, or lipids, conversion catalyst that performs the hydrocarbon isomerization function, removes oxygen from the feedstock, cracks off the c3 backbone, and saturates double bonds.

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