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 Barrier composition and properties patent thumbnailBarrier composition and properties
A barrier film on an organic electronic device. The barrier film comprises an inorganic polymeric silicon composition having si—o—si bonds which exhibit an asymmetric stretching si—0 vibration frequency (as1) ranging between 1200 cm−1 and 1000 cm−1, si—o—h vibration frequency ranging between 950 cm−1 and 810 cm−1 and an —o—h ranging between 3400 cm−1 and 3700 cm−1 in which the ratio of peak areas for si—o—h and —o—h vibration frequencies compared to the peak area of the si—o—si vibration frequency is less than 0.15.
Universal Display Corporation


 Display device and  manufacturing a display device patent thumbnailDisplay device and manufacturing a display device
A display device provided with a display region composed of a plurality of pixels. The display device includes a first substrate including at least one spacer that is formed so as to surround the display region, and an inorganic film that is formed of an inorganic material and covers at least a top and an outer side surface of the at least one spacer, a second substrate that is disposed opposed to the first substrate and a bonding layer that is disposed inside the at least one spacer, bonds the first substrate and the second substrate with each other, and is made of an organic material..
Japan Display Inc.


 Substrate surface metallization method and substrate having metallized surface manufactured by the same patent thumbnailSubstrate surface metallization method and substrate having metallized surface manufactured by the same
A substrate having a metallized surface is provided. The substrate includes a substrate having a silanated surface, an adhesive layer disposed on the silanated surface, and a first metallic layer bonded to the silanated surface through the adhesive layer.
National Tsing Hua University


 Onium salt, photoacid generator, photosensitive resin composition, and  producing device patent thumbnailOnium salt, photoacid generator, photosensitive resin composition, and producing device
An onium salt represented by formula (a). Z-a-w—y+(r)n x− (a) (in formula (a), z, a, w, y, (r)n, and x have the following meanings: z represents a monovalent organic group having a ring structure provided with a conjugated π electron system, which may have one or more substituent groups; w represents a divalent organic group having a ring structure provided with a conjugated π electron system, which may have one or more substituent groups; a represents a divalent linking group containing a direct coupling of one or more bonds selected from a group consisting of a carbon-carbon single bond, a carbon-carbon double bond, and a carbon-carbon triple bond (any z and/or w substituent group may form a ring structure in which one or more atoms included in z and/or w are saturated or partially saturated together with a); y is an iodine or sulfur atom, n=1 when y is an iodine atom, and n=2 when y is a sulfur atom; (r)n may be identical to or different from one another, and each (r)n is a monovalent organic group having a carbon number of 1 or more, which may have a substituent group; and x is a monovalent anion.).
Toyo Gosei Co., Ltd.


 Novel photoresist having sensitizer bonded to acid generator patent thumbnailNovel photoresist having sensitizer bonded to acid generator
The present disclosure is directed to a photoresist and a method of performing a lithography process using the photoresist. The photoresist contains a polymer and a photo-acid generator.
Taiwan Semiconductor Manufacturing Company, Ltd.


 Display device patent thumbnailDisplay device
According to one embodiment, a display device includes a display module including a peripheral area located outside a display area, a cover member including a phototransmissive region and a light-shielding region, and a ultraviolet-cured resin layer which bonds the display module to the cover member, includes first and second portions, and contains polar monomers as a monomer component. A transparent first electrode is interposed between the cover member and the display module to cover the phototransmissive region.
Japan Display Inc.


 Methods for securing an optical fiber to a ferrule and optical connectors formed by such methods patent thumbnailMethods for securing an optical fiber to a ferrule and optical connectors formed by such methods
A method of securing an optical fiber to a ferrule includes: heating an adhesive composition that is disposed within the ferrule to melt the adhesive composition; inserting the optical fiber into a fiber-receiving passage defining an inner surface of the ferrule and into contact with the melted adhesive composition; and cooling the melted adhesive composition. The adhesive composition is a solid material disposed within the fiber-receiving passage of the ferrule and in contact with the inner surface of the ferrule prior to the heating step.
Corning Optical Communications Llc


 Decoy cartridge for aircraft patent thumbnailDecoy cartridge for aircraft
The present invention relates to a device forming an infrared decoy comprising a pyrotechnic priming part (150), a composition (121) suited to emitting radiation in the infrared domain, and a protective casing (130) for protecting the composition (121) and formed of a plastic sleeve, characterized in that at least one out of a body (150) of the initiation pyrotechnic part and/or of a plug (140) that blanks off the sleeve (130) has an annular groove (152, 142) that opens onto its external periphery and communicates with at least one longitudinal duct (154, 156; 144, 146) which opens onto an end of the body (150) or of the plug (140) in order to accept a polymerizable adhesive tape that bonds the body (150) and/or the plug (140) to the sleeve (130).. .
Etienne Lacroix Tous Artifices S.a.


 Method and device for reinforcement patent thumbnailMethod and device for reinforcement
A method comprising: (i) forming a reinforcement device by the following steps: forming a first member (1) and a second member (2), applying an adhesive (3) to the first member (1) and the second member (2), attaching at least one connecting feature to the first member (1), the second member (2), or both, bringing the first member (1) and the second member (2) together to form a clam-like structure, locking the first member (1) and the second member (2) with the at least one connecting feature, forming a first encasing member and a second encasing member, attaching the first encasing member to the second encasing member to form an encasing around the clam-like structure, (ii) exposing the reinforcement device to electrocoating, wherein the adhesive expands during the electro coating and bonds the first member (1) to the second member (2) and bonds the clam-like structure to the encasing.. .
Zephyros, Inc.


 Methods and systems for removing interstitial material from superabrasive materials of cutting elements using energy beams patent thumbnailMethods and systems for removing interstitial material from superabrasive materials of cutting elements using energy beams
A method of forming a cutting element for an earth-boring tool may include directing at least one energy beam at a surface of a volume of polycrystalline superabrasive material including interstitial material disposed in regions between inter-bonded grains of polycrystalline superabrasive material. The method includes ablating the interstitial material with the at least one energy beam such that at least a portion of the interstitial material is removed from a first region of the volume of polycrystalline superabrasive material without any substantial degradation of the inter-bonded grains of superabrasive material or of bonds thereof in the first region..
Baker Hughes Incorporated


Thermocycling system and manufacturing method

A system for thermocycling biological samples within detection chambers comprising: a set of heater-sensor dies, each heater-sensor die comprising a heating surface configured to interface with a detection chamber and a second surface, inferior to the heating surface, including a first connection point; an electronics substrate, comprising a first substrate surface coupled to the second surface of each heater-sensor die, an aperture providing access through the electronics substrate to at least one heater-sensor die, and a second substrate surface inferior to the first substrate surface, wherein the electronics substrate comprises a set of substrate connection points at least at one of the first substrate surface, an aperture surface defined within the aperture, and the second substrate surface, and wherein the electronics substrate is configured to couple heating elements and sensing elements of the set of heater-sensor dies to a controller; and a set of wire bonds, including a wire bond coupled between the first connection point of at least one of the set of heater-sensor dies and one of the set of substrate connection points.. .
Neumodx Molecular, Inc.

Direct integration of feedthrough to implantable medical device housing with ultrasonic welding

One aspect is an implantable medical device including a metal housing configured for implantation in a human and including a biocompatible metal and defining an opening. A feedthrough device is configured within the opening of the metal housing and includes an insulating section and a conducting section, the insulating section electrically isolating the conducting section from the metal housing.
Heraeus Deutschland Gmbh & Co. Kg

Method to configure network bonds as a port on an integration bridge for a virtualized multilayer switch

Techniques are disclosed for configuring a physical computing system (e.g., in a cloud computing network) to connect a network bond with a virtual multilayer switch. An operating system process executing in the physical computing system receives a selection of one or more network interfaces.
International Business Machines Corporation

Method to configure network bonds as a port on an integration bridge for a virtualized multilayer switch

Techniques are disclosed for configuring a physical computing system (e.g., in a cloud computing network) to connect a network bond with a virtual multilayer switch. An operating system process executing in the physical computing system receives a selection of one or more network interfaces.
International Business Machines Corporation

Thermoelectric conversion module and manufacturing method thereof

Provided is a thermoelectric conversion module having a high heat resistance. The thermoelectric conversion module includes a first substrate, a second substrate, a thermoelectric element, and a bonding layer.
Yamaha Corporation

3d-joining of microelectronic components with conductively self-adjusting anisotropic matrix

3d joining of microelectronic components and a conductively self-adjusting anisotropic matrix are provided. In an implementation, an adhesive matrix automatically makes electrical connections between two surfaces that have electrical contacts, and bonds the two surfaces together.
Invensas Corporation

Variable call-date bonds

A computer-based system, method and non-transitory medium for reducing cost to an issuer of a debt instrument. One or more computers and connected electronic storage that stores the computer-executable instructions, and data, together, process a structure for the operation of the debt investment which includes handling interactions with participants in the debt instrument and administrators by way of network connections.
Environmental Financial Products, Llc

Flame resistant composite fabrics

A flame resistant composite fabric includes a first flame resistant fabric layer, a second flame resistant fabric layer, and a barrier layer that bonds the first flame resistant fabric layer to the second flame resistant fabric layer. The barrier layer is capable of withstanding temperature of 500° f.
Mmi-ipco, Llc

Peptide libraries

The invention relates to a method for altering the conformational diversity of a first repertoire of polypeptide ligands, comprising a plurality of polypeptides comprising at least two reactive groups separated by a loop sequence covalently linked to a molecular scaffold which forms covalent bonds with said reactive groups, to produce a second repertoire of polypeptide ligands, comprising assembling said second repertoire from the polypeptides and structural scaffold of said first repertoire, incorporating one of the following alterations: (a) altering at least one reactive group; or (b) altering the nature of the molecular scaffold; or (c) altering the bond between at least one reactive group and the molecular scaffold; or (d) any combination of (a), (b) or (c).. .
Bicycle Therapeutics Limited

Fluorinated resin composition

Copolymer (a): a copolymer comprising units derived from the following monomer (a) and units derived from the following monomer (b), and optionally containing units derived from the following monomer (c), wherein the content of the units derived from the following monomer (c) is from 0 to 0.05 mol % based on the total of all units, and it has carbonyl groups; copolymer (b): a copolymer comprising units derived from the following monomer (a), units derived from the following monomer (b) and units derived from the following monomer (c), wherein the content of the units derived from the following monomer (c) is from 0.1 to 2 mol % based on the total of all units; volume flow rate: extrusion rate (mm3/sec.) at the time of extruding the fluorinated resin composition from an orifice having a diameter of 2.1 mm and a length of 8 mm under a pressure of 68.7n/cm2 at a temperature of the melting point+50° c.; monomer (a): tetrafluoroethylene; monomer (b): at least one member selected from ethylene, hexafluoropropylene and a perfluoro(alkyl vinyl ether); monomer (c): a monomer having two or more polymerizable carbon-carbon double bonds.. .

Fluorinated copolymer

Monomer (a): tetrafluoroethylene. Monomer (b): ethylene.

Piezoelectric printhead assembly with multiplier to scale multiple nozzles

In an example, a piezoelectric printhead assembly includes a micro-electro mechanical system (mems) die including a plurality of nozzles. An application-specific integrated circuit (asic) die is coupled to the mems die by a plurality of wire bonds, wherein each of the wire bonds corresponds to a respective nozzle of the plurality of nozzles.
Hewlett-packard Development Company, L.p.

Polycrystalline diamond, methods of forming same, cutting elements, and earth-boring tools

A method of forming polycrystalline diamond includes providing an alloy over at least portions of a plurality of diamond particles, and subjecting the plurality of diamond particles to a high-temperature, high-pressure process to form a polycrystalline diamond material having inter-granular bonds between adjacent diamond particles. The alloy includes iridium and nickel, and a volume of the diamond particles is at least about 92% of a total volume of the alloy and the diamond particles.
Baker Hughes Incorporated

Iv anticoagulant treatment systems and methods

An intravenous delivery system may have a plurality of components with interior surfaces that cooperate to define a fluid pathway through which fluid flows into a body of a patient. One or more anticoagulant coatings may reside on one or more of the interior surfaces to restrict blood clot formation in the fluid pathway.
Becton, Dickinson And Company

Systems and methods for quartz wafer bonding

In one embodiment, a bonded quartz wafer package includes a first quartz wafer including at least one quartz-based device, a second quartz wafer disposed above the first quartz wafer, and a liquid crystal polymer (lcp) bonding layer disposed in between the first and second quartz wafers that bonds the first and second quartz wafers together.. .
General Electric Company

High performance battery anodes with polymeric coatings

A battery includes an anode, a cathode, and an electrolyte disposed between the anode and the cathode. The anode includes a current collector and an interfacial layer disposed over the current collector, and the interfacial layer includes a polymer including dynamic bonds..
The Board Of Trustees Of The Leland Stanford Junior University

Semiconductor package and manufacturing method thereof

A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device structure (e.g., a sensor device structure), and method for manufacturing thereof, that comprises a three-dimensional package structure free of wire bonds, through silicon vias, and/or flip-chip bonding..
Amkor Technology, Inc.

Flip chip assembly and process with sintering material on metal bumps

A method is disclosed of fabricating a microelectronic package comprising a substrate overlying the front face of a microelectronic element. A plurality of metal bumps project from conductive elements of the substrate towards the microelectronic element, the metal bumps having first ends extending from the conductive elements, second ends remote from the conductive elements, and lateral surfaces extending between the first and second ends.
Tessera, Inc.

Multi-step processes for high temperature bonding and bonded substrates formed therefrom

A method for high temperature bonding of substrates may include providing a top substrate and a bottom substrate, and positioning an insert between the substrates to form a assembly. The insert may be shaped to hold at least an amount of sn having a low melting temperature and a gap shaped to hold at least a plurality of metal particles having a high melting temperature greater than the low melting temperature.
Toyota Motor Engineering & Manufacturing North America, Inc.

Fiber optic component holders and enclosures and methods including same

A method for securing a fiber optic component includes: providing a holding medium having a tack and mounted on a substrate; and placing the fiber optic component in intimate contact with the holding medium to thereby secure the fiber optic component to the substrate. The tack of the holding medium releasably bonds the fiber optic component to the holding medium and the holding medium retains its tack upon removal of the fiber optic component to permit re-placement of the fiber optic component or placement of a further fiber optic component on the holding medium to secure said fiber optic component or further fiber optic component to the substrate..
Commscope Technologies Llc

Dna sequencing using multiple metal layer structure with different organic coatings forming different transient bondings to dna

A nanodevice includes a reservoir filled with conductive fluid and a membrane separating the reservoir. A nanopore is formed through the membrane having electrode layers separated by insulating layers.
International Business Machines Corporation

Methods of fabricating polycrystalline diamond, and cutting elements and earth-boring tools comprising polycrystalline diamond

Methods of fabricating polycrystalline diamond include subjecting a particle mixture to high pressure and high temperature (hpht) conditions to form inter-granular diamond-to-diamond bonds. Before being subjected to hpht conditions, the particle mixture includes a plurality of non-diamond nanoparticles, diamond nanoparticles, and diamond grit.
Baker Hughes Incorporated

Transparent adhesive sheet

The present invention is a transparent pressure-sensitive adhesive sheet that is formed of a resin composition [f], and has a storage modulus at 25° c. Of 1×106 to 1×108 pa, the resin composition [f] comprising a modified hydrogenated block copolymer [e] as a main component, the modified hydrogenated block copolymer [e] being obtained by introducing an alkoxysilyl group into a hydrogenated block copolymer [d], the hydrogenated block copolymer [d] being obtained by hydrogenating 90% or more of unsaturated bonds of a block copolymer [c] that comprises at least two polymer blocks [a] comprising a specific compound and at least one polymer block [b] comprising a specific compound, and a ratio (wa:wb) of a total weight fraction wa of the polymer block [a] in the block copolymer [c] to a total weight fraction wb of the polymer block [b] in the block copolymer [c] being 20:80 to 60:40..
Zeon Corporation

Alkali-activated natural aluminosilicate materials for compressed masonry products, and associated processes and systems

Disclosed are masonry product feedstock compositions having natural aluminosilicate minerals, e.g., clay minerals and feldspars, to activate a geopolymer reaction. During the formation and curing of a masonry product, an alkali activator creates structural bonds within a mix of aggregates in the feedstock having a low moisture content (e.g., 5-10% by weight).
Watershed Materials, Llc

Multiple digital data sequences from an arbitrary data generator of a printhead assembly

In an example, a piezoelectric printhead assembly includes a micro-electro mechanical system (mems) die including a plurality of nozzles. An application-specific integrated circuit (asic) die is coupled to the mems die by a plurality of wire bonds, wherein each of the wire bonds corresponds to a respective nozzle of the plurality of nozzles.
Hewlett-packard Development Company, L.p.

Process for producing optical material

A process for producing an optical material of the present invention includes a step of mixing di- or higher-functional thiol compounds (a) having one or more sulfide bonds and/or one or more ester bonds with an imidazole-based curing catalyst (b) to prepare a mixed solution; a step of mixing the mixed solution with an isocyanate compound (c) including at least one kind of a di- or higher-functional alicyclic isocyanate compound (c1) and/or a di- or higher-functional aliphatic isocyanate compound (c2) to prepare a polymerizable composition for optical materials; a step of injecting the polymerizable composition for optical materials into a mold; and a step of polymerization-curing the polymerizable composition for optical materials in the mold.. .
Mitsui Chemicals, Inc.

Insole for footwear

The present disclosures concerns embodiments of a footwear insole that can be used with various types of footwear, including, without limitation, shoes (including open and closed toe shoes), boots, sandals, etc. The insole includes an upper fabric layer that comes in contact with the foot and a cushioning base layer that contacts the footbed of the footwear.
Soxsols, Llc

Polymer having terminal structure including plurality of reactive silicon groups, manufacturing same, and use for same

A polymer (a) having, at one terminal moiety thereof, a terminal structure having two or more carbon-carbon unsaturated bonds. A reactive-silicon-group-containing polymer (b) having, at one terminal moiety thereof, a terminal structure having two or more reactive silicon groups..
Kaneka Corporation

Composition of cross-linked polymers comprising pending exchangeable bonds and exchangeable cross-links, via aldehyde-imine and/or imine-imine exchange reactions, preparation processes and use

Finally, an object of the invention is the use of aldehyde to catalyse imine-imine metathesis reactions and imine-aldehyde exchange reactions.. .

Reagent-controlled stereoselective glycosylation

Provided are methods for the efficient stereoselective formation of glycosidic bonds, without recourse to prosthetic or directing groups.. .
Trustees Of Tufts College

Inhibitors of bruton's tyrosine kinase

Disclosed herein are compounds that form covalent bonds with bruton's tyrosine kinase (btk). Also described are irreversible inhibitors of btk.
Pharmacyclics Llc

Hydrophilic aiol with bonding

An accommodating intraocular lens comprises a first lens component, a second lens component, and an adhesive between portions of the two lens components. The cured adhesive bonds the lens components to form a fluid chamber.
Shifamed Holdings, Llc

Display device

A display device includes a first substrate that is provided with a display element in a display region, a second substrate that faces the first substrate, and a sealant that bonds the first substrate and the second substrate to each other in a region surrounding the periphery of the display region in a plan view, in which each of the first substrate and the second substrate has a rectangular shape, in which at least one of the first substrate and the second substrate has a corner portion and a recess formed at a position which is close to the corner portion and overlaps at least a part of the region in which the sealant is disposed, and in which the sealant is provided to be in contact with at least a surface far from the display region among inner surfaces of the recess.. .
Japan Display Inc.

Method for making a semiconductor device having an interposer

A semiconductor device and a method for making the semiconductor device are provided. The semiconductor device comprises a leadframe and a metal interposer.
Freescale Semiconductor, Inc.

Method of localizing lipid double bonds

A method of mass spectrometry for analysing lipids and similar biological molecules is disclosed. The lipid molecules may be ionised to form a plurality of lipid parent ions and subjected to photon-induced fragmentation to form a plurality of fragment or product ions.
Micromass Uk Limited

Imaging lens and imaging device

An imaging lens is provided with: a first lens with negative power; a second lens with negative power; a third lens with positive power; and a fourth lens with positive power. The cemented fourth lens is formed from an object side lens with negative power and an image side lens with positive power.
Hitachi Maxell, Ltd.

Interlocking cushioned tiles from crumb rubber

Improvements in interlocking cushioned tiles from crumb rubber for the bulk of the tile to be made from recycled tire rubber with virgin material at interlocking areas of the tiles is disclosed. The use of recycled rubber reduces the amount of material in landfills.

Polymer having terminal structure including plurality of reactive silicon groups, manufacturing same, and use for same

A polymer (a) having, at one terminal moiety thereof, a terminal structure having two or more carbon-carbon unsaturated bonds. A reactive-silicon-group-containing polymer (b) having, at one terminal moiety thereof, a terminal structure having two or more reactive silicon groups..
Kaneka Corporation

Bio-based superabsorbents prepared via the macromonomer approach

A novel bio-based superabsorbent polymer material based on a proteinaceous natural polymer is introduced herein. There is further disclosed a method for the manufacture of such a bio-based crosslinked superabsorbent polymer material.
Washington State University

Compositions and methods for improving glucose uptake

Wherein r1, r2, r3, are independently selected from the group consisting of null, hydroxy, alkoxy, and halo, or r1 and r2 taken together form a cyclic boronate ester and r3 is null; wherein when four bonds to boron are present, boron bears a formal negative charge and the structure further comprises a countercation that is potassium or sodium, x1, x2, x3, and x4 are independently selected from the group consisting of o, ch, and n, with the proviso that no more than two of combined o and n are selected, and z is selected from the group consisting of hydrogen, alkyl, aryl, heteroaryl, and halogen, any of which may be optionally substituted. Such compounds can increase glucose uptake by cells and preferably do not substantially increase adipogenesis..



Bonds topics:
  • Carbon Dioxide
  • Zinc Oxide
  • Lost Circulation
  • Circulation
  • Chemical Reaction
  • Fatty Acid
  • Polyurethane
  • Parthenolide
  • Pharmaceutically Acceptable Salt
  • Alkyl Group
  • Cycloalkyl


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    This listing is a sample listing of patent applications related to Bonds for is only meant as a recent sample of applications filed, not a comprehensive history. There may be associated servicemarks and trademarks related to these patents. Please check with patent attorney if you need further assistance or plan to use for business purposes. This patent data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Bonds with additional patents listed. Browse our RSS directory or Search for other possible listings.


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