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This page is updated frequently with new Bonds-related patent applications. Subscribe to the Bonds RSS feed to automatically get the update: related Bonds RSS feeds. RSS updates for this page: Bonds RSS RSS


Wearable article with outwardmost layer of multicomponent fiber nonwoven providing enhanced mechanical features

Procter & Gamble

Wearable article with outwardmost layer of multicomponent fiber nonwoven providing enhanced mechanical features

Method for insulating the filling contents of a food product

N.n.t.

Method for insulating the filling contents of a food product

Method for insulating the filling contents of a food product

Invensas

Microelectronic unit and package with positional reversal


Date/App# patent app List of recent Bonds-related patents
07/30/15
20150214187 
 Leadframe area array packaging technology patent thumbnailnew patent Leadframe area array packaging technology
Embodiments of the present invention are directed to leadframe area array packaging technology for fabricating an area array of i/o contacts. A manufactured package includes a polymer material substrate, an interconnect layer positioned on top of the polymer material substrate, a die coupled to the interconnect layer via wire bonds or conductive pillars, and a molding compound encapsulating the die, the interconnect layer and the wire bonds or conductive pillars.
United Test And Assembly Center, Ltd.


07/30/15
20150214178 
 Microelectronic unit and package with positional reversal patent thumbnailnew patent Microelectronic unit and package with positional reversal
A semiconductor unit includes a chip having left and right columns of contacts at its front surface. Interconnect pads are provided overlying the front surface of the chip and connected to at least some of the contacts as, for example, by traces or by arrangements including wire bonds.
Invensas Corporation


07/30/15
20150214098 
 Processing for fabrication of a structure with a view to a subsequent sepration patent thumbnailnew patent Processing for fabrication of a structure with a view to a subsequent sepration
A process for fabrication of a structure includes assembling at least two substrates. At least one of these two substrates is intended to be used in electronics, optics, optoelectronics and/or photovoltaics.
Soitec


07/30/15
20150212555 
 Orthogonally hinged individualized memory module cooling patent thumbnailnew patent Orthogonally hinged individualized memory module cooling
A memory module cooling system includes a liquid cooled manifold assembly and a heat spreader assembly rotateably attached to the liquid cooled manifold assembly about an axis perpendicular to the memory module. The liquid cooled manifold assembly includes a manifold, an liquid inlet, and a liquid outlet.
Lenovo Enterprise Solutions (singapore) Pte. Ltd.


07/30/15
20150211884 
 Inertial sensor and  manufacturing the same patent thumbnailnew patent Inertial sensor and manufacturing the same
Disclosed herein are an inertial sensor and a method of manufacturing the same. The inertial sensor 100 according to a preferred embodiment of the present invention is configured to include a plate-shaped membrane 110, a mass body 120 disposed under a central portion 113 of the membrane 110, a post 130 disposed under an edge 115 of the membrane 110 so as to support the membrane 110, and a bottom cap 150 of which the edge 153 is provided with the first cavity 155 into which an adhesive 140 is introduced, wherein the adhesive 140 bonds an edge 153 to a bottom surface of the post, whereby the edge 153 of the bottom cap 150 is provided with the first cavity 155 to introduce the adhesive 140 into the first cavity 155, thereby preventing the adhesive 140 from being permeated into the post 130..
Samsung Electro-mechanics Co., Ltd.


07/30/15
20150211305 
 Use of tungsten carbide tube rod to hard-face pdc matrix patent thumbnailnew patent Use of tungsten carbide tube rod to hard-face pdc matrix
A hardfaced infiltrated matrix downhole tool and a method for hardfacing such items is provided. The hardfaced infiltrated matrix downhole tool includes a body, an intermediate base coat coupled to at least a portion of the surface of the body, and a hardfacing material coupled to at least a portion of the intermediate base coat.
Varel International Ind., L.p.


07/30/15
20150210797 
 Silicon-containing highly branched polymer and curable composition containing the same patent thumbnailnew patent Silicon-containing highly branched polymer and curable composition containing the same
There is provided a composition for forming a hard coat layer which has high slippage and is excellent in water/oil repellency and also has antifouling properties such as fingerprint resistance and dirt wiping-off properties, and which is curable through ultraviolet irradiation in a nitrogen atmosphere or an air atmosphere that is generally used. A silicon-containing highly branched polymer obtained by polymerization of a monomer a having two or more radically polymerizable double bonds in a molecule and a monomer b having a polysiloxane chain and at least one radically polymerizable double bond in a molecule in the presence of a polymerization initiator d in an amount of 5 to 200% by mole relative to the number of moles of the monomer a; a curable composition including the highly branched polymer; a cured film obtained from the composition; and a hard coat film obtained by use of the composition..
Nissan Chemical Industries, Ltd.


07/30/15
20150210726 
 Methods for preparing ruthenium carbene complex precursors and ruthenium carbene complexes patent thumbnailnew patent Methods for preparing ruthenium carbene complex precursors and ruthenium carbene complexes
A method for preparing a ruthenium carbene complex precursor includes reacting a ruthenium refinery salt with a hydrogen halide to form a ruthenium intermediate, and reacting the ruthenium intermediate with an l-type ligand to form the ruthenium carbene complex precursor. A method for preparing a ruthenium vinylcarbene complex includes converting a ruthenium carbene complex precursor into a ruthenium hydrido halide complex, and reacting the ruthenium hydrido halide complex with a propargyl halide to form the ruthenium vinylcarbene complex.
Elevance Renewable Sciences, Inc.


07/30/15
20150209241 
 Enamel bond for application in dental practice patent thumbnailnew patent Enamel bond for application in dental practice
This patent application is for enamel bond, a chemical solution for creating tooth enamel that successfully bonds to the dentin layer and provides both structure and composition of true, natural enamel.. .

07/30/15
20150209201 
 Wearable article with outwardmost layer of multicomponent fiber nonwoven providing enhanced mechanical features patent thumbnailnew patent Wearable article with outwardmost layer of multicomponent fiber nonwoven providing enhanced mechanical features
A fastening system comprising a nonwoven web material operable to fastenably engage a fastening component is disclosed. The nonwoven web material may comprising multicomponent fibers having a polyolefin component and a polyamide component, and a machine direction bias.
The Procter & Gamble Company


07/30/15
20150208715 
new patent

Method for insulating the filling contents of a food product


The invention relates to a method for insulating the filling contents of a food product, including the following steps: providing at least one shell initially made of an edible moldable material; applying at least one coating layer including b at least one fatty substance in said shell in order to form an inner insulating coating layer; feeding the filling contents into said shell; applying at least one covering layer including at least one fatty substance onto the filling contents in order to obtain a continuous insulating covering layer that bonds to said inner insulating coating layer; and closing said shell by applying an edible moldable material, characterized in that the second and fourth steps are preceded by cooling to a temperature of around −25° c. To 30° c., and in that the fifth step is preceded by a step of heating said upper surface of said mold..
N.n.t.


07/23/15
20150207204 

Surface acoustic wave transponder package for down-hole applications


A method and apparatus for packaging surface acoustic wave transponders for use in down-hole or other extreme environmental applications. An exemplary id tag transponder may include a surface acoustic wave (saw) piezoelectric device, wire bonds, antennae structure, an antenna reflector, a radome, and a base constructed of a conductive, non-magnetic metal or metal alloy adapted to withstand an extreme environment encountered in down-hole applications.
Hm Energy, Llc


07/23/15
20150204063 

Covering system for insulation devices on (load-bearing) structures


A covering system for insulation devices (2) on (load-bearing) structures, having a connecting device (24), consisting of a carrier surface (28), which has touch-and-close fastener elements (30), which can be connected to correspondingly designed touch-and-close fastener elements (22), is characterized in that a reactive functional surface (36) is fitted, as a further component of the connecting device (24), on the side (34) of the carrier surface (28), said side being directed away from the touch-and-close fastener elements (30), and the reactive functional surface bonds permanently, under predeterminable shaping pressure and at a predeterminable reaction temperature, to a preferably closed-cell foam is material (4; 26) of the respective insulation device (2).. .
Gottlieb Binder Gmbh & Co. Kg


07/23/15
20150203977 

Confinement of reaction components at electrode surface


A co2 reduction electrode includes an active layer on an electrode base. The active layer includes a polymer that includes one or more reaction components selected from a group consisting of a co2 reduction catalyst and an activator that bonds co2 so as to form a co2 reduction intermediate..
The California Institute Of Technology


07/23/15
20150203693 

Flame-retardant polymer composition


The invention relates to a flame-proofed polymeric composition suitable for coating workpieces, containing a vinyl acetate-containing thermoplastic polymer and an unsaturated elastomer containing double bonds as polymeric components, wherein the polymeric components are present in the form of a homogeneous polymeric mixture, and a mixture matrix vulcanised exclusively by a sulphur or sulphur-containing crosslinking system is formed, wherein the sulphur crosslinking system extends across the entire matrix and permeates the matrix completely, and—at least one flame retardant or a combination of flame retardants. The invention further relates to articles produced therefrom, and to composite elements coated with this composition and to a method for producing the same..
Bategu Gummitechnologie Gmbh & Co. Kg


07/23/15
20150203555 

Alpha/beta-peptide mimics of z-domain peptides


Described are α/β-peptide mimics of z-domain scaffold peptides, methods of making them, and methods of using them. The α/β-peptide mimics include β-amino acid residues and, optionally, disulfide bonds to stabilize the conformation of the mimics.
Wisconsin Alumni Research Foundation


07/23/15
20150202858 

Laser film debonding method


A laser-based coating removal method debonds a film from a substrate rather than ablating the film. A laser light is transmitted through a transparent film to an underlying bonding layer for bonding the film to one or more additional films and/or a substrate.
General Lasertronics Corporation


07/23/15
20150202592 

Carbon dioxide adsorbent


Provided is a carbon dioxide adsorbent with which large quantities of carbon dioxide can be adsorbed and removed even under conditions having low carbon dioxide concentrations such as when under subatmospheric pressure or when under an environment having a carbon dioxide partial pressure of less than atmospheric pressure, said carbon dioxide adsorbent exhibiting excellent adsorption activity. A carbon dioxide adsorbent including at least a zsm-5 zeolite including barium (ba) or strontium (sr) is characterized in that the zsm-5 zeolite includes m-o-m bonds (m being ba or sr, and o being oxygen).
Panasonic Corporation


07/23/15
20150202165 

Use of polyunsaturated ketones for the treatment of psoriasis


Psoriasis is a common, chronic, inflammatory skin disorder. This invention provides the use of a compound of formula (i) r—co—x (wherein r is a c16-24 unsaturated hydrocarbon group optionally interrupted α, β, γ, or δ to the carbonyl group by a heteroatom or group of heteroatoms selected from s, o, n, so, so2 said hydrocarbon group comprising at least 5 non-conjugated double bonds; and x is an electron withdrawing group) in the manufacture of a medicament for the treatment of psoriasis..
Avexxin As


07/23/15
20150202141 

Cosmetic


A cosmetic has a polymer (a) having a content of an oxyalkylene unit and/or a glycerin unit of 0.5% by mass or more and under 5.0% by mass; and a polymer (b) having a content of an oxyethylene unit and/or a glycerin unit of 5.0% by mass or more and 20.0% by mass or less, the polymer (a) and the polymer (b) being a crosslinking organopolysiloxane polymer obtained by reacting organohydrogen polysiloxane having two or more hydrogen atoms bonded to a silicon atom in one molecule and polyoxyalkylene and/or polyglycerin having two or more aliphatic unsaturated bonds in one molecule, wherein the mass ratio of the polymer (a) to the polymer (b) is 5:95 to 60:40.. .
Shin-etsu Chemical Co., Ltd.


07/16/15
20150198520 

Systems and methods for creating altered adhesive bonds


Disclosed are systems and methods of creating altered adhesive bonded joints between metal or composite substrates, including bonds that are weaker in strength than selected reference bonds. One method of creating an altered adhesive bond includes providing a first substrate and a second substrate, selecting a manufacturing process having a plurality of steps designed to produce a desired, or reference, adhesive bond having a desired strength, and selectively altering at least one of the plurality of steps during performance of the manufacturing process to produce an altered bond between the first substrate and the second substrate, the altered bond having an altered strength that is weaker than the strength of the desired adhesive bond.
The Boeing Company


07/16/15
20150197991 

Cutting elements including nanoparticles in at least one region thereof, earth-boring tools including such cutting elements, and related methods


Cutting elements for earth-boring applications may include a substrate and a polycrystalline diamond material secured to the substrate. A first region of the polycrystalline diamond material may exhibit a first volume percentage of nanoparticles bonded to diamond grains within the first region.
Baker Hughes Incorporated


07/16/15
20150197588 

Hydrogenated block copolymer and producing same


The present invention relates to a hydrogenated block copolymer including a polymer block (a) containing a constitutional unit derived from an aromatic vinyl compound and a polymer block (b) containing from 1 to 100% by mass of a constitutional unit (b1) derived from farnesene and from 99 to 0% by mass of a constitutional unit (b2) derived from a conjugated diene other than the farnesene, in which 50 mol % or more of carbon-carbon double bonds in the polymer block (b) are hydrogenated.. .
Amyris, Inc.


07/16/15
20150197586 

Novel elastomer material, and obtaining same


The invention relates to an elastomer material including flexible polymer chains containing crosslinking bridges having covalent bonds and crosslinking bridges having noncovalent bonds. The invention also relates to a method for preparing such elastomer material..
Arkema France


07/16/15
20150196889 

Methods of electrospray chemical synthesis


The present invention relates to methods of production of chemical bonds and subsequent molecules by electrospray ionization for use in chemical synthesis and expedited organic chemical reactions.. .
Canam Bioresearch Inc.


07/16/15
20150196573 

Process for producing an injectable medicament preparation


The invention relates to a method for producing injectable medicament preparations containing a therapeutically and/or diagnostically effective substance which is comprised of an active agent, of a spacer molecule and of at least one protein-binding molecule. After being brought into contact with the body, said therapeutically and/or diagnostically effective substance covalently bonds to the body fluid constituents or tissue constituents via the protein-binding molecule, thus providing a form of transport of the active agent that an be hydrolytically or enzymatically cleaved, according to ph, in the body while releasing the active agent..
Ktb Tumorforschungs Gmbh


07/09/15
20150195903 

Laminate foil assembly for a printed product apparatus and manufacturing the same


A foil assembly of a printed product includes a metallic layer and a polymer layer. The metallic layer forms conductive bodies that can be detected by a touch-sensitive device.
Lllinois Tool Works Inc.


07/09/15
20150194369 

Semiconductor package with conductive clips


One exemplary disclosed embodiment comprises a high power semiconductor package configured as a buck converter having a control transistor and a sync transistor disposed on a common leadframe pad, a driver integrated circuit (ic) for driving the control and sync transistors, and conductive clips electrically coupling the top surfaces of the transistors to substrate pads such as leadframe pads. In this manner, the leadfirame and the conductive clips provide efficient grounding or current conduction by direct mechanical connection and large surface area conduction, thereby enabling a package with significantly reduced electrical resistance, form factor, complexity, and cost when compared to conventional packaging methods using wirebonds for transistor interconnections..
International Rectifier Corporation


07/09/15
20150194337 

Method for the treatment and direct bonding of a material layer


A method for treating at least one first material layer including siloxane bonds, wherein at least one surface can be interlocked with a surface of a second material layer by direct bonding, the method including: at least one forced diffusion at a temperature greater than or equal to 30° c., at least in the first material layer, of chemical species including at least one pair of free electrons and at least one labile proton; and converting at least one portion of the siloxane bonds into silanol bonds in at least one portion of the first material layer extending from the surface to a depth greater than or equal to approximately 10 nm.. .
Commissariat A I'energie Atomique Et Aux Ene Alt


07/09/15
20150194322 

Lead carrier with thermally fused package components


A lead carrier provides support for a semiconductor device during manufacture. The lead carrier includes a temporary support member with multiple package sites.
Eoplex Limited


07/09/15
20150192589 

Method using fluorescent turn-on probes for cell-specific detection


Wherein w, x, y, z have the meaning as described in the description, r is a reactive group that can interact with enzymes and other bioactive molecules, linker is a single bond or a combination of chemical bonds linking the targeting group t to the probe molecule, and t represents a targeting group that has an ability to interact with an organelle.. .

07/09/15
20150191416 

Method for manufacturing tertiary amino group-containing lipid


(in formula, r1 represents a hydrocarbon group having at least one methylene group sandwiched between adjacent two cis form double bonds in the molecule and having the carbon number of 8 to 24 and x represents a releasing group) is reacted with (b) a compound having at least one of each of tertiary amino group and hydroxyl group in the molecule in a saturated hydrocarbon solvent having the carbon number of 5 to 10 in the presence of an alkali catalyst.. .

07/09/15
20150190783 

Polymers grafted with organic phosphorous compounds for extracting uranium from solutions


Complexing or chelating agents that offer strong, selective bonding with uranium as well as a broad ph range of effectiveness, specifically including the ph range around 8.2, together with the acrylic double bonds required for radiation-induced grafting on polymers to remove uranium from a solution such as seawater. The novel adsorbing species are phosphorus-containing molecules, in particular organic phosphates, phosphonates and phosphoric acids.
The Catholic University Of America


07/02/15
20150188020 

Extremely low resistance composition and methods for creating same


The invention pertains to creating new extremely low resistance (“elr”) materials, which may include high temperature superconducting (“hts”) materials. In some implementations of the invention, an elr material may be modified by depositing a layer of modifying material unto the elr material to form a modified elr material.
Ambature, Inc.


07/02/15
20150188008 

Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode


The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (a) an organic compound having at least two carbon-carbon double bonds reactive with sih groups per molecule, (b) a compound containing at least two sih groups per molecule, (c) a hydrosilylation catalyst, (d) a silicone compound having at least one carbon-carbon double bond reactive with a sih group per molecule, and (e) an inorganic filler..
Kaneka Corporation


07/02/15
20150187745 

Solder pillars for embedding semiconductor die


A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate.
Sandisk Information Technology (shanghai) Co., Ltd.


07/02/15
20150187729 

Wire stitch bond having strengthened heel


A semiconductor chip (1100) assembled on a substrate (1110), the chip having bond pads (1102) and the substrate having contact pads (1111). Wires (1101) form arches to connect electrically the chip and the substrate, the wires forming first bonds (1103, e.g.
Texas Instruments Incorporated


07/02/15
20150187587 

Memory device structure and method


A system and method for manufacturing a memory device is provided. A preferred embodiment comprises manufacturing a flash memory device with a tunneling layer.
Taiwan Semiconductor Manufacturing Company, Ltd.


07/02/15
20150185889 

Touch panel and manufacturing the touch panel


To prevent disconnection of a touch panel to which a three-dimensional shape has been imparted, the touch panel includes a first electrode layer that is formed upon a first base material sheet and includes material having flexibility. The first electrode layer has a first electrode part and a first mount part extending from the first electrode part.
Nissha Printing Co., Ltd.


07/02/15
20150184749 

Fluororesin seal ring


A ptfe resin seal ring in which at least one surface of an abutting part that forms a discontinuous part of the seal ring is treated by plasma modification using non-polymerizable gas under pressure conditions of 10 to 500 pa during plasma irradiation. Since the abutting surfaces of the ptfe resin seal ring are treated with low-pressure plasma, and the state of cf bonds in the surface portion is changed, sticking does not occur in the abutting part even after constant load is applied at a high temperature.
Nok Corporation


07/02/15
20150183904 

Method for producing polybutadiene, polybutadiene, rubber composition and tire


(in the formula, m is at least one selected from lanthanides, scandium and yttrium; (nq)1, (nq)2 and (nq)3 are amide groups which may be the same or different to each other, and have m-n bonds).. .

07/02/15
20150183892 

Hydrogenation of a diene-based polymer latex


The present invention provides a novel process for selectively hydrogenating the carbon-carbon double bonds in diene-based polymers which are present in latex form, this means as a suspension of diene-based polymer particles in an aqueous medium, using a ruthenium or osmium-based complex catalyst without any organic solvent.. .
University Of Waterloo


07/02/15
20150183642 

Systems and methods for nanoscopically aligned carbon nanotubes


The present invention relates to systems and methods for generating nanoscopically aligned carbon nanotubes in yarns, tapes and sheets. Some embodiments relate to methods and systems to allow in situ alignment of the tubes within the growth chamber.
Nanocomp Technologies, Inc.


07/02/15
20150182311 

Oval platform dental implant system and its components


(opi) oval platform dental implants, a new generation of dental implants, have a wider implant structure (3.75 to 12 mm) and wider platform (oval versus round) versus the cylindrical tapered shape and round platform of conventional dental implants. Opi have a thicker body (3.75 to 6 mm) versus blade shape implants, (2-3 mm), which, due to high failure rate, are not used today.

07/02/15
20150181918 

Fiber-containing carbohydrate composition


A food product comprises an oligosaccharide composition that is digestion resistant or slowly digestible. The oligosaccharide composition can be produced by a process that comprises producing an aqueous composition that comprises at least one oligosaccharide and at least one monosaccharide by saccharification of starch, membrane filtering the aqueous composition to form a monosaccharide-rich stream and an oligosaccharide-rich stream, and recovering the oligosaccharide-rich stream.
Tate & Lyle Ingredients Americas Llc


06/25/15
20150180189 

Air-tight and water-tight electrical bonding device


A bonding device electrically bonds metallic surfaces through serrated metal teeth which embed into each metal surface as a fastener is tightened. A sealing material circumferentially outward and inward from the teeth create an air-tight and water-tight seal around the teeth, protecting the bonding location.

06/25/15
20150180188 

Air-tight and water-tight electrical bonding device


A bonding device electrically bonds metallic surfaces through serrated metal teeth which embed into each metal surface as a fastener is tightened. A sealing material circumferentially outward and inward from the teeth create an air-tight and water-tight seal around the teeth, protecting the bonding location.

06/25/15
20150180013 

High voltage battery for vehicles


A high voltage battery for vehicles is provided and includes an electrode tab that is divided into a first part disposed substantially adjacent to a battery cell and a second part disposed substantially adjacent to a terminal. A first part extension extends from the first part and is fixed to a lower pouch and a second part extension extends from the second part and is fixed to an upper pouch.
Hyundai Motor Company


06/25/15
20150179998 

Electrode, secondary battery, battery pack, electric vehicle, electric power storage system, electric power tool, and electronic apparatus


(r1 to r6 are each one of a hydrogen group (—h), a monovalent hydrocarbon group, a monovalent hydroxyl-group-containing hydrocarbon group, a monovalent group obtained by bonding one or more monovalent hydrocarbon groups and one or more oxygen bonds (—o—), a monovalent group obtained by bonding one or more monovalent hydroxyl-group-containing hydrocarbon groups and one or more oxygen bonds, and a monovalent group obtained by bonding two or more thereof.). .

06/25/15
20150179913 

Fluorine passivation of dielectric for superconducting electronics


An amorphous silicon (a-si) dielectric for superconducting electronics is fabricated with reduced loss tangent by fluorine passivation throughout the bulk of the layer. Complete layers or thinner sub-layers of a-si are formed by physical vapor deposition at low temperatures (<350 c, e.g.
Intermolecular, Inc.


06/25/15
20150179903 

Led package with multiple element light source and encapsulant having curved and/or planar surfaces


Led packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The led package are also directed to features or arrangements that allow for improved or tailored emission characteristic for led packages according to the present invention.
Cree, Inc.


06/25/15
20150179609 

Method for interconnecting die and substrate in an electronic package


A method for interconnecting a die on a substrate of an electronic package. The method includes the steps of forming a plurality of free-end wire bonds on the die, wherein the free-end wire bonds are upstanding from the die, and encapsulating the free-end wire bonds in an encapsulation layer.
The Charles Stark Draper Laboratory, Inc.


06/25/15
20150179583 

Semiconductor devices comprising edge doped graphene and methods of making the same


A method of forming an edge-doped graphene channel is described. The method involves selectively removing graphene from a graphene layer on a substrate in the presence of a dopant to form graphene channels.
Harper Laboratories, Llc


06/25/15
20150177790 

Electronic apparatus, light-transmissive cover plate, and portable device


An electronic apparatus and a light-transmissive cover plate are disclosed. The electronic apparatus includes an image display device that includes an image display surface; a casing that houses at least a portion of periphery of the image display device; a light-transmissive cover plate that includes a first surface facing the image display surface, at least a peripheral edge region of the first surface is bonded to the casing; and a joining member that bonds the peripheral edge region of the first surface to the casing.
Kyocera Corporation


06/25/15
20150177551 

Liquid crystal display device


The present invention discloses an lcd device. The lcd device includes a bezel, a light guide plate on the light source for guiding light, an optical film on the light guide plate for processing the guided light through the light guide plate, an lcd panel directly carried on the optical film, a driving chip, a fpc with metal wires, wherein the driving chip bonds with the fpc and is used for being coupled to the lcd panel via the metal wires of the fpc, and a heat sink attached between the bezel and the fpc and used for dissipating heat generated from the driving chip..
Shenzhen China Star Optoelectronics Technology Co. Ltd.


06/25/15
20150175859 

Adhesive formulations


The present invention relates to adhesive formulations based on uretdione-group-comprising polyaddition compounds that are free of isocyanate groups and monomeric polyisocyanates, and to the use thereof for the production of adhesive bonds between substrates, in particular for the production of flexible film composites.. .
Bayer Materialscience Ag


06/25/15
20150175854 

Hydrogenated alkenyl aromatic-diene copolymers containing comonomers having silyl hydride units and their functionalized analogs


The present invention relates primarily to polymers comprising at least one alkenyl aromatic monomer, at least one conjugated diene monomer, and at least one monomer containing silyl hydride moieties, characterized in that said polymers are hydrogenated and preferably functionalized by hydrosilylation reactions between the silyl hydride groups on the polymer chain and the multiple bonds of any alkene or alkyne compound. Besides the described products, this invention comprises their synthesis processes and their uses, especially as thermofusible adhesives, in plastics impact modification, and in chain-extension reactions to obtain new materials, among others..
Dynasol Elastomeros, S.a.


06/25/15
20150173967 

Absorbent article comprising one or more colored areas


An absorbent article comprising a liquid permeable topsheet, a liquid impermeable backsheet, and an absorbent core comprising a core wrap enclosing absorbent material comprising a superabsorbent polymer. The absorbent core comprises one or more substantially absorbent material free areas through which a portion of the top side of the core wrap is attached to a portion of the bottom side of the core wrap.
The Procter & Gamble Company


06/18/15
20150171618 

Esd protection device and manufacturing the same


An esd protection device having high insulation reliability and excellent discharge characteristics is provided. In an esd protection device including a first and a second discharge electrode disposed to face each other, a discharge auxiliary electrode (18) formed so as to bridge the first and second discharge electrodes, and an insulating substrate holding the first and second discharge electrodes and the discharge auxiliary electrode (18), the discharge auxiliary electrode (18) is formed of an aggregate of metal grains (24) each having a core-shell structure comprising a core portion (22) primarily formed of a first metal and a shell portion (23) primarily formed of a metal oxide containing a second metal, and the aggregate of metal grains (24) further includes an insulating resin (27) which bonds the metal grains (24) to each other..
Murata Manufacturing Co., Ltd.


06/18/15
20150171452 

Fuel cell electrode assembly


An exemplary fuel cell electrode assembly includes a membrane. A first electrode is on the first side of the membrane.
Ballard Power Systems Inc.


06/18/15
20150171245 

Flip-chip solar cell chip and fabrication method thereof


A flip-chip solar cell chip includes a bonding transfer substrate; a metal bonding layer; a flip-chip solar cell epitaxial layer that bonds with the bonding transfer substrate with the metal bonding layer; the flip-chip solar cell epitaxial layer and the metal bonding layer are divided into two or more portions; the surface of the flip-chip solar cell epitaxial layer has a front electrode; and the metal bonding layer is connected with the ends of the front electrode to form a series connection of the divided epitaxial layer. Advantageously, the division of the solar cell epitaxial layer into a plurality of completely-separated portions greatly reduces photo currents and power loss of cell chip series resistance while realizing multiplied increase of output voltage, thereby improving photoelectric conversion efficiency.
Xiamen Sanan Optoelectronics Technology Co., Ltd.


06/18/15
20150170277 

Municipal bond exchange


An exchange system for municipal bonds and other securities, that comprises a database and a central server coupled to user devices through a network. Bond information is inputted through the user devices, received and processed by the central server, and stored in the database.

06/18/15
20150168842 

Block co-polymer photoresist


An integrated circuit is made by depositing a pinning layer on a substrate. A block copolymer photoresist is formed on the pinning layer.
Pixelligent Technologies, Llc


06/18/15
20150167724 

High temperature secondary torque retention for bolted assemblies


A fastening assembly includes a fastener having a head with an underside and an elongated shaft extending therefrom. The fastener constructed of at least one of a refractory metal and a superalloy.
General Electric Company


06/18/15
20150167243 

Energy efficient process for preparing nanocellulose fibers


A scalable, energy efficient process for preparing cellulose nanofibers is disclosed. The process employs a depolymerizing treatment with one or both of: (a) a relatively high charge of ozone under conditions that promote the formation of free radicals to chemically depolymerize the cellulose fiber cell wall and interfiber bonds; or (b) a cellulase enzyme.
University Of Maine System Board Of Trustees


06/18/15
20150166988 

Methods and compositions


Wherein said connector compound is attached to the polypeptide by at least three discrete covalent bonds. The invention also relates to libraries, and to methods for making complexes and to methods of screening using same..

06/18/15
20150166757 

Method of forming carbon nanotube or graphene-based aerogels


A method of forming aerogels includes mixing a plurality of polymers or aromatic molecules, a solvent, and a plurality of carbon nanotubes (cnts) or graphene including structures to form a mixture, where the polymers or aromatic molecules have at least one crosslinkable structure. A solid gel is formed including a plurality of supramolecular structures from the mixture.
University Of Central Florida Research Foundation, Inc.


06/18/15
20150166695 

Methacrylic resin composition, its molded product, and producing the composition


A methacrylic resin composition, which comprises a methacrylic resin comprising 99.5% by mass or more of a structural unit derived from methyl methacrylate. The methacrylic resin includes less than 0.03 mol % of terminal double bonds based on the amount of the structural unit derived from methyl methacrylate and 0.2 mol % or more of combined sulfur atoms based on the amount of the structural unit derived from methyl methacrylate.
Kuraray Co., Ltd.


06/18/15
20150166464 

Process for creating carbon-carbon bonds using carbonyl compounds


The present invention concerns a process for preparing a compound of formula (i) by reaction between a compound of formula (ii) and a compound of formula (iii) in the presence of a copper-containing catalyst, a ligand and base. The invention also concerns the implementing of this process for the preparation of building blocks to prepare molecules of interest in particular in the pharmaceutical, agro-chemical fields, etc..
Ecole Nationale Superieure De Chime De Montpellier


06/18/15
20150165810 

Method and document


A blank form for a mailing document is provided, the form comprising a paper substrate having a first border area and a second border area; adhesive located in one or both of the first border area and the second border area so positioned that when the form is folded the first border area contacts and bonds to the second border area; and wherein the form further comprises a releasable panel.. .
Document Management Solutions Limited


06/18/15
20150165679 

Three dimensional mold object manufacturing apparatus, manufacturing three dimensional mold object, and three dimensional mold object


A three dimensional mold object manufacturing apparatus is adapted to manufacture a three dimensional mold object by repeatedly forming and layering layers using a composition including particles. The apparatus includes a layer forming section which forms the layers using the composition, a bonded section forming part which bonds the particles included in a predetermined region of the layer and forms a bonded section, and a modifying part which carries out modification processing with regard to the layer where the bonded section is formed before a subsequent layer is formed on the layer where the bonded section is formed..
Seiko Epson Corporation


06/18/15
20150165220 

Direct integration of feedthrough to implantable medical device housing by sintering


One aspect provides a method of attaching a feedthrough to a titanium housing of an implantable medical device. The method includes applying a sinter paste onto a surface of the housing about a perimeter of an opening through the housing, the sinter paste including a biocompatible bonding material, and placing an insulator of the feedthrough onto the sinter paste so as to cover the opening.
Heraeus Precious Metals Gmbh & Co. Kg


06/18/15
20150165218 

Direct integration of feedthrough to implantable medical device housing using a gold alloy


One aspect provides a method of attaching a feedthrough to a titanium housing of an implantable medical device. The method includes providing the housing with a flange forming a recess about an opening through the housing, the opening disposed within the recess.
Heraeus Precious Metals Gmbh & Co. Kg


06/18/15
20150164988 

Pan-antiviral peptides and uses thereof


Methods for preparing viral neuraminidase inhibitors including antiviral peptides by specifically chemically modifying disulfide bonds in precursor molecules. A method of inhibiting viral neuraminidases by administrating a viral neuraminidase inhibitor comprising an antiviral peptide prepared by the above methods and inhibiting the viral neuraminidase.
Nuovo Biologics, Llc


06/11/15
20150163970 

Electronic component removal a circuit board


A removal apparatus includes a main body, a carrying device, a heating device and a brush device. The carrying device is disposed on the main body, and includes a holding module for holding a circuit board.
Wistron Corporation


06/11/15
20150162304 

Silver-to-silver bonded ic package having two ceramic substrates exposed on the outside of the package


A packaged power device involves no soft solder and no wire bonds. The direct-bonded metal layers of two direct metal bonded ceramic substrate assemblies, such as direct bonded aluminum (dba) substrates, are provided with sintered silver pads.
Ixys Corporation


06/11/15
20150162292 

Semiconductor package and manufacturing semiconductor package


A semiconductor package includes a wiring substrate that includes a first conductive member; a semiconductor chip that is mounted on the wiring substrate and includes a second conductive member, the first conductive member and the second conductive member being positioned to face each other; and a bonding member that bonds and electrically connects the first conductive member and the second conductive member, at least one of the first conductive member and the second conductive member being a pillar-shaped terminal, the bonding member being bonded to an end surface of the pillar-shaped terminal and a portion of a side surface of the pillar-shaped terminal, an intermetallic compound layer being formed at an interface of the bonding member and the pillar-shaped terminal.. .
Shinko Electric Industries Co., Ltd.


06/11/15
20150160159 

Dna sequencing using multiple metal layer structure with different organic coatings forming different transient bondings to dna


A nanodevice includes a reservoir filled with conductive fluid and a membrane separating the reservoir. A nanopore is formed through the membrane having electrode layers separated by insulating layers.
International Business Machines Corporation


06/11/15
20150159150 

Method for activating a surface by increasing the hydrophilicity and/or for binding target structures


The invention relates to a method for activating a surface by increasing the hydrophilicity and/or for binding target structures, particularly selected from the group consisting of proteins, cellular proteins, proteins, cells, carbohydrates, peptides and amino acids. It also relates to the use of an oxidoreductase for activating a surface for the mentioned bonds and to corresponding activated surfaces..
Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.


06/11/15
20150159149 

Thermostable phytase variants


The present invention relates to a method for producing phytase variants which has at least 74% identity to a phytase derived from citrobacter braakii and comprises at least two additional disulfide bonds as compared to this phytase. These phytase variants have modified, preferably improved, properties, such as thermostability, temperature profile, ph profile, specific activity, performance in animal feed, reduced protease sensitiliby, and/or an modified glycosylation pattern.
Novozymes A/s


06/11/15
20150159031 

Ink, ink cartridge, and ink jet recording method


An aqueous ink for ink jet contains a urethane resin. The urethane resin has a unit derived from a polyether polyol and a unit containing an acidic group.
Canon Kabushiki Kaisha


06/11/15
20150159007 

Mold material, molding method, mold object, and molding apparatus


A molding apparatus includes a heating section, a spreading section, a molding section, a drawing section and a curing section. The heating section which heats a mold material including particles and a binder agent which bonds together the particles, to a temperature equal to or higher than the melting point of the binder agent and forms a fluid mold material.
Seiko Epson Corporation


06/11/15
20150158959 

Fluorine-containing highly branched polymer and epoxy resin composition containing the same


A fluorine-containing highly branched polymer obtained by polymerizing a polyfunctional monomer a that has two or more radically polymerizable double bonds and all or a portion of which has a bisphenol structure, a monomer b having a fluoroalkyl group and at least one radically polymerizable double bond, within a molecule, and a monomer c having at least one ring-opening polymerizable group selected from the group including an epoxy group and an oxetanyl group, and having at least one radically polymerizable double bond, within a molecule, under the presence of a polymerization initiator d with an amount of 5% by mole to 200% by mole to the number of moles of the polyfunctional monomer a; an epoxy resin composition including the polymer; and an epoxy resin cured product obtained from the resin composition.. .
Nissan Chemical Industries, Ltd.


06/11/15
20150158773 

Methods of making carbon composites


A carbon composite contains a plurality of expanded graphite particles; and a second phase comprising a carbide, a carbonization product of a polymer, or a combination thereof; wherein the second phase bonds at least two adjacent basal planes of the same expanded graphite particle together. Methods of making the carbon composite and articles comprising the carbon composite are also disclosed..
Baker Hughes Incorporated


06/11/15
20150158772 

Carbon composites, methods of manufacture, and uses thereof


A carbon composite contains a plurality of expanded graphite particles; and a second phase comprising a carbide, a carbonization product of a polymer, or a combination thereof; wherein the second phase bonds at least two adjacent basal planes of the same expanded graphite particle together. Methods of making the carbon composite and articles comprising the carbon composite are also disclosed..
Baker Hughes Incorporated


06/11/15
20150158649 

Component carrier tape with uv radiation curable adhesive


A carrier tape for transporting a plurality of components includes a flexible substrate extending along a longitudinal axis of the carrier tape, a plurality of pockets formed in the substrate and spaced apart along the longitudinal axis of the carrier tape, and an adhesive layer. Each pocket includes a bottom wall and a side wall extending from the bottom wall to a top surface of the flexible substrate.
3m Innovative Properties Company


06/11/15
20150158245 

Ultrasonic bonding of a cover glass sub-assembly


A method of using ultrasonic energy to secure a first and a second component is described, and an apparatus formed therefrom. A first layer is bonded to a second layer by converting ultrasonic energy into thermal energy.
Apple Inc.


06/11/15
20150158221 

Electronic device and manufacturing the same


An electronic device includes a first molded product integrated with an electronic component, and a second molded product secondarily molded outside of the first molded product. The first molded product includes a thermosetting resin, and a first additive contained in the thermosetting resin, and the second molded product includes a thermoplastic resin, and a second additive contained in the thermoplastic resin and having a reactive group that chemically bonds with the first additive.
Denso Corporation


06/11/15
20150158056 

Light-assisted acoustic cleaning tool


A cleaning tool facilitating removal of particles from a surface is provided which includes an acoustic wave generator and one or more light-emitting diodes. The acoustic wave generator, which is configured to direct acoustic waves towards the surface to be cleaned, may include an acoustic transducer that facilitates generating the acoustic waves, and an acoustic coupler substrate through which the acoustic waves propagate.
Sematech, Inc.




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Bonds topics: Carbon Dioxide, Zinc Oxide, Lost Circulation, Circulation, Chemical Reaction, Fatty Acid, Polyurethane, Parthenolide, Pharmaceutically Acceptable Salt, Alkyl Group, Cycloalkyl

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