|| List of recent Barrier Film-related patents
| Mixed metal-silicon-oxide barriers|
A method of forming a thin barrier film of a mixed metal-silicon-oxide is disclosed. For example, a method of forming an aluminum-silicon-oxide mixture having a refractive index of 1.8 or less comprises exposing a substrate to sequences of a non-hydroxylated silicon-containing precursor, activated oxygen species, and metal-containing precursor until a mixed metal-silicon-oxide film having a thickness of 500 Ångstroms or less is formed on the substrate..
| Barrier film and methods of making same|
A barrier film for blocking moisture and oxygen transmission includes a single layer grown from a precursor of organic silicide by a chemical vapor deposition, having at least silicon (si) atoms, oxygen (o) atoms and carbon (c) atoms with atomic ratios of c/si in a range of about 0.1-0.5, and o/si in a range of about 2.0-2.5. The si and o atoms form four bonding structures: si(—o)4, si(—o)3, si(—o)2, and si(—o)1, in the single layer.
| Method and means for protecting a windshield from further damage before repair is possible|
The invention could be a windshield repair kit comprising a laminate having a protective barrier film, an adhesive layer, and a peel-able cover, the protective barrier film having at least one side to which the adhesive layer is applied, the adhesive layer being capable of cured in a presence of a uv light; the peel-able cover removably covering one or more exposed portions of the adhesive layer; a covering that removably receives the laminate, the covering reducing the transmission of uv light to the adhesive layer to a level that prevents the uv activation of the adhesive layer while the laminate is within the covering.. .
|Gas barrier film, manufacturing method thereof, and substrate for electronic element using the same|
Provided are a gas barrier film which has excellent transparency, surface smoothness, gas barrier property and adhesivity and a manufacturing method thereof, and a substrate for an electronic element using the same. The gas barrier film of the present invention has a sheet substrate which contains a surface-modified cellulose nanofiber in which at least a part of hydrogen atoms in a hydroxyl group in a cellulose nanofiber are substituted with acyl groups each having 1 to 8 carbon atoms and has a content of a matrix resin of 10% by mass or less with respect to the total amount of the cellulose nanofiber and the matrix resin, and a gas barrier layer which is formed on at least one surface of the sheet substrate.
|Barrier film defect detecting method and apparatus|
A method for detecting a defect of a barrier film includes preparing a device including an electrode and a barrier film covering the electrode, allowing a charged medium to contact a surface of the barrier film, and measuring a change in a flow of current between the charged medium and the electrode.. .
|Gas barrier film|
The present invention aims to provide a transparent gas barrier film having excellent gas barrier properties against oxygen, water vapor and the like especially under high humidity, and showing excellent delamination resistance after hydrothermal treatment. The present invention relates to a gas barrier film comprising: a base film having an inorganic compound layer formed on one side thereof; and a (meth)acrylic silane coupling agent layer and a layer (y) that are laminated in this order on the inorganic compound layer, which layer (y) comprises a polymer of a polyvalent metal salt of an unsaturated carboxylic acid compound (a) and a vinyl alcohol polymer (b)..
|Semiconductor device and method for manufacturing semiconductor device|
During the production of a semiconductor device having a cu wiring line of a damascene structure, diffusion of fluorine from a cf film that serves as an interlayer insulating film is prevented in cases where a heat treatment is carried out, thereby suppressing increase in the leakage current. A semiconductor device of the present invention having a damascene wiring structure is provided with: an interlayer insulating film (2) that is formed of, for example, a fluorine-added carbon film; and a copper wiring line (4) that is embedded in the interlayer insulating film.
|Optoelectronic devices with thin barrier films with crystalline characteristics that are conformally coated onto complex surfaces to provide protection against moisture|
The present invention provides optoelectronic devices containing at least one conforming, thin film barrier coating provided on a nonplanar surface comprising a plurality of junctures. The barrier coating has a hybrid morphology including crystalline domains distributed in an amorphous matrix.
|Vinylidene chloride interpolymer and poly(butylene succinate) blend|
Barrier films made from a composition comprising vinylidene chloride (vdc) interpolymer and poly(butylene succinate) (pbs) exhibit improved tear resistance in both the machine and cross directions without a significant deterioration in oxygen transmission rate as compared to barrier films made under like conditions and from a composition alike in all respects except that the pbs is replaced with additional vdc interpolymer.. .
|Multilayered film and method for manufacturing same|
A multi-layered film, a method of preparing the same and a photovoltaic module are provided. A barrier film having excellent moisture barrier properties can be coated with a fluoropolymer having excellent weather resistance by means of a primer layer including a silane-modified acrylic copolymer, and an interfacial adhesive strength can also be ensured.
|Method for manufacturing semiconductor device|
A method for manufacturing semiconductor device includes preparing a structure including a substrate, an insulating layer on the substrate and having a recess, a barrier film on the insulating layer, and a copper film on the barrier such that the copper film is filling the recess with the barrier between the insulating layer and copper film, removing the copper film down to interface with the barrier such that copper wiring is formed in the recess, etching the wiring such that surface of the wiring is recessed from surface of the insulating layer, and removing the barrier from the surface of the insulating layer such that the surface of the insulating layer is exposed. The etching includes positioning the structure removed down to the barrier in organic compound atmosphere having vacuum state, and irradiating oxygen gas cluster ion beam on the surface of the wiring to anisotropically etch the wiring..
|Methods for fabricating a thin film transistor and an array substrate|
The present invention provides methods for fabricating a thin film transistor and an array substrate, which are applicable in the field of display device fabrication, and solve the problem of performing patterning process too many times during the fabrications of a thin film transistor and an array substrate. The method for fabricating a thin film transistor comprises: forming a gate layer on a substrate; forming a gate insulation layer on the substrate; forming an oxide semiconductor layer and a barrier layer and on the substrate; and forming a source-drain layer on the substrate, wherein, the step of forming the oxide semiconductor layer and the barrier layer comprises: sequentially forming an oxide semiconductor film a the barrier film; and forming the oxide semiconductor layer from the oxide semiconductor film and the barrier layer from the barrier film by performing a patterning process once..
|Modified polysilazane film and method for producing gas barrier film|
A modified polysilazane film comprising a substrate and a modified polysilazane layer formed thereon, and a method for producing a gas barrier film obtained through such intermediate material, wherein the modified polysilazane layer has a thickness of a value in the range of 10 to 500 nm, and the modified polysilazane layer has a refractive index of a value in the range of 1.48 to 1.63.. .
|Multilayer barrier film, a packaging laminate comprising the film, a packaging container formed from the packaging laminate and a method for the production of the film|
The invention relates to a biaxially oriented multilayer, barrier polymer film, having gas barrier properties and consisting of polymer layers, comprising a polyolefin core layer and a barrier surface layer of ethylene vinyl alcohol (evoh) on a first side of the core layer. The invention further relates to such a vapour deposition coated film, especially a metallised such film.
Various polymeric barrier compositions are described which when formed into films, are useful in reducing transmission of odors. The films can be incorporated into a wide range of products such as multilayer barrier films used in medical applications and particularly in ostomy appliances.
|Multilayer film for encapsulating oxygen and/or moisture sensitive electronic devices|
The present invention relates to a multilayer barrier film capable of encapsulating a moisture and/or oxygen sensitive electronic or optoelectronic device, the barrier film including at least one nanostructured layer including reactive nanoparticles capable of interacting with moisture and/or oxygen, the reactive nanoparticles being distributed within a polymeric binder, and at least one ultraviolet light neutralizing layer comprising a material capable of absorbing ultraviolet light, thereby limiting the transmission of ultraviolet light through the barrier film.. .
|Method for forming copper wiring|
In a cu wiring forming method for forming a cu wiring by filling cu in a recess which is formed in a substrate in a predetermined pattern, a barrier film formed of a taaln film is formed at least on the surface of the recess by thermal ald or thermal cvd. Then a cu film is formed to fill the recess with the cu film.
|Gas barrier film laminate and electronic component|
The invention relates to a gas barrier film laminate comprising at least two gas barrier films and a pressure-sensitive adhesive layer, the at least two gas barrier films being stacked through the pressure-sensitive adhesive layer, at least one of the at least two gas barrier films including a base formed of a plastic film, and at least one gas barrier layer provided on the base, and the pressure-sensitive adhesive layer being a layer formed using a rubber-based pressure-sensitive adhesive composition that includes a rubber-based compound. The invention also relates to an electronic member comprising the gas barrier film laminate.
|Gas barrier film and method for producing same|
An object is to provide a gas barrier film which has high gas barrier performance and a method for producing a gas barrier film with excellent continuous productivity. A gas barrier film, which is obtained by laminating at least one gas barrier layer on a resin substrate, wherein a hardness and an elastic modulus recovery ratio of at least one layer that is adjacent to the gas barrier layer satisfy 0.5 gpa≦hardness≦5.0 gpa and 50%≦elastic modulus recovery ratio≦100% as measured by a nanoindentation method..
|Method for manufacturing a transparent gas barrier film and an organic electroluminescence element comprising such a film|
A transparent gas barrier film comprising a substrate having thereon a gas barrier layer comprising at least a low density layer and a high density layer, wherein one or more intermediate density layers are sandwiched between the low density layer and the high density layer.. .
|Organic el element sealing member|
The present invention provides a sealing member for organic el elements that enables organic el elements, in particular, organic el elements for illumination devices to maintain stable luminescence over a long period and that can be fabricated at reduced cost. The sealing member for organic el elements of the present invention includes a barrier film including a plastic film and at least one thin metal layer, and a curable resin composition layer on the barrier film.
|Barrier laminate, gas barrier film, and device employing the same|
The present invention provides a barrier laminate, comprising an organic layer and an inorganic barrier layer adjacent to the organic layer, characterized in that the organic layer comprises a polymer obtained by polymerizing a polymerizable compound having two or more polymerizable groups per molecule, and has a refractive index of 1.60 or higher, and in that the refractive index of the inorganic barrier layer is 1.60 or higher. The gas barrier film exhibits high barrier properties and transparence..
|Method for forming copper wiring|
There is provided a cu wiring forming method for forming a cu wiring by filling cu in a recess, which is formed in a predetermined pattern in a si-containing film of a substrate. The cu wiring forming method includes forming a mn film, which becomes a self-aligned barrier film by reaction with an underlying base, at least on a surface of the recess by chemical vapor deposition, forming a cu film by a physical vapor deposition to fill the recess with the cu film, and forming a cu wiring in the recess by polishing the entire surface of the substrate by a chemical mechanical polishing..
|Organic light emitting diode device and method for fabricating the same|
Disclosed are an organic light emitting diode device, and a method for fabricating the same. The organic light emitting diode device comprises a non-active area formed outside an active area of a substrate; a switching thin film transistor and a driving thin film transistor at each of the pixel regions; a planarization layer on the substrate; a first electrode on the planarization layer; a bank formed in the non-active area outside each pixel region; an organic light emitting layer on the first electrode; a second electrode on an entire surface of the substrate; a first passivation layer on the substrate; an organic layer on the first passivation layer; a second passivation layer on the organic layer and the first passivation layer; a barrier film disposed to face the substrate..
|Flexible organic light emitting display device|
A flexible organic light emitting display device includes: a display panel configured to output an image; a retardation film formed on an upper portion of the display panel to cover the display panel and formed by laminating a half wave plate and a quarter wave plate; and a polarizing plate attached to the retardation film. A color shift in a black screen can be improved by replacing a barrier film used for face seal with a retardation film including a half wave plate and a quarter wave plate combined at a predetermined angle..
|Uv barrier film|
Transparent polypropylene film comprising at least two uv-absorbing additives, a first additive being a non-aggregated inorganic material present in the film composition in an amount of from 0.1 to 5.0% by weight, and a second additive comprising an organic material selected from triazines, hindered amines, oxanilides, cyanoacrylates, benzotriazoles and/or benzophenones and present in the film in an amount of less than 2.0% by weight and wherein when both benzotriazole(s) and benzophenone(s) are present in the film, the ratio of benzotriazole(s) to benzophenone(s) is above 0.5.. .
|Barrier film and method of manufacturing the same|
A barrier film including a plurality of cured layers each cured layer including a curing product of a polysilazane photocurable precursor, an uncured layer disposed between a first and a second cured layer of the plurality of cured layers, the uncured layer including the polysilazane photocurable precursor, and a gradient composition layer disposed between the first and the second cured layer and the uncured layer, wherein a concentration of the polysilazane photocurable precursor in the gradient composition layer increases with a distance from the first and the second cured layers toward the uncured layer.. .
|Optical member, display device having the same and method for fabricating the same|
Disclosed are an optical member, a display device including the same, and a method of fabricating the same. The optical member includes a barrier film; an adhesive layer bonded onto the barrier film and including a plurality of wavelength conversion particles and an adhesive; and a detachable film detachably attached onto the adhesive layer..
|Gas barrier film and electronic device|
Disclosed is a gas barrier film, which demonstrates superior gas barrier properties and surface flatness, demonstrates a high degree of adhesion between layers and is resistant to cracking when bent, and an electronic device provided therewith. A gas barrier film (10) of the present invention has a base (11), and a polyorganosiloxane layer (12) and an inorganic material layer (13) sequentially provided on at least one side of the base (11), and the inorganic material layer (13) is deposited by dynamic ion mixing method..
|Gas barrier film and method of preparing the same|
Provided are a gas barrier film that is simply and economically manufactured, and has high hardness and strength, excellent gas blocking properties, controllable refraction index and transparency, and a compositionally gradient structure, and a method of producing the same. The gas barrier film includes a base material; and an organic/inorganic hybrid gas barrier layer that is formed on the base material and has a composition-gradient structure.
|Barrier film with reclaimed metalized polyester|
A method reclaims metalized polymer film or mixtures containing metal and/or metal alloys into a metal-containing, polymeric film. The resulting film structure has better oxygen and moisture barrier properties when metalized than plain metalized polymer films.
|Laminate body, gas barrier film, and method of manufacturing the same|
A laminate body includes a base material, a film-like or a membrane-like undercoat layer that is formed in at least a portion of the outer surface of the base material, and an atomic layer deposition film that is formed on a surface opposite to a surface coming into contact with the base material among both surfaces of the undercoat layer in the thickness direction thereof. At least a portion of precursors of the atomic layer deposition film bind to the undercoat layer, and the atomic layer deposition film is formed into a membrane shape covering the undercoat layer..
|Laminate body, gas barrier film, method of manufacturing laminate body, and laminate body manufacturing apparatus|
A laminate body of the present invention includes a base material, an atomic layer deposition film that is formed along the outer surface of the base material, and an overcoat layer that covers the atomic layer deposition film with a film having a mechanical strength higher than that of the atomic layer deposition film.. .
|Organic light-emitting diode display panel and method for fabricating the same|
Disclosed is an organic light-emitting diode (oled) display panel. An oled display panel comprises a plurality of signal lines and a thin film transistor formed on a substrate, an interlayer insulating layer, a first electrode, a bank, an organic light-emitting layer, a second electrode, a first passivation layer, an organic layer, a second passivation layer and a barrier film, wherein the bank is formed to completely cover the interlayer insulating layer, and an inclination formed by side surfaces of the bank and the interlayer insulating layer is made to be gradual..
|Solar-cell module and manufacturing method therefor|
A solar-cell submodule sealed by an adhesive filler. A water-vapor-barrier film, a first adhesive filler layer, and a front-surface protection layer are layered on the front surface side of the solar-cell submodule, and a second adhesive filler layer and a back surface protection layer are layered on the back surface side of the solar cell submodule.
|High oxygen and water barrier multilayer film|
A multilayer plastic film comprising polyethylene outer layers with inner layers of additional polyethylene adjacent to tie layers of adhesive bonded to a blended polyamide and polyvinyl alcohol core. This structure results in excellent oxygen and water barrier properties.
|Barrier laminate and gas barrier film|
The barrier laminate maintains both barrier properties and adhesion between an organic layer and an inorganic layer, even when incorporated into an element.. .
|Flexible organic electroluminescent device and method for fabricating the same|
Provided is a flexible organic electroluminescent device and a method for fabricating the same. The device includes a switching thin film transistor and a drive thin film transistor formed at an each pixel region on the substrate; an interlayer insulating layer formed on the substrate; a partition wall pattern formed in the non-display area of the substrate; a first electrode formed on the interlayer insulating layer; a bank formed around each pixel region; an organic light emitting layer separately formed on the first electrode; a second electrode formed on an entire surface of the display area; a first passivation layer formed on an entire surface of the substrate; an organic layer and a second passivation layer formed on the first passivation layer of the display area; a barrier film located to face the substrate..
|Flexible organic electroluminescent device and method for fabricating the same|
Disclosed are a flexible organic electroluminescent device, and a method for fabricating the same. The flexible organic electroluminescent device comprises a non-active area formed outside an active area of a substrate; a switching thin film transistor and a driving thin film transistor on the substrate; an interlayer insulating layer formed on the substrate; a first electrode formed on the interlayer insulating layer; a bank formed in the non-active area of the substrate; an organic light-emitting layer formed on the first electrode; a second electrode formed on the organic light-emitting layer; a first passivation layer formed on the substrate; an organic layer formed on the first passivation layer; a partition wall pattern formed on the first passivation layer; a second passivation layer formed on the first passivation layer; and a barrier film disposed to face the substrate..
|Enhanced moisture barrier immediate release film coating systems and substrates coated therewith|
The present invention is directed to immediate release film coating systems for use on oral dosage forms such as compressed tablets and other orally-ingestible substrates which have improved moisture barrier properties. The film coating systems can be applied either directly to a substrate or after the substrate has been coated with a subcoat.
|Water vapor barrier film, method for producing the same, and electronic equipment using the same|
A water vapor barrier film that has high water vapor barrier performance, and further is excellent in water resistance, heat resistance, transparency, and smoothness; and a method for producing the same; and an electronic equipment using the same are provided. A water vapor barrier film containing at least one water vapor barrier layer, and at least one protective layer, on a base material having gas permeability, wherein the water vapor barrier layer is a layer formed by applying a coating liquid containing polysilazane, drying the applied coating liquid to form a film, and then by irradiating the film with vacuum ultraviolet light, and the protective layer is a layer formed by applying a coating liquid containing polysilozane, drying the applied coating liquid to form a film, and then by irradiating the film with vacuum ultraviolet light..
|Primer coating for metallized gas barrier films|
A primer coating is provided for use on polymeric substrates to enhance the adhesion of metallized coatings to the substrates. The primer coating also improves the gas barrier properties of the substrate when used in combination with a metallized coating.
|Method for strengthening glass and glass using the same|
A method for strengthening glass and a glass using the same are provided. The method for strengthening glass includes the following steps.
|Partially opaque-partially clear laminates and methods thereof|
The present relates a laminate comprising: an outer polyethylene (pe) layer; a first adhesive layer; a substrate layer with one side selectively vacuum metalized or selectively reverse printed and said printed or metalized side is toward first adhesive layer; a second adhesive layer; an ethylene vinyl alcohol (evoh) polymer barrier film layer; an linear density polyethylene (ldpe) extrusion layer; and an inner polyethylene (pe) layer. The present disclosure further relates to tubes made of the partially opaque and partially clear laminate.
|Flexible organic electroluminescent device|
The present invention relates to a flexible organic electroluminescent device, and the invention disclosed herein includes a switching thin film transistor and a drive thin film transistor formed at the each pixel region on a substrate; a first electrode connected to a drain electrode of the drive thin film transistor, and formed at the each pixel region; a bank formed on the display area and non-display area of the substrate; a spacer formed on a bank in the non-display area, and disposed in the vertical direction in parallel to a lateral surface of the display area; an organic light emitting layer separately formed for each pixel region; a second electrode formed on an entire surface of the organic light emitting layer; an organic layer formed on an entire surface of the substrate; a barrier film located to face the substrate.. .
|Gas barrier film, manufacturing method for gas barrier film, and electronic device|
Provided are a gas barrier film which has extremely excellent gas barrier performance and high durability, a manufacturing method thereof, and an electronic device using the same. The gas barrier film having at least two gas barrier layers which contain at least si, o and n and are laminated on a substrate, in which the total thicknesswise composition distribution of the gas barrier layers includes both a thicknesswise continuous region which has a thickness of 20 nm or more and satisfies the following composition range (a) and a thicknesswise continuous region which has a thickness of 50 nm or more and satisfies the following composition range (b) in this order from the substrate side.
|Barrier film composite, display apparatus including the barrier film composite, method of manufacturing barrier film composite, and method of manufacturing display apparatus including the barrier film composite|
A barrier film composite includes a film with an undulating surface; and at least one decoupling layer and at least one barrier layer disposed on the undulating surface of the film.. .
An object is to prevent an impurity such as moisture and oxygen from being mixed into an oxide semiconductor and suppress variation in semiconductor characteristics of a semiconductor device in which an oxide semiconductor is used. Another object is to provide a semiconductor device with high reliability.
|Barrier film for electronic devices and substrates|
Methods for forming a coating over a surface are disclosed. A method includes directing a first source of barrier film material toward a substrate in a first direction at an angle θ relative to the substrate, wherein θ is greater than about 0° and less than about 85°.
|Apparatus for manufacturing an adhesive-free gas barrier film having a ceramic barrier layer|
The present invention relates to an apparatus for manufacturing an adhesive-free gas barrier film comprising conveying means for conveying a film web; at least one first lock system for introducing the film web into a coating chamber of the apparatus; at least one first coating means by means of which the film web can be at least partially coated by depositing a barrier material in the coating chamber; and optionally at least one second lock system for expelling the film web out of the coating chamber; and at least one second coating means by means of which the coated film web can be at least partially coated by extrusion of a plastic melt.. .
|Light emitting device and method of manufacturing the same|
The present invention has an object of providing a light-emitting device including an oled formed on a plastic substrate, which prevents degradation due to penetration of moisture or oxygen. On a plastic substrate, a plurality of films for preventing oxygen or moisture from penetrating into an organic light-emitting layer in the oled (“barrier films”) and a film having a smaller stress than the barrier films (“stress relaxing film”), the film being interposed between the barrier films, are provided.
|Semiconductor storage device and manufacturing method thereof|
A semiconductor storage device according to the present embodiment includes a semiconductor substrate. A plurality of memory cells are provided on the semiconductor substrate.
|Protective film for solar cell and solar cell comprising the same|
A protective film for a solar cell including a barrier film having a multilayer structure in which a substrate layer, an organic-inorganic hybrid layer and an inorganic barrier layer are sequentially stacked and a fluorine-based polymer layer, and a solar cell including the same are provided. Here, at least one of the substrate layer, the organic-inorganic hybrid layer, the inorganic barrier layer and the fluorine-based polymer layer includes at least one of a uv stabilizer and a uv absorbent.
|Semiconductor device and fabricating method thereof|
A semiconductor device includes a lower conductor having a lower conductor sidewall, a barrier film having a barrier film sidewall formed directly on the lower conductor sidewall, and a via formed on a top surface of the lower conductor. A top portion of the barrier film sidewall is recessed, such that a top surface of the barrier film sidewall is at a level lower than the top surface of the lower conductor..
|Semiconductor device and method for manufacturing the same|
A semiconductor device comprises a bit line formed over a semiconductor substrate. The bit line has an upper portion and a lower portion, and the upper portion is narrower than the lower portion.
|Method for producing laminate|
A method for producing a laminate comprising a substrate sheet containing a fluororesin and a gas barrier film directly laminated on at least one side of the substrate sheet, wherein the gas barrier film contains as the main component an inorganic compound comprising at least one member selected from the group consisting of oxygen, nitrogen and carbon, and silicon or aluminum, and the gas barrier film is formed on the substrate sheet by a high-frequency plasma chemical vapor deposition method at a frequency of 27.12 mhz.. .
|Method for forming cu wiring|
A cu wiring forming method forms cu wiring in a recess of a predetermined pattern including a trench formed in an insulating film on a substrate surface. The method includes: forming a barrier film at least on a surface of the recess; forming a cu film by pvd to fill the recess with the cu film; forming an additional layer on the cu film; polishing an entire surface by cmp to form the cu wiring in the recess; forming a metal cap including a manganese oxide film on an entire surface including the insulating film and the cu wiring of the substrate after performing the cmp polishing; and forming a dielectric cap on the metal cap..
|Plasticizer-free flexible oxygen barrier films and laminates based on negatively charged and acetylated non-cellulosic polysaccharides isolated from biomass|
Food, consumer, and industrial product packaging materials are provided by embodiments of the present invention. Films and laminates based on a combination of negatively charged polysaccharides are provided as such packaging materials.
|Method for forming copper wiring|
A copper (cu) wiring forming method includes forming a barrier film on the entire surface of a wafer which has a trench, forming a ruthenium (ru) film on the barrier film, and filling the trench by forming a pure copper film on the ruthenium film by a physical vapor deposition (pvd). The method further includes forming a copper alloy film on the pure copper film by the pvd, forming a copper wiring by polishing the entire surface by a chemical mechanical polishing, forming a cap layer made of a dielectric material on the copper wiring, and segregating an alloy component included in the copper alloy film in a region including a portion corresponding an interface between the copper wiring and the cap layer..
|Vapor-deposited film having barrier performance|
Such a vapor-deposited barrier film is provided that has a vapor-deposited layer having uniform film quality, a high film density and high barrier performance in the initial stage. The vapor-deposited barrier film contains a substrate having on at least one surface thereof at least one layer of a vapor-deposited layer (a).
|Microlayer barrier films|
The present invention relates to films comprising a number of repeating microlayer units. The repeating units include one layer made from a barrier resin derived from one or more monomers having at least one oxygen atom, and one layer comprising a non-polar polyolefin.
A nitride insulating film which prevents diffusion of hydrogen into an oxide semiconductor film in a transistor including an oxide semiconductor is provided. Further, a semiconductor device which has favorable electrical characteristics by using a transistor including a silicon semiconductor and a transistor including an oxide semiconductor is provided.
|Gas barrier film|
An object of the invention is to provide a gas barrier characteristic film that has a gas barrier characteristic and that is excellent in the repetitive reproducibility of the gas barrier characteristic. The film is a gas barrier characteristic film in which an [a] layer and a [b] layer mentioned below are sequentially layered on at least one surface of a macromolecular base, the [a] layer being a crosslinked resin layer whose pencil hardness is greater than or equal to h and whose surface free energy is less than or equal to 45 mn/m, and the [b] layer being a silicon-containing inorganic layer whose thickness is 10 to 1000 nm..
|Semiconductor device and a method of increasing a resistance value of an electric fuse|
Provided is a semiconductor device having an electric fuse structure which receives the supply of an electric current to be permitted to be cut without damaging portions around the fuse. An electric fuse is electrically connected between an electronic circuit and a redundant circuit as a spare of the electronic circuit.
|Light-emitting device and method of manufacturing the same|
An organic light-emitting device is provided comprising a stack of layers including—an electro-optical layer structure (10) having a light emissive surface (12), —a light extraction structure (20) adjacent the light emissive surface, the light extraction structure has a nanostructured layer (22); and a backfill layer (24) comprising a material having a second index of refraction different from the first index of refraction, wherein the backfill layer (24) forms a planarizing layer over the nanostructured layer (22). The light emitting device includes a barrier film that comprises a first and a second inorganic layer (22, 26) and an organic layer (24) arranged between said inorganic layers.
|Semiconductor device and method of manufacturing the same|
A ferroelectric capacitor is formed above a semiconductor substrate (1), and thereafter, wirings (24a) are formed. A barrier film (25) covering the wirings (24a) is formed.
|Biodegradable composite barrier film|
The present invention is directed to a multilayer film having, as its main component, a hydroxy acid polymer with improved gas barrier and optional heat sealability. The oriented film of predominately hydroxy acid polymer having controlled shrink can be produced by melting and coextruding a hydroxy acid polymer with a much thinner layer of an amorphous aromatic copolyester to form a multilayer film that is quench cooled, then biaxially stretched at a process temperature above the glass transition and below the cold crystallization temperature of the hydroxy acid polymer.
|Thin-film transistor and zinc oxide-based sputtering target for the same|
A thin-film transistor includes a metal electrode and a zinc oxide-based barrier film that blocks a material from diffusing out of the metal electrode. The zinc oxide-based barrier film is made of zinc oxide doped with indium oxide, the content of the indium oxide ranging, by weight, 1 to 50 percent of the zinc oxide-based barrier film.
|Encapsulating sheet, light emitting diode device, and producing method thereof|
An encapsulating sheet includes an encapsulating resin layer and a barrier film layer formed at one side in a thickness direction of the encapsulating resin layer.. .
|Coatings for barrier films and methods of making and using the same|
A barrier film including a substrate, a base (co)polymer layer applied on a major surface of the substrate, an oxide layer applied on the base (co)polymer layer, and a protective (co)polymer layer applied on the oxide layer. The protective (co)polymer layer is formed as the reaction product of a first (meth)acryloyl compound and a (meth)acryl-silane compound derived from a michael reaction between a second (meth)acryloyl compound and an aminosilane.
|Coating composition for forming gas barrier layer, gas barrier film, and method for producing gas barrier film|
Provided are a coating composition for forming a gas barrier layer as configured such that a specific compound having two or more 5-membered cyclic carbonate groups and a compound having two or more amino groups are reactable at an equivalent ratio of functional groups of 0.8 to 1.25 to form the gas barrier layer with a polyhydroxyurethane resin as a principal component; a gas barrier film formed of a single layer or multiple layers, at least one of the layer or layers that forms or form the film is a layer that exhibits gas barrier properties, and the layer is formed of a polyhydroxyurethane resin having a specific chemical structure; and a production method of a film having gas barrier properties. Owing to the use of the specific polyhydroxyurethane resin, the coating composition, gas barrier film and production method readily enable to reduce moisture-dependent variations in gas barrier properties, to avoid the production of noxious fumes upon incineration disposal, to provide excellent processability, and to lower the pollutant load on the environment..
|Process for producing multilayered gas-barrier film|
Provided are a method for producing a film, which is satisfactory in productivity, exhibits high gas-barrier property immediately after production, and has excellent adhesive strength between constituent layers while maintaining the excellent gas-barrier property, and a gas-barrier film, which is obtained by the method. The method for producing a gas-barrier film includes the steps of: (1) forming an inorganic thin film by a vacuum deposition method on at least one surface of a base film; (2) forming a thin film by a plasma cvd method on the inorganic thin film formed in the step (1); and (3) forming an inorganic thin film by the vacuum deposition method on the thin film formed in the step (2), in which each of the steps (1) and (3), and the step (2) are sequentially carried out at a pressure of 1×10−7 to 1 pa, and at a pressure of 1×10−3 to 1×102 pa, respectively..