|| List of recent Alloy-related patents
|Mobile assay facility and method of using same to procure and assay precious metals|
A self contained, mobile assay facility built in a modified armored truck is completely equipped to smelt and assay precious metals, particularly gold and silver. An induction furnace melts the metal that is then poured into an ingot.
|Method of analyzing numeric model for metal hydride tank|
A method of analyzing a numeric model for a metal hydride tank, which calculates the temperature change and the change of a reaction rate and the hydrogen concentration in the alloy resulting from a hydrogen reaction based on various user conditions with respect to metal hydride (mh) alloy tanks having various shapes when mh alloy tanks are actually used. The method includes (a) inputting a temperature (t), a real reaction flow rate (qr), and an initial data value of hydrogen concentration (c) for each cell of a model, (b) calculating a possible reaction rate (rp) depending on the temperature (t) and the hydrogen concentration (c) in the metal hydride alloy with respect to each cell, (c) calculating a possible flow rate (qp) with respect to an entire mh alloy region, and (d) calculating a k between the real reaction flow rate (qr) and the possible reaction flow rate (qp)..
|Shape memory alloy articles with improved fatigue performance and methods therefore|
Articles made of shape memory alloys having improved fatigue performance and to methods of treating articles formed from shape memory alloy materials by pre-straining the articles (or desired portions of the articles) in a controlled manner so that the resultant articles exhibit improved fatigue performance. The shape memory articles are preferably medical devices, more preferably implantable medical devices.
|Paint stripping compositions|
An environmental safety paint stripping composition comprising dichloroethylene, aromatic alcohols and ethers, surfactants, corrosion inhibitors, thickeners, wax solvents and water. This paint stripping composition is particularly useful in stripping paint and other polymeric coatings from metal substrates such as aluminum and it alloys..
|Low temperature deposition of phase change memory materials|
A system and method for forming a phase change memory material on a substrate, in which the substrate is contacted with precursors for a phase change memory chalcogenide alloy under conditions producing deposition of the chalcogenide alloy on the substrate, at temperature below 350° c., with the contacting being carried out via chemical vapor deposition or atomic layer deposition. Various tellurium, germanium and germanium-tellurium precursors are described, which are useful for forming gst phase change memory films on substrates..
|Methods of growing heteroepitaxial single crystal or large grained semiconductor films on glass substrates and devices thereon|
A method is disclosed for making semiconductor films from a eutectic alloy comprising a metal and a semiconductor. Through heterogeneous nucleation said film is deposited at a deposition temperature on relatively inexpensive buffered substrates, such as glass.
|Catalyst production method, electrode catalyst for fuel cell produced by this method, and catalyst production apparatus|
A method for producing a catalyst supporting a metal or an alloy on a support, including: independently controlling a temperature of a first supercritical fluid to be first temperature, the first supercritical fluid containing a precursor of the metal or precursor of the alloy that is dissolved in a supercritical fluid; independently controlling a temperature of the support to be a second temperature higher than the temperature of the first supercritical fluid; and supplying the first supercritical fluid controlled to the first temperature to the support, to cause the metal or the alloy to be supported on the support.. .
|Ternary platinum alloy catalyst|
A platinum alloy catalyst ptxy, wherein x is nickel, cobalt, chromium, copper, titanium or manganese and y is tantalum or niobium, characterised in that in the alloy the atomic percentage of platinum is 46-75 at %, of x is 1-49 at % and of y is 1-35 at %; provided that the alloy is not 66 at % pt 20 at % cr14 at % ta or 50 at % pt, 25 at % co, 25 at % ta is disclosed. The catalyst has particular use as an oxygen reduction catalyst in fuel cells, and in particular in phosphoric acid fuel cells..
|Ultrathin surface coating on negative electrodes to prevent transition metal deposition and methods for making and use thereof|
An electrode material for use in an electrochemical cell, like a lithium-ion battery, is provided. The electrode material may be a negative electrode comprising graphite, silicon, silicon-alloys, or tin-alloys, for example.
|Aluminum alloy foil for electrode collector and production method therefor|
An object of the present invention is to provide an aluminum alloy foil for an electrode current collector, the foil having a high strength and high strength after a drying process. The aluminum alloy foil can be manufactured at low cost.
A method of treating aluminum or aluminum alloy includes providing an aluminum or aluminum alloy substrate; depositing a first zincating layer on the substrate by zincate immersion; stripping off the first zincating layer; depositing a second zincating layer on the substrate by zincate immersion; stripping off the second zincating layer; and depositing a third zincating layer on the substrate by zincate immersion.. .
|Process and hardware for deposition of complex thin-film alloys over large areas|
Systems and methods for depositing complex thin-film alloys on substrates are provided. In particular, systems and methods for the deposition of thin-film cd1-xmxte ternary alloys on substrates using a stacked-source sublimation system are provided, where m is a metal such as mg, zn, mn, and cu..
|Blended fluoropolymer compositions|
Blended fluoropolymer compositions are provided. In one embodiment, a liquid dispersion of a first fluoropolymer is blended with a liquid dispersion of a second fluoropolymer.
|Copper alloy wire rod and method for manufacturing the same|
A copper alloy wire rod according to the present invention includes a copper parent phase and short fiber-shaped composite phases which are dispersed in the copper parent phase and which contain cu8zr3 and cu, wherein the content of zr is within the range of 0.2 atomic percent or more and 1.0 atomic percent or less. This copper alloy wire rod can be obtained by including the steps of melting a raw material in such a way that a copper alloy having a zr content within the above-described range of is produced so as to obtain a molten metal in a melting step, casting the molten metal so as to obtain an ingot in a casting step, and subjecting the ingot to cold wire drawing in a wire drawing step, wherein the wire drawing step and a treatment after the wire drawing step are performed at lower than 500° c..
|Copper alloy material|
A copper alloy material includes an additional element m including ti, and a balance having copper and an inevitable impurity. An atomic ratio of the additional element m to oxygen is in a range of 0.33≦m/o≦1.5..
|Nickel-based alloy and turbine component having nickel-based alloy|
A nickel-based alloy and a turbine component including a nickel-based alloy are disclosed. The nickel-based alloy includes, by weight, between about 8% and about 11% cobalt, up to about 3% niobium, up to about 3% titanium, up to about 2.3% aluminum, up to about 3% tungsten, up to about 25% chromium, up to about 0.1% carbon, up to about 0.01% boron, and a balance nickel, or the nickel-based alloy includes, by weight, between about 1% and about 3% niobium, between about 1% and about 3% titanium, between about 2.1% and about 2.5% aluminum, up to about 3% tungsten, up to about 11% cobalt, up to about 25% chromium, up to about 0.1% carbon, up to about 0.01% boron, and a balance nickel.
|Non-heat treated magnesium alloy sheet with excellent formability at room temperature in which segreation is minimized|
Disclosed herein is a non-heat treatable magnesium alloy sheet, including: 1˜3 wt % of aluminum (al); 0.5˜3 wt % of tin (sn); and a balance of magnesium, wherein the maximum deviation of average vickers hardness (hv) thereof, caused by center segregation and inverse segregation, is 10 hv or less.. .
|Superalloys and components formed thereof|
A gamma prime nickel-base superalloy and components formed therefrom that exhibit improved high-temperature dwell capabilities, including creep and hold time fatigue crack growth behavior. A particular example of a component is a powder metallurgy turbine disk of a gas turbine engine.
|Fast fastening antifouling tape or substrate useable in marine seismic surveys|
A streamer usable underwater for a marine seismic survey has a portion adjacent to a protuberance covered by an adhesive antifouling tape or substrate. The tape, which may be made of copper or copper alloy is configured to be fast fastened, may be applied when the streamer is deployed and may be covered by a protective jacket during recovery..
|Electronic device and method for manufacturing electronic device|
An electronic device includes a glass substrate, an electronic element mounted on one surface of the glass substrate, a cover body covering the electronic element and bonded to the glass substrate and a through electrode penetrating from one surface to the other surface of the glass substrate. The through electrode is composed of an iron-nickel based alloy and; and a nickel film is formed on an end face of the through electrode exposing on the other surface of the glass substrate and on the other surface of the glass substrate located in the vicinity of the end face..
|Multilayer ceramic capacitor and method of manufacturing the same|
There is provided a multilayer ceramic capacitor including a ceramic body including dielectric layers, first and second internal electrodes formed within the ceramic body and disposed to face each other, having the dielectric layer interposed therebetween, first and second electrode layers disposed on outer surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively, a conductive resin layer disposed on the first and second electrode layers and containing copper powder, a nickel plating layer disposed on an outer portion of the conductive resin layer, and a copper-nickel alloy layer disposed between the conductive resin layer and the nickel plating layer and having a thickness of 1 to 10 nm.. .
In a semiconductor device in which a copper plating layer is used for a conductor of an antenna and in which an integrated circuit and the antenna are formed over the same substrate, an object is to prevent an adverse effect on electrical characteristics of a circuit element due to diffusion of copper, as well as to provide a copper plating layer with favorable adhesiveness. Another object is to prevent a defect in the semiconductor device that stems from poor connection between the antenna and the integrated circuit, in the semiconductor device in which the integrated circuit and the antenna are formed over the same substrate.
|Functionalized zno or zno alloy films exhibiting high electron mobility|
Functionalized films are provided comprising a film of zno or zno alloy disposed over a supporting substrate and a layer of organic molecules comprising terminal carboxylic acid linkage groups, wherein the organic molecules are bound to a surface of the film of zno or zno alloy via the terminal carboxylic acid linkage groups. Thin film transistors comprising the functionalized films are also provided.
|Semiconductor device and power source device|
A manufacturing of a semiconductor device includes forming one of a layer with a first metal and the layer with a second metal on one of a semiconductor chip mounting area of a support plate and a back surface of the semiconductor chip; forming the other of the layer with the first metal and the layer with the second metal on an area corresponding to a part of the area, in which one of the layer with the first metal and the layer with the second metal, of the other one of the semiconductor chip mounting area and the back surface of the semiconductor chip; and forming a layer which includes an alloy with the first metal and the second metal after positioning the semiconductor chip in the semiconductor chip mounting area to bond the semiconductor chip with the semiconductor chip mounting area.. .
|Semiconductor device and fabricating method thereof|
A semiconductor device is provided. The semiconductor device includes a first fin on a substrate, a first gate electrode formed on the substrate to intersect the first fin, a first elevated source/drain on the first fin on both sides of the first gate electrode, and a first metal alloy layer on an upper surface and sidewall of the first elevated source/drain..
|Electroconductive particle and metal paste, and electrode|
The present invention is an electroconductive particle for forming an electrode including a precious metal particle including pt or a pt alloy and having an average particle diameter of 50 to 150 nm, a first ceramic particle including al2o3 or zro2 dispersed in the precious metal particle and having an average particle diameter of 5 to 50 nm, and a second ceramic particle including al2o3 or zro2 bonded to an outer periphery of the precious metal particle and having an average particle diameter of 5 to 50 nm. The sum of the volume of the first ceramic particle and the volume of the second ceramic particle is preferably 2 to 40 vol % based on the whole electroconductive particle.
|Anode active material for secondary battery and method of manufacturing the same|
An anode active material for a lithium secondary battery having high-capacity and high-efficient charging/discharging characteristics. The anode active material includes silicon single phases, and silicon-metal alloy phases distributed around the silicon single phases.
|Ultra fine pitch wedge for thicker wire|
An ultra-fine pitch wedge bonding tool and method for its manufacture are disclosed. The wedge tool is formed with a foot width calculated to enable accurate bonding of wires separated at an ultra-fine pitch.
|Copper alloy composite and method for manufacturing same|
A method for preparing a copper alloy given a certain special surface shape yields tremendous bonding strength through compatibility with an epoxy resin adhesive. With a composite part in which this technology is utilized to integrate a copper alloy member as a cover material with a cfrp, it is possible to take advantage of the characteristics of both the copper alloy and the frp due to the tremendous bonding strength.
|Anode assembly for cathodic protection|
The cathodic protection of a reinforced concrete structure utilizes sacrificial anodes such as aluminum or zinc as well as alloys thereof. Each anode is embedded or substantially covered in a material consisting of a hydrophilic non-cementious open-cell foam.
|Non-asbestos friction material composition|
Provided by the present invention are: a non-asbestos frictional material composition containing a binder, an organic filler, an inorganic filler, and a fiber substrate, wherein, in the non-asbestos frictional material composition, content of a copper is 5% or less by mass as a copper element, content of a metal fiber other than a copper fiber and a copper alloy fiber is 0.5% or less by mass, and a titanate salt is contained therein with antimony trisulfide or zinc powders, with content of the titanate salt being in the range of 10 to 35% by mass; and a frictional material and a friction member that use the said non-asbestos frictional material composition.. .
|Electrical shielding material composed of metallized stainless steel monofilament yarn|
A yarn or multi-fiber formed of a plurality of micron diameter stainless steel monofilaments which have been rendered more conductive by one or more coatings of electrolytically-deposited metal or metal alloy materials. The metallized yarn provided by the invention has a very low electrical resistance, with consequent benefit in electrical performance, and is particularly useful as an rfi/emi shielding material..
|Soft dilute-copper alloy insulated twisted wire and coil|
A soft dilute-copper alloy insulated twisted wire includes a plurality of insulated wires twisted together and each including a conductor and an insulating cover layer thereon. The conductor includes a soft dilute-copper alloy wire including a soft dilute-copper alloy material including an additional element selected from the group consisting of ti, mg, zr, nb, ca, v, ni, mn and cr with a balance consisting a copper and an inevitable impurity.
|Methods of adjusting the rate of galvanic corrosion of a wellbore isolation device|
A wellbore isolation device comprises a first material and pieces of a second material, wherein the first material: is a metal or a metal alloy; forms a matrix of the portion of the wellbore isolation device; and partially or wholly dissolves when an electrically conductive path exists between the first material and the second material and at least a portion of the first and second materials are in contact with the electrolyte, wherein the pieces of the second material: are a metal or metal alloy; and are embedded within the matrix of the first material; wherein the first material and the second material form a galvanic couple and wherein the first material is the anode and the second material is the cathode of the couple. The isolation device can also include a bonding agent for bonding the pieces of the second material into the matrix of the first material..
|Continuous casting equipment for titanium or titanium alloy slab|
Using plasma arcs generated by plasma torches, the surface of molten metal charged into a mold is heated. Emss arranged on the lateral sides of the mold are used to stir the surface of the molten metal or the vicinity thereof electromagnetically.
|Copper alloy sheet and method for manufacturing copper alloy sheet|
An aspect of the copper alloy sheet contains 5.0 mass % to 12.0 mass % of zn, 1.1 mass % to 2.5 mass % of sn, 0.01 mass % to 0.09 mass % of p and 0.6 mass % to 1.5 mass % of ni with a remainder of cu and inevitable impurities, and satisfied a relationship of 20≦[zn]+7×[sn]+15×[p]+4.5×[ni]≦32. The aspect of the copper alloy sheet is manufactured using a manufacturing process including a cold finishing rolling process in which a copper alloy material is cold-rolled, the average crystal grain diameter of the copper alloy material is 1.2 μm to 5.0 μm, round or oval precipitates are present in the copper alloy material, the average grain diameter of the precipitates is 4.0 nm to 25.0 nm or a proportion of precipitates having a grain diameter of 4.0 nm to 25.0 nm in the precipitates is 70 % or more..
|Forged tial components, and method for producing same|
The present invention relates to a method for producing forged components of a tial alloy, in particular turbine blades, wherein the components are forged and undergo a two-stage heat treatment after the forging process, the first stage of the heat treatment comprising a recrystallization annealing process for 50 to 100 minutes at a temperature below the γ/α transition temperature, and the second stage of the heat treatment comprising a stabilization annealing process in the temperature range of from 800° c. To 950° c.
|Lightweight, crash-sensitive automotive component|
The present invention provides a casting having increased crashworthiness including an an aluminum alloy of about 6.0 wt % to about 8.0 wt % si; about 0.12 wt % to about 0.25 wt % mg; less than or equal to about 0.35 wt % cu; less than or equal to about 4.0 wt % zn; less than or equal to about 0.6 wt % mn; and less than or equal to about 0.15 wt % fe, wherein the cast body is treated to a t5 or t6 temper and has a tensile strength ranging from 100 mpa to 180 mpa and has a critical fracture strain greater than 10%. The present invention further provides a method of forming a casting having increased crashworthiness..
|Melt overheating method for improved toughness and glass-forming ability of metallic glasses|
A method of forming a bulk metallic glass is provided. The method includes overheating the alloy melt to a temperature above a threshold temperature, ttough, associated with the metallic glass demonstrating substantial improvement in toughness compared to the toughness demonstrated in the absence of overheating the melt above tliquidus, and another threshold temperature, tgfa, associated with the metallic glass demonstrating substantial improvement in glass-forming ability compared to the glass-forming ability demonstrated in the absence of overheating the melt above tliquidus.
|Systems and methods for fabricating objects including amorphous metal using techniques akin to additive manufacturing|
Systems and methods in accordance with embodiments of the invention fabricate objects including amorphous metals using techniques akin to additive manufacturing. In one embodiment, a method of fabricating an object that includes an amorphous metal includes: applying a first layer of molten metallic alloy to a surface; cooling the first layer of molten metallic alloy such that it solidifies and thereby forms a first layer including amorphous metal; subsequently applying at least one layer of molten metallic alloy onto a layer including amorphous metal; cooling each subsequently applied layer of molten metallic alloy such that it solidifies and thereby forms a layer including amorphous metal prior to the application of any adjacent layer of molten metallic alloy; where the aggregate of the solidified layers including amorphous metal forms a desired shape in the object to be fabricated; and removing at least the first layer including amorphous metal from the surface..
|Flux for brazing aluminum materials|
The present invention provides a flux for brazing aluminum-based materials, the flux being capable of brazing an a5052 alloy or the like containing 1.5 wt % or more of magnesium even when an al—si eutectic alloy (si content: 7 to 12 wt %; a4343 alloy, a4047 alloy; melt starting temperature: about 577 to 615° c.) is used as a brazing material. Specifically, the present invention provides a flux for brazing aluminum-based materials, comprising, expressed in mol %, 20 mol %≦csf≦49 mol %, 1 mol %≦lif≦58 mol %, 19 mol %≦alf3≦41 mol %, and 0 mol %<naf and/or kf≦19 mol %..
|Magnesium-based alloy produced using a silicon compound and method for producing same|
The present invention relates to a magnesium-based alloy, and to a method for producing same. The method comprises the steps of: melting a magnesium alloy into a liquid state; adding a silicon compound to said molten magnesium alloy; exhausting the silicon compound through a full reaction between said molten magnesium alloy and said added silicon compound such that the silicon compound does not substantially remain in the magnesium alloy; and exhausting the silicon produced as a result of said exhaustion in the precious step such that the silicon may not substantially remain in said magnesium alloy..
|Cold finger for cryocoolers|
Method for fabricating a cold finger for attachment to a base assembly of a cold head of a stirling cycle or pulse tube cryocooler. The exterior of a titanium alloy workpiece is machined to form a cylindrical outer surface.
|Binding element for a building wall structure|
A binding element for a building wall structure, wherein said binding element comprises an elongated steel element coated with a thermoplastic material, and wherein the coated thermoplastic material has a uniform thickness on each straight portion of the elongated steel element. The building wall structure comprising an inner wall, an outer wall spaced from said inner wall and provided with at least one insulation layer(s) in between, at least one binding element comprising an elongated steel element coated with a thermoplastic material interconnecting said outer wall and inner wall through the insulation layer, wherein ends of said binding element is fixed to the said outer wall and said inner wall respectively and wherein middle portion of said binding element is in contact with the said insulation layer(s).
|Bonded abrasive article and method of forming|
An abrasive article includes a body having abrasive grains contained within a bond material comprising a metal or metal alloy, wherein the body comprises a ratio of vag/vbm of at least about 1.3, wherein vag is the volume percent of abrasive grains within the total volume of the body and vbm is the volume percent of bond material within the total volume of the body.. .
|Method of manufacturing composite contact|
A method of manufacturing a composite contact in which a flange section with a large diameter at an end of a base part with a small diameter, the composite contact having: a contact section which is made from silver alloy into an upper-surface part of the flange section; and a leg section which is made from copper alloy by forming a large-diameter part so as to form a lower-surface part of the flange section is made integrally with the base part, having the steps of: a primary-forming process forging a copper-alloy wire and a silver-alloy wire having a smaller diameter than that of the copper-alloy wire in a hole of a forming die in a state of being butted to each other so as to form a primary-formed body including a silver-alloy part and a copper-alloy part so that the wires are bonded with each other.. .
|Precious metals transaction systems and methods|
Systems and methods directed to the purchase of articles formed of precious metals are disclosed. Precious metal content is analyzed using an x-ray fluorescence (“xrf”) analysis instrument to determine alloy content, in combination with an ultrasound or electrical conductivity instrument to confirm uniformity of cross-sectional content.
|Microstructured absorbable implant|
The production of microstructured surfaces in magnesium alloys, containing zinc as the major alloying element, in particular in absorbable implants such as stents, wherein microstructures in sizes of up to 5 μm (micrometers) are generated on a magnesium alloy base body of the absorbable implant, for example of the absorbable stent, by way of optionally combined, pickling and electrochemical micropolishing processes, and allow better adhesion of a polymer coating (including higher break resistance) and higher corrosion resistance. The microstructured surface is produced out of the bulk material and exhibits no delamination from the base material during the mechanical deformation of the implant..
|Dental retention systems|
Dental retention systems which facilitate the adjustment or removal of an oral appliance, e.g., a crown or bridge, from a reconfigurable abutment assembly are described. The adjustable abutment assembly may be secured to an anchoring implant bored into the bones within the mouth.
|Anode active material for secondary battery and method of manufacturing the same|
An anode active material for a lithium secondary battery having high-capacity and high-efficient charge/discharge characteristics. The anode active material includes silicon single phases; and silicon-metal alloy phases surrounding the silicon single phases.
|Electrolytic copper foil, method of producing electrolytic copper foil, lithium ion secondary cell using electrolytic copper foil as collector|
The present invention provides an electrodeposited copper foil having a tensile strength of at least 300 mpa and elongation rate of at least 3.0% after heat treatment at 350° c. For 1 hour and provides a copper foil which prevents the breakage of a current collector (copper foil) while maintaining adhesiveness between the current collector (copper foil) and the active material in response to substantial expansion and contraction of a si or sn alloy-based active material.
|Composite and preparation method of joining amorphous alloy material to heterogeneous material|
A method of joining an amorphous alloy material to a heterogeneous material and a composite formed by the same are provided. The method comprises steps of: placing a pre-formed piece made of one of the amorphous alloy material and the heterogeneous material into a mold; heating the other of the amorphous alloy material and the heterogeneous material to a predetermined temperature, and casting the other of the amorphous alloy material and the heterogeneous material into the mold to form a transition connection part joining the amorphous alloy material to the heterogeneous material and having a fusion welded structure, a microstructure reinforcing connection structure and a composite connection structure; and cooling the amorphous alloy material and the heterogeneous material at a rate higher than a critical cooling rate of the amorphous alloy material to obtain a composite formed by joining the amorphous alloy material to the heterogeneous material by the transition connection part..
|Vehicle components and sacrificial ribs|
A structural component 1 is provided for a vehicle designed for driving off-road on rough terrain. The component 1, such as the lower control arm of a suspension system, is formed from aluminium, aluminium-alloy or other light-weight material and provided on its underside with a parallel arrangement of chamfered ribs 5 which extend in the direction of travel of the vehicle.
|Methods of production for corrosion-resistant bit patterned media (bpm) and discrete track media (dtm)|
A method for producing a magnetic recording medium in one embodiment includes forming a magnetic material layer above a substrate, transferring an uneven pattern to the magnetic material layer to form concave portions and convex portions, the convex portions being magnetic regions, depositing a nonmagnetic material above the concave portions to form nonmagnetic regions, forming an oxide layer and/or hydroxide layer above the magnetic regions of the recording layer, and forming an organic material layer which exhibits a corrosion-inhibiting characteristic with respect to cobalt or cobalt alloy above the oxide layer and/or hydroxide layer.. .
|Method for producing high-strength hot-dip galvannealed steel sheet|
Exemplary embodiments of the present invention can provide a method for producing hot dip galvannealed steel sheet which exhibits high strength, high ductility, and a significant degree of alloying. Such exemplary method can be applied to, e.g., a pickled hot rolled steel sheet or an annealed and pickled cold rolled steel sheet containing between about 0.02% and about 0.2% c and between about 0.15% and about 2.5% mn, and may include one or more procedures for rinsing the sheet, preplating the sheet with ni, rapidly heating the sheet in a nonoxidizing atmosphere to a sheet temperature of about 430° c.
|Resorbable stents which contain a magnesium alloy|
The present invention is directed to stents made of a magnesium alloy degradable under physiological conditions and an outer polymeric coating. Herein, the stents according to the invention can be additionally coated with at least one anti-inflammatory, antiproliferative, antiangiogenic, antirestenotic and/or antithrombogenic active agent..
|Aluminum alloy and production method thereof|
Provided are an aluminum alloy and a production method thereof. In accordance with an embodiment, an aluminum-based mother material is melted to form a molten metal.
|Manufacturing and applications of metal powders and alloys|
The present invention is directed to a method of manufacture of metal or alloy powders that uses liquid phase reduction of a metal halide, or a mixture of metal halides, to produce a metal particle coated in salts produced as a reaction byproduct. The reaction conditions can be chosen to select a range of metal particle sizes, and the salt coating prevents oxidation (or reaction with other atmospheric gases) and permits a range of applications hitherto difficult to achieve using metal powders..
|Nickel-based alloy and turbine component having nickel-based alloy|
A nickel-based alloy and a turbine component are disclosed. The alloy includes, by weight, between about 0.8% and about 1.3% hafnium, between about 5.7% and about 6.4% aluminum, between about 7.0% and about 10.0% cobalt, up to about 0.1% carbon, up to about 8.7% chromium, up to about 0.6% molybdenum, up to about 9.7% tungsten, up to about 0.9% titanium, up to about 0.02% boron, up to about 0.1% manganese, up to about 0.06% silicon, up to about 0.01% phosphorus, up to about 0.004% sulfur, up to about 0.02% zirconium, up to about 1.8% niobium, up to about 0.1% vanadium, up to about 0.1% copper, up to about 0.2% iron, up to about 0.003% magnesium, up to about 0.002% oxygen, up to about 0.002% nitrogen, and a balance nickel.
A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.. .
|Substrate provided with a multilayer coating having thermal properties, in particular for production of a heated glazing unit|
The invention relates to a substrate (10), especially a transparent glass substrate, equipped with a thin-film multilayer comprising, in alternation, “n” metallic functional films (40, 80, 120), in particular functional films based on silver or a metal alloy containing silver, and “(n+1)” antireflection coatings (20, 60, 100, 140), where n is an integer≧3, each antireflection coating comprising at least one antireflection film, so that each functional film (40, 80, 120) is located between two antireflection coatings (20, 60, 100, 140), characterized in that said multilayer comprises at least two high-refractive-index antireflection films (25, 145), each having a refractive index≧2.15 such that the antireflection coating (20) located under the first, starting from the substrate, functional film (40) and the antireflection coating located on the last, starting from the substrate, functional film each comprise at least one high-refractive-index antireflection film (25, 145) and each antireflection coating (60, 100) located between two functional films does not comprise a high-refractive-index film.. .
|Lightweight hub unit with integrated bearing rings and process for its manufacture|
A hub unit is provided with a hub made of an aluminum alloy for plastic processing, which forms, in a single piece, an axially extending cylindrical portion and a radial flange; two bearing rings are mounted axially aligned around the cylindrical portion, an axially inner edge of the cylindrical portion is plastically deformed in a radially outer direction against the axially inner bearing ring.. .
|Void-free metallic filled high aspect ratio openings|
One embodiment is a device which includes at least one filled via or trench wherein the at least one filled via or trench includes void-free filled metal or alloy, and the filled via or trench has an aspect ratio in a range from 9:1 to about 28:1.. .
|Mg discontinuous insertion layer for improving mtj shunt|
A mtj is disclosed with a discontinuous mg or mg alloy layer having a thickness from 1 to 3 angstroms between a free layer and a capping layer in a bottom spin valve configuration. It is believed the discontinuous mg layer serves to block conductive material in the capping layer from diffusing through the free layer and into the tunnel barrier layer thereby preventing the formation of conductive channels that function as electrical shunts within the insulation matrix of the tunnel barrier.
The present invention discloses a semiconductor device, which comprises a substrate, a buffer layer on the substrate, an inversely doped isolation layer on the buffer layer, a barrier layer on the inversely doped isolation layer, a channel layer on the barrier layer, a gate stack structure on the channel layer, and source and drain regions at both sides of the gate stack structure, characterized in that the buffer layer and/or the barrier layer and/or the inversely doped isolation layer are formed of sige alloys or sigesn alloys, and the channel layer is formed of a gesn alloy. The semiconductor device according to the present invention uses a quantum well structure of sige/gesn/sige to restrict transportation of carriers, and it introduces a stress through lattice mis-match to greatly increase the carrier mobility, thus improving the device driving capability so as to be adapted to high-speed and high-frequency application..
|Automatic ball charging system for a ball mill assembly|
The present invention is directed toward a material handling, processing and milling facility which utilizes ball milling as a means for material grinding, mixing or mechanical alloying of materials. The system includes an automatic ball charging, agitating and indexing assembly, constructed and arranged to deagglomerate and directly distribute a plurality of grinding balls to the facility.
|Method for manufacture of a multi-layer plate device|
A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors.
|Nanocomposite welding wires|
Welding wires and methods for welding metal work pieces using the welding wires are provided. The welding wires are composite materials comprising a metal alloy and high temperature nanoparticles dispersed in the metal alloy..
|Mold production method|
A method for manufacturing a moth-eye mold of an embodiment of the present invention employs a mold base including a metal base, an organic insulating layer provided on the metal base, and an aluminum alloy layer provided on the organic insulating layer, the aluminum alloy layer containing aluminum and a non-aluminum metal element m, an absolute value of a difference between a standard electrode potential of the metal element m and a standard electrode potential of aluminum being not more than 0.64 v, and a content of the metal element m in the aluminum alloy layer not exceeding 10 mass %.. .